compound

Abstract

To provide a novel compound that has high weather resistance and that sufficiently absorbs light having a wavelength of around 440 nm.SOLUTION: A compound includes an anion having a partial structure represented by formula (X). [In formula (X), a ring W1 represents a ring structure having at least one substituent. The ring W1 is preferably a ring having 5-7 carbon atoms].SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a compound. [Background technology]

[0002] In recent years, with the spread of mobile devices such as smartphones, the amount of time spent looking at displays at close range has continued to increase. As the amount of time spent looking at displays at close range increases, the health effects of light in the 400nm to 500nm wavelength range (so-called blue light) have also been attracting increasing attention. One method for reducing the health effects of blue light is to impart blue light blocking functionality to display surfaces, glasses, contact lenses, etc. Blue light blocking functionality can be imparted by mixing an absorber that absorbs light with wavelengths of 400 to 500 nm into the display surface, glasses, contact lenses, etc., or by laminating a layer containing an absorber that absorbs light with wavelengths of 400 to 500 nm.

[0003] For example, Patent Document 1 describes the use of CI Solvent Yellow 33, a quinoline compound, as a compound that efficiently absorbs blue light with a wavelength of around 440 nm. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-17152 Summary of the Invention [Problem to be solved by the invention]

[0005] However, quinoline compounds such as CI Solvent Yellow 33 sometimes do not have sufficient weather resistance. [Means for solving the problem]

[0006] The present invention includes the following inventions. [1] A compound containing an anion having a partial structure represented by formula (X). [ka] [In formula (X), ring W 1 represents a ring structure having at least one substituent. [2] The compound according to [1], wherein the anion having a partial structure represented by formula (X) is any one of the anions represented by formula (I) to formula (VIII). [ka] [ka] [In the formula, ring W 1 has the same meaning as above. Ring W 2 , Tamaki W 3 , Tamaki W 4 , Tamaki W 5 , Tamaki W 6 , Tamaki W 7 , Tamaki W 8 , Tamaki W 9 , Tamaki W 10 , Tamaki W 11 , Tamaki W 12 , Tamaki W 13 and Ring W 14 each independently represents a ring structure, and the ring structure may have a substituent. R 1 , R 2 , R 4 , R 5 , R 12 , R 14 , R 15 , R 22 , R 24 , R 25 , R 32 , R 34 , R 35 , R 42 , R 44 , R 45 , R 52 , R 54 , R55 , R 62 , R 64 , R 65 , R 71 , R 72 , R 74 , R 75 , R 81 , R 82 , R 84 , R 85 , R 91 , R 92 , R 94 , R 95 , R 101 , R 102 , R 104 , R 105 , R 111 , R 112 , R 114 , R 115 , R 121 , R 122 , R 124 , R 125 , R 131 , R 132 , R 134 and R 135 each independently represents an electron-withdrawing group. R 3 represents a monovalent substituent. R 13 , R 23 , R 33 , R 43 , R 53 , R 63 and R 133 represents a monovalent substituent. R 1 and R 2 may be linked to each other to form a ring. R 2 and R 3 may be linked to each other to form a ring. R 3 and R 4 may be linked to each other to form a ring. R 4 and R 5 may be linked to each other to form a ring. R 12 and R 13 may be linked to each other to form a ring. R 13 and R14 may be linked to each other to form a ring. R 14 and R 15 may be linked to each other to form a ring. R 22 and R 23 may be linked to each other to form a ring. R 23 and R 24 may be linked to each other to form a ring. R 24 and R 25 may be linked to each other to form a ring. R 32 and R 33 may be linked to each other to form a ring. R 33 and R 34 may be linked to each other to form a ring. R 34 and R 35 may be linked to each other to form a ring. R 42 and R 43 may be linked to each other to form a ring. R 43 and R 44 may be linked to each other to form a ring. R 44 and R 45 may be linked to each other to form a ring. R 52 and R 53 may be linked to each other to form a ring. R 53 and R 54 may be linked to each other to form a ring. R 54 and R 55 may be linked to each other to form a ring. R 62 and R 63 may be linked to each other to form a ring. R 63 and R 64 may be linked to each other to form a ring. R 64 and R 65may be linked to each other to form a ring. R 71 and R 72 may be linked to each other to form a ring. R 74 and R 75 may be linked to each other to form a ring. R 81 and R 82 may be linked to each other to form a ring. R 84 and R 85 may be linked to each other to form a ring. R 91 and R 92 may be linked to each other to form a ring. R 94 and R 95 may be linked to each other to form a ring. R 101 and R 102 may be linked to each other to form a ring. R 104 and R 105 may be linked to each other to form a ring. R 111 and R 112 may be linked to each other to form a ring. R 114 and R 115 may be linked to each other to form a ring. R 121 and R 122 may be linked to each other to form a ring. R 124 and R 125 may be linked to each other to form a ring. R 131 and R 132 may be linked to each other to form a ring. R 132 and R 133 may be linked to each other to form a ring. R 133 and R 134 may be linked to each other to form a ring. R 134 and R 135 may be linked to each other to form a ring. R x1 , R x4 and R x7 each independently represents a single bond or a divalent linking group. R x2 and R x5 each independently represents a trivalent linking group. R x3 and R x6 each independently represents a tetravalent linking group. [3]R 3 is an electron-withdrawing group. [4]R 1 , R 2 , R 3 , R 4 and R 5 At least one selected from the group consisting of a cyano group, a nitro group, a halogenated alkyl group, a halogenated aryl group, -CO-R1, -CO-O-R2, and -CO-NR3R 3k , -CO-S-R4, -CS-R5, -CS-O-R6, -CS-S-R7, -SO-R8, -SO2-R9(R1, R2, R3, R 3k , R4, R5, R6, R7, R8 and R9 each independently represent a hydrocarbon group which may have a substituent or a halogen atom.), -OCF3, -SCF3, -SF5, -SF3, or -SO3H. [5]R 1 , R 2 , R 3 , R 4 and R 5 The compound according to any one of [2] to [4], wherein at least one selected from the above is a cyano group, a nitro group, -CO-R1, -CO-O-R2, -SO2-R9 (R1, R2 and R9 each independently represent a hydrocarbon group or a halogen atom which may have a substituent), -SF5, -SF3, -SO3H, -SO2H, -OCF3 or -SCF3. [6]R 1 , R 2 , R 3 , R 4 and R 5The compound according to any one of [2] to [5], wherein at least one selected from the group consisting of is a cyano group or a nitro group. [7] The compound according to any one of [1] to [6], which exhibits a maximum absorption in the wavelength range of 400 nm to 550 nm. [8] The compound according to any one of [1] to [7], which has a gram absorption coefficient of 0.5 or more at the maximum absorption wavelength. [9] The compound according to any one of [1] to [8], which satisfies the following formula (a): ε(λ max ) / ε(λ max +30nm)≧10 (a) [Where ε(λmax) is the maximum absorption wavelength (λ max ) represents the gram extinction coefficient. ε(λ max +30nm) is the maximum absorption wavelength (λ max ) +30 nm wavelength. The unit of gram absorption coefficient is L / (g·cm).

[10] A composition comprising the compound according to any one of [1] to [9].

[11] A molded article obtained by molding the resin composition according to

[10] .

[12] The molded article according to

[11] , which has a transmittance of 50% or less at a wavelength of 440 nm. [Effects of the Invention]

[0007] The present invention provides a novel compound that sufficiently absorbs light having a wavelength of about 440 nm and has high weather resistance. DETAILED DESCRIPTION OF THE INVENTION

[0008] The compound of the present invention is a compound containing an anion having a partial structure represented by formula (X) (hereinafter, may be referred to as compound (X)). [ka] [In formula (X), ring W 1 represents a ring having at least one substituent.]

[0009] Ring W 1 The ring structure of the ring W is not particularly limited. 1 may be a single ring or a condensed ring. Ring W 1 may be a heterocyclic ring containing a heteroatom (for example, an oxygen atom, a sulfur atom, a nitrogen atom, etc.) as a ring constituent, or may be an aliphatic hydrocarbon ring consisting of carbon atoms and hydrogen atoms.

[0010] Ring W 1 is usually a ring having 5 to 18 carbon atoms, preferably a 5- to 7-membered ring structure, and more preferably a 6-membered ring structure. 1 is preferably a ring structure having 5 to 7 carbon atoms, and more preferably a ring structure having 6 carbon atoms. Ring W 1 is preferably a monocyclic ring. Ring W 1 is preferably an aliphatic hydrocarbon ring (alicyclic hydrocarbon group).

[0011] Ring W 1 Examples of the ring structure include the following: [ka]

[0012] Ring W 1 has at least one substituent, and the substituent is a ring W 1 That is, the compound of the present invention is preferably a compound containing an anion having a partial structure represented by formula (X-1). [ka] [In formula (X-1), ring W 1 has the same meaning as above, and R 3 represents a monovalent substituent.]

[0013] R 3is not particularly limited as long as it is a monovalent substituent, and examples thereof include a monovalent aliphatic hydrocarbon group, a monovalent aromatic hydrocarbon group, an electron-withdrawing group, an electron-donating group, and a heterocyclic group.

[0014] R 3 Examples of the monovalent aliphatic hydrocarbon group represented by the formula (I) include linear or branched alkyl groups having 1 to 25 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, tert-butyl, sec-butyl, n-pentyl, isopentyl, n-hexyl, isohexyl, n-octyl, isooctyl, n-nonyl, isononyl, n-decyl, isodecyl, n-dodecyl, isododecyl, undecyl, lauryl, myristyl, cetyl, stearyl, 2-ethylhexyl, and 4-butyloctyl; cycloalkyl groups having 3 to 25 carbon atoms, such as cyclopropyl, cyclobutyl, cyclopentyl, and cyclohexyl; cycloalkylalkyl groups having 4 to 25 carbon atoms, such as cyclohexylmethyl; and alkylcycloalkyl groups having 4 to 25 carbon atoms, such as isobornyl. A straight or branched chain alkyl group having 1 to 12 carbon atoms is preferred.

[0015] R 3 Examples of the monovalent aromatic hydrocarbon group represented by the formula (I) include aryl groups having 6 to 18 carbon atoms, such as a phenyl group, a naphthyl group, an anthracenyl group, a tetracenyl group, a pentacenyl group, a phenanthryl group, a chrysenyl group, a triphenylenyl group, a tetraphenyl group, a pyrenyl group, a perylenyl group, a coronenyl group, and a biphenyl group; and aralkyl groups having 7 to 18 carbon atoms, such as a benzyl group, a phenylethyl group, and a naphthylmethyl group. Basic The aryl group may be an aryl group having 6 to 18 carbon atoms, and a phenyl group or a benzyl group is more preferred.

[0016] R 3Examples of the electron-donating group represented by the formula (I) include a hydroxyl group; an alkoxy group having 1 to 12 carbon atoms, such as a methoxy group, an ethoxy group, a propoxy group, a butoxy group, a pentyloxy group, a hexyloxy group, a heptyloxy group, or an octyloxy group; and an amino group which may be substituted with one or two alkyl groups having 1 to 6 carbon atoms, such as an amino group, a monomethylamino group, a monoethylamino group, a dimethylamino group, a diethylamino group, or a methylethylamino group.

[0017] R 3 Examples of the heterocyclic group represented by the formula (I) include aliphatic heterocyclic groups having 4 to 20 carbon atoms and aromatic heterocyclic groups having 3 to 20 carbon atoms, such as a pyrrolidine ring group, a pyrroline ring group, an imidazolidine ring group, an imidazoline ring group, an oxazoline ring group, a thiazoline ring group, a piperidine ring group, a morpholine ring group, a piperazine ring group, an indole ring group, an isoindole ring group, a quinoline ring group, a thiophene ring group, a pyrrole ring group, a thiazoline ring group, and a furan ring group.

[0018] R 3 Examples of the electron-withdrawing group represented by formula (z-1) include a halogen atom, a nitro group, a cyano group, a carboxy group, a halogenated alkyl group, a halogenated aryl group, -OCF3, -SCF3, -SF5, -SF3, -SO3H, -SO2H, and a group represented by formula (z-1). [ka] [In formula (z-1), R 222 represents a hydrogen atom, a halogen atom, or a hydrocarbon group which may have a substituent. X 1 are -CO-, -COO-, -OCO-, -CS-, -CSS-, -COS-, -CSO-, -SO-, -SO2-, and -NR 223 CO- or -CONR 224 - represents. R 223 and R 224 each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group. * represents a bond.]

[0019] Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Examples of halogenated alkyl groups include halogenated alkyl groups having 1 to 25 carbon atoms, such as trifluoromethyl, perfluoroethyl, perfluoropropyl, perfluoroisopropyl, perfluorobutyl, perfluorosec-butyl, perfluorotert-butyl, perfluoropentyl, perfluorohexyl, dichloromethyl, bromomethyl, and iodomethyl. Preferred are halogenated alkyl groups having 1 to 12 carbon atoms, more preferred are fluoroalkyl groups having 1 to 12 carbon atoms, and even more preferred are perfluoroalkyl groups having 1 to 12 carbon atoms. Examples of the halogenated aryl group include halogenated aryl groups having 6 to 18 carbon atoms, such as a fluorophenyl group, a chlorophenyl group, and a bromophenyl group. A fluoroaryl group having 6 to 18 carbon atoms is preferred, a perfluoroaryl group having 6 to 12 carbon atoms is more preferred, and a pentafluorophenyl group is even more preferred.

[0020] X 1 is preferably —CO—, —COO— or —SO 2 —. R 222 Examples of the halogen atom represented by the formula (I) include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. R 222 Examples of the hydrocarbon group represented by the formula include an aliphatic hydrocarbon group having 1 to 25 carbon atoms and an aromatic hydrocarbon group having 6 to 18 carbon atoms. Examples of the aliphatic hydrocarbon group having 1 to 25 carbon atoms include linear, branched, and cyclic alkyl groups having 1 to 25 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, tert-butyl, sec-butyl, n-pentyl, n-hexyl, 1-methylbutyl, 3-methylbutyl, n-octyl, n-decyl, 2-hexyl-octyl, and cyclohexyl groups, and alkyl groups having 1 to 12 carbon atoms are preferred. Examples of aromatic hydrocarbon groups having 6 to 18 carbon atoms include aryl groups having 6 to 18 carbon atoms, such as a phenyl group, a naphthyl group, an anthracenyl group, and a biphenyl group; and aralkyl groups having 7 to 18 carbon atoms, such as a benzyl group, a phenylethyl group, and a naphthylmethyl group. R 222 Examples of the substituent that the hydrocarbon group represented by the formula (I) may have include a halogen atom and a hydroxy group. R 223 and R 224 Examples of the alkyl group having 1 to 6 carbon atoms represented by the formula (I) include linear or branched alkyl groups having 1 to 6 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a tert-butyl group, a sec-butyl group, an n-pentyl group, an n-hexyl group, and a 1-methylbutyl group.

[0021] The group represented by formula (z-1) is -CO-R1, -CO-O-R2, -CO-NR3R 3k , -CO-S-R4, -CS-R5, -CS-O-R6, -CS-S-R7, -SO-R8, -SO2-R9(R1, R2, R3, R 3k and R4, R5, R6, R7, R8 and R9 each independently represent a hydrocarbon group which may have a substituent or a halogen atom. More preferably, —CO—R1, —CO—O—R2, —SO2—R9; More preferably, —SO2—R9; -SO2-R 10 (R 10 is even more preferably an aromatic hydrocarbon group having 6 to 18 carbon atoms which may have a substituent), -SO2CF3, -SO2CHF2, or -SO2CH2F.

[0022] R 3 is preferably an electron-withdrawing group, Cyano group, nitro group, halogenated alkyl group, halogenated aryl group, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, -CO-NR3R 3k, -CO-S-R4, -CS-R5, -CS-O-R6, -CS-S-R7, -SO-R8, -SO2-R9(R1, R2, R3, R 3k R4, R5, R6, R7, R8 and R9 each independently represent a hydrocarbon group which may have a substituent or a halogen atom, and more preferably -OCF3 or -SCF3; More preferably, it is a cyano group, a nitro group, -OCF3, -SCF3, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, or -SO2-R9; Cyano group, nitro group, -OCF3, -SCF3, -SF5, -SO2CF3, -SO2-R 10 Even more preferably, A cyano group or a nitro group is particularly preferred.

[0023] Ring W 1 is R 3Examples of the substituent include a halogen atom such as a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom; an aliphatic hydrocarbon group having 1 to 25 carbon atoms (preferably an alkyl group having 1 to 12 carbon atoms) such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, or a nonyl group; a fluoromethyl group, a difluoromethyl group, a trifluoromethyl group, a 2-fluoroethyl group, a 2,2-difluoroethyl group, a 2,2,2-trifluoroethyl group, a 1,1,2,2-tetrafluoroethyl group, a 1,1,2,2,2-pentyl ... halogenated alkyl groups having 1 to 12 carbon atoms, such as a trifluoroethyl group; alkoxy groups having 1 to 12 carbon atoms, such as a methoxy group, an ethoxy group, a propoxy group, a butoxy group, a pentyloxy group, and a hexyloxy group; alkylthio groups having 1 to 12 carbon atoms, such as a methylthio group, an ethylthio group, a propylthio group, a butylthio group, a pentylthio group, and a hexylthio group; alkylthio groups having 1 to 12 carbon atoms, such as a monofluoromethoxy group, a difluoromethoxy group, a trifluoromethoxy group, a 2-fluoroethoxy group, and a 1,1,2,2,2-pentafluoroethoxy group; Fluorinated alkoxy groups; fluorinated alkoxy groups having 1 to 12 carbon atoms, such as a trifluoromethanethioalkoxy group; amino groups which may be substituted with one or two alkyl groups having 1 to 6 carbon atoms, such as an amino group, a methylamino group, an ethylamino group, a dimethylamino group, a diethylamino group, or a methylethyl group; carbamoyl groups which may be substituted at the N-position with an alkyl group having 1 to 6 carbon atoms, such as a carbamoyl group, an N-methylcarbamoyl group, or an N,N-dimethylcarbamoyl group; methylcarbonyloxy groups, ethylcarbonyloxy groups, etc. alkylcarbonyloxy groups having 2 to 12 carbon atoms; alkylsulfonyl groups having 1 to 12 carbon atoms, such as a methylsulfonyl group or an ethylsulfonyl group; aromatic hydrocarbon groups having 6 to 25 carbon atoms, such as a phenyl group, a naphthyl group or a diphenyl group (preferably an aryl group having 6 to 18 carbon atoms); arylsulfonyl groups having 6 to 12 carbon atoms, such as a phenylsulfonyl group; alkoxysulfonyl groups having 1 to 12 carbon atoms, such as a methoxysulfonyl group or an ethoxysulfonyl group; acyl groups having 2 to 12 carbon atoms, such as an acetyl group or an ethylcarbonyl group; aldehyde groups;Examples of such alkoxycarbonyl groups include alkoxycarbonyl groups having 2 to 12 carbon atoms, such as a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, and a butyloxycarbonyl group; alkoxythiocarbonyl groups having 2 to 12 carbon atoms, such as a methoxythiocarbonyl group and an ethoxythiocarbonyl group; a cyano group; a nitro group; a hydroxyl group; a thiol group; a sulfo group; a carbamoyl group; a carboxyl group; -SF3; and -SF5.

[0024] The anion having a partial structure represented by formula (X-1) is preferably an anion represented by formula (I) to an anion represented by formula (IV) or an anion represented by formula (VIII). [ka] [In the formula, ring W 1 and R 3 have the same meanings as above. Ring W 2 , Tamaki W 3 , Tamaki W 4 , Tamaki W 5 , Tamaki W 6 , Tamaki W 7 and Ring W 14 each independently represents a ring structure, and the ring structure may have a substituent. R 1 , R 2 , R 4 , R 5 , R 12 , R 14 , R 15 , R 22 , R 24 , R 25 , R 32 , R 34 , R 35 , R 42 , R 44 , R 45 , R 52 , R 54 , R 55 , R 62 , R 64 , R 65 , R 131 , R 132 , R 134 and R 135each independently represents an electron-withdrawing group. R 13 , R 23 , R 33 , R 43 , R 53 , R 63 and R 133 represents a monovalent substituent. R 1 and R 2 may be linked to each other to form a ring. R 2 and R 3 may be linked to each other to form a ring. R 3 and R 4 may be linked to each other to form a ring. R 4 and R 5 may be linked to each other to form a ring. R 12 and R 13 may be linked to each other to form a ring. R 13 and R 14 may be linked to each other to form a ring. R 14 and R 15 may be linked to each other to form a ring. R 22 and R 23 may be linked to each other to form a ring. R 23 and R 24 may be linked to each other to form a ring. R 24 and R 25 may be linked to each other to form a ring. R 32 and R 33 may be linked to each other to form a ring. R 33 and R 34 may be linked to each other to form a ring. R 34 and R 35 may be linked to each other to form a ring. R 42 and R 43may be linked to each other to form a ring. R 43 and R 44 may be linked to each other to form a ring. R 44 and R 45 may be linked to each other to form a ring. R 52 and R 53 may be linked to each other to form a ring. R 53 and R 54 may be linked to each other to form a ring. R 54 and R 55 may be linked to each other to form a ring. R 62 and R 63 may be linked to each other to form a ring. R 63 and R 64 may be linked to each other to form a ring. R 64 and R 65 may be linked to each other to form a ring. R 131 and R 132 may be linked to each other to form a ring. R 132 and R 133 may be linked to each other to form a ring. R 133 and R 134 may be linked to each other to form a ring. R 134 and R 135 may be linked to each other to form a ring. R x1 and R x7 each independently represents a single bond or a divalent linking group. R x2 represents a trivalent linking group. R x3 represents a tetravalent linking group.

[0025] Ring W 2 , Tamaki W 3 , Tamaki W 4 , Tamaki W 5, Tamaki W 6 , Tamaki W 7 and Ring W 14 The ring structure in the ring W is not particularly limited. 2 ~Tamaki W 7 and ring 14 Each of the rings W may be a single ring or a fused ring. 2 ~Tamaki W 7 and ring 14 may be a heterocycle containing a heteroatom (for example, an oxygen atom, a sulfur atom, a nitrogen atom, etc.) as a ring component. Ring W 2 ~Tamaki W 7 and ring 14 is usually a ring having 5 to 18 carbon atoms, preferably a 5- to 7-membered ring structure, and more preferably a 6-membered ring structure. 2 ~Tamaki W 7 and ring 14 is preferably a ring structure having 5 to 7 carbon atoms, and more preferably a ring structure having 6 carbon atoms. Ring W 2 ~Tamaki W 7 and ring 14 are each preferably independently a monocyclic ring. Ring W 2 ~Tamaki W 7 and ring 14 may have a substituent, specifically, R 3 Ring W other than the substituent represented by 1 The substituents are the same as those that may be contained in the group.

[0026] Ring W 2 ~Tamaki W 7 and ring 14 The substituent that the group has is preferably an amino group which may be substituted with an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alkylthio group having 1 to 12 carbon atoms, or an alkyl group having 1 to 6 carbon atoms.

[0027] Ring W 2 ~Tamaki W 7 and ring 14 A specific example of this is the ring W 1 The same specific examples as above can be cited.

[0028] R 13 , R 23 , R 33 , R 43 , R 53 , R 63 and R 133 The monovalent substituent represented by R 3 Specific examples include monovalent aliphatic hydrocarbon groups, monovalent aromatic hydrocarbon groups, electron-withdrawing groups, electron-donating groups, heterocyclic groups, and the like. R 13 , R 23 , R 33 , R 43 , R 53 , R 63 and R 133 are preferably each independently an electron-withdrawing group, Cyano group, nitro group, halogenated alkyl group, halogenated aryl group, -CO-R1, -CO-O-R2, -CO-NR3R 3k , -CO-S-R4, -CS-R5, -CS-O-R6, -CS-S-R7, -SO-R8, -SO2-R9(R1, R2, R3, R 3k , R4, R5, R6, R7, R8 and R9 each independently represent a hydrocarbon group which may have a substituent or a halogen atom, and more preferably —OCF3, —SCF3, —SF5, —SF3, —SO2H or —SO3H; More preferably, it is a cyano group, a nitro group, -OCF3, -SCF3, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, or -SO2-R9; Cyano group, nitro group, -OCF3, -SCF3, -SF5, -SO2CF3, -SO2-R 10 Even more preferably, A cyano group or a nitro group is particularly preferred.

[0029] R 1 , R 2 , R 4 , R 5 , R 12 , R 14 , R15 , R 22 , R 24 , R 25 , R 32 , R 34 , R 35 , R 42 , R 44 , R 45 , R 52 , R 54 , R 55 , R 62 , R 64 , R 65 , R 131 , R 132 , R 134 and R 135 Examples of electron-withdrawing groups represented by the formula R 3 The electron-withdrawing groups may be the same as those represented by the following formula:

[0030] R 1 , R 2 , R 4 , R 5 , R 12 , R 14 , R 15 , R 22 , R 24 , R 25 , R 32 , R 34 , R 35 , R 42 , R 44 , R 45 , R 52 , R 54 , R 55 , R 62 , R 64 , R 65 , R 131 , R 132 , R 134 and R 135 each independently represents a cyano group, a nitro group, a halogenated alkyl group, a halogenated aryl group, -CO-R1, -CO-O-R2, or -CO-NR3R 3k , -CO-S-R4, -CS-R5, -CS-O-R6, -CS-S-R7, -SO-R8, -SO2-R9(R1, R2, R3, R 3k, R4, R5, R6, R7, R8 and R9 each independently represent a hydrocarbon group which may have a substituent or a halogen atom, and more preferably —OCF3, —SCF3, —SF5, —SF3, —SO2H or —SO3H; More preferably, it is a cyano group, a nitro group, -OCF3, -SCF3, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, or -SO2-R9; Cyano group, nitro group, -OCF3, -SCF3, -SF5, -SO2CF3, -SO2-R 10 Even more preferably, A cyano group or a nitro group is particularly preferred.

[0031] R 1 and R 2 may be bonded to each other to form a ring. 1 and R 2 The ring formed by bonding R may be a monocyclic ring or a condensed ring, but is preferably a monocyclic ring. 1 and R 2 The ring formed by bonding together may contain a heteroatom (nitrogen atom, oxygen atom, sulfur atom) or the like as a ring component. R 1 and R 2 The ring formed by bonding together is usually a 3- to 10-membered ring, preferably a 5- to 7-membered ring, and more preferably a 5- or 6-membered ring.

[0032] R 1 and R 2 Examples of the ring formed by bonding together include the ring structures described below. [ka] [In the formula, * represents a bond.]

[0033] R 1 and R 2and (w-36) are bonded to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0034] R 4 and R 5 The ring formed by connecting these is R 1 and R 2 The ring formed by connecting R 4 and R 5 and (w-36) are linked to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0035] R 14 and R 15 The ring formed by connecting these is R 1 and R 2 The ring formed by connecting R 14 and R 15 and (w-36) are linked to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0036] R 24 and R 25 The ring formed by connecting these is R 1 and R 2The ring formed by connecting R 24 and R 25 and (w-36) are linked to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0037] R 34 and R 35 The ring formed by connecting these is R 1 and R 2 The ring formed by connecting R 34 and R 35 and (w-36) are linked to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0038] R 44 and R 45 The ring formed by connecting these is R 1 and R 2 The ring formed by connecting R 44 and R 45 and (w-36) are linked to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0039] R 54 and R 55The ring formed by connecting these is R 1 and R 2 The ring formed by connecting R 54 and R 55 and (w-36) are linked to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0040] R 64 and R 65 The ring formed by connecting these is R 1 and R 2 The ring formed by connecting R 64 and R 65 and (w-36) are linked to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0041] R 131 and R 132 The ring formed by connecting these is R 1 and R 2 The ring formed by connecting R 131 and R 132 and (w-36) are linked to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0042] R 134 and R 135 The ring formed by connecting these is R 1 and R 2 The ring formed by connecting R 134 and R 135 and (w-36) are linked to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0043] R 2 and R 3 may be linked to each other to form a ring. 2 and R 3 The ring formed by connecting and has ring W as a ring component. 1 Also, R 2 and R 3 and the ring formed by connecting W 1 R forms a condensed ring. 2 and R 3 and the ring formed by bonding together and ring W 1 Examples of the fused ring formed by the above include ring structures represented by formulas (w11-1) to (w11-12) shown below. [ka] [In the formula, ring W 1 has the same meaning as above. *1 is R 1 *2 represents the bond with R 4 *3 represents the bond with R 5 Represents a bond with . R f1 , R f2 and R f3 each independently represents an electron-withdrawing group, a hydrocarbon group, or a hydroxyl group. m1 represents an integer of 0 to 6, m2 represents an integer of 0 to 4, and m3 represents an integer of 0 to 2.

[0044] R 2 and R 3 and the ring formed by bonding together and ring W 1 More specific examples of the fused ring formed by the above include the ring structures shown below. [ka]

[0045] R 12 and R 13 may be linked to each other to form a ring. 12 and R 13 The ring formed by connecting and has ring W as a ring component. 2 Also, R 12 and R 13 and the ring formed by connecting W 2 Specifically, R 2 and R 3 and the ring formed by bonding together and ring W 1 and the fused ring formed by

[0046] R 22 and R 23 may be linked to each other to form a ring. 22 and R 23 The ring formed by connecting and has ring W as a ring component. 3 Also, R 22 and R 23 and the ring formed by connecting W 3 Specifically, R 2 and R 3 and the ring formed by bonding together and ring W 1 and the fused ring formed by

[0047] R 32 and R 33 may be linked to each other to form a ring.32 and R 33 The ring formed by connecting and has ring W as a ring component. 4 Also, R 32 and R 33 and the ring formed by connecting W 4 Specifically, R 2 and R 3 and the ring formed by bonding together and ring W 1 and the fused ring formed by

[0048] R 42 and R 43 may be linked to each other to form a ring. 42 and R 43 The ring formed by connecting and has ring W as a ring component. 5 Also, R 42 and R 43 and the ring formed by connecting W 5 Specifically, R 2 and R 3 and the ring formed by bonding together and ring W 1 and the fused ring formed by

[0049] R 52 and R 53 may be linked to each other to form a ring. 52 and R 53 The ring formed by connecting and has ring W as a ring component. 6 Also, R 52 and R 53 and the ring formed by connecting W 6 Specifically, R 2 and R 3 and the ring formed by bonding together and ring W 1 and the fused ring formed by

[0050] R 62 and R 63 may be linked to each other to form a ring. 62 and R63 The ring formed by connecting and has ring W as a ring component. 7 Also, R 62 and R 63 and the ring formed by connecting W 7 Specifically, R 2 and R 3 and the ring formed by bonding together and ring W 1 and the fused ring formed by

[0051] R 132 and R 133 may be linked to each other to form a ring. 132 and R 133 The ring formed by connecting and has ring W as a ring component. 14 Contains a double bond attached to Also, R 132 and R 133 and the ring formed by connecting W 14 and form a condensed ring. Specifically, R 2 and R 3 and the ring formed by bonding together and ring W 1 and the fused ring formed by

[0052] R 3 and R 4 may be linked to each other to form a ring. 3 and R 4 The ring formed by connecting and has ring W as a ring component. 1 Also, R 3 and R 4 and the ring formed by connecting W 1 R forms a condensed ring. 3 and R 4 and the ring formed by bonding together and ring W 1 Specific examples of the fused ring formed by the above include the rings described below. [ka] [In the formula, ring W1 has the same meaning as above. *4 is R 1 *5 represents the bond with R 2 *6 represents the bond with R 5 Represents a bond with . R f4 , R f5 and R f6 each independently represents an electron-withdrawing group, a hydrocarbon group, or a hydroxyl group. m4 represents an integer of 0 to 6, m5 represents an integer of 0 to 4, and m6 represents an integer of 0 to 2.

[0053] R 3 and R 4 and the ring formed by bonding together and ring W 1 More specific examples of the fused ring formed by the above include the ring structures shown below. [ka]

[0054] R 13 and R 14 may be linked to each other to form a ring. 13 and R 14 The ring formed by connecting and has ring W as a ring component. 2 Also, R 13 and R 14 and the ring formed by connecting W 2 Specifically, R 3 and R 4 and the ring formed by bonding together and ring W 1 and the fused ring formed by

[0055] R 23 and R 24 may be linked to each other to form a ring. 23 and R 24 The ring formed by connecting and has ring W as a ring component. 3 Also, R 23 and R 24and the ring formed by connecting W 3 Specifically, R 3 and R 4 and the ring formed by bonding together and ring W 1 and the fused ring formed by

[0056] R 33 and R 34 may be linked to each other to form a ring. 33 and R 34 The ring formed by connecting and has ring W as a ring component. 4 Also, R 33 and R 34 and the ring formed by connecting W 4 Specifically, R 3 and R 4 and the ring formed by bonding together and ring W 1 and the fused ring formed by

[0057] R 43 and R 44 may be linked to each other to form a ring. 43 and R 44 The ring formed by connecting and has ring W as a ring component. 5 Also, R 43 and R 44 and the ring formed by connecting W 5 Specifically, R 3 and R 4 and the ring formed by bonding together and ring W 1 and the fused ring formed by

[0058] R 53 and R 54 may be linked to each other to form a ring. 53 and R 54 The ring formed by connecting and has ring W as a ring component. 6 Also, R 53 and R 54 and the ring formed by connecting W6 Specifically, R 3 and R 4 and the ring formed by bonding together and ring W 1 and the fused ring formed by

[0059] R 63 and R 64 may be linked to each other to form a ring. 63 and R 64 The ring formed by connecting and has ring W as a ring component. 7 Also, R 63 and R 64 and the ring formed by connecting W 7 Specifically, R 3 and R 4 and the ring formed by bonding together and ring W 1 and the fused ring formed by

[0060] R 133 and R 134 may be linked to each other to form a ring. 133 and R 134 The ring formed by connecting and has ring W as a ring component. 14 Also, R 133 and R 134 and the ring formed by connecting W 14 Specifically, R 3 and R 4 and the ring formed by bonding together and ring W 1 and the fused ring formed by

[0061] R x1 and R x7 Examples of the divalent linking group represented by the formula (I) include, independently, a divalent aliphatic hydrocarbon group having 1 to 18 carbon atoms which may have a substituent, or a divalent aromatic hydrocarbon group having 6 to 18 carbon atoms which may have a substituent. The -CH2- contained in the divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group may be -O-, -S-, -NR 1B -(R1B represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms), and may be substituted with -CO-, -SO2-, -SO-, or -PO3-. Furthermore, examples of the substituent that the divalent aliphatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, an amino group, and an aryl group having 6 to 16 carbon atoms. Examples of the substituent that the divalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxyl group, an amino group, and an aldehyde group.

[0062] R x1 and R x7 Specific examples of the divalent linking group represented by the formula include the linking groups shown below: In the formula, * represents a bond. [ka]

[0063] [ka]

[0064] [ka]

[0065] [ka]

[0066] [ka]

[0067] [ka]

[0068] R x1 and R x7are preferably each independently a divalent aliphatic hydrocarbon group having 1 to 12 carbon atoms which may have a substituent, or a divalent aromatic hydrocarbon group having 6 to 12 carbon atoms which may have a substituent (-CH- contained in the divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group is not -O-, -S-, -NR 1B -, -CO-, -SO2-) is preferred, and the linking groups described below are more preferred. [ka]

[0069] R x2 Examples of the trivalent linking group represented by the formula (I) include a trivalent aliphatic hydrocarbon group having 1 to 18 carbon atoms which may have a substituent, and a trivalent aromatic hydrocarbon group having 6 to 18 carbon atoms which may have a substituent. The -CH2- contained in the trivalent aliphatic hydrocarbon group and the trivalent aromatic hydrocarbon group can be -O-, -S-, -CS-, -CO-, -SO-, -SO2-, -NR 11B -(R 11B represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. Examples of the substituent that the trivalent aliphatic hydrocarbon group and the trivalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, and an amino group. R x2 is preferably a trivalent aliphatic hydrocarbon group having 1 to 18 carbon atoms (-CH2- contained in the trivalent aliphatic hydrocarbon group may be replaced by -O-, -CO-, or -SO2-) or a trivalent aromatic hydrocarbon group having 6 to 18 carbon atoms (-CH2- contained in the trivalent aromatic hydrocarbon group may be replaced by -O-, -CO-, or -SO2-). R x2 Specific examples of the trivalent linking group represented by the formula include the linking groups shown below. [ka]

[0070] [ka]

[0071] [ka]

[0072] R x3 Examples of the tetravalent linking group represented by the formula (I) include a tetravalent aliphatic hydrocarbon group having 1 to 18 carbon atoms which may have a substituent, and a tetravalent aromatic hydrocarbon group having 6 to 18 carbon atoms which may have a substituent. The -CH2- contained in the tetravalent aliphatic hydrocarbon group and the tetravalent aromatic hydrocarbon group can be -O-, -S-, -CS-, -CO-, -SO-, -SO2-, -NR 11C -(R 11C represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. Examples of the substituent that the tetravalent aliphatic hydrocarbon group and the tetravalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, and an amino group. R x3 is preferably a tetravalent aliphatic hydrocarbon group having 1 to 18 carbon atoms (-CH2- contained in the tetravalent aliphatic hydrocarbon group may be replaced by -O-, -CO-, or -SO2-) or a tetravalent aliphatic hydrocarbon group having 6 to 18 carbon atoms (-CH2- contained in the tetravalent aromatic hydrocarbon group may be replaced by -O-, -CO-, or -SO2-). R x3 Specific examples of the tetravalent linking group represented by the formula include the linking groups shown below. [ka]

[0073] [ka]

[0074] The anion represented by formula (I) is more preferably an anion represented by formula (IA). [ka] [In formula (IA), R 1 , R 2 , R 3 , R 4 and R 5 have the same meanings as above. R E1 , R E2 , R E3 , R E4 , R E5 and R E6 each independently represents a hydrogen atom, a hydrocarbon group having 1 to 25 carbon atoms, or an alkoxy group.] In formula (IA), R 1 , R 2 , R 3 , R 4 and R 5 At least one selected from the group consisting of a cyano group, a nitro group, a halogenated alkyl group, a halogenated aryl group, -SCF3, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, and -CO-NR3R 3k , -CO-S-R4, -CS-R5, -CS-O-R6, -CS-S-R7, -SO-R8, -SO2-R9(R1, R2, R3, R 3k R4, R5, R6, R7, R8 and R9 each independently represent a hydrocarbon group which may have a substituent or a halogen atom, preferably -OCF3 or -SCF3; More preferably, it is a cyano group, a nitro group, -OCF3, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, or -SO2-R9; More preferably, it is a cyano group, a nitro group, —CO—R1, —CO—O—R2, —SO2—R9, —OCF3, —SCF3 or —SF5; Cyano group, nitro group, -OCF3, -SCF3, -SF5, -SO2CF3, -SO2-R 10 (R 10is even more preferably an aromatic hydrocarbon group having 6 to 18 carbon atoms which may have a substituent), A cyano group or a nitro group is particularly preferred.

[0075] Examples of the anion represented by formula (I) include the anions described below. [ka]

[0076] [ka]

[0077] [ka]

[0078] [ka]

[0079] [ka]

[0080] [ka]

[0081] Examples of the anion represented by formula (II) include the anions described below. [ka]

[0082] [ka]

[0083] [ka]

[0084] [ka]

[0085] [ka]

[0086] [ka]

[0087] [ka]

[0088] [ka]

[0089] [ka]

[0090] [ka]

[0091] [ka]

[0092] Examples of the anion represented by formula (III) include the anions described below. [ka]

[0093] [ka]

[0094] [ka]

[0095] [ka]

[0096] [ka]

[0097] [ka]

[0098] [ka]

[0099] [ka]

[0100] [ka]

[0101] [ka]

[0102] Examples of the anion represented by formula (IV) include the anions shown below. [ka]

[0103] [ka]

[0104] [ka]

[0105] [ka]

[0106] Examples of the anion represented by formula (VIII) include the anions shown below. [ka]

[0107] [ka]

[0108] Ring W 1 has at least one substituent R 3 In the case where the anion has a partial structure represented by formula (X) other than the above, examples include anions represented by formulas (V) to (VII). [ka] [In the formula, ring W 1 , R 1 , R 2 , R 4 and R 5 have the same meanings as above. Ring W 8 , Tamaki W 9 , Tamaki W 10 , Tamaki W 11 , Tamaki W 12 and Ring W 13 each independently represents a ring structure, and the ring structure may have a substituent. R 71 , R 72 , R74 , R 75 , R 81 , R 82 , R 84 , R 85 , R 91 , R 92 , R 94 , R 95 , R 101 , R 102 , R 104 , R 105 , R 111 , R 112 , R 114 , R 115 , R 121 , R 122 , R 124 and R 125 each independently represents an electron-withdrawing group. R 71 and R 72 may be linked to each other to form a ring. R 74 and R 75 may be linked to each other to form a ring. R 81 and R 82 may be linked to each other to form a ring. R 84 and R 85 may be linked to each other to form a ring. R 91 and R 92 may be linked to each other to form a ring. R 94 and R 95 may be linked to each other to form a ring. R 101 and R 102 may be linked to each other to form a ring. R 104 and R 105 may be linked to each other to form a ring. R 111 and R 112 may be linked to each other to form a ring. R 114 and R 115 may be linked to each other to form a ring. R 121 and R 122may be linked to each other to form a ring. R 124 and R 125 may be linked to each other to form a ring. R x4 represents a single bond or a divalent linking group. R x5 represents a trivalent linking group. R x6 represents a tetravalent linking group.

[0109] Ring W 8 , Tamaki W 9 , Tamaki W 10 , Tamaki W 11 , Tamaki W 12 and Ring W 13 The ring structure in the ring W is not particularly limited. 9 ~Tamaki W 12 Each of the rings W may be a single ring or a fused ring. 9 ~Tamaki W 12 may be a heterocycle containing a heteroatom (for example, an oxygen atom, a sulfur atom, a nitrogen atom, etc.) as a ring component. Ring W 9 ~Tamaki W 12 is usually a ring having 5 to 18 carbon atoms, preferably a 5- to 7-membered ring structure, and more preferably a 6-membered ring structure. 9 ~Tamaki W 12 is preferably a ring structure having 5 to 7 carbon atoms, and more preferably a ring structure having 6 carbon atoms. Ring W 9 ~Tamaki W 12 are each preferably independently a monocyclic ring. Ring W 9 ~Tamaki W 12 may have a substituent, specifically, R 3 Ring W other than the substituent represented by 1 The substituents are the same as those that may be contained in the group.

[0110] Ring W 9 ~Tamaki W 12The substituent that the group has is preferably an amino group which may be substituted with an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alkylthio group having 1 to 12 carbon atoms, or an alkyl group having 1 to 6 carbon atoms.

[0111] Ring W 9 ~Tamaki W 12 A specific example of this is the ring W 1 The same specific examples as above can be cited.

[0112] R 71 , R 72 , R 74 , R 75 , R 81 , R 82 , R 84 , R 85 , R 91 , R 92 , R 94 , R 95 , R 101 , R 102 , R 104 , R 105 , R 111 , R 112 , R 114 , R 115 , R 121 , R 122 , R 124 and R 125 Examples of electron-withdrawing groups represented by the formula R 3 The electron-withdrawing groups may be the same as those represented by the following formula:

[0113] R 71 , R 72 , R 74 , R 75 , R 81 , R 82 , R 84 , R 85 , R 91 , R 92 , R 94 , R 95 , R 101 , R 102 , R 104 , R 105 , R 111 , R 112 , R 114 , R 115 , R121 , R 122 , R 124 and R 125 each independently represents a cyano group, a nitro group, a halogenated alkyl group, a halogenated aryl group, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, or -CO-NR3R 3k , -CO-S-R4, -CS-R5, -CS-O-R6, -CS-S-R7, -SO-R8, -SO2-R9(R1, R2, R3, R 3k R4, R5, R6, R7, R8 and R9 each independently represent a hydrocarbon group which may have a substituent or a halogen atom, preferably -OCF3 or -SCF3; More preferably, it is a cyano group, a nitro group, -OCF3, -SCF3, -SF5, -SF3, -SO3H, -SO2H, -CO-R1, -CO-O-R2, or -SO2-R9; More preferably, it is a cyano group, a nitro group, —CO—R1, —CO—O—R2, —SO2—R9, —OCF3, —SCF3 or —SF5; Cyano group, nitro group, -OCF3, -SCF3, -SF5, -SO2CF3, -SO2-R 10 (R 10 is even more preferably an aromatic hydrocarbon group having 6 to 18 carbon atoms which may have a substituent), A cyano group or a nitro group is particularly preferred.

[0114] R 71 and R 72 may be bonded to each other to form a ring. 71 and R 72 The ring formed by bonding R may be a monocyclic ring or a condensed ring, but is preferably a monocyclic ring. 71 and R 72 The ring formed by bonding together may contain a heteroatom (nitrogen atom, oxygen atom, sulfur atom) or the like as a ring component. R 71 and R 72The ring formed by bonding together is usually a 3- to 10-membered ring, preferably a 5- to 7-membered ring, and more preferably a 5- or 6-membered ring. R 71 and R 72 The ring formed by bonding with each other is R 1 and R 2 and the ring formed by bonding together are exemplified. R 71 and R 72 and (w-36) are bonded to each other to form a ring, which is preferably a ring represented by any of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0115] R 74 and R 75 The ring formed by connecting these is R 71 and R 72 The ring formed by connecting R 74 and R 75 and (w-36) are bonded to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0116] R 81 and R 82 The ring formed by connecting these is R 71 and R 72 The ring formed by connecting R 81 and R 82and (w-36) are bonded to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0117] R 84 and R 85 The ring formed by connecting these is R 71 and R 72 The ring formed by connecting R 84 and R 85 and (w-36) are bonded to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0118] R 91 and R 92 The ring formed by connecting these is R 71 and R 72 The ring formed by connecting R 91 and R 92 and (w-36) are bonded to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0119] R 94 and R 95 The ring formed by connecting these is R 71 and R 72The ring formed by connecting R 94 and R 95 and (w-36) are bonded to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0120] R 101 and R 102 The ring formed by connecting these is R 71 and R 72 The ring formed by connecting R 101 and R 102 and (w-36) are bonded to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0121] R 104 and R 105 The ring formed by connecting these is R 71 and R 72 The ring formed by connecting R 104 and R 105 and (w-36) are bonded to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0122] R 111 and R 112The ring formed by connecting these is R 71 and R 72 The ring formed by connecting R 111 and R 112 and (w-36) are bonded to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0123] R 114 and R 115 The ring formed by connecting these is R 71 and R 72 The ring formed by connecting R 114 and R 115 and (w-36) are bonded to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0124] R 121 and R 122 The ring formed by connecting these is R 71 and R 72 The ring formed by connecting R 121 and R 122 and (w-36) are bonded to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0125] R 124 and R 125 The ring formed by connecting these is R 71 and R 72 The ring formed by connecting R 124 and R 125 and (w-36) are bonded to each other to form a ring structure represented by any one of formulas (w-1) to (w-15), (w-17), (w-31), (w-32), (w-35) to (w-42), and (w-44), and more preferably a ring structure represented by any one of formulas (w-1) to (w-6), (w-13), (w-35), (w-36), (w-42), and (w-44).

[0126] R x4 Examples of the divalent linking group represented by the formula (I) include a divalent aliphatic hydrocarbon group having 1 to 18 carbon atoms which may have a substituent, and a divalent aromatic hydrocarbon group having 6 to 18 carbon atoms which may have a substituent. The -CH2- contained in the divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group may be -O-, -S-, -NR 1B -(R 1B represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms), and may be substituted with -CO-, -SO2-, -SO-, or -PO3-. Furthermore, examples of the substituent that the divalent aliphatic hydrocarbon group and the divalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, and an amino group. R x4 Specific examples of the divalent linking group represented by R x1 Specific examples of the divalent linking group represented by the formula: R x4 The divalent linking group represented by the following formula is preferred. [ka]

[0127] R x5Examples of the divalent linking group represented by the formula (I) include a trivalent aliphatic hydrocarbon group having 1 to 18 carbon atoms which may have a substituent, or a trivalent aromatic hydrocarbon group having 6 to 18 carbon atoms which may have a substituent. The -CH2- contained in the trivalent aliphatic hydrocarbon group can be -O-, -S-, -CS-, -CO-, -SO-, -NR 11B (R 11B represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. Examples of the substituent that the trivalent aliphatic hydrocarbon group and the trivalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, and an amino group. R x5 The trivalent linking group represented by the following formula is preferably a trivalent aliphatic hydrocarbon group having 1 to 12 carbon atoms which may have a substituent. R x5 Specific examples of the trivalent linking group represented by R x2 Specific examples of the trivalent linking group represented by the formula: R x5 The linking group represented by the formula (I) is preferably a linking group described below. [ka]

[0128] R x6 Examples of the tetravalent linking group represented by the formula (I) include a tetravalent aliphatic hydrocarbon group having 1 to 18 carbon atoms which may have a substituent, and a tetravalent aromatic hydrocarbon group having 6 to 18 carbon atoms which may have a substituent. The -CH2- contained in the tetravalent aliphatic hydrocarbon group can be -O-, -S-, -CS-, -CO-, -SO-, -NR 11C -(R 11C represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. Examples of the substituent that the tetravalent aliphatic hydrocarbon group and the tetravalent aromatic hydrocarbon group may have include a halogen atom, a hydroxyl group, a carboxy group, and an amino group. R x6Preferably, the tetravalent linking groups represented by the following formula are each independently a tetravalent aliphatic hydrocarbon group having 1 to 12 carbon atoms which may have a substituent. R x6 Specific examples of the tetravalent linking group represented by R x3 Specific examples of the tetravalent linking group represented by the following formula are the same as those of the tetravalent linking group represented by the following formula: R x6 The tetravalent linking group represented by the following formula is preferably a linking group described below. [ka]

[0129] Examples of the anion represented by formula (V) include the anions shown below. [ka]

[0130] [ka]

[0131] Examples of the anion represented by formula (VI) include the anions shown below. [ka]

[0132] [ka]

[0133] Examples of the anion represented by formula (VII) include the anions shown below. [ka]

[0134] [ka]

[0135] [ka]

[0136] <cation> The compound of the present invention is composed of an anion represented by formula (X) and a paired cation. The combination is not limited as long as the valence of the anion represented by formula (X) and the cation are the same. When the anion represented by formula (X) has a valence of 2 or more, the cation may be a cation with the same valence as the anion represented by formula (X), or may have multiple monovalent cations so that the valence is the same as that of the anion represented by formula (X). Furthermore, the compound may have a monovalent cation and a non-monovalent cation (e.g., a divalent cation) so long as the valence is the same as that of the anion represented by formula (X). On the other hand, when the valence of the cation is 2 or more, the compound may have multiple monovalent anions represented by formula (X) so that the valence is the same as that of the cation. Furthermore, the compound may have a monovalent anion represented by formula (X) and a non-monovalent anion represented by formula (X) so long as the valence is the same as that of the cation.

[0137] The cation may be an organic cation or an inorganic cation. When the anion represented by formula (X) has a valence of 2 or more, compound (X) may have both an organic cation and an inorganic cation as the cation.

[0138] Examples of organic cations include pyridinium cations such as N-methylpyridinium, N-ethylpyridinium, N-propylpyridinium, N-ethyl-2-methylpyridinium, N-ethyl-3-methylpyridinium, 1-ethyl-3-(hydroxymethyl)pyridinium, N-butylpyridinium, N-butyl-4-methylpyridinium, N-butyl-3-methylpyridinium, N-hexylpyridinium, N-octylpyridinium, N-octyl-4-methylpyridinium, 1,1'-dimethyl-4,4'-bipyridinium, and 1,1'-dibenzyl-4,4'-bipyridinium; piperidinium cations such as 1-butyl-1-methylpiperidinium and 1-methyl-1-propylpiperidinium; pyrrolidinium cations such as 1-allyl-1-methylpyrrolidinium, 1-butyl-1-methylpyrrolidinium, 1-ethyl-1-methylpyrrolidinium, 1-methyl-1-propylpyrrolidinium, 1-(2-methoxyethyl)-1-methylpyrrolidinium, 1-methyl-1-n-octylpyrrolidinium, and 1-methyl-1-pentylpyrrolidinium; Cations having a pyrroline skeleton, such as 2-methyl-1-pyrrolinium; imidazolium cations such as 1-butyl-2,3-dimethylimidazolium, 3,3'-(butane-1,4-diyl)bis(1-vinyl-3-imidazolium), 1-benzyl-3-methylimidazolium, 1,3-dimethylimidazolium, 1,2-dimethyl-3-propylimidazolium, 1-decyl-3-methylimidazolium, 1-dodecyl-3-methylimidazolium, 1-ethyl-2,3-dimethylimidazolium, 3-ethyl-1-vinylimidazolium, 3-ethyl-1-vinylimidazolium, 1-methyl-3-(4-sulfobutyl)imidazolium, 1-ethyl-3-methylimidazolium, and 1-butyl-3-methylimidazolium; ammonium cations such as amyltriethylammonium, butyltrimethylammonium, benzyl(ethyl)dimethylammonium, cyclohexyltrimethylammonium, diethyl(methyl)propylammonium, diethyl(2-methoxyethyl)methylammonium, ethyl(2-methoxyethyl)dimethylammonium, ethyl(dimethyl)(2-phenylethyl)ammonium, methyltri-n-octylammonium, tetrabutylammonium, tetrahexylammonium, tetrapentylammonium, tetra-n-octylammonium, tetraheptylammonium, tetrapropylammonium, and N,N,N,N',N',N'-hexamethyl-3-[2-[(trimethylammonio)ethyl]-1,5-pentanediaminium; trialkylsulfonium cations such as trimethylsulfonium, tributylsulfonium, and triethylsulfonium; phosphonium cations such as tributylhexadecylphosphonium, tributylmethylphosphonium, tributyl-n-octylphosphonium, tributyl-n-octylphosphonium, tetra-n-octylphosphonium, tributyl(2-methoxyethyl)phosphonium, tributylmethylphosphonium, trihexyl(tetradecyl)phosphonium, and trihexyl(tetradecyl)phosphonium; morpholinium cations such as 4-ethyl-4-methylmorpholinium; Examples include triarylmethane cations such as triphenylmethylium.

[0139] Inorganic cations include alkali metal ions such as lithium ion, sodium ion, potassium ion, rubidium ion, and cesium ion; Monovalent metal ions such as copper(I) ions, silver ions, and iron(I) ions; alkaline earth metal ions such as beryllium ions, magnesium ions, calcium ions, strontium ions, and barium ions; Divalent metal ions such as copper (II) ions, nickel ions, cobalt ions, iron (II) ions, manganese ions, palladium ions, zinc ions, and germanium (IV) ions; trivalent metal ions such as aluminum ions, cobalt (III) ions, iron (III) ions, chromium (III) ions, scandium ions, yttrium ions, ruthenium (III) ions, gallium ions, and indium ions; tetravalent metal ions such as titanium ions, vanadium (IV) ions, zirconium ions, hafnium ions, germanium (IV) ions, and molybdenum (IV) ions; NH4 + etc.

[0140] The cation is preferably an alkali metal ion, an alkaline earth metal ion, a copper (I) ion, a copper (II) ion, a nickel ion, a cobalt (III) ion, an iron (II) ion, an iron (III) ion, a palladium ion, or an organic cation, more preferably a potassium ion, a calcium ion, a barium ion, a magnesium ion, a copper (I) ion, a copper (II) ion, a nickel ion, or an organic cation, and even more preferably a potassium ion or an organic cation.

[0141] Examples of compound (X) include the compounds listed in the following Tables 1 to 9. Note that compound (1) in Table 1 is the compound shown below. [ka]

[0142] [Table 1]

[0143] [Table 2]

[0144] [Table 3]

[0145] [Table 4]

[0146] [Table 5]

[0147] [Table 6]

[0148] [Table 7]

[0149] [Table 8]

[0150] [Table 9]

[0151] Compound (X) having an anion represented by formula (I) (hereinafter, may be referred to as compound (I)) includes compounds (1) to (63), and is preferably compound (2), compound (3), compounds (7) to (11), compounds (13) to (18), compound (24), compound (28), compound (31), compound (32), compound (37), compounds (40) to (44), compound (46), compound (47), compound (49), compound (50), compound (55), compound (58), or compound (60).

[0152] Compound (X) having an anion represented by formula (II) (hereinafter, may be referred to as compound (II)) includes compounds (64) to (92), and is preferably compound (64), compound (65), compound (67), compound (70), compound (72), compounds (75) to (77), compound (79), compound (80), compound (83), compound (84), compound (86), or compound (87). Compound (X) having an anion represented by formula (III) (hereinafter, may be referred to as compound (III)) includes compounds (93) to (118), and is preferably compound (93), compound (94), compound (96), compound (101) to compound (105), compound (107), compound (109), compound (111), compound (115), or compound (116). Compound (X) having an anion represented by formula (IV) (hereinafter, may be referred to as compound (IV)) includes compounds (119) to (129), and is preferably compound (125).

[0153] Compound (X) having an anion represented by formula (V) (hereinafter, may be referred to as compound (V)) includes compounds (130) to (139), and is preferably compound (130), compound (131), compound (134), or compound (135). Compound (X) having an anion represented by formula (VI) (hereinafter, may be referred to as compound (VI)) includes compounds (140) to (144), and is preferably compound (140), compound (142), or compound (144). Examples of the compound (X) having an anion represented by formula (VII) (hereinafter, sometimes referred to as compound (VII)) include compounds (145) to (153). Examples of the compound (X) having an anion represented by formula (VIII) (hereinafter, sometimes referred to as compound (VIII)) include compounds (154) to (163).

[0154] <Method for producing compound (I)> Compound (I) can be obtained, for example, by reacting a compound represented by formula (M-1) (hereinafter, sometimes referred to as compound (M-1)) with a compound represented by formula (M-2) (hereinafter, sometimes referred to as compound (M-2)). [ka] [In formula (M-1), R 3 , R 4 and R 5 has the same meaning as above, and the ring W 1A represents a ring structure. In formula (M-2), R 1 and R 2 has the same meaning as above.]

[0155] The reaction of compound (M-1) with compound (M-2) is usually carried out by mixing compound (M-1) with compound (M-2), and it is preferable to add compound (M-2) to a mixture of a base and compound (M-1). The reaction of compound (M-1) with compound (M-2) is preferably carried out further in the presence of a methylating agent, It is more preferable to add compound (M-2) to a mixture of compound (M-1), a methylating agent and a base.

[0156] Examples of the base include metal hydroxides (preferably alkali metal hydroxides) such as sodium hydroxide, lithium hydroxide, potassium hydroxide, cesium hydroxide, rubidium hydroxide, calcium hydroxide, barium hydroxide, and magnesium hydroxide; metal alkoxides (preferably alkali metal alkoxides) such as sodium methoxide, potassium methoxide, lithium methoxide, sodium ethoxide, sodium isopropoxide, sodium tertiary butoxide, and potassium tertiary butoxide; metal hydrides such as lithium hydride, sodium hydride, potassium hydride, lithium aluminum hydride, sodium borohydride, aluminum hydride, and sodium aluminum hydride; metal oxides such as calcium oxide and magnesium oxide; metal carbonates (preferably alkaline earth metal carbonates) such as sodium bicarbonate, sodium carbonate, and potassium carbonate; organic alkyl metal compounds such as butyllithium, tertiary butyllithium, methyllithium, and Grignard reagents; amine compounds (preferably tertiary amines such as triethylamine and diisopropylethylamine) such as ammonia, triethylamine, diisopropylethylamine, ethanolamine, pyrrolidine, piperidine, diazabicycloundecene, diazabicyclononene, guanidine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, pyridine, aniline, dimethoxyaniline, ammonium acetate, and β-alanine; metal amide compounds (preferably alkali metal amides) such as lithium diisopropylamide, sodium amide, and potassium hexamethyldisilazide; sulfonium compounds such as trimethylsulfonium hydroxide; iodonium compounds such as diphenyliodonium hydroxide; and phosphazene bases. The amount of the base used is usually 0.1 to 10 mol, preferably 0.5 to 5 mol, per 1 mol of compound (M-1).

[0157] Examples of the methylating agent include iodomethane, dimethyl sulfate, methyl methanesulfonate, methyl fluorosulfonate, methyl paratoluenesulfonate, methyl trifluoromethanesulfonate, and trimethyloxonium tetrafluoroborate. The amount of the methylating agent used is usually 0.1 to 10 mol, preferably 0.5 to 5 mol, per 1 mol of compound (M-1).

[0158] The reaction of compound (M-1) with compound (M-2) may be carried out in the presence of a solvent. Examples of the solvent include acetonitrile, benzene, toluene, acetone, ethyl acetate, chloroform, dichloroethane, monochlorobenzene, methanol, ethanol, isopropanol, tert-butanol, 2-butanone, tetrahydrofuran, diethyl ether, dimethyl sulfoxide, N,N-dimethylacetamide, N,N-dimethylformamide, and water. Preferred are acetonitrile, tetrahydrofuran, chloroform, dichloromethane, and diethyl ether, more preferred are acetonitrile, tetrahydrofuran, and chloroform, and even more preferred is acetonitrile. The solvent is preferably a dehydrated solvent.

[0159] The reaction time of the compound (M-1) and the compound (M-2) is usually 0.1 to 10 hours, preferably 0.2 to 3 hours. The reaction temperature of the compound (M-1) and the compound (M-2) is usually from -50 to 150°C, and preferably from -20 to 100°C. The amount of compound (M-2) used is usually 0.1 to 10 mol, preferably 0.5 to 5 mol, per 1 mol of compound (M-1).

[0160] Examples of the compound (M-1) include the compounds shown below. [ka]

[0161] As the compound (M-2), a commercially available product may be used, and examples thereof include mantonitrile.

[0162] Compound (I), obtained by reacting compound (M-1) with compound (M-2) in the presence of a base, usually has a cation derived from the base as a counter cation. When it is desired to exchange the cation of compound (I) with a desired cation, ion exchange can be performed by mixing compound (I) with a salt having the desired cation. The ion exchange may be performed in the presence of a solvent. Examples of salts having a desired cation include chloride salts consisting of the desired cation and chloride ions, bromide salts consisting of the desired cation and bromide ions, iodide salts consisting of the desired cation and iodide ions, fluoride salts consisting of the desired cation and fluoride ions, nitrates consisting of the desired cation and nitrate ions, sulfates consisting of the desired cation and sulfate ions, perchlorates consisting of the desired cation and perchlorate ions, sulfonates consisting of the desired cation and sulfonate ions, carboxylates consisting of the desired cation and carboxylate ions, hypochlorites consisting of the desired cation and hypochlorite ions, hexafluorophosphate salts consisting of the desired cation and hexafluorophosphate, and imide salts consisting of the desired cation and imide.

[0163] Compound (M-1) can be obtained by reacting a compound represented by formula (M-3) (hereinafter, sometimes referred to as compound (M-3)) with a compound represented by formula (M-4) (hereinafter, sometimes referred to as compound (M-4)). [ka] [In formula (M-3), ring W 1A , R 4 and R 5 has the same meaning as above. In formula (M-4), R 3 has the same meaning as above, and E1 represents a leaving group.

[0164] Examples of the leaving group represented by E1 include a halogen atom, a p-toluenesulfonyl group, and a trifluoromethylsulfonyl group.

[0165] The reaction between the compound (M-3) and the compound (M-4) is carried out by mixing the compound (M-3) and the compound (M-4). The amount of compound (M-4) used is usually 0.1 to 5 moles, preferably 0.5 to 2 moles, per mole of compound (M-3).

[0166] The reaction of compound (M-3) with compound (M-4) is preferably carried out in the presence of a base. Examples of the base include metal alkoxides (preferably alkali metal alkoxides) such as sodium methoxide, potassium methoxide, lithium methoxide, sodium ethoxide, sodium isopropoxide, sodium tert-butoxide, and potassium tert-butoxide; metal hydroxides such as lithium hydroxide, sodium hydroxide, and potassium hydroxide; metal hydrides such as sodium hydride, lithium aluminum hydride, and sodium borohydride; and amine compounds such as lithium diisopropylamide, pyridine, triethylamine, diisopropylethylamine, piperidine, pyrrolidine, and proline. The amount of the base used is usually 0.1 to 10 mol, preferably 0.5 to 5 mol, per 1 mol of compound (M-3).

[0167] The reaction of compound (M-3) with compound (M-4) may be carried out in the presence of a solvent. Examples of the solvent include acetonitrile, benzene, toluene, acetone, ethyl acetate, chloroform, dichloroethane, monochlorobenzene, methanol, ethanol, isopropanol, tert-butanol, 2-butanone, tetrahydrofuran, diethyl ether, dimethyl sulfoxide, N,N-dimethylacetamide, N,N-dimethylformamide, and water. Preferred are acetonitrile, tetrahydrofuran, chloroform, dichloromethane, and diethyl ether, more preferred are acetonitrile, tetrahydrofuran, and chloroform, and even more preferred are methanol, ethanol, isopropanol, and acetonitrile. The reaction time of the compound (M-3) and the compound (M-4) is usually 0.1 to 10 hours. The reaction temperature of the compound (M-3) and the compound (M-4) is usually -50 to 150°C.

[0168] Examples of the compound (M-3) include the compounds shown below. [ka]

[0169] As the compound (M-4), commercially available products may be used. Examples thereof include cyanogen chloride, cyanogen bromide, paratoluenesulfonyl cyanide, trifluoromethanesulfonyl cyanide, 1-chloromethyl-4-fluoro-1,4-diazoniabicyclo[2.2.2]octane bis(tetrafluoroborate (also known as SelectFloor (registered trademark of Air Products and Chemicals)), benzoyl(phenyliodonio)(trifluoromethanesulfonyl)methanide, 2,8-difluoro-5-(trifluoromethyl)-5H-dibenzo[b,d]thiophen-5-ium trifluoromethanesulfonate, N-bromosuccinimide, N-chlorosuccinimide, and N-iodosuccinimide.

[0170] Compound (M-3) can be obtained by reacting a compound represented by formula (M-5) (hereinafter sometimes referred to as compound (M-5)) with compound (M-2a). [ka] [In formula (M-5), ring W 1A , R 4 and R 5 has the same meaning as above.]

[0171] The reaction of compound (M-5) with compound (M-2a) can be carried out by mixing compound (M-5) with compound (M-2a). The reaction of compound (M-5) with compound (M-2a) is preferably carried out in the presence of a base. Examples of the base include the same bases as those used in the reaction of compound (M-1) with compound (M-2). The amount of the base used is usually 0.1 to 5 moles, preferably 0.5 to 2 moles, per mole of compound (M-5). The reaction of compound (M-5) with compound (M-2a) may be carried out in the presence of a solvent, preferably methanol, ethanol, isopropanol, toluene, or acetonitrile. The reaction time of the compound (M-5) and the compound (M-2a) is usually 0.1 to 10 hours. The reaction temperature of the compound (M-5) and the compound (M-2a) is usually -50 to 150°C. The amount of compound (M-2a) used is usually 0.1 to 10 mol, preferably 0.5 to 2 mol, per 1 mol of compound (M-5).

[0172] Examples of the compound (M-5) include the compounds shown below. [ka]

[0173] In compound (I), R 1 and R 2 A combination of R 4 and R 5 When the combination of is the same, compound (I) can also be obtained by reacting a compound represented by formula (M-6) (hereinafter, sometimes referred to as compound (M-6)) with compound (M-2). [ka] [In formula (M-6), ring W 1A and R 3 has the same meaning as above.]

[0174] The reaction of compound (M-6) with compound (M-2) can be carried out by mixing compound (M-6) with compound (M-2). The reaction of compound (M-6) with compound (M-2) is preferably carried out in the presence of a base or a methylating agent, more preferably in the presence of a base and methyl. The reaction of compound (M-6) with compound (M-2) is more preferably carried out by mixing compound (M-6), compound (M-2), a base, and a methylating agent; It is more preferable to mix the compound (M-2) and a base with the mixture of the compound (M-6) and a methylating agent.

[0175] The base used in the reaction of compound (M-6) with compound (M-2) may be the same as the base used in the reaction of compound (M-1) with compound (M-2), and is preferably a metal carbonate, more preferably an alkaline earth metal carbonate. The amount of the base used is usually 0.1 to 5 mol, preferably 0.5 to 2 mol, per 1 mol of compound (M-6).

[0176] The methylating agent used in the reaction of compound (M-6) with compound (M-2) may be the same as the methylating agent used in the reaction of compound (M-1) with compound (M-2), and is preferably dimethyl sulfate. The amount of the methylating agent used is usually 0.1 to 5 mol, and preferably 0.5 to 2 mol, per 1 mol of compound (M-6).

[0177] The reaction of compound (M-6) with compound (M-2) may be carried out in the presence of a solvent. Examples of the solvent include acetonitrile, benzene, toluene, acetone, ethyl acetate, chloroform, dichloroethane, monochlorobenzene, methanol, ethanol, isopropanol, tert-butanol, 2-butanone, tetrahydrofuran, diethyl ether, dimethyl sulfoxide, N,N-dimethylacetamide, N,N-dimethylformamide, and water. Preferred are acetonitrile, tetrahydrofuran, chloroform, dichloromethane, and diethyl ether, more preferred are acetonitrile, tetrahydrofuran, and chloroform, and even more preferred is acetonitrile. The solvent is preferably a dehydrated solvent.

[0178] The reaction time of the compound (M-6) and the compound (M-2) is usually 0.1 to 10 hours, preferably 0.2 to 3 hours. The reaction temperature of the compound (M-6) and the compound (M-2) is usually from -50 to 150°C, and preferably from -20 to 100°C. The amount of compound (M-2) used is usually 0.1 to 10 mol, preferably 0.5 to 5 mol, per 1 mol of compound (M-6).

[0179] Examples of the compound (M-6) include 2-methyl-1,3-cyclohexanedione.

[0180] The molecular weight of compound (X) is preferably 3000 or less, more preferably 2000 or less, and even more preferably 1000 or less. It is also preferably 50 or more, more preferably 100 or more, and even more preferably 200 or more.

[0181] Compound (X) preferably exhibits an absorption maximum at a wavelength of 400 to 550 nm. The absorption maximum wavelength (λmax) of compound (X) is preferably 410 to 500 nm, more preferably 420 to 480 nm, and even more preferably 430 to 450 nm.

[0182] The gram absorption coefficient ε at the maximum absorption wavelength (λmax) is preferably 0.5 or more, more preferably 1.0 or more, and particularly preferably 1.5 or more. There is no particular upper limit, but it is generally 10 or less. It is preferable that the gram absorption coefficient ε at λmax of the compound (X) is 0.5 or more, since light known as blue light can be efficiently absorbed.

[0183] The compound (X) preferably satisfies the following formula (a). ε(λ max ) / ε(λ max +30nm)≧5 (a) [Where ε(λmax) is the maximum absorption wavelength (λ max ) represents the gram extinction coefficient. ε(λ max +30nm) is the maximum absorption wavelength (λ max ) +30 nm wavelength. The unit of the gram absorption coefficient is L / (g·cm). The compound (X) preferably has a ratio ε(λmax) / ε(λmax+30 nm) of 5 or more, more preferably 10 or more, and particularly preferably 20 or more. There is no particular upper limit, but it is generally 1000 or less. It is preferable that ε(λmax) / ε(λmax+30 nm) is 5 or more, since it can minimize the coloration of the composition containing compound (X) and selectively absorb only blue light. This is particularly preferable because it can contribute to suppressing the influence on color display on displays and expanding the color gamut.

[0184] <Composition containing compound (X)> The present invention also includes a composition containing compound (X) (preferably any one of compounds (I) to (VIII)). The composition containing compound (X) of the present invention (preferably any of compounds (I) to (VIII)) is preferably a resin composition containing compound (X) (preferably any of compounds (I) to (VIII)) and a resin.

[0185] The composition can be used in a variety of applications, but is particularly suitable for applications where it may be exposed to sunlight or light including ultraviolet rays.Specific examples include glass substitutes and surface coating materials thereof; coating materials for window glass, lighting glass, and light source protection glass for homes, facilities, transport equipment, etc.; window films for homes, facilities, transport equipment, etc.; interior and exterior materials and interior and exterior paints for homes, facilities, transport equipment, etc., and coating films formed by said paints; alkyd resin lacquer paints and coating films formed by said paints; acrylic lacquer paints and coating films formed by said paints; components for light sources that emit ultraviolet rays, such as fluorescent lamps and mercury lamps; materials for blocking electromagnetic waves generated by precision machinery, electronic and electrical equipment components, and various displays; containers or packaging materials for food, chemicals, pharmaceuticals, etc.; bottles, boxes, blisters, cups, special packaging, compact disc coatings, agricultural and industrial sheets or films; anti-fading agents for printed matter, dyed matter, dyes and pigments, etc.; polymer supports ( Examples of suitable applications include protective films for plastic parts such as machinery and automotive parts; overcoats for printed matter; inkjet media coatings; matte laminates; optical light films; safety glass / windshield interlayers; electrochromic / photochromic applications; overlaminate films; solar heat control films; cosmetics such as sunscreen creams, shampoos, conditioners, and hair styling products; apparel textiles and fibers such as sportswear, stockings, and hats; household interior products such as curtains, carpets, and wallpaper; medical devices such as plastic lenses, contact lenses, and artificial eyes; optical products such as optical filters, backlit display films, prisms, mirrors, and photographic materials; stationery such as mold films, transfer stickers, anti-graffiti films, tapes, and inks; sign boards, markers, and the like, and surface coating materials for such signs.

[0186] The molded article obtained by molding the composition is preferably a polymer molded article, and may have any shape, such as a flat film, powder, spherical particles, crushed particles, a continuous mass, fiber, tube, hollow fiber, granule, plate, or porous shape.

[0187] When the composition is a resin composition, examples of the resin used in the resin composition include thermoplastic resins and thermosetting resins that have been conventionally used in the production of various known molded articles, sheets, films, etc. Examples of thermoplastic resins include olefin-based resins such as polyethylene resin, polypropylene resin, and polycycloolefin resin, poly(meth)acrylic acid ester-based resin, polystyrene-based resin, styrene-acrylonitrile-based resin, acrylonitrile-butadiene-styrene-based resin, polyvinyl chloride-based resin, polyvinylidene chloride-based resin, polyvinyl acetate-based resin, polyvinyl butyral-based resin, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol-based resin, polyethylene terephthalate resin, polybutylene terephthalate resin, and polyester-based resins such as liquid crystal polyester resin, polyacetal resin, polyamide resin, polycarbonate resin, polyurethane resin, and polyphenylene sulfide resin. One or more of these resins may be used as a polymer blend or polymer alloy.

[0188] Examples of thermosetting resins include epoxy resins, melamine resins, unsaturated polyester resins, phenolic resins, urea resins, alkyd resins, and thermosetting polyimide resins.

[0189] When the resin composition is used as an ultraviolet absorbing filter or an ultraviolet absorbing film, the resin is preferably a transparent resin.

[0190] The resin composition can be obtained by mixing the compound (X) with a resin. The compound (X) may be contained in an amount necessary to impart the desired performance, for example, 0.00001 to 99 parts by mass per 100 parts by mass of the resin. The composition of the present invention may contain other additives such as a solvent, a crosslinking catalyst, a tackifier, a plasticizer, a softener, a dye, a pigment, an inorganic filler, etc., as required.

[0191] <Composition for eyeglass lenses> The composition and the resin composition may be a composition for spectacle lenses. Spectacle lenses can be formed by molding or the like using the composition for spectacle lenses. The method for molding the composition for spectacle lenses may be injection molding or cast polymerization. Note that cast polymerization is a method in which a composition for spectacle lenses, mainly consisting of a monomer or oligomer resin, is injected into a lens mold and cured by heat or light to form a lens. The composition for spectacle lenses may be formulated to suit the molding method. For example, when spectacle lenses are formed by injection molding, the composition may be a resin composition for spectacle lenses containing a resin and compound (X). When spectacle lenses are formed by cast polymerization, the composition may be a composition for spectacle lenses containing a curable monomer that is cured by heat or light and compound (X).

[0192] Examples of resins contained in the composition for spectacle lenses include the resins described above, and transparent resins are preferred. The resin contained in the composition for spectacle lenses is preferably one or more of poly(meth)acrylic acid ester resins, polycarbonate resins, polyamide resins, polyurethane resins, and polythiourethane resins, used as a polymer blend or polymer alloy. Furthermore, the composition may contain not only polymers but also monomer components.

[0193] The spectacle lens composition may be a composition containing a curable monomer and compound (X). Two or more types of curable monomers may be included. Specifically, the composition may be a mixture of a polyol compound and an isocyanate compound, or a mixture of a thiol compound and an isocyanate compound, preferably a mixture of a thiol compound and an isocyanate, and more preferably a mixture of a polyfunctional thiol compound and a polyfunctional isocyanate compound.

[0194] The thiol compound is not particularly limited as long as it has at least one thiol group in the molecule. It may be linear or cyclic. Furthermore, it may have a sulfide bond, a polysulfide bond, or other functional groups in the molecule. Specific examples of the thiol compound include thiol group-containing organic compounds having one or more thiol groups in one molecule, such as aliphatic polythiol compounds, aromatic polythiol compounds, thiol group-containing cyclic compounds, and thiol group-containing sulfide compounds, as described in JP-A-2004-315556. Among these, polyfunctional thiol compounds having two or more thiol groups are preferred in terms of improving the refractive index and glass transition temperature of the lens, with aliphatic polythiol compounds having two or more thiol groups and sulfide compounds having two or more thiol groups being more preferred, and bis(mercaptomethyl)sulfide, 1,2-bis[(2-mercaptoethyl)thio]-3-mercaptopropane, pentaerythritol tetrakisthiopropionate, and 4,8-dimercaptomethyl-1,11-mercapto-3,6,9-trithiaundecane being even more preferred. The above thiol compounds may be used alone or in combination of two or more.

[0195] The isocyanate compound is preferably a polyfunctional isocyanate compound having at least two isocyanato groups (-NCO) in the molecule, and examples thereof include aliphatic isocyanate compounds (e.g., hexamethylene diisocyanate, etc.), alicyclic isocyanate compounds (e.g., isophorone diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate), and aromatic isocyanate compounds (e.g., tolylene diisocyanate, xylylene diisocyanate, diphenylmethane diisocyanate, naphthalene diisocyanate, triphenylmethane triisocyanate, etc.). Further, the isocyanate compound may be an adduct of the isocyanate compound with a polyhydric alcohol compound (for example, an adduct with glycerol, trimethylolpropane, or the like), an isocyanurate compound, a biuret-type compound, or a derivative of a urethane prepolymer-type isocyanate compound obtained by addition reaction with a polyether polyol, a polyester polyol, an acrylic polyol, a polybutadiene polyol, a polyisoprene polyol, or the like.

[0196] When the spectacle lens composition contains a curable monomer, it may contain a curing catalyst to improve curability. Examples of the curing catalyst include tin compounds such as dibutyltin chloride, amines described in JP-A-2004-315556, phosphines, quaternary ammonium salts, quaternary phosphonium salts, tertiary sulfonium salts, secondary iodonium salts, mineral acids, Lewis acids, organic acids, silicic acids, tetrafluoroboric acids, peroxides, azo compounds, condensates of aldehydes and ammonia compounds, guanidines, thioureas, thiazoles, sulfenamides, thiurams, dithiocarbamates, xanthogenates, and acidic phosphate esters. These curing catalysts may be used alone or in combination of two or more.

[0197] When the spectacle lens composition is a resin composition, the content of compound (X) in the spectacle lens composition may be, for example, 0.01 to 20 parts by mass per 100 parts by mass of the resin. When the spectacle lens composition is a curable composition, the content of compound (X) may be, for example, 0.00001 to 20 parts by mass per 100 parts by mass of the curable component. The content of compound (X) is preferably 0.0001 to 15 parts by mass, more preferably 0.001 to 10 parts by mass, even more preferably 0.01 to 5 parts by mass, and particularly preferably 0.1 to 3 parts by mass per 100 parts by mass of the resin or curable component. The amount of the curing catalyst added is preferably 0.0001 to 10.0% by mass, and more preferably 0.001 to 5.0% by mass, relative to 100% by mass of the spectacle lens composition. The spectacle lens composition may contain other additives.

[0198] When the composition of the present invention is used for optical products such as optical filters, it can be applied to, for example, optical display devices. When the resin composition is applied to an optical display device, the layer formed from the resin composition may be any of a film layer, a pressure-sensitive adhesive layer, a coating layer, etc., and is preferably a pressure-sensitive adhesive layer or a coating layer.

[0199] <Adhesive composition> When the layer formed from the composition of the present invention is a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer is formed from a pressure-sensitive adhesive composition (hereinafter sometimes referred to as pressure-sensitive adhesive composition (i)) containing a resin (A), a compound (X), a crosslinking agent (B), and a silane compound (C). The pressure-sensitive adhesive composition (i) may further contain a radical-curable component (D), an initiator (E), a light-absorbing compound (F) other than the compound (X) (hereinafter sometimes referred to as the light-selective absorbing compound (F)), an antistatic agent, etc., and preferably contains at least one selected from the group consisting of the radical-curable component (D), the initiator (E), and the light-selective absorbing compound (F).

[0200] There are no particular limitations on the resin (A) as long as it is a resin that can be used in a pressure-sensitive adhesive composition. It is preferable that the resin (A) does not exhibit a maximum absorption in the wavelength range of 300 nm to 780 nm. The resin (A) preferably has a glass transition temperature (Tg) of 40°C or lower. The glass transition temperature (Tg) of the resin (A) is more preferably 20°C or lower, even more preferably 10°C or lower, and particularly preferably 0°C or lower. The glass transition temperature of the resin (A) is usually -80°C or higher, preferably -70°C or higher, more preferably -60°C or higher, even more preferably -55°C or higher, and particularly preferably -50°C or higher. A glass transition temperature of the resin (A) of 40°C or lower is advantageous in improving the adhesion of the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition (i) to the adherend. A glass transition temperature of the resin (A) of -80°C or higher is advantageous in improving the durability of the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition (i). The glass transition temperature can be measured by a differential scanning calorimeter (DSC).

[0201] Examples of the resin (A) include (meth)acrylic resins, silicone resins, rubber resins, and urethane resins, with (meth)acrylic resins being preferred.

[0202] The (meth)acrylic resin is preferably a polymer containing, as a main component (preferably containing 50% by mass or more) structural units derived from (meth)acrylic acid esters. The structural units derived from (meth)acrylic acid esters may contain structural units derived from one or more monomers other than (meth)acrylic acid esters (for example, structural units derived from monomers having polar functional groups such as hydroxyl groups, carboxyl groups, and amino groups).

[0203] The content of the resin (A) is usually 50% by mass to 99.9% by mass, preferably 60% by mass to 95% by mass, and more preferably 70% by mass to 90% by mass, based on 100% by mass of the solid content of the adhesive composition (i). The content of the compound (X) is usually 0.01 to 20 parts by mass, preferably 0.1 to 20 parts by mass, more preferably 0.2 to 10 parts by mass, and particularly preferably 0.5 to 5 parts by mass, relative to 100 parts by mass of the resin (A).

[0204] Examples of the crosslinking agent (B) include an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, an aziridine-based crosslinking agent, and a metal chelate-based crosslinking agent. In particular, from the viewpoints of the pot life of the pressure-sensitive adhesive composition (i), the durability of the pressure-sensitive adhesive layer, the crosslinking rate, etc., an isocyanate-based crosslinking agent is preferred. The content of the crosslinking agent (B) is usually 0.01 to 25 parts by mass, preferably 0.1 to 15 parts by mass, more preferably 0.15 to 7 parts by mass, even more preferably 0.2 to 5 parts by mass, and particularly preferably 0.25 to 2 parts by mass, relative to 100 parts by mass of the resin (A).

[0205] Examples of the silane compound (C) include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)silane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylethoxydimethylsilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, and 3-mercaptopropyltrimethoxysilane. The silane compound (C) may be a silicone oligomer. The content of the silane compound (C) is usually 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, more preferably 0.15 to 7 parts by mass, even more preferably 0.2 to 5 parts by mass, and particularly preferably 0.25 to 2 parts by mass, relative to 100 parts by mass of the resin (A).

[0206] The radically curable component (D) may be a radically curable component such as a compound or oligomer that is cured by a radical polymerization reaction. Examples of the radically polymerizable component (D) include (meth)acrylate compounds, styrene compounds, and vinyl compounds. The pressure-sensitive adhesive composition (i) may contain two or more types of radically curable components (D).

[0207] Examples of (meth)acrylate compounds include (meth)acrylate monomers and (meth)acrylamide monomers having at least one (meth)acryloyloxy group in the molecule, and (meth)acryl oligomers having at least two (meth)acryloyl groups in the molecule, and other (meth)acryl group-containing compounds. The (meth)acrylic oligomer is preferably a (meth)acrylate oligomer having at least two (meth)acryloyloxy groups in the molecule. The (meth)acrylate compounds may be used alone or in combination of two or more.

[0208] Examples of the (meth)acrylate monomer include a monofunctional (meth)acrylate monomer having one (meth)acryloyloxy group in the molecule, a bifunctional (meth)acrylate monomer having two (meth)acryloyloxy groups in the molecule, and a polyfunctional (meth)acrylate monomer having three or more (meth)acryloyloxy groups in the molecule. A (meth)acrylate compound is preferred, and a polyfunctional (meth)acrylate compound is more preferred. The polyfunctional (meth)acrylate compound is preferably tri- or higher functional.

[0209] The content of the radical curable component (D) is usually 0.5 to 100 parts by mass, preferably 1 to 70 parts by mass, more preferably 3 to 50 parts by mass, even more preferably 5 to 30 parts by mass, and particularly preferably 7.5 to 25 parts by mass, relative to 100 parts by mass of the resin (A).

[0210] The initiator (E) may be either a compound that initiates a polymerization reaction by absorbing heat energy (thermal polymerization initiator) or a compound that initiates a polymerization reaction by absorbing light energy (photopolymerization initiator). Here, the light is preferably active energy rays such as visible light, ultraviolet light, X-rays, or electron beams.

[0211] Examples of the thermal polymerization initiator include a compound that generates radicals upon heating or the like (thermal radical generator), a compound that generates an acid upon heating or the like (thermal acid generator), and a compound that generates a base upon heating or the like (thermal base generator). Examples of the photopolymerization initiator include a compound that generates radicals by absorbing light energy (photoradical generator), a compound that generates acid by absorbing light energy (photoacid generator), and a compound that generates a base by absorbing light energy (photobase generator).

[0212] The initiator (E) is preferably selected from those suitable for the polymerization reaction of the radically curable component (D) described above, and is more preferably a radical polymerization initiator, and even more preferably a photoradical polymerization initiator. Examples of radical polymerization initiators include alkylphenone compounds, benzoin compounds, benzophenone compounds, oxime ester compounds, and phosphine compounds. The radical polymerization initiator is preferably a photoradical polymerization initiator, and from the viewpoint of the reactivity of the polymerization reaction, it is more preferably an oxime ester-based photoradical polymerization initiator. By using an oxime ester-based photoradical polymerization initiator, the reaction rate of the radical curing component (D) can be increased even under curing conditions with low illuminance or light intensity.

[0213] The content of the initiator (E) is usually 0.01 to 20 parts by mass, preferably 0.3 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, even more preferably 0.75 to 4 parts by mass, and particularly preferably 1 to 3 parts by mass, relative to 100 parts by mass of the resin (A).

[0214] The light-selective absorbing compound (F) is a light-absorbing compound other than the compound (X), and is, for example, a compound (ultraviolet absorber) that absorbs light with a wavelength of 250 nm to 380 nm (preferably a wavelength of 250 nm or more and less than 360 nm), a compound (dye) that absorbs light with a wavelength of 380 nm to 780 nm, or a compound (infrared absorber) that absorbs light with a wavelength of 780 nm to 1500 nm. The structure of the ultraviolet absorber is not particularly limited as long as it is a compound that absorbs light with a wavelength of 250 nm to 380 nm, but compounds such as benzotriazole-based compounds, benzophenone-based compounds, triazine-based compounds, salicylic acid-based compounds, cyanoacrylate-based compounds, and benzoxazine-based compounds are preferred. The content of the light-selective absorption compound (F) is usually 0.1 to 50 parts by mass, preferably 0.2 to 40 parts by mass, more preferably 0.5 to 30 parts by mass, even more preferably 1 to 25 parts by mass, and particularly preferably 2 to 20 parts by mass, relative to 100 parts by mass of the resin (A).

[0215] The molded article molded from the composition containing the compound (X) preferably has a transmittance at a wavelength of 440 nm of 50% or less, more preferably 30% or less. [Example]

[0216] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples. In the examples, % and parts representing the content or amount used are by mass unless otherwise specified.

[0217] (Example 1) Synthesis of compound represented by formula (1) [ka] A 100 mL four-neck flask equipped with a Dimroth condenser and a thermometer was conditioned under a nitrogen atmosphere, and 2 parts of 2-methyl-1,3-cyclohexanedione, 1.3 parts of dimethyl sulfate, and 10 parts of acetonitrile were added, followed by heating and stirring under reflux for 3 hours. 0.75 parts of malononitrile, 1.2 parts of potassium carbonate, and 10 parts of isopropanol were added to the resulting mixture, which was then heated and stirred under reflux for 3 hours. The solvent was distilled off from the resulting mixture, and the mixture was purified to obtain 0.1 parts of the compound represented by formula (1).

[0218] LC-MS measurement and 1 H-NMR analysis confirmed that the compound represented by formula (1) was produced. 1 H-NMR:1.70(m, 2H), 2.16(s, 3H), 2.50~2.62(m, 4H) LC-MS; [M] - =221.3

[0219] <Measurement of maximum absorption wavelength and gram absorption coefficient ε> The resulting 2-butanone solution (0.006 g / L) of the compound represented by formula (1) was placed in a 1 cm quartz cell, and the quartz cell was placed in a spectrophotometer UV-2450 (Shimadzu Corporation). The absorbance was measured in 1 nm steps over the wavelength range of 300 to 800 nm using the double beam method. The gram extinction coefficient for each wavelength was calculated from the absorbance value, the concentration of the compound represented by formula (1) in the solution, and the optical path length of the quartz cell. ε(λ)=A(λ) / CL (where ε(λ) represents the gram absorption coefficient (L / (g cm)) of the compound represented by formula (1) at a wavelength of λ nm, A(λ) represents the absorbance at a wavelength of λ nm, C represents the concentration (g / L), and L represents the optical path length (cm) of the quartz cell.) The maximum absorption wavelength of the compound represented by formula (1) was 457 nm. The ε(λmax) of the compound represented by formula (1) was 150.6 L / (g cm), the ε(λmax+30 nm) was 3.8 L / (g cm), and the ε(λmax) / ε(λmax+30 nm) was 39.6.

[0220] (Example 2) Synthesis of compound represented by formula (2) [ka] A 300 mL four-neck flask equipped with a Dimroth condenser and a thermometer was filled with nitrogen, and 70 parts of dimedone, 10.4 parts of malononitrile, 40.6 parts of diisopropylethylamine, and 100 parts of ethanol were added, followed by heating under reflux and stirring for 3 hours. The solvent was distilled off from the resulting mixture, and the mixture was purified to obtain 15.1 parts of the compound represented by formula (M-5).

[0221] [ka] Under a nitrogen atmosphere, 5 parts of the compound represented by formula (M-5), 5.8 parts of paratoluenesulfonyl cyanide, 3 parts of potassium tert-butoxide, and 50 parts of ethanol were mixed. The resulting mixture was stirred at a temperature of 0 to 5°C for 3 hours. The solvent was distilled off from the resulting mixture, and the mixture was purified to obtain 3.3 parts of the compound represented by formula (M-6).

[0222] [ka] Under a nitrogen atmosphere, 5 parts of the compound represented by formula (M-6), 7.7 parts of methyl triflate, 3.2 parts of potassium carbonate, and 50 parts of methyl ethyl ketone were mixed. The resulting mixture was stirred at a temperature of 0 to 5°C for 3 hours. To the resulting mixture, 4.6 parts of malononitrile and 13.0 parts of potassium carbonate were added, and the mixture was stirred at a temperature of 0 to 5°C for 3 hours. The solvent was distilled off from the resulting mixture, and the mixture was purified to obtain 3.1 parts of the compound represented by formula (2).

[0223] LC-MS measurement and 1 H-NMR analysis confirmed that the compound represented by formula (2) was produced. 1 H-NMR (heavy DMSO) δ: 0.92 (s, 6H), 2.45~2.52 (s, 4H) LC-MS; [M] -=260.2

[0224] The maximum absorption wavelength and gram absorption coefficient were measured in the same manner as above. The maximum absorption wavelength of the compound represented by formula (2) was 432 nm. The ε(λmax) of the compound represented by formula (2) was 237 L / (g cm), ε(λmax + 30 nm) was 4.4 L / (g cm), and ε(λmax) / ε(λmax + 30 nm) was 53.9.

[0225] (Example 3) Preparation of resin composition (1) (adhesive composition (1)) Polymerization Example 1: Preparation of acrylic resin (A) A reaction vessel equipped with a condenser, nitrogen inlet, thermometer, and stirrer was charged with a mixed solution of 81.8 parts ethyl acetate as a solvent, 96 parts butyl acrylate, 3 parts 2-hydroxyethylmethyl acrylate, and 1 part acrylic acid. The air in the reaction vessel was purged with nitrogen gas to remove oxygen, and the internal temperature was raised to 55°C. A solution of 0.14 parts azobisisobutyronitrile (polymerization initiator) in 10 parts ethyl acetate was then added in its entirety. After the addition of the polymerization initiator, the temperature was maintained for 1 hour. Ethyl acetate was then added continuously to the reaction vessel at a rate of 17.3 parts / hour while maintaining the internal temperature at 54-56°C. When the acrylic resin concentration reached 35%, the ethyl acetate addition was stopped. The temperature was maintained for 12 hours. Finally, ethyl acetate was added to adjust the acrylic resin concentration to 20%, preparing an acrylic resin-ethyl acetate solution. The resulting acrylic resin had a weight average molecular weight Mw of 1,470,000 in terms of polystyrene measured by GPC, and an Mw / Mn ratio of 5.5, which was designated as acrylic resin (A).

[0226] <Preparation of Resin Composition (1)> 100 parts of a solids solution of acrylic resin (A) in ethyl acetate (resin concentration: 20%) was mixed with 0.3 parts of a crosslinker (manufactured by Tosoh Corporation: trade name "Coronate L", an isocyanate-based compound, solids content 75%), 0.28 parts of a silane compound (manufactured by Shin-Etsu Chemical Co., Ltd.: trade name "KBM3066"), and 1.5 parts of the compound represented by formula (2), and ethyl acetate was added to give a solids concentration of 14%, to obtain resin composition (1) (adhesive composition). Note that the amount of crosslinker is the number of parts by mass of the active ingredient.

[0227] (Examples 4 to 7 and Comparative Example 1) Preparation of Resin Compositions (2) to (6) Pressure-sensitive adhesive compositions (2) to (6) were prepared in the same manner as in Example 3, except that the components and the amounts of the components were changed as shown in Table 10. The blending amount of the crosslinking agent is the number of parts by mass as the active ingredient, and the blending amount of the resin (A) is the number of parts by mass of the solid content.

[0228] [Table 10]

[0229] The abbreviations in Table 1 have the following meanings: Acrylic resin (A): Acrylic resin (A) synthesized in Polymerization Example 1 Formula (2): Compound represented by formula (2) synthesized in Example 2 Coronate L: manufactured by Tosoh Corporation, product name: Coronate L, isocyanate-based crosslinking agent KBM3066: Shin-Etsu Chemical Co., Ltd., product name: KBM3066, silane coupling agent A-DPH-12E: Product name: A-DPH-12E, manufactured by Shin-Nakamura Chemical Co., Ltd., hexafunctional (meth)acrylate compound NCI-730: ADEKA Corporation, product name: NCI-730, a photoradical generator that is an oxime ester compound RUVA-93: Benzotriazole-based UV absorber manufactured by Otsuka Chemical Co., Ltd., product name: RUVA-93, maximum absorption wavelength λmax = 337 nm CIY33: Sumiplast Lemon Yellow HL (CI Solvent Yellow 33, manufactured by Sumika Chemtex Co., Ltd.)

[0230] <Evaluation of Molded Article of Resin Composition (1)> [Production of resin molded body (1)] The obtained resin composition (1) was applied using an applicator to the release-treated surface of a release-treated polyethylene terephthalate separate film (trade name "PLR-382190" obtained from Lintec Corporation) and dried at a temperature of 100°C for 1 minute to produce a resin molded body (adhesive layer) (1). The thickness of the obtained resin molded body (1) was 15 µm.

[0231] The obtained resin molded body (1) was laminated to a 23 μm thick ultraviolet absorber-containing cycloolefin film (trade name "ZEONOR" available from Zeon Corporation) using a laminator, and then aged for 7 days under conditions of a temperature of 23°C and a relative humidity of 65%, to obtain a laminate (1) of cycloolefin film / resin molded body (1) / separate film.

[0232] [Measurement of absorbance of resin molded body (1)] The obtained laminate (1) was cut into a size of 30 mm x 30 mm, the separate film was peeled off, and the resin molded body (1) was laminated with alkali-free glass (trade name "EAGLE XG" manufactured by Corning Incorporated), which was used as sample (1). The absorbance of the prepared sample (1) in the wavelength range of 300 to 800 nm was measured in 1 nm increments using a spectrophotometer (UV-2450, manufactured by Shimadzu Corporation). The measured absorbance at a wavelength of 440 nm was taken as the absorbance of the resin molded body (1) at a wavelength of 440 nm. The results are shown in Table 11. The absorbance of the alkali-free glass alone and the cycloolefin film alone at wavelengths of 330 nm and 440 nm, respectively, was 0. The transmittance at wavelengths of 440 nm and 330 nm was also calculated according to the following formula: The results are shown in Table 11 in the T440 column for transmittance at a wavelength of 440 nm and in the T330nm column for transmittance at a wavelength of 330 nm. T=10-A ×100 (T represents transmittance, and A represents absorbance.)

[0233] [Measurement of absorbance retention of resin molded product (1)] After the absorbance measurement, sample (1) was placed in a Sunshine Weather Meter (manufactured by Suga Test Instruments Co., Ltd.) for 75 hours under conditions of a temperature of 63°C and a relative humidity of 50% RH, and a weather resistance test was conducted. The absorbance of the removed sample (1) was measured in the same manner as above. From the measured absorbance, the absorbance retention of the sample at a wavelength of 440 nm was calculated based on the following formula. In the formula, A(440) represents the absorbance at a wavelength of 440 nm. The results are shown in Table 11. The closer the absorbance retention is to 100, the less deterioration of the light-selective absorption function and the better the weather resistance. Absorbance retention rate (%) = (A(440) after durability test / A(440) before durability test) × 100

[0234] [Evaluation of Bleeding Resistance of Resin Molded Product (1)] A separate film was further laminated on one side of the obtained resin molded product (1) to obtain a resin molded product (1) with double-sided separate films. The obtained resin molded product (1) with double-sided separate films was stored for one month in air at a temperature of 23 to 25°C. After storage, the resin molded product (1) with double-sided separate films was examined using a microscope to check for the presence or absence of crystal precipitation of the compound within the surface. Cases where no crystal precipitation was observed were marked with a, and cases where crystal precipitation was observed were marked with b. The evaluation results are shown in the column for bleed resistance in Table 11.

[0235] Resin composition (2) was used instead of resin composition (1) to prepare resin molded product (2), laminate (2), and resin molded product (2) with double-sided separate films, and the evaluations were similarly performed. The results are shown in Table 11.

[0236] Resin composition (3) was used instead of resin composition (1) to prepare resin molded product (3), laminate (3), and resin molded product (3) with double-sided separate films, and the evaluations were similarly performed. The results are shown in Table 11.

[0237] Resin composition (6) was used instead of resin composition (1) to prepare a resin molded product (6), a laminate (6), and a resin molded product (6) with double-sided separate films, and the results were evaluated in the same manner. The results are shown in Table 11.

[0238] <Evaluation of Molded Article of Resin Composition (4)> [Preparation of resin molded body (4)] Resin composition (4) was applied to the release-treated surface of a release-treated polyethylene terephthalate film (trade name "PLR-382190" available from Lintec Corporation) using an applicator so that the dry thickness would be 5 μm, and the film was dried at 100° C. for 1 minute. Subsequently, a UV irradiation device ("Electrodeless UV Lamp System H Bulb" manufactured by Fusion UV Systems) was used to irradiate the film with UV-A (wavelength 320-390 nm) from the side of the film, adjusting the illuminance to 500 mW and the cumulative light amount to 500 mJ, to produce a resin molded product (adhesive layer) (4). The obtained resin molded body (4) was laminated to alkali-free glass, and after peeling off the separate film, a 23 μm ultraviolet absorber-containing cycloolefin film (trade name "ZEONOR" available from Zeon Corporation) was laminated to the resin molded body (4) to produce a laminate (4) having a configuration of cycloolefin film / resin molded body (4) / glass.

[0239] [Measurement of absorbance of resin molded body (4)] The prepared laminate (4) was set in a spectrophotometer UV-2450 (Shimadzu Corporation), and the absorbance was measured in the wavelength range of 300 to 800 nm in 1 nm steps using the double beam method. The measured absorbance at a wavelength of 440 nm was taken as the absorbance of the resin molded product (4) at a wavelength of 440 nm. The absorbance of the alkali-free glass alone and the cycloolefin film alone at wavelengths of 330 nm and 440 nm, respectively, was 0. The transmittance at wavelengths of 440 nm and 330 nm was also calculated according to the following formula: The results are shown in Table 11 in the T440 column for transmittance at a wavelength of 440 nm and in the T330nm column for transmittance at a wavelength of 330 nm. T=10-A ×100 (T represents transmittance, and A represents absorbance.)

[0240] [Measurement of absorbance retention of resin molded product (4)] After the absorbance measurement, the laminate (4) was placed in a Sunshine Weather Meter (manufactured by Suga Test Instruments Co., Ltd.) for 75 hours under conditions of a temperature of 63°C and a relative humidity of 50% RH, and a weather resistance test was performed. The absorbance of the resin molded body (4) of the removed laminate (4) was measured in the same manner as above. From the measured absorbance, the absorbance retention of the sample at a wavelength of 440 nm was calculated based on the following formula. In the formula, A(440) represents the absorbance at a wavelength of 440 nm. The results are shown in Table 11. The closer the absorbance retention is to 100, the less deterioration of the light-selective absorption function and the better the weather resistance. Absorbance retention rate (%) = (A(440) after durability test / A(440) before durability test) × 100

[0241] [Evaluation of Bleeding Resistance of Resin Molded Product (4)] A separate film was further laminated on one side of the obtained resin molded product (4) to obtain a resin molded product (4) with double-sided separate films. The obtained resin molded product (4) with double-sided separate films was stored in air at a temperature of 23 to 25°C for one month. After storage, the resin molded product (4) with double-sided separate films was examined using a microscope to check for the presence or absence of crystal precipitation of the compound within the surface. Cases where no crystal precipitation was observed were marked a, and cases where crystal precipitation was observed were marked b. The evaluation results are shown in the column for bleed resistance in Table 11.

[0242] Resin composition (5) was used instead of resin composition (4) to prepare resin molded product (5), laminate (5), and resin molded product (5) with double-sided separate films, and the evaluations were similarly performed. The results are shown in Table 11.

[0243] [Table 11]

[0244] Example 8: Preparation of resin composition for eyeglass lenses and molded article thereof 40 parts of xylylene diisocyanate, 60 parts of trimethylolpropane tris(thioglycolate), 0.01 parts of the compound represented by formula (2) synthesized in Example 2, 0.2 parts of a mold release agent (trade name: ZELEC-UN, obtained from Sigma-Aldrich), and 0.03 parts of dibutyldichlorotin as a curing catalyst were mixed and stirred. The resulting mixture was left to stand in a vacuum dryer for 1 hour to degas. The resulting mixture was poured into a glass mold and heated at 120°C for 1 hour. The molded body was then peeled off from the glass mold, and a 2 mm thick, 3 cm x 3 cm resin plate was prepared as the molded body.

[0245] (Examples 9 to 12) Preparation of resin compositions for eyeglass lenses and molded articles thereof A resin composition for eyeglass lenses and a resin plate, which is a molded product thereof, were obtained in the same manner as in Example 8, except that the content of the compound represented by formula (2) was changed to the content [parts] shown in Table 12.

[0246] [Table 12]

[0247] <Evaluation of resin boards> [Measurement of absorbance of resin plate] The absorbance of the resin plate obtained above in the wavelength range of 300 to 800 nm was measured in 1 nm steps using a spectrophotometer (UV-2450, manufactured by Shimadzu Corporation). The transmittance at a wavelength of 440 nm was calculated using the following formula: The results are shown in the T440 column of Table 13. T=10 -A ×100 (T represents transmittance, and A represents absorbance.)

[0248] [Measurement of absorbance retention rate of resin plate] After the absorbance measurement, the resin plate was placed in a Sunshine Weather Meter (manufactured by Suga Test Instruments Co., Ltd.) for 75 hours under conditions of a temperature of 63°C and a relative humidity of 50% RH to conduct a weather resistance test. The absorbance of the removed resin plate was measured in the same manner as above. From the measured absorbance, the absorbance retention of the resin plate at a wavelength of 440 nm was calculated using the following formula. In the formula, A(440) represents the absorbance at a wavelength of 440 nm. The results are shown in Table 13. The closer the absorbance retention rate is to 100, the less deterioration of the light-selective absorption function and the better the weather resistance. Absorbance retention rate (%) = (A(440) after durability test / A(440) before durability test) × 100

[0249] [Table 13]

[0250] (Examples 13 to 15) Preparation of resin compositions (7) to (9) (adhesive compositions (7) to (9)) Polymerization Example 2: Preparation of acrylic resin (A1) A reaction vessel equipped with a condenser, nitrogen inlet, thermometer, and stirrer was charged with a mixture of 81.8 parts ethyl acetate as solvent, 70 parts butyl acrylate, 1 part 2-hydroxyethylmethyl acrylate, 1 part acrylic acid, 8 parts phenoxyethyl acrylate, and 0.5 parts butoxymethyl acrylamide. The air in the reaction vessel was purged with nitrogen gas to remove oxygen, and the internal temperature was raised to 55°C. A solution of 0.14 parts azobisisobutyronitrile (polymerization initiator) in 10 parts ethyl acetate was then added in its entirety. After the addition of the polymerization initiator, the temperature was maintained for 1 hour. Ethyl acetate was then continuously added to the reaction vessel at a rate of 17.3 parts / hour while maintaining the internal temperature at 54-56°C. When the acrylic resin concentration reached 35%, the ethyl acetate addition was stopped. The temperature was maintained for 12 hours after the start of the ethyl acetate addition. Finally, ethyl acetate was added to adjust the acrylic resin concentration to 20%, preparing an acrylic resin-ethyl acetate solution. The resulting acrylic resin had a weight average molecular weight Mw of 1,250,000 in terms of polystyrene measured by GPC, and an Mw / Mn ratio of 4.5, which was designated as acrylic resin (A1).

[0251] Pressure-sensitive adhesive compositions (7) to (9) were prepared in the same manner as in Example 3, except that the components and the amounts of the components were changed as shown in Table 14. The blending amount of the crosslinking agent is the number of parts by mass as the active ingredient, and the blending amount of the resin (A) is the number of parts by mass of the solid content.

[0252] [Table 14]

[0253] The abbreviations in Table 14 have the following meanings: Acrylic resin (A1): Acrylic resin (A1) synthesized in Polymerization Example 2 Formula (2): Compound represented by formula (2) synthesized in Example 2 Coronate L: manufactured by Tosoh Corporation, product name: Coronate L, isocyanate-based crosslinking agent KBM3066: Shin-Etsu Chemical Co., Ltd., product name: KBM3066, silane coupling agent KBM403: Shin-Etsu Chemical Co., Ltd., product name: KBM403, silane coupling agent M-130G: Shin-Nakamura Chemical Co., Ltd., product name: M-130G, monofunctional methoxypolyethylene glycol methacrylate Ionic compound: an ionic compound represented by the following formula [ka]

[0254] <Evaluation of molded article of resin composition (7)> [Production of resin molded body (7)] The obtained resin composition (7) was applied using an applicator to the release-treated surface of a release-treated polyethylene terephthalate separate film (trade name "PLR-382190" obtained from Lintec Corporation), and dried at a temperature of 100°C for 1 minute to produce a resin molded body (adhesive layer) (7). The thickness of the obtained resin molded body (7) was 20 µm.

[0255] The obtained resin molded body (7) was laminated to a 23 μm thick ultraviolet absorber-containing cycloolefin film (trade name "ZEONOR" available from Zeon Corporation) using a laminator, and then aged for 7 days under conditions of a temperature of 23°C and a relative humidity of 65%, to obtain a laminate (7) of cycloolefin film / resin molded body (7) / separate film.

[0256] [Measurement of absorbance of resin molded body (7)] The obtained laminate (7) was cut into a size of 30 mm x 30 mm, the separate film was peeled off, and the resin molded body (7) was laminated with alkali-free glass (trade name "EAGLE XG" manufactured by Corning Incorporated), which was used as sample (7). The absorbance of the prepared sample (7) in the wavelength range of 300 to 800 nm was measured in 1 nm increments using a spectrophotometer (UV-2450, manufactured by Shimadzu Corporation). The measured absorbance at a wavelength of 440 nm was taken as the absorbance of the resin molded body (7) at a wavelength of 440 nm. The results are shown in Table 15. The absorbance of the alkali-free glass alone and the cycloolefin film alone at wavelengths of 330 nm and 440 nm, respectively, was 0. The transmittance at wavelengths of 440 nm and 330 nm was also calculated according to the following formula: The results are shown in Table 15 in the T440 column for transmittance at a wavelength of 440 nm and in the T330nm column for transmittance at a wavelength of 330 nm. T=10 -A ×100 (T represents transmittance, and A represents absorbance.)

[0257] [Measurement of absorbance retention of resin molded product (7)] After the absorbance measurement, sample (7) was placed in a Sunshine Weather Meter (manufactured by Suga Test Instruments Co., Ltd.) for 75 hours under conditions of a temperature of 63°C and a relative humidity of 50% RH, and a weather resistance test was conducted. The absorbance of the removed sample (7) was measured in the same manner as above. From the measured absorbance, the absorbance retention of the sample at a wavelength of 440 nm was calculated based on the following formula. In the formula, A(440) represents the absorbance at a wavelength of 440 nm. The results are shown in Table 15. The closer the absorbance retention is to 100, the less deterioration of the light-selective absorption function and the better the weather resistance. Absorbance retention rate (%) = (A(440) after durability test / A(440) before durability test) × 100

[0258] [Evaluation of bleeding resistance of resin molded body (7)] A separate film was further laminated on one side of the obtained resin molded product (7) to obtain a resin molded product (7) with double-sided separate films. The obtained resin molded product (7) with double-sided separate films was stored in air at 23 to 25°C for one month. After storage, the resin molded product (7) with double-sided separate films was examined using a microscope to check for the presence or absence of crystal precipitation of the compound within the surface. Cases where no crystal precipitation was observed were marked a, and cases where crystal precipitation was observed were marked b. The evaluation results are shown in the column for bleed resistance in Table 15.

[0259] Resin composition (8) was used instead of resin composition (7) to prepare resin molded product (8), laminate (8), and resin molded product (7) with double-sided separate films, and the evaluations were similarly performed. The results are shown in Table 15.

[0260] Resin composition (9) was used instead of resin composition (7) to prepare resin molded product (9), laminate (9), and resin molded product (9) with double-sided separate films, and the evaluations were similarly performed. The results are shown in Table 15.

[0261] [Table 15]

[0262] The compound of the present invention has high absorption selectivity for visible light with a short wavelength of 440 nm. Furthermore, a resin composition containing the compound of the present invention has high absorbance retention even after weathering tests, and has good weather resistance.

Claims

1. an anion represented by formula (IA); a cation paired with the anion, The compound, wherein the cation includes at least one of an organic cation and an inorganic cation. 【Chemistry 1】 [In formula (IA), R Ｅ１ , R Ｅ２ , R Ｅ３ , R Ｅ４ , R Ｅ５ , and R Ｅ６ each independently represents a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms. R １ , R ２ , R ３ , R ４ , and R ５ is the following [A-1a] or [A-2a]. [A-1a]R １ , R ２ , R ３ , R ４ , and R ５ are each independently a cyano group or a nitro group. [A-2a]R １ , R ２ , R ４ , and R ５ are each independently a cyano group or a nitro group, and R ３ is a linear or branched alkyl group having 1 to 12 carbon atoms.

2. In the formula (IA), R Ｅ１ , R Ｅ２ , R Ｅ３ , R Ｅ４ , R Ｅ５ , and R Ｅ６ and each independently represent a hydrogen atom or a hydrocarbon group having 1 to 8 carbon atoms.

3. In the formula (IA), R １ , R ２ , R ３ , R ４ , and R ５ The compound according to claim 1 or 2, wherein the compound is the following [A-1b] or [A-2b]: [A-1b]R １ , R ２ , R ３ , R ４ , and R ５ are each independently a cyano group. [A-2b]R １ , R ２ , R ４ , and R ５ are each independently a cyano group, and R ３ is a straight or branched chain alkyl group having 1 to 12 carbon atoms.

4. the cation comprises an organic cation; The compound according to any one of claims 1 to 3, wherein the organic cation is a pyridinium cation, a piperidinium cation, a pyrrolidinium cation, a cation having a pyrroline skeleton, an imidazolium cation, an ammonium cation, a trialkylsulfonium cation, a phosphonium cation, a morpholinium cation, or a triarylmethane cation.

5. the cations include inorganic cations; The inorganic cation may be an alkali metal ion, a monovalent metal ion (excluding alkali metal ions), an alkaline earth metal ion, a divalent metal ion (excluding alkaline earth metal ions), a trivalent metal ion, a tetravalent metal ion, or NH ４ ＋ The compound according to any one of claims 1 to 4,

6. The compound according to any one of claims 1 to 5, wherein the cation is an alkali metal ion, an alkaline earth metal ion, a copper (I) ion, a copper (II) ion, a nickel ion, a cobalt (III) ion, an iron (II) ion, an iron (III) ion, a palladium ion, or an organic cation.

7. The compound according to any one of claims 1 to 6, which exhibits a maximum absorption in the wavelength range of 400 nm to 550 nm.

8. The compound according to any one of claims 1 to 7, which has a gram absorption coefficient of 0.5 or more at the maximum absorption wavelength.

9. The compound according to any one of claims 1 to 8, which satisfies the following formula (a): e (l) ｍａｘ ) / e(l ｍａｘ +30nm)≧5 (a) [Where ε(λmax) is the maximum absorption wavelength (λ ｍａｘ ) represents the gram extinction coefficient. ε (λ ｍａｘ +30 nm) is the maximum absorption wavelength (λ ｍａｘ ) +30 nm wavelength. The unit of the gram absorption coefficient is L / (g cm).

10. A composition comprising a compound according to any one of claims 1 to 9.

11. A molded article obtained by molding the composition according to claim 10.

12. The molded article according to claim 11, which has a transmittance of 50% or less at a wavelength of 440 nm.

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