Multilayer vacuum electronic device and manufacturing method

Abstract

SOLUTION: To joint vacuum electronic devices (VEDs) having a plurality of two-dimensional layers formed of different materials and create at least one VED at the same time, a two-dimensional material layer being mechanically processed to include features necessary for device operations to form features of a three-dimension when the two-dimensional material layer is assembled and is joined and becomes a three-dimensional structure and the two-dimensional layers being joined together to have a structure similar to a sandwich.EFFECT: This manufacturing step makes it possible to built in a metal material, a magnetic material, a ceramic material, and other materials which are necessary to manufacture a VED while maintaining a required positional accuracy and a large number of devices for a batch capacity.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application is incorporated herein by reference in its entirety (1) as if fully set forth herein; The term "Multi-layered multi-material" is incorporated herein by reference. al manufacturing process for vacuum elec "Multilayer multi-material manufacturing process for vacuum electronic devices" The present application is jointly owned by inventor Diana Gamzina Daugherty. U.S. Provisional Patent Application No. 63 / 198,817, filed November 15, 2020; and (2) the contents of which are incorporated herein by reference as if fully set forth herein. Incorporated into the Specification, "Electronic magneto-electrost atic sensing, focusing, and steering of electron beams in microwave, millimeter wave, and near-terahertz vacuum electron IC devices (microwave, millimeter wave, and near-terahertz vacuum electron "Electronic, magnetic, and electrostatic detection, focusing, and steering of electron beams in a device," inventor Shared under the name of Diana Gamzina Daugherty, © 2020 Priority based on U.S. Provisional Patent Application No. 63 / 198,915 filed November 21st assert the interests of rights.

[0002] This application also provides: (1) "Multi-layered multi-materia l manufacturing process for vacuum elect "Multilayer multi-material manufacturing process for vacuum electronic devices" , inventor Diana Gamzina Daugherty, co-owned with this application. U.S. Provisional Patent Application No. 63 / 198,817, filed November 15, 2020; Rabini (2) “Electronic magneto-electrostatic sensing, focusing, and steering of elect ron beams in microwave, millimeter wave, and near-terahertz vacuum electronic de vices (microwave, millimeter wave, and near-terahertz vacuum electronic devices) "Electronic, Magnetic, and Electrostatic Detection, Focusing, and Steering of Electron Beams," inventor Diana Shared under the name of Gamzina Daugherty and published on November 21, 2020 The present application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 198,915, filed on Another patent application filed on November 12, 2020, alleges inventor Diana Co-owned by Gamzina Daugherty, "Magneto -Electrostatic Sensing, Focusing, and St eering of Electron Beams in Vacuum Elect ron Devices (electronic, magnetic, electrostatic detection and focusing of electron beams in vacuum electron devices) Related to U.S. Provisional Patent Application No. 17 / 525,698, entitled "Steered Drive, Steering, and Steering," The contents of the specification of U.S. Provisional Patent Application No. 17 / 525,698 are as if No. 6,399,797, which is incorporated herein by reference as if fully set forth herein. [Background technology]

[0003] The present disclosure generally relates to one or more vacuum electron devices. Various materials bonded together to form a simultaneous VED The present invention relates to a manufacturing process used to fabricate a VED having multiple two-dimensional layers comprising: Two-dimensional material layers acquire three-dimensional features when assembled and joined into three-dimensional structures. It is machined to form and contain the features necessary for device operation. The layers are bonded together to form a sandwich-like structure. for VED fabrication while maintaining the required positional accuracy and large number of devices per batch capability It can incorporate metallic, magnetic, ceramic and other materials as required. It becomes possible.

[0004] A vacuum electron device (VED) operates in a vacuum environment and combines one or more electron beams with a VE The interaction between the electromagnetic field generated in the interaction region of the D is utilized. is the passage of electrons from the cathode (electron emitter) to the collector (electron acceptor) of a vacuum electron device. A single assembly that may be vacuum-held or vacuum-sealed to prevent the A vacuum region is also a vacuum. Chamber, or cavity, or tunnel (electron beam tunnel), or RF interconnect Also called the region of interaction, this is the area of ​​interaction between one or more electron beams and one or more electromagnetic waves. Examples of such VEDs in the prior art are particle accelerators, ron, gyrotron, gyroklystron, gyro amplifier, traveling wave tube (trav TWT, gyro TWT, backward wave oscillator, induction inductive output tubes (IOTS), magnetrons, cross-field amplifier, free electron laser, ubiquitous ubitron, maser, diode, triode, tetrode, pentode, etc. (but Some gas-ion lasers operate strictly in a vacuum. They operate at very low pressures rather than at high pressures and generally lack an RF interaction region, but It works the same way. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] U.S. Provisional Patent Application No. 63 / 198,817 [Patent Document 2] U.S. Provisional Patent Application No. 63 / 198,915 [Patent Document 3] U.S. Provisional Patent Application No. 17 / 525,698 Summary of the Invention [Problem to be solved by the invention]

[0006] Previous VEDs generally used individual 2D and 3D subcomponents to The components are formed into an assembly and the assembly is joined to the enclosure to provide structural support and a vacuum enclosure. and then undergoing conventional vacuum processing and sealing procedures to produce a functional VED. Such procedures may take several minutes to complete a single device, depending on the complexity of the device. It can take weeks or more and requires many highly skilled workers and large Today, we have a clean room for the ground station to the satellite, base station, and local Wi-Fi. Explosive demand for wireless broadband data communications on i-systems and terrestrial backbone systems As the number of such devices increases dramatically, there is a significant need for cheaper, higher volume such devices. [Means for solving the problem]

[0007] The subject matter described herein generally relates to laminates of materials assembled and bonded together. Fabrication of three-dimensional vacuum electron devices (VEDs) using parallel sheets The advantage of this approach is that multiple VEDs can be fabricated simultaneously with the same structure, and the semiconductor device When completed, they can be easily separated for individual use, much like is commonly done in vise making. This allows for separation, thereby significantly reducing manufacturing costs per device.

[0008] The foregoing summary is a summary and, as a result, may contain simplifications, generalizations, and omissions of detail. As a result, those skilled in the art will understand that the summary is illustrative only and is in no way intended to be limiting. Please be aware that this is not a diagram.

[0009] The accompanying drawings, which are incorporated in and constitute a part of this specification, show one or more representative The present invention will be described in detail with reference to the accompanying drawings, in which: It helps to explain. [Brief explanation of the drawings]

[0010] [Figure 1]1 is an exploded perspective view of a multi-layer, multi-material assembly for a VED according to one embodiment that incorporates a conductive magnetic material layer while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. FIG. [Figure 2] FIG. 1 is an exploded perspective view of a multi-layer, multi-material assembly for a VED according to another embodiment that incorporates not only conductive magnetic material layers but also insulating layers while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Figure 3] 1 is a perspective cross-sectional view of a multi-layer, multi-material assembly for a VED that incorporates a conductive magnetic material layer while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Figure 4] 1A-1C are top plan views of a series of three multi-layer, multi-material assemblies for VEDs that incorporate layers of conductive magnetic material while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Figure 5] 5 is a cross-sectional view taken along line 5-5 of FIG. 4 illustrating the internal structure of a single multi-layer multi-material assembly for a VED incorporating a conductive magnetic material layer while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Figure 6] 1A-1C are top plan views of a series of three multi-layer, multi-material assemblies for VEDs that incorporate layers of conductive magnetic material while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Figure 7] 7 is a cross-sectional view taken along line 7-7 of FIG. 6 illustrating the internal structure of a single multi-layer multi-material assembly for a VED incorporating a conductive magnetic material layer while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Figure 8] 1 is a top plan view of a series of three multi-layer, multi-material assemblies for VEDs that incorporate layers of conductive magnetic material while creating three-dimensional apertures for electron beam propagation and electromagnetic wave interaction, shown after gaps have been carved or otherwise created between the substrate assembly and the individual VEDs. [Figure 9] 9 is a cross-sectional view taken along line 9-9 of FIG. 8 illustrating the internal structure of a single multi-layer multi-material assembly for a VED incorporating a conductive magnetic material layer while creating a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. [Figure 10] 1 is a flow chart illustrating a process or method for fabricating a vacuum electronic device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0011] such as TWTs (commonly used for RF signal amplification in broadband data communication systems) Exemplary embodiments are described herein in connection with VEDs. Those skilled in the art will recognize that this is merely an example and is not intended to be limiting in any way. will readily occur to such skilled artisans having the benefit of this disclosure. Reference will now be made in detail to exemplary embodiment implementations as illustrated in the drawings and the following description. Wherever possible, the same reference numbers will be used throughout to refer to the same or similar items. .

[0012] For clarity, not all of the routine features of the implementations described herein are shown. It is understood that any such practical implementation may be developed. to achieve the developer's specific goals, including adhering to application-related and business-related constraints. Many implementation-specific decisions must be made to achieve this, and these specific goals are It will be recognized that this will vary from implementation to implementation and from developer to developer. Development efforts can be complex and time-consuming, but this development is nonetheless It will be appreciated that this is a routine undertaking for those skilled in the art having the benefit of the present teachings.

[0013] As used herein, "one embodiment" or "an embodiment" or "one implementation" or References to "an implementation" or the like refer to particular features described in connection with representative embodiments. , structure, part, function, or characteristic may be included in at least one exemplary embodiment. In various places within this specification, "in one embodiment" or "in one embodiment" may be used. The appearance of phrases such as "in one embodiment" or "in another embodiment" does not necessarily refer to the same embodiment or implementation. The present invention does not refer to any particular embodiment, nor does it refer to any separate embodiment that necessarily excludes other embodiments. It is not an alternative embodiment of the.

[0014] In accordance with the present disclosure, the components and process steps described herein are may be implemented using various techniques without departing from the spirit and scope of the inventive concept. That's fine.

[0015] What is described herein includes examples of embodiments of the present invention. Any conceivable combination of elements or methodologies for the purpose of describing the subject matter sought Although it is not possible to describe all of the above, other combinations and permutations of the subject innovation are also possible. Accordingly, it is recognized that claimed subject matter is all such alternatives, modifications, and variations that fall within the spirit and scope of the Moreover, the disclosure of the subject matter, including that described in the Abstract, is intended to be illustrative and not restrictive. The above description of the embodiments is neither exclusive nor intended to limit the scope of the disclosed embodiments. Furthermore, it is not intended to be limiting to the specific embodiments, examples, and aspects described herein. Although implementations are described herein, those skilled in the art will recognize that such implementations Various modifications are possible that are considered to fall within the scope of the embodiments and examples.

[0016] In particular, the various functions performed by the components, devices, systems, etc. described above The terminology used to describe such components with respect to functionality is not specified. As long as the claimed subject matter performs its functions in the exemplary manner illustrated herein, Even if they are not structurally equivalent to the disclosed structures, they may still perform the designated functions of the described components. It is intended to correspond to any component (e.g., functional equivalent) that performs the functions described herein.

[0017] Additionally, certain features of the present invention may be described with respect to only one of several implementations. Although some features have been disclosed, such features may not be suitable for any given application or particular suitability. One or more of such other implementations may be desirable or advantageous in the field of application. It may be combined with any number of other features. (including), "has", "contains" The terms "and" and variations thereof, and other similar terms, are used in the detailed description and claims. to the extent that it is used within the scope of It is included in a similar way to the term "comprising" as a transitional word that is not unique. It is intended to be comprehensive.

[0018] Moreover, the words "example" or "exemplary" are used herein to mean something that is an example, instance, or illustration. Any term described herein as "representative" is used to mean "useful" No aspect or design is necessarily to be construed as preferred or advantageous over other aspects or designs. Rather, the use of the words "example" or "representative" should not be construed as implying that It is intended to present concepts in a concrete manner. As used in this application, the terms "or" and "(" are used interchangeably herein). "or") is intended to mean an inclusive "or" rather than an exclusive "or." That is, unless otherwise specified or clear from the context, "X is A" "or with B" is intended to mean any of the natural inclusive permutations, i.e. If X uses A, X uses B, or X uses both A and B, then "X is either A or B" "Using the article 'a' and 'a'" is satisfied under any of the preceding examples. As used in this application and the appended claims, the terms "an" and "an" refer to or "one or more" generally unless the context clearly directs to the singular. should be interpreted to mean "number."

[0019] In the figures, when a callout number or reference symbol is used in more than one figure, Unless otherwise expressly intended by the context, the same or similar parts, components, or step.

[0020] The devices and methods described herein are applicable to pencil beams, sheet beams, rectangular beams, and for VEDs utilizing beams, elliptical beams, hollow beams, diverging beams, and multiple beams It can be used.

[0021] Most of the following description assumes that the plate is positioned above the electron beam. It addresses the creation of VEDs in the form of parallel aligned layers, but also the fabrication of such devices. The chair can be constructed perpendicular to the electron beam in a relatively simple manner as taught herein. It is contemplated that such a device may also be used, if desired, for example, as a diverging beam detector. The device may be constructed at any angle to the electron beam, such as a vise.

[0022] A significant benefit of the present invention is that it is possible to build even a single prototype device using the present invention without using prior art techniques. It has been proven to be much more cost-effective than multiple VEDs in a single batch. The ability of the present invention to simultaneously fabricate multiple VEDs and then cut them into individual components It's in the power.

[0023] Typically, magnets are used to perform some of the functions of shaping and aiming the electron beam in a VED. The electron beam will not be properly guided from the cathode to the collector. , may strike some other part of the VED structure, causing damage and destroying the vacuum area. The ability to incorporate a variety of magnet material types is beneficial in the construction of VEDs. Halbach, or quadrupole arrays, are often placed some distance from the electron beam. A solenoid is introduced around the electron beam, which is used to focus the electron beam. Another important benefit of the present invention is that it eliminates the need to place magnets inside the vacuum chamber. This allows the magnet to be brought much closer to the electron beam (electromagnetic provides a higher magnetic field strength at the electron beam for a given magnet (either rhomboid or fixed) The magnetic field obtained from a magnet decreases with the square of the distance from the magnet. Therefore, the magnets can be brought closer, and as a result, the magnets can be made smaller with this invention. Magnetic steering is not just about the actual magnets, but also about the magnets in the VED. a magnetically susceptible material that establishes a desired magnetic field at the point where the electron beam is properly steered; This can also be accomplished using a combination of magnets. Magnetic materials and / or iron and nickel containing materials. The electromagnetic circuit is typically concentrated far from the electron beam because the materials it covers are not good electrical conductors. From materials such as copper (or tungsten for helix-type devices) that drive the bundle structure Magnets and / or materials containing iron and nickel are made from highly conductive materials such as copper. High-efficiency materials can be electroplated and used to alleviate this problem, however However, such an arrangement is not recommended as such materials may degrade over time within the VED. This can create potential vacuum purity issues for the VED. High quality nickel plated vacuum double melted iron is available. In this case, heating a permanent magnet above its Curie point causes it to lose its magnetism. Adding permanent magnetic materials such as SmCo and NbFeB to the outside of the vacuum enclosure and low-temperature joining techniques (adhesives or solid-state ultrasonics) must be used to bond such materials. It must be fixed in place.

[0024] In one embodiment, magnets may be added to the circuit of the present invention as follows: To be combined to create (for example) a TWT circuit, each sheet is made of a few hundred nanometers of It is sputter coated with a layer of gold or silver 1000°C (2000°F) thick, and then heated to approximately 1000°C (3200°F) under a weight of about 50 pounds. in a hydrogen furnace or in a fixture that holds the layers in place. To add a magnetic assembly to the layered copper circuit assembly, one or more (vacuum double A layer of (molten) iron or stainless steel is nickel-plated with pockets for magnetic pieces and A copper-gold or copper-silver brazing sheet (approximately 25 microns thick) is used to create the solder joint. A layer of iron / stainless steel may be used in this case brazed to a copper circuit assembly. The magnet pieces are then inserted into the assembly, and remain outside the vacuum area of ​​the VED by the brazed shims. The magnet is inserted into a pre-made pocket in the The magnet is then added and secured using low temperature adhesive to hold the magnet in place.

[0025] Electrostatic focusing also provides some of the electron beam shaping and aiming functions in VEDs. The ability of the present invention to introduce conductors into vacuum structures can then be used to: A vacuum is created by applying a voltage across two or more plates placed around the electron beam. Allows for precise electrostatic focusing within the structure, as desired for specific applications, and If required, several sets of such plates may be used.

[0026] The manufacturing approach described herein is suitable for manufacturing VEDs at a variety of frequencies. It can be used for VEDs, but is particularly useful for VEDs operating between about 25 GHz and about 1 THz. The manufacture of such devices using conventional device assembly by hand (in some cases) Some are difficult due to the small feature scale (micrometers to millimeters). be.

[0027] Turning now to the figures, Figure 1 shows a three-dimensional (3D) model for electron beam propagation and electromagnetic wave interactions. A multi-layer multilayer VED according to one embodiment incorporating a conductive magnetic material layer during aperture creation. FIG.

[0028] In the embodiment illustrated in FIG. 1, the VED 100 includes a first A first planar non-magnetic conductive plate 102 and a second planar non-magnetic conductive plate 103 made of a conductive material such as copper. The planar non-magnetic conductive plate 104, the first planar non-magnetic conductive plate 102 and the second a plurality of planar non-magnetic interacting structures disposed between the planar non-magnetic conductive plates 104; The assembly 101 includes forming plates 106a, 106b, and 106c. If an external fixed magnetic field is to be used for electron beam control, the assembly 101 may be made of iron, nickel, etc. a first planar magnetic plate formed of any magnetic material and a may be placed opposite one or more permanent magnets, including those embedded in or Instead, the assembly 101 includes a first planar magnetic plate 108 and a second planar magnetic plate Two such plates 108 and 110 are arranged between the gate 110. The alignment features 112 (discussed in more detail below) may form a sandwich structure. The parallel plates may be provided to provide a simple mechanism for aligning the parallel plates. Also, the magnet layer is a solid, planar permanent magnet rather than made up of multiple smaller magnets. It is contemplated that this approach may be implemented with a planar "solenoid." If desired, the conductive plates may be made of sputtered alumina. (Al2O3), or to create more complex circuits, the presence of electron beams A vacuum-compatible insulator, such as another conventional insulator that does not outgas into a heated vacuum environment The resin may be coated on one or both sides.

[0029] Figure 2 shows the propagation path during the creation of a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. Multilayer composite for VEDs according to another embodiment incorporating not only a conductive magnetic material layer but also an insulating layer FIG.

[0030] In the embodiment illustrated in FIG. 2, the VED 200 includes a first A first planar non-magnetic conductive plate 202 and a second planar non-magnetic conductive plate 203 made of a conductive material such as copper. The planar non-magnetic conductive plate 204, the first planar non-magnetic conductive plate 202 and the second a plurality of planar non-magnetic interacting structures disposed between the planar non-magnetic conductive plates 204; an assembly having forming plates 206a, 206b, 206c, 206d, and 206e; If an external fixed magnetic field is to be used for electron beam control, the assembly 20 1. Placed on or embedded in one or more permanent A first planar magnetic plate formed of a magnetic material such as iron, nickel, etc., containing a magnet. Alternatively, the assembly 201 may be positioned facing the first plane as shown in FIG. The two magnetic plates 108 and 110 are arranged between the magnetic plate 108 and the second magnetic plate 110. A sandwich structure may be formed from such plates 108 and 110 (hereinafter The alignment feature 112 (discussed in more detail in) provides a simple method for aligning multiple parallel plates. According to the embodiment of FIG. 2, the plate 202 and The "inside" of 204 (i.e., the inside labeled 202a and 204a) is a plate The assembly consisting of 206a, 206b, 206c, 206d, and 206e is plate 2 Form an insulating surface so that it can be floating relative to O2 and 204 In this way, a voltage is applied to both ends of the plates 202 and 204. The electrostatic field generated by the applied voltage difference, as discussed above, is used in conjunction with magnetic beam control and can be used for electron beam control separately from magnetic beam control. The overlying conductors can deliver electrical current to specific locations within the assembly as desired. For example, such conductors may deliver RF signals to and from the interaction region. Such conductors may also control other components within the VED as well. It may be used to deliver a fixed or variable voltage for control.

[0031] In the embodiment of FIG. 2, a pair of conductors 208a, 208b are disposed on insulating surface 202a. It is not shown that the same arrangement is provided on insulating surface 204a. The conductors 208a, 208b may be deposited or placed. 08b should be suitable for a vacuum environment, i.e., under the high temperatures expected in a VED. The plates 206a and 206e are arranged in a corresponding manner as shown. conductors, e.g., 208a, 208b, from the contact points of plates 206a and 206e. Plates 206b and 206d each include an insulating opening. 210 and upper interaction region 212, and plate 206c includes a lower interaction region 210 and an electron beam tunnel 214 surrounded by an upper interaction region 212. Includes.

[0032] Figure 3 shows the propagation path during the creation of a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. 3 is a transparent cross-sectional view of a multi-layer, multi-material assembly for a VED incorporating a conductive magnetic material layer. 2. In particular, a view of the structure formed when the components of FIG. 2 are joined together as intended. be.

[0033] Figure 4 shows the propagation path during the creation of a three-dimensional aperture for electron beam propagation and electromagnetic wave interaction. Top plan view of a series of three multi-layered multi-material assemblies for the VED400 incorporating layers of conductive magnetic material. be.

[0034] Figure 5 shows the propagation of electron beams while creating a three-dimensional aperture for electromagnetic wave interaction. 1 illustrates the internal structure of a single multi-layer multi-material assembly for a VED400 incorporating a conductive magnetic material layer; FIG. 5 is a cross-sectional view taken along line 5-5 of FIG. 4.

[0035] In the embodiment illustrated in FIGS. 4 and 5, the VED 400 is made from a conductive material such as copper. a first planar non-magnetic conductive plate 402 formed from a conductive material such as copper; The second planar non-magnetic conductive plate 404 and the first planar non-magnetic conductive plate 40 a plurality of planar non-magnetic phases disposed between the first and second planar non-magnetic conductive plates 402 and 404; Assembly 401 having interacting structure forming plates 406a, 406b, and 406c. In this embodiment, an external fixed magnetic field should be used to control the electron beam. Therefore, the assembly 401 (also known as the "circuit assembly") is made of iron, nickel, etc. A first planar magnetic plate 408 formed from such a magnetic material and a The magnet 412 is disposed between the magnet and one or more permanent magnets 412, including those embedded therein. Instead, the assembly 401 includes a first planar magnetic plate 408 and a second planar magnetic plate The sample is then taken from two such plates 408 and 410 so as to be placed between the plates 408 and 410. The alignment features (discussed in more detail below) may form a German structure. It may be provided to provide a simple mechanism for aligning the parallel plates.

[0036] Figure 6 shows the propagation of electron beams while creating a three-dimensional aperture for electromagnetic wave interaction. Top plan view of a series of three multi-layered multi-material assemblies for the VED600 incorporating layers of conductive magnetic material. be.

[0037] Figure 7 shows the propagation of electron beams while creating a three-dimensional aperture for electromagnetic wave interaction. 6 illustrates the internal structure of a single multi-layer multi-material assembly 600 for a VED incorporating a conductive magnetic material layer; FIG. 7 is a cross-sectional view taken along line 7-7 of FIG. 6.

[0038] In the embodiment illustrated in FIGS. 6 and 7, the VED 600 is made from a conductive material such as copper. a first planar non-magnetic conductive plate 602 made of a conductive material such as copper; a second planar non-magnetic conductive plate 604 and a first planar non-magnetic conductive plate 60 a plurality of planar non-magnetic phases disposed between the first and second planar non-magnetic conductive plates 602 and 604; Interacting structure forming plates 606a, 606b, 606c, 606d, and 606e In this embodiment, an external fixation element is used to control the electron beam. A magnetic field should be used, and therefore assembly 601 (also known as the "circuit assembly") a first planar magnetic plate 608 formed from a magnetic material such as iron, nickel, etc.; and one or more permanent magnets, including those placed on or embedded within the 12. Instead, the assembly 601 is placed opposite the first planar magnetic plate 60 8 and a second planar magnetic plate 610. A sandwich structure may be formed from layers 608 and 610 (discussed in more detail below). ) Alignment feature 112 provides a simple mechanism for aligning multiple parallel plates during fabrication. According to the embodiment of FIGS. 6 and 7, plates 602 and The "inside" of 604 (i.e., the inside labeled 602a and 604a) is a plate The assembly consisting of 606a, 606b, 606c, 606d, and 606e is plate 6 Form an insulating surface so that it can be floating relative to O2 and 604 In this way, a voltage is applied to both ends of the plates 202 and 204. The electrostatic field generated by the applied voltage difference, as discussed above, is used in conjunction with magnetic beam control and can be used separately for electron beam control. Conductors 614a, 614b, 614c, and 614d, which are placed on electrical insulators, are assembled Electric current can be delivered to specific locations inside the body as desired. For example, such conductors may deliver an RF signal to the interaction region and extract an RF signal from the interaction region. Such conductors may also carry fixed voltages or voltages to control other components within the VED as well. may be used to deliver a varying voltage.

[0039] Figure 8 shows the propagation of electron beams while creating a three-dimensional aperture for electromagnetic wave interaction. Top plan view of a series of three multi-layered multi-material assemblies for the VED600 incorporating layers of conductive magnetic material. This figure shows the gaps 802 between the substrate assembly 804 and the individual VEDs 806. or after it has been created in some other way.

[0040] Figure 9 shows the conduction between electron beam propagation and the three-dimensional aperture created for electromagnetic wave interaction. 8 illustrates the internal structure of a single multi-layer multi-material assembly 800 for a VED 806 incorporating a layer of reflective magnetic material. 9 is a cross-sectional view taken along line 9-9 of FIG. 8.

[0041] The gap 802 may be formed by any conventional method suitable for cutting such materials, for example, Even if it is cut with a laser, high-pressure water, or a diamond-blade saw, it will remain in its original shape even if it is cut with a die. The gap may be machined, drilled, or otherwise fabricated. Once group 802 is formed, the individual VEDs 806 are conventionally configured as known to those skilled in the art. They may be removed and individually packaged for use.

[0042] FIG. 10 illustrates a process for fabricating a vacuum electronic device according to an embodiment of the present invention. is a flow chart illustrating method 1000. The process steps described in connection with FIG. may be performed, or some or all at once.

[0043] Step 1002 is the first step, which involves forming a first planar non-magnetic conductive material from a non-magnetic conductive material. A conductive plate is formed.

[0044] Step 1004 is the second step, which involves forming a second planar non-magnetic conductive material from the non-magnetic conductive material. A conductive plate is formed.

[0045] Step 1006 is the third step, in which a plurality of conductive non-magnetic electrodes are arranged parallel to each other. From the conductive non-magnetic interaction structure forming plate, An interaction structure is formed with a portion of the interaction zone embedded therein.

[0046] Step 1008 is the fourth step, which comprises forming a first planar non-magnetic conductive plate and a second planar non-magnetic conductive plate. The first planar non-magnetic conductive plate is placed on the outside of the lamination so that the second planar non-magnetic conductive plate is placed on the outside of the lamination. The port, the interacting structure, and the second planar non-magnetic conductive plate are arranged in a stack.

[0047] Step 1010 is the fifth step, which involves forming a first planar non-magnetic conductive plate, The magnetic structure and the second planar non-magnetic conductive plate are joined together.

[0048] Step 1012 is the sixth step, which involves forming a first planar magnetic plate from a magnetic material. and disposing at least one magnet on the first planar magnetic plate.

[0049] Step 1014 is the seventh step, which comprises forming a plurality of non-magnetic interaction structure-forming plates. On the side of the opposing first planar non-magnetic conductive plate, parallel to the first planar non-magnetic conductive plate, Place the first planar magnetic plate in the row.

[0050] Step 1016 is the eighth step, which involves applying a first magnetic field to a first planar non-magnetic conductive plate. A planar magnetic plate is bonded.

[0051] Step 1018 is the ninth step, which involves forming a second planar magnetic plate from the magnetic material. and disposing at least one magnet on the second planar magnetic plate.

[0052] Step 1020 is the tenth step, which comprises forming a plurality of non-magnetic interaction structure-forming plates. On the side of the second planar non-magnetic conductive plate facing the A second planar magnetic plate is placed in parallel.

[0053] Step 1022 is an eleventh step, in which a second planar non-magnetic conductive plate is provided with a second A planar magnetic plate is joined to the

[0054] Those skilled in the art will now appreciate that these steps can be performed in the order most convenient for manufacturing and fixing. It will be appreciated that the steps do not necessarily have to be performed in a set order. For example, the joining steps may all be performed in a set order. The forming step can be performed in one step to produce a part for later assembly. It can be carried out with

[0055] The step of joining two-dimensional sheets together can be performed by brazing, diffusion bonding, assisted diffusion bonding (a sisted diffusion bonding, solid state bonding ate bonding), cold welding, ultrasonic welding, or a combination of one or more of the above The joint formed between two adjacent sheets may be a 1x1 0 -6 The vacuum environment should be maintained at a level better than that of torr. Bonding can be performed using hydrogen, nitrogen, vacuum, etc. Before joining, the corresponding layers should be cleaned or plated. It should be etched to remove the surface oxide layer, which helps to form a good leak-tight joint. To avoid this, the corresponding layers should be kept in a vacuum environment before bonding. In this case, the corresponding layers (which may be of different materials) have a vacuum-compatible boundary between them. Coating with vacuum compatible materials (sputtering, electroplating, metallization, and / or painted). Coatings include nickel, gold, silver, molybdenum-manganese, Gun, Copper, Copper-Gold, Copper-Silver, Titanium-Nickel, Gold-Copper-Titanium, Copper-Silver-Titanium, Copper- Silver-titanium-aluminum, titanium-nickel-copper, gold-copper-titanium-aluminum, silver - Copper-Indium-Titanium, Copper-Germanium, Palladium-Nickel-Copper-Silver, Gold-Palladium Radium-magnesium, silver-palladium, gold-copper-nickel, gold-copper-indium, silver -Containing one or more of copper-indium, gold-nickel, gold-nickel-chromium, etc. In this manner, the bonded layers form a high strength assembly, resulting in a relatively high yield. The force handling capability and high gradient capability of the VED are obtained.

[0056] The layers are also electrically insulating to manage the heat flow as well as the electrical potential within the VED. coated with conductive or electrically conductive materials (sputtered, electroplated, metallized, and / or painted) ) The coating may also reduce the flow of heat into and away from the VED. To better manage this, materials designed to conduct heat (e.g., diamond) The layers may then include electrodes and and an insulator plated with conductive paths to form an electrical path for biasing the electrodes. (e.g., Al2O3).

[0057] Cutouts or pockets can be milled, turned, eroded, or lithographed Using techniques such as etching, laser cutting, electron beam cutting, water jet cutting, etc. The cutouts or pockets so formed may be formed in the conductive sheet of the VED. The kit includes ceramic materials, vacuum windows, and circuit-breaking materials (used to improve device stability). attenuators for electron emission, electron emitting materials, vacuum pumping materials, getter materials, Structures such as magnets, iron pieces, shielding materials, separating materials, conductors, connectors, waveguides, couplers, etc. It may be populated by elements.

[0058] Incorporating ceramic materials for focusing, propagation, guidance, steering, and ultimately the cathode Electrostatic beam shaping lenses or electrostatic beam forming lenses are used to help improve the electron beam propagation between the detector and the collector. This allows for the addition of a room-forming area inside the VED. This capability is provided outside the vacuum area of ​​the VED. By incorporating this capability within the VED itself rather than using a This allows for more precise control with lower power consumption.

[0059] Aligning adjacent layers or sheets of material within a VED during the manufacturing process is essential. This may be achieved using column features 112. Such features are discussed elsewhere herein. Alignment holes, alignment pins, rectangular features, and combinations thereof, suitable for robotic assembly techniques. The seat assembly may be performed by manual assembly, robot assembly, Translation stage, automatic translation, robot placement, video from microscale to nanoscale It may be affected by alignment, banya, etc.

[0060] The aforementioned approach uses purely electrostatic focusing without any magnets to achieve VE Note that this allows the construction of D.

[0061] Having shown and described exemplary embodiments and applications, it is understood that those skilled in the art will recognize that many alternatives, including those having the benefit of this disclosure, may be readily apparent to those skilled in the art. Those skilled in the art will appreciate that, without departing from the scope of the present invention as defined by the appended claims, The various exemplary embodiments described herein may include numerous modifications not specifically mentioned above. It will be apparent that corrections, modifications and adaptations may be made.

Claims

1. A vacuum electron device, comprising: a first non-magnetic conductive plate having a first outer surface and a first inner surface, the first non-magnetic conductive plate having a first alignment feature; a second non-magnetic conductive plate having a second outer surface and a second inner surface, the second non-magnetic conductive plate having a second alignment feature; a plurality of non-magnetic interaction structure forming plates disposed in a stacked configuration between the first inner surface of the first non-magnetic conductive plate and the second inner surface of the second non-magnetic conductive plate, each of the plurality of non-magnetic interaction structure forming plates including a third alignment feature, the plurality of non-magnetic interaction structure forming plates together forming a radio frequency (RF) interaction structure, the plurality of non-magnetic interaction structure forming plates including an RF interaction region for propagation of an electron beam; the first non-magnetic conductive plate, the second non-magnetic conductive plate, and the plurality of non-magnetic interacting structure-forming plates are aligned and joined together in a stack by the first alignment feature, the second alignment feature, and the third alignment feature; Vacuum electron devices.

2. 2. The vacuum electron device of claim 1, further comprising a first magnetic plate formed of a first magnetic material, the first magnetic plate being disposed on the first outer surface of the first non-magnetic conductive plate, and at least one first magnet being disposed on or within the first magnetic plate, the at least one first magnet being configured to control the electron beam in the RF interaction region.

3. 3. The vacuum electron device of claim 2, further comprising a second magnetic plate formed of a second magnetic material, the second magnetic plate being disposed on the second outer surface of the second planar non-magnetic conductive plate, and at least one second magnet being disposed on or within the second magnetic plate, the at least one second magnet being configured to further control the electron beam in the RF interaction region.

4. The vacuum electron device of claim 2 , wherein one or more pockets are formed in the first non-magnetic conductive plate.

5. The vacuum electron device of claim 4 , wherein at least one of the one or more pockets contains a getter material.

6. The vacuum electron device of claim 4 , wherein at least one of the one or more pockets contains an emissive material.

7. The vacuum electronic device of claim 4 , wherein at least one of the one or more pockets contains a circuit-disconnecting material.

8. 10. The vacuum electron device of claim 1, wherein the vacuum electron device is configured for use in an RF amplifier or oscillator.

9. 1. A method of manufacturing one or more vacuum electronic devices, comprising: forming a first non-magnetic conductive plate from a first non-magnetic conductive material, the first non-magnetic conductive plate having a first outer surface and a first inner surface; forming a second non-magnetic conductive plate from a second non-magnetic conductive material, the second non-magnetic conductive plate having a second outer surface and a second inner surface; forming an RF interaction region in each of a plurality of electrically conductive non-magnetic interaction structure forming plates; forming an RF interaction structure by stacking the plurality of conductive non-magnetic interaction structure forming plates, each having the RF interaction region formed thereon, wherein the RF interaction regions of the plurality of conductive non-magnetic interaction structure forming plates together form an RF interaction region in the RF interaction structure for propagation of an electron beam; arranging the first non-magnetic conductive plate, the RF interactive structure, and the second non-magnetic conductive plate in a stack such that the first outer surface of the first non-magnetic conductive plate and the second outer surface of the second non-magnetic conductive plate are outside the stack; joining the first non-magnetic conductive plate, the RF interactive structure, and the second non-magnetic conductive plate together.

1. A method for manufacturing one or more vacuum electronic devices, comprising:

10. forming a first magnetic plate from a first magnetic material and disposing at least one first magnet on or within the first magnetic plate; disposing the first magnetic plate on the first outer surface of the first non-magnetic conductive plate and configuring the at least one first magnet to control the electron beam in the RF interaction region; The method of claim 9 further comprising:

11. The method of claim 10 further comprising the step of bonding the first magnetic plate to the first non-magnetic conductive plate.

12. forming a second magnetic plate from a second magnetic material and disposing at least one second magnet on or within the second magnetic plate; disposing the second magnetic plate on the second outer surface of the second non-magnetic conductive plate and configuring the at least one second magnet to further control the electron beam in the RF interaction region; The method of claim 11 further comprising:

13. The method of claim 12 further comprising the step of bonding the second magnetic plate to the second non-magnetic conductive plate.

14. The method of claim 13 further comprising forming one or more pockets in the first non-magnetic conductive plate.

15. The method of claim 14 further comprising placing a getter material in at least one of the one or more pockets.

16. The method of claim 14 , further comprising placing an electron-emitting material in at least one of the one or more pockets.

17. The method of claim 14, further comprising placing a circuit interruption material in at least one of the one or more pockets.

18. 10. The method of claim 9, further comprising forming one or more alignment features in each of the first non-magnetic conductive plate, the second non-magnetic conductive plate, and the plurality of conductive non-magnetic interactive structure-forming plates to assist in alignment.

19. The method of claim 9 , wherein the vacuum electronic device is configured for use in an RF amplifier or oscillator.

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