Light emitting diode package and display device having the same

Abstract

To provide a light emitting diode package which enables reduction of a thickness of a display device while adopting a direct type backlight.SOLUTION: A light emitting module includes a frame, a plurality of light sources disposed in the frame, and an optical part disposed above the light sources and including at least one of a fluorescent sheet and an optical sheet. The light source includes a light emitting diode, a reflection part disposed on the light emitting diode, and a molding part which covers a side surface and an upper surface of the light emitting diode. The molding part includes: a first molding part; and a second molding part disposed on the first molding part. The second molding part has an area in which a thickness is smaller than that of the first molding part. Luminous intensity of a center part of light emitted from the light source is lower than luminous intensity of a periphery of the center part.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to a light emitting diode package and a display device having the same, and more particularly to a light emitting diode package and a display device having the same. A light emitting diode package for emitting light from a direct backlight of a display device and the light emitting diode package The present invention relates to a display device having the same. [Background technology]

[0002] In recent years, there has been an increasing demand to make display devices as thin as possible. In the case of LCDs that use a backlight unit among the display devices, the backlight unit Edge-type backlight units, in which the light source is located on the side, are widely used.

[0003] However, when using an edge-type backlight unit as mentioned above, the actual light The sense of seeing the scenery is enhanced by the HDR (high dynamic range) images reproduced on the display device. ) is impossible to achieve. This is because in order to achieve HDR, Depending on the position on the screen, the brightness of the light emitted through the display device must be different. However, edge-type backlight units cannot realize differences in brightness depending on the position. This is the case.

[0004] This allows the use of a direct backlight unit and an active matrix By realizing this type, various researches are being conducted to realize HDR. Patent Application No. 10-2016-0051566 (2016.05.11, hereinafter Patent Document 1 However, the above-mentioned Patent Document 1 is a direct type backlight unit. The LED is made of glass and has a lens to disperse the light emitted from the LED to the side. By using a lens in this way, the thickness of the lens makes it possible to reduce the size of the display. However, there is a limit to how thin the thickness can be. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Korean Patent No. 10-2016-0051566 Summary of the Invention [Problem to be solved by the invention]

[0006] The problem to be solved by the present invention is to reduce the thickness of the display device while adopting a direct backlight. and a display device having the same. It says: [Means for solving the problem]

[0007] The LED package according to an embodiment of the present invention includes a LED chip, a light emitting diode, and a light emitting diode. a light-emitting diode chip; a light-emitting diode chip; a light-emitting diode chip; a reflector that reflects at least a portion of the light, and a light-emitting diode chip that covers the upper and side surfaces of the reflector and the reflector. The molded portion may include a molding portion arranged as follows:

[0008] At this time, the thickness of the molding part from the top surface of the reflecting part to the top surface of the molding part is may be smaller than the width from the side of the light-emitting diode chip to the side of the molding part. stomach.

[0009] Here, the molding part is formed by extending from the side of the light-emitting diode chip to the side of the molding part. The width from the top surface of the reflecting part to the top surface of the molding part is 1.5 times or more than the thickness It may be twice or less.

[0010] The molding portion contains at least one of one or more phosphors and a light diffusing agent. That's fine too.

[0011] The reflecting portion is a distributed Bragg reflector. may include a reflector.

[0012] At this time, the reflector has a transmittance of 0% to 80% for the light emitted from the LED chip. may be.

[0013] The molding part covers the upper and side surfaces of the light emitting diode chip and the reflector. 1 molding part and the second molding part covering the top and sides of the first molding part The device may include a tagging section.

[0014] At this time, one type of molding material is provided in at least one of the first molding part and the second molding part. The above phosphors may be included.

[0015] At this time, one or more kinds of fluorescent lamps are provided in each of the first and second molding parts. If a light source is included, the phosphor included in the first molding part and the second molding part may be of different types.

[0016] The second molding part may be thinner than the first molding part.

[0017] The reflecting portion includes a first reflecting portion disposed on a part of the upper surface of the light-emitting diode chip, and a second reflecting portion disposed on the upper surface of the light-emitting diode chip. A second reflector is disposed on the upper surface of the photodiode chip and is disposed so as to surround the first reflector. It may include a part.

[0018] In this case, the reflectance of the first reflecting portion and the reflectance of the second reflecting portion may be different from each other. The reflectance of the first reflecting portion may be less than the reflectance of the second reflecting portion.

[0019] The molding portion may have a sloping side surface, and the sloping side surface may be inclined downward. It may also be a surface.

[0020] Meanwhile, the LED package according to an embodiment of the present invention includes an LED chip. , disposed on the upper surface of the light-emitting diode chip, and a reflecting portion that reflects at least a portion of the light, and a molded portion disposed on the side of the light-emitting diode chip. The device may include a ring portion.

[0021] In this case, the reflecting portion may be exposed to the outside from the upper surface of the light-emitting diode chip.

[0022] On the other hand, the display device according to one embodiment of the present invention includes a frame, a plurality of pixels regularly arranged on the frame, and a plurality of pixels regularly arranged on the frame. a plurality of light-emitting diode packages, a plurality of light-emitting diode packages, and a and an optical unit including at least one of a fluorescent sheet and an optical sheet, and a display panel. , the light emitting diode package is a light emitting diode chip, the top surface of the light emitting diode chip a reflector disposed on the light-emitting diode chip, the reflector reflecting at least a portion of the light emitted from the light-emitting diode chip; and a mold disposed to cover the upper and side surfaces of the light-emitting diode chip and the reflector. The sensor may include a ring portion.

[0023] Here, the distance between the frame and the optical part may be 1 mm or more and 15 mm or less.

[0024] The thickness of the molding part from the top surface of the reflecting part to the top surface of the molding part is , may be smaller than the width from the side surface of the light-emitting diode chip to the side surface of the molding part. .

[0025] At this time, the molding part is pressed against the side of the light-emitting diode chip. The width to the side is 1.5 times or more the thickness from the top surface of the reflecting part to the top surface of the molding part It may be four times or less.

[0026] The molding portion contains at least one of one or more phosphors and a light diffusing agent. That's fine too.

[0027] The reflecting portion may include a distributed Bragg reflector.

[0028] At this time, the reflector has a transmittance of 0% to 80% for the light emitted from the LED chip. may be.

[0029] The molding part covers the upper and side surfaces of the light emitting diode chip and the reflector. 1 molding part and the second molding part covering the top and sides of the first molding part The hologram section may include a hologram section.

[0030] At this time, one type of molding material is provided in at least one of the first molding part and the second molding part. The above phosphors may be included.

[0031] At this time, one or more kinds of fluorescent lamps are provided in each of the first and second molding parts. If a light source is included, the phosphor included in the first molding part and the second molding part may be of different types.

[0032] The second molding part may be thinner than the first molding part.

[0033] The reflecting portion includes a first reflecting portion disposed on a part of the upper surface of the light-emitting diode chip, and a second reflecting portion disposed on the upper surface of the light-emitting diode chip. A second reflector is disposed on the upper surface of the photodiode chip and is disposed so as to surround the first reflector. It may include a part.

[0034] In this case, the reflectance of the first reflecting portion and the reflectance of the second reflecting portion may be different from each other. The reflectance of the first reflecting portion may be less than the reflectance of the second reflecting portion.

[0035] The molding portion may have a sloping side surface, and the sloping side surface may be inclined downward. It may also be a surface.

[0036] Meanwhile, the display device according to an embodiment of the present invention may include a light emitting diode chip, a light emitting diode a light-emitting diode chip that is disposed on the upper surface of the chip and that reflects at least a portion of the light emitted from the chip; and a molding part disposed on the side of the light emitting diode chip. Good too.

[0037] In this case, the reflecting portion may be exposed to the outside from the upper surface of the light-emitting diode chip. [Effects of the Invention]

[0038] According to the present invention, a light emitting diode is used as a light source for a backlight unit used in a display device. A light-emitting diode package in which a reflector is placed on the diode chip and covered with a molding part. By using this lens, the LED package can be directly mounted without using a separate lens. It can be used as a bottom backlight unit.

[0039] In addition, since no separate lens is used, it is relatively brighter than conventional direct-type backlight units. It is possible to provide a direct backlight with a small thickness, thereby reducing the thickness of the display device. can.

[0040] Then, the molding part that covers the LED chip is formed twice. At least one of the LEDs contains one or more types of phosphor, and It is easy to control the color of the light emitted from the LED package. One or more types of phosphors are placed in the outer molding part of the double molding part. By including the above, the thermal properties of the light emitting diode package can be improved.

[0041] The LED package also has a second insulating layer disposed at the center of the top surface of the LED chip. a first reflecting section and a second reflecting section arranged to surround the first reflecting section, By varying the reflectivity of the second reflective portion, the light emitted from the light emitting diode package can be reduced. This can improve the efficiency of scattering light in the lateral direction.

[0042] In addition, by forming the side of the molding part of the LED package into an inclined surface, Therefore, the dispersion efficiency of the light emitted from the light emitting diode package can be improved. [Brief explanation of the drawings]

[0043] [Figure 1a] 1 is a plan view showing an example of a display device according to a first embodiment of the present invention. [Figure 1b] FIG. 2 is a rear view showing an example of the display device according to the first embodiment of the present invention. [Figure 2a] 1 is a cross-sectional view showing a display device according to a first embodiment of the present invention. [Figure 2b] 1 is a cross-sectional view showing a display device according to a first embodiment of the present invention. [Figure 3] 1 is a cross-sectional view showing a light emitting diode package according to a first embodiment of the present invention. [Figure 4] 4 is a graph comparing light emitted from the light emitting diode package according to the first embodiment of the present invention. [Figure 5] 4 is a graph showing a state in which light is uniformly emitted from the light emitting diode package according to the first embodiment of the present invention. [Figure 6a] 4 is a graph showing light directivity characteristics depending on the reflectance of a reflective portion in the light emitting diode package according to the first embodiment of the present invention. [Figure 6b] 6b is a graph showing peak values ​​depending on the reflectance of the reflecting portion in the graph showing the light directivity characteristics of FIG. 6a. [Figure 6c] 6b is a graph showing center values ​​according to the reflectance of the reflecting portion in the graph showing the light directivity characteristics of FIG. 6a. [Figure 7a] 10 is an actual image comparing central illuminance depending on reflectance of a reflective portion of the light emitting diode package according to the first embodiment of the present invention. [Figure 7b] 4 is a graph comparing central illuminance according to reflectance of a reflective portion of the light emitting diode package according to the first embodiment of the present invention. [Figure 8a] 10 is an actual image showing uniformity when only a light emitting diode chip is arranged to explain the uniformity of the light emitting diode package according to the first embodiment of the present invention; [Figure 8b] 10 is a distribution image showing uniformity when only a light emitting diode chip is arranged to explain the uniformity of the light emitting diode package according to the first embodiment of the present invention; [Figure 8c] 4 is a graph showing uniformity when only LED chips are arranged to explain the uniformity of the LED package according to the first embodiment of the present invention; [Figure 9a] 4 is an actual image illustrating uniformity of the light emitting diode package according to the first embodiment of the present invention. [Figure 9b] 4 is a distribution image for explaining the uniformity of the light emitting diode package according to the first embodiment of the present invention. [Figure 9c] 4 is a graph showing uniformity of the light emitting diode package according to the first embodiment of the present invention. [Figure 10] FIG. 4 is a cross-sectional view showing a light emitting diode package according to a second embodiment of the present invention. [Figure 11] FIG. 10 is a cross-sectional view showing a light emitting diode package according to a third embodiment of the present invention. [Figure 12] FIG. 10 is a cross-sectional view showing a light emitting diode package according to a fourth embodiment of the present invention. [Figure 13] FIG. 10 is a cross-sectional view showing a light emitting diode package according to a fifth embodiment of the present invention. [Figure 14] FIG. 10 is a cross-sectional view showing a light emitting diode package according to a sixth embodiment of the present invention. [Figure 15] 13 is a graph showing light distribution at the center of the light emitting diode package according to the sixth embodiment of the present invention. [Figure 16] FIG. 10 is a cross-sectional view showing a light emitting diode package according to a seventh embodiment of the present invention. [Figure 17] 13 is a graph showing light distribution at the center of the light emitting diode package according to the seventh embodiment of the present invention. [Figure 18a] FIG. 10 is a cross-sectional view showing a light emitting diode package according to an eighth embodiment of the present invention. [Figure 18b] FIG. 13 is a perspective view showing a light emitting diode package according to an eighth embodiment of the present invention. [Figure 19] 13 is a graph showing light distribution at the center of the light emitting diode package according to the eighth embodiment of the present invention. [Figure 20] FIG. 13 is a cross-sectional view showing a light emitting diode package according to a ninth embodiment of the present invention. [Figure 21] 13 is a graph showing illuminance of the light emitting diode package according to the ninth embodiment of the present invention. [Figure 22]FIG. 20 is a cross-sectional view showing a light emitting diode package according to a tenth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0044] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0045] 1a and 1b are a plan view and a rear view showing a display device according to a first embodiment of the present invention. 2a and 2b are cross-sectional views showing a display device according to a first embodiment of the present invention.

[0046] The display device 200 according to the first embodiment of the present invention includes a light-emitting diode package 100, a flat panel display panel, a ... The light emitting diode package includes a front cover 230, a frame 210, and an optical part 220. The package 100 includes a light-emitting diode chip 112, a reflecting portion 114, and a molding portion 116. This will be explained later.

[0047] The front cover 230 covers the side and part of the front of the display panel 227 of the optical unit 220. The center of the front cover 230 is open, and the front cover By disposing the display panel 227 at the center of the display panel 230, The captured image can be displayed externally.

[0048] The frame 210 supports the display device 200 and is connected to a front cover 230 on one side. The frame 210 may be made of a metal material such as an aluminum alloy or a synthetic resin material. The frame 210 may be spaced apart from the optical portion 220 by a predetermined distance. On the optical unit 220 side, the light emitting diode package 100 is disposed on the frame 210. In this case, the distance between the frame 210 and the optical part 220 may be set to be equal to the distance between the light emitting diodes 210 and 220. The optical distance (OD) from the optical package 100 to the optical section 220 In this case, in this embodiment, the OD may be, for example, about 1 mm or more and 1 It may be 5 mm or less.

[0049] The frame 210 has an upper portion to which the light emitting diode package 100 is electrically connected. The substrate 212 may be disposed on the light-emitting diode package 100. It is provided to supply power.

[0050] The optical unit 220 is disposed on the upper part of the frame 210 and includes a fluorescent sheet 221, a diffusion plate 223, and a , an optical sheet 225 and a display panel 227 .

[0051] The phosphor sheet 221 converts the light emitted from the light emitting diode package 100 into light having different wavelengths. The fluorescent sheet 221 contains one or more types of fluorescent material. It may contain one or more types of quantum dots (QDs). In this embodiment, the light emitted from the light emitting diode package 100 is blue light. The light emitted through the fluorescent sheet 221 may be ultraviolet light. It may be white light.

[0052] The diffusion plate 223 diffuses the light emitted from the light emitting diode package 100 upward. It has a role to play.

[0053] The optical sheet 225 may be disposed on the upper side of the diffusion plate 223, and the display panel 22 7 may be arranged. The optical sheet 225 may have a plurality of optical elements each having a different function. For example, the optical element may include one or more prism sheets and a diffusion sheet. The diffusion sheet prevents the light emitted through the diffusion plate 223 from being partially concentrated. The prism sheet is placed between the diffuser sheet and the light source, and the brightness of the light can be made more uniform. The emitted light can be concentrated and made to be perpendicularly incident on the display panel 227 .

[0054] The display panel 227 is disposed in front of the display device 200 and is capable of displaying images. The display panel 227 includes a plurality of pixels, and each pixel has its own hue, brightness, saturation, etc. You can output the video by combining the above.

[0055] As shown in FIG. 1a, a plurality of light emitting diode packages 100 are provided, and a display device The LEDs may be arranged regularly over a large area of ​​the device 200. The cages 100 are arranged in rows and columns on the display device 200 at regular intervals. may be arranged in

[0056] FIG. 1a shows an example of a state in which a plurality of light emitting diode packages 100 are regularly arranged. The plurality of light emitting diode packages 100 can be used in a display device 200. The more the number of images arranged, the better the HDR (high dynamic range) of the display device 200. ge) can be realized with higher quality.

[0057] A plurality of power supplies for supplying power to the plurality of light emitting diode packages 100 are provided. The power supply unit 250 may include one or more LED packages. In this embodiment, one power supply unit 250 can supply power to the device 100. A case where power is supplied to 32 light emitting diode packages 100 via the power supply 102 will be described. The plurality of light emitting diode packages 100 are supplied with power via the power supply unit 250. emits light, and each light emitting diode package 100 can operate individually.

[0058] FIG. 3 is a cross-sectional view showing a light emitting diode package according to a first embodiment of the present invention. .

[0059] Referring to FIG. 3, a light emitting diode package 100 according to a first embodiment of the present invention will be described. As shown in the figure, the light emitting diode package 100 is a light emitting diode. The light emitting device includes a metal chip 112, a reflecting portion 114, and a molding portion .

[0060] The light-emitting diode chip 112 may include an n-type semiconductor layer, an active layer, and a p-type semiconductor layer. The n-type semiconductor layer, active layer, and p-type semiconductor layer are each made of III-V group compounds. The semiconductor may include a nitride semiconductor, for example, a nitride semiconductor such as (Al, Ga, In)N. That's fine.

[0061] The n-type semiconductor layer may be a conductive semiconductor layer containing n-type impurities (e.g., Si), The p-type semiconductor layer may be a conductive semiconductor layer containing p-type impurities (for example, Mg). The conductive layer is interposed between the n-type semiconductor layer and the p-type semiconductor layer and includes a multi-quantum well structure (MQW). The composition ratio of the active layer is then determined so that light having a desired peak wavelength can be emitted. It is possible.

[0062] In this embodiment, the light-emitting diode chip 112 is a flip-chip type light-emitting diode. The light-emitting diode chip 112 may be a light-emitting diode chip 112. , an n-type electrode electrically connected to the n-type semiconductor layer, and a p-type electrode electrically connected to the p-type semiconductor layer. A mold electrode may be placed.

[0063] The light emitted from the light emitting diode chip 112 is incident on the upper surface of the light emitting diode chip 112. and the light is emitted to the outside through the side surfaces. For example, the width, length and thickness are 670 μm, 670 μm and 250 μm, respectively. Good too.

[0064] The reflector 114 is disposed on the top of the light-emitting diode chip 112. The reflecting portion 114 may be disposed so as to cover the entire upper portion of the reflecting portion 114. can reflect the entire light emitted from the light emitting diode chip 112, or It transmits a portion of the light emitted from the light-emitting diode chip 112 and reflects the rest of the light. It can also be done as follows.

[0065] As an example, the reflecting portion 114 may be a distributed Bragg reflector. The distributed Bragg reflectors may include a plurality of different The distributed Bragg reflector may be formed by stacking a plurality of layers of materials having refractive indices. is determined by the number of material layers forming the distributed Bragg reflector. It can reflect all or part of the emitted light. If desired, the reflecting portion 114 may be formed of a metal or other material that is not a distributed Bragg reflector. For example, the light transmittance of the reflective portion 114 may be 0% to 80%.

[0066] To explain the distributed Bragg reflector in more detail, the distributed Bragg reflectors are different from each other. Alternatively, the dielectric layer may have a structure in which two or more dielectric layers having different refractive indices are alternately arranged. The upper dielectric layers are selected from the group consisting of Si, Zr, Ta, Ti, and Al. The oxide or nitride of the element may be used, specifically AlGaN, GaN, SiO 2. SiN, Si3N4, SiO x N y , TiO2, TiN, TiAlN, TiSiN, Each of the materials contains one of AlN, Al2O3, ZrO2, and MgO, which are different from each other. That's fine.

[0067] Each of the two or more dielectric layers may have a thickness of λ / 4n. , λ denotes the wavelength of the light emitted from the active layer, and n denotes the refractive index of the dielectric layer. Therefore, the thickness of the distributed Bragg reflector may be approximately 300 Å to 900 Å. The reflector may be formed of 2 to 50 pairs of two or more dielectric layers, but is not limited thereto. In this embodiment, the refraction of two or more dielectric layers is controlled by the light transmittance of the reflective portion 114. The rate and thickness can be determined.

[0068] In addition, a distributed Bragg reflector has a structure in which two or more dielectric layers are alternately stacked, The light energy emitted from the light emitting diode chip 112 is absorbed so that no light is absorbed inside. The dielectric may have a band gap energy greater than the energy of the dielectric. The greater the difference in refractive index between layers, the greater the reflectivity can be.

[0069] The distributed Bragg reflector may be, for example, SiI2 / TiO2, SiO2 / Ta2O2 or It may consist of a repeating stack of SiO2 / HfO, and for blue light it may be SiO2 / TiO2. When composed of SiO2 / Ta2O2 or SiO2 / H, the reflection efficiency is good. When configured as fO, the reflection efficiency is good.

[0070] The reflecting unit 114 may be configured as an omni-directional reflector (ODR) as needed. ional reflector).

[0071] The reflecting section 114 may include both a distributed Bragg reflector and an omnidirectional reflector as needed. The distributed Bragg reflector has a higher reflectivity for light that is closer to the perpendicular direction. High, allowing other light to pass through.

[0072] For example, when light is incident at a specific angle on the interface between two media, one of the polarization components Only a certain amount of light is reflected, and the other polarization components are not reflected and are completely transmitted. The angle is called the Brewster angle, but when vertically and horizontally polarized light is taken into consideration, the Brewster angle When vertically and horizontally polarized light is incident on the boundary surface at a corner, the reflected and transmitted waves are at a 90-degree angle to each other. The vertically polarized light is almost entirely reflected, and the horizontally polarized light is almost entirely reflected. , there may be an angle where most of the light is transmitted. Thus, the reflection coefficient of the horizontally polarized component is 0 ( The Brewster angle is the angle at which the angle becomes zero. The Brewster angle varies depending on the physical properties of the medium. Although this can vary, unpolarized light (e.g., light emitted from the active layer) When incident on a distributed Bragg reflector at an angle, the vertically polarized light component is almost entirely reflected, while the horizontally polarized light component is All of the light components are transmitted.

[0073] In this case, the distributed Bragg reflector is fabricated by molecular beam epitaxy. m epitaxy, E-beam evaporation, ion-beam assisted deposition, reactive plasma deposition, electron Electron beam evaporation, thermal evaporation normal evaporation, sputtering and Conformal sputtering process etc. It may be formed through

[0074] As shown in FIG. 3, the molding part 116 is a light emitting part with a reflecting part 114 disposed on the top. It may be arranged so as to cover the entire photodiode chip 112. The light-emitting diode chip 112 is provided with an n-type electrode and a p-type electrode. It may be disposed so as to cover the side and top of the light emitting diode chip 112 except for the above.

[0075] The molding part 116 is a part through which the light emitted from the light emitting diode chip 112 can pass. The transparent material may be transparent and may include, for example, silicone.

[0076] In this embodiment, the molding part 116 covers the light emitting diode chip 112. For example, the width, length and thickness are 1500 μm, 1500 μm and 4 μm, respectively. That is, the thickness of the molding part 116 may be 20 μm. The thickness t of the chip 112 and the distance from the top surface of the light-emitting diode chip 112 to the molding part 11 The thickness of the upper surface of the 6th layer (hereinafter referred to as the first thickness, d1) is equal to or greater than the total thickness of the 6th layer (hereinafter referred to as the first thickness, d1). In this case, the first thickness d1 may be equal to or smaller than the thickness t of the light-emitting diode chip 112. It may be smaller than this (d1≦t).

[0077] Then, from the side of the light-emitting diode chip 112 to the side of the molding part 116 The width (hereinafter referred to as the first width, d2) may be smaller than the first thickness d1. The first width d2 may be 1.5 times or more and 4 times or less than the first thickness d1, for example, about 2.4 It may be four times as large.

[0078] In other words, the molding part 116 is formed on the top of the light emitting diode chip 112. The thickness d1 formed on the side of the light-emitting diode chip 112 is thinner than the width d2 formed on the side of the light-emitting diode chip 112. The light emitted from the light-emitting diode chip 112 is reflected by the reflector 114 disposed on the top. and most of the light can be emitted in the lateral direction of the light-emitting diode chip 112. Furthermore, the light emitted from the light emitting diode chip 112 The molded portion 116 is guided laterally by the shape of the molded portion 116 formed on the top and side surfaces. and can be better discharged laterally.

[0079] As described above, the molding part 116 is formed to cover the light emitting diode chip 112. The light emitting diode package 100 thus formed emits light relatively to the side rather than the top. By being emitted, it can be used as a backlight for the display device 200.

[0080] In particular, the light emitted from the light emitting diode package 100 in the lateral direction allows The lens for emitting light can be omitted. Since a separate lens is not used, the light-emitting diode The display device 200 includes a frame 210 and a plurality of the code packages 100. It can replace the backlight unit and does not require a separate lens. Therefore, the thickness of the display device 200 can be minimized.

[0081] Furthermore, the molding portion 116 may be formed only from a transparent material, if necessary. One or more types of phosphors and a diffusing agent for adjusting light diffusion may be contained inside. In this embodiment, as described above, the optical unit 220 includes the fluorescent sheet 221. The illuminating unit 116 may not include a separate phosphor. In order to improve the color reproducibility of the light emitted through the fluorescent sheet 221, the molding part 11 6 may contain one or more types of phosphors.

[0082] FIG. 4 is a comparative diagram showing the light emitted from the light emitting diode package according to the first embodiment of the present invention. This is a comparison graph.

[0083] FIG. 4 shows the LED emitted from the light emitting diode package 100 according to the first embodiment of the present invention. 4A and 4B are graphs showing the image and the directional angle of the light. First, referring to FIG. 4A, the light emitting diode The image was taken at 0.4 mm OD relative to the light emitted from the electrode chip 112. Images taken at 4mm and light distribution data at 50cm (far field data ) can be seen. Referring to FIG. 4(b), the LED chip 112 The photo was taken with the OD at 0.4 mm for the light emitted with the reflector 114 placed on top. You can check the image, the image taken at 4mm OD, and the light distribution data at 50cm. 4(c), the reflecting portion 114 and the molding portion 116 are The OD of the light emitted from the formed light emitting diode package 100 is 0.4 mm. Check the image taken at 50cm, the image taken at 4mm OD, and the light distribution data at 50cm. It is possible.

[0084] In this way, the light emitting diode chip 112 is provided with the reflector 1 through the image and light distribution data. 14 and the molding part 116 are formed, thereby forming a light emitting diode package. It can be seen that the light emitted from 100 is uniformly dispersed.

[0085] FIG. 5 shows a light emitting diode package according to a first embodiment of the present invention, in which light is uniformly emitted. 10 is a graph showing the state of the device.

[0086] As shown in FIG. 5(a), without the fluorescent sheet 221 and the optical sheet 225, a plurality of light emitting elements are The image and output graph of the light emitted from the photodiode package 100 are shown. This allows you to confirm that the light is emitted uniformly throughout. The reason why the light output decreases toward the right in Figure 5(a) is that the This is due to the difference in the current input to the power package 100.

[0087] As shown in FIG. 5(b), a phosphor sheet 2 is attached to the top of the plurality of light-emitting diode packages 100. Check the image and output graph taken for the light output with 21 placed. As compared with (a) of FIG. 5, each light-emitting diode package 100 located on the right side Even if the output is somewhat weak, you can see that the light is output evenly.

[0088] Also, as shown in FIG. 5(c), a fluorescent strip is attached to the top of the plurality of light-emitting diode packages 100. The light output from the port 221 and the light diffusion sheet is placed. The light output from the display device 200 is When it is emitted uniformly to the outside on a flat surface, it is emitted uniformly to the outside over the entire area. In particular, the graph shows that the light is diffused more effectively by the diffusion sheet. It can be seen that the radiation is released to the outside more uniformly.

[0089] 6a to 6c show a reflective portion of a light emitting diode package according to a first embodiment of the present invention. 10 is a graph showing light directivity characteristics depending on reflectance.

[0090] FIG. 6a shows a case where the reflectance of the reflective portion 114 is changed from 0% to 100% in this embodiment. 10 is a graph showing the results of a simulation of the light directional characteristics when a light emitting diode is used. The optical package 100 used is the one shown in FIG. 3, and the optical directional distribution is This is the result.

[0091] As shown in FIG. 6a, the higher the reflectivity of the reflective portion 114, the lower the light intensity at the center. It can be seen that the peak angle at which the maximum light intensity is reached increases. That is, the angle at which the light intensity reaches its maximum value increases as the reflectivity increases. In the graph of FIG. 6a, the x-axis indicates the light directivity angle. vinegar.

[0092] The graph in Figure 6a shows the results for reflectances of 90% and 100%. When looking at the rough, the light intensity is small at the central angle and the peak angle has the maximum light intensity. Based on this, it can be seen that the reflectance of the reflective portion 114 In order to confirm the angle at which the side dispersion efficiency of the light directional characteristics increases depending on the size, Figures 6b and 6c are shown. 6c.

[0093] 6b shows that the peak value of the light directivity characteristic at an angle of about 60 degrees in FIG. 6a is proportional to the reflectance of the reflecting portion 114. 6b, the reflectance of the reflective portion 114 is 75 It can be seen that the peak value suddenly changes and increases based on the point at %.

[0094] 6c shows that the peak value of the light directivity characteristic at the central angle of FIG. 6a varies depending on the reflectance of the reflecting portion 114. Referring to FIG. 6c, when the reflectance of the reflective portion 114 is 75%, It can be seen that the peak value suddenly changes and then decreases based on a certain point.

[0095] 6b and 6c, the reflectance of the reflector 114 is greater than 75%. It is confirmed that the side dispersion efficiency of the light emitting diode package 100 improves as it is used. It is possible.

[0096] 7a and 7b are diagrams illustrating a reflective portion of a light emitting diode package according to a first embodiment of the present invention. 10 is a graph comparing the central illuminance depending on the reflectance of the

[0097] FIG. 7a shows a case where the OD is 2 mm, and there is no reflector 114, and the light-emitting diode chip 11 2, the light emitted from the LED panel 110 is combined with a reflector 114 having a reflectivity of 90%. The light emitted from the package 100 and the reflecting part 114 having a reflectance of 100% are combined. 7a is an illuminance image comparing the light emitted from the light emitting diode package 100. When the OD is 2 mm and the reflectance of the reflecting portion 114 is 90%, the illuminance image of the light is uniform. It can be seen that the light is uniformly distributed, and when the reflectance is 100%, the light illuminance image It can be seen that some dark spots occur in the center.

[0098] The relative value of the central illuminance depending on the reflectance of the reflecting portion 114 is shown in FIG. 7b, it is confirmed that the higher the reflectance of the reflecting portion 114, the lower the central illuminance value. In this way, the higher the reflectance of the reflecting portion 114, the lower the central illuminance. By doing so, the degree to which light is dispersed in the lateral direction of the light emitting diode package 100 is varied. It can be seen that the relative

[0099] 8a to 8c show the uniformity of the light emitting diode package according to the first embodiment of the present invention. FIG. 10 is a diagram illustrating the uniformity when only a light-emitting diode chip is arranged to explain the 9a to 9c show the structure of the light emitting diode package according to the first embodiment of the present invention. FIG. 10 is a diagram for explaining uniformity.

[0100] 8a and 8b show a light-emitting diode without the reflecting portion 114 and the molding portion 116. 8c shows an actual image and a distribution image when the light-emitting diode chips 112 are arranged. 10 is a graph for checking the uniformity of the arrangement of the electrode chips 112.

[0101] 8a and 8b, the positions of the light-emitting diode chips 112 can be seen. Check whether and how many light-emitting diode chips 112 are arranged. The uniformity of the light emitted from the light emitting diode chip 112 is relatively good. It can be confirmed that

[0102] Also, through the graph of FIG. 8c, the maximum value of the light emitted from the light emitting diode chip 112 Make sure the brightness is about 8000 lux and the minimum brightness is about 4600 lux. Based on this, it can be determined that the uniformity is approximately 57.5%. .

[0103] 9a and 9b show a structure in which a reflector 11 is provided on the top of a light-emitting diode chip 112. 4 is arranged, and the light emitting diode package 100 in which the molding part 116 is formed is 8a shows the actual image and distribution image when arranged as shown in Fig. 8a. 10 is a graph for checking the uniformity of the arrangement of the photodiode packages 100. .

[0104] The images shown in Figures 9a and 9b are relatively small compared to the images shown in Figures 8a and 8b. It can be seen that the light is uniformly distributed over the entire surface. As a result, the maximum brightness of the light emitted from the light emitting diode package 100 is about 210,000. lux, you can see that the minimum brightness is about 175,000 lux. Based on this, it can be seen that the uniformity is about 83.3%.

[0105] Comparing FIG. 9c with FIG. 8c, the reflecting portion 114 and the molding portion 116 are applied. In the case of the light emitting diode package 100, only the light emitting diode chip 112 is used. It can be seen that the uniformity is improved by about 25% or more compared to the case of the conventional method.

[0106] FIG. 10 is a cross-sectional view showing a light emitting diode package according to a second embodiment of the present invention. do.

[0107] In this embodiment, the other configuration of the display device 200 is the same as that of the first embodiment. The only difference is the configuration of the diode package 100, so for this, please refer to FIG. While explaining this embodiment, explanations that overlap with the first embodiment will be omitted. In this embodiment, the light emitting diode package 100 includes a light emitting diode chip 112 , a reflecting portion 114 and a molding portion 116 .

[0108] In this embodiment, the configuration of the light emitting diode chip 112 and the reflector 114 is the same as that of the first embodiment. Since the shape is the same as that of the first mold, the description thereof will be omitted. The molding portion 116 includes a first molding portion 116a and a second molding portion 116b.

[0109] As shown in FIG. 10, the first molding portion 116a has a reflecting portion 114 disposed on the top thereof. The first mold may be disposed so as to cover the entire light emitting diode chip 112. The light-emitting diode chip 112 is connected to the n-type electrode and the p-type electrode. It may be disposed so as to cover the side and top of the light-emitting diode chip 112 excluding the poles.

[0110] The second molding part 116b covers the entire first molding part 116a. The second molding part may be arranged in the same manner as the first molding part 116a. Similarly, the side surface of the first molding part 116a is covered with the light emitting diode chip 112 except for the bottom surface of the first molding part 116a. In this case, the thickness of the second molding part 116b may be The thickness of the first molding portion 116a may be the same as or different from the thickness of the first molding portion 116b. It may be thinner than the thickness of the guiding portion 116a.

[0111] At this time, the first molding part 116a and the second molding part 116b are Each is made of a transparent material so that the light emitted from the light emitting diode chip 112 can pass through. This may be done.

[0112] In this embodiment, the first molding part 116a and the second molding part 116 The refractive index of the light emitted from the light-emitting diode chip 112 may be different from that of the light-emitting diode chip 112. To reduce reflections caused by differences in the medium while the emitted light is emitted to the outside The refractive index of the second molding part 116b arranged on the outside is set to be equal to that of the first molding part 116. The refractive index of the first molding die may be smaller than that of the second molding die. The refractive index of the second molding portion 116a is equal to or greater than the refractive index of the second molding portion 116b. That's fine.

[0113] In addition, the materials of the first molding part 116a and the second molding part 116b are The soft materials used may be different. The difference in soft materials during the manufacturing process may cause external cracks. However, the second molding part 116a may have a stronger material on the outside than the material of the first molding part 116a. By forming the molding portion 116b, the soft material of the first molding portion 116a This can prevent external cracks from occurring due to crack quality.

[0114] FIG. 11 is a cross-sectional view showing a light emitting diode package according to a third embodiment of the present invention. do.

[0115] In this embodiment, the other configuration of the display device 200 is the same as that of the first embodiment. The only difference is the configuration of the diode package 100, so for this, refer to FIG. While explaining this embodiment, explanations that overlap with the first embodiment will be omitted. In this embodiment, the light emitting diode package 100 includes a light emitting diode chip 112 , a reflecting portion 114 , a molding portion 116 and a wavelength converting portion 117 .

[0116] In the configuration of the light emitting diode package 100 according to this embodiment, the light emitting diode chip The configurations of the cap 112, the reflecting portion 114 and the molding portion 116 are the same as those in the first embodiment. Therefore, the explanation for this will be omitted.

[0117] As shown in the figure, the wavelength converting section 117 is disposed so as to cover the entire molding section 116. The wavelength converting portion 117 may be a light emitting diode, similar to the molding portion 116. The chip 112 is arranged to cover the sides and top of the molding part 116 except for the bottom part of the molding part 116. In this case, the thickness of the wavelength converting portion 117 may be the same as that of the molding portion 116. It may be the same or different and may be thinner than the thickness of the molding portion 116 .

[0118] The wavelength converting portion 117 is made of the same material as the molding portion 116. The material may be a transparent material, and one or more kinds of materials may be included inside. The wavelength conversion portion 117 may include a phosphor. The light emitted from 12 can be wavelength converted and light of a different wavelength can be emitted to the outside.

[0119] In this embodiment, the wavelength converting section 117 is disposed outside the molding section 116. By this, the light emitted from the light emitting diode chip 112 is wavelength-converted into light of a different wavelength. This makes it easier to change the color of the light-emitting diode package 100 .

[0120] In this embodiment, between the wavelength conversion portion 117 and the light emitting diode chip 112, The molding part 116 is arranged so that the wavelength conversion part 117 is a light emitting diode. There may be no direct contact with the chip 112. Since the heat generated in the wavelength conversion unit 117 is not directly transmitted to the wavelength conversion unit 117, The deterioration of the phosphor due to the heat generated by the light emitting diode chip 112 is minimized. This can be done.

[0121] FIG. 12 is a cross-sectional view showing a light emitting diode package according to a fourth embodiment of the present invention. do.

[0122] In this embodiment, the other configuration of the display device 200 is the same as that of the first embodiment. The only difference is the configuration of the diode package 100. This will be explained with reference to FIG. In this embodiment, the light emitting diode panel is The package 100 includes a light-emitting diode chip 112, a reflecting portion 114, a molding portion 11 6 and a wavelength conversion section 117.

[0123] The light-emitting diode chip in the light-emitting diode package 100 according to this embodiment The configurations of the reflecting portion 112 and the reflecting portion 114 are the same as those in the first embodiment, so the description thereof will be omitted. Abbreviated.

[0124] As shown in FIG. 12, the wavelength conversion section 117 is a light emitting diode with a reflecting section 114 disposed on the top. The wavelength conversion unit 117 may be disposed so as to cover the entire diode chip 112. The light emitting diode 112 is formed by removing the n-type electrode and the p-type electrode disposed under the diode chip 112. It may be arranged to cover the sides and top of the chip 112 .

[0125] The wavelength conversion unit 117 may contain one or more types of phosphors therein. The conversion unit 117 converts the wavelength of the light emitted from the light emitting diode chip 112 into a different wavelength. It can emit long light to the outside.

[0126] The molding section 116 may be arranged to cover the entire wavelength converting section 117. The molding portion 116 is preferably a portion of the light-emitting diode chip 112, similar to the wavelength shifting portion. It may be arranged to cover the sides and top of the molding part 116 except for the bottom part. In this case, the thickness of the molding portion 116 may be the same as or different from the thickness of the wavelength converting portion 117. It may be thinner than the thickness of the wavelength converting portion 117 .

[0127] The wavelength conversion section 117 contains one or more kinds of phosphors inside, and the molding section 11 It may be made of the same material as 6, or may be made of a different, transparent material. That is, the light emitted from the light emitting diode chip 112 passes through the wavelength conversion unit 117. After being wavelength converted, the light can be emitted to the outside through the molding part 116 .

[0128] In this manner, the wavelength conversion portion 117 is disposed so as to be in contact with the light-emitting diode chip 112. By this, the light emitted from the light emitting diode chip 112 is wavelength-converted into light of a different wavelength. This makes it easier to change the color of the light-emitting diode package 100 .

[0129] The wavelength conversion section 117 is disposed adjacent to the light-emitting diode chip 112. Therefore, the wavelength conversion efficiency of the light emitted from the light emitting diode chip 112 is increased, The light extraction efficiency of the light emitting diode package 100 can be improved.

[0130] FIG. 13 is a cross-sectional view showing a light emitting diode package according to a fifth embodiment of the present invention. do.

[0131] In this embodiment, the other configuration of the display device 200 is the same as that of the first embodiment. The difference lies in the configuration of the diode package 100. This will be explained with reference to FIG. In this embodiment, the light emitting diode package The device 100 includes a light-emitting diode chip 112 , a reflector 114 and a wavelength converting portion 117 .

[0132] In the configuration of the light emitting diode package 100 according to this embodiment, the light emitting diode chip The configurations of the reflector 112 and the reflector 114 are the same as those in the first embodiment, so the explanation thereof will be omitted. Omitted.

[0133] As shown in FIG. 13, the wavelength converter 117 includes a first wavelength converter 117a and a second wavelength converter 117b. The converter 117b is included.

[0134] The first wavelength conversion portion 117a is a light-emitting diode chip 1 on which the reflecting portion 114 is disposed. The first wavelength-converting portion 117a may be disposed so as to cover the entire light-emitting diode 12. The LED chip 112 is formed by removing the n-type electrode and the p-type electrode from the bottom of the chip 112. 12. The inside of the fluorescent lamp may be covered with one or more kinds of fluorescent materials. may include:

[0135] The second wavelength-converting portion 117b may be disposed so as to cover the entire first wavelength-converting portion 117a. The second wavelength-converting portion 117b is a light-emitting diode chip, similar to the first wavelength-converting portion 117a. The first wavelength-converting portion 117a is disposed so as to cover the side and upper portion of the first wavelength-converting portion 117a except for the lower portion of the cap 112. In this case, the thickness of the second wavelength-converting portion 117b may be the same as that of the first wavelength-converting portion 117a. and may be thinner than the thickness of the first wavelength-converter 117a. The second wavelength-converter 117b may contain one or more types of phosphors therein.

[0136] The phosphor contained in the first wavelength-converting portion 117a and the phosphor contained in the second wavelength-converting portion 117b The first wavelength conversion element may be of the same type or may be of different types. When the types of phosphors contained in the first wavelength-converting portion 117a and the second wavelength-converting portion 117b are the same, The amount of phosphor contained in the first wavelength converting part 117a and the second wavelength converting part 117b may be different. Therefore, the light emitted from the light-emitting diode chip 112 passes through the first wavelength-converting portion 117a and the After being wavelength-converted by the second wavelength-converter 117b, the light can be emitted to the outside. By disposing the first wavelength conversion portion 117a and the second wavelength conversion portion 117b, This makes it easier to control the color of the light emitted from the card package 100.

[0137] FIG. 14 is a cross-sectional view showing a light emitting diode package according to a sixth embodiment of the present invention. FIG. 15 shows the light distribution at the center of the light emitting diode package according to the sixth embodiment of the present invention. This is a graph.

[0138] In this embodiment, the other configuration of the display device 200 is the same as that of the first embodiment. The only difference is the configuration of the diode package 100, which will be explained with reference to FIG. Therefore, explanations that overlap with the first embodiment will be omitted.

[0139] In this embodiment, the light emitting diode package 100 includes a light emitting diode chip 11. 2, including a reflecting portion 114 and a molding portion 116. Referring to FIG. 14, this embodiment The light emitting diode package 100 according to this embodiment has the same shape as that of the first embodiment shown in FIG. However, in this embodiment, the reflectance of the reflective portion 114 is 100%. The reflector 114 is a light-emitting diode chip. It may be arranged to cover the entire upper part of 112.

[0140] As a result, the light emitting diode package 100 according to this embodiment has the same structure as that shown in FIG. As shown in FIG. 1, the light distribution at the center of the light emitting diode package 100 can be obtained. The light distribution in the center shown in Figure 5 is an image with an OD of 1 mm. Looking at the rough, you can see that the light distribution in the center is lower than that in the periphery. Therefore, the light emitted from the light emitting diode package 100 is dispersed well in the lateral direction. It can be confirmed that

[0141] Also, considering that the image shown in Figure 15 is an image at OD of 1 mm, When D is smaller than 1 mm, the light emitting diode chip 112 has good lateral dispersion efficiency. A distributed Bragg reflector with a reflectivity of 100% can be used on the top surface of the substrate.

[0142] FIG. 16 is a cross-sectional view showing a light emitting diode package according to a seventh embodiment of the present invention. FIG. 17 shows the light distribution at the center of the light emitting diode package according to the seventh embodiment of the present invention. This is a graph showing the above.

[0143] In this embodiment, the other configuration of the display device 200 is the same as that of the first embodiment. The configuration of the diode package 100 is different. Explanations that overlap with the first embodiment will be omitted.

[0144] In this embodiment, the light emitting diode package 100 includes a light emitting diode chip 11. 2, including a reflecting portion 114 and a molding portion 116. Referring to FIG. 16, this embodiment The light emitting diode package 100 according to this embodiment has the same shape as that of the first embodiment shown in FIG. However, in this embodiment, the reflectance of the reflective portion 114 is 25%. The reflector 114 is a light-emitting diode chip. It may be arranged to cover the entire upper part of 112.

[0145] FIG. 17 shows the light distribution at the center of the light emitting diode package 100 according to this embodiment. 10 shows an image and an illuminance graph at D=1 mm. It can be seen that the light distribution in the center of the card package 100 is higher than that in the periphery. Therefore, the light emitting diode package 100 of this embodiment has an OD greater than 1 mm. It can be used in cases where

[0146] 18a and 18b show a light emitting diode package 10 according to an eighth embodiment of the present invention. 19 is a cross-sectional view and a perspective view showing a light-emitting diode according to an eighth embodiment of the present invention. 1 is a graph showing the light distribution in the center of the card package 100.

[0147] As shown in FIGS. 18a and 18b, the light emitting diode package 1 according to this embodiment 00 includes a light emitting diode chip 112, a reflector 114 and a molding part 116. In this embodiment, the other configurations of the display device 200 are the same as those of the first embodiment. Therefore, the explanation for this will be omitted.

[0148] In this embodiment, the reflecting portion 114 includes a first reflecting portion 114a and a second reflecting portion 114b. The first reflecting portion 114a and the second reflecting portion 114b are, as shown in the figure, light emitting diodes (LEDs). The first reflecting portion 114a is disposed on the same plane as the upper surface of the chip 112. The second reflecting portion 114b is disposed at the center of the diode chip 112, and the first reflecting portion 114a is disposed at the center of the diode chip 112. As a result, as shown in FIG. 18b, the first reflecting portion 114 a may be disposed within the second reflecting portion 114b.

[0149] In this embodiment, referring to FIG. 18a, the width w1 of the first reflecting portion 114a is The width of the first reflecting portion 114b may be about 30% to 45% of the width w2 of the second reflecting portion 114b. The width w1 of the light-emitting diode chip 112 may be located at the center of the upper surface of the first The reflectance of the reflecting portion 114a reflects a part of the light emitted from the light emitting diode chip 112. and allows the remaining light to pass through.

[0150] In this embodiment, the reflectance of the first reflecting portion 114a is different from the reflectance of the second reflecting portion 114b. The reflectance of the first reflecting portion 114a may be smaller than the reflectance of the second reflecting portion 114b. Good too.

[0151] In this embodiment, the light emitting diode package 100 is a backlight of the display device 200. Since it is used as a light unit, it is intended to increase the efficiency of dispersion to the sides. The reflectance of the second reflecting portion 114b is greater than the reflectance of the first reflecting portion 114a. and improve the light output efficiency at the center of the light-emitting diode chip 112. can.

[0152] The simulation results for this are shown in Figure 19. The image shows the distribution of light emitted from the light-emitting diode package 100 according to this embodiment. In the image, the bottom graph is the illuminance graph.

[0153] The simulation results shown in FIG. 19 are the results when the OD is 1 mm, and the first reflecting part The result when the reflectance of the first reflecting portion 114a is 25% and the reflectance of the second reflecting portion 114b is 100%. Through this, as in the present embodiment, the first reflecting portion 114a and the second reflecting portion 114 b, the light emitted from the light-emitting diode package 100 is It can be seen that the air is discharged more uniformly through the top and side portions.

[0154] In this embodiment, the reflectances of the first reflecting portion 114a and the second reflecting portion 114b are set and the simulation is performed. The present invention is not limited to the results of simulation, and may be modified as necessary by the first reflecting portion 114a and the second reflecting portion 114b. The reflectance of the reflective portion 114b may be changed. The first reflecting portion 114a and the second reflecting portion 114b are provided to uniformly reflect the light emitted from the reflecting portion 114a to the outside. The reflectivity of 114b may vary.

[0155] In addition, when the light emitting diode package 100 is disposed on the display device 200, the light emitting diode package 100 is uniformly exposed to the outside. The reflectance of the first reflecting portion 114a and the second reflecting portion 114b is changed so that the light emitted from the first reflecting portion 114a is uniform. The ratio of the widths w1 and w2 of the first and second reflecting portions 114a and 114b may also be may change.

[0156] FIG. 20 is a cross-sectional view showing a light emitting diode package according to a ninth embodiment of the present invention; FIG. 21 is a graph showing the illuminance of the light emitting diode package according to the ninth embodiment of the present invention. is.

[0157] As shown in FIG. 20, the light emitting diode package 100 according to this embodiment is The device includes a diode chip 112, a reflecting portion 114, and a molding portion 116. In this embodiment, the other configurations of the display device 200 are the same as those in the first embodiment. The explanation will be omitted.

[0158] The light emitting diode package 100 according to this embodiment includes a light emitting diode chip 112. A reflector 114 is disposed on the top, and the reflector 114 covers the light-emitting diode chip 112 and the light-emitting diode chip 112. The molding part 116 is arranged as shown in FIG. The chip 112 is covered with a protective film so as to cover the side and top surfaces thereof except for the n-type electrode and p-type electrode arranged at the bottom. will be placed in.

[0159] The molding portion 116 may have a sloped surface (inc) on the side. The side inclined surface (inc) of the molding portion 116 is downward from the upper surface of the molding portion 116. Alternatively, all sides of the molding portion 116 may be formed in a direction inclined at the same angle. In this embodiment, the molding part 116 has a rectangular parallelepiped shape. The four side surfaces of the molding part 116 are downwardly inclined surfaces ( inc), whereby light emitted from the light-emitting diode chip 112 is guided to the inclined surface It can be released to the outside via (inc).

[0160] The graph shown in FIG. 21 shows the case where the side surface of the light emitting diode package 100 is a vertical surface. (ref.), and the side of the light-emitting diode package 100 is a downward inclined surface at a 50-degree angle ( 21 is an illuminance graph showing the case where the side is inclined downward. The light emitted from the light emitting diode package 100 is incident on the surface (inc) of the light emitting diode package 100. It can be seen that the particles are dispersed widely in a uniform manner. Therefore, the illuminance of the light emitted from the light emitting diode package 100 is relatively high. This can be confirmed, and the efficiency of light dispersion in the lateral direction can be improved.

[0161] In this embodiment, the side of the molding part 116 of the light emitting diode package 100 Although the test was conducted with the surface inclination at 50 degrees, the inclination angle of the downward inclined surface (inc) can be adjusted as required. The angle of the inclined surface (inc) of the molding part 116 can be adjusted. This can increase the efficiency of light dispersion in the lateral direction.

[0162] Furthermore, in the light emitting diode package 100 according to this embodiment, light is relatively radiated in the lateral direction. By dispersing the light, the central illuminance of the light emitted from the light-emitting diode package 100 It can be seen that the relative size of the hot spot becomes smaller. This can prevent the occurrence of a crash.

[0163] FIG. 22 is a cross-sectional view showing a light emitting diode package according to a tenth embodiment of the present invention. be.

[0164] Referring to FIG. 22, the light emitting diode package 100 according to this embodiment includes a light emitting diode The electrode chip 112, the reflecting portion 114, and the molding portion 116 are included. In this embodiment, the other configurations of the display device 200 are the same as those in the first embodiment. The explanation will be omitted.

[0165] The light emitting diode package 100 according to this embodiment includes a light emitting diode chip 112. The reflector 114 is disposed on the top, and the side surfaces of the light-emitting diode chip 112 and the reflector 114 are The molding part 116 is arranged so as to surround the reflection part 116. The upper surface of the light-emitting diode chip 112 on which the portion 114 is arranged is not covered, and the light-emitting diode chip The light emitting diode 112 may be disposed so as to surround only the side surfaces of the light emitting diode 112 and the reflecting portion 114. The n-type electrode and p-type electrode disposed under the diode chip 112 may not be covered.

[0166] Thereby, the light emitted from the side of the light-emitting diode chip 112 is guided to the molding. The heat can be released to the outside via the sealing portion 116.

[0167] Here, the reflector 114 reflects all or part of the light emitted from the light emitting diode chip 112. If the reflectivity of the reflective portion 114 is 100%, the light emitting diode The light emitted from the chip 112 is emitted to the outside only through the side surfaces. The light can be emitted to the outside through the molding part 116. If the reflectance is less than 100%, the light emitted upward from the LED chip 112 A part of the light is emitted to the outside through the reflecting portion 114, and the remaining light is reflected by the molded The heat can be released to the outside via the ring portion 116.

[0168] As described above, the molding portion 116 is disposed only on the side surface of the light-emitting diode chip 112. By placing the LED package 100 in the above-described manner, the height of the LED package 100 is increased compared to that of the first embodiment. As a result, in the display device 200 having a relatively small OD, The light emitting diode package 100 according to the embodiment does not use a separate lens and does not have a direct It can replace conventional backlight units.

[0169] As described above, the present invention will be described in detail with reference to the accompanying drawings. However, the above-described embodiment is merely a preferred example of the present invention. Therefore, the present invention should not be understood as being limited to the above-described embodiments. The scope of the rights should be understood in accordance with the claims set forth below and their equivalents. [Explanation of symbols]

[0170] 100 light emitting diode packages 112 Light-emitting diode chip 114 Reflector 114a 1st reflection section 114b 2nd reflection section 116 Molding section 116a First molding section 116b Second molding section 117 Wavelength conversion unit 117a First wavelength conversion unit 117b Second wavelength conversion unit 200 Display device 210 frames 212 Substrate 220 Optics Department 221 Fluorescent Sheet 223 Diffuser 225 Optical Sheet 227 Display Panel 230 Front cover 250 Power supply section inc inclined plane

Claims

1. The frame and a plurality of light sources disposed on the frame; an optical unit disposed on the plurality of light sources and including at least one of a fluorescent sheet and an optical sheet; The light source is A light emitting diode; a reflector disposed on an upper surface of the light-emitting diode; a molding part covering the side and top surfaces of the light emitting diode. the molding part has a thickness from the top surface of the light-emitting diode to the top surface of the molding part that is smaller than a width from the side surface of the light-emitting diode to the side surface of the molding part; The light-emitting module, wherein the reflecting portion is configured to reflect a portion of the light emitted from the light-emitting diode and transmit the remaining light.

2. The light emitting module according to claim 1 , wherein the light source includes an electrode of a first conductivity type and an electrode of a second conductivity type.

3. The light emitting module according to claim 2 , wherein the molding part includes an area that does not cover the first conductive type electrode and the second conductive type electrode.

4. The light-emitting module according to claim 1 , wherein the molding part covers an upper surface and a side surface of the light-emitting diode.

5. The light emitting module according to claim 1 , wherein the molding portion has a side surface with an inclined surface.

Images