Transmissive LCD panels and projectors

Abstract

To provide a transmission type liquid crystal panel that can simplify a replacement process and an incorporation process and can reduce the size of a device in which the panel is mounted.SOLUTION: A transmission type liquid crystal panel comprises: a pixel area in which a plurality of pixels are arranged; a liquid crystal layer that modulates light for each of the plurality of pixels; an incident unit that makes light incident on the liquid crystal layer; an emission unit that emits the light modulated by the liquid crystal layer as image light; and a vapor chamber that has an opening according to the pixel area, a heat receiving unit provided on the periphery of the opening, and a heat radiation unit that radiates the heat received by the heat receiving unit, and vaporizes a liquid coolant sealed therein with the heat received by the heat receiving unit and radiates heat of a gaseous coolant with the heat radiation unit, thereby condensing the gaseous coolant into the liquid coolant.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present disclosure relates to a transmissive liquid crystal panel. and projector Regarding. [Background technology]

[0002] BACKGROUND ART Conventionally, projectors equipped with a cooling device that cools a liquid crystal panel are known (see, for example, Patent Document 1). In the projector described in Patent Document 1, the liquid crystal panel is housed in a frame, which has a flow path for a liquid refrigerant circulated by a cooling device. The frame is a cooling unit that cools the liquid crystal panel by transferring heat transferred from the liquid crystal panel to the liquid refrigerant. The liquid crystal panel and the frame are housed in a first sealed housing, which has a heat exchanger and a blower fan. The liquid refrigerant circulated by the cooling device flows through the heat exchanger, which transfers heat from the gas in the first sealed housing to the liquid refrigerant, thereby cooling the gas in the first sealed housing. The gas in the first sealed housing is circulated within the first sealed housing by the blower fan, cooling the liquid crystal panel. The cooling device includes a pump that pumps a liquid refrigerant, a radiator that cools the liquid refrigerant, and a plurality of pipes that the liquid refrigerant circulates in. Some of the pipes are provided with couplers so that components through which the liquid refrigerant flows can be replaced. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2019-74695 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the projector described in Patent Document 1, a liquid refrigerant flows through the frame housing the liquid crystal panel, and so the frame is provided with piping. With such piping, if the liquid crystal panel needs to be replaced, the liquid crystal panel must be removed while taking measures to prevent the liquid refrigerant from leaking, making the liquid crystal panel replacement process complicated. This also occurs when the liquid crystal panel is installed in the projector. Furthermore, a pump and a tank are required to circulate the liquid coolant that flows through the frame, which results in an increase in the size of the cooling device and, ultimately, the projector. For this reason, there has been a demand for a configuration that can simplify the process of replacing and assembling a liquid crystal panel, and that can reduce the size of the device in which the liquid crystal panel is mounted. [Means for solving the problem]

[0005] A transmissive liquid crystal panel according to a first aspect of the present disclosure includes a pixel region in which a plurality of pixels are arranged, a liquid crystal layer that modulates light for each of the plurality of pixels, an incident portion that allows light to enter the liquid crystal layer, an exit portion that emits the light modulated by the liquid crystal layer as image light, an opening corresponding to the pixel region, a heat receiving portion provided around the opening, and a heat dissipation portion that dissipates heat received by the heat receiving portion, and a vapor chamber that vaporizes a liquid refrigerant sealed inside by the heat received by the heat receiving portion, and condenses the gaseous refrigerant into the liquid refrigerant by dissipating the heat of the gaseous refrigerant in the heat dissipation portion.

[0006] a first opening corresponding to the pixel region, a first heat receiving portion provided around the first opening and connected to at least one of the first dust-proof substrate and the first dust-proof substrate so as to be heat transferable; and a first heat dissipation portion configured to dissipate heat received by the first heat receiving portion. a first vapor chamber that vaporizes a liquid first refrigerant sealed inside by heat received by the first heat receiving portion and condenses the liquid first refrigerant into the gaseous first refrigerant by dissipating the heat of the gaseous first refrigerant by the first heat dissipation portion; a second opening corresponding to the pixel area; a second heat receiving portion provided around the second opening and connected to at least one of the pixel substrate and the second dustproof substrate in a heat-transferable manner; and a second heat dissipation portion that dissipates the heat received by the second heat receiving portion; and a second vapor chamber that vaporizes a liquid second refrigerant sealed inside by heat received by the second heat receiving portion and condenses the liquid second refrigerant into the gaseous second refrigerant by dissipating the heat of the gaseous second refrigerant by the second heat dissipation portion. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of a projector according to a first embodiment. [Figure 2] FIG. 2 is a perspective view showing an image forming unit according to the first embodiment. [Figure 3] FIG. 2 is an exploded perspective view showing a liquid crystal panel and a holding member according to the first embodiment. [Figure 4] FIG. 2 is an exploded perspective view showing a liquid crystal panel and a holding member according to the first embodiment. [Figure 5] FIG. 1 is a cross-sectional view showing a liquid crystal panel according to a first embodiment. [Figure 6] FIG. 2 is a perspective view showing a main body of the exit side cooling member according to the first embodiment. [Figure 7] FIG. 3 is a perspective view showing a first heat dissipation member attached to a main body according to the first embodiment. [Figure 8] FIG. 2 is a schematic diagram showing a cross section of the liquid crystal panel according to the first embodiment. [Figure 9] 5A and 5B are schematic diagrams showing cross sections of deformation of the liquid crystal panel according to the first embodiment. [Figure 10] 5A and 5B are schematic diagrams showing cross sections of deformation of the liquid crystal panel according to the first embodiment. [Figure 11] FIG. 10 is a schematic diagram showing a cross section of a liquid crystal panel included in a projector according to a second embodiment. [Figure 12] 10A and 10B are schematic diagrams showing cross sections of deformation of a liquid crystal panel according to a second embodiment. [Figure 13] 10A and 10B are schematic diagrams showing cross sections of deformation of a liquid crystal panel according to a second embodiment. [Figure 14] FIG. 11 is a schematic diagram showing a cross section of a liquid crystal panel included in a projector according to a third embodiment. [Figure 15] 10A and 10B are schematic diagrams showing cross sections of deformation of a liquid crystal panel according to a third embodiment. [Figure 16] 10A and 10B are schematic diagrams showing cross sections of deformation of a liquid crystal panel according to a third embodiment. [Figure 17] FIG. 10 is a schematic diagram showing a cross section of a liquid crystal panel included in a projector according to a fourth embodiment. [Figure 18] FIG. 10 is a schematic diagram showing a cross section of a deformed liquid crystal panel according to a fourth embodiment. [Figure 19] FIG. 10 is a schematic diagram showing a cross section of a deformed liquid crystal panel according to a fourth embodiment. [Figure 20] FIG. 13 is a schematic diagram showing a cross section of a liquid crystal panel provided in a projector according to a fifth embodiment. [Figure 21] FIG. 13 is a schematic diagram showing a cross section of a deformed liquid crystal panel according to a fifth embodiment. [Figure 22] FIG. 13 is a schematic diagram showing a cross section of a deformed liquid crystal panel according to a fifth embodiment. [Figure 23] FIG. 13 is a schematic diagram showing a cross section of a liquid crystal panel provided in a projector according to a sixth embodiment. [Figure 24] FIG. 13 is a schematic diagram showing a cross section of a deformed liquid crystal panel according to the sixth embodiment. [Figure 25] FIG. 13 is a schematic diagram showing a cross section of a deformed liquid crystal panel according to the sixth embodiment. [Figure 26] FIG. 20 is a schematic diagram showing a cross section of a liquid crystal panel provided in a projector according to a seventh embodiment. [Figure 27] FIG. 13 is a schematic diagram showing a cross section of a deformed liquid crystal panel according to the seventh embodiment. [Figure 28] FIG. 13 is a schematic diagram showing a cross section of a deformed liquid crystal panel according to the seventh embodiment. [Figure 29] FIG. 13 is a schematic diagram showing a cross section of a deformed liquid crystal panel according to the seventh embodiment. [Figure 30] FIG. 13 is a schematic diagram showing a cross section of a deformed liquid crystal panel according to the seventh embodiment. [Figure 31] FIG. 13 is a schematic diagram showing a cross section of a deformed liquid crystal panel according to the seventh embodiment. [Figure 32] FIG. 20 is a schematic diagram showing a cross section of a liquid crystal panel provided in a projector according to a seventh embodiment. [Figure 33] FIG. 13 is a schematic diagram showing a cross section of a deformed liquid crystal panel according to the seventh embodiment. [Figure 34] FIG. 13 is a schematic diagram showing a cross section of a deformed liquid crystal panel according to the seventh embodiment. [Figure 35] FIG. 13 is a schematic diagram showing a cross section of a deformed liquid crystal panel according to the seventh embodiment. [Figure 36] 5A to 5C are schematic diagrams showing cross sections of deformations of liquid crystal panels according to the embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0008] [First embodiment] A first embodiment of the present disclosure will be described below with reference to the drawings. [Projector configuration] FIG. 1 is a schematic diagram showing the configuration of a projector 1 according to this embodiment. A projector 1 according to this embodiment modulates light emitted from a light source to form an image according to image information, and enlarges and projects the formed image onto a projection surface such as a screen. As shown in Fig. 1, the projector 1 includes an exterior housing 2 and an image projection device 3. In addition, although not shown, the projector 1 also includes a cooling device that cools objects to be cooled that make up the projector 1, a power supply device that supplies power to electronic components that make up the projector 1, and a control device that controls the operation of the projector 1.

[0009] [Exterior casing configuration] The exterior housing 2 constitutes the exterior of the projector 1, and houses the image projection device 3, a cooling device, a power supply device, and a control device inside. The exterior housing 2 has a front surface 21, a back surface 22, and a left side surface 23 and a right side surface 24 relative to the front surface 21. Although not shown, the exterior housing 2 has a top surface connecting one end of each of the surface portions 21 to 24, and a bottom surface connecting the other end of each of the surface portions 21 to 24. The exterior housing 2 is formed, for example, in a substantially rectangular parallelepiped shape.

[0010] The right side surface 24 has an air intake port 241. The air intake port 241 introduces air from outside the exterior housing 2 as cooling gas into the interior of the exterior housing 2. The air intake port 241 may be provided with a filter that collects dust contained in the air passing through the air intake port 241. The front surface 21 has a passage opening 211 located approximately in the center of the front surface 21. Light projected from a projection optical device 37, which will be described later, passes through the passage opening 211. The front surface portion 21 has an exhaust port 212 located on the left side surface portion 23 side of the front surface portion 21. The exhaust port 212 exhausts the cooling gas that has cooled the cooling target provided inside the exterior housing 2 to the outside of the exterior housing 2.

[0011] [Configuration of image projection device] The image projection device 3 forms an image according to image information input from the control device and projects the formed image. The image projection device 3 includes a light source 31, a light homogenizing unit 32, a color separation unit 33, a relay unit 34, an image forming unit 35, an optical component housing 36, and a projection optical device 37.

[0012] The light source 31 emits illumination light to the light homogenizing unit 32. The light source 31 may be configured, for example, to include a solid-state light source that emits blue light, which is excitation light, and a wavelength conversion element that converts the wavelength of a portion of the blue light emitted from the solid-state light source into fluorescence containing green light and red light. Note that other configurations of the light source 31 include a configuration that includes a light source lamp such as an ultra-high pressure mercury lamp as a light source, and a configuration that includes a solid-state light source using a semiconductor laser or light-emitting element that individually emits blue light, green light, and red light. The light homogenizing unit 32 homogenizes the light emitted from the light source 31. The homogenized light passes through a color separation unit 33 and a relay unit 34, and illuminates a modulation area of ​​the liquid crystal panel 4A (described later). The light homogenizing unit 32 includes two lens arrays 321 and 322, a polarization conversion element 323, and a superimposing lens 324. The color separation unit 33 separates the light incident from the light uniformization unit 32 into red, green, and blue light. The color separation unit 33 includes two dichroic mirrors 331 and 332, and a reflection mirror 333 that reflects the blue light separated by the dichroic mirror 331.

[0013] The relay unit 34 is provided on the optical path of the red light, which is longer than the optical paths of the other colored lights, to suppress loss of the red light. The relay unit 34 includes an incident-side lens 341, a relay lens 343, and reflecting mirrors 342 and 344. In this embodiment, the relay unit 34 is provided on the optical path of the red light. However, this is not limiting, and for example, the colored light having a longer optical path than the other colored lights may be blue light, and the relay unit 34 may be provided on the optical path of the blue light.

[0014] Image forming section 35 modulates the incident red, green, and blue light and combines the modulated light to form an image. Image forming section 35 includes three field lenses 351 provided according to the incident color light, three incident-side polarizing plates 352, and image forming unit 353A.

[0015] The image forming unit 353A has three liquid crystal panels 4A, three viewing angle compensation plates 354, three exit side polarizing plates 355, and one color combining section 356, which are integrated together.

[0016] The liquid crystal panel 4A modulates the light emitted from the light source 31 based on an image signal input from the control device. Specifically, the liquid crystal panel 4A modulates the light emitted from the incident-side polarizing plate 352 based on the input image signal, and outputs the modulated light as image light. The liquid crystal panel 4A includes a liquid crystal panel 4AR that modulates red light, a liquid crystal panel 4AG that modulates green light, and a liquid crystal panel 4AB that modulates blue light. The liquid crystal panel 4A is a transmissive liquid crystal panel that emits modulated light along the direction of incidence of light onto the liquid crystal panel 4A, and the incident-side polarizing plate 352, the liquid crystal panel 4A, and the exit-side polarizing plate 355 form a liquid crystal light valve. The detailed configuration of the liquid crystal panel 4A will be described later.

[0017] The color combining unit 356 combines the three color lights modulated by the liquid crystal panels 4AB, 4AG, and 4AR. The image light combined by the color combining unit 356 is incident on the projection optical device 37. In this embodiment, the color combining unit 356 is configured by a cross dichroic prism having a substantially rectangular parallelepiped shape. The cross dichroic prism is a prism having a substantially rectangular parallelepiped shape, for example, formed by bonding together four right-angled triangular prisms, and two intersecting dielectric multilayer films are provided at the interfaces between the four prisms.

[0018] FIG. 2 is a perspective view showing the image forming unit 353A. 2, the color combining unit 356 faces the liquid crystal panels 4AR, 4AG, and 4AB, and has three incident surfaces 356R, 356G, and 356B onto which the colored light beams passing through the liquid crystal panels 4AR, 4AG, and 4AB are incident, and one exit surface 356S. Of the three colored light beams incident on the incident surfaces 356R, 356G, and 356B, the blue and red light beams are reflected by the two dielectric multilayer films toward the projection optical device 37, and the green light beam passes through the two dielectric multilayer films toward the projection optical device 37. This combines the three colored light beams. The combined image light is emitted from the exit surface 356S toward the projection optical device 37.

[0019] In addition to the above-described configuration, the image forming unit 353A has three holding members 357 as shown in FIG. Each of the three holding members 357 holds the liquid crystal panel 4A and an output-side polarizing plate 355 (described later), and is fixed to a corresponding one of the input surfaces 356R, 356G, and 356B.

[0020] FIG. 3 is an exploded perspective view of the liquid crystal panel 4A and the holding member 357 as viewed from the light incident side of the liquid crystal panel 4A, and FIG. 4 is an exploded perspective view of the liquid crystal panel 4A and the holding member 357 as viewed from the light exit side of the liquid crystal panel 4A. As shown in FIGS. 3 and 4, the holding member 357 has an attachment portion 358 and four protrusion insertion portions 359. The mounting portion 358 is formed in a rectangular frame shape and is attached to the corresponding incident surface by adhesive, etc. The mounting portion 358 has an opening 3581 and a holding portion 3582. Opening 3581 is formed in a rectangular shape at approximately the center of mounting portion 358. Light that has passed through exit-side polarizing plate 355 passes through opening 3581 toward color combining portion 356. The holder 3582 holds the exit-side polarizing plate 355 .

[0021] The four insertion portions 359 protrude toward the liquid crystal panel 4A from portions corresponding to the four corners of the mounting portion 358. After being inserted into the position adjustment portions 503 of the liquid crystal panel 4A, the four insertion portions 359 are adhered and fixed to the liquid crystal panel 4A with an adhesive such as an ultraviolet curing adhesive. The liquid crystal panel 4A is integrated with the color combining section 356 by such a holding member 357. However, the color combining section 356 is not limited to a substantially rectangular parallelepiped cross dichroic prism, and may be configured by, for example, a plurality of dichroic mirrors.

[0022] 1, the optical component housing 36 accommodates the above-described components 32 to 34 and the field lens 351. The image projection device 3 is provided with an illumination optical axis Ax, which is a design optical axis, and the optical component housing 36 holds the components 32 to 34 and the field lens 351 at predetermined positions on the illumination optical axis Ax. The light source 31, the image forming unit 353A, and the projection optical device 37 are arranged at predetermined positions on the illumination optical axis Ax.

[0023] The projection optical device 37 is a projection lens that enlarges and projects an image incident from the image forming unit 35 onto a projection surface. That is, the projection optical device 37 projects image light modulated by the liquid crystal panel 4A. An example of the projection optical device 37 is a lens assembly having a plurality of lenses and a cylindrical lens barrel that houses the plurality of lenses inside.

[0024] [LCD panel configuration] As described above, the liquid crystal panel 4A is a transmissive liquid crystal panel that modulates light incident from the incident-side polarizing plate 352, and is arranged by the holding member 357 at a position corresponding to each incident surface of the color combining unit 356. As shown in FIGS. 3 and 4, the liquid crystal panel 4A has a panel main body 41, wiring 49 formed of a flat cable, a holding housing 50, and an output-side cooling member 6A. In the following description, three mutually orthogonal directions are referred to as the +X direction, the +Y direction, and the +Z direction. In this embodiment, the +Z direction is the traveling direction of light incident on the liquid crystal panel 4A. The right direction when viewing the liquid crystal panel 4A along the +Z direction so that the +Y direction coincides with the upward direction is referred to as the +X direction. Although not shown in the figures, the direction opposite the +X direction is referred to as the -X direction, the direction opposite the +Y direction is referred to as the -Y direction, and the direction opposite the +Z direction is referred to as the -Z direction. In other words, the +Z direction with respect to the liquid crystal panel 4A is the light exit side with respect to the liquid crystal panel 4A, and the -Z direction with respect to the liquid crystal panel 4A is the light entrance side with respect to the liquid crystal panel 4A.

[0025] [Panel body configuration] FIG. 5 is a cross-sectional view showing the liquid crystal panel 4A. The panel main body 41 modulates incident light. The panel main body 41 has a pixel region 41A in which a plurality of pixels are arranged. The pixel region 41A is a region in the liquid crystal panel 4A in which a plurality of pixels are arranged and which modulates incident light based on an input image signal, and each of the plurality of pixels can individually modulate light. 5, the panel body 41 has a liquid crystal layer 42, an incident portion 43, and an exit portion 46. That is, the liquid crystal panel 4A is a transmissive liquid crystal panel having a pixel region 41A.

[0026] [Liquid crystal layer configuration] The liquid crystal layer 42 is formed by liquid crystal sealed between the incident portion 43 and the exit portion 46. More specifically, the liquid crystal layer 42 is formed by liquid crystal sealed between the counter substrate 44 that constitutes the incident portion 43 and the pixel substrate 47 that constitutes the exit portion 46. The liquid crystal layer 42 modulates the light incident through the incident portion 43 in accordance with an input image signal. That is, the liquid crystal layer 42 is a modulation portion that modulates the incident light in the pixel region 41A, and constitutes a main portion of the pixel region 41A. Heat is generated when light is incident on the liquid crystal layer 42. The heat generated in the liquid crystal layer 42 is transferred to the incident portion 43 and the exit portion 46 that sandwich the liquid crystal layer 42.

[0027] [Configuration of the entrance section] The incident section 43 is provided on the light incident side of the liquid crystal layer 42, and transmits light incident on the liquid crystal layer 42, thereby allowing the light to be incident on the liquid crystal layer 42. The incident section 43 includes an opposing substrate 44 that sandwiches the liquid crystal layer 42 together with the pixel substrate 47, and an incident-side dustproof substrate 45 provided on the opposing substrate 44.

[0028] [Configuration of the opposing substrate] The counter substrate 44 is disposed on the light incident side of the liquid crystal layer 42 and is a light-transmitting incident-side electrode substrate connected to the liquid crystal layer 42 in a heat-transferable manner. Although not shown, the counter substrate 44 includes a counter electrode serving as a common electrode electrically connected to the liquid crystal layer 42 and a support substrate that supports the counter electrode. The counter electrode corresponds to an incident-side electrode and constitutes the pixel region 41A. When viewed along the traveling direction of light incident on the pixel region 41A, the area of ​​the counter substrate 44 is larger than the area of ​​the pixel region 41A. In other words, when viewed from the -Z direction, the area of ​​the counter substrate 44 is larger than the area of ​​the pixel region 41A. The counter substrate 44 has a light incident surface 441, which is the surface on the light incident side, where light enters, and a light emitting surface 442, which is the surface on the light emitting side, where light that has passed through the counter substrate 44 is emitted. The heat generated in the liquid crystal layer 42 is transferred to the opposing substrate 44 .

[0029] [Configuration of dustproof substrate on the entrance side] The incident-side dustproof substrate 45 is a light-transmitting substrate provided in a portion corresponding to the pixel region 41A on the light incident surface 441 of the counter substrate 44. That is, when the liquid crystal panel 4A is viewed from the -Z direction, the incident-side dustproof substrate 45 is provided on the light incident surface 441 in a heat-transferable manner so as to cover the pixel region 41A. The incident-side dustproof substrate 45 prevents dust and other particles from adhering to an area of ​​the light incident surface 441 corresponding to the pixel region 41A and causing the shadow of the dust and other particles to appear in the image light. When viewed along the traveling direction of light incident on the pixel region 41A, the area of ​​the incident-side dustproof substrate 45 is larger than the area of ​​the pixel region 41A. More specifically, when viewed from the -Z direction, the area of ​​the incident-side dustproof substrate 45 is larger than the area of ​​the pixel region 41A and smaller than the area of ​​the counter substrate 44.

[0030] The incident-side dustproof substrate 45 has a light incident surface 451, a light emitting surface 452, and side surfaces 453, and is formed in a substantially rectangular parallelepiped shape. The light incident surface 451 is the surface of the incident-side dustproof substrate 45 on the light incident side, and is the surface onto which the light emitted from the incident-side polarizing plate 352 is incident. The light exit surface 452 is the light exit side surface of the incident-side dustproof substrate 45, and is the surface from which light that passes through the incident-side dustproof substrate 45 is emitted. The light exit surface 452 is connected to the light incident surface 441 of the counter substrate 44. The side surface 453 is a surface that connects the light incident surface 451 and the light exit surface 452 . Heat from the liquid crystal layer 42 is transferred to the incident-side dustproof substrate 45 via the counter substrate 44. That is, the incident-side dustproof substrate 45 is connected to the liquid crystal layer 42 via the counter substrate 44 so as to be able to transfer heat.

[0031] [Configuration of the output section] The exit unit 46 is provided on the light exit side of the liquid crystal layer 42, and emits light modulated by the liquid crystal layer 42 as image light. The exit unit 46 includes a pixel substrate 47 that sandwiches the liquid crystal layer 42 together with the counter substrate 44, and an exit-side dustproof substrate 48 provided on the pixel substrate 47.

[0032] [Pixel substrate configuration] The pixel substrate 47 is a light-transmitting, output-side electrode substrate disposed on the light-emitting side of the liquid crystal layer 42 and connected to the liquid crystal layer 42 in a heat-transferable manner. Although not shown, the pixel substrate 47 includes a plurality of switching elements such as thin film transistors (TFTs), a plurality of pixel electrodes electrically connected to the liquid crystal layer 42, and a support substrate supporting the switching elements and the pixel electrodes. The pixel electrodes correspond to output-side electrodes and constitute the pixel region 41A. More specifically, each of the pixel electrodes is provided corresponding to a plurality of pixels arranged in the pixel region 41A and is electrically connected to a plurality of switching elements and portions of the liquid crystal layer 42 corresponding to the pixels. In other words, the pixel electrodes define the pixels arranged in the pixel region 41A. When viewed from the direction of emission of image light from the pixel substrate 47, the area of ​​the pixel substrate 47 is larger than the area of ​​the pixel region 41A. The pixel substrate 47 has a light incident surface 471, which is the light incident side surface, onto which light modulated by the liquid crystal layer 42 enters, and a light exit surface 472, which is arranged on the light exit side, from which light that has passed through the pixel substrate 47 exits. The heat generated in the liquid crystal layer 42 is transferred to the pixel substrate 47 .

[0033] [Configuration of the dustproof substrate on the output side] The output-side dustproof substrate 48 is a light-transmitting substrate provided in a portion corresponding to the pixel region 41A on the light output surface 472 of the pixel substrate 47. That is, when the liquid crystal panel 4A is viewed from the light output side, the output-side dustproof substrate 48 is provided on the light incident surface 471 in a heat-transferable manner so as to cover the pixel region 41A. The exit-side dustproof substrate 48 prevents dust and other particles from directly adhering to the pixel substrate 47 and casting a shadow of the dust and other particles on the image light. When viewed from the emission direction of the image light emitted from the liquid crystal layer 42, the area of ​​the exit-side dustproof substrate 48 is larger than the area of ​​the pixel region 41A. More specifically, when viewed from the +Z direction, the area of ​​the exit-side dustproof substrate 48 is larger than the area of ​​the pixel region 41A and smaller than the area of ​​the pixel substrate 47.

[0034] The emission-side dustproof substrate 48 has a light incident surface 481, a light emitting surface 482, and a side surface 483, and is formed in a substantially rectangular parallelepiped shape. The light incident surface 481 is the light incident side surface of the output-side dustproof substrate 48, and is connected to the light output surface 472 of the pixel substrate 47 so that light output from the light output surface 472 is incident thereon. The light exit surface 482 is the surface of the exit-side dustproof substrate 48 on the light exit side, and is the surface from which light that has passed through the exit-side dustproof substrate 48 is emitted. Side surface 483 is a surface that connects light incident surface 481 and light exit surface 482. Heat from the liquid crystal layer 42 is transferred to the output-side dustproof substrate 48 via the pixel substrate 47. That is, the output-side dustproof substrate 48 is connected to the liquid crystal layer 42 via the pixel substrate 47 so as to be capable of transferring heat.

[0035] Wiring Configuration The wiring 49 applies a voltage corresponding to an image signal to regions of the liquid crystal layer 42 corresponding to the pixels, between the plurality of pixel electrodes provided on the pixel substrate 47 and the counter electrode of the counter substrate 44. In other words, the wiring 49 supplies the image signal that drives the liquid crystal layer 42. The wiring 49 is electrically connected to the pixel substrate 47. More specifically, the wiring 49 extends in the +Y direction from each of the counter substrate 44 and the pixel substrate 47, and is connected to a control device (not shown). In this embodiment, the wiring 49 is configured by an FPC (Flexible Printed Circuits). A driver circuit 491 that controls the operation of the panel body 41 in response to an image signal input from the control device is provided on the +Z direction surface of the wiring 49. The driver circuit 491 is thermally connected to the first member 62 of the output-side cooling member 6A.

[0036] [Configuration of the holding housing] The holding housing 50 covers the panel main body 41, the opposing substrate 44, and part of the wiring 49 in the -Z direction. The holding housing 50 holds the panel main body 41 therein by being combined with the output-side cooling member 6A. That is, the holding housing 50 is separate from the output-side cooling member 6A, which will be described later. The holding housing 50 has an opening 501 and heat dissipation fins 502 as shown in FIG. 3, and also has four position adjustment units 503 as shown in FIGS. 3 and 4.

[0037] 3, the opening 501 is provided in a substantially rectangular shape corresponding to the pixel region 41A when viewed from the -Z direction. The opening 501 allows light emitted from the incident-side polarizing plate 352 to pass through and enter the incident-side dustproof substrate 45. A plurality of heat dissipation fins 502 are provided so as to protrude in the −Z direction from a portion in the +Y direction with respect to opening 501. Heat dissipation fins 502 dissipate heat transferred from incident portion 43 to holding housing 50. 3 and 4, the four position adjustment units 503 are provided at the four corners of the holding housing 50 when viewed from the -Z direction. Each position adjustment unit 503 is a hole into which a corresponding insertion unit 359 is inserted from the +Z direction. The position of the holding housing 50 with respect to the incident surface of the color combining unit 356 to which the holding member 357 is attached, and therefore the position of the liquid crystal panel 4A, is adjusted depending on the amount of insertion of the insertion unit 359 into each position adjustment unit 503. After the position of the liquid crystal panel 4A is adjusted, the insertion units 359 and the position adjustment units 503 are fixed with an adhesive as described above.

[0038] [Configuration of the output side cooling member] The output-side cooling member 6A is disposed on the opposite side of the pixel substrate 47 from the counter substrate 44, and is thermally connected to the pixel substrate 47. As shown in Fig. 5, the output-side cooling member 6A has a hollow enclosed space SP filled with a refrigerant, and consumes the heat transferred from the heat-generating element by vaporizing the liquid refrigerant using the heat transferred from the heat-generating element, thereby cooling the heat-generating element. In this embodiment, the exit-side cooling member 6A cools the liquid crystal layer 42 by vaporizing the liquid refrigerant into a gaseous refrigerant using heat from the liquid crystal layer 42 transmitted via the pixel substrate 47 and the exit-side dustproof substrate 48. That is, the exit-side cooling member 6A cools the liquid crystal layer 42 by vaporizing the liquid refrigerant. The output side cooling member 6A has a main body portion 61A and a first heat dissipation member 68.

[0039] [Main body configuration] Fig. 6 is a perspective view showing the main body 61A. More specifically, Fig. 6 is a perspective view of the main body 61A as seen from the second member 63 side. As shown in FIG. 6, the main body 61A has a first member 62 and a second member 63, and is configured by combining the first member 62 and the second member 63. In this embodiment, the main body 61A is a vapor chamber, and an enclosed space SP (see FIG. 5) is formed inside the main body 61A by combining the first member 62 and the second member 63. A refrigerant is enclosed in the enclosed space SP. When viewed from the emission side (+Z direction) of light emitted from the liquid crystal layer 42, the main body 61A extends outward beyond the pixel substrate 47 and the emission-side dustproof substrate 48.

[0040] The first member 62 is a substrate formed in a flat plate shape, and can also be called a first substrate. The first member 62 is a connection portion of the main body 61A that is connected to the heat generating element, and is configured to be able to come into contact with the liquid refrigerant sealed in the enclosed space SP. The portion of the first member 62 to which heat is transferred from the outside changes the liquid refrigerant in the enclosed space SP into a gaseous refrigerant. In other words, the first member 62 vaporizes the liquid refrigerant using the transferred heat. A first surface 62A of the first member 62 opposite the second member 63 is the surface that comes into contact with the heat generating element. In this embodiment, the first surface 62A is a flat surface. The first member 62 has a heat receiving portion 621 that receives heat from a heat generating element. That is, the main body portion 61A, which is the vapor chamber according to this embodiment, has the heat receiving portion 621. The heat receiving portion 621 will be described in detail later.

[0041] The second member 63 is a substrate formed in a flat plate shape and can also be called a second substrate. The second member 63 is joined to the first member 62 and forms the enclosed space SP together with the first member 62. The second member 63 is configured to be able to come into contact with the gaseous refrigerant in the enclosed space SP. The second member 63 has a second surface 63A and a first heat dissipation portion 631. The second surface 63A is the surface of the second member 63 on the opposite side to the first member 62. First heat dissipation section 631 receives heat from the gaseous refrigerant in enclosed space SP, condenses the gaseous refrigerant into liquid refrigerant, and dissipates the received heat to the outside. In other words, first heat dissipation section 631 can also be called a first condensation section. The position of first heat dissipation section 631 will be described in detail later. The second member 63 is disposed on the liquid crystal panel 4A on the opposite side of the first member 62 from the liquid crystal layer .

[0042] The main body portion 61A has an opening 64. The opening 64 is a substantially rectangular opening provided in the main body 61A in accordance with the pixel region 41A. The opening 64 penetrates the main body 61A along the direction in which the first member 62 and the second member 63 face each other (the +Z direction), and light passing through the liquid crystal panel 4A passes through the opening 64. In other words, the opening 64 is a through-hole having an inner circumferential surface. The inner circumferential surface of the opening 64 is formed by the joint between the first member 62 and the second member 63. Therefore, the heat transferred to the inner edge of the opening 64 is transferred to the first member 62. The main body 61A extends in the +Y direction from the opening 64. More specifically, the main body 61A extends from the opening 64 in the extension direction (+Y direction) of the wiring 49 from the pixel substrate 47 connected to the liquid crystal layer 42. In other words, the main body 61A extends from the opening 64 in the extension direction (+Y direction) of the wiring 49 from the liquid crystal layer 42.

[0043] [Configuration of the heat receiving section] The heat receiving portion 621 is a portion of the main body 61A that receives heat from the heat generating element. For this reason, in this embodiment, a part of the heat receiving portion 621 is provided around the opening 64 in the first member 62. In this embodiment, the main body 61A is provided so that the first member 62 is in contact with the pixel substrate 47 and the output-side dustproof substrate 48, and therefore the heat receiving portion 621 is a portion around the opening 64 and a portion of the first member 62 that is in contact with the pixel substrate 47 and the output-side dustproof substrate 48. In other words, the main body 61A has the heat receiving portion 621 that is provided around the opening 64 in the first member 62 and receives heat from the light output surface 472 of the pixel substrate 47, which is a heat generating element, and the side surface 483 of the output-side dustproof substrate 48, which is also a heat generating element. Although not shown in the drawings, the portion of the inner surface of the enclosed space SP that corresponds to the heat receiving portion 621 can be said to be an evaporation portion that evaporates the liquid refrigerant by the heat received by the heat receiving portion 621. In more detail, among the portions of the inner surface of the enclosed space SP that come into contact with the liquid refrigerant, the portion to which the heat received by the heat receiving portion 621 is transferred and that evaporates the liquid refrigerant is the evaporation portion.

[0044] [Configuration of the first heat dissipation section] The first heat dissipation portion 631 is a portion that dissipates heat from the gaseous refrigerant flowing in the enclosed space SP in the main body portion 61A. Although not shown in the figures, the portion of the inner surface of the enclosed space SP that corresponds to first heat dissipation portion 631 can be referred to as a first condensation portion that receives heat from the gaseous refrigerant and condenses the gaseous refrigerant into liquid refrigerant. More specifically, the first condensation portion is the portion of the inner surface of the enclosed space SP that comes into contact with the gaseous refrigerant and receives heat from the gaseous refrigerant and condenses the gaseous refrigerant into liquid refrigerant. The heat received from the gaseous refrigerant by this first condensation portion is dissipated by first heat dissipation portion 631. The first heat dissipation section 631 is provided in the extension direction of the wiring 49 from the liquid crystal layer 42 relative to the opening 64. A first heat dissipation member 68 (see FIG. 5) is provided on the second surface 63A at a position corresponding to the first heat dissipation section 631. By providing the first heat dissipation member 68 on the first heat dissipation section 631, the first heat dissipation section 631 becomes a part that easily dissipates heat received from the gaseous refrigerant in the second member 63 to the outside of the main body section 61A. Therefore, the part of the output-side cooling member 6A where the first heat dissipation member 68 is provided is configured as the first heat dissipation section 631.

[0045] [Configuration of first heat dissipation member] FIG. 7 is a perspective view showing the first heat dissipation member 68 attached to the main body 61A. The first heat dissipation member 68 dissipates the heat transferred from the first heat dissipation section 631. The first heat dissipation member 68 has a plurality of fins 681, as shown in FIG. Each of the fins 681 is formed in a rectangular cylindrical shape and is arranged side by side in the +X direction. Each of the fins 681 has a flow path therein through which cooling gas can flow along the +Y direction. A portion of the cooling gas flowing through the liquid crystal panel 4A flows in the +Y direction along the second surface 63A, and flows along the flow path provided inside each fin 681. Heat is transferred from each fin 681 to the cooling gas flowing through the flow path. The fins 681 may have other shapes. For example, the fins 681 may be pins that protrude on the side opposite to the first member 62. In this case, the shape of the pins may be one of a cylindrical shape, a prismatic shape, a truncated cone shape, and a truncated pyramid shape.

[0046] [Arrangement of the output side cooling member relative to the panel body] FIG. 8 is a diagram schematically showing a cross section of the liquid crystal panel 4A along the YZ plane. 8, the output-side cooling member 6A is provided on the light output side of the liquid crystal layer 42. Specifically, the output-side cooling member 6A is provided on the light output surface 472 of the pixel substrate 47. That is, the first surface 62A of the first member 62 is connected to the light output surface 472 of the pixel substrate 47 so as to be capable of transferring heat. In this embodiment, the pixel substrate 47 corresponds to the output-side substrate. The output-side dustproof substrate 48 is disposed within the opening 64. A side surface 483 of the output-side dustproof substrate 48 is connected to the inner peripheral surface of the opening 64 via a thermally conductive adhesive in a heat-transferable manner. That is, the inner peripheral surface of the opening 64 is part of the heat-receiving portion 621.

[0047] [Transmission path of heat generated in the liquid crystal layer] Of the heat generated in the liquid crystal layer 42, a portion of the heat is transferred to the counter substrate 44, and the other portion is transferred to the pixel substrate 47. The heat transferred to the counter substrate 44 is transferred to the incident-side dustproof substrate 45 and the holding housing 50 and dissipated. Of the heat transferred to the pixel substrate 47, some of the heat is transferred to the heat receiving portion 621, and the other part of the heat is transferred to the heat receiving portion 621 via the output-side dustproof substrate 48. More specifically, in the output-side cooling member 6A shown in Fig. 8, the heat transferred from the liquid crystal layer 42 to the pixel substrate 47 is transferred to the heat receiving portion 621 in contact with the light output surface 472 of the pixel substrate 47. On the other hand, the heat transferred to the output-side dustproof substrate 48 is transferred to the inner circumferential surface of the opening 64 that is connected to the side surface 483 of the output-side dustproof substrate 48 in a heat-transferable manner. The first member 62 having the heat-receiving portion 621 consumes the heat of the liquid crystal layer 42 transferred to the first member 62 by vaporizing the liquid refrigerant in the sealed space SP using the transferred heat of the liquid crystal layer 42. This cools the pixel substrate 47 and the output-side dustproof substrate 48, and ultimately the liquid crystal layer 42. The gaseous refrigerant that has circulated through the enclosed space SP and reached the first condenser section is condensed into a liquid refrigerant in the first condenser section. The heat received from the gaseous refrigerant in the first condenser section is transferred from the first heat dissipation section 631 to the first heat dissipation member 68, and is dissipated by the first heat dissipation member 68.

[0048] [Flow of cooling gas circulating around the LCD panel] Cooling gas circulated by a fan of a cooling device disposed in exterior housing 2 flows in the +Y direction relative to liquid crystal panel 4A. Specifically, the cooling gas flowing through liquid crystal panel 4A is divided at the end of liquid crystal panel 4A in the -Y direction into cooling gas flowing through a space on the light incident side relative to liquid crystal panel 4A and cooling gas flowing through a space on the light exit side relative to liquid crystal panel 4A.

[0049] The cooling gas flowing through the space on the light incident side relative to the liquid crystal panel 4A flows in the +Y direction, sequentially cooling the incident-side dustproof substrate 45 and the holding housing 50. That is, the heat of the liquid crystal layer 42 transferred to the incident-side dustproof substrate 45 and the holding housing 50 is transferred to the cooling gas. Note that some of the heat from electronic components such as the driver circuit 491 provided on the wiring 49 is transferred to the holding housing 50. Since the cooling gas flowing through the space on the light incident side relative to the liquid crystal panel 4A flows through the heat dissipation fins 502 of the holding housing 50, some of the heat from the electronic components is transferred to the cooling gas by the heat dissipation fins 502. This also cools the electronic components.

[0050] The cooling gas flowing through the space on the light-emitting side of the liquid crystal panel 4A flows in the +Y direction, sequentially cooling the emission-side dustproof substrate 48 and the first heat-dissipating member 68. That is, the heat of the liquid crystal layer 42 transferred to the emission-side dustproof substrate 48 and the first heat-dissipating member 68 is transferred to the cooling gas. In this manner, cooling gas flows through the entrance-side dustproof substrate 45, the holding housing 50, the exit-side dustproof substrate 48, and the first heat dissipation member 68, to which the heat of the liquid crystal layer 42 is transferred, thereby transferring the heat of the liquid crystal layer 42 to the cooling gas, and ultimately cooling the liquid crystal layer 42. In this embodiment, the driver circuit 491 is thermally connected to the first member 62 of the exit-side cooling member 6A, and therefore part of the heat of the driver circuit 491 is transferred to the first member 62, and then transferred to the first heat dissipation member 68 by the first heat dissipation section 631 of the second member 63, and then transferred to the cooling gas flowing through the first heat dissipation member 68. This cools the driver circuit 491.

[0051] Here, in the liquid crystal panel 4A, the first heat dissipation section 631 is provided in the +Y direction from the connection portion of the first member 62 with the pixel substrate 47 and the connection portion with the output-side dustproof substrate 48. In other words, the first heat dissipation section 631 is provided in the +Y direction with respect to the opening 64. Therefore, the first condensation section that condenses the gaseous refrigerant into liquid refrigerant is provided in the +Y direction with respect to the opening 64. Therefore, when the liquid crystal panel 4A is positioned so that the +Y direction is vertically upward, the heat received by the heat receiving portion 621 is transferred by not only capillary force but also gravity to transport the liquid refrigerant condensed in the first condenser portion to the vaporizer portion that vaporizes the liquid refrigerant. This allows the heat transferred from the liquid crystal layer 42 via the pixel substrate 47 and the output-side dustproof substrate 48 to promote the change of the refrigerant from liquid to gas in the vaporizer portion. This means that the heat dissipation efficiency of the liquid crystal layer 42, and therefore the cooling efficiency of the liquid crystal layer 42, can be improved.

[0052] [Effects of the first embodiment] The projector 1 according to the present embodiment described above has the following advantages. The projector 1 includes a liquid crystal panel 4A as a light modulation device that modulates light emitted from a light source. The liquid crystal panel 4A is a transmissive liquid crystal panel that emits modulated light along the traveling direction of the light incident on the liquid crystal panel. The liquid crystal panel 4A includes a pixel region 41A, a liquid crystal layer 42, an incident portion 43, an exit portion 46, and a main body portion 61A. A plurality of pixels are arranged in the pixel region 41A. The liquid crystal layer 42 modulates light for each of the plurality of pixels. The incident portion 43 causes light to enter the liquid crystal layer 42. The exit portion 46 emits the light modulated by the liquid crystal layer 42 as image light. The main body portion 61A is a vapor chamber constituting the exit-side cooling member 6A. The main body portion 61A has an opening 64, a heat receiving portion 621, and a first heat dissipation portion 631. The opening 64 is provided in the main body portion 61A in accordance with the pixel region 41A. The heat receiving portion 621 is provided around the opening 64. The first heat dissipation portion 631 corresponds to a heat dissipation portion and dissipates heat received by the heat receiving portion 621. The main body 61A vaporizes the liquid refrigerant sealed inside the enclosed space SP provided inside the main body 61A by the heat received by the heat receiving section 621, and condenses the gaseous refrigerant into liquid refrigerant by dissipating the heat of the gaseous refrigerant at the first heat dissipation section 631.

[0053] Here, the vapor chamber does not require piping for circulating a refrigerant or wiring for supplying drive power. This configuration simplifies the configuration of the liquid crystal panel 4A compared to cases where a cooling device for circulating a refrigerant is provided or cases where a thermoelectric conversion element such as a Peltier element that transfers heat using electric power is provided. Therefore, the projector 1 as a device equipped with the liquid crystal panel 4A can be made more compact. Furthermore, since the liquid crystal panel 4A can be attached and detached from the projector 1 without attaching and detaching piping and wiring, replacement of the liquid crystal panel 4A can be easily performed. Furthermore, since the heat receiving portion 621 provided around the opening 64 corresponding to the pixel region 41A receives heat, the temperature uniformity in the pixel region 41A can be improved.

[0054] In the liquid crystal panel 4A, the emission section 46 has a pixel substrate 47 that is connected to the liquid crystal layer 42 in a heat-transferable manner and through which image light passes. The pixel substrate 47 is a light-transmitting emission-side substrate, and the area of ​​the pixel substrate 47 is larger than the area of ​​the pixel region 41A when viewed from the emission direction of the image light emitted from the liquid crystal layer 42. The main body section 61A, which is a vapor chamber, is provided on the pixel substrate 47 in a heat-transferable manner. According to this configuration, the main body 61A is provided in a heat-transferable manner on the pixel substrate 47 which is connected to the liquid crystal layer 42 in a heat-transferable manner, so that the heat-receiving portion 821 can easily receive heat from the liquid crystal layer 42 via the pixel substrate 47. Therefore, the liquid crystal layer 42 can be easily cooled.

[0055] In the liquid crystal panel 4A, the emission section 46 has a pixel substrate 47. The pixel substrate 47 has an emission-side electrode electrically connected to the liquid crystal layer 42. The pixel substrate 47 is a light-transmitting emission-side electrode substrate that is disposed on the light emission side of the liquid crystal layer 42. The pixel substrate 47 is the emission-side substrate on which the main body 61A of the emission-side cooling member 6A is provided. According to this configuration, the pixel substrate 47 is a light-transmitting substrate directly connected to the liquid crystal layer 42, which is susceptible to heat, and therefore, by connecting the heat-receiving portion 621 to the pixel substrate 47, heat generated in the liquid crystal layer 42 can be efficiently transferred to the heat-receiving portion 621. Therefore, the cooling efficiency of the liquid crystal layer 42 can be improved.

[0056] In the liquid crystal panel 4A, the emission section 46 includes an emission-side dustproof substrate 48 provided on a light emission surface 472 of the pixel substrate 47. The light emission surface 472 corresponds to the light emission side surface of the pixel substrate 47. The emission-side dustproof substrate 48 has a light incident surface 481, a light emission surface 482, and a side surface 483. The side surface 483 connects the light incident surface 481 and the light emission surface 482. The light incident surface 481 corresponds to the light incident side surface of the emission-side dustproof substrate 48, and the light emission surface 482 corresponds to the light emission side surface of the emission-side dustproof substrate 48. The heat receiving section 621 receives heat from the light emission surface 472 of the pixel substrate 47 and the side surface 483 of the emission-side dustproof substrate 48. According to this configuration, the heat receiving portion 621 is connected to both the pixel substrate 47 and the output-side dustproof substrate 48, and therefore the heat of the liquid crystal layer 42 can be transferred to the heat receiving portion 621 via both the pixel substrate 47 and the output-side dustproof substrate 48. Therefore, the heat of the liquid crystal layer 42 can be efficiently transferred to the heat receiving portion 621, and the cooling efficiency of the liquid crystal layer 42 can be improved.

[0057] In the liquid crystal panel 4A, the pixel substrate 47 has, as emission-side electrodes, a plurality of pixel electrodes provided corresponding to the plurality of pixels. The pixel substrate 47 is an emission-side electrode substrate disposed on the light emission side of the liquid crystal layer 42. In a typical transmissive liquid crystal panel, an opposing substrate is disposed on the light incident side of the liquid crystal layer, and a pixel substrate is disposed on the light exit side of the liquid crystal layer. Therefore, by using the pixel substrate 47 as the output-side electrode substrate, the liquid crystal panel 4A that can achieve the above-described effects can be configured by providing a general transmissive liquid crystal panel with the main body 61A having the above-described configuration. Therefore, the liquid crystal panel 4A can be easily configured.

[0058] The liquid crystal panel 4A includes wiring 49 that supplies image signals that drive the liquid crystal layer 42. A main body portion 61A, which is a vapor chamber, extends from an opening 64 in the direction in which the wiring 49 extends from the liquid crystal layer 42. With this configuration, the liquid crystal panel 4A can be prevented from becoming large in size, compared to when the main body 61A extends from the opening 64 in the −Y direction, which is the opposite direction to the extension direction of the wiring 49, for example.

[0059] In the liquid crystal panel 4A, the output-side cooling member 6A is provided in the main body 61A, which is a vapor chamber, and includes a first heat dissipation member 68 that dissipates heat transferred from the first heat dissipation member 631. The first heat dissipation member 68 corresponds to a heat dissipation member. The first heat dissipation member 68 is provided in the +Y direction relative to the opening 64, in which the main body 61A extends from the opening 64. With this configuration, the pixel substrate 47 and the output-side dustproof substrate 48, which are heat-generating bodies connected to the heat-receiving portion 621, can be separated from the first heat dissipation member 68. This makes it possible to prevent the heat transferred to the first heat dissipation member 68 from affecting the pixel substrate 47 and the output-side dustproof substrate 48.

[0060] [First Modification of the First Embodiment] In the liquid crystal panel 4A, the side surface 483 of the output-side dustproof substrate 48 is connected to the inner circumferential surface of the opening 64, which is part of the heat-receiving portion 621, via a thermally conductive adhesive in a manner capable of conducting heat. However, this is not a limitation, and the side surface 483 and the inner circumferential surface of the opening 64 do not have to be connected in a manner capable of conducting heat. Furthermore, the side surface 483 and the inner circumferential surface of the opening 64 may be connected in a manner capable of conducting heat by a heat conducting member such as a leaf spring. In addition, the configuration is not limited to one in which the entire side surface 483 is connected to the inner circumferential surface of the opening 64 in a manner capable of conducting heat, and only a part of the side surface 483 may be connected to the inner circumferential surface of the opening 64 in a manner capable of conducting heat.

[0061] [Second Modification of the First Embodiment] In the liquid crystal panel 4A, the heat receiving portion 621 of the output-side cooling member 6A is connected directly to the light output surface 472 of the pixel substrate 47, and is connected to the side surface 483 of the output-side dustproof substrate 48 via a thermally conductive adhesive or the like so as to be able to transfer heat. However, this is not limiting, and the heat receiving portion 621 may be connected directly to the output-side dustproof substrate 48, but not directly to the pixel substrate 47. For example, a heat transfer member capable of transferring heat from the pixel substrate 47 to the heat receiving portion 621 may be provided between the pixel substrate 47 and the heat receiving portion 621.

[0062] FIG. 9 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 4B, which is a modification of the liquid crystal panel 4A. For example, the liquid crystal panel 4B shown in FIG. 9 may be used in place of the liquid crystal panel 4A. The liquid crystal panel 4B has the same configuration and functions as the liquid crystal panel 4A, except that it has an output-side cooling member 6B and a clamping member 51 instead of the output-side cooling member 6A. That is, the liquid crystal panel 4B has a panel body 41, wiring 49, a holding housing 50, a clamping member 51, and the output-side cooling member 6B. The clamping member 51 is combined with the holding housing 50 and clamps the panel main body 41 together with the holding housing 50 in the +Z direction. That is, the clamping member 51 is disposed on the light emission side of the liquid crystal layer 42. More specifically, a portion of the clamping member 51 is disposed between the pixel substrate 47 and the heat receiving portion 621. The clamping member 51 is formed of, for example, a metal with good thermal conductivity.

[0063] The exit side cooling member 6B has the same configuration and function as the exit side cooling member 6A, except that it has a main body 61B instead of the main body 61A. That is, the exit side cooling member 6B has a main body 61B and a first heat dissipation member 68. The main body 61D has a first member 62, a second member 63, and an opening 64. The first member 62 has a first surface 62A and a heat receiving portion 621, and the second member 63 has a second surface 63A and a first heat dissipation portion 631. In the output-side cooling member 6B, the first surface 62A of the first member 62 is not directly connected to the pixel substrate 47, but is connected to the pixel substrate 47 via the sandwiching member 51 in a heat-transferable manner. The first surface 62A is also connected to the light output surface 482 of the output-side dustproof substrate 48. That is, in the liquid crystal panel 4B, the area of ​​the output-side dustproof substrate 48 is larger than the area of ​​the opening 64 of the output-side cooling member 6B when viewed from the traveling direction (+Z direction) of light incident on the liquid crystal layer 42. For this reason, the output-side dustproof substrate 48 is not disposed inside the opening 64, and the main body portion 61B is provided on the output-side dustproof substrate 48.

[0064] The heat transferred to the output-side dustproof substrate 48 is transferred to the first member 62 at the first surface 62A. That is, the heat-receiving portion 621 of the main body 61D is a portion of the first member 62 that is connected to the light output surface 482 of the output-side dustproof substrate 48, and is also a portion that is connected to the pixel substrate 47 via the sandwiching member 51 in a manner that allows heat transfer. Of the heat generated in the liquid crystal layer 42, the amount of heat transferred to the output-side dustproof substrate 48 via the pixel substrate 47 is greater than the amount of heat transferred to the clamping member 51 via the pixel substrate 47, so the heat-receiving portion 621 does not need to be connected to the clamping member 51 in a manner that allows heat transfer.

[0065] [Effects of the second modification of the first embodiment] The liquid crystal panel 4B as described above has the same effects as the liquid crystal panel 4A, and also has the following effects. In the liquid crystal panel 4B, the emission section 46 has a plurality of pixel electrodes electrically connected to the liquid crystal layer 42, and includes a pixel substrate 47 arranged on the light emission side of the liquid crystal layer 42, and an emission-side dustproof substrate 48 provided on a light emission surface 472 of the pixel substrate 47. The emission-side substrate on which the main body 61B of the emission-side cooling member 6B is provided is the emission-side dustproof substrate 48. The pixel substrate 47 corresponds to a light-transmitting emission-side electrode substrate, and the plurality of pixel electrodes correspond to emission-side electrodes. According to this configuration, the main body portion 61B, which is a vapor chamber, is arranged to be heat-transferable to the emission-side dustproof substrate 48, which is arranged on the light emission side of the pixel substrate 47. Therefore, the main body portion 61B can be more easily connected to the emission portion 46 than when the main body portion 61B is arranged on the pixel substrate 47 so as to avoid the emission-side dustproof substrate 48. Here, heat generated in the liquid crystal layer 42 is transferred to the output-side dustproof substrate 48 via the pixel substrate 47, thereby diffusing the heat of the liquid crystal layer 42. In contrast, the first member 62 of the main body 61B is connected to the light output surface 482 of the output-side dustproof substrate 48, which makes it easier to transfer the heat of the liquid crystal layer 42 to the heat-receiving portion 621 of the first member 62.

[0066] In the liquid crystal panel 4B, the main body 61B, which is a vapor chamber, is provided on the light exit surface 482 of the exit-side dustproof substrate 48. The light exit surface 482 corresponds to the surface of the exit-side dustproof substrate 48 on the light exit side. With this configuration, compared to, for example, a case where the exit-side dustproof substrate 48 is placed within an opening 64 corresponding to the pixel region 41A, even if a tolerance occurs in the main body part 61B, which is a vapor chamber, the main body part 61B can be easily attached to the exit part 46.

[0067] [Third Modification of the First Embodiment] In the liquid crystal panel 4A, the heat receiving portion 621 of the output-side cooling member 6A is connected to the light output surface 472 of the pixel substrate 47 and the side surface 483 of the output-side dustproof substrate 48 so as to be heat transferable. In the liquid crystal panel 4B, the heat receiving portion 621 is connected to the light output surface 482 of the output-side dustproof substrate 48. However, the connection portions of the heat receiving portion 621 with the pixel substrate 47 and the output-side dustproof substrate 48 are not limited to those described above.

[0068] FIG. 10 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 4C, which is a modification of the liquid crystal panel 4A. For example, the liquid crystal panel 4A may be replaced with a liquid crystal panel 4C shown in FIG. The liquid crystal panel 4C has the same configuration and functions as the liquid crystal panel 4A, except that it has a clamping member 51 and an output-side cooling member 6C instead of the output-side cooling member 6A. That is, the liquid crystal panel 4C has a panel body 41, wiring 49, a holding housing 50, a clamping member 51, and an output-side cooling member 6C. Similar to the output-side cooling member 6A, the output-side cooling member 6C vaporizes the liquid refrigerant into gaseous refrigerant using heat transferred from the pixel substrate 47 and the output-side dustproof substrate 48, and radiates the heat received from the gaseous refrigerant to the outside. The output-side cooling member 6C has the same configuration and function as the output-side cooling member 6A, except that it includes a main body 61C instead of the main body 61A. That is, the output-side cooling member 6C includes a main body 61C and a first heat radiation member 68.

[0069] Similar to the main body 61A, the main body 61C includes a first member 62 and a second member 63, and is configured by combining the first member 62 and the second member 63. The main body 61C is provided on the pixel substrate 47 so that a first surface 62A of the first member 62 is in contact with the light emission surface 472 of the pixel substrate 47. That is, a portion of the heat receiving portion 621 of the main body 61C is connected to the pixel substrate 47 in a manner capable of transferring heat. The main body 61C includes an opening 64C. The opening 64C is a two-step hole having a first opening 64C1 provided on the light incident side (-Z direction) and a second opening 64C2 provided on the light exit side (+Z direction). The inner diameter of the first opening 64C1 is larger than the inner diameter of the second opening 64C2. The output-side dustproof substrate 48 is disposed inside the first opening 64C1, and a side surface 483 of the output-side dustproof substrate 48 is connected to the inner peripheral surface of the first opening 64C1 via a thermally conductive adhesive or the like in a heat-transferable manner.

[0070] The connection portion 64C3 connecting the inner circumferential surface of the first opening 64C1 and the inner circumferential surface of the second opening 64C2 is substantially parallel to a plane orthogonal to the traveling direction (+Z direction) of light passing through the output-side dustproof substrate 48, and a part of the light output surface 482 of the output-side dustproof substrate 48 is connected to the connection portion 64C3 in a heat-transferable manner. In other words, the main body 61C has a step portion formed by the first opening 64C1, the connection portion 64C3, and the second opening 64C2. The inner circumferential surface of the first opening 64C1 corresponds to the inner circumferential surface of the step portion, and the connection portion 64C3 corresponds to the bottom surface of the step portion. In the main body 61C, the connection portion between the pixel substrate 47 and the output-side dustproof substrate 48 is the heat-receiving portion 621. Therefore, the inner circumferential surface of the first opening 64C1 and the connection portion 64C3 are part of the heat-receiving portion 621.

[0071] [Effects of the third modified example of the first embodiment] The liquid crystal panel 4C has the same effects as the liquid crystal panels 4A and 4B described above, and also has the following effects. In the liquid crystal panel 4C, the output-side dustproof substrate 48 has a side surface 483 connecting a light incident surface 481 and a light exit surface 482. The light incident surface 481 corresponds to the light incident side surface of the output-side dustproof substrate 48, and the light exit surface 482 corresponds to the light exit side surface of the output-side dustproof substrate 48. The inner circumferential surface of the first opening 64C1 of the main body 61C is heat-transferably connected to at least a part of the side surface 483 of the output-side dustproof substrate 48. Furthermore, the connection portion 64C3 of the main body 61C is heat-transferably connected to the light exit surface 482 of the output-side dustproof substrate 48. That is, the inner circumferential surface of the first opening 64C1 and the connection portion 64C3 are part of the heat-receiving portion 621. With this configuration, the heat of the liquid crystal layer 42 transferred to the output-side dustproof substrate 48 can be received by the inner circumferential surface of the first opening 64C1 and the connection portion 64C3. This makes it possible to prevent the size of the liquid crystal panel 4C from increasing in the direction in which light passes (+Z direction) compared to when a main body portion serving as a vapor chamber is provided on the light output surface 482 of the output-side dustproof substrate 48.

[0072] In the liquid crystal panel 4C, the heat receiving portion 621 is connected to the pixel substrate 47 so as to be capable of transferring heat. With this configuration, heat is transferred to the heat-receiving portion 621 not only from the side surface 483 of the output-side dustproof substrate 48, but also from the pixel substrate 47. This makes it easier to transfer heat from the liquid crystal layer 42 to the heat-receiving portion 621, thereby improving the cooling efficiency of the liquid crystal layer 42. In the liquid crystal panel 4C, the first member 62 having the heat-receiving portion 621 does not have to be connected to the pixel substrate 47 in a manner that allows heat transfer. In this case, the main body portion 61C may be fixed to the output-side dustproof substrate 48.

[0073] [Second embodiment] Next, a second embodiment of the present disclosure will be described. The projector according to this embodiment has a similar configuration to the projector 1 according to the first embodiment, but the position of the first heat dissipation member in the output-side cooling member that constitutes the liquid crystal panel is different. Note that in the following explanation, parts that are the same or approximately the same as parts that have already been explained will be given the same reference numerals and explanations thereof will be omitted.

[0074] FIG. 11 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 4D provided in the projector according to this embodiment. The projector according to this embodiment has the same configuration and functions as the projector 1 according to the first embodiment, except that it has a liquid crystal panel 4D shown in Fig. 11 instead of the liquid crystal panel 4A according to the first embodiment. The liquid crystal panel 4D has the same configuration and functions as the liquid crystal panel 4A, except that it has an output-side cooling member 6D instead of the output-side cooling member 6A.

[0075] The exit-side cooling member 6D has the same configuration and function as the exit-side cooling member 6A according to embodiment 1, except that it has a main body 61D instead of the main body 61A according to embodiment 1. That is, the exit-side cooling member 6D has a main body 61D and a first heat dissipation member 68. The main body 61D includes a first member 62 and a second member 63, and is configured by combining the first member 62 and the second member 63 in the +Z direction. The main body 61D has an opening 64, and extends from the opening 64 in the −Y direction, which is the opposite direction to the extension direction of the wiring 49 from the liquid crystal layer 42. Therefore, in the second member 63 of the main body 61D, the first heat dissipation member 631 is arranged in the −Y direction with respect to the opening 64. The first heat dissipation member 68 is provided on the second surface 63A of the second member 63 at a position corresponding to the first heat dissipation member 631. The exit-side dustproof substrate 48 is disposed inside the opening 64, and the inner peripheral surface of the opening 64 and the side surface 483 of the exit-side dustproof substrate 48 are connected to each other in a heat-conductive manner by a heat-conductive adhesive or the like. That is, in the main body 61D, the heat-receiving portion 621 is connected to the light exit surface 472 of the pixel substrate 47, and is also connected to the side surface 483 of the exit-side dustproof substrate 48 in a heat-conductive manner.

[0076] [Flow of cooling gas circulating around the LCD panel] Cooling gas circulated by a fan of a cooling device disposed in exterior housing 2 flows in the +Y direction relative to liquid crystal panel 4D. Although not shown, the cooling gas circulating through liquid crystal panel 4D, like the cooling gas circulating through liquid crystal panel 4A, is divided at the end of liquid crystal panel 4D in the -Y direction into cooling gas circulating through a space on the light incident side relative to liquid crystal panel 4D and cooling gas circulating through a space on the light exit side relative to liquid crystal panel 4D.

[0077] The cooling gas flowing through the space on the light incident side of the liquid crystal panel 4D flows in the +Y direction to cool the incident-side dustproof substrate 45, and then cools the holding housing 50. The cooling gas flowing through the space on the light exit side of the liquid crystal panel 4D flows in the +Y direction to cool the first heat dissipation member 68, and then cools the exit-side dustproof substrate . In this way, in the liquid crystal panel 4D, cooling gas flows through the entrance-side dustproof substrate 45, the exit-side dustproof substrate 48, the holding housing 50, and the exit-side cooling member 6D, so that the heat of the liquid crystal layer 42 is transferred to the cooling gas, thereby cooling the liquid crystal layer 42 and also the driver circuit 491.

[0078] In the liquid crystal panel 4D, the first heat dissipation section 631 and the first heat dissipation member 68 are disposed in the -Y direction with respect to the opening 64. Therefore, when the liquid crystal panel 4D is positioned so that the -Y direction is vertically upward, the liquid refrigerant condensed in the first condenser section corresponding to the first heat dissipation section 631 can be transported by gravity as well as capillary force to the vaporization section corresponding to the connection section with the pixel substrate 47 and the connection section with the output-side dustproof substrate 48 in the heat-receiving section 621. This allows heat transferred from the liquid crystal layer 42 via the pixel substrate 47 and the output-side dustproof substrate 48 to promote the change of the refrigerant from liquid to gas in the vaporization section. That is, the heat dissipation efficiency of the liquid crystal layer 42, and therefore the cooling efficiency of the liquid crystal layer 42, can be improved.

[0079] [Effects of the second embodiment] The projector according to the present embodiment described above has the same effects as the projector 1 according to the first embodiment, and also has the following effects: That is, the liquid crystal panel 4D according to the present embodiment has the same effects as the liquid crystal panel 4A according to the first embodiment, and also has the following effects. The liquid crystal panel 4D includes wiring 49 that supplies image signals to the liquid crystal layer 42. The main body 61D, which is a vapor chamber, extends from the opening 64 in the −Y direction, which is the opposite direction to the extension direction of the wiring 49 from the liquid crystal layer 42. According to this configuration, it is possible to prevent the wiring 49 and the main body portion 61D from interfering with each other, and therefore it is possible to prevent the wiring 49 from interfering with heat dissipation by the main body portion 61D.

[0080] [First Modification of Second Embodiment] In the liquid crystal panel 4D, the side surface 483 of the output-side dustproof substrate 48 is connected to the inner circumferential surface of the opening 64, which is part of the heat-receiving portion 621, via a thermally conductive adhesive in a manner capable of conducting heat. However, this is not a limitation, and the side surface 483 and the inner circumferential surface of the opening 64 do not have to be connected in a manner capable of conducting heat. Furthermore, the side surface 483 and the inner circumferential surface of the opening 64 may be connected in a manner capable of conducting heat by a heat transfer member such as a leaf spring. In addition, the configuration is not limited to one in which the entire side surface 483 is connected to the inner circumferential surface of the opening 64 in a manner capable of conducting heat, and only a part of the side surface 483 may be connected to the inner circumferential surface of the opening 64 in a manner capable of conducting heat.

[0081] [Second Modification of the Second Embodiment] In the liquid crystal panel 4D, the heat receiving portion 621 is directly connected to the light exit surface 472 of the pixel substrate 47, and is connected to the side surface 483 of the exit-side dustproof substrate 48 via a thermally conductive adhesive or the like so as to be able to transfer heat. However, this is not limiting, and the heat receiving portion 621 may be directly connected to the exit-side dustproof substrate 48, and not directly connected to the pixel substrate 47. For example, a heat transfer member capable of transferring heat from the pixel substrate 47 to the heat receiving portion 621 may be provided between the pixel substrate 47 and the heat receiving portion 621.

[0082] FIG. 12 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 4E, which is a modification of the liquid crystal panel 4D. For example, the liquid crystal panel 4D may be replaced with a liquid crystal panel 4E shown in FIG. The liquid crystal panel 4E has the same configuration and functions as the liquid crystal panel 4D, except that it includes an output-side cooling member 6E and a clamping member 51 instead of the output-side cooling member 6D. That is, the liquid crystal panel 4E includes a panel body 41, wiring 49, a holding housing 50, a clamping member 51, and an output-side cooling member 6E.

[0083] The exit-side cooling member 6E has the same configuration and function as the exit-side cooling member 6D, except that it has a main body 61E instead of the main body 61D. That is, the exit-side cooling member 6E has a main body 61E and a first heat dissipation member 68. The main body 61E has a first member 62 and a second member 63, and is configured by combining the first member 62 and the second member 63. The main body 61E has an opening 64, the first member 62 has a first surface 62A and a heat receiving portion 621, and the second member 63 has a second surface 63A and a first heat dissipation portion 631. Similar to the main body 61D, the main body 61E extends from the opening 64 in the −Y direction, which is the opposite direction to the extension direction of the wiring 49.

[0084] In the output-side cooling member 6E, a first surface 62A of the first member 62 is not directly connected to the pixel substrate 47, but is heat-transferably connected to the pixel substrate 47 via the clamping member 51. The main body 61E is provided on the output-side dustproof substrate 48, and the first surface 62A is connected to the light-emitting surface 482 of the output-side dustproof substrate 48. That is, the output-side cooling member 6E is provided on the output-side dustproof substrate 48 so that the portion of the first surface 62A surrounding the opening 64 is connected to the light-emitting surface 482. In other words, a portion of the heat-receiving portion 621 provided around the opening 64 is heat-transferably connected to the light-emitting surface 482 of the output-side dustproof substrate 48, and another portion of the heat-receiving portion 621 is heat-transferably connected to the pixel substrate 47 via the clamping member 51.

[0085] Of the heat generated in the liquid crystal layer 42, the amount of heat transferred to the output-side dustproof substrate 48 via the pixel substrate 47 is greater than the amount of heat transferred to the clamping member 51 via the pixel substrate 47. For this reason, the heat-receiving portion 621 does not need to be connected to the clamping member 51 in a manner that allows heat transfer. Such a liquid crystal panel 4E has the same effects as the above-described liquid crystal panels 4B and 4D.

[0086] [Third Modification of Second Embodiment] In the liquid crystal panel 4D, the heat receiving portion 621 of the output-side cooling member 6D is connected to the light output surface 472 of the pixel substrate 47 and the side surface 483 of the output-side dustproof substrate 48 so as to be heat transferable. In the liquid crystal panel 4E, the heat receiving portion 621 is connected directly to the light output surface 482 of the output-side dustproof substrate 48. However, the connection portions of the heat receiving portion 621 with the pixel substrate 47 and the output-side dustproof substrate 48 are not limited to those described above.

[0087] FIG. 13 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 4F, which is a modification of the liquid crystal panel 4D. For example, the liquid crystal panel 4D may be replaced with a liquid crystal panel 4F shown in FIG. The liquid crystal panel 4F has the same configuration and functions as the liquid crystal panel 4D, except that it has an exit-side cooling member 6F instead of the exit-side cooling member 6D. That is, the liquid crystal panel 4F has a panel body 41, wiring 49, a holding housing 50, and an exit-side cooling member 6F. Similar to the output-side cooling member 6D, the output-side cooling member 6F vaporizes the liquid refrigerant into gaseous refrigerant using heat transferred from the pixel substrate 47 and the output-side dustproof substrate 48, and radiates the heat received from the gaseous refrigerant to the outside. The output-side cooling member 6F has the same configuration and function as the output-side cooling member 6D, except that it includes a main body 61F instead of the main body 61D. That is, the output-side cooling member 6F includes a main body 61F and a first heat radiation member 68.

[0088] Similar to the main body 61D, the main body 61F includes a first member 62 and a second member 63, and is configured by combining the first member 62 and the second member 63. The main body 61F is provided on the pixel substrate 47 so that a first surface 62A of the first member 62 is in contact with the light emission surface 472 of the pixel substrate 47. That is, a portion of the heat receiving portion 621 of the main body 61F is connected to the pixel substrate 47 in a manner capable of transferring heat.

[0089] The main body 61F includes an opening 64C. As described above, the opening 64C is a two-step hole having a first opening 64C1 on the light incident side and a second opening 64C2 on the light exit side. The exit-side dustproof substrate 48 is disposed inside the first opening 64C1, and a side surface 483 of the exit-side dustproof substrate 48 is heat-transferably connected to the inner circumferential surface of the first opening 64C1 via a thermally conductive adhesive or the like. Furthermore, a portion of the light exit surface 482 of the exit-side dustproof substrate 48 is heat-transferably connected to a connection portion 64C3 connecting the inner circumferential surfaces of the first opening 64C1 and the second opening 64C2. In other words, the main body 61F has a step portion formed by the first opening 64C1, the connection portion 64C3, and the second opening 64C2. The inner circumferential surface of the first opening 64C1 corresponds to the inner circumferential surface of the step portion, and the connection portion 64C3 corresponds to the bottom surface of the step portion. In the main body 61C, the connection portion between the pixel substrate 47 and the output-side dustproof substrate 48 is part of the heat-receiving portion 621. Therefore, the inner circumferential surface of the first opening 64C1 and the connection portion 64C3 are part of the heat-receiving portion 621.

[0090] Such a liquid crystal panel 4F can achieve the same effects as the above-mentioned liquid crystal panels 4C and 4D. In the liquid crystal panel 4F, similarly to the liquid crystal panel 4C, the first member 62 having the heat-receiving portion 621 does not have to be connected to the pixel substrate 47 in a manner that allows heat transfer. In this case, the main body portion 61F may be fixed to the output-side dustproof substrate 48.

[0091] [Third embodiment] Next, a third embodiment of the present disclosure will be described. The projector according to this embodiment has a configuration similar to that of the projector 1 according to the first embodiment, but differs in that the main body of the output-side cooling member of the liquid crystal panel extends from the opening in the extension direction of the wiring 49, and also extends from the opening in the opposite direction to the extension direction of the wiring 49. In the following explanation, parts that are the same or approximately the same as parts that have already been explained will be given the same reference numerals and explanations thereof will be omitted.

[0092] FIG. 14 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 4G provided in the projector according to this embodiment. The projector according to this embodiment has the same configuration and functions as the projector 1 according to the first embodiment, except that it has a liquid crystal panel 4G shown in FIG. 14 instead of the liquid crystal panel 4A according to the first embodiment. The liquid crystal panel 4G has the same configuration and functions as the liquid crystal panel 4A, except that it includes an output-side cooling member 6G instead of the output-side cooling member 6A. That is, the liquid crystal panel 4G includes a panel main body 41, wiring 49, a holding housing 50, and the output-side cooling member 6G. The panel main body 41 includes a liquid crystal layer 42, an incident section 43, and an output section 46. The input section 43 includes a counter substrate 44 and an input-side dustproof substrate 45, and the output section 46 includes a pixel substrate 47 and an output-side dustproof substrate 48. The panel main body 41 includes a pixel region 41A defined by the liquid crystal layer 42, the counter substrate 44, and the pixel substrate 47, and a plurality of pixels are arranged in the pixel region 41A.

[0093] The output-side cooling member 6G further includes a second heat dissipation member 69, and is larger in the +Y direction than the output-side cooling member 6A, but has the same configuration as the output-side cooling member 6A. That is, the output-side cooling member 6G includes a main body 61G, a first heat dissipation member 68, and a second heat dissipation member 69.

[0094] The main body 61G has a first member 62, a second member 63, and an opening 64. The first member 62 has a first surface 62A and a heat receiving portion 621. The second member 63 has a second surface 63A, a first heat dissipation portion 631, and a second heat dissipation portion 632. The main body 61G is configured by combining a first member 62 and a second member 63. The main body 61G extends from the opening 64 along the +Y direction, which is the extension direction of the wiring 49 from the liquid crystal layer 42, and also extends from the opening 64 along the −Y direction, which is the opposite direction to the extension direction of the wiring 49 from the liquid crystal layer 42. As described above, the first heat dissipation portion 631 is disposed in the +Y direction of the opening 64 on the second member 63. A first heat dissipation member 68 is provided on the second surface 63A of the second member 63 at a position corresponding to the first heat dissipation portion 631. The second heat dissipation portion 632 is disposed in the −Y direction relative to the opening 64 on the second member 63. A second heat dissipation member 69 is provided on the second surface 63A of the second member 63 at a position corresponding to the second heat dissipation portion 632. The second heat dissipation member 69 dissipates the heat transferred from the second heat dissipation section 632 to the cooling gas flowing through the second heat dissipation member 69. The second heat dissipation member 69 may be configured to have, for example, a plurality of fins similar to the plurality of fins 681, or may be configured to have a plurality of fins formed in another shape.

[0095] [Flow of cooling gas circulating around the LCD panel] Cooling gas circulated by a fan of a cooling device disposed in the exterior housing 2 flows in the +Y direction relative to the liquid crystal panel 4G. Although not shown, the cooling gas circulating through the liquid crystal panel 4G is divided at the end of the liquid crystal panel 4G in the -Y direction into cooling gas circulating through a space on the light incident side relative to the liquid crystal panel 4G and cooling gas circulating through a space on the light exit side relative to the liquid crystal panel 4G. The cooling gas flowing through the space on the light incident side relative to the liquid crystal panel 4G flows in the +Y direction to cool the incident-side dustproof substrate 45, and then cools the holding housing 50. The cooling gas flowing through the space on the light exit side of the liquid crystal panel 4G flows in the +Y direction and cools the second heat dissipation member 69, the exit-side dustproof substrate 48, and the first heat dissipation member 68 in this order. In this way, cooling gas flows through the incident-side dustproof substrate 45, the holding housing 50, the exit-side dustproof substrate 48, the first heat dissipation member 68 and the second heat dissipation member 69, to which the heat of the liquid crystal layer 42 is transferred, and the heat of the liquid crystal layer 42 is thereby transferred to the cooling gas, thereby cooling the liquid crystal layer 42 and the driver circuit 491.

[0096] In the liquid crystal panel 4G, the first heat dissipation section 631 and the first heat dissipation member 68 are provided in the +Y direction with respect to the opening 64, and the second heat dissipation section 632 and the second heat dissipation member 69 are provided in the -Y direction with respect to the opening 64. Therefore, when the liquid crystal panel 4G is positioned so that the +Y direction is vertically upward, the liquid refrigerant condensed in the first condenser corresponding to the first heat dissipation section 631 can be transported by not only capillary force but also gravity to the vaporizers corresponding to the connection portions of the heat receiving section 621 with the pixel substrate 47 and the connection portions of the heat receiving section 621 with the output-side dustproof substrate 48. When the liquid crystal panel 4G is positioned so that the -Y direction is vertically upward, the liquid refrigerant condensed in the second condenser corresponding to the second heat dissipation section 632 can be transported by not only capillary force but also gravity to the vaporizers corresponding to the connection portions of the heat receiving section 621 with the pixel substrate 47 and the connection portions of the heat receiving section 621 with the output-side dustproof substrate 48. This allows the heat transferred from the liquid crystal layer 42 via the pixel substrate 47 and the output-side dustproof substrate 48 to promote the change of the refrigerant from liquid to gas in each vaporizer. That is, the heat dissipation efficiency of the liquid crystal layer 42 and, ultimately, the cooling efficiency of the liquid crystal layer 42 can be improved.

[0097] [Effects of the third embodiment] The projector according to the present embodiment described above has the same effects as the projectors according to the first embodiment and the second embodiment, and also has the following effects: That is, the liquid crystal panel 4G according to the present embodiment has the same effects as the liquid crystal panel 4A according to the first embodiment and the liquid crystal panel 4D according to the second embodiment, and also has the following effects. The liquid crystal panel 4G includes wiring 49 that supplies image signals to the liquid crystal layer 42. A main body 61G, which is a vapor chamber, extends from an opening 64 in both the +Y direction and the −Y direction. The +Y direction corresponds to the extension direction of the wiring 49 from the liquid crystal layer 42, and the −Y direction corresponds to the opposite direction to the extension direction of the wiring 49 from the liquid crystal layer 42. This configuration increases the heat dissipation area of ​​the main body 61G for heat received from the gaseous refrigerant, making it easier to condense the gaseous refrigerant into a liquid refrigerant. This allows the liquid refrigerant to flow smoothly through the vaporization section, facilitating the evaporation of the liquid refrigerant by the heat of the liquid crystal layer 42. Furthermore, by positioning the liquid crystal panel 4G so that one of the +Y and -Y directions is vertically upward, the condensed liquid refrigerant can be transported to the vaporization section that vaporizes the liquid refrigerant not only by capillary force but also by gravity. This promotes the transformation of the refrigerant from liquid to gas using the heat received by the heat receiving section 621. This therefore improves the heat dissipation efficiency of the liquid crystal layer 42, and ultimately the cooling efficiency of the liquid crystal layer 42.

[0098] [First Modification of the Third Embodiment] In the liquid crystal panel 4G, the side surface 483 of the output-side dustproof substrate 48 is connected to the inner circumferential surface of the opening 64, which is part of the heat-receiving portion 621, via a thermally conductive adhesive in a manner capable of conducting heat. However, this is not limited to this, and the side surface 483 and the inner circumferential surface of the opening 64 do not have to be connected in a manner capable of conducting heat. Furthermore, the side surface 483 and the inner circumferential surface of the opening 64 may be connected in a manner capable of conducting heat by a heat conducting member such as a leaf spring. In addition, the configuration is not limited to one in which the entire side surface 483 is connected to the inner circumferential surface of the opening 64 in a manner capable of conducting heat, and only a part of the side surface 483 may be connected to the inner circumferential surface of the opening 64 in a manner capable of conducting heat.

[0099] [Second Modification of the Third Embodiment] In the liquid crystal panel 4G, the heat receiving portion 621 of the output-side cooling member 6G is connected directly to the light output surface 472 of the pixel substrate 47, and is connected to the side surface 483 of the output-side dustproof substrate 48 via a thermally conductive adhesive or the like so as to be able to transfer heat. However, this is not limiting, and the heat receiving portion 621 may be connected directly to the output-side dustproof substrate 48, but not directly to the pixel substrate 47. For example, a heat transfer member capable of transferring heat from the pixel substrate 47 to the heat receiving portion 621 may be provided between the pixel substrate 47 and the heat receiving portion 621.

[0100] FIG. 15 is a diagram showing a schematic cross section along the YZ plane of a liquid crystal panel 4H, which is a modification of the liquid crystal panel 4G. For example, the liquid crystal panel 4G may be replaced with a liquid crystal panel 4H shown in FIG. The liquid crystal panel 4H has the same configuration and functions as the liquid crystal panel 4G, except that it is equipped with an output-side cooling member 6H and a clamping member 51 instead of the output-side cooling member 6G. That is, the liquid crystal panel 4H is equipped with a panel main body 41, wiring 49, a holding housing 50, a clamping member 51, and the output-side cooling member 6H.

[0101] The exit-side cooling member 6H has the same configuration and function as the exit-side cooling member 6G, except that it has a main body 61H instead of the main body 61G. That is, the exit-side cooling member 6H has a main body 61H, a first heat dissipation member 68, and a second heat dissipation member 69. The main body 61H includes a first member 62, a second member 63, and an opening 64. The first member 62 has a first surface 62A and a heat receiving portion 621, and the second member 63 has a second surface 63A, a first heat dissipation portion 631, and a second heat dissipation portion 632. Like the main body 61A, the main body 61H extends from the opening 64 in the +Y direction, which is the extension direction of the wiring 49 from the liquid crystal layer 42, and like the main body 61D, the main body 61H extends from the opening 64 in the −Y direction, which is the opposite direction to the extension direction of the wiring 49 from the liquid crystal layer 42.

[0102] In the output-side cooling member 6H, the first surface 62A of the first member 62 is not directly connected to the pixel substrate 47, but is thermally conductively connected to the pixel substrate 47 via the sandwiching member 51, and is also thermally conductively connected to the counter substrate 44 via the holding housing 50. The first surface 62A is also connected to the light-emitting surface 482 of the output-side dustproof substrate 48. When viewed from the direction in which image light is emitted by the liquid crystal panel 4H, the area of ​​the output-side dustproof substrate 48 is larger than the area of ​​the opening 64 of the output-side cooling member 6H. The output-side dustproof substrate 48 is not disposed inside the opening 64, and the first surface 62A is connected to the light-emitting surface 482 of the output-side dustproof substrate 48 at a portion surrounding the opening 64. That is, the output-side cooling member 6H is provided on the output-side dustproof substrate 48 such that the portion of the first surface 62A surrounding the opening 64 is connected to the light-emitting surface 482. In other words, a part of the heat-receiving portion 621 provided around the opening 64 is connected to the light-emitting surface 482 of the emission-side dustproof substrate 48 so as to be heat-transferable, another part of the heat-receiving portion 621 is connected to the pixel substrate 47 via the clamping member 51 so as to be heat-transferable, and yet another part of the heat-receiving portion 621 is connected to the counter substrate 44 via the holding housing 50 so as to be heat-transferable. Heat transferred from the liquid crystal layer 42 to the emission-side dustproof substrate 48 via the pixel substrate 47 is transferred to the heat-receiving portion 621.

[0103] As described above, of the heat generated in the liquid crystal layer 42, the amount of heat transferred to the output-side dustproof substrate 48 via the pixel substrate 47 is greater than the amount of heat transferred to the clamping member 51 via the pixel substrate 47. For this reason, the heat-receiving portion 621 does not need to be connected to the clamping member 51 in a manner that allows heat transfer. Such a liquid crystal panel 4H has the same effects as the above-mentioned liquid crystal panels 4B, 4E, and 4G.

[0104] [Third Modification of the Third Embodiment] In the liquid crystal panel 4G, the heat receiving portion 621 of the output-side cooling member 6G is directly connected to the light output surface 472 of the pixel substrate 47 and the side surface 483 of the output-side dustproof substrate 48. In the liquid crystal panel 4H, the heat receiving portion 621 is directly connected to the light output surface 482 of the output-side dustproof substrate 48. However, the connection portions of the heat receiving portion 621 with the pixel substrate 47 and the output-side dustproof substrate 48 are not limited to those described above.

[0105] FIG. 16 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 4I, which is a modification of the liquid crystal panel 4G. For example, the liquid crystal panel 4G may be replaced with a liquid crystal panel 4I shown in FIG. The liquid crystal panel 4I has the same configuration and functions as the liquid crystal panel 4G, except that it has an exit-side cooling member 6I instead of the exit-side cooling member 6G. That is, the liquid crystal panel 4I has a panel body 41, wiring 49, a holding housing 50, and the exit-side cooling member 6I. Similar to the output-side cooling member 6G, the output-side cooling member 6I vaporizes the liquid refrigerant into gaseous refrigerant using heat transferred from the pixel substrate 47 and the output-side dustproof substrate 48, and dissipates the heat received from the gaseous refrigerant to the outside. The output-side cooling member 6I has the same configuration and function as the output-side cooling member 6G, except that it includes a main body 61I instead of the main body 61G. That is, the output-side cooling member 6I includes a main body 61I, a first heat dissipation member 68, and a second heat dissipation member 69.

[0106] Similar to the main body 61G, the main body 61I includes a first member 62 and a second member 63, and is configured by combining the first member 62 and the second member 63. The main body 61I is provided on the pixel substrate 47 so that a first surface 62A of the first member 62 is in contact with the light emission surface 472 of the pixel substrate 47. That is, a portion of the heat receiving portion 621 of the main body 61I is connected to the pixel substrate 47 in a manner capable of transferring heat.

[0107] The main body 61I includes an opening 64C. As described above, the opening 64C is a two-step hole having a first opening 64C1 on the light incident side and a second opening 64C2 on the light exit side. The exit-side dustproof substrate 48 is disposed inside the first opening 64C1, and a side surface 483 of the exit-side dustproof substrate 48 is heat-transferably connected to the inner circumferential surface of the first opening 64C1 via a thermally conductive adhesive or the like. A portion of the light exit surface 482 of the exit-side dustproof substrate 48 is heat-transferably connected to a connection portion 64C3 connecting the inner circumferential surfaces of the first opening 64C1 and the second opening 64C2. In other words, the main body 61I has a step portion formed by the first opening 64C1, the connection portion 64C3, and the second opening 64C2. The inner circumferential surface of the first opening 64C1 corresponds to the inner circumferential surface of the step portion, and the connection portion 64C3 corresponds to the bottom surface of the step portion. In the main body 61I, the connection portion between the pixel substrate 47 and the output-side dustproof substrate 48 is part of the heat-receiving portion 621. Therefore, the inner circumferential surface of the first opening 64C1 and the connection portion 64C3 are part of the heat-receiving portion 621.

[0108] Like main body portion 61G, main body portion 61I extends from opening 64C in the +Y direction, which is the extension direction of wiring 49 from liquid crystal layer 42, and also extends from opening 64C in the −Y direction, which is the opposite direction to the extension direction of wiring 49 from liquid crystal layer 42. First heat dissipation portion 631 and first heat dissipation member 68 are provided on second surface 63A in a portion on the +Y direction relative to opening 64C, and second heat dissipation portion 632 and second heat dissipation member 69 are provided on second surface 63A in a portion on the −Y direction relative to opening 64C. Such a liquid crystal panel 4I can achieve the same effects as the above-mentioned liquid crystal panels 4C, 4F, and 4G. In the liquid crystal panel 4I, similarly to the liquid crystal panels 4C and 4F, the first member 62 having the heat-receiving portion 621 does not have to be connected to the pixel substrate 47 in a manner that allows heat transfer. In this case, the main body portion 61C may be fixed to the output-side dustproof substrate 48.

[0109] [Fourth embodiment] Next, a fourth embodiment of the present disclosure will be described. The projector according to this embodiment has a similar configuration to the projector 1 according to the first embodiment, but the arrangement of the cooling member in the liquid crystal panel is different. In the following explanation, parts that are the same or approximately the same as parts that have already been explained will be given the same reference numerals and explanations thereof will be omitted.

[0110] FIG. 17 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 7A provided in the projector according to this embodiment. The projector according to this embodiment has the same configuration and functions as the projector 1 according to the first embodiment, except that it has a liquid crystal panel 7A shown in FIG. 17 instead of the liquid crystal panel 4A according to the first embodiment. The liquid crystal panel 7A has the same configuration as the liquid crystal panel 4A, except that it includes a clamping member 51 and an incident-side cooling member 8A instead of the exit-side cooling member 6A. That is, the liquid crystal panel 7A includes a panel main body 41, wiring 49, a holding housing 50, a clamping member 51, and an incident-side cooling member 8A. The panel main body 41 includes a liquid crystal layer 42, an incident section 43, and an exit section 46. The incident section 43 includes a counter substrate 44 and an entrance-side dustproof substrate 45, and the exit section 46 includes a pixel substrate 47 and an exit-side dustproof substrate 48. The panel main body 41 includes a pixel region 41A defined by the liquid crystal layer 42, the counter substrate 44, and the pixel substrate 47, and a plurality of pixels are arranged in the pixel region 41A. As shown in the second modified example of the first embodiment, the clamping member 51 clamps the panel main body 41 together with the holding housing 50. In this embodiment, the holding housing 50 does not include heat dissipation fins 502, and an incident-side cooling member 8A is provided on a surface 50A of the holding housing 50 on the light incident side.

[0111] [Configuration of the entrance side cooling member] Like the exit-side cooling member 6A, the entrance-side cooling member 8A consumes the heat transferred from the liquid crystal layer 42 to cool the liquid crystal layer 42 by vaporizing the liquid refrigerant sealed inside into a gaseous refrigerant using the heat transferred from the liquid crystal layer 42, and also receives the heat of the gaseous refrigerant, condensing it into a liquid refrigerant, and dissipating the received heat to the outside. The incident-side cooling member 8A includes a main body 81A and a first heat dissipation member 88, and the main body 81A has a first member 82 and a second member 83 that are combined with each other, as well as an opening 84. When viewed from the incident side (-Z direction) of light incident on the liquid crystal layer 42, the main body 81A extends outward beyond the counter substrate 44 and the incident-side dustproof substrate 45.

[0112] The first member 82 is a substrate formed in a flat plate shape, and can also be called a first substrate. The first member 82 has a configuration similar to that of the first member 62. The first member 82 has a first surface 82A, which is the surface of the first member 82 opposite to the second member 83. The first surface 82A is the surface that comes into contact with the heating element. In this embodiment, the first surface 82A is a flat surface. The first member 82 has a heat receiving portion 821 that receives heat from a heat generating element. That is, the main body portion 81A, which is the vapor chamber according to this embodiment, has the heat receiving portion 821. The heat receiving portion 821 will be described in detail later.

[0113] The second member 83 is a substrate formed in a flat plate shape and can also be referred to as a second substrate. The second member 83 has a configuration similar to that of the second member 63. The second member 83 is joined to the first member 82 and, together with the first member 82, forms the enclosed space SP. The second member 83 has a second surface 83A, which is the surface of the second member 83 opposite to the first member 82, and a first heat dissipation portion 831 provided on the second surface 83A. The second member 83 receives heat from the gaseous refrigerant in the enclosed space SP at the first heat dissipation portion 831 and dissipates the heat of the gaseous refrigerant to the outside. Although not shown, a first condensation portion, which is a portion on the inner surface of the enclosed space SP corresponding to the first heat dissipation portion 831, condenses the gaseous refrigerant that has received heat into liquid refrigerant.

[0114] The opening 84 is a through-hole that penetrates the main body 81A along the direction in which the first member 82 and the second member 83 face each other (the +Z direction). The opening 84 is an opening that is substantially rectangular when viewed from the +Z direction. The inner circumferential surface of the opening 84 is formed by the joint portion between the first member 82 and the second member 83. The main body 81A extends from the opening 84 along the +Y direction, which is the extension direction of the wiring 49 from the liquid crystal layer 42. That is, the first member 82 and the second member 83 extend from the opening 84 in the extension direction of the wiring 49 (+Y direction).

[0115] [Configuration of the heat receiving section] The heat receiving portion 821 is a portion of the first member 82 that is connected to the heat generating element and receives heat from the heat generating element. In other words, the heat receiving portion 821 can be defined as a connection portion of the first member 82 that is connected to the heat generating element. The heat receiving portion 821 is provided around the opening 84 of the first member 82. In this embodiment, the heat receiving portion 821 is connected to the light incident surface 441 of the counter substrate 44 and the side surface 453 of the entrance-side dustproof substrate 45, and receives heat from the counter substrate 44 and the entrance-side dustproof substrate 45. Although not shown in the drawings, the portion of the inner surface of the enclosed space SP that corresponds to the heat receiving portion 821 can be said to be an evaporation portion that evaporates the liquid refrigerant by the heat received by the heat receiving portion 821. In more detail, among the portions of the inner surface of the enclosed space SP that come into contact with the liquid refrigerant, the portion to which the heat received by the heat receiving portion 821 is transferred and that evaporates the liquid refrigerant is the evaporation portion.

[0116] [Configuration of the first heat dissipation section] The first heat radiating portion 831 is provided on a second surface 83A of the second member 83 opposite to the first member 82. The first heat radiating portion 831 radiates heat from the gaseous refrigerant flowing within the enclosed space SP. Although not shown in the figures, the portion of the inner surface of the enclosed space SP that corresponds to first heat dissipation portion 831 can be referred to as a first condensation portion that receives heat from the gaseous refrigerant and condenses the gaseous refrigerant into liquid refrigerant. More specifically, the first condensation portion is the portion of the inner surface of the enclosed space SP that comes into contact with the gaseous refrigerant and receives heat from the gaseous refrigerant and condenses the gaseous refrigerant into liquid refrigerant. The heat received from the gaseous refrigerant by this first condensation portion is dissipated by first heat dissipation portion 831. The first heat dissipation section 831 is provided in the extension direction of the wiring 49 from the liquid crystal layer 42 relative to the opening 64. A first heat dissipation member 88 is provided on the second surface 83A at a position corresponding to the first heat dissipation section 831. By providing the first heat dissipation member 88 on the first heat dissipation section 831, the second member 83 becomes a portion that easily dissipates heat received from the gaseous refrigerant to the outside of the main body section 81A. For this reason, the portion of the incident-side cooling member 8A where the first heat dissipation member 88 is provided is configured as the first heat dissipation section 831.

[0117] [Arrangement of the incident side cooling member relative to the panel body] The incident-side cooling member 8A is provided on the light incident side of the liquid crystal layer 42. Specifically, the incident-side cooling member 8A is provided on the light incident surface 441 of the counter substrate 44, which is the incident-side substrate, and the first surface 82A of the first member 82 is connected to the light incident surface 441 of the counter substrate 44 so as to be capable of transferring heat. The entrance-side dustproof substrate 45 is disposed within the opening 84. A side surface 453 of the entrance-side dustproof substrate 45 is connected to the inner peripheral surface of the opening 84 via a thermally conductive adhesive in a heat-transferable manner. That is, the inner peripheral surface of the opening 84 is a part of the heat-receiving portion 821.

[0118] [Transmission path of heat generated in the liquid crystal layer] Of the heat transferred from the liquid crystal layer 42 to the counter substrate 44, some of the heat is transferred via the counter substrate 44 to the heat receiving portion 821, and the other part of the heat is transferred from the counter substrate 44 to the heat receiving portion 821 via the incident-side dustproof substrate 45. More specifically, in the incident-side cooling member 8A shown in Fig. 17 , the heat transferred from the liquid crystal layer 42 to the counter substrate 44 is transferred to the heat receiving portion 821 in contact with the light incident surface 441 of the counter substrate 44. On the other hand, the heat transferred to the incident-side dustproof substrate 45 is transferred to the inner circumferential surface of the opening 84 that is connected to the side surface 453 of the incident-side dustproof substrate 45 in a heat-transferable manner. The first member 82 having the heat-receiving portion 821 consumes the heat transferred to the first member 82 by vaporizing the liquid refrigerant in the enclosed space SP using the transferred heat from the liquid crystal layer 42. This cools the counter substrate 44 and the incident-side dustproof substrate 45, and ultimately the liquid crystal layer 42. The gaseous refrigerant that has circulated through the enclosed space SP and reached the first condenser section is condensed into a liquid refrigerant in the first condenser section. The heat received from the gaseous refrigerant in the first condenser section is transferred from the first heat dissipation section 831 to the first heat dissipation member 88, and is dissipated by the first heat dissipation member 88.

[0119] [Flow of cooling gas circulating around the LCD panel] Cooling gas circulated by a fan of a cooling device disposed in exterior housing 2 flows in the +Y direction relative to liquid crystal panel 7A. Although not shown, the cooling gas circulating through liquid crystal panel 7A, like the cooling gas circulating through liquid crystal panel 4A, is divided at the end of liquid crystal panel 7A in the -Y direction into cooling gas circulating through the space on the light incident side relative to liquid crystal panel 7A and cooling gas circulating through the space on the light exit side relative to liquid crystal panel 7A.

[0120] The cooling gas flowing through the space on the light incident side of the liquid crystal panel 7A flows in the +Y direction to cool the incident-side dustproof substrate 45, and then flows in the +Y direction along the second surface 83A to the first heat dissipation member 88. The first heat dissipation member 88 transfers the heat transferred from the first heat dissipation section 831 to the cooling gas. The cooling gas flowing through the space on the light emission side of the liquid crystal panel 7A flows in the +Y direction to cool the emission side dustproof substrate 48, then cools the clamping member 51, and ultimately cools circuit elements such as the driver circuit 491. In this way, cooling gas flows through the entrance-side dustproof substrate 45, the exit-side dustproof substrate 48, the clamping member 51, and the first heat dissipation member 88, through which the heat of the liquid crystal layer 42 is transferred, and the heat of the liquid crystal layer 42 is thereby transferred to the cooling gas, thereby cooling the liquid crystal layer 42.

[0121] In the liquid crystal panel 7A, the first heat dissipation section 831 is also provided in the +Y direction with respect to the opening 84. Therefore, when the liquid crystal panel 7A is positioned so that the +Y direction is vertically upward, the liquid refrigerant condensed in the first condensation section can be transported to the vaporization section, where heat received by the heat receiving section 821 is transferred not only by capillary force but also by gravity, and the liquid refrigerant is vaporized. This allows the heat transferred from the liquid crystal layer 42 via the counter substrate 44 and the incident-side dustproof substrate 45 to promote the change of the refrigerant from liquid to gas in the vaporization section. In other words, the heat dissipation efficiency of the liquid crystal layer 42, and therefore the cooling efficiency of the liquid crystal layer 42, can be improved.

[0122] [Effects of the fourth embodiment] The projector according to the present embodiment described above can achieve the same effects as the projector 1 according to the first embodiment, and also achieves the following effects: That is, the liquid crystal panel 7A according to the present embodiment achieves the same effects as the liquid crystal panel 4A according to the first embodiment, and also achieves the following effects. The projector according to this embodiment includes a liquid crystal panel 7A as a light modulation device that modulates light emitted from a light source. The liquid crystal panel 7A is a transmissive liquid crystal panel that emits modulated light along the traveling direction of the light incident on the liquid crystal panel. The liquid crystal panel 7A includes a pixel region 41A, a liquid crystal layer 42, an incident portion 43, an exit portion 46, and a main body portion 81A. A plurality of pixels are arranged in the pixel region 41A. The liquid crystal layer 42 modulates light for each of the plurality of pixels. The incident portion 43 causes light to enter the liquid crystal layer 42. The exit portion 46 emits the light modulated by the liquid crystal layer 42 as image light. The main body portion 81A is a vapor chamber constituting the incident-side cooling member 8A. The main body portion 81A has an opening 84, a heat receiving portion 821, and a first heat dissipation portion 831. The opening 84 is provided in the main body portion 81A in accordance with the pixel region 41A. The heat receiving portion 821 is provided around the opening 84. The first heat dissipation portion 831 dissipates heat received by the heat receiving portion 821. The main body 81A vaporizes the liquid refrigerant sealed inside the enclosed space SP provided inside the main body 81A using heat received by the heat receiving section 821, and condenses the gaseous refrigerant into liquid refrigerant by dissipating the heat of the gaseous refrigerant at the first heat dissipation section 831.

[0123] Here, the vapor chamber does not require piping for circulating a refrigerant or wiring for supplying drive power. This configuration simplifies the configuration of the liquid crystal panel 7A compared to cases where a cooling device for circulating a refrigerant is provided or cases where a thermoelectric conversion element such as a Peltier element that transfers heat using electric power is provided. This allows for a more compact projector in which the liquid crystal panel 7A is installed. Furthermore, since the liquid crystal panel 7A can be attached and detached from the projector without attaching and detaching piping and wiring, replacement of the liquid crystal panel 7A can be easily performed. Furthermore, since the heat receiving portion 821 provided around the opening 84 corresponding to the pixel region 41A receives heat, the temperature uniformity in the pixel region 41A can be improved.

[0124] In the liquid crystal panel 7A, the incident portion 43 has a counter substrate 44 that is connected to the liquid crystal layer 42 in a heat-transferable manner and through which light incident on the liquid crystal layer 42 passes. In this embodiment, the counter substrate 44 corresponds to a light-transmitting incident-side substrate. The area of ​​the counter substrate 44 is larger than the area of ​​the pixel region 41A when viewed from the -Z direction. The -Z direction corresponds to the opposite direction to the traveling direction of light incident on the liquid crystal layer 42. The main body portion 81A, which is a vapor chamber, is provided on the counter substrate 44 in a heat-transferable manner. According to this configuration, the main body 81A is provided in a heat-transferable manner on the counter substrate 44 which is connected to the liquid crystal layer 42 in a heat-transferable manner, so that the heat-receiving portion 821 can easily receive heat from the liquid crystal layer 42 via the counter substrate 44. Therefore, the liquid crystal layer 42 can be easily cooled.

[0125] In the liquid crystal panel 7A, the incident section 43 has a common electrode electrically connected to the liquid crystal layer 42, and includes a counter substrate 44 disposed on the light incident side of the liquid crystal layer 42. The common electrode corresponds to the incident side electrode, and the counter substrate 44 corresponds to a light-transmitting incident side electrode substrate. The counter substrate 44 is an incident side substrate on which the main body 81A, which is a vapor chamber, is provided. According to this configuration, the counter substrate 44 is a light-transmitting substrate that is directly connected to the heat-sensitive liquid crystal layer 42. Since the main body portion 81A is provided on such a counter substrate 44, heat generated in the liquid crystal layer 42 can be efficiently transferred to the main body portion 81A. This improves the cooling efficiency of the liquid crystal layer 42.

[0126] In the liquid crystal panel 7A, the incident section 43 includes an incident-side dustproof substrate 45 provided on a light incident surface 441 of the counter substrate 44. The light incident surface 441 corresponds to the surface on the light incident side. The incident-side dustproof substrate 45 has a light incident surface 451, a light exit surface 452, and a side surface 453. The light incident surface 451 corresponds to the surface on the light incident side of the incident-side dustproof substrate 45, and the light exit surface 452 corresponds to the surface on the light exit side of the incident-side dustproof substrate 45. The side surface 453 connects the light incident surface 451 and the light exit surface 452. The heat receiving section 821 receives heat from the light incident surface 441 of the counter substrate 44 and the side surface 453 of the incident-side dustproof substrate 45. According to this configuration, the heat receiving portion 821 receives heat from the counter substrate 44 and the incident-side dustproof substrate 45, and therefore the heat of the liquid crystal layer 42 can be transferred to the heat receiving portion 821 via both the counter substrate 44 and the incident-side dustproof substrate 45. Therefore, the heat of the liquid crystal layer 42 can be efficiently transferred to the heat receiving portion 821, and the cooling efficiency of the liquid crystal layer 42 can be improved.

[0127] In the liquid crystal panel 7A, the counter substrate 44 has, as an incident-side electrode, a common electrode provided in accordance with the pixel region 41A. As described above, in a typical transmissive liquid crystal panel, the counter substrate is disposed on the light incident side of the liquid crystal layer, and the pixel substrate is disposed on the light exit side of the liquid crystal layer. Therefore, by providing a general transmissive liquid crystal panel with the main body 81A having the above-described configuration, that is, the main body 81A that is a vapor chamber, it is possible to configure a liquid crystal panel 7A that achieves the above-described effects.

[0128] The liquid crystal panel 7A includes wiring 49 that supplies image signals that drive the liquid crystal layer 42. A main body portion 81A that is a vapor chamber extends from an opening 84 in the direction in which the wiring 49 extends from the liquid crystal layer 42. With this configuration, the liquid crystal panel 7A can be prevented from increasing in size in the direction in which the wiring 49 extends, compared to when the main body extends from the opening 84 in the opposite direction to the direction in which the wiring 49 extends, for example.

[0129] [First Modification of Fourth Embodiment] In the liquid crystal panel 7A, the side surface 453 of the incident-side dustproof substrate 45 is connected to the inner circumferential surface of the opening 84, which is part of the heat-receiving portion 821, via a thermally conductive adhesive in a manner capable of conducting heat. However, this is not limited to this, and the side surface 453 and the inner circumferential surface of the opening 84 do not have to be connected to each other in a manner capable of conducting heat. As described above, the side surface 453 and the inner circumferential surface of the opening 84 may be connected to each other in a manner capable of conducting heat by a configuration other than a thermally conductive adhesive, for example, a heat transfer member such as a leaf spring. In addition, the configuration is not limited to one in which the entire side surface 453 is connected to the inner circumferential surface of the opening 84 in a manner capable of conducting heat, and only a portion of the side surface 453 may be connected to the inner circumferential surface of the opening 84 in a manner capable of conducting heat.

[0130] [Second Modification of Fourth Embodiment] In the liquid crystal panel 7A, the heat receiving portion 821 of the incident-side cooling member 8A is connected directly to the light incident surface 441 of the counter substrate 44, and is connected to the side surface 453 of the incident-side dustproof substrate 45 via a thermally conductive adhesive or the like so as to be able to transfer heat. However, the present invention is not limited to this, and the heat receiving portion 821 may be connected directly to the incident-side dustproof substrate 45, but not directly to the counter substrate 44. For example, a heat transfer member capable of transferring heat from the counter substrate 44 to the heat receiving portion 821 may be provided between the counter substrate 44 and the heat receiving portion 821.

[0131] FIG. 18 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 7B which is a modification of the liquid crystal panel 7A. For example, the liquid crystal panel 7A may be replaced with a liquid crystal panel 7B shown in FIG. Liquid crystal panel 7B has the same configuration and function as liquid crystal panel 7A, except that it has an incident-side cooling member 8B instead of incident-side cooling member 8A. That is, liquid crystal panel 7B has a panel body 41, wiring 49, a holding housing 50, clamping members 51, and incident-side cooling member 8B.

[0132] The incident-side cooling member 8B includes a main body 81B and a first heat dissipation member 88, and the main body 81B has a first member 82, a second member 83, and an opening 84. The first member 82 has a first surface 82A and a heat receiving portion 821, and the second member 83 has a second surface 83A and a first heat dissipation portion 831. In the incident-side cooling member 8B, a first surface 82A of the first member 82 is not directly connected to the counter substrate 44, but is connected to the counter substrate 44 via the holding housing 50 in a heat-transferable manner. The first surface 82A is also connected to a light incident surface 451 of the incident-side dustproof substrate 45. That is, in the liquid crystal panel 7B, the area of ​​the incident-side dustproof substrate 45 is larger than the area of ​​the opening 84 of the incident-side cooling member 8B when viewed from the direction opposite to the traveling direction of light incident on the liquid crystal layer 42 (the -Z direction). For this reason, the incident-side dustproof substrate 45 is not disposed inside the opening 84, and the main body 81B is provided on the incident-side dustproof substrate 45.

[0133] The heat transferred to the incident-side dustproof substrate 45 is transferred to the first member 82 at the first surface 82A. That is, a part of the heat-receiving portion 821 of the main body 81D is a portion that is connected to the light incident surface 451 of the incident-side dustproof substrate 45 in the first member 82. In addition, heat is transferred from the liquid crystal layer 42 to the holding housing 50 also via the pixel substrate 47, so another part of the heat-receiving portion 821 is a portion that is connected to the counter substrate 44 via the holding housing 50 in a heat-transferable manner. Of the heat generated in the liquid crystal layer 42, the amount of heat transferred to the incident-side dustproof substrate 45 via the opposing substrate 44 is greater than the amount of heat transferred to the holding housing 50 via the opposing substrate 44, so the heat-receiving section 821 does not need to be connected to the holding housing 50 in a manner that allows heat transfer.

[0134] [Effects of the second modified example of the fourth embodiment] The liquid crystal panel 7B as described above has the same effects as the liquid crystal panel 7A, and also has the following effects. In the liquid crystal panel 7B, the incident section 43 includes a counter substrate 44 and an incident-side dustproof substrate 45. The counter substrate 44 has a common electrode electrically connected to the liquid crystal layer 42, and is a light-transmitting incident-side electrode substrate arranged on the light incident side of the liquid crystal layer 42. The common electrode corresponds to the incident-side electrode. The incident-side dustproof substrate 45 is provided on a light incident surface 441 of the counter substrate 44. The light incident surface 441 corresponds to the light incident side surface of the counter substrate 44. The incident-side dustproof substrate 45 is an incident-side substrate on which the main body section 81B, which is a vapor chamber, is provided. According to this configuration, the main body portion 81B is provided to be able to transfer heat to the incident-side dustproof substrate 45, which is provided on the light incident side of the counter substrate 44. This makes it easier to connect the main body portion 81B to the emission portion 46 than when the main body portion 81B is provided on the counter substrate 44 so as to avoid the incident-side dustproof substrate 45. Here, the heat generated in the liquid crystal layer 42 is transferred to the incident-side dustproof substrate 45 via the opposing substrate 44, thereby diffusing the heat of the liquid crystal layer 42. In contrast, the first member 82 of the main body 81B is connected to the light incident surface 451 of the incident-side dustproof substrate 45, which makes it easier to transfer the heat of the liquid crystal layer 42 to the heat-receiving portion 821 of the first member 82.

[0135] In the liquid crystal panel 7B, the main body 81B, which is a vapor chamber, is provided on the light incident surface 451 of the incident-side dustproof substrate 45. The light incident surface 451 corresponds to the surface of the incident-side dustproof substrate 45 on the light incident side. With this configuration, compared to when the incident-side dustproof substrate 45 is placed within an opening 84 corresponding to the pixel area, for example, the main body 81B, which is a vapor chamber, can be easily attached to the incident section 43 even if a tolerance occurs in the main body 81B.

[0136] [Third Modification of Fourth Embodiment] In the liquid crystal panel 7A, the heat receiving portion 821 of the incident-side cooling member 8A is connected to the light incident surface 441 of the counter substrate 44 and the side surface 453 of the incident-side dustproof substrate 45 so as to be heat transferable. In the liquid crystal panel 7B, the heat receiving portion 821 is connected directly to the light incident surface 451 of the incident-side dustproof substrate 45. However, the connection portions of the heat receiving portion 821 with the counter substrate 44 and the incident-side dustproof substrate 45 are not limited to those described above.

[0137] FIG. 19 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 7C which is a modification of the liquid crystal panel 7A. For example, the liquid crystal panel 7A may be replaced with a liquid crystal panel 7C shown in FIG. Liquid crystal panel 7C has the same configuration and functions as liquid crystal panel 7A, except that it has an incident-side cooling member 8C instead of incident-side cooling member 8A. That is, liquid crystal panel 7C has a panel body 41, wiring 49, a holding housing 50, clamping members 51, and incident-side cooling member 8C. Similar to the incident-side cooling member 8A, the incident-side cooling member 8C vaporizes the liquid refrigerant into gaseous refrigerant using heat transferred from the counter substrate 44 and the incident-side dustproof substrate 45, and then radiates the heat received from the gaseous refrigerant to the outside. The incident-side cooling member 8C has the same configuration and function as the incident-side cooling member 8A, except that it includes a main body 81C instead of the main body 81A. That is, the incident-side cooling member 8C includes a main body 81C and a first heat radiation member 88.

[0138] Similar to the main body 81A, the main body 81C includes a first member 82 and a second member 83, and is configured by combining the first member 82 and the second member 83. The first member 82 has a first surface 82A and a heat receiving portion 821, and the second member 83 has a second surface 83A and a first heat dissipation portion 831. The main body 81C has an opening 84C. The opening 84C is a two-step hole similar to the opening 64C, and has a first opening 84C1 provided on the light emission side (+Z direction) and a second opening 84C2 provided on the light incidence side (-Z direction). The inner diameter of the first opening 84C1 is larger than the inner diameter of the second opening 84C2. The entrance-side dustproof substrate 45 is disposed inside the first opening 84C1, and a side surface 453 of the entrance-side dustproof substrate 45 is connected to the inner peripheral surface of the first opening 84C1 via a thermally conductive adhesive or the like so as to be capable of transferring heat.

[0139] The connection portion 84C3 connecting the inner circumferential surface of the first opening 84C1 and the inner circumferential surface of the second opening 84C2 is substantially parallel to a plane orthogonal to the traveling direction (+Z direction) of light passing through the incident-side dustproof substrate 45, and a part of the light incident surface 451 of the incident-side dustproof substrate 45 is connected to the connection portion 84C3 in a heat-transferable manner. In other words, the main body 81C has a step portion formed by the first opening 84C1, the connection portion 84C3, and the second opening 84C2. The inner circumferential surface of the first opening 84C1 corresponds to the inner circumferential surface of the step portion, and the connection portion 84C3 corresponds to the bottom surface of the step portion. In the main body 81C, the connection portions between the opposing substrate 44 and the incident-side dustproof substrate 45 are part of the heat-receiving portion 821. Therefore, the inner circumferential surface of the first opening 84C1 and the connection portion 84C3 are part of the heat-receiving portion 821.

[0140] [Effects of the third modified example of the fourth embodiment] The liquid crystal panel 7C has the same effects as the liquid crystal panels 7A and 7B described above, and also has the following effects. In the liquid crystal panel 7C, the incident-side dustproof substrate 45 has a side surface 453 connecting a light incident surface 451 and a light exit surface 452. The light incident surface 451 corresponds to the light incident side surface of the incident-side dustproof substrate 45, and the light exit surface 452 corresponds to the light exit side surface of the incident-side dustproof substrate 45. The inner circumferential surface of the first opening 84C1 of the main body 81C is connected to at least a part of the side surface 453 of the incident-side dustproof substrate 45 so as to be heat conductive. Furthermore, the connection portion 84C3 of the main body 81C is connected to the light incident surface 451 of the incident-side dustproof substrate 45 so as to be heat conductive. That is, the inner circumferential surface of the first opening 84C1 and the connection portion 84C3 are part of the heat-receiving portion 821. With this configuration, the heat of the liquid crystal layer 42 transferred to the incident-side dustproof substrate 45 can be received by the inner circumferential surface of the first opening 84C1 and the connection portion 84C3. This makes it possible to prevent the size of the liquid crystal panel 7C from increasing in the direction in which light passes (+Z direction) compared to when a main body portion serving as a vapor chamber is provided on the light incident surface 451 of the incident-side dustproof substrate 45.

[0141] In the liquid crystal panel 7C, the heat receiving portion 821 is connected to the counter substrate 44 in a manner that allows heat transfer. With this configuration, heat is transferred to the heat-receiving portion 821 not only from the side surface 453 of the incident-side dustproof substrate 45, but also from the opposing substrate 44. This makes it easier to transfer heat from the liquid crystal layer 42 to the heat-receiving portion 821, thereby improving the cooling efficiency of the liquid crystal layer 42. In the liquid crystal panel 7C, the first member 82 having the heat-receiving portion 821 does not have to be connected to the counter substrate 44 in a manner that allows heat transfer. In this case, the main body portion 81C may be fixed to the incident-side dustproof substrate 45.

[0142] [Fifth embodiment] Next, a fifth embodiment of the present disclosure will be described. The projector according to this embodiment has the same configuration as the projector according to the fourth embodiment, but the position of the first heat dissipation member in the cooling member on the incident side of the liquid crystal panel is different. Note that in the following explanation, parts that are the same or approximately the same as parts already explained will be assigned the same reference numerals and explanations will be omitted.

[0143] FIG. 20 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 7D provided in the projector according to this embodiment. The projector according to this embodiment has the same configuration and functions as the projector 1 according to the first embodiment, except that it has a liquid crystal panel 7D shown in FIG. 20 instead of the liquid crystal panel 7A according to the fourth embodiment. The liquid crystal panel 7D has the same configuration as the liquid crystal panel 7A according to the fourth embodiment, except that it has an incident-side cooling member 8D instead of the incident-side cooling member 8A. That is, the liquid crystal panel 7D has a panel body 41, wiring 49, a holding housing 50, clamping members 51, and the incident-side cooling member 8D.

[0144] Similar to the incident-side cooling member 8A, the incident-side cooling member 8D uses heat from the liquid crystal layer 42 transferred from the counter substrate 44 and the incident-side dustproof substrate 45 to vaporize the liquid refrigerant sealed inside, thereby cooling the liquid crystal layer 42 and radiating the heat received from the gaseous refrigerant. The incident-side cooling member 8D includes a main body 81D and a first heat radiation member 88. The main body 81D includes a first member 82 and a second member 83, and is configured by combining the first member 82 and the second member 83. The main body 81D includes an opening . The main body 81D extends from the opening 84 in the −Y direction, which is the opposite direction to the extension direction of the wiring 49 from the liquid crystal layer 42. Therefore, on the second surface 83A of the second member 83, the first heat dissipation portion 831 is provided in the −Y direction with respect to the opening 84. The first heat dissipation member 88 is provided at a position on the second surface 83A corresponding to the first heat dissipation portion 831. The entrance-side dustproof substrate 45 is disposed inside the opening 84, and the inner peripheral surface of the opening 84 and the side surface 453 of the entrance-side dustproof substrate 45 are connected to each other so as to be able to transfer heat with a thermally conductive adhesive or the like. That is, in the main body 81D, the heat-receiving portion 821 is connected to the light entrance surface 451 of the opposing substrate 44, and is also connected to the side surface 453 of the entrance-side dustproof substrate 45 so as to be able to transfer heat.

[0145] [Flow of cooling gas circulating around the LCD panel] Cooling gas circulated by a fan of a cooling device disposed in exterior housing 2 flows in the +Y direction relative to liquid crystal panel 7D. The cooling gas flowing through the space on the light incident side of the liquid crystal panel 7D flows in the +Y direction to cool the first heat dissipation member 88 and the incident-side dustproof substrate 45, and then cools the holding housing 50. The cooling gas flowing through the space on the light exit side of the liquid crystal panel 7D flows in the +Y direction to cool the exit-side dustproof substrate 48, and then cools the clamping member 51. In this way, in the liquid crystal panel 7D, cooling gas flows through the incident-side dustproof substrate 45, the exit-side dustproof substrate 48, the holding housing 50, the clamping member 51 and the first heat dissipation member 88, so that the heat of the liquid crystal layer 42 is transferred to the cooling gas, thereby cooling the liquid crystal layer 42 and also the driver circuit 491.

[0146] In the liquid crystal panel 7D, the first heat dissipation section 831 and the first heat dissipation member 88 are disposed in the -Y direction with respect to the opening 84. Therefore, when the liquid crystal panel 7D is positioned so that the -Y direction is vertically upward, the liquid refrigerant condensed in the first condensation section corresponding to the first heat dissipation section 831 can be transported by gravity as well as capillary force to the vaporization section corresponding to the connection section with the counter substrate 44 and the connection section with the incident-side dustproof substrate 45 in the heat receiving section 821. This allows the heat transferred from the liquid crystal layer 42 via the counter substrate 44 and the incident-side dustproof substrate 45 to promote the change of the refrigerant from liquid to gas in the vaporization section. In other words, the heat dissipation efficiency of the liquid crystal layer 42, and therefore the cooling efficiency of the liquid crystal layer 42, can be improved.

[0147] [Effects of the fifth embodiment] The projector according to the present embodiment described above can achieve the same effects as the projector according to the fourth embodiment, and also achieves the following effects: That is, the liquid crystal panel 7D according to the present embodiment achieves the same effects as the liquid crystal panel 7A according to the fourth embodiment, and also achieves the following effects. The liquid crystal panel 7D includes wiring 49 that supplies image signals to the liquid crystal layer 42. A main body portion 81D, which is a vapor chamber, extends from an opening 84 in the -Y direction. The -Y direction is the opposite direction to the extension direction of the wiring 49 from the liquid crystal layer 42. According to this configuration, it is possible to prevent the wiring 49 and the main body portion 81D from interfering with each other, and therefore it is possible to prevent the wiring 49 from interfering with heat dissipation by the main body portion 81D.

[0148] [First Modification of Fifth Embodiment] In the liquid crystal panel 7D, the side surface 453 of the incident-side dustproof substrate 45 is connected to the inner circumferential surface of the opening 84, which is part of the heat-receiving portion 821, via a thermally conductive adhesive in a manner capable of conducting heat. However, this is not a limitation, and the side surface 453 and the inner circumferential surface of the opening 84 do not have to be connected to each other in a manner capable of conducting heat. Furthermore, the side surface 453 and the inner circumferential surface of the opening 84 may be connected to each other in a manner capable of conducting heat via a heat transfer member such as a leaf spring. In addition, the configuration is not limited to one in which the entire side surface 453 is connected to the inner circumferential surface of the opening 84 in a manner capable of conducting heat, and only a part of the side surface 453 may be connected to the inner circumferential surface of the opening 84 in a manner capable of conducting heat.

[0149] [Second Modification of Fifth Embodiment] In the liquid crystal panel 7D, the heat receiving portion 821 is connected directly to the light incident surface 441 of the counter substrate 44, and is connected to the side surface 453 of the incident-side dustproof substrate 45 via a thermally conductive adhesive or the like so as to be able to transfer heat. However, the invention is not limited to this, and the heat receiving portion 821 may be connected directly to the incident-side dustproof substrate 45, and not directly to the counter substrate 44. For example, a heat transfer member capable of transferring heat from the counter substrate 44 to the heat receiving portion 821 may be provided between the counter substrate 44 and the heat receiving portion 821.

[0150] FIG. 21 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 7E, which is a modification of the liquid crystal panel 7D. For example, the liquid crystal panel 7D may be replaced with a liquid crystal panel 7E shown in FIG. Liquid crystal panel 7E has the same configuration and function as liquid crystal panel 7D, except that it includes incident-side cooling member 8E instead of incident-side cooling member 8D. That is, liquid crystal panel 7E includes panel body 41, wiring 49, holding housing 50, clamping members 51, and incident-side cooling member 8E. The incident-side cooling member 8E includes a main body 81E and a first heat dissipation member 88. Similar to the main body 81D, the main body 81E has a first member 82, a second member 83, and an opening 84, the first member 82 having a first surface 82A and a heat receiving portion 821, and the second member 83 having a second surface 83A and a first heat dissipation portion 831. Similar to the main body 81D, the main body 81E extends from the opening 84 in the −Y direction, which is the opposite direction to the extension direction of the wiring 49 from the liquid crystal layer 42.

[0151] In the incident-side cooling member 8E, the first surface 82A of the first member 82 is not directly connected to the counter substrate 44, but is heat-transferably connected to the counter substrate 44 via the holding housing 50. The main body 81E is provided on the incident-side dustproof substrate 45, and the first surface 82A is directly connected to the light incident surface 451 of the incident-side dustproof substrate 45. That is, the incident-side cooling member 8E is provided on the incident-side dustproof substrate 45 so that the portion of the first surface 82A surrounding the opening 84 is connected to the light incident surface 451. In other words, a portion of the heat-receiving portion 821 provided around the opening 84 is heat-transferably connected to the light incident surface 451 of the incident-side dustproof substrate 45, and another portion of the heat-receiving portion 821 is heat-transferably connected to the counter substrate 44 via the holding housing 50. Heat is also transferred from the liquid crystal layer 42 to the holding housing 50 via the pixel substrate 47. Of the heat generated in the liquid crystal layer 42, the amount of heat transferred to the incident-side dustproof substrate 45 via the counter substrate 44 is greater than the amount of heat transferred to the holding housing 50 via the counter substrate 44 and the pixel substrate 47. For this reason, the heat-receiving section 821 does not need to be connected to the holding housing 50 in a manner that allows heat transfer. Such a liquid crystal panel 7E has the same effects as the above-described liquid crystal panels 7B and 7D.

[0152] [Third Modification of Fifth Embodiment] In the liquid crystal panel 7D, the heat receiving portion 821 of the incident-side cooling member 8D is connected to the light incident surface 441 of the counter substrate 44 and the side surface 453 of the incident-side dustproof substrate 45 so as to be heat transferable. In the liquid crystal panel 7E, the heat receiving portion 821 is connected directly to the light incident surface 451 of the incident-side dustproof substrate 45. However, the connection portions of the heat receiving portion 821 with the counter substrate 44 and the incident-side dustproof substrate 45 are not limited to those described above.

[0153] FIG. 22 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 7F which is a modification of the liquid crystal panel 7D. For example, the liquid crystal panel 7D may be replaced with a liquid crystal panel 7F shown in FIG. The liquid crystal panel 7F has the same configuration and functions as the liquid crystal panel 7D, except that it has an incident-side cooling member 8F instead of the incident-side cooling member 8D. That is, the liquid crystal panel 7F has a panel body 41, wiring 49, a holding housing 50, clamping members 51, and an incident-side cooling member 8F. Similar to the incident-side cooling member 8D, the incident-side cooling member 8F vaporizes the liquid refrigerant into a gaseous refrigerant using heat transferred from the counter substrate 44 and the incident-side dustproof substrate 45, and then radiates the heat received from the gaseous refrigerant to the outside. The incident-side cooling member 8F has the same configuration and function as the incident-side cooling member 8D, except that it includes a main body 81F instead of the main body 81D. That is, the incident-side cooling member 8F includes a main body 81F and a first heat radiation member 88.

[0154] The main body 81F has a first member 82, a second member 83, and an opening 84C. Similar to the main body 81D, the main body 81F extends from the opening 84C in the −Y direction, which is the opposite direction to the extension direction of the wiring 49 from the liquid crystal layer 42. As shown in the third modified example of the fourth embodiment, the opening 84C is a two-step hole having a first opening 84C1 on the light-emitting side and a second opening 84C2 on the light-incident side. The inner diameter of the first opening 84C1 is larger than the inner diameter of the second opening 84C2, and the incident-side dustproof substrate 45 is disposed inside the first opening 84C1. A side surface 453 of the incident-side dustproof substrate 45 is heat-conductively connected to the inner circumferential surface of the first opening 84C1 via a thermally conductive adhesive or the like. A portion of the light-incident surface 451 of the incident-side dustproof substrate 45 is heat-conductively connected to the connecting portion 84C3. In other words, the main body 81F has a step portion formed by the first opening 84C1, the connecting portion 84C3, and the second opening 84C2. The inner circumferential surface of the first opening 84C1 corresponds to the inner circumferential surface of the step portion, and the connecting portion 84C3 corresponds to the bottom surface of the step portion. In the main body 81F, the connection portions between the opposing substrate 44 and the incident-side dustproof substrate 45 are part of the heat-receiving portion 821. Therefore, the inner circumferential surface of the first opening 84C1 and the connection portion 84C3 are part of the heat-receiving portion 821. Such a liquid crystal panel 7F has the same effects as the above-described liquid crystal panels 7C and 7D. In the liquid crystal panel 7F, similarly to the liquid crystal panel 7C, the first member 82 having the heat-receiving portion 821 does not have to be connected to the counter substrate 44 in a manner that allows heat transfer. In this case, the main body portion 81F may be fixed to the incident-side dustproof substrate 45.

[0155] [Sixth embodiment] Next, a sixth embodiment of the present disclosure will be described. The projector according to this embodiment has a similar configuration to the projector according to the fourth embodiment, but differs in that the main body of the incident-side cooling member of the liquid crystal panel extends from the opening in the extension direction of the wiring 49, and also extends from the opening in the opposite direction to the extension direction of the wiring 49. In the following explanation, parts that are the same or approximately the same as parts already explained will be given the same reference numerals and explanations thereof will be omitted.

[0156] FIG. 23 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 7G provided in the projector according to this embodiment. The projector according to this embodiment has the same configuration and functions as the projector according to the fourth embodiment, except that it has a liquid crystal panel 7G shown in FIG. 23 instead of the liquid crystal panel 7A according to the fourth embodiment. The liquid crystal panel 7G has the same configuration as the liquid crystal panel 7A according to the fourth embodiment, except that it includes an incident-side cooling member 8G instead of the incident-side cooling member 8A. That is, the liquid crystal panel 7G includes a panel main body 41, wiring 49, a holding housing 50, clamping members 51, and the incident-side cooling member 8G. The panel main body 41 includes a liquid crystal layer 42, an incident section 43, and an exit section 46. The incident section 43 includes a counter substrate 44 and an incident-side dustproof substrate 45, and the exit section 46 includes a pixel substrate 47 and an exit-side dustproof substrate 48. The panel main body 41 includes a pixel region 41A defined by the liquid crystal layer 42, the counter substrate 44, and the pixel substrate 47, and a plurality of pixels are arranged in the pixel region 41A.

[0157] The incident-side cooling member 8G further includes a second heat dissipation member 89, and is larger in the +Y direction than the incident-side cooling member 8A, but otherwise has the same configuration as the incident-side cooling member 8A. That is, the incident-side cooling member 8G includes a main body 81G, a first heat dissipation member 88, and a second heat dissipation member 89.

[0158] The main body 81G has a first member 82, a second member 83, and an opening 84. The first member 82 has a first surface 82A and a heat receiving portion 821. The second member 83 has a second surface 83A, a first heat dissipation portion 831, and a second heat dissipation portion 832. The main body 81G is configured by combining a first member 82 and a second member 83. The main body 81G extends from the opening 84 along the +Y direction, which is the extension direction of the wiring 49 from the liquid crystal layer 42, and also extends from the opening 84 along the −Y direction, which is the opposite direction to the extension direction of the wiring 49 from the liquid crystal layer 42. As described above, the first heat dissipation portion 831 is disposed in the +Y direction of the opening 84 on the second member 83. A first heat dissipation member 88 is provided on the second surface 83A of the second member 83 at a position corresponding to the first heat dissipation portion 831. The second heat dissipation portion 832 is disposed in the second member in the −Y direction relative to the opening 84. A second heat dissipation member 89 is provided on the second surface 83A of the second member 83 at a position corresponding to the second heat dissipation portion 832. The second heat dissipation member 89 dissipates the heat transferred from the second heat dissipation section 832 into the cooling gas flowing through the second heat dissipation member 89. The second heat dissipation member 89 may be configured to have, for example, a plurality of fins similar to the plurality of fins 681, or may be configured to have a plurality of fins formed in another shape.

[0159] [Flow of cooling gas circulating around the LCD panel] Cooling gas circulated by a fan of a cooling device disposed in the exterior housing 2 flows in the +Y direction relative to the liquid crystal panel 7G. The cooling gas flowing through the space on the light incident side of the liquid crystal panel 7G flows in the +Y direction and cools the second heat dissipation member 89, the incident-side dustproof substrate 45, and the first heat dissipation member 88 in this order. The cooling gas flowing through the space on the light exit side of the liquid crystal panel 7G flows in the +Y direction to cool the exit-side dustproof substrate 48, and then cools the clamping member 51. In this way, cooling gas flows through the entrance-side dustproof substrate 45, the exit-side dustproof substrate 48, the clamping member 51, the first heat dissipation member 88 and the second heat dissipation member 89 to which the heat of the liquid crystal layer 42 is transferred, and the heat of the liquid crystal layer 42 is transferred to the cooling gas, thereby cooling the liquid crystal layer 42 and the driver circuit 491.

[0160] In the liquid crystal panel 7G, the first heat dissipation section 831 and the first heat dissipation member 88 are provided in the +Y direction with respect to the opening 84, and the second heat dissipation section 832 and the second heat dissipation member 89 are provided in the -Y direction with respect to the opening 84. Therefore, when the liquid crystal panel 7G is positioned so that the +Y direction is vertically upward, the liquid refrigerant condensed in the first condenser corresponding to the first heat dissipation section 831 can be transported by not only capillary force but also gravity to the vaporizers corresponding to the connection portions of the heat receiving section 821 with the counter substrate 44 and the incident-side dustproof substrate 45. When the liquid crystal panel 7G is positioned so that the -Y direction is vertically upward, the liquid refrigerant condensed in the second condenser corresponding to the second heat dissipation section 832 can be transported by not only capillary force but also gravity to the vaporizers corresponding to the connection portions of the heat receiving section 821 with the counter substrate 44 and the incident-side dustproof substrate 45. This allows the heat transferred from the liquid crystal layer 42 via the counter substrate 44 and the incident-side dustproof substrate 45 to promote the transformation of the refrigerant from a liquid to a gas in each vaporizer. This increases the heat dissipation efficiency of the liquid crystal layer 42 and, ultimately, the cooling efficiency of the liquid crystal layer 42.

[0161] [Effects of the sixth embodiment] The projector according to the present embodiment described above has the same effects as the projectors according to the fourth embodiment and the fifth embodiment, and also has the following effects: That is, the liquid crystal panel 7G according to the present embodiment has the same effects as the liquid crystal panel 7A according to the fourth embodiment and the liquid crystal panel 7D according to the fifth embodiment, and also has the following effects. The liquid crystal panel 7G includes wiring 49 that supplies image signals to the liquid crystal layer 42. A main body 81G, which is a vapor chamber, extends from an opening 84 in both the +Y direction and the −Y direction. The +Y direction corresponds to the extension direction of the wiring 49 from the liquid crystal layer 42, and the −Y direction corresponds to the opposite direction to the extension direction of the wiring 49 from the liquid crystal layer 42. This configuration increases the heat dissipation area of ​​the main body 81G for heat received from the gaseous refrigerant, making it easier to condense the gaseous refrigerant into a liquid refrigerant. This allows the liquid refrigerant to flow smoothly through the vaporization section, facilitating the evaporation of the liquid refrigerant by the heat of the liquid crystal layer 42. Furthermore, by positioning the liquid crystal panel 7G so that one of the +Y and -Y directions is vertically upward, the condensed liquid refrigerant can be transported to the vaporization section, which vaporizes the liquid refrigerant, not only by capillary force but also by gravity. This promotes the transformation of the refrigerant from liquid to gas using the heat received by the heat receiving section 821. This therefore improves the heat dissipation efficiency of the liquid crystal layer 42, and ultimately the cooling efficiency of the liquid crystal layer 42.

[0162] [First Modification of Sixth Embodiment] In the liquid crystal panel 7G, the side surface 453 of the incident-side dustproof substrate 45 is connected to the inner circumferential surface of the opening 84, which is part of the heat-receiving portion 821, via a thermally conductive adhesive in a manner capable of conducting heat. However, this is not a limitation, and the side surface 453 and the inner circumferential surface of the opening 84 do not have to be connected to each other in a manner capable of conducting heat. Furthermore, the side surface 453 and the inner circumferential surface of the opening 84 may be connected to each other in a manner capable of conducting heat via a heat transfer member such as a leaf spring. In addition, the configuration is not limited to one in which the entire side surface 453 is connected to the inner circumferential surface of the opening 84 in a manner capable of conducting heat, and only a part of the side surface 453 may be connected to the inner circumferential surface of the opening 84 in a manner capable of conducting heat.

[0163] [Second Modification of Sixth Embodiment] In the liquid crystal panel 7G, the heat receiving portion 821 of the incident-side cooling member 8G is connected directly to the light incident surface 441 of the counter substrate 44, and is connected to the side surface 453 of the incident-side dustproof substrate 45 via a thermally conductive adhesive or the like so as to be able to transfer heat. However, this is not limiting, and the heat receiving portion 821 may be connected directly to the incident-side dustproof substrate 45, but not directly to the counter substrate 44. For example, a heat transfer member capable of transferring heat from the counter substrate 44 to the heat receiving portion 821 may be provided between the counter substrate 44 and the heat receiving portion 821.

[0164] FIG. 24 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 7H, which is a modification of the liquid crystal panel 7G. For example, the liquid crystal panel 7G may be replaced with a liquid crystal panel 7H shown in FIG. The liquid crystal panel 7H has the same configuration and function as the liquid crystal panel 7G, except that it has an incident-side cooling member 8H instead of the incident-side cooling member 8G. That is, the liquid crystal panel 7H has a panel body 41, wiring 49, a holding housing 50, clamping members 51, and the incident-side cooling member 8H. The incident-side cooling member 8H includes a main body 81H, a first heat dissipation member 88, and a second heat dissipation member 89. The main body 81H includes a first member 82, a second member 83, and an opening 84. The first member 82 has a first surface 82A and a heat receiving portion 821. The second member 83 has a second surface 83A, a first heat dissipation portion 831, and a second heat dissipation portion 832. Like the main body 81A, the main body 81H extends from the opening 84 in the +Y direction, which is the extension direction of the wiring 49 from the liquid crystal layer 42, and like the main body 81D, it extends from the opening 84 in the −Y direction, which is the opposite direction to the extension direction of the wiring 49.

[0165] In the incident-side cooling member 8H, the first surface 82A of the first member 82 is not directly connected to the counter substrate 44, but is connected to the counter substrate 44 via the holding housing 50 in a heat-transferable manner. The first surface 82A is also connected to a light incident surface 451 of the incident-side dustproof substrate 45. That is, when viewed from the opposite direction (-Z direction) to the traveling direction of light incident on the liquid crystal layer 42, the area of ​​the incident-side dustproof substrate 45 is larger than the area of ​​the opening 84 of the incident-side cooling member 8H. For this reason, the incident-side dustproof substrate 45 is not disposed inside the opening 84, and the first surface 82A is connected to the light incident surface 451 of the incident-side dustproof substrate 45 at a portion surrounding the opening 84. That is, the incident-side cooling member 8H is provided on the incident-side dustproof substrate 45 so that the portion of the first surface 82A surrounding the opening 84 is connected to the light incident surface 451. In other words, a part of the heat receiving portion 821 provided around the opening 84 is connected to the light incident surface 451 of the incident-side dustproof substrate 45 so as to be heat transferable, another part of the heat receiving portion 821 is connected to the counter substrate 44 via the holding housing 50 so as to be heat transferable, and yet another part of the heat receiving portion 821 is connected to the counter substrate 44 via the holding housing 50 so as to be heat transferable. Then, heat transferred from the liquid crystal layer 42 to the incident-side dustproof substrate 45 via the counter substrate 44 is transferred to the heat receiving portion 821.

[0166] As described above, of the amount of heat generated in the liquid crystal layer 42, the amount of heat transferred to the incident-side dustproof substrate 45 via the opposing substrate 44 is greater than the amount of heat transferred to the holding housing 50 via the opposing substrate 44. For this reason, the heat-receiving section 821 does not need to be connected to the holding housing 50 in a manner that allows heat transfer. Such a liquid crystal panel 7H has the same effects as the above-mentioned liquid crystal panels 7B, 7E, and 7G.

[0167] [Third Modification of Sixth Embodiment] In the liquid crystal panel 7G, the heat receiving portion 821 of the incident-side cooling member 8G is connected to the light incident surface 441 of the counter substrate 44 and the side surface 453 of the incident-side dustproof substrate 45 so as to be heat transferable. In the liquid crystal panel 7H, the heat receiving portion 821 is connected to the light incident surface 451 of the incident-side dustproof substrate 45 so as to be heat transferable. However, the connection portions of the heat receiving portion 821 with the counter substrate 44 and the incident-side dustproof substrate 45 are not limited to those described above.

[0168] FIG. 25 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 7I which is a modification of the liquid crystal panel 7G. For example, the liquid crystal panel 7G may be replaced with a liquid crystal panel 7I shown in FIG. The liquid crystal panel 7I has the same configuration and functions as the liquid crystal panel 7G, except that it has an incident-side cooling member 8I instead of the incident-side cooling member 8G. That is, the liquid crystal panel 7I has a panel body 41, wiring 49, a holding housing 50, clamping members 51, and an incident-side cooling member 8I. Similar to the incident-side cooling member 8G, the incident-side cooling member 8I vaporizes the liquid refrigerant into a gaseous refrigerant using heat transferred from the counter substrate 44 and the incident-side dustproof substrate 45, and then radiates the heat received from the gaseous refrigerant to the outside. The incident-side cooling member 8I has the same configuration and function as the incident-side cooling member 8G, except that it includes a main body 81I instead of the main body 81G. That is, the incident-side cooling member 8I includes a main body 81I, a first heat dissipation member 88, and a second heat dissipation member 89.

[0169] Similar to the main body 81G, the main body 81I includes a first member 82 and a second member 83, and is configured by combining the first member 82 and the second member 83. The main body 81I is provided on the counter substrate 44 so that the first surface 82A of the first member 82 is in contact with the light incident surface 441 of the counter substrate 44. That is, a portion of the heat receiving portion 821 of the main body 81I is connected to the counter substrate 44 in a manner capable of transferring heat.

[0170] The main body 81I has an opening 84C. As shown in the third modified example of the fourth embodiment, the opening 84C is a two-step hole having a first opening 84C1 on the light-emitting side and a second opening 84C2 on the light-incident side. The entrance-side dustproof substrate 45 is disposed inside the first opening 84C1, and a side surface 453 of the entrance-side dustproof substrate 45 is heat-conductively connected to the inner circumferential surface of the first opening 84C1 via a thermally conductive adhesive or the like. A portion of the light-incident surface 451 of the entrance-side dustproof substrate 45 is heat-conductively connected to the connecting portion 84C3. In other words, the main body 81I has a step portion formed by the first opening 84C1, the connecting portion 84C3, and the second opening 84C2. The inner circumferential surface of the first opening 84C1 corresponds to the inner circumferential surface of the step portion, and the connecting portion 84C3 corresponds to the bottom surface of the step portion. In the main body 81I, the connection portions between the opposing substrate 44 and the incident-side dustproof substrate 45 are part of the heat-receiving portion 821. Therefore, the inner circumferential surface of the first opening 84C1 and the connection portion 84C3 are part of the heat-receiving portion 821. Like main body portion 81G, main body portion 81I extends from opening 84C in the +Y direction, which is the extension direction of wiring 49 from liquid crystal layer 42, and also extends from opening 84C in the −Y direction, which is the opposite direction to the extension direction of wiring 49 from liquid crystal layer 42. First heat dissipation portion 831 and first heat dissipation member 88 are provided on second surface 83A in the +Y direction with respect to opening 84C, and second heat dissipation portion 832 and second heat dissipation member 89 are provided on second surface 83A in the −Y direction with respect to opening 84C.

[0171] Such a liquid crystal panel 7I has the same effects as the above-described liquid crystal panels 7C, 7F, and 7G. In the liquid crystal panel 7I, similarly to the liquid crystal panels 7C and 7F, the first member 82 having the heat-receiving portion 821 does not have to be connected to the counter substrate 44 in a manner that allows heat transfer. In this case, the main body portion 81C may be fixed to the incident-side dustproof substrate 45.

[0172] [Seventh embodiment] Next, a seventh embodiment of the present disclosure will be described. The projector according to this embodiment has the same configuration as the projector according to the first embodiment, but differs in that the liquid crystal panel has an entrance-side cooling member and an exit-side cooling member. Note that in the following explanation, parts that are the same or substantially the same as parts already explained will be assigned the same reference numerals and explanations thereof will be omitted.

[0173] FIG. 26 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 9A provided in the projector according to this embodiment. The projector according to this embodiment has the same configuration as the projector 1 according to the first embodiment, except that it has a liquid crystal panel 9A shown in FIG. 26 instead of the liquid crystal panel 4A according to the first embodiment. The liquid crystal panel 9A includes an incident-side cooling member 8A in addition to the configuration of the liquid crystal panel 4A according to the first embodiment. In other words, the liquid crystal panel 9A includes an exit-side cooling member 6A in addition to the configuration of the liquid crystal panel 7A according to the fourth embodiment. That is, the liquid crystal panel 9A includes a panel main body 41, wiring 49, a holding housing 50, an exit-side cooling member 6A, and an incident-side cooling member 8A. As described in the first embodiment, the panel main body 41 includes a liquid crystal layer 42, an incident section 43, and an exit section 46. The incident section 43 includes a counter substrate 44 and an incident-side dustproof substrate 45, and the exit section 46 includes a pixel substrate 47 and an exit-side dustproof substrate 48.

[0174] In this embodiment, the incident-side dustproof substrate 45 corresponds to the first dustproof substrate, and the exit-side dustproof substrate corresponds to the second dustproof substrate. The main body 81A constituting the incident-side cooling member 8A corresponds to the first vapor chamber, and the first member 82, second member 83, and opening 84 constituting the main body 81A correspond to the first heat receiving portion, the first heat dissipation portion, and the first opening. When viewed from the incident side (-Z direction) of light incident on the liquid crystal layer 42, the main body 81A extends outward beyond the counter substrate 44 and the incident-side dustproof substrate 45.

[0175] The main body 61A constituting the output-side cooling member 6A corresponds to the second vapor chamber, and the first member 62, the second member 63 and the opening 64 constituting the main body 61A correspond to the second heat receiving portion, the second heat dissipation portion and the second opening. When viewed from the output side (+Z direction) of the light emitted from the liquid crystal layer 42, the main body 61A extends outward beyond the pixel substrate 47 and the output-side dustproof substrate 48. The main body portion 81A and the main body portion 61A face each other in the incident direction of light to the liquid crystal layer 42 (the +Z direction).

[0176] In the liquid crystal panel 9A, a portion of the heat-receiving portion 621 of the output-side cooling member 6A is connected to the light output surface 472 of the pixel substrate 47 constituting the panel body 41 in a heat-transferable manner, and the inner circumferential surface of the opening 64 of the output-side cooling member 6A is connected to the side surface 483 of the output-side dustproof substrate 48 via a thermally conductive adhesive or the like in a heat-transferable manner. The inner circumferential surface of the opening 64 is part of the heat-receiving portion 621. The output-side cooling member 6A may be provided on the pixel substrate 47 or on the output-side dustproof substrate 48. In the liquid crystal panel 9A, a portion of the heat receiving portion 821 of the incident-side cooling member 8A is connected to the light incident surface 441 of the counter substrate 44 constituting the panel body 41 in a heat-transferable manner, and the inner peripheral surface of the opening 84 of the incident-side cooling member 8A is connected to the side surface 453 of the incident-side dustproof substrate 45 via a thermally conductive adhesive or the like in a heat-transferable manner. The inner peripheral surface of the opening 84 is part of the heat receiving portion 821. The incident-side cooling member 8A may be provided on the counter substrate 44 or on the incident-side dustproof substrate 45.

[0177] In the liquid crystal panel 9A, cooling gas flows from a cooling device along the +Y direction, similar to the liquid crystal panels 4A to 4I and 7A to 7I described above. The cooling gas flowing through the space on the light incident side of the liquid crystal panel 9A flows in the +Y direction to cool the incident-side dustproof substrate 45 and the first heat dissipation member 88. The cooling gas flowing through the space on the light exit side of the liquid crystal panel 9A flows in the +Y direction to cool the exit-side dustproof substrate 48 and the first heat dissipation member 68. In this way, in the liquid crystal panel 9A, the heat of the liquid crystal layer 42 is dissipated to the outside of the liquid crystal panel 9A by the incident-side dustproof substrate 45, the exit-side dustproof substrate 48, the exit-side cooling member 6A, and the incident-side cooling member 8A, thereby cooling the liquid crystal layer 42 and also the driver circuit 491.

[0178] [Effects of the Seventh Embodiment] The projector according to the present embodiment described above has the same effects as the projector 1 according to the first embodiment and the projector according to the fourth embodiment. That is, the liquid crystal panel 9A according to the present embodiment can have the same effects as the liquid crystal panel 4A according to the first embodiment and the liquid crystal panel 7A according to the fourth embodiment. Specifically, the liquid crystal panel 9A is a transmissive liquid crystal panel that emits modulated light along the traveling direction of light incident on the liquid crystal panel. The liquid crystal panel 9A includes a pixel region 41A, a liquid crystal layer 42, a counter substrate 44, an incident-side dustproof substrate 45, a pixel substrate 47, an exit-side dustproof substrate 48, and main body portions 61A and 81A. A plurality of pixels are arranged in the pixel region 41A. The liquid crystal layer 42 modulates light for each of the plurality of pixels, and the counter substrate 44 has a common electrode provided corresponding to the pixel region. The pixel substrate 47 has a plurality of pixel electrodes provided corresponding to each of the plurality of pixels, and supports the liquid crystal layer 42 between itself and the counter substrate 44. The incident-side dustproof substrate 45 corresponds to a first dustproof substrate and is provided on the surface of the counter substrate 44 opposite to the pixel substrate 47. The exit-side dustproof substrate 48 corresponds to a second dustproof substrate and is provided on the surface of the pixel substrate 47 opposite to the counter substrate 44.

[0179] The main body 81A corresponds to a first vapor chamber and has an opening 84 as a first opening, a heat receiving portion 821 as a first heat receiving portion, and a first heat dissipation portion 831 as a first heat dissipation portion. The opening 84 is an opening corresponding to the pixel region 41A. The heat receiving portion 821 is provided around the opening 84 and is connected to at least one of the counter substrate 44 and the incident-side dustproof substrate 45 so as to be heat transferable. The first heat dissipation portion 831 dissipates heat received by the heat receiving portion 821. The main body 81A vaporizes the liquid refrigerant sealed inside by the heat received by the heat receiving portion 821, and condenses the liquid refrigerant into gaseous refrigerant by dissipating the heat of the gaseous refrigerant by the first heat dissipation portion 831. The refrigerant sealed in the sealed space SP of the main body 81A corresponds to the first refrigerant.

[0180] The main body 61A corresponds to the second vapor chamber and has an opening 64 as a second opening, a heat receiving portion 621 as a second heat receiving portion, and a first heat dissipation portion 631 as a second heat dissipation portion. The opening 64 corresponds to the pixel region 41A. The heat receiving portion 621 is provided around the opening 64 and is connected to at least one of the pixel substrate 47 and the output-side dustproof substrate 48 in a heat-transferable manner. The first heat dissipation portion 631 dissipates heat received by the heat receiving portion 621. The main body 61A vaporizes the liquid refrigerant sealed inside by the heat received by the heat receiving portion 621, and condenses the liquid refrigerant into gaseous refrigerant by dissipating the heat of the gaseous refrigerant by the first heat dissipation portion 631. The refrigerant sealed in the enclosed space SP of the main body 61A corresponds to the second refrigerant.

[0181] This configuration can achieve the same effects as the liquid crystal panels 4A and 7A. Furthermore, the liquid crystal panel 9A includes a main body portion 81A that is heat-transferably connected to at least one of the counter substrate 44 and the incident-side dustproof substrate 45, and a main body portion 61A that is heat-transferably connected to at least one of the pixel substrate 47 and the exit-side dustproof substrate 48, thereby further improving the cooling efficiency of the liquid crystal layer 42.

[0182] In the liquid crystal panel 9A, the main body 81A serving as a first vapor chamber extends outward beyond the counter substrate 44 and the incident-side dustproof substrate 45 when viewed from the incident side of light entering the liquid crystal layer 42. The main body 61A serving as a second vapor chamber extends outward beyond the pixel substrate 47 and the output-side dustproof substrate 48 when viewed from the output side of light exiting the liquid crystal layer 42. The main body 81A and the main body 61A face each other in the direction of incidence of light to the liquid crystal layer 42. According to this configuration, the liquid crystal panel 9A can be prevented from becoming larger than when the main body portion 81A and the main body portion 61A do not face each other.

[0183] [First Modification of Seventh Embodiment] In the liquid crystal panel 9A, the side surface 453 of the entrance-side dustproof substrate 45 is connected to the inner circumferential surface of the opening 84, which is part of the heat-receiving portion 821, in the main body 81A of the entrance-side cooling member 8A via a thermally conductive adhesive, so as to be heat transferable. Also, the side surface 483 of the exit-side dustproof substrate 48 is connected to the inner circumferential surface of the opening 64, which is part of the heat-receiving portion 621, in the main body 61A of the exit-side cooling member 6A via a thermally conductive adhesive. However, this is not limiting, and at least one of the side surfaces 453 of the entrance-side dustproof substrate 45 and the side surface 483 of the exit-side dustproof substrate 48 does not have to be connected to the inner circumferential surface of the corresponding opening, either the opening 84 of the entrance-side cooling member 8A or the opening 64 of the exit-side cooling member 6A, so as to be heat transferable. Furthermore, at least one of the side surface 453 of the entrance-side dustproof substrate 45 and the side surface 483 of the exit-side dustproof substrate 48 may be connected to the inner circumferential surface of the corresponding opening, either the opening 84 of the entrance-side cooling member 8A or the opening 64 of the exit-side cooling member 6A, via a heat transfer member such as a leaf spring. In addition, as described above, a portion of the side surface 453 may be connected to the inner circumferential surface of the opening 84 in a heat-transferable manner, or a portion of the side surface 483 may be connected to the inner circumferential surface of the opening 64 in a heat-transferable manner.

[0184] [Second Modification of Seventh Embodiment] In the liquid crystal panel 9A, the exit-side cooling member 6A is used as the exit-side cooling member, and the entrance-side cooling member 8A is used as the entrance-side cooling member. However, this is not a limitation, and the configurations of the entrance-side cooling member and the exit-side cooling member are not limited to those described above. For example, the liquid crystal panel may be configured to include one of the exit-side cooling members 6A-6I as the exit-side cooling member and one of the entrance-side cooling members 8A-8I as the entrance-side cooling member. In this case, the exit-side cooling member may be configured so that its main body portion extends outward beyond the pixel substrate 47 and the exit-side dustproof substrate 48 when viewed from the exit side (+Z direction) of light emitted from the liquid crystal layer 42. Furthermore, the entrance-side cooling member may be configured so that its main body portion extends outward beyond the counter substrate 44 and the entrance-side dustproof substrate 45 when viewed from the entrance side (-Z direction) of light incident on the liquid crystal layer 42. The exit-side cooling member and the entrance-side cooling member may be arranged so that the main body of the exit-side cooling member and the main body of the entrance-side cooling member face each other in the incident direction of light to the liquid crystal layer 42 (+Z direction).

[0185] FIG. 27 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 9B, which is a modification of the liquid crystal panel 9A. For example, the liquid crystal panel 9B shown in FIG. 27 may be used in place of the liquid crystal panel 9A. The liquid crystal panel 9B has a configuration that combines the liquid crystal panel 4B shown in the second modified example of the first embodiment and the liquid crystal panel 7B shown in the second modified example of the fourth embodiment. That is, the liquid crystal panel 9B includes a panel main body 41, wiring 49, a holding housing 50, a clamping member 51, an exit-side cooling member 6B, and an entrance-side cooling member 8B.

[0186] In the liquid crystal panel 9B, the output-side cooling member 6B is provided on the output-side dustproof substrate 48 so that the heat-receiving portion 621 provided around the opening 64 is connected to the light output surface 482. Another part of the heat-receiving portion 621 is connected to the pixel substrate 47 via the clamping member 51 in a manner that allows heat transfer. In the liquid crystal panel 9B, the incident-side cooling member 8B is provided on the incident-side dustproof substrate 45 so that the heat-receiving portion 821 provided around the opening 84 is connected to the light incident surface 451. Another part of the heat-receiving portion 821 is connected to the counter substrate 44 via the holding housing 50 so as to be capable of transferring heat. The heat receiving portion 621 does not have to be connected to the clamping member 51 so as to be able to transfer heat therethrough, and the heat receiving portion 821 does not have to be connected to the holding housing 50 so as to be able to transfer heat therethrough. Such a liquid crystal panel 9B provides the same effects as the liquid crystal panels 4B, 7B, and 9A.

[0187] [Third Modification of Seventh Embodiment] FIG. 28 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 9C which is a modification of the liquid crystal panel 9A. For example, instead of the liquid crystal panel 9A, a liquid crystal panel 9C shown in FIG. 28 may be used. Liquid crystal panel 9C has a configuration that combines liquid crystal panel 4C shown in the third modified example of Embodiment 1 and liquid crystal panel 7C shown in the third modified example of Embodiment 4. That is, liquid crystal panel 9C includes panel main body 41, wiring 49, holding housing 50, clamping members 51, exit-side cooling member 6C, and entrance-side cooling member 8C.

[0188] In the liquid crystal panel 9C, the output-side dustproof substrate 48 is disposed within a first opening 64C1 of the output-side cooling member 6C. The inner edge of the first opening 64C1 is connected to a side surface 483 of the output-side dustproof substrate 48, and the connection portion 64C3 is connected to a part of the light output surface 482 of the output-side dustproof substrate 48. In addition, the heat-receiving portion 621 of the first member 62 is connected to the pixel substrate 47. In the liquid crystal panel 9C, the incident-side dustproof substrate 45 is disposed within a first opening 84C1 of the incident-side cooling member 8C. The inner edge of the first opening 84C1 is connected to a side surface 453 of the incident-side dustproof substrate 45, and the connection portion 84C3 is connected to a part of the light incident surface 451 of the incident-side dustproof substrate 45. In addition, the heat receiving portion 821 of the first member 82 is connected to the pixel substrate 47 via the holding housing 50 so as to be able to transfer heat. The heat receiving portion 621 does not have to be connected to the clamping member 51 so as to be able to transfer heat therethrough, and the heat receiving portion 821 does not have to be connected to the holding housing 50 so as to be able to transfer heat therethrough. Such a liquid crystal panel 9C has the same effects as the liquid crystal panels 4C, 7C, and 9A.

[0189] [Fourth Modification of Seventh Embodiment] FIG. 29 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 9D which is a modification of the liquid crystal panel 9A. For example, a liquid crystal panel 9D shown in FIG. 29 may be used in place of the liquid crystal panel 9A. The liquid crystal panel 9D has a configuration that combines the liquid crystal panel 4D shown in the second embodiment and the liquid crystal panel 7D shown in the fifth embodiment. That is, the liquid crystal panel 9D includes a panel body 41, wiring 49, a holding housing 50, an exit-side cooling member 6D, and an entrance-side cooling member 8D. In addition, the main body 61D of the exit side cooling member 6D extends from the opening 64 in the -Y direction, which is the opposite direction to the extension direction of the wiring 49 from the liquid crystal layer 42, and the main body 81D of the entrance side cooling member 8D extends from the opening 84 in the -Y direction, which is the opposite direction to the extension direction of the wiring 49 from the liquid crystal layer 42.

[0190] In the liquid crystal panel 9D, the heat receiving portion 621 of the output-side cooling member 6D is connected to the light output surface 472 of the pixel substrate 47. The output-side dustproof substrate 48 is disposed inside the opening 64, and the side surface 483 of the output-side dustproof substrate 48 is connected to the inner circumferential surface of the opening 64 of the output-side cooling member 6G via a thermally conductive adhesive or the like so as to be able to transfer heat. The inner circumferential surface of the opening 64 is part of the heat receiving portion 621. The main body portion 61D of the output-side cooling member 6D may be provided on the pixel substrate 47 or on the output-side dustproof substrate 48. In the liquid crystal panel 9D, the heat receiving portion 821 of the incident-side cooling member 8D is connected to the light incident surface 441 of the counter substrate 44. The incident-side dustproof substrate 45 is disposed inside the opening 84, and the side surface 453 of the incident-side dustproof substrate 45 is connected to the inner circumferential surface of the opening 84 of the incident-side cooling member 8D via a thermally conductive adhesive or the like so as to be heat transferable. The inner circumferential surface of the opening 84 is part of the heat receiving portion 821. The main body portion 81D of the incident-side cooling member 8D may be provided on the counter substrate 44 or on the incident-side dustproof substrate 45.

[0191] In the liquid crystal panel 9D, cooling gas flows from a cooling device along the +Y direction, similar to the liquid crystal panels 4A to 4I and 7A to 7I described above. The cooling gas flowing through the space on the light incident side of the liquid crystal panel 9D flows in the +Y direction to cool the first heat dissipation member 88 and the incident-side dustproof substrate 45 in that order, and then cools the holding housing 50. The cooling gas flowing through the space on the light exit side of the liquid crystal panel 9D flows in the +Y direction to cool the first heat dissipation member 68 and the exit-side dustproof substrate 48 in that order, and then cools the sandwiching member 51. In this way, in the liquid crystal panel 9D, the heat of the liquid crystal layer 42 is dissipated to the outside of the liquid crystal panel 9D by the incident-side dustproof substrate 45, the exit-side dustproof substrate 48, the exit-side cooling member 6D, and the incident-side cooling member 8D, thereby cooling the liquid crystal layer 42 and also the driver circuit 491. Such a liquid crystal panel 9D provides the same effects as the liquid crystal panels 4D, 7D, and 9A.

[0192] [Fifth Modification of Seventh Embodiment] FIG. 30 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 9E, which is a modification of the liquid crystal panel 9A. For example, instead of the liquid crystal panel 9A, a liquid crystal panel 9E shown in FIG. 30 may be used. The liquid crystal panel 9E has a configuration that combines the liquid crystal panel 4E shown in the second modified example of the second embodiment and the liquid crystal panel 7E shown in the second modified example of the fifth embodiment. That is, the liquid crystal panel 9E includes a panel main body 41, wiring 49, a holding housing 50, a clamping member 51, an exit-side cooling member 6E, and an entrance-side cooling member 8E.

[0193] In the liquid crystal panel 9E, the main body 61E of the output-side cooling member 6E is provided on the output-side dustproof substrate 48 so that a portion of the heat-receiving portion 621 provided around the opening 64 on the first surface 62A is connected to the light output surface 482. Another portion of the heat-receiving portion 621 is connected to the pixel substrate 47 via the clamping member 51 in a manner capable of conducting heat. In the liquid crystal panel 9E, the main body 81E of the incident-side cooling member 8E is provided on the incident-side dustproof substrate 45 so that a portion of the heat-receiving portion 821 provided around the opening 84 on the first surface 82A is connected to the light incident surface 451. Another portion of the heat-receiving portion 821 is connected to the counter substrate 44 via the holding housing 50 so as to be capable of thermal transfer. The heat receiving portion 621 does not have to be connected to the clamping member 51 so as to be able to transfer heat therethrough, and the heat receiving portion 821 does not have to be connected to the holding housing 50 so as to be able to transfer heat therethrough. Such a liquid crystal panel 9E has the same effects as the liquid crystal panels 4E, 7E, and 9D.

[0194] [Sixth Modification of Seventh Embodiment] FIG. 31 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 9F which is a modification of the liquid crystal panel 9A. For example, a liquid crystal panel 9F shown in FIG. 31 may be used in place of the liquid crystal panel 9A. The liquid crystal panel 9F has a configuration that combines the liquid crystal panel 4F shown in the third modified example of the second embodiment and the liquid crystal panel 7F shown in the third modified example of the fifth embodiment. That is, the liquid crystal panel 9F includes a panel main body 41, wiring 49, a holding housing 50, a clamping member 51, an exit-side cooling member 6F, and an entrance-side cooling member 8F.

[0195] In the liquid crystal panel 9F, the output-side dustproof substrate 48 is disposed within the first opening 64C1 of the output-side cooling member 6I. The inner circumferential surface of the first opening 64C1 is connected to the side surface 483 of the output-side dustproof substrate 48 so as to be able to transfer heat, and the connection portion 64C3 is connected to a part of the light output surface 482 of the output-side dustproof substrate 48. The heat-receiving portion 621 is connected to the pixel substrate 47. However, the heat-receiving portion 621 does not necessarily have to be connected to the pixel substrate 47. In the liquid crystal panel 9F, the incident-side dustproof substrate 45 is disposed within a first opening 84C1 of the incident-side cooling member 8F. The inner peripheral surface of the first opening 84C1 is connected to a side surface 453 of the incident-side dustproof substrate 45 so as to be able to transfer heat, and the connection portion 84C3 is connected to a part of the light incident surface 451 of the incident-side dustproof substrate 45. In addition, the heat-receiving portion 821 is connected to the pixel substrate 47 via the holding housing 50 so as to be able to transfer heat. The heat receiving portion 621 does not have to be connected to the clamping member 51 so as to be able to transfer heat therethrough, and the heat receiving portion 821 does not have to be connected to the holding housing 50 so as to be able to transfer heat therethrough. Such a liquid crystal panel 9F has the same effects as the liquid crystal panels 4F, 7F, and 9D.

[0196] [Seventh Modification of Seventh Embodiment] FIG. 32 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 9G, which is a modification of the liquid crystal panel 9A. For example, a liquid crystal panel 9G shown in FIG. 32 may be used in place of the liquid crystal panel 9A. The liquid crystal panel 9G has a configuration that combines the liquid crystal panel 4G shown in the third embodiment and the liquid crystal panel 7G shown in the sixth embodiment. That is, the liquid crystal panel 9G includes a panel body 41, wiring 49, a holding housing 50, a clamping member 51, an exit-side cooling member 6G, and an entrance-side cooling member 8G.

[0197] In the liquid crystal panel 9G, the heat receiving portion 621 of the output-side cooling member 6G is connected to the light output surface 472 of the pixel substrate 47 in a heat-transferable manner. The output-side dustproof substrate 48 is disposed inside the opening 64 of the output-side cooling member 6G, and the side surface 483 is connected to the inner circumferential surface of the opening 64 via a thermally conductive adhesive or the like in a heat-transferable manner. The main body portion 61G of the output-side cooling member 6G may be provided on the pixel substrate 47 or on the output-side dustproof substrate 48. In the liquid crystal panel 9G, the heat receiving portion 821 of the incident-side cooling member 8G is connected to the light incident surface 441 of the counter substrate 44 in a manner allowing heat transfer. The incident-side dustproof substrate 45 is disposed inside the opening 84 of the incident-side cooling member 8G, and the side surface 453 is connected to the inner peripheral surface of the opening 84 via a thermally conductive adhesive or the like in a manner allowing heat transfer. The main body portion 81G of the incident-side cooling member 8G may be provided on the counter substrate 44 or on the incident-side dustproof substrate 45.

[0198] In the liquid crystal panel 9G, cooling gas flows from a fan of a cooling device along the +Y direction, similar to the liquid crystal panels 4A to 4I and 7A to 7I described above. The cooling gas flowing through the space on the light incident side of the liquid crystal panel 9G flows in the +Y direction and cools the second heat dissipation member 89, the incident-side dustproof substrate 45, and the first heat dissipation member 88 in this order. The cooling gas flowing through the space on the light exit side of the liquid crystal panel 9G flows in the +Y direction and cools the second heat dissipation member 69, the exit-side dustproof substrate 48, and the first heat dissipation member 68 in this order. In this way, in the liquid crystal panel 9G, the heat of the liquid crystal layer 42 is dissipated to the outside of the liquid crystal panel 9G by the incident-side dustproof substrate 45, the exit-side dustproof substrate 48, the exit-side cooling member 6G, and the incident-side cooling member 8G, thereby cooling the liquid crystal layer 42 and also the driver circuit 491. Such a liquid crystal panel 9G provides the same effects as the liquid crystal panels 4G, 7G, and 9A.

[0199] [Eighth Modification of Seventh Embodiment] FIG. 33 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 9H, which is a modification of the liquid crystal panel 9A. For example, the liquid crystal panel 9A may be replaced with a liquid crystal panel 9H shown in FIG. The liquid crystal panel 9H has a configuration that combines the liquid crystal panel 4H shown in the second modified example of the third embodiment and the liquid crystal panel 7H shown in the second modified example of the sixth embodiment. That is, the liquid crystal panel 9H includes a panel main body 41, wiring 49, a holding housing 50, a clamping member 51, an exit-side cooling member 6H, and an entrance-side cooling member 8H.

[0200] In the liquid crystal panel 9H, the main body 61H of the output-side cooling member 6H is provided on the output-side dustproof substrate 48, and the heat-receiving portion 621 provided around the opening 64 on the first surface 62A is connected to the light output surface 482 of the output-side dustproof substrate 48. Another part of the heat-receiving portion 621 is connected to the pixel substrate 47 via the clamping member 51 so as to be heat transferable. In the liquid crystal panel 9H, the main body 81H of the incident-side cooling member 8E is provided on the incident-side dustproof substrate 45, and the heat-receiving portion 821 provided around the opening 84 on the first surface 82A is connected to the light incident surface 451 of the incident-side dustproof substrate 45. Another part of the heat-receiving portion 821 is connected to the counter substrate 44 via the holding housing 50 so as to be able to transfer heat. The heat receiving portion 621 does not have to be connected to the clamping member 51 so as to be able to transfer heat therethrough, and the heat receiving portion 821 does not have to be connected to the holding housing 50 so as to be able to transfer heat therethrough. Such a liquid crystal panel 9H has the same effects as the liquid crystal panels 4H, 7H, and 9G.

[0201] [Ninth Modification of Seventh Embodiment] FIG. 34 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 9I, which is a modification of the liquid crystal panel 9A. For example, instead of the liquid crystal panel 9A, a liquid crystal panel 9I shown in FIG. 34 may be used. The liquid crystal panel 9I has a configuration in which the liquid crystal panel 4I shown in the third modified example of the third embodiment and the liquid crystal panel 7I shown in the third modified example of the sixth embodiment are combined. That is, the liquid crystal panel 9I includes a panel main body 41, wiring 49, a holding housing 50, clamping members 51, an exit-side cooling member 6I, and an entrance-side cooling member 8I.

[0202] In the liquid crystal panel 9I, the output-side dustproof substrate 48 is disposed within a first opening 64C1 of the output-side cooling member 6F. The inner circumferential surface of the first opening 64C1 is connected to a side surface 483 of the output-side dustproof substrate 48, and the connection portion 64C3 is connected to part of the light output surface 482 of the output-side dustproof substrate 48. The inner circumferential surface of the first opening 64C1 and the connection portion 64C3 form part of a heat-receiving portion 621. The heat-receiving portion 621 is also connected to the pixel substrate 47. In the liquid crystal panel 9I, the incident-side dustproof substrate 45 is disposed within a first opening 84C1 of the incident-side cooling member 8F. The inner circumferential surface of the first opening 84C1 is connected to a side surface 453 of the incident-side dustproof substrate 45, and the connection portion 84C3 is connected to a part of the light incident surface 451 of the incident-side dustproof substrate 45. The inner circumferential surface of the first opening 84C1 and the connection portion 84C3 form a part of a heat-receiving portion 821. The heat-receiving portion 821 is also connected to the counter substrate 44 and the pixel substrate 47 via the holding housing 50 in a manner that allows heat transfer. The heat receiving portion 621 does not have to be connected to the clamping member 51 so as to be able to transfer heat therethrough, and the heat receiving portion 821 does not have to be connected to the holding housing 50 so as to be able to transfer heat therethrough. Such a liquid crystal panel 9I has the same effects as the liquid crystal panels 4I, 7I, and 9G.

[0203] [Tenth Modification of Seventh Embodiment] In the liquid crystal panel 9A, the main body portion 81A serving as the first vapor chamber of the incident-side cooling member 8A and the main body portion 61A serving as the second vapor chamber of the output-side cooling member 6A are opposed to each other in the direction of travel of light incident on the liquid crystal layer 42. However, this is not limiting, and the main body portion 81A and the main body portion 61A do not have to be opposed to each other in the direction of travel of light incident on the liquid crystal layer 42. The same applies to a liquid crystal panel including one of the output-side cooling members 6A-6I and one of the input-side cooling members 8A-8I.

[0204] Fig. 35 is a schematic diagram of a liquid crystal panel 9J, which is a variation of the liquid crystal panel 9G, viewed from the light incident side of the liquid crystal layer 42. In other words, Fig. 35 is a diagram showing the arrangement of a main body 61G of the exit-side cooling member 6G and a main body 81G of the entrance-side cooling member 8G in the liquid crystal panel 9J. For example, instead of the liquid crystal panel 9A, a liquid crystal panel 9J shown in FIG. 35 may be used. Like the liquid crystal panel 9G, the liquid crystal panel 9J includes a panel body 41, wiring 49, a holding housing 50 (not shown), an exit side cooling member 6G, and an entrance side cooling member 8G.

[0205] In the liquid crystal panel 9J, a main body 61G constituting the output-side cooling member 6G is inclined with respect to both the +Y and +X directions so that it is positioned in the +X direction from the end of the main body 61G in the -Y direction toward the +Y direction. Therefore, in the example of Fig. 35, the first heat dissipation member 68 of the output-side cooling member 6G is disposed in a position in the +X and +Y directions with respect to the pixel region 41A, and the second heat dissipation member 69 is disposed in a position from the -X direction to the -Y direction with respect to the pixel region 41A. The first heat dissipation member 68 and the second heat dissipation member 69 are arranged in accordance with the first heat dissipation section 631 and the second heat dissipation section 632 so that the flow paths provided in the first heat dissipation member 68 and the second heat dissipation member 69 are aligned along the +Y direction.

[0206] In the liquid crystal panel 9J, a main body 81G constituting the incident-side cooling member 8G is inclined with respect to both the +Y and +X directions so that it is positioned in the -X direction as it moves from the -Y-direction end of the main body 81G toward the +Y direction. Therefore, in the example of Fig. 35, the first heat dissipation member 88 of the incident-side cooling member 8G is disposed in a position in the -X direction and the +Y direction with respect to the pixel region 41A, and the second heat dissipation member 89 is disposed in a position from the +X direction to the -Y direction with respect to the pixel region 41A. The first heat dissipation member 88 and the second heat dissipation member 89 are arranged in accordance with the first heat dissipation section 831 and the second heat dissipation section 832 so that the flow paths provided in the first heat dissipation member 88 and the second heat dissipation member 89 are aligned in the +Y direction.

[0207] In this way, in the liquid crystal panel 9J, the exit-side cooling member 6G and the entrance-side cooling member 8G are arranged to intersect in the pixel region 41A when viewed from the light entrance side of the liquid crystal panel 9J. This makes it easier for the cooling gas flowing along the +Y direction to flow through the heat dissipation members 68, 69, 88, 89, the entrance-side dustproof substrate 45, and the exit-side dustproof substrate 48. This therefore improves the cooling efficiency of the liquid crystal layer 42. In addition, main body portion 61G may be inclined so that it is positioned in the -X direction as it moves from the -Y direction end of main body portion 61G toward the +Y direction, and main body portion 81G may be inclined so that it is positioned in the +X direction as it moves from the -Y direction end of main body portion 81G toward the +Y direction. Furthermore, the cooling members arranged as described above are not limited to the exit-side cooling member 6G and the entrance-side cooling member 8G, but may be one of the exit-side cooling members 6A to 6I, or one of the entrance-side cooling members 8A to 8I. For example, even when the liquid crystal panel includes one of the exit-side and entrance-side cooling members, the one cooling member may be inclined with respect to the +X and +Y directions.

[0208] [Modification of the embodiment] The present disclosure is not limited to the above-described embodiments including the above-described modified examples, and modifications and improvements within the scope that can achieve the object of the present disclosure are included in the present disclosure. In the output-side cooling members according to the second and eighth embodiments, the first heat dissipation member 68 provided on the second surface 63A of the second member 63 in accordance with the first heat dissipation section 631 is disposed on the light output side with respect to the first member 62. However, this is not a limitation, and the first heat dissipation member 68 may be disposed on the light incident side with respect to the first member 62. In the output-side cooling members according to the third and ninth embodiments, the second heat dissipation member 69 provided on the second surface 63A of the second member 63 in accordance with the second heat dissipation section 632 is disposed on the light output side with respect to the first member 62. However, this is not a limitation, and the second heat dissipation member 69 may be disposed on the light incident side with respect to the first member 62. In these cases, for example, the first heat dissipation section 631 and the first heat dissipation member 68 may be connected to each other via a heat transfer member so that heat can be transferred, and for example, the second heat dissipation section 632 and the second heat dissipation member 69 may be connected to each other via a heat transfer member so that heat can be transferred. The heat transfer member may have a function of supporting the first heat dissipation member 68 or the second heat dissipation member 69.

[0209] In the incident-side cooling members according to the fourth and eighth embodiments, the first heat dissipation member 88 provided on the second surface 83A of the second member 83 in accordance with the first heat dissipation section 831 is disposed on the light incident side with respect to the first member 82. However, this is not a limitation, and the first heat dissipation member 88 may be disposed on the light exit side with respect to the first member 82. In the incident-side cooling members according to the fifth and ninth embodiments, the second heat dissipation member 89 provided on the second surface 83A of the second member 83 in accordance with the second heat dissipation section 832 is disposed on the light incident side with respect to the first member 82. However, this is not a limitation, and the second heat dissipation member 89 may be disposed on the light exit side with respect to the first member 82. In these cases, for example, the first heat dissipation section 831 and the first heat dissipation member 88 may be connected to each other by a heat transfer member so as to be heat transferable, and for example, the second heat dissipation section 832 and the second heat dissipation member 89 may be connected to each other by a heat transfer member so as to be heat transferable. The heat transfer member may have a function of supporting the first heat dissipation member 88 or the second heat dissipation member 89.

[0210] FIG. 36 is a diagram schematically showing a cross section along the YZ plane of a liquid crystal panel 9K which is a modification of the liquid crystal panel 9D. For example, the liquid crystal panel 9K shown in FIG. 36 may be used in place of the liquid crystal panel 9D. The liquid crystal panel 9K has the same configuration and functions as the liquid crystal panel 9D, except that it has an exit-side cooling member 6K and an entrance-side cooling member 8K instead of the exit-side cooling member 6D and the entrance-side cooling member 8D. That is, the liquid crystal panel 9K has a panel body 41, wiring 49, a holding housing 50, clamping members 51, the exit-side cooling member 6K, and the entrance-side cooling member 8K.

[0211] Similar to the output-side cooling member 6D, the output-side cooling member 6K vaporizes the liquid refrigerant into gaseous refrigerant using heat transferred from the pixel substrate 47 and the output-side dustproof substrate 48, and dissipates the heat received from the gaseous refrigerant to the outside. The output-side cooling member 6K includes a heat transfer member 67, and has the same configuration and function as the output-side cooling member 6D, except that the position of the first heat dissipation member 68 is different. That is, the output-side cooling member 6K includes a main body 61D, a heat transfer member 67, and a first heat dissipation member 68.

[0212] In the output-side cooling member 6K, the first heat dissipation member 68 is disposed on the light incident side with respect to the first member 62. That is, the first heat dissipation member 68 is disposed on the opposite side of the first member 62 from the second member 63. When a plurality of fins 681 are provided as the plurality of fins of the first heat dissipation member 68, the flow paths provided in the fins 681 may be inclined with respect to the +Y direction so as to be positioned in the +X direction or the −X direction as they move toward the +Y direction. Heat transfer member 67 connects first heat dissipation section 631 and first heat dissipation member 68 on second surface 63A in a manner that allows heat to be transferred therebetween, and transfers the heat of the gaseous refrigerant transferred from the first condenser section to first heat dissipation section 631 to first heat dissipation member 68. Heat transfer member 67 may be formed, for example, from a metal sheet, or may be formed from a metal member that can support first heat dissipation member 68.

[0213] Similar to the incident-side cooling member 8D, the incident-side cooling member 8K vaporizes the liquid refrigerant into gaseous refrigerant using heat transferred from the counter substrate 44 and the incident-side dustproof substrate 45, and then radiates the heat received from the gaseous refrigerant to the outside. The incident-side cooling member 8K includes a heat transfer member 87, and has the same configuration and function as the incident-side cooling member 8D, except that the arrangement of the first heat dissipation member 88 is different. That is, the incident-side cooling member 8K includes a main body 81D, a heat transfer member 87, and a first heat dissipation member 88.

[0214] In the incident-side cooling member 8K, the first heat dissipation member 88 is disposed on the light-emitting side with respect to the first member 82. That is, the first heat dissipation member 88 is disposed on the opposite side of the first member 82 from the second member 83. When a plurality of fins 681 are provided as the plurality of fins of the first heat dissipation member 88, the flow paths provided in the fins 681 may be inclined with respect to the +Y direction so as to be positioned in the +X direction or the −X direction as they approach the +Y direction. Heat transfer member 87 connects first heat dissipation section 831 and first heat dissipation member 88 on second surface 83A in a manner that allows heat to be transferred therebetween, and transfers the heat of the gaseous refrigerant transferred from the first condenser section to first heat dissipation section 831 to first heat dissipation member 88. Heat transfer member 87 may be formed, for example, from a metal sheet, or may be formed from a metal member that can support first heat dissipation member 88.

[0215] Cooling gas circulated by a fan of a cooling device disposed inside the exterior housing 2 flows in the +Y direction relative to the liquid crystal panel 9K. The cooling gas flowing through the space on the light incident side of the liquid crystal panel 9K flows in the +Y direction to cool the incident-side dustproof substrate 45, and then cools the holding housing 50. The cooling gas flowing through the space on the light exit side of the liquid crystal panel 9K flows in the +Y direction to cool the exit-side dustproof substrate 48 and then cools the clamping member 51. The cooling gas flowing between the main body 61D of the exit side cooling member 6K and the main body 81D of the entrance side cooling member 8K flows in the +Y direction to cool the first heat dissipation members 68, 88, and then flows in the +X or -X direction, away from the liquid crystal panel 9K.

[0216] Such a liquid crystal panel 9K provides the following advantages in addition to the advantages provided by the liquid crystal panel 9D. The cooling gas that has flowed through the first heat dissipation member 68 can be prevented from flowing to the exit-side dustproof substrate 48, and the cooling gas that has flowed through the first heat dissipation member 88 can be prevented from flowing to the entrance-side dustproof substrate 45. This allows a cooling gas with a relatively low temperature to flow individually through the exit-side dustproof substrate 48 and the first heat dissipation member 68 that is arranged in the -Y direction relative to the exit-side dustproof substrate 48. Similarly, this allows a cooling gas with a relatively low temperature to flow individually through the entrance-side dustproof substrate 45 and the first heat dissipation member 88 that is arranged in the -Y direction relative to the entrance-side dustproof substrate 45. This allows the entrance-side dustproof substrate 45, the exit-side dustproof substrate 48, and the first heat dissipation members 68 and 88 to be efficiently cooled, and ultimately allows the liquid crystal layer 42 to be efficiently cooled.

[0217] In addition, in the case of a liquid crystal panel equipped with one of the output side cooling members 6D to 6I, the first heat dissipation member 68 or the second heat dissipation member 69 arranged in the -Y direction relative to the openings 64, 64C may be arranged on the opposite side of the first member 62 from the second member 63, and the second surface 63A and the first heat dissipation member 68 or the second heat dissipation member 69 may be connected by a heat transfer member 67 so as to be able to transfer heat. Similarly, in the case of an LCD panel having one of the incident side cooling members 8D to 8I, the first heat dissipation member 88 or the second heat dissipation member 89 arranged in the -Y direction relative to the openings 84, 84C may be arranged on the opposite side of the first member 82 from the second member 83, and the second surface 63A and the first heat dissipation member 88 or the second heat dissipation member 89 may be connected by a heat transfer member 87 so as to be able to transfer heat.

[0218] Furthermore, when the cooling gas flowing from the fan of the cooling device flows in the -Y direction relative to the liquid crystal panel, the first heat dissipation member 68 arranged in the +Y direction relative to the openings 64, 64C in the output side cooling members 6A to 6C, 6G to 6I may be arranged in the opposite direction to the second member 63 relative to the first member 62, and the second surface 63A and the first heat dissipation member 68 may be connected to each other so as to be able to transfer heat via the heat transfer member 67. Similarly, when the cooling gas flowing from the cooling device flows in the -Y direction relative to the liquid crystal panel, the first heat dissipation member 88 arranged in the +Y direction relative to the openings 84, 84C in the incident side cooling members 8A to 8C, 8G to 8I may be arranged in the opposite direction to the second member 83 relative to the first member 82, and the second surface 83A and the first heat dissipation member 88 may be connected to each other so as to be able to transfer heat via the heat transfer member 87. Furthermore, one of the incident-side heat dissipation members of the incident-side cooling member and the exit-side heat dissipation member of the exit-side cooling member may be provided on the second member 83 side relative to the first member 82, and the other heat dissipation member may be provided on the opposite side of the first member 82 from the second member 83.

[0219] In the above-described embodiments, the incident section 43 includes the incident-side dustproof substrate 45, and the exit section 46 includes the exit-side dustproof substrate 48. However, this is not limiting, and the liquid crystal panel of the present disclosure does not necessarily have to include at least one of the incident-side dustproof substrate 45 and the exit-side dustproof substrate 48.

[0220] In the above embodiments, the exit-side cooling members 6A to 6I include at least one of the first heat dissipation member 68 and the second heat dissipation member 69, and the entrance-side cooling members 8A to 8I include at least one of the first heat dissipation member 88 and the second heat dissipation member 89. However, this is not limiting, and at least one of the entrance-side cooling member and the exit-side cooling member does not have to include a heat dissipation member. In other words, in the present disclosure, a heat dissipation member does not have to be provided in the vapor chamber.

[0221] In the above-described embodiments, the incident-side electrode substrate arranged on the light incident side of the liquid crystal layer 42 is the counter substrate 44, and the output-side electrode substrate arranged on the light output side of the liquid crystal layer 42 is the pixel substrate 47. However, the present invention is not limited to this, and the incident-side electrode substrate may be the pixel substrate 47, and the output-side electrode substrate may be the counter substrate 44.

[0222] In the above embodiments, a projector is given as an example of a device equipped with liquid crystal panels 4A to 4I, 7A to 7I, and 9A to 9K. However, the present disclosure is not limited to this, and the liquid crystal panel of the present disclosure may be applied to, for example, a stationary liquid crystal display device, or may be applied to, for example, a mobile liquid crystal display device.

[0223] Summary of this disclosure A summary of this disclosure is provided below. A transmissive liquid crystal panel according to a first aspect of the present disclosure includes a pixel region in which a plurality of pixels are arranged, a liquid crystal layer that modulates light for each of the plurality of pixels, an incident portion that allows light to enter the liquid crystal layer, an exit portion that emits the light modulated by the liquid crystal layer as image light, an opening corresponding to the pixel region, a heat receiving portion provided around the opening, and a heat dissipation portion that dissipates heat received by the heat receiving portion, and a vapor chamber that vaporizes a liquid refrigerant sealed inside by the heat received by the heat receiving portion, and condenses the gaseous refrigerant into the liquid refrigerant by dissipating the heat of the gaseous refrigerant in the heat dissipation portion.

[0224] Here, the vapor chamber does not require piping for circulating a coolant or wiring for supplying drive power. This configuration simplifies the configuration of the transmissive liquid crystal panel compared to when a cooling device for circulating a coolant is provided or when a thermoelectric conversion element such as a Peltier element that transfers heat using electric power is provided. Therefore, the size of the device in which the transmissive liquid crystal panel is installed can be reduced. Furthermore, since the transmissive liquid crystal panel can be attached and detached from the device without attaching and detaching piping and wiring, replacement of the transmissive liquid crystal panel can be easily performed. Furthermore, since the heat receiving portion provided around the opening corresponding to the pixel area receives heat, the temperature uniformity in the pixel area can be improved.

[0225] In the first aspect, the emission section may have a translucent emission-side substrate that is thermally connected to the liquid crystal layer and through which the image light passes, the area of ​​the emission-side substrate being larger than the area of ​​the pixel region when viewed from the emission direction of the image light, and the vapor chamber may be thermally conductively arranged on the emission-side substrate. With this configuration, the exit-side substrate is connected to the liquid crystal layer in a heat-transferable manner, so that heat from the liquid crystal layer is transferred. By providing the vapor chamber in a heat-transferable manner on the exit-side substrate, the heat-receiving section can more easily receive heat from the liquid crystal layer. This makes it easier to cool the liquid crystal layer.

[0226] In the first aspect, the emission section has an emission-side electrode electrically connected to the liquid crystal layer, and includes a translucent emission-side electrode substrate arranged on the light emission side of the liquid crystal layer, and the emission-side substrate may be the emission-side electrode substrate. With this configuration, the output-side electrode substrate is a light-transmitting substrate that is directly connected to the heat-sensitive liquid crystal layer. Because the output-side electrode substrate is provided with a vapor chamber, heat generated in the liquid crystal layer can be efficiently transferred to the heat-receiving section. This improves the cooling efficiency of the liquid crystal layer.

[0227] In the first aspect, the emission section may include an emission-side dustproof substrate provided on a surface of the emission-side electrode substrate on the light emission side, the emission-side dustproof substrate having a side surface connecting the light incident side surface of the emission-side dustproof substrate and the light emission side surface of the emission-side dustproof substrate, and the heat-receiving section may receive heat from the light emission side surface of the emission-side electrode substrate and the side surface of the emission-side dustproof substrate. With this configuration, the heat receiving portion receives heat from both the output-side electrode substrate and the output-side dustproof substrate, and the heat of the liquid crystal layer can be transferred to the heat receiving portion via the output-side electrode substrate and the output-side dustproof substrate, respectively. Therefore, the heat of the liquid crystal layer can be efficiently transferred to the heat receiving portion, thereby improving the cooling efficiency of the liquid crystal layer.

[0228] In the first aspect, the emission section includes a light-transmitting emission-side electrode substrate having an emission-side electrode electrically connected to the liquid crystal layer and arranged on the light emission side of the liquid crystal layer, and an emission-side dustproof substrate provided on the light emission side surface of the emission-side electrode substrate, and the emission-side substrate may be the emission-side dustproof substrate. With this configuration, the vapor chamber is provided in a heat-transferable manner on the emission-side dustproof substrate, which is provided closer to the light emission side than the emission-side electrode substrate. This makes it easier to connect the vapor chamber to the emission section than when the vapor chamber is provided on the emission-side electrode substrate so as to avoid the emission-side dustproof substrate. Here, the heat generated in the liquid crystal layer is transferred to the output-side dustproof substrate via the output-side electrode substrate, so the heat in the liquid crystal layer is diffused. In contrast, the vapor chamber is provided on the light-output side surface of the output-side dustproof substrate, so that the heat of the liquid crystal layer can be easily transferred to the heat-receiving section.

[0229] In the first aspect, the vapor chamber may be provided on the light-emitting side surface of the emission-side dustproof substrate. With this configuration, the vapor chamber can be easily attached to the exit section even if tolerances occur in the vapor chamber, compared to when the exit-side dustproof substrate is placed within an opening corresponding to the pixel area, for example.

[0230] In the first aspect, the output-side dustproof substrate may have a side surface connecting a light-incident side surface of the output-side dustproof substrate and a light-exit side surface of the output-side dustproof substrate, and an inner circumferential surface of the opening may be connected to at least a part of the side surface of the output-side dustproof substrate in a manner capable of conducting heat. With this configuration, the heat of the liquid crystal layer transferred to the exit-side dustproof substrate can be received by the inner peripheral surface of the opening, which prevents the transmissive liquid crystal panel from becoming larger in size in the light passing direction than when the vapor chamber is provided so that the heat receiving section is connected to the light-exiting surface of the exit-side dustproof substrate.

[0231] In the first aspect, the heat receiving portion may be connected to the emission side electrode substrate in a heat transferable manner. With this configuration, heat is transferred to the heat-receiving portion not only from the side surface of the output-side dustproof substrate but also from the output-side electrode substrate, which makes it easier to transfer heat from the liquid crystal layer to the heat-receiving portion, thereby improving the cooling efficiency of the liquid crystal layer.

[0232] In the first aspect, the emission-side electrode substrate may be a pixel substrate having, as the emission-side electrode, a plurality of pixel electrodes provided corresponding to each of the plurality of pixels, and disposed on the light emission side with respect to the liquid crystal layer. In a typical transmissive liquid crystal panel, an opposing substrate is disposed on the light incident side of the liquid crystal layer, and a pixel substrate is disposed on the light exit side of the liquid crystal layer. Therefore, since the output-side electrode substrate is the pixel substrate, the transmissive liquid crystal panel of the present disclosure can be configured by providing a vapor chamber having the above-described configuration in a general transmissive liquid crystal panel, and therefore the transmissive liquid crystal panel of the present disclosure can be easily configured.

[0233] In the first aspect, the incident portion has a translucent incident-side substrate that is thermally connected to the liquid crystal layer and through which light incident on the liquid crystal layer passes, the area of ​​the incident-side substrate being larger than the area of ​​the pixel region when viewed from the direction opposite to the traveling direction of the light incident on the liquid crystal layer, and the vapor chamber may be thermally conductively arranged on the incident-side substrate. With this configuration, the incident-side substrate is connected to the liquid crystal layer in a heat-transferable manner, so that heat from the liquid crystal layer is transferred. By providing the vapor chamber in a heat-transferable manner on the incident-side substrate, the heat-receiving section can more easily receive heat from the liquid crystal layer. This makes it easier to cool the liquid crystal layer.

[0234] In the first aspect, the incident portion has an incident side electrode electrically connected to the liquid crystal layer, and includes a light-transmitting incident side electrode substrate arranged on the light incident side of the liquid crystal layer, and the incident side substrate may be the incident side electrode substrate. With this configuration, the incident-side electrode substrate is a light-transmitting substrate that is directly connected to the heat-sensitive liquid crystal layer. Because the exit-side electrode substrate is provided with a vapor chamber, heat generated in the liquid crystal layer can be efficiently transferred to the heat-receiving section. This improves the cooling efficiency of the liquid crystal layer.

[0235] In the first aspect, the incident portion may include an incident-side dustproof substrate provided on a light-incident surface of the incident-side electrode substrate, the incident-side dustproof substrate having a side surface connecting the light-incident surface of the incident-side dustproof substrate and a light-exiting surface of the incident-side dustproof substrate, and the heat-receiving portion may receive heat from the light-incident surface of the incident-side electrode substrate and the side surface of the incident-side dustproof substrate. With this configuration, the heat receiving portion receives heat from both the incident-side electrode substrate and the incident-side dustproof substrate, and the heat of the liquid crystal layer can be transferred to the heat receiving portion via both the incident-side electrode substrate and the incident-side dustproof substrate. Therefore, the heat of the liquid crystal layer can be efficiently transferred to the heat receiving portion, thereby improving the cooling efficiency of the liquid crystal layer.

[0236] In the first aspect, the incident section includes a light-transmitting incident-side electrode substrate having an incident-side electrode electrically connected to the liquid crystal layer and arranged on the light incident side of the liquid crystal layer, and an incident-side dustproof substrate provided on the light incident side surface of the incident-side electrode substrate, and the incident-side substrate may be the incident-side dustproof substrate. With this configuration, the vapor chamber is provided in a heat-transferable manner on the entrance-side dustproof substrate, which is provided closer to the light entrance side than the entrance-side electrode substrate. This makes it easier to connect the vapor chamber to the emission section than when the vapor chamber is provided on the entrance-side electrode substrate so as to avoid the entrance-side dustproof substrate. Here, heat generated in the liquid crystal layer is transferred to the exit-side dustproof substrate via the entrance-side electrode substrate, so the heat in the liquid crystal layer is diffused. In contrast, the vapor chamber is provided on the light-incident surface of the entrance-side dustproof substrate, so that the heat of the liquid crystal layer can be easily transferred to the heat-receiving section.

[0237] In the first aspect, the vapor chamber may be provided on the light incident side surface of the incident-side dustproof substrate. With this configuration, the vapor chamber can be easily attached to the incident section even if tolerances occur in the vapor chamber, compared to when the incident-side dustproof substrate is placed within an opening corresponding to the pixel area, for example.

[0238] In the first aspect, the incident-side dustproof substrate may have a side surface connecting a light incident side surface of the incident-side dustproof substrate and a light exit side surface of the incident-side dustproof substrate, and an inner circumferential surface of the opening may be in heat-conductive contact with at least a part of the side surface of the incident-side dustproof substrate. With this configuration, the heat of the liquid crystal layer transferred to the incident-side dustproof substrate can be received by the inner edge of the opening, which prevents the transmissive liquid crystal panel from becoming larger in size in the light passing direction than when the vapor chamber is provided so that the heat receiving section is connected to the light incident surface of the incident-side dustproof substrate.

[0239] In the first aspect, the heat receiving portion may be connected to the entrance side electrode substrate in a heat transferable manner. With this configuration, heat is transferred to the heat receiving section not only from the side surface of the entrance-side dustproof substrate but also from the entrance-side electrode substrate, which makes it easier to transfer heat from the liquid crystal layer to the heat receiving section, thereby improving the cooling efficiency of the liquid crystal layer.

[0240] In the first aspect, the incident-side electrode substrate may be a counter substrate having, as the incident-side electrode, a common electrode provided in accordance with the pixel region. As described above, in a typical transmissive liquid crystal panel, the counter substrate is disposed on the light incident side of the liquid crystal layer, and the pixel substrate is disposed on the light exit side of the liquid crystal layer. Therefore, since the incident-side electrode substrate is the opposing substrate, the transmissive liquid crystal panel of the present disclosure can be constructed by providing a vapor chamber having the above-described configuration in a general transmissive liquid crystal panel, and therefore the transmissive liquid crystal panel of the present disclosure can be easily constructed.

[0241] In the first aspect, the display device may further include wiring that supplies image signals that drive the liquid crystal layer, and the vapor chamber may extend from the opening in a direction in which the wiring extends from the liquid crystal layer. With this configuration, the size of the transmissive liquid crystal panel can be prevented from increasing, compared to when the vapor chamber extends from the opening in the opposite direction to the extending direction of the wiring, for example.

[0242] In the first aspect, the display device may include wiring that supplies image signals that drive the liquid crystal layer, and the vapor chamber may extend from the opening in a direction opposite to the extension direction of the wiring from the liquid crystal layer. With this configuration, interference between the wiring and the vapor chamber can be suppressed, and therefore, heat dissipation by the vapor chamber can be prevented from being hindered by the wiring.

[0243] In the first aspect, the display device may include wiring that supplies image signals to drive the liquid crystal layer, and the vapor chamber may extend from the opening in both the extension direction of the wiring from the liquid crystal layer and the opposite direction to the extension direction. This configuration increases the heat dissipation area of ​​the vapor chamber for heat received from the gaseous refrigerant, making it easier to condense the gaseous refrigerant into a liquid refrigerant. This allows the liquid refrigerant to flow smoothly through the heat receiving section, facilitating the evaporation of the liquid refrigerant by the heat of the liquid crystal layer. Furthermore, by positioning the transmissive liquid crystal panel so that either the direction in which the wiring extends or the direction opposite to the direction in which the wiring extends is vertically upward, the condensed liquid refrigerant can be transported to the area where the liquid refrigerant is vaporized not only by capillary force but also by gravity. This promotes the transformation of the refrigerant from liquid to gas due to the heat received by the heat receiving section. This therefore improves the heat dissipation efficiency of the liquid crystal layer and, ultimately, the cooling efficiency of the liquid crystal layer.

[0244] In the first aspect, the vapor chamber may be provided with a heat dissipation member that dissipates heat transferred from the heat dissipation portion, and the heat dissipation member may be provided in a direction in which the vapor chamber extends from the opening relative to the opening. With this configuration, the heat-generating element connected to the heat-receiving portion can be separated from the heat-dissipating member, thereby preventing the heat transferred to the heat-dissipating member from affecting the heat-generating element.

[0245] a first opening corresponding to the pixel region, a first heat receiving portion provided around the first opening and connected to at least one of the first dust-proof substrate and the first dust-proof substrate so as to be heat transferable; and a first heat dissipation portion configured to dissipate heat received by the first heat receiving portion. a first vapor chamber that vaporizes a liquid first refrigerant sealed inside by heat received by the first heat receiving portion and condenses the liquid first refrigerant into the gaseous first refrigerant by dissipating the heat of the gaseous first refrigerant by the first heat dissipation portion; a second opening corresponding to the pixel area; a second heat receiving portion provided around the second opening and connected to at least one of the pixel substrate and the second dustproof substrate in a heat-transferable manner; and a second heat dissipation portion that dissipates the heat received by the second heat receiving portion; and a second vapor chamber that vaporizes a liquid second refrigerant sealed inside by heat received by the second heat receiving portion and condenses the liquid second refrigerant into the gaseous second refrigerant by dissipating the heat of the gaseous second refrigerant by the second heat dissipation portion.

[0246] This configuration can achieve the same effects as the transmissive liquid crystal panel according to the first aspect. Furthermore, the transmissive liquid crystal panel can further improve the cooling efficiency of the liquid crystal layer by including a first vapor chamber connected to at least one of the counter substrate and the first dustproof substrate in a heat-transferable manner, and a second vapor chamber connected to at least one of the pixel substrate and the second dustproof substrate in a heat-transferable manner.

[0247] In the second aspect, the first vapor chamber may extend outward beyond the opposing substrate and the first dustproof substrate when viewed from the incident side of light entering the liquid crystal layer, and the second vapor chamber may extend outward beyond the pixel substrate and the second dustproof substrate when viewed from the exit side of light exiting the liquid crystal layer, and the first vapor chamber and the second vapor chamber may be opposite each other in the incident direction of light to the liquid crystal layer. With this configuration, the size of the transmissive liquid crystal panel can be prevented from increasing compared to when the first vapor chamber and the second vapor chamber do not face each other. [Explanation of symbols]

[0248] 4A, 4B, 4C, 4D, 4E, 4F, 4G, 4H, 4I... liquid crystal panel (transmissive liquid crystal panel), 41... panel body, 41A... pixel region, 42... liquid crystal layer, 43... incident portion, 44... opposing substrate (incident side electrode substrate), 441... light incident surface, 442... light exit surface, 45... incident side dustproof substrate (first dustproof substrate), 451... light incident surface (surface on the light incident side), 452... light exit surface (surface on the light exit side), 453... side surface, 46... exit portion, 47... pixel substrate (exit side electrode substrate), 471 ...light incident surface, 472...light exit surface, 48...exit side dustproof substrate (second dustproof substrate), 481...light incident surface (surface on the light incident side), 482...light exit surface (surface on the light exit side), 483...side surface, 49...wiring, 50...holding housing, 51...clamping member, 6A, 6B, 6C, 6D, 6E, 6F, 6G, 6H, 6I...exit side cooling member, 61A, 61B, 61C, 61D, 61E, 61F, 61G, 61H, 61I...main body (vapor chamber, second vapor chamber), 62... First member, 621...heat receiving portion, 62A...first surface, 63...second member, 631...first heat dissipation portion (heat dissipation portion), 632...second heat dissipation portion (heat dissipation portion), 63A...second surface, 64, 64C...opening, 67...heat transfer member, 68...first heat dissipation member, 69...second heat dissipation member, 7A, 7B, 7C, 7D, 7E, 7F, 7G, 7H, 7I...liquid crystal panel, 8A, 8B, 8C, 8D, 8E, 8F, 8G, 8H, 8I...incident side cooling member, 81A, 81B, 81C, 81D, 81E, 81 F, 81G, 81H, 81I...main body (vapor chamber, first vapor chamber), 82...first member, 821...heat receiving portion, 82A...first surface, 83...second member, 831...first heat dissipation portion (heat dissipation portion), 832...second heat dissipation portion (heat dissipation portion), 83A...second surface, 84, 84C...opening, 87...heat transfer member, 88...first heat dissipation member, 89...second heat dissipation member, 9A, 9B, 9C, 9D, 9E, 9F, 9G, 9H, 9I, 9J, 9K...liquid crystal panel, SP...enclosed space.

Claims

1. a pixel region in which a plurality of pixels are arranged; a liquid crystal layer that modulates light for each of the plurality of pixels; an incident portion for making light incident on the liquid crystal layer; an emission section that emits light modulated by the liquid crystal layer as image light; a vapor chamber having a first surface and a second surface opposite to the first surface, formed in a flat plate shape extending along the first surface and the second surface, having a refrigerant sealed therein, an opening corresponding to the pixel region, a heat receiving portion provided around the opening, and a heat dissipation portion that dissipates heat received by the heat receiving portion, wherein the liquid refrigerant sealed therein is vaporized by the heat received by the heat receiving portion, and the heat of the gaseous refrigerant is dissipated by the heat dissipation portion, thereby condensing the gaseous refrigerant into the liquid refrigerant, the opening has a first inner circumferential surface, a second inner circumferential surface opposing the first inner circumferential surface, a third inner circumferential surface intersecting the first inner circumferential surface, and a fourth inner circumferential surface opposing the third inner circumferential surface, the vapor chamber further includes a first flat portion that is a part of the first surface and is connected to the first inner circumferential surface, a second flat portion that is a part of the first surface and is connected to the second inner circumferential surface, a third flat portion that is a part of the first surface and is connected to the third inner circumferential surface, and a fourth flat portion that is a part of the first surface and is connected to the fourth inner circumferential surface, the heat receiving portion includes a first heat receiving portion including the first inner circumferential surface and the first flat portion, a second heat receiving portion including the second inner circumferential surface and the second flat portion, a third heat receiving portion including the third inner circumferential surface and the third flat portion, and a fourth heat receiving portion including the fourth inner circumferential surface and the fourth flat portion, The transmissive liquid crystal panel, wherein the light emitting portion is connected to the first heat receiving portion, the second heat receiving portion, the third heat receiving portion, and the fourth heat receiving portion in a heat-transferable manner.

2. 2. The transmissive liquid crystal panel according to claim 1, the emission section is connected to the liquid crystal layer in a heat-transmissive manner and has an emission-side substrate through which the image light passes; an area of ​​the exit-side substrate is larger than an area of ​​the pixel region when viewed from the exit direction of the image light; The vapor chamber is provided on the output substrate so as to be capable of transferring heat therethrough.

3. 3. The transmissive liquid crystal panel according to claim 2, the emission section includes an emission-side electrode substrate that has an emission-side electrode electrically connected to the liquid crystal layer and is disposed on the light emission side with respect to the liquid crystal layer, and 2. A transmissive liquid crystal panel, wherein the exit-side substrate is the exit-side electrode substrate.

4. 4. The transmissive liquid crystal panel according to claim 3, the emission section includes an emission-side dustproof substrate provided on a light-emission-side surface of the emission-side electrode substrate, the output-side dustproof substrate has a side surface connecting a light incident surface of the output-side dustproof substrate to a light output surface of the output-side dustproof substrate, a light-emitting element configured to receive heat from a surface of the light-emitting electrode substrate on the light-emitting side and a side surface of the light-emitting dustproof substrate;

5. 3. The transmissive liquid crystal panel according to claim 2, The emission section is a light-transmitting exit electrode substrate having an exit electrode electrically connected to the liquid crystal layer and disposed on the light exit side with respect to the liquid crystal layer; an emission-side dustproof substrate provided on a light-emission-side surface of the emission-side electrode substrate, 2. A transmissive liquid crystal panel, wherein the exit-side substrate is the exit-side dustproof substrate.

6. 6. The transmissive liquid crystal panel according to claim 5, A transmissive liquid crystal panel, characterized in that the vapor chamber is provided on the light-emitting side surface of the emission-side dustproof substrate.

7. 6. The transmissive liquid crystal panel according to claim 5, the output-side dustproof substrate has a side surface connecting a light incident surface of the output-side dustproof substrate to a light output surface of the output-side dustproof substrate, a transmission type liquid crystal panel, wherein an inner peripheral surface of the opening is connected to at least a part of the side surface of the emission-side dustproof substrate so as to be capable of conducting heat therethrough;

8. 8. The transmissive liquid crystal panel according to claim 7, The transmissive liquid crystal panel is characterized in that the heat receiving portion is connected to the output side electrode substrate in a heat transferable manner.

9. 9. The transmissive liquid crystal panel according to claim 3, a light-emitting side electrode substrate having a plurality of pixel electrodes provided corresponding to each of the plurality of pixels as the light-emitting side electrode, and being a pixel substrate disposed on the light-emitting side of the liquid crystal layer.

10. a pixel region in which a plurality of pixels are arranged; a liquid crystal layer that modulates light for each of the plurality of pixels; an incident portion for making light incident on the liquid crystal layer; an emission section that emits light modulated by the liquid crystal layer as image light; a vapor chamber having a first surface and a second surface opposite to the first surface, formed in a flat plate shape extending along the first surface and the second surface, having a refrigerant sealed therein, an opening corresponding to the pixel region, a heat receiving portion provided around the opening, and a heat dissipation portion that dissipates heat received by the heat receiving portion, wherein the liquid refrigerant sealed therein is vaporized by the heat received by the heat receiving portion, and the heat of the gaseous refrigerant is dissipated by the heat dissipation portion, thereby condensing the gaseous refrigerant into the liquid refrigerant, the opening has a first inner circumferential surface, a second inner circumferential surface opposing the first inner circumferential surface, a third inner circumferential surface intersecting the first inner circumferential surface, and a fourth inner circumferential surface opposing the third inner circumferential surface, the vapor chamber further includes a first flat portion that is a part of the first surface and is connected to the first inner circumferential surface, a second flat portion that is a part of the first surface and is connected to the second inner circumferential surface, a third flat portion that is a part of the first surface and is connected to the third inner circumferential surface, and a fourth flat portion that is a part of the first surface and is connected to the fourth inner circumferential surface, the heat receiving portion includes a first heat receiving portion including the first inner circumferential surface and the first flat portion, a second heat receiving portion including the second inner circumferential surface and the second flat portion, a third heat receiving portion including the third inner circumferential surface and the third flat portion, and a fourth heat receiving portion including the fourth inner circumferential surface and the fourth flat portion, The transmissive liquid crystal panel, wherein the incident portion is connected to the first heat receiving portion, the second heat receiving portion, the third heat receiving portion, and the fourth heat receiving portion in a heat-transferable manner.

11. 11. The transmissive liquid crystal panel according to claim 10, the incident portion has a light-transmitting incident-side substrate that is connected to the liquid crystal layer in a heat-transferable manner and through which light incident on the liquid crystal layer passes; an area of ​​the incident-side substrate is larger than an area of ​​the pixel region when viewed from a direction opposite to a traveling direction of light incident on the liquid crystal layer; The vapor chamber is provided on the incident-side substrate so as to be capable of transferring heat therethrough.

12. 12. The transmissive liquid crystal panel according to claim 11, the incident portion has an incident-side electrode electrically connected to the liquid crystal layer, and includes a light-transmitting incident-side electrode substrate disposed on a light incident side with respect to the liquid crystal layer; 2. A transmissive liquid crystal panel, wherein the incident side substrate is the incident side electrode substrate.

13. The transmissive liquid crystal panel according to claim 12, the incident portion includes an incident-side dustproof substrate provided on a light incident side surface of the incident-side electrode substrate, the incident-side dustproof substrate has a side surface connecting a light incident surface of the incident-side dustproof substrate to a light exit surface of the incident-side dustproof substrate, a light receiving portion configured to receive heat from a light incident surface of the light incident-side electrode substrate and from the side surface of the light incident-side dustproof substrate;

14. 12. The transmissive liquid crystal panel according to claim 11, The incident portion is a light-transmitting incident-side electrode substrate having an incident-side electrode electrically connected to the liquid crystal layer and disposed on the light incident side of the liquid crystal layer; an incident-side dustproof substrate provided on a light incident side surface of the incident-side electrode substrate, 2. A transmissive liquid crystal panel, wherein the incident-side substrate is the incident-side dustproof substrate.

15. 15. The transmissive liquid crystal panel according to claim 14, A transmissive liquid crystal panel, characterized in that the vapor chamber is provided on the light incident side surface of the incident-side dustproof substrate.

16. 15. The transmissive liquid crystal panel according to claim 14, the incident-side dustproof substrate has a side surface connecting a light incident surface of the incident-side dustproof substrate to a light exit surface of the incident-side dustproof substrate, a transmission-type liquid crystal panel, wherein an inner peripheral surface of the opening is in contact with at least a part of the side surface of the incident-side dustproof substrate so as to be capable of conducting heat therethrough;

17. 17. The transmissive liquid crystal panel according to claim 16, The transmissive liquid crystal panel is characterized in that the heat receiving portion is connected to the incident side electrode substrate in a heat transferable manner.

18. 18. The transmissive liquid crystal panel according to claim 12, The transmissive liquid crystal panel is characterized in that the incident-side electrode substrate is a counter substrate having a common electrode provided in accordance with the pixel region as the incident-side electrode.

19. A transmissive liquid crystal panel according to any one of claims 1 to 18, which modulates light emitted from a light source; a projection optical device that projects light modulated by the transmissive liquid crystal panel.

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