Image stabilization device, imaging device

Abstract

To efficiently radiate the heat of an imaging element, without greatly reducing an image blur correction function.SOLUTION: A camera 100 includes a fixed part 408 which is fixed to a main base 200, an imaging substrate 402 on which an imaging element 401 is mounted, and a movable part 406 which is fixed to the imaging substrate 402 and relatively movable with respect to the fixed part 408. Bendable heat transfer members G1 and G2 are pulled out from the imaging substrate 402. The heat transfer member G1 is fixed to the fixed part 408 and the heat transfer member G2 is fixed to the movable part 406. The heat transfer member G1 is closer to the mounting surface 402b of the imaging element 401 than the heat transfer member G2 in the thickness direction of the imaging substrate 402.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to an image stabilization device and an imaging device. [Background technology]

[0002] In recent years, it has become known that in image stabilization devices used in imaging devices such as digital cameras and digital video cameras that have an image sensor, heat generated from the image sensor and image processing ICs affects image quality. To solve this problem, Patent Document 1 discloses a technology for dissipating heat from a movable body including the image sensor to a fixed body by providing a heat transfer member that is displaceable in a direction perpendicular to the optical axis between the movable body and the fixed body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] WO2020 / 202811 publication Summary of the Invention [Problem to be solved by the invention]

[0004] However, in Patent Document 1, a displaceable heat transfer member is interposed between the movable body and the fixed body to prevent deterioration of the image blur correction characteristics in the image blur correction device. This results in inefficient heat transfer, and the heat dissipation efficiency of the image sensor is insufficient. There is room for improvement in terms of efficiently dissipating heat from the image sensor without degrading the image blur correction function.

[0005] An object of the present invention is to efficiently dissipate heat from an imaging element without significantly reducing the image blur correction function. [Means for solving the problem]

[0006] In order to achieve the above object, the present invention provides a heat transfer device having a fixed portion fixed to a housing, a substrate on which an image sensor is mounted, a movable portion to which the substrate is fixed and which is movable relatively to the fixed portion, a first bendable heat transfer member drawn out from the substrate and fixed to the fixed portion, and a second bendable heat transfer member drawn out from the substrate and fixed to the movable portion, wherein within the substrate, the first heat transfer member is closer to a mounting surface of the image sensor in a thickness direction of the substrate than the second heat transfer member. The first heat transfer member and the second heat transfer member are thermally connected to a power supply terminal of the image pickup element within the substrate. It is characterized by: [Effects of the Invention]

[0007] According to the present invention, heat from the imaging element can be efficiently dissipated without significantly reducing the image blur correction function. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is a perspective view of the appearance of the imaging device as seen from the front side. [Figure 2] FIG. 2 is an exploded perspective view of the front side of the camera excluding the top cover, front cover, and rear cover. [Figure 3] FIG. 2 is an exploded perspective view of the rear side of the camera excluding the top cover, front cover, and rear cover. [Figure 4] FIG. 2 is an exploded perspective view of the imaging unit as seen from the front side. [Figure 5] FIG. 2 is an exploded perspective view of the imaging unit as seen from the rear side. [Figure 6] FIG. 2 is a YZ cross-sectional view of the imaging unit. [Figure 7] FIG. 2 is an XZ cross-sectional view of the imaging unit. [Figure 8] FIG. 2 is a schematic YZ cross-sectional view of an imaging substrate. [Figure 9] FIG. 2 is a rear perspective view of the movable portion, the imaging board, and the board holding member. [Figure 10] FIG. 10 is an enlarged cross-sectional view of a portion where a heat transfer member is led out from an imaging substrate. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0010] 1 is a perspective view of an imaging device to which an image stabilization device according to an embodiment of the present invention is applied, seen from the front side. This imaging device is configured as a digital camera 100 (hereinafter referred to as camera 100). Camera 100 is of an interchangeable lens type, but may also be of an integrated lens type. Camera 100 may also be referred to as the imaging device body.

[0011] Hereinafter, the directions of each part will be referred to based on the X, Y, and Z coordinate axes. For convenience, the subject side in the direction parallel to the center of the optical axis will be referred to as the front. Therefore, for example, the +Y direction is upward and the +Z direction is forward. The +X direction is to the right when viewed from the subject side.

[0012] The camera 100 is covered by a top cover 101, a front cover 102, and a back cover 103, all of which are exterior components. A release button 104 on the top cover 101 is used to issue a shooting command to the camera 100. When the photographer presses the release button 104, various components within the camera 100 are activated to perform an image capture operation. An electronic dial 105 is an operation unit for setting the shooting settings of the camera 100. By operating the electronic dial 105, the photographer can set any shooting parameters, such as exposure settings. A grip 106 is an area that the photographer holds when photographing a subject. A lens (not shown) is attached to the mount 107. A mode dial 108 is an operation unit for changing the shooting mode. The photographer can set the shooting conditions of the camera 100 by operating the operation unit, such as the dial on the mode dial 108, and then shoot videos or still images.

[0013] Next, the internal structure of the camera will be described. Figures 2 and 3 are exploded perspective views of the camera 100, excluding the top cover 101, front cover 102, and rear cover 103, as seen from the front and rear, respectively.

[0014] Inside the camera 100, a mount 107, a main base 200 (housing), a shutter unit 300, an imaging unit 400, and a control board 500 are arranged in this order from the front side to the rear side.

[0015] The main base 200 is a structural member of the camera 100 and is made of metal, resin, or the like. The shutter unit 300 is fixed to the main base 200 with screws (not shown) or the like. The imaging unit 400 is fixed to the main base 200 after being adjusted so that the imaging surface of the imaging element 401 is parallel to the mount 107 with a predetermined gap. A flexible printed wiring board 404 (FIG. 3) is connected to the imaging unit 400. The imaging unit 400 is electrically connected to the control board 500 via the flexible printed wiring board 404 and a connector 501. A subject image formed on the imaging element 401 (FIG. 2) is converted into an electrical signal and transmitted to the control board 500 via the flexible printed wiring board 404. An image processing IC 502 (FIG. 3) is mounted on the control board 500. The image processing IC 502 converts the electrical signal obtained from the flexible printed wiring board 404 into an image and provides the image to the photographer via a liquid crystal display device (not shown).

[0016] 4 and 5 are exploded perspective views of the imaging unit 400 as seen from the front and rear, respectively. The image stabilization device of this embodiment mainly includes an imaging board 402, a movable section 406, and a fixed section 408. The imaging unit 400 includes an imaging element 401, which is mounted on the imaging board 402. Although a CMOS sensor is used as the imaging element 401, the present invention is not limited to this, and other imaging devices such as a CCD type may also be used.

[0017] An electrode 403 (described later in FIG. 8) is provided on the opposite side (-Z side) of the image sensor 401 from the subject side. The electrode 403 is electrically connected to a photoelectric conversion unit (not shown) provided inside the image sensor 401. The imaging board 402 is electrically connected to the photoelectric conversion unit of the image sensor 401 via the electrode 403, and receives an electrical signal from the image sensor 401.

[0018] A connector 407 (FIG. 5) and various electronic components 410 (described later in FIG. 8) are mounted on the back side of the imaging board 402. A flexible printed wiring board 404 is electrically connected to the connector 407. The photoelectric conversion unit of the imaging element 401 is composed of a photodiode that detects light and generates an electric charge, etc. The imaging element 401 has an LLCC (Lead Less Chip Carrier) type structure in which electrodes are provided on the back side and leads do not extend outside the imaging element 401. Note that instead of the LLCC type, it is also possible to use a cerdip type in which the leads are sandwiched between ceramic plates and soldered to the imaging element 401 and imaging board 402 with a gap formed between them.

[0019] The imaging optical axis of the camera 100 is defined as optical axis C. The movable part 406 has coils C1 and C2 for moving the imaging element 401. The fixed part 408 has three magnets 409 at positions facing the coils C1, C1, and C2 in the imaging optical axis direction. The movable part 406 is attracted and held to the fixed part 408 side by the three magnets 409. By changing the amount of current flowing through the coils C1 and C2, the movable part 406 becomes movable relative to the fixed part 408. In other words, the movable part 406 moves relative to the fixed part 408 in a direction perpendicular to the optical axis direction. Camera shake can be corrected by moving the movable part 406 in a direction that cancels out shake of the camera 100. The imaging board 402 is held by a board holding member 405. The imaging board 402 is fixed to the movable part 406.

[0020] 6 and 7 are YZ and XZ cross-sectional views of the imaging unit 400, respectively. The imaging substrate 402 is substantially rectangular when viewed from the optical axis direction. One end of each of the heat transfer members G1 to G4 is fixed to the imaging substrate 402. The heat transfer members G1 and G2 are pulled out in the same +Y direction from a side portion 402a on the +Y side of the imaging substrate 402 (FIG. 6). The heat transfer members G3 and G4 are pulled out in the same -X direction (a direction different from that of the heat transfer members G1 and G2) from a side portion 402c on the -X side of the imaging substrate 402 (FIG. 7). That is, from the outer shape (outer shell) of the imaging substrate 402 when viewed from the optical axis C direction, the heat transfer members G1 and G2 are exposed in the +Y direction, and the heat transfer members G3 and G4 are exposed in the -X direction. The heat transfer members G1 to G4 are made of a flexible material, such as graphite. The technology for embedding graphite in a substrate is publicly known, for example, from JP 2017-204503 A, and therefore detailed description thereof will be omitted.

[0021] The other end of the heat transfer member G1 (first heat transfer member) is thermally connected to the fixed portion 408, and the other end of the heat transfer member G2 (second heat transfer member) is thermally connected to the movable portion 406. The other end of the heat transfer member G3 is thermally connected to the fixed portion 408, and the other end of the heat transfer member G4 is thermally connected to the movable portion 406. In the optical axis direction, the distance between the fixed portion 408 and the imaging substrate 402 is longer than the distance between the movable portion 406 and the imaging substrate 402. Therefore, the heat transfer members G1 and G3 are designed to be longer than the heat transfer members G2 and G4. By increasing the lengths of the heat transfer members G1 and G3, it is possible to reduce the load on the movable portion 406 due to the resistance of the heat transfer members G1 and G3 to the movable portion 406 when the movable portion 406 moves relative to the fixed portion 408.

[0022] Next, the detailed configuration of the imaging substrate 402 will be described with reference to Fig. 8. Fig. 8 is a schematic YZ cross-sectional view of the imaging substrate 402.

[0023] The imaging substrate 402 is a multilayer printed wiring board made up of a plurality of internal insulating layers K1 to Kn, conductor layers P1 to Pm, and an insulating layer R on the surface of the substrate. In this embodiment, the imaging substrate 402 has a structure of three internal insulating layers (n=3: K1 to K3) and four conductor layers (m=4: P1 to P4), but the number of layers is not limited to this example.

[0024] A plurality of electrodes 403 are provided on the side (-Z side) opposite to the subject side of the imaging element 401. A plurality of electrode pads 411 are provided on the imaging substrate 402 at positions facing the plurality of electrodes 403, and the electrodes 403 and the electrode pads 411 are connected by solder (not shown), thereby electrically connecting the imaging element 401 and the imaging substrate 402.

[0025] Of the insulating layers R on both sides of the imaging substrate 402 in the optical axis direction, the surface on the +Z side is a mounting surface 402b on which the imaging element 401 is mounted. Of the insulating layers R on both sides of the imaging substrate 402, a surface 402d on the -Z side, which is the surface opposite to the mounting surface 402b, is mounted with a connector 407 for connecting to the flexible printed wiring board 404 and various electronic components 410 such as a capacitor.

[0026] A plurality of conductive vias are provided within the imaging substrate 402 (substrate) to electrically connect the conductor layers P1 to Pn. Of the plurality of conductive vias, the conductive via TH1 connects the conductor layer P1 to the conductor layer P2. The conductive via TH2 connects the conductor layer P2 to the conductor layer P3. The conductive vias TH1 and TH2 can be provided at any position within the imaging substrate 402. In this embodiment, the conductive vias TH1 and TH2 are configured to overlap in the optical axis direction (overlap when viewed from the optical axis direction). This shortens the connection distance from the power supply wiring layer P1a of the conductor layer P1 to the power supply wiring layer P3a of the conductor layer P3, and forms an efficient heat transfer path.

[0027] The imaging element 401 is a heat-generating element. In particular, the power terminal 403a of the imaging element 401 is the main heat-generating part. Heat transfer members G1 and G2 are thermally connected to the power terminal 403a mainly via conductive vias TH1 and TH2 within the imaging substrate 402. Furthermore, the heat transfer member G1 is in contact with the power supply wiring layer P2a of the conductor layer P2, and the heat transfer member G2 is in contact with the power supply wiring layer P3a.

[0028] In this embodiment, the heat transfer member G1 is located inside the insulating layer K1, and the heat transfer member G2 is located inside the insulating layer K2. Within the imaging board 402, the heat transfer member G1 is disposed closer to the imaging element 401 (closer to the mounting surface 402b) than the heat transfer member G2 in the thickness direction (direction of the optical axis C) of the imaging board 402. This allows heat to be transferred from the power supply terminal 403a to the power supply wiring layer P1a, and the heat transferred to the power supply wiring layer P2a is then efficiently transferred to the heat transfer member G1. Similarly, the heat transferred from the power supply wiring layer P2a to the power supply wiring layer P3a is also efficiently transferred to the heat transfer member G2.

[0029] In particular, heat transfer member G1 is connected to fixed portion 408, and heat transfer member G2 is connected to movable portion 406, so heat transfer members G1 and G2 separate the destinations of heat from imaging board 402 into fixed portion 408 and movable portion 406. This makes it possible to prevent heat from concentrating, and allows heat from imaging element 401 to be dissipated efficiently.

[0030] Heat transfer members G1 and G2 are exposed by being pulled out from the outer edges of imaging board 402. The portion of heat transfer member G1 that is pulled out from imaging board 402 is called pulled-out portion G1a, and the portion of heat transfer member G2 that is pulled out from imaging board 402 is called pulled-out portion G2a. Pull-out portions G1a and G2a have an overlapping area when viewed from the optical axis direction. This allows each of heat transfer members G1 and G2 to have a large width in the X direction, thereby improving the heat transfer effect.

[0031] Furthermore, both heat transfer members G1 and G2 overlap with the power terminal 403a in the optical axis direction within the imaging board 402 (they have an overlapping area when viewed from the optical axis direction). This shortens the distance from the power terminal 403a to the heat transfer members G1 and G2, allowing the heat from the power terminal 403a to be efficiently transferred to the heat transfer members G1 and G2. Furthermore, within the projected area of ​​the imaging board 402, the mounting area 402e of the imaging element 401 and each of the heat transfer members G1 and G2 have an overlapping area when viewed from the optical axis direction. This shortens the distance from the imaging element 401 to the heat transfer members G1 and G2, allowing the heat from the imaging element 401 to be efficiently transferred to the heat transfer members G1 and G2. Therefore, a short and efficient heat transfer path can be formed, improving heat dissipation efficiency.

[0032] Heat transfer members G3 and G4 differ from heat transfer members G1 and G2 in that the direction in which they are drawn from imaging board 402 is the -X direction. However, other than this, their configurations are the same as those of heat transfer members G1 and G2. That is, heat transfer members G1 and G2 can be considered as being replaced with heat transfer members G3 and G4, respectively. For example, in the thickness direction (optical axis C direction) of imaging board 402, heat transfer member G3 (third heat transfer member) is disposed closer to imaging element 401 (closer to mounting surface 402b) than heat transfer member G4 (fourth heat transfer member).

[0033] As described above, the heat transfer members G1 and G2 are drawn out from the imaging substrate 402 at a side portion 402a on the +Y side of the imaging substrate 402 (FIG. 6). The side portion 402a faces the coil C1 across the optical axis C (see FIGS. 4 and 5). In other words, in the rectangular shape of the imaging substrate 402, the side portion 402a is located diagonally (on the +Y side) with respect to the edge on the -Y side on which the coil C1 is disposed. Therefore, the heat transfer members G1 and G2 and the coil C1 can be efficiently accommodated. Meanwhile, the heat transfer members G3 and G4 are drawn out from the imaging substrate 402 at a side portion 402c on the -X side of the imaging substrate 402 (FIG. 7). The side portion 402c faces the coil C2 across the optical axis C (see FIGS. 4 and 5). In other words, in the rectangular shape of imaging board 402, side 402c is located at a diagonal position (-X side) relative to the +X side edge on which coil C2 is located. Therefore, heat transfer members G3 and G4 and coil C2 can be efficiently accommodated. This arrangement relationship between heat transfer members G1 to G4 and coils C1 and C2 can prevent the imaging unit 400 from becoming larger.

[0034] 9 is a rear perspective view of the movable part 406, the imaging board 402, and the board holding member 405. The imaging unit 400 is further provided with a heat transfer member G5 (fifth heat transfer member) and a heat transfer member G6 (sixth heat transfer member) (see also FIGS. 4 and 5). Both the heat transfer members G5 and G6 thermally connect the imaging board 402 and the movable part 406. The materials constituting the heat transfer members G5 and G6 are the same as those of the heat transfer members G1 to G4.

[0035] Heat transfer member G5 is disposed at a position opposite to heat transfer member G1 across the optical axis C. In other words, in the rectangular shape of imaging board 402, heat transfer member G5 is located on the side diagonal to the side on which heat transfer member G1 is located. Heat transfer member G6 is disposed at a position opposite to heat transfer member G3 across the optical axis C. In other words, in the rectangular shape of imaging board 402, heat transfer member G6 is located on the side diagonal to the side on which heat transfer member G3 is located. Such an arrangement of heat transfer members G5 and G6 ensures that the heat generated within imaging element 401 is uniformly distributed without being unevenly distributed, which contributes to suppressing deterioration in image quality of imaging element 401.

[0036] Furthermore, slits S1 and S3 are provided in the heat transfer members G1 and G3, respectively. The slits S1 and S3 are formed in the direction in which the heat transfer members G1 and G3 are drawn out. Because the fixed portion 408 and the movable portion 406, to which the heat transfer members G1 and G3 are connected, move relative to each other, a torsional load is generated in the heat transfer members G1 and G3. However, the slits S1 and S3 can reduce the torsional load on the heat transfer members G1 and G3 when the movable portion 406 moves. This makes it difficult for an excessive load to be generated in the fixed portion 408, and does not significantly affect the image blur correction characteristics. Furthermore, damage to the heat transfer members G1 and G3 can also be suppressed.

[0037] Here, the width of slit S3 is wider than the width of slit S1. The width here refers to the width in the direction perpendicular to the drawing direction. As a result, when the maximum amount of movement of the movable part 406 in the Y direction is greater than the maximum amount of movement of the movable part 406 in the X direction, the wider width of slit S3 can reduce the load generated on the heat transfer member G3. Note that when the maximum amount of movement of the movable part 406 in the X direction is greater than the maximum amount of movement of the movable part 406 in the Y direction, the wider width of slit S1 can reduce the load generated on the heat transfer member G1. Therefore, by making the width of the slit whose width direction is the direction in which the maximum amount of movement of the movable part 406 is greater wider (larger), the load generated on the heat transfer member can be effectively reduced.

[0038] 10 is an enlarged cross-sectional view of the portion where heat transfer members G1 and G2 are pulled out from imaging board 402. Reinforcing members H1 and H2 made of a material such as an adhesive are provided at the base portions of heat transfer members G1 and G2 pulled out from imaging board 402. Reinforcement by reinforcing members H1 and H2 can suppress damage caused by tensile or twisting loads that occur at the base portions of heat transfer members G1 and G2 on the board side, thereby improving durability.

[0039] The reinforced portions of the heat transfer members G1 and G2 are not limited to the portions directly connected to the imaging board 402, but may be portions drawn out from the board holding member 405. Similarly, the drawn-out base portions of the heat transfer members G3 and G4 may be reinforced with a reinforcing member.

[0040] According to this embodiment, bendable heat transfer members G1 and G2 are extended from the imaging substrate 402. The heat transfer member G1 is fixed to the fixed portion 408, and the heat transfer member G2 is fixed to the movable portion 406. The heat transfer member G1 is closer to the mounting surface 402b of the imaging element 401 in the thickness direction of the imaging substrate 402 than the heat transfer member G2. This allows most of the heat generated by the imaging element 401 to be transferred directly and efficiently to the fixed portion 408 via the heat transfer member G1, compared to a configuration in which a heat transfer member is interposed between the movable portion 406 and the fixed portion 408. Furthermore, since the destinations of heat from the imaging substrate 402 are separated between the fixed portion 408 and the movable portion 406, heat concentration is suppressed. Moreover, because the heat transfer members G1 and G2 are bendable, they do not significantly impede the movement of the movable portion 406. Therefore, heat from the imaging element 401 can be efficiently dissipated without significantly reducing the image blur correction function.

[0041] Moreover, the heat transfer members G3 and G4 can also exert the same effects as the heat transfer members G1 and G2.

[0042] Furthermore, the lead-out portions G1a and G2a of the heat transfer members G1 and G2 from the imaging substrate 402 have regions that overlap each other when viewed from the optical axis direction, so that a large width in the X direction can be ensured, thereby improving the heat transfer effect.

[0043] Furthermore, within the projected area of ​​the imaging board 402, the mounting area 402e of the imaging element 401 and the heat transfer members G1 and G2 have an area where they overlap when viewed from the optical axis direction, so a short and efficient heat transfer path can be formed, thereby improving heat dissipation efficiency.

[0044] Furthermore, since the heat transfer members G1 and G2 are thermally connected to the power supply terminal 403a inside the imaging board 402, the heat of the imaging element 401 can be efficiently transferred to the fixed part 408 and the movable part 406.

[0045] Furthermore, since the heat transfer members G1 and G2 are drawn out from positions facing the coil C1 across the optical axis C, it is possible to prevent the image pickup unit 400 from becoming large.

[0046] Furthermore, the heat transfer members G5 and G6 are disposed at positions facing the heat transfer members G1 and G3 across the optical axis C, respectively, and therefore it is possible to suppress uneven distribution of heat and suppress deterioration of image quality.

[0047] Furthermore, by widening the width of the slit, the width direction of which corresponds to the maximum movable amount of the movable portion 406, the load on the heat transfer member can be reduced.

[0048] Furthermore, since the base portions of the heat transfer members G1 and G2 are reinforced, durability can be improved.

[0049] The image stabilization device of the present invention may be applied to a photographing lens alone.

[0050] The present invention has been described in detail above based on its preferred embodiments, but the present invention is not limited to these specific embodiments, and various forms within the scope of the invention that do not deviate from the gist of the invention are also included in the present invention. [Explanation of symbols]

[0051] 200 Main Base 401 Image sensor 402 Imaging board 402b Mounting surface 406 Moving parts 408 Fixed part G1, G2 heat transfer material

Claims

1. a fixed portion fixed to a housing; a substrate on which an imaging element is mounted; a movable portion to which the substrate is fixed and which is movable relative to the fixed portion; a bendable first heat transfer member drawn out from the substrate and fixed to the fixing portion; a bendable second heat transfer member that is drawn out from the substrate and fixed to the movable portion, Within the substrate, the first heat transfer member is closer to a mounting surface of the imaging element in a thickness direction of the substrate than the second heat transfer member, The image stabilization device according to claim 1, wherein the first heat transfer member and the second heat transfer member are thermally connected to a power supply terminal of the image sensor within the substrate.

2. 2. The image blur correction device according to claim 1, wherein a portion of the first heat transfer member that is extended from the substrate and a portion of the second heat transfer member that is extended from the substrate have an overlapping area when viewed from the imaging optical axis direction.

3. 3. The image stabilization device according to claim 1, wherein within the projected area of ​​the substrate, the mounting area of ​​the image sensor and each of the first heat transfer member and the second heat transfer member have overlapping areas when viewed from the imaging optical axis direction.

4. a coil for moving the movable part relative to the fixed part; 4. The image blur correction device according to claim 1, wherein the first heat transfer member and the second heat transfer member are drawn out from positions on the side of the substrate that face the coil across the imaging optical axis.

5. the first heat transfer member and the second heat transfer member are drawn out from the substrate in the same direction; a bendable third heat transfer member that is drawn out from the substrate in a direction different from the first and second heat transfer members and that is fixed to the fixing portion; a bendable fourth heat transfer member that is drawn out from the substrate in a direction different from the first and second heat transfer members and that is fixed to the movable portion, 5. The image stabilization device according to claim 1, wherein, within the substrate, the third heat transfer member is closer to the mounting surface of the image sensor in the thickness direction of the substrate than the fourth heat transfer member.

6. 6. The image blur correction device according to claim 5, wherein slits are formed in the first heat transfer member and the third heat transfer member in the direction in which they are drawn out.

7. a maximum movable amount of the movable part in the drawing direction of the first heat transfer member is larger than a maximum movable amount of the movable part in the drawing direction of the third heat transfer member, 7. The image blur correction device according to claim 6, wherein the width of the slit formed in the third heat transfer member is wider than the width of the slit formed in the first heat transfer member.

8. 8. The image blur correction device according to claim 1, further comprising a fifth heat transfer member that thermally connects the substrate and the movable portion to each other, the fifth heat transfer member being disposed opposite the first heat transfer member across the imaging optical axis.

9. 8. The image blur correction device according to claim 5, further comprising a sixth heat transfer member that thermally connects the substrate and the movable portion to each other, the sixth heat transfer member being disposed opposite the third heat transfer member across the imaging optical axis.

10. 10. The image stabilization device according to claim 1, wherein the base portions of the first heat transfer member and the second heat transfer member that are pulled out from the substrate are reinforced by a reinforcing member.

11. An imaging device comprising the image blur correction device according to any one of claims 1 to 10.

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