Encapsulation system for an optoelectronic component comprising at least a first capsule and a second capsule and an optoelectronic component comprising such an encapsulation system

Abstract

The present invention relates to an encapsulation system (1), in particular a double encapsulation, for an optoelectronic component (2), comprising at least a first encapsulation (3) and a second encapsulation (4), wherein the first encapsulation (3) is formed from at least a front barrier layer (5) on the front side of the optoelectronic component (2) and at least a back barrier layer (6) on the back side of the optoelectronic component (2), with at least a first connecting material (7) attached therebetween, and the second encapsulation (4) is formed from at least a front protective layer (8) on the front side of the optoelectronic component (2) and at least a back protective layer (9) on the back side of the optoelectronic component (2), with at least a second connecting material (10) attached therebetween. The first capsule (3) surrounds the optoelectronic component (2) such that the first capsule (3) protrudes from the optoelectronic component (2) by a first end region (11), and the second capsule (4) surrounds the first capsule (3) together with the optoelectronic component (2) such that the second capsule (4) protrudes beyond the first end region (11) of the first capsule (3) by a second end region (12).

Description

[Technical Field]

[0001] The present invention relates to an encapsulation system for an optoelectronic component, comprising at least a first encapsulation and a second encapsulation, and to an optoelectronic component comprising such an encapsulation system. [Background technology]

[0002] Optoelectronics comprises the fields of optics and semiconductor electronics. It includes, in particular, systems and methods that enable the conversion of electronically generated energy into or from optical transmission. Optoelectronic components, in particular organic photovoltaics and organic light-emitting diodes (OLEDs), generate or convert electrical energy into optical transmission.

[0003] Organic optoelectronic components, in particular organic solar cells, consist of a sequence of thin layers with at least one photoactive layer, which are preferably deposited in a vacuum or processed from a solution. Electrical connections can be made via metal layers, transparent conductive oxides, and / or transparent conductive polymers. Vacuum deposition of organic layers is particularly advantageous for the production of multilayer solar cells, in particular tandem or triple cells. Organic single or tandem cells have been disclosed in the prior art. DE 102004014046 A1 discloses a photovoltaic component, in particular a solar cell, consisting of an organic layer composed of one or more pI, nI, and / or pI n diodes stacked on top of each other.

[0004] Organic optoelectronic components, in particular organic photovoltaic or organic photodetector components, exhibit very short lifetimes due to direct contact with air, in particular oxygen and / or moisture, in particular water, and therefore must be adequately protected by barrier layers and / or encapsulation. Organic optoelectronic components, in particular organic photovoltaic components, therefore require a protective barrier against moisture and / or oxygen, in particular an encapsulation, to prevent contact of moisture and / or oxygen with the layer system of the optoelectronic component, in particular with the organic photoactive layer of the layer system.

[0005] Organic optoelectronic components can be protected against both moisture and oxygen ingress and mechanical damage by applying protective layers or encapsulants. While specific films and layers with different properties are known for this purpose, they are expensive and extremely complex to coat, with only a few films available that meet these high demands. Furthermore, during the coating process, the corners of the encapsulated optoelectronic components must be protected against layer delamination and the resulting moisture and / or oxygen ingress. The corners and edges are sealed in complex ways for this purpose. Flexible solar cells are known that are provided with protective layers, typically laminates or film composites, that protect the internal components from external influences and allow reliable electrical contact from the outside. The demands on materials are particularly stringent when a good moisture barrier is required.

[0006] US Pat. No. 5,699,499 discloses a multilayer film for optoelectronic components that includes one or more barrier layers with low moisture and / or oxygen permeability and one or more sealing layers.

[0007] Patent document 2 discloses a multilayer encapsulation having a sequence of layers including at least one barrier layer and at least one planarization layer, both of which have a lower water permeability than the barrier layer, and an optoelectronic component having an encapsulation.

[0008] Patent Document 3 discloses a method and apparatus for improving the protection of solar cells, which comprises individual capsules for the solar cells, the encapsulated solar cells having at least one protective layer on at least one side of the solar cells, the at least one protective layer being formed essentially from an inorganic material.

[0009] Patent Document 4 discloses an organic optoelectronic component, which has a substrate on which at least one layer system is arranged and a multilayer barrier layer on the at least one layer system.

[0010] US Pat. No. 5,699,499 discloses an organic optoelectronic component, which has a vacuum-deposited protective layer for protecting the organic optoelectronic component from moisture and oxygen.

[0011] However, a drawback of the prior art is that the end regions and edges resulting from the barrier layer and / or encapsulation are not sufficiently protected from external influences, in particular moisture and / or oxygen. The end regions and edges are particularly fragile or may at least crack as a result of bending or wrinkling, which reduces the protection of the optoelectronic component and therefore its service life. Furthermore, simply bonding barrier layers stacked one on top of the other in a planar manner does not provide adequate barrier functionality. [Prior art documents] [Patent documents]

[0012] [Patent Document 1] European Patent Application Publication No. 2927985 [Patent Document 2] German Patent Application Publication No. 102016106846 [Patent Document 3] International Publication No. 2008 / 014492 [Patent Document 4] US Patent Application Publication No. 2007 / 0216300 [Patent Document 5] U.S. Patent No. 6,765,351 Summary of the Invention [Problem to be solved by the invention]

[0013] It is therefore an object of the present invention to provide an encapsulation element for an optoelectronic component having at least a first encapsulation and a second encapsulation system, in which the aforementioned drawbacks do not occur and in which better protection of the optoelectronic component from external influences is particularly ensured. [Means for solving the problem]

[0014] This object is achieved by the subject matter of the independent claims. Advantageous configurations will become apparent from the dependent claims.

[0015] This object is particularly achieved in that an encapsulation system, in particular a double encapsulation, for an optoelectronic component is provided, which has at least a first encapsulation and a second encapsulation, the first encapsulation being formed from at least one front barrier layer on the front surface of the optoelectronic component and at least one back barrier layer on the back surface of the optoelectronic component, with at least one first connecting material disposed therebetween, and the second encapsulation being formed from at least one front protective layer on the front surface of the optoelectronic component and at least one back protective layer on the back surface of the optoelectronic component, with at least one second connecting material disposed therebetween, wherein the first encapsulation surrounds the optoelectronic component such that the first encapsulation protrudes beyond the optoelectronic component by a first end region, and the second encapsulation surrounds the first encapsulation containing the optoelectronic component such that the second encapsulation protrudes beyond the first end region of the first encapsulation by a second end region. The second capsule is now arranged on the first capsule, in particular at least one front protective layer is arranged on at least one front barrier layer and at least one back protective layer is arranged on at least one back barrier layer.

[0016] This is preferably the case when the encapsulation system according to the present invention has different zones, particularly encapsulation zones, which perform particularly different functions, preferably with a plurality of material properties distributed between any two front and back layers. Preferably, the first encapsulation having a first end region with a specific width at least largely prevents water diffusion into the optoelectronic component, and the second encapsulation having a second end region with a specific width ensures mechanical protection of the first encapsulation and thus the optoelectronic component. More specifically, the first end region of the overhang and the second end region of the overhang can prevent moisture and / or oxygen from penetrating through the second encapsulation and the first encapsulation to the optoelectronic component. The width of the first end region of the first encapsulation and the width of the second end region of the second encapsulation are particularly formed so that the diffusion length of the first end region and / or the second end region is sufficient to prevent moisture and / or oxygen from penetrating the interior of the encapsulation, particularly the optoelectronic component.

[0017] A connecting material is to be understood in particular to mean a material, preferably an adhesive or a layer of material, in particular a layer of adhesive, by which one element is fixed, in particular bonded, to another element, in particular two layers are bonded to each other so that they are tightly joined to each other.

[0018] The front surface of an optoelectronic component, in particular a photovoltaic element, and correspondingly the front barrier layer and the front protective layer, are to be understood to mean the surface of the optoelectronic component that is intended to face the sunlight. Accordingly, the back surface of an optoelectronic component, in particular a photovoltaic element, and correspondingly the back barrier layer and the back protective layer, are to be understood to mean the surface of the optoelectronic component that is intended to face away from the sunlight.

[0019] An edge region of the capsule is to be understood to mean in particular a region which protrudes beyond the area of ​​another element, in particular an optoelectronic component of another capsule, i.e. which has a larger area than the other element.

[0020] In a preferred embodiment of the present invention, the first capsule, preferably the front and / or back surface of the first capsule, is formed from at least two barrier layers, preferably two barrier layers or preferably three barrier layers, and / or the second capsule, preferably the front and / or back surface of the second capsule, is formed from at least two protective layers, preferably two protective layers or preferably three protective layers. In a preferred embodiment of the present invention, at least one connecting material is applied in each case between successive barrier layers and / or successive protective layers, and the type of the at least one connecting material can be different in each case.

[0021] A barrier layer is understood to mean a layer that provides protection, in particular a barrier, against chemicals, pollutants, moisture and / or oxygen, in particular atmospheric oxygen. A barrier layer is in particular a layer that prevents penetration by external influences, in particular atmospheric oxygen and / or moisture. In a particularly preferred embodiment, the barrier layer is also a protective layer.

[0022] Protective layer is understood to mean in particular a layer for increasing the mechanical durability, in particular scratch resistance, and / or a layer having a filter layer, in particular a UV filter. In a particularly preferred embodiment, the protective layer is also a barrier layer.

[0023] Edges of an optoelectronic component or capsule are to be understood in particular to mean the end regions of the optoelectronic component or capsule, in particular the edges of the optoelectronic component or capsule which are arranged in the geometric plane of their greatest horizontal extent.

[0024] In preferred embodiments of the present invention, the optoelectronic component is an LED, an OLED, a photovoltaic element, in particular a solar cell, an organic photovoltaic element, in particular an organic solar cell, or a photodetector, in particular an organic photodetector.

[0025] In a preferred embodiment of the present invention, the first capsule, in particular the front surface of the first capsule, and / or the second capsule, in particular the front surface of the second capsule, are at least mostly transparent, in particular at least mostly translucent, for light in the visible wavelength range. In a preferred embodiment of the present invention, the at least one front barrier layer, the at least one front protective layer, and the first and second connecting materials are at least mostly translucent for light in the visible wavelength range.

[0026] In a preferred embodiment of the present invention, the first capsule and / or the second capsule are at least partially transparent on the side facing sunlight as intended, and at least one front barrier layer of the first capsule and at least one front barrier layer of the second capsule are at least partially transparent.

[0027] The encapsulation system of the present invention for an optoelectronic component, comprising at least a first encapsulation and a second encapsulation, is advantageous compared to the prior art. Advantageously, the encapsulation system provides particularly good protection for the optoelectronic component from external influences, particularly environmental influences and mechanical damage. Advantageously, the edges and / or corners of the first encapsulation are covered and protected by the second encapsulation. Advantageously, the edges of the encapsulation are protected from delamination. Advantageously, the lifetime of the optoelectronic component is extended. Advantageously, different properties are distributed between at least the first encapsulation and the second encapsulation layer, particularly by barrier and / or protective layers having different properties. Advantageously, there is less dependency on suppliers of specific barrier and / or protective layers. Advantageously, the distribution of requirements between different encapsulations and / or encapsulation layers is possible. Advantageously, electrical contact connections are made by contact elements that extend mostly outside the first encapsulation and below the second encapsulation, thereby reducing the complexity associated with the barrier of the first encapsulation. Advantageously, the encapsulation system can be produced easily, flexibly, and at low cost, especially by roll-to-roll process.By roll-to-roll process, it is understood that it is particularly the production of flexible electronic components that are deposited on a flexible polymer film or a sheet of metal foil.A substrate, especially made of a polymer film, for example PET or PEN, on a roll is unwound, processed, and finally rolled up again.To form the electronic components, materials are deposited on this substrate, especially by evaporation, printing, coating, sputtering, or plasma deposition.By roll-to-roll process, it is particularly understood that it is a continuous processing method in which individual components are processed continuously.

[0028] In the context of the present invention, an element, in particular a layer, coated, deposited or formed on another element, in particular another layer, is understood to mean a direct contact of one element with the other element or an indirect contact, in particular by means of another layer disposed between both.

[0029] According to one development of the invention, the first capsule is formed over the entire area of ​​the optoelectronic component, the second capsule is formed over the entire area of ​​the first capsule, and / or the first end region of the first capsule is formed around the optoelectronic component, and / or the second end region of the second capsule is formed around the first capsule, preferably with the width of the first end region being formed differently depending on the edge of the optoelectronic component and / or the width of the second end region being formed differently depending on the edge of the first capsule.

[0030] In a preferred embodiment of the present invention, the corners of the first capsule and / or the second capsule are rounded.

[0031] In one development of the invention, at least one front barrier layer and at least one back barrier layer of the first capsule are formed from different materials and / or a different number of layers, and / or at least one front protective layer and at least one back protective layer of the second capsule layer are formed from different materials and / or a different number of layers.

[0032] In one development of the invention, the first capsule is formed from at least two front and / or back barrier layers, in particular barrier layers with different properties, and / or the second capsule is formed from at least two front and / or back protective layers, in particular protective layers with different properties, the first capsule preferably providing protection against moisture and / or oxygen, in particular atmospheric oxygen, and the second capsule providing mechanical protection.

[0033] In one development of the invention, a bonding layer is arranged between the optoelectronic component and the first encapsulation, and / or a bonding layer is arranged between the first encapsulation and the second encapsulation, and / or a planarization layer is arranged between the optoelectronic component and the first encapsulation.

[0034] In a preferred embodiment of the invention, a bonding layer is arranged between the optoelectronic component and the first capsule and / or the bonding layer is arranged between the first capsule and the second capsule and is made of a material selected from the group consisting of siloxanes / polysiloxanes in monomeric, oligomeric or polymeric form, epoxides, in particular epoxy resins, acrylates / polyacrylates, in particular polymethyl methacrylate (PMMA), styrene / polystyrene, urethanes / polyurethanes or derivatives thereof.

[0035] In one development of the invention, the layer thickness of the first capsule is 20 μm to 400 μm, preferably 50 μm to 200 μm, and / or the layer thickness of the second capsule is 50 μm to 1000 μm, preferably 50 μm to 500 μm or preferably 100 μm to 500 μm, and / or the layer thickness of the first connecting material and / or the second connecting material is 10 μm to 300 μm, preferably 20 μm to 150 μm or preferably 20 μm to 100 μm. If the capsule has several layers, the individual layers relative to one another may have equal or different layer thicknesses.

[0036] In a preferred embodiment of the present invention, the layer thickness of the first capsule is 1 μm to 2000 μm, preferably 1 μm to 1000 μm, preferably 1 μm to 100 μm, preferably 1 μm to 10 μm, preferably 5 μm to 1000 μm, preferably 10 μm to 1000 μm, preferably 10 μm to 500 μm, preferably 10 μm to 200 μm, preferably 10 μm to 100 μm, preferably 20 μm to 200 μm, preferably 20 μm to 100 μm, preferably 20 μm to 100 μm, preferably 50 μm to 500 μm, preferably 50 μm to 200 μm or preferably 50 μm to 100 μm.

[0037] In a preferred embodiment of the present invention, the layer thickness of the second capsule is 10 μm to 2000 μm, preferably 10 μm to 1000 μm, preferably 10 μm to 500 μm, preferably 10 μm to 100 μm, preferably 10 μm to 200 μm, preferably 10 μm to 100 μm, preferably 20 μm to 200 μm, preferably 20 μm to 100 μm, preferably 20 μm to 100 μm, preferably 50 μm to 500 μm, preferably 50 μm to 200 μm or preferably 50 μm to 100 μm. In a preferred embodiment of the present invention, the layer thickness of the second capsule is at least 100 μm, preferably at least 1000 μm or preferably at least 2000 μm.

[0038] In a preferred embodiment of the present invention, the capsule system has flexible properties, and the elasticity (modulus of elasticity) of the capsule system is 80,000 psi to 360,000 psi, preferably 100,000 psi to 300,000 psi, preferably 120,000 psi to 260,000 psi or preferably 100,000 psi to 200,000 psi.

[0039] In one development of the invention, the width of the first end region is 5 mm to 200 mm, preferably 5 mm to 100 mm, preferably 10 mm to 100 mm, preferably 10 mm to 80 mm, preferably 10 mm to 50 mm, preferably 10 mm to 30 mm, preferably 20 mm to 100 mm or preferably 20 mm to 50 mm and / or the width of the second end region is 5 mm to 100 mm, preferably 5 mm to 50 mm, preferably 5 mm to 40 mm, preferably 5 mm to 30 mm, preferably 8 mm to 50 mm, preferably 8 mm to 40 mm, preferably 8 mm to 30 mm, preferably 10 mm to 80 mm, preferably 10 mm to 50 mm, preferably 10 mm to 40 mm, preferably 10 mm to 30 mm or preferably 20 mm to 40 mm.

[0040] In one development of the invention, the layer thickness of the first capsule decreases partially towards the first end region, preferably continuously or discontinuously, to a width of the first end region of preferably 5 mm to 60 mm, preferably 20 mm to 30 mm, and / or the layer thickness of the second capsule decreases partially towards the second end region, preferably continuously or discontinuously, to a width of the second end region of preferably 5 mm to 50 mm, preferably 8 mm to 20 mm.

[0041] In one development of the invention, the at least one barrier layer and / or the at least one protective layer is a UV protection layer, an anti-reflection layer, a moisture-proof and / or anti-oxygen, in particular anti-atmospheric oxygen layer and / or a mechanical protection layer, in particular for increasing scratch resistance.

[0042] In one development of the invention, at least one front barrier layer and / or at least one back barrier layer comprises a material selected from the group consisting of polyacrylate (PA), polycarbonate (PC), polyethylene (PE), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polypropylene (PP), polyvinyl chloride (PVC) and thermoplastic polyurethane (TPU), preferably the material of the front and / or back barrier layer is coated, and / or at least one front protective layer and / or at least one back protective layer comprises a material selected from the group consisting of ethylene vinyl acetate (EVA), polyacrylate (PA), polycarbonate (PC), polyethylene (PE), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polypropylene (PP), polyvinyl chloride (PVC) and thermoplastic polyurethane (TPU), preferably the material of the front and / or back protective layer is coated.

[0043] In a preferred embodiment of the present invention, at least one barrier layer and / or at least one protective layer has a coating, which provides the barrier layer and / or the protective layer with specific functional properties. In a preferred embodiment of the present invention, at least one barrier layer and / or at least one protective layer is made of ethylene tetrafluoroethylene (ETFE), polyvinylidene fluoride (PVDF), polyvinyl fluoride (PVF) or polytetrafluoroethylene (PTFE), or Al2O3, ITO (indium tin oxide), SiO2 x , coated with TiO2 or ZrO2.

[0044] In a preferred embodiment of the present invention, the first capsule and / or the second capsule are at least largely electrically insulating.

[0045] In one development of the invention, the first and / or second connecting material is preferably selected from the group consisting of acrylates, epoxides and polyurethanes, preferably in one- or two-component compositions. In a preferred embodiment of the invention, the first and / or second connecting material is preferably a UV- or thermally curable, preferably crosslinkable, material.

[0046] Encapsulating connecting material is understood to mean in particular a material for connecting layers, in particular barrier layers and / or protective layers, to one another and / or to the optoelectronic component, in particular by adhesive bonding.

[0047] In a preferred embodiment of the present invention, the first and / or second connecting material is selected from the group consisting of siloxanes / polysiloxanes in monomeric, oligomeric or polymeric form, epoxides, in particular epoxy resins, acrylates / polyacrylates, in particular polymethyl methacrylate (PMMA), styrene / polystyrene, urethane / polyurethane or derivatives thereof.

[0048] In a preferred embodiment of the present invention, the first connecting material and / or the second connecting material include an initiator and / or catalyst to promote curing and / or crosslinking.

[0049] In a preferred embodiment of the present invention, the layer thickness of the first end region of the first capsule is 1 μm to 100 μm, preferably 10 μm to 50 μm or preferably 10 μm to 30 μm, and / or the layer thickness of the second end region of the second capsule is 1 μm to 100 μm, preferably 10 μm to 50 μm, preferably 10 μm to 30 μm.

[0050] In one development of the invention, the first end region and / or the second end region, in particular the end of the first end region and / or the end of the second end region, are sealed.

[0051] In one development of the invention, at least two optoelectronic components are encapsulated together in a capsule system, preferably at least two optoelectronic components are each individually encapsulated by a first capsule and collectively encapsulated by a second capsule.

[0052] In a preferred embodiment of the present invention, a functional layer may be arranged at least partially between the first capsule and the second capsule and / or between the optoelectronic component and the first capsule, which is preferably a color layer, a filter layer and / or an adhesive layer.

[0053] In a preferred embodiment of the invention, the encapsulation system comprises at least one further encapsulation, preferably a third encapsulation, in which the third encapsulation surrounds the second encapsulation, or a third encapsulation and a fourth encapsulation, in which the third encapsulation surrounds the second encapsulation and the fourth encapsulation surrounds the third encapsulation. In a preferred embodiment of the invention, the third encapsulation is composed of at least one front protective layer on the front surface of the optoelectronic component and at least one back protective layer on the back surface of the optoelectronic component, with at least one connecting material disposed therebetween, and preferably surrounds the second encapsulation such that the third encapsulation protrudes beyond the second end region of the second encapsulation only in its end regions.

[0054] The object of the present invention is also achieved by providing an optoelectronic component, preferably a flexible optoelectronic component, having an inventive encapsulation system, in particular a double encapsulation, in particular according to one of the above-mentioned embodiments. The advantages obtained with respect to the optoelectronic component are in particular those already mentioned in connection with the encapsulation system. The optoelectronic component has a layer system comprising an electrode, a counterelectrode and at least one photovoltaic layer, the at least one photovoltaic layer being arranged between the two electrodes.

[0055] In a preferred embodiment of the present invention, the photovoltaic device comprises a cell with at least one photovoltaic layer, in particular a CIS cell, a CIGS cell, a GaAs cell or a Si cell, a perovskite cell or an organic photovoltaic device (OPV), which are also called organic solar cells.

[0056] Organic photovoltaic elements are understood to mean photovoltaic elements having at least one photovoltaic layer, in particular polymer organic photovoltaic elements or small molecule organic photovoltaic elements. While polymers are characterized by their non-evaporative nature and therefore can only be applied from solution, small molecules are usually evaporative and, like polymers, can also be deposited as a liquid or by vapor deposition, in particular vacuum deposition. Organic photoactive layers are in particular photoactive layers in which excitons (electron-hole pairs) are formed by visible light radiation, UV radiation, and / or IR radiation. The organic materials are then deposited in the form of thin films or small volumes on foils by printing, bonding, coating, vapor deposition, or any other method.

[0057] In a particularly preferred embodiment of the present invention, at least one photoactive layer is formed from an organic material, preferably from small organic molecules or organic polymers, particularly preferably from small organic molecules.

[0058] Small molecules are understood to mean, in particular, non-polymeric organic molecules with a monodisperse molar mass of 100 to 2000 g / mol and in a solid phase at standard pressure (the atmospheric pressure around humans) and room temperature. More specifically, small molecules are photoactive, with "photoactive" being understood to mean that the molecule changes its charge and / or polarization state upon the input of light.

[0059] In a preferred embodiment of the invention, the optoelectronic component has a substrate, in particular a foil, on which the layer system of the optoelectronic component is arranged.

[0060] In one development of the invention, the optoelectronic component has at least one busbar, preferably two busbars, arranged under the first capsule and / or the second capsule and at least partially in conductive contact with an electrode and / or a counter-electrode of the optoelectronic component, and at least one busbar in conductive contact with a connection box outside the second capsule by means of at least one contact element.

[0061] A busbar is understood to mean, in particular, an arrangement that is electrically conductively connected to the input and output lines, preferably by means of at least one electrode and / or at least one counter electrode, as a central distributor of electrical energy, for the purpose of making electrical contacts. The busbar is in particular in the form of a flat ribbon, strip, plate or metal layer.

[0062] A connection box is understood to mean in particular an element for connecting an optoelectronic component to an external circuit, which serves in particular to electrically connect at least one bus bar arranged under at least one protective layer of the optoelectronic component to an electrical circuit.

[0063] In a preferred embodiment of the invention, contact elements, in particular electrically conductive contact elements, are arranged at least approximately between the first and second capsules and are electrically conductively contacted through the first capsule to the layer system of the optoelectronic component.

[0064] In one development of the invention, the optoelectronic component is a photovoltaic element, in particular a solar cell.

[0065] In a preferred embodiment of the present invention, multiple cells of a photovoltaic device are placed together and connected in series, each cell preferably having its own electrode and counter-electrode, and the series connection is made by electrically connecting the electrode of one cell to the counter-electrode of the next cell.

[0066] An optoelectronic component is understood to mean, in particular, a photovoltaic element. A photovoltaic element is understood to mean, in particular, a photovoltaic cell, in particular a solar cell. A photovoltaic element is preferably formed from a plurality of photovoltaic cells, which may be connected in series or in parallel. The plurality of photovoltaic cells may be arranged and / or connected in various ways within the optoelectronic component.

[0067] In a preferred embodiment of the present invention, the at least one bus bar is directly attached to, and preferably conductively connected to, the electrode or counter electrode. In an alternative preferred embodiment, a conductive layer is disposed between the at least one bus bar and the electrode or counter electrode.

[0068] In a preferred embodiment of the invention, the optoelectronic component is a flexible optoelectronic component.In a preferred embodiment of the invention, the flexible optoelectronic component is a flexible photovoltaic element, in particular a flexible organic photovoltaic element.

[0069] A flexible optoelectronic component is understood to mean an optoelectronic component that is particularly pliable and / or extensible in certain areas.

[0070] The invention will now be described in detail with reference to the drawings. [Brief explanation of the drawings]

[0071] [Figure 1] 1 is a schematic cross-sectional view of an embodiment of a layer system of an optoelectronic component; [Figure 2] 1 is a cross-sectional schematic view of an embodiment of an optoelectronic component with an encapsulation system. [Figure 3] 1 is a cross-sectional schematic view of an embodiment of an optoelectronic component with an encapsulation system. [Figure 4] 1 is a cross-sectional schematic diagram of an example embodiment of multiple optoelectronic components encapsulated within an encapsulation system. DETAILED DESCRIPTION OF THE INVENTION

[0072] The embodiments relate in particular to optoelectronic components manufactured in a roll-to-roll process.

[0073] FIG. 1 shows a schematic cross-sectional view of an embodiment of a layer system 20 of an optoelectronic component 2 .

[0074] The optoelectronic component 2, in particular an organic photovoltaic element, consists of a succession of thin layers, which comprises a layer system 20, which preferably includes at least one photoactive layer 26 deposited by vapor deposition in vacuum or from solution. Electrical connections can be realized via metal layers, transparent conductive oxides and / or transparent conductive polymers. Vacuum deposition of organic layers is particularly advantageous when producing multiple photovoltaic elements, in particular tandem or triple cells.

[0075] A layer system 20 of such an optoelectronic component 2 is shown in the example of Fig. 1. The optoelectronic component 2 comprises at least two electrodes 18, e.g., ITO and 19, e.g., aluminum, and a layer system 20 with at least one photoactive layer 26, with at least one absorber on a substrate 23, e.g., a polymer film, with the at least one photoactive layer 26 arranged between the two electrodes 18, 19. The layer system 20 may further comprise a hole transport layer 24 and a charge carrier layer 25. The layer system 20 with the electrodes 18, 19 may be structured by laser.

[0076] 2 shows a schematic cross-sectional view of an embodiment of an optoelectronic component 2 comprising an encapsulation system 1. Elements that are the same and have the same functions are given the same reference numerals, and reference is made to the previous description in this regard. In this embodiment, the optoelectronic component 2 is an organic photovoltaic element.

[0077] The encapsulation system 1, in particular the double encapsulation, for the optoelectronic component 2 comprises at least a first encapsulation 3 and a second encapsulation 4, the first encapsulation 3 being formed from at least one front barrier layer 5 on the front surface of the optoelectronic component 2 and at least one back barrier layer 6 on the back surface of the optoelectronic component 2, with at least a first connecting material 7 disposed therebetween, and the second encapsulation 4 being formed from at least one front protective layer 8 on the front surface of the optoelectronic component 2 and at least one back protective layer 9 on the back surface of the optoelectronic component 2, with at least a second connecting layer 10 disposed therebetween. The first encapsulation 3 surrounds the optoelectronic component 2 such that the first encapsulation 3 projects beyond the optoelectronic component 2 by a first end region 11. The second encapsulation 4 surrounds the first encapsulation 3 containing the optoelectronic component 2 such that the second encapsulation 4 projects beyond the first end region 11 of the first encapsulation 3 by a second end region 12. The optoelectronic component 2 is encapsulated and completely enclosed on all sides by the encapsulation system 1. The end regions 11, 12 can here be different.

[0078] As a result, the encapsulation system provides particularly good protection for the optoelectronic component 2 against external influences, in particular environmental influences and mechanical damage, so that in particular the edges and / or corners of the first encapsulation 3 are covered by the second encapsulation 4 and protected from peeling. Advantageously, the different properties of the barrier layers 5, 6 and / or protective layers 8, 9 are distributed at least between the first encapsulation 3 and the second encapsulation 4.

[0079] The barrier layers 5, 6 and / or protective layers 8, 9 for the formation of the first capsule 3 and / or the second capsule 4 may be deposited by deposition methods known to those skilled in the art, such as atomic layer deposition (ALD), plasma-enhanced atomic layer deposition (PEALD) or plasma-less atomic layer deposition (PLALD), by chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), plasma-less chemical vapor deposition (PLCVD), and / or alternatively by other suitable deposition methods.

[0080] In one configuration of the present invention, the first capsule 3 is formed over the entire area of ​​the optoelectronic component 2, the second capsule 4 is formed over the entire area of ​​the first capsule 3, and / or the first end region 11 of the first capsule 3 is formed around the optoelectronic component 2, and / or the second end region 12 of the second capsule 4 is formed around the first capsule 3, and the width 13 of the first end region 11 is formed differently depending on the edge of the optoelectronic component 2, and / or the width 14 of the second end region 12 is formed differently depending on the edge of the first capsule 3.

[0081] In another configuration of the present invention, the at least one front barrier layer 5 and the at least one back barrier layer 6 of the first capsule 3 are formed from different materials and / or a different number of layers, and / or the at least one front barrier layer 8 and the at least one back barrier layer 9 of the second capsule 4 are formed from different materials and / or a different number of layers.

[0082] In another configuration of the invention, the first capsule 3 is formed from at least two front and / or back barrier layers 5, 6, in particular barrier layers 5, 6 with different properties, and / or the second capsule 4 is formed from at least two front and / or back protective layers 8, 9, in particular protective layers 8, 9 with different properties, the first capsule 3 preferably providing protection from moisture and / or oxygen, in particular atmospheric oxygen, and the second capsule 4 providing mechanical protection.

[0083] In other configurations of the invention, an adhesive layer is arranged between the optoelectronic component 2 and the first encapsulation 3, and / or an adhesive layer is arranged between the first encapsulation 3 and the second encapsulation 4, and / or a planarization layer is arranged between the optoelectronic component 2 and the first encapsulation 3.

[0084] In another configuration of the present invention, the layer thickness of the first capsules 3 is 20 μm to 400 μm, preferably 50 μm to 200 μm, and / or the layer thickness of the second capsules 4 is 50 μm to 1000 μm, preferably 100 μm to 500 μm, and / or the layer thickness of the first connecting material 7 and / or the second connecting material 10 is 10 μm to 300 μm, preferably 20 μm to 100 μm.

[0085] In another configuration of the invention, the width 13 of the first end region 11 is between 5 mm and 200 mm, preferably between 20 mm and 50 mm, and / or the width 14 of the second end region 12 is between 5 mm and 100 mm, preferably between 8 mm and 40 mm.

[0086] In another embodiment of the invention, the layer thickness of the first capsule 3 is partially End of Towards Decreased , The widthwise position is at least from the end of the first end region 11 Preferably 5mm to 60mm, preferably 20mm to 30mm m's width Reaches an area stretching across 22 and / or the layer thickness of the second capsule 4 is partially reduced to End of Towards Decreased , The widthwise position is at least from the end of the second end region 12 Preferably 5mm to 50mm, preferably 8mm to 20mm m's width Reaches an area stretching over 21 decreases to.

[0087] In another configuration of the invention, the at least one barrier layer 5, 6 and / or the at least one protective layer 8, 9 is a UV protection layer, an anti-reflection layer, a moisture and / or anti-oxygen layer and / or a mechanical protection layer, preferably to increase scratch resistance.

[0088] In another configuration of the invention, the at least one front barrier layer 5 and / or the at least one back barrier layer 6 comprise a material selected from the group consisting of polyacrylate (PA), polycarbonate (PC), polyethylene (PE), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polypropylene (PP), polyvinyl chloride (PVC) and thermoplastic polyurethane (TPU), preferably the material of the front and / or back barrier layer 5, 6 is coated, and / or the at least one front protective layer 8 and / or the at least one back protective layer 9 comprise a material selected from the group consisting of ethylene vinyl acetate (EVA), polyacrylate (PA), polycarbonate (PC), polyethylene (PE), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polypropylene (PP), polyvinyl chloride (PVC) and thermoplastic polyurethane (TPU), preferably the material of the front and / or back protective layer 8, 9 is coated.

[0089] In another configuration of the invention, the first connecting material 7 and / or the second connecting material 10 are preferably selected from the group consisting of acrylates, epoxides and polyurethanes, in one- or two-component compositions.

[0090] In another configuration of the present invention, the first end region 11 and / or the second end region 12, in particular the end of the first end region 11 and / or the end of the second end region 12, are sealed and / or at least two optoelectronic components 2 are encapsulated together in the encapsulation system 1, preferably at least two optoelectronic components 2 are each individually encapsulated by a first encapsulation 3 and collectively encapsulated by a second encapsulation 4.

[0091] The optoelectronic component 2 is encapsulated by an encapsulation system 1, in particular a double encapsulation. The optoelectronic component 2 has a layer system 20 including an electrode 18, a counter electrode 19 and at least one photoactive layer 26, which is arranged between the two electrodes 18, 19.

[0092] In another configuration of the invention, the optoelectronic component 2 has at least one busbar 15, preferably at least two busbars 15, which are arranged under the first capsule 3 and / or the second capsule 4 and are at least partially in conductive contact with the electrodes 18 and / or counter electrodes 19 of the optoelectronic component 2, and at least one busbar 15 is in conductive contact with a connection box 17 outside the second capsule 4 by means of at least one contact element 16.

[0093] In another configuration of the invention, the optoelectronic component 2 is an optoelectronic element, in particular a solar cell, preferably a flexible organic photovoltaic element.

[0094] In one example, the capsule system 1 can be manufactured as follows: In this example, the capsule system 1 is first prepared by placing a 100 μm thick PET carrier material and a plurality of SiO xThe material for forming the barrier layers 5, 6 is unwound from a roll and coated on the inside over its entire surface with a 50 μm-thick acrylate adhesive layer as the connecting material 7 using a slot die. The process is repeated with a second roll made from the same material. Both coated rolls are then fed into the lamination system with the two acrylate adhesive-coated sides facing each other and the edges of the rolls overlapping. The optoelectronic component 2 is then separated from the third roll and fed into the lamination system between the barrier layers 5, 6, where it is compressed. The optoelectronic component 2 is, for example, 2 m long and 30 cm wide. After compression within the lamination system, the connecting material 7 is cured by heating with an infrared lamp. This can be done, for example, at 100°C for 180 seconds. The optoelectronic component 2 is thus encapsulated in the first capsule 3 having the first end region 11. The second capsule 4 largely follows the sequence of the first capsule 3. However, here, materials are applied to form the protective layers 8, 9. In this example, a mechanical protective film is used, but direct coating is also conceivable as an alternative. In this example, the front protective layer 8 is a 100 μm-thick PET film with a protective lacquer on the side opposite the optoelectronic component 2, which is weather-resistant and has a UV-blocking effect. The back protective layer 9 is a PP coextrusion molding with a layer thickness of 200 μm. The connecting materials 7, 10 of both capsules are two-component polyurethane adhesives, which are cured thermally at 100°C for a duration of 180 seconds, but it is also possible to use different first and second connecting materials 7, 10.

[0095] The first capsule 3 and / or the second capsule 4 may alternatively be cured by UV curing, dual curing, thermal curing and / or reactive gases. The barrier layers 5, 6 and / or the protective layers 8, 9 may alternatively be formed by a printing method, preferably a screen printing method, a plotting method, an inkjet printing method or a 3D printing method, a slot die method, a comma bar method or a knife coating method.

[0096] The first encapsulation 3 and the second encapsulation 4 of the optoelectronic component 2 can in particular be realised in a roll-to-roll manner.

[0097] 3 shows a schematic cross-sectional view of an embodiment of an optoelectronic component 2 comprising an encapsulation system 1. Elements that are the same and have the same function are given the same reference numerals, and reference is made to the previous description in this regard. In this embodiment, the optoelectronic component 2 is an organic photovoltaic element.

[0098] The electrical contact connection 16, in which at least one busbar 15 is at least partially conductively connected to an electrode 18 or a counter electrode 19, can be realized as follows: in step a), an optoelectronic component 2 having a first encapsulation 3 is provided, the optoelectronic component 2 having at least one busbar 15 arranged below the first encapsulation 3. In step b), at least one opening is formed in the first encapsulation 3 by laser ablation with at least one laser beam, partially exposing the at least one busbar 15 arranged below the first encapsulation 3. In step c), low-melting-point solder is introduced into the at least one opening, and a conductive element is aligned on the opposite side of the at least one opening from the at least one busbar 15. In step d), a conductive contact element 16 is formed in the at least one opening by induction soldering. After forming the second encapsulation 4, in step e), at least one connection opening is formed in the second encapsulation 4 by laser ablation with at least one laser beam for the conductive connection of the connection box 17. In step f), the conductive contact element 16 is brought into conductive contact with the connection box 17. The laser ablation parameters, in particular the energy density, pulse duration, pulse shape, pulse frequency and / or wavelength of the at least one laser beam, are adjusted depending on the material and layer thickness of the first encapsulation 3 and / or second encapsulation 4, and the induction soldering parameters are adjusted depending on the material and dimensions of the connection element to be formed.

[0099] 4 shows a cross-sectional schematic view of an embodiment of multiple optoelectronic components 2 encapsulated in an encapsulation system 1. Elements that are the same and have the same function are given the same reference numerals, and reference is made to the previous description in that regard.

[0100] In one configuration of the present invention, at least two optoelectronic components 2 are encapsulated together in a capsule system 1, preferably at least two optoelectronic components 2 are each individually encapsulated by a first capsule 3 and collectively encapsulated by a second capsule 4.

[0101] In this embodiment, three optoelectronic components 2 are each individually encapsulated by a first capsule 3, and then the optoelectronic components 2 individually encapsulated by the first capsules 3 are collectively encapsulated by a second capsule 4 to obtain individually encapsulated components 27. The individual optoelectronic components 2, in particular the individual photovoltaic elements, are here conductively connected to one another via line elements 28. The optoelectronic components 2 can here be connected in parallel or in series.

Claims

1. 1. An encapsulation system (1) for a flexible optoelectronic component (2), comprising a layer system (20) arranged on a substrate (23) having at least a first encapsulation (3) and a second encapsulation (4), wherein the first encapsulation (3) is formed from at least one front barrier layer (5) on a front surface of the optoelectronic component (2) and at least one back barrier layer (6) on a back surface of the optoelectronic component (2), with at least one first adhesive or first adhesive layer (7) arranged therebetween, and the second encapsulation (4) is formed from at least one front protective layer (8) on the front surface of the optoelectronic component (2) and at least one back protective layer (9) on the back surface of the optoelectronic component (2), with at least one second adhesive or second adhesive layer (10) arranged therebetween, The first capsule (3) surrounds the optoelectronic component (2) such that a first end region (11) having a specific width (13) protrudes beyond the optoelectronic component (2), and in the first end region (11), the at least one front barrier layer (5) on the front surface of the optoelectronic component (2) and the at least one back barrier layer (6) on the back surface of the optoelectronic component (2) are adhesively bonded to each other so as to be in intimate contact with each other, and the second capsule (4) surrounds the first capsule (3) containing the optoelectronic component (2) such that a second end region (12) having a specific width (14) protrudes beyond the first end region (11) of the first capsule (3), and in the second end region (12), the at least one front barrier layer (5) on the front surface of the optoelectronic component (2) and the at least one back barrier layer (6) on the back surface of the optoelectronic component (2) are adhesively bonded to each other so as to be in intimate contact with each other. at least one front protective layer (8) on the front surface of an optoelectronic component (2) and at least one back protective layer (9) on the back surface of the optoelectronic component (2) are adhesively bonded to each other so as to be tightly joined to each other, the first encapsulation (3) is formed over the entire area of ​​the optoelectronic component (2) and the second encapsulation (4) is formed over the entire area of ​​the first encapsulation (3), the first end region (11) of the first encapsulation (3) is formed around the optoelectronic component (2) and the second end region (12) of the second encapsulation (4) is formed around the first encapsulation (3), the layer thickness of the first encapsulation (3) partially decreases towards the end of the first end region (11) and the layer thickness of the second encapsulation (4) partially decreases towards the end of the second end region (12).

2. 2. The encapsulation system (1) of claim 1, characterized in that the width (13) of the first end region (11) is formed differently depending on the edge of the optoelectronic component (2) and / or the width (14) of the second end region (12) is formed differently depending on the edge of the first capsule (3).

3. 2. The capsule system (1) according to claim 1, characterized in that the at least one front barrier layer (5) and the at least one back barrier layer (6) of the first capsule (3) are made of different materials and / or a different number of layers, and / or the at least one front protective layer (8) and the at least one back protective layer (9) of the second capsule (4) are made of different materials and / or a different number of layers.

4. 2. The capsule system (1) according to claim 1, characterized in that the first capsule (3) is formed from at least two front and / or back barrier layers (5, 6) and / or the second capsule (4) is formed from at least two front and / or back protective layers (8, 9), the first capsule (3) providing protection against moisture and / or oxygen and the second capsule (4) providing mechanical protection.

5. 2. The capsule system (1) according to claim 1, characterized in that the layer thickness of the first capsule (3) is between 20 μm and 400 μm and / or the layer thickness of the second capsule (4) is between 50 μm and 1000 μm and / or the layer thickness of the first adhesive or first adhesive layer (7) and / or the second adhesive or second adhesive layer (10) is between 10 μm and 300 μm.

6. 6. Capsule system (1) according to any one of claims 1 to 5, characterized in that the width (13) of the first end region (11) is between 5 mm and 200 mm and / or the width (14) of the second end region (12) is between 5 mm and 100 mm.

7. 7. Capsule system (1) according to claim 6, characterized in that the width (13) of the first end region (11) is between 20 mm and 50 mm and / or the width (14) of the second end region (12) is between 8 mm and 40 mm.

8. 2. The encapsulation system (1) according to claim 1, characterized in that the at least one barrier layer (5, 6) and / or the at least one protective layer (8, 9) are UV protection layers, anti-reflection layers, moisture and / or anti-oxygen layers and / or mechanical protection layers.

9. 2. The capsule system (1) according to claim 1, characterized in that the at least one front barrier layer (5) and / or the at least one back barrier layer (6) comprise a material selected from the group consisting of polyacrylate (PA), polycarbonate (PC), polyethylene (PE), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polypropylene (PP), polyvinyl chloride (PVC) and thermoplastic polyurethane (TPU), and / or the at least one front protective layer (8) and / or the at least one back protective layer (9) comprise a material selected from the group consisting of ethylene vinyl acetate (EVA), polyacrylate (PA), polycarbonate (PC), polyethylene (PE), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polypropylene (PP), polyvinyl chloride (PVC) and thermoplastic polyurethane (TPU).

10. 2. The encapsulation system (1) according to claim 1, characterized in that the first adhesive or first adhesive layer (7) and / or the second adhesive or second adhesive (10) are selected from the group consisting of acrylates, epoxides and polyurethanes.

11. The encapsulation system (1) according to any one of claims 1 to 10, characterized in that the first end region (11) and / or the second end region (12) are sealed, and / or at least two optoelectronic components (2) are each individually encapsulated by the first encapsulation (3) and collectively encapsulated by the second encapsulation (4).

12. 2. The capsule system (1) according to claim 1, wherein the first end region (11) comprises a region extending from the end of the first end region (11) over a width (22) of 5 mm to 60 mm, and the layer thickness of the first capsule (3) decreasing towards the end of the first end region (11) decreases until the width-directional position reaches at least the region of the width (22); and / or the second end region (12) comprises a region extending from the end of the first end region (12) over a width (21) of 5 mm to 50 mm, and the layer thickness of the second capsule (4) decreasing towards the end of the second end region (12) decreases until the width-directional position reaches at least the region of the width (22).

13. 13. An optoelectronic component (2) comprising an encapsulation system (1) according to any one of claims 1 to 12, comprising a layer system (20) having an electrode (18), a counter electrode (19) and at least one photoactive layer (26), wherein the optoelectronic component (2) is a flexible optoelectronic component (2), and the at least one photoactive layer (26) is arranged between the two electrodes (18, 19).

14. 14. The optoelectronic component (2) according to claim 13, characterized in that it has at least one busbar (15) arranged under the first capsule (3) and / or the second capsule (4) and in conductive contact at least partially with the electrode (18) and / or the counter electrode (19) of the optoelectronic component (2), the at least one busbar (15) being in conductive contact with a connection box (17) outside the second capsule (4) by means of at least one contact element (16).

15. An optoelectronic component (2) according to claim 13 or 14, characterized in that it is a photovoltaic element.

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