Splice repair device, system, and method

Abstract

To provide a scarf repair apparatus, system, and method, which actuate reduction of dispersion inherent in a traditional manual scarfing process.SOLUTION: There is provided a duplicator assembly 122 for forming a first void 144, which can be layered, in a laminated material of a part that matches a second void 142 in a scarf repair guide. The duplicator assembly comprises an arm 134 that comprises a first end portion and a second end portion. The first end portion is spaced apart from the second end portion. The duplication assembly also comprises a probe 136 that is fixed to the first end portion of the arm and configured to trace the second void in the scarf repair guide 120. The duplication assembly further comprises a milling tool 140 that is fixed to the second end portion of the arm. Accordingly, the milling tool is co-movably coupled with the probe via the arm.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE This disclosure relates generally to repairing components having abnormalities, and more particularly to repairing laminated components using scarf repair devices, systems, and processes. [Background technology]

[0002] Many structures are made from fiber-reinforced polymers because they have high strength and low weight. However, repairing damage to fiber-reinforced polymer parts is complex, time-consuming, and expensive. Although several techniques, such as patch repair techniques, have been designed specifically for repairing fiber-reinforced polymer parts, such techniques still have several drawbacks. For example, conventional void formation techniques do not accurately predict the size (e.g., depth and shape) of the anomaly, and therefore cannot accurately identify the size of the void in the part that corresponds to the removal of the anomaly. Therefore, in some conventional patch repair techniques, the void size is predicted to be larger (e.g., wider and deeper) and manually formed to ensure that the anomaly is sufficiently removed. This results in unnecessary waste of the part's laminate material and reduces the structural integrity of the part. Furthermore, manually patching plies using conventional methods can introduce variability, which can negatively affect the overall appearance of the repair. Summary of the Invention

[0003] The subject matter of the present application was developed in response to the current state of the art, and in particular, in response to shortcomings in conventional patch repair techniques that have not yet been fully addressed by currently available technology. Accordingly, the subject matter of the present application has been developed to provide apparatus, systems, and methods that overcome at least some of the above-described shortcomings of the prior art. For example, the apparatus, systems, and methods described herein facilitate reducing the variability inherent in conventional manual patch repair processes by promoting accuracy, facilitating reduced material and labor waste, and providing a significant improvement in the appearance of the repair area.

[0004] Below is a non-exhaustive list of examples of the subject matter disclosed herein, which may or may not be claimed.

[0005] Disclosed herein is a copier assembly for forming a first void in a laminate material of a component that matches a second void in a mating repair guide. The copier assembly includes an arm, the arm having a first end portion and a second end portion. The first end portion is spaced apart from the second end portion. The copier assembly also includes a probe secured to the first end portion of the arm and configured to trace the second void in the mating repair guide. The copier assembly further includes a milling tool secured to the second end portion of the arm. The milling tool is thus co-movably coupled to the probe via the arm. The foregoing subject matter of this paragraph characterizes Example 1 of the present disclosure.

[0006] The copier assembly further includes a handle secured to the first end portion, the handle being cooperatively coupled to the probe. The preceding subject matter of this paragraph characterizes Example 2 of the present disclosure, which also includes subject matter according to Example 1 above.

[0007] The probe is movable relative to the arm in response to changes in the contour of the second gap in the mating repair guide. The milling tool is pivotally coupled to the second end portion. The milling tool pivots relative to the arm in response to movements of the probe relative to the arm. The preceding subject matter of this paragraph characterizes Example 3 of the present disclosure, which also includes subject matter according to any one of Examples 1-2 above.

[0008] The copier assembly further includes an articulatable arm coupled to the arm. The articulatable arm is manually movable relative to the part and the mating repair guide to manually move the arm relative to the part and the mating repair guide. The preceding subject matter of this paragraph characterizes Example 4 of the present disclosure, which also includes subject matter according to any one of Examples 1-3 above.

[0009] The articulatable arm is manually movable about at least three axes of rotation, whereby the probe and milling tool are manually movable about at least three axes of rotation. The preceding subject matter of this paragraph characterizes Example 5 of the present disclosure, which also includes subject matter according to Example 4 above.

[0010] The arm, the probe, and the milling tool form an arm assembly. The arm assembly is selectively releasably coupled to the articulatable arm. The preceding subject matter of this paragraph characterizes Example 6 of the present disclosure, which also includes subject matter according to any one of Examples 4-5 above.

[0011] Also disclosed herein is a system for forming a first void in a laminate material of a component to repair the component. The system includes a mating repair guide immovably fixed to the component and including a second void. The first void aligns with the second void. The system also includes an arm assembly. The arm assembly includes an arm having a first end portion and a second end portion. The first end portion is spaced apart from the second end portion. The arm assembly also includes a probe fixed to the first end portion of the arm and configured to trace the second void in the mating repair guide. The arm assembly further includes a milling tool fixed to the second end portion of the arm. Thus, the milling tool is movably coupled to the probe via the arm. The milling tool is configured to form a first void in the component to align with the second void in the mating repair guide when the probe traces the second void in the mating repair guide. The foregoing subject matter of this paragraph characterizes Example 7 of the present disclosure.

[0012] The system further includes a joint repair modeling module configured to generate a digital joint repair model based at least in part on the data corresponding to the anomaly in the part. The system also includes a joint repair guide formation tool configured to create a joint repair guide based on the digital joint repair model. The preceding subject matter of this paragraph characterizes Example 8 of the present disclosure, which also includes subject matter according to Example 7 above.

[0013] The inlay repair guide forming tool includes an additive manufacturing machine. The preceding subject matter of this paragraph characterizes Example 9 of the present disclosure, which also includes subject matter according to Example 8 above.

[0014] The system further includes a defect modeling module configured to generate a computer-aided design (CAD) model of at least the anomaly in the part based on the data corresponding to the anomaly in the part. The patch repair modeling module is further configured to generate a digital patch repair model based at least in part on the CAD model. The preceding subject matter of this paragraph characterizes Example 10 of the present disclosure, which also includes subject matter according to any one of Examples 8-9 above.

[0015] The patch repair modeling module is further configured to generate a digital patch repair model according to the defined patch repair parameters before generating the CAD model of at least the anomaly in the part. The preceding subject matter of this paragraph characterizes Example 11 of the present disclosure, which also includes subject matter according to Example 10 above.

[0016] The system further comprises a scanning tool configured to scan the part to generate data corresponding to anomalies in the part. The preceding subject matter of this paragraph characterizes Example 12 of the present disclosure, which also includes subject matter according to any one of Examples 10-11 above.

[0017] The arm assembly is further configured to form a first gap in the surface of the part, and the mating repair guide is immovably attached to the surface of the part. The preceding subject matter of this paragraph characterizes Example 13 of the present disclosure, which also includes subject matter according to any one of Examples 7 to 12 above.

[0018] Further disclosed herein is a method of creating a joint repair guide for repairing a laminate material of a part. The method includes scanning at least a portion of the part containing an anomaly. The method also includes generating data corresponding to the anomaly in response to scanning at least a portion of the part containing the anomaly. The method further includes generating a digital joint repair model based at least in part on the data corresponding to the anomaly. The method further includes creating a joint repair guide based on the digital joint repair model. The preceding subject matter of this paragraph characterizes Example 14 of the present disclosure.

[0019] The method further includes generating a computer-aided design (CAD) model of at least the anomaly in the part based on the data corresponding to the anomaly. A digital joint repair model is generated based on the CAD model. The preceding subject matter of this paragraph characterizes Example 15 of the present disclosure, which also includes subject matter according to Example 14 above.

[0020] The data corresponding to the anomaly includes the orientation of the part, the location of the anomaly on the part, and the shape of the anomaly. The subject matter described above in this paragraph characterizes Example 16 of the present disclosure, which also includes subject matter according to any one of Examples 14-15 above.

[0021] Also disclosed herein is a method of repairing a laminate material of a component. The method includes using a probe to trace a second void in a mating repair guide that is immovably fixed relative to the component. The method also includes cooperating a milling tool with the probe as the probe traces the second void. The method further includes removing laminate material of the component using the milling tool as the milling tool cooperates with the probe to form a first void in the laminate material of the component that matches the second void in the mating repair guide. The foregoing subject matter of this paragraph characterizes Example 17 of the present disclosure.

[0022] The step of tracing the second void with the probe includes moving the probe according to any one of at least three degrees of freedom. The step of cooperating with the milling tool includes moving the milling tool according to any one of at least three degrees of freedom. The preceding subject matter of this paragraph characterizes Example 18 of the present disclosure, which also includes subject matter according to Example 17 above.

[0023] The step of tracing the second void with the probe includes pivoting the probe in response to a change in the contour of the second void in the joint repair guide. The step of co-moving the milling tool includes co-pivoting the milling tool with the probe. The above-mentioned subject matter of this paragraph characterizes Example 19 of the present disclosure, which also includes subject matter according to any one of Examples 17-18 above.

[0024] The step of tracing the second gap with the probe includes manually moving the probe along the second gap. The preceding subject matter of this paragraph characterizes Example 20 of the present disclosure, which also includes subject matter according to any one of Examples 17 to 19 above.

[0025] The described features, structures, advantages, and / or characteristics of the presently disclosed subject matter may be combined in any suitable manner in one or more examples and / or embodiments. Numerous specific details are provided in the following description to facilitate a comprehensive understanding of embodiments of the presently disclosed subject matter. Those skilled in the art will recognize that the presently disclosed subject matter can be practiced without one or more of the specific features, details, components, materials, and / or methods of a particular example or embodiment. In other cases, additional features and advantages may be recognized in particular examples and / or embodiments, but may not be present in all examples or embodiments. Furthermore, in some instances, well-known structures, materials, or steps have not been described or shown in detail so as not to obscure aspects of the presently disclosed subject matter. The features and advantages of the presently disclosed subject matter will become more apparent from the following description and appended claims, or may be learned by practicing the subject matter as described below.

[0026] In order that the advantages of the present subject matter may be more readily understood, a more particular description of the subject matter outlined above will be provided with reference to specific embodiments thereof, which are illustrated in the accompanying drawings. It will be understood that these drawings, which are not necessarily drawn to scale, depict only particular embodiments of the subject matter and therefore should not be considered limiting of its scope, the subject matter being described with added specificity and detail using the drawings. [Brief explanation of the drawings]

[0027] [Figure 1] FIG. 1 is a schematic block diagram of a system for repairing a component, in accordance with one or more embodiments of the present disclosure. [Figure 2] 2 is a perspective view of the copier assembly and mating repair guide of the system of FIG. 1 from a first side of the copier assembly in accordance with one or more embodiments of the present disclosure. [Figure 3] 2 is a perspective view of the copier assembly and mating repair guide of the system of FIG. 1 from the rear of the copier assembly in accordance with one or more embodiments of the present disclosure. [Figure 4]2 is a perspective view of the copier assembly and mating repair guide of the system of FIG. 1 from a second side of the copier assembly in accordance with one or more embodiments of the present disclosure. [Figure 5] 2 is a perspective view of the copier assembly and mating repair guide of the system of FIG. 1 from above the copier assembly in accordance with one or more embodiments of the present disclosure. [Figure 6] 6 is a partial cross-sectional side elevation view of an arm assembly of a copier assembly of a system for servicing parts, taken along a line similar to line 6-6 of FIG. 3, in accordance with one or more embodiments of the present disclosure. [Figure 7] 6A is a partial cross-sectional side elevation view of the arm assembly of FIG. 6 taken along a line similar to line 6-6 of FIG. 3 in accordance with one or more embodiments of the present disclosure. [Figure 8] 6 is a partial cross-sectional side elevation view of an arm assembly of a copier assembly of a system for servicing parts, taken along a line similar to line 6-6 of FIG. 3, in accordance with one or more embodiments of the present disclosure. [Figure 9] 1 is a cross-sectional side elevation view of a repair patch coupled to a void formed in a component in accordance with one or more embodiments of the present disclosure. [Figure 10] 1 is a schematic flowchart of a method of making a splice repair guide for repairing a laminate material of a component, in accordance with one or more embodiments of the present disclosure. [Figure 11] 1 is a schematic flow chart of a method for repairing a laminate material of a component, in accordance with one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0028] When reference is made herein to "one embodiment," "an embodiment," or similar phrases, it means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present disclosure. The phrases "one embodiment," "an embodiment," or similar phrases used throughout this specification may, but do not necessarily, all refer to the same embodiment. Similarly, the term "embodiment" refers to an embodiment having a particular feature, structure, or characteristic described in connection with one or more embodiments of the present disclosure, but the embodiment may be associated with one or more embodiments unless there is a clear correlation suggesting otherwise.

[0029] Disclosed herein are systems, assemblies, and methods for improving the repair of laminated components. More specifically, the systems, assemblies, and methods disclosed herein facilitate simplifying, facilitating, and increasing the accuracy of patch repair of laminate materials of components. Referring to FIG. 9 , an example of a patch repair method is shown. Generally, a patch repair involves removing an anomaly in a laminate material by removing the laminate material within which the anomaly is located and replacing the removed laminate material with a repair patch. As shown in FIG. 9 , the laminate material of a component 102 (e.g., a composite structure) includes multiple layers 170 or plies bonded together in a stack configuration. The component 102 may be or form a component of a larger structure, such as an aircraft, another vehicle (e.g., a helicopter, boat, spacecraft, automobile, etc.), or a non-moving composite structure (e.g., a building, bridge, machinery, etc.).

[0030] The laminate material of the part 102 may have an anomaly 104 (see, e.g., FIG. 1 ). The anomaly 104 may be any of a variety of anomalies that can affect the performance or structural integrity of the part. For example, the anomaly 104 may be a crack or delamination that grows over time and continued use of the part 102. In alternative embodiments, the anomaly 104 may be a manufacturing defect. Thus, the anomaly 104 may have any of a variety of shapes and sizes and may be any of a variety of types. In parts made from laminate materials, the anomaly 104 may penetrate multiple plies of the laminate material. To eliminate the anomaly 104 and ensure the safe and continued use of the part 102, the part 102 may be repaired using a patch repair method. According to certain embodiments, the patch repair method includes removing the damaged portion of the part 102 (e.g., the portion of the part 102 containing the anomaly 104) to form a void 144 (see, e.g., FIG. 9 ) within the part 102. The void 144 formed in the part 102 extends from the surface 126 of the part 102. In one embodiment, the surface 126 is an exterior or exterior surface of the part 102, and in another embodiment, the surface 126 is an interior or interior surface of the part 102. Although in FIG. 9 the void 144 is shown extending only partially through the thickness of the part 102, such that it is considered a blind void, in certain embodiments the void 144 extends completely through the thickness of the part 102, such that it is considered a through void.

[0031] The side or surface of the component 102 that defines the void 144 is tapered to define an angle with the surface 126 of the component 102. The tapering of the surface of the component 102 that defines the void 144 gradually reduces the angle of extension as it extends through the thickness of the component 102 away from the surface 126, resulting in a convergence of the surface of the void 144. The void 144 is tapered to promote bonding between the component 102 and a repair patch 164 (see, for example, FIG. 9 ) that is inserted into the void 144 and to improve load distribution between the component 102 and the repair patch 164. In certain embodiments, a mating repair method includes disposing an adhesive layer 174 over or into the void 144 before the repair patch 164 is inserted. In this position, the adhesive layer 174 is interposed between the component 102 and the repair patch 164 when the repair patch 164 is placed within the void 144. Adhesive layer 174 not only promotes a secure, fixed engagement between repair patch 164 and component 102, but also provides a medium for load distribution between component 102 and repair patch 164. In some embodiments, adhesive layer 174 is a flexible, film-like adhesive sheet made from any of a variety of adhesive materials, such as epoxy.

[0032] Void 144 is tapered to facilitate restoring the structural integrity of component 102. In certain embodiments, for example, as shown, when void 144 extends into multiple layers 170 of laminate material of component 102, repair patch 164 includes multiple layers 172 that may or may not correspond with multiple layers 170 of component 102. Generally, the taper required to restore the structural integrity of component 102 corresponds to the strength of repair patch 164 (e.g., the strength of layers 172 of repair patch 164). For example, conventional patch repair processes for repairing composite structures may use voids having length-to-depth taper ratios between 28:1 and 32:1, but may be as low as between 15:1 and 20:1.

[0033] Generally, the less tapered or smaller the void 144, the less material is removed from the part 102, preserving the part 102 more intact and thereby promoting the structural integrity of the part 102, saving time and effort to perform the repair and material in the repair patch 164, and facilitating reduced material costs and labor. However, conventional void formation techniques do not accurately predict the size (e.g., depth and shape) of the anomaly and therefore are unable to accurately identify the size of the void corresponding to the removal of the anomaly. Therefore, conventional void formation techniques estimate and manually form the void size larger than necessary (e.g., wider and deeper) to ensure the anomaly is adequately removed, which can result in unnecessary waste of laminate material in the part 102 and reduced structural integrity of the part 102. The systems, assemblies, and methods disclosed herein, among other advantages, accurately identify the size of the void corresponding to the removal of the anomaly, thus facilitating reduced material removal in the part 102 and increased structural integrity of the part 102 after the patch repair.

[0034] Referring to FIG. 1 , a system 100 for forming voids 144 in a laminate material of a part 102 is shown, according to certain embodiments. The system 100 includes a scanning tool 106 configured to scan the part 102 and generate scanned data 108 based on the scanning of the part 102. As depicted in FIG. 1 , in one embodiment, the scanning tool 106 is an autonomous robot (e.g., a robotic arm). The autonomous robot includes an end effector having a scanning head. The scanning head includes one or more cameras or sensors operable to detect one or more characteristics of the part 102 and / or one or more characteristics of the anomaly 104. The scanning tool 106 may include any of a variety of computer processors, controllers, and the like, to detect and assign one or more characteristics of the part 102 and / or one or more characteristics of the anomaly 104 as scanned data 108. Thus, the scanned data 108 includes data corresponding to the anomaly 104 in the part 102.

[0035] In certain embodiments, the scan head includes one or more transmitters that transmit signals, such as optical signals (e.g., laser signals, infrared signals, etc.), acoustic signals (e.g., ultrasonic signals), or electromagnetic signals (e.g., radio frequency identification (RFID) signals), to the part 102, and one or more receivers that receive corresponding reflected signals from the part. Based on a comparison between characteristics of the signals transmitted to the part 102 and corresponding characteristics of the signals reflected from the part 102, characteristics of the part 102 and / or characteristics of the anomaly 103 are detected.

[0036] In certain embodiments, characteristics of the part that are detectable by the scanning tool 106 include, but are not limited to, the alignment (e.g., orientation) of the part 102 relative to the orientation of the structure (e.g., aircraft) that includes the part 102, data points on the part 102 synchronized with a pre-existing computer-aided design (CAD) model of the part 102, etc. In certain embodiments, the scanning tool 106 may scan the same or different characteristics of any other part / model within the spatial reach of the scanning tool 106 to aid in obtaining useful scanned data for modeling and creating the splice repair guide 120. According to the same or other embodiments, characteristics of the anomaly 104 that are detectable by the scanning tool 106 include, but are not limited to, the location of the anomaly 104 on the part 102, the total area of ​​the anomaly 104, the shape of the anomaly 104, the depth of the anomaly 104, the type of the anomaly 104, etc.

[0037] 1 as an autonomous robot, according to some embodiments, scanning tool 106 is a manually operated tool, such as a hand-held tool, a manually movable tool, etc. Like an autonomous robot, a manually operated tool may have a scanning head that includes one or more cameras or sensors operable to detect one or more characteristics of part 102 and / or one or more characteristics of anomaly 104.

[0038] The system 100 further includes a defect modeling module 110 configured to generate a CAD model 112 of the anomaly 104 in the part 102. The CAD model 112 includes at least the anomaly 104 in the part 102. In some embodiments, the CAD model 112 also includes the portion of the part 102 having the anomaly 104 formed therein, such as the portion of the part 102 surrounding the anomaly 104. According to particular embodiments, the CAD model 112 includes the entire part 102 having the anomaly 104 formed therein, and in some cases may include the entire structure (e.g., an aircraft) containing the part 102. Optionally, after sorting and analyzing the scanned data 108 for outlier information, the defect modeling module 110 generates the CAD model 112 based on the scanned data 108 (e.g., data corresponding to the anomaly 104 in the part 102). In some embodiments, the defect modeling module 110 generates the CAD model 112 further based on a pre-existing CAD model of the part 102. In practice, defect modeling module 110 may be configured to digitally incorporate anomalies 104 into a pre-existing CAD model of part 102 to generate CAD model 112. In some embodiments, defect modeling module 110 utilizes the capabilities of CAD modeling software (e.g., CATIA®, Solidworks®, AutoCAD®, Pro / ENGINEER®, etc.) to model anomalies 104 into the model of part 102. Alternatively, in certain embodiments, defect modeling module 110 generates a new model of part 102 without utilizing any pre-existing CAD model of part 102, such as by using laser measurement techniques.

[0039] The system 100 also includes a mating joint repair modeling module 114 configured to generate a digital mating joint repair model 116 based at least in part on the CAD model 112 generated by the defect modeling module 110. Because the CAD model 112 is generated based on the scanned data 108, the digital mating joint repair model is correspondingly generated based on the scanned data 108. The digital mating joint repair model 116 is a digital model of a physical mating joint repair guide 120 that can be used to repair the part 102. Thus, the digital mating joint repair model 116 includes features of the mating joint repair guide 120 for performing the mating joint repair of the part 102, such as the shape of the void 142 in the mating joint repair guide 120. In some embodiments, the digital mating joint repair model 116 also includes other features, such as the shape of the part-engagement surface 152 of the mating joint repair guide 120, that help facilitate the mating joint repair of the part 102.

[0040] In some embodiments, the mating repair guide 114 generates the digital mating repair model 116 according to defined mating repair parameters prior to generating the CAD model 112. The mating repair parameters may be predefined parameters based on standard or proven methods for mating repair of various types and sizes of anomalies in parts of various materials and sizes. Furthermore, in some embodiments, the mating repair modeling module 114 includes CAD modeling software (e.g., CATIA®) that utilizes the predefined parameters and compares them with the CAD model 112 of the anomaly 104 to generate the digital mating repair model 116. According to certain embodiments, the mating repair modeling module 114 includes a lookup table of characteristic values ​​of the anomaly and part and associated mating repair parameters. For example, the lookup table may include values ​​for the depth, area (e.g., diameter), shape, and taper (e.g., depth relative to taper) of the void 144 to remove an anomaly with given characteristics (e.g., a crack or delamination and associated size or shape) and a part with given characteristics (e.g., composite type, number of plies, ply thickness, ply orientation, etc.). In another example, the void representation may be created by CAD modeling software based on the geometry of the underlying plies and the size and depth of the defect. By taking into account the original shape of the laminate, the void volume may be optimized to reduce the amount of material removed, thereby reducing structural impact, labor, and material costs. Because the detection and modeling of the anomaly 104 in the part 102 is accurate, the modeling of the splice repair guide 120 and the void 142 in the splice repair guide 120 will also be an accurate representation of the void in the part, accommodating accurate removal of the anomaly 104 without wasting material.

[0041] System 100 further includes a mating joint repair guide formation tool 118 configured to fabricate mating joint repair guide 120. Mating joint repair guide formation tool 118 utilizes digital mating joint repair model 116 generated by mating joint repair modeling module 114 to fabricate mating joint repair guide 120. More specifically, in certain embodiments, mating joint repair guide formation tool 118 is an automated manufacturing tool that automatically fabricates mating joint repair guide 120 based on CNC (computer numerical control) programming code (e.g., G-code and M-code) derived from digital mating joint repair model 116. In one embodiment, mating joint repair guide formation tool 118 is an additive manufacturing machine or another CNC machine. As used herein, void 142 in mating joint repair guide 120 is not necessarily a void in the following sense. That is, material was removed from the splice repair guide 120 to create an open space, but rather the void 142 is a feature or template formed in the splice repair guide 120 that aids in forming the void in the part. Thus, the term void is used to define the template or feature in the splice repair guide 120, but only for consistency in associating the template or feature with the void formed in the part.

[0042] According to some embodiments, the system 100 described above can perform a method 200 of creating a joint repair guide 120 for repairing a part 102. Referring to FIG. 9 , the method 200 includes scanning at least a portion of the part 102 containing an anomaly 104 (block 202). In one embodiment, the scanning step in block 202 is performed by a scanning tool 106. The method 200 also includes generating scanned data 108 (block 204) in response to scanning at least the portion of the part 102 containing anomaly 104 in block 202. The method 200 further includes generating a digital joint repair model 116 (block 206) based at least in part on the scanned data 108. In one embodiment, generating the digital joint repair model 116 in block 206 is performed by the joint repair modeling module 114. The method 200 further includes creating (block 208) a mating joint repair guide 120 based on the digital mating joint repair model 116. According to one embodiment, creating the mating joint repair guide 120 at block 208 is performed by a mating joint repair guide formation tool 118.

[0043] In some embodiments, system 100 also includes a repair patch formation tool 119. Repair patch formation tool 119 is configured to create a repair patch 164 to fill void 144 formed in part 102 as part of the mating repair process. In some implementations, repair patch formation tool 119 is an automated manufacturing tool that automatically creates repair patch 164 based on CNC programming code derived from digital mating repair model 116. Thus, in particular embodiments, mating repair modeling module 114 is configured to include a digital model of repair patch 164 in digital mating repair model 116 in addition to a digital model of mating repair guide 120. In one embodiment, repair patch formation tool 119 is a CNC machine or an additive manufacturing machine, and may be the same tool as mating repair guide formation tool 118.

[0044] System 100 further includes a copier assembly 122 that utilizes mating repair guide 120 created by mating repair guide forming tool 118 to form voids 144 in part 102. Copier assembly 122 is configured to, in effect, replicate voids 142 of mating repair guide 120 in part 102. Copier assembly 122 is thus operable to form voids in part 102 that match voids 142 in mating repair guide 120. In this manner, voids 144 in part 102 can be created with precision that reduces wasted material and resources.

[0045] 2-5, copier assembly 122 includes an arm assembly 132 and an articulatable arm 130. Arm assembly 132 is coupled to articulatable arm 130, which is manually movable relative to part 102 to manually move arm assembly 132 relative to part 102. Arm assembly 132 includes an arm 134, a probe 136, and a milling tool 140.

[0046] Arm 132 is a rigid, elongated rod having a first end portion 146 and a second end portion 148 (see, e.g., FIG. 3 ). First end portion 146 is opposite and spaced apart from second end portion 148. First end portion 146 comprises a first end of arm 132, and second end portion 148 comprises a second end of arm 132. The second end of arm 132 is opposite the first end of arm 132.

[0047] A probe 136 is fixed to a first end portion 146 of the arm 134. Generally, the probe 136 is configured to trace the gap 142 within the mating splice repair guide 120. In the illustrative embodiment of FIG. 3, the probe 136 is a passive, rigid rod extending from the arm 134 at a substantially perpendicular angle. Thus, the probe 136 includes a fixed portion 159 fixed to the first end portion 146 and a tip 167 spaced from the fixed portion that engages a probe engagement surface 150 (see, e.g., FIG. 6 ) of the mating splice repair guide 120. In one embodiment, the tip 167 of the probe 136 includes a rounded surface that helps reduce friction between the probe 136 and the probe engagement surface 150 that defines the gap 142 when the probe 136 is at any of a variety of angles relative to the probe engagement surface 150. 8, in some embodiments, probe 136 includes a pivotable tip 160 that pivots about a pivot axis 162 as pivotable tip 160 traces the changing contours of void 142. In one embodiment, probe 136 includes a position sensor that detects the position (e.g., angular position) of pivotable tip 160 relative to arm 134. Pivotable tip 160 may include one or more biasing springs or switches that help keep pivotable tip 160 perpendicular to the surface being traced.

[0048] A milling tool 140 is fixed to a second end portion 148 of the arm 134. Thus, the milling tool 140 is spaced apart from the probe 136. Because the arm 134 is rigid, the milling tool 140 is movable with the probe 136 via the arm 134. In other words, the milling tool 140 moves with the movement of the probe 136. The milling tool 140 may be any of a variety of machining tools configured to machine the part 102. Thus, although the milling tool 140 is referred to as a "milling tool," it may be any of a variety of machining tools other than the milling tool 140. However, in the exemplary embodiment, the milling tool 140 is a machining tool that performs a milling operation on the part 102. Thus, the milling tool 140 in the exemplary embodiment includes a motor portion 155 and a bit 154 that is rotationally driven by the motor 155 about an axis of rotation 157 that is concentric with the bit 154. The bit 154 includes a cutting edge configured to remove material from the part 102 when rotationally driven into the part 102. The motor portion 155 includes a housing and a rotary motor at least partially contained by the housing. In some embodiments, as shown in FIGS. 6 and 7 , the milling tool 140 is angularly fixed to the arm 134, such that the axis of rotation 157 of the bit 154 is angularly fixed relative to the arm 134. However, in other embodiments, as shown in FIG. 8 , the milling tool 140 is movably fixed to the arm 134, such that the axis of rotation 157 of the bit 154 is angularly movable relative to the arm 134. Although not shown, the angular movement of the milling tool 140 relative to the arm 134 may be facilitated by a servo motor or other rotary actuator.

[0049] 2-8 , the arm assembly 132 further includes a handle 138 secured to a first end portion 146 of the arm 134. The handle 138 is cooperatively coupled to the probe 136 via the arm 134. Thus, movement of the handle 138 results in corresponding movement of the probe 136 and, therefore, the milling tool 140. As described in more detail below, the handle 138 is configured to be grasped and manually moved by an operator to trace the gap 142 in the splice repair guide 120. Thus, in some embodiments, the handle 138 includes grip-enhancing features to facilitate grasping of the handle 138 by the operator. In some embodiments, as shown, the handle 138 extends from the arm 134 in a direction opposite to the direction in which the probe 136 extends from the arm 134 to facilitate access to the handle 138. More specifically, in certain embodiments, when the probe 136 extends from the arm 134 toward the part 102 , the handle 138 extends from the arm 134 away from the part 102 .

[0050] The articulatable arm 130 includes a first arm segment 134A and a second arm segment 134B. The second arm segment 134B is cooperatively secured to the arm 134 of the arm assembly 132, such that movement of the probe 136 results in corresponding movement of the second arm segment 134B. In certain embodiments, the arm 134 is selectively releasably coupleable to the second arm segment 134B. The arm assembly 132 is selectively releasably coupleable to the second arm segment 134B. Such a configuration allows a plurality of differently configured arm assemblies 132 (e.g., differently sized, different bits, etc.) to be interchangeably coupleable with the second arm segment 134B to facilitate compatible formation of differently configured voids within the part 102.

[0051] The first arm segment 134A is movably coupled to the second arm segment 134B, such that the first arm segment 134A is movable relative to the second arm segment 134B. In an exemplary embodiment, as shown in FIG. 5 , the second arm segment 134B is pivotable relative to the first arm segment 134A about at least one first axis of rotation 180 (e.g., a vertical axis) and at least one second axis of rotation 182 (e.g., a horizontal axis). With reference to FIGS. 2 and 3 , pivoting the second arm segment 134B relative to the first arm segment 134A about the first axis of rotation 180 enables the arm 134 (including the probe 136 and the milling tool 140) to translate in a first linear direction 190 along (e.g., parallel to) the part 102. 2 and 3, pivoting of second arm segment 134B relative to first arm segment 134A about second axis of rotation 182 allows arm 134 (including probe 136 and milling tool 140) to translate in second linear direction 192 along part 102. First linear direction 190 is perpendicular to second linear direction 192.

[0052] 2, 3, and 5, in some embodiments, the copier assembly 122 further includes a movable base 128 to which the first arm segment 134A is pivotally secured. The movable base 128 is movable along a floor on which the component 102 is supported to move the copier assembly 122 relative to the component 102 to the repair site 124. Furthermore, once at the repair site 124, the movable base 128 is selectively lockable (e.g., via lockable casters) to temporarily prevent movement of the movable base 128 relative to the component 102. The first arm segment 134A is pivotable relative to the movable base 128 about a third axis of rotation 184 and a fourth axis of rotation 186. 3 and 5, pivoting of first arm segment 134A relative to movable base 128 about third axis of rotation 184 allows arm 134 (including probe 136 and milling tool 140) to translate in a second linear direction 192 along part 102. In contrast, with reference to FIGS. 2, 3, and 5, pivoting of first arm segment 134A relative to movable base 128 about fourth axis of rotation 186 allows arm 134 (including probe 136 and milling tool 140) to translate in a third linear direction 194 along part 102. Third linear direction 194 is perpendicular to first linear direction 190 and second linear direction 192. In this manner, articulatable arm 130 is movable (e.g., articulatable) about at least three axes of rotation. Thereby, the probe 136 and milling tool 140 are also movable about at least three axes of rotation.

[0053] 11 , after the mating joint repair guide 120 is formed, according to some embodiments, a method 300 for repairing the part 102 includes immovably securing the mating joint repair guide 120 relative to the part 102. In particular embodiments, as shown, the mating joint repair guide 120 is attached directly to the part 102, such as to the same surface 126 of the part 102 in which the void 144 is to be formed. The mating joint repair guide 120 may be attached to the surface 126 of the part 102 using any of a variety of attachment techniques, such as fastening, bonding, or adhesive. In alternative embodiments, the mating joint repair guide 120 is attached to another structure (e.g., a wall, a table, a jig, a fixture, etc.) that is immovably secured relative to the part.

[0054] The mating joint repair guide 120 is immovably fixed relative to the part 102 with a distance D1 between the probe 136 at the first end portion 146 of the arm 134 and the milling tool 140 at the second end portion 148 of the arm 132 (see, e.g., FIG. 6 ). More specifically, the position of the mating joint repair guide 120 is selected such that when the probe 136 engages a given portion of the gap 142 of the mating joint repair guide 120, the bit 154 of the milling tool 140 engages a machined portion of the gap 144 of the part 102 at a desired location of the gap 144 of the part 102. Thus, the position of the mating joint repair guide 120 (e.g., the distance D2 between the desired location of the gap 144 and the mating joint repair guide 120) is based on the desired location of the gap 144 and the distance D1 between the probe 136 and the milling tool 140. The desired location of the void 144 may be generated by the defect modeling module 110 or the splice repair modeling module 114 based on the scanned data 108. The desired location may then be marked on the part 102 to serve as a reference for positioning and immovably securing the splice repair guide 120.

[0055] After the mating splice repair guide 120 is immovably fixed relative to the part 102 in the proper position for forming the void 144, the method 300 further includes tracing the void 142 in the mating splice repair guide 120 with the probe 136 (block 302). In some embodiments, tracing the void 142 in block 302 includes manually moving the probe 136 along and into contact with the probe engagement surface 150 of the mating splice repair guide 120 that defines the void 142. The probe 136 is manually moved when an operator grasps the handle 138 of the arm assembly 132 and manually moves the handle 138 relative to the part 102. As described above, movement of the handle 138 results in corresponding movement of the probe 136 and the milling tool 140. Thus, method 300 further includes moving milling tool 140 in cooperation with probe 136 (block 304) as probe 136 traces void 142 in mating splice repair guide 120. Method 300 further includes removing material from part 102 using milling tool 140 as probe 136 traces void 142 in mating splice repair guide 120 (block 306). In other words, as probe 136 traces void 142 in mating splice repair guide 120, milling tool 140 is operating to cut into part 102 at the proper location to form void 144 and rotate bit 154 at a cutting rotational speed to remove material from part 102.

[0056] 7 , in some embodiments, tip 167 of probe 159 is offset from the tip of bit 154 (e.g., away from part 102) to allow bit 154 to engage and remove material from part 102 when probe 159 is tracing void 142 and when mating repair guide 120 is secured to part 102. In other embodiments, there is no offset or the offset is reversed between tip 167 of probe 159 and the tip of bit 154 due to the contour of part 102 or the mating repair guide 120 being secured to a structure separate from the part.

[0057] According to some embodiments, tracing the void 142 in the splice repair guide 120 with the probe 136 includes moving the probe 136 along the void 142 according to any one of at least three degrees of freedom. Correspondingly, cooperating the milling tool 140 includes moving the milling tool 140 according to any one of at least three degrees of freedom. More specifically, in certain embodiments, the void 142 is traced with the probe 136 by moving the probe 136 in a first linear direction 190 and / or a second linear direction 192 (see, e.g., FIG. 2 ) to trace across a two-dimensional area of ​​the void 142. As shown in FIGS. 6 and 7 , the arm assembly 132 is moved from a first position ( FIG. 6 ) to a second position ( FIG. 7 ) in a linear direction parallel to the first linear direction 190 or the second linear direction 192. Tracing of the void 142 by the probe 136 can follow a desired path or tracing pattern, such as a rastering or step pattern, to trace over the entire two-dimensional area of ​​the void 142. As the two-dimensional area of ​​the void 142 is traced by the probe 136, three-dimensional features of the void 142 are traced using the probe 136 by moving the probe 136 in a third linear direction 194. As the planar shape of the void 142 is traced via tracing in the first linear direction 190 and the second linear direction 192, the operator applies pressure to the probe 136 via the handle 138 to ensure that the probe 136 traces along the depthwise contour within the void 142. Such tracing ensures that when void 142 in mating splice repair guide 120 is traced, void 144 in part 102 being formed matches the two-dimensional and three-dimensional shape of void 142 in mating splice repair guide 120. Thus, by forming and tracing void 142 in mating splice repair guide 120, which is designed to precisely match anomaly 104, void 144 in part 102 is formed to precisely match anomaly 104.

[0058] In some embodiments, maintaining the probe 136 perpendicular to the probe engagement surface 150 that defines the void 142 is desirable to ensure accurate tracing of the contour of the void 142. Accordingly, in such embodiments, the method 300 includes pivoting the probe 136 in response to changes in the contour of the void 142 and co-pivoting the milling tool 140 with the probe 136. In some embodiments, pivoting the probe 136 includes pivoting the pivotable tip 160, and pivoting the milling tool 140 includes actuating a motor in response to the detected pivot of the pivotable tip 160 to pivot the milling tool 140.

[0059] After the voids 142 in the butt joint repair guide 120 have been properly traced to properly form the machined voids 144 in the part 102, the butt joint repair guide 120 is removed from the part 102 (if attached to the part). A repair patch 164 is then inserted and secured in place within the voids 144 in the part 102 to complete the butt joint repair process. Other steps may be performed before forming the voids 144 in the part 102, such as pre-treating (e.g., cleaning) the part 102 and / or post-treating (e.g., polishing) the voids 144 after cutting them and before applying the repair patch 164.

[0060] In the above description, certain terms may be used, such as "top," "bottom," "upper," "lower," "horizontal," "vertical," "left," "right," "above," and "below." These terms are used, where necessary, to provide some clarity to the description when dealing with interrelationships. However, these terms are not intended to imply absolute relationships, positions, and / or orientations. For example, with respect to an object, the "upper" surface may become the "lower" surface simply by turning the object upside down. This is still the same object. Furthermore, terms such as "include," "comprise," and "have," and variations thereof, mean "including, but not limited to," unless expressly stated otherwise. Listed items do not imply that any or all of the items are mutually exclusive and / or inclusive, unless expressly stated otherwise. Terms such as "a," "an," and "the" also mean "one or more," unless expressly stated otherwise. Furthermore, the term "plurality" may be defined as "at least two." Furthermore, unless specifically stated otherwise, as made clear herein, a plurality of particular features does not necessarily refer to every particular feature of a particular set or class of features.

[0061] Furthermore, as used herein, "connected" an element to another element may include direct connection and indirect connection. A direct connection may be defined as one element being connected to the other element and being in some contact with the other element. An indirect connection may be defined as a connection between two elements that are not in direct contact with each other but have one or more additional elements between the connected elements. Furthermore, as used herein, fixing one element to another element may include direct fixation and indirect fixation. Furthermore, as used herein, "adjacent" does not necessarily mean in contact. For example, one element may be adjacent to the other element without contacting it.

[0062] As used herein, the phrase "at least one of" used in conjunction with enumerated items means that various combinations of one or more of the enumerated items may be used, and that only one of each enumerated item may be required. An item may be a specific object, article, or category. That is, "at least one of" means that any combination or number of items from the list may be used, but not all of the listed items may be required. For example, "at least one of item A, item B, and item C" may mean, e.g., "item A," "item A and item B," "item B," "item A, item B, and item C," or "item B and item C." In some cases, "at least one of item A, item B, and item C" may mean, for example, without limitation, "two item A, one item B, and ten item C," "four item B, and seven item C," or other suitable combinations.

[0063] Unless otherwise indicated, terms such as "first," "second," etc. are used herein merely as labels and are not intended to impose any sequential, positional, or hierarchical requirements on the items they represent. Further, for example, reference to a "second" item does not require or exclude, for example, a "first" or smaller item and / or a "third" or larger item.

[0064] As used herein, a system, device, structure, article, element, component, or hardware that is "configured to" perform a particular function is not, in fact, capable of performing that particular function without any modification, but rather may perform that particular function after further modification. In other words, a system, device, structure, article, element, component, or hardware that is "configured to" perform a particular function is specifically selected, created, implemented, utilized, programmed, and / or designed for the purpose of performing that particular function. As used herein, the phrase "configured to" refers to the existing characteristics of a system, device, structure, article, element, component, or hardware that enable the system, device, structure, article, element, component, or hardware to perform a particular function without further modification. In this disclosure, a system, device, structure, article, element, component, or hardware described as being "configured to" perform a particular function may additionally or alternatively be described as being "adapted to" and / or "operative to" perform that function.

[0065] The schematic flowcharts contained herein are generally presented as logical flowcharts. Accordingly, the order of description and labeled steps represent one embodiment of the presented method. Other steps and methods may be conceived that are equivalent in function, logic, or effect to one or more steps, or portions thereof, of the depicted method. Furthermore, it is understood that the format and symbols employed are provided to illustrate the logical steps of the method and are not intended to limit the scope of the method. While various types of arrows and lines may be used in a flowchart, they are not intended to limit the scope of the corresponding method. Indeed, some arrows or other connectors may be used to indicate only the logical flow of the method. For example, arrows may indicate an indefinite amount of waiting or monitoring time between listed steps of the described method. Furthermore, the order in which a particular method occurs may or may not strictly follow the order of the corresponding steps shown.

[0066] Many of the functional units described herein are labeled modules to more specifically emphasize their implementation independence. For example, a module may be implemented as hardware circuitry including custom VLSI circuits or gate arrays, or off-the-shelf semiconductors such as logic chips, transistors, or other discrete components. A module may also be implemented in programmable hardware devices such as field programmable gate arrays, programmable array logic, programmable logic devices, or the like.

[0067] Modules may also be implemented in code and / or software for execution on various types of processors. An identified module of code comprises, for example, one or more physical or logical blocks of executable code, which may be organized as, for example, an object, procedure, or function. However, the executables of an identified module need not be physically located together, but may comprise disparate instructions stored in different locations that, when logically assembled, constitute the module and achieve the module's stated purpose.

[0068] Indeed, a module of code may be a single instruction or multiple instructions, and may be distributed across several different code segments, among different programs and across several memory devices. Similarly, operational data may be identified and illustrated herein within a module and may be embodied in any suitable form and organized within any suitable type of data structure. The operational data may be collected as a single data set or distributed across different locations, including across different computer-readable storage devices. When a module or portions of a module are implemented in software, the software portions are stored in one or more computer-readable storage devices.

[0069] Any combination of one or more computer-readable mediums may be utilized. The computer-readable medium may be a computer-readable storage medium. The computer-readable storage medium may be a storage device that stores the code. The storage device may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, holographic, micro-mechanical, or semiconductor system, apparatus, or device, or any suitable combination thereof.

[0070] More specific examples of storage devices include (although this is not an exhaustive list) an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In the context of this document, a computer-readable storage medium may be any tangible medium that can contain or store a program for use by or in connection with a system, apparatus, or device that executes instructions.

[0071] Code for carrying out operations for embodiments may be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Python, Ruby, Java, Smalltalk, C++, etc., and conventional procedural programming languages ​​such as the "C" programming language, and / or machine languages ​​such as assembly language. The code may execute entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., through the Internet using an Internet Service Provider).

[0072] It will be understood that each block of the schematic flowcharts and / or schematic block diagrams, and combinations of blocks in the schematic flowcharts and / or schematic block diagrams, may be implemented by code that may be provided to a processor of a general purpose computer, a special purpose computer, or other programmable data processing apparatus to create an apparatus, such that instructions executing via the processor of the computer or other programmable data processing apparatus create means for implementing the functions / acts specified in one or more blocks of the schematic flowcharts and / or schematic block diagrams.

[0073] The code may be stored in a storage device medium that may instruct a computer, other programmable data processing apparatus, or other device to function in a particular manner, thereby creating an article of manufacture including instructions that implement the functions / acts identified in one or more blocks of the schematic flowcharts and / or schematic block diagrams, where the instructions stored in the storage device.

[0074] The code may be loaded into a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable apparatus, or other device to generate a computer-implemented process, whereby the code running on the computer or other programmable apparatus may provide a process for implementing the functions / acts identified in one or more blocks of the flow diagrams and / or block diagrams.

[0075] The schematic flowcharts and / or block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of apparatuses, systems, methods, and program products according to various embodiments. In this regard, each block in the schematic flowcharts and / or block diagrams may represent a module, segment, or portion of code, which includes one or more executable instructions of code for implementing one or more specific logical functions.

[0076] In some alternative implementations, the functions noted in the blocks need not occur in the order noted in the figures. For example, in practice, two blocks shown in succession may be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending on the functionality involved. Other steps and methods may be conceived that are equivalent to the function, logic, or effect of one or more of the illustrated blocks or portions thereof.

[0077] The present subject matter may be embodied in other specific forms without departing from its spirit or essential characteristics. The described embodiments are to be considered in all respects as illustrative and not restrictive. All variations and modifications that come within the scope and range of equivalence of the appended claims are within the scope of the present invention.

[0078] Furthermore, the present disclosure includes embodiments according to the following clauses: Article 1. a copier assembly (122) for forming a first void (144) in a laminate material of a part (102) that mates with a second void (142) in a joint repair guide (120), the copier assembly comprising: an arm (134) having a first end portion (146) and a second end portion (148), the first end portion (146) being spaced from the second end portion (148); a probe (136) secured to the first end portion (146) of the arm (134) and configured to trace the second void (142) within the splice repair guide (120); and A copier assembly (122) including a milling tool (140) fixed to a second end portion (148) of the arm (134) such that the milling tool (140) is cooperatively coupled with the probe (136) via the arm (134). Article 2. 2. The copier assembly (122) of claim 1, further comprising a handle (138) fixed to the first end portion (146), the handle (138) being movably coupled to the probe (136). Article 3. the probe (136) is movable relative to the arm (134) in response to changes in the contour of the second gap (142) within the splice repair guide (120); a milling tool (140) pivotally coupled to the second end portion (148); 3. The copier assembly (122) of clause 1 or 2, wherein the milling tool (140) pivots relative to the arm (134) in response to movement of the probe (136) relative to the arm (134). Article 4. A copier assembly (122) as described in any one of clauses 1 to 3, further comprising an articulatable arm (130) coupled to the arm (134), the articulatable arm (130) being manually movable relative to the part (102) and the mating repair guide (120) for manually moving the arm (134) relative to the part (102) and the mating repair guide (120). Article 5. A copier assembly (122) as described in clause 4, wherein the articulatable arm (130) is manually movable about at least three axes of rotation such that the probe (136) and milling tool (140) are manually movable about at least three axes of rotation. Article 6. the arm (134), the probe (136), and the milling tool (140) form an arm assembly (132); 6. The copier assembly (122) of clause 4 or 5, wherein the arm assembly (132) is selectively releasably coupled to the articulatable arm (130). Article 7. 1. A system (100) for forming a first void (144) in a laminate material of a component (102) for repairing the component (102), comprising: a mating repair guide (120) immovably fixed to the part (102) and including a second void (142), the mating repair guide (120) having a first void (144) aligned with the second void (142); and an arm assembly (132), the arm assembly (132) comprising: an arm (134) having a first end portion (146) and a second end portion (148), the first end portion (146) being spaced from the second end portion (148); a probe (136) secured to the first end portion (146) of the arm (134) and configured to trace the second void (142) within the splice repair guide (120); and A system (100) comprising a milling tool (140) fixed to a second end portion (148) of an arm (134) so ​​that the milling tool (140) is cooperatively coupled to a probe (136) via the arm (134), the milling tool (140) being configured to form a first void (144) in the part (102) that matches the second void (142) in the joint repair guide (120) when the probe (136) traces the second void (142) in the joint repair guide (120). Article 8. a patch repair modeling module (114) configured to generate a digital patch repair model (116) based at least in part on data corresponding to the anomaly (104) in the part (102); and 8. The system (100) of clause 7, further comprising a joint repair guide forming tool (118) configured to create a joint repair guide (120) based on the digital joint repair model (116). Article 9. 9. The system of claim 8, wherein the joint repair guide forming tool comprises an additive manufacturing machine. Article 10. The system (100) of clause 8 or 9, further comprising a defect modeling module (110) configured to generate a computer-aided design (CAD) model (112) of at least the anomaly (104) in the part (102) based on data corresponding to the anomaly (104) in the part (102), and the joint repair modeling module (114) is further configured to generate a digital joint repair model (116) based at least in part on the CAD model (112). Article 11. The system (100) described in clause 10, wherein before generating the CAD model (112) of at least the anomaly (104) in the part (102), the joint repair modeling module (114) is further configured to generate a digital joint repair model (116) according to specified joint repair parameters. Article 12. 12. The system (100) of clause 10 or 11, further comprising a scanning tool (106) configured to scan the part (102) to generate data corresponding to anomalies (104) in the part (102). Article 13. The arm assembly (132) is further configured to form a first void (144) within the surface (126) of the part (102); 13. The system (100) of any one of clauses 7 to 12, wherein the joint repair guide (120) is non-movably attached to the surface (126) of the component (102). Article 14. A method (200) of making a joint repair guide (120) for repairing a laminate material of a component (102), comprising: scanning at least a portion of the part (102) containing the anomaly (104); generating data corresponding to the anomaly (104) in response to scanning at least a portion of the part (102) containing the anomaly (104); generating a digital joint repair model (116) based at least in part on the data corresponding to the anomaly (104); and A method (200) comprising creating a mating repair guide (120) based on the digital mating repair model (116). Article 15. 15. The method (200) of claim 14, further comprising generating a computer-aided design (CAD) model (112) of at least the anomaly (104) in the part (102) based on the data corresponding to the anomaly (104), wherein a digital joint repair model (116) is generated based on the CAD model (112). Article 16. 16. The method (200) of clause 14 or 15, wherein the data corresponding to the anomaly (104) includes an orientation of the part (102), a location of the anomaly (104) on the part (102), and a shape of the anomaly (104). Article 17. A method (300) for repairing a laminate material of a component (102), comprising: tracing a second gap (142) of a joint repair guide (120) immovably fixed relative to the part (102) using a probe (136); moving a milling tool (140) in cooperation with the probe (136) as the probe (136) traces the second gap (142); and A method (300) including removing laminate material of the part (102) using the milling tool (140) when the milling tool (140) cooperates with the probe (136) to form a first void (144) in the laminate material of the part (102) that mates with a second void (142) in the joint repair guide (120). Article 18. the step of tracing the second gap (142) with the probe (136) includes moving the probe (136) according to any one of at least three degrees of freedom; 18. The method (300) of clause 17, wherein the step of coacting the milling tool (140) includes moving the milling tool (140) according to any one of at least three degrees of freedom. Article 19. tracing the second void (142) with the probe (136) includes pivoting the probe (136) in response to changes in the contour of the second void (142) within the splice repair guide (120); 19. The method (300) of clause 17 or 18, wherein the step of co-moving the milling tool (140) includes co-pivoting the milling tool (140) with the probe (136). Article 20. 20. A method (300) according to any one of clauses 17 to 19, wherein the step of tracing the second gap (142) using the probe (136) comprises manually moving the probe (136) along the second gap (142).

Claims

1. A copier assembly (122) for forming a first void (144) in a laminate material of a part (102) that matches a second void (142) in a joint repair guide (120) created based on a digital joint repair model (116), comprising: an arm (134) having a first end portion (146) and a second end portion (148), said first end portion (146) being spaced from said second end portion (148); a probe (136) secured to the first end portion (146) of the arm (134) and configured to trace the second void (142) in the splice repair guide (120); and a milling tool (140) secured to the second end portion (148) of the arm (134) such that the milling tool (140) is cooperatively coupled to the probe (136) via the arm (134); The digital patch repair model (116) is based at least in part on data corresponding to anomalies (104) of the part (102).

2. 2. The copier assembly (122) of claim 1, further comprising a handle (138) secured to said first end portion (146), said handle (138) cooperatively coupled with said probe (136).

3. A system (100) for forming a first void (144) in a laminate material of a component (102) having an anomaly (104) to repair the component (102), comprising: a mating repair guide (120) immovably fixed to the part (102) and including a second void (142), the first void (144) aligning with the second void (142); and an arm assembly (132), the arm assembly (132) comprising: an arm (134) having a first end portion (146) and a second end portion (148), said first end portion (146) being spaced from said second end portion (148); a probe (136) secured to the first end portion (146) of the arm (134) and configured to trace the second void (142) in the splice repair guide (120); and a milling tool (140) secured to the second end portion (148) of the arm (134) such that the milling tool (140) is cooperatively coupled to the probe (136) via the arm (134), the milling tool (140) being configured to form the first void (144) in the part (102) that matches the second void (142) in the mating splice repair guide (120) when the probe (136) traces the second void (142) in the mating splice repair guide (120); The patch repair guide (120) is created based on the digital patch repair model (116); The digital patch repair model (116) is based at least in part on data corresponding to the anomaly (104).

4. A method of repairing a laminate material of a component (102), comprising: scanning at least a portion of the part (102) having an anomaly (104); generating data corresponding to the anomaly (104) in response to scanning at least the portion of the part (102) having the anomaly (104); generating a digital patch repair model (116) based at least in part on the data corresponding to the anomaly (104); creating a joint repair guide (120) based on said digital joint repair model (116); tracing a second gap (142) of the splice repair guide (120) immovably fixed relative to the part (102) using a probe (136); cooperating a milling tool (140) with said probe (136) as said probe (136) traces said second gap (142); and removing the laminate material of the part (102) with the milling tool (140) as the milling tool (140) cooperates with the probe (136) to form a first void (144) in the laminate material of the part (102) that mates with the second void (142) in the splice repair guide (120).

5. 5. The method of claim 4, further comprising generating a computer-aided design (CAD) model (112) of at least the anomaly (104) in the part (102) based on the data corresponding to the anomaly (104), wherein the digital joint repair model (116) is generated based on the CAD model (112).

6. 6. The method of claim 4, wherein the data corresponding to the anomaly (104) includes an orientation of the part (102), a location of the anomaly (104) on the part (102), and a shape of the anomaly (104).

7. A method (300) for repairing a laminate material of a component (102) having an anomaly (104), comprising: using a probe (136) to trace a second gap (142) of a splice repair guide (120) immovably fixed relative to the part (102); cooperating a milling tool (140) with said probe (136) as said probe (136) traces said second gap (142); and removing the laminate material of the component (102) with the milling tool (140) as the milling tool (140) cooperates with the probe (136) to form a first void (144) in the laminate material of the component (102) that mates with the second void (142) in the splice repair guide (120); The patch repair guide (120) is created based on the digital patch repair model (116); The method (300), wherein the digital patch repair model (116) is based at least in part on data corresponding to the anomaly (104).

8. tracing the second gap with the probe includes moving the probe according to any one of at least three degrees of freedom; 8. The method (300) of claim 7, wherein coacting the milling tool (140) comprises moving the milling tool (140) according to any one of the at least three degrees of freedom.

9. tracing the second void (142) with the probe (136) includes pivoting the probe (136) in response to changes in the contour of the second void (142) within the splice repair guide (120); 9. The method (300) of claim 7 or 8, wherein co-moving the milling tool (140) comprises co-pivoting the milling tool (140) with the probe (136).

10. 10. The method (300) of any one of claims 7 to 9, wherein tracing the second gap (142) with the probe (136) comprises manually moving the probe (136) along the second gap (142).

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