Carrier, film forming apparatus, film forming method, and method for manufacturing electronic device

Abstract

To provide a technology that can suppress misalignment between a substrate and a mask during conveyance when conveying an aligned substrate and a mask in unison.SOLUTION: A substrate carrier 9 for a vapor deposition apparatus has substrate holding means for holding a substrate and a support 33 provided around the periphery of the substrate to be held and is conveyed while being placed on a mask 6 via the support 33. The support 33 has a block body 331 having a surface in contact with the mask 6 and an elastic body 330 interposed between the periphery and a block body 331.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present invention relates to a carrier, a film forming apparatus, a film forming method, and a method for manufacturing an electronic device. [Background technology]

[0002] A known method for manufacturing organic EL displays is the mask deposition method, in which a film with a predetermined pattern is formed on a substrate through a mask with openings formed in a predetermined pattern. In the mask deposition method, the mask and substrate are aligned, and then the mask and substrate are brought into close contact with each other to deposit the film. In order to deposit the film accurately using the mask deposition method, it is important to align the mask and substrate with high precision.

[0003] Patent Document 1 discloses an in-line vapor deposition apparatus that performs film formation while transporting a superposed substrate and a mask.

[0004] Furthermore, Patent Document 2 describes a method in which a substrate is held by a chuck plate (also referred to as a "substrate carrier") and the substrate is transported together with the chuck plate. In this configuration, the carrier holding the substrate is placed on a mask and transported. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-097330 [Patent Document 2] Japanese Patent Application Laid-Open No. 2013-055093 Summary of the Invention [Problem to be solved by the invention]

[0006] If the relative positions of the substrate and the mask are shifted during transportation due to vibration or inertial force, there is a risk of a decrease in yield, which is particularly likely to have a significant impact on yield in electronic devices manufactured by stacking multiple thin films.

[0007] Patent Document 1 does not disclose a specific means for overlapping the substrate and the mask. Therefore, there is a risk of the relative positions of the substrate and the mask being misaligned. Furthermore, when using the configuration of Patent Document 2 to transport a carrier holding a substrate, which is placed on the mask, it becomes an issue to prevent the carrier from being misaligned with respect to the mask.

[0008] An object of the present invention is to provide a technique that can suppress misalignment between an aligned substrate and a mask during transportation when the aligned substrate and mask are transported. [Means for solving the problem]

[0009] In order to solve the above problems, a carrier according to one aspect of the present invention is 、 base a substrate holding means for holding a plate; a first support and a second support provided on an outer periphery surrounding the outer periphery of the substrate to be held; A substrate carrier for a deposition apparatus, which is transported while being placed on a mask via the first support and the second support, the first support body has an elastic body, the second support has a block body fixed to the outer periphery and in contact with the mask, the first support body supports the elastic body and has a block body fixed to the outer periphery, The elastic body contacts the mask. It is characterized by: [Effects of the Invention]

[0010] According to the present invention, when an aligned substrate and a mask are transported, it is possible to suppress misalignment between the substrate and the mask during transport. [Brief explanation of the drawings]

[0011] [Figure 1] Schematic diagram showing the configuration of a substrate carrier according to the first embodiment. [Figure 2] Schematic diagram of an in-line manufacturing system for organic EL panels according to Example 1. [Figure 3] Schematic diagram of an alignment mechanism according to the first embodiment. [Figure 4] Schematic diagram showing how the substrate carrier is inverted and placed on the mask in Example 1. [Figure 5] Plan view showing how the substrate and mask are held and an enlarged view of the marks [Figure 6] Schematic diagram of an alignment mechanism according to the first embodiment. [Figure 7] FIG. 1 is a perspective view of an alignment mechanism according to a first embodiment; [Figure 8] Schematic diagram showing the configuration of a modified example of a substrate carrier [Figure 9] Schematic diagram showing the structure of the support of Example 1 [Figure 10] Schematic diagram illustrating the characteristics of the support of Example 1 [Figure 11] Schematic diagram showing the configuration of a first support in Example 2 [Figure 12] Schematic diagram showing the configuration of the second support of Example 2 [Figure 13] Schematic diagram showing the transport of masks and carriers across multiple chambers [Figure 14] Schematic diagram of the analysis of the deflection of the mask and carrier [Figure 15] Schematic diagram illustrating the arrangement of supports in Example 2 [Figure 16] Flowchart showing each step of the process in the embodiment [Figure 17] Schematic diagram showing the structure of the support of Example 3 [Figure 18] Schematic diagram showing how a substrate carrier is placed on a mask in Example 4. [Figure 19] Schematic diagram showing the structure of the support of Example 4 [Figure 20] Diagram of an organic EL display device DETAILED DESCRIPTION OF THE INVENTION

[0012] [Example 1] The following detailed description of the present invention will be given by way of example with reference to the accompanying drawings, although the dimensions, materials, shapes, relative positions, etc. of the components described in the examples are not intended to limit the scope of the present invention unless otherwise specified.

[0013] With reference to Figures 1 to 12, a substrate carrier, a substrate transport apparatus, a film formation apparatus, a film formation method, and a method for manufacturing an electronic device according to an embodiment of the present invention will be described. In the following description, a mask mounting apparatus and the like provided in an apparatus for manufacturing an electronic device will be described as an example. Also, a case where a vacuum deposition method is used as a film formation method for manufacturing an electronic device will be described as an example. However, the present invention is also applicable to a case where a sputtering method is used as a film formation method. Furthermore, the mask mounting apparatus and the like of the present invention can be applied to various apparatuses that require mounting a mask on a substrate, other than apparatuses used in film formation processes, and are particularly applicable to apparatuses that require mounting a mask on a large substrate. The plate is preferably applicable to the device to be processed. The substrate material applicable to the present invention can be glass, as well as any material such as a semiconductor (e.g., silicon), a polymeric film, or a metal. For example, a silicon wafer or a substrate in which a film such as polyimide is laminated on a glass substrate can also be used as the substrate. When multiple layers are formed on a substrate, the "substrate" will also include layers already formed in the previous process. In addition, when multiple identical or corresponding components are included in the same drawing of various devices described below, they may be indicated by suffixes such as a and b in the drawing. However, when there is no need to distinguish between them in the description, the suffixes such as a and b may be omitted.

[0014] (Career composition) The configuration of a substrate carrier 9 according to an embodiment of the present invention will be described with reference to FIG. 1. FIG. 1(a) is a schematic plan view of the substrate carrier 9 with the holding surface for holding the substrate 5 facing upward (toward the viewer in the drawing), and FIG. 1(b) is a cross-sectional view taken along the arrow A in FIG. 1(a). The substrate carrier 9 is a flat, rectangular structure in plan view. For convenience, the substrate carrier 9 includes a substrate holding portion corresponding to the position where the substrate 5 is held and an outer peripheral portion surrounding the periphery of the substrate 5. In FIG. 1(a), the dotted line indicating the outer edge of the substrate 5 is the boundary between the substrate holding portion and the outer peripheral portion. As such, the two portions are conveniently defined by the substrate 5 to be held, and the boundary between them does not necessarily have a distinctive structure. Note that hereinafter, the substrate holding portion may also be referred to as the substrate holding area. The substrate carrier 9 is supported by transport rollers 15 (see FIGS. 3 and 5) near two opposing sides of the four sides that make up the rectangular outer peripheral edge of the substrate carrier 9. The substrate carrier 9 is supported with each of the two opposing sides aligned along the transport direction. The transport rollers 15 are composed of a plurality of transport rotators arranged along the transport direction on both sides of the transport path of the substrate carrier 9. With this support structure, the movement of the substrate carrier 9 in the transport direction is guided by the rotation of the transport rollers as substrate transport means. The substrate carrier 9 has a carrier face plate 30 which is a rectangular flat member, a plurality of chuck members 32, and a plurality of supports 33 (seating members). The substrate carrier 9 holds the substrate 5 on the holding surface 31 of the carrier face plate 30.

[0015] The chuck members 32 are protrusions having chuck surfaces that contact the substrate 5 and chuck the substrate 5. The chuck surfaces of the chuck members 32 in this embodiment are adhesive surfaces made of a physical sticky chucking material (PSC) and hold the substrate 5 by physical adhesion or physical adsorption. Therefore, the chuck members 32 in this embodiment can also be called adhesive pads. By chucking the substrate 5 with each of the multiple chuck members 32, the substrate 5 can be held along the holding surface 31 of the carrier face plate 30. The multiple chuck members 32 are arranged so that their chuck surfaces protrude a predetermined distance from the holding surface 31 of the carrier face plate 30. The chuck members 32 are preferably arranged according to the shape of the mask 6, and more preferably, are arranged corresponding to the boundary portions (bridge portions) of the mask 6 that define the film formation area of ​​the substrate 5. This reduces the impact of the chuck members 32 on the temperature distribution in the film formation area of ​​the substrate 5 due to contact between the chuck members 32 and the substrate 5.

[0016] It is preferable that the chuck members 32 be arranged outside the active area of ​​the display. This is because there is a concern that the stress caused by adhesion by the chuck members 32 may distort the substrate 5 or cause temperature distribution during film formation, so it is better to keep the contact area between the chuck members 32 and the substrate 5 as small as possible and to keep the number of chuck members as small as possible. Furthermore, for the reasons mentioned above, it is preferable from the standpoint of film formation that the chuck members 32 be arranged on the back side of the mask section.

[0017] The material of the carrier face plate 30 is preferably made primarily of aluminum or an aluminum alloy in order to reduce the weight of the entire substrate carrier 9 .

[0018] As will be described later, when the substrate carrier 9 is inverted so that the holding surface 31 of the carrier face plate 30 that holds the substrate 5 faces downward and placed on the mask 6, the supports 33 support the substrate carrier 9 relative to the mask 6. In this embodiment, the supports 33 support the substrate carrier 9 so that the substrate 5 held by the substrate carrier 9 and the mask 6 are spaced apart at least in the vicinity of the supports 33. Details will be described later.

[0019] A manufacturing system (film forming apparatus) according to an embodiment of the present invention will be described with reference to FIG. 2. FIG. 2 is a schematic configuration diagram of a manufacturing system according to an embodiment of the present invention, illustrating a manufacturing system 300 that manufactures organic EL panels (organic EL display devices) in-line. Organic EL panels are generally manufactured through a circuit element forming process in which circuit elements are formed, an organic light emitting element forming process in which organic light emitting elements are formed on a substrate, and a sealing process in which a protective layer is formed on the formed organic light emitting layer. The manufacturing system 300 according to this embodiment mainly performs the organic light emitting element forming process.

[0020] 2, the manufacturing system 300 has a mask carry-in chamber 90, an alignment chamber 100 (mask mounting chamber), multiple film formation chambers 110a and 110b, reversal chambers 111a and 111b, a transfer chamber 112, a mask separation chamber 113, a substrate separation chamber 114, a carrier transfer chamber 115, a mask transfer chamber 116, and a substrate carry-in chamber 117 (substrate mounting chamber). The manufacturing system 300 further has a transfer means, which will be described later, and the substrate carrier 9 is transferred by the transfer means along a predetermined transfer path that passes through each chamber of the manufacturing system 300.

[0021] 2, the substrate carrier 9 is transported through each chamber in the order of the substrate load chamber 117, the reversing chamber 111a, the mask load chamber 90, the alignment chamber 100 (mask mounting chamber), the plurality of film formation chambers 110a and 110b, the transfer chamber 112, the mask separation chamber 113, the reversing chamber 111b, the substrate separation chamber 114, and the transfer chamber 115, before returning to the substrate load chamber 117. Meanwhile, the mask 6 is transported through each chamber in the order of the mask load chamber 90, the alignment chamber 100 (mask mounting chamber), the plurality of film formation chambers 110a and 110b, the transfer chamber 112, and the mask separation chamber 113, before returning to the mask load chamber 90. In this manner, the substrate carrier 9 and the mask 6 are transported in a circulating manner along their respective predetermined transport paths (circulating transport paths). The function of each chamber will be described below.

[0022] The substrate 5 on which a film is not yet formed is loaded from the substrate carry-in chamber 117 onto the circulating transfer path, and is subjected to film formation while held by the substrate carrier 9. The substrate 5 on which a film has been formed is then carried out from the substrate separation chamber 114. The substrate 5 on which a film is not yet formed that has been carried into the substrate carry-in chamber 117 is first attached to and held by the substrate carrier 9 in the substrate carry-in chamber 117. Then, before film formation, the substrate 5 is carried into the alignment chamber 110 via the reversal chamber 111a and the mask carry-in chamber 90.

[0023] The reversing chambers 111a and 111b are provided with reversing mechanisms 120a and 120b that reversing the orientation of the substrate holding surface of the substrate carrier 9 from a vertically upward orientation to a vertically downward orientation, or from a vertically downward orientation to a vertically upward orientation. The reversing mechanisms 120a and 120b as reversing means may be any conventionally known mechanism that can change the posture (orientation) of the substrate carrier 9 by gripping it, and a description of the specific configuration will be omitted.

[0024] The substrate 5 is carried into the substrate carrying-in chamber 117, in which the substrate carrier 9 is arranged with its holding surface facing vertically upward, with its surface on which a film is to be formed facing vertically upward. The carried-in substrate 5 is placed on the holding surface of the substrate carrier 9 and is held by the substrate carrier 9. Thereafter, in the reversing chamber 111a, the substrate carrier 9 holding the substrate 5 is reversed by the reversing mechanism 120a, so that the surface on which a film is to be formed of the substrate 5 faces vertically downward. On the other hand, when the substrate carrier 9 is carried from the mask separation chamber 113 into the reversing chamber 111b, the substrate 5 is carried in with its surface on which a film is to be formed facing vertically downward. After carrying-in, the substrate 5 is held by the reversing mechanism 120b. The substrate carrier 9 is then inverted so that the surface on which the film is to be formed of the substrate 5 faces vertically upward. Thereafter, the substrate 5 is carried out of the substrate separation chamber 114 with the surface on which the film is to be formed facing vertically upward.

[0025] The inverted substrate carrier 9 carrying the substrate 5 loaded into the substrate loading chamber 117 is loaded into the alignment chamber 100 via the mask loading chamber 90. At the same time, the mask 6 is also loaded from the mask loading chamber 90 into the alignment chamber 100. The alignment chamber 100 (mask mounting chamber) is equipped with an alignment device 1. In the alignment chamber 100, the alignment device 1 aligns the substrate 5 and the mask 6 loaded on the substrate carrier 9 according to this embodiment with high precision, and the substrate carrier 9 (substrate 5) is placed on the mask 6. The mask 6 loaded on the substrate carrier 9 is then transferred to a transport roller (transport means), which begins transporting the mask 6 to the next process. As shown in FIGS. 3 and 6, a plurality of transport rollers 15 serving as transport means are arranged on both sides of the transport path along the transport direction. Each of the transport rollers 15 is rotated by a driving force of an AC servo motor (not shown) to transport the substrate carrier 9 and the mask 6.

[0026] In FIG. 2, in film formation chambers 110a and 110b, a substrate 5 adsorbed on a substrate carrier 9 that has been brought in passes over an evaporation source 7 (see FIG. 3), so that a film is formed on the surface of the substrate 5 on which a film is to be formed except for areas blocked by a mask 6. The film formation chamber 110 can adjust its chamber pressure (pressure inside the chamber) using a chamber pressure control unit (not shown) equipped with a vacuum pump and a chamber pressure gauge. An evaporation source (film formation source) containing an evaporation material (film formation material) can be placed inside the film formation chamber 110, thereby forming a reduced-pressure film formation space inside the chamber. In the film formation space, the evaporation material flies from the evaporation source toward the substrate 5, forming a film on the substrate. The evaporation source may include, for example, a material storage unit such as a crucible that stores the evaporation material, and a heating unit such as a sheath heater that heats the evaporation material. Furthermore, by providing a mechanism for moving the material storage section within a plane approximately parallel to the substrate carrier 9 and the mask 6, or a mechanism for moving the entire evaporation source, the position of the outlet for ejecting the evaporation material can be displaced relative to the substrate 5 within the chamber 4, thereby making the film formed on the substrate 5 uniform.

[0027] After film formation is completed in the film formation chambers 110a and 110b, the substrate carrier 9 and mask 6 arrive at the mask separation chamber 113 and are separated there. The mask 6 separated from the substrate carrier 9 is transported to the mask transfer chamber 116 and sent to a film formation process for a new substrate 5. Meanwhile, the substrate carrier 9 holding the substrate 5 is transported to the reversal chamber 111b and the substrate separation chamber 114. In the substrate separation chamber 114, the substrate 5 on which film formation has been completed is separated from the substrate carrier 9 and collected from the circulating transfer path. The substrate carrier 9 is transported to the substrate load chamber 117, where a new substrate 5 is loaded and adsorbed. Thereafter, the substrate carrier 9 is reversed in the reversal chamber 111a and again aligned and placed on the mask 6 transferred from the load chamber 90 in the alignment chamber 100.

[0028] FIG. 3 is a schematic cross-sectional view showing the overall configuration of the alignment mechanism of the in-line vapor deposition apparatus of this embodiment, and corresponds to the view seen from the arrow BB in FIG.

[0029] The deposition apparatus generally includes a chamber 4, and an alignment device 1 that holds and aligns a substrate 5 and a mask 6 held by a substrate carrier 9. The chamber pressure (pressure inside the chamber) of the chamber 4 can be adjusted by a chamber pressure control unit (not shown) that includes a vacuum pump and a chamber pressure gauge.

[0030] In the illustrated example, a deposition-up configuration is described in which a film is formed with the film-forming surface (film-forming surface) of the substrate 5 facing downward in the direction of gravity. However, a deposition-down configuration in which a film is formed with the film-forming surface of the substrate 5 facing upward in the direction of gravity may also be used. A side deposition configuration in which the substrate 5 is set up vertically and film formation is performed with the film-forming surface approximately parallel to the direction of gravity may also be used. In other words, the present invention relates to a method for forming a film when the substrate 5 and the mask 6 held by the substrate carrier 9 are brought relatively close to each other. In particular, it can be suitably used when high-precision alignment is required in a state where sagging or bending occurs in at least one of the substrate carrier 9 and the mask 6.

[0031] In this embodiment, as shown in FIG. 5, the mask 6 has a structure in which a mask foil 6b having a thickness of several μm to several tens of μm is welded and fixed to a frame-shaped mask frame 6a. The mask frame 6a supports the mask foil 6b in a state in which it is pulled in its surface direction (the X and Y directions described below) to prevent the mask foil 6b from bending. The mask foil 6b includes a boundary portion for partitioning the substrate region to be film-formed. The boundary portion of the mask foil 6b adheres to the substrate 5 when the mask 6 is attached to the substrate 5 and blocks the film-forming material. The mask 6 may be an open mask in which the mask foil 6b has only a boundary portion, or a fine mask in which fine openings corresponding to pixels or subpixels are formed in the portion other than the boundary portion, i.e., the portion of the substrate corresponding to the film-formed region. When a glass substrate or a substrate having a resin film such as polyimide formed on a glass substrate is used as the substrate 5, an iron alloy can be used as the main material for the mask frame 6a and the mask foil 6b, and an iron alloy containing nickel is preferably used. Specific examples of iron alloys containing nickel include Invar material containing 34% by mass or more and 38% by mass or less of nickel, Super Invar material containing 30% by mass or more and 34% by mass or less of nickel and further containing cobalt, and low-thermal expansion Fe-Ni-based plated alloys containing 38% by mass or more and 54% by mass or less of nickel.

[0032] 3, the chamber 4 has an upper partition wall 4a (top plate), a side wall 4b, and a bottom wall 4c. The interior of the chamber may be maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas, in addition to the reduced pressure atmosphere described above. In this specification, "vacuum" refers to a state in a space filled with a gas at a pressure lower than atmospheric pressure, and typically refers to a state in a space filled with a gas at a pressure lower than 1 atm (1013 hPa).

[0033] The alignment device 1 generally includes an alignment mechanism 60 that is mounted on the upper partition wall 4a of the chamber 4 and drives the substrate carrier 9 to relatively align the position with the mask 6. The alignment device 1 has a carrier support part 8 (substrate carrier support part) that holds the substrate carrier 9, a mask receiving table 16 (mask support part) that holds the mask 6, and transport rollers 15 (transport means).

[0034] The alignment mechanism 60 is provided outside the chamber 4 and changes and stably maintains the relative positional relationship between the substrate carrier 9 and the mask 6 so as to achieve the desired accuracy during deposition. The alignment mechanism 60 generally includes an in-plane movement means 11, a Z lift base 13, and a Z lift slider 10.

[0035] The in-plane movement means 11 is connected to the upper partition wall 4a of the chamber 4 and drives the Z lift base 13 in the X, Y, and θ directions. The Z lift base 13 is connected to the in-plane movement means 11 and serves as a base for the substrate carrier 9 when it moves in the Z direction. The Z lift slider 10 is a member that can move in the Z direction along a Z guide 18. The Z lift slider is connected to the substrate carrier support part 8 via a substrate holding shaft 12.

[0036] In this configuration, when the in-plane moving means 11 performs XYθ drive in a plane substantially parallel to the substrate carrier 9 and mask 6, the Z lift base 13, Z lift slider 10, and substrate holding shaft 12 move as a unit, transmitting a drive force to the carrier support portion 8. The substrate 5 is then moved in a plane substantially parallel to the substrate 5 and mask 6. Note that the mask 6 and substrate 5 are bent due to gravity as will be described later, but the plane substantially parallel to the substrate 5 and mask 6 here refers to a plane substantially parallel to the substrate 5 and mask 6 in an ideal state where no bending occurs. For example, in a configuration in which the substrate 5 and mask 6 are arranged horizontally, such as in a deposit-up or deposit-down configuration, the in-plane moving means 11 moves the substrate 5 in a horizontal plane. In addition, the Z guide When Z lift slider 10 is driven in the Z direction relative to Z lift base 13 by Z guide 18, the driving force is transmitted to carrier support part 8 via substrate holding shafts 12 (in this embodiment, four substrate holding shafts 12a, 12b, 12c, and 12d are provided. Note that in FIG. 6, shaft 12d is hidden by substrate 5 and mask 6 and is not shown). This changes the distance (moves away from or closer to) substrate 5 relative to mask 6. In other words, Z lift base 13 and Z guide 18 function as the distance changing means of the alignment means.

[0037] As shown in the illustrated example, by locating the alignment mechanism 60, which includes many moving parts, outside the film formation space, it is possible to suppress dust generation within the film formation space or the space where alignment is performed. This prevents dust from contaminating the mask or substrate, which would otherwise cause a decrease in film formation accuracy. While this embodiment describes a configuration in which the alignment mechanism 60 moves the substrate 5 in the X, Y, θ, and Z directions, this is not limiting. The alignment mechanism 60 may also move the mask 6, or may move both the substrate 5 and the mask 6. In other words, the alignment mechanism 60 is a mechanism that moves at least one of the substrate 5 and the mask 6, thereby aligning the relative positions of the substrate 5 and the mask 6.

[0038] 4 is a schematic cross-sectional view showing the process from the substrate loading chamber 117 through the reversing chamber 111a and the mask loading chamber 90 to the alignment chamber 100, from when the substrate 5 is attached to the substrate carrier 9, to when the substrate carrier 9 is inverted and placed on the mask 6. The substrate carrier 9 has a carrier face plate 30 (face plate member), a chuck member 32, and a support 33 (seat member).

[0039] 4(a), the carrier face plate 30 is a plate-like member made of metal or the like, and is a member that constitutes a holding surface 31 that holds the substrate 5. The carrier face plate 30 has a certain degree of rigidity (at least higher rigidity than the substrate 5), and by holding the substrate 5 along the holding surface 31, it is possible to suppress bending of the substrate 5. In the substrate loading chamber 117, the substrate 5 is lowered from above onto the holding surface 31 of the substrate carrier 9, with the holding surface 31 facing upward.

[0040] 4(b), in the inversion chamber 111a, the substrate carrier 9 and the substrate 5 are inverted upside down. That is, the substrate carrier 9 is in a position where the holding surface 31 faces downward, and the substrate 5 is attached to the holding surface 31 from below by the holding force of the chuck member 32, with the surface on which a film is to be formed facing downward.

[0041] As shown in FIGS. 4(c) and 4(d), in the alignment chamber 100, the substrate carrier 9 is placed on the mask 6. A plurality of supports 33 are arranged outside (at the outer periphery) of the substrate holding area (substrate holding portion) of the holding surface 31 of the carrier faceplate 30, protruding beyond the holding surface 31 and the chuck members 32. The supports 33 are arranged so as to protrude toward the mask 6 beyond the substrate 5 when the substrate 5 is held by the substrate carrier 9. The substrate carrier 9 is seated on the outer peripheral frame of the mask frame 6a via the supports 33 after an alignment operation. At this time, it is preferable that the substrate 5 and the mask 6 are spaced apart at least near the supports 33. This configuration improves alignment accuracy. Here, "nearby" refers to any portion of the substrate 5 that is closer to the supports 33 than the contacting portion of the substrate 5 when a portion of the substrate 5 is in contact with the mask 6. In FIG. 4(d), the entire substrate 5 is spaced apart from the mask 6. Naturally, the substrate 5 and the mask 6 are spaced apart even near the supports 33. Due to the bending of the substrate 5, a part of the substrate 5 may come into contact with the mask 6, or the entire substrate 5 may come into contact with the mask 6.

[0042] The substrate carrier 9 may further include a magnetic force generating means (not shown) for magnetically attracting the mask 6 via the held substrate 5. The magnetic force generating means may be a permanent magnet or an electromagnetic A magnet plate equipped with a magnet or a permanent electromagnet can be used. The magnetic force generating means may be provided so as to be movable relative to the carrier face plate 30. More specifically, the magnetic force generating means may be provided so as to be able to change the distance between the magnetic force generating means and the carrier face plate 30.

[0043] The configuration of the substrate holding means of the substrate carrier 9 is not limited to the chuck member 32 shown in this embodiment. For example, as in the substrate carrier 9a of Modification 1 shown in Fig. 8(a), a configuration including a support portion 321 that structurally supports the substrate 5 from below when inverted may be used. Alternatively, as in the substrate carrier 9a of Modification 2 shown in Fig. 8(b), a configuration (electrostatic chuck) may be used in which an electrode 322 is provided inside the carrier face plate 30 and the substrate 5 is held by electrostatic force generated by applying a voltage to the electrode 322.

[0044] 6 is a perspective view showing one embodiment of the alignment mechanism. The mask receiving table 16 is guided up and down (raised and lowered) along a lifting table guide 34 placed on a mask table base 19. In addition, transport rollers 15 are placed under the sides of the mask 6 in the transport direction, and the mask 6 is handed over to the transport rollers 15 as the mask receiving table 16 descends.

[0045] The substrate holding shaft 12 is provided between the outside and the inside of the chamber 4, passing through a through-hole provided in the upper partition wall 4a of the chamber 4. In the film formation space, a carrier support part 8 is provided below the substrate holding shaft 12, and is capable of holding a substrate 5, which is an object to be film formed, via a substrate carrier 9.

[0046] The through-hole is designed to be sufficiently large relative to the outer diameter of the substrate holding shaft 12 so that the substrate holding shaft 12 and the upper partition wall 4a do not interfere with each other. The section of the substrate holding shaft 12 from the through-hole to the portion where it is fixed to the Z-lift slider 10 (the portion above the through-hole) is covered by a bellows 40 fixed to the Z-lift slider 10 and the upper partition wall 4a. This allows the substrate holding shaft 12 to be covered by a closed space that communicates with the chamber 4, so that the entire substrate holding shaft 12 can be maintained in the same state as the film formation space 2 (e.g., a vacuum state). The bellows 40 should preferably be flexible in both the Z direction and the X and Y directions. This sufficiently reduces the resistance force generated when the bellows 40 is displaced by operation of the alignment device 1, thereby reducing the load during position adjustment.

[0047] The mask receiving portion is installed inside the chamber 4 on the surface of the upper partition wall 4a facing the film formation space 2, and is capable of supporting the mask 6. For example, a mask used in manufacturing organic EL panels has a configuration in which a mask foil 6b having openings corresponding to the film formation pattern is stretched and fixed on a highly rigid mask frame 6a. This configuration allows the mask receiving portion to hold the mask foil 6b in a state where it is less likely to bend.

[0048] Various operations performed by the alignment apparatus 1 (such as alignment by the in-plane movement means 11, raising and lowering of the Z-axis lift slider 10 by the distance change means, substrate holding by the carrier support 8, and deposition by the evaporation source 7) are controlled by a control unit 70. The control unit 70 can be configured, for example, by a computer having a processor, memory, storage, I / O, and the like. In this case, the functions of the control unit 70 are realized by the processor executing a program stored in the memory or storage. The computer may be a general-purpose personal computer, an embedded computer, or a PLC (programmable logic controller). Alternatively, some or all of the functions of the control unit 70 may be configured by a circuit such as an ASIC or FPGA. A control unit 70 may be provided for each deposition apparatus, or one control unit 70 may control multiple deposition apparatuses.

[0049] The alignment mechanism 60 of the alignment device 1 will now be described in detail. The guides that guide Z lift slider 10 in the vertical Z direction include multiple (four in this case) Z guides 18a to 18d, which are fixed to the side of Z lift base 13. A ball screw 27 for transmitting driving force is disposed in the center of Z lift slider 10, and power transmitted from motor 26 fixed to Z lift base 13 is transmitted to Z lift slider 10 via ball screw 27.

[0050] Motor 26 has a built-in rotary encoder (not shown), and the Z direction position of Z lift slider 10 can be measured indirectly from the number of rotations of the encoder. By controlling the drive of motor 26 with an external controller, it is possible to precisely position Z lift slider 10 in the Z direction. Note that the lift mechanism for Z lift slider 10 is not limited to ball screw 27 and rotary encoder, and any mechanism can be used, such as a combination of a linear motor and linear encoder.

[0051] Figure 7 is a perspective view showing the in-plane movement means 11 of the alignment mechanism of this embodiment. In the configuration of Figure 7, the in-plane movement means 11 has multiple drive units 21a, 21b, 21c, and 21d at the four corners of the base. Each of the drive units 21a to 21d is arranged with the direction of the drive unit located at the adjacent corner rotated by 90 degrees around the Z axis so that the direction in which the drive force is generated differs by 90 degrees at each of the four corners.

[0052] Each drive unit 21 includes a drive unit motor 25 that generates a drive force. Each drive unit 21 further includes a first guide 22 that slides in a first direction as the force of the drive unit motor 25 is transmitted via a drive unit ball screw 46, and a second guide 23 that slides in a second direction perpendicular to the first direction in the XY plane. Each drive unit 21 also includes a rotary bearing 24 that can rotate around the Z axis. For example, drive unit 21d includes a first guide 22 that slides in the X direction, a second guide 23 that slides in the Y direction perpendicular to the X direction, and a rotary bearing 24, and the force of the drive unit motor 25 is transmitted to the first guide 22 via the drive unit ball screw 46. The other drive units 21a, 21b, and 21c each have a configuration similar to drive unit 21d, except that their orientations differ by 90 degrees from each other.

[0053] The drive unit motor 25 has a built-in rotary encoder (not shown) and is capable of measuring the amount of displacement of the first guide 22. In each drive unit 21, the drive of the drive unit motor 25 is controlled by the control unit 70, making it possible to precisely control the position of the Z lift base 13 in the X, Y, θ, and z directions.

[0054] For example, when moving Z lifting base 13 in the +X direction, it is preferable to use drive unit motor 25 to generate a sliding force in the +X direction in each of drive units 21a and 21d, and transmit that force to Z lifting base 13. When moving in the +Y direction, it is preferable to use drive unit motor 25 to generate a sliding force in the +Y direction in each of drive units 21b and 21c, and transmit that force to Z lifting base 13.

[0055] When rotating Z lift base 13 by +θ around a rotation axis parallel to the Z axis (rotating θz clockwise), it is preferable to use diagonally arranged drive units 21a and 21d to generate the force required for +θz rotation around the Z axis and transmit that force to Z lift base 13. Alternatively, drive units 21b and 21c can be used to transmit the force required for rotation to Z lift base 13.

[0056] Next, we will explain an imaging device for simultaneously measuring the positions of the alignment marks on the substrate 5 and the mask 6 in order to detect the positions of the substrate 5 and the mask 6. As shown in Figures 3 and 6, the alignment marks (mask marks) on the mask 6 and the substrate 5 are recorded on the outer surface of the upper partition wall 4a. The chamber 4 is provided with imaging devices 14 (14a, 14b, 14c, 14d) that serve as position acquisition means for acquiring the positions of alignment marks (substrate marks) on the substrate 5. An imaging through-hole is provided in the upper partition wall 4a on the camera optical axis so that the imaging device 14 can measure the positions of alignment marks arranged inside the chamber 4. The imaging through-hole is provided with window glasses 17 (17a, 17b, 17c, 17d) and the like to maintain the air pressure inside the chamber. Furthermore, lighting (not shown) is provided inside or near the imaging device 14, and by irradiating light near the alignment marks on the substrate and mask, accurate measurement of the mark images is possible. In FIG. 3, the imaging device 14d and window glasses 17c, 17d are hidden by other components and are not shown.

[0057] A method for measuring the positions of the board mark 37 and the mask mark 38 using the imaging device 14 will be described with reference to FIGS. 5(a) to 5(c).

[0058] FIG. 5(a) is a top view of the substrate 5 on the carrier face plate 30 while it is held by the carrier support part 8. For ease of explanation, the carrier face plate 30 is shown as if it were transparent, using dotted lines. On the substrate 5, board marks 37a, 37b, 37c, and 37d that can be measured by the imaging device 14 are formed at the four corners of the substrate 5. These board marks 37a to 37d are simultaneously measured by the four imaging devices 14a to 14d, and the amount of movement of the substrate 5 in the X direction, the amount of movement in the Y direction, and the amount of rotation are calculated from the positional relationship of the four central points of each of the board marks 37a to 37d, thereby obtaining position information for the substrate 5. A through-hole is opened in the carrier face plate 30, allowing the position of the board mark 37 to be measured from above by the imaging device 14.

[0059] 5(b) is a top view of the mask frame 6a. Mask marks 38a, 38b, 38c, and 38d that can be measured by imaging devices are formed at the four corners. These mask marks 38a to 38d are simultaneously measured by the four imaging devices 14a, 14b, 14c, and 14d, and the amount of movement of the mask 6 in the X direction, the amount of movement in the Y direction, the amount of rotation, etc. can be calculated from the positional relationships between the four central positions of each of the mask marks 38a to 38d, thereby obtaining position information for the mask 6.

[0060] FIG. 5(c) is a diagram schematically illustrating the field of view 44 of an image captured when one of four pairs of mask marks 38 and board marks 37 is measured by the imaging device 14. In this example, the board mark 37 and the mask mark 38 are simultaneously measured within the field of view 44 of the imaging device 14, making it possible to measure the relative positions of the mark centers. The mark center coordinates can be calculated using an image processing device (not shown) based on the image obtained by measurement by the imaging device 14. Note that while the mask marks 38 and the board marks 37 are shown as being square or round, the mark shapes are not limited to these. For example, it is preferable to use symmetrical shapes, such as an X or a cross, that make it easy to calculate the center position.

[0061] When highly accurate alignment is required, a high-magnification CCD camera with a high resolution on the order of several microns is used as the imaging device 14. Because such a high-magnification CCD camera has a narrow field of view of several millimeters, if there is a large misalignment when the substrate carrier 9 is placed on the carrier receiving claws, the substrate mark 37 will fall out of the field of view, making measurement impossible. Therefore, it is preferable to use a low-magnification CCD camera with a wide field of view in addition to the high-magnification CCD camera as the imaging device 14. In this case, rough alignment is performed using the low-magnification CCD camera so that the mask mark 38 and the substrate mark 37 simultaneously fit within the field of view of the high-magnification CCD camera, and then the positions of the mask mark 38 and the substrate mark 37 are measured using the high-magnification CCD camera to perform highly accurate alignment (fine alignment).

[0062] By using a high-magnification CCD camera as the imaging device 14, the mask frame 6a and the base The relative position of plate 5 can be adjusted with an accuracy of within a few microns. However, imaging device 14 is not limited to a CCD camera, and may be, for example, a digital camera equipped with a CMOS sensor as an imaging element. Furthermore, instead of separately installing a high-magnification camera and a low-magnification camera, a camera with interchangeable high-magnification and low-magnification lenses or a zoom lens may be used, allowing high-magnification and low-magnification measurements to be made with a single camera.

[0063] The relative position information between the mask frame 6a and the substrate 5 can be obtained from the position information of the mask frame 6a and the substrate 5 acquired by the imaging device 14. This relative position information is fed back to the control unit 70 of the alignment device, which controls the drive amount of each drive unit, such as the lift slider 10, the in-plane moving means 11, and the carrier support unit 8.

[0064] (Substrate placement method) A series of operations of the vapor deposition apparatus from setting the substrate 5 on the substrate carrier 9, aligning the substrate 5 on the substrate carrier 9 with the mask 6, and placing the substrate carrier 9 (substrate 5) on the mask 6 will be described below.

[0065] FIG. 16 is a flowchart showing the operation sequence of the vapor deposition apparatus of the embodiment.

[0066] First, in step S101, the substrate carrier 9 mounted on the transfer mechanism is carried into the chamber 4 via the gate valve and placed on the carrier receiving claws on both sides of the carrier support part 8. One of the carrier receiving claws is arranged at a predetermined interval along a first side of the substrate 5 (substrate carrier 9) and supports the peripheral edge of the substrate carrier 9 near the first side of the substrate 5. The other of the carrier receiving claws is arranged at a predetermined interval along a second side of the substrate 5 opposite the first side and supports the peripheral edge of the substrate carrier 9 near the second side of the substrate 5.

[0067] Next, in step S103, the substrate carrier 9 is lowered and set to a height at which it can be imaged by the low-magnification CCD camera. Next, in step S104, the low-magnification CCD camera images the substrate marks 37 provided on the substrate 5. The control unit 70 obtains position information of the substrate 5 based on the image thus captured and stores the information in memory.

[0068] Step S105 may be executed following step S104, or following step S109 or S113 when the determination in step S109 or S113 is "NO."

[0069] In step S105, which is executed following step S104, the substrate carrier 9 is lowered and set to the alignment operation height, and the position of the substrate 5 is adjusted based on the position information acquired in step S104.

[0070] First, regarding the height of the substrate carrier 9, the distance separating the carrier receiving surface (upper surface of the carrier receiving claws) and the mask 6 is changed to a height lower than that in step S104. However, at this time, the position of the carrier receiving surface is set to a height such that the substrate 5 on the substrate carrier 9 that has been bent due to its own weight does not come into contact with the mask 6. Note that, in some cases, steps S105 and S104 may be performed at the same height.

[0071] In the alignment operation in step S105, which is executed following step S104, the control unit 70 drives the alignment mechanism 60 provided in the alignment device 1 based on the position information of the substrate 5 acquired in step S104. That is, the control unit 70 adjusts the position of the substrate 5 so that the substrate mark 37 of the substrate 5 is within the field of view of the high-magnification CCD camera. Note that with respect to the mask 6, the mask mark 38 is within the field of view of the high-magnification CCD camera (preferably The relative positions of the mask 6 and the high-magnification CCD camera have already been adjusted in advance so that the mask 6 is positioned within the field of view (center of the field). Therefore, the alignment operation in step S105, which is executed following step S104, adjusts both the substrate mark 37 and the mask mark 38 so that they are within the field of view of the high-magnification CCD camera. However, at this point, due to the depth of field, it is possible that the high-magnification CCD camera will not be able to capture the substrate mark 37. Note that in the alignment operation, the substrate 5 is moved in the X, Y, θ, and z directions, but as described above, the substrate 5 is moved at a height that prevents it from coming into contact with the mask 6 due to its own weight. Therefore, the surface of the substrate 5 or the film pattern already formed on the surface of the substrate 5 will not be damaged by sliding against the mask 6.

[0072] Next, in step S106, the substrate carrier 9 is lowered and the substrate 5 is set at a height at which it can be imaged by the high-magnification CCD camera.

[0073] Here, in order to focus a high-magnification CCD camera with a shallow depth of field on both the substrate mark 37 and the mask mark 36 and take an image, the substrate 5 is brought close to the mask 6 until at least a part (the bent part) of the substrate 5 comes into contact with the mask 6 and a substrate-mask abutment part is formed.

[0074] Next, in step S108, the substrate mark 37 on the substrate 5 and the mask mark 38 on the mask 6 are simultaneously imaged by a high-magnification CCD camera. The control unit 70 acquires relative position information between the substrate 5 and the mask 6 based on the captured image. Specifically, the relative position information here refers to information regarding the distance between the centers of the substrate mark 37 and the mask mark 38 and the direction of positional misalignment. Step S108 is a measurement process (measurement processing) that acquires relative position information (amount of relative positional misalignment) between the substrate 5 and the mask 6 and measures the amount of positional misalignment between the substrate 5 and the mask 6.

[0075] Next, in step S109, the control unit 70 determines whether the amount of misalignment between the substrate 5 and the mask 6 measured in step S108 is equal to or less than a predetermined threshold. The predetermined threshold is a value set in advance so that the amount of misalignment between the substrate 5 and the mask 6 falls within a range that does not cause any problems even when film formation is performed. The threshold is set so that the desired alignment accuracy between the substrate 5 and the mask 6 can be achieved. The threshold is set, for example, to an error on the order of a few μm.

[0076] In step S109, if it is determined that the amount of misalignment between the substrate 5 and the mask 6 exceeds a predetermined threshold (step S109: NO), the process returns to step S105 to perform the alignment operation, and then the process continues from step S106 onwards.

[0077] In step S105, which is executed if the determination in step S109 is NO, the substrate carrier 9 is raised and set to the alignment operation height, and the position of the substrate 5 is adjusted based on the relative position information acquired in step S108.

[0078] In the alignment operation that is performed when the determination in step S109 is NO, the control unit 70 drives the alignment mechanism provided in the alignment apparatus 1 based on the relative position information between the substrate 5 and the mask 6 acquired in step S108. That is, the control unit 70 adjusts the position by moving the substrate 5 in the XYθz directions so that the substrate mark 37 on the substrate 5 and the mask mark 38 on the mask 6 are positioned closer to each other.

[0079] During the alignment operation, the substrate 5 is moved in the XYθz directions, but as mentioned above, the substrate 5 is moved at a height that prevents it from coming into contact with the mask 6 due to its bending due to its own weight, so the surface of the substrate 5 or the film pattern already formed on the surface of the substrate 5 will not be damaged by sliding against the mask 6.

[0080] Step S105 is an alignment process (alignment processing) in which the substrate 5 is moved so that the amount of misalignment between the substrate 5 and the mask 6 is reduced, and if the determination in step S109 is NO, fine alignment is performed.

[0081] If the determination in step S109 is YES, in step S110, the substrate carrier 9 is further lowered so that the entire substrate carrier 9 is placed on the mask frame 6a. That is, the support of the substrate carrier 9 by the carrier support part 8 is released, and both the substrate carrier 9 (substrate 5) and the mask frame 6a (mask 6) carrying it are supported by the mask support table 16 (mask support part). Then, in step S112, images of the substrate mark 37 and the mask mark 36 are taken by a high-magnification CCD camera, and relative position information of the substrate 5 and the mask 6 is obtained.

[0082] Next, in step S113, the control unit 70 determines whether the amount of misalignment between the substrate 5 and the mask 6 is equal to or less than a predetermined threshold based on the relative position information between the substrate 5 and the mask 6 acquired in step S112. The predetermined threshold is set in advance as a condition that film formation can be performed without any problems if the amount is within the threshold.

[0083] In step S113, if it is determined that the amount of misalignment between the substrate 5 and the mask 6 exceeds a predetermined threshold (step S113: NO), the carrier receiving claws are raised to the height of the substrate 5 to support the substrate carrier 9. Note that such a NO determination can occur, for example, when misalignment occurs due to external vibrations between steps S109 and S114.

[0084] Then, the process returns to step S105 to perform the alignment operation, and then the process continues from step S106 onwards.

[0085] On the other hand, if it is determined in step S113 that the amount of misalignment between the substrate 5 and the mask 6a is equal to or less than the predetermined threshold (step S113: YES), the process proceeds to step S114, where the mask lifting table 16 is lowered and the mask is handed over to the transport rollers 15. This completes the alignment sequence (END).

[0086] Then, in the mounting step, the substrate carrier support part 8 is lowered to move the substrate carrier 9 and the mask 6 from a separate position where the substrate carrier 9 is spaced above the mask 6 to a mounting position where the substrate carrier 9 is placed on the mask 6 (transition from the separate state to the mounted state). In this embodiment, the substrate carrier is lowered along the Z-axis direction, which is the third direction, but the direction may be at a slight angle to the Z-axis direction as long as the desired mounting operation of the present invention can be achieved. Also, the substrate carrier support part 8 may be left unchanged and only the mask support part may be moved, or both may be moved.

[0087] The structure of the substrate carrier 9 according to this embodiment will be described with reference to FIGS. 1, 9, and 10. FIG. 9 is a schematic diagram showing the structure of the support 33 according to this embodiment. FIGS. 9(a) and 9(b) are a front view and a perspective view illustrating the structure of the unitized support 33. FIG. 9(c) is a schematic diagram (a cross-sectional view taken along arrow C in FIG. 4(d)) showing the support 33 assembled to the carrier face plate 30 of the substrate carrier 9 and placed on the mask 6. FIGS. 10(a) and 10(b) are schematic diagrams showing how the support 33 according to this embodiment absorbs tilt misalignment between the substrate carrier 9 and the mask 6. Note that the structure of the support 33 is omitted in FIGS. 10(a) and 10(b). FIGS. 10(c) and 10(d) are schematic diagrams showing how the support 33e according to the comparative example absorbs tilt misalignment between the substrate carrier 9 and the mask 6.

[0088] The support 33 according to this embodiment functions as a support portion that supports the substrate carrier 9 with respect to the mask 6 when the substrate carrier 9 holding the substrate 5 is placed on the mask 6. The support 33 according to this embodiment can support the substrate carrier 9 with respect to the mask 6 even when the opposing surfaces of the carrier face plate 30 of the substrate carrier 9 and the mask 6 are misaligned in inclination, in other words, when the opposing surfaces are not locally parallel to each other. A stable supporting state can be maintained and formed, and as a result, misalignment between the substrate carrier 9 and the mask 6 can be reduced.

[0089] As shown in FIGS. 9(a) and 9(b), the support 33 includes a first block body 331, a second block body 332, and a leaf spring 330 interposed between them to connect them. The first block body 331 and the second block body 332 are rigid bodies made of stainless steel or the like and each having a substantially rectangular parallelepiped shape. They are arranged so that their longitudinal directions are parallel to each other. As shown in FIG. 1(a), the longitudinal direction is a direction along one side of the substrate 5 when the substrate 5 is held by the substrate carrier 9. The direction along each side of the substrate 5 is the "direction along the periphery" of the portion extending along each side of the periphery of the carrier face plate 30. For example, as shown in FIG. 1(a), the periphery of the carrier face plate 30 includes portions extending vertically on the left and right sides of the substrate 5. In these two portions, the direction along the periphery is a direction along either the left or right side of the substrate 5 (referred to as the first direction for convenience). The outer periphery of the carrier face plate 30 includes portions extending in the left-right direction on the page above and below the substrate 5. In these two portions, the direction along the outer periphery is the direction along either the top or bottom edge of the substrate 5 (for convenience, referred to as the second direction).

[0090] The substrate carrier 9 of this embodiment is provided with a plurality of supports 33. If the outer periphery of the carrier face plate 30 is divided into four sections extending along the four sides of the substrate 5, seven supports 33 are provided in each section. As shown in FIG. 1( a), the supports 33 provided in the section of the outer periphery of the carrier face plate 30 extending along a first direction are arranged so that their longitudinal direction is aligned with the first direction. On the other hand, the supports 33 provided in the section of the outer periphery extending along a second direction intersecting the first direction are arranged so that their longitudinal direction is aligned with the second direction. In other words, each support 33 is arranged along a nearby edge of the substrate 5.

[0091] The leaf spring 330 connecting the first block body 331 and the second block body 332 is an elastic body. The leaf spring 330 has a substantially horizontal C-shape. That is, the leaf spring 330 includes a long plate extending in the longitudinal direction of the first block body 331. The center of the long plate is fixed to the first block body 331. Both ends of the long plate are curved and folded back inward relative to the center, that is, in a direction away from the first block body 331. The portions extending beyond the folded back portions are fixed to the second block body 332. The length of the leaf spring 330 in the direction along the outer periphery is determined by the apex of the folded back portion, and is preferably equal to or shorter than the length of the first block body 331 in the longitudinal direction. The width of the plates constituting the leaf spring 330 is shorter than the length in the direction along the outer periphery of the leaf spring 330. The thickness of the plates constituting the leaf spring 330 is also smaller than the width. While the leaf spring 330 has been described as being curved and folded to explain its shape, this does not limit the manufacturing process of the leaf spring 330. The leaf spring 330 may be formed by bending a single plate as described above, or may be formed into the above-described shape by carving out a single block.

[0092] The structure of the leaf spring 330 when viewed in cross section or side view will be described in more detail. The cross section in FIG. 9(c) is a cross section that includes a line parallel to one side of the substrate 5 and is perpendicular to the surface of the first block body 331 that contacts the mask 6. Therefore, FIG. 9(c) shows a portion of the outer periphery of the carrier face plate 30 that extends in a direction along that side of the substrate 5. Note that the cross section perpendicular to the surface of the block body 331 that contacts the mask 6 is defined when no external force is applied to the first block body 331, that is, when the leaf spring 330 is in a steady state.

[0093] The leaf spring 330 has a first fixed portion 330a, a second fixed portion 330b, and a spring portion 330c, which are configured as a single curved plate member. The first fixed portion 330a is oriented in a direction along the outer periphery of the substrate carrier 9 (a direction along a line parallel to the one side of the substrate 5). ) and fixed to the first block body 331. The second fixing portion 330b extends in the same direction as the first fixing portion 330a (the direction along a line parallel to the one side of the substrate 5) and is fixed to the carrier face plate 30 side via the second block 332. The spring portion 330c is a portion that connects the first fixing portion 330a and the second fixing portion 330b, and extends while curving back between the first fixing portion 330a and the second fixing portion 330b, and is integrated with the first fixing portion 330a and the second fixing portion 330b. The second fixing portion 330b is configured to be separated in the direction along the line parallel to the one side of the substrate 5, and two spring portions 330c corresponding to the separated second fixing portions 330b each connect the second fixing portion 330b and the first fixing portion 330a. That is, the separated second fixing portion 330b is connected to one end of the first fixing portion 330a in the direction along the line via one of the two spring portions 330c (first spring portion). Similarly, the separated other second fixing portion 330b is connected to the other end of the second fixing portion 330a in the direction along the line via the other of the two spring portions 330c (second spring portion). Note that if the second block body 332 is omitted, the second fixing portion 330b is fixed directly to the carrier face plate 30.

[0094] In the support body 33, the first block body 331 and the leaf spring 330, and the second block body 332 and the leaf spring 330 are connected by screws 334 as fastening members. In other words, the support body 33 has a unit structure in which the first block body 331, the second block body 332, and the leaf spring 330 are connected to one another and integrated.

[0095] As shown in FIG. 9( c), the support 33 is accommodated and arranged in an attachment recess 301 provided on the underside of the carrier face plate 30 (the surface facing the mask 6) and is connected and fixed to the carrier face plate 30 by screws 333 serving as fastening members. That is, the support 33 is configured such that a unit consisting of a first block body 331, a second block body 332, and a leaf spring 330 can be attached and detached as a whole to the carrier face plate 30 of the substrate carrier 9. The screws 333 are configured to fasten the support 33 (second block body 332) in a recess 302 provided on the upper surface of the carrier face plate 30. When the first block body 331 of the support 33 fixed to the outer periphery of the carrier face plate 30 is placed on the mask frame 6 a of the mask 6, the substrate carrier 9 is placed in a state in which the film formation surface of the substrate 5 it holds faces the mask 6 with a predetermined gap between them (the state in which the substrate carrier 9 is placed on the mask 6 shown in FIG. 4( d) and the like). The heights of the first and second block bodies 331 and 332, the strength of the leaf spring 330, and the like are set so as to ensure a predetermined height h between the opposing surfaces of the carrier face plate 30 and the mask 6. For example, the height of the unit consisting of the first and second block bodies 331, 332, and leaf spring 330 in the direction in which the three members are connected is greater than the depth of the mounting recess 301. The difference between the height of the unit and the depth of the mounting recess 301 is greater than the thickness 5 of the substrate. It is preferable that the above relationship be maintained after the substrate carrier 9 is placed on the mask 6 and the leaf spring 330 is elastically deformed by the load.

[0096] As shown in FIG. 9( c), the support 33 is configured so that the inclination between the first block body 331 and the second block body 332 can be varied by elastic deformation of the leaf spring 330 serving as an elastic body. The carrier 9 and the mask 6 undergo considerable bending deformation due to their own weight, and their surface properties, such as surface roughness and the presence or absence of fine irregularities, may vary. That is, the outer periphery of the carrier face plate 30 and the mask frame 6a of the mask 6 are not always parallel to each other. Therefore, the support 33 of this embodiment has an outer shape that follows the outer periphery of the carrier face plate 30. The support 33 is configured to be elastically deformable so that at least the distance between the first block body 331 and the carrier face plate 30 on one side in the direction along the outer periphery differs from the distance between the first block body 331 and the carrier face plate 30 on the other side. Here, the distance between the first block body 331 and the carrier face plate 30 is determined by the distance between the first block body 331, the second block body 332, and the leaf spring 330. This is the distance in the connected direction (the height direction of the unit). In Figure 9(c), this is the distance along the vertical direction of the paper.

[0097] 1(a), the direction in which the outer periphery extends varies depending on the position, and therefore the longitudinal direction of the support 33 varies depending on the position of the outer periphery where the support 33 is disposed. At least the support 33 is provided so as to be elastically deformable so as to make the distance between the first block body 331 and the carrier face plate 30 on one side different from the distance between the first block body 331 and the carrier face plate 30 on the other side in the first direction. Furthermore, in this embodiment, the support 33 is provided so as to be elastically deformable so as to make the distance between the first block body 331 and the carrier face plate 30 on one side different from the distance between the first block body 331 and the carrier face plate 30 on the other side in the second direction intersecting the first direction.

[0098] Here, Figures 10(c) and 10(d) show a comparative example of a support 33e. Unlike the support 33 of this embodiment, the support 33e is configured to maintain a constant shape and is unable to follow any deviation in the tilt between the carrier face plate 30 and the mask 6. In this configuration, the contact area between the support 33e and the mask 6 is unstable due to factors such as the tilt between the carrier face plate 30 and the mask 6 and the presence or absence of unevenness. This can easily lead to deviations between the two due to changes in the frictional force between the two. In particular, as the substrate carrier 9 and the mask 6 increase in size in response to an increase in the size of the substrate 5, various patterns of unevenness are likely to occur on the carrier face plate 30 and the mask 6. Therefore, localized differences in tilt between the carrier face plate 30 and the mask 6 are likely to occur. This localized difference in tilt is thought to lead to a reduction in the contact area between the support 33e and the mask 6.

[0099] 10(a) and 10(b), the support 33 in this embodiment can deform to absorb any deviation in the tilt between the carrier face plate 30 and the mask 6. As a result, the lower surface (the surface in contact with the mask 6) of the first block body 331 placed on the mask 6 faces parallel to the tilt of the mask 6, and the contact area with the mask 6 (and therefore the frictional force between the support 33 and the mask 6) can be maintained constant. Therefore, the substrate carrier 9 can be stably supported relative to the mask 6, and any positional deviation between the substrate carrier 9 and the mask 6 can be prevented.

[0100] 1(a), multiple supports 33 are provided along the outer periphery surrounding the outer periphery of the substrate holding portion of the carrier face plate 30, but their arrangement is not limited to a specific arrangement and is set appropriately depending on the specifications of the substrate 5, substrate carrier 9, and mask 6. For example, they are arranged appropriately taking into consideration the sizes and materials of the substrate 5, substrate carrier 9, and mask 6, their ease of bending, etc.

[0101] Furthermore, the elastic body of the support 33 does not need to be configured in the same manner as the leaf spring 330 of this embodiment. For example, an elastic body such as a coil spring or rubber may be used. Furthermore, the leaf spring 330 does not need to be configured as a single leaf spring as in this embodiment, but may be configured as a unit between the first block body and the second block body by combining multiple leaf springs. That is, the spring portions 330c of the leaf spring 330 of this embodiment are provided in pairs at both ends along the outer periphery of the first fixed portion 330a, and the second fixed portion 330b is also provided in pairs so as to be connected to each of the paired spring portions 330c. However, for example, the first fixed portion 330a may also be configured in pairs, with the approximately C-shaped leaf springs arranged in pairs facing each other. Furthermore, instead of the curved folded form of this embodiment, the leaf spring may be in the form of a linearly folded leaf spring.

[0102] The strength of the elastic force of the elastic body and the range of tilt that can be achieved by elastic deformation can be set as appropriate. For example, multiple types of support unit 33 units with different elastic deformation performances can be prepared in advance, and they can be used according to the specifications of the substrate 5, substrate carrier 9, or mask 6 to be attached, or according to differences in the setting position on the carrier face plate 30.

[0103] In this embodiment, a rectangular substrate 5 and a rectangular mask 6 are exemplified, but the shapes of the substrate and mask are not limited to rectangular.

[0104] [Example 2] A second embodiment of the present invention will be described with reference to Figures 11 to 16. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals and will not be described again. In the second embodiment, matters that will not be particularly described here are the same as those in the first embodiment.

[0105] This embodiment differs from the first embodiment in that different types of supports are arranged as multiple supports provided on the outer periphery of the carrier face plate 30. The different types of supports include a first support 33a that combines a block body and an elastic body, and a second support 33b that is composed only of a block body.

[0106] FIG. 11 is a schematic diagram showing the configuration of the first support 33a of this embodiment, with (a) being a front view and (b) being a perspective view. The first support 33a has a substantially rectangular parallelepiped block body 332a, which is a rigid body made of stainless steel or the like, and a substantially rectangular parallelepiped elastic body 335 made of an elastic material such as rubber. The block body 332a and the elastic body 335 are integrally fixed to each other, with the block body 332a fixed to the outer periphery of the carrier face plate 33, and the rubber-like elastic body 335 contacting the mask 6. Similar to the support 33 of Example 1, the first support 33a is accommodated and disposed in an attachment recess 301 provided on the underside of the carrier face plate 30 (the surface facing the mask 6) and is connected and fixed to the carrier face plate 30 by screws 33 as fastening members.

[0107] 12 is a schematic diagram showing the configuration of the second support 33b of this embodiment, with (a) being a front view and (b) being a perspective view. The second support 33b has a substantially rectangular parallelepiped block body 332b that is a rigid body made of stainless steel or the like, and the block body 332b is fixed to the outer periphery of the carrier face plate 33 and is in contact with the mask 6. Similar to the support 33 of Example 1, the second support 33b is also housed and disposed in an attachment recess 301 provided on the underside of the carrier face plate 30 (the surface facing the mask 6), and is connected and fixed to the carrier face plate 30 by screws 33 as fastening members.

[0108] 13 is a schematic cross-sectional view showing the transport of a mask 6 and a carrier 9 (substrate 5) along a transport line that runs from an alignment chamber 100, through a transport chamber 112b, to a film formation chamber 110 in which an evaporation source 20 and the like are disposed. The carrier 9 that holds the substrate 5 is positioned and superimposed (placed) on the mask 6 in the alignment chamber 100. The mask 6 and carrier 9 are transported from the alignment chamber 100 to various chambers, such as the transport chamber 112b and the film formation chamber 110, with the mask 6 placed on the carrier 9. The transport assembly consisting of the mask 6 and the carrier 9 is supported by rollers 15 that serve as transport means (transport members), and is transported in a predetermined transport direction while being guided by the rotation of the rollers 15 under the driving force of a driving means (not shown).

[0109] Here, the above-mentioned conveying assembly is conveyed by rollers 15 with the carrier 9, which holds the substrate 5 of approximately the same size as the mask 6, simply placed on top of the mask 6. Therefore, vibrations during conveyance may cause misalignment between the mask 6 and the carrier 9. Such misalignment may result in misalignment between the mask 6 and the substrate 5, which may affect the film formation accuracy. The behavior and degree of misalignment when it occurs depend on the conveying speed within the conveying path, the arrangement of the rollers 15, individual differences between the rollers 15, manufacturing differences, etc. This varies depending on the individual differences of the carriers 9 and masks 6 combined in the manufacturing line, and on the changes in their combination in the circulation route.

[0110] Furthermore, gate valves 130 are installed between each chamber to separate them, preventing the placement of rollers 15. This restricts the spacing W2 of rollers 15 across adjacent chambers. While the spacing W1 of rollers 15 within each chamber can be set arbitrarily, the spacing W2 must ensure the installation width of the gate valves 130. In most film-forming systems, this spacing must be longer than the spacing W1. To maintain the vacuum / atmospheric state within the chamber, the gate valve 130 is not simply a lid separating the chambers. It requires a movable valve body that seals the lid and holds it in place to prevent it from coming off. This thickness tends to increase as film-forming systems become larger due to larger substrates. Therefore, while the spacing of rollers 15 within a chamber can be set at equal intervals, ensuring stable transport, the spacing of rollers 15 becomes uneven when crossing chambers, resulting in unstable transport.

[0111] Furthermore, the leading and trailing ends of the conveying assembly, consisting of the mask 6 and carrier 9, in the conveying direction are temporarily unsupported by the rollers 15 (i.e., cantilevered) between the adjacent rollers 15, resulting in deflection due to their own weight. This deflection is particularly pronounced when the leading and trailing ends of the conveying assembly approach the area of ​​the placement interval W2 on the conveying path. Due to such deflection, in conventional carriers, the seating state of the rigid gap block used as a support relative to the mask changes, resulting in misalignment between the carrier and the mask. For example, the inventors of the present invention have found that in a 3 m square mask-carrier conveying assembly, the amount of misalignment is on the order of several tens to several tens of microns. For example, if the amount of misalignment is 30 microns, the ratio of the amount of misalignment to the length of the assembly is 1 / 100,000. In conventional conveying assemblies, the carrier size is 3m square and the thickness is about 40mm, so gap blocks are arranged to provide multi-point support at about 30 points to prevent deformation due to its own weight, but this can sometimes cause misalignment as described above.

[0112] Figure 14 is a schematic diagram showing an analysis of the deflection of the rear end of the transport assembly consisting of the mask 6 and carrier 9 when it approaches the area where the placement interval is W2 on the transport path. The various parameters shown in Figure 14 are as follows. dz: Forced deformation of the mask 6 due to riding on the roller 15 during transportation kr: spring constant of the first support 33a Forced load caused by Fm:dz β: Coefficient for expressing the horizontal component of Fm (angle component, etc.) Fs: Horizontal component of Fm load mg: Load of carrier 9 μ: coefficient of friction of the second support 33b α: Ratio of the load received at the center of the conveying assembly Fh: friction force of the second support 33b

[0113] Figure 15 is a schematic diagram illustrating the arrangement of supports in this embodiment. Figure 15(a) is a schematic plan view showing the arrangement of first supports 33a and second supports 33b in carrier 9. Figures 15(b) and 15(c) are schematic diagrams showing the state of the mask 6 / carrier 9 transport assembly during transport in this embodiment.

[0114] In this embodiment, in the transport direction of the substrate 5, the first support 33a is arranged at the front and rear ends of the outer periphery of the carrier face plate 30, and the second support 33b is arranged at the center of the outer periphery. The first support 33a is disposed only in the center in the transport direction, that is, in a location where cantilever-like bending does not occur and the seating state of the mask 6 is unlikely to change. On the other hand, the first support 33a, in which the elastic body 335 capable of elastic deformation following such bending deformation comes into contact with the mask 6, is disposed at each of the leading and trailing ends in the transport direction where cantilever-like bending deformation occurs in the mask 6 and carrier 9.

[0115] In the rectangular outer periphery, a plurality of first supports 33a are arranged at predetermined intervals along the edge perpendicular to the conveying direction at the leading end in the conveying direction, and a plurality of first supports 33a are arranged at predetermined intervals along the edge perpendicular to the conveying direction at the trailing end in the conveying direction. In this embodiment, as an example, a configuration is shown in which the first supports 33a are arranged at three points, at each corner and in the center at the leading and trailing ends.

[0116] The second supports 33b are arranged at predetermined intervals along the sides parallel to the conveying direction on the outer periphery of the rectangle. In this embodiment, as an example, three second supports 33b are arranged at equal intervals in the central region of the carrier face plate 30 in the conveying direction.

[0117] By arranging the second supports 33b only in the center of the transport direction, where the seating state of the mask 6 is unlikely to change, transport misalignment can be effectively suppressed. The range in which the second supports 33b are arranged is within the area obtained by subtracting the maximum roller spacing (W2) of the transport line from both ends of the mask 6 in the transport direction. That is, if the area from the leading edge of the mask 6 to the rear edge at a distance equal to W2 in the transport direction is defined as the first area, and the area from the rear edge of the mask 6 to the leading edge at a distance equal to W2 in the transport direction is defined as the second area, the first supports 33a are arranged in both the first and second areas. The second supports 33b are arranged in the third area, which is the area between the first and second areas in the transport direction. It is preferable to arrange the second supports 33b in a minimum number. If the number of support points is too large, not all support points will be evenly contacted, and the contact between the support points may change during transport. Since such changes can cause misalignment, it is ideal to have three support points with minimal change in contact point.

[0118] By configuring the second support 33b solely from a rigid block body 332b, misalignment can be suppressed if the frictional force between the second support 33b and the mask 6 exceeds the external force (such as misalignment at the edges during transport or shock during transport). For example, if the second support 33b is configured to include an elastic body, when deformation occurs in response to an external force, the reaction due to the restoring force to that deformation may lead to misalignment during transport, which is undesirable. Furthermore, when aligning the carrier with the mask, misalignment between the support that actually contacts the mask and the mask when the carrier sits on the mask can contribute to misalignment. When the support is configured solely from a rigid block body like the second support 33b, misalignment can be suppressed by the action of the frictional force against the mask. On the other hand, when the support is configured to include an elastic body, spring force due to elastic deformation accumulates within the support when the carrier sits on the mask. If the accumulated spring force is greater than the frictional force with the mask due to the balance between the spring force and the mask, the seating surface will shift, and if this occurs in each support, it may cause misalignment.

[0119] By arranging the first supports 33a at both ends in the transport direction where the change in the seating state of the mask 6 becomes relatively large, the effect of the load on the mask 6 and carrier at both ends in the transport direction can be reduced. The first supports 33a are arranged within an area approximately equal to the maximum roller spacing (W2) of the transport line from both ends of the mask 6 in the transport direction. Note that if the gap between the carrier 9 and mask 6 can be maintained even if they deform due to their own weight (cantilever-like bending deformation), the first supports 33a do not need to be provided. In other words, if the gap between the carrier 9 and mask 6 cannot be maintained due to deformation due to their own weight, the first supports 33a are arranged so that the gap can be maintained.

[0120] The first support 33a is configured to have the function of horizontally deflecting misalignment between the carrier 9 and the mask 6 due to deformation of the carrier 9 or the mask 6, or of deforming in the shear direction with a low reaction force. This function allows "β" shown in FIG. 14 to approach 0. The first support 33a is also configured to have the function of reducing the reaction force generated at the edges of the mask 6 due to deflection of the carrier 9 or the mask 6, vibration during transport, or vertical deformation caused by load changes, so that the friction force between the first support 33a and the ends of the mask 6 does not become larger than the friction force between the second support 33b and the center of the mask 6. This function reduces the reaction force, thereby suppressing the friction force with the edges of the mask 6, and allows "kr" shown in FIG. 14 to approach 0.

[0121] According to this embodiment, in a mechanism in which a carrier holding a substrate and a mask are conveyed by rollers in a state where they are superimposed on each other, it is possible to suppress misalignment between the substrate and the mask and misalignment during conveyance.

[0122] The configuration of the first support 33a is not limited to the above-described configuration. For example, the rigid block body 332a mainly serves as a spacer between the carrier face plate 33 and the elastic body 335 and is not an essential component. Therefore, depending on the size and specifications of the carrier 9, the first support 33a may be configured to include only the elastic body 335 and be directly fixed to the outer periphery of the carrier face plate 33. Alternatively, instead of a substantially rectangular parallelepiped block body, a plate-shaped member may be used to support the elastic body 335 in the unitized first support 33a.

[0123] [Example 3] The configuration of a substrate carrier 9 according to a third embodiment of the present invention will be described with reference to Fig. 17. In the third embodiment, components common to the first and second embodiments are assigned the same reference numerals and descriptions thereof will be omitted. Items in the third embodiment that are not specifically described here are the same as those in the first and second embodiments.

[0124] FIG. 17 is a schematic diagram showing the configuration of the support 33c of Example 3. FIGS. 17(a) and 17(b) are a front view and a perspective view illustrating the configuration of the unitized support 33c. FIG. 17(c) is a schematic diagram showing the reciprocating mechanism (a partial cross-sectional view taken along arrow D in FIG. 17(b)). FIG. 17(d) is a schematic diagram showing the support 33c assembled to the carrier face plate 30 of the substrate carrier 9 and placed on the mask 6 (a cross-sectional view taken along arrow C in FIG. 4(d)).

[0125] The manner in which the support 33c of Example 3 absorbs the tilt misalignment between the substrate carrier 9 and the mask 6 is the same as that described in Example 1 with reference to FIG. 10 . That is, the support 33c of Example 3 also functions as a support portion that supports the substrate carrier 9 with respect to the mask 6 when the substrate carrier 9 holding the substrate 5 is placed on the mask 6. The support 33c of Example 3 can maintain and form a stable support state even when the opposing surfaces of the carrier face plate 30 of the substrate carrier 9 and the mask 6 are misaligned in tilt (when the opposing surfaces are not locally parallel). As a result, the misalignment between the substrate carrier 9 and the mask 6 can be reduced.

[0126] 17(a) and 17(b), the support body 33c has a first block body 331, a second block body 332, and a leaf spring 330 that connects them. The first block body 331 and the second block body 332 each have a substantially rectangular parallelepiped shape and are arranged so that their longitudinal directions are parallel to each other.

[0127] The leaf spring 330 connecting the first block body 331 and the second block body 332 is made of an elastic C-shaped leaf spring that is arranged to face each other. The leaf spring is fixed to the first block body 331, and the curved, folded end is fixed to the second block body 332.

[0128] As shown in FIG. 17(c), the first block body 331 is connected to the second block body 332. The opposing surface of the first block body 331 has a conical groove 335 as a recessed receiving portion. On the other hand, the second block body 332 has a pin 336 as an abutting member provided movably in the opposing direction to the first block body 331, and a spring 337 as a biasing means (biasing member) that biases the pin 336 toward the conical groove 335. In other words, the second block body 332 has a mechanism 400 in which the pin 336 reciprocates due to the spring 337. The first block body 331 and the second block body 332 are configured to align their centers by the pin 336 pressing down on the conical groove 335.

[0129] The second block body 332 has a through-hole 332a that penetrates in the direction facing the first block body 331. The pin 336 is inserted into the second block body 332. The through-hole 332a has an inward flange-like reduced diameter portion 332b at the opening on the side facing the first block body 331. The pin 336 has a bullet-shaped pin tip portion 336a that is exposed in the gap between the first block body 331 and the second block body 332, an outward flange portion 336b provided at the rear end, and a rear-end shaft portion 336c provided on the rear end side of the flange portion 336b. The flange portion 336b abuts against the reduced diameter portion 332b of the through-hole 332a, thereby determining the maximum protrusion amount of the pin tip portion 336a from the through-hole 332a. The spring 337 is arranged in the through hole 332a so as to surround the rear end shaft portion 336c of the pin 336, with one end connected to the pin 336 and the other end connected to the second block body 332, and urges the pin 336 in the direction toward the first block body 331 (in the direction in which the pin tip portion 336a abuts against the conical groove 335).

[0130] In the support body 33c, the first block body 331 and the leaf spring 330, and the second block body 332 and the leaf spring 330 are connected by screws 334 as fastening members. In other words, the support body 33c has a unit structure in which the first block body 331, the second block body 332, and the leaf spring 330 are connected to one another and integrated.

[0131] As shown in FIG. 17(d), the support 33c is accommodated and arranged in an attachment recess 301 provided on the underside of the carrier face plate 30 (the surface facing the mask 6) and is connected and fixed to the carrier face plate 30 by a screw 333 as a fastening member. The screw 333 is configured to fasten the support 33c (second block body 332) in a recess 302 provided on the upper surface of the carrier face plate 30. When the first block body 331 of the support 33c fixed to the outer periphery of the carrier face plate 30 is placed on the mask frame, the substrate carrier 9 is placed in a state where the deposition surface of the substrate 5 it holds faces the mask 6 with a predetermined gap (the state where the substrate carrier 9 is placed on the mask 6 shown in FIG. 4(d)). The heights of the first block body 331 and the second block body 332, the strength of the leaf spring 330, etc. are set so that a predetermined height h can be secured between the opposing surfaces of the carrier face plate 30 and the mask 6.

[0132] As shown in FIG. 17(d), the support body 33c is configured so that the inclination between the first block body 331 and the second block body 332 can be changed by elastic deformation of the leaf spring 330 serving as an elastic body.

[0133] Here, the support 33e of the comparative example shown in Figures 10(c) and 10(d) differs from the support 33c of this embodiment in that it is configured to maintain a constant shape and is configured to be unable to follow the inclination between the carrier face plate 30 and the mask 6. In such a configuration, the contact area between the support 33e and the mask 6 is unstable depending on the inclination between the carrier face plate 30 and the mask 6 and the presence or absence of unevenness, and misalignment between the two is likely to occur due to changes in the frictional force between the two. In particular, when the substrate carrier 9 and the mask 6 also become larger in size in accordance with the increase in size of the substrate 5, unevenness of various patterns is likely to occur on the carrier face plate 30 and the mask 6. Therefore, differences in inclination between the carrier face plate 30 and the mask 6 are likely to occur locally. This local inclination It is considered that this difference leads to a decrease in the contact area between the support 33e and the mask 6.

[0134] In contrast, the support 33c of Example 3 behaves in the same manner as the support 33 of Example 1 shown in Figures 10(a) and 10(b). That is, as shown in a simplified manner in Figures 10(a) and 10(b), the support 33c of this example can deform by the leaf spring 330 so as to absorb the deviation in the tilt between the carrier face plate 30 and the mask 6. As a result, the lower surface (the surface in contact with the mask 6) of the first block body 331 placed on the mask 6 faces parallel to the tilt of the mask 6, and it becomes possible to always maintain a constant contact area with the mask 6 (and therefore a constant frictional force between the support 33c and the mask 6).

[0135] In addition, the position of the second block body 332 (and thus the mask face plate 30) can be more stabilized by the reciprocating mechanism 400. Since the support body 33c is divided into two parts and connected by an elastic body (plate spring 330), the second block body 332 is likely to shake when subjected to vibrations during transportation, and the positional relationship between the first block body 331 and the second block body 332 is likely to be lost. In contrast, the pin 336 included in the reciprocating mechanism 400 is constantly pressed into the conical groove 335, so that the relative positions of the centers of the opposing surfaces of the first block body 331 and the second block body 332 are kept constant (maintained). This centering mechanism stabilizes the position between the supports 33c. Therefore, the substrate carrier 9 can be stably supported relative to the mask 6, and misalignment between the substrate carrier 9 and the mask 6 can be prevented.

[0136] 1(a), like the supports 33 of Example 1, a plurality of supports 33c of this example are provided along the outer periphery surrounding the outer periphery of the substrate holding portion of the carrier face plate 30, but their arrangement is not limited to a specific arrangement and is set appropriately depending on the specifications of the substrate 5, substrate carrier 9, and mask 6. For example, they are arranged appropriately taking into consideration the sizes and materials of the substrate 5, substrate carrier 9, and mask 6, their ease of bending, etc.

[0137] The strength of the elastic force of the spring 337 as an elastic body and the range within which the pin 336 can be tilted due to elastic deformation are set appropriately. For example, multiple types of support body 33c units with different elastic deformation performances can be prepared in advance and used according to the specifications of the substrate 5, substrate carrier 9, or mask 6 to be attached, or according to differences in the setting position on the carrier face plate 30.

[0138] In this embodiment, the pin 336 is provided on the second block body 332 and configured to abut against the first block body 331, but the configuration may be reversed. That is, the pin 336 may be provided on the first block body 331 and configured to abut against a conical groove provided in the second block body 332.

[0139] [Example 4] 18 and 19, the configuration of a substrate carrier 9 according to a fourth embodiment of the present invention will be described. In the fourth embodiment, components common to the first to third embodiments will be assigned the same reference numerals and descriptions thereof will be omitted. Items in the fourth embodiment that will not be specifically described here are the same as those in the first to third embodiments.

[0140] 18 is a schematic diagram of a configuration in which a substrate 5 held flat by a substrate carrier 9 and a mask 6 are integrated together in Example 4 of the present invention. The substrate 5 is held flat by the substrate carrier 9, and is placed on the mask 6 via a support 33d in this example, an elastic structure 33d1 with spring properties and a resin member 33d2 with adhesiveness or a high friction coefficient provided at the tip of the elastic structure 33d1, with the relative positions of the substrate 5 and the mask 1 being positioned (aligned) by a mechanism not shown. The elastic repulsive force of the elastic structure 33d1 reduces the weight of the substrate carrier 9, thereby reducing the weight load on the substrate 6.

[0141] The resin member 33d2 that comes into contact with the mask 6 may be, for example, a resin member made of phenolic resin containing asbestos fibers (high-friction member). Alternatively, the adhesive member (PSC) described above may be used. Alternatively, at least the contact surface with the mask 6 may be made of a high-friction resin or adhesive member to serve as a high-friction member or adhesive member. Furthermore, for example, the material of the contact surface with the mask 6 may be coated with an aluminum alloy. Furthermore, it is also possible to improve the frictional force by providing fine irregularities on the contact surface.

[0142] FIG. 19 is a schematic cross-sectional view showing in detail the configuration of the support 33d of Example 4. The elastic structure 33d1 includes an elastically deformable leaf spring portion 33d4 that supports the resin member 33d2, and a support portion 33d3 that is fixed to the carrier face plate 30 (substrate carrier 9) and is integrally formed with the leaf spring portion 33d4 to support the leaf spring portion 33d4. The elastic structure 33d1 is attached to a recess provided on the outer periphery of the carrier face plate 30's surface for supporting the substrate 5 (the surface facing the mask 6). The elastic structure 33d1 includes a support member 33d5 disposed in a void inside the support portion 33d3 where the back surface of the leaf spring portion 33d4 is exposed. The support member 33d5 is disposed so as to abut against the leaf spring portion 33d4 to support the back side of the portion of the leaf spring portion 33d4 that supports the resin member 33d2, and is biased in this abutting direction by a coil spring 33d6 serving as a biasing member. The leaf spring 33d4 can be configured to have weak rigidity in the Z direction and strong rigidity in the X and Y directions, so that when the substrate 5 held flat by the substrate carrier 9 is placed on the mask 6, even if the leaf spring 33d4 strokes in the Z direction, the substrate 5 can be placed while maintaining rigidity in the direction of positional misalignment. Also, if the reaction force of the leaf spring 33d4 alone is not sufficient to reduce the weight of the substrate carrier 9, a coil spring 33d6 can be provided to compensate for the shortfall. That is, the coil spring 33d6 is an optional component in the above configuration.

[0143] <Electronic device manufacturing method> A method for manufacturing an electronic device using the above-described substrate processing apparatus will be described. Here, an organic EL element used in a display device such as an organic EL display device will be described as an example of the electronic device. The electronic device according to the present invention is not limited to this, and may also be a thin-film solar cell or an organic CMOS image sensor. This embodiment includes a step of forming an organic film on a substrate 5 using the above-described film formation method. Furthermore, after the organic film is formed on the substrate 5, a step of forming a metal film or a metal oxide film is also included. The structure of an organic EL display device 600 obtained by these steps will be described below.

[0144] FIG. 20(a) shows an overall view of an organic EL display device 600, and FIG. 20(b) shows the cross-sectional structure of one pixel. As shown in FIG. 20(a), a display area 61 of the organic EL display device 600 has a matrix of pixels 62, each of which includes a plurality of light-emitting elements. Each light-emitting element has a structure including an organic layer sandwiched between a pair of electrodes. Note that the term "pixel" here refers to the smallest unit capable of displaying a desired color in the display area 61. In the organic EL display device shown in this figure, each pixel 62 is configured by a combination of a first light-emitting element 62R, a second light-emitting element 62G, and a third light-emitting element 62B, which emit light different from each other. While the pixel 62 is often configured by a combination of red, green, and blue light-emitting elements, it may also be a combination of yellow, cyan, and white light-emitting elements, and is not particularly limited as long as it emits at least one color. Furthermore, each light-emitting element may be configured by stacking multiple light-emitting layers.

[0145] Alternatively, the pixel 62 may be configured with a plurality of light-emitting elements that emit the same light, and a color filter having a plurality of different color conversion elements arranged in a pattern corresponding to each light-emitting element may be used to enable one pixel to display a desired color in the display region 61. For example, the pixel 62 may be configured with at least three white light-emitting elements, and a plurality of red light-converting elements may be arranged in a pattern corresponding to each light-emitting element. Alternatively, a color filter in which color conversion elements for red, green, and blue are arranged may be used. Alternatively, pixel 62 may be configured with at least three blue light-emitting elements, and a color filter in which color conversion elements for red, green, and achromatic are arranged to correspond to the respective light-emitting elements may be used. In the latter case, by using a quantum dot color filter (QD-CF) using quantum dot (QD) material as the material for the color filter, the display color gamut can be wider than that of a typical organic EL display device that does not use a quantum dot color filter.

[0146] 20(b) is a partial cross-sectional view taken along line AB in FIG. 20(a). A pixel 62 includes an organic EL element on a substrate 5, the organic EL element including a first electrode (anode) 64, a hole transport layer 65, one of light-emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68. Among these, the hole transport layer 65, the light-emitting layers 66R, 66G, and 66B, and the electron transport layer 67 are organic layers. In this embodiment, the light-emitting layer 66R is an organic EL layer that emits red light, the light-emitting layer 66G is an organic EL layer that emits green light, and the light-emitting layer 66B is an organic EL layer that emits blue light. When using color filters or quantum dot color filters as described above, the color filters or quantum dot color filters are disposed on the light-emitting side of each light-emitting layer, i.e., at the top or bottom of FIG. 20(b), but are not shown.

[0147] The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue, respectively. The first electrodes 64 are formed separately for each light-emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light-emitting elements 62R, 62G, and 62B, or may be formed for each light-emitting element. An insulating layer 69 is provided between the first electrodes 64 to prevent short-circuiting between the first electrodes 64 and the second electrodes 68 due to foreign matter. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer P is provided to protect the organic EL elements from moisture and oxygen.

[0148] Next, an example of a method for manufacturing an organic EL display device as an electronic device will be specifically described. First, a circuit (not shown) for driving the organic EL display device and a substrate 5 on which a first electrode 64 is formed are prepared.

[0149] Next, a resin layer such as an acrylic resin or polyimide is formed by spin coating on the substrate 5 on which the first electrode 64 has been formed, and the resin layer is patterned by lithography so as to form an opening in the area where the first electrode 64 has been formed, thereby forming an insulating layer 69. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0150] Next, the substrate 5 with the patterned insulating layer 69 is carried into a first film formation apparatus, the substrate is held by a substrate holding unit, and a hole transport layer 65 is formed as a common layer on the first electrode 64 in the display area. The hole transport layer 65 is formed by vacuum evaporation. In practice, the hole transport layer 65 is formed to be larger than the display area 61, so a high-resolution mask is not required. Here, the film formation apparatus used in the film formation in this step and in the film formation of each of the following layers is the film formation apparatus described in any of the above embodiments.

[0151] Next, the substrate 5 on which the hole transport layer 65 has been formed is carried into a second film formation apparatus and held by a substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and a red light-emitting layer 66R is formed on the portion of the substrate 5 where the red light-emitting element is to be disposed. According to this example, the mask and the substrate can be properly aligned, enabling highly accurate film formation.

[0152] In the same manner as in the formation of the light-emitting layer 66R, a light-emitting layer 66G that emits green light is formed by a third film-forming device. Then, a fourth film forming apparatus is used to form a blue-emitting luminescent layer 66B. After the formation of the luminescent layers 66R, 66G, and 66B is completed, a fifth film forming apparatus is used to form an electron transport layer 67 over the entire display area 61. Each of the luminescent layers 66R, 66G, and 66B may be a single layer, or may be a layer in which multiple different layers are stacked. The electron transport layer 65 is formed as a layer common to the three luminescent layers 66R, 66G, and 66B. In this embodiment, the electron transport layer 67 and the luminescent layers 66R, 66G, and 66B are formed by vacuum deposition.

[0153] Next, a second electrode 68 is formed on the electron transport layer 67. The second electrode may be formed by vacuum deposition or sputtering. Thereafter, the substrate on which the second electrode 68 has been formed is moved to a sealing device, and a protective layer P is formed by plasma CVD (sealing step), thereby completing the organic EL display device 600. Note that, although the protective layer P is formed by the CVD method here, the method is not limited thereto and may also be formed by the ALD method or the inkjet method.

[0154] If the substrate 5 on which the insulating layer 69 has been patterned is exposed to an atmosphere containing moisture or oxygen after being carried into the film-forming apparatus until the formation of the protective layer P is completed, the light-emitting layer made of an organic EL material may be deteriorated by the moisture or oxygen. Therefore, in this example, the substrate is carried in and out of the film-forming apparatus in a vacuum atmosphere or an inert gas atmosphere. [Explanation of symbols]

[0155] 100: alignment chamber, 1: alignment device, 9: substrate carrier, 5: substrate, 6: mask, 33: support

Claims

1. a substrate holding means for holding a substrate; a support provided on an outer periphery surrounding the outer periphery of the substrate to be held, a carrier for a substrate for a deposition apparatus, the carrier being transported in a state in which the carrier is placed on a mask via the support, The support is a block body having a surface in contact with the mask; an elastic body interposed between the outer circumferential portion and the block body; and the outer periphery includes a first portion extending in a first direction along one side of the substrate; The elastic body of the support provided in the first portion is configured to be elastically deformable so as to make different at least the distance between the outer periphery and the block body on one side in the first direction from the distance between the outer periphery and the block body on the other side. A carrier characterized by:

2. a substrate holding means for holding a substrate; a support provided on an outer periphery surrounding the outer periphery of the substrate to be held, a carrier for a substrate for a deposition apparatus, the carrier being transported in a state in which the carrier is placed on a mask via the support, The support is a block body having a surface in contact with the mask; an elastic body interposed between the outer circumferential portion and the block body; and a plurality of the supports are provided on the outer periphery, the outer periphery includes a first portion extending in a first direction along a first side of the substrate, and a second portion extending in a second direction along a second side of the substrate intersecting the first side, The elastic body of the support provided in the first portion is configured to be elastically deformable so as to make different at least the distance between the outer periphery and the block body on one side in the first direction from the distance between the outer periphery and the block body on the other side. 、 The elastic body of the support provided in the second portion is configured to be elastically deformable so as to make different at least the distance between the outer periphery and the block body on one side in the second direction from the distance between the outer periphery and the block body on the other side. A carrier characterized by:

3. Transported along the first direction 3. The carrier according to claim 1 or 2.

4. The elastic body is a leaf spring. The carrier according to any one of claims 1 to 3.

5. In a cross section that includes a line parallel to one side of the substrate and is perpendicular to the contact surface, the leaf spring has: a first fixing portion extending in a direction along the line and fixed to the block body; a second fixing portion extending in a direction along the line and fixed to the outer periphery; a spring portion that extends between the first fixed portion and the second fixed portion in a folded manner and integrally connects the first fixed portion and the second fixed portion.

5. The carrier of claim 4.

6. the second fixing portion is separated in a direction along the line, The spring portion includes a first spring portion that connects one end of the first fixed portion in the direction along the line to one of the separated second fixed portions, and a second spring portion that connects the other end of the first fixed portion in the direction along the line to the other of the separated second fixed portions.

6. The carrier of claim 5.

7. The leaf spring is elongated in the direction along the line, and has a configuration in which a central portion in the direction is fixed to the block body, and both ends in the direction are curved inward and folded back relative to the central portion and fixed to the outer periphery.

7. The carrier according to claim 5 or 6.

8. the support body further includes a second block body fixed to the outer periphery when the block body is a first block body, The elastic body is provided to connect the first block body and the second block body. The carrier according to any one of claims 1 to 7.

9. The support body is configured so that the first block body, the elastic body, and the second block body are attached to and detached from the outer periphery as a single unit.

9. The carrier of claim 8.

10. a carrier face plate having a recess for mounting the unit; The height of the unit is greater than the depth of the recess; 10. The carrier of claim 9, wherein the difference between the height of the unit and the depth of the recess is greater than the thickness of the substrate.

11. a substrate holding means for holding a substrate; a first support and a second support provided on an outer periphery surrounding the outer periphery of the substrate to be held; Has, a substrate carrier for a deposition apparatus, the substrate carrier being placed on a mask via the first support and the second support and transported thereon, the first support member has an elastic body, the second support member has a block body fixed to the outer periphery and in contact with the mask, the first support body supports the elastic body and has a block body fixed to the outer periphery, The elastic body contacts the mask. A carrier characterized by:

12. the first supports are provided on the leading end side and the trailing end side of the outer periphery in the substrate transport direction, The second support is provided at the center of the outer periphery in the transport direction.

12. The carrier of claim 11.

13. a plurality of the first supports are provided along a side of the rectangular outer periphery that is perpendicular to the transport direction on the leading end side, and a plurality of the first supports are provided along a side of the rectangular outer periphery that is perpendicular to the transport direction on the trailing end side, The second support member is provided in plurality along the outer periphery of the rectangle, the outer periphery being parallel to the transport direction.

13. The carrier of claim 12.

14. the first support is provided in a first region in a transport direction of the substrate, the first region being a distance from a leading end of the outer circumferential portion to a distance equal to a gap between two adjacent transport rollers that transport the carrier, and the second region in the transport direction being a distance from a trailing end of the outer circumferential portion to a distance equal to the gap; The second support is provided in a third region between the first region and the second region. The carrier according to any one of claims 11 to 13.

15. the interval is the largest among the intervals between a plurality of conveyance rollers that convey the carrier; The second support is not provided in the first region and the second region.

15. The carrier of claim 14.

16. a substrate holding means for holding a substrate; a support provided on an outer periphery surrounding the outer periphery of the substrate to be held, a carrier for a substrate for a deposition apparatus, the carrier being transported in a state in which the carrier is placed on a mask via the support, The support is a first block body having a surface in contact with the mask; a second block body having a surface in contact with the carrier; and The first block body and the second block body are connected via an elastic body and are provided with a centering mechanism for aligning the centers of their opposing surfaces. A carrier characterized by:

17. one of the first and second block bodies has a conical groove on a surface facing the other block body; the other block body has a pin that is provided on the one block body so as to be movable in a direction facing the one block body and that abuts against the groove, and a biasing means that biases the pin toward the groove, The centering mechanism is configured by at least the conical groove, the pin, and the biasing means. Consists of 17. The carrier of claim 16.

18. a substrate holding means for holding a substrate; a support provided on an outer periphery surrounding the outer periphery of the substrate to be held, a carrier for a substrate for a deposition apparatus, the carrier being transported in a state in which the carrier is placed on a mask via the support, The support is an adhesive member or a high-friction member having a surface that comes into contact with the mask; an elastic structure interposed between the outer circumferential portion and the adhesive member or the high-friction member; and The elastic structure includes: a leaf spring portion that supports the adhesive member or the high-friction member; a support member that abuts against a rear side of a portion of the leaf spring that supports the adhesive member or the high-friction member; a biasing member that biases the support member toward the back side; have A carrier characterized by:

19. The support supports the carrier such that, when the support holds the substrate, the substrate and the mask are spaced apart at least in the vicinity of the support.

20. The carrier of claim 18.

20. The substrate holding means includes a plurality of protrusions each having an adhesive surface that contacts the surface of the substrate opposite to the mask. A carrier according to any one of claims 1 to 19.

21. The plurality of protrusions are arranged corresponding to the boundary portions for dividing the film formation area of ​​the mask.

21. The carrier of claim 20.

22. A conveying means for conveying the carrier according to any one of claims 1 to 21; a film formation chamber having a film formation means for forming a film on the film formation surface of the substrate through the mask, In the film formation chamber, the transport means transports the carrier holding the substrate while the carrier is placed on the mask, and the film formation means forms a film on the film formation surface. A film forming apparatus characterized by:

23. A film forming apparatus comprising: a transport means for transporting the carrier according to any one of claims 1 to 10; and a film forming means, The carrier is placed on the mask via the support, and while the transport means transports the mask on the carrier, the film forming means forms a film on the substrate via the mask. A film forming apparatus characterized by:

24. A film forming apparatus comprising: a transport means for transporting the carrier according to any one of claims 11 to 15; and a film forming means, In a state where the carrier is placed on the mask via the first support and the second support, the transport means transports the mask on which the carrier is placed, and the film forming means Steps are deposited on the substrate through the mask. A film forming apparatus characterized by:

25. A substrate transport device comprising transport means for transporting the carrier according to any one of claims 1 to 21, The carrier holding the substrate is transported while being placed on the mask. A substrate transport device characterized by:

26. A substrate transport device comprising transport means for transporting the carrier according to any one of claims 1 to 10, The carrier is placed on the mask via the support, and the mask on the carrier is transported by the transport means. A substrate transport device characterized by:

27. A substrate transport device comprising transport means for transporting the carrier according to any one of claims 11 to 15, the second support member has a block member fixed to the outer periphery and in contact with the mask, The carrier is placed on the mask via the first support and the second support, and the mask placed on the carrier is transported by the transport means. A substrate transport device characterized by:

28. A film is formed on the substrate being transported by the carrier according to any one of claims 1 to 21 through the mask. A film forming method characterized by:

29. A method for forming an organic film on a substrate by using the film forming method according to claim 28.

1. A method for manufacturing an electronic device comprising the steps of:

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