Image sensor drive module, optical assembly, camera module, and electronic device

Abstract

The present application discloses an image sensor driving module, an optical assembly, a camera module, and an electronic device. The image sensor driving module includes a driving unit, a fixed base, and a movable base. The fixed base holds a fixed member of the driving unit. The movable base includes a support part, a fixed part, and a connection part. The support part is configured to support the image sensor and the movable member of the driving unit. The fixed base includes a fixed platform and a fixed frame. The fixed base is provided with an opening on the opposite side of the fixed platform, and the opening is configured to attach the image sensor to the movable base. The present application can ensure that the image sensor is separated from the image sensor driving module and improve the manufacturing yield of the camera module.

Description

[Technical Field]

[0001] Book Possible embodiments of the application relate to the field of photography, in particular to image sensor drive modules, optical assemblies, camera modules, and electronic devices. [Background technology]

[0002] When an electronic device with a photographing function (e.g., a mobile phone or a tablet computer) performs photographing, the photographed picture may be blurred, ghosted, or unclear due to slight shaking. For example, a human body holding an object will naturally shake to some extent. During image capture, the human body is often in a state of motion, and these irregular and non-autonomous shaking or motion vibrations may blur the captured image and degrade the user experience. Therefore, electronic devices with a photographing function are equipped with an automatic focus (AF) function and optical image stabilization. (O It is necessary to have IS functionality.

[0003] During the design of the camera module, a drive structure is considered that drives and moves the image sensor to adjust the specific position and attitude of the image sensor in order to implement the image stabilization function of the camera module.

[0004] With electronic devices being developed to be lighter, thinner, and more functional, how to separate the image sensor from the image sensor driving structure during the design of the camera module and how to design the image sensor driving structure to improve the manufacturing yield of the camera module is a subject of ongoing exploration in the industry. Summary of the Invention [Problem to be solved by the invention]

[0005] The present application provides an image sensor drive module, an optical assembly, a camera module, and an electronic device to separate the image sensor from the image sensor drive module and improve the manufacturing yield of the camera module. [Means for solving the problem]

[0006] According to a first aspect, one embodiment of the present application provides an image sensor drive module including a drive unit, a fixed base, and a movable base. The drive unit includes a fixed member and a movable member that are movable relative to each other. The fixed base includes a fixed platform and a fixed frame. The fixed platform includes an inner surface and a first bottom surface facing inversely to each other, the fixed frame is connected to the fixed platform and protrudes from the inner surface, the fixed member is fixed to the fixed base, and an opening is formed in the side of the fixed frame away from the inner surface. The movable base is spaced apart from or in contact with the inner surface of the fixed platform. The movable base includes a support portion, a fixed portion, and a connecting portion, the connecting portion is configured to implement mechanical and electrical connection between the support portion and the fixed portion, the fixed portion is connected to the fixed base, the support portion includes a first supporting area and a second supporting area, the movable member is disposed on the second supporting area, the first supporting area is configured to support the image sensor, the size of the opening is larger than the size of the image sensor, and the opening is configured to attach the image sensor to the first supporting area.

[0007] In the present application, the image sensor drive module is designed as a modular configuration independent of the image sensor, and the size of the opening of the image sensor drive module is larger than the size of the image sensor. In this way, after the image sensor drive module is assembled as a whole, the image sensor is assembled to the support of the image sensor drive module through the opening of the image sensor drive module. In the present application, the image sensor drive module is separated from the image sensor. This helps to control the manufacturing accuracy of the image sensor drive module. During the manufacturing and assembly process of the image sensor drive module, the image sensor is not assembled to the image sensor drive module, so the manufacturing process of the image sensor drive module does not affect the performance of the image sensor, and the inspection process of the image sensor drive module may alternatively use a separate image sensor dedicated to inspection. When the image sensor drive module is used in a camera module, high-quality performance of the image sensor of the camera module can be guaranteed, the manufacturing yield of the camera module can be improved, and costs can be reduced.

[0008] In a possible embodiment, the bottom surface of the image sensor is fixedly connected to the movable base, and a gap is formed between the movable base and the side surface of the image sensor. In this solution, the gap between the movable base and the side surface of the image sensor can facilitate the assembly of the image sensor. The space reserved on the movable base for the image sensor is larger than the size of the outer contour of the image sensor, which can be seen to be easy to operate and have low precision requirements in the process of assembling the image sensor from the position of the opening to the image sensor driving module.

[0009] In one possible embodiment, the fixed frame includes a side frame and an upper plate, the upper plate and the inner surface of the fixed platform are arranged opposite each other, the side frame is connected between the upper plate and the fixed platform, the side frame, the upper plate, and the fixed platform form an enclosed space, the drive unit, the connection portion, and the second bearing area are arranged in the enclosed space, and the opening is formed by surrounding the upper plate. In this solution, the fixed frame is limited to include the upper plate, which is located opposite the fixed platform and forms the enclosed space together with the side frame and the fixed platform. The second bearing area and the connection portion of the movable base, as well as the drive unit, are all housed in the enclosed space. In this way, the fixed base protects the drive unit and the circuitry of the movable base. Alternatively, the upper plate may be configured to mount a separate drive unit for the camera module.

[0010] In one possible embodiment, the upper plate is made of a hard material and includes a first upper surface, the first upper surface being a surface of the upper plate that is remote from the fixed platform and configured to mount the lens driving module of the camera module. The hard material provides a more stable support for the upper plate, allowing the mounting position of the lens driving module to be more accurately restricted, thereby improving the driving accuracy of the lens driving module of the camera module.

[0011] In a possible embodiment, the first support area faces the opening. The fact that the opening faces the first support area may be understood as meaning that the vertical projection of the opening onto the movable base and the first support area overlap in the extension direction of the optical axis, or that the center position of the vertical projection of the opening onto the movable base coincides with the center position of the first support area, or that the edge of the vertical projection of the opening onto the movable base is disposed on the periphery of the first support area, or that the edge of the vertical projection of the opening onto the movable base coincides with the edge of the first support area. The opening of the image sensor drive module provided in this solution faces the first support area. In the process of assembling the image sensor, the image sensor is directly fixed using the suction force of a suction cup, and the suction cup is moved in the optical axis direction. The image sensor is placed on the first support area, and the image sensor is fixedly connected to the support. Therefore, the process of assembling the image sensor is easy, the positioning accuracy of the image sensor can be improved, and the imaging quality of the camera module can be guaranteed.

[0012] In a possible embodiment, the first support area includes a first central area and a second central area, the second central area being arranged around the first central area, and a projection of the second central area onto the inner surface of the fixed platform being arranged between the projection of the first central area onto the inner surface of the fixed platform and the projection of the second support area onto the inner surface of the fixed platform, the first central area being configured to mount an image sensor, and the second central area being configured to mount an optical component. The optical component may be an IR filter. In this embodiment, the image sensor or optical component may be mounted on the first support area of ​​the image sensor drive module. This helps reduce the size of the camera module in the optical axis direction. Regarding the electronic device, the electronic device can be made thinner.

[0013] In a possible embodiment, the movable base is an integrated circuit board structure. Specifically, the size of the movable base in the optical axis direction of the image sensor is the thickness of the movable base, and the thickness of the second bearing area, the thickness of the connecting portion, and the thickness of the fixed portion are all equal. The second bearing area is connected between the connecting portion and the first bearing area, and the thickness of at least a portion of the first bearing area is smaller than the thickness of the second bearing area, so that at least a portion of the first bearing area has a concave structure and forms an accommodation space used to accommodate the image sensor. The integrated circuit board structure means that the movable base is manufactured at once using a circuit board manufacturing process, rather than combining multiple circuit boards or joining a circuit board and another substrate. The movable base is an integrated circuit board structure, which can minimize the size of the movable base in the optical axis direction. Furthermore, signal interaction between the image sensor and the processor of the electronic device, powering on the image sensor, and powering on the drive unit can all be implemented by circuit board routing placed on the movable base. Transmitting electrical signals and image signals through the circuit board routing of the integrated circuit substrate structure can help ensure signal quality, reduce signal loss, and reduce external interference to the signals, thereby improving the imaging efficiency and imaging quality of the camera module.

[0014] In the present application, a groove structure may be disposed on the movable base of the integrated circuit substrate structure. For example, the first central region may have a small thickness and be a recess. Alternatively, the first support region may have a small thickness and be a recess. A solution in which the recess is configured to support the image sensor helps to reduce the size of the camera module in the optical axis direction.

[0015] In one possible embodiment, the fixed member is fixed to the upper plate, and the movable member is fixed to the second bearing area and faces the upper plate. This solution limits the specific position layout of the drive unit, which makes it easier to design a small size image sensor drive module.

[0016] In a possible embodiment, the second bearing area and the connecting portion are stacked, and the connecting portion is arranged between the second bearing area and the fixed platform in the optical axis direction. In this embodiment, the bearing is designed as a two-plate structure (in other words, the second bearing area and the connecting portion are formed on two circuit boards, respectively), and using the configuration in which the second bearing area and the connecting portion are stacked, a small size design of the movable base in the direction perpendicular to the optical axis can be implemented. When this solution is applied to an electronic device, the board area occupied by the circuit board on which the camera module is arranged can be reduced.

[0017] In a possible embodiment, the first support area includes a first mounting area and a second mounting area, the first mounting area is configured to support the image sensor, the connection portion surrounds the first mounting area and is connected to an edge of the first mounting area, the second mounting area and the second support area are connected to each other, the second mounting area and a portion of the first mounting area overlap to form an overlap area, and all locations of mechanical and electrical connections between the first mounting area and the second mounting area are in the overlap area.

[0018] In a possible embodiment, the first mounting area and the connection portion are an integrated circuit board structure. This solution defines a specific design solution for the movable base. By designing the positional relationship between the first mounting area and the second mounting area of ​​the first support area, the structure of the movable base can be made compact, saving the internal space of the image sensor drive module. This helps to design a small size for the movable base in a direction perpendicular to the optical axis. When this solution is applied to an electronic device, the board area occupied by the circuit board on which the camera module is arranged can be reduced.

[0019] In one possible embodiment, the fixed member is fixed to the fixed platform, and the movable member is fixed to the second bearing area and faces the fixed platform. This solution provides a specific arrangement of the drive unit, in which the fixed member is held by the movable plane. This helps to save space and allows for a reduction in the size of the image sensor drive module in the axial direction.

[0020] In a possible embodiment, the second bearing area and the connection part are stacked, and the second bearing area is arranged between the fixed platform and the connection part in the optical axis direction. In this embodiment, the support part is designed as a two-plate structure (in other words, the second bearing area and the connection part are formed on two circuit boards, respectively), and using the configuration in which the second bearing area and the connection part are stacked, a small size design of the movable base in the direction perpendicular to the optical axis can be implemented. When this solution is applied to an electronic device, the board area occupied by the circuit board on which the camera module is arranged can be reduced.

[0021] In one possible embodiment, the support portion includes a first plate and a second plate, the first plate connected to the connector, the inner edge of the first plate forming the storage space, the second support area disposed on the first plate, the second plate including a first portion and a second portion, the first portion and the first plate stacked, the second portion disposed at the bottom of the storage space, the second portion configured to support the image sensor, the image sensor electrically connected to the first plate, and the image sensor signal transmitted using the first plate, the connector, and the fixed portion. In this solution, the second plate is connected to the image sensor, the first plate holds the movable member, and the image sensor is housed in the storage space. This helps to implement the size in the optical axis direction, thereby easily implementing a small size configuration for the image sensor drive module in the optical axis direction. Furthermore, all electrical connection routing of the movable base used to transmit current and image signals is placed on the first plate, and the image sensor is electrically connected to the first plate. This helps to ensure accuracy and stability of signal transmission.

[0022] In a possible implementation, the support contacts the fixed platform, and the image sensor drive module further includes a holding structure, a portion of which is connected to the support and a portion of which is disposed on the fixed base. The holding structure is configured to provide a holding force to the support, and the holding force is used to maintain contact between the support and the fixed platform. In this specific embodiment of the present application, the holding structure is arranged to ensure contact between the support and the fixed platform. This ensures that there is no displacement in the optical axis direction of the image sensor during the movement process, and can improve the stability of the image sensor during the movement process. The movement trajectory of the image sensor can be limited to a stable plane. This can avoid axial vibration or tilt generated by the image sensor during the movement process (specifically, reduce crosstalk between displacement in the optical axis direction and the rotational direction of the image sensor), and can ensure the quality and stability of the image data obtained by the image sensor. In a design solution in which the movable base of the image sensor is suspended relative to the bottom plate of the module, a position detection sensor in the optical axis direction needs to be arranged on the movable base. In this solution, the image sensor does not displace in the optical axis direction, so a sensor for detecting the position in the optical axis direction does not need to be configured in the present application. This can help to reduce the cost of the image sensor driving module, simplify the structure of the components disposed on the movable base, and implement a small size of the movable base.

[0023] According to a second aspect, an embodiment of the present application provides an optical assembly including a lens driving module and an image sensor driving module according to any possible implementation of the first aspect. The lens driving module is fixedly connected to a fixed base. The image sensor driving module is configured to drive the image sensor to move in a plane perpendicular to the optical axis, and the lens driving module is configured to drive the lens module to move axially or tilt. The optical assembly provided in this solution can drive the image sensor to move and can also drive the lens assembly to perform focusing, and is highly integrated. This facilitates the design of a compact camera module.

[0024] In a possible embodiment, the lens driving module includes a housing and a driving component mounted within the housing, the driving component configured to perform focusing of the camera module, and the outer surface of the housing is fixedly connected to the fixed base. The lens driving module and the image sensor driving module of the optical assembly provided in this solution are two modular structures independent of each other. The lens driving module and the image sensor driving module each have an independent driving device, which separates the lens driving module from the image sensor driving module. The image sensor driving module can be adapted to different types of lens driving modules to form different driving solutions.

[0025] According to a third aspect, an embodiment of the present application provides a camera module including an image sensor, a lens assembly, and an optical assembly according to any possible implementation of the second aspect. The lens assembly is connected to a lens driving module, the image sensor is fixed to the image sensor driving module, and the lens assembly is disposed on a light incident side of the image sensor. The camera module provided by this solution has the advantages of being easy to assemble and low cost.

[0026] According to a fourth aspect, an embodiment of the present application provides a camera module including an image sensor, a lens assembly, and an image sensor drive module according to any possible implementation of the first aspect. The image sensor is fixed to the image sensor drive module, and the lens assembly is disposed on a light incident side of the image sensor. The camera module provided by this solution has the advantages of easy assembly and low cost.

[0027] According to a fifth aspect, an embodiment of the present application provides an electronic device including a processor and a camera module according to the third or fourth aspect, wherein the processor is electrically connected to the camera module, and the processor is configured to process an image signal output by the image sensor.

[0028] According to a sixth aspect, an embodiment of the present application provides a camera module including an image sensor, a lens assembly, a lens driving module, and an image sensor driving module. The lens assembly is disposed on a light incident side of the image sensor. The lens driving module includes a housing and a driving component mounted within the housing, the driving component configured to drive and move the lens assembly. The image sensor driving module includes a fixed base, a movable base, and a driving unit. The driving unit includes a fixed member and a movable member that are movable relative to each other. The fixed base includes a fixed platform and side frames, the side frames are connected to the fixed platform, the fixed member is fixed to the fixed base, and the movable base includes a bearing portion, a fixed portion, and a connecting portion, the connecting portion being configured to implement a mechanical and electrical connection between the bearing portion and the fixed portion, the fixed portion being connected to the fixed base, and the bearing portion being configured to support the image sensor and the movable member. The lens driving module is disposed on a side of the side frames away from the fixed platform, and an outer surface of the housing is fixedly connected to the fixed base. The lens driving module and the image sensor driving module of the optical assembly provided in this solution are two independent modular structures. The lens driving module and the image sensor driving module each have an independent driving device, which separates the lens driving module from the image sensor driving module. The image sensor driving module can be adapted to different types of lens driving modules to form different driving solutions. [Brief explanation of the drawings]

[0029] [Figure 1] 1 is a three-dimensional view of an electronic device according to a possible embodiment of the present application; [Figure 2] 2 is a three-dimensional view of another orientation of the electronic device shown in FIG. 1. [Figure 3A] 1 is a three-dimensional view of a camera module according to a possible embodiment of the present application; [Figure 3B] 1 is a three-dimensional cross-sectional view of a camera module according to an embodiment of the present application; [Figure 4] 1 is a three-dimensional exploded view of a camera module according to a possible embodiment of the present application; [Figure 5] 1 is a three-dimensional exploded view of a camera module according to a possible embodiment of the present application; [Figure 6] 1 is a three-dimensional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 7] 1 is a three-dimensional exploded view of an image sensor drive module according to a possible embodiment of the present application; [Figure 8] 1 is a three-dimensional exploded view of an image sensor drive module according to a possible embodiment of the present application; [Figure 9] 1 is a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 10A] 10 is a partial enlarged view of the cross-sectional view of the image sensor drive module shown in FIG. 9. [Figure 10B] 1 is a partial enlarged view of a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 11A] 1 is a schematic diagram of a friction interface between a bearing of an image sensor drive module and a fixed platform according to a possible embodiment of the present application; [Figure 11B] 1 is a schematic diagram of a friction interface between a bearing of an image sensor drive module and a fixed platform according to a possible embodiment of the present application; [Figure 11C] 1 is a schematic diagram of a friction interface between a bearing of an image sensor drive module and a fixed platform according to a possible embodiment of the present application; [Figure 12] 1 is a schematic diagram of a friction interface between a bearing of an image sensor drive module and a fixed platform according to a possible embodiment of the present application; [Figure 13] 1 is a schematic diagram of a friction interface between a bearing of an image sensor drive module and a fixed platform according to a possible embodiment of the present application; [Figure 14] 10 is a schematic diagram of a specific form of a contact surface between a support part of an image sensor drive module and a fixed plane according to a possible embodiment of the present application; [Figure 15] 10 is a schematic diagram of a specific form of a contact surface between a support part of an image sensor drive module and a fixed plane according to a possible embodiment of the present application; [Figure 16] 10 is a schematic diagram of a specific form of a contact surface between a support part of an image sensor drive module and a fixed plane according to a possible embodiment of the present application; [Figure 17] 10 is a schematic diagram of a specific form of a contact surface between a support part of an image sensor drive module and a fixed plane according to a possible embodiment of the present application; [Figure 18] 10 is a schematic diagram of a specific form of a contact surface between a support part of an image sensor drive module and a fixed plane according to a possible embodiment of the present application; [Figure 19] 10 is a schematic diagram of a specific form of a contact surface between a support part of an image sensor drive module and a fixed plane according to a possible embodiment of the present application; [Figure 20] 1 is a schematic diagram of a specific configuration of a holding structure of an image sensor drive module according to a possible embodiment of the present application; [Figure 21] 1 is a schematic diagram of a specific configuration of a holding structure of an image sensor drive module according to a possible embodiment of the present application; [Figure 22] 1 is a schematic diagram of a specific configuration of a holding structure of an image sensor drive module according to a possible embodiment of the present application; [Figure 23A] 1 is a schematic diagram of a specific configuration of a holding structure of an image sensor drive module according to a possible embodiment of the present application; [Figure 23B] 1 is a schematic diagram of a specific configuration of a holding structure of an image sensor drive module according to a possible embodiment of the present application; [Figure 24] 1 is a schematic diagram of a specific configuration of a holding structure of an image sensor drive module according to a possible embodiment of the present application; [Figure 25A] 1 is a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 25B] Similar to the embodiment shown in Figure 25A, Figure 25B shows the detailed structure of the first bearing region. [Figure 26A]1 is a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 26B] 1 is a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 27A] 1 is a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 27B] 1 is a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 28A] 1 is a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 28B] 1 is a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 29A] 1 is a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 29B] 1 is a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 30A] 1 is a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 30B] 1 is a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 31A] 1 is a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; [Figure 31B] 1 is a cross-sectional view of an image sensor drive module according to a possible embodiment of the present application; DETAILED DESCRIPTION OF THE INVENTION

[0030] Possible embodiments of the present application will now be described with reference to the accompanying drawings in which:

[0031] 1 is a schematic diagram of the structure of an electronic device 1000 in some possible embodiments according to possible embodiments of the present application. The electronic device may be an electronic product such as a mobile phone, a tablet computer, a laptop computer, a television, an in-car device, a wearable device, or a video surveillance device. The wearable device may be a smart band, a smart watch, a wireless headset, an augmented reality (A R) Glasses, Augmented Reality Technology Helmet, Virtual Reality (V R) technology glasses, or a virtual reality technology helmet, etc. Possible implementations of the present application are described using an example in which the electronic device is a mobile phone.

[0032] Please refer to Figures 1 and 2. Figure 2 is a schematic diagram of the structure of the electronic device 1000 shown in Figure 1 from another angle. The electronic device 1000 includes a housing 100, a display 200, a front camera assembly 300, a rear camera assembly 400, a main board 500, a processor 600, a memory 700, and a battery 800. The display 200 is configured to display images, and the display 200 may further be integrated with a touch function. The display 200 is attached to the housing 100. The housing 100 may include a bezel 1001 and a back cover 1002. The display 200 and the back cover 1002 are attached to two opposite sides of the bezel 1001, respectively. In this possible embodiment, in the external space of the electronic device 1000, the space facing the display 200 is defined as the front of the electronic device 1000, and the space facing the back cover 1002 is defined as the rear of the electronic device 1000.

[0033] In some possible implementations, the front camera assembly 300 is disposed within the housing 100 and disposed below the display 200. The display 200 is provided with a front camera hole 2001 through which the front camera assembly 300 collects light from the front of the electronic device 1000 to take pictures. The front camera assembly 300 may include a camera module described in the following possible implementations, or may include a camera module with a different structure.

[0034] In some possible implementations, at least one rear camera hole 1003 is disposed in the rear cover 1002. The rear camera assembly 400 is disposed within the housing 100. The rear camera assembly 400 collects light from the rear of the electronic device 1000 through the at least one rear camera hole 1003 to capture images. In possible implementations of the present application, "at least one" includes both "one" and "multiple," "multiple" means more than two, and "more than two" includes two. The rear camera assembly 400 includes at least one camera module 4001, which may include, for example, one or more of a standard camera module, a long-focus camera module, a wide-angle camera module, an ultra-long-focus camera module, or an ultra-wide-angle camera module. For example, the rear camera assembly 400 includes a standard camera, a wide-angle camera, and a periscope long-focus camera. The camera module 4001 of the rear camera assembly 400 may include a camera module described in the following possible implementations or may include a camera module of another structure.

[0035] In some possible implementations, the rear camera assembly 400 may further include a flash module 4002. The rear cover 1002 is provided with a flash hole 1004. The flash module 4002 is disposed within the housing 100 and emits light through the flash hole 1004.

[0036] In some possible implementations, the main board 500 is disposed within the housing 100, and the processor 600 and memory 700 are fixed to the main board 500. The display 200, the front camera assembly 300, and the rear camera assembly 400 are coupled to the processor 600. The memory 700 is configured to store computer program code. The computer program code includes computer instructions. The processor 600 is configured to invoke the computer instructions to enable the electronic device 1000 to perform corresponding operations, for example, to enable the display 200 to display a target image or to enable the front camera assembly 300 or the rear camera assembly 400 to capture a target image. The battery 800 is electrically connected to the main board 500 and configured to supply power to the electronic device 1000. In some possible implementations, the electronic device 1000 may further include one or more functional modules, such as an antenna module, a mobile communication module, a sensor module, a motor, a microphone module, and a speaker module. These functional modules may be electrically connected to the processor 600 to transmit signals.

[0037] A possible embodiment of the present application provides a camera module. The camera module may be the front camera assembly 300 or the rear camera assembly 400 in the embodiments shown in Figures 1 and 2. The camera module is electrically connected to a processor 600 of the electronic device. Specifically, the processor 600 is electrically connected to an image sensor of the camera module and may drive the image sensor or process an image signal output by the image sensor.

[0038] FIG. 3A is a three-dimensional assembly view of a camera module 10 according to an embodiment of the present application. FIG. 3B is a three-dimensional cross-sectional view of a camera module 10 according to an embodiment of the present application. FIG. 4 and FIG. 5 are three-dimensional exploded views in two directions of the camera module 10 provided in FIG. 3A. Please refer to FIGS. 3A, 3B, 4, and 5. In an embodiment, the camera module 10 includes an image sensor driving module 2, a lens driving module 3, an image sensor 4, and a lens assembly 5. The lens driving module 3 and the image sensor driving module 2 form an optical assembly 80, and the image sensor driving module 2 is configured to drive and move the image sensor 4. The lens driving module 3 is configured to perform optical focusing, optical image stabilization, aberration adjustment, etc. of the camera module 10.

[0039] In the embodiment, the image sensor 4 moves on a reference plane. The reference plane may be coplanar with or parallel to the photosensitive surface of the image sensor 4, and may be a plane perpendicular to the extension direction of the optical axis P. The optical axis P may be understood as the optical axis of the image sensor 4, the optical axis of the lens assembly 5, or the optical axis of the camera module 10. In the camera module, the optical axis of the lens assembly 5 and the optical axis of the image sensor 4 may theoretically overlap. In the case of assembly errors or design tolerances, the optical axis of the lens assembly 5 and the optical axis of the image sensor 4 may be offset or tilted with respect to each other. However, regardless of the overlap, offset, or tilt, the optical axis of the lens assembly 5 and the optical axis of the image sensor 4 extend in the same direction (coincident extension directions may be understood as substantially the same direction, and relative tilt within a small range is allowed), and both of them may be considered as the optical axis of the camera module 10.

[0040] In the embodiment, the lens driving module 3 includes a housing 31 and a driving component 32. The housing 31 is enclosed to form an accommodation space and is configured to be fixedly connected to another functional module (e.g., the image sensor driving module 2). The driving component 32 is accommodated in the accommodation space of the housing 31 and is configured to drive and move the lens assembly 5 of the camera module 10. Specifically, the driving component 32 of the driving module 3 is configured to drive and move or tilt the lens assembly 5 in an axial direction (specifically, in the extension direction of the optical axis P) to perform optical image stabilization, optical focusing, aberration adjustment, and the like. Specifically, the lens driving module 3 can drive and move the lens assembly 5 in an axial direction to perform optical focusing of the camera module 10. The lens driving module 3 can also be configured to compensate for other optical parameters of the camera module 10, such as aberrations, which can be compensated for by the lens driving module 3 driving and moving at least a portion of the lens of the lens assembly 5. 3B , in an embodiment, the drive components 32 include a magnetic drive member 321 and a coil drive member 322. The coil drive member 322 is connected to the lens assembly 5, and the magnetic drive member 321 is connected to the housing 31. When the coil drive member 322 is powered on, the coil drive member 322 and the magnetic drive member 321 are coupled to generate an electromagnetic drive force that drives and moves the lens assembly 5. In a specific embodiment of the present application, the drive components 32 of the lens drive module 3 are shielded by the housing 31, and the drive components 32 of the lens drive module 3 do not participate in driving the image sensor drive module 2.

[0041] In this solution, the lens driving module 3 and the image sensor driving module 2 of the optical assembly 80 are two independent modular structures, and the image sensor driving module 2 can be adapted to different types of lens driving modules 3 to form different driving solutions. The lens driving module and the image sensor driving module each have independent driving devices, which allows the lens driving module to be separated from the image sensor driving module. The image sensor driving module 2 provided in the present application can form multiple different optical image stabilization solutions and has wide adaptability. In the assembly process of the embodiment, the image sensor 4 may be first fixed to the image sensor driving module 2, and then the lens driving module 3 is fixed to the top surface of the image sensor driving module 2. Specifically, the lens driving module 3 and the image sensor driving module 2 can be fixedly connected using an adhesive (adhesive layer 801). In the assembly process of another embodiment, the lens driving module 3 and the image sensor driving module 2 can be fixedly connected as a whole to form the optical assembly 80, and then the image sensor 4 is attached to the optical assembly 80. In other words, the optical assembly 80 may be a modular structure independent of the image sensor 4 and the lens assembly 5, and the assembly precision of the modular structure is easily controlled and the manufacturing cost is low. In the process of assembling the optical assembly 80 to the image sensor 4 and the lens assembly 5, the assembly process can be simplified. In addition, the positioning precision of the assembled optical components is high, which helps ensure the optical stability of the camera module.

[0042] The camera module 10 includes a circuit board 9 configured to electrically connect to a processor on a main board of an electronic device. The circuit board 9 may be a flexible circuit board. The circuit board 9 may be part of the image sensor drive module 2. The circuit board 9 is configured to transmit signals collected by the image sensor 4 to the processor. A drive circuit may further be disposed on the circuit board 9, and the drive circuit is configured to drive the image sensor drive module 2 to move the image sensor 4.

[0043] See Figures 4 and 5. In a specific embodiment, the image sensor drive module 2 includes a first top surface S1 and a first bottom surface S2 arranged in opposite directions. The first bottom surface S2 is planar and configured to connect to a main board or intermediate frame support of an electronic device. The first top surface S1 has a frame-like configuration. The image sensor drive module 2 includes a first support region R1, which is disposed inside an opening S11 formed by surrounding the first top surface S1. The image sensor 4 is mounted in the first support region R1 through the opening S11. An optical component 6, such as an IR filter, may also be mounted in the first support region R1. The lens drive module 3 has an overall frame-like configuration. The region surrounded by the lens drive module 3 is disposed on the light incident side of the first support region R1 of the image sensor drive module 2, specifically, directly facing the first support region R1 in the optical axis direction. The opening S11 is connected to an area surrounded by the first support area R1 and the lens driving module 3, and the area surrounded by the lens driving module 3 is configured to mount the lens assembly 5. In an embodiment, a portion of the lens assembly 5 may be disposed inside the opening S11. In an embodiment, a portion of the lens assembly 5 may alternatively be placed in the first support area R1. The lens driving module 3 includes a second bottom surface S3 and a second top surface S4 arranged inversely. The second bottom surface S3 is the outer surface of the bottom plate of the housing 31, and the second top surface S4 is the outer surface of the top plate of the housing 31. The second bottom surface S3 may be adhered and fixed to the first top surface S1 using an adhesive layer 801, or the second bottom surface S3 may alternatively be fixed to the first top surface S1 by another connection method, such as screw fixing or welding.

[0044] In another embodiment provided in the present application, the lens driving module does not need to be disposed in the camera module 10. The position of the image sensor 4 is adjusted using only the image sensor driving module 2 to perform functions such as image stabilization or aberration compensation of the camera module 10. A compact camera module 10 with a simple structure is provided for use in a specific electronic device. This helps to save space in the electronic device and reduce the board footprint of the electronic device.

[0045] 3B , the image sensor drive module 2 provided in the embodiment of the present application includes a fixed base 21, a drive unit 22, and a movable base 23. The drive unit 22 includes a fixed member 221 and a movable member 222 that can move relative to each other. For example, the fixed member 221 is a magnet, and the movable member 222 is a coil. When the power supply of the movable member 222 is turned on, the movable member 222 interacts with the fixed member 221 to generate a driving force. The fixed base 21 is configured to support the fixed member 221, and the movable base 23 is configured to support the movable member 222 and the image sensor 4. The fixed base 21 includes a fixed platform 211 and a fixed frame 212. The fixed platform 211 includes an inner surface S0 and a first bottom surface S2 facing inversely to each other. The fixed frame 212 is connected to the fixed platform 211 and protrudes from the inner surface S0. The fixed member 221 is fixed to the fixed base 211. The opening S11 is formed on the side of the fixed frame 212 away from the inner surface S0. A gap may be provided between the movable base 23 and the inner surface S0 of the fixed platform 211. In other words, the movable base 23 and the inner surface S0 of the fixed platform 211 are spaced apart. Alternatively, the movable base 23 and the inner surface S0 of the fixed platform 211 may contact each other. The movable base 23 includes a support portion 231, a fixed portion 232, and a connecting portion 233. The connecting portion 233 is configured to establish mechanical and electrical connections between the support portion 231 and the fixed portion 232. The fixed portion 232 is connected to the fixed base 21 and is fixedly connected relative to the fixed base 21. The bearing portion 231 includes a second bearing region R2 and a first bearing region R1. The second bearing region R2 is arranged around the first bearing region R1, the second bearing region R2 is configured to support the movable member 222, the first bearing region R1 is configured to support the image sensor 4, and the opening S11 is configured to attach the image sensor 4 to the first bearing region R1.

[0046] In the present application, the image sensor driving module 2 is designed as a modular configuration independent from the image sensor 4. After the image sensor driving module 2 is assembled as a whole, the image sensor 4 is attached to the image sensor driving module 2 through the opening S11 of the image sensor driving module 2. In the present application, the image sensor driving module 2 is separated from the image sensor 4. This helps to control the manufacturing accuracy of the image sensor driving module 2. Because the image sensor 4 is not attached to the image sensor driving module 2 during the manufacturing and assembly process of the image sensor driving module 2, the manufacturing process of the image sensor driving module 2 does not affect the performance of the image sensor 4, and the inspection process of the image sensor driving module 2 may alternatively use a separate image sensor dedicated to inspection. When the image sensor driving module 2 is used in a camera module, high-quality performance of the image sensor 4 of the camera module can be guaranteed, the manufacturing yield of the camera module can be improved, and costs can be reduced.

[0047] Conventional camera modules include a first drive component configured to drive and move an image sensor and a second drive component configured to focus the camera module. However, the first drive component and the second drive component typically share a common substructure of the camera module. For example, the first drive component includes a magnet and a first coil, and the interaction between the magnet and the first coil generates a drive force for driving and moving the image sensor. The second drive component includes a magnet and a second coil, and the interaction between the magnet and the second coil drives the lens assembly to move for focusing. The first drive component and the second drive component share a magnet, and the same magnet is used with the first coil and the second coil. This is difficult to design and manufacture.

[0048] The first drive component in the prior art includes a housing and a movable circuit board. The first coil, the electronic device, and the image sensor are disposed on the movable circuit board. In the manufacturing process of the movable circuit board, the first coil, the electronic device, and the image sensor are directly assembled to the board, and then the movable circuit board is attached to the housing. In the manufacturing process of the first drive component, the image sensor must be attached to the circuit board. In the resulting camera module, the image sensor is coupled to the first drive component and the second drive component. In this camera module, if any component is not certified or is damaged, all components must be replaced. This does not contribute to environmental protection.

[0049] In this application, an independent image sensor driving module is designed, and an opening S11 is designed for assembling the image sensor. In this way, not only can the image sensor driving module be separated from the image sensor, but the image sensor driving module can also be separated from the lens driving module. In the separated state, it is not so difficult to develop and design the image sensor driving module, and the difficulty of the manufacturing process of the image sensor driving module is also reduced. In this application, the camera module is divided into multiple modules using a modular design concept. Even if there is a problem with some components, only the module in which the problematic component is located needs to be repaired or replaced, and the entire camera module does not need to be replaced. Therefore, this application has the advantage of environmental protection. Due to the component yield, the cost loss of the entire module is also small.

[0050] The detailed structure of a specific image sensor drive module provided in the present application is described as follows. FIG. 6 is a three-dimensional assembly view of the image sensor drive module 2 according to an embodiment of the present application. FIGS. 7 and 8 are three-dimensional exploded views of the image sensor drive module 2 in two directions according to FIG. 6. FIG. 9 is a cross-sectional view of the image sensor drive module 2 according to FIG. 6. As shown in FIG. 9, in this embodiment, the fixed base 21 corresponds to the housing of the image sensor drive module 2. The fixed frame 212 of the fixed base 21 includes a side frame 2122 and an upper plate 2121, and the upper plate 2121 and the inner surface S0 of the fixed platform 211 are arranged opposite each other. The side frame 2122 is connected between the upper plate 2121 and the fixed platform 211 and forms an enclosed space 2120 together with the upper plate 2121 and the fixed platform 211. The drive unit 22, the connection portion 233, and the second bearing region R2 are arranged in the enclosed space 2120. The opening S11 is formed by surrounding the upper plate 2121. Specifically, the upper plate is located opposite the fixed platform 211 and forms an enclosed space 2120 together with the side frame 2122 and the fixed platform 211. The second support region R2 and connection portion 233 of the movable base 23, as well as the drive unit 22, are all housed in the enclosed space 2120. In this way, the fixed base 21 protects the drive unit 22 and the circuitry of the movable base 23. Alternatively, the upper plate 2121 may be configured to mount another drive unit of a camera module. In a possible embodiment, the upper plate 2121 is made of a hard material and includes a first upper surface S1, which is the surface of the upper plate 2121 away from the fixed platform 211 and is configured to mount a lens drive module of a camera module. The upper plate 2121 made of a hard material has a more stable supporting force, and the mounting position of the lens driving module can be more accurately restricted, which improves the driving precision of the lens driving module of the camera module.

[0051] 6 is inside the fixed base 21 and cannot be seen because the drive unit is blocked by the fixed base 21. The fixed base 21 may be used as a mounting carrier and may also protect the drive unit 22 and the movable base 23. The fixed base 21 may also be used as a structure for connecting the image sensor drive module 2 to another device. For example, the image sensor drive module 2 may be attached to a circuit board of an electronic device by fixedly connecting the fixed base 21 to the circuit board.

[0052] See Figures 7, 8, and 9. In an embodiment, the fixed platform 211 has a flat structure and is configured to contact a portion of the movable base 23. The inner surface of the fixed platform 211 may have a flat structure, the inner surface of the fixed platform 211 may be perpendicular to the optical axis direction of the image sensor 4, the inner surface of the fixed platform 211 may be parallel to the photosensitive surface of the image sensor 4, and the outer surface of the fixed platform 211 is the first bottom surface S2 of the image sensor drive module 2 (as shown in Figure 5). In an embodiment, the fixed platform 211 is made of a metal material or has a magnetic conductive material. The fixed platform 211 can be attracted by the magnetic attractive force of the magnetic component. The fixed platform 211 is configured to contact a partial structure of the movable base 23 that drives and moves the image sensor 4, and the movable base 23 drives and moves the image sensor 4 on the fixed platform 211. During the movement process, the contact surfaces of the fixed platform 211 and the movable base 23 maintain contact. The fixed platform 211 has a heat-conductive material and can be used as a heat-dissipating structure to dissipate heat generated by the image sensor and other electronic components of the movable base 23.

[0053] Specifically, the fixed platform 211 includes a central region 2111, a connection region 2112, and an edge region 2113. The central region 2111, the connection region 2112, and the edge region 2113 are on the same plane. The connection region 2112 is disposed around the central region 2111 and is connected between the edge region 2113 and the central region 2111. As shown in FIG. 7, the fixed platform 211 may have a one-piece flat structure. The dotted box schematically represents the separation between the central region 2111, the connection region 2112, and the edge region 2113. Specifically, the separation between the three parts needs to be defined based on the functions of the three parts. A detailed description is given below, and the central region 2111 is configured to contact a partial region of the movable base 23. In this embodiment, the partial structure of the movable base 23 that holds the image sensor 4 is frame-shaped (or ring-shaped), a partial area of ​​the central region 2111 is in contact with the movable base 23, the partial area of ​​the central region 2111 and the image sensor 4 are arranged opposite each other, and there is a gap between the central region 2111 and the image sensor 4. The edge region 2113 is configured to be connected to the fixed frame 212.

[0054] In the embodiment, the fixed frame 212 includes an upper plate 2121 and a side frame 2122. The upper plate 2121 is a rectangular frame structure, and an opening S11 formed by surrounding the upper plate 2121 is configured to mount or accommodate an optical component (e.g., an optical lens) or is used as a light passing hole. The size of the outer contour of the opening S11 formed by surrounding the upper plate 2121 is larger than the outer contour of the image sensor. This is useful for mounting the image sensor to the movable base 23 via the position of the opening S11.

[0055] The side frames 2122 are connected to the outer edge of the upper plate 2121, and the side frames 2122 and the upper plate 2121 are surrounded together to form an enclosed space 2120. In this embodiment, the fixed member 221 of the drive unit 22 is fixed to the inside of the upper plate 2121 and disposed within the enclosed space 2120. In this embodiment, the fixed member 221 is a magnetic drive member, and includes four stripe-shaped magnets, which are arranged in pairs facing each other. The upper plate 2121 includes four frames, and each frame is equipped with one stripe-shaped magnet.

[0056] In an embodiment, the magnetic conductive structure 2123 is disposed on the fixed frame 212. In the embodiment shown in FIG. 7, the magnetic conductive structure 2123 is disposed on the inner surface of the upper plate 2121. In another embodiment, the magnetic conductive structure 2123 may alternatively be disposed on the outer surface of the upper plate 2121 or alternatively be embedded in an intermediate layer of the upper plate 2121. The fixed member 221 is attached to the inner side of the magnetic conductive structure 2123, and the magnetic conductive structure 2123 is configured to perform magnetic shielding of the image sensor driving module 2. The magnetic conductive structure 2123 is made of a material having magnetic shielding performance. The shape of the magnetic conductive structure 2123 may be the same as that of the upper plate 2121. Alternatively, the magnetic conductive structure 2123 may be disposed on both the upper plate 2121 and the side frame 2122. In other words, the magnetic conductive structure 2123 forms an enclosed space 2120 and provides all-around shielding of the magnetic environment inside the image sensor driving module 2. In an embodiment, the magnetic conductive structure 2123 may be a plate-like structure, such as a metal plate, which may be fixed to the inner surface of the upper plate 2121. In another embodiment, the magnetic conductive structure 2123 may be a layer structure coated on the surface of the upper plate, such as a magnetic conductive coating formed on the surface of the upper plate 2121 by spraying or electroplating. Alternatively, the magnetic conductive structure 2123 may be a mesh structure and may have an electromagnetic shielding function or a grounding function. In the present application, the magnetic conductive structure 2123 is disposed on the fixed frame 212, thereby implementing magnetic shielding for the image sensor driving module 2. When the driving unit 22 of the image sensor driving module 2 is magnetically driven, the magnetic conductive structure 2123 can ensure the stability of the driving signal of the driving unit 22, thereby improving the motion stability of the image sensor 4. In addition, the magnetic conductive structure 2123 is grounded to protect the electronic components of the image sensor driving module 2, for example, to prevent static electricity from damaging the electronic components.

[0057] In an embodiment, the fixed frame 212 may be a one-piece structure. The top plate 2121, the side frame 2122, and the magnetic conductive structure 2123 are made into a one-piece structure using a two-material injection molding process.

[0058] As shown in FIG. 8 , positioning structures 2125 are disposed protruding from the inner surface of the upper plate 2121 of the fixed frame 212. The positioning structures 2125 protrude from the inner surface of the upper plate 2121 into the enclosed space 2120. The positioning structures 2125 are cylindrical, and the upper plate 2121 has a rectangular structure. There are four positioning structures 2125, which are distributed at the four corners of the upper plate 2121. The positioning structures 2125 are configured to cooperate with corresponding hole structures of the movable base 23 to implement assembly and positioning of the fixed base 21 and the movable base 23. Accurate alignment of the movable member 222 and the fixed member 221 of the drive unit 22 can be implemented during the assembly process through the cooperation of the positioning structures 2125 and the hole structures of the movable base 23.

[0059] As a power source of the image sensor driving module, the driving unit 22 is configured to generate a driving force, which can drive the movable base 23 to move relative to the fixed base 21. In an embodiment, the driving unit 22 is a motor with a magnetic structure, such as a VCM (Voice Coil Motor). r) 7, the fixed member 221 is a magnetic drive member and the movable member 222 is a coil drive member. In another particular solution, the fixed member 221 is a coil drive member and the movable member 222 is a magnetic drive member. In another embodiment, the drive unit 22 may alternatively be another type of drive device, for example an SMA (shape memory array). y) Motor or PIEZO (Piezo Moto r)In this embodiment of the present application, the movable member 222 and the fixed member 221 of the drive unit 22 may be two independent components (e.g., a coil and a magnet of a magnetic motor). In a power-on state, a driving force is generated to drive and move the image sensor. Alternatively, the movable member 222 and the fixed member 221 of the drive unit 22 in this embodiment of the present application may be an integral structure, for example, a shape memory alloy motor, and may be driven by changing the size of the material through electric heating.

[0060] In this embodiment, no electrical connections or electronic components are located on the fixed base 21. Instead, all circuit routing, electronic components, and components that need to be powered on in the camera module 10 are located on the movable base 23. The movable base 23 corresponds to the main board (or circuit board structure) of the camera module 10 and is configured to support all components that need to be powered on or transmit signals. This solution facilitates the design of a compact camera module 10, optimizes signal transmission paths, and improves signal stability. In particular, when the movable base 23 is an integrated circuit board structure, it is only necessary for the routing for transmitting signals or currents to be placed on the integrated circuit board; signals or currents do not need to be transmitted between different circuit boards or FPCs. This signal and current transmission process can ensure signal stability and reduce signal loss. It also facilitates signal isolation to prevent signal interference from affecting the quality of the image signal.

[0061] See Figures 7, 8, and 9. In this embodiment, the movable base 23 includes a support portion 231, a fixed portion 232, and a connecting portion 233. The connecting portion 233 is configured to establish a mechanical and electrical connection between the support portion 231 and the fixed portion 232. The mechanical connection is a structural connection relationship and may include a direct connection or an indirect connection. A direct connection may also be an integral configuration. For example, two parts of an integrated circuit board structure may be understood as a direct connection. An indirect connection is a connection using another connection structure, such as connecting two board structures using solder balls. The electrical connection is a signal routing connection. Image signals, electrical signals, or other signals may be transmitted using the electrical connection relationship. For example, the electrical connection is performed using circuit board routing or an FPC. The fixed portion 232 is connected to the fixed base 21. Specifically, the fixed portion 232 may be connected between the fixed platform 211 and the fixed frame 212. In another embodiment, the stationary portion 232 may alternatively be connected to the stationary frame 212 , with the stationary portion 232 and the stationary platform 211 being separated by at least a portion of the stationary frame 212 .

[0062] The movable base 23 is provided with hole structures 235. The hole structures 235 are distributed at the corners of the movable base 23 and are configured to cooperate with the positioning structures 2125 of the fixed base 21 to implement positioning during the assembly process of the movable base 23 and the fixed base 21. This ensures the positioning accuracy of the fixed member 221 and the movable member 222 of the drive unit 22. The hole structures 235 are distributed between the support part 231 and the connection part 233 and arranged outside the four corners of the support part 231.

[0063] The movable member 222 of the drive unit 22 is disposed on the support 231. The support 231 is further configured to assemble the image sensor 4. Specifically, after the image sensor drive module 2 is assembled, the image sensor 4 is placed on the support 231 through the opening S11 using an assembly device, such as a surface mounter. In the assembly process, the image sensor 4 is fixed to and electrically connected to the support 231. The image sensor 4 may be fixed to the support 231 using an adhesive, and then the traces of the image sensor 4 and the support 231 are electrically connected using gold wires. In another embodiment, the image sensor 4 may alternatively be directly connected to the solder pads of the support 231 using solder balls, and the traces of the image sensor 4 and the support 231 are implemented using the solder balls and solder pads.

[0064] Specifically, see Figures 7, 8, 9, and 10A. The fixed portion 232 of the movable base 23 is assembled between the edge region 2113 of the fixed platform 211 and the side frame 2122 of the fixed frame 212. The outer edge of the fixed portion 232 is connected to the circuit board 9. The circuit board 9 and the fixed portion 232 may be integral with each other, or the circuit board 9 may be connected to the fixed portion 232 via a plug-in. Specifically, a male connector may be disposed on the fixed portion 232, and a female connector may be disposed on the circuit board 9. Electrical signal transmission is achieved by cooperation between the male and female connectors. The circuit board 9 is configured to be electrically connected to a processor of an electronic device for transmitting signals from the image sensor 4 to the processor. The support portion 231 and the fixed platform 211 are stacked, and a central region of the support portion 231 is surrounded to form an accommodation space 2310, which is used to accommodate the image sensor 4. 10A , the bottom surface of the image sensor 4 is fixedly connected to the movable base 23 (particularly, connected to the stiffening plate structure 23B), and there is a gap (or space) between the side surface of the image sensor 4 and the movable base 23; in other words, the side surface of the image sensor 4 is not connected to any other structure. In another embodiment, the space between the side surface of the image sensor 4 and the movable base 23 may be filled with a medium, such as foam. In another implementation, the accommodating space 2310 may alternatively be used to accommodate another optical component 6 (e.g., an optical filter or lens) or as a light passage (in other words, no optical component is placed therein, but the accommodating space 2310 is disposed on the light incident side of the image sensor 4). As shown in FIG. 7 , the electronic device 7 is disposed on the surface of the support 231 away from the fixed platform 211, and the electronic device 7 is distributed on both sides of the accommodating space 2310 on the support 231. In order to ensure the structural symmetry of the movable base 23, the electronic devices 7 may be symmetrically distributed on both sides of the accommodating space 2310, which helps to ensure a stable movement process of the movable base 23.In the embodiment, the electronic device 7 and the movable member 222 of the drive unit 22 are attached to the same surface of the support 231, specifically, to the surface of the support 231 facing the upper plate 2121 of the fixed frame 212. In this way, the electronic device 7 and the movable member 222 on the support 231 are all housed within the enclosed space 2120 of the fixed frame 212 (as shown in Figures 8 and 10A).

[0065] As shown in FIG. 9 , the movable member 222 is fixed to the second bearing region R2 side of the support portion 231, facing away from the fixed platform 211, and faces the upper plate 2121. Specifically, in this embodiment, the movable member 222 of the drive unit 22 is a coil driving member. The movable member 222 includes four coils arranged in pairs opposite each other, and all of the coils are arranged in one-to-one correspondence with the four magnets fixed to the upper plate 2121, and the coils are arranged on the support portion 231. Circuit routing is arranged on the support portion 231, which facilitates routing of the coil power supply traces. For the embodiment, see FIGS. 7 , 8 , 9 , and 10A . The support structure 8 is arranged on the support portion 231, and the movable member 222 surrounds the support structure 8. Specifically, a support structure 8 is disposed on each coil, and the support structure 8 is a rigid structure that protrudes from the surface of the bearing portion 231. It can be understood that the coil is disposed around the support structure 8, and the support structure 8 can protect the coil from being scratched by another structure.

[0066] In this application, the drive unit 22 drives the bearing 231 to move, while the position of the fixed portion 232 remains unchanged. Thus, during the movement of the bearing 231, the connection portion 233 elastically deforms and is connected between the fixed portion 232 and the bearing 231. From a mechanical perspective, the connection portion 233 corresponds to a spring or spring plate structure, and circuit board routing for transmitting signals and currents is also arranged on the connection portion 233. Electrical connection between the bearing 231 and the fixed portion 232 is implemented by the circuit board routing. In other words, signals from the image sensor 4 can be transmitted outside the image sensor drive module 2. The connection portion 233 is a thin, stripe-shaped spring arm structure connected between the fixed portion 232 and the bearing 231. Specifically, multiple stripe-shaped spring arms, or in other words, the connection portion 233, are formed by removing material from the movable base 23. The connection portion 233 is elastically deformable due to the shape of the material. The connecting portion 233 can be elastically deformed when the driving force of the drive unit 22 drives the bearing portion 231 to move relative to the fixed portion 232, while maintaining the mechanical and electrical connection between the fixed portion 232 and the bearing portion 231. In the embodiment of the present application, the drive unit 22 can drive the image sensor 4 to move in the X-axis and Y-axis directions. Both the X-axis and Y-axis directions are perpendicular to the optical axis direction of the image sensor 4, and the optical axis direction is considered to be the Z-axis. The X-axis, Y-axis, and optical axis directions can form a three-axis Cartesian coordinate system. Specifically, the drive unit 22 drives the image sensor 4 to move in the X-axis and Y-axis directions, which are perpendicular to each other, on a plane perpendicular to the optical axis. During the movement process of the bearing portion 231, the connecting portion 233 elastically deforms to ensure that the bearing portion 231 can move relative to the fixed portion 232.

[0067] In an embodiment, the movable base 23 may be an elastic circuit board structure, in which the support portion 231 and the fixed portion 232 are not elastic, and the connecting portion 233 is elastic. FIG. 10A is a partially enlarged schematic view of FIG. 9. The connecting portion 233 includes a conductor layer 2333 and a metal layer 2334. The conductor layer 2333 is configured to set the circuit board routing and implement an electrical connection between the support portion 231 and the fixed portion 232. The metal layer 2334 may be a metal bending structure. The metal layer 2334 is configured to cause elastic deformation of the connecting portion 233. The presence of the metal layer 2334 ensures the flexibility and strength of the connecting portion 233, thereby improving the elastic deformation ability of the connecting portion 233. The conductor layer 2333 and the metal layer 2334 may be separated using an insulating layer (the insulating layer is omitted in FIG. 10A), which may specifically be a polyamide insulating material.

[0068] See Figures 7, 8, 9, and 10A. The movable base 23 includes an integrated circuit substrate structure 23A and a reinforcing plate structure 23B. The integrated circuit substrate structure 23A includes a fixing portion 232, a connecting portion 233, and a portion of the support portion (referred to as a first plate 231A). The integrated circuit substrate structure 23A is an integrally formed structure using a circuit board manufacturing process, and a conductor layer 2333 and a metal layer 2334 are disposed within this structure. The metal layer 2334 is configured to ensure the strength and elastic deformation capability of the connecting portion 233. The reinforcing plate structure 23B is a portion of the support portion (referred to as a second plate), and the reinforcing plate structure 23B is connected to the bottom surface of the portion of the support portion (referred to as a first plate 231A) of the integrated circuit substrate structure 23A.

[0069] The stiffening plate structure 23B is configured to contact the fixed platform 211, form a friction interface X, and conduct and dissipate heat. Generally, in this embodiment, the bearing part 231 includes a first plate 231A and a second plate (stiffening plate structure 23B), an outer edge of the first plate 231A and a connecting part 233 are connected to each other to form an integral structure, the accommodating space 2310 is formed by surrounding an inner edge of the first plate 231A, the first plate 231A is configured to support the movable member 222, and the second plate (stiffening plate structure 23B) is configured to support the first 9, the image sensor 4 is electrically connected to the first plate 231A via a signal line 41 (e.g., a gold wire). An adhesive structure 61 is arranged at the location of the signal line 41, and the adhesive structure 61 is configured to fix an optical component 6, for example an IR optical filter. On the one hand, the adhesive structure 61 can be fixedly connected to the optical component 6, and on the other hand, the adhesive structure 61 can also fix the signal line 41 to ensure a stable and reliable electrical connection between the image sensor 4 and the conductor layer 2333 of the support part 231. In this solution, the signal of the image sensor is transmitted using the first plate, the connection part, and the fixing part.

[0070] In the optical axis direction, a portion of the second plate (reinforcement plate structure 23B) facing the opening S11 and a portion of the first plate 231A facing the opening S11 together form a first bearing region R1 of the bearing portion 231 (the portion marked with R1 between the two dashed lines in FIG. 9 represents the first bearing region R1 of the bearing portion 231). A portion of the first plate 231A facing the upper plate 2121 is a second bearing region R2 of the bearing portion 231 (the portion marked with R2 between the two dashed lines in FIG. 9 represents the second bearing region R2 of the bearing portion 231). The opening S11 of the image sensor drive module 2 provided in this solution faces the first bearing region R1. In the process of assembling the image sensor 4, the image sensor 4 is directly fixed using the suction force of a suction cup, and the suction cup is moved in the optical axis direction. The image sensor 4 is placed in the first bearing area R1, and the image sensor 4 is fixedly connected to the bearing portion 231. Therefore, the process of assembling the image sensor 4 is easy, the positioning accuracy of the image sensor 4 can be improved, and the imaging quality of the camera module can be guaranteed.

[0071] The opening S11 being directly opposite the first support region R1 may be understood as the vertical projection of the opening S11 onto the movable base 23 and the first support region R1 overlapping in the extension direction of the optical axis, or as the central position of the vertical projection of the opening S11 onto the movable base 23 coinciding with the central position of the first support region R1, or as the edge of the vertical projection of the opening S11 onto the movable base 23 being arranged on the periphery of the first support region R1, or the edge of the vertical projection of the opening S11 onto the movable base 23 coinciding with the edge of the first support region R1.

[0072] In another embodiment, the opening S11 and the first bearing region R1 may alternatively be staggered. It can be understood that a partial region of the first bearing region R1 faces the opening S11, and a part of the first bearing region R1 does not face the opening S11. In this embodiment, in the process of assembling the image sensor, the image sensor may be fixed using a suction cup, in which the image sensor is placed in an area corresponding to the opening S11 in the optical axis direction, and the suction cup is moved in a direction perpendicular to the optical axis direction to transfer the image sensor to the first bearing region.

[0073] 10B is a partially enlarged cross-sectional view of an image sensor drive module according to a possible embodiment of the present application. Please refer to FIG. 10B. There is a gap G between the movable base 23 and the inner surface S0 of the fixed platform 211. It can be seen that the movable base 23 and the inner surface S0 of the fixed platform 211 are spaced apart by a floating gap.

[0074] 9 and 10A. The bearing 231 contacts the fixed platform 211 of the fixed base 21, and a friction interface X is formed at the contact position between the bearing 231 and the fixed platform 211 of the fixed base 21. The friction coefficient of the friction interface X is less than 0.3. The friction interface X may be the contact surface between the bearing 231 and the fixed base 21 (in other words, the friction interface is formed by one surface). Alternatively, the friction interface X may be a medium between the bearing 231 and the fixed base 21, such as a lubricant (in other words, the friction interface is formed by grease or paste). Alternatively, the friction interface X may be a layer structure between the bearing 231 and the fixed base 21. For example, a super-slip material layer is disposed between the bearing 231 and the fixed base 21 to form the friction interface X (in other words, the friction interface is formed by a three-dimensional layer structure). Generally, the bearing 231 and the fixed platform 211 are in a sliding friction relationship, and a low friction coefficient can be obtained at the friction interface X by surface treatment or by disposing a solid structure layer or a grease or paste-like lubricating layer. In the present application, the friction coefficient of the sliding friction between the bearing 231 and the fixed platform 211 is limited, thereby limiting the plane on which the image sensor 4 moves and ensuring smooth movement of the image sensor 4. This reduces the friction resistance in the movement process of the image sensor 4 and improves the efficiency of driving and moving the image sensor 4.

[0075] In this embodiment, the bearing 231 and / or the fixed platform 211 of the fixed base 21 includes a super-slip material layer at the location of the friction interface X. The super-slip material layer has a solid structure, and the friction coefficient of the friction interface X is less than 0.3. For the first case, see FIG. 11A. The super-slip material layer M1 is disposed only on the surface of the bearing 231, and the super-slip material layer M1 on the surface of the bearing 231 contacts the surface of the fixed platform 211 of the fixed base 21. The friction interface X is formed, and the friction coefficient of the friction interface X is less than 0.3. In this solution, the super-slip material layer does not need to be disposed on the fixed base 21. This helps to save super-slip material and reduce costs. For the second case, see FIG. 11B. The super-slip material layer M2 is disposed only on the surface of the fixed platform 211 of the fixed base 21. The area of ​​the superslippery material layer M2 disposed on the fixed platform 211 of the fixed base 21 must be larger than the area of ​​the portion of the support 231 that contacts the fixed platform 211. Because the support 231 needs to slide on the superslippery material layer M2, the area covered by the movement process of the support must be considered when determining the superslippery material layer M2 disposed in this solution. The fixed platform 211 of the fixed base 21 has a simple flat structure, and no circuitry is disposed on the fixed platform 211 of the fixed base 21. Therefore, disposing the superslippery material layer M2 on the fixed platform 211 has the advantage of easy manufacturing. For the third case, see FIG. 11C. The superslippery material layers are disposed on the surfaces of the support 231 and the fixed platform 211 of the fixed base 21. Specifically, the superslippery material layer M1 is disposed on the surface of the support 231, and the superslippery material layer M2 is disposed on the surface of the fixed platform 211. The super-slip material layer M1 contacts the super-slip material layer M2, and the area of ​​the super-slip material layer M2 is larger than the area of ​​the super-slip material layer M1. This solution combines the first and second cases. A friction interface X is formed between the super-slip material layer M1 and the super-slip material layer M2, and the friction coefficient of the friction interface X provided by this solution can be smaller.The combination of a solid super-slip material layer with the support 231 and the fixed platform 211 is easier to implement, for example, can be directly connected and fixed using an adhesive layer, and has the advantage of a simple and easy assembly process.

[0076] 11A, 11B, and 11C, the superslip material layer M1 and the superslip material layer M2 may be a coating or coating structure disposed on the surface of the bearing 231 and the fixed platform 211, and may be formed using a physical spraying or electroplating process. Alternatively, the superslip material layer M1 and the superslip material layer M2 may be separate sheet-like structures. For example, the superslip material layer M1 and the superslip material layer M2 are micro-nanostructures (nanomaterials) and are connected to the surface of the bearing 231 and the fixed platform 211 using manufacturing processes such as adhesive bonding and physical press-fitting.

[0077] For an embodiment, see FIG. 12 . At the position of the friction interface X, a lubricating layer M3 is disposed between the bearing portion 231 and the fixed platform 211 of the fixed base 21. The lubricating layer M3 has an oily, grease-like, or paste-like structure. The friction coefficient of the friction interface X is less than 0.3, which is achieved using the lubricating layer M3. In this solution, the lubricating layer M3 having an oily, grease-like, or paste-like structure is disposed between the bearing portion 231 and the fixed platform 211 of the fixed base 21 to achieve a friction interface X with a low friction coefficient. Because the shape of the lubricating layer M3 is not fixed, the lubricating layer M3 is applied to the contact surface between the bearing portion 231 and the fixed platform 211 of the fixed base 21, and the lubricating layer M3 can have a small size. This facilitates miniaturization of the camera module in the optical axis direction. It can be understood that the design of the lubricating layer M3 further helps to ensure the flatness of the contact surface, and the flatness can be compensated using the lubricating layer M3 to avoid vibration or tilt in the optical axis direction during the movement process of the image sensor 4.

[0078] For an embodiment, see FIG. 13 . No super-slip material layer or lubricant is disposed between the bearing 231 and the fixed platform 211 of the fixed base 21. In this embodiment, the friction coefficient of the friction interface X is less than 0.3 by performing a surface treatment manufacturing process on the surfaces in contact with the bearing 231 and the fixed platform 211 of the fixed base 21. The surface treatment method may be a surface modification technique such as polishing, a surface alloying technique such as carburizing and nitriding, or a surface conversion film technique (a chemical reaction between an additive material and a substrate to form a conversion film). The surface treatment method can form the friction interface X without adding a super-slip material layer or lubricant layer, and can achieve a small size in the optical axis direction.

[0079] In another embodiment, a solid superslip material layer and a grease or pasty lubricant may be used in combination in the same embodiment. Alternatively, a solid superslip material layer and a surface obtained using a surface treatment manufacturing process are used in the same embodiment. Alternatively, a grease or pasty lubricant and a surface obtained using a surface treatment manufacturing process are used in the same embodiment.

[0080] In this application, the friction coefficient of the friction interface X between the bearing 231 and the fixed base 21 is set to achieve a low-friction sliding connection between the bearing 231 and the fixed base 21. During the process of driving the bearing 231 of the movable base 23 to move, the image sensor 4 can be flexibly driven by the friction interface X, which has a low friction coefficient, such as a super-slip material or a lubricating layer. This ensures the stability of the axial position of the image sensor 4 during the movement process and prevents phenomena such as axial displacement, vibration, or tilt. The contact between the bearing 231 and the fixed base 21 further facilitates heat conduction. The circuit, coil drive member, and image sensor of the bearing 231 all generate heat during the operation process. In this embodiment of the application, heat conduction can be achieved through the contact between the bearing 231 and the fixed base 21. The friction interface X includes a thermally conductive material. The bearing 231 may be made of a thermally conductive material, and the fixed platform 211 of the fixed base 21 may also be made of a thermally conductive material. The thermal conductivity coefficient of the friction interface X is greater than 0.5 W / m*K. In this solution, limiting the thermal conductivity coefficient of the friction interface helps to ensure the performance of the image sensor and improve the quality of the image signal.

[0081] In a camera module, if the movable base of the image sensor is floating relative to the module's base plate, the space between the movable base and the base plate not only increases the size of the camera module in the optical axis direction, but also easily causes tilting of the movable base and vibration along the optical axis, resulting in a deterioration of imaging quality. Furthermore, the high air thermal resistance makes it difficult for the image sensor and driving circuit to dissipate heat, causing the image sensor's junction temperature to become excessively high (e.g., exceeding 70 degrees or even reaching 90 degrees), resulting in excessive imaging noise from the image sensor and affecting imaging quality. In the embodiment of the present application, the movement stability of the image sensor 4 can be ensured by the contact between the support 231 and the fixed platform 211. The movement trajectory of the image sensor 4 is limited to a fixed (stable) plane (e.g., a plane perpendicular to the optical axis). This can avoid axial vibration or tilting caused by the image sensor 4 during the movement process and ensure the quality and stability of the image data obtained by the image sensor 4. In addition, in the present application, the thermal resistance can be further reduced, and the heat of the support portion can be better conducted to one side of the outer surface of the fixed base using the contact relationship between the support portion and the fixed portion, thereby improving the heat conduction capability of the image sensor drive module 2. The heat dissipation efficiency of the image sensor 4 and the drive unit 22 can be optimized, and a decrease in imaging quality caused by an excessively high temperature of the camera module 10 during a video or long-term shooting process can be avoided. In a specific embodiment provided in the present application, the operating junction temperature of the image sensor 4 can be controlled to less than 70 degrees. For example, the operating junction temperature of the image sensor can be less than 50 degrees.

[0082] FIG. 14 shows a specific structure of the contact surface between the bearing 231 and the fixed platform 211. In this embodiment, the contact between the bearing 231 and the fixed platform 211 of the fixed base 21 is a flat-surface contact. This solution facilitates heat conduction. The large contact area between the bearing 231 and the fixed base 21 exhibits high heat conduction efficiency. This solution can improve heat dissipation capacity through complete flat-surface contact. The plane of the bearing 231 used to contact the fixed base 21 is a first plane S5, and the plane of the fixed platform 211 of the fixed base 21 used to contact the bearing 231 is a second plane S6, and both the first plane S5 and the second plane S6 are continuous flat structures.

[0083] 15 shows a specific structure of the contact surface between the support portion 231 and the fixed platform 211. The contact between the support portion 231 and the fixed platform 211 of the fixed base 21 is a contact between a flat surface and an array of bumps. At the position where the support portion 231 contacts the fixed platform 211, one of the structures of the support portion 231 and the fixed platform 211 is a completely flat structure, while the other structure of the support portion 231 and the fixed platform 211 is an array of bumps. As shown in FIG. 15, the support portion 231 includes an array of bumps S51. The structure where the fixed platform 211 contacts the support portion 231 is a second flat surface S6, and the array of bumps S51 is disposed over the entire area of ​​the second flat surface S6. This solution can solve the problem of misalignment in the optical axis direction caused by the flatness of the contact between the flat surfaces by the contact between the array of bumps S51 and the second flat surface S6. Positioning the array bump structure S51 facilitates control of the flatness of the plane, including the position where the bump contacts the plane. This makes it more stable during relative movement, and the friction coefficient can be stabilized. In the embodiment shown in FIG. 15, the array bump structure S51 may alternatively be positioned on the fixed platform 211. Correspondingly, the second plane S6 is positioned on the support 231.

[0084] 16 shows a specific structure of the contact surface between the support portion 231 and the fixed platform 211. The contact between the support portion 231 and the fixed platform 211 of the fixed base 21 is a contact between a flat surface and a plurality of arranged bumps. At the position where the support portion 231 contacts the fixed platform 211, one of the structures of the support portion 231 and the fixed platform 211 is a completely flat structure, while the other structure of the support portion 231 and the fixed platform 211 is a multi-bump structure. As shown in FIG. 16, the multi-bump structure S52 is disposed on the support portion 231, the structure where the fixed platform 211 contacts the support portion 231 is a second flat surface S6, and the multi-bump structure S52 is disposed corresponding to a partial region of the second flat surface S6. In this embodiment, the second flat surface S6 is rectangular, and the multi-bump structure S52 is disposed at positions corresponding to the four corners of the second flat surface S6. In another embodiment, the multi-bump structure S52 may alternatively be disposed at another position corresponding to the second plane S6, for example, at the midpoint of the side corresponding to the second plane S6. Alternatively, the multi-bump structure S52 may be appropriately distributed on each side. In the embodiment shown in FIG. 16, the multi-bump structure S52 may alternatively be disposed on the fixed platform 211. Correspondingly, the second plane S6 is disposed on the support portion 231. In this solution, the cooperation of the bump structures S52 distributed at local positions and the plane helps to adjust the flatness of the position of the friction interface. The position of the contact surface between the fixed platform 211 and the support portion 231 does not require high manufacturing precision for flatness to satisfy the motion stability of the image sensor 4.

[0085] Please refer to Figures 17, 18, and 19. The three figures show three different structural forms of the contact surface between the support 231 and the fixed platform 211. In the embodiment, the contact between the support 231 and the fixed platform 211 of the fixed base 21 is a contact between a flat surface and a protruding rod structure, or a contact between the protruding rod structures. Compared with a bump structure, the contact area can be increased by arranging the rod structure. This helps reduce pressure and avoids friction damage to the contact surface during relative movement, which affects the positioning accuracy in the optical axis direction. Compared with a fully flat contact structure, the rod structure can solve the problem of movement in the optical axis direction caused by flatness.

[0086] As shown in Fig. 17, at the contact position between the bearing 231 and the fixed platform 211 of the fixed base 21, the structure of the bearing 231 is a protruding rod structure S53, and the structure of the fixed platform 211 is a completely planar structure S6. The protruding rod structure S53 slides on the planar structure S6 to form a friction interface. In this embodiment, the protruding rod structures S53 are distributed in a ring shape. As shown in Fig. 18, the structure of the bearing 231 is also a protruding rod structure S53. The difference from the embodiment shown in Fig. 17 is that the protruding rod structures S53 in the embodiment shown in Fig. 18 are distributed in a mesh shape.

[0087] 19, at the contact position between the bearing 231 and the fixed platform 211 of the fixed base 21, the structure of the fixed platform 211 is a protruding rod structure S54. In this solution, the structure of the bearing 231 may be a planar structure S7. Alternatively, the structure of the bearing 231 may be a rod-like structure. In another embodiment, a protruding rod structure may alternatively be arranged on the bearing 231, and the fixed platform 211 may be arranged as a planar structure.

[0088] 14 to 19 are schematic illustrations of several different structural forms of friction interfaces and are not intended to limit the structural forms of friction interfaces in the present application, in which different structural forms of friction interfaces may be designed based on specific design requirements.

[0089] See Fig. 10A. In the present application, the bearing 231 is in sliding contact with the fixed platform 211 to provide a motion platform for the bearing 231, and the bearing 231 does not separate from the fixed platform 211 during the motion process. Therefore, the bearing 231 needs to have a holding force to maintain contact between the bearing 231 and the fixed platform 211. Specifically, a holding structure is arranged on the image sensor drive module 2. A part of the holding structure is connected to the bearing 231, and a part of the holding structure is arranged on the fixed base 21. The holding structure provides a holding force to the bearing 231 to maintain contact between the bearing 231 and the fixed platform 211 of the fixed base 21. Arranging the holding structure may be implemented in several different embodiments. Details are as follows.

[0090] In an embodiment, as shown in FIG. 10A , the holding structure 26 includes a connecting portion 233 and a fixed portion 232. The connecting portion 233 is connected to the bearing portion 231, and the fixed portion 232 is disposed on the fixed base 21. Specifically, the fixed portion 232 is fixedly connected to the fixed base 21. A partial structure of the fixed base 21 configured to be fixedly connected to the fixed portion 232 may be used as part of the holding structure. In this solution, the connecting portion 233 of the movable base 23 is used as part of the holding structure. The connecting portion 233 is an elastic structure, and the elastic force of the connecting portion 233 acts on the bearing portion 231 to form a holding force. In this embodiment, the elastic force of the connecting portion 233 is used as a holding force to ensure contact between the bearing portion 231 and the fixed base 21. If necessary, a separate holding structure other than the fixed base and the movable base is added. The connecting portion 233 can not only ensure that the bearing portion 231 moves under the driving force of the drive unit 22, but also provide a holding force. The dual function design of the connection portion 233 facilitates miniaturization of the size of the image sensor driving module 2 .

[0091] See FIG. 10A . The connection point between the connection portion 233 and the fixing portion 232 is a first position 2331, and the connection point between the connection portion 233 and the support portion 231 is a second position 2332. Elastic potential energy exists between the first position 2331 and the second position 2332, and this elastic potential energy forms a holding force. This solution specifies a method for forming the elastic force of the connection portion 233. Forming the elastic potential energy between the first position 2331 and the second position 2332 utilizes the required assembly position of the connection portion 233. This helps to ensure the size of the image sensor drive module 2 is miniaturized.

[0092] Specifically, in a direction perpendicular to the fixed platform 211, i.e., in the optical axis direction, a distance D1 between the first position 2331 in the optical axis direction and the fixed platform 211 is smaller than a distance D2 between the second position 2332 in the optical axis direction and the fixed platform 211. It can be understood that the first position 2331 and the second position 2332 form a stepped configuration during the assembly process, and the assembled connecting portion 233 has a force that pulls the support portion 231 in a direction toward the fixed platform 211. In other words, the elastic tension of the connecting portion 233 acts on the second position 2332 to form a holding force toward the fixed platform 211. In this solution, the distance relationship between the first position 2331 and the second position 2332 and the fixed platform 211 is determined during the process of assembling the movable base 23. When it is ensured that D1 is smaller than D2, this can provide a pulling force of the second position 2332 toward the fixed platform 211, or in other words, a holding force can be formed. In this solution, the formation of the holding force is implemented during the assembly process. Regarding the connection part 233 of the movable base 23, the structure of the connection part 233 does not need to be specially designed in the manufacturing process of the connection part 233 to take into account the formation of the holding force. This can reduce manufacturing costs.

[0093] In another embodiment, the connecting portion 233 is used as a retaining structure, and the fixed portion 232 and the support portion 231 may be designed to be non-coplanar during the manufacturing process of the movable base 23. Specifically, when the connecting portion 233 is in a free state (without a restraining force), a first position 2331 at the connection point between the connecting portion 233 and the fixed portion 232 and a second position 2332 at the connection point between the connecting portion 233 and the support portion 231 correspond to different positions on the optical axis. Before assembly, there is a height difference between the first position 2331 and the second position 2332 in the optical axis direction. During the assembly process, the first position 2331 and the second position 2332 may be assembled to be coplanar. Alternatively, during the assembly process, the specific physical position of the first position 2331 or the second position 2332 may be adjusted to store energy, specifically, to store elastic potential energy in the connecting portion 233. Also, the force of the elastic potential energy acting on the bearing 231 becomes a holding force towards the fixed platform 211. This solution helps to implement a miniaturization of the size of the assembled image sensor drive module.

[0094] For an embodiment, see FIGS. 20 and 21 . The holding structure 26 includes a magnetic member 24 and a fixed platform 211. The magnetic member 24 is fixed to a support 231, and the magnetic attraction between the magnetic member 24 and the fixed platform 211 forms at least part of the holding force. In this solution, the magnetic member is disposed on the support 231, and the fixed platform 211 is designed to cooperate with the magnetic member to form the magnetic attraction. Using the magnetic attraction as the holding force can ensure the life and stability of the holding force. When the elastic force of the connection part 233 is used as the holding force, the elastic coefficient of the elastic force may change during long-term use, and the elastic performance of the connection part 233 may deteriorate. In this case, the holding force between the support 231 and the fixed platform 211 may be affected. If the holding force is insufficient to keep the support 231 in contact with the fixed platform 211 through the friction interface, the movement stability of the image sensor 4 may be affected, and the thermal conductivity of the image sensor drive module 2 may also be affected. In this solution, a magnetic member 24 is arranged and magnetic attraction force is used as a holding force, which can ensure the continuous stability of the holding force and can extend the life of the image sensor driving module 2.

[0095] In an embodiment, the holding force may include a resilient force provided by the connecting portion 233 and may further include a magnetic force provided by the magnetic member 24 .

[0096] In a specific embodiment, as shown in FIG. 20 , the magnetic member 24 includes four magnets 241, 242, 243, and 244. The four magnets 241, 242, 243, and 244 are arranged in a dotted distribution on the bearing 231 and adjacent to the outer edge of the bearing 231. The outer edge of the bearing 231 is located at the edge of the bearing 231 near the fixed portion 232. In this embodiment, the four magnets 241, 242, 243, and 244 are distributed at the four corners of the bearing 231. In another embodiment, the magnetic member 24 may include two or three magnets, or the number of magnets may be five or more, with the multiple magnets evenly distributed and spaced apart at the edge of the bearing 231. Specifically, when there are three magnets, the three magnets may define a plane. This can ensure surface contact between the bearing and the fixed base. When there are four magnets, the magnets may be symmetrically distributed at the four outer corners of the image sensor, which helps ensure the motion stability of the image sensor.

[0097] In a specific embodiment, as shown in FIG. 21 , the magnetic member 24 includes four magnetic stripes 245, 246, 247, and 248. The four magnetic stripes 245, 246, 247, and 248 are all long stripes, symmetrically distributed in pairs on the support 231, and adjacent to the outer edge of the support 231. The outer edge of the support 231 is the edge of the support 231 near the fixed portion 232. In this embodiment, the magnetic stripes 245, 246, 247, and 248 are disposed inside a coil, which is the movable member 222 of the drive unit. In another embodiment, the magnetic stripes 245, 246, 247, and 248 may alternatively be disposed around the periphery of the movable member 222. In another embodiment, the number of magnetic stripes may be two, three, or more. Arranging the magnetic stripe in a long stripe not only provides a large magnetic attraction force but also makes assembly and fixing easy.

[0098] In this embodiment of the present application, the magnetic attraction force between the magnetic member 24 disposed on the bearing 231 and the fixed base 21 must ensure that the bearing 231 can maintain contact with the fixed base 21 during the movement process, and the magnetic attraction force must be controlled within a predetermined range; in other words, the magnetic attraction force must not be excessively large. If the magnetic attraction force is excessively large, the drive unit 22 may be unable to drive the bearing 231 to move, or the efficiency of moving the bearing 231 may be affected.

[0099] For a specific embodiment, see FIG. 22 . The holding structure 26 includes a movable member 222 and a fixed platform 211. Specifically, the movable member 222 is a magnetic drive member, and the fixed member 221 is a coil drive member. In this embodiment, the fixed member 221 is fixed to the fixed base 21, and circuit board routing needs to be placed on the fixed base 21 to supply power to the coil drive member. Generally, in this solution, the movable member 222 is used as a magnetic member (similar to the magnet and magnetic stripe configuration described above) to form a magnetic attraction force between the movable member 222 and the fixed platform 211, and the magnetic attraction force between the movable member 222 and the fixed platform 211 forms at least a part of the holding force. In this solution, a magnetic drive member (movable member 222) is used to form the holding structure. This facilitates the design of a compact size for the image sensor drive module 2.

[0100] See Figures 23A and 23B. In this embodiment, the magnetic member is disposed on the fixed platform 211 of the fixed base 21, and the magnetically attractive member, e.g., a steel plate, is disposed on the bearing portion 231 of the movable base 23. The magnetic attraction between the magnetic member and the magnetically attractive member forms the holding force. Specifically, in this embodiment, the holding structure 26 includes a magnetic member 24 and a magnetically attractive member 238. The magnetically attractive member 238 has a magnetic conductive material and is part of the bearing portion 231. The magnetic member 24 is fixed to the fixed base 21 and is disposed at the contact surface between the fixed base 21 and the bearing portion 231. The magnetic attraction between the magnetic member 24 and the magnetically attractive member 238 forms the holding force. In the embodiment shown in Figure 23A, the magnetic member 24 is disposed on the surface of the fixed platform 211 of the fixed base 21, away from the bearing portion 231. In the embodiment shown in Figure 23B, the magnetic member 24 is embedded inside the fixed platform 211 of the fixed base 21. The support portion 231 includes a circuit board structure and a magnetically attractive member 238. The magnetically attractive member is fixed to the bottom surface of the circuit board structure to reinforce the strength of the circuit board. The magnetically attractive member 238 is disposed on the surface of the support portion 231 facing the fixed platform 211. The magnetically attractive member 238 contacts the fixed platform 211 to form a friction interface X. The magnetically attractive member 238 is further configured to support the image sensor 4. In this embodiment, the magnetically attractive member 238 may have the same structure as the reinforcing plate structure 23B in the embodiment shown in FIG. 7. However, in this embodiment, the magnetically attractive member 238 not only provides structural reinforcement for the support portion 231 but also supports the image sensor 4. The magnetically attractive member 238 must be made of a magnetically conductive material. The magnetically attractive member 238 must cooperate with the magnetic member 24 to generate a magnetic attraction force. However, in the embodiment shown in FIG. 7, the stiffening plate structure 23B does not need to create a magnetic attraction force, but only needs to provide a stiffening force to the circuit board structure 23A and support the image sensor 4.

[0101] 23A and 23B , the magnetic member 24 and the magnetically attractive member 238 form part of the holding structure 26, and other parts of the holding structure 26 include the connecting portion 233 and the fixed portion 232. Specifically, in this embodiment, the holding structure 26 ensures reliable contact between the support portion 231 and the fixed platform 211 through magnetic and elastic forces acting together between the support portion 231 and the fixed platform 211. In this solution, the magnetic member 24 is disposed on the fixed platform 211, and the magnetically attractive member, e.g., a steel plate, is correspondingly disposed on the support portion 231. This design can reduce the influence of the magnetic member on the drive unit 22 and the image sensor 4, ensuring the motion stability of the image sensor 4 and the quality of the generated image signal. In this solution, the magnetic member 24 is disposed on a surface of the fixed base 21 away from the support portion 231, thereby maximizing the distance between the magnetic member 24 and the image sensor 4 and the drive unit 22. This helps to reduce the influence of the magnetic member 24 on the drive unit 22 and the image sensor 4, and ensure the motion stability of the image sensor 4 and the quality of the generated image signal. The magnetic member 24 is embedded inside the fixed platform 211, so that the magnetic member 24 and the fixed platform 211 are integrated together. This does not affect the overall structure of the image sensor drive module 2, and facilitates assembly and positioning of the image sensor drive module 2 with other structures of an electronic device.

[0102] For a specific embodiment, see FIG. 24 . The retaining structure 26 includes an elastic member 25. One end of the elastic member 25 is connected to the upper plate 2121 of the fixed frame 212 of the fixed base 21, and the other end is connected to the bearing portion 231. In the assembled state, the elastic member 25 is in an elastically compressed state and applies an elastic force to the bearing portion 231. The elastic force is directed toward the contact surface between the bearing portion 231 and the fixed base 21, and the elastic force is a holding force to ensure that the bearing portion 231 contacts the fixed platform 211. The elastic member 25 can maintain a contact state at the friction interface X. In the embodiment shown in FIG. 24 , the elastic member 25, the connecting portion 233, and the fixed portion 232 together form the retaining structure 26. In other words, the holding force provided by the connecting portion 233 and the holding force of the elastic member 25 are utilized, thereby making the contact between the bearing portion 231 and the fixed platform 211 more stable.

[0103] In the present application, the support 231 contacts the fixed platform 211 of the fixed base 21, and the support 231 further has a holding force for maintaining contact between the support 231 and the fixed base 21. The direction of the holding force is toward the contact surface between the support 231 and the fixed base 21, thereby allowing the support 231 to contact the fixed base 21 regardless of the position or environment of the image sensor drive module 2. The holding force must be greater than the sum of the gravitational forces of the support 231 and all structures held by the support 231 so that the support 231 can move on a fixed plane during the movement of the image sensor 4, regardless of how the camera module 10 is placed. The image sensor 4 can be stabilized to prevent tilting or axial movement. The axial movement is in the optical axis direction. It can be understood that the plane on which the contact surface between the support 231 and the fixed base 21 is arranged is a plane perpendicular to the optical axis. The image sensor driving module 2 provided in this application can drive the image sensor 4 to move in a plane perpendicular to the optical axis.

[0104] See FIG. 25A. In this embodiment, the movable base 23 has an integrated circuit board structure. Specifically, the support portion 231, the connecting portion 233, and the fixed portion 232 are integrally formed, and the periphery of the fixed portion 232 is configured to connect a circuit board (e.g., FPC) 9. The circuit board 9 is configured to electrically connect the image sensor 4 to a processor of an electronic device. In this embodiment, the circuit board 9 and the fixed portion 232 have an integrated circuit board structure. The circuit board is formed using an integral molding process. The manufacturing process is simple, the assembly is convenient, and the structural stability is good. The trace layer of the movable base 23 is routed only to the same circuit board. This can ensure the stability of signal transmission and reduce signal loss. The support portion 231 includes a first region 231C configured to support the movable member 222 and another electronic device, and a second region 231D configured to support the image sensor 4. The size of the movable base 23 in the direction of the optical axis P of the image sensor 4 is the thickness of the movable base 23, which is equal to the thickness T1 of the first region 231C, the thickness T2 of the connecting portion 233, and the thickness T3 of the fixed portion 232. The movable base including the integrated circuit structure can save space in the thickness direction of the image sensor drive module, which facilitates the design of a smaller size of the image sensor drive module in the direction of the optical axis of the image sensor.

[0105] The first region 231C is connected between the second region 231D and the connecting portion 233, and the thickness T4 of the second region 231D is smaller than the thickness T1 of the first region 231C. The first region 231C is arranged around the edge of the second region 231D and is enclosed together with the second region 231D to form a storage space (the storage space in FIG. 25A is occupied by the image sensor 4, so the storage space is not labeled). The storage space is used to store the image sensor 4, which may be connected to the bottom surface and the second region 231D using an adhesive layer. A gap may be provided between the side of the image sensor 4 and the inner wall of the storage space, which is useful for mounting the image sensor. In this solution, a groove is provided in the support portion 231, and the groove is configured to store the image sensor, which saves space in the optical axis direction and facilitates a design with a small size in the optical axis direction. The contact surface between the first region 231C and the fixed platform 211 of the fixed base 21 is flush with the contact surface between the second region 231D and the fixed platform 211. In this embodiment, the second region 231D of the support 231 may be a completely flat plate structure; in other words, the second region 231D does not have a through-hole or window structure. In another embodiment, the second region 231D may alternatively have a frame-like structure. Specifically, the second region 231D holds only a portion of the edge of the image sensor 4, and the partial region of the image sensor 4 is separated from the fixed platform 211 by a gap. The gap may be filled with air or a heat-conductive medium.

[0106] FIG. 25B is the same as the embodiment shown in FIG. 25A, and shows the detailed structure of the first support region R1. The first support region R1 includes a first central region R11 and a second central region R12, which face the opening S11 in the extension direction of the optical axis. The second central region R12 is arranged around the first central region R11 and connected between the first central region R11 and the second support region R2. The first central region R11 is configured to mount the image sensor 4, and the second central region R12 is configured to mount the optical component 6, which may be an IR filter. In this embodiment, the image sensor 4 or the optical component 6 can be assembled to the first support region R1 of the image sensor drive module 2. This helps reduce the size of the camera module in the optical axis direction. Regarding the electronic device, the electronic device can be made thinner. In this embodiment, the movable base 23 is an integrated circuit board structure. The integrated circuit board structure means that the movable base 23 is manufactured in one step using a circuit board manufacturing process, rather than being a combination of multiple circuit boards or a combination of a circuit board and another substrate. The integrated circuit board structure minimizes the size of the movable base 23 in the optical axis direction. Furthermore, signal interaction between the image sensor 4 and the processor of the electronic device, powering on the image sensor 4, and powering on the drive unit can all be implemented through the circuit board routing placed on the movable base 23. Transmitting electrical and image signals through the circuit board routing of the integrated circuit board structure can also help ensure signal quality, reduce signal loss, and reduce external interference with the signals, improving the imaging efficiency and quality of the camera module. The size of the movable base 23 in the optical axis direction of the image sensor 4 is the thickness of the movable base, which is equal to the thickness T1 of the second support region R2, the thickness T2 of the connecting portion 233, and the thickness T3 of the fixed portion 232.

[0107] The thickness of at least a portion of the first bearing region R1 is smaller than the thickness of the second bearing region R2, thereby forming at least a portion of the first bearing region R1 with a concave structure and forming a receiving space used to receive the image sensor 4. In the embodiment shown in FIGS. 25A and 25B , the thickness of the first central region R11 of the first bearing region R1 is smaller than the thickness of the second central region R12, and the thickness of the second central region R12 is equal to the thickness of the second bearing region R2. The second central region R12 and the first central region R11 are surrounded together to form a receiving space used to receive the image sensor 4. In another embodiment, the thickness of the first central region R11 may be equal to the thickness of the second central region R12; in other words, the first bearing region R1 has a structure with a uniform thickness. The thickness of the first bearing region R1 is smaller than the thickness of the second bearing region R2. In this way, an accommodation space used to accommodate the image sensor is formed between the second support region R2 and the first support region R1. In summary, in this application, a groove structure may be arranged on the movable base 23 of the integrated circuit substrate structure. For example, the first central region R11 may have a small thickness and be a recess. Alternatively, the first support region may have a small thickness and be a recess. The solution in which the recess is configured to support the image sensor helps to reduce the size of the camera module in the optical axis direction.

[0108] See Fig. 26A. In the embodiment shown in Fig. 26A, the friction interface X between the support portion 231 and the fixed platform 211 has a three-dimensional layer structure. For a specific design of the friction interface X, see the embodiments shown in Figs. 11A, 11B, and 11C. A height difference is formed between the fixed portion 232 and the support portion 231 in the extension direction of the optical axis P of the image sensor 4. Specifically, the vertical distance H1 between the fixed platform 211 and the surface of the fixed portion 232 remote from the fixed platform 211 is smaller than the vertical distance H2 between the fixed platform 211 and the surface of the support portion 231 remote from the fixed platform 211. In this embodiment, the fixed portion 232 and the fixed platform 211 are connected using an adhesive layer.

[0109] In the embodiment shown in Figures 25A and 26A, the drive unit 22 is arranged on the side of the support 231 away from the fixed platform 211, in other words, the drive unit 22 is arranged between the upper plate 2121 of the fixed frame 212 and the support 231.

[0110] See Figure 26B. There is a gap G between the movable base 23 and the inner surface S0 of the fixed platform 211. It can be seen that the movable base 23 and the inner surface S0 of the fixed platform 211 are spaced apart by a gap.

[0111] See Figure 27A. In this embodiment, the fixed platform 211 of the fixed base 21 is flat, and the fixed frame 212 is connected to an edge region of the fixed platform 211, and the fixed frame 212 is configured to connect to the fixed portion 232 of the movable base 23. Specifically, the fixed frame 212 includes a first portion 212A and a second portion 212B. The first portion 212A is disposed between the fixed portion 232 and the fixed platform 211 and supports the fixed portion 232 above the fixed platform 211. The second portion 212B is disposed on the side of the fixed portion 232 away from the first portion 212A. In other words, the fixed portion 232 is sandwiched between the first portion 212A and the second portion 212B. The drive unit 22 is disposed between the bearing 231 and the fixed platform 211, the fixed member 221 of the drive unit 22 is fixed to the fixed platform 211, and the movable member 222 is fixed to the surface of the bearing 231 facing the fixed platform 211. Specifically, the movable member 222 is fixed to the side of the second bearing region R2 of the bearing 231 away from the upper plate 2121 (specifically, to the surface of the second bearing region R2 facing the fixed platform 211). In this solution, the position of the fixed member 221 on the fixed platform 211 is disposed around the friction interface X between the bearing 231 and the fixed platform 211. The range of movement of the bearing 231 on the fixed platform 211 is within a range limited by the fixed member 221 on the fixed platform 211. The support portion 231 includes three portions: a first section A1, a second section A2, and a third section A3. The second section A2 is connected between the first section A1 and the third section A3. The first section A1 is connected to the connection portion 233 and is configured to accommodate the movable member 222 and another electronic device. The third section A3 is configured to support the image sensor 4. The first section A1 may be parallel to the third section A3.

[0112] See Figure 27B. There is a gap G between the movable base 23 and the inner surface S0 of the fixed platform 211. It can be seen that the movable base 23 and the inner surface S0 of the fixed platform 211 are spaced apart by a gap.

[0113] 27A , fixed frame 212 of fixed base 21 includes upper plate 2121. Upper plate 2121 is configured to shield connection portion 233 and protect connection portion 233. Specifically, the upper plate is located on the opposite side of fixed platform 211 and forms enclosed space 2120 together with side frame 2122 and fixed platform 211. Second bearing region R2 and connection portion 233 of movable base 23, as well as drive unit 22, are all housed in enclosed space 2120. In this manner, fixed base 21 protects drive unit 22 and the circuitry of movable base 23. Alternatively, upper plate 2121 may be configured to mount another drive unit of a camera module.

[0114] 28A , the fixed base 21 does not need to have an upper plate, and the fixed portion 232 of the movable base 23 overlaps the upper surface 212C of the fixed frame 212. This embodiment helps to miniaturize the image sensor drive module and save space in the electronic device. In the embodiment shown in FIG. 28A , the area surrounded by the end of the fixed frame 212 away from the fixed platform 211 is the opening S11. In the process of assembling the image sensor 4, the image sensor 4 is assembled to the first support region R1 of the support portion 231 through the opening S11.

[0115] See Figure 28B. There is a gap G between the movable base 23 and the inner surface S0 of the fixed platform 211. It can be seen that the movable base 23 and the inner surface S0 of the fixed platform 211 are spaced apart by a gap.

[0116] 29A. In this embodiment, the support portion 231 includes a first support platform 231E and a second support platform 231F. The first support platform 231E is configured to support the image sensor 4, and the first support platform 231E is provided with an accommodating slot E1. The image sensor 4 is fixed to the accommodating slot E1 of the first support platform 231E using an adhesive layer. The first support platform 231E contacts the fixed platform 211 of the fixed base 21 to form a contact surface, and the direction perpendicular to the contact surface is the direction of the optical axis P. The second support platform 231F and the connecting portion 233 are stacked in the direction of the optical axis P. The movable member 222 of the drive unit 22 is fixed to the second support platform 231F, and the fixed member 221 is fixed to the upper plate 2121 of the fixed frame 212 of the fixed base 21. The drive unit 22 is arranged on a side of the second bearing platform 231F away from the connecting portion 233. The first bearing platform 231E and the connecting portion 233 are connected to each other to form an integral structure, and the connecting portion 233 is arranged between the second bearing platform 231F and a contact surface (specifically, the friction interface X) in the direction of the optical axis P. The first bearing platform 231E and the second bearing platform 231F are connected using solder balls; in other words, a mechanical connection can also be implemented. In this embodiment, the bearing 231 is designed as a structure of two plates (specifically, the first bearing platform 231E and the second bearing platform 231F), and using a configuration in which the second bearing platform 231F and the connecting portion 233 are stacked, a small-sized design of the movable base 23 in the direction perpendicular to the optical axis P can be implemented. When this solution is applied to an electronic device, the board area occupied by the circuit board on which the camera module is arranged can be reduced. In the embodiment shown in FIG. 29A, the portion of the second support platform 231F facing the upper plate 2121 is the second support region R2, and the second support region R2 and the connecting portion 233 are stacked.In the direction of the optical axis P, the connection portion 233 is disposed between the second support region R2 and the fixed platform 211. The first support region R1 includes a first mounting region R13 and a second mounting region R14. The first mounting region R13 is configured to support the image sensor 4. The connection portion 233 surrounds the first mounting region R13 and is connected to an edge of the first mounting region R13, and the second mounting region R14 and the second support region R2 are connected to each other. The second mounting region R14 and a portion of the first mounting region R13 overlap to form an overlap region R111. All mechanical and electrical connections between the first mounting region R13 and the second mounting region R14 are located in the overlap region R111. The portion within the rectangular frame indicated by the dashed line in FIG. 29A is the overlap region R111.

[0117] See Figure 29B. There is a gap G between the movable base 23 and the inner surface S0 of the fixed platform 211. It can be seen that the movable base 23 and the inner surface S0 of the fixed platform 211 are spaced apart by a gap.

[0118] 30A and 31A. In this embodiment, the first bearing platform 231E and the connecting portion 233 are connected to the top and bottom surfaces of the second bearing platform 231F, respectively, and the second bearing platform 231F is disposed between the connecting portion 233 and the fixed platform 211 in the direction of the optical axis P. It can also be understood that the second bearing platform 231F is disposed between the connecting portion and the friction interface in the direction of the optical axis P. In this embodiment, the first bearing platform 231E and the second bearing platform are directly connected to form a Z-shaped configuration, and the connecting portion 233 is disposed on the side of the second bearing platform 231F away from the fixed platform 211, and the connecting portion 233 is connected to the top surface of the second bearing platform 231F using a compliant plate 233A. The compliant plate 233A and the second bearing platform 231F are connected using solder balls; in other words, a mechanical connection or an electrical connection can be implemented. The drive unit 22 is disposed between the second support platform 231F and the fixed platform 211, the movable member 222 is fixed to the second support platform 231F, and the fixed member 221 is fixed to the fixed platform 211.

[0119] 30A, the portion of the second bearing platform 231F facing the upper plate 2121 is the second bearing region R2, and the movable member 222 is fixed to the surface of the second bearing region R2 facing the fixed platform 211. In the optical axis direction, the connection portion 233 is disposed between the upper plate 2121 and the second bearing region R2. The first bearing platform 231E is the first bearing region R1.

[0120] 30A , the fixed frame 212 includes an upper plate 2121. The upper plate 2121 may be disposed above the connecting portion 233 to protect the connecting portion 233. The fixed portion 232 and the fixed platform 211 are spaced apart using a portion of the fixed frame 212; in other words, the fixed portion 232 is fixed to the fixed frame 212.

[0121] In the embodiment shown in Figure 31A, the upper plate 2121 is not placed on the fixed frame 212, and the fixed part 232 is fixed to the upper surface of the fixed frame 212, in other words, the fixed part 232 is fixed to a surface of the fixed frame 212 that is away from the fixed platform 211.

[0122] See Figures 30B and 31B. There is a gap G between the movable base 23 and the inner surface S0 of the fixed platform 211. It can be seen that the movable base 23 and the inner surface S0 of the fixed platform 211 are spaced apart by a gap.

[0123] The terms "first," "second," "third," "fourth," and various numerals used herein are merely used for distinction purposes for ease of explanation and are not to be construed as limitations on the scope of the present application.

[0124] It should be understood that the sequence numbers of the above processes do not refer to the execution order in various embodiments of the present application. The execution order of the processes should be determined based on the functions and internal logic of the processes, and should not be construed as any limitation on the implementation process of the embodiments of the present application.

[0125] The above description is merely a specific embodiment of the present application and is not intended to limit the scope of protection of the present application. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present application shall fall within the scope of protection of the present application. When no contradiction occurs, the possible embodiments and features of the possible embodiments of the present application may be combined with each other. Therefore, the scope of protection of the present application shall be subject to the scope of protection of the claims. [Explanation of symbols]

[0126] 2 image sensor driving module, 3 lens driving module, 4 image sensor, 5 lens assembly, 6 optical component, 7 electronic device, 8 support structure, 9 circuit board, 10 camera module, 21 fixed base, 22 driving unit, 23 movable base, 23A integrated circuit board structure, 23B stiffening plate structure, 23B1 first part, 23B2 second part, 24 magnetic member, 25 elastic member, 26 holding structure, 31 housing, 32 driving component, 41 signal line, 61 adhesive structure, 80 optical assembly, 100 housing, 200 display, 211 fixed platform, 212 fixed frame, 212A first part, 212B second part, 212C upper surface, 221 fixed member, 222 movable member, 231 support portion, 231A first plate, 231C first region, 231D Second area, 231E First support platform, 231F Second support platform, 232 Fixing portion, 233 Connection portion, 233A Compliant plate, 235 Hole structure, 238 Magnetic attraction member, 241 Magnet, 242 Magnet, 243 Magnet, 244 Magnet, 245 Magnetic stripe, 246 Magnetic stripe, 247 Magnetic stripe, 248 Magnetic stripe, 300 Front camera assembly, 321 Magnetic drive member, 322 Coil drive member, 400 Rear camera assembly, 500 Main board, 600 Processor, 700 Memory, 800 Battery, 801 Adhesive layer, 1000 Electronic device, 1001 Bezel, 1002 Rear cover, 1003 Rear camera hole, 1004 Flash hole, 2001 Front camera hole, 2111 Central area, 2112 Connection region, 2113 edge region, 2120 surrounding space, 2121 upper plate, 2122 side frame, 2123 magnetic conductive structure, 2125 positioning structure, 2310 accommodating space, 2331 first position, 2332 second position, 2333 conductor layer, 2334 metal layer, 4001 camera module, 4002 flash module, A1 first section, A2 second section, A3 third section, D1 distance, D2 distance, E1 accommodating slot, G gap, H1 vertical distance, H2 vertical distance, M1 super-slip material layer, M2 super-slip material layer, M3 lubricating layer, P optical axis, R1 first support region, R2 second support region, R11First central region, R12 Second central region, R13 First assembly region, R14 Second assembly region, R111 Overlapping region, S0 Inner surface, S1 First top surface, S2 First bottom surface, S3 Second bottom surface, S4 Second top surface, S5 First flat surface, S6 Second flat surface, S7 Flat structure, S11 Opening, S51 Arrayed bump structure, S52 Multi-bump structure, S53 Protruding rod structure, S54 Protruding rod structure, T1 Thickness, T2 Thickness, T3 Thickness, T4 Thickness, X Friction interface

Claims

1. a drive unit comprising a fixed member and a movable member movable relative to one another; a stationary base including a stationary platform and a stationary frame, the stationary platform having opposing inner surfaces and a first bottom surface, the stationary frame being connected to the stationary platform and protruding from the inner surface, the stationary member being fixed to the stationary base, and an opening being formed in the stationary frame on a side away from the inner surface; a movable base floatingly spaced apart from or in contact with the inner surface of the fixed platform, the movable base comprising a bearing portion, a fixed portion, and a connecting portion, the connecting portion configured to implement a mechanical and electrical connection between the bearing portion and the fixed portion, the fixed portion connected to the fixed base, the bearing portion comprising a first bearing area and a second bearing area, the movable member being disposed on the second bearing area, the first bearing area being configured to support an image sensor, the size of the opening being larger than the size of the image sensor, and the opening being configured to attach the image sensor to the first bearing area; a retaining structure, a portion of the retaining structure connected to the bearing and a portion of the retaining structure disposed on the fixed base, the retaining structure configured to provide a retaining force to the bearing; Equipped with The image sensor drive module, wherein the holding force is a force that pulls the support portion in a direction toward the fixed platform.

2. 2. The image sensor drive module of claim 1, wherein the fixed frame comprises a side frame and an upper plate, the upper plate and the inner surface of the fixed platform are arranged opposite each other, the side frame is connected between the upper plate and the fixed platform, the side frame, the upper plate, and the fixed platform form an enclosed space, the drive unit, the connection portion, and the second support area are arranged in the enclosed space, and the opening is formed by surrounding the upper plate.

3. 3. The image sensor drive module of claim 2, wherein the top plate is made of a hard material, the top plate has a first top surface, the first top surface being a surface of the top plate away from the fixed platform, and the first top surface is configured to mount a lens drive module of a camera module.

4. The image sensor drive module of claim 1 , wherein the first bearing area faces the opening.

5. 2. The image sensor drive module of claim 1, wherein the first support area comprises a first central area and a second central area, the second central area is arranged around the first central area, a projection of the second central area onto the inner surface of the fixed platform is arranged between a projection of the first central area onto the inner surface of the fixed platform and a projection of the second support area onto the inner surface of the fixed platform, the first central area being configured to mount the image sensor, and the second central area being configured to mount an optical component.

6. 2. The image sensor driving module of claim 1, wherein the movable base is an integrated circuit substrate structure, the second support area is connected between the connection portion and the first support area, and the thickness of at least a portion of the first support area is smaller than the thickness of the second support area, thereby causing at least a portion of the first support area to have a concave structure and form an accommodation space used to accommodate the image sensor.

7. The image sensor drive module of claim 2 , wherein the fixed member is fixed to the upper plate, and the movable member is fixed to the second bearing area and faces the upper plate.

8. The image sensor drive module of claim 1 , wherein the second support area and the connection portion are stacked, and the connection portion is disposed between the second support area and the fixed platform in the optical axis direction.

9. 9. The image sensor drive module of claim 8, wherein the first support area comprises a first mounting area and a second mounting area, the first mounting area is configured to support the image sensor, the connection portion surrounds the first mounting area and is connected to an edge of the first mounting area, the second mounting area and the second support area are connected to each other, the second mounting area and a portion of the first mounting area overlap to form an overlap area, and all positions of mechanical and electrical connections between the first mounting area and the second mounting area are located in the overlap area.

10. The image sensor drive module of claim 9 , wherein the first mounting area and the connection portion are integrated circuit substrate structures.

11. The image sensor drive module of claim 1 , wherein the fixed member is fixed to the fixed platform, and the movable member is fixed to the second bearing area and faces the fixed platform.

12. The image sensor drive module of claim 1 , wherein the second support area and the connection portion are stacked, and the second support area is disposed between the fixed platform and the connection portion in the optical axis direction.

13. 2. The image sensor drive module of claim 1, wherein the support portion comprises a first plate and a second plate, the first plate connected to the connection portion, the inner edge periphery of the first plate forms an accommodating space, the second support area is disposed on the first plate, the second plate comprises a first portion and a second portion, the first portion and the first plate are stacked, the second portion is disposed at the bottom of the accommodating space, the second portion is configured to support an image sensor, the image sensor is electrically connected to the first plate, and a signal of the image sensor is transmitted by the first plate, the connection portion, and the fixing portion.

14. The image sensor drive module of claim 1 , wherein the bearing contacts the fixed platform and the retention force is used to maintain contact between the bearing and the fixed platform.

15. A camera module comprising an image sensor, a lens assembly, and an image sensor drive module, wherein the image sensor is fixed to the image sensor drive module, the lens assembly is disposed on a light incident side of the image sensor, and the image sensor drive module: a drive unit comprising a fixed member and a movable member movable relative to one another; a stationary base including a stationary platform and a stationary frame, the stationary platform having opposing inner surfaces and a first bottom surface, the stationary frame being connected to the stationary platform and protruding from the inner surface, the stationary member being fixed to the stationary base, and an opening being formed in the stationary frame on a side away from the inner surface; a movable base floatingly spaced apart from or in contact with the inner surface of the fixed platform, the movable base comprising a bearing portion, a fixed portion, and a connecting portion, the connecting portion configured to implement a mechanical and electrical connection between the bearing portion and the fixed portion, the fixed portion connected to the fixed base, the bearing portion comprising a first bearing area and a second bearing area, the movable member being disposed on the second bearing area, the first bearing area being configured to support an image sensor, the size of the opening being larger than the size of the image sensor, and the opening being configured to attach the image sensor to the first bearing area; a retaining structure, a portion of the retaining structure connected to the bearing and a portion of the retaining structure disposed on the fixed base, the retaining structure configured to provide a retaining force to the bearing; Equipped with A camera module, wherein the holding force is a force that pulls the support portion in a direction toward the fixed platform.

16. An electronic device comprising: a processor; and a camera module, the processor being electrically connected to the camera module, the processor being configured to process an image signal output by an image sensor, the camera module comprising the image sensor, a lens assembly, and an image sensor drive module, the image sensor being fixed to the image sensor drive module, the lens assembly being disposed on a light incident side of the image sensor, and the image sensor drive module being: a drive unit comprising a fixed member and a movable member movable relative to one another; a stationary base including a stationary platform and a stationary frame, the stationary platform having opposing inner surfaces and a first bottom surface, the stationary frame being connected to the stationary platform and protruding from the inner surface, the stationary member being fixed to the stationary base, and an opening being formed in the stationary frame on a side away from the inner surface; a movable base floatingly spaced apart from or in contact with the inner surface of the fixed platform, the movable base comprising a bearing portion, a fixed portion, and a connecting portion, the connecting portion configured to implement a mechanical and electrical connection between the bearing portion and the fixed portion, the fixed portion connected to the fixed base, the bearing portion comprising a first bearing area and a second bearing area, the movable member being disposed on the second bearing area, the first bearing area being configured to support an image sensor, the size of the opening being larger than the size of the image sensor, and the opening being configured to attach the image sensor to the first bearing area; a retaining structure, a portion of the retaining structure connected to the bearing and a portion of the retaining structure disposed on the fixed base, the retaining structure configured to provide a retaining force to the bearing; Equipped with The electronic device, wherein the holding force is a force that pulls the support portion in a direction toward the fixed platform.

17. an image sensor and lens assembly, the lens assembly being disposed on a light incident side of the image sensor; a lens driving module comprising a housing and a driving component mounted within the housing, the driving component configured to drive movement of the lens assembly; an image sensor drive module comprising a fixed base, a movable base, and a drive unit, the drive unit comprising a fixed member and a movable member movable relative to each other, the fixed base comprising a fixed platform and a side frame, the side frame connected to the fixed platform, the fixed member fixed to the fixed base, the movable base comprising a bearing portion, a fixed portion, and a connection portion, the connection portion configured to implement a mechanical and electrical connection between the bearing portion and the fixed portion, the fixed portion connected to the fixed base, and the support portion configured to support the image sensor and the movable member; Equipped with the lens driving module is disposed on a side of the side frame away from the fixed platform, and an outer surface of the housing is fixedly connected to the fixed base; the image sensor drive module further comprises a holding structure, a portion of the holding structure connected to the support and a portion of the holding structure disposed on the fixed base, the holding structure configured to provide a holding force to the support; A camera module, wherein the holding force is a force that pulls the support portion in a direction toward the fixed platform.

Images