Heat dissipation structure, vehicle-mounted device and terminal device

Abstract

Embodiments of the present application provide a heat dissipation structure, a vehicle-mounted device, and a terminal device used in the field of heat dissipation technology. The heat dissipation structure includes a heat sink, a circuit board, a fixed connection structure, and an elastic connection structure. A chip mounting area and a first position are provided on the circuit board. The first position is positioned outside the chip mounting area. The fixed connection structure is positioned at the first position and fastens the circuit board to the heat sink. The elastic connection structure is configured to apply an elastic force toward the heat sink in the chip mounting area. In an embodiment of the present application, the elastic force provided by the elastic connection structure can significantly reduce the thermal resistance between the chip and the housing of the heat sink, thereby improving the heat dissipation efficiency. Further, the fixed connection structure can fasten the circuit board to the heat sink to avoid overall sliding of the circuit board and improve stability. Therefore, the present application can improve the heat dissipation efficiency while ensuring the stability of the heat dissipation structure, and is particularly applicable to the stable heat dissipation of high-power consumption chips.

Description

[Technical Field]

[0001] This application claims priority to Chinese Patent Application No. 202210592066.9, entitled "Heat Dissipation Structure, Vehicle-Mounted Device and Terminal Device," filed with the State Intellectual Property Administration of China on May 28, 2022, which is incorporated herein by reference in its entirety.

[0002] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation structure, a vehicle-mounted device, and a terminal device. [Background technology]

[0003] With the continuous development of intelligent technology, various electronic devices are used in terminal devices, such as vehicles. In particular, self-driving vehicles involve many intelligent devices / systems. Therefore, the problem of heat dissipation of these electronic devices during the working process is highlighted.

[0004] A large tolerance is set between the heat sink and the chip in a conventional vehicle. Therefore, a thick thermal conductive material (such as gel or thermal pad) needs to be filled between the chip and the heat sink. Because the thermal conductive material is thick and has a large thermal resistance, the heat dissipation efficiency is low when the power consumption of the chip is high. However, with the intelligence of electronic devices, the power consumption of electronic devices in terminal devices increases by several tens of times, and such a heat dissipation method cannot meet the heat dissipation requirements. Summary of the Invention [Means for solving the problem]

[0005] The embodiments of the present application provide a heat dissipation structure, a vehicle-mounted device, and a terminal device to improve the heat dissipation efficiency of high-power-consuming components.

[0006] According to a first aspect, an embodiment of the present application provides a heat dissipation structure including a heat sink, a circuit board, at least one fixed connection structure, and at least one elastic connection structure. At least one chip mounting area and at least one first location are provided on the circuit board, and the at least one first location is located outside the chip mounting area. The at least one fixed connection structure is located at the at least one first location and fastens the circuit board to the heat sink. The at least one elastic connection structure is configured to apply an elastic force to the chip mounting area toward the heat sink.

[0007] In one aspect, the elastic force applied to the elastic connection structure can significantly reduce the thermal resistance between the chip and the housing of the heat sink, thereby improving heat dissipation efficiency. For example, the elastic connection structure can generate elastic deformation in the chip mounting area, which can absorb assembly tolerances, so that the chip positioned in the chip mounting area is closely attached to the heat sink (wherein the attachment can be direct attachment or attachment using an intermediate). In this way, the thermal resistance between the chip and the housing of the heat sink is significantly reduced.

[0008] In another aspect, the fixed connection structure can fasten the circuit board to the heat sink to prevent the circuit board from sliding together, thereby improving stability. In conclusion, in this embodiment of the present application, the temperature of the chip can be effectively reduced, while the overall structure remains stable, the risk of chip overheating can be reduced, and safety can be improved.

[0009] In a possible solution, the heat dissipation device provided in the embodiments of the present application can be configured to dissipate heat from a chip in an intelligent mobile terminal. With the popularity of intelligent mobile terminals, more and more chips are used in fields such as intelligent driving vehicles, unmanned aerial vehicles, and mobile robots. However, because mobile intelligent terminals need to move in external environments or be carried around for movement in external environments, they often encounter scenarios such as vibration or bumps. In these scenarios, if the chip is in unstable contact with the heat sink or the circuit board, not only will the chip's heat dissipation efficiency be affected, but poor electrical connection may also occur. This will affect the normal operation of the intelligent terminal and endanger personal safety. However, with the heat dissipation structure provided in the embodiments of the present application, the circuit board on which the chip is located and the heat sink can be securely fastened, and longitudinal deformation will only be generated within the safe range of the chip, thereby attaching the chip to the heat sink. In other words, a stable and high heat dissipation efficiency can be achieved, the stability of the whole structure is strengthened, and the safety of the intelligent mobile terminal is improved.

[0010] It should be noted that in the embodiments of the present application, there can be multiple fixed and / or elastic connection structures.

[0011] When multiple fixed connection structures are arranged, the multiple fixed connection structures may provide uniform and reliable fixed connections to the circuit board, and the overall service life of the fixed connection structures may be improved.

[0012] When multiple elastic connection structures are arranged, the multiple elastic connection structures can improve the overall service life of the elastic connection structures. Furthermore, the multiple elastic connection structures can evenly distribute the elastic force around the chip mounting area, thereby improving the flatness of the chip mounting area. This can improve the reliability of the connection between the chip and the circuit board and further ensure the consistency and balance of the elastic top retention force applied between the chip and the heat sink.

[0013] In yet another possible implementation of the first aspect, the at least one fixed connection structure is configured to position the circuit board in a horizontal direction, thereby reducing the possibility of the circuit board sliding in the horizontal direction and improving structural stability.

[0014] Optionally, the at least one fixed connection structure includes a fastening screw, which has sufficient fastening force so that the circuit board and the heat sink can be securely fastened together.

[0015] In a possible implementation of the first aspect, the at least one elastic connection structure includes a fastener and an elastic member. The circuit board is provided with a through hole, the fastener passes through the through hole, and is fastened to the heat sink. The elastic member is sleeved onto the fastener and elastically connected to the fastener and to a surface of the circuit board remote from the heat sink.

[0016] In the above-described implementation, the fastener is fastened to the heat sink through a through-hole in the circuit board, and the elastic member attached to the fastener can be fastened in a horizontal direction (also called a direction parallel to the circuit board). Therefore, the deformation of the elastic member is mostly in a vertical direction (also called a direction perpendicular to the circuit board), thereby stabilizing the direction of the elastic force exerted by the elastic member. In other words, through fastening of the fastener, the elastic member can stably exert an elastic force toward the heat sink for the circuit board. According to the solution provided in the above-described implementation, the chip positioned in the chip mounting area is more stably attached to the heat sink, thereby improving heat dissipation efficiency.

[0017] In yet another possible implementation of the first aspect, the at least one elastic connecting structure includes a spring screw, an elastic sheet, etc. The spring screw or the elastic sheet has sufficient supporting strength and can be elastically deformed to provide an elastic force, thereby closely attaching the chip to the heat sink.

[0018] In yet another possible implementation of the first aspect, the at least one elastic connecting structure is an elastic body, which is elastically connected between the circuit board and the support.

[0019] In the above-described implementation, the elastic force is provided by using an elastic body positioned between the circuit board and the support. In this case, no additional modifications need to be made to the circuit board and the heat sink, which reduces the complexity of the design of the circuit board and the heat sink, and reduces the design and manufacturing costs.

[0020] In yet another possible implementation of the first aspect, the support is positioned on the side of the circuit board away from the heat sink. An elastic body is compressed between the circuit board and the support, thereby applying a "pressing force" to the circuit board. Correspondingly, the circuit board is "pressed" against the heat sink, thereby stably attaching the chip positioned in the chip mounting area to the heat sink. This improves heat dissipation efficiency.

[0021] Optionally, the elastic body may be fastened by using a groove provided in the support, in which case there is no need to provide a through hole in the circuit board, which reduces the complexity of the design of the circuit on the circuit board.

[0022] In yet another possible implementation of the first aspect, the support is positioned on the side of the circuit board facing the heat sink. The elastic body is stretched between the circuit board and the support, thereby applying a "tensile force" to the circuit board. Correspondingly, the circuit board is "pulled" toward the heat sink, thereby stably attaching the chip positioned in the chip mounting area to the heat sink. This improves heat dissipation efficiency.

[0023] In yet another possible implementation of the first aspect, the support is a housing of the heat dissipation structure.

[0024] Optionally, the heat dissipation structure may be contained within a housing. Further, optionally, the housing of the heat sink includes an upper housing and a lower housing (also called a bottom housing), and the support may specifically be the lower housing of the heat sink structure.

[0025] In yet another possible implementation form of the first aspect, the circuit board of the heat dissipation structure is connected to the stress-sensitive component, and the distance between the stress-sensitive component and the first fixed connection structure is smaller than the distance between the stress-sensitive component and any elastic connection structure, and the first fixed connection structure belongs to at least one fixed connection structure.

[0026] In this embodiment of the present application, the stress-sensitive component is disposed close to the fixed connecting structure, thus avoiding damage or poor connection of the stress-sensitive component connected to the circuit board caused by the deformation of the circuit board under the elastic force provided by the elastic connecting structure.

[0027] In yet another possible implementation of the first aspect, the heat dissipation structure further includes a connector and a main board. One end of the connector is connected to the circuit board, and the other end of the connector is connected to the main board. The connector can enable the circuit board to be electrically connected to the main board.

[0028] This configuration meets different customer requirements for different types of chips and is highly applicable. Furthermore, when the performance of the chip needs to be upgraded, only the chip and the circuit board need to be replaced. Therefore, the evolution ability is strong and the upgrade and replacement costs are low. Furthermore, the above implementation can further meet the requirement to add or remove chips, thereby improving the flexibility of the components.

[0029] In yet another possible solution, the connector may be a flexible conductive member, and the signal interconnection between the connector and the main board is implemented by using the flexible conductive member. The flexible conductive member may include a flexible circuit board, a flexible connector, a cable, etc. The flexible conductive member may implement the signal interconnection between the circuit board and the main board, and the flexibility of the flexible conductive member can ensure the reliability of the electrical connection when the circuit board floats up and down.

[0030] In a possible solution, the connector may be a BTB connector.

[0031] In yet another possible implementation form of the first aspect, the distance between the connector and the second fixed connection structure is smaller than the distance between the connector and any elastic connection structure, and the second fixed connection structure belongs to at least one of the fixed connection structures.

[0032] It should be understood that in this embodiment of the present application, the terms "first fixed connection structure" and "second fixed connection structure" are merely for ease of description and are not intended to be a limitation that the two are certainly two different fixed connection structures. That is, the second fixed connection structure and the aforementioned first fixed connection structure may be two different fixed connection structures or may be the same fixed connection structure.

[0033] In yet another possible implementation of the first aspect, there is one chip mounting area on the circuit board, the first location is located at an edge of the circuit board, and the chip mounting area is located in a central area of ​​the circuit board.

[0034] In yet another possible implementation of the first aspect, there are at least two chip mounting areas on the circuit board, and the first location is located between the at least two chip mounting areas.

[0035] In yet another possible implementation of the first aspect, the chip mounting area is located on one side of the circuit board and the first location is located on another side of the circuit board.

[0036] In yet another possible implementation form of the first aspect, the heat dissipation structure further includes a support, the support is fastened to the circuit board, the elastic force of the at least one elastic connecting structure acts on the support, and the elastic force of the elastic connecting structure is imparted to the circuit board by using the support.

[0037] The support can improve the rigidity of the chip-mounting area, and in this way, the elastic force of the elastic connecting structure acts on the chip-mounting area, thereby ensuring the overall shape of the chip-mounting area, the flatness of the chip-mounting area is not affected, the reliability of the connection between the chip and the circuit board is ensured, and the consistency and balance of the elastic top retention force applied between the chip and the heat sink can be ensured.

[0038] In yet another possible implementation of the first aspect, the heat dissipation structure is used in an autonomous driving controller, a cockpit domain controller, or a vehicle domain controller.

[0039] As the structure of vehicles becomes more complex and the degree of intelligence becomes higher, the power consumption of the chips in the vehicle controller also increases. According to this embodiment of the present application, the heat dissipation structure can provide stable and efficient heat dissipation for the chips in the vehicle, thereby reducing the risk of chip overheating and improving safety.

[0040] In yet another possible implementation of the first aspect, the heat sink is provided with a boss, which is in thermal conduction to a heat-radiating component (e.g., a chip) in the chip-mounting area, and the boss is arranged so that heat dissipation can be performed at the chip in a targeted manner, thereby improving heat dissipation efficiency.

[0041] In yet another possible implementation of the first aspect, a thermally conductive medium is disposed between the heat sink and the heat-radiating component (eg, the chip) in the chip-mount area.

[0042] Optionally, the thermally conductive medium is silicone grease or a thermal pad (e.g., a phase-change thermally conductive film). The thermal resistance of the thermally conductive silicone grease and the phase-change thermally conductive film is low, and an extremely thin thickness can be implemented in the process, which helps to reduce the temperature of the chip.

[0043] In yet another possible implementation of the first aspect, the thermal pad has a thickness of 0.3 millimeters or less.

[0044] Under the influence of the elastic fastening structure, the heat radiation component (e.g., chip) is closely attached to the heat sink, and the thickness of the thermal conductive layer can be greatly reduced, thereby greatly reducing the thermal resistance of the thermal conductive layer and effectively reducing the temperature of the chip.

[0045] In possible implementations of the first aspect, the heat sink may dissipate heat in different forms, such as air-cooled or water-cooled, etc. In other words, the heat dissipation device provided in this embodiment of the present application is applicable to air-cooled heat sinks or liquid-cooled heat sinks.

[0046] In yet another possible implementation of the first aspect, the heat sink includes a conduit, the conduit configured to be filled with a liquid, the liquid including water or a cooling material.

[0047] According to a second aspect, an embodiment of the present application provides a vehicle-mounted device, the vehicle-mounted device including the heat dissipation structure described above and at least one chip, the at least one chip being disposed in at least one chip mounting area on a circuit board of the heat dissipation structure.

[0048] In one aspect, the fixed connection structure can fasten the circuit board to the heat sink and prevent the circuit board from sliding together, thereby improving stability. In another aspect, the elastic force provided by the elastic connection structure can generate elastic deformation in the chip mounting area, so that the chip is tightly attached to the heat sink. This can significantly reduce the thermal resistance between the chip and the heat sink housing and improve heat dissipation efficiency. In conclusion, in this embodiment of the present application, the temperature of the chip can be effectively reduced, while the overall structure remains stable, and the risk of chip overheating can be reduced.

[0049] It should be noted that the heat dissipation assembly is not only applicable to the aforementioned vehicle-mounted devices, but also to one or more devices having heat dissipation requirements. For example, the heat dissipation assembly is used in devices such as intelligent terminal devices, network devices, equipment room devices, industrial devices, transportation devices, or recreational and entertainment devices. Examples of intelligent terminal devices include mobile phones, tablet computers, notebook computers, smart bands, smart watches, and smart glasses. Examples of network devices include metro routers, central routers, and base stations. Examples of equipment room devices include data center servers and data center switches. Examples of industrial devices include industrial robots and robot arms. Examples of transportation devices include vehicles, ships, aircraft, rail transport (e.g., subways or high-speed rail), and logistics robots. Examples of recreational and entertainment devices include virtual reality (VR) devices, mixed reality (MR) devices, massage chairs, and 4D cinema cockpits. This is not strictly limited to the embodiments of the present application.

[0050] In a possible implementation of the second aspect, at least one resilient connection structure in the heat sink is configured to maintain a thermally conductive connection between the at least one chip and the heat sink in the heat dissipation structure.

[0051] In a possible implementation of the second aspect, the vehicle-mounted device further includes a main board, on which there are multiple chips, and on which there are at least two heat dissipation structures.

[0052] A plurality of chips are mounted on chip mounting areas on the circuit board in the at least two heat dissipation structures, and the main board is electrically connected to the circuit board in the plurality of heat dissipation structures.

[0053] Multiple heat dissipation structures are arranged, allowing multiple high-power-consumption chips to conduct heat with the heat sink and dissipate heat separately. Furthermore, multiple circuit boards (or heat dissipation devices) are arranged, which not only meets different customer requirements for different types of chips but also has high applicability. Furthermore, when the performance of a chip needs to be upgraded, only the chip and the circuit board need to be replaced. Therefore, the evolution capability is strong and the replacement cost is low. Furthermore, the above implementation can further meet the requirement for adding or removing chips, thereby improving the flexibility of components.

[0054] In a possible implementation of the second aspect, the vehicle-mounted device is an integral plate-shaped structure.

[0055] In a possible implementation of the second aspect, the vehicle-mounted device is used in an Electronic Control Unit (ECU) module that uses a high-power consumption chip. The ECU module includes, but is not limited to, an autonomous driving controller, a cockpit domain controller (CDC), a vehicle domain controller (VDC), a vehicle integrated / integration unit (VIU), etc. The autonomous driving controller may be, for example, a mobile data center (MDC).

[0056] According to a third aspect, the present application further provides a terminal device, which includes the above-mentioned heat dissipation structure or vehicle-mounted device.

[0057] In a possible implementation form of the third aspect, the terminal device may be a transportation tool such as a vehicle, an unmanned aerial vehicle, a robot, a handheld terminal, or a wearable device. [Brief explanation of the drawings]

[0058] [Figure 1] 1 is a schematic diagram of a partial structure of a heat-dissipating structure according to an embodiment of the present application; [Figure 2] 1 is a schematic diagram of a deformation of a circuit board according to an embodiment of the present application; [Figure 3] 1 is a schematic diagram of a usage scenario of a heat-dissipating structure according to an embodiment of the present application; [Figure 4] FIG. 2 is a schematic diagram of a chip mounting area and a first position according to an embodiment of the present application. [Figure 5A] FIG. 10 is a schematic diagram of another chip mounting area and a first position according to an embodiment of the present application. [Figure 5B] 10 is a schematic diagram of a partial structure of another heat-dissipating structure according to an embodiment of the present application; [Figure 6A] FIG. 10 is a schematic diagram of another chip mounting area and a first position according to an embodiment of the present application. [Figure 6B] 10 is a schematic diagram of a partial structure of another heat-dissipating structure according to an embodiment of the present application; [Figure 7] 10 is a schematic diagram of a partial structure of another heat-dissipating structure according to an embodiment of the present application; [Figure 8] 10 is a schematic diagram of a partial structure of another heat-dissipating structure according to an embodiment of the present application; [Figure 9] 10 is a schematic diagram of a partial structure of another heat-dissipating structure according to an embodiment of the present application; [Figure 10] 10 is a schematic diagram of a partial structure of another heat-dissipating structure according to an embodiment of the present application; [Figure 11] 10 is a schematic diagram of a partial structure of another heat-dissipating structure according to an embodiment of the present application; [Figure 12] 10 is a schematic diagram of a partial structure of another heat-dissipating structure according to an embodiment of the present application; [Figure 13A] 1 is a schematic diagram of a partial structure of a vehicle-mounted device according to an embodiment of the present application; [Figure 13B] 1 is a schematic diagram of a partial structure of another vehicle-mounted device according to an embodiment of the present application; [Figure 14]1 is a schematic diagram of a partial structure of another vehicle-mounted device according to an embodiment of the present application; [Figure 15A] 1 is a schematic diagram of a partial structure of another vehicle-mounted device according to an embodiment of the present application; [Figure 15B] 1 is a schematic diagram of a partial structure of another vehicle-mounted device according to an embodiment of the present application; [Figure 16] 1 is a schematic diagram of a partial structure of another vehicle-mounted device according to an embodiment of the present application; DETAILED DESCRIPTION OF THE INVENTION

[0059] With the development of computer technology, the functions of electronic devices are becoming more and more intelligent and diversified. Diversified intelligent functions are implemented by computing modules with high computing power (the following uses chips as an example for illustration). As the computing power of chips increases, the power consumption of the chips also increases. High-power-consuming chips generate a large amount of heat during operation, forming hot zones. Hot zones have high temperatures and need to be dissipated in a timely manner.

[0060] Currently, when a chip dissipates heat, a large tolerance exists between the heat sink and the chip, so a thick thermally conductive material (such as gel or thermal pad) needs to be filled between the chip and the heat sink to achieve heat dissipation.

[0061] Note that the formula for calculating thermal resistance is: Thermal resistance = Filling thickness / (Thermal conductivity * Chip coverage area) Formula 1

[0062] The formula for calculating the temperature difference is: Temperature difference = Chip power dissipation * Thermal resistance Equation 2

[0063] For example, if a thermally conductive medium with a thickness of 0.001 m (meter) is filled between the chip and the heat sink, for example, when the thermal conductivity of the thermally conductive medium is 8 W / mk (watts per meter Kelvin) and the effective heat transfer area of ​​the chip is 0.024 m * 0.024 m, the thermal resistance of the thermal gel is 0.217 ° C / W. For example, when the power consumption of the chip is 66 W (watts), the temperature difference generated on the surface of the thermally conductive medium is 14 ° C. The above is just an example where the thickness of the thermally conductive medium is 1 mm (millimeter). In practice, the thermally conductive medium coated between the heat sink and the chip is usually thick.

[0064] Because the thermal conductive material is thick and has a large thermal resistance, the heat dissipation performance may drop sharply when the power consumption of the chip increases, making the chip prone to overheating. Overheating not only damages the chip, but also poses a safety risk, endangering the life and property of users.

[0065] Therefore, an embodiment of the present application provides a heat dissipation structure, a vehicle-mounted device, and a vehicle to improve the heat dissipation efficiency of high-power-consuming components. In this embodiment of the present application, a chip mounting area and a first position are provided on a circuit board. A heat sink is fastened to the circuit board at the first position using a fixed connection structure to prevent the circuit board from sliding. An elastic connection structure in the heat dissipation structure applies an elastic force to the chip mounting area on the circuit board toward the heat sink, thereby reducing the thermal resistance between the chip and the heat sink and improving the heat dissipation efficiency.

[0066] The following specifically describes the heat dissipation structure and the vehicle-mounted device provided in the embodiments of the present application with reference to the accompanying drawings and specific embodiments. It should be noted that in the embodiments of the present application, the heat dissipation of a chip by using a heat dissipation structure is used as an example for explanation. In a specific implementation process, the chip may be replaced with various heat dissipation components. Similarly, the heat dissipation component mounted in the chip mounting area may not only include a chip, but also another heat dissipation component.

[0067] 1 is a schematic diagram of a partial structure of a heat dissipation structure according to an embodiment of the present application. The heat dissipation structure may include a heat sink 101, a circuit board 102, a fixed connecting structure 104, and an elastic connecting structure 103.

[0068] The heat sink 101 is a structure having the functions of heat conduction and heat dissipation, and the heat dissipation method of the heat sink may be air-cooled heat dissipation, liquid-cooled heat dissipation, natural heat dissipation, etc.

[0069] In a possible solution, the heat sink may be a water-cooled heat sink. Pipes may be arranged in the heat sink and filled with a liquid, so that the heat is dissipated to the outside by flowing the liquid. The liquid in the pipes may be water or another coolant.

[0070] In yet another possible solution, the heat sink may be an air-cooled heat sink. For example, a plurality of heat dissipation fins may be disposed on the heat sink, and the plurality of heat dissipation fins may be spaced apart to provide a heat dissipation surface with a large area. After the heat of the heat-radiating component is transferred to the heat sink, the heat is dissipated to the outside through dissipation and convection.

[0071] For targeted heat dissipation on the area where the chip is located, bosses may be arranged on the heat sink 101. The bosses are in thermally conductive connection with the heat-radiating components (e.g., chips) in the chip-mounting area. The bosses are arranged so that heat dissipation can be performed on the chips in a targeted manner, and the heat dissipation efficiency is improved.

[0072] A chip mounting area and a first location are provided on the circuit board 102. A chip (e.g., chip 105 shown in FIG. 1) may be mounted in the chip mounting area. The first location is located outside the chip mounting area. Optionally, there may be one or more chip mounting areas and first locations.

[0073] Optionally, the circuit board 102 may be a printed circuit board (PCB).

[0074] The elastic connecting structure 103 is configured to apply an elastic force to the chip mounting area toward the heat sink 101. The elastic connecting structure applies an elastic force, so that the chip in the chip mounting area can be attached to the heat sink 101 in close contact.

[0075] It should be understood that the elastic connecting structure 103 may absorb tolerances, so that the chip 105 is tightly attached to the heat sink 101 to achieve efficient conduction and heat dissipation of the chip 105.

[0076] For example, the chip 105 has a thickness tolerance, the heat sink 101 has a height tolerance, and the circuit board 102 also has a thickness tolerance. Due to the existence of the tolerances, the distance between the chip 105 and the heat sink 101 is not a fixed value. Figure 2 is a schematic diagram of possible deformations of the circuit board according to an embodiment of the present application. The elastic connecting structure 103 provides an upward elastic force to the chip mounting area, absorbs the tolerance between the chip and the heat sink as much as possible, implements a tight attachment between the chip 105 and the heat sink 101, and achieves efficient conduction and heat dissipation of the chip 105.

[0077] In this embodiment of the present application, the elastic connecting structure 103 generates elastic deformation under external force, and the generated elastic force is related to the amount of deformation. When the distance between the chip 105 and the heat sink 101 is small, the degree of deformation of the elastic connecting structure 103 is small. When the distance between the chip 105 and the heat sink 101 is large, the degree of deformation of the elastic connecting structure 103 is large. In this way, the elastic connecting structure 103 implements floating of the chip 105, so that the chip 105 can be constantly pressed against the heat sink 101, ensuring that the chip 105 and the heat sink 101 can maintain good thermal conduction contact. It should be noted that by appropriately setting the compression amount of the elastic connecting structure 103, the pressure borne by the chip 105 can be ensured to fall within a safe range tolerated by the chip 105, thereby avoiding damage to the chip.

[0078] Under the influence of the elastic connecting structure 103, the chip 105 is closely attached to the heat sink 101, and the gap between the heat sink 101 and the chip 105 may be close to 0. However, in some scenarios, when the chip 105 is directly attached to the heat sink 101, the thermal resistance between the chip 105 and the heat sink 101 is large.

[0079] To improve the heat dissipation efficiency, in a possible solution, a thermally conductive medium (or a thermally conductive layer) is filled between the chip 105 and the heat sink 101, and the thermally conductive medium is used to reduce the thermal contact resistance between the chip 105 and the heat sink 101.

[0080] The thermally conductive medium may include a conductive material such as thermally conductive silicone grease or a thermal pad (e.g., a phase-change thermally conductive film). Thermally conductive silicone grease and phase-change thermally conductive film have low thermal conductivity and can be implemented in a very thin thickness, e.g., 0.3 mm or less, in the process. The thin thickness of the thermally conductive medium provides low thermal resistance between the chip 105 and the heat sink 101 and high heat dissipation efficiency.

[0081] In a possible implementation, the thickness of the thermally conductive medium may be less than 0.2 mm, for example, the thermally conductive medium is an ultra-thin thermal pad having a thickness of 0.2 mm or less. For example, when thermally conductive silicone grease is used as the thermally conductive medium, the thickness of the thermally conductive silicone grease reaches 0.1 mm.

[0082] Optionally, there are multiple possible cases of the positional relationship between the elastic member in the elastic connecting structure and the circuit board. For example, the elastic connecting structure may be positioned on the side of the circuit board away from the heat sink. When the elastic connecting structure 103 is in a compressed state, an upward pressure (also called a pressing force) is applied to the circuit board 102, thereby causing the chip in the circuit board to be closely attached to the heat sink 101. Alternatively, the elastic connecting structure may be positioned on the side of the circuit board closer to the heat sink. When the elastic connecting structure 103 is in an extended state, an upward pulling force is applied to the circuit board 102, thereby causing the chip in the circuit board to be closely attached to the heat sink 101.

[0083] The fixed connection structure 104 is positioned at a first position and fastens the circuit board 102 to the heat sink 101. For example, the fixed connection structure 104 may be a fastening screw (e.g., a threaded screw). To achieve heat dissipation of the heat-radiating components, the circuit board 102 and the heat sink 101 are arranged opposite each other, with the side of the circuit board where the chip mounting area is located facing the heat sink.

[0084] Because the force applied by the elastic connection structure 103 is perpendicular to the circuit board, the heat dissipation device may slide horizontally under external force. Horizontal sliding may result in poor electrical connection, damage to chip pins, etc. FIG. 3 is a schematic diagram of a possible usage scenario of a heat dissipation structure according to an embodiment of the present application. The heat dissipation device is used in a vehicle to dissipate heat from a chip mounted on the vehicle. The vehicle vibrates while moving. For example, the vehicle may bump when passing through an obstacle. The elastic connection structure 103 may generate large elastic deformation when the vehicle bumps. The elastic deformation needs to be recovered within a certain period of time. Therefore, there is a gap between the elastic connection structure 103 and the circuit board 102, which causes the circuit board 102 to slide horizontally. If the circuit board slides horizontally, the electrical connection between the circuit board and another device may fail. Furthermore, because frictional forces exist between the chip 105 and the heat sink 101, the chip pins may be damaged by friction.

[0085] However, in this embodiment of the present application, the fixed connection structure 104 may firmly fasten the circuit board 102 and the heat sink 101 to achieve horizontal positioning of the circuit board 102 (the horizontal direction in this specification refers to the horizontal direction on the plane on which the circuit board 102 is positioned). Even if the elastic connection structure 103 is affected by vibration and floats up and down, the fixed connection structure 104 may also fasten the circuit board 102 to prevent the circuit board 102 from sliding together, improving stability and avoiding threats to the safety of the user's personal and property. Furthermore, without the fixed connection structure 104, when a gap occurs between the elastic connection structure 103 and the circuit board 102 during the vibration process, a gap may also exist between the chip and the heat sink, resulting in an ideal heat dissipation effect being unable to be achieved. In other words, when the elastic connection structure floats, the fixed connection structure 104 can control the spacing between the chip and the heat sink and maintain a thermally conductive connection between the chip and the heat sink, thereby enabling the heat dissipation device to provide stable heat dissipation.

[0086] In conclusion, in the embodiments of the present application, the temperature of the chip can be effectively reduced while the overall structure remains stable, the risk of overheating of the chip can be reduced, and safety can be improved.

[0087] For example, a thermally conductive silicone grease having a thickness of 0.00001 m (i.e., 0.1 mm) is used as the thermally conductive medium. The thermal conductivity of the thermally conductive silicone grease is about 6 W / mK, and the chip coverage area remains 0.024 m * 0.024 m. The chip filling thickness, thermal conductivity, and coverage area are substituted into the above-mentioned Equation 1 to obtain the thermal resistance of the thermally conductive silicone grease as 0.029 ° C / W.

[0088] For a chip with a power consumption of 66W, the power consumption of the chip and the thermal resistance of the thermal conductive silicone grease are substituted into Equation 2 to obtain a temperature difference of 1.9°C between the top and bottom surfaces of the thermal conductive silicone grease. Therefore, the heat dissipation efficiency is high and the temperature of the chip can be effectively reduced.

[0089] When a heat conducting medium with a thermal conductivity of 8 W / mk is used, the temperature difference generated by the heat conducting medium is about 1.4°C, which is reduced by about 12°C compared to the temperature difference of 14°C in the related art mentioned above, and the heat dissipation effect is very obvious.

[0090] In this embodiment of the present application, there may be one or more elastic connection structures 103. When multiple elastic connection structures are arranged, the multiple elastic connection structures can improve the overall service life of the elastic connection structures. Furthermore, the multiple elastic connection structures can evenly distribute the elastic force around the chip mounting area, thereby improving the flatness of the chip mounting area. This can improve the reliability of the connection between the chip and the circuit board and further ensure the consistency and balance of the elastic top retention force applied between the chip and the heat sink.

[0091] Similarly, there may be one or more fixed connection structures 104. When multiple fixed connection structures are arranged, the multiple fixed connection structures may provide a uniform and reliable fixed connection to the circuit board, and the overall service life of the fixed connection structures may be improved.

[0092] Based on the embodiment shown in Figure 1, the following describes some possible designs of the embodiments of the present application. It should be noted that the following multiple designs may be implemented separately or may be combined for implementation. The case where multiple designs are combined for implementation will not be described again in the embodiments of the present application.

[0093] [Design 1] In the heat dissipation structure provided in this embodiment of the present application, there may be one or more chip mounting areas and / or first locations on the circuit board.

[0094] Because the elastic connecting structure 103 and the fixed connecting structure 104 have different functions on the circuit board, in some possible implementations, there is a gap between the chip mounting area and the first position. In other words, the gap between the elastic connecting structure 103 and the fixed connecting structure is implemented indirectly. In this case, the chip mounting area on the circuit board is prone to deformation, thereby improving the heat dissipation effect and extending the life of the elastic connecting structure.

[0095] To facilitate understanding of the relationship between the chip mounting area and the first position, the following lists three possible cases.

[0096] Case 1: The chip mounting area is located in the central area of ​​the circuit board, and the first locations are located on the edges of the circuit board. FIG. 4 is a schematic diagram of possible chip mounting areas and first locations according to one embodiment of the present application. The chip mounting area 1021 is close to the geometric center on the plane of the circuit board 102. There are four first locations: location 1022a, location 1022b, location 1022c, and location 1022d. These locations are closer to the edges of the circuit board than the geometric center. Note that there may be multiple possible cases where the chip mounting area is located near the edges. This is not strictly limited in the present application. For example, the multiple first locations shown in FIG. 4(a) are provided at multiple corners of the circuit board. In another example, the multiple first locations shown in FIG. 4(b) are provided near the midpoints of multiple edges of the circuit board. In another example, the design of the first locations may be further related to the circuits and electronic elements on the circuit board (e.g., the first locations are close to the electronic elements).

[0097] Case 2: The chip mounting area is located on one side of the circuit board, and the first position is located on another side of the circuit board. FIG. 5A is a schematic diagram of another possible chip mounting area and first position according to an embodiment of the present application. FIG. 5B is a schematic diagram of a partial structure of another heat dissipation structure according to an embodiment of the present application. For example, the first position includes four positions (these are position 1022a, position 1022b, and position 1022c). The chip mounting area 1021 and the first position are respectively located on two sides of the circuit board, and there is a certain interval between the chip mounting area 1021 and the first position. The fixed connecting structure 104 is located at the first position and fastens the circuit board 102 to the heat sink 101. The elastic connecting structure 103 applies an elastic force to the chip mounting area toward the heat sink 101.

[0098] Case 3: There are multiple chip mounting areas, and the first position includes a position located between the multiple chip mounting areas. FIG. 6A is a schematic diagram of yet another possible chip mounting area and first position according to an embodiment of the present application. FIG. 6B is a schematic diagram of a partial structure of yet another heat dissipation structure according to an embodiment of the present application. For example, the first position includes six positions (position 1022a, position 1022b, position 1022c, position 1022d, position 1022e, and position 1022f), and there are two chip mounting areas, 1021a and 1021b. The elastic connecting structure 103 is adjacent to the chip mounting area and applies an elastic force toward the heat sink 101 for each chip mounting area. The fixed connecting structure 104 is disposed at the first position and fastens the circuit board 102 to the heat sink 101.

[0099] The fixed connection structure 104 is disposed in the middle of the plurality of chip mounting areas, which can reduce the floating amplitude of the circuit board 102, can avoid excessive deformation in the chip mounting areas, and can extend the life of the circuit board.

[0100] It should be noted that the above cases may be combined with each other in cases where the cases are not mutually exclusive, and details regarding the combined cases will not be described herein.

[0101] [Design 2] The elastic connecting structure 103 may include a spring screw, an elastic body, an elastic body, etc. The location of the elastic connecting structure is not strictly limited in the present application. For example, the elastic connecting structure 103 may be arranged around the chip mounting area of ​​the circuit board. Here, the elastic connecting structure 103 may be arranged around the chip mounting area of ​​the circuit board, which means that the elastic connecting structure 103 is positioned at the edge of the chip mounting area. In another example, the distance between the elastic connecting structure 103 and the center of the chip mounting area is smaller than the distance between the fixed connecting structure 104 and the center of the chip mounting area. For example, the elastic connecting structure 103 may alternatively be arranged in an area of ​​the circuit board that corresponds to the extent of the chip mounting area and is away from the heat sink.

[0102] In some scenarios, the location of the elastic connecting structures 103 is related to the structure of the elastic connecting structures 103. For example, when the elastic connecting structures 103 need to penetrate the circuit board or are positioned on the side of the circuit board closer to the heat sink, the elastic connecting structures are distributed around the chip mounting area and spaced apart from the chip mounting area (to avoid damaging the circuitry in the chip mounting area). When the elastic connecting structures are positioned on the side of the circuit board away from the heat sink, the elastic connecting structures 103 may be disposed in an area on the circuit board corresponding to the extent of the chip mounting area.

[0103] 7 is a schematic diagram of a partial structure of a possible heat dissipation structure according to an embodiment of the present application. The elastic connecting structure 103 includes a fastener 1031 and an elastic member 1032. The circuit board is provided with a through-hole, and the fastener 1031 passes through the through-hole and is fastened to the heat sink 101. The elastic member 1032 is sleeved on the fastener 1031 and elastically connects the fastener 1031 to the circuit board 102.

[0104] The fastener 1031 is fastened to the heat sink 101 through a through-hole in the circuit board 102, and the elastic member 1032 with a sleeve attached to the fastener 1031 can be fastened in a horizontal direction (also called a direction parallel to the circuit board). Therefore, the deformation of the elastic member 1032 is mostly in a vertical direction (also called a direction perpendicular to the circuit board 102), thereby stabilizing the direction of the elastic force exerted by the elastic member 1032. In other words, through fastening of the fastener, the elastic member can stably exert an elastic force toward the heat sink for the circuit board. According to the solution provided in the above-described implementation, the chip positioned in the chip mounting area is more stably attached to the heat sink, thereby improving heat dissipation efficiency.

[0105] To further stabilize the elastic member 1032, in a possible solution, the end of the elastic member 1032 remote from the circuit board 102 may be fixed to the fastener 1031. Of course, the elastic member 1032 may alternatively not be fastened to a fastener. For example, the fastener 1031 may have a protrusion at the end remote from the circuit board 102, and the end of the elastic member 1032 remote from the circuit board 102 may press against the protrusion of the fastener 1031 to prevent the elastic member 1032 from slipping off the fastener.

[0106] It should be understood that there is a space between the wall of the through-hole in the circuit board and the fastener because the chip mounting area of ​​the circuit board floats up and down via the elastic member 1032. For example, when the cross section of the fastener and the cross section of the through-hole are cylindrical, the outer diameter of the portion of the fastener that is positioned within the through-hole is smaller than the inner diameter of the through-hole.

[0107] Optionally, in the embodiment shown in FIG. 7, the elastic connecting structure 103 may be a spring screw. In this case, the fastener is a screw and the elastic member is a spring. One end of the spring faces the circuit board, and the other end of the spring presses against the protrusion of the screw. The spring is in a compressed state and applies an elastic force toward the heat sink 101 for the chip mounting area.

[0108] [Design 3] The elastic connecting structure 103 may include an elastic body. An elastic body refers to a material that can be deformed when subjected to an external force and can be restored to its original state and size after the external force is removed. For example, an elastic body is a spring or polymer material that can be greatly deformed under a small stress and can quickly recover to its original state and size after the stress is released. Optionally, there may be one or more elastic bodies.

[0109] FIG. 8 is a schematic diagram of a partial structure of yet another possible heat dissipation structure according to an embodiment of the present application. The elastic connecting structure 103 includes elastic bodies 1033, and the number of the elastic bodies 1033 is two (this is just an example). The elastic bodies 1033 elastically connect the circuit board 102 to the support 106. In other words, one end of the elastic body 1033 faces the circuit board 102, and the other end of the elastic body 1033 presses against the support 106. The distance between the circuit board 102 and the support 106 is smaller than the length of the elastic body in its natural state. In other words, the elastic body is in a compressed state and can apply a "pressing force" to the circuit board 102. Correspondingly, the chip mounting area on the circuit board is "pressed" against the heat sink, so that the chip located in the chip mounting area is stably attached to the heat sink. This improves heat dissipation efficiency.

[0110] Optionally, the support 106 may be a housing or a partial housing of the heat dissipation structure. The housing surrounds the heat sink 101 and the circuit board 102 to form an accommodation space, and the heat sink 101 and the circuit board 102 are positioned within the accommodation space. Optionally, the housing includes an upper housing and a lower housing (also called a bottom housing), and the support may specifically be the lower housing of the heat sink structure.

[0111] The above examples have been described using examples in which the support is positioned on the side of the circuit board 102 away from the heat sink 101. In certain implementation processes, the support may be positioned on the side of the circuit board closer to the heat sink.

[0112] 9 is a schematic diagram of a partial structure of yet another possible heat dissipation structure according to an embodiment of the present application. A fixing boss 106b protrudes from the side wall of the housing 106a, and the fixing boss 106b is disposed on the side of the circuit board closer to the heat sink. One end of an elastic body 1033 is fastened to the fixing boss 106b, and the other end of the elastic body 1033 is connected to the circuit board 102. The length of the elastic body 1033 in its natural state is shorter than the distance between the circuit board 102 and the fixing boss 106b. In this way, the elastic body 1033 is in an elongated state, exerting a pulling force on the chip mounting area of ​​the circuit board 102 toward the heat sink 101, thereby allowing the chip 105 to be closely attached to the heat sink 101.

[0113] In some possible cases, the function of the support 106 may be performed by using the heat sink 101. In this way, part of the heat dissipation structure is simplified and the manufacturing costs are reduced.

[0114] 10 is a schematic diagram of yet another heat dissipation structure according to an embodiment of the present application. One end of an elastic body 1033 is fastened to the heat sink 101, and the other end of the elastic body 1033 is connected to the circuit board 102. The length of the elastic body 1033 in its natural state is smaller than the distance between the circuit board 102 and the heat sink 101. In this way, the elastic body 1033 is in an elongated state, and applies a pulling force to the chip mounting area of ​​the circuit board 102 toward the heat sink 101, so that the chip 105 can be closely attached to the heat sink 101.

[0115] It should be noted that the elastic body may be fastened horizontally by using fastening screws, fastening hooks, fastening grooves, welding, adhesives, and the like.

[0116] For example, as shown in Fig. 8, the elastic body may be fastened by using a groove provided in the support. In this implementation, there is no need to provide a through hole in the circuit board, which reduces the complexity of the design of the circuit on the circuit board.

[0117] [Design 4] In some possible designs, the heat dissipation structure further includes a main board, which is electrically connected to the circuit board 102. The main board, also called a main circuit board, system board, or motherboard, is the basic circuit board in a device (or controller). Each of the circuit board 102 and the main board may be a printed circuit board (PCB).

[0118] Generally, when the heat dissipation structure includes both a main board and a circuit board, the area of ​​the main board is larger than the area of ​​the circuit board 102. Of course, in some scenarios, due to a simplified design of the main board, the area of ​​the main board may alternatively be smaller than the area of ​​the circuit board 102. When the heat dissipation structure includes both a main board and a circuit board 102, the circuit board 102 may alternatively be referred to as a transfer circuit board or an extension circuit board.

[0119] The electrical connection between the main board and the circuit board 102 may be implemented by using a connector. The connector may include a board-to-board (BTB) connector, a flexible circuit board, a flexible connector, a cable, etc. This configuration meets different customer requirements for different types of chips and is highly applicable. Furthermore, when the performance of the chip needs to be upgraded, only the chip 105 and the circuit board 102 need to be replaced. Therefore, the evolution capability is strong and the upgrade and replacement costs are low. Furthermore, the above implementation can further meet the requirement for adding or removing chips, thereby improving the flexibility of the components.

[0120] 11 is a schematic diagram of a partial structure of yet another possible heat dissipation structure according to an embodiment of the present application. A main board 107 is connected to a circuit board 102 by using a connector 108, one end of the connector 108 is connected to the circuit board 102, and the other end of the connector 108 is connected to the main board 107. This configuration can meet user requirements for different types of chips and is highly applicable. When a chip is replaced, only the chip 105 and the circuit board 102 need to be replaced.

[0121] 11 can meet the requirements for adding or removing chips, thereby improving component flexibility. For example, a vehicle-mounted chip is used. When a chip needs to be installed in a specific type of vehicle, only the circuit boards 102 need to be connected to the main board 107, thereby implementing convenient control of computing power.

[0122] In some scenarios, the connector may be a flexible conductive member, such as the aforementioned flexible circuit board, flexible connector, or cable. The flexible conductive member may implement the signal interconnection between the circuit board 102 and the main board 107, and the flexible characteristics of the flexible conductive member can ensure the reliability of the electrical connection when the circuit board floats up and down.

[0123] Since the connector is required to implement the electrical connection between the circuit board and the main board to improve the signal connection stability, the connector may be located in a position close to the fixed connection structure.

[0124] In a possible implementation, the distance between the connector and the first fixed connection structure is smaller than the distance between the connector and any elastic connection structure, and the first fixed connection structure in this specification belongs to at least one fixed connection structure.

[0125] [Design 5] Multiple electronic components may be disposed on a circuit board, or a circuit board may be connected to multiple electronic components. Different electronic components may withstand different stresses. Stress includes, but is not limited to, internal forces in a unit cross-sectional area of ​​an object caused by factors such as external forces, non-uniform temperature fields, and permanent deformation of the object. Stress is sometimes used to describe the structural strength of electronic components.

[0126] For example, for electronic components connected to a circuit board, if the circuit board 102 floats in any area, a large stress will be generated in the floating process, which will affect the electronic components in that area, and if the stress exceeds the stress that the electronic components can withstand, it may cause failure or damage to the electronic components.

[0127] In this embodiment of the present application, the stress-sensitive components are located close to the fixed connection structure, for example, the stress-sensitive components include BTB connectors, crystal oscillators, ceramic capacitors, microphone components, or electronic elements packaged by using ball grid array (BGA) packaging technology.

[0128] Since the fixed connection structure implements a fixed connection, in a vibration scenario, the deformation of the circuit board around the fixed connection structure 104 is small. The stress-sensitive components are located in a position close to the fixed connection structure 104 to prevent the circuit board 102 from deforming due to the elastic force provided by the elastic connection structure 103, and to prevent the stress-sensitive components connected to the circuit board 102 from being damaged or poorly connected.

[0129] The following lists some possible implementations in which the stress-sensitive component is located near the fixed connection structure.

[0130] Implementation 1: The distance between the stress-sensitive component and the first fixed connection structure is smaller than the distance between the stress-sensitive component and any elastic fastening structure, and the first fixed connection structure is one of the at least one fixed connection structure, i.e., the stress-sensitive component is close to the fixed connection structure.

[0131] Implementation 2: The distance between the stress-sensitive component and the fixed connecting structure is less than or equal to N millimeters (mm), where N is a positive number. For example, N is 10 mm, 30 mm, 50 mm, or 100 mm. Optionally, N is related to the stiffness of the circuit board and / or the strength of the fixed connecting structure.

[0132] Implementation 3: The distance between the stress-sensitive component and the elastic connecting structure is greater than or equal to M millimeters (mm), where M is a positive number. For example, M is 5 mm, 10 mm, or 50 mm. In this way, it is equivalent to providing a component-free area around the elastic connecting structure, so that the stress-sensitive component maintains a certain secure distance from the elastic connecting structure 103. Optionally, N is related to the stiffness of the circuit board and / or the strength of the fixed connecting structure.

[0133] It should be noted that the stress-sensitive components listed above are merely examples. In a specific implementation process, the determination of a stress-sensitive component is related to the stress sensitivity of the electronic element or the tolerable deformation of the electronic element (the more sensitive the electronic device is to stress, the smaller the tolerable deformation of the electronic element). Alternatively, whether an electronic element belongs to the stress-sensitive component is determined by using a predefined and preconfigured decision rule. Alternatively, a stress measuring device may be used to determine the tolerable stress of the electronic element. When the tolerable stress is less than or equal to a threshold value, the electronic element belongs to the stress-sensitive component.

[0134] In yet another possible solution, the deformation range of each position on the circuit board is related to the elastic connecting structure and the fixed connecting structure on the circuit board, the closer to the position of the fixed connecting structure, the lower the upper limit of the deformation amount, and the closer to the position of the elastic connecting structure, the higher the upper limit of the deformation amount.

[0135] Therefore, when the positions of the electronic elements are designed, the deformation range of each position on the circuit board and the allowable deformation amount of the electronic element may be designed. When the allowable deformation amount of the electronic element is smaller than the maximum deformation amount of the circuit board at position A, the electronic element is a stress-sensitive component for position A, and the electronic device cannot be placed at position A. When the allowable deformation amount of the electronic element is larger than the maximum deformation amount of the circuit board at position B, the electronic device can be placed at position B.

[0136] In yet another possible solution, the stresses at different locations on the circuit board can be determined by simulation tests or simulation tests, in which case the placement of electronic components on the circuit board may be determined based on the allowable stress of the electronic components and the stress distribution on the circuit board.

[0137] [Design 6] To improve the balance of the elastic force, the heat dissipation device may further include a support, which is configured to withstand the elastic force provided by the elastic connecting structure 103 .

[0138] 12 is a schematic diagram of a partial structure of yet another possible heat dissipation structure according to an embodiment of the present application. The support 109 is fastened to the circuit board 102. The elastic force of the elastic connecting structure 103 acts on the support 109 and is applied to the circuit board 102 through the support 109.

[0139] The support 109 can improve the rigidity of the chip mounting area. The elastic force of the elastic connecting structure 103 is applied to the chip mounting area by using the support 109, so that the overall shape of the chip mounting area can be ensured, the flatness of the chip mounting area is not affected, the reliability of the connection between the chip 105 and the circuit board 102 can be ensured, and the consistency and balance of the elastic top holding force applied between the chip 105 and the heat sink 101 can be ensured.

[0140] Optionally, the support may be rectangular, square, frame-type, etc.

[0141] For example, the support 109 may be a frame-type support, which is enclosed to form a plane. The elastic force of the elastic connection structure 103 acts on the support 109 and is uniformly applied to the circuit board 102. This prevents the force applied by the elastic connection structure from directly acting on the circuit board and damaging it. The support 109 is particularly applicable to mobile terminals or wearable terminals. In a vibration scenario, the support 109 can effectively increase the stress area of ​​the circuit board and ensure consistency and balance of the elastic top retention force applied between the chip 105 and the heat sink 101. Furthermore, the hollow portion of the frame-type support can be used to place protrusions or electronic elements with a specific height, thereby increasing the usable area of ​​the circuit board.

[0142] Optionally, the support may be fastened to the circuit board. Optionally, the support may be fastened by using elastic connecting structures 103. Alternatively, optionally, the support may be fastened by using fastening screws, fastening connectors, etc.

[0143] In a possible implementation, when the elastic connecting structure 103 includes a fastener 1031, such as shown in the embodiment of FIG. 7, the fastener may alternatively be configured to fasten the support to the circuit board.

[0144] Of course, if the resilient connecting structure does not include a fastener, a separate connector may alternatively be used to fasten the support to the circuit board.

[0145] The embodiments shown in Figures 1 to 12 include many possible implementation solutions. The following describes some of the implementation solutions by using examples with reference to Figures 13A, 13B, 14, 15A, 15B, and 16. Please note that for related concepts, connections, and functional effects not described below, please refer to the corresponding descriptions of the preceding embodiments.

[0146] The heat dissipation structure in the embodiments of the present application may be used in a variety of devices that require heat dissipation. For example, the heat dissipation structure may be used in devices such as intelligent terminal devices, network devices, equipment room devices, industrial devices, transportation devices, or recreational and entertainment devices. Examples of intelligent terminal devices include mobile phones, tablet computers, notebook computers, smart bands, smart watches, and smart glasses. Examples of network devices include metro routers, central routers, and base stations. Examples of equipment room devices include data center servers and data center switches. Examples of industrial devices include industrial robots and robot arms. Examples of transportation devices include vehicles, ships, aircraft, rail transport (e.g., subways or high-speed rail), and logistics robots. Examples of recreational and entertainment devices include virtual reality (VR) devices, mixed reality (MR) devices, massage chairs, and 4D cinema cockpits. This is not strictly limited to the embodiments of the present application.

[0147] The following uses a heat dissipation structure used in a vehicle as an example for illustration.

[0148] An embodiment of the present application further provides a vehicle-mounted device including a chip and the heat dissipation structure provided in the previous embodiment. The heat dissipation structure includes a heat sink 101, a circuit board 102, an elastic connecting structure 103, and a fixed connecting structure 104. The chip is disposed in the chip mounting area of ​​the circuit board 102. The heat dissipation structure is configured to provide stable heat dissipation for the chip in the vehicle-mounted device.

[0149] Specifically, the elastic connection structure 103 of the heat sink may provide an elastic force to the chip mounting area toward the heat sink 101 to maintain a thermally conductive connection between the chip and the heat sink in the heat dissipation structure. The fixed connection structure 104 can fasten the circuit board on which the chip is located, thereby improving the stability of the vehicle-mounted device and implementing heat dissipation of the chip.

[0150] The aforementioned on-board device may be, for example, an intelligent driving calculation module, a cockpit domain controller, a vehicle domain controller (VDC), a vehicle integrated unit, or a power module. The on-board device may be mounted in locations such as the engine compartment, the cockpit, the driver's glove compartment, or the front end of an electric vehicle. These locations have high ambient temperatures and poor heat dissipation environments. With the development of intelligent vehicles, the power consumption of on-board chips continues to increase, increasing the demand for heat dissipation efficiency. Furthermore, bumps are often generated during the vehicle driving process, which often causes vibrations in on-board devices. In this case, the structure of the on-board device must be stable. In short, the on-board device requires a heat dissipation structure with a stable structure and high heat dissipation efficiency.

[0151] For example, the on-board device is an intelligent driving module. Intelligent driving in this specification may refer to assisted driving, unmanned driving, etc. For example, an advanced driving assistance system (ADAS) is an assisted driving system. ADAS may use various sensing devices (e.g., cameras, camera lenses, and vision system sensors such as radar system sensors) installed in a vehicle to sense the surrounding environment, detect and recognize objects (including pedestrians), etc. ADAS performs systematic calculations and analyses of the driving environment based on map data, etc., and plans driving paths and driving operations. It may be known that ADAS performs calculations and analyses on large amounts of data and needs to output large amounts of calculation data and / or control signals. If an intelligent driving chip is at risk of overheating, the lives of passengers may be highly endangered. Therefore, stable and efficient heat dissipation is required for the intelligent driving chip.

[0152] 13A and 13B are schematic diagrams of a partial structure of a vehicle-mounted device according to an embodiment of the present application. As shown in Fig. 13A and 13B, the vehicle-mounted device includes a chip 105, a heat sink 101, a circuit board 102, an elastic connecting structure 103, a fixed connecting structure 104, a main board 107, a connector 108, a support 109, and a heat conduction medium.

[0153] The fixed connection structure 104 fastens the circuit board 102 to the heat sink 101, preventing the circuit board 102 from sliding horizontally. Pressure applied to the elastic connection structure 103 acts on the support 109, thereby bringing the chip 105, the heat conductive medium, and the heat dissipation bosses 1011 of the heat sink 101 into close contact. Assembly tolerances between the chip 105 and the heat sink 101 are absorbed by deformation of the chip mounting area of ​​the circuit board 102. During operation, heat generated by the chip 105 is transferred to the heat sink 101 using the heat conductive medium, and the heat is removed using a coolant flowing inside the heat sink 101.

[0154] The heat dissipation structure used in vehicle-mounted devices significantly reduces the thermal resistance between the chip and the heat sink, effectively improving heat dissipation efficiency, and by using fastening screws, improves the structural stability of the vehicle-mounted device, thereby achieving stable heat dissipation for high-power-consuming chips.

[0155] It should be understood that the liquid-cooled heat dissipation method is only one example in the vehicle-mounted device shown in Figures 13A and 13B, and heat sinks using other heat dissipation methods may also be used.

[0156] In a possible solution, the fixed connection structure 104 may be replaced with a fastening screw, the elastic connection structure 103 may be replaced with a spring screw, the connector 108 may be replaced with a BTB connector, and the support 109 is a frame-type support.

[0157] Optionally, signal interconnections (also called electrical connections) are implemented between the main board and the circuit board by using BTB connectors, which are located in close proximity to the fixed connection structures 104 to reduce the possibility of failure of the BTB connectors caused by misalignment.

[0158] Optionally, the stress-sensitive components are located in an area close to the fastening screws to avoid damage to the stress-sensitive components, extend the life of the vehicle-mounted device, and meet reliability requirements.

[0159] Optionally, the main board may be fastened to a heat sink, thereby improving the stability of the whole structure.

[0160] Optionally, the vehicle-mounted device further includes a bottom housing 110. The bottom housing 110 is disposed on a side of the main board 107 away from the circuit board 102. The bottom housing 110 is disposed to meet the dustproof and waterproof design requirements, and can further fasten the main board, thereby improving the stability of the main board and the entire vehicle-mounted device.

[0161] Optionally, the heat sink and bottom housing of the vehicle mounting structure are sealed and connected to form an integrated plate shape.

[0162] Optionally, there may be multiple chips, and the multiple chips may be mounted on chip mounting areas on multiple circuit boards, with one or more chips mounted on each circuit board.

[0163] The assembly process for the vehicle-mounted device is as follows: first, a heat-conducting medium is installed on the heat-dissipating boss 1011, and then the circuit board 102 is assembled to the heat sink 101. When the components on the circuit board 102 are installed, the fixed connection structure 104 is first installed around the periphery of the circuit board 102. Second, the elastic connection structure 103 and the support 109 are integrally installed on the circuit board 102, and the elastic connection structure 103 is fastened so that the support 109 can be fastened to the circuit board 102. The pressure applied by the elastic connection structure 103 allows the chip 105, the heat-dissipating medium, and the heat-dissipating boss 1011 to be in close contact. The assembly tolerance between the chip 105 and the heat sink 101 is absorbed through deformation of the central region of the circuit board 102. Next, the main board 107 is installed on the heat sink 101, and the main board 107 and the heat sink 101 are in signal and electrical connection via the connector 108. Finally, the bottom housing 110 is installed.

[0164] 14 is a schematic diagram of yet another possible partial structure of a vehicle-mounted device according to an embodiment of the present application. The vehicle-mounted device includes a heat sink 101, a circuit board 102, an elastic connecting structure 103, a fixed connecting structure 104, a chip 105, and a main board 107. In the vehicle-mounted device shown in FIG. 14, there are two heat dissipation structures. The circuit boards in the two heat dissipation structures are electrically connected to the main board. Each circuit board is connected to the main board 107 by using a connector 108.

[0165] In a possible solution, the vehicle-mounted device further includes a support 109, which is disposed on a part or all of the circuit board to provide a balanced elastic force to the chip mounting area in the circuit board. For related explanations, please refer to the above description. The details will not be repeated here.

[0166] In a possible solution, a heat dissipation boss 1011 is disposed on the heat sink 101. The elastic connecting structure 103 provides elastic force to the chip mounting area to implement a tight attachment between the chip 105, the heat conducting medium and the heat dissipation boss 1011, thereby specifically dissipating the heat of the chip and improving the heat dissipation efficiency.

[0167] In a possible solution, a fixing boss 1012 is disposed on the side wall of the heat sink 101, and the main board 107 in the vehicle-mounted device is fastened to the fixing boss 1012. For example, the main board 107 is fastened to the fixing boss 1012 by using a fastening member 111.

[0168] In a possible solution, the heat dissipation device further includes a bottom housing 110. Note that the bottom housing 110 specifically refers to the housing (or part of the housing) on ​​the side of the circuit board that is away from the heat sink.

[0169] Optionally, the bottom housing 110 may be attached to the heat sink 101 to meet dustproof and waterproof design requirements and improve the stability of the vehicle-mounted device. Optionally, the attachment herein may be in the form of adhesion, engagement, or fastening by using a connector.

[0170] The above describes the heat dissipation structure in which the circuit board is connected to the main board. The following describes the case in which the circuit board 102 is the main board.

[0171] 15A and 15B are schematic diagrams of a partial structure of another vehicle-mounted device according to an embodiment of the present application. As shown in Fig. 15A and 15B, the vehicle-mounted device includes a chip 105, a heat sink 101, a circuit board 102, an elastic connecting structure 103, a fixed connecting structure 104, a support 109, and a heat conduction medium.

[0172] The fixed connection structure 104 fastens the circuit board 102 to the heat sink 101, preventing the circuit board 102 from sliding horizontally. The pressure provided by the spring screw acts on the support, so that the chip 105, the heat conductive medium, and the heat dissipation bosses 1011 of the heat sink 101 are in close contact. Assembly tolerances between the chip 105 and the heat sink 101 are absorbed by deformation of the chip mounting area of ​​the circuit board 102. During operation, heat generated by the chip 105 is transferred to the heat sink 101 using the heat conductive medium, and the heat is removed using the coolant flowing inside the heat sink 101.

[0173] The heat dissipation structure used in the vehicle-mounted device significantly reduces the thermal resistance between the chip and the heat sink, effectively improving the heat dissipation efficiency, and by using the fixed connection structure 104, improves the structural stability of the vehicle-mounted device and achieves stable heat dissipation for the high-power consumption chip.

[0174] It should be understood that the liquid-cooled heat dissipation method is only one example in the vehicle-mounted device shown in Figures 15A and 15B, and heat sinks using other heat dissipation methods may also be used.

[0175] Optionally, the stress-sensitive components are located in an area close to the fixed connection structure 104 to avoid damage to the stress-sensitive components, extend the life of the vehicle-mounted device, and meet reliability requirements.

[0176] Optionally, the vehicle-mounted device further includes a bottom housing 110. The bottom housing 110 is disposed on a side of the circuit board 102 away from the heat sink 101. The bottom housing is disposed so that dustproof and waterproof design requirements can be met and the stability of the vehicle-mounted device is improved.

[0177] The assembly process for the vehicle-mounted device is as follows: first, the heat-conducting medium is installed on the heat-dissipating boss 1011, and the circuit board 102 may be attached to the heat sink 101 using the fixed connecting structure 104. Next, the support 109 and the elastic connecting structure 103 are installed on the circuit board 102 and the heat sink 101 to fasten the elastic connecting structure 103. The pressure applied by the elastic connecting structure 103 allows the chip 105, the heat-dissipating medium, and the heat-dissipating boss 1011 to be in close contact. The assembly tolerance between the chip 105 and the heat sink 101 is absorbed through deformation of the central region of the circuit board 102. Finally, the bottom housing 110 is installed.

[0178] The above describes an elastic connection structure including a spring screw. The following describes a vehicle-mounted device that uses an elastic body as an elastic connection structure.

[0179] 16 is a schematic diagram of a partial structure of yet another vehicle-mounted device according to an embodiment of the present application. As shown in FIG. 16, the vehicle-mounted device includes a chip 105, a heat sink 101, a circuit board 102, an elastic body 1033, a fixed connection structure 104, a support 109, a bottom housing 110, and a heat conduction medium.

[0180] The fixed connection structure 104 fastens the circuit board 102 to the heat sink 101 to prevent the circuit board 102 from sliding horizontally. The elastic body 1033 may be pre-installed on the bottom housing 110 or installed on the support 109. The pressure applied by the elastic body 1033 acts on the support 109, thereby bringing the chip 105, the heat conductive medium, and the heat dissipation boss 1011 into close contact. Assembly tolerances between the chip 105 and the heat sink 101 are absorbed by deformation of the chip mounting area of ​​the circuit board 102. During operation, heat generated by the chip 105 is transferred to the heat sink 101 using the heat conductive medium, and the heat is removed using a coolant flowing inside the heat sink 101.

[0181] The heat dissipation structure used in vehicle-mounted devices significantly reduces the thermal resistance between the chip and the heat sink, effectively improving heat dissipation efficiency. The use of fastening screws improves the structural stability of the vehicle-mounted device, ensuring stable heat dissipation for high-power chips. In this implementation, the bottom housing not only provides space but also supports the elastic body. The elastic connection structure arranged in this way does not need to be bumped against the circuit board, thereby reducing the complexity of the circuit design on the circuit board.

[0182] It should be understood that the liquid-cooled heat dissipation method is only one example in the vehicle-mounted device shown in Figure 16. Heat sinks using other heat dissipation methods may also be used.

[0183] Optionally, the stress-sensitive components are located in an area close to the fixed connection structure 104 to avoid damage to the stress-sensitive components, extend the life of the vehicle-mounted device, and meet reliability requirements.

[0184] Optionally, the vehicle-mounted device further includes a bottom housing 110. The bottom housing 110 is disposed on a side of the circuit board 102 away from the heat sink 101. The bottom housing is disposed so that dustproof and waterproof design requirements can be met and the stability of the vehicle-mounted device is improved.

[0185] An embodiment of the present application further provides a terminal, which includes the above-mentioned heat-dissipating structure or the vehicle-mounted device.

[0186] Optionally, the terminal may be a mobile terminal (eg, a vehicle), a handheld terminal, a wearable device, a transportation tool, a recreational entertainment device, or another intelligent device or transportation tool.

[0187] It should be noted that the above embodiments are only used to describe the technical solutions of the embodiments of the present application, and do not limit the technical solutions. Although the embodiments of the present application have been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments may still be modified, or some or all of their technical features may be equivalently replaced. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to depart from the scope of the technical solutions of the embodiments of the present application.

[0188] In the description of this application, directions or positional relationships indicated by terms such as "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer" are directions or positional relationships based on the accompanying drawings, and are intended merely to facilitate and simplify the description of this application, and are not intended to indicate or imply that a device or element has a particular orientation, is configured, or needs to be operated in a particular direction, and therefore cannot be understood as a limitation on this application.

[0189] In the description of this application, unless otherwise clearly specified or limited, the term "connection" should be understood in a broad sense. For example, "connection" may be a fixed connection, a detachable connection, an integral connection, a press connection, or an integral connection. The contact of the connection may be a direct connection or an indirect connection via an intermediate medium. Those skilled in the art may understand the specific meaning of the above terms in this application based on the specific circumstances.

[0190] In the embodiments of this application, words such as "example" and "for example" are used to indicate providing an example, illustrative example, or explanation. Any embodiment or design manner described in this application as an "example" or "for example" should not be described as preferred or having more advantages than another embodiment or design manner. Strictly speaking, the use of terms such as "example," "for example," etc. is intended to present the related concept in a particular manner.

[0191] In the embodiments of the present application, "at least one" means one or more, and "multiple" means two or more. "At least one of the following items (moieties)" or similar expressions refers to any combination of these items, including a single item (moiety) or any combination of multiple items (moieties). For example, at least one of a, b, or c may refer to a, b, c, (a and b), (a and c), (b and c), or (a, b, and c), where a, b, and c may be singular or plural. The term "and / or" describes an association relationship between related objects and indicates that three relationships may exist. For example, A and / or B may refer to the following three cases: a case where only A exists, a case where both A and B exist, and a case where only B exists, where A and B may be singular or plural. The character " / " usually indicates an "or" relationship between related objects.

[0192] Furthermore, unless otherwise stated, ordinal numbers such as "first" and "second" in the embodiments of the present application are intended to distinguish between multiple objects, but are not intended to limit the order, chronology, priority, or importance of the multiple objects. For example, "first fastening structure" and "second fastening structure" are merely for ease of explanation and do not indicate differences between the first fastening structure and the second fastening structure in terms of materials, installation order, importance, etc. In some embodiments, the first fastening structure and the second fastening structure may alternatively be the same light signal. [Explanation of symbols]

[0193] 101 Heatsink 1011 Heat dissipation boss 1012 Fixed Boss 102 Circuit Board 1021 (and 1021x) chip mounting area 1022x 1st position 103 Elastic connection structure 1031 Fasteners 1032 Elastic member 1033 Elastic body 104 Fixed connection structure 105 chips 106 Support 106a Housing 106b Fixing boss on housing 107 Mainboard 108 Connector 109 support 110 Bottom Housing 111 Main board fastening member

Claims

1. A heat dissipation structure comprising a heat sink, a circuit board, at least one fixed connection structure, and at least one elastic connection structure, At least one chip mounting area and at least one first location are provided on the circuit board, and the at least one first location is located outside the chip mounting area; the at least one fixed connection structure is positioned at the at least one first position and fastens the circuit board to the heat sink; and a heat dissipation structure, wherein the at least one elastic connecting structure is configured to apply an elastic force to the chip mounting area toward the heat sink;

2. the at least one elastic connection structure comprises a fastener and an elastic member; The circuit board has a through hole, and the fastener passes through the through hole and is fastened to the heat sink; and The heat dissipation structure of claim 1 , wherein the resilient member is sleeved over the fastener and resiliently connects the fastener and a surface of the circuit board remote from the heat sink.

3. The heat-dissipating structure according to claim 2 , wherein the at least one fixed connection structure is configured to perform positioning of the circuit board in a horizontal direction.

4. The heat-dissipating structure according to claim 1 , wherein the at least one elastic connecting structure is an elastic body, and the elastic body is elastically connected between the circuit board and the support.

5. The heat-dissipating structure of claim 4 , wherein the support is positioned on a side of the circuit board away from the heat sink.

6. The heat-dissipating structure of claim 4 , wherein the support is a housing of the heat-dissipating structure.

7. 2. The heat dissipation structure of claim 1, wherein the circuit board of the heat dissipation structure is connected to a stress-sensitive component, the distance between the stress-sensitive component and a first fixed connection structure is smaller than the distance between the stress-sensitive component and any elastic connection structure, and the first fixed connection structure belongs to the at least one fixed connection structure.

8. 2. The heat dissipation structure of claim 1, further comprising a board-to-board BTB connector and a main board, one end of the BTB connector being connected to the circuit board and the other end of the BTB connector being connected to the main board.

9. 9. The heat dissipation structure of claim 8, wherein the distance between the BTB connector and a second fixed connection structure is smaller than the distance between the BTB connector and any elastic connection structure, and the second fixed connection structure belongs to the at least one fixed connection structure.

10. There is one chip mounting area on the circuit board, the first location is located on an edge of the circuit board, and the chip mounting area is located in a central area of ​​the circuit board; or There are at least two chip mounting areas on the circuit board, and the first location is located between the at least two chip mounting areas; or The heat-dissipating structure of claim 1 , wherein the chip-mounting area is located on one side of the circuit board and the first location is located on another side of the circuit board.

11. 2. The heat dissipation structure of claim 1, wherein the heat dissipation structure further comprises a support, the support is fastened to the circuit board, the elastic force of the at least one elastic connection structure acts on the support, and the elastic force of the at least one elastic connection structure is imparted to the circuit board by using the support.

12. 10. The heat dissipation structure of claim 1, wherein the heat dissipation structure is used in an autonomous driving controller, a cockpit domain controller, or a vehicle domain controller.

13. A vehicle-mounted device comprising the heat dissipation structure of claim 1 and at least one chip, the at least one chip being disposed in at least one chip mounting area on a circuit board of the heat dissipation structure.

14. The vehicle-mounted device according to claim 13 , wherein at least one elastic connection structure in the heat sink is configured to maintain a thermally conductive connection between the at least one chip and the heat sink in the heat dissipation structure.

15. The vehicle-mounted device further comprises a main board, a plurality of chips, and at least two heat dissipation structures; The plurality of chips are mounted on chip mounting areas on a circuit board of the at least two heat dissipation structures; and The vehicle-mounted device according to claim 13 , wherein the main board is electrically connected to the circuit boards in the at least two heat dissipation structures.

16. The vehicle-mounted device according to claim 13, wherein the vehicle-mounted device is an integrated plate-shaped structure.

17. The vehicle-mounted device according to claim 13, wherein the vehicle-mounted device is used in an autonomous driving controller, a cockpit domain controller, or a vehicle domain controller.

18. A terminal device, comprising the heat-dissipating structure according to any one of claims 1 to 12 or the vehicle-mounted device according to claim 13.

19. The terminal device of claim 18, wherein the terminal device is a vehicle, a robot, or an unmanned aerial vehicle.

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