Data center and data center module

Abstract

To provide a data center configured to reduce operation cost.SOLUTION: A data center includes: an intake fan and an exhaust fan located on a wall surface of the data center; a floor which partitions the indoor space of the data center into an under-floor part and an above-floor part; a first temperature sensor provided in the under-floor part; a second temperature sensor provided in the above-floor part; and a control unit which controls rotation speed of the intake fan and the exhaust fan on the basis of the temperatures detected by the first temperature sensor and the second temperature sensor. The floor includes an opening formed in at least a part thereof to allow the under-floor part and the above-floor part to communicate with each other. On the floor, a plurality of racks configured are installed so that electronic devices are stored therein. The intake fan is located on a wall surface of the under-floor part, and the exhaust fan is located on a wall surface of the above-floor part. The outside air taken in by the intake fan flows from the under-floor part to the above-floor part through the opening, then the air is discharged to the outside by the exhaust fan.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a data center and a data center module.

Background Art

[0002] Conventionally, in a data center that houses a large number of electronic devices such as servers, those equipped with cooling facilities for cooling these electronic devices are known (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in recent years, the requirements for data centers have tended to be relaxed, and instead of conventional high-quality data centers, data centers with lower operating costs are demanded.

[0005] In view of the above circumstances, the present invention aims to provide a data center capable of reducing operating costs.

Means for Solving the Problems

[0006] According to one aspect of the present invention, a data center is provided. This data center comprises an intake fan and an exhaust fan located on the wall of the data center, a floor separating the interior of the data center into a lower floor and an upper floor, a first temperature sensor located in the lower floor, a second temperature sensor located in the upper floor, and a control unit that controls the rotational speed of the intake fan and the exhaust fan based on the temperatures detected by the first and second temperature sensors. The floor has an opening in at least a portion thereof that connects the lower floor and the upper floor. Multiple racks configured to house electronic equipment are installed on the floor. The intake fan is located on the wall of the lower floor, and the exhaust fan is located on the wall of the upper floor. The outside air drawn in by the intake fan flows from the lower floor to the upper floor through the opening, and is then discharged to the outside by the exhaust fan.

[0007] This configuration can reduce the operating costs of the data center. [Brief explanation of the drawing]

[0008] [Figure 1] This is a plan view showing an example of Data Center 1. [Figure 2] This is a cross-sectional view (AA) showing an example of data center 1. [Figure 3] This is a cross-sectional view (AA) showing an example of data center 1. [Figure 4] This is a block diagram showing an example of the hardware configuration of the information processing device 15. [Figure 5] This flowchart shows an example of the information processing flow performed by the information processing device 15. [Figure 6] This is an elevation view showing an example of a data center module 2, which is a modified version of the present disclosure. [Modes for carrying out the invention]

[0009] Embodiments of the present invention will be described below with reference to the drawings. The various features shown in the embodiments below can be combined with each other.

[0010] Incidentally, the program for implementing the software appearing in this embodiment may be provided as a computer-readable non-temporary recording medium, or it may be provided so that the program is launched on an external computer and its functions are realized on a client terminal (so-called cloud computing).

[0011] Furthermore, in this embodiment, "part" may include, for example, hardware resources implemented by circuits in a broad sense, and the information processing of software that can be specifically realized by these hardware resources. In addition, various types of information are handled in this embodiment, and these types of information can be represented, for example, by the physical values ​​of signal values ​​representing voltage and current, the high or low values ​​of signal values ​​as a set of binary bits composed of 0s or 1s, or by quantum superposition (so-called qubits), and communication and calculations can be performed on circuits in a broad sense.

[0012] Furthermore, a circuit in a broad sense is a circuit realized by combining at least a suitable combination of circuits, circuits, processors, and memory. In other words, it includes application-specific integrated circuits (ASICs), programmable logic devices (for example, simple programmable logic devices (SPLDs), complex programmable logic devices (CPLDs), and field programmable gate arrays (FPGAs)), etc.

[0013] 1. Configuration of Data Center 1 Section 1 describes an example of the configuration of Data Center 1 related to this disclosure.

[0014] <Data Center 1> Figure 1 is a plan view showing an example of data center 1. Figures 2 and 3 are cross-sectional views (AA) showing an example of data center 1. Data center 1 is a raised, roughly rectangular building comprising a floor 14, walls, and a ceiling. The floor 14 divides the interior of data center 1 into an underfloor area 10 and an upper floor area 11. In other words, data center 1 is a building with an underfloor area. Data center 1 further comprises a door 16 and a staircase 17 for worker access.

[0015] <Intake fan 101 and exhaust fan 131> The walls of data center 1 are provided with multiple air intakes 100 and multiple exhaust ports 130. Each air intake 100 is equipped with an intake fan 101 and an intake fan hood 102. Each exhaust port 130 is equipped with an exhaust fan 131 and an exhaust fan hood 132. From another perspective, the intake fans 101 and exhaust fans 131 are located on the walls of data center 1. The intake fan 101 is located on the wall of the lower floor 10, and the exhaust fan 131 is located on the wall of the upper floor 11.

[0016] In a preferred example, the wall surfaces equipped with the intake fan 101 and the exhaust fan 131 are parallel to each other. This configuration generates airflow within the data center 1, allowing for more efficient cooling of the interior of the data center 1.

[0017] There are no particular restrictions on the number of intake fans 101 and exhaust fans 131 to be installed, and they may be appropriately determined depending on the size of the data center 1. Furthermore, there are no particular restrictions on the size of the intake port 100 and exhaust port 130, or the size or airflow performance of the intake fans 101 and exhaust fans 131, and these may be appropriately determined depending on the volume of the data center 1. For example, by making the intake volume in the entire data center 1 greater than the exhaust volume, it is possible to prevent the door 16 from becoming difficult to open and close. It is also possible to prevent the exhaust fan 131 from being unable to exhaust air at its intended performance.

[0018] From another perspective, the data center 1 does not have ducts indoors. In a preferred example, the data center 1 is configured without ducts inside and outside. This can reduce the introduction cost and operation cost of the data center 1. In particular, since duct maintenance is not required, the maintenance cost can be suppressed compared to a data center equipped with ducts.

[0019] <Floor 14> Floor 14 includes an opening 140 at least partially connecting the lower floor part 10 and the upper floor part 11. There is no particular limitation on the area of the opening 140, which may be appropriately determined according to the area of the data center 1. A grating 141 for workers to pass through is installed in the opening 140. Workers can enter the lower floor part 10 for work such as cleaning or maintaining the exhaust fan 131. There is no particular limitation on the opening ratio of the grating 141. Specifically, for example, from the perspective of achieving both durability and breathability, the opening ratio is 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80%, and it may also be within the range between any two of the values exemplified here.

[0020] <Rack 112> On the bed 14, a plurality of racks 112 configured to be able to store electronic devices are installed. For example, the electronic devices stored in the rack 112 are various IT (Information Technology) devices such as servers, storage systems, and network devices. Specifically, for example, the rack 112 may be a server rack such as a 19-inch rack. There is no particular limitation on the number of installed racks 112, and it may be appropriately determined according to the size of the data center 1. Specifically, for example, the number of installed racks 112 may be 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, and may also be within the range between any two of the numerical values exemplified here. In addition, storage spaces for storing wiring cables may be provided above and below the rack 112.

[0021] In a preferred example, the plurality of racks 112 are arranged side by side in a direction along the wall surface where the intake fan 101 and the exhaust fan 131 are installed. In a more preferred example, the plurality of racks 112 are arranged side by side in a row. From another perspective, the plurality of racks 112 are arranged side by side in a row in a direction perpendicular to the air flow direction. In such a manner, the electronic devices loaded on the rack 112 can be cooled more efficiently. Also, the path from the intake fan 101 to the exhaust fan 131 can be shortened, and the size of the data center 1 itself can be reduced. Thereby, space saving of the data center 1 becomes possible, and it becomes easier to secure an installation location.

[0022] The arrows shown in Figure 3 represent the airflow within the data center 1. As shown in Figure 3, outside air drawn in by the intake fan 101 flows from the lower part of the floor 10 to the upper part of the floor 11 through the opening 140, then passes through the racks 112, and is discharged to the outside by the exhaust fan 131. This configuration allows the data center 1 to be cooled by outside air without the use of air conditioning equipment, achieving energy savings compared to data centers with air conditioning equipment. This reduces the environmental impact and suppresses operating costs.

[0023] <Partition plate 111> In a preferred example, the data center 1 further includes a partition plate 111 located above the floor 11. The partition plate 111 is located between the ceiling and walls of the data center 1 and the racks 112. The partition plate 111 separates the above floor 11 into an intake-side passage 12 and an exhaust-side passage 13 of the racks 112. This configuration suppresses the recirculation of air inside the data center 1 and allows for more efficient airflow from the intake fan 101 to the exhaust fan 131. This allows for more efficient cooling of the electronic equipment loaded on the racks 112. The partition plate 111 may also be provided with a door, allowing workers to pass from the intake-side passage 12 to the exhaust-side passage 13. Alternatively, the partition plate 111 may be omitted.

[0024] <Information Processing Device 15> An information processing device 15 (not shown) is provided on the floor portion 11. In a specific example, the information processing device 15 may be installed in a rack 112. The information processing device 15 will be described in detail later.

[0025] <Temperature sensor> Data center 1 is equipped with multiple temperature sensors. The temperature sensors may be installed both indoors and outdoors of data center 1. In a specific example, data center 1 includes a first temperature sensor (not shown) located in the lower part of the floor 10 and a second temperature sensor (not shown) located in the upper part of the floor 11. In a preferred example, the second temperature sensor is located in the exhaust side passage 13. This configuration makes it possible to measure the temperature of the exhaust side passage 13, which becomes hot due to the heat dissipated by electronic equipment. In a preferred example, multiple first temperature sensors and multiple second temperature sensors may be installed.

[0026] 2. Hardware configuration of the information processing device 15 Section 2 describes an example of the hardware configuration of the information processing device 15.

[0027] Figure 4 is a block diagram showing an example of the hardware configuration of the information processing device 15. The information processing device 15 includes a communication unit 151, a storage unit 152, a control unit 153, an input unit 154, and a display unit 155. These components are electrically connected within the information processing device 15 via a communication bus 150. Each component will be described further.

[0028] The communication unit 151 preferably uses wired communication methods such as USB, IEEE1394, Thunderbolt®, and wired LAN network communication, but may also include wireless LAN network communication, mobile communication such as 5G / LTE / 3G, and Bluetooth® communication as needed. In other words, it is more preferable to implement it as a collection of these multiple communication methods. That is, the information processing device 15 communicates various information with other devices via a network through the communication unit 151. In particular, the communication unit 151 is configured to communicate with the first temperature sensor, the second temperature sensor, the intake fan 101, and the exhaust fan 131.

[0029] The memory unit 152 stores various information necessary for information processing by the information processing device 15. This can be implemented, for example, as a storage device such as a solid-state drive (SSD) that stores various programs related to the information processing device 15 executed by the control unit 153, or as memory such as random access memory (RAM) that stores temporarily necessary information (arguments, arrays, etc.) related to program calculations. A combination of these may also be used.

[0030] The control unit 153 performs processing and control of the overall operation related to the information processing device 15. The control unit 153 is, for example, a Central Processing Unit (CPU) (not shown). The control unit 153 realizes various functions related to the information processing device 15 by reading predetermined programs stored in the memory unit 152. That is, information processing by software stored in the memory unit 152 is concretely realized by the control unit 153, which is an example of hardware, and can be executed as each functional unit included in the control unit 153. These will be described in more detail in the next section. Note that the control unit 153 is not limited to being a single unit, and may be implemented with multiple control units 153 for each function. Or a combination thereof. In particular, the control unit 153 acquires temperature information measured by the first temperature sensor and the second temperature sensor. The control unit 153 also acquires information on the rotational speed of the motors that rotate the fans of the intake fan 101 and the exhaust fan 131. Furthermore, the control unit 153 controls the rotation speed of the intake fan 101 and the exhaust fan 131 based on the temperatures detected by the first and second temperature sensors.

[0031] The input unit 154 may be included in the housing of the information processing device 15, or it may be an external component. For example, the input unit 154 may be integrated with the display unit 155 and implemented as a touch panel. If it is a touch panel, the user can input tap operations, swipe operations, etc. Of course, instead of a touch panel, switch buttons, a mouse, a QWERT keyboard, etc., may be used. In other words, the input unit 154 receives operation input made by the user. This input is transmitted as a command signal to the control unit 153 via the communication bus 150. The control unit 153 can then perform predetermined controls and calculations as needed.

[0032] The display unit 155 may be included in the housing of the information processing device 15 or it may be an external unit. The display unit 155 displays a graphical user interface (GUI) screen that can be operated by the user. It is preferable to use a display device such as a CRT display, liquid crystal display, organic EL display, and plasma display, depending on the type of information processing device 15.

[0033] 3. Information Processing Methods Section 3 describes an example of the information processing method of the information processing device 15 described above. Figure 5 is a flowchart showing an example of the information processing flow performed by the information processing device 15. The following explanation will follow this flowchart. It is assumed that the information processing method shown in Figure 5 is repeated at arbitrary time intervals.

[0034] First, the control unit 153 obtains the temperature detected by the first temperature sensor and the temperature detected by the second temperature sensor via the communication unit 151, and identifies the temperature difference between the two detected temperatures (step S001).

[0035] Next, the control unit 153 determines whether the identified temperature difference value is greater than or equal to a threshold Th (step S002). The threshold Th may be any value pre-set by the user. If it is determined that the temperature difference value is less than the threshold Th, the process described in S007 is executed. On the other hand, if it is determined that the temperature difference value is greater than or equal to the threshold Th, the process proceeds to the next step.

[0036] Next, the control unit 153 transmits a signal via the communication unit 151 to set the rotation speed of the intake fan 101 to a first speed V1 and the rotation speed of the exhaust fan 131 to a second speed V2 (step S003). The first speed V1 and the second speed V2 may be arbitrary values ​​that are set in advance according to the scale of the data center 1. In a specific example, the control unit 153 increases the rotation speed of the motors that rotate the fans of the intake fan 101 and the exhaust fan 131 to increase the amount of air blown in order to promote heat dissipation to the outside. Note that the first speed V1 and the second speed V2 may be equal values.

[0037] Next, the control unit 153 determines whether or not the period T has elapsed (step S004). Here, the period T may be any length of time. If it is determined that the period T has not elapsed, the process will not be executed until the period T has elapsed. On the other hand, if it is determined that the period T has elapsed, the process proceeds to the next step.

[0038] Next, the control unit 153 obtains the temperature detected by the first temperature sensor and the temperature detected by the second temperature sensor via the communication unit 151 and determines the temperature difference between the two detected temperatures (step S005).

[0039] Next, the control unit 153 determines whether the identified temperature difference value is less than the threshold Th (step S006). If it is determined that the temperature difference value is greater than or equal to the threshold Th, the process returns to step S004. On the other hand, if it is determined that the temperature difference value is less than the threshold Th, the process proceeds to the next step.

[0040] Next, the control unit 153 transmits a signal via the communication unit 151 to set the rotation speed of the intake fan 101 to the third speed V3 and the rotation speed of the exhaust fan 131 to the fourth speed V4 (step S007). The third speed V3 and the fourth speed V4 may be arbitrary values ​​that are set in advance according to the scale of the data center 1. In a specific example, the control unit 153 reduces the rotation speed of the motors that rotate the fans of the intake fan 101 and the exhaust fan 131, thereby reducing the amount of air blown. Note that the third speed V3 and the fourth speed V4 may be equal values.

[0041] With the above configuration, it becomes possible to properly cool the electronic equipment installed in the data center 1 without using air conditioning equipment. In particular, since the amount of heat generated changes depending on the operating status of the electronic equipment, the temperature inside the data center 1 also fluctuates. By appropriately controlling the airflow rate of the intake fan 101 and exhaust fan 131 in accordance with the temperature fluctuations inside the data center 1, it is possible to suppress wasted power consumption. This makes it possible to further reduce the operating costs of the data center 1.

[0042] 4. Other aspects Section 4 describes modifications of this disclosure.

[0043] Figure 6 is an elevation view showing an example of a data center module 2, which is a modified version of the present disclosure. The data center module 2 comprises a plurality of data centers 1. The data center module 2 further comprises a connecting corridor roof 21 located above the intake fan 101 and connecting the plurality of data centers 1. The plurality of data centers 1 are configured such that the walls equipped with the intake fan 101 face each other. This configuration makes it possible to provide data centers of various sizes according to the needs of the customer. In addition, by providing the connecting corridor roof 21 above the location where the intake fan 101 is installed, it is possible to suppress rain, snow, or dust from entering the data center 1. Furthermore, by providing the connecting corridor roof 21 with respect to the longitudinal direction of the data center module 2, the removal of rain or snow becomes easier. Similarly, the roof of the data center 1 may also be provided with a slope with respect to the short direction of the data center 1.

[0044] In one embodiment, the data center 1 may not include the information processing device 15. In a specific example, the intake fan 101 and exhaust fan 131 may be configured to communicate with a temperature sensor, and when the temperature difference value becomes greater than or equal to a threshold Th, the rotation speed mode of the intake fan 101 and exhaust fan 131 may be switched to high-speed mode. Similarly, when the temperature difference value falls below a threshold Th, the rotation speed mode of the intake fan 101 and exhaust fan 131 may be switched to low-speed mode.

[0045] In one embodiment, the threshold Th may be set relative to the temperature detected by the second temperature sensor. In one embodiment, multiple threshold Ths and corresponding operating modes for the intake fan 101 and exhaust fan 131 may be set. In another embodiment, the first temperature sensor may be installed near the outdoor intake fan 101 and may be configured to detect the outside temperature. If there are multiple first temperature sensors, their average temperature may be specified. The same applies to the second temperature sensor. In another embodiment, the threshold Th may be set relative to, for example, the average value of the temperatures detected by each temperature sensor, or the average value of the temperatures detected by all temperature sensors in the data center 1.

[0046] In one embodiment, the data center 1 may further be equipped indoors and outdoors with various sensors or measuring devices for measuring humidity, atmospheric pressure, indoor pressure, airflow, etc. These sensors or measuring devices may be configured to communicate with the communication unit 151, and the control unit 153 may be configured to acquire each measurement result.

[0047] In one embodiment, the information processing device 15 may be capable of controlling multiple data centers 1. Furthermore, the information processing device 15 may be located in a separate building from the data centers 1, such as a management center. From another perspective, one aspect of this disclosure may be a data center system comprising multiple data centers 1 and the information processing device 15, configured to communicate with each other via telecommunication lines. In one embodiment, a data center system consists of one or more devices or components. For example, if it consists only of a data center 1, then the data center system may be a data center 1.

[0048] For example, the information processing device 15 may be distributed across two or more devices, or it may be replaced by a cloud computing system. For example, the functions of the information processing device 15 may be distributed across two or more devices. For example, it may be possible to control the data center 1 from a user terminal operated by a user. Also, the operation performed by one function may be distributed across two or more functions, or two or more functions may be integrated into one function. In short, as long as each of the functions shown in this disclosure is realized in the data center or data center system as a whole, the devices that realize those functions may be configured in any way.

[0049] An aspect of this disclosure may be an information processing method. The information processing method comprises each step of the information processing method executed by the control unit 153. An aspect of this disclosure may also be a program. The program causes the computer, which is the information processing device 15, to execute the information processing method described above.

[0050] The product may be provided in any of the following embodiments.

[0051] (1) A data center comprising an intake fan and an exhaust fan located on the wall surface of the data center, a floor separating the interior of the data center into a lower floor and an upper floor, a first temperature sensor located in the lower floor, a second temperature sensor located in the upper floor, and a control unit that controls the rotational speed of the intake fan and the exhaust fan based on the temperatures detected by the first and second temperature sensors, wherein the floor has an opening in at least a part thereof that connects the lower floor and the upper floor, a plurality of racks configured to house electronic equipment are installed on the floor, the intake fan is located on the wall surface of the lower floor and the exhaust fan is located on the wall surface of the upper floor, and outside air drawn in by the intake fan flows from the lower floor to the upper floor through the opening, and is then discharged to the outside by the exhaust fan.

[0052] (2) In the data center described in (1) above, the wall surfaces equipped with the intake fan and the exhaust fan are parallel to each other, and the multiple racks are installed in a line along these wall surfaces.

[0053] (3) A data center as described in (1) or (2) above, wherein the data center does not have ducts inside its building.

[0054] (4) A data center according to any one of (1) to (3) above, further comprising a partition plate located above the floor, wherein the partition plate is located between the ceiling and walls of the data center and the rack, and the above floor is divided into an intake side passage of the rack and an exhaust side passage of the rack, and the second temperature sensor is located in the exhaust side passage.

[0055] (5) A data center module comprising a plurality of data centers described in any one of (1) to (4) above, further comprising a roof located above the intake fan and connecting the plurality of data centers, wherein the plurality of data centers are configured such that the walls on which the intake fans are located face each other. Of course, this is not always the case.

[0056] Finally, various embodiments of the present invention have been described, but these are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims and their equivalents. [Explanation of symbols]

[0057] 1: Data center 10: Underfloor 100: Air intake 101: Intake fan 102: Intake fan hood 11: Upper floor 111: Partition plate 112: Rack 12: Intake side passage 13: Exhaust side passage 130: Exhaust port 131: Exhaust fan 132: Exhaust fan hood 14: Floor 140: Opening 141: Grating 15: Information Processing Device 150: Communications bus 151: Communications Department 152: Storage section 153: Control Unit 154: Input section 155: Display section 16: Door 17:Stairs 2: Data center module 21: Roof of the connecting corridor T: period Th: threshold V1: 1st speed V2: 2nd speed V3: 3rd speed V4: 4th speed

Claims

1. A data center module, The aforementioned data center module includes multiple data centers, The aforementioned data center is An intake fan and an exhaust fan are located on the wall of the aforementioned data center, A floor that separates the interior of the aforementioned data center into an underfloor area and an upper floor area, The first temperature sensor located in the lower part of the floor, A second temperature sensor is positioned on the upper part of the floor, The system includes a control unit that controls the rotational speed of the intake fan and the exhaust fan based on the temperatures detected by the first temperature sensor and the second temperature sensor, The floor is provided with an opening in at least a portion thereof that connects the lower part of the floor with the upper part of the floor. Multiple racks configured to house electronic devices are installed on the aforementioned floor. The intake fan is located on the wall surface below the floor, and the exhaust fan is located on the wall surface above the floor. The system is configured such that outside air drawn in by the intake fan flows through the opening from the underside of the floor to the top side of the floor, and is then discharged to the outside by the exhaust fan. The data center module is located above the intake fan and further comprises a roof connecting a plurality of the data centers, The multiple data centers are configured such that the walls equipped with the intake fans face each other.

2. In the data center module according to claim 1, The wall surfaces comprising the intake fan and the exhaust fan are wall surfaces located parallel to each other. Multiple of the aforementioned racks are installed in a line along these wall surfaces.

3. In the data center module according to claim 1, The aforementioned data center does not have ducts inside its building.

4. In the data center module according to claim 1, Furthermore, it is equipped with a partition plate located above the floor, The aforementioned partition plate is Located between the ceiling and walls of the data center and the racks, The floor portion is divided into an intake side passage of the rack and an exhaust side passage of the rack. The second temperature sensor is located in the exhaust side passage.

Images