High-frequency module

Abstract

To provide a technique for expanding an operating frequency range of a high frequency module to a higher frequency by reducing a loss at a connection portion of lines.SOLUTION: A first substrate has, at a substrate end, a connection part protruding from the end. A second substrate has a substrate through-hole which penetrates the substrate in the thickness direction, and through which the connection part is inserted. The first substrate has a connection pattern which connects a terminal pad formed at the tip end of the connection part penetrating the substrate through-hole to a first line pattern forming a tri-plate line. The connection pattern is formed such that its line width gradually becomes wider from the terminal pad toward the first line pattern. The second substrate has a connection pad electrically connected to the terminal pad penetrating the substrate through-hole.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a technique for connecting high-frequency lines formed on different substrates.

Background Art

[0002] Patent Document 1 discloses a connection structure used for connecting a triplate line formed on a first substrate and a microstrip line formed on a second substrate. Specifically, a through hole is formed in the second substrate, and a U-shaped pad pattern formed so as to sandwich the through hole from both sides is provided at one end of the microstrip line. A protruding connection portion having a size that penetrates the through hole is provided at the edge of the first substrate, and a terminal pad connected to the signal line pattern of the triplate line is provided at the tip of the connection portion. The two substrates are combined in a state where the connection portion of the first substrate penetrates the through hole of the second substrate, and the terminal pad formed at the tip of the connection portion that penetrates the through hole and the pad pattern provided so as to sandwich the through portion are soldered. Thereby, the high-frequency lines formed on different substrates are electrically connected to each other.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] It has been found that when a high-frequency module designed to operate in a certain frequency band is used to extend its operating frequency band to a higher range, signal loss due to reflection and other factors is likely to occur at the connection points of the two transmission lines (i.e., through-holes and connection points). For example, when a high-frequency module designed to operate at 3 GHz or below (e.g., an antenna device) is used to extend its operating frequency band up to 5 GHz, signal loss due to reflection and other factors occurs at the connection points, and the desired performance (e.g., VSWR) cannot be achieved. VSWR stands for Voltage Standing Wave Ratio.

[0005] One aspect of this disclosure is the provision of a technology that reduces losses at line connection points and extends the operating frequency range of high-frequency modules to higher frequencies. [Means for solving the problem]

[0006] One aspect of the present disclosure is a high-frequency module comprising a first substrate and a second substrate. The first substrate has a connecting portion protruding from the end of the substrate. The second substrate has a substrate through-hole that penetrates the substrate in the thickness direction and through which the connecting portion is inserted, and is integrated with the first substrate with the connecting portion inserted into the substrate through-hole. The first substrate comprises a first line pattern, a terminal pad, and a connecting pattern. The first line pattern is provided on both sides of the substrate facing each other and forms a triplate line. The terminal pad is formed at the tip of the connecting portion that penetrates the substrate through-hole. The connecting pattern connects the first line pattern and the terminal pad, and is configured such that the line width gradually widens from the terminal pad toward the first line pattern. The second substrate comprises a second line pattern and a connecting pad. The second line pattern is formed on the pattern surface of the second substrate and, together with a ground pattern formed on the ground surface opposite to the pattern surface, forms a microstrip line. The connecting pad surrounds at least a portion of the through-hole on the circuit board on the pattern side, is connected to one end of the second line pattern, and is electrically connected to the terminal pad that penetrates the through-hole on the circuit board. [Effects of the Invention]

[0007] This configuration reduces losses at the connection points of the transmission lines and extends the frequency range in which the high-frequency module can be used to higher frequencies. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1A is a schematic front view of the high-frequency module, and Figure 1B is a schematic side view of the high-frequency module. [Figure 2] This is a schematic cross-sectional view along the line II-II in Figure 1A. [Figure 3] Figure 3A is a schematic front view of the area on the metal frame where the antenna substrate is attached, viewed from the reflective surface side of the base plate, and Figure 3B is a schematic front view of the area shown in Figure 3A with the antenna substrate removed. [Figure 4] Figure 3A shows a schematic cross-sectional view of the metal frame and antenna substrate along the IV-IV line, and a schematic diagram showing the circuit board held in the metal frame. [Figure 5] Figure 3A shows a schematic cross-sectional view of the metal frame and antenna substrate in the VV line, and a schematic diagram showing the circuit board held in the metal frame. [Figure 6] This is a schematic perspective view showing the configuration around the area where the antenna board and the circuit board are electrically connected. [Figure 7] This is an explanatory diagram showing the conventional pad pattern shape and the pattern shape around the connection part. [Figure 8] This diagram illustrates the pad pattern shape and the pattern shape around the connection portion in this disclosure. [Figure 9] This graph shows the results of calculating the VSWR through simulation for a conventional high-frequency module, by changing the width W1 of the connection portion through which the board is inserted (i.e., the pattern width of the terminal pad). [Figure 10] This graph shows the results of calculating the VSWR through simulation by changing the line width W22 of the connecting line on the power supply line side in the high-frequency module of the embodiment. [Figure 11] This graph shows the results of calculating the VSWR by simulation while varying the width W1 of the connection part in the high-frequency module of the embodiment. [Figure 12] This graph shows the results of calculating the VSWR by simulation in the high-frequency module of the embodiment, by changing the length L1 of the connection portion protruding from the pattern surface of the antenna substrate (i.e., the pattern length of the terminal pad). [Modes for carrying out the invention]

[0009] Embodiments of this disclosure will be described below with reference to the drawings. [1. Structure] The high-frequency module 1 shown in Figures 1 to 8 comprises a metal frame 2, a plurality of circuit boards 3, a plurality of connection boards 4, a plurality of antenna boards 5, a distribution board 6, and a group of connectors 7.

[0010] [1-1. Metal frame] The metal frame 2 integrally holds multiple circuit boards 3, multiple connection boards 4, multiple antenna boards 5, distribution board 6, and a group of connectors 7. The metal frame 2 is made of, for example, aluminum or an aluminum alloy. The metal frame 2 is a grounded earth conductor. The metal frame 2 has a base plate 21, multiple wall plates 22, and two end plates 23.

[0011] The base plate 21 has a rectangular surface. In the following, the axis along the shorter side of the surface of the base plate 21 will be defined as the X-axis, the axis along the longer side of the surface of the base plate 21 will be defined as the Z-axis, and the axis perpendicular to the X and Z axes, i.e., the axis along the thickness direction of the surface of the base plate 21, will be defined as the Y-axis. One surface of the base plate 21 will be defined as the reflective surface 21A, and the surface opposite to the reflective surface 21A will be defined as the holding surface 21B. The high-frequency module 1 is installed in a orientation such that the Z-axis is parallel to the vertical direction, and the X and Y axes are parallel to the horizontal direction.

[0012] End plates 23 are provided at both ends of the base plate 21 in the Z-axis direction. A connector group 7 is provided on the end plate 23 located on the lower end side in the vertical direction. For each connector belonging to the connector group 7, for example, a BNC connector for connecting a coaxial cable or the like is used.

[0013] On the reflecting surface 21A of the base plate 21, a plurality of connection substrates 4 and a plurality of antenna substrates 5 are juxtaposed between the two end plates 23 along the Z-axis direction. The reflecting surface 21A has a function of reflecting radio waves toward the antenna substrate 5 disposed on the reflecting surface 21A. A distribution substrate 6 is provided at one end (here, the lower end) of the reflecting surface 21A in the Z-axis direction.

[0014] A plurality of wall plates 22 are provided on the holding surface 21B of the base plate 21 along the X-axis direction. The plurality of wall plates 22 project from the holding surface 21B in the Y-axis direction, and are arranged such that the thickness direction of each wall plate 22 coincides with the X-axis direction. The plurality of wall plates 22 are arranged at equal intervals along the X-axis direction.

[0015] The holding surface 21B includes a substrate holding groove 21C formed along the Z-axis direction at an intermediate position between two adjacent wall plates 22 as shown in FIGS. 2 to 5. The substrate holding groove 21C has a groove width into which the edge portion of the circuit board 3 can be inserted, and holds the circuit board 3 inserted into the substrate holding groove 21C between the two wall plates 22. The sizes of the plurality of wall plates 22 are all equal, and have a size such that the entire circuit board 3 is covered by the wall plates when the circuit board 3 held in the substrate holding groove 21C is viewed from the X-axis direction.

[0016] The plurality of circuit boards 3 are juxtaposed along the X-axis direction on the holding surface 21B, and are each held in a state of being sandwiched between two wall plates 22. The plurality of wall plates 22 form a triple plate line together with the wiring patterns formed on the plurality of circuit boards 3. That is, the plurality of wall plates 22 function as an outer conductor of the triple plate line.

[0017] The base plate 21 has a plurality of frame through-holes 21D that penetrate the base plate 21 in the thickness direction. The frame through-holes 21D are provided at least in part at the points where the connecting substrate 4 or antenna substrate 5, which is arranged on the reflective surface 21A, intersects with the substrate holding grooves 21C formed on the holding surface 21B.

[0018] In this embodiment, the base plate 21 and the multiple wall plates 22 are configured as a single component. The base plate 21 may be composed of two separate components: a central portion on which the multiple wall plates 22 are provided (i.e., on which the multiple circuit boards 3 are arranged) and a main body which includes a portion outside the central portion in the X-axis direction. In this case, the central portion may be fitted into the main body and fixed to it, for example, by bolts.

[0019] [1-2. Antenna board] The multiple antenna boards 5 are all printed circuit boards having the same configuration.

[0020] On one side of the antenna substrate 5 (hereinafter referred to as the ground surface) 5A, a ground pattern 51 is formed over almost the entire surface. On the side of the antenna substrate 5 opposite to the ground surface 5A (hereinafter referred to as the pattern surface) 5B, wiring patterns that function as antenna elements 52, antenna feed lines 53, and connection pads 54 are formed. For details of the antenna elements 52, please refer to Figure 1A. For details of the antenna feed lines 53 and connection pads 54, please refer to Figures 3A, 6, and 8A.

[0021] On each antenna substrate 5, the two antenna elements 52 are arranged at both ends of the antenna substrate 5 in a direction parallel to the X-axis, as shown in Figure 1. Both antenna elements 52 are formed by combining two linear antenna elements with orthogonal polarization angles in an X-shape. Of the two linear antenna elements that form one antenna element 52, the polarization angle of one linear antenna element is set to be +45° with respect to the horizontal, and the polarization angle of the other linear antenna element is set to be -45° with respect to the horizontal.

[0022] The multiple antenna substrates 5 are arranged apart from each other in the vertical direction (i.e., in the Z-axis direction). Therefore, in this embodiment, the high-frequency module 1 has two rows composed of multiple antenna elements 52 arranged in the vertical direction. However, the arrangement pattern of the multiple antenna elements 52 is not limited to this.

[0023] As shown in Figures 2 and 4, the antenna substrate 5 is positioned such that its ground surface 5A is in contact with the reflective surface 21A of the base plate 21. However, the ground pattern 51 of the antenna substrate 5 may be covered with an insulating resist layer. In this case, the ground pattern 51 of the antenna substrate 5 and the metal frame 2 are electromagnetically coupled via the resist layer.

[0024] As shown in Figures 3A and 6, when the antenna substrate 5 is placed on the reflective surface 21A, it has a pattern removal portion 51A in the portion facing the frame through-hole 21D, where a part of the ground pattern 51 has been removed. In other words, the antenna substrate 5 is positioned on the reflective surface 21A of the base plate 21 such that the pattern removal portion 51A covers the frame through-hole 21D.

[0025] The antenna substrate 5 has a rectangular substrate through-hole 5C in the center of the position opposite the frame through-hole 21D when it is placed on the reflective surface 21A of the base plate 21 (i.e., the pattern removal portion 51A), through which the tip portion 33A of the connection portion 33 of the circuit board 3, which will be described later, is inserted.

[0026] As shown in Figures 3A and 8A, the connection pad 54 is formed on the pattern surface 5B of the antenna substrate 5 so as to surround the substrate through-hole 5C. Specifically, the connection pad 54 has a U-shape formed by connecting two edges of the rectangular substrate through-hole 5C along the Z-axis direction, with the pattern formed to sandwich the substrate through-hole 5C at one end along the Z-axis direction.

[0027] The antenna feed line 53 has one end connected to the antenna element 52 and the other end connected to the connection pad 54. On the antenna substrate 5, the antenna feed line 53 formed on the pattern surface 5B functions as a microstrip line together with the ground pattern 51 formed on the ground surface 5A.

[0028] [1-3. Connection board] The connecting board 4 is used to electrically connect different circuit boards 3 that are equipped with the same power supply circuit. The connecting board 4 is placed on the reflective surface 21A of the base plate 21 and is electrically connected to the circuit board 3 via the frame through-hole 21D.

[0029] The structure of the through-holes in the board and the connecting pads provided for electrically connecting the connecting board 4 and the circuit board 3 via the frame through-holes 21D is the same as the structure of the through-holes in the board 5C and the connecting pads 54 provided for electrically connecting the antenna board 5 and the circuit board 3.

[0030] [1-4. Circuit Boards] The circuit board 3 is a strip-shaped dielectric substrate on which wiring patterns are formed on both sides of the substrate. The circuit board 3 has one or more connecting portions 33 at the edge that is inserted into the substrate holding groove 21C. The connecting portions 33 are protruding parts formed to penetrate the frame through hole 21D of the base plate 21 and the substrate through hole 5C of the antenna substrate 5 (or connecting substrate 4) when the circuit board 3 is held in a predetermined position by the metal frame 2.

[0031] As shown in Figures 4 to 6 and Figure 8B, the connecting portion 33 comprises a tip portion 33A and a base portion 33B. The tip portion 33A is located on the tip side of the connecting portion 33 and has a width that allows it to pass through the substrate through-hole 5C. The base portion 33B is located on the base side of the connecting portion 33 and has a width that allows it to be inserted into the frame through-hole 21D. In other words, when the base portion 33B is inserted into the frame through-hole 21D, the position of the circuit board 3 relative to the base plate 21 is determined, and the tip portion 33A of the connecting portion 33 is positioned in the center of the frame through-hole 21D. In this state, by further pushing the circuit board 3 toward the base plate 21, the tip portion 33A of the connecting portion 33 passes through the substrate through-hole 5C.

[0032] The circuit board 3 has wiring patterns formed on both sides of the dielectric substrate 31, which function as power supply lines 34, connection lines 35, and terminal pads 36. These wiring patterns have the same shape when viewed from one side in the thickness direction of the circuit board 3 (i.e., a shape symmetrical with respect to the center in the thickness direction of the circuit board 3). The wiring patterns formed on both sides of the circuit board 3 may be electrically connected by through-holes that penetrate the circuit board 3.

[0033] One end of the power supply line 34 is connected to a power supply circuit (not shown), and the other end (hereinafter referred to as the connection part 33 side end) is wired in a position opposite the connection part 33, with the portion of the circuit board 3 that is inserted into the board holding groove 21C in between.

[0034] The terminal pad 36 is formed on the entire surface of the tip portion 33A of the connection portion 33 that penetrates the substrate through-hole 5C. In other words, the pattern width W1 of the terminal pad 36 in the direction along the Z axis is the same as the width of the tip portion 33A in the direction along the Z axis.

[0035] When the terminal pad 36 is assembled to the metal frame 2, it penetrates the through-hole 5C and protrudes from the pattern surface 5B of the antenna substrate 5. This terminal pad 36 protruding from the pattern surface 5B is soldered to the U-shaped connection pad 54 formed around the through-hole 5C, thereby electrically connecting the feed line 34 on the circuit board 3 and the antenna feed line 53 on the antenna substrate 5.

[0036] In the connection section 33 of the circuit board 3, the connecting line 35 that connects the power supply line 34 and the terminal pad 36 has a shape in which the line width gradually widens from the terminal pad 36 side toward the power supply line 34 side, as shown in Figures 4, 6 and 8B.

[0037] In this embodiment, the connecting line 35 is divided into two stages: the connecting line 35A on the terminal pad 36 side and the connecting line 35B on the power supply line 34 side. The line width W22 of the connecting line 35B is set to be wider than the line width W21 of the connecting line 35A and narrower than the line width W3 of the power supply line 34.

[0038] When the circuit board 3 is held in place by the metal frame 2, the connecting line 35A is located at the center of the frame through-hole 21D and functions as a coaxial line with the connecting line 35A as the internal conductor and the inner circumferential wall of the frame through-hole 21D as the external conductor.

[0039] [1-5. Distribution board] The distribution board 6 has the function of electrically connecting the group of connectors 7 provided on the end plate 23 to each circuit provided on the multiple circuit boards 3. A detailed explanation of the specific configuration is omitted.

[0040] [2.Design] In the following, the center frequency of the operating frequency band of the high-frequency module 1 is referred to as the reference frequency. The wavelength corresponding to the reference frequency is called the reference wavelength λ, and the shortened wavelength corresponding to the reference frequency within the circuit board 3 and antenna board 5 is called the reference shortened wavelength λg. Glass epoxy material was used as the dielectric substrate 31 for the antenna board 5 and circuit board 3.

[0041] The length L2 of the connecting line 35B is set to 2 mm. If the length L2 of the connecting line 35B is made too long, the coaxial structure of the connecting line 35 will be disrupted, and if it is made too short, the effect of broadband characteristics will not be obtained. The line width W3 of the feed line 34, which functions as a triplate line, the line width W21 of the connecting line 35A, which functions as a coaxial line, and the line width W4 of the antenna feed line 53, which functions as a microstrip line, are all set so that their impedance at the reference frequency is a predetermined value (for example, 50Ω).

[0042] Next, the width W1 of the tip portion 33A of the connection portion 33 (i.e., the terminal pad 36) is designed so that the average value of the VSWR in the operating frequency band approaches 1.0 as closely as possible. At this time, the height L1 of the tip portion 33A of the connection portion 33 protruding from the pattern surface 5B of the antenna substrate 5 is set to the smallest possible size that provides sufficient physical strength when the terminal pad 36 and the connection pad 54 are soldered together.

[0043] The track width W22 of connecting line 35B is set so that the average VSWR value in the operating frequency band is 1.05 or less, based on the above settings. After performing the basic design described above, W1, W22, L1, L2, etc. may be further fine-tuned to optimize the VSWR.

[0044] [3. Experiment] Figure 9 is a graph showing the results of simulation-based calculation of the VSWR for a conventional high-frequency module by changing the width W1 of the tip portion 33A (width of the terminal pad 36) of the connection portion 33.

[0045] The conventional structure refers to a structure in which the line width W2 of the connecting line 35 is constant, as shown in Figure 7B. The high-frequency module used was designed to have an average VSWR of 1.05 or less in the operating frequency band of 0.5GHz to 3GHz. Specifically, W1=3.2mm, W2=0.8mm, W3=4.4mm, W4=1.5mm, W5=0.8mm, and L1=1.5mm, with W1=3.2mm to 1.6mm. W5 is the pattern width of the connecting pad 54. It was also assumed that the upper limit of the operating frequency band could be extended to 5GHz.

[0046] As shown in Figure 9, it was confirmed that with conventional high-frequency modules, narrowing W1 improves the VSWR above 4 GHz, but it is not possible to reduce the average VSWR value in the operating frequency band to 1.05 or less. Figure 10 is a graph showing the results of VSWR calculation by simulation using the high-frequency module 1 of this embodiment, while varying the line width W22 of the connecting line 35B. Specifically, W1=2.0mm, W21=0.8mm, W3=4.4mm, W4=1.5mm, W5=0.8mm, L1=1.5mm, L2=2.0mm, and W22=0.8mm to 4.4mm.

[0047] As shown in Figure 10, it was confirmed that the average VSWR value in the operating frequency band is 1.05 or less when W22 = 1.6 mm to 2.6 mm (i.e., in the range of 0.021 λ to 0.035 λ with λ = 75.0 mm, and in the range of 0.035 λ g to 0.057 λ g with λ g = 45.8 mm).

[0048] Figure 11 is a graph showing the results of VSWR calculation by simulation using the high-frequency module 1 of this embodiment, while varying the width W1 of the tip portion 33A of the connection portion 33 (width of the terminal pad 36). Specifically, W21=0.8mm, W22=2.0mm, W3=4.4mm, W4=1.5mm, W5=0.8mm, L1=1.5mm, L2=2.0mm, and W1=1.6mm to 3.2mm.

[0049] As shown in Figure 11, it was confirmed that the average VSWR value in the operating frequency band is 1.05 or less when W1 = 1.8 mm to 2.4 mm (i.e., in the range of 0.024 λ to 0.032 λ with λ = 75.0 mm, and in the range of 0.039 λg to 0.052 λg with λg = 45.8 mm).

[0050] Figure 12 is a graph showing the results of VSWR calculations performed by simulation using the high-frequency module 1 of this embodiment, by changing the protrusion length L1 of the tip portion 33A of the connection portion 33 from the pattern surface 5B of the antenna substrate 5. Specifically, W1=2.0mm, W21=0.8mm, W22=2.0mm, W3=4.4mm, W4=1.5mm, W5=0.8mm, and L2=2.0mm, with L1=1.1mm to 3.1mm.

[0051] As shown in Figure 12, it was confirmed that the average VSWR value in the operating frequency band was 1.05 or less in the L1 = 1.1 mm to 3.1 mm range (i.e., the entire measured range).

[0052] [4. Correspondence of Terms] In this embodiment, the circuit board 3 corresponds to an example of the first substrate in this disclosure, and the connection board 4 and antenna board 5 correspond to an example of the second substrate in this disclosure. In this embodiment, the feed line 34 corresponds to an example of the first line pattern in this disclosure, and the antenna feed line 53 corresponds to an example of the second line pattern in this disclosure. In this embodiment, the connection line 35 corresponds to an example of the connection pattern in this disclosure, the connection line 35A corresponds to an example of the narrow line in this disclosure, and the connection line 35B corresponds to an example of the wide line in this disclosure.

[0053] [5. Effects] The embodiments described in detail above produce the following effects. The high-frequency module 1 is newly equipped with a section of the connecting line 35 having a different line width W22 (i.e., connecting line 35B) than the section having a line width W21 (i.e., connecting line 35A) set to obtain a predetermined impedance in the connecting line 35. In the high-frequency module 1, by adding the line width W22 of connecting line 35B to the adjustment target in addition to the width W1 of the tip section 33A of the connecting section 33, the frequency range in which the desired VSWR is satisfied, i.e., the frequency range in which the high-frequency module 1 can be used, can be extended to higher frequencies.

[0054] [6. Other Embodiments] Although embodiments of the present disclosure have been described above, the present disclosure is not limited to the embodiments described above and can be implemented in various modified forms.

[0055] (6a) In the above embodiment, an example was shown in which the circuit board 3 is connected to the connection board 4 or the antenna board 5. However, the board connected to the circuit board 3 does not necessarily have to have an antenna element, and any board on which a high-frequency circuit is mounted can be connected.

[0056] (6b) Multiple functions of one component in the above embodiment may be realized by multiple components, or one function of one component may be realized by multiple components. Also, multiple functions of multiple components may be realized by one component, or one function realized by multiple components may be realized by one component. Furthermore, some of the configurations of the above embodiment may be omitted. Furthermore, at least some of the configurations of the above embodiment may be added to or replaced with the configurations of other above embodiments. [Explanation of Symbols]

[0057] 1...High-frequency module, 2...Metal frame, 3...Circuit board, 4...Connection board, 5...Antenna board, 5A...Ground surface, 5B...Pattern surface, 5C...Board through-hole, 6...Distribution board, 7...Connector group, 21...Base plate, 21A...Reflective surface, 21B...Retaining surface, 21C...Board retaining groove, 21D...Frame through-hole, 22...Wall plate, 23...End plate, 33...Connection part, 33A...Tip part, 33B...Root part, 34...Feed line, 35,35A,35B...Connection line, 36...Terminal pad, 51...Ground pattern, 51A...Pattern removal part, 52...Antenna element, 53...Antenna feed line, 54...Connection pad.

Claims

1. A first substrate having a connecting portion protruding from the end of the substrate, A second substrate is integrated with the first substrate, having a through-hole that penetrates the substrate in the thickness direction and through which the connecting portion is inserted, and with the connecting portion inserted through the through-hole, A metal frame interposed between the first substrate and the second substrate, configured to hold the first substrate and the second substrate together, Equipped with, The first substrate is, A first track pattern is provided on both sides of the substrate, facing each other, and forms a triplate track. A terminal pad is formed at the tip of the connecting portion that penetrates the through-hole in the substrate, A connection pattern that connects the first line pattern and the terminal pad, and is configured such that the line width gradually widens from the terminal pad toward the first line pattern, Equipped with, The second substrate is A second line pattern formed on the pattern surface of the second substrate, which together with a ground pattern formed on the ground surface opposite to the pattern surface, forms a microstrip line. A connection pad is provided that surrounds at least a portion of the through-hole in the substrate on the pattern surface, is connected to one end of the second line pattern, and is electrically connected to the terminal pad that penetrates the through-hole in the substrate, Equipped with, The connecting portion is configured to reach the substrate through hole formed in the second substrate through a frame through hole formed in the frame, The connection pattern comprises a narrow line located inside the frame through-hole and functioning as a coaxial line with the inner circumferential wall of the frame through-hole as the outer conductor, and a widened line located between the narrow line and the first line pattern, which is wider than the narrow line and narrower than the first line pattern, and is configured to form a coaxial line with the inner circumferential wall of the frame through-hole as the outer conductor and the connection pattern as the inner conductor. High-frequency module.

2. The high-frequency module according to Claim 1, The line width of the first line pattern forming the triplate line, the line width of the second line pattern forming the microstrip line, and the line width of the narrow line which is the terminal pad side portion of the connection pattern forming the coaxial line are set to achieve the same impedance. High-frequency module.

3. A high-frequency module according to claim 2, The pattern width of the terminal pad and the line width of the widened line, which is the portion of the connection pattern other than the narrow line, are set such that the average VSWR in the operating frequency band in which the high-frequency module is used is 1.05 or less. High-frequency module.

4. A high-frequency module according to claim 3, Let λg be the shortened wavelength within the first substrate at the center frequency of the aforementioned operating frequency band. The pattern width of the terminal pad is set to 0.039λg to 0.052λg. The track width of the widened track is set to 0.035λg to 0.057λg. High-frequency module.

5. A high-frequency module according to claim 3, The aforementioned operating frequency band is 0.5 GHz to 5.5 GHz. High-frequency module.

6. A high-frequency module according to any one of claims 1 to 5, The second substrate comprises one or more antenna elements connected to the second line pattern, The first substrate includes a power supply circuit that supplies power to the second substrate via the first line pattern. High-frequency module.

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