Multilayer ceramic electronic components

Abstract

Provided is a layered ceramic electronic component (1) with which it is easy to flatten the surface of a layered body (2). This layered ceramic electronic component (1) comprises a layered body (2) including a first internal electrode layer (10a) that is alternately layered with a plurality of ceramic layers (4) and is exposed at a first end surface (62a), a second internal electrode layer (10b) that is alternately layered with the plurality of ceramic layers (4) and is exposed at a second end surface (62b), a first step layer (5a) that is positioned on the same plane as the second internal electrode layer (10b) and is exposed at the first end surface (62a), and a second step layer (5b) that is positioned on the same plane as the first internal electrode layer (10a) and is exposed at the second end surface (62b), the thickness of the first step layer (5a) in a height direction (T) of the layered body (2) being greater in the portion of the first step layer (5a) that is located at a position near a first main surface (61a), and the thickness of the second step layer (5b) in the height direction (T) of the layered body (2) being greater in the portion of the second step layer (5b) that is located at a position near the first main surface (61a).

Description

Technical Field

[0001] The present invention relates to a multilayer ceramic electronic component, particularly a multilayer ceramic capacitor.

Background Art

[0002] Conventionally, multilayer ceramic capacitors are known as multilayer ceramic electronic components. Generally, a multilayer ceramic capacitor has a structure including a laminate which is a fired body in which a plurality of dielectric layers made of ceramic and internal electrode layers are alternately laminated, and external electrodes provided on both end faces of the laminate, and has a desired capacitance according to the number of laminated layers and the thickness of the dielectric layer. Patent Document 1 and the like describe providing a step absorption layer to eliminate steps due to the internal electrode layer.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in reality, it often curves toward the first main surface or the second main surface, and the degree of curvature tends to be stronger on the side farther from the surface in the curved direction. Therefore, when arranging a step absorption layer on the same plane of each internal electrode layer as described in Patent Document 1, the step absorption layer is also arranged for a portion that is not curved enough not to affect the structural defect. Therefore, there are problems such as the possibility of generating new structural defects and the cost of the step absorption layer becoming high. Thus, an object of the present invention is to suppress structural defects by suppressing costs and arranging an appropriate amount of step absorption layers at appropriate locations.

Means for Solving the Problems

[0005] The multilayer ceramic electronic component of the present invention includes a plurality of stacked ceramic layers, comprising: a first main surface and a second main surface opposite to each other in the height direction; a first side surface and a second side surface opposite to each other in the width direction perpendicular to the height direction; a first end surface and a second end surface opposite to each other in the length direction perpendicular to the height direction and the width direction; a first internal electrode layer alternately stacked with the plurality of ceramic layers and exposed on the first end surface; a second internal electrode layer alternately stacked with the plurality of ceramic layers and exposed on the second end surface; and arranged on the same plane as the second internal electrode layer. The laminate includes a first stepped layer exposed on the first end face and a second stepped layer arranged on the same plane as the first internal electrode layer and exposed on the second end face, and a first external electrode provided on the first end face and a second external electrode provided on the second end face, wherein the thickness of the first stepped layer in the height direction of the laminate is greater for the first stepped layer located closer to the first main surface, and the thickness of the second stepped layer in the height direction of the laminate is greater for the second stepped layer located closer to the first main surface.

[0006] Furthermore, the multilayer ceramic electronic component of the present invention includes a plurality of stacked ceramic layers, a first main surface and a second main surface facing each other in the height direction, a first side surface and a second side surface facing each other in the width direction perpendicular to the height direction, a first end surface and a second end surface facing each other in the length direction perpendicular to the height direction and the width direction, an end surface exposed electrode layer which is an internal electrode layer alternately stacked with the plurality of ceramic layers and exposed on the first end surface and the second end surface, a side surface exposed electrode layer which is an internal electrode layer alternately stacked with the plurality of ceramic layers and exposed on the first side surface and the second side surface, and the same plane as the end surface exposed electrode layer A laminate comprising: a side step layer arranged on the first side and the second side and exposed on the first side and the second side; an end step layer arranged on the same plane as the side exposed electrode layer and exposed on the first end face and the second end face; a first external electrode provided on the first end face and the second end face; and a second external electrode provided on the first side and the second side, wherein the thickness of the side step layer in the height direction of the laminate is greater for the side step layer located closer to the first main surface, and the thickness of the end step layer in the height direction of the laminate is greater for the end step layer located closer to the first main surface. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a multilayer ceramic electronic component in which the surface of the laminate can be made flatter. [Brief explanation of the drawing]

[0008] [Figure 1] This is a perspective view of a multilayer ceramic electronic component according to the first embodiment of the present invention. [Figure 2] This is a cross-sectional view taken along line II in Figure 1. [Figure 3] This is a cross-sectional view taken along line II-II in Figure 1. [Figure 4] This is a cross-sectional view of the laminate in the first embodiment. [Figure 5] This is a cross-sectional view of the laminate in the second embodiment. [Figure 6]This is a cross-sectional view of the LT of a multilayer ceramic electronic component according to the second embodiment. [Figure 7] This is a perspective view of a multilayer ceramic electronic component according to the third embodiment. [Figure 8] This is a cross-sectional view taken along line III-III in Figure 7. [Figure 9] This is a cross-sectional view taken along line IV-IV in Figure 7. [Figure 10] Figure 7 is a cross-sectional view along the VV line, showing the planar structure of the end-face exposed electrode layer. [Figure 11] Figure 7 is a cross-sectional view along the VV line, showing the planar structure of the side-exposed electrode layer. [Modes for carrying out the invention]

[0009] Hereinafter, an example of an embodiment of the multilayer ceramic electronic component 1 of the present invention will be described with reference to the attached drawings. In the following description, the case in which the multilayer ceramic electronic component 1 is a multilayer ceramic capacitor will be used as an example.

[0010] (First embodiment) The multilayer ceramic electronic component 1 of the first embodiment will be described. (Outline of multilayer ceramic electronic component) The external appearance of the multilayer ceramic electronic component 1 will be described based on Figure 1. Figure 1 is a perspective view showing the multilayer ceramic electronic component 1 of this embodiment. The multilayer ceramic electronic component 1 comprises a laminate 2 and an external electrode 20.

[0011] (Definition of direction) The drawings show the L, W, and T directions as appropriate. The L direction is the length direction of the multilayer ceramic electronic component 1. The W direction is the width direction of the multilayer ceramic electronic component 1. The T direction is the height direction of the multilayer ceramic electronic component 1. Accordingly, the cross-section shown in Figure 2 is called the LT cross-section, and the cross-section shown in Figure 3 is called the WT cross-section. The length direction L, the width direction W, and the height direction T do not necessarily have to be orthogonal to each other. The length direction L, the width direction W, and the height direction T may intersect to each other.

[0012] (Outer shape of the laminate) The laminate 2 has a substantially rectangular parallelepiped shape. The laminate 2 has two main surfaces 61, two end surfaces 62, and two side surfaces 63. The main surface 61 is a surface facing the height direction T. The end surface 62 is a surface facing the length direction L. The side surface 63 is a surface facing the width direction W. One of the two main surfaces 61 is defined as the first main surface 61a, and the other is defined as the second main surface 61b. One of the two end surfaces 62 is defined as the first end surface 62a, and the other is defined as the second end surface 62b. One of the two side surfaces 63 is defined as the first side surface 63a, and the other is defined as the second side surface 63b. The first main surface 61a and the first side surface 63a are shown in FIG. 1.

[0013] It is preferable that the ridge lines and corners of the laminate 2 are rounded. A ridge line is a portion where two surfaces of the laminate 2 intersect. A corner is a portion where three surfaces of the laminate 2 intersect. Note that the size of the laminate 2 is not particularly limited.

[0014] (Structure of the laminate) The laminate 2 includes a plurality of ceramic layers 4 and a plurality of internal electrode layers 10. Hereinafter, the structure of the laminate 2 will be described while referring to the cross-sectional view of the laminate 2.

[0015] (Internal structure of the laminate (LT cross-section)) Based on FIG. 2, the internal structure of the laminate 2 will be described. FIG. 2 is a cross-sectional view taken along the line I-I of the multilayer ceramic electronic component 1 shown in FIG. 1. FIG. 2 shows the LT cross-section of the multilayer ceramic electronic component 1. The laminate 2 includes a plurality of ceramic layers 4 and a plurality of internal electrode layers 10. The plurality of ceramic layers 4 and the plurality of internal electrode layers 10 are laminated on each other in the height direction T.

[0016] (Inner layer part and outer layer part) In the height direction T, the laminate 2 is divided into an inner layer part 53 and two outer layer parts 54. The outer layer part 54 includes a first outer layer part 54a and a second outer layer part 54b. The first outer layer part 54a and the second outer layer part 54b are located at positions sandwiching the inner layer part 53 in the height direction T.

[0017] The inner layer 53 contains parts of multiple ceramic layers 4 and multiple internal electrode layers 10. In the inner layer 53, the multiple internal electrode layers 10 face each other via the ceramic layers 4. As a result, capacitance is formed in the inner layer 53. Therefore, the inner layer 53 is a portion of the laminate 2 that functions substantially as a capacitor.

[0018] The first outer layer 54a is the portion of the outer layer 54 located on the side of the first main surface 61a of the laminate 2. The second outer layer 54b is the portion of the outer layer 54 located on the side of the second main surface 61b of the laminate 2. Specifically, the first outer layer 54a is the portion between the internal electrode layer 10 closest to the first main surface 61a and the first main surface 61a. The second outer layer 54b is the portion between the internal electrode layer 10 closest to the second main surface 61b and the second main surface 61b. No internal electrode layers 10 are arranged in the first outer layer 54a and the second outer layer 54b. The ceramic layers 4 remaining from the multiple ceramic layers 4, excluding the ceramic layer 4 for the inner layer 53, are arranged in the first outer layer 54a and the second outer layer 54b. The first outer layer 54a and the second outer layer 54b function as protective layers for the inner layer 53.

[0019] (Ceramic layer) The ceramic layer 4 can be classified into a ceramic layer 4 located in the inner layer 53 and a ceramic layer 4 located in the outer layer 54. The ceramic layer 4 located in the inner layer 53 is referred to as the inner ceramic layer 4a. The ceramic layer 4 located in the outer layer 54 is referred to as the outer ceramic layer 4b.

[0020] (Number of ceramic layers) The ceramic layers 4 laminated on the laminate 2 can be, for example, 5 to 2000 layers.

[0021] (Materials for the ceramic layer) As the material for the ceramic layer 4, for example, dielectric ceramics consisting of main components such as BaTiO3, CaTiO3, SrTiO3, and CaZrO3 can be used. Alternatively, these main components may be used with added minor components such as Mn compounds, Fe compounds, Cr compounds, Co compounds, and Ni compounds.

[0022] When piezoelectric ceramics are used in the laminate 2, the multilayer ceramic electronic component 1 functions as a ceramic piezoelectric element. Specific examples of piezoelectric ceramic materials include, for example, PZT (lead zirconate titanate) based ceramic materials.

[0023] When semiconductor ceramics are used in the laminate 2, the multilayer ceramic electronic component 1 functions as a thermistor element. Specific examples of semiconductor ceramic materials include, for example, spinel-based ceramic materials.

[0024] When a magnetic ceramic material is used in the laminate, the multilayer ceramic electronic component 1 functions as an inductor element. Furthermore, when the multilayer ceramic electronic component 1 functions as an inductor element, the internal electrode layer becomes a coil-shaped conductor. Specific examples of magnetic ceramic materials include, for example, ferrite ceramic materials.

[0025] (Thickness of the ceramic layer) The thickness of the ceramic layer 4 can be, for example, 10 μm or less.

[0026] (Internal electrode layer) The internal electrode layer 10 can be classified into a first internal electrode layer 10a and a second internal electrode layer 10b. The first internal electrode layer 10a is the internal electrode layer 10 connected to the first external electrode 20a. The second internal electrode layer 10b is the internal electrode layer 10 connected to the second external electrode 20b. The first internal electrode layer 10a extends from the first end face 62a toward the second end face 62b. The second internal electrode layer 10b extends from the second end face 62b toward the first end face 62a.

[0027] (Opposite section and extension section) The first internal electrode layer 10a and the second internal electrode layer 10b each have an opposing portion 11 and an extension portion 12. The opposing portion 11 is the portion of the internal electrode layer 10 where the first internal electrode layer 10a and the second internal electrode layer 10b face each other in the height direction T. The extension portion 12 is the portion of the internal electrode layer 10 that extends from the opposing portion 11 to the first end face 62a or the second end face 62b of the laminate 2.

[0028] The opposing portion 11 of the first internal electrode layer 10a is designated as the first opposing portion 11a. The extension portion 12 of the first internal electrode layer 10a is designated as the first extension portion 12a. The first extension portion 12a is the portion that extends from the first opposing portion 11a to the first end face 62a of the laminate 2.

[0029] Similarly, the opposing portion 11 of the second internal electrode layer 10b is designated as the second opposing portion 11b. The extension portion 12 of the second internal electrode layer 10b is designated as the second extension portion 12b. The second extension portion 12b is the portion that extends from the second opposing portion 11b to the second end face 62b of the laminate 2.

[0030] (Number of layers in the internal electrode layer) The internal electrode layer 10 can consist of, for example, 10 to 2000 layers. The number of layers in this internal electrode layer 10 includes the number of layers of the first internal electrode layer 10a and the number of layers of the second internal electrode layer 10b.

[0031] (Thickness of the internal electrode layer) The thickness of the internal electrode layer 10 can be, for example, 0.1 μm or more and 5.0 μm or less, preferably 0.2 μm or more and 2.0 μm or less. When the thickness of the internal electrode layer 10 is 0.5 μm or more, the plating film grows more easily when the metal layer of the external electrode 20 is formed by plating.

[0032] (Material of the internal electrode layer) The material of the internal electrode layer 10 can be, for example, metals such as Ni, Cu, Ag, Pd, and Au, or alloys of Ni and Cu or alloys of Ag and Pd. In addition, the material of the internal electrode layer 10 may also contain dielectric particles of the same composition as the ceramic contained in the ceramic layer 4.

[0033] (electrode facing part) The division of the laminate 2 in the longitudinal direction L will now be described. The laminate 2 can be divided in the longitudinal direction L into an electrode-facing portion 50 and an L-gap 51. The electrode-facing portion 50 in the division in the longitudinal direction L will be called the L-facing portion 50a. The L-gap 51 includes a first L-gap 51a and a second L-gap 51b.

[0034] The L-facing portion 50a corresponds to the portion where the first internal electrode layer 10a and the second internal electrode layer 10b face each other in the height direction T. A capacitance is formed in the L-facing portion 50a.

[0035] (L gap) The L gap 51 is the portion in the longitudinal direction L of the laminate 2 where the first internal electrode layer 10a and the second internal electrode layer 10b do not face each other in the height direction T. Of the L gap 51, the first L gap 51a is between the L-facing portion 50a and the first end face 62a. The second L gap 51b is between the L-facing portion 50a and the second end face 62b.

[0036] In the first L gap 51a, the first internal electrode layer 10a is located in the height direction T, but the second internal electrode layer 10b is not located. In the second L gap 51b, the second internal electrode layer 10b is located in the height direction T, but the first internal electrode layer 10a is not located.

[0037] The first L-gap 51a functions as a lead-out portion to the first end face 62a of the first opposing portion 11a. The second L-gap 51b functions as a lead-out portion to the second end face 62b of the second opposing portion 11b.

[0038] The length L in the longitudinal direction of the L gap 51 can be, for example, 10% to 30% of the length L in the longitudinal direction of the laminate 2.

[0039] (external electrode) The external electrode 20 includes a first external electrode 20a and a second external electrode 20b. (First external electrode) The first external electrode 20a is an external electrode 20 positioned on the first end face 62a of the laminate 2. The first external electrode 20a is electrically connected to the first internal electrode layer 10a. (Second external electrode) The second external electrode 20b is an external electrode 20 positioned on the second end face 62b of the laminate 2. The second external electrode 20b is electrically connected to the second internal electrode layer 10b.

[0040] (External electrodes on each surface) The external electrode 20 extends from one end face 62 to a portion of the two main faces 61 and to a portion of the two side faces 63.

[0041] (Layer configuration of external electrodes) The layer structure of the external electrode 20 will be described based on Figure 2. The external electrode 20 includes a base layer 21 and a plating layer 23. The plating layer 23 includes an inner plating layer 23a and a surface plating layer 23b. These layers are arranged in the order of base layer 21, inner plating layer 23a, and surface plating layer 23b from the end face 62 of the laminate 2.

[0042] (base layer) The base layer 21 is placed on the end face 62 of the laminate 2 and covers the end face 62. The base layer 21 extends from the end face 62 to a portion of the main surface 61 and a portion of the side surface 63.

[0043] (Baked layer) The base layer 21 is configured as a baked layer. The baked layer contains glass components and metals. The glass components include at least one selected from B, Si, Ba, Mg, Al, Li, etc. The metals include at least one selected from, for example, Cu, Ni, Ag, Pd, Ag-Pd alloy, Au, etc. The baked layer may consist of multiple layers.

[0044] (Plating layer) The plating layer 23 on the base layer 21 will now be described. As mentioned above, in this embodiment, the plating layer 23 includes an inner plating layer 23a and a surface plating layer 23b. When the plating layer 23 is made of two layers, it is preferable that the layers be in the order of Ni plating layer and Sn plating layer from bottom to top. That is, the inner plating layer 23a becomes the Ni plating layer and the surface plating layer 23b becomes the Sn plating layer. When there are three layers, it is preferable that the layers be in the order of Sn plating layer, Ni plating layer, and Sn plating layer from bottom to top.

[0045] The Ni plating layer prevents the underlayer 21 from being corroded by the solder used when mounting the multilayer ceramic electronic component 1. The Sn plating layer improves the wettability of the solder used when mounting the multilayer ceramic electronic component 1, making mounting easier. Therefore, by making the surface plating layer 23b a Sn plating layer, the wettability of the solder to the external electrode 20 can be improved. The thickness of each plating layer is preferably 3 μm to 9 μm.

[0046] (Internal structure of the laminate (WT cross-section)) The internal structure of the laminate 2 will be explained based on Figure 3. Figure 3 is a cross-sectional view taken along line II-II of the multilayer ceramic electronic component 1 shown in Figure 1. The laminate 2 is divided in the width direction W into an electrode-facing portion 50 and a W-gap 52. The electrode-facing portion 50 in the width direction W is referred to as the W-facing portion 50b. The W-gap 52 includes a first W-gap 52a and a second W-gap 52b.

[0047] The W-facing portion 50b is the portion where the internal electrode layers 10 face each other in the height direction T. The W-gap 52 is the portion in the width direction W where neither the first internal electrode layer 10a nor the second internal electrode layer 10b is located in the height direction T.

[0048] Of the W gaps 52, the first W gap 52a is between the W-facing portion 50b and the first side surface 63a in the width direction W of the laminate 2. The second W gap 52b is between the W-facing portion 50b and the second side surface 63b.

[0049] The first W gap 52a and the second W gap 52b are positioned to sandwich the W-facing portion 50b. The first W gap 52a and the second W gap 52b function as protective layers for the internal electrode layer 10.

[0050] The length of the widthwise W of the W gap 52 can be, for example, 20% to 30% of the length of the widthwise W of the laminate 2. Alternatively, the length of the widthwise W of the W gap 52 can be, for example, 5 μm to 50 μm.

[0051] (Size of multilayer ceramic electronic components) The size of the multilayer ceramic electronic component 1 is not particularly limited. The size of the multilayer ceramic electronic component 1 can be, for example, as follows: The length L dimension of the multilayer ceramic electronic component 1, including the laminate 2 and external electrodes 20, is denoted as dimension L. Dimension L is preferably 0.25 mm or more and 1.0 mm or less. The height T dimension of the multilayer ceramic electronic component 1, including the laminate 2 and external electrodes 20, is denoted as dimension T. Dimension T is preferably 0.125 mm or more and 0.5 mm or less. The width W dimension of the multilayer ceramic electronic component 1, including the laminate 2 and external electrodes 20, is denoted as dimension W. Dimension W is preferably 0.125 mm or more and 0.5 mm or less.

[0052] (step layer) The multilayer ceramic electronic component 1 of this embodiment is provided with a stepped layer 5. It is preferable that the length T in the height direction of the laminate 2 differs little between the electrode-facing portion 50 and the L-gap 51. However, in the inner layer portion 53, the length T in the height direction tends to differ between the electrode-facing portion 50 and the L-gap 51. The electrode-facing portion 50 has a ceramic layer 4 and an internal electrode layer 10 laminated on it. In contrast, the L-gap 51 has only a ceramic layer 4 laminated on it. The L-gap 51 does not have an internal electrode layer 10 laminated on it. Therefore, the length T in the height direction tends to differ between the electrode-facing portion 50 and the L-gap 51.

[0053] Therefore, in order to reduce the difference in length T in the height direction between the electrode opposing portion 50 and the L gap 51, an additional ceramic layer 4 is placed in the L gap 51. This additional ceramic layer 4 is designated as a stepped layer 5. Preferably, the stepped layer 5 has the same composition as the ceramic layer 4. However, the composition of the ceramic layer 4 is not limited to this.

[0054] (Arrangement of stepped layers) The arrangement of the stepped layer 5 in the multilayer ceramic electronic component 1 of this embodiment will be described with reference to Figure 4. Figure 4 is a cross-sectional view (LT) of the laminate 2 provided in the multilayer ceramic electronic component 1 of this embodiment. Figure 4 shows a cross-section of the laminate 2 at a position corresponding to line II in Figure 1. The stepped layer 5 is arranged between the leading edge E and the end face 62 in the longitudinal direction L of the internal electrode layer 10. The stepped layer 5 includes a first stepped layer 5a and a second stepped layer 5b.

[0055] (First step layer) The first stepped layer 5a is a stepped layer 5 that is arranged on the same plane as the second internal electrode layer 10b. The tip E of the second internal electrode layer 10b on the side of the first end face 62a in the longitudinal direction L is called tip E1. The first stepped layer 5a is arranged between tip E1 and the first end face 62a in the longitudinal direction L. The first stepped layer 5a is exposed from the first end face 62a.

[0056] (Second step layer) The second stepped layer 5b is a stepped layer 5 that is arranged on the same plane as the first internal electrode layer 10a. The tip E of the first internal electrode layer 10a on the side of the second end face 62b in the longitudinal direction L is called tip E2. The second stepped layer 5b is arranged in the longitudinal direction L between tip E2 and the second end face 62b. The second stepped layer 5b is exposed from the second end face 62b.

[0057] As mentioned above, the laminate 2 has multiple internal electrode layers 10 stacked on top of each other. The first step layer 5a and the second step layer 5b can be placed for each internal electrode layer 10. Therefore, multiple first step layers 5a and second step layers 5b are arranged in one laminate 2. Note that Figure 4 shows two layers each of the first step layer 5a and the second step layer 5b. This is because Figure 4 is a simulated diagram for explanatory purposes. Therefore, Figure 4 does not mean that the number of layers in a multilayer ceramic capacitor is limited to the number of layers shown in Figure 4.

[0058] (Thickness of the stepped layer) The length T in the height direction of the stepped layer 5 is defined as the thickness of the stepped layer 5. (Change in thickness) In the multiple first stepped layers 5a, the thickness of the first stepped layers 5a is greater for those located closer to the first main surface 61a than for those located closer to the second main surface 61b. The same applies to the second stepped layer 5b. In multiple second stepped layers 5b, the thickness of the second stepped layer 5b is greater for the second stepped layer 5b located closer to the first main surface 61a than for the second stepped layer 5b located closer to the second main surface 61a.

[0059] Figure 4 shows the thickness of the stepped layer 5 as H. Figure 4 shows two first stepped layers 5a and two second stepped layers 5b. For the two first stepped layers 5a, the thickness of the first stepped layer 5a closer to the first main surface 61a is taken as H2, and the thickness of the first stepped layer 5a closer to the second main surface 61b is taken as H4. Thickness H2 is greater than thickness H4.

[0060] The same applies to the second stepped layer 5b. For the two second stepped layers 5b, let H1 be the thickness of the second stepped layer 5b closer to the first main surface 61a, and let H3 be the thickness of the second stepped layer 5b closer to the second main surface 61b. Thickness H1 is greater than thickness H3.

[0061] As described above, in the multilayer ceramic electronic component 1 of this embodiment, the thickness of the ceramic layer 4 in the height direction T between the internal electrode layers 10 connected to the same external electrode 20 increases as it approaches the first main surface 61a.

[0062] When fabricating the laminate 2, curvature of each layer due to the presence or absence of the internal electrode layer 10 is more likely to occur at the end of the lamination process than at the beginning. In other words, the effect of the step difference due to the presence or absence of the internal electrode layer 10 is greater at the end of the lamination process. Here, the beginning of the lamination process corresponds to the side of the second main surface 61b, and the end of the lamination process corresponds to the side of the first main surface 61a. In the multilayer ceramic electronic component 1 of this embodiment, a thicker stepped layer 5 is provided towards the end of the lamination. This allows the multilayer ceramic electronic component 1 to reduce the curvature of the laminate 2.

[0063] Furthermore, the step layer 5 may not be formed at the beginning of the lamination process. In other words, the step layer 5 may be partially formed in a portion of the laminated body 2 in the height direction T. This makes it possible to more effectively suppress the formation of steps in the laminated body 2.

[0064] (Comparison with the internal electrode layer) Next, the relationship between the thickness H of the stepped layer 5 and the thickness of the internal electrode layer 10 will be explained. Figure 4 shows the thickness of the internal electrode layer 10 as H. In this embodiment, the thickness H of the stepped layer 5 is 20% to 120% of the thickness K of the internal electrode layer 10. More specifically, the thickness of the first stepped layer 5a is 20% to 120% of the thickness of the second internal electrode layer 10b. Similarly, the thickness of the second stepped layer 5b is 20% to 120% of the thickness of the first internal electrode layer 10a. In the example shown in Figure 4, the thicknesses of the two first stepped layers 5a are H2 and H4. Also in Figure 4, the thickness of the second internal electrode layer 10b is shown as K2. Thicknesses H2 and H4 are between 20% and 120% of thickness K2. The same applies to the second stepped layer 5b. The thicknesses of the two second stepped layers 5b shown in Figure 4 are thickness H1 and thickness H3. Also in Figure 4, the thickness of the first internal electrode layer 10a is shown as K1. Thicknesses H1 and H3 are between 20% and 120% of thickness K1.

[0065] (Arrangement in the longitudinal direction) So far, we have described the configuration of the stepped layer 5 in the height direction T. Next, we will describe the arrangement of the stepped layer 5 in the length direction L. (end side) The stepped layer 5 is exposed from the end face 62. Specifically, the first stepped layer 5a is exposed to the first end face 62a, and the second stepped layer 5b is exposed to the second end face 62b.

[0066] (Internal electrode side) The end of the stepped layer 5 opposite to the end exposed from the end face 62 in the longitudinal direction L is in contact with the internal electrode layer 10 of the same layer as the stepped layer 5 at the tip E of the internal electrode layer 10. The tip E of the internal electrode layer 10 refers to the end of the internal electrode layer 10 opposite to the end exposed from the end face 62 in the longitudinal direction L. The tip E of the second internal electrode layer 10b on the side of the first end face 62a is defined as tip E1. The first stepped layer 5a is in contact with the second internal electrode layer 10b at tip E1 of the second internal electrode layer 10b. Similarly, the tip E of the first internal electrode layer 10a on the second end face 62b side is defined as tip E2. The second stepped layer 5b is in contact with the first internal electrode layer 10a at tip E2 of the first internal electrode layer 10a.

[0067] (L direction end) The L-direction end 47 refers to a region of 0 μm to 60 μm from the L-direction end of the internal electrode layer 10 toward the end face 62 to which the internal electrode layer 10 is connected. In other words, D1 shown in Figure 4 is between 0 μm and 60 μm.

[0068] Here, let D2 be the thickness of the ceramic layer 4 and step layer 5 between the first internal electrode layer 10a and the adjacent first internal electrode layer 10a on the first main surface 61a side. Also, let D3 be the thickness of the ceramic layer 4 and step layer 5 between the first internal electrode layer 10a and the adjacent second main surface 61b side. D2 is larger than D3. D2 increases as it approaches the first main surface side.

[0069] (coverage) The coverage of the internal electrode layer 10 will now be explained. The coverage at the L-direction end 47 of the internal electrode layer 10 is lower than the coverage at the opposing portion 11 of the internal electrode layer 10. Specifically, the coverage at the L-direction end 47 of the first internal electrode layer 10a is lower than the coverage at the first opposing portion 11a of the first internal electrode layer 10a. The same applies to the second internal electrode layer 10b; the coverage at the L-direction end 47 of the second internal electrode layer 10b is lower than the coverage at the second opposing portion 11b of the second internal electrode layer 10b.

[0070] (Additive concentration) Furthermore, at the L-direction end 47 of the internal electrode layer 10, the concentration of the additive, which is selected from Ni, V, and Sn, is lower when the internal electrode layer 10 is located closer to the second main surface 61b.

[0071] (Second embodiment) A second embodiment of the multilayer ceramic electronic component 1 of the present invention will be described with reference to Figures 5 and 6. Figure 5 is an LT cross-sectional view of the laminate 2 in the second embodiment. Figure 5 corresponds to Figure 4 in the first embodiment. Figure 6 is an LT cross-sectional view of a part of the multilayer ceramic electronic component 1 of the second embodiment. The following description will focus on the differences from the first embodiment. In the first embodiment, as shown in Figure 4, the length T in the height direction of the stepped layer 5 varied due to the internal electrode layer 10. In contrast, in the second embodiment, as shown in Figure 5, the length L in the length direction of the stepped layer 5 varies due to the internal electrode layer 10.

[0072] (Distance between the step layer and the internal electrode layer) The distance between the stepped layer 5 and the internal electrode layer 10 in the longitudinal direction L will be explained. Of the two ends of the stepped layer 5 in the longitudinal direction L, the end that is not exposed to the end face 62 will be called the inner end Q of the stepped layer 5. The distance in the longitudinal direction L between the tip E of the internal electrode layer 10 and the inner end Q of the stepped layer 5 which is arranged in the same layer as the internal electrode layer 10 will be J. This distance J is the distance between the stepped layer 5 and the internal electrode layer 10 in the longitudinal direction L.

[0073] The distance J in the longitudinal direction L between the stepped layer 5 and the internal electrode layer 10 becomes greater when the internal electrode layer 10 is located closer to the first main surface 61a. More specifically, the distance J in the longitudinal direction L between the first stepped layer 5a and the second internal electrode layer 10b is greater when the distance J in the longitudinal direction L between the first stepped layer 5a and the second internal electrode layer 10b is located closer to the first main surface 61a. Similarly, the distance J in the longitudinal direction L between the second step layer 5b and the first internal electrode layer 10a is greater when the second step layer 5b is located closer to the first main surface 61a.

[0074] Figure 5 shows two of the first stepped layer 5a and two of the second stepped layer 5b. For the two first stepped layers 5a, the distance J in the longitudinal direction L between the first stepped layer 5a and the second internal electrode layer 10b is defined as distance J2 for the first stepped layer 5a closer to the first main surface 61a, and distance J4 for the first stepped layer 5a closer to the second main surface 61b. Distance J2 is greater than distance J4.

[0075] The same applies to the second stepped layer 5b. For the two second stepped layers 5b, the distance J in the longitudinal direction L between the second stepped layer 5b and the first internal electrode layer 10a is defined as distance J1 for the second stepped layer 5b closer to the first main surface 61a, and distance J3 for the second stepped layer 5b closer to the second main surface 61b. Distance J1 is greater than distance J3.

[0076] As described above, in the multilayer ceramic electronic component 1 of this embodiment, the length of the stepped layer 5 becomes shorter as it approaches the first main surface 61a.

[0077] When fabricating the laminate 2, curvature of each layer due to the presence or absence of the internal electrode layer 10 is more likely to occur at the end of the lamination process than at the beginning. In other words, the effect of the step difference due to the presence or absence of the internal electrode layer 10 is greater at the end of the lamination process. Furthermore, the beginning of the bending of each layer is closer to the end face at the end of the lamination. In the multilayer ceramic electronic component 1 of this embodiment, the length of the stepped layer 5 from the end face 62 becomes shorter towards the end of the lamination. As a result, the multilayer ceramic electronic component 1 can reduce the curvature of the laminate 2. Furthermore, overlapping of the internal electrode layer 10 and the step layer 5 in the height direction T can be suppressed, thereby improving the reliability of the multilayer ceramic electronic component 1.

[0078] (Length ratio with L gap) The ratio of the lengths of the stepped layer 5 and the L gap 51 in the longitudinal direction L will be explained. In Figure 5, the length L in the longitudinal direction of the stepped layer 5 is shown by S. Also, the length L in the longitudinal direction of the L gap 51 is shown by D5. The length S of the stepped layer 5 is 20% or more of the length D5 of the L gap 51. More specifically, the length S in the longitudinal direction L of the first stepped layer 5a is 20% or more of the distance in the longitudinal direction L between the tip E1 of the second internal electrode layer 10b and the first end face 62a, i.e., the length D5 in the longitudinal direction L of the first L gap 51a. Similarly, the length S of the second stepped layer 5b in the longitudinal direction L is 20% or more of the distance L in the longitudinal direction between the tip E2 of the first internal electrode layer 10a and the second end face 62b, i.e., the length D5 of the second L gap 51b in the longitudinal direction L.

[0079] Figure 5 shows two of the first stepped layer 5a and two of the second stepped layer 5b. For the two first stepped layers 5a, the length S in the longitudinal direction L is set to S2 for the first stepped layer 5a closer to the first main surface 61a, and to S4 for the first stepped layer 5a closer to the second main surface 61b. Both lengths S2 and S4 are 20% or more of the length D5 in the longitudinal direction L of the first L gap 51a.

[0080] The same applies to the second stepped layer 5b. For the two second stepped layers 5b, the length S in the longitudinal direction L is set to length S1 for the second stepped layer 5b closer to the first main surface 61a, and to length S3 for the second stepped layer 5b closer to the second main surface 61b. Both length S1 and length S3 are 20% or more of the length D5 in the longitudinal direction L of the second L gap 51b.

[0081] (Bending section) The bent portion 40 of the internal electrode layer 10 will be described based on Figure 6. Figure 6 is an LT cross-sectional view of a part of the multilayer ceramic electronic component 1 of the second embodiment. Figure 6 shows the first L gap 51a of the multilayer ceramic electronic component 1, etc. In the second embodiment, the internal electrode layer 10 has a bent portion 40. The bent portion 40 refers to the portion of the internal electrode layer 10 in the extension 12 that is bent in the direction of the second main surface 61b.

[0082] Figure 6 shows the bent portions 40 of the first internal electrode layer 10a. Figure 6 shows five bent portions 40. The five bent portions 40 are labeled 41 to 45 in order from the first main surface 61a to the second main surface 61b.

[0083] (Starting point of the bend) The starting point of the bend in the bent portion 40 is denoted as point F, and the ending point of the bend is denoted as point G. The starting point of the bend is the point where the internal electrode layer 10a begins to bend in the direction of the second main surface 61b in the extended portion 12. In Figure 6, the starting point F of the bend for each bent portion 40 is shown as points F1 to F5.

[0084] (End point of the bend) The end point of the bend is the point where the bent portion 40 of the internal electrode layer 10 contacts the end face 62. In the configuration shown in Figure 6, the end point of the bend is the point where the first internal electrode layer 10a contacts the first end face 62a. In Figure 6, the points G, which are the end points of the bend for each bent portion 40, are shown as points G1 to G5.

[0085] (Length of the bent section) The length M of the bent portion 40 will now be explained. The length M of the bent portion 40 is the distance in the longitudinal direction L between the starting point G of the bend and the ending point G of the bend. Figure 6 shows the lengths M of each bent portion 40, from length M1 to length M5. The length M of the bent portion 40 becomes shorter as the internal electrode layer 10 is located closer to the second main surface 61b. That is, the length M decreases in the order from length M1 to length M5.

[0086] (Height of the bend) Let's explain the height N of the bent section 40. The height N of the bent section 40 is the distance in the height direction T between the starting point G of the bend and the ending point G of the bend. Figure 6 shows the height N of each bent portion 40, expressed as height N1 to length N5. The height N of the bent portion 40 decreases as the internal electrode layer 10 is located closer to the second main surface 61b. That is, the height N decreases in the order from height N1 to height N5.

[0087] (Third embodiment) A third embodiment of the multilayer ceramic electronic component 1 of the present invention will be described with reference to Figures 7 to 11. The following description will focus on the differences from the first and second embodiments. In the first and second embodiments, the case where the multilayer ceramic electronic component 1 is a two-terminal multilayer ceramic capacitor was described. However, the multilayer ceramic electronic component 1 is not limited to a two-terminal multilayer ceramic capacitor. The multilayer ceramic electronic component 1 can also be a multi-terminal multilayer ceramic capacitor with three or more terminals. In the third embodiment, the case where the multilayer ceramic electronic component 1 is a three-terminal multilayer ceramic capacitor will be described.

[0088] (Overview of multilayer ceramic electronic components) Based on Figure 7, the general structure of the multilayer ceramic electronic component 1 is explained. Figure 7 is a perspective view showing the multilayer ceramic electronic component 1 of this embodiment. As shown in Figure 7, the multilayer ceramic electronic component 1 of the third embodiment has external electrodes 20 formed on two side surfaces 63 in addition to the two end faces 62. The external electrodes 20 formed on the side surfaces 63 are referred to as side external electrodes 30. The side external electrodes 30 include a first side external electrode 30a and a second side external electrode 30b. The first side external electrode 30a is formed on the first side surface 63a. The second side external electrode 30b is formed on the second side surface 63b. In the multilayer ceramic electronic component 1 of this embodiment, in addition to the two end faces 62, the internal electrode layer 10 and the external electrode 20 can be connected at the two side faces 63.

[0089] (LT cross section layer) The LT cross-section of the multilayer ceramic electronic component 1 will be described based on Figure 8. Figure 8 is a cross-sectional view taken along line III-III in Figure 7. As shown in Figure 8, the laminate 2 has multiple end-face exposed electrode layers 10c and multiple side-face exposed electrode layers 10d laminated in between the inner ceramic layer 4a. The end-face exposed electrode layer 10c is connected to the first external electrode 20a at the first end face 62a. The end-face exposed electrode layer 10c is also connected to the second external electrode 20b at the second end face 62b. On the other hand, the side exposed electrode layer 10d is not connected to the external electrode 20 at any of the end faces 62. In a three-terminal multilayer ceramic capacitor, the end-face exposed electrode layer 10c functions as a through electrode. The side-face exposed electrode layer 10d functions as a ground electrode.

[0090] (WT cross section layer) Based on Figure 9, the WT cross-section of the multilayer ceramic electronic component 1 will be described. Figure 9 is a cross-sectional view taken along line IV-IV in Figure 7. As shown in Figure 9, the side exposed electrode layer 10d is connected to the first side external electrode 30a at the first side 63a. The side exposed electrode layer 10d is also connected to the second side external electrode 30b at the second side 63b. On the other hand, the end-face exposed electrode layer 10c is not connected to the external electrode 20 on any of the sides 63.

[0091] (Planar structure of the internal electrode layer) The planar structure of the end-face exposed electrode layer 10c and the side-face exposed electrode layer 10d will be explained based on Figures 10 and 11. Here, the planar structure refers to the structure of the internal electrode layer 10 when viewed from the height direction T of the multilayer ceramic electronic component 1. (Edge exposed electrode layer) The end-face exposed electrode layer 10c will be explained based on Figure 10. Figure 10 is a cross-sectional view taken along the VV line in Figure 7. Figure 10 shows the planar structure of the end-face exposed electrode layer 10c. A first end face extension 12c is provided in the portion of the end face exposed electrode layer 10c that is exposed to the first end face 62a. A second end face extension 12d is provided in the portion of the end face exposed electrode layer 10c that is exposed to the second end face 62b. The opposing portion 11 of the end-face exposed electrode layer 10c is connected to the first end face 62a via the first end-face extension 12c. Furthermore, the opposing portion 11 of the end-face exposed electrode layer 10c is connected to the second end face 62b via the second end-face extension 12d. In Figure 10, the end-face exposed electrode layer 10c is shown in a rectangular shape, but the width in the width direction W of the opposing portion 11 and the end-face vertical portion, i.e., the first end-face extension portion 12c and the second end-face extension portion 12d, may be the same.

[0092] (Side exposed electrode layer) The side-exposed electrode layer 10d will be explained based on Figure 11. Figure 11 is a cross-sectional view taken along the VV line in Figure 7. Figure 11 shows the planar structure of the side-exposed electrode layer 10d. A first side extension 12e is provided on the portion of the side exposed electrode layer 10d that is exposed on the first side surface 63a. A second side extension 12f is provided on the portion of the side exposed electrode layer 10d that is exposed on the second side surface 63b. The opposing portion 11 of the side exposed electrode layer 10d is connected to the first side surface 63a via the first side extension 12e. The opposing portion 11 of the side exposed electrode layer 10d is connected to the second side surface 63b via the second side extension 12f.

[0093] (Definition of domain) In the end-face exposed electrode layer 10c, the region corresponding to the area where the first side extension 12e is provided on the side-face exposed electrode layer 10d is defined as the third W gap 52c. Similarly, in the end-face exposed electrode layer 10c, the region corresponding to the area where the second side extension 12f is provided on the side-face exposed electrode layer 10d is defined as the fourth W gap 52d.

[0094] Furthermore, in the side exposed electrode layer 10d, the region corresponding to the area where the first end face extension 12c is provided on the end face exposed electrode layer 10c is defined as the third L gap 51c. Similarly, in the side exposed electrode layer 10d, the region corresponding to the area where the second end face extension 12d is provided on the end face exposed electrode layer 10c is defined as the fourth L gap 51d.

[0095] In the longitudinal direction L of the laminate 2, the extension region 55 where the first side extension portion 12e is provided is defined as the first L extension region 55c. Similarly, in the longitudinal direction L of the laminate 2, the extension region 55 where the second side extension portion 12f is provided is defined as the second L extension region 55d.

[0096] Furthermore, in the width direction W of the laminate 2, the extension region 55 where the first end face extension portion 12c is provided is defined as the first W extension region 55a. Similarly, in the width direction W of the laminate 2, the extension region 55 where the second end face extension portion 12d is provided is defined as the second W extension region 55b.

[0097] (step layer) Even if the multilayer ceramic electronic component 1 is a three-terminal multilayer ceramic capacitor, the stepped layer 5 is arranged in the same way as in the case of a two-terminal multilayer ceramic capacitor. By appropriately arranging the stepped layer 5, it is possible to suppress the non-uniformity of the thickness of the laminate 2 in the height direction T caused by the first end face extension portion 12c, the second end face extension portion 12d, the first side extension portion 12e, and the second side extension portion 12f.

[0098] (end face step layer) In this embodiment, the stepped layer 5 includes an end face stepped layer 5c and a side face stepped layer 5d. The end face step layer 5c can be used to eliminate the step caused by the first end face extension 12c and the second end face extension 12d of the end face exposed electrode layer 10c. The side-exposed electrode layer 10d does not have electrodes at the positions corresponding to the first end face extension 12c and the second end face extension 12d. Therefore, in the same layer as the side-exposed electrode layer 10d, an end face step layer 5c is placed at the positions corresponding to the first end face extension 12c and the second end face extension 12d. This makes it possible to suppress non-uniformity in the height direction T of the laminate 2.

[0099] There are two preferred regions for arranging the end face step layer 5c in the same layer as the side exposed electrode layer 10d. One is the portion in Figure 11 where the third L gap 51c and the first W extension region 55a overlap. The end face step layer 5c arranged in this portion reduces the height unevenness caused by the side exposed electrode layer 10d not having the first end face extension portion 12c. Another is the area in Figure 11 where the fourth L gap 51d and the second W extension region 55b overlap. The end face step layer 5c placed in this area reduces the height unevenness caused by the side exposed electrode layer 10d not having the second end face extension portion 12d.

[0100] (side step layer) Next, we will explain the side step layer 5d. The side step layer 5d can be used to eliminate the step caused by the first side extension 12e and the second side extension 12f of the side exposed electrode layer 10d. The end-face exposed electrode layer 10c does not have electrodes at the position corresponding to the first side extension 12e and the position corresponding to the second side extension 12f. Therefore, in the same layer as the end-face exposed electrode layer 10c, a side step layer 5d is placed at a position corresponding to the first side extension 12e and a position corresponding to the second side extension 12f. This makes it possible to suppress non-uniformity in the height direction T of the laminate 2.

[0101] There are two regions in which it is preferable to place the side step layer 5d in the same layer as the end-face exposed electrode layer 10c. One is the portion in Figure 10 where the third W gap 52c and the first L extension region 55c overlap. Placing the side step layer 5d in this portion reduces the height unevenness caused by the end-face exposed electrode layer 10c not having the first side extension portion 12e. Another is the area in Figure 10 where the fourth W gap 52d and the second L extension region 55d overlap. The side step layer 5d placed in this area reduces the height unevenness caused by the end face exposed electrode layer 10c not having the second side extension portion 12f.

[0102] The end face step layer 5c and the side step layer 5d can be arranged in the same manner as the first step layer 5a and the second step layer 5b described in the first and second embodiments. Furthermore, in the first and second embodiments, the shape of the stepped layer 5 was described using the vicinity of the end face 62 as an example. The shape of the stepped layer 5 described based on this end face 62 is applicable not only to the end face stepped layer 5c of the third embodiment but also to the side stepped layer 5d.

[0103] Furthermore, it is possible to provide a side step layer 5d in the same layer as the side exposed electrode layer 10d. When the side step layer 5d is provided in the same layer as the side exposed electrode layer 10d, the distance between the electrode layer 10 and the step layer 5 can be the distance in the length direction L between the adjacent side extensions 12e, 12f and the side step layer 5d. Also, the distance between the electrode layer 10 and the step layer 5 can be the distance in the width direction W between the adjacent side exposed electrode layer 10d facing portion 11 and the side step layer 5d.

[0104] Similarly, the end face step layer 5c can be provided in the same layer as the end face exposed electrode layer 10c. When the end face step layer 5c is provided in the same layer as the end face exposed electrode layer 10c, the distance between the electrode layer 10 and the step layer 5 can be the distance in the longitudinal direction L between the adjacent opposing portion 11 of the end face exposed electrode layer 10c and the end face step layer 5c. Alternatively, the distance between the electrode layer 10 and the step layer 5 can be the distance in the width direction W between the adjacent end face extensions 12c, 12d and the end face step layer 5c.

[0105] (Combination of embodiments) The embodiments described above can also be combined. In the first embodiment, the thickness of the stepped layer 5 in the height direction T was mainly described. On the other hand, in the second embodiment, the length of the stepped layer 5 in the length direction T was mainly described. For example, the thickness of the stepped layer 5 in the height direction T can be as in the first embodiment, and the length of the stepped layer 5 in the length direction T can be as in the second embodiment.

[0106] Furthermore, as described above, in the third embodiment, the stepped layer 5 of the first or second embodiment may be applied to at least one of the end-face exposed electrode layer 10c and the side-face exposed electrode layer 10d. Also, in the third embodiment, the stepped layer 5 of the first embodiment may be applied to one of the end-face exposed electrode layer 10c and the side-face exposed electrode layer 10d, and the stepped layer 5 of the second embodiment may be applied to the other. Also, in the third embodiment, the stepped layer 5 combining the first and second embodiments may be applied to at least one of the end-face exposed electrode layer 10c and the side-face exposed electrode layer 10d. Thus, the aforementioned embodiments can be combined in various ways.

[0107] (Manufacturing method for multilayer ceramic electronic components) A method for manufacturing a multilayer ceramic electronic component 1 will be described. (Fabrication of laminated blocks) Prepare a ceramic green sheet, an electrode paste for the internal electrode layer 10, and a step paste for the step layer 5.

[0108] (Application of paste) Electrode paste and step paste are applied to the ceramic green sheet in a desired pattern. The application of each paste to the ceramic green sheet can be done, for example, by screen printing or gravure printing. The electrode paste and step paste are printed onto the ceramic green sheet in a predetermined pattern using any printing method. This results in a ceramic green sheet for the inner layer 53 with the paste printed on it. The thickness of the step layer can be controlled by reducing the amount of step paste applied.

[0109] (Laminated) A predetermined number of ceramic green sheets without the pattern of the internal electrode layer 10 printed on them are stacked. This creates a portion corresponding to the outer layer 54. On top of this, ceramic green sheets for the inner layer 53, to which paste has been applied, are stacked sequentially. This creates a portion corresponding to the inner layer 53. Furthermore, a predetermined number of ceramic green sheets for the other outer layer 54 are stacked on top of that. This creates a laminated sheet. The laminated sheet is pressed in the height direction by means of a hydrostatic press or the like to create a laminated block.

[0110] (Fabrication of multilayer chips) The laminated block is cut to a predetermined size, and the laminated chips are cut out. At this time, the corners and edges of the laminated chips may be rounded by barrel polishing or other methods.

[0111] (Firing) Next, the laminated chips are fired to produce the laminated body 2. The firing temperature depends on the materials of the ceramic layer 4 and the internal electrode layer 10, but it is preferably between 900°C and 1400°C.

[0112] (external electrode) Next, the external electrode 20 is formed. (base layer) A conductive paste, which will form the base layer 21, is applied to the two end faces 62 of the laminate 2 to form the base layer 21. Furthermore, in order to form the baked layer, a conductive paste containing glass components and metal is applied by methods such as dipping. After that, a baking treatment is performed to form the base layer 21. The baking treatment temperature is preferably between 500°C and 900°C. The baking treatment time is preferably between 30 minutes and 2 hours. The atmosphere for the baking treatment is preferably a reducing atmosphere containing, for example, H2O or H2.

[0113] Next, a plating layer 23 is formed on the surface of the base layer 21. In this embodiment, a Ni plating layer is formed on the baked layer. This Ni plating layer becomes the inner plating layer 23a. Next, a Sn plating layer is formed on the Ni plating layer. This Sn plating layer becomes the outer plating layer 23b. The Ni plating layer and the Sn plating layer are formed sequentially, for example, by a barrel plating method. In this way, a multilayer ceramic electronic component 1 is obtained.

[0114] Furthermore, when manufacturing a three-terminal multilayer ceramic capacitor, external electrodes 20 are formed not only on the two end faces 62 of the laminate 2, but also on the two side faces 63.

[0115] (Method for measuring thickness) One method for measuring the length and thickness of the ceramic layer 4 and the internal electrode layer 10 is to observe a cross-section of the laminate 2, exposed by polishing, using a scanning electron microscope. Furthermore, each value can be the average of measurements taken at multiple locations corresponding to the area to be measured. Furthermore, the lengths of various parts of the laminate 2 can be measured with a micrometer or optical microscope. The stepped layers become thicker as they approach the first main surface. At this time, the distance between the first internal electrode layer and the closest first internal electrode layer on the first main surface side becomes thicker as it approaches the first main surface.

[0116] (Method for measuring coverage) Coverage can be measured, for example, as follows: The internal electrode layer 10 contains voids where no metal is present. The proportion of metal in the internal electrode layer 10 is defined as coverage. However, when the internal electrode layer 10 is laminated with the ceramic layer 4, some of the voids in the internal electrode layer 10 may be filled with ceramic material. Therefore, the definition of coverage is metal / (metal + (voids or ceramic material)). In other words, the entire internal electrode layer 10 is defined as the sum of (i) the portion where metal and (ii) the ceramic material are not filled and exist as a cavity, and (iii) the portion where the cavity is filled with ceramic material. The proportion of (i) the metal to the entire internal electrode layer 10 is defined as the coverage.

[0117] Coverage can be performed in the following ways: First, the laminate 2 is polished to expose the cross-section of the area where coverage is to be measured. Then, the exposed stepped surface is observed using an optical microscope or similar device to determine the area of ​​metal within a predetermined range. Coverage is calculated based on the determined area. Note that coverage can also be calculated by averaging the values ​​obtained at multiple locations.

[0118] Although embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above, and various modifications and variations are possible.

[0119] <1> It includes multiple stacked ceramic layers, A first principal surface and a second principal surface that are opposite each other in the height direction, The first side surface and the second side surface which are perpendicular to the height direction and opposite to each other in the width direction, A first end face and a second end face that are opposite to each other in the longitudinal direction perpendicular to the height direction and the width direction, The plurality of ceramic layers are alternately stacked, and a first internal electrode layer is exposed on the first end face, The plurality of ceramic layers are alternately stacked, and a second internal electrode layer is exposed on the second end face, A first stepped layer is arranged on the same plane as the second internal electrode layer and is exposed on the first end face, A laminate comprising: a second stepped layer disposed on the same plane as the first internal electrode layer and exposed on the second end face; The first external electrode provided on the first end face, The device comprises a second external electrode provided on the second end face, The thickness of the first stepped layer in the height direction of the laminate becomes thicker as the first stepped layer located closer to the first main surface increases. The thickness of the second stepped layer in the height direction of the laminate is such that the second stepped layer located closer to the first main surface is thicker. Multilayer ceramic electronic components.

[0120] <2> The thickness of the first stepped layer is 20% to 120% of the thickness of the second internal electrode layer. The thickness of the second stepped layer is 20% to 120% of the thickness of the first internal electrode layer. <1> Multilayer ceramic electronic components as described above.

[0121] <3> The first internal electrode layer and the second step layer are in contact. The second internal electrode layer and the first stepped layer are in contact. <1> or <2> Multilayer ceramic electronic components as described above.

[0122] <4> When the region of the first internal electrode layer extending from its longitudinal tip towards the first end face, and the region of the second internal electrode layer extending from its longitudinal tip towards the second end face, are defined as the ends in the L direction, The coverage at the L-direction end is lower than the coverage at the opposing portion of the first internal electrode layer. The coverage at the L-direction end is lower than the coverage at the opposing portion of the second internal electrode layer. <1> from <3> A multilayer ceramic electronic component as described in any one of the following.

[0123] <5> At the L-direction end, the concentration of the additive selected from Ni, V, and Sn is: The internal electrode layer located closer to the second main surface is lower. <4> Multilayer ceramic electronic components as described above.

[0124] <6> It includes multiple stacked ceramic layers, A first principal surface and a second principal surface that are opposite each other in the height direction, The first side surface and the second side surface which are perpendicular to the height direction and opposite to each other in the width direction, A first end face and a second end face that are opposite to each other in the longitudinal direction perpendicular to the height direction and the width direction, The plurality of ceramic layers are alternately laminated, and the end-face exposed electrode layer is an internal electrode layer exposed at the first end face and the second end face, A side-exposed electrode layer, which is an internal electrode layer exposed on the first side and the second side, is alternately laminated with the plurality of ceramic layers, Displaced on the same plane as the end-face exposed electrode layer, the side step layer is exposed on the first side and the second side, A laminate including an end face step layer disposed on the same plane as the side exposed electrode layer and exposed at the first end face and the second end face, The first external electrode provided on the first end face and the second end face, The first and second external electrodes are provided on the first and second sides, and the device comprises The thickness of the side step layer in the height direction of the laminate becomes thicker as the side step layer located closer to the first main surface increases. The thickness of the end face step layer in the height direction of the laminate is such that the end face step layer located closer to the first main surface is thicker. Multilayer ceramic electronic components. [Explanation of Symbols]

[0125] 1. Multilayer ceramic electronic components 2 Laminate 4. Ceramic layer 5 step layer 10 Internal electrode layer 11 Opposite section 12 Extension 20 External electrode 21 Base layer 23 Plating layer 30 Side external electrode 40. Flexed section 41 to 45 First bend to fifth bend 47 L direction end 50 Electrode facing part 51 L gap 52 W gap 53 Inner layer 54 Outer layer 55 Extension area 61 Main surface 62 End face 63 Side view T (height direction) L (Length direction) W (width direction)

Claims

1. A first principal surface and a second principal surface that are opposite each other in the height direction, The first side surface and the second side surface which are perpendicular to the height direction and opposite to each other in the width direction, A first end face and a second end face that are opposite to each other in the length direction perpendicular to the height direction and the width direction, The first internal electrode layer exposed on the first end face, The second internal electrode layer exposed on the second end face, A laminate comprising: a first stepped layer disposed on the same plane as the second internal electrode layer and exposed on the first end face; The first external electrode provided on the first end face, The device comprises a second external electrode provided on the second end face, The thickness of the first stepped layer in the stacked body in the height direction is such that the first stepped layer located closer to the first main surface is thicker. Multilayer ceramic electronic components.

2. The thickness of the first stepped layer is 20% to 120% of the thickness of the second internal electrode layer. The multilayer ceramic electronic component according to claim 1.

3. The second internal electrode layer and the first stepped layer are in contact. The multilayer ceramic electronic component according to claim 1 or 2.

4. When the region from the longitudinal tip of the second internal electrode layer toward the second end face is defined as the L-direction end, The coverage at the L-direction end is lower than the coverage at the opposing portion of the second internal electrode layer. The multilayer ceramic electronic component according to claim 1 or 2.

5. At the L-direction end, the concentration of the additive selected from Ni, V, and Sn is: The second internal electrode layer located closer to the second main surface is lower. The multilayer ceramic electronic component according to claim 4.

6. A first principal surface and a second principal surface that are opposite each other in the height direction, The first side surface and the second side surface which are perpendicular to the height direction and opposite to each other in the width direction, A first end face and a second end face that are opposite to each other in the length direction perpendicular to the height direction and the width direction, The end face exposed electrode layer is an internal electrode layer exposed to the first end face and the second end face, The side exposed electrode layer is an internal electrode layer exposed on the first side and the second side, A laminate comprising: a side step layer disposed on the same plane as the end face exposed electrode layer and exposed on the first side surface and the second side surface; The first external electrode provided on the first end face and the second end face, The first side and the second side are provided with second external electrodes, The thickness of the side step layer in the height direction of the laminate is such that the side step layer located closer to the first main surface is thicker. Multilayer ceramic electronic components.

7. A first main surface and a second main surface that are opposite to each other in the height direction, The first side surface and the second side surface which are perpendicular to the height direction and opposite to each other in the width direction, A laminate comprising a first end face and a second end face that are opposite to each other in the longitudinal direction perpendicular to the height direction and the width direction, A first external electrode disposed on the first end face, The second external electrode positioned on the second end face and Equipped with, The laminated body is A first internal electrode layer and a second internal electrode layer, Ceramic layer and The first stepped layer and the second stepped layer Equipped with, A multilayer ceramic electronic component in which the thickness in the height direction between the first internal electrode layer and the first internal electrode layer is greater in the height direction between the first internal electrode layer located closer to the first main surface.

8. The first internal electrode layer is The second internal electrode layer and the first opposing portion facing the height direction, A first extension extending from the first opposing portion to the first end face and Equipped with, The multilayer ceramic electronic component according to claim 7, wherein the thickness in the height direction between the first extension and the first extension is greater in the height direction between the first extension and the first extension located closer to the first main surface.

9. The multilayer ceramic electronic component according to claim 7 or 8, wherein the first internal electrode layer is exposed on the first end face and the second end face.

10. The multilayer ceramic electronic component according to claim 7 or 8, wherein the second internal electrode layer is exposed on the second end face.

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