Camera device

Abstract

This embodiment relates to a camera device including a first substrate; a base disposed on the first substrate; an image sensor disposed on the first substrate to move in a direction perpendicular to an optical axis; a housing coupled to the base; a bobbin disposed on the base and disposed to move in the direction of the optical axis; a sensing substrate disposed in the housing; and a connecting substrate connecting the image sensor to the first substrate, the connecting substrate including a first terminal portion connected to the first substrate and a second terminal portion connected to the sensing substrate.

Description

Technical Field

[0001] This embodiment relates to a camera device.

Background Art

[0002] A camera device is a device that captures a subject in a photograph or video, and is mounted on an optical device such as a smartphone, a drone, a vehicle, etc.

[0003] In a camera device, in order to improve the quality of an image, a shake correction (optical image stabilization, OIS) function for correcting the shake of an image due to the movement of a user is required.

[0004] In a camera device, the shake correction function is executed by moving a lens in a direction perpendicular to the optical axis. However, in recent years, due to the trend of increasing pixel count, the diameter of the lens has increased, the weight of the lens has increased, and accordingly, there is a problem that it is difficult to secure an electromagnetic force for moving the lens within a limited space.

Summary of the Invention

Problems to be Solved by the Invention

[0005] An object of this embodiment is to provide a camera device that performs a shake correction function by moving an image sensor.

[0006] An object of this embodiment is to provide a camera device that drives an image sensor in the x-axis shift, y-axis shift, and z-axis rolling, that is, in three axes. Technical Solution ​​​The camera device according to this embodiment includes a first substrate; a base disposed on the first substrate; an image sensor disposed on the first substrate so as to move in a direction perpendicular to the optical axis; a housing coupled to the base; a bobbin disposed on the base so as to move in the direction of the optical axis; a sensing substrate disposed on the housing; and a connecting substrate connecting the image sensor and the first substrate, wherein the connecting substrate may include a first terminal portion connected to the first substrate and a second terminal portion connected to the sensing substrate.

[0008] The image sensor may be coupled to the holder, which is located on the first substrate.

[0009] The connecting substrate may include a first connecting region that is coupled to the base, a second connecting region that is coupled to the holder, and a connecting portion that connects the first connecting region and the second connecting region.

[0010] The sensing board may include a Hall sensor or a driver IC.

[0011] The camera device according to this embodiment includes a fixed part including a first substrate and a sensing substrate; a first movable part arranged to move in the optical axis direction with respect to the fixed part; a second movable part arranged to move in a direction perpendicular to the optical axis direction; and a connecting substrate connecting the fixed part and the second movable part, wherein the connecting substrate may include a first terminal part connected to the first substrate and a second terminal part connected to the sensing substrate.

[0012] The connecting substrate can move in a direction perpendicular to the optical axis direction with respect to the first coupling region which is coupled to the fixed portion.

[0013] The connecting substrate includes a connecting portion connected to the second movable portion, an extension portion extending from the connecting portion, and a terminal portion connected to the extension portion and coupled to the first substrate, wherein at least a portion of the extension portion can move in a direction perpendicular to the optical axis direction with respect to the terminal portion.

[0014] The second moving part may include an image sensor, and the first moving part may include a lens.

[0015] The camera device according to this embodiment includes a main board, a fixed part including a sensing board, a first movable part including a bobbin and arranged to move in the optical axis direction with respect to the fixed part, a second movable part including a holder board and arranged to move in a direction perpendicular to the optical axis, and a connecting board connecting the fixed part and the second movable part, wherein the holder board is arranged between the main board and the bobbin, and the connecting board includes a first terminal part connected to the main board and a second terminal part connected to the sensing board.

[0016] The connecting substrate is formed integrally with the holder substrate, and the connecting substrate may include a first bending region that is bent in the direction of the optical axis and a second bending region that is bent in a direction perpendicular to the optical axis.

[0017] The camera device according to this embodiment includes a fixed part including a first substrate; a first movable part disposed within the fixed part and including a lens; a second movable part including an image sensor disposed below the lens; a first drive unit for moving the first movable part in the optical axis direction; a second drive unit for moving the second movable part in a direction perpendicular to the optical axis direction; a sensing substrate disposed in the fixed part; a sensor disposed on the sensing substrate for sensing the movement of the first movable part; and a connecting substrate for electrically connecting the first substrate and the image sensor, wherein the connecting substrate may include a first terminal portion connected to the first substrate and a second terminal portion connected to the sensing substrate.

[0018] The camera device according to this embodiment includes a fixed part including a first substrate; a first movable part disposed within the fixed part and including a lens; a second movable part including an image sensor disposed at a position corresponding to the lens; a drive magnet disposed in the fixed part; a first coil disposed in the first movable part at a position corresponding to the drive magnet; a second coil disposed in the second movable part at a position corresponding to the drive magnet; a connecting substrate connecting the first substrate and the second movable part; a sensing substrate disposed in the fixed part; and a driver IC disposed on the sensing substrate and electrically connected to the first coil, wherein the connecting substrate includes a first terminal and a second terminal, the first terminal of the connecting substrate is connected to the first substrate, and the sensing substrate is connected to the second terminal of the connecting substrate.

[0019] The first terminal and the second terminal of the connecting substrate can be arranged on the outer surface of the connecting substrate.

[0020] The second terminal of the connecting substrate can be positioned on the outer surface of the connecting substrate at a distance from the first terminal.

[0021] The first terminal of the connecting substrate is located at the lower end of the connecting substrate, and the second terminal of the connecting substrate can be located at a distance from the lower end of the connecting substrate.

[0022] The second terminal of the connecting substrate can be positioned on the first terminal in the optical axis direction.

[0023] The second movable part includes a second substrate electrically connected to the image sensor, and the connecting substrate includes a connecting part connected to the second substrate, a terminal part connected to the first substrate, and an extension part connecting the connecting part and the terminal part, and the first terminal and the second terminal can be arranged on the terminal part.

[0024] The camera device includes a sensing magnet and a correction magnet that are arranged on opposite sides of the first moving part. The driver IC includes a sensor part that senses the sensing magnet, and the driver IC can be arranged to face the sensing magnet.

[0025] The camera device includes an upper elastic member and a lower elastic member that connect the fixed part and the first moving part. The lower elastic member is arranged below the upper elastic member. The lower elastic member includes two lower elastic members that are separated from each other, and the two lower elastic members can electrically connect the sensing substrate and the first coil.

[0026] The sensing substrate can include a first terminal connected to the second terminal of the connection substrate and a second terminal connected to the two lower elastic members.

[0027] The second terminal of the connection substrate includes four second terminals, and the first terminal of the sensing substrate can include four first terminals that are coupled to the four second terminals of the connection substrate.

[0028] The sensing substrate is bent at least twice in a direction perpendicular to the optical axis direction.

[0029] The fixed part includes a base arranged on the first substrate and a housing arranged on the base. The housing includes a hole or groove that sinks in a shape corresponding to the sensing substrate. A part of the connection substrate is fixed to the base, and the sensing substrate can be arranged in the hole or groove of the housing.

[0030] The sensing substrate is separated from the first substrate and can be electrically connected to the first substrate via the connection substrate.

[0031] The fixing portion includes a cover member including an upper plate and a side plate extending from the upper plate, the sensing substrate includes a first terminal connected to the second terminal of the connecting substrate, and the cover member may include a groove formed by recessing from the lower end of the side plate to expose the first terminal of the sensing substrate.

[0032] The optical device according to this embodiment may include a main body; a camera device according to claim 1 disposed on the main body; and a display disposed on the main body that outputs video or images captured by the camera device.

[0033] The camera device according to this embodiment includes: a fixed part including a first substrate; a first movable part disposed within the fixed part and including a lens; a second movable part disposed between the first movable part and the first substrate and including an image sensor; a drive magnet disposed in the fixed part; a first coil disposed in the first movable part at a position corresponding to the drive magnet; a second coil disposed in the second movable part at a position corresponding to the drive magnet; a connecting substrate connecting the first substrate and the second movable part; a sensing magnet disposed in the first movable part; a sensing substrate disposed in the fixed part; and a sensor disposed on the sensing substrate that senses the sensing magnet, wherein the sensing substrate is coupled to the connecting substrate and can be electrically connected to the first substrate via the connecting substrate.

[0034] The second movable part includes a second substrate electrically connected to the image sensor, the connecting substrate includes a connecting portion connected to the second substrate, a terminal portion connected to the first substrate, and an extension portion connecting the connecting portion and the terminal portion, and the sensing substrate can be connected to the terminal portion of the connecting substrate.

[0035] The connecting substrate includes a first terminal and a second terminal arranged on the outer surface of the terminal portion, the second terminal being positioned on the first terminal, the first terminal of the connecting substrate being connected to the first substrate, and the sensing substrate being connected to the second terminal of the connecting substrate.

[0036] The sensing substrate can be separated from the first substrate.

[0037] The camera device according to this embodiment includes a first substrate; a housing disposed on the first substrate; a bobbin disposed inside the housing; a second substrate disposed between the bobbin and the first substrate; a holder coupled to the second substrate; a drive magnet disposed in the housing; a first coil disposed on the bobbin at a position corresponding to the drive magnet; a second coil disposed on the holder at a position corresponding to the drive magnet; a connecting substrate connecting the first substrate and the second substrate; a sensing substrate disposed in the housing; and a driver IC disposed on the sensing substrate and electrically connected to the first coil. The connecting substrate includes a connecting portion connected to the second substrate, a terminal portion coupled to the first substrate, and an extension portion connecting the connecting portion and the terminal portion. The connecting substrate includes a first terminal and a second terminal disposed on the outer surface of the terminal portion. The second terminal is disposed on top of the first terminal. The first terminal of the connecting substrate is connected to the first substrate, and the sensing substrate is connected to the second terminal of the connecting substrate. [Effects of the Invention]

[0038] This embodiment prevents interference between the sensing board for AF drive control and the connecting board for powering the image sensor.

[0039] More specifically, the phenomenon of the connecting board interfering with the sensing board during the movement of the connecting board is prevented.

[0040] Furthermore, the cover member is assembled into the OIS assembly while already assembled into the AF assembly, via a partially open structure of the cover member. [Brief explanation of the drawing]

[0041] [Figure 1] This is a perspective view of the camera device according to this embodiment. [Figure 2]This is an exploded perspective view of the camera device according to this embodiment, with the cover member separated. [Figure 3] This is a plan view of the camera device according to this embodiment. [Figure 4] This is a cross-sectional view as seen in Figure 3, section AA. [Figure 5] This is a cross-sectional view taken at BB in Figure 3. [Figure 6] This is a cross-sectional view taken at CC in Figure 3. [Figure 7] This is an exploded perspective view of the camera device according to this embodiment. [Figure 8] This is an exploded perspective view of the camera device according to this embodiment, viewed from a different direction than that shown in Figure 7. [Figure 9] This is an exploded perspective view of the first moving part and related configuration of the camera device according to this embodiment. [Figure 10] This is an exploded perspective view of the second moving part and related components of the camera device according to this embodiment. [Figure 11] This is a perspective view of the camera device according to this embodiment. [Figure 12A] This is a perspective view of the camera device according to this embodiment, with the cover member omitted. [Figure 12B] This is a partially enlarged view of Figure 12A. [Figure 12C] This figure illustrates the connection between the sensing board and the connecting board of a modified camera device. [Figure 13] This is a plan view of the camera device according to this embodiment, with the cover member omitted. [Figure 14] This is a bottom view of the first moving part and related configuration of the camera device according to this embodiment. [Figure 15] This is a perspective view of a modified camera device in which the cover member has been omitted. [Figure 16] This is a perspective view of the second moving part and the connecting substrate of the camera device according to this embodiment. [Figure 17] This is a perspective view illustrating the drive magnet and drive coil of the camera device according to this embodiment. [Figure 18]This is a cross-sectional view of the camera device according to this embodiment. The wires of the camera device according to this embodiment are omitted in drawings other than Figure 18. However, the wires can be illustrated and explained in Figure 18 as a component of the camera device according to this embodiment. [Figure 19] This is a diagram illustrating the operation of the autofocus function of the camera device according to this embodiment. [Figure 20] This is a diagram illustrating the drive of the image stabilization function of the camera device according to this embodiment. More specifically, Figure 20 is a diagram illustrating the drive of the image sensor of the camera device according to this embodiment being shifted along the x-axis. [Figure 21] This is a diagram illustrating the drive of the image stabilization function of the camera device according to this embodiment. More specifically, Figure 21 is a diagram illustrating the drive of the image sensor of the camera device according to this embodiment being shifted along the y-axis. [Figure 22] This is a diagram illustrating the drive of the image stabilization function of the camera device according to this embodiment. More specifically, Figure 22 is a diagram illustrating the drive of the image sensor of the camera device according to this embodiment, which rolls around the z-axis. [Figure 23] This is a perspective view of the optical instrument according to this embodiment. [Figure 24] This is a perspective view of the optical device according to this embodiment, taken from a different direction than Figure 23. [Modes for carrying out the invention]

[0042] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0043] However, the technical concept of the present invention is not limited to the embodiments described, and can be realized in various different forms. Within the scope of the technical concept of the present invention, one or more components of the embodiments can be selectively combined or substituted for each other.

[0044] Furthermore, unless otherwise explicitly defined, terms used in the embodiments of the present invention (including technical and scientific terms) should be interpreted in a way that is generally understood by a person with ordinary skill in the art to which the present invention pertains. Terms that are commonly used, such as those defined in dictionaries, should be interpreted in consideration of their meaning in the context of the relevant art.

[0045] Furthermore, the terminology used in the embodiments of the present invention is for illustrative purposes only and does not limit the present invention.

[0046] In this specification, the singular form includes the plural form unless otherwise specified in the text, and when it says "A and / or at least one of B, C," it may include one or more of all possible combinations of A, B, and C.

[0047] Furthermore, when describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used. Such terms are used to distinguish a component from other components, and do not limit the essence, order, or sequence of the component in question.

[0048] Furthermore, when it is stated that one component is “linked,” “joined,” or “connected” to another component, this may include not only cases where the component is “linked,” “joined,” or “connected” to the other component directly, but also cases where it is “linked,” “joined,” or “connected” by yet another component between that component and the other component.

[0049] Furthermore, when it is stated that each component is formed or positioned "above" or "below," "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or positioned between the two components. Also, when it is indicated as "above" or "below," it includes not only the upward direction but also the downward direction relative to one component.

[0050] The camera device according to this embodiment will be described below with reference to the drawings.

[0051] Figure 1 is a perspective view of the camera device according to this embodiment, Figure 2 is an exploded perspective view of the camera device according to this embodiment with the cover member separated, Figure 3 is a plan view of the camera device according to this embodiment, Figure 4 is a cross-sectional view as seen at AA in Figure 3, Figure 5 is a cross-sectional view as seen at BB in Figure 3, Figure 6 is a cross-sectional view as seen at CC in Figure 3, Figure 7 is an exploded perspective view of the camera device according to this embodiment, Figure 8 is an exploded perspective view of the camera device according to this embodiment as seen from a different direction than Figure 7, Figure 9 is an exploded perspective view of the first moving part and related configuration of the camera device according to this embodiment, Figure 10 is an exploded perspective view of the second moving part and related configuration of the camera device according to this embodiment, Figure 11 is a perspective view of the camera device according to this embodiment, and Figure 12A is an exploded perspective view of the camera device according to this embodiment Figure 12B is a perspective view of the camera device in which the cover member is omitted, Figure 12C is a drawing illustrating the connection between the sensing board and the connecting board of the camera device according to a modified example, Figure 13 is a plan view of the camera device according to this embodiment in which the cover member is omitted, Figure 14 is a bottom view of the first moving part and related configuration of the camera device according to this embodiment, Figure 15 is a perspective view of the camera device according to a modified example in which the cover member is omitted, Figure 16 is a perspective view of the second moving part and connecting board of the camera device according to this embodiment, Figure 17 is a perspective view illustrating the drive magnet and drive coil of the camera device according to this embodiment, and Figure 18 is a cross-sectional view of the camera device according to this embodiment. The wires of the camera device according to this embodiment are omitted in drawings other than Figure 18. However, the wires can be illustrated and explained in Figure 18 as a component of the camera device according to this embodiment.

[0052] The camera device 10 can capture one or more images and video. The camera device 10 may be a camera. The camera device 10 may be a camera module. The camera device 10 may be a camera assembly. The camera device 10 may be a camera unit. The camera device 10 may include a lens drive device. The camera device 10 may include a sensor drive device. The camera device 10 may include a voice coil motor (VCM). The camera device 10 may include an autofocus assembly. The camera device 10 may include an image stabilization assembly. The camera device 10 may include an autofocus device. The camera device 10 may include an image stabilization device. The camera device 10 may include an actuator. The camera device 10 may include a lens drive actuator. The camera device 10 may include a sensor drive actuator. The camera device 10 may include an autofocus actuator. The camera device 10 may include an image stabilization actuator.

[0053] The camera device 10 may include a fixed part 100. The fixed part 100 may be a part that is fixed relative to the moving parts 200 and 300 when they are moving. The fixed part 100 may be a part that is fixed relative to one or more of the first moving part 200 and the second moving part 300 when they are moving. The fixed part 100 can accommodate the first moving part 200 and the second moving part 300. The fixed part 100 may be positioned outside the first moving part 200 and the second moving part 300.

[0054] Throughout this specification, the first substrate 110 is described as a component of the fixing part 100, but the first substrate 110 may also be understood as a separate component from the fixing part 100. The fixing part 100 can be placed on the first substrate 110. The fixing part 100 can be placed on the first substrate 110. The fixing part 100 can be placed on the first substrate 110.

[0055] The camera device 10 may include the first circuit board 110. The fixing part 100 may include the first circuit board 110. The first circuit board 110 may be a main circuit board. The first circuit board 110 may be a circuit board. The first circuit board 110 may be a printed circuit board (PCB). The first circuit board 110 can be connected to the power supply of the optical device 1. The first circuit board 110 may include a connector that is connected to the power supply of the optical device 1.

[0056] The camera device 10 may include a base 120. The fixing part 100 may include a base 120. The base 120 can be placed on the first substrate 110. The base 120 can be placed on the first substrate 110. The base 120 can be placed on the first substrate 110. The base 120 can be fixed to the first substrate 110. The base 120 can be bonded to the first substrate 110. The base 120 may be bonded to the first substrate 110 with an adhesive. The base 120 can be placed between the first substrate 110 and the housing 130.

[0057] The camera device 10 may include a housing 130. The fixing part 100 may include a housing 130. The housing 130 can be placed on the base 120. The housing 130 can be placed on the base 120. The housing 130 can be placed on top of the base 120. The housing 130 can be fixed to the base 120. The housing 130 can be coupled to the base 120. The housing 130 may be bonded to the base 120 with an adhesive. The housing 130 can be placed on the first substrate 110. The housing 130 can be placed on top of the first substrate 110. The housing 130 can be formed from a base 120 and other components.

[0058] The housing 130 may include a hole 131. The hole 131 may be a sensing substrate housing hole. The hole 131 may be formed in a shape corresponding to the sensing substrate 470. The hole 131 may be recessed in a shape corresponding to the sensing substrate 470. At least a portion of the hole 131 may be formed in a shape corresponding to the sensing substrate 470. The sensing substrate 470 may be placed in the hole 131. The hole 131 can accommodate at least a portion of the sensing substrate 470.

[0059] In a modified example, the hole 131 can be formed as a groove. The housing 130 may include a sensing substrate housing groove. The groove can be formed in a shape corresponding to the sensing substrate 470. The groove can be recessed in a shape corresponding to the sensing substrate 470. At least a portion of the groove can be formed in a shape corresponding to the sensing substrate 470. The sensing substrate 470 may be placed in the groove. The groove can accommodate at least a portion of the sensing substrate 470.

[0060] The camera device 10 may include a cover member 140. The fixing part 100 may include a cover member 140. The cover member 140 can be coupled to the base 120. The cover member 140 can be coupled to the housing 130. The cover member 140 can be coupled to the first substrate 110. The cover member 140 can be fixed to the base 120. The cover member 140 can be fixed to the housing 130. The cover member 140 can be fixed to the first substrate 110. The cover member 140 can cover at least a portion of the base 120. The cover member 140 can cover at least a portion of the housing 130.

[0061] The cover member 140 may be a "cover can" or a "shield can". The cover member 140 can be made of a metal material. The cover member 140 can block electromagnetic interference (EMI). The cover member 140 can be electrically connected to the first substrate 110. The cover member 140 can be grounded to the first substrate 110.

[0062] The cover member 140 may include a top plate. The cover member 140 may include a hole formed in the top plate. The hole may be formed in a position corresponding to the lens 220. The cover member 140 may include side plates. The side plates may include a plurality of side plates. The side plates may include four side plates. The side plates may include first to fourth side plates. The side plates may include first and second side plates positioned on opposite sides of each other, and third and fourth side plates positioned on opposite sides of each other. The cover member 140 may include a plurality of corners between the plurality of side plates.

[0063] The cover member 140 may include a groove 141. The groove 141 can be formed as a recess from the lower end of the side plate of the cover member 140. The groove 141 can be formed at the lower end of the side plate of the cover member 140. The groove 141 can expose the first terminal 471 of the sensing substrate 470. The groove 141 can be positioned in a location corresponding to the first terminal 471 of the sensing substrate 470. The groove 141 can expose the first terminal 631 of the connecting substrate 630. The groove 141 can expose the second terminal 632 of the connecting substrate 630. The groove 141 may also be a cut. The first terminal 471 of the sensing substrate 470 may be soldered to the second terminal 632 of the connecting substrate 630 through the groove 141. With the cover member 140 assembled by the groove 141, the AF assembly is assembled into the OIS assembly. The AF assembly may include the first movable part 200 and related configurations. The OIS assembly may include a second moving part 300 and related components. In this embodiment, a portion of the cover member 140 corresponding to the first terminal 471 of the sensing board 470 can be moved aside to prevent a short circuit between the solder joint between the cover member 140 and the sensing board 470. The ground of the sensing board 470 can be electrically connected to the cover member 140.

[0064] Throughout the specification, the cover member 140 has been described as a component of the fixing part 100, but the cover member 140 may also be understood as a separate component from the fixing part 100. The cover member 140 can be coupled with the fixing part 100. The cover member 140 can cover the first movable part 200.

[0065] The camera device 10 may include a first movable unit 200. The first movable unit 200 can move relative to the fixed unit 100. The first movable unit 200 can move in the optical axis direction with respect to the fixed unit 100. The first movable unit 200 can be positioned within the fixed unit 100. The first movable unit 200 can be positioned so as to be movable within the fixed unit 100. The first movable unit 200 can be positioned so as to be movable within the fixed unit 100 in the optical axis direction. By moving the first movable unit 200 in the optical axis direction relative to the fixed unit 100, an autofocus (AF) function can be performed. The first movable unit 200 can be positioned on top of a second movable unit 300.

[0066] The camera device 10 may include a bobbin 210. The first moving part 200 may include a bobbin 210. The bobbin 210 may be placed on the first substrate 110. The bobbin 210 may be placed on the first substrate 110. The bobbin 210 may be placed at a distance from the first substrate 110. The bobbin 210 may be placed inside the housing 130. The bobbin 210 may be placed inside the housing 130. At least a portion of the bobbin 210 is housed in the housing 130. The bobbin 210 may be positioned to move within the housing 130. The bobbin 210 may be positioned to move within the housing 130 in the optical axis direction. The bobbin 210 may be coupled with a lens 220. The bobbin 210 may be hollow or have a hole. The lens 220 may be placed in the hollow or hole of the bobbin 210. The outer surface of the lens 220 can be coupled to the inner surface of the bobbin 210.

[0067] The bobbin 210 may include a projection 211. The projection 211 may be a damper projection. A damper may be positioned on the projection 211. The projection 211 may be formed on the upper surface of the bobbin 210. The projection 211 may protrude upward from the bobbin 210. The projection 211 of the bobbin 210 may be positioned adjacent to the connecting portion 713 of the upper elastic member 710. The projection 211 may be formed to have a curvature corresponding to the connecting portion 713. A damper may connect the projection 211 of the bobbin 210 to the connecting portion 713 of the upper elastic member 710. The damper may be an AF damper. The AF damper may be applied between the upper elastic member 710 and the first movable portion 200. In a modified example, the AF damper may be applied between the first movable portion 200 and the fixed portion 100.

[0068] The camera device 10 may include a lens 220. The first moving part 200 may include a lens 220. The lens 220 may be coupled to a bobbin 210. The lens 220 may be fixed to the bobbin 210. The lens 220 may move integrally with the bobbin 210. The lens 220 may be screw-coupled to the bobbin 210. The lens 220 may be bonded to the bobbin 210 with adhesive. The lens 220 may be positioned in a location corresponding to the image sensor 330. The optical axis of the lens 220 may coincide with the optical axis of the image sensor 330. The optical axis may also be the z-axis. The lens 220 may include multiple lenses. The lens 220 may include five or six lenses.

[0069] The camera device 10 may include a lens module. The lens module can be coupled to a bobbin 210. The lens module may include a barrel and one or more lenses 220 positioned within the barrel.

[0070] The camera device 10 may include a second moving unit 300. The second moving unit 300 can move relative to the fixed unit 100. The second moving unit 300 can move in a direction perpendicular to the optical axis direction with respect to the fixed unit 100. The second moving unit 300 can be positioned within the fixed unit 100. The second moving unit 300 can be positioned so as to be movable within the fixed unit 100. The second moving unit 300 can be positioned within the fixed unit 100 so as to be movable in a direction perpendicular to the optical axis direction. By moving the second moving unit 300 in a direction perpendicular to the optical axis direction with respect to the fixed unit 100, an optical image stabilization (OIS) function can be performed. The second moving unit 300 can be positioned between the first moving unit 200 and the first substrate 110.

[0071] The camera device 10 may include a second substrate 310. The second moving unit 300 may include a second substrate 310. The second substrate 310 may be a substrate. The second substrate 310 may be a printed circuit board (PCB). The second substrate 310 may be placed between the first moving unit 200 and the first substrate 110. The second substrate 310 may be placed between the bobbin 210 and the first substrate 110. The second substrate 310 may be placed between the lens 220 and the first substrate 110. The second substrate 310 may be separated from the fixed unit 100. The second substrate 310 may be separated from the fixed unit 100 in the direction of the optical axis and in the direction perpendicular to the optical axis. The second substrate 310 may be moved in the direction perpendicular to the optical axis. The second substrate 310 may be electrically connected to the image sensor 330. The second substrate 310 may move together with the image sensor 330. The second substrate 310 may include holes. An image sensor 330 may be placed in the hole of the second substrate 310.

[0072] The second substrate 310 may include terminals 311. Terminals 311 may be located on the underside of the second substrate 310. Terminals 311 can be coupled to terminals 321 of the sensor substrate 320. The second substrate 310 may be formed separately from the sensor substrate 320. The second substrate 310 may be formed separately from the sensor substrate 320 and coupled to it. Terminals 311 of the second substrate 310 may be soldered to terminals 321 of the sensor substrate 320.

[0073] The camera device 10 may include a sensor board 320. The second moving unit 300 may also include a sensor board 320. The sensor board 320 may be a circuit board. The sensor board 320 may be a printed circuit board (PCB). The sensor board 320 can be coupled to an image sensor 330. The sensor board 320 can be coupled to a second board 310.

[0074] The sensor board 320 may include terminals 321. Terminals 321 of the sensor board 320 can be coupled to terminals 311 of the second board 310. The sensor board 320 can be coupled to the underside of the second board 310. The sensor board 320 can be placed beneath the second board 310. The sensor board 320 can be coupled beneath the second board 310 with the image sensor 330 coupled to it.

[0075] The camera device 10 may include an image sensor 330. The second moving unit 300 may also include an image sensor 330. The image sensor 330 may be placed on a sensor substrate 320. The image sensor 330 may be placed between the sensor substrate 320 and the sensor base 350. The image sensor 330 may be electrically connected to the second substrate 310. The image sensor 330 may move together with the second substrate 310.

[0076] Light that has passed through the lens 220 and filter 360 enters the image sensor 330, and an image can be formed. The image sensor 330 can be electrically connected to the sensor substrate 320, the second substrate 310, and the first substrate 110. The image sensor 330 can include an effective image area. The image sensor 330 can convert the light illuminating the effective image area into an electrical signal. The image sensor 330 may include one or more of the following: CCD (charge coupled device), MOS (metal oxide semiconductor), CPD, and CID.

[0077] The camera device 10 may include a holder 340. The second moving part 300 may include a holder 340. The holder 340 may be made of an insulating material. The holder 340 may be placed on the second substrate 310. The holder 340 may be placed on the second substrate 310. The holder 340 may be placed on the second substrate 310. The holder 340 may be fixed to the second substrate 310. The holder 340 may be coupled to the second substrate 310. The holder 340 may include a hollow or hole in which an image sensor 330 is placed. A second coil 440 may be placed in the holder 340. The holder 340 may include a projection in which the second coil 440 is wound. The holder 340 may include a hole in which a Hall sensor 445 is placed.

[0078] The camera device 10 may include a sensor base 350. The second moving unit 300 may include a sensor base 350. The sensor base 350 may be placed on a sensor substrate 320. The sensor base 350 may include a hole formed at a position corresponding to the image sensor 330. The sensor base 350 may include a groove in which a filter 360 is placed.

[0079] The camera device 10 may include a filter 360. The second moving unit 300 may include a filter 360. The filter 360 may be placed between the lens 220 and the image sensor 330. The filter 360 may be placed on the sensor base 350. The filter 360 can block light of a specific frequency band from entering the image sensor 330 from the light that has passed through the lens 220. The filter 360 may include an infrared blocking filter. The filter 360 can block infrared light from entering the image sensor 330.

[0080] The camera device 10 may include a drive unit. The drive unit can move the movable parts 200 and 300 relative to the fixed part 100. The drive unit can perform autofocus (AF) functionality. The drive unit can perform optical image stabilization (OIS) functionality. The drive unit can move the lens 220. The drive unit can move the image sensor 330. The drive unit may include a magnet and a coil. The drive unit may include a shape memory alloy (SMA).

[0081] The camera device 10 may include a first drive unit. The first drive unit may be an AF drive unit. The first drive unit can move the first moving unit 200 in the optical axis direction. The first drive unit can move the bobbin 210 in the optical axis direction. The lens 220 can move in the optical axis direction. The first drive unit can perform autofocus (AF) function. The first drive unit can move the first moving unit 200 upward in the optical axis direction. The first drive unit can move the first moving unit 200 downward in the optical axis direction.

[0082] The camera device 10 may include a second drive unit. The second drive unit may be an OIS drive unit. The second drive unit can move the second moving unit 300 in a direction perpendicular to the optical axis. The second drive unit can move the second substrate 310 in a direction perpendicular to the optical axis. The second drive unit can move the sensor substrate 320 in a direction perpendicular to the optical axis. The second drive unit can move the image sensor 330 in a direction perpendicular to the optical axis. The second drive unit can move the holder 340 in a direction perpendicular to the optical axis. The second drive unit can move the sensor base 350 in a direction perpendicular to the optical axis. The second drive unit can move the filter 360 in a direction perpendicular to the optical axis. The second drive unit can perform optical image stabilization (OIS) function.

[0083] The second drive unit can move the second moving unit 300 in a first direction perpendicular to the optical axis direction. The second drive unit can move the second moving unit 300 in a second direction perpendicular to the optical axis direction and the first direction. The second drive unit can rotate the second moving unit 300 around the optical axis.

[0084] In this embodiment, the first drive unit may include a first coil 430. The second drive unit may include a second coil 440. The first and second drive units may include a drive magnet 410 that is used in common for the interaction between the first coil 430 and the second coil 440. That is, the first and second drive units may include individually controlled coils and a shared magnet.

[0085] The camera device 10 may include a drive magnet 410. The drive unit may include a drive magnet 410. The drive magnet 410 may be a magnet. The drive magnet 410 may be a permanent magnet. The drive magnet 410 may be a common magnet. The drive magnet 410 can be used in common for autofocus (AF) and optical image stabilization (OIS).

[0086] The drive magnet 410 can be placed on the fixed part 100. The drive magnet 410 can be fixed to the fixed part 100. The drive magnet 410 can be coupled to the fixed part 100. The drive magnet 410 may be bonded to the fixed part 100 with adhesive. The drive magnet 410 can be placed on the housing 130. The drive magnet 410 can be fixed to the housing 130. The drive magnet 410 can be coupled to the housing 130. The drive magnet 410 may be bonded to the housing 130 with adhesive. The drive magnet 410 can be placed in the corner of the housing 130. The drive magnet 410 can be positioned off-center in the corner of the housing 130.

[0087] The drive magnet 410 may be a two-pole magnetized magnet containing one north pole region and one south pole region. In a modified example, the drive magnet 410 may be a four-pole magnetized magnet containing two north pole regions and two south pole regions.

[0088] The drive magnet 410 may include multiple magnets. The drive magnet 410 may include four magnets. The drive magnet 410 may include first to fourth magnets. The first to fourth magnets may be arranged symmetrically along the optical axis. The first to fourth magnets may be formed to be the same size and shape as each other.

[0089] In the modified example, the drive magnet 410 may include a first magnet positioned corresponding to the first coil 430 and a second magnet positioned corresponding to the second coil 440. In this case, the first and second magnets may be positioned in the fixed part 100, and the first coil 430 and the second coil 440 may be positioned in the movable parts 200 and 300. Alternatively, the first and second magnets may be positioned in the movable parts 200 and 300, and the first coil 430 and the second coil 440 may be positioned in the fixed part 100.

[0090] The camera device 10 may include a first coil 430. The drive unit may include a first coil 430. The first coil 430 may be placed on the first moving part 200. The first coil 430 may be fixed to the first moving part 200. The first coil 430 may be coupled to the first moving part 200. The first coil 430 may be bonded to the first moving part 200 with adhesive. The first coil 430 may be placed on the bobbin 210. The first coil 430 may be fixed to the bobbin 210. The first coil 430 may be coupled to the bobbin 210. The first coil 430 may be bonded to the bobbin 210 with adhesive. The first coil 430 may be electrically connected to the driver IC 480. The first coil 430 may be electrically connected to the lower elastic member 720, the sensing substrate 470, and the driver IC 480. The first coil 430 may receive current from the driver IC 480.

[0091] The first coil 430 can be positioned in a location corresponding to the drive magnet 410. The first coil 430 can be positioned on the bobbin 210 in a location corresponding to the drive magnet 410. The first coil 430 can face the drive magnet 410. The first coil 430 may include a surface facing the drive magnet 410. The first coil 430 can be positioned adjacent to the drive magnet 410. The first coil 430 can interact with the drive magnet 410. The first coil 430 can have an electromagnetic interaction with the drive magnet 410.

[0092] The first coil 430 can move the first moving part 200 in the optical axis direction. The first coil 430 can move the bobbin 210 in the optical axis direction. The first coil 430 can move the lens 220 in the optical axis direction. The first coil 430 can move the first moving part 200 upward in the optical axis direction. The first coil 430 can move the bobbin 210 upward in the optical axis direction. The first coil 430 can move the lens 220 upward in the optical axis direction. The first coil 430 can move the first moving part 200 downward in the optical axis direction. The first coil 430 can move the bobbin 210 downward in the optical axis direction. The first coil 430 can move the lens 220 downward in the optical axis direction.

[0093] The camera device 10 may include a second coil 440. The drive unit may include a second coil 440. The second coil 440 can be placed in the second moving unit 300. The second coil 440 can be fixed to the second moving unit 300. The second coil 440 can be coupled to the second moving unit 300. The second coil 440 may be bonded to the second moving unit 300 with adhesive. The second coil 440 can be placed in the holder 340. The second coil 440 can be fixed to the holder 340. The second coil 440 can be coupled to the holder 340. The second coil 440 may be bonded to the holder 340 with adhesive. The second coil 440 can be wound around a projection on the holder 340. The second coil 440 can be placed on the holder 340. The second coil 440 can be electrically connected to the second substrate 310. Both ends of the second coil 440 may be soldered to the second substrate 310. The second coil 440 can be electrically connected to the driver IC 495. The second coil 440 can be electrically connected to the second board 310 and the driver IC 495. The second coil 440 can receive current from the driver IC 495.

[0094] The second coil 440 can be positioned in a location corresponding to the drive magnet 410. The second coil 440 can be positioned in the holder 340 in a location corresponding to the drive magnet 410. The second coil 440 can face the drive magnet 410. The second coil 440 may include a surface facing the drive magnet 410. The second coil 440 can be positioned adjacent to the drive magnet 410. The second coil 440 can interact with the drive magnet 410. The second coil 440 can have an electromagnetic interaction with the drive magnet 410.

[0095] The second coil 440 can move the second moving part 300 in a direction perpendicular to the optical axis. The second coil 440 can move the second substrate 310 in a direction perpendicular to the optical axis. The second coil 440 can move the sensor substrate 320 in a direction perpendicular to the optical axis. The second coil 440 can move the image sensor 330 in a direction perpendicular to the optical axis. The second coil 440 can move the holder 340 in a direction perpendicular to the optical axis. The second coil 440 can rotate the second moving part 300 with respect to the optical axis. The second coil 440 can rotate the second substrate 310 with respect to the optical axis. The second coil 440 can rotate the sensor substrate 320 with respect to the optical axis. The second coil 440 can rotate the image sensor 330 with respect to the optical axis. The second coil 440 can rotate the holder 340 with respect to the optical axis.

[0096] The second coil 440 can contain multiple coils. The second coil 440 can contain four coils. The second coil 440 can contain a coil for x-axis shifting. The second coil 440 can contain a coil for y-axis shifting.

[0097] The second coil 440 may include a second-first coil 441. The second-first coil 441 may be a first sub-coil. The second-first coil 441 may be a coil for x-axis shifting. The second-first coil 441 can move the second moving part 300 in the x-axis direction. The second-first coil 441 may be positioned elongated along the y-axis. The second-first coil 441 may include multiple coils. The second-first coil 441 may include two coils. The two coils of the second-first coil 441 may be electrically connected to each other. The second-first coil 441 may include a connecting coil that links the two coils. In this case, the two coils of the second-first coil 441 may both receive current. Alternatively, the two coils of the second-first coil 441 may be electrically isolated from each other and receive current individually.

[0098] The second coil 440 may include a second-second coil 442. The second-second coil 442 may be a second sub-coil. The second-second coil 442 may be a coil for y-axis shifting. The second-second coil 442 can move the second moving part 300 in the y-axis direction. The second-second coil 442 may be positioned elongated along the x-axis. The second-first coil 441 may include multiple coils. The second-second coil 442 may include two coils. The two coils of the second-second coil 442 may be electrically connected to each other. The second-second coil 442 may include a connecting coil that links the two coils. In this case, the two coils of the second-second coil 442 may both receive current. Alternatively, the two coils of the second-second coil 442 may be electrically isolated from each other and receive current individually.

[0099] The camera device 10 may include a Hall sensor 445. The Hall sensor 445 can be placed on the second substrate 310. The Hall sensor 445 can be placed in a hole in the holder 340. The Hall sensor 445 may include a Hall element (Hall IC). The Hall sensor 445 can sense the drive magnet 410. The Hall sensor 445 can sense the magnetic force of the drive magnet 410. The Hall sensor 445 can face the drive magnet 410. The Hall sensor 445 can be placed in a position corresponding to the drive magnet 410. The Hall sensor 445 can be placed adjacent to the drive magnet 410. The Hall sensor 445 can sense the position of the second moving part 300. The Hall sensor 445 can sense the movement of the second moving part 300. The Hall sensor 445 can be placed in the hollow of the second coil 440. The sensing value detected by the Hall sensor 445 can be used to provide feedback to the image stabilization drive. The Hall sensor 445 can be electrically connected to the driver IC 495.

[0100] The Hall sensor 445 may include multiple Hall sensors. The Hall sensor 445 may include three Hall sensors. The Hall sensor 445 may include first to third Hall sensors. The first Hall sensor can sense the displacement of the second moving part 300 in the x-axis direction. The second Hall sensor can sense the displacement of the second moving part 300 in the y-axis direction. The third Hall sensor can sense the rotation of the second moving part 300 with respect to the z-axis, either alone or together with one or more of the first and second Hall sensors.

[0101] The camera device 10 may include a sensing magnet 450. The sensing magnet 450 may be placed on the first moving part 200. The sensing magnet 450 may be fixed to the first moving part 200. The sensing magnet 450 may be coupled to the first moving part 200. The sensing magnet 450 may be bonded to the first moving part 200 with adhesive. The sensing magnet 450 may be placed on the bobbin 210. The sensing magnet 450 may be fixed to the bobbin 210. The sensing magnet 450 may be coupled to the bobbin 210. The sensing magnet 450 may be bonded to the bobbin 210 with adhesive. The sensing magnet 450 may be formed to be smaller in size than the drive magnet 410. This minimizes the influence of the sensing magnet 450 on the drive.

[0102] The sensing magnet 450 can be positioned on the opposite side of the compensating magnet 460. The sensing magnet 450 and the compensating magnet 460 can be positioned on opposite sides of the first moving part 200. The sensing magnet 450 and the compensating magnet 460 can be positioned on opposite sides of the bobbin 210.

[0103] The camera device 10 may include a compensating magnet 460. The compensating magnet 460 may also be a compensation magnet. The compensating magnet 460 can be placed on the first moving part 200. The compensating magnet 460 can be fixed to the first moving part 200. The compensating magnet 460 can be coupled to the first moving part 200. The compensating magnet 460 may be bonded to the first moving part 200 with adhesive. The compensating magnet 460 can be placed on the bobbin 210. The compensating magnet 460 can be fixed to the bobbin 210. The compensating magnet 460 can be coupled to the bobbin 210. The compensating magnet 460 may be bonded to the bobbin 210 with adhesive. The compensating magnet 460 can be formed to be smaller than the drive magnet 410. This minimizes the influence of the compensating magnet 460 on the drive. In addition, the compensating magnet 460 can be placed on the opposite side of the sensing magnet 450 to form magnetic force equilibrium with the sensing magnet 450. This prevents tilting that may occur due to the sensing magnet 450.

[0104] The camera device 10 may include a sensing board 470. The sensing board 470 may be a circuit board. The sensing board 470 may be a printed circuit board (PCB). The sensing board 470 may be a flexible circuit board. The sensing board 470 may be an FPCB. The sensing board 470 can be coupled to the first circuit board 110. The sensing board 470 can be placed on the fixing part 100. The sensing board 470 can be connected to the first circuit board 110. The sensing board 470 can be electrically connected to the first circuit board 110. The sensing board 470 may be soldered to the first circuit board 110. The sensing board 470 can be placed on the housing 130. The sensing board 470 can be fixed to the housing 130. The sensing board 470 can be coupled to the housing 130. The housing 130 may include holes 131 or grooves of a shape corresponding to the sensing board 470. The sensing substrate 470 can be placed in a hole 131 or groove in the housing 130. The sensing substrate 470 may be bent at least twice in a direction perpendicular to the optical axis.

[0105] The sensing board 470 can also be referred to as the third board, fourth board, etc., similar to the first board 110 and the second board 310.

[0106] In this embodiment, the sensing board 470 can be separated from the first board 110. At this time, the sensing board 470 can be electrically connected to the first board 110 via the connecting board 600. That is, the sensing board 470 and the first board 110 are not physically in contact or directly connected, but can be indirectly connected via the connecting board 600. The sensing board 470 can be coupled to the connecting board 600. The sensing board 470 can be coupled to the terminal portion 630 of the connecting board 600. The sensing board 470 can be fixed to the connecting board 600. The sensing board 470 can be fixed to the terminal portion 630 of the connecting board 600. The sensing board 470 can be placed on the connecting board 600. The sensing board 470 can be placed on the terminal portion 630 of the connecting board 600. The sensing board 470 can be coupled to the connecting board 600 by soldering. The sensing board 470 can be connected to the terminal portion 630 of the connecting board 600 by soldering.

[0107] The sensing board 470 overlaps the connecting board 600 in a direction perpendicular to the optical axis. In the direction perpendicular to the optical axis, the sensing board 470 overlaps the connecting board 600 by 40% to 70% of the height ratio of the maximum points of the connecting board 600. In the direction perpendicular to the optical axis, the sensing board 470 overlaps the terminal portion 630 of the connecting board 600. The sensing board 470 is soldered to the connecting board 600, spaced apart from the lower end of the connecting board 600. The sensing board 470 is soldered to the second terminal 632 of the connecting board 600. The sensing board 470 may include a first terminal 471. The first terminal 471 can be connected to the second terminal 632 of the connecting board 600. The solder connecting the sensing board 470 and the connecting board 600 can be positioned closer to the first board 110 than to the driver IC 480.

[0108] The sensing substrate 470 overlaps the metal plate 650 in a direction perpendicular to the optical axis. The sensing substrate 470 is soldered to the connecting substrate 600 beneath the metal plate 650. When viewed from the side, the sensing substrate 470 can be positioned offset to the opposite side of the connector of the first substrate 471.

[0109] The first terminal 471 can include multiple terminals. The first terminal 471 can include four first terminals 471. The four first terminals 471 can each be coupled to one of the four second terminals 632 of the connecting board 600. The four first terminals 471 can include an SDA terminal, an SCL terminal, a Vcc terminal, and a Vdd terminal. The first terminal 471 can include a terminal for I2C communication. In this embodiment, the power terminal and the I2C communication terminal of the first board 110 can be used interchangeably. The cover member 140 can be electrically connected to the ground pad of the sensing board 470 or the first board 110.

[0110] In a modified example, a Hall element may be placed in the position of the driver IC 480. In this case, the control unit for applying current to the first coil 430 can be placed on the first substrate 110. At this time, the first terminal of the sensing substrate 470 may include six terminals. These six terminals may include a first coil (+) terminal, a first coil (-) terminal, a Hall input (+) terminal, a Hall input (-) terminal, a Hall output (+) terminal, and a Hall output (-) terminal.

[0111] The sensing board 470 may include a second terminal 472. It can be connected to two lower elastic members 720. The two lower elastic members 720 can be connected to a first coil 430. That is, the lower elastic members 720 can connect the second terminal 472 of the sensing board 470 to the first coil 430. The lower elastic members 720 can electrically connect the second terminal 472 of the sensing board 470 to the first coil 430.

[0112] As shown in Figure 15, in a modified example, the camera device 10 may include a sensing substrate 470a. The sensing substrate 470a can be bonded to the first substrate 110. The sensing substrate 470a can be directly bonded to the first substrate 110. The sensing substrate 470a can be bonded to the first substrate 110 by soldering. The sensing substrate 470a can be bonded to the first substrate 110 by conductive epoxy. The sensing substrate 470a can be fixed to the first substrate 110. The sensing substrate 470a can be placed on the first substrate 110. The sensing substrate 470a can be bonded to the first terminal 471a of the first substrate 110. The sensing substrate 470a can be bonded to the first terminal 471a of the first substrate 110 by soldering. The sensing substrate 470a can be bonded to the first terminal 471a of the first substrate 110 by conductive epoxy. In a modified example, the housing 130 may include a groove that opens the portion where the terminal of the first substrate 110 and the first terminal 471a of the first substrate 110 are connected.

[0113] In a modified example, the upper elastic member 710 may include two upper elastic members spaced apart from each other. The upper elastic member 710 can connect the second terminal 472 of the sensing board 470 to the first coil 430. The upper elastic member 710 can electrically connect the second terminal 472 of the sensing board 470 to the first coil 430.

[0114] The camera device 10 may include a driver IC 480. The driver IC 480 may be an AF driver IC. The driver IC 480 can be electrically connected to the first coil 430. The driver IC 480 can apply current to the first coil 430 to perform AF driving. The driver IC 480 can apply power to the first coil 430. The driver IC 480 can apply current to the first coil 430. The driver IC 480 can apply voltage to the first coil 430. The driver IC 480 can be placed on the sensing board 470. The driver IC 480 can be placed in a position corresponding to the sensing magnet 450. The driver IC 480 can be placed facing the sensing magnet 450. The driver IC 480 can be placed adjacent to the sensing magnet 450.

[0115] The driver IC 480 may include a sensor. The sensor may include a Hall element (Hall IC). The sensor may be positioned in a position corresponding to the sensing magnet 450. The sensor may be positioned facing the sensing magnet 450. The sensor may be positioned adjacent to the sensing magnet 450. The sensor may sense the sensing magnet 450. The sensor may sense the magnetic force of the sensing magnet 450. The sensor may sense the position of the first moving part 200. The sensor may sense the movement of the first moving part 200. The sensed value detected by the sensor may be used for feedback for autofocus drive.

[0116] The camera device 10 may include a gyro sensor 490. The gyro sensor 490 can be placed on the first circuit board 110. The gyro sensor 490 can detect shaking of the camera device 10. The gyro sensor 490 can sense the angular velocity or linear velocity due to shaking of the camera device 10. The gyro sensor 490 can be electrically connected to a driver IC 495. The shaking of the camera device 10 detected by the gyro sensor 490 can be used for optical image stabilization (OIS) driving.

[0117] The camera device 10 may include a driver IC 495. The driver IC 495 may be an OIS driver IC. The driver IC 495 can be electrically connected to the second coil 440. The driver IC 495 can apply current to the second coil 440 to perform OIS driving. The driver IC 495 can apply power to the second coil 440. The driver IC 495 can apply current to the second coil 440. The driver IC 495 can apply voltage to the second coil 440. The driver IC 495 can be placed on the second board 310.

[0118] The camera device 10 may include a connecting member. The connecting member may be an interposer. The connecting member can support the movement of the second moving part 300. The connecting member can support the second moving part 300 so that it can move. The connecting member can connect the second moving part 300 to the fixed part 100. The connecting member can connect the first substrate 110 to the second substrate 310. The connecting member can electrically connect the first substrate 110 to the second substrate 310. The connecting member can connect the first substrate 110 to the second moving part 300. The connecting member can guide the movement of the second moving part 300. The connecting member can guide the second moving part 300 to move in a direction perpendicular to the optical axis. The connecting member can guide the second moving part 300 to rotate with respect to the optical axis. The connecting member can restrict the movement of the second moving part 300 in the direction of the optical axis.

[0119] The connecting member may include a connecting base plate 600. The connecting member may include an elastic member that connects the fixed part 100 and the second movable part 300. The connecting member may include a leaf spring. The connecting member may include a wire 800. The connecting member may include a ball that is positioned between the fixed part 100 and the second movable part 300.

[0120] The camera device 10 may include a connecting substrate 600. The connecting substrate 600 may be a connecting portion. The connecting substrate 600 may be a connecting member. The connecting substrate 600 may be a flexible substrate. The connecting substrate 600 may be a flexible printed circuit board. The connecting substrate 600 may be an FPCB (flexible printed circuit board). The connecting substrate 600 may be flexible in at least a part of it. The second substrate 310 and the connecting substrate 600 may be formed as a single unit.

[0121] The connecting substrate 600 can support the second movable part 300. The connecting substrate 600 can support the movement of the second movable part 300. The connecting substrate 600 can support the second movable part 300 so that it can move. The connecting substrate 600 can connect the second movable part 300 and the fixed part 100. The connecting substrate 600 can connect the first substrate 110 and the second substrate 310. The connecting substrate 600 can electrically connect the first substrate 110 and the second substrate 310. The connecting substrate 600 can connect the first substrate 110 and the second movable part 300. The connecting substrate 600 can guide the movement of the second movable part 300. The connecting substrate 600 can guide the second movable part 300 to move in a direction perpendicular to the optical axis. The connecting substrate 600 can guide the second movable part 300 to rotate with respect to the optical axis. The connecting substrate 600 can restrict the movement of the second moving part 300 in the optical axis direction. A portion of the connecting substrate 600 can be coupled to the base 120.

[0122] The connecting substrate 600 may include two connecting substrates 600 that are spaced apart from each other and formed symmetrically. The two connecting substrates 600 can be placed on both sides of the second substrate 310. The connecting substrate 600 can be folded a total of six times to form a connection between the first substrate 110 and the second substrate 310.

[0123] The connecting substrate 600 may include a first region connected to the second substrate 310 and bent in the direction of the optical axis. The first region may be connected to the second substrate 310 and be bent in the direction of the optical axis. The first region may be connected to the second substrate 310 and extend in the direction of the optical axis. The first region may be connected to the second substrate 310 and be bent and extended in the direction of the optical axis. The connecting substrate 600 may include a second region extending into the first region. The connecting substrate 600 may include a third region that is bent in the second region in a direction perpendicular to the optical axis. The third region may be bent in the second region in a direction perpendicular to the optical axis. The third region may be extended in the second region in a direction perpendicular to the optical axis. The third region may be bent and extended in the second region in a direction perpendicular to the optical axis.

[0124] The connecting substrate 600 may include a first bending region that is bent in the direction of the optical axis. The connecting substrate 600 may include a first bending region that is folded in the direction of the optical axis. The connecting substrate 600 may include a first bending region that extends in the direction of the optical axis. The extension 620 of the connecting substrate 600 may include a second bending region that is bent in a direction perpendicular to the optical axis. The extension 620 may include a second bending region that is folded in a direction perpendicular to the optical axis. The extension 620 may include a second bending region that extends in a direction perpendicular to the optical axis. The extension 620 may include a second bending region that is folded and extended in a direction perpendicular to the optical axis.

[0125] The connecting substrate 600 may include a connecting portion 610 that includes a first region. The connecting substrate 600 may include an extension portion 620 that includes a second region and a third region. The connecting substrate 600 may include a connecting portion 610 that is connected to the second substrate 310. The connecting substrate 600 may include an extension portion 620 that extends to the connecting portion 610. The connecting substrate 600 may include a terminal portion 630 that is connected to the extension portion 620 and includes terminals.

[0126] The connecting substrate 600 may include a connecting portion 610. The connecting portion 610 can be connected to the second movable portion 300. The connecting portion 610 can be coupled to the second movable portion 300. The connecting portion 610 can be fixed to the second movable portion 300. The connecting portion 610 can be connected to the second substrate 310. The connecting portion 610 can be coupled to the second substrate 310. The connecting portion 610 can be fixed to the second substrate 310. The connecting portion 610 may include a first bending region that is bent in the direction of the optical axis. The connecting portion 610 may include a first bending region that is bent in the direction of the optical axis. The connecting portion 610 may include a first bending region that extends in the direction of the optical axis. The connecting portion 610 may include a first region that is bent in the direction of the optical axis relative to the second substrate 310, and a second region that extends from the first region and is bent in a direction perpendicular to the optical axis.

[0127] The connecting substrate 600 may include an extension 620. The extension 620 can connect the connecting portion 610 and the terminal portion 630. The extension 620 may extend from the connecting portion 610. The extension 620 may include a second bending region that is bent in a direction perpendicular to the optical axis.

[0128] The connecting substrate 600 may include a terminal portion 630. The terminal portion 630 can be coupled to the fixing portion 100. The terminal portion 630 can be fixed to the fixing portion 100. The terminal portion 630 can be coupled to the first substrate 110. The terminal portion 630 can be connected to the first substrate 110. The terminal portion 630 may be soldered to the first substrate 110. The terminal portion 630 can be fixed to the first substrate 110. The terminal portion 630 can be coupled to the base 120. The terminal portion 630 can be fixed to the base 120. The terminal portion 630 may include a terminal. The terminal can be coupled to the first substrate 110. The terminal portion 630 may include a first portion having a first width and a second portion having a second width narrower than the first width. A first terminal 631 may be placed in the first portion, and a second terminal 632 may be placed in the second portion. The second part can connect the first part and the extension 620.

[0129] The terminal portion 630 may include a first terminal 631. The first terminal 631 can be connected to the first substrate 110. The first terminal 631 can be placed on the outer surface of the connecting substrate 600. The first terminal 631 of the connecting substrate 600 can be placed at the lower end of the connecting substrate 600. The first terminal 631 can be placed in the terminal portion 630. The first terminal 631 can be coupled to the first substrate 110. The first terminal 631 can be coupled to a terminal on the first substrate 110. The first terminal 631 can be coupled to a terminal on the first substrate 110 by soldering.

[0130] The terminal section 630 may include a second terminal 632. The second terminal 632 can be connected to the sensing board 470. The second terminal 632 can be positioned on the outer surface of the connecting board 600. The second terminal 632 of the connecting board 600 can be positioned on the outer surface of the connecting board 600, spaced apart from the first terminal 631. The second terminal 632 of the connecting board 600 can be positioned spaced apart from the lower end of the connecting board 600. The second terminal 632 of the connecting board 600 can be positioned above the first terminal 631 in the optical axis direction. The second terminal 632 can be positioned in the terminal section 630. The second terminal 632 can be coupled to the sensing board 470. The second terminal 632 can be coupled to the first terminal 471 of the sensing board 470. The second terminal 632 can be coupled to the first terminal 471 of the sensing board 470 by soldering.

[0131] The second terminal 632 can include multiple terminals. The second terminal 632 can include four second terminals 632. Each of the four second terminals 632 can be coupled to one of the four first terminals 471. The four second terminals 632 can include SDA, SCL, Vcc, and Vdd terminals. The second terminal 632 can also include terminals for I2C communication.

[0132] As shown in Figure 12C, in a modified example, the connecting substrate 600 may include the second terminal 632a. In this embodiment, the second terminal 632 can be formed with four terminals on either of the two unit connecting substrates. However, in a modified example, the second terminal 632a can be formed with three terminals on each of the two unit connecting substrates, for a total of six terminals. However, only four of the six terminals can be energized with the sensing substrate 470. The remaining two terminals may be test terminals or ground terminals.

[0133] In this embodiment, the camera device 10 may include a flexible substrate. The flexible substrate can connect the fixed portion 100 and the second movable portion 300. The flexible substrate may include a connecting portion 610 connected to the second movable portion 300, an extension portion 620 extending to the connecting portion 610, and a terminal portion 630 connected to the extension portion 620 and including a terminal.

[0134] In this embodiment, the connecting substrate 600 may include a first portion that is coupled to the first substrate 110, a second portion that is coupled to the second substrate 310, and a third portion that connects the first and second portions. The third portion may be positioned parallel to the optical axis in at least part of it. The length of the third portion in the optical axis direction may be longer than its thickness. The second portion of the connecting substrate 600 may be positioned parallel to the second substrate 310 in at least part of it. The third portion of the connecting substrate 600 may be positioned perpendicular to the second portion in at least part of it. The third portion of the connecting substrate 600 may be bent in a rounded shape at a portion corresponding to the corner of the second substrate 310. The second substrate 310 may include a first side and a second side that are positioned opposite each other, and a third side and a fourth side that are positioned opposite each other. The second portion of the connecting substrate 600 may be coupled to the first side and the second side of the second substrate 310. The first portion of the connecting substrate 600 can be coupled to the third and fourth sides of the second substrate 310 and the corresponding portion of the first substrate 110.

[0135] The camera device 10 may include a metal plate 650. The connecting member may include a metal plate 650. The connecting substrate 600 may include a metal plate 650. However, the metal plate 650 may be understood as a separate component from the connecting substrate 600. The metal plate 650 may be a metal component. The metal plate 650 may be a metal part. The metal plate 650 may be a metal layer. The metal plate 650 may be a metal foil film. The metal plate 650 can be formed from metal. The metal plate 650 can be formed from an alloy. The metal plate 650 can be formed from a copper alloy. The metal plate 650 can be formed from an electrically conductive material. The metal plate 650 can be separated from the conductive layer of the connecting substrate 600. The metal plate 650 can be formed from a different material than the conductive layer of the connecting substrate 600. The metal plate 650 can be bonded to the connecting substrate 600. The metal plate 650 may be elastic.

[0136] In the optical axis direction, the length of the metal plate 650 may be the same as the length of the extension 620 in at least a portion of it. The metal plate 650 can extend to the same length as the extension 620 in the optical axis direction. The thickness of the metal plate 650 may be the same as the thickness of the connecting substrate 600. The thickness of the metal plate 650 may be greater than the thickness of the connecting substrate 600.

[0137] At least a portion of the metal plate 650 can be placed on the extension 620 of the connecting substrate 600. The extension 620 may include a bending region that is bent in a direction perpendicular to the optical axis. In this case, the metal plate 650 can be placed on the bending region.

[0138] The metal plate 650 can be formed from a conductive material. The metal plate 650 can be used for grounding (GND). The metal plate 650 can be electrically connected to the first substrate 110. In this case, the number of power supply connection patterns (Patterns) on the connecting substrate 600 can be reduced.

[0139] The camera device 10 may include an elastic member 700. The elastic member 700 may also be a support member. The elastic member 700 can connect the fixed part 100 and the first movable part 200. The elastic member 700 can elastically connect the fixed part 100 and the first movable part 200. The elastic member 700 can connect the bobbin 210 and the housing 130. The elastic member 700 can elastically connect the bobbin 210 and the housing 130. The elastic member 700 can support the first movable part 200 so that it can move relative to the fixed part 100. The elastic member 700 may deform when the first movable part 200 moves. Once the movement of the first movable part 200 is complete, the elastic member 700 can return the first movable part 200 to its initial position by restoring force (elastic force). The elastic member 700 may include a leaf spring. The elastic member 700 may include a spring. The elastic member 700 can be elastic in at least part of its structure. The elastic member 700 can provide a restoring force (elastic force) to the first moving part.

[0140] The camera device 10 may include an upper elastic member 710. The elastic member 700 may include the upper elastic member 710. The upper elastic member 710 may be positioned on top of the lower elastic member 720. The upper elastic member 710 may include an inner portion that is coupled to the bobbin 210. The inner portion of the upper elastic member 710 may be coupled to the upper part of the bobbin 210. The inner portion of the upper elastic member 710 may be positioned on the upper surface of the bobbin 210. The upper elastic member 710 may include an outer portion that is coupled to the housing 130. The outer portion of the upper elastic member 710 may be coupled to the lower part of the housing 130. The outer portion of the upper elastic member 710 may be positioned on the lower surface of the housing 130. The upper elastic member 710 may include a connecting portion that connects the inner portion and the outer portion. The connecting portion may be elastic.

[0141] The camera device 10 may include a lower elastic member 720. The elastic member 700 may include the lower elastic member 720. The lower elastic member 720 may be positioned below the upper elastic member 710. The lower elastic member 720 may include an inner portion that is coupled to the bobbin 210. The inner portion of the lower elastic member 720 may be coupled to the bottom of the bobbin 210. The inner portion of the lower elastic member 720 may be positioned on the bottom surface of the bobbin 210. The lower elastic member 720 may include an outer portion that is coupled to the housing 130. The outer portion of the lower elastic member 720 may be coupled to the top of the housing 130. The outer portion of the lower elastic member 720 may be positioned on the top surface of the housing 130. The lower elastic member 720 may include a connecting portion that connects the inner portion and the outer portion. The connecting portion may be elastic.

[0142] The lower elastic member 720 may include a plurality of lower elastic units. The lower elastic member 720 may include first and second lower elastic units 720-1 and 720-2. The lower elastic member 720 may include two lower elastic units 720-1 and 720-2. The two lower elastic units 720-1 and 720-2 can be spaced apart from each other to electrically connect the sensing board 470 and the first coil 430.

[0143] The camera device 10 may include a wire 800. The wire 800 may be a wire spring. The wire 800 may be an elastic member. In a modified example, the wire 800 may be a leaf spring. The wire 800 can connect the fixed part 100 and the second movable part 300. The wire 800 can elastically connect the fixed part 100 and the second movable part 300. The wire 800 can connect the housing 130 and the second substrate 310. The wire 800 can elastically connect the housing 130 and the second substrate 310. The wire 800 can movably support the second movable part 300. The wire 800 can support the second movable part 300 so that it moves or rotates in a direction perpendicular to the optical axis.

[0144] The camera device 10 according to this embodiment can use a shared magnet for AF and OIS drive. In this embodiment, a VCM magnetic field structure for a total of four axis drives (AF 1 axis (Z-shift) and OIS 3 axes (X-shift, Y-shift, Z-Roll)) can be realized with four magnets. Furthermore, in this embodiment, the FPCB bending structure can perform both electrical connection and spring functions.

[0145] In this embodiment, the shared drive magnet structure allows for a reduction in the number of magnets used, thereby reducing material costs. Furthermore, the shared magnet structure also allows for a reduction in the height of the camera device 10. Additionally, the spring shape of the connecting substrate 600 is achieved through a total of six bending processes, improving assembly and productivity.

[0146] The operation of the camera device according to this embodiment will be described below with reference to the drawings.

[0147] Figure 19 is a diagram illustrating the operation of the autofocus function of the camera device according to this embodiment.

[0148] When power is applied to the first coil 430 of the camera device 10 according to this embodiment, an electromagnetic field is formed in the first coil 430, and the first coil 430 can move in the optical axis direction (z axis direction) due to electromagnetic interaction with the drive magnet 410. At this time, the first coil 430 can move in the optical axis direction together with the first moving part 200 including the lens 220. In this case, the lens 220 moves away from or closer to the image sensor 330, so the focus of the subject can be adjusted. One or more currents and voltages are applied to supply power to the first coil 430.

[0149] When a current in a first direction is applied to the first coil 430 of the camera device 10 according to this embodiment, the first coil 430 can move upward in the optical axis direction (see Figure 19a) due to electromagnetic interaction with the drive magnet 410. At this time, the first coil 430 can move the lens 220 upward in the optical axis direction so that it moves away from the image sensor 330.

[0150] When a current in a second direction opposite to the first direction is applied to the first coil 430 of the camera device 10 according to this embodiment, the first coil 430 can move downward in the optical axis direction (see Figure 19b) due to electromagnetic interaction with the drive magnet 410. At this time, the first coil 430 can move downward in the optical axis direction so that the lens 220 is closer to the image sensor 330.

[0151] Figures 20 to 22 are diagrams illustrating the operation of the image stabilization function of the camera device according to this embodiment.

[0152] When power is applied to the second coil 440 of the camera device 10 according to this embodiment, an electromagnetic field is formed in the second coil 440, and the second coil 440 can move in a direction perpendicular to the optical axis direction due to electromagnetic interaction with the drive magnet 410. In addition, the second coil 440 can rotate with respect to the optical axis due to electromagnetic interaction with the drive magnet 410. At this time, the second coil 440 can move and rotate together with the second moving part 300, which includes the image sensor 330. In this embodiment, the second coil 440 can move the image sensor 330 so as to compensate for the shaking of the camera device 10 detected by the gyro sensor 490.

[0153] Figure 20 is a diagram illustrating the drive mechanism by which the image sensor of the camera device according to this embodiment is shifted along the x-axis.

[0154] When a current in the first direction is applied to the second-first coil 441 of the camera device 10 according to this embodiment, the second-first coil 441 can move in one of the first directions (x-axis direction) perpendicular to the optical axis direction (see Figure 20a) due to electromagnetic interaction with the drive magnet 410. At this time, the second-first coil 441 can move the image sensor 330 in one of the first directions perpendicular to the optical axis direction. Conversely, when a current in the second direction, which is opposite to the first direction, is applied to the second-first coil 441, the second-first coil 441 can move in another direction among the first directions (x-axis direction) perpendicular to the optical axis direction due to electromagnetic interaction with the drive magnet 410. At this time, the second-first coil 441 can move the image sensor 330 in another direction among the first directions perpendicular to the optical axis direction.

[0155] Figure 21 is a diagram illustrating the drive mechanism by which the image sensor of the camera device according to this embodiment is shifted along the y-axis.

[0156] When a current in the first direction is applied to the second-second coil 442 of the camera device 10 according to this embodiment, the second-second coil 442 can move in one of the second directions (y-axis direction) perpendicular to the optical axis direction (see Figure 21b) due to electromagnetic interaction with the drive magnet 410. At this time, the second-second coil 442 can move the image sensor 330 in one of the second directions perpendicular to the optical axis direction. Conversely, when a current in the second direction, which is opposite to the first direction, is applied to the second-second coil 442, the second-second coil 442 can move in the other direction of the second direction (y-axis direction) perpendicular to the optical axis direction due to electromagnetic interaction with the drive magnet 410. At this time, the second-second coil 442 can move the image sensor 330 in the other direction of the second direction perpendicular to the optical axis direction.

[0157] Figure 22 is a diagram illustrating the drive mechanism by which the image sensor of the camera device according to this embodiment is rolled around the z-axis.

[0158] When a current in the first direction is applied to the 2-1 coil 441 and the 2-2 coil 442 of the camera device 10 according to this embodiment, the 2-1 coil 441 and the 2-2 coil 442 can rotate in one direction around the optical axis due to electromagnetic interaction with the drive magnet 410 (see Figure 22c). At this time, the 2-1 coil 441 and the 2-2 coil 442 can rotate the image sensor 330 in one direction around the optical axis. This one direction may be counterclockwise. Conversely, when a current in the second direction, which is opposite to the first direction, is applied to the 2-1 coil 441 and the 2-2 coil 442, the 2-1 coil 441 and the 2-2 coil 442 can rotate in the other direction around the optical axis due to electromagnetic interaction with the drive magnet 410. At this time, the 2-1 coil 441 and the 2-2 coil 442 can rotate the image sensor 330 in the other direction around the optical axis. In this case, the other direction could be clockwise.

[0159] The optical equipment according to this embodiment will be described below with reference to the drawings.

[0160] Figure 23 is a perspective view of the optical device according to this embodiment, and Figure 24 is a perspective view of the optical device according to this embodiment, viewed from a different direction than Figure 23.

[0161] Optical device 1 may include one or more of the following: mobile phones, mobile terminals, mobile devices, smartphones, smartpads, portable smart devices, digital cameras, laptop computers, digital broadcasting terminals, PDAs (Personal Digital Assistants), PMPs (Portable Multimedia Players), and navigation systems. Optical device 1 may also include any device for capturing images or photographs.

[0162] The optical device 1 may include a main body 20. The optical device 1 may include a camera device 10. The camera device 10 may be mounted on the main body 20. The camera device 10 can photograph a subject. The optical device 1 may include a display 30. The display 30 may be mounted on the main body 20. The display 30 can output one or more of either video or images captured by the camera device 10. The display 30 may be mounted on the first surface of the main body 20. The camera device 10 may be mounted on either the first surface of the main body 20 or one or more of the second surface opposite the first surface.

[0163] Although embodiments of the present invention have been described above with reference to the attached drawings, those with ordinary skill in the art to which the present invention pertains should be able to understand that the present invention can be implemented in other specific forms without altering its technical idea or essential features. Therefore, the embodiments described above should be understood to be illustrative and not limiting in all respects.

Claims

1. First substrate; A base disposed on the first substrate; An image sensor positioned on the first substrate so as to move in a direction perpendicular to the optical axis; A housing that connects to the aforementioned base; A bobbin positioned on the base and arranged to move in the direction of the optical axis; A sensing board disposed in the housing; and It includes a connecting substrate that connects the image sensor and the first substrate, The camera device includes a connecting substrate which comprises a first terminal portion connected to the first substrate and a second terminal portion connected to the sensing substrate.

2. Includes a holder disposed on the first substrate, The camera device according to claim 1, wherein the image sensor is coupled with the holder.

3. The camera device according to claim 2, wherein the connecting substrate includes a first connecting region coupled to the base, a second connecting region coupled to the holder, and a connecting portion connecting the first connecting region and the second connecting region.

4. The camera device according to any one of claims 1 to 3, further comprising a Hall sensor or driver IC disposed on the sensing substrate.

5. Fixed section including the first substrate and the sensing substrate; A first movable part is positioned to move in the optical axis direction with respect to the fixed part; A second moving part arranged to move in a direction perpendicular to the optical axis; and Includes a connecting substrate that connects the fixed portion and the second movable portion, The camera device includes a connecting substrate which comprises a first terminal portion connected to the first substrate and a second terminal portion connected to the sensing substrate.

6. The camera device according to claim 5, wherein the connecting substrate moves in a direction perpendicular to the optical axis direction with respect to the first coupling region which is coupled to the fixed portion.

7. The connecting substrate includes a connecting portion connected to the second movable portion, an extension portion extending from the connecting portion, and a terminal portion connected to the extension portion and coupled to the first substrate. The camera device according to claim 5 or 6, wherein at least a portion of the extension moves in a direction perpendicular to the optical axis with respect to the terminal portion.

8. The second moving part includes an image sensor, The camera device according to claim 5 or 6, wherein the first moving part includes a lens.

9. Fixing portion including the first substrate; A first movable part, including a lens, is disposed within the fixed part; A second moving unit including an image sensor positioned at a location corresponding to the aforementioned lens; A drive magnet disposed in the fixed part; A first coil positioned in the first moving part at a location corresponding to the drive magnet; A second coil positioned in the second moving part at a location corresponding to the drive magnet; A connecting substrate that connects the first substrate and the second movable part; A sensing board disposed in the fixed part; and The sensing board includes a driver IC that is arranged on the sensing board and electrically connected to the first coil, The aforementioned connecting substrate includes a first terminal and a second terminal, The first terminal of the connecting substrate is connected to the first substrate. The sensing board is connected to the second terminal of the connecting board, and the camera device is provided.

10. The camera device according to claim 9, wherein the first terminal and the second terminal of the connecting substrate are arranged on the outer surface of the connecting substrate.

11. The camera device according to claim 10, wherein the second terminal of the connecting substrate is arranged on the outer surface of the connecting substrate at a distance from the first terminal.

12. The first terminal of the connecting substrate is located at the lower end of the connecting substrate. The camera device according to any one of claims 9 to 11, wherein the second terminal of the connecting substrate is arranged at a distance from the lower end of the connecting substrate.

13. The camera device according to any one of claims 9 to 11, wherein the second terminal of the connecting substrate is arranged on the first terminal in the optical axis direction.

14. The second moving part includes a second substrate that is electrically connected to the image sensor. The connecting substrate includes a connecting portion connected to the second substrate, a terminal portion connected to the first substrate, and an extension portion connecting the terminal portion. The camera device according to any one of claims 9 to 11, wherein the first terminal and the second terminal are arranged in the terminal portion.

15. The first moving part includes a sensing magnet and a correction magnet arranged on opposite sides of each other, The driver IC includes a sensor unit that senses the sensing magnet, The camera device according to any one of claims 9 to 11, wherein the driver IC is arranged to face the sensing magnet.

16. The fixed portion and the first movable portion are connected by an upper elastic member and a lower elastic member, The lower elastic member is positioned below the upper elastic member. The lower elastic member includes two lower elastic members that are separated from each other. The camera device according to any one of claims 9 to 11, wherein the two lower elastic members electrically connect the sensing substrate and the first coil.

17. The camera device according to claim 16, wherein the sensing board includes a first terminal connected to the second terminal of the connecting board and a second terminal connected to the two lower elastic members.

18. The second terminal of the connecting substrate includes four second terminals, The camera device according to claim 17, wherein the first terminal of the sensing board includes four first terminals that are coupled to the four second terminals of the connecting board.

19. The camera device according to any one of claims 9 to 11, wherein the sensing substrate is bent at least twice in a direction perpendicular to the optical axis.

20. Main unit; A camera device according to any one of claims 1, 2, 3, 9, 10, and 11, which is arranged on the main body; An optical device, including a display positioned on the main body and outputting video or images captured by the camera device.

Images