Vibration device

Abstract

To provide a vibration device which remedies the difficulty in handling and suppresses cracking or chipping of a vibrator.SOLUTION: A vibration device 1 comprises: a multilayer substrate 2 including a first face 101, a second face 102 positioned on the opposite side of the first face 101, a first insulation layer 21 including the first face 101, a second insulation layer 22 including the second face 102, a bottomed recess 40 including an opening 41 in the first face 101 and penetrating the first insulation layer 21, and a connection wiring layer 25 disposed between the first insulation layer 21 and the second insulation layer 22; a vibrator 5 which includes a container 51 including a storage space 52, a vibration element 6 stored in the storage space 52 and a connection terminal 70 disposed on an outer surface of the container 51 and electrically connected with the vibration element 6, and is disposed inside of the recess 40; and a conductive connection member 8 electrically connecting the connection wiring layer 25 and the connection terminal 70 to each other.SELECTED DRAWING: Figure 2

Description

Technical Field

[0004] , , , , , , , , ,

[0003] , , , ,

[0001] The present invention relates to a vibration device.

Background Art

[0002] In recent years, miniaturization and thinning of various electronic devices have been progressing. Therefore, vibration devices such as crystal oscillators used in these electronic devices are also required to cope with miniaturization. For example, Patent Document 1 describes that a first substrate made of silicon on which a crystal resonator is mounted and a second substrate made of silicon in which a recess for accommodating the crystal resonator is formed are overlapped and joined in a state where the crystal resonator is housed in the recess, and packaged, whereby a piezoelectric oscillator as a vibration device can be miniaturized. Also, for example, Patent Document 2 describes that one main surface of a crystal vibration plate having a vibration part is joined to a first sealing member formed of crystal, and the other main surface of the crystal vibration plate is joined to a second sealing member formed of crystal, and a package having a sandwich structure is configured, whereby miniaturization of a crystal oscillator as a vibration device can be achieved.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, the vibration devices described in Patent Document 1 and Patent Document 2 have problems that the handling difficulty due to miniaturization of the vibration device becomes remarkable, and also, since the members constituting the package are a silicon substrate and crystal, the vibrator and oscillator as vibration devices are brittle and easily chipped.

Means for Solving the Problems

[0005] The vibration device comprises a multilayer substrate having a first surface, a second surface located opposite to the first surface, a first insulating layer including the first surface, a second insulating layer including the second surface, a bottomed recess having an opening in the first surface and penetrating at least the first insulating layer, and a connecting wiring layer disposed between the first insulating layer and the second insulating layer; a container having a housing space, a vibration element housed in the housing space, a connecting terminal disposed on the outer surface of the container and electrically connected to the vibration element, a vibrator disposed in the recess, and a conductive connecting member electrically connecting the connecting wiring layer and the connecting terminal. [Brief explanation of the drawing]

[0006] [Figure 1] A plan view showing the schematic structure of the vibration device according to Embodiment 1. [Figure 2] Cross-sectional view of line AA in Figure 1. [Figure 3] A plan view showing the schematic structure of the vibration device according to Embodiment 2. [Figure 4] Cross-sectional view of line BB in Figure 2. [Figure 5] A plan view showing the schematic structure of the vibration device according to Embodiment 3. [Figure 6] Cross-sectional view of line CC in Figure 5. [Figure 7] Cross-sectional view of line DD in Figure 5. [Figure 8] A plan view showing the schematic structure of the vibration device according to Embodiment 4. [Figure 9] Cross-sectional view of line EE in Figure 8. [Figure 10] A plan view showing the schematic structure of the vibration device according to Embodiment 5. [Figure 11] Cross-sectional view of line GG in Figure 10. [Figure 12] A plan view showing the schematic structure of the vibration device according to Embodiment 6. [Figure 13] Cross-sectional view of line HH in Figure 12. [Figure 14]A plan view showing the schematic structure of the vibration device according to Embodiment 7. [Figure 15] Cross-sectional view of line II in Figure 14. [Modes for carrying out the invention]

[0007] 1. Embodiment 1 The vibration device 1 according to Embodiment 1 will be described with reference to Figures 1 and 2. For the sake of explanation, the following diagrams illustrate three mutually orthogonal axes: the X-axis, Y-axis, and Z-axis. The direction along the X-axis is referred to as the "X-direction," the direction along the Y-axis as the "Y-direction," and the direction along the Z-axis as the "Z-direction." The side with the arrow on each axis is also referred to as the "positive side," and the side opposite the arrow as the "negative side." The positive side of the Z-direction is also referred to as "up," and the negative side of the Z-direction as "down." In a plan view from the Z-direction, the surface on the positive Z-direction side is referred to as the top surface, and the surface on the opposite side of the Z-direction side is referred to as the bottom surface.

[0008] As shown in Figures 1 and 2, the vibration device 1 includes a multilayer substrate 2 having a first surface 101, a second surface 102 located on the opposite side of the first surface 101, a first insulating layer 21 including the first surface 101, a second insulating layer 22 including the second surface 102, a bottomed recess 40 having an opening 41 in the first surface 101 and penetrating the first insulating layer 21, and a connecting wiring layer 25 disposed between the first insulating layer 21 and the second insulating layer 22; a container 51 having a housing space 52; a vibration element 6 housed in the housing space 52; a connecting terminal 70 disposed on the outer surface of the container 51 and electrically connected to the vibration element 6; a vibrator 5 disposed in the recess 40; and a conductive connecting member 8 that electrically connects the connecting wiring layer 25 and the connecting terminal 70. The housing space 52 is also called the housing section.

[0009] First, let's explain the multilayer substrate 2. The multilayer substrate 2 is a flat plate with a rectangular outer shape when viewed from the Z direction perpendicular to the first surface 101 of the multilayer substrate 2. In this embodiment, the first surface 101 is the top surface of the multilayer substrate 2, and the second surface 102 is the bottom surface of the multilayer substrate 2.

[0010] The multilayer substrate 2 is, for example, a substrate formed by laminating a plurality of printed wiring boards in the Z direction, which is the thickness direction of the printed wiring board. As the multilayer substrate 2, resin substrates such as glass epoxy substrates, glass phenolic substrates, and glass polyimide substrates can be used. In the present embodiment, the multilayer substrate 2 is a glass epoxy substrate.

[0011] The multilayer substrate 2 includes a first insulating layer 21 including a first surface 101, a second insulating layer 22 including a second surface 102, and a third insulating layer 23 disposed between the first insulating layer 21 and the second insulating layer 22. The first insulating layer 21, the third insulating layer 23, and the second insulating layer 22 are laminated in this order from above downward.

[0012] In the multilayer substrate 2, a first wiring layer 26 is disposed between the first insulating layer 21 and the third insulating layer 23 adjacent to each other in the Z direction, which is the stacking direction. A second wiring layer 27 is disposed between the third insulating layer 23 and the second insulating layer 22 adjacent to each other in the stacking direction.

[0013] Further, on the second surface 102 of the multilayer substrate 2, an external terminal 28 for making an electrical connection with the outside is disposed.

[0014] The second insulating layer 22 and the third insulating layer 23 each have a through hole 291 penetrating in the Z direction, which is the thickness direction of the second insulating layer 22 and the third insulating layer 23, and a through electrode 29 embedded inside the through hole 291. The through electrode 29 electrically connects the first wiring layer 26, the second wiring layer 27, and the external terminal 28. In the present embodiment, the first insulating layer 21 does not have the through hole 291 and the through electrode 29, but the first insulating layer 21 may have the through hole 291 and the through electrode 29.

[0015] Further, the multilayer substrate 2 has a bottomed recess 40 having an opening 41 on the first surface 101. In this embodiment, the recess 40 penetrates the first insulating layer 21, which includes the first surface 101. That is, the first insulating layer 21 has a penetration portion corresponding to the recess 40. In the penetration portion of the first insulating layer 21 corresponding to the recess 40, the surface located opposite to the first surface 101 is closed by the third insulating layer 23, which is adjacent to the first insulating layer 21 in the stacking direction. In this way, a bottomed recess 40 is formed, having an opening 41 in the first surface 101 and penetrating the first insulating layer 21. The bottom surface 42 of the recess 40 is the surface of the third insulating layer 23 that closes the penetration portion of the first insulating layer 21 corresponding to the recess 40 and faces the first insulating layer 21.

[0016] In this embodiment, the opening 41 of the recess 40 is rectangular in shape when viewed from the Z direction, and the opening 41 is surrounded by the first surface 101. In other words, the periphery of the recess 40 is surrounded by the first surface 101.

[0017] As described above, since the first wiring layer 26 is positioned between the first insulating layer 21 and the third insulating layer 23, which are adjacent in the stacking direction, the first wiring layer 26 can be positioned on the bottom surface 42 of the recess 40, which is the surface of the third insulating layer 23 facing the first insulating layer 21. The first wiring layer 26 positioned on the bottom surface 42 of the recess 40 can function as a connecting wiring layer 25. In other words, the first wiring layer 26 as a connecting wiring layer 25 is positioned on the bottom surface 42 of the recess 40.

[0018] The first wiring layer 26, which serves as a connecting wiring layer 25 and is positioned on the bottom surface 42 of the recess 40, is located on the negative Z side of the first surface 101 of the multilayer substrate 2 and on the positive Z side of the second surface 102 of the multilayer substrate 2. In other words, the first wiring layer 26, which serves as a connecting wiring layer 25, is positioned between the first surface 101 and the second surface 102 of the multilayer substrate 2.

[0019] The first wiring layer 26, which serves as the connecting wiring layer 25, is electrically connected to a connecting terminal 70, which will be described later, located on the outer surface of the container 51 of the vibrator 5, which is placed in the recess 40, via a conductive connecting member 8.

[0020] Furthermore, the first wiring layer 26, which serves as a connecting wiring layer 25, is electrically connected to an external terminal 28 located on the second surface 102 of the multilayer substrate 2 via a through electrode 29, or via the through electrode 29 and the second wiring layer 27.

[0021] Next, we will explain the oscillator 5.

[0022] The vibrator 5 comprises a container 51 having a housing space 52, a vibrating element 6 housed in the housing space 52, and a connection terminal 70 arranged on the outer surface of the container 51 and electrically connected to the vibrating element 6. The outer surface of the container 51 refers to the outer surface of the container 51 and includes the top, bottom, and sides of the container 51.

[0023] The container 51 includes a base 53 which is a semiconductor substrate and a lid 54 which is a semiconductor substrate.

[0024] The base 53 is plate-shaped. The base 53 has a surface 55 facing the lid 54 and a surface 56 located on the opposite side of the surface 55 facing the lid 54. In this embodiment, the surface 56 located on the opposite side of the surface 55 facing the lid 54 becomes the bottom surface of the container 51.

[0025] In this embodiment, the base 53 is a semiconductor substrate containing single-crystal silicon. However, the base 53 may also be a semiconductor substrate other than silicon, such as germanium, gallium arsenide, gallium phosphide, gallium nitride, or silicon carbide.

[0026] The lid 54 is box-shaped. The lid 54 has a surface 57 facing the base 53, a surface 58 located on the opposite side of the surface 57 facing the base 53, and a bottomed recess 541 that opens into the surface 57 facing the base 53. In this embodiment, the surface 58 located on the opposite side of the surface 57 facing the base 53 becomes the top surface of the container 51.

[0027] In this embodiment, the lid 54 is a semiconductor substrate containing single-crystal silicon. However, the lid 54 may also be a semiconductor substrate other than silicon, such as germanium, gallium arsenide, gallium phosphide, gallium nitride, or silicon carbide.

[0028] The surface 55 of the base 53 facing the lid 54 and the surface 57 of the lid 54 facing the base 53, located at the outer edge of the recess 541, are joined via a joining member 511 so as to close the opening of the recess 541 in the lid 54. This forms a housing space 52 for housing the vibrating element 6. Alternatively, instead of using the joining member 511, the components may be joined by diffusion bonding utilizing the diffusion of metal contained in the base 53 and lid 54, diffusion bonding between silicon, or hydrophilic bonding with a Si-O-Si bond layer created by hydrophilizing the surface layer.

[0029] Furthermore, the base 53 has a through hole 531 that penetrates in the Z direction, which is the thickness direction of the base 53. An insulating film 532 is formed on the surface of the base 53, including the inner surface of the through hole 531, the surface 55 facing the lid 54, and the surface 56 located on the opposite side of the surface 55 facing the lid 54. A through electrode 59 is embedded in the through hole 531.

[0030] On the surface 56 of the base 53, opposite to the surface 55 facing the lid 54, the connection terminals 70 are positioned. In other words, the connection terminals 70 are positioned on the outer surface of the container 51, specifically on the lower surface of the container 51, which is the surface 56 of the base 53, opposite to the surface 55 facing the lid 54.

[0031] Wiring 71 is positioned on the surface 55 of the base 53 facing the lid 54. The connection terminal 70 and the wiring 71 are electrically connected by a through electrode 59.

[0032] The vibrating element 6 housed in the housing space 52 includes a vibrating piece 61 which is a quartz substrate, an excitation electrode 62 which vibrates the vibrating piece 61, a connecting electrode 63 which mechanically and electrically connects the vibrating element 6 to the base 53 and outputs a vibration signal to the outside, and a lead electrode 64 which electrically connects the excitation electrode 62 and the connecting electrode 63. In this embodiment, an AT-cut quartz substrate is used as the vibrating piece 61, but an SC-cut quartz substrate, BT-cut quartz substrate, Z-cut quartz substrate, ST-cut quartz substrate, etc. may also be used.

[0033] The connecting electrode 63 of the vibrating element 6 and the wiring 71 located on the surface 55 of the base 53 facing the lid 54 are joined via a conductive member 65 such as a metal bump. This mechanically connects the vibrating element 6 to the base 53, and electrically connects the connecting electrode 63 of the vibrating element 6 to the wiring 71 located on the surface 55 facing the lid 54. As a result of this electrical connection between the connecting electrode 63 of the vibrating element 6 and the wiring 71 located on the surface 55 facing the lid 54, the connecting terminal 70 located on the surface 56 of the base 53 opposite to the surface 55 facing the lid 54 is electrically connected to the vibrating element 6 via the conductive member 65, the wiring 71, and the through electrode 59.

[0034] Next, the arrangement of the oscillator 5 on the multilayer substrate 2 will be described. In this embodiment, the vibrator 5 is placed in a bottomed recess 40 having an opening 41 on the first surface 101, which is the upper surface of the multilayer substrate 2.

[0035] In the oscillator 5, the surface 58 on the lid 54, which is the upper surface of the container 51, opposite to the surface 57 facing the base 53, becomes the surface 512 of the container 51 located on the side of the opening 41 of the recess 40 in the multilayer substrate 2. The surface 56 on the base 53, which is the lower surface of the container 51, opposite to the surface 55 facing the lid 54, becomes the surface 513 of the container 51 located on the side of the bottom 42 of the recess 40 in the multilayer substrate 2. In the container 51, the surface 512 of the container 51 located on the side of the opening 41 of the recess 40 in the multilayer substrate 2 is located on the opposite side of the surface 513 of the container 51 located on the side of the bottom 42 of the recess 40 in the multilayer substrate 2.

[0036] A first wiring layer 26, which serves as a connecting wiring layer 25, is positioned on the bottom surface 42 of the recess 40 in the multilayer substrate 2. A connecting terminal 70 is positioned on a surface 56 of the base 53, which is the surface 513 of the container 51 located on the bottom surface 42 side of the recess 40 in the multilayer substrate 2. This surface 513 is opposite to the surface 55 facing the lid 54. These two surfaces are electrically connected by a conductive connecting member 8.

[0037] In this way, by positioning the vibrator 5 within the recess 40 of the multilayer substrate 2, the handling difficulties associated with the miniaturization of the vibration device 1 are improved. Furthermore, since the vibrator 5 is protected by the multilayer substrate 2, cracks and chips of the vibrator 5 can be suppressed.

[0038] In this embodiment, as described above, the material constituting the container 51 in the oscillator 5 is a silicon substrate. Semiconductor substrates such as silicon substrates are brittle and easily chipped. For an oscillator 5 having a container 51 made of such a brittle and easily chipped semiconductor substrate, cracking and chipping of the oscillator 5 can be effectively suppressed.

[0039] Furthermore, in this embodiment, as described above, the multilayer substrate 2 is a glass epoxy substrate. Resin substrates such as glass epoxy substrates have excellent mechanical properties and are less prone to cracking or chipping, allowing for easy handling of the vibration device 1.

[0040] Furthermore, in this embodiment, as shown in Figure 2, the surface 58 on the lid 54, which is the surface 512 of the container 51 located on the side of the opening 41 of the recess 40 in the multilayer substrate 2, is flush with the first surface 101 of the multilayer substrate 2 in which the opening 41 of the recess 40 is formed.

[0041] Specifically, the surface 58 on the lid 54, which is the surface 512 of the container 51 located on the side of the opening 41 of the recess 40 in the multilayer substrate 2, and the first surface 101 of the multilayer substrate 2, on which the opening 41 of the recess 40 in the multilayer substrate 2 is formed, are located on the same XY plane, which is surface F1. In other words, the surface 512 of the container 51 located on the side of the opening 41 of the recess 40 in the multilayer substrate 2 and the first surface 101 of the multilayer substrate 2 are at the same position in the Z direction.

[0042] In other words, the oscillator 5 is positioned within the recess 40, which has an opening 41 in the first surface 101 of the multilayer substrate 2, so as not to protrude from the recess 40.

[0043] Thus, in this embodiment, the oscillator 5 does not protrude above the first surface 101 of the multilayer substrate 2, which effectively suppresses cracks, chips, and other damage to the oscillator 5.

[0044] Furthermore, in this embodiment, as described above, the external terminals 28 are located on the second surface 102, which is the lower surface of the multilayer substrate 2. Therefore, for example, when surface mounting the vibration device 1 to an external substrate using a suction collet, the vibration device 1 is attracted and held by the suction collet on the first surface 101, which is the upper surface of the multilayer substrate 2. At this time, the vibrator 5 does not protrude above the first surface 101 of the multilayer substrate 2, so the vibrator 5 does not interfere with the suction collet. As a result, the attraction and holding of the vibration device 1 by the suction collet is stable, and the vibration device 1 can be easily mounted to the external substrate.

[0045] Furthermore, in this embodiment, as described above, in a plan view from the Z direction, the opening 41 of the recess 40 is surrounded by the first surface 101. This makes it possible to more effectively suppress cracks and chips in the vibrator 5. In addition, the adsorption and holding of the vibration device 1 by the suction collet becomes more stable, and the vibration device 1 can be mounted on an external substrate more easily.

[0046] Furthermore, in this embodiment, the connection terminal 70 and the first wiring layer 26, which serves as the connection wiring layer 25, are joined via a conductive connecting member 8, such as a metal bump or solder paste. As a result, the vibrator 5, which has the connection terminal 70 and is located on the outer surface of the container 51, and the multilayer substrate 2, which has the first wiring layer 26 as the connection wiring layer 25 and is located on the bottom surface 42 of the recess 40, are electrically connected, and the vibrator 5 and the multilayer substrate 2 are mechanically connected.

[0047] Furthermore, in this embodiment, the connection terminal 70 and the first wiring layer 26, which serves as the connection wiring layer 25, are arranged to overlap in a plan view from the Z direction. This allows the vibration device 1 to be miniaturized by joining the connection terminal 70 and the first wiring layer 26, which serves as the connection wiring layer 25, via the conductive connection member 8.

[0048] Furthermore, when joining the connection terminals 70 on the vibrator 5 and the first wiring layer 26, which serves as the connection wiring layer 25 on the multilayer substrate 2, via a conductive connecting member 8, it is preferable to attach the conductive connecting member 8, such as a metal bump or solder paste, to the connection terminals 70 on the vibrator 5 in advance before placing the vibrator 5 in the recess 40 of the multilayer substrate 2. This eliminates the need to attach the conductive connecting member 8 to the connection wiring layer 25, which is placed on the bottom surface 42 of the recess 40, in advance before placing the vibrator 5 in the recess 40 of the multilayer substrate 2, making it easier to manufacture the vibration device 1.

[0049] As described above, the vibration device 1 of this embodiment has a multilayer substrate 2 having a first surface 101, a second surface 102 located on the opposite side of the first surface 101, a first insulating layer 21 including the first surface 101, a second insulating layer 22 including the second surface 102, a bottomed recess 40 having an opening 41 in the first surface 101 and penetrating the first insulating layer 21, and a connecting wiring layer 25 disposed between the first insulating layer 21 and the second insulating layer 22; a container 51 having a housing space 52; a vibration element 6 housed in the housing space 52; a connecting terminal 70 disposed on the outer surface of the container 51 and electrically connected to the vibration element 6; and a conductive connecting member 8 that electrically connects the vibration element 6, the connecting wiring layer 25 and the connecting terminal 70, which are disposed within the recess 40. This improves the handling difficulties associated with miniaturization and provides a vibration device 1 that suppresses cracking or chipping of the oscillator 5.

[0050] In this embodiment, the multilayer substrate 2 consists of three layers: a first insulating layer 21, a second insulating layer 22, and a third insulating layer 23. However, by stacking multiple third insulating layers 23 between the first insulating layer 21 and the second insulating layer 22, the multilayer substrate 2 may consist of four or more layers.

[0051] Furthermore, in this embodiment, the recess 40 penetrates the first insulating layer 21, but the recess 40 may also penetrate the first insulating layer 21 and the third insulating layer 23 adjacent to the first insulating layer 21 in the lamination direction. In other words, the recess 40 only needs to penetrate at least the first insulating layer 21.

[0052] Furthermore, in this embodiment, the container 51 in the oscillator 5 is made of a silicon substrate, which is a semiconductor substrate. However, the container 51 may also be made of a material other than a semiconductor substrate, for example, quartz, which is a material that is as brittle and easily chipped as a semiconductor substrate.

[0053] Furthermore, although the oscillator 5 does not have an oscillation circuit in this embodiment, the oscillator 5 may be an oscillator that has an oscillation circuit.

[0054] 2. Embodiment 2 Next, the vibration device 1a according to Embodiment 2 will be described with reference to Figures 3 and 4. Components similar to those in Embodiment 1 are denoted by the same reference numerals, and their descriptions are omitted. Embodiment 2 is the same as Embodiment 1 except that the depth of the recess 40a in the multilayer substrate 2a, that is, the position in the Z direction on the bottom surface 42a of the recess 40a, is different.

[0055] As shown in Figures 3 and 4, the multilayer substrate 2a has a bottomed recess 40a with an opening 41a on the first surface 101.

[0056] In this embodiment, the recess 40a penetrates the first insulating layer 21 and the third insulating layer 23 adjacent to the first insulating layer 21 in the stacking direction. That is, the first insulating layer 21 has a first penetration portion 43 that penetrates the first insulating layer 21, and the third insulating layer 23 has a second penetration portion 44 that penetrates the third insulating layer 23. In this embodiment, in a plan view from the Z direction, the shape of the first penetration portion 43 corresponding to the recess 40a formed in the first insulating layer 21 and the shape of the second penetration portion 44 corresponding to the recess 40a formed in the third insulating layer 23 are substantially the same, and the first penetration portion 43 that penetrates the first insulating layer 21 and the second penetration portion 44 that penetrates the third insulating layer 23 overlap in a plan view from the Z direction.

[0057] The bottom surface 42a of the recess 40a is the surface of the second insulating layer 22 that is adjacent to the third insulating layer 23 in the stacking direction and faces the third insulating layer 23. In other words, the bottom surface 42a of the recess 40a is the surface of the second insulating layer 22 that is on the opposite side from the second surface 102 of the multilayer substrate 2a.

[0058] In other words, in this embodiment, the depth of the recess 40a in the multilayer substrate 2a is deeper than in Embodiment 1 by an amount corresponding to the thickness of the third insulating layer 23 through which the recess 40a penetrates. To put it another way, the position of the bottom surface 42a of the recess 40a in the Z direction is located on the second surface 102 side of the multilayer substrate 2a, compared to Embodiment 1, by an amount corresponding to the thickness of the third insulating layer 23 through which the recess 40a penetrates.

[0059] Since the second wiring layer 27 is positioned between the third insulating layer 23 and the second insulating layer 22, which are adjacent in the stacking direction, the second wiring layer 27 can be positioned on the bottom surface 42a of the recess 40a, which is the surface of the second insulating layer 22 facing the third insulating layer 23. The second wiring layer 27 positioned on the bottom surface 42a of the recess 40a can function as a connecting wiring layer 25a. In other words, the second wiring layer 27 as a connecting wiring layer 25a is positioned on the bottom surface 42a of the recess 40a.

[0060] The second wiring layer 27, which serves as a connecting wiring layer 25a and is positioned on the bottom surface 42a of the recess 40a, is located on the negative Z side of the first surface 101 of the multilayer substrate 2a and on the positive Z side of the second surface 102 of the multilayer substrate 2a. In other words, the second wiring layer 27, which serves as a connecting wiring layer 25a, is positioned between the first surface 101 and the second surface 102 of the multilayer substrate 2a.

[0061] The second wiring layer 27, which serves as a connecting wiring layer 25a, is electrically connected to a connecting terminal 70 located on the surface 513 of a container 51 situated on the bottom surface 42a side of the recess 40a in the multilayer substrate 2a, via a conductive connecting member 8.

[0062] In this embodiment, as shown in Figure 4, the surface 58 on the lid 54, which is the surface 512 of the container 51 located on the side of the opening 41a of the recess 40a in the multilayer substrate 2a, is located on the side of the second surface 102 of the multilayer substrate 2a, rather than the first surface 101 of the multilayer substrate 2a where the opening 41a of the recess 40a in the multilayer substrate 2a is formed.

[0063] Specifically, the surface 58 on the lid 54, which is the surface 512 of the container 51 located on the side of the opening 41a of the recess 40a in the multilayer substrate 2a, is located on the opposite side from the surface 57 facing the base 53. This surface 58 is located below the surface F1, which is the XY plane containing the first surface 101 of the multilayer substrate 2a where the opening 41a of the recess 40a in the multilayer substrate 2a is formed. In other words, the surface 512 of the container 51 located on the side of the opening 41a of the recess 40a in the multilayer substrate 2a and the first surface 101 of the multilayer substrate 2a are at different positions in the Z direction, and the surface 512 of the container 51 located on the side of the opening 41a of the recess 40a in the multilayer substrate 2a is located on the side of the second surface 102 of the multilayer substrate 2a than the first surface 101 of the multilayer substrate 2a.

[0064] According to this embodiment, in addition to the effects of Embodiment 1, the following effects can be obtained. The surface 512 of the container 51 of the resonator 5, which is located on the side of the opening 41a of the recess 40a in the multilayer substrate 2a, is located on the side of the second surface 102 of the multilayer substrate 2a, rather than on the first surface 101 of the multilayer substrate 2a. In this way, since the resonator 5 is located on the side of the second surface 102 of the multilayer substrate 2a, which is on the side of the bottom surface 42a of the recess 40a, rather than on the first surface 101 where the opening 41a of the recess 40a is formed, cracks and chips of the resonator 5 can be suppressed even more effectively.

[0065] 3. Embodiment 3 Next, the vibration device 1b according to Embodiment 3 will be described with reference to Figures 5 to 7. Components similar to those in Embodiment 1 are denoted by the same reference numerals, and their descriptions are omitted. Embodiment 3 is the same as Embodiment 1 except that the shape of the recess 40b in the multilayer substrate 2b is different.

[0066] As shown in Figure 5, the multilayer substrate 2b is a flat plate with a rectangular shape when viewed from the Z direction perpendicular to the first surface 101 of the multilayer substrate 2b. When viewed from the Z direction, the multilayer substrate 2b has a first side surface 20A along the X direction, a second side surface 20B opposite the first side surface 20A and along the X direction, a third side surface 20C adjacent to the first side surface 20A and the second side surface 20B and along the Y direction, and a fourth side surface 20D opposite the third side surface 20C and along the Y direction. The first surface 101, which is the top surface of the multilayer substrate 2b, and the second surface 102, which is the bottom surface of the multilayer substrate 2b, are connected via the first side surface 20A, the second side surface 20B, the third side surface 20C, and the fourth side surface 20D.

[0067] As shown in Figures 5 to 7, the multilayer substrate 2b has a bottomed recess 40b with an opening 41b on the first surface 101. The recess 40b penetrates the first insulating layer 21 and extends in a groove-like manner from the first side surface 20A, which is one of the opposing sides of the multilayer substrate 2b, to the second side surface 20B, which is the other side surface. The recess 40b communicates with the outside of the multilayer substrate 2b at the first side surface 20A and the second side surface 20B of the multilayer substrate 2b.

[0068] Furthermore, in this embodiment, as shown in Figure 6, the surface 58 on the lid 54, which is the surface 512 of the container 51 located on the side of the opening 41b of the recess 40b in the multilayer substrate 2b, is flush with the first surface 101 of the multilayer substrate 2b where the opening 41b of the recess 40b in the multilayer substrate 2b is formed.

[0069] According to this embodiment, in addition to the effects of Embodiment 1, the following effects can be obtained. The recess 40b in the multilayer substrate 2b extends in a groove shape from the first side surface 20A, which is one of the opposing sides of the multilayer substrate 2b, to the second side surface 20B, which is the other side surface. In this way, the recess 40b in the multilayer substrate 2b can be easily formed by extending the recess 40b in a groove shape from the first side surface 20A, which is one of the opposing sides of the multilayer substrate 2b, to the second side surface 20B, which is the other side surface. In other words, the manufacturing cost of the multilayer substrate 2b having the recess 40b can be reduced, and therefore, a vibration device 1b with reduced manufacturing cost can be provided.

[0070] In this embodiment, the recess 40b in the multilayer substrate 2b extends in a groove shape from the first side surface 20A to the second side surface 20B of the multilayer substrate 2b. However, the recess 40b may also extend in a groove shape from the third side surface 20C, which is one of the opposing sides of the multilayer substrate 2b, to the fourth side surface 20D, which is the other side surface.

[0071] 4. Embodiment 4 Next, the vibration device 1c according to Embodiment 4 will be described with reference to Figures 8 and 9. Components similar to those in Embodiment 1 are denoted by the same reference numerals, and their descriptions are omitted. Embodiment 4 is the same as Embodiment 1, except that the conductive connecting member 8c that electrically connects the connecting wiring layer 25c, which is placed in the recess 40c of the multilayer substrate 2c, and the connecting terminal 70, which is placed on the outer surface of the container 51 of the vibrator 5c, is a conductive wire, the shape of the recess 40c is different, the arrangement of the connecting wiring layer 25c within the recess 40c is different, and the arrangement of the vibrator 5c within the recess 40c is different.

[0072] As shown in Figures 8 and 9, the multilayer substrate 2c has a bottomed recess 40c with an opening 41c on the first surface 101. The recess 40c has a stepped portion 45 that protrudes inward between the opening 41c and the bottom surface 42c of the recess 40c.

[0073] In this embodiment, the recess 40c penetrates the first insulating layer 21 and the third insulating layer 23 adjacent to the first insulating layer 21 in the stacking direction. That is, the first insulating layer 21 has a first penetration portion 43c that penetrates the first insulating layer 21, and the third insulating layer 23 has a second penetration portion 44c that penetrates the third insulating layer 23.

[0074] The bottom surface 42c of the recess 40c is the surface of the second insulating layer 22 that is adjacent to the third insulating layer 23 in the stacking direction and faces the third insulating layer 23. In other words, the bottom surface 42c of the recess 40c is the surface of the second insulating layer 22 that is on the opposite side from the second surface 102 of the multilayer substrate 2c.

[0075] In a plan view from the Z direction, the shape of the first penetration portion 43c that penetrates the first insulating layer 21 is different from the shape of the second penetration portion 44c that penetrates the third insulating layer 23. The width of the second penetration portion 44c that penetrates the third insulating layer 23 in the X direction is smaller than the width of the first penetration portion 43c that penetrates the first insulating layer 21 in the X direction, and the width of the second penetration portion 44c that penetrates the third insulating layer 23 in the Y direction is smaller than the width of the first penetration portion 43c that corresponds to the recess 40c formed in the first insulating layer 21 in the Y direction.

[0076] Thus, in a plan view from the Z direction, the second penetration portion 44c that penetrates the third insulating layer 23 is smaller than the first penetration portion 43c that penetrates the first insulating layer 21. Therefore, the third insulating layer 23, which becomes a stepped portion 45 protruding inward from the recess 40c, can be positioned between the opening 41c of the recess 40c and the bottom surface 42c of the recess 40c. The upper surface of the stepped portion 45 is the surface of the third insulating layer 23 that is adjacent to the first insulating layer 21 in the stacking direction and faces the first insulating layer 21.

[0077] Since the first wiring layer 26 is positioned between the first insulating layer 21 and the third insulating layer 23, which are adjacent in the stacking direction, the first wiring layer 26 can be positioned on the upper surface of the stepped portion 45 that protrudes inward from the recess 40c. The first wiring layer 26 positioned on the upper surface of the stepped portion 45 can function as a connecting wiring layer 25c. In other words, the first wiring layer 26 is positioned on the upper surface of the stepped portion 45 as a connecting wiring layer 25c.

[0078] Furthermore, in this embodiment, the arrangement of the transducer 5c within the recess 40c is reversed compared to Embodiment 1, with the top and bottom of the transducer 5c reversed. That is, the bottom surface of the container 51 of the transducer 5c is the surface 58 located on the opposite side of the surface 57 of the lid 54 that faces the base 53, and this surface 58 is the surface 513 of the container 51 located on the bottom surface 42c side of the recess 40c in the multilayer substrate 2c. The top surface of the container 51 of the transducer 5c is the surface 56 located on the opposite side of the surface 55 of the base 53 that faces the lid 54, and this surface 56 is the surface 512 of the container 51 located on the opening 41c side of the recess 40c in the multilayer substrate 2c.

[0079] The bottom surface 42c of the recess 40c and the surface 513 of the container 51 on the vibrator 5c located on the bottom surface 42c side of the recess 40c are joined via a bonding member 515 such as a thermosetting adhesive. In this way, the vibrator 5c and the multilayer substrate 2c are mechanically connected.

[0080] A connection terminal 70 is located on the upper surface of the container 51 of the transducer 5c, that is, on the surface 56 that is opposite to the surface 55 facing the lid 54 of the base 53.

[0081] The connection terminal 70 and the first wiring layer 26, which is a connection wiring layer 25c positioned on the upper surface of the stepped portion 45 in the recess 40c, are electrically connected via a conductive wire, which is a conductive connection member 8c, using a wire bonding technique.

[0082] Furthermore, in this embodiment, as shown in Figure 9, the surface 56 on the base 53, which is the surface 512 of the container 51 located on the side of the opening 41c of the recess 40c in the multilayer substrate 2c, is located on the side of the second surface 102 of the multilayer substrate 2c, rather than the first surface 101 of the multilayer substrate 2c where the opening 41c of the recess 40c in the multilayer substrate 2c is formed.

[0083] Specifically, the surface 56 on the base 53, which is the surface 512 of the container 51 located on the side of the opening 41c of the recess 40c in the multilayer substrate 2c, is located on the opposite side of the surface 55 facing the lid 54. This surface 56 is located below the surface F1, which is the XY plane containing the first surface 101 of the multilayer substrate 2c where the opening 41c of the recess 40c in the multilayer substrate 2c is formed. This effectively suppresses cracks and chips in the oscillator 5c.

[0084] Furthermore, in this embodiment, the conductive wire, which is a conductive connecting member 8c that electrically connects the connecting terminal 70 and the first wiring layer 26 as a connecting wiring layer 25c, is located below the plane F1, which is the XY plane that includes the first surface 101 of the multilayer substrate 2c where the opening 41c of the recess 40c in the multilayer substrate 2c is formed. This effectively suppresses damage to the conductive wire, which is the conductive connecting member 8c.

[0085] According to this embodiment, in addition to the effects of Embodiment 1, the following effects can be obtained. By connecting the first wiring layer 26, which serves as the connecting wiring layer 25c, and the connecting terminal 70 via a conductive wire, which is a conductive connecting member 8c, the reliability of the electrical connection between the first wiring layer 26, which serves as the connecting wiring layer 25c, and the connecting terminal 70 can be increased. Therefore, a highly reliable vibration device 1c can be provided.

[0086] 5. Embodiment 5 Next, the vibration device 1d according to Embodiment 5 will be described with reference to Figures 10 and 11. Components similar to those in Embodiment 1 are denoted by the same reference numerals, and their descriptions are omitted. Embodiment 5 is the same as Embodiment 1, except that the external terminal 28d is arranged on the first surface 101d of the multilayer substrate 2d, and the top and bottom of the multilayer substrate 2d and the vibrator 5d are reversed.

[0087] As shown in Figures 10 and 11, the multilayer substrate 2d is inverted compared to Embodiment 1. That is, the first surface 101d of the multilayer substrate 2d is the bottom surface of the multilayer substrate 2d, and the second surface 102d of the multilayer substrate 2d is the top surface of the multilayer substrate 2d.

[0088] The multilayer substrate 2d includes a first insulating layer 21d including a first surface 101d, a second insulating layer 22d including a second surface 102d, and a third insulating layer 23d disposed between the first insulating layer 21d and the second insulating layer 22d. The second insulating layer 22d, the third insulating layer 23d, and the first insulating layer 21d are stacked in this order from top to bottom.

[0089] The multilayer substrate 2d has a bottomed recess 40d with an opening 41d on its first surface 101d. The recess 40d penetrates the first insulating layer 21d. The bottom surface 42d of the recess 40d is the surface of the third insulating layer 23d that is adjacent to the first insulating layer 21d in the lamination direction and faces the first insulating layer 21d.

[0090] Since the first wiring layer 26 is positioned between the first insulating layer 21d and the third insulating layer 23d, which are adjacent in the stacking direction, the first wiring layer 26 can be positioned on the bottom surface 42d of the recess 40d, which is the surface of the third insulating layer 23d facing the first insulating layer 21d. The first wiring layer 26 positioned on the bottom surface 42d of the recess 40d can function as a connecting wiring layer 25d. In other words, the first wiring layer 26 as a connecting wiring layer 25d is positioned on the bottom surface 42d of the recess 40d.

[0091] In this embodiment, an external terminal 28d for electrical connection to the outside is arranged on the first surface 101d of the multilayer substrate 2d. The first insulating layer 21d, including the first surface 101d, has a through electrode 29. The external terminal 28d is electrically connected to the first wiring layer 26, which serves as a connecting wiring layer 25d, via the through electrode 29.

[0092] Furthermore, in this embodiment, the top and bottom of the transducer 5d are reversed compared to Embodiment 1. That is, the bottom surface of the container 51 in the transducer 5d is the surface 58 located on the opposite side of the surface 57 of the lid 54 that faces the base 53, and the surface 58 located on the opposite side of the surface 57 of the lid 54 that faces the base 53 becomes the surface 512 of the container 51 located on the opening 41d side of the recess 40d. And the top surface of the container 51 in the transducer 5d is the surface 56 located on the opposite side of the surface 55 of the base 53 that faces the lid 54, and the surface 56 located on the opposite side of the surface 55 of the base 53 that faces the lid 54 becomes the surface 513 of the container 51 located on the bottom surface 42d side of the recess 40d.

[0093] Furthermore, in this embodiment, as shown in Figure 11, the surface 58 on the lid 54, which is the surface 512 of the container 51 located on the side of the opening 41d of the recess 40d in the multilayer substrate 2d, is flush with the first surface 101d of the multilayer substrate 2d in which the opening 41d of the recess 40d is formed.

[0094] Specifically, the surface 58 on the lid 54, which is the surface 512 of the container 51 located on the side of the opening 41d of the recess 40d in the multilayer substrate 2d, and the first surface 101d of the multilayer substrate 2d, where the opening 41d of the recess 40d in the multilayer substrate 2d is formed, are located on the same XY plane, which is surface F2. In other words, the surface 512 of the container 51 located on the side of the opening 41d of the recess 40d in the multilayer substrate 2d and the first surface 101d of the multilayer substrate 2d are at the same position in the Z direction.

[0095] In other words, the oscillator 5d is positioned within the recess 40 such that it does not protrude from the recess 40d having an opening 41d on the first surface 101d of the multilayer substrate 2d.

[0096] Thus, in this embodiment, the oscillator 5d does not protrude below the first surface 101d of the multilayer substrate 2d, and cracks and chips of the oscillator 5d can be effectively suppressed.

[0097] Furthermore, in this embodiment, as described above, the external terminals 28d are located on the first surface 101d, which is the lower surface of the multilayer substrate 2d. Therefore, for example, when surface mounting the vibration device 1d to an external substrate using a suction collet, the vibration device 1d is held and attracted by the suction collet on the second surface 102d, which is the upper surface of the multilayer substrate 2d. At this time, since there are no recesses 40d on the second surface 102d of the multilayer substrate 2d, the suction and attraction of the vibration device 1d by the suction collet is stable, and the vibration device 1d can be easily mounted to the external substrate. In addition, since the vibrator 5d does not interfere with the suction collet, cracks and chips of the vibrator 5d can be effectively suppressed.

[0098] According to this embodiment, in addition to the effects of Embodiment 1, the following effects can be obtained. The first surface 101d of the multilayer substrate 2d has an opening 41d in a bottomed recess 40d and an external terminal 28d that is electrically connected to the first wiring layer 26, which serves as a connecting wiring layer 25d. Therefore, by holding the second surface 102d, which is located on the opposite side of the first surface 101d of the multilayer substrate 2d, the vibration device 1d can be easily mounted on an external substrate, and cracks and chips of the vibrator 5d can be effectively suppressed.

[0099] 6. Embodiment 6 Next, the vibration device 1e according to Embodiment 6 will be described with reference to Figures 12 and 13. Components similar to those in Embodiment 1 are denoted by the same reference numerals, and their descriptions are omitted. Embodiment 6 is the same as Embodiment 1, except that the resonator 5e has an integrated circuit 80 including an oscillation circuit, and the resonator 5e is an oscillator.

[0100] As shown in Figures 12 and 13, the oscillator 5e has an integrated circuit 80. The integrated circuit 80 is located on the surface 55 of the base 53 facing the lid 54. The integrated circuit 80 is a circuit in which a plurality of active elements, such as transistors (not shown), are electrically connected by wiring (not shown). In this embodiment, the integrated circuit 80 includes an oscillation circuit for generating the frequency of a reference signal such as a clock signal by causing the vibrating element 6 to oscillate. In addition to the oscillation circuit, the integrated circuit 80 may also include, for example, a temperature compensation circuit for correcting the vibration characteristics of the vibrating element 6 according to temperature changes, a processing circuit for processing the output signal from the oscillation circuit, and an electrostatic discharge protection circuit.

[0101] A passivation film 81 is formed on the upper surface of the integrated circuit 80. Furthermore, an internal connection terminal 82 for joining the vibration element 6 is formed on the upper surface of the passivation film 81, which is electrically connected to the integrated circuit 80 by wiring (not shown).

[0102] The connecting electrode 63 and the internal connection terminal 82 of the vibrating element 6 are joined via a conductive member 65 such as a metal bump. As a result, the vibrating element 6 is mechanically connected to the base 53, and the vibrating element 6 and the integrated circuit 80 are electrically connected via the internal connection terminal 82, the conductive member 65, and wiring (not shown).

[0103] By electrically connecting the vibrating element 6 and the integrated circuit 80, the vibrating element 6 can be made to oscillate by the oscillation signal output from the integrated circuit 80.

[0104] Furthermore, the wiring (not shown) of the integrated circuit 80 and the connection terminal 70 are electrically connected via the through electrode 59. Because the connection terminal 70 and the integrated circuit 80 are electrically connected via the through electrode 59 and the wiring (not shown), it is possible to supply ground potential and other signals to the integrated circuit 80 via the connection terminal 70, and to output clock signals and other signals from the integrated circuit 80.

[0105] Thus, in this embodiment, the oscillator 5e is an oscillator having an integrated circuit 80 that includes an oscillation circuit.

[0106] Furthermore, in this embodiment, as shown in Figure 13, the surface 58 on the lid 54, which is the surface 512 of the container 51 located on the side of the opening 41 of the recess 40 in the multilayer substrate 2, is flush with the first surface 101 of the multilayer substrate 2 in which the opening 41 of the recess 40 is formed.

[0107] According to this embodiment, even when the resonator 5e is an oscillator, cracks, chips, and other damage to the resonator 5e can be effectively suppressed, similar to the first embodiment.

[0108] 7. Embodiment 7 Next, the vibration device 1f according to Embodiment 7 will be described with reference to Figures 14 and 15. Components similar to those in Embodiment 1 are denoted by the same reference numerals, and their descriptions are omitted. Embodiment 7 is the same as Embodiment 1, except that the material constituting the container 51f in the oscillator 5f is a quartz crystal.

[0109] As shown in Figures 14 and 15, the vibrator 5f comprises a container 51f having a housing space 52f, a vibrating element 6f housed in the housing space 52f, and a connecting terminal 70f arranged on the outer surface of the container 51f and electrically connected to the vibrating element 6f.

[0110] The container 51f includes a first sealing substrate 85 which is a quartz substrate, a vibration substrate 86 which is a quartz substrate having an outer frame portion 90 surrounding the vibration element 6f, and a second sealing substrate 87 which is a quartz substrate.

[0111] The first encapsulating substrate 85, the vibrating substrate 86, and the second encapsulating substrate 87 are flat plates with a rectangular shape when viewed from the Z direction in a plan view.

[0112] The first sealing substrate 85 is located on the positive Z-direction side, above the vibrating substrate 86, and the second sealing substrate 87 is located on the negative Z-direction side, below the vibrating substrate 86. In other words, the first sealing substrate 85, the vibrating substrate 86, and the second sealing substrate 87 are stacked in this order from top to bottom.

[0113] The first sealing substrate 85 has a surface 851 facing the vibrating substrate 86 and a surface 852 located on the opposite side of the surface 851 facing the vibrating substrate 86. The surface 851 facing the vibrating substrate 86 is the lower surface of the first sealing substrate 85, and the surface 852 located on the opposite side of the surface 851 facing the vibrating substrate 86 is the upper surface of the first sealing substrate 85. In this embodiment, the surface 852 on the first sealing substrate 85 that is on the opposite side of the surface 851 facing the vibrating substrate 86 becomes the upper surface of the container 51f.

[0114] The vibrating substrate 86 has a frame-shaped outer frame portion 90 surrounding the vibrating element 6f, and the vibrating element 6f provided inside the outer frame portion 90. The vibrating substrate 86 has a surface 861 facing the first sealing substrate 85, and a surface 862 located on the opposite side from the surface 861 facing the first sealing substrate 85. The surface 862, located on the opposite side from the surface 861 facing the first sealing substrate 85, is the surface of the vibration substrate 86 facing the second sealing substrate 87.

[0115] The vibrating element 6f includes a vibrating piece 91, a connecting piece 92 that connects the vibrating piece 91 to the outer frame 90, an excitation electrode 62f that vibrates the vibrating piece 91, a connecting electrode 63f that electrically connects the vibrating element 6f to the wiring 71f and outputs a vibration signal to the outside, and a lead electrode 64f that electrically connects the excitation electrode 62f and the connecting electrode 63f.

[0116] The vibrating piece 91 is thinner in the Z direction than the outer frame portion 90, the upper surface of the vibrating piece 91 is located on the negative Z side of the surface 861 of the vibrating substrate 86 that faces the first sealing substrate 85, and the lower surface of the vibrating piece 91 is located on the positive Z side of the surface 862 of the vibrating substrate 86 that is on the opposite side of the surface 861 that faces the first sealing substrate 85. As a result, when the first sealing substrate 85, the vibrating substrate 86, and the second sealing substrate 87 are stacked, contact between the vibrating piece 91 and the first sealing substrate 85 and the second sealing substrate 87 can be suppressed.

[0117] The second sealing substrate 87 has a surface 871 facing the vibrating substrate 86 and a surface 872 located on the opposite side of the surface 871 facing the vibrating substrate 86. The surface 871 facing the vibrating substrate 86 is the upper surface of the second sealing substrate 87, and the surface 872 located on the opposite side of the surface 871 facing the vibrating substrate 86 is the lower surface of the second sealing substrate 87. In this embodiment, the surface 872 of the second sealing substrate 87 located on the opposite side of the surface 871 facing the vibrating substrate 86 becomes the lower surface of the container 51f.

[0118] The surface 851 of the first sealing substrate 85 facing the vibrating substrate 86 and the surface 861 of the outer frame portion 90 of the vibrating substrate 86 facing the first sealing substrate 85 are joined via a joining member 521. The surface 862 of the outer frame portion 90 of the vibrating substrate 86, which is located on the opposite side from the surface 861 facing the first sealing substrate 85, and the surface 871 of the second sealing substrate 87 facing the vibrating substrate 86 are joined via a joining member 522. In other words, the first sealing substrate 85 and the second sealing substrate 87 are joined via the joining member 521, the joining member 522, and the outer frame portion 90 of the vibrating substrate 86.

[0119] In this way, the first sealing substrate 85 and the second sealing substrate 87 are joined together via the outer frame portion 90 of the vibrating substrate 86, thereby forming a housing space 52f for housing the vibrating element 6f.

[0120] Furthermore, the second sealing substrate 87 has a through hole 531f that penetrates in the Z direction, which is the thickness direction of the second sealing substrate 87. A through electrode 59f is embedded in the through hole 531f.

[0121] A connecting terminal 70f is located on the surface 872 of the second sealing substrate 87, which is opposite to the surface 871 facing the vibration substrate 86. In other words, the connecting terminal 70f is located on the outer surface of the container 51, specifically on the lower surface of the container 51f, which is the surface 872 of the second sealing substrate 87, which is opposite to the surface 871 facing the vibration substrate 86.

[0122] Wiring 71f is arranged on the surface 871 of the second sealing substrate 87 that faces the vibration substrate 86. The connection terminal 70f and the wiring 71f are electrically connected by a through electrode 59f.

[0123] Furthermore, the wiring 71f arranged on the surface 871 of the second sealing substrate 87 facing the vibrating substrate 86 and the connecting electrode 63f of the vibrating element 6f are joined via a conductive member 65f such as a metal bump. The connecting electrode 63f of the vibrating element 6f and the wiring 71f arranged on the surface 871 of the second sealing substrate 87 facing the vibrating substrate 86 are electrically connected via the conductive member 65f, thereby electrically connecting the connecting terminal 70f, which is located on the surface 872 of the second sealing substrate 87 opposite to the surface 871 facing the vibrating substrate 86, and the vibrating element 6f via the conductive member 65f, the wiring 71f, and the through electrode 59f.

[0124] In this embodiment, the vibrator 5f is placed in a bottomed recess 40 having an opening 41 on the first surface 101, which is the upper surface of the multilayer substrate 2.

[0125] The surface 852 of the first sealing substrate 85, which is the upper surface of the container 51f of the vibrator 5f, located on the opposite side of the surface 851 facing the vibrating substrate 86, becomes the surface 512f of the container 51f located on the side of the opening 41 of the recess 40 in the multilayer substrate 2. The surface 872 of the second sealing substrate 87, which is the lower surface of the container 51f of the vibrator 5f, located on the opposite side of the surface 871 facing the vibrating substrate 86, becomes the surface 513f of the container 51f located on the side of the bottom surface 42 of the recess 40 in the multilayer substrate 2.

[0126] In this embodiment, as shown in Figure 15, the surface 852 of the first sealing substrate 85, which is the surface 512f of the container 51f located on the side of the opening 41 of the recess 40 in the multilayer substrate 2, is flush with the first surface 101 of the multilayer substrate 2 in which the opening 41 of the recess 40 is formed.

[0127] According to this embodiment, even when the oscillator 5f is made of a quartz substrate, cracks and chips in the oscillator 5f can be effectively suppressed, similar to Embodiment 1.

[0128] In this embodiment, the vibration substrate 86 is an AT-cut quartz substrate, but the vibration substrate 86 is not limited to an AT-cut quartz substrate; an SC-cut quartz substrate, BT-cut quartz substrate, Z-cut quartz substrate, ST-cut quartz substrate, etc., may also be used.

[0129] Furthermore, in this embodiment, the first sealing substrate 85 and the second sealing substrate 87 are AT-cut quartz substrates. However, the first sealing substrate 85 and the second sealing substrate 87 are not limited to AT-cut quartz substrates, and at least one of the first sealing substrate 85 and the second sealing substrate 87 may be formed from a quartz substrate with a different cut angle than the vibrating substrate 86. Alternatively, the first sealing substrate 85 and the second sealing substrate 87 may have the same cut angle as the vibrating substrate 86, but their crystal axes may be oriented in a different direction than the vibrating substrate 86. [Explanation of symbols]

[0130] 1,1a,1b,1c,1d,1e,1f…Vibration device, 2,2a,2b,2c,2d…Multilayer substrate, 5,5c,5d,5e,5f…Vibrator, 6,6f…Vibration element, 8,8c…Conductive connecting member, 21,21d…First insulating layer, 22,22d…Second insulating layer, 23,23d…Third insulating layer, 25,25a,25c,25d…Connecting wiring layer, 26…First wiring layer, 27…Second wiring layer, 2 8,28d...External terminals, 40,40a,40b,40c,40d...Recesses, 41,41a,41b,41c,41d...Openings, 42,42a,42c,42d...Bottom surfaces, 51,51f...Containers, 52,52f...Accommodation spaces, 70,70f...Connection terminals, 101,101d...First surface, 102,102d...Second surface, 512,512f...Surface, 513,513f...Surface, F1...Surface, F2...Surface.

Claims

1. A multilayer substrate having a first surface, a second surface located opposite to the first surface, a first insulating layer including the first surface, a second insulating layer including the second surface, a bottomed recess having an opening in the first surface and penetrating at least the first insulating layer, and a connecting wiring layer disposed between the first insulating layer and the second insulating layer, A vibrator having a container with a housing space, a vibrating element housed in the housing space, and a connecting terminal arranged on the outer surface of the container and electrically connected to the vibrating element, and positioned in the recess, A conductive connecting member electrically connects the aforementioned connecting wiring layer and the aforementioned connecting terminals. It has, In a plan view from the first surface, the vibrator is exposed within the opening. The multilayer substrate is rectangular in shape, The recess extends in a groove-like manner from one opposing side surface to the other of the multilayer substrate, thereby forming a vibration device.

2. A multilayer substrate having a first surface, a second surface located opposite to the first surface, a first insulating layer including the first surface, a second insulating layer including the second surface, a bottomed recess having an opening in the first surface and penetrating at least the first insulating layer, and a connecting wiring layer disposed between the first insulating layer and the second insulating layer, A vibrator having a container with a housing space, a vibrating element housed in the housing space, and a connecting terminal arranged on the outer surface of the container and electrically connected to the vibrating element, and positioned in the recess, A conductive connecting member electrically connects the aforementioned connecting wiring layer and the aforementioned connecting terminals. It has, In a plan view from the first surface, the vibrator is exposed within the opening. A vibration device wherein an external terminal electrically connected to the connecting wiring layer is arranged on the second surface of the multilayer substrate.

3. The surface of the container located on the opening side of the recess is flush with the first surface of the multilayer substrate or is located on the second surface side of the multilayer substrate, The vibration device according to claim 1 or claim 2.

4. The opening of the recess is surrounded by the first surface of the multilayer substrate. The vibration device according to claim 2.

5. External terminals that are electrically connected to the connecting wiring layer are arranged on the first surface of the multilayer substrate. The vibration device according to claim 1.

6. The aforementioned connecting wiring layer is positioned on the bottom surface of the recess, The aforementioned connecting terminal is positioned on the surface of the container facing the bottom surface of the recess, The connecting wiring layer and the connecting terminal are joined together via the conductive connecting member. A vibration device according to any one of claims 1 to 5.

7. The conductive connecting member is a conductive wire. A vibration device according to any one of claims 1 to 5.

8. The container includes a base which is a semiconductor substrate and a lid which is a semiconductor substrate. The base and the lid are joined together to form the storage space. A vibration device according to any one of claims 1 to 7.

9. The container includes a first sealing substrate which is a quartz substrate, a vibration substrate which is a quartz substrate having an outer frame portion surrounding the vibration element, and a second sealing substrate which is a quartz substrate. The housing space is formed by joining the first sealing substrate and the second sealing substrate via the outer frame portion of the vibration substrate. A vibration device according to any one of claims 1 to 7.

10. The multilayer substrate is a resin substrate. The vibration device according to claim 8 or claim 9.

Images