Imprinting apparatus and method for manufacturing articles

Abstract

To provide an imprint device that can accurately perform alignment between a mold and a substrate even when forming a pattern of an imprint material for a chipped shot area.SOLUTION: An imprint device according to the present invention comprises: a mold holding unit that is movable while holding a mold; a movable body that is movable while holding a substrate; a detection unit that detects the position of a mold-side mark formed in a pattern area of the mold, and the position of a substrate-side mark formed in a shot area on the substrate; a measuring unit that measures the relative position between the mold holding unit and the movable body; and a control unit that controls the movement of the movable body based on a result of detection performed by the detection unit when performing imprint processing on a normal shot area, and controls the movement of the movable body based on a result of measurement performed by the measuring unit when performing imprint processing on a chipped shot area.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to an imprint apparatus.

Background Art

[0002] Conventionally, in an imprint apparatus, there are cases where it is required to improve productivity by forming a pattern of an imprint material even for a so-called missing shot region having a partially missing shape with respect to a normal shot region on a substrate. On the other hand, since such a missing shot region has a partially missing shape, at least one of a plurality of substrate-side marks used to determine the shape and position when forming a pattern of the imprint material may not be formed.

[0003] In that case, it becomes difficult to perform highly accurate alignment of the missing shot region with respect to the pattern region based on the result of detecting the mold-side mark formed in the pattern region of the mold and the substrate-side mark formed in the missing shot region. Patent Document 1 discloses an imprint apparatus that calculates and corrects the shape and position of a missing shot region based on the result of detecting a substrate-side mark formed in a normal shot region when forming a pattern of an imprint material for the missing shot region.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By detecting the mold-side marks formed in the pattern area of ​​the mold and the substrate-side marks formed in the shot area, the relative shape and position of the shot area itself with respect to the pattern area can be determined with high precision. However, these detection results do not provide highly accurate information about the location of the shot region on the substrate, that is, the relative shape and position of the shot regions.

[0006] Therefore, the accuracy of the shape and position of the missing shot area calculated based on the detection of substrate-side marks formed in the normal shot area, as in the imprint apparatus disclosed in Patent Document 1, is insufficient. Therefore, the present invention aims to provide an imprint apparatus that can perform high-precision alignment between the mold and the substrate when forming an imprint material pattern on a chipped shot area. [Means for solving the problem]

[0007] The imprint apparatus according to the present invention includes a mold holding unit for holding a mold, a movable body that can move while holding a substrate, and a detection unit for detecting the position of mold-side marks formed in the pattern region of the mold and the position of substrate-side marks formed in the shot region on the substrate. , type The device comprises a first measurement unit that performs a first measurement to measure the relative position between a holding unit and a moving body, a control unit capable of performing a first control to control the movement of the moving body based on the detection result by the detection unit, and a second control to control the movement of the moving body based on the measurement result by the first measurement unit, wherein the substrate is provided with a first region where a plurality of substrate-side marks are formed and a second region where fewer substrate-side marks are formed than in the first region or where no substrate-side marks are formed, and the control unit performs the first control when performing imprint processing on the first region and the second control when performing imprint processing on the second region. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide an imprint apparatus that can perform high-precision alignment between the mold and the substrate when forming an imprint material pattern on a chipped shot area. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic cross-sectional view of the imprint apparatus according to the first embodiment. [Figure 2] A top view of the pattern area of ​​the mold and the shot area on the substrate in an imprint apparatus according to the first embodiment. [Figure 3] A top view of the substrate stage in an imprint apparatus according to the first embodiment. [Figure 4] A top view showing another configuration of the length measuring unit in the imprint device according to the first embodiment. [Figure 5] A flowchart of the imprint process in the imprint device according to the first embodiment. [Figure 6] Control flow of alignment in the imprint process in the imprint device according to the first embodiment. [Figure 7] A schematic cross-sectional view of the imprint apparatus according to the second embodiment. [Modes for carrying out the invention]

[0010] The imprint apparatus according to this embodiment will be described in detail below with reference to the attached drawings. Note that the following drawings are drawn to a different scale than the actual dimensions in order to facilitate understanding of this embodiment. In the following, the direction perpendicular to the substrate surface of substrate 2 is defined as the Z direction, and the two directions perpendicular to each other in a plane parallel to the substrate surface of substrate 2 are defined as the X direction and the Y direction, respectively.

[0011] [First Embodiment] In recent years, due to the increasing demand for miniaturization in semiconductor devices, MEMS, etc., in addition to the conventional photolithography technology, an imprint technology that can form fine patterns (structures) on the order of several nanometers on a substrate has attracted attention. Specifically, the imprint technology is a microfabrication technology in which after supplying (coating) an uncured imprint material on a substrate, the imprint material and the mold are brought into contact with each other to form a pattern of the imprint material corresponding to the fine uneven pattern formed on the mold on the substrate.

[0012] In an imprint apparatus that employs such an imprint technology, when forming a pattern of an imprint material in a predetermined shot area on a substrate, the positional relationship between the substrate and the mold and the correction of the deviation of the shot shape are performed by optically detecting a plurality of marks formed in the predetermined shot area. Such correction is called die-to-die alignment.

[0013] On the other hand, in the vicinity of the edge of the substrate, generally, there is a so-called missing shot area that has a partially missing shape with respect to the normal shot area and cannot transfer the entire pattern formed on the mold. And in an imprint apparatus, there may be a case where the productivity is improved by forming a pattern of an imprint material for such a missing shot area.

[0014] Here, when at least one of the plurality of marks is not formed in the missing shot area, it becomes difficult to perform die-to-die alignment with high accuracy for the missing shot area. Therefore, conventionally, when forming a pattern of an imprint material for a missing shot area, a method of calculating and correcting the shape and position of the missing shot area from the result of die-to-die alignment in the normal shot area is known.

[0015] That is, in this method, when forming a pattern of an imprint material on a missing shot area, first, the shot shape measured for a normal shot area provided in the vicinity of the missing shot area is corrected to calculate the shot shape of the missing shot area. Next, after detecting a mark formed in the missing shot area, the positional relationship between the pattern area of the mold and the missing shot area is calculated by removing the influence of the shot shape calculated as described above from the detection result. Thereby, alignment between the pattern area of the mold and the missing shot area can be performed based on the calculated positional relationship.

[0016] However, in this method, when the shot shape calculated in the missing shot area is different from the actual shot shape, the positional relationship between the pattern area of the mold and the missing shot area is erroneously calculated. Therefore, it becomes difficult to perform alignment between the pattern area of the mold and the missing shot area with high accuracy. Therefore, an object of the present embodiment is to provide an imprint apparatus capable of performing alignment between a mold and a substrate with high accuracy even when forming a pattern of an imprint material on a missing shot area.

[0017] FIG. 1 shows a schematic cross-sectional view of an imprint apparatus 100 according to the first embodiment.

[0018] The imprint apparatus 100 according to the present embodiment is used for manufacturing a device such as a semiconductor device as an article, and specifically, is a lithography apparatus for performing an imprint process of forming a pattern of an imprint material on a substrate using a mold. Specifically, in the imprint apparatus 100 according to the present embodiment, after bringing the imprint material supplied on the substrate and the mold into contact with each other, by applying energy for curing to the imprint material, a pattern of a cured product in which the concavo-convex pattern of the mold is transferred can be formed on the substrate.

[0019] In the imprint apparatus 100 according to this embodiment, a curable composition (sometimes called an uncured resin) that hardens when curing energy is applied is used as the imprint material. The energy used for curing in this context includes electromagnetic waves and heat. The wavelength of the electromagnetic waves used is selected from a range of, for example, 10 nm to 1 mm, meaning that infrared light, visible light, ultraviolet light, etc., are used.

[0020] Furthermore, in the imprint apparatus 100 according to this embodiment, the imprint material may be applied to the substrate in a film-like manner by a spin coater or a slit coater. The imprint material may also be applied to the substrate by a liquid spray head in the form of droplets, islands formed by multiple connected droplets, or films. Furthermore, the viscosity of the imprint material (viscosity at 25°C) is, for example, within the range of 1 mPa·s to 100 mPa·s.

[0021] In the imprint apparatus 100 according to this embodiment, glass, ceramics, metal, semiconductor, resin, etc., are used as the substrate material, and if necessary, components made of materials other than the substrate may be formed on the substrate surface. Specifically, the substrates used in the imprint apparatus 100 according to this embodiment include silicon wafers, compound semiconductor wafers, and quartz glass.

[0022] As shown in Figure 1, the imprint apparatus 100 according to this embodiment includes a mold holding unit 3, a substrate stage 4 (moving body), a detection unit 5, a length measuring unit 6, a control unit 7, a stage platen 8, a bridge platen 9, and a support column 10.

[0023] The substrate stage 4 is placed on the stage platen 8, and the mold holder 3 is fixed to the bridge platen 9. Furthermore, the support column 10 is supported by the stage base plate 8 and also supports the bridge base plate 9.

[0024] Furthermore, the imprint apparatus 100 according to this embodiment is equipped with a vibration isolater (not shown) on a base platen (not shown) supported from the floor, and the vibration isolater supports the stage platen 8, thereby reducing vibrations transmitted from the floor to the stage platen 8. Furthermore, the imprint apparatus 100 according to this embodiment is also provided with a mold transport unit (not shown) for transporting the mold 1 from the outside to the mold holding unit 3, and a substrate transport unit (not shown) for transporting the substrate 2 from the outside to the substrate stage 4.

[0025] The mold holding unit 3 is configured to be movable while holding the mold 1, and specifically consists of a movable element 31 (movable part), a stator 32 (fixed part), and a movable element lifting mechanism 33. The movable element 31 holds the mold 1 by attracting it with vacuum suction force or electrostatic force. In this case, when the movable element 31 holds the mold 1 by vacuum suction force, the movable element 31 is connected to a vacuum pump (not shown) located outside the imprint apparatus 100 according to this embodiment. The mold 1 is then attached to and detached (held and released) by switching the vacuum pump on and off.

[0026] The stator 32 is fixed to the bridge platen 9. The movable element lifting mechanism 33 is composed of, for example, a voice coil motor and is fixed to the movable element 31 and the stator 32, thereby allowing the movable element 31 to move in the Z direction. This allows imprint processing to be applied to the imprint material supplied onto substrate 2. The movable element lifting mechanism 33 may be composed of multiple drive systems so as to be able to control not only the position of the movable element 31 in the Z direction, but also its tilt with respect to the Z direction.

[0027] The substrate stage 4 is configured to be movable while holding the substrate 2 so as to change its position in the XY plane, and specifically consists of a top plate 41, a drive unit 42, and a first length measuring system 43 (second measurement unit). In the imprint apparatus 100 according to this embodiment, the first length measuring system 43 consists of a first encoder head 43a and a first encoder scale 43b. Furthermore, the first encoder head 43a is fixed to the stage base plate 8 (reference member), and the first encoder scale 43b is fixed to the circuit board stage 4.

[0028] In addition, the first encoder head 43a may be fixed to the circuit board stage 4, and the first encoder scale 43b may be fixed to the stage base plate 8. The first length measuring system 43 may also consist of an interference displacement meter or a laser displacement meter, in which case, for example, the relative position between the support column 10, which serves as a reference member, and the substrate stage 4 may be measured.

[0029] The first length measuring system 43, with the above configuration, can measure the position of the substrate stage 4 in the XY plane relative to a reference member such as the stage base plate 8 in real time (fourth measurement). The control unit 7 can then control the movement of the substrate stage 4 for aligning the substrate 2 based on the measurement values ​​of the first length measuring system 43.

[0030] The control unit 7 is composed of a computer including a CPU and memory, and controls each part of the imprint device 100 according to this embodiment according to the program stored in the memory. Specifically, the control unit 7 controls the imprint process, which forms an imprint pattern on the substrate 2, by controlling the operation and adjustment of each part provided in the imprint apparatus 100 according to this embodiment. More specifically, the control unit 7 is configured to control the substrate stage 4, the detection unit 5, and the length measuring unit 6.

[0031] The detection unit 5 consists of a scope that can optically detect (observe) at least one mold-side mark 201 formed in the pattern region 1a of the mold 1 and at least one substrate-side mark 202 formed in each of the multiple shot regions 50 on the substrate 2. Figure 2(a) shows a schematic view from the Z direction of the mold-side mark 201 formed in the pattern region 1a of mold 1 and the substrate-side mark 202 formed in the shot region 50 on the substrate 2.

[0032] The detection unit 5 only needs to be able to detect the relative position in the XY plane between the mold-side mark 201 and the substrate-side mark 202. Therefore, the detection unit 5 may be composed of a scope equipped with an optical system for simultaneously imaging both the mold-side mark 201 and the substrate-side mark 202, or it may be composed of a scope that detects interference signals and signals resulting from synergistic effects such as moiré between the two.

[0033] Furthermore, the detection unit 5 does not necessarily need to be able to simultaneously detect both the mold-side mark 201 and the substrate-side mark 202. In other words, the detection unit 5 may detect the relative position between the mold-side mark 201 and the substrate-side mark 202 in the XY plane by determining the respective positions of the mold-side mark 201 and the substrate-side mark 202 with respect to a reference position provided inside the detection unit 5.

[0034] In the imprint apparatus 100 according to this embodiment, a plurality of mold-side marks 201 are formed in the pattern area 1a of the mold 1, and a plurality of substrate-side marks 202 are formed in the shot area 50 on the substrate 2. Specifically, as shown in Figure 2(a), for example, four mold-side marks 201 are formed at each of the four corners of the rectangular pattern area 1a, and four substrate-side marks 202 are formed at each of the four corners of the rectangular shot area 50. Then, by detecting the relative positions in the XY plane between multiple mold-side marks 201 and multiple substrate-side marks 202, it is possible to calculate shape differences related to shifts, rotations, and magnification deviations between the pattern area 1a of mold 1 and the shot area 50 on substrate 2.

[0035] Figure 2(b) shows an enlarged top view of a region near a predetermined edge of the substrate surface of the substrate 2 used in the imprint apparatus 100 according to this embodiment.

[0036] As shown in Figure 2(b), shot regions 50a, 50b, and 50c are provided in the region of the substrate 2. Specifically, four substrate-side marks 202 are formed in the shot region 50a. The detection unit 5 then detects these four substrate-side marks 202 and four mold-side marks 201 formed in the pattern region 1a, thereby enabling the calculation of, for example, two components related to shift, one component related to rotation, two components related to magnification shift, and three components related to other arbitrary deformation shifts.

[0037] Furthermore, when performing imprint processing on the shot area 50a, the control unit 7 controls the movement of the substrate stage 4 based on the calculation result, thereby enabling high-precision alignment of the shot area 50a. This method of performing alignment by calculating shape differences related to shift, rotation, and magnification deviation between the pattern area 1a of mold 1 and the shot area 50 on the substrate 2 based on the detection results by the detection unit 5 is called the die-by-diaalignment method.

[0038] On the other hand, at least one of the four substrate-side marks 202 is not formed in the shot regions 50b and 50c. Specifically, two substrate-side marks 202 are formed in the shot area 50b, and three substrate-side marks 202 are formed in the shot area 50c. Therefore, if diversity alignment is performed on such shot regions 50b and 50c using the detection unit 5, the number of components indicating shape differences related to shift, rotation, and magnification deviation that can be calculated will decrease, leading to a decrease in alignment accuracy.

[0039] Hereinafter, a shot region 50 in which all four substrate-side marks 202 are formed, as in shot region 50a, will be referred to as a normal shot region 50. On the other hand, a shot region 50 in which at least one of the four substrate-side marks 202 is not formed, such as shot regions 50b and 50c, is referred to as a missing shot region 50.

[0040] The length measuring unit 6 (first measuring unit) is equipped with a second length measuring system 61, a third length measuring system 62, and a fourth length measuring system 63, and can measure the relative position between the mold holding unit 3, i.e., the mold 1 and the substrate stage 4. In this case, if the change in the relative position between the substrate 2 and the substrate stage 4 is sufficiently small, the measuring unit 6 can be considered to be measuring the relative position between the mold 1 and the substrate 2.

[0041] As shown in Figure 1, the second length measuring system 61 consists of a second encoder head 61a and a second encoder scale 61b. The second encoder scale 61b has the configuration of a two-dimensional encoder scale.

[0042] In the second length measuring system 61, the second encoder head 61a is fixed to the stator 32 of the mold holding unit 3, and the second encoder scale 61b is fixed to the top plate 41 of the substrate stage 4. Thus, since the second encoder head 61a is fixed within the imprint device 100, that is, fixed to the non-moving stator 32, cables and the like connected to the second encoder head 61a can be easily arranged.

[0043] However, this is not the only option; the second encoder head 61a may be fixed to the top plate 41, and the second encoder scale 61b may be fixed to the stator 32. Furthermore, the second encoder scale 61b may be fixed to a part of the circuit board stage 4 other than the top plate 41.

[0044] Figures 3(a), (b), (c), and (d) show top views of the substrate stage 4 positioned in a predetermined location. Figures 3(a) to 3(d) also show the second encoder head 61a, which is fixed to the stator 32 of the mold holding section 3.

[0045] In the examples shown in Figures 3(a) to 3(d), the second length measuring system 61 is provided with two sets of a second encoder head 61a and a second encoder scale 61b, and these two sets are spaced apart from each other. The two sets of second encoder heads 61a are each attached to a predetermined position on the stator 32 of the mold holding unit 3.

[0046] The second encoder scale 61b has an arc shape and is positioned on the top plate 41 of the substrate stage 4 such that, when the center of the substrate 2 is positioned directly below the pattern area 1a as shown in Figure 3(a), the corresponding second encoder head 61a is positioned at the center of the arc in the XY plane. Furthermore, the second encoder scale 61b does not need to have an overall arc shape as long as it has the arc-shaped portion described above.

[0047] Figure 3(a) shows the arrangement of the substrate stage 4 when performing imprint processing on a normal shot area 203a located in the center of the substrate 2. In this case, the second encoder head 61a and the second encoder scale 61b do not overlap each other in the XY plane. Therefore, the relative position between mold 1 and substrate 2 cannot be measured using the second length measuring system 61, and the position of substrate 2 is adjusted by performing a die-dialignment (first control, first control step).

[0048] Figure 3(b) shows the arrangement of the substrate stage 4 when performing imprint processing on a normal shot area 203b located near a predetermined edge of the substrate surface of the substrate 2. In this case, a portion of the second encoder head 61a included in one of the pairs overlaps with the corresponding second encoder scale 61b in the XY plane.

[0049] Therefore, when performing imprint processing on the normal shot area 203b and positioning the normal shot area 203b directly below the pattern area 1a, the relative position between the mold 1 and the substrate 2 can be measured using the second length measuring system 61. Hereinafter, the process of adjusting the position of the substrate 2 by measuring the relative position between the mold 1 and the substrate 2 using the length measuring unit 6 will be referred to as global alignment. Furthermore, since all four substrate-side marks 202 are formed in the normal shot area 203b, the position of the substrate 2 can also be adjusted by performing diversity alignment using the detection unit 5.

[0050] Figure 3(c) shows the arrangement of the substrate stage 4 when performing imprint processing on a chipped shot region 204a located near a predetermined edge of the substrate 2. In this case, in the XY plane, the second encoder head 61a included in one of the pairs overlaps with the corresponding second encoder scale 61b. Therefore, when imprinting the chipped shot area 204a and positioning the chipped shot area 204a directly below the pattern area 1a, the position of the substrate 2 can be adjusted by performing global alignment using the second length measuring system 61 (second control, second control step).

[0051] On the other hand, in the chipped shot region 204a, as described above, at least one of the four substrate-side marks 202 is not formed, so adjusting the position of the substrate 2 by die-dialignment will lead to a decrease in alignment accuracy. Therefore, in the imprint apparatus 100 according to this embodiment, when performing imprint processing on a chipped shot region 50 located near the edge of the substrate 2, such as a chipped shot region 204a, the position of the substrate 2 is adjusted by global alignment to suppress a decrease in alignment accuracy.

[0052] Figure 3(d) shows the arrangement of the substrate stage 4 when performing imprint processing on a chipped shot region 204b located near another predetermined edge of the substrate 2. In this case, a portion of each of the second encoder heads 61a included in both sets overlaps with the corresponding second encoder scale 61b in the XY plane. Therefore, when performing imprint processing on the chipped shot area 204b, and positioning the chipped shot area 204b directly below the pattern area 1a, the position of the substrate 2 can be adjusted by performing global alignment using the second length measuring system 61.

[0053] When the second length measuring system 61 is composed of two sets of second encoder heads 61a and second encoder scales 61b as described above, it is preferable that each set be arranged to be switchable, as shown in Figures 3(b) to (d). In other words, for both the normal shot area 50 and the chipped shot area 50 located near the edge of the substrate 2, when placed directly beneath the pattern area 1a, it is sufficient that at least a portion of the second encoder head 61a overlaps the corresponding second encoder scale 61b in at least one pair.

[0054] In the second length measuring system 61, a three-dimensional encoder scale may be used instead of a two-dimensional encoder scale as the second encoder scale 61b. In this case, it becomes possible to measure the relative position between the top plate 41 and the stator 32 in the Z direction, that is, the relative position between the substrate 2 and the mold 1 in the Z direction.

[0055] Furthermore, by providing multiple sets of a second encoder scale 61b, which is composed of a three-dimensional encoder scale, and a second encoder head 61a, it is possible to measure the relative difference between the inclination of the top plate 41 and the stator 32 with respect to the XY plane. The drive of the movable element 31 may then be controlled based on the relative difference measured in this manner.

[0056] Figures 4(a) and 4(b) show alternative configurations of the second length measuring system 61 in the imprint apparatus 100 according to this embodiment.

[0057] In the example shown in Figure 4(a), a second length measuring system 61 is provided, which consists of a set of a second encoder head 61a and a second encoder scale 61b. The second encoder scale 61b has a circular shape and is positioned on the top plate 41 of the substrate stage 4 such that when the center of the substrate 2 is positioned directly below the pattern area 1a, the second encoder head 61a is positioned at the center of the circle in the XY plane.

[0058] In the example shown in Figure 4(b), the second length measuring system 61 is provided with three sets of a second encoder head 61a and a second encoder scale 61b, and these three sets are spaced apart from each other. Specifically, the three second encoder heads 61a are each positioned at the vertices of a predetermined equilateral triangle and are fixed to the stator 32 of the mold holder 3 such that the pattern area 1a of the mold 1 is positioned at the centroid of the equilateral triangle. Each of the three second encoder scales 61b has an arc shape and is positioned on the top plate 41 of the substrate stage 4 such that when the center of the substrate 2 is positioned directly below the pattern area 1a, the corresponding second encoder head 61a is positioned at the center of the arc in the XY plane.

[0059] Here, it is preferable that the second encoder scale 61b has a shape corresponding to the outer shape of the substrate 2 in the XY plane. In other words, in the imprint apparatus 100 according to this embodiment, the second encoder scale 61b has a shape corresponding to a circle, which is the outer shape of the substrate 2 in the XY plane.

[0060] In other words, the relationship between the relative position and relative shape of the second encoder head 61a and the second encoder scale 61b is not limited to the above, and only needs to correspond to the relationship between the center of the substrate 2 and its outer shape in the XY plane when the center of the substrate 2 is positioned directly below the pattern area 1a of the mold 1. Furthermore, as shown in Figures 3(a) to (d) and Figure 4(b), if multiple sets of a second encoder head 61a and a second encoder scale 61b are provided as the second length measuring system 61, it is sufficient that each set corresponds to the relationship between the center of the substrate 2 in the XY plane and the corresponding outer shape.

[0061] As described above, the substrate 2 used in the imprint apparatus 100 according to this embodiment is provided with a plurality of normal shot regions 50 on which all of the substrate-side marks 202 used in die-dialignment are formed, and a plurality of missing shot regions 50 on which at least one of the marks is not formed. The second length measuring system 61 can measure the relative position between the mold holding unit 3 and the substrate stage 4 when all of the missing shot areas 50 and a predetermined shot area 50 from at least one normal shot area 50 are moved to a position where imprint processing can be performed (first measurement).

[0062] Figure 5 shows a flowchart of the imprint process in the imprint device 100 according to this embodiment. Each step of the imprint process is executed by the control unit 7.

[0063] As described above, in the imprint process of the imprint apparatus 100 according to this embodiment, the following first imprint process, second imprint process, or third imprint process is selected for each shot area 50 on the substrate 2. In other words, the first imprint process is a process in which an imprint process is performed by adjusting the position of a normal shot area 50 located inside the substrate surface of the substrate 2, where global alignment cannot be performed, by die-di-alignment, as shown in the normal shot area 203a in Figure 3(a).

[0064] The second imprint process is a process in which imprint processing is performed by adjusting the position by die-di-alignment on a normal shot area 50 provided near the edge of the substrate surface of the substrate 2, which can perform both global alignment and die-di-alignment, as shown in the normal shot area 203b in Figure 3(b). In this case, by measuring the relative position between the mold 1 and the substrate 2 using the second length measuring system 61, the relationship between the position and shape of the shot region 50 in the die-dialignment and the position and shape of the shot region 50 in the global alignment can be obtained.

[0065] The third imprint process is a process in which an imprint process is performed by adjusting the position of a chipped shot region 50, which is located near the edge of the substrate surface of the substrate 2 where die-dialignment is undesirable, as shown in the chipped shot region 204a in Figure 3(c), by global alignment.

[0066] As shown in Figure 5, when the imprint process on the substrate 2 begins, the substrate stage 4 first moves the substrate 2 so that the shot area 50 to be imprinted is positioned directly below the pattern area 1a of the mold 1, based on the shot layout information on the substrate 2 that has been input to the control unit 7 in advance (step S111). Next, it is determined from the information of the shot layout whether the shot area 50 is a missing shot area (step S112).

[0067] If the shot area 50 is not a defective shot area (No. in step S112), that is, if it is a normal shot area, the movable lifting mechanism 33 is activated to lower the mold 1 so that the imprint material on the shot area 50 and the mold 1 come into contact with each other (step S113). Then, the detection unit 5 detects the mold-side mark 201 formed in the pattern area 1a of mold 1 and the substrate-side mark 202 formed in the shot area 50 (step S114).

[0068] Next, in step S114, the substrate stage 4 is moved based on the detection result obtained by the detection unit 5 to perform diversity alignment (step S115). Then, it is determined whether the shot region 50 is a shot region in which the relative position between the mold 1 and the substrate 2 can be measured by the second length measuring system 61 (step S116). In other words, in step S116, when the shot area 50 is placed directly below the pattern area 1a of type 1, it is determined whether at least a part of the second encoder head 61a overlaps with the corresponding second encoder scale 61b in the XY plane.

[0069] If the relative position between mold 1 and substrate 2 can be measured by the second length measuring system 61 (Yes in step S116), the second length measuring system 61 is made to measure the relative position (step S117), and the measurement result is saved as a position correction amount. Then, the process proceeds to step S121.

[0070] On the other hand, if the relative position between the mold 1 and the substrate 2 cannot be measured by the second length measuring system 61 (No. in step S116), the process proceeds to step S121, where exposure is performed by irradiating the shot area 50 with exposure light using an illumination unit (not shown). Then, by driving the movable element lifting mechanism 33, the mold 1 is raised so that the imprint material on the shot area 50 where the exposure has been performed and the mold 1 are separated from each other (step S122). As a result, a pattern made of hardened imprint material is formed on the shot area 50.

[0071] Then, it is determined whether imprint processing has been performed on all shot areas 50 that are subject to imprint processing on the substrate 2 (step S123). If imprinting has not been performed on all shot areas 50 (No. in step S123), the process returns to step S111, and the same process as above is performed on the shot areas 50 that have not been imprinted. On the other hand, if imprint processing is performed on all shot areas 50 (Yes in step S123), the imprint processing on the substrate 2 in the imprint apparatus 100 according to this embodiment is terminated.

[0072] Returning to step S112, if the shot area 50 to be imprinted is a missing shot area (Yes in step S112), the second length measuring system 61 is used to measure the relative position between the mold 1 and the substrate 2 (step S118). Then, global alignment is performed by moving the substrate stage 4 based on the relative position measured in step S118 and the relative position saved in step S117 for the previously performed normal shot area 50 (step S119).

[0073] Then, by operating the movable element lifting mechanism 33, the mold 1 is lowered so that the imprint material on the shot area 50 and the mold 1 come into contact with each other (step S120), and then the process proceeds to step S121, where the same process as described above is performed.

[0074] When performing imprint processing on the missing shot area 50 in this manner, the alignment of the missing shot area 50 can be performed based on the measurement values ​​from the second length measuring system 61 that were previously applied to the normal shot area 50. Furthermore, the origin of the second encoder scale 61b in the second length measuring system 61 can be the measurement position relative to the normal shot area 50 that was first imprinted, among the normal shot areas 50 that can be measured by the second length measuring system 61. Furthermore, the origin may be changed each time an imprint process is performed on each of the normal shot areas 50 that can be measured by the second length measuring system 61.

[0075] In the above example, the determination process in step S116 is performed after the diversity alignment in step S115, but this is not the only way to do so. In other words, step S116 may be performed simultaneously at a predetermined timing between steps S113 to S115.

[0076] As shown in Figure 1, the third measuring system 62 included in the measuring unit 6 consists of a third encoder head 62a fixed to the stator 32 and a third encoder scale 62b, which is a two-dimensional encoder scale fixed to the movable element 31. The third length measurement system 62 may also consist of an interferometer, a laser displacement meter, or the like.

[0077] The third length measuring system 62, with the above configuration, can measure the relative position between the movable element 31 and the stator 32 in the YZ plane (third measurement). As a result, by combining the second length measuring system 61 and the third length measuring system 62, it is possible to obtain the change in the relative position between the top plate 41 and the movable element 31, and based on the obtained results, a global alignment of the chipped shot area 50 can be performed.

[0078] Furthermore, in the third length measuring system 62, a three-dimensional encoder scale may be used as the third encoder scale 62b, or the number of measurement points of the interference displacement meter or laser displacement meter may be increased to measure the relative difference between the inclination of the movable element 31 and the stator 32 with respect to the YZ plane, and the drive of the movable element 31 may be controlled based on the measurement results. Furthermore, if the second length measuring system 61 also measures the relative difference between the inclination of the top plate 41 and the stator 32, the second length measuring system 61 and the third length measuring system 62 may be combined to calculate the relative difference between the inclination of the top plate 41 and the movable element 31, and the drive of the movable element 31 may be controlled based on the calculated result.

[0079] As shown in Figure 1, the fourth length measuring system 63 included in the length measuring unit 6 is composed of, for example, an interference displacement meter or a laser displacement meter, and is fixed to the movable element 31. Specifically, the fourth length measuring system 63 is positioned to measure the change in the relative position between the movable element 31 and the mold 1 in the XY plane by detecting the side of the mold 1 (second measurement). More specifically, by configuring the fourth length measuring system 63 with multiple interference displacement sensors or laser displacement sensors to detect the four sides of the rectangular mold 1 in the XY plane, for example, the relative rotation amount around the Z axis between the movable element 31 and the mold 1, and the deformation amount of the mold 1's outer shape can be measured.

[0080] Furthermore, by combining the second length measuring system 61, the third length measuring system 62, and the fourth length measuring system 63, the change in the relative position between the top plate 41 and the mold 1 can be calculated, and based on the calculated result, global alignment of the chipped shot area 50 can be performed.

[0081] As described above, the control unit 7 can determine the amount of drive for the substrate stage 4 and control the movement of the substrate stage 4 based on the relative position between the mold 1 and the substrate 2 detected by the detection unit 5 or the result of the relative position measured by the length measuring unit 6. In other words, the control unit 7 can switch the alignment method by determining whether the shot area 50 to be imprinted is a normal shot area where all of the four substrate-side marks 202 are formed, or a missing shot area where some are not formed.

[0082] Figures 6(a), (b), and (c) show the alignment control flow in the imprint process of the imprint device 100 according to this embodiment, respectively.

[0083] As described above, if the shot area 50 to be imprinted is not a missing shot area, i.e., it is a normal shot area, then diversity dialignment is performed on that shot area 50. The control flow at that time is shown in Figure 6(a), where the control unit 7 determines the target mark misalignment amount and then controls the drive unit 42 of the substrate stage 4 based on the determined target mark misalignment amount. At this time, feedback control is performed on the drive unit 42 based on the measurement results of the first length measuring system 43.

[0084] Here, since the drive unit 42 and the top plate 41 are connected to each other via multiple members, the amount of movement of the drive unit 42 and the top plate 41 do not necessarily coincide with each other. In addition, the relative position between the substrate 2 and the top plate 41, and the relative position between the mold 1 and the mold holding part 3 may also change. Therefore, the detection unit 5 performs feedback control by detecting the amount of mark displacement caused by the above factors.

[0085] On the other hand, if the shot area 50 to be imprinted is a missing shot area, global alignment is performed on that shot area 50. The control flow at that time is shown in Figure 6(b), in which the control unit 7 first determines the target top plate position based on the measurement results from the length measuring unit 6 in the normal shot area 50 near the edge of the substrate surface that was performed previously. Subsequently, the control unit 7 controls the drive unit 42 of the substrate stage 4 to move the top plate 41 to the determined target top plate position. At this time, feedback control is performed on the drive unit 42 based on the measurement results of the first length measuring system 43.

[0086] Here, since the drive unit 42 and the top plate 41 are connected to each other via multiple components, the amount of movement of the drive unit 42 and the top plate 41 do not necessarily coincide with each other. In addition, the relative position between the mold 1 and the mold holding unit 3 may also change. Therefore, the measuring unit 6 performs feedback control by measuring the change in the relative position between the top plate 41 and the mold 1 caused by the above factors.

[0087] Note that when performing global alignment using the length measuring unit 6 as described above, changes in the relative position between the substrate 2 and the top plate 41 are not taken into consideration. Furthermore, as shown in Figure 6(c), when performing global alignment on the chipped shot area 50, the first length measuring system 43 may be omitted, and feedback control may be performed using the measurement results from the length measuring unit 6 directly.

[0088] As described above, in the imprint apparatus 100 according to this embodiment, the position of the substrate 2 is adjusted by die-dialignment when performing imprint processing on the shot area 50. On the other hand, when performing imprint processing on the chipped shot area 50, the position of the substrate 2 is adjusted by global alignment. This allows for high-precision alignment between the mold 1 and the substrate 2 when forming the pattern of the imprint material on the chipped shot area 50.

[0089] Furthermore, as shown in Figure 3(b), when performing imprint processing on a normal shot area 50 provided near the edge of the substrate surface of the substrate 2, the position of the substrate 2 can be measured using the second length measuring system 61 in addition to the first length measuring system 43. Here, the second length measuring system 61 measures the position of the top plate 41 on which the substrate 2 is placed on the substrate stage 4, while the first length measuring system 43 measures the position of the drive unit 42 of the substrate stage 4, that is, it measures a component that is relatively far from the substrate 2. Therefore, if the position of the substrate 2 can be measured using the second length measuring system 61, it is preferable to measure the position of the substrate 2 using the second length measuring system 61 instead of the first length measuring system 43.

[0090] Furthermore, in the imprint apparatus 100 according to this embodiment, when performing imprint processing on the missing shot area 50, diversity alignment may be performed in addition to global alignment. Specifically, in addition to global alignment, the shape within the chipped shot area 50 may be corrected using a correction amount obtained by performing diversity alignment on the normal shot area 50.

[0091] In this case, for example, the shape difference between the pattern region 1a of type 1 acquired in step S115 of the flowchart shown in Figure 5 and the normal shot region 50 on the substrate 2 is saved. Then, in step S119, in addition to global alignment, die-di-di-alignment can be performed on the chipped shot area 50 based on a correction amount calculated from the shape difference preserved in the normal shot area 50.

[0092] Alternatively, in step S119, in addition to global alignment, the detection unit 5 may detect the substrate-side marks 202 formed within the missing shot region 50 to perform diversity alignment.

[0093] Furthermore, in the imprint apparatus 100 according to this embodiment, the length measuring unit 6 is composed of a second length measuring system 61, a third length measuring system 62, and a fourth length measuring system 63, but is not limited to this, and there may be length measuring systems that are omitted as needed. Furthermore, in the imprint apparatus 100 according to this embodiment, due to the configuration described above, alignment of the missing shot area 50 can be performed even if no substrate-side marks 202 are formed in the missing shot area 50.

[0094] [Second Embodiment] Figure 7 shows a schematic cross-sectional view of the imprint apparatus 200 according to the second embodiment. The imprint device 200 according to this embodiment has the same configuration as the imprint device 100 according to the first embodiment, except for the configuration of the length measuring unit 6. Therefore, the same reference numerals are used for the same components and their descriptions are omitted.

[0095] The length measuring unit 6 provided in the imprint device 200 according to this embodiment consists of a second length measuring system 61 and a fourth length measuring system 63. In other words, unlike the imprint device 100 according to the first embodiment, a third length measuring system 62 is not provided. Furthermore, in the second length measuring system 61, unlike the imprint device 100 according to the first embodiment, the second encoder head 61a is fixed to the movable element 31 instead of the stator 32.

[0096] Furthermore, in the imprint apparatus 200 according to this embodiment, global alignment can be performed on the missing shot area 50 during the imprint process on the substrate 2, similar to the imprint apparatus 100 according to the first embodiment.

[0097] As described above, in the imprint apparatus 200 according to this embodiment, the position of the substrate 2 is adjusted by die-dialignment when performing imprint processing on the shot area 50. On the other hand, when performing imprint processing on the chipped shot area 50, the position of the substrate 2 is adjusted by global alignment. This allows for high-precision alignment between the mold 1 and the substrate 2 when forming the pattern of the imprint material on the chipped shot area 50.

[0098] Furthermore, in the imprint apparatus 200 according to this embodiment, the relative position between the mold 1 and the substrate 2 can be measured at a position closer to the mold 1 and the substrate 2, respectively, compared to the imprint apparatus 100 according to the first embodiment. This allows for more precise alignment between the mold 1 and the substrate 2 when forming the pattern of the imprint material on the chipped shot area 50. In addition, the imprint device 200 according to this embodiment can measure the relative position between the movable element 31 and the top plate 41 without providing a third length measuring system 62, thus reducing the number of parts compared to the imprint device 100 according to the first embodiment.

[0099] [Method of manufacturing articles] The patterns of imprinted materials formed using the imprint apparatus according to this embodiment can be used permanently in at least a portion of various articles, or temporarily during the manufacturing of various articles. The items referred to here include electrical circuit elements, optical elements, MEMS, recording elements, sensors, molds, etc.

[0100] Electrical circuit elements also include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, as well as semiconductor elements such as LSIs, CCDs, image sensors, and FPGAs. The mold also includes molds for imprint processing, etc.

[0101] The pattern of the imprint material formed using the imprint apparatus according to this embodiment can be used as is as a component of at least a part of the above-mentioned article. Alternatively, the pattern on the imprint material may be temporarily used as a resist mask and removed after etching or ion implantation is performed during the substrate processing process.

[0102] Although preferred embodiments have been described above, the invention is not limited to these embodiments, and various modifications and changes are possible within the scope of its essence. [Explanation of Symbols]

[0103] Type 1 1a Pattern region 2 circuit boards 3 Type holding part 4. Circuit board stage (movable unit) 5. Detection Unit 6. Measuring section (first measuring section) 7 Control Unit 50 Shot Area 100 Imprinting Devices 201 type side mark 202 Mark on the circuit board

Claims

1. A mold holding section that holds the mold, A mobile body that can move while holding the circuit board, A detection unit for detecting the position of a mold-side mark formed in the pattern region of the mold and the position of a substrate-side mark formed in the shot region on the substrate, A first measuring unit performs a first measurement to measure the relative position between the mold holding unit and the moving body, The system includes a control unit capable of performing a first control that controls the movement of the moving body based on the detection result from the detection unit, and a second control that controls the movement of the moving body based on the measurement result from the first measurement unit. The substrate is provided with a first region where multiple substrate-side marks are formed, and a second region where fewer substrate-side marks are formed than in the first region, or where no substrate-side marks are formed. The imprinting apparatus is characterized in that the control unit performs the first control when performing imprinting on the first region, and performs the second control when performing imprinting on the second region.

2. The imprint apparatus according to claim 1, characterized in that the first measuring unit is an encoder.

3. The imprint apparatus according to claim 1, characterized in that the first measuring unit is an interferometer.

4. The imprint apparatus according to any one of claims 1 to 3, characterized in that the first control is diversity alignment.

5. The imprint apparatus according to any one of claims 1 to 4, characterized in that the second control is global alignment.

6. The imprint apparatus according to any one of claims 1 to 5, characterized in that the first measurement unit is capable of performing the first measurement when the first region or the second region is moved to a position where imprint processing can be performed.

7. The mold holding portion has a movable portion that can move while holding the mold, and a fixed portion to which a drive unit that drives the movable portion is fixed. The imprint apparatus according to any one of claims 1 to 6, characterized in that the first measuring unit measures the relative position between the fixed unit and the moving unit in the first measurement.

8. The imprint apparatus according to any one of claims 1 to 7, characterized in that the first measuring unit performs a second measurement to measure the relative position between the mold holding unit and the mold.

9. The mold holding portion has a movable portion that can move while holding the mold, and a fixed portion to which a drive unit that drives the movable portion is fixed. The imprint apparatus according to claim 8, characterized in that the first measuring unit measures the relative position between the movable part and the mold in the second measurement.

10. The imprint apparatus according to claim 8 or 9, characterized in that the control unit, in controlling the movement of the moving body based on the measurement results of the first measurement unit, calculates the relative position between the mold and the moving body from the measurement results of the first measurement and the second measurement, respectively, and controls the movement of the moving body based on the calculation result.

11. The mold holding portion has a movable portion that can move while holding the mold, and a fixed portion to which a drive unit that drives the movable portion is fixed. The imprint apparatus according to any one of claims 1 to 10, characterized in that the first measuring unit performs a third measurement to measure the relative position between the movable part and the fixed part.

12. The first measuring unit measures the relative position between the fixed part and the moving body in the first measurement, The imprint apparatus according to claim 11, characterized in that the control unit, in controlling the movement of the moving body based on the measurement results of the first measurement unit, calculates the relative position between the movable part and the moving body from the measurement results of the first measurement and the third measurement, respectively, and controls the movement of the moving body based on the calculation result.

13. The first measuring unit performs a fourth measurement to measure the relative position between the movable part and the mold. The imprint apparatus according to claim 11 or 12, characterized in that the control unit, in controlling the movement of the moving body based on the measurement results of the first measurement unit, calculates the relative position between the mold and the moving body from the measurement results of the first measurement, the third measurement, and the fourth measurement, and controls the movement of the moving body based on the calculation result.

14. The imprint apparatus according to any one of claims 1 to 13, further comprising a second measuring unit that performs a fifth measurement for measuring the relative position of the moving body with respect to a reference member.

15. The imprint apparatus according to claim 14, characterized in that the control unit controls the movement of the moving body based on the detection result of the detection unit and the measurement result of the fifth measurement.

16. The first measurement unit is capable of performing the first measurement when the first region or the second region is moved to a position where imprint processing can be performed. The control unit, When performing imprint processing on the first region, the first measurement unit is made to perform the first measurement. The imprinting apparatus according to claim 15, characterized in that when performing imprinting on the second region, the first measurement unit performs the first measurement, and then the movement of the moving body is controlled based on the measurement results of the first measurement for the first region and the second region respectively and the measurement results of the fifth measurement.

17. A step of forming a pattern of imprint material on a substrate using a mold with an imprint apparatus according to any one of claims 1 to 16, A process of processing the substrate on which the pattern is formed, A method for manufacturing an article, characterized by including the substrate and manufacturing an article from the processed substrate.

18. A method for controlling the movement of a moving body in an imprint apparatus comprising: a mold holding unit for holding a mold; a movable body that can move while holding a substrate; a detection unit for detecting the position of a mold-side mark formed in the pattern region of the mold and the position of a substrate-side mark formed in the shot region on the substrate; a first measurement unit for performing a first measurement for measuring the relative position between the mold holding unit and the movable body; and a control unit capable of performing a first control for controlling the movement of the movable body based on the detection result by the detection unit and a second control for controlling the movement of the movable body based on the measurement result by the first measurement unit, wherein The substrate is provided with a first region where multiple substrate-side marks are formed, and a second region where fewer substrate-side marks are formed than in the first region, or where no substrate-side marks are formed. When performing imprint processing on the first region, a first control step is performed to perform the first control, When performing imprint processing on the second region, a second control step is performed to perform the second control, A method characterized by including the following.

19. The method according to 18, characterized in that the first measurement unit can perform the first measurement when the first region or the second region is moved to a position where imprint processing can be performed.

20. The mold holding portion has a movable portion that can move while holding the mold, and a fixed portion to which a drive unit that drives the movable portion is fixed. The method according to 18 or 19, characterized in that the first measuring unit measures the relative position between the fixed unit and the moving unit in the first measurement.

21. The method according to any one of claims 18 to 20, characterized in that the first measuring unit performs a second measurement to measure the relative position between the mold holding unit and the mold.

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