Vapor deposition mask

Abstract

To improve an accuracy relating to vapor deposition.SOLUTION: A vapor deposition mask includes a mask body including a vapor deposition pattern consisting of multiple independent vapor deposition through-holes, and a frame body used for reinforcing the mask body. The mask body has a multi-layer structure of two or more layers that consist of a glossy layer and a non-glossy layer.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a vapor deposition mask including a mask body and a frame for reinforcing the mask body.

Background Art

[0002] As a method for forming a light-emitting layer of an organic EL (Electroluminescence) device, a vapor deposition mask method is widely used. In this vapor deposition mask method, in order to vapor-deposit an organic light-emitting substance at a desired position on a substrate made of a transparent material such as glass, a portion corresponding to the vapor deposition site of the substrate is removed and perforated vapor deposition mask is used.

[0003] In a vapor deposition apparatus for performing vapor deposition, the vapor deposition mask is installed in a correctly aligned state with respect to the substrate to be vapor-deposited, and vapor deposition is executed. However, since heating is generally performed in order to create a vapor deposition-capable environment inside the vapor deposition apparatus during vapor deposition, when the thermal deformation states of the vapor deposition mask and the glass substrate are different, the relative positional relationship between the vapor deposition mask and the substrate changes, and there is a problem that the required accuracy of the formed light-emitting layer cannot be satisfied.

[0004] In recent years, a mask structure in which a reinforcing frame made of a material having the same thermal expansion coefficient as the vapor deposition substrate such as glass or a material having a low thermal expansion coefficient is attached to the outer peripheral edge of a thin mask body is adopted. ​​​​A highly accurate vapor deposition mask has been proposed. An example of such a conventional vapor deposition mask is disclosed in Japanese Patent Publication No. 2005-15908. There are some things that can be described. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2005-15908 [Overview of the project] [Problems that the invention aims to solve]

[0006] Conventional vapor deposition masks have the configuration shown in Patent Document 1, and the difference in thermal expansion coefficients To suppress relative deformation between the mask and the substrate, thereby preventing a significant deterioration in the positional accuracy of the deposited material. It is possible. However, there is a demand in the market for even higher precision in vapor-deposited products, and the displacement caused by mask displacement is a concern. Further efforts are needed to suppress the occurrence of this disease.

[0007] Ma Regarding the combined structure of the mask body and the frame, the frame strength must be sufficient to withstand the displacement of the mask body. of Secure In doing so, it is necessary to optimize the frame structure, as well as to ensure that the force applied to the frame from the mask body is appropriate.

[0008] Conventionally, when forming the mask body by electroforming, nickel alloys such as nickel and nickel-cobalt, and other electrodeposited metals are used as materials. In particular, when a matte nickel layer is formed on a mold as the electrodeposited layer that forms the mask body, it has been known for its excellent release properties in the process of separating and removing the mold from this electrodeposited layer, and has been widely used.

[0009] but, If the mask body is formed solely from matte nickel, the thermal expansion of various parts in the completed vapor-deposited mask may cause excessive tension in the mask body, potentially leading to deformation of the frame and making it impossible to suppress the deformation of the mask body.

[0010] As described above, in conventional mask structures ,MaDepending on the mask body, it was affected by thermal expansion and had a problem that it was inevitable to deteriorate the yield due to the displacement of the vapor deposition formation.

[0011] An object of the present invention is to provide a vapor deposition mask capable of improving the accuracy related to vapor deposition.

Means for Solving the Problems

[0012] The vapor deposition mask disclosed in the present invention comprises a mask body having a vapor deposition pattern consisting of a large number of independent vapor deposition holes, and a frame used to reinforce the mask body, wherein the mask body has a multilayer structure of two or more layers consisting of a glossy metal layer and a matte metal layer, and the frame is formed such that the cross-sectional shape of the minimum width portion is such that the ratio of the thickness dimension to the width dimension is 0.8 / 4 or more and 2 / 4 or less. As described above, according to the disclosure of the present invention, the mask body is made of a multilayer structure of a glossy metal layer and a matte metal layer, and the frame is made to have an appropriate thickness, thereby accurately imparting resistance to deformation (rigidity) to bending. This ensures that the frame has strength against forces that attempt to deform the frame from the mask body side, suppressing deformation of the frame and its effect on the mask body. Furthermore, the tension (tensile stress) that causes the mask body to contract inward after completion can be increased, resulting in a heat-resistant vapor deposition mask that does not deform even when affected by the expansion of various parts due to heat, thereby improving the precision of the through-hole positions of the mask body and enabling high-precision vapor deposition on the target object.

[0013] Furthermore, other possible forms of the vapor deposition mask disclosed in this invention are noted. The vapor deposition mask according to this disclosure comprises a plurality of mask bodies provided with a plurality of independent vapor deposition holes in a predetermined pattern, and a frame body arranged around the mask bodies, wherein the frame body is formed in a grid shape as a whole, having a rectangular or square outer frame portion located on the outermost periphery and an inner frame portion that divides the inside of the outer frame portion into a plurality of opening regions, and the mask bodies are positioned in each of the plurality of opening regions of the frame body and are integrated with the frame body, and the cross-sectional shape of the narrowest part of the inner frame portion of the frame body is a rectangular cross-section with a ratio of thickness dimension to width dimension of 0.8 / 5 or more and 2 / 5 or less. In this way Honkai As shown, by making the cross-sectional shape of the minimum width portion in the inner frame portion of the frame such that the relationship between its width and thickness is appropriate, and accurately imparting the bending rigidity (difficulty in bending deformation) of the minimum width portion, sufficient strength against the force from the mask body side can be given. Together with the other parts of the frame that are wider and stronger than this minimum width portion, the displacement of each part of the mask body from its original position can be suppressed as a whole frame, the alignment state between the mask and the vapor deposition substrate in the vapor deposition process can be ensured, and vapor deposition can be accurately performed at an appropriate position on the vapor deposition substrate. Also, due to the difficulty in bending deformation of the minimum width portion, the deflection due to the self-weight of the minimum width portion can be suppressed, and the deformation of the frame and the influence on the mask body can be suppressed.

[0014] Also, Honkai The vapor deposition mask according to the shown figure, if necessary, has a rectangular cross-section such that the ratio of the thickness dimension to the width dimension of each cross-section at a portion other than the thinnest portion of the outer frame portion and the inner frame portion in the frame is 0.8 / 90 or more and smaller than the ratio of the thickness dimension to the width dimension at the thinnest portion of the inner frame portion.

[0015] In this way HonkaiAccording to the illustration, for each part of the frame body other than the minimum width part, by setting a thickness dimension that is a certain amount or more with respect to the width dimension for each part of the frame body to form an appropriate cross-sectional shape and imparting the necessary minimum bending rigidity to make it difficult to bend, the strength of the frame body against the force from the mask body side can be sufficiently ensured, suppressing the deformation of the frame body and its influence on the mask body, enhancing the accuracy related to the through-hole position of the mask body, and enabling high-precision vapor deposition on the vapor deposition target.

[0016] Also, Honkai The vapor deposition mask according to the illustration is, if necessary, formed such that the frame body has a thickness dimension of each part of 0.8 mm or more and 2 mm or less.

[0017] In this way Honkai According to the illustration, within the realistic range of width dimensions where a cross-sectional shape that is difficult to bend can be obtained for each part of the frame body, by setting the thickness dimension in the cross-sectional shape so as not to become too large, the manifestation of deformation due to bending by its own weight or internal strain in each part of the frame body can be suppressed, enabling a highly accurate frame body and high-precision vapor deposition. Also, by not increasing the thickness more than necessary, an increase in the weight of the frame body can be suppressed, preventing the deterioration of the handling property of the vapor deposition mask.

[0018] Also, Honkai The vapor deposition mask according to the illustration is, if necessary, formed such that the frame body has a laminated structure in which a first frame member and a second frame member are overlapped and integrated, and the first frame member and the second frame member are warped frame members formed from a thin metal sheet material, and the warping directions of each are opposite to each other.

[0019] In this way HonkaiAccording to the diagram, the frame is constructed by overlapping and joining together a first frame member and a second frame member made of thin metal sheet material. By stacking the first and second frame members, which have curvature, so that their respective curvature directions are opposite, the curvature cancels out in the frame, resulting in a flat state. This allows for a frame with improved flatness to be obtained at a lower cost, and enables efficient vapor deposition while increasing the shape accuracy of the mask. Furthermore, because the frame is constructed by combining the first and second frame members, even if the thickness of the frame reaches a thickness that would cause curvature if a simple single thin sheet material were used, unwanted deformations such as curvature can be prevented. This does not adversely affect the positional accuracy of the mask body, resulting in a stronger mask structure, and enabling vapor deposition with high precision using this mask.

[0020] Also, Honkai The vapor deposition mask shown is formed such that, if necessary, the frame is made of different materials for the inner and outer parts.

[0021] In this way Honkai According to the diagram, by using different materials for the inner and outer frames of the frame, and giving them different properties, for example, if a material with a higher specific strength than the inner frame is used for the outer frame, the deformation based on forces from the mask body can be mainly suppressed by the outer frame, thereby efficiently reinforcing the mask body and improving the accuracy of the mask body's position. In addition, for example, if a material with a smaller coefficient of linear expansion than the outer frame is used for the inner frame of the frame, the displacement of various positions of the mask due to thermal deformation of the mask body under the heated conditions of the vapor deposition process can be efficiently suppressed by the inner frame adjacent to the mask body, ensuring that the positional relationship between the mask and the substrate to be vapor-deposited, as it is at room temperature, is reliably maintained even under heated conditions, allowing for highly accurate vapor deposition. [Brief explanation of the drawing]

[0022] [Figure 1] This is a schematic plan view of a vapor deposition mask according to one embodiment of the present invention. [Figure 2] This is an explanatory diagram of the main components of a vapor deposition mask according to one embodiment of the present invention. [Figure 3] This is a schematic cross-sectional view of a key part of a vapor deposition mask according to one embodiment of the present invention. [Figure 4] This is a plan view of the frame of a vapor deposition mask according to one embodiment of the present invention. [Figure 5] This is an explanatory diagram of the frame formation process in a vapor deposition mask according to one embodiment of the present invention. [Figure 6] This is an explanatory diagram of the primary pattern resist formation process in the manufacturing of a vapor deposition mask according to one embodiment of the present invention. [Figure 7] This is an explanatory diagram of the primary electrodeposition layer formation process in the manufacturing of a vapor deposition mask according to one embodiment of the present invention. [Figure 8] This is an explanatory diagram of the first half of the secondary pattern resist formation process in the manufacturing of a vapor deposition mask according to one embodiment of the present invention. [Figure 9] This is an explanatory diagram of the latter half of the secondary pattern resist formation process in the manufacturing of a vapor deposition mask according to one embodiment of the present invention. [Figure 10] This is an explanatory diagram of the frame crimping process in the manufacturing of a vapor deposition mask according to one embodiment of the present invention. [Figure 11] This diagram illustrates the metal layer formation process and the separation state of the deposition mask and the master mold in the manufacturing of a deposition mask according to one embodiment of the present invention. [Figure 12] This is a schematic plan view of another example of a vapor deposition mask according to one embodiment of the present invention. [Figure 13] These are a plan view and a schematic cross-sectional view of another frame in a vapor deposition mask according to one embodiment of the present invention. [Modes for carrying out the invention]

[0023] The following describes a vapor deposition mask according to one embodiment of the present invention, based on Figures 1 to 11. In this embodiment, an example of its application to a deposition mask for organic EL elements will be described. In each of the figures above, the deposition mask 1 according to this embodiment has a number of deposition holes 8 arranged in a predetermined pattern. It comprises multiple mask bodies 2 provided therein, and a frame 3 arranged around the mask bodies 2. It is structured.

[0024] The mask body 2 is made of nickel, nickel-cobalt or other nickel alloys, and other electroplated metals. Formed in a sheet shape by electroforming using a material, it has numerous independent vapor deposition channels through which the vapor-deposited material can pass. The configuration allows for the holes 8 to be arranged in a predetermined pattern.

[0025] The mask body 2 has an internal pattern-forming region 2a in which numerous deposition holes 8 are provided, and Including an outer peripheral edge 2b which is integrally joined to the frame 3 via a metal layer 7 formed by the process. In the pattern formation region 2a, numerous deposition holes 8 are used for luminescence layer formation, in the front and back directions. Multiple groups of through-holes are arranged in a straight line in the direction of travel, and multiple such rows are arranged in parallel in the left-right direction. A matrix-like deposition pattern 9 is formed. The thickness of the mask body 2 is preferably in the range of 5 to 20 μm, and in this embodiment it is 8 μm. I set it up.

[0026] The frame 3 is a plate-like body that is thicker than the mask body 2 and has a rectangular frame shape. It is positioned to surround the outside of the mask body 2 as reinforcement for the main body 2, and is connected to the mask body 2. It is an integrated structure. In detail, the frame 3 consists of a rectangular outer frame portion 4 located on the outermost periphery, and The outer frame portion 4 has an inner frame portion 5 that divides the inside of the outer frame portion 4 into multiple opening regions 6, and the overall structure is lattice-shaped. It is formed in such a way. And in each opening region 6 that is partitioned by the inner frame portion 5 of the frame body 3, Each of the main body units 2 is positioned and integrated with the frame 3 via a metal layer 7.

[0027] This frame 3 has a cross-sectional shape at the narrowest part of its inner frame 5 that is relative to the width dimension W. A rectangular cross-section in which the ratio (aspect ratio) of the thickness dimension T is 0.8 / 4 or more and 2 / 4 or less. This is the resulting configuration. On the other hand, the cross-sectional shapes of the outer frame portion 4 and the inner frame portion 5 of the frame body 3, excluding the narrowest part, are , a rectangular cross section in which the ratio of the thickness dimension T to the width dimension W (aspect ratio) is 0.8 / 90 or greater. It is considered a surface.

[0028] Furthermore, the outer frame portion 4 and the inner frame portion 5 of the frame body 3 are of uniform thickness, and their thickness dimension is 0. 2 mm or more and 6 mm or less, preferably 0.8 mm or more and 3 mm or less, more preferably 2 mm It is formed to be m. Here, the thickness dimension is preferably 0.8 mm or more. If the thickness of each part of the frame is less than 0.8 mm, the strength of the frame is the tension inherent in the mask body. This is because it may deform if it cannot withstand the force (tensile stress).

[0029] On the other hand, if the thickness of each part of this frame exceeds 2 mm, so-called shadows will appear during the vapor deposition process. The problem (that the frame acts as an obstacle to the progress of the vapor deposition material) and the frame Since the thickness of the mold is usually 1 mm, handling the frame after it has been crimped becomes difficult. For these reasons, it is preferable to make the thickness dimension 2 mm or less.

[0030] In this embodiment, the width dimension W1 of the narrowest part (minimum width) of the inner frame 5 is 4 mm. The width dimension W2 at the widest point (maximum width) is approximately 90 mm. If the width dimension becomes less than 4 mm, the strength of the frame will be affected by the tension (tensile stress) inherent in the mask body. Since there is a risk of deformation due to inability to withstand the force, it is preferable to have a width dimension of 4 mm or more.

[0031] In addition, if the maximum width dimension exceeds 90 mm, a mask can be formed on a single mold. The number of units (number of pieces) would be excessively reduced, lowering the efficiency of mask manufacturing, therefore, the width dimension It is preferable that the length be 90 mm or less.

[0032] Thus, the frame 3 has a rectangular cross-sectional shape of the minimum width portion of the inner frame, relative to the width dimension W of the minimum width portion. The shape is formed such that the ratio of the thickness dimension T is within the aforementioned range. As shown above, the aspect ratio of the cross-sectional shape of the minimum width portion is kept within a predetermined range, and is not excessive in relation to the width. To ensure an appropriate thickness is secured, and to reduce deformation when bending at the minimum width portion based on the cross-sectional shape. By precisely applying rigidity, deflection due to the self-weight of the narrowest part is made less likely, This ensures strength against forces attempting to deform the frame 3 from the mask body side, and prevents deformation of the frame 3. To minimize the shape and its impact on the mask body 2, and to improve the precision of the hole positions in the mask body 2. This enables high-precision vapor deposition on the target surface.

[0033] Furthermore, the cross-sectional shape of each part of the frame 3 other than the minimum width section is designed to provide the necessary bending rigidity. And, while ensuring sufficient strength against force from the mask body side, the thickness relative to its width dimension. By setting it appropriately, the weight of frame 3 will not increase unnecessarily due to the thickness (cross-sectional area) becoming larger than necessary. This suppresses the increase in volume, preventing the overall weight and deflection of the deposition mask from becoming excessive. .

[0034] On the other hand, the frame 3 consists of a first frame member 3a and a second frame member 3b of the same shape, with adhesive interposed between them. The structure is a laminated structure in which the first frame member 3a and the second frame member 3a are stacked and joined together as a single unit. b is a frame member formed from a thin metal sheet material manufactured through the same thin sheet manufacturing process, and is thin The metal thin sheet material has a warp based on internal distortion resulting from the sheet manufacturing process, and each warp The direction is reversed to form a laminated structure as frame 3.

[0035] Thus, metal sheet materials manufactured through the same thin sheet manufacturing process, specifically the rolling process, The first frame member 3a and the second frame member 3b, which are of the same shape formed by cutting or other processing, By reversing the direction of the curvature and joining them together with adhesive, the resulting frame 3 has a relative curvature. It is killed and becomes flat (see Figure 5). Note that in Figure 5, the first frame member 3a and the second frame The magnitude of the warp in member 3b is exaggerated in the illustration for ease of understanding; the actual value is different. The warping will be extremely small. However, if these warps appear as they are in frame 3... This affects the mask body 2, worsening the accuracy related to its position, and thus improving the precision of the vapor deposition mask. Because its size could potentially cause problems, the above-mentioned laminated structure is used to eliminate warping. .

[0036] In this embodiment, the adhesive is a sheet-like uncured photosensitive dry film resin. The first frame member 3a and the second frame member 3b are interposed to use the first frame member 3a and the second frame member 3b. After joining the two frame members 3b, the portion other than the portion that becomes the adhesive layer 3c between the first frame member 3a and the second frame member 3b The parts that do not require a resist are removed. In addition, various adhesives that are commonly available can be used. It can also be used. Furthermore, when the warping is canceled out by the joint, it becomes a flat state, that is, frame 3. If the flatness and parallelism of the front and back surfaces of the frame are within an acceptable range at this stage, then the first frame part The planar shape, cross-sectional shape, and degree of curvature of material 3a and the second frame member 3b may be different.

[0037] The first frame member 3a and the second frame member 3b are joined together and integrated with their respective curvature directions facing opposite directions. By forming a flat frame 3, the thickness of the frame 3 is reduced compared to using a simple single thin sheet material. Even when the thickness reaches a level that could potentially cause warping, it is possible to prevent unwanted deformations such as bending from occurring. This does not negatively affect the positional accuracy of the mask body, and allows for high-speed deposition using this mask body. It can be executed with high precision.

[0038] This frame 3 is made of a material with a low coefficient of thermal expansion, for example, Invar material, which is a nickel-iron alloy. The materials are formed from materials such as Super Invar, which is a nickel-iron-cobalt alloy. The frame 3 is formed by a metal layer 7 created by electroforming, which forms the pattern of the mask body 2. The outer periphery 2b of the formation region 2a is connected and integrated with each other so as not to separate.

[0039] When Invar material or Super Invar material is used as the material for frame 3, the coefficient of thermal expansion Because it is extremely small, the dimensional change of the mask body 2 due to the thermal effect during the deposition process is well controlled. It can be suppressed. That is, the mask body 2 is made of a material such as nickel, which has a coefficient of thermal expansion of the deposited group. Even if the thermal expansion coefficient is larger than that of ordinary glass (not shown in the diagram), during deposition Due to the difference in thermal expansion coefficients at high temperatures, when the deposition mask 1 is aligned with the substrate to be deposited at room temperature... A discrepancy occurs between the position of the holes in the substrate and the position of the deposited material during actual deposition. Without any problems, the frame 3 that holds the mask body 2 has a small coefficient of thermal expansion, and the temperature rises. The dimensional and shape changes caused by the expansion of the mask body 2 during this time are well suppressed, and at room temperature... The matching accuracy can be maintained well even when the temperature rises during deposition.

[0040] The material of the frame 3 is a material with a low coefficient of thermal expansion, similar to the glass or other substrate to be coated, for example, Materials such as glass and ceramics can also be used. In this case, less of these materials This will impart conductivity to the surface.

[0041] The deposition mask 1 is placed on the surface of the matrix 10, corresponding to the unplaced portion of the primary electrodeposition layer 15. After the next pattern resist 14 is applied, the primary electrodeposited layer is formed on the matrix 10 by electroforming the electrodeposited metal. A secondary pattern is formed, which covers the portion of the primary electrodeposited layer 15 corresponding to the pattern formation region 2a. After the resist 18 is formed, and the frame 3 is positioned to surround the primary electrodeposition layer 15, A metal layer 7 is formed by electroforming so as to cover the surface of the frame 3 and the outer edge 2b surface of the primary electrodeposited layer 15. This metal layer 7 is formed and integrally connects the primary electrodeposited layer 15 and the frame 3 so that they do not separate. In this state, the integrated primary electrodeposited layer 15, frame 3, and metal layer 7 are separated from the mold 10. It is manufactured by doing so.

[0042] The master mold 10 used in the manufacturing process of the vapor deposition mask 1 according to this embodiment is made of stainless steel. They are formed from conductive materials such as brass and steel, and are separated during the manufacturing process of the vapor deposition mask. Up to this point, it supports the primary electrodeposited layer 15 and other components that make up the mask body 2, and in the vapor deposition mask manufacturing process At each stage, a primary pattern resist 14, a primary electrodeposition layer 15, and a secondary pattern resist are applied to the surface side. Layer 18 and the metal layer 7 are formed. When forming the primary electrodeposition layer 15 and the metal layer 7, this mother When current is passed through mold 10, the conductive material is not covered by the resist on the surface of the master mold 10. A primary electrodeposited layer 15 or a metal layer 7 will be formed in the portion by electroforming (plating).

[0043] The matrix 10 is, for example, 42 alloy (42% nickel-iron alloy) or Invar (36% nickel-iron alloy). Materials with a low coefficient of thermal expansion, such as Kel-iron alloy and SUS430, can also be used. The mold is made of conductive metal such as chromium or titanium on the surface of an insulating substrate such as a glass plate or resin plate. It is also acceptable to use a metal film formed from a group of elements.

[0044] In the manufacturing process of the vapor deposition mask 1, once the metal layer 7 is formed on the master mold 10 by plating (Figure See Figure 11(B)), and the matrix 10 is separated and removed from these (see Figure 11(C)). Matrix 1 If 0 is made of stainless steel, apply force to physically peel it off from the deposition mask side and remove it. It is preferable to use the method described above, and if the matrix 10 is made of another metal material, dissolve and remove it using a chemical solution. It is preferable to use an etching method that removes the matrix. In the case of etching, the matrix 10 dissolves. The selective etching properties ensure that the primary electrodeposition layer 15, the frame 3, and the metal layer 7 are not affected. The etching solution will be used.

[0045] The primary electrodeposited layer 15 is a nickel alloy suitable for electroforming, such as nickel or nickel-cobalt. It consists of a structure formed by electroforming in the portion of the matrix 10 where there is no primary pattern resist 14. In the deposition mask 1, the primary electrodeposition layer 15 is deposited on the substrate to be deposited, such as the light-emitting layer. The mask body 2 that covers the surface of the substrate to be vapor-deposited, excluding the vapor deposition holes 8 corresponding to the target area. It will be formed as such.

[0046] The primary pattern resist 14 is resistant to the electrolyte used in the electroforming of the primary electrodeposition layer 15. A primary electrodeposited layer 15 is formed from a soluble insulating material and pre-set on the matrix 10. It is positioned to correspond to the non-placed portion and is removed after the formation of the primary electrodeposition layer 15. (See Figures 6 and 7).

[0047] This primary pattern resist 14 is placed on the matrix 10 prior to the formation of the primary electrodeposition layer 15. A photosensitive resist, for example, a negative-type photosensitive dry film resist, is used in matrix 1. The mask 1 is arranged to have a predetermined thickness, for example, about 20 μm, and the mask is placed at 0. A mask with a predetermined pattern corresponding to the position of the main body 2, that is, the position of the primary electrodeposited layer 15. With film 12 applied, curing occurs through exposure with ultraviolet irradiation, and the resist is removed from the unirradiated areas. After processing such as development, it is formed in a shape corresponding to the non-placed portion of the primary electrodeposited layer 15. .

[0048] The secondary pattern resist 18 is resistant to dissolution in the electrolyte used for plating the metal layer 7. It is formed of an insulating material having properties, preferably with a thickness in the range of 100 to 120 μm, The metal layer 7 is positioned to correspond to the portion of the metal layer 7 that is not pre-configured in the subsequent electrodeposition layer 15. These are placed prior to formation and removed after the formation of the metal layer 7 (see Figures 8 and 9). ).

[0049] This secondary pattern resist 18 is a photosensitive resist, for example, a negative type photosensitive dry resist. The film resist is attached and disposed on the matrix 10 and the already placed primary electrodeposition layer 15. A mask film 1 with a predetermined pattern corresponding to the positions of the metal layer 7 and frame 3 of the vapor deposition mask 1. The process of exposing the object 7 to ultraviolet light is repeated once or multiple times. After achieving the required resist thickness, remove the photosensitive material from the non-irradiated areas during exposure. After processing such as development, the non-placed portion of the metal layer 7 (the pattern formation region 2a of the mask body 2) It is formed in a corresponding shape.

[0050] The aforementioned metal layer 7 is formed by plating, and consists of nickel and nickel-cobalt. Made of alloy, etc., the matrix 10 and the already placed primary electrodeposition layer 15 and frame 3, the secondary pattern The surface is formed by plating in areas where the surface resist 18 is not applied and is exposed.

[0051] This metal layer 7 joins the outer edge 2b of the pattern-forming region 2a of the mask body 2 to the frame 3. The metal layer 7 is located on the upper surface of the mask body 2, which is related to the outer edge 2b of the pattern formation region. It is laminated by plating. Specifically, the metal layer 7 is located on the outer edge 2b of the pattern formation region 2a. The top surface, the top surface and side surface of the frame 3 and the pattern forming region 2a side, and the mask body 2 and frame 3 It is formed in the gap portion, and this connects the outer edge 2b of the pattern forming region 2a and the opening of the frame 3. It is connected integrally with the periphery so that it does not separate.

[0052] Next, the process of forming the frame in the deposition mask according to this embodiment and the deposition mask including this frame I will explain the entire manufacturing process for the scooter. First, we will explain the process of forming the frame 3 used to reinforce the mask body 2.

[0053] First, from a general thin metal sheet material that has undergone rolling or similar processes, a first frame member 3a and a second frame member of the same shape are formed. The frame member 3b is formed by cutting processes such as electrical discharge machining or laser processing. When cutting the second frame member 3b, the portion on the thin metal sheet material that is set as the second frame member 3b is the The first frame member 3a is provided in such a way that its orientation is reversed relative to the part of the frame member 3a, and the second The frame member 3b is designed so that the warping caused by distortion occurs in opposite directions.

[0054] After cutting, an opening region 6 is created in each cut-out component by etching, laser processing, etc. The first frame member 3a and the second frame member 3b are then completed. An adhesive layer 3c is interposed between the frame member 3b and the other member, and the two members are joined in a state where the direction of curvature is reversed. By integrating the parts, a frame 3 is obtained in which each part has a predetermined cross-sectional shape.

[0055] As an adhesive for integrating the first frame member 3a and the second frame member 3b, for example, an uncured adhesive A sheet-like photosensitive dry film resist that is adhesive in its state is used, and can also be used in subsequent processes. By using the same materials, we can prepare and replenish them together, and reuse some of them. It can be prepared, and there is no need to separately prepare commercially available adhesives, etc., just to use as an adhesive layer. Because there are no costs associated with specialized adhesives, the manufacturing costs of the vapor deposition mask can be reduced accordingly. preferable.

[0056] If necessary, the joined and integrated first frame member 3a and second frame member 3b are joined together by a pair of pressurizing rods. A device capable of applying clamping force to laminated members, such as a lathe, is used to secure the bonded state. It would be good to implement the plan.

[0057] After joining, the unnecessary portion of the adhesive layer 3c, i.e., the portion located outside the opening area 6 and the outer frame portion 4. By removing the above, frame 3 is completed. Note that if the adhesive is film resist... This will be removed during the development process.

[0058] A separate adhesive layer 19 is provided on the completed frame 3 for bonding it to the mold 10. This adhesive layer 19 can be, for example, a photosensitive dry material that is tacky in its uncured state. It can be used by attaching a film resist, and the film resist is attached to the frame 3. Furthermore, the film resist in the portion located in the opening area 6 of the frame 3 and the portion that extends beyond the outer frame 4 By removing the material, an adhesive layer 19 is obtained.

[0059] On the other hand, the manufacturing process for the vapor deposition mask involves first setting a predetermined shape on the master mold 10. Corresponding to the deposition holes 8 of the mask body 2, i.e., the non-placed portions of the primary electrodeposition layer 15, the matrix A resist layer 11 is placed on 10 (see Figure 6). Specifically, on the surface side of the master mold 10, for example Then, a negative-type photosensitive dry film resist is used for the formation of the primary electrodeposition layer 15. One to several layers are stacked according to the thickness (for example, about 20 μm), and the resist layer 11 is formed by thermocompression bonding. It forms (see Figure 6(A)).

[0060] Furthermore, the surface of the resist layer 11 has light-transmitting holes 12a corresponding to the deposition holes 8. A mask film (glass mask) with a predetermined pattern corresponding to the placement position of the primary electrodeposited layer 15. After 12 is firmly attached, it is cured by exposure to ultraviolet light (see Figures 6(B) and (C)), The process involves developing and drying to remove the resist from the unirradiated areas. Then, the primary pattern resist 14 corresponding to the unplaced portion of the primary electrodeposition layer 15 is placed on the matrix 10 Form it on top (see Figure 7(A)). Furthermore, such primary pattern resists 14 are lithographic resists using photoresists, etc. It can be formed by a fee method or any other method, and the method of formation is not limited to the above. No.

[0061] The matrix 10 having this primary pattern resist 14 is placed in an electroforming bath prepared under predetermined conditions. Therefore, within the thickness range of the primary pattern resist 14, the primary pattern resist 14 of the master mold 10 On surfaces not covered (exposed areas), electroforming of an electrodeposited metal such as a nickel alloy is performed, for example. A primary electrodeposited layer 15, which will form the mask body 2, is formed with a thickness of 8 μm (see Figure 7(B)).

[0062] After this, the primary pattern resist 14 is dissolved and removed, thereby creating a predetermined deposition pattern 9 A primary electrodeposited layer 15 is obtained, which forms the mask body 2 and is provided with a number of independent deposition holes 8. (See Figure 7(C)).

[0063] After this primary electrodeposited layer 15 is obtained, the surface of the matrix 10 including the portion where this primary electrodeposited layer 15 is formed is A resist layer 16, preferably with a thickness in the range of 50 to 60 μm, is provided across the entire surface. Specifically, on the surface side of the matrix 10, for example, a negative-type photosensitive dry film with a thickness of 56 μm is placed. A resist is applied, and the key areas are cured by exposure. These processes are carried out from the resist layer 16. The final secondary pattern resist 18 will have a predetermined thickness. Repeat as needed multiple times, a single layer or multiple layers of film resist are formed. A resist layer 16 with a layered structure is formed.

[0064] The film resist is exposed after each sheet is applied. On the surface of the film resist, there are light-transmitting holes 17a corresponding to the pattern formation area 2a of the mask body 2. The process involves adhering a mask film 17 having the above characteristics to the surface, and then curing it by exposure to ultraviolet light. This is done (see Figures 8(B) and 9(A)). This process is repeated as needed, and in the area corresponding to the pattern formation region 2a, exposure occurs. The cured resist layer 16a is exposed in the other areas, while the unexposed resist layer 16b is exposed in the other areas. The result will be a predetermined thickness.

[0065] In this embodiment, the process of applying a film resist and performing exposure is repeated twice, resulting in a thickness of 5 Two 6 μm thick resist layers 16 are formed. After this, a process is performed to dissolve and remove the unexposed resist layer 16b that is exposed on the surface. A secondary pattern resist 18 with a thickness of 112 μm is formed to cover the pattern formation region 2a (Figure 9(C)).

[0066] After forming the secondary pattern resist 18 in this manner, the frame formation process is completed The adhesive layer 19 is pre-placed on the lower side of the frame 3, and then the primary electrodeposition layer 15 is pre-filled Align and position it at the designated location (see Figure 9(C)). In this state, the frame 3 does not easily move on the primary electrodeposition layer 15 due to the adhesive properties of the adhesive layer 19. It can be temporarily fixed in place.

[0067] For the temporarily fixed frame 3, a process is carried out to apply a load from above the frame 3 to compress it, and the frame To prevent body 3 from easily separating from the primary electrodeposition layer 15 (see Figure 10). Specifically, first As a temporary crimping step, a static load is applied to the frame 3 for a predetermined time, pressing it against the mold side. , placing a glass plate weighing 50 kg or more, for example 105 kg, on frame 3 for more than 1 hour, for example Leave it for 4 hours. Note that in this temporary crimping, the static load should be something that can be placed on the frame 3. If it's the body, other materials besides glass plates can be used.

[0068] Next, as the final crimping step, each part of the frame 3 is pressed evenly to securely fix it to the primary electrodeposition layer 15. For example, after removing the glass plate, etc., move 0.1M while moving relative to the frame 3. A pressure roller (laminator) that applies pressure of Pa or more, for example 0.6 MPa, on the frame 3 The pressing motion is performed by making a reciprocating motion, for example, three times, or more than one back-and-forth movement.

[0069] When applying pressure with a pressure roller as part of this crimping process, a highly rigid plate that does not easily deform is required, for example, For example, a plate made of SUS material is interposed between the frame 3 and the roller, and the roller is connected to this plate. If pressing is performed, the force from the roller will be distributed across the plate and transmitted to the frame 3. This method is preferable because it is less likely to cause uneven pressure distribution compared to when the roller is used to apply pressure directly.

[0070] In addition, a sheet made by layering a highly rigid plate with an elastic sheet made of rubber or other material is called a sheet. With the side facing the frame 3, the plate is interposed between the frame 3 and the roller, and these plates and sheets are connected via It is also possible to apply pressure using rollers. In this case, slight tilting or distortion of the plate surface can be compensated for. Furthermore, the unevenness of the gap between the plate and the frame due to irregularities, etc., is compensated for by the interposed sheet between the plate and the frame. The force from the roller can be absorbed by elastic deformation and is evenly distributed by the frame 3 through the sheet that is in close contact with the frame 3. This allows the signal to be transmitted more evenly and uniformly pressed against the primary electrodeposition layer 15. This prevents gaps from forming between the frame 3 and the primary electrodeposition layer 15, and prevents gaps from forming during the formation of the metal layer 7. This prevents adverse effects such as abnormal plating growth during the process.

[0071] In addition to pressing the frame 3 for the final crimping using a pressure roller (laminator), A press-type device is used that allows the pressure part to be operated only in the thickness direction of the frame 3 to press against the frame 3. It is also possible to accidentally make contact with the roller from the rolling roller, as is the case when rollers are used for pressing. A linear (lateral) force applied to the frame does not pose a risk of causing lateral displacement of the frame, which is preferable.

[0072] After this crimping process, the pattern formation region 2a remains uncovered by the secondary pattern resist 18. The upper surface of the primary electrodeposited layer 15 exposed on the outer edge 2b, and the lower side of the primary electrodeposited layer 15 of the frame 3 on a and the exposed surfaces of the matrix 10 that are exposed on its sides, and on the surface of the frame 3, electrodeposited metal A metal layer 7 is formed by plating (see Figure 11(B)). This metal layer 7 forms the primary electrodeposited layer. 15 and frame 3 can be connected together as a single unit without separating.

[0073] In this case, the metal layer 7 is a primary layer exposed on the surface relating to the outer edge 2b of the pattern formation region 2a. On the upper surface of the electrodeposited layer 15 and on the surface of the matrix 10 that is exposed between the primary electrodeposited layer 15 and the frame 3 Compared to the thickness of the frame, the thickness of the metal layer 7 on the surface of the frame 3 will be formed to be thinner. The difference in thickness is due to the sequential layering of the metal layer 7 from the surface of the matrix 10 and the primary electrodeposition layer 15, and the bonding Only when the height dimension of layer 19 exceeds the frame 3 does the frame 3 become the matrix 10 and the primary electrodeposited layer 15 This is because electrical conductivity is established, and the formation of the metal layer 7 on the surface of the frame 3 begins.

[0074] Once the formation of the metal layer 7 is complete, the final step is to create a single primary electrodeposited layer 15 from the mold 10. Remove the frame 3 and the metal layer 7 (see Figure 11(C)). Furthermore, the lower side of the frame 3 The primary electrodeposition layer 15a is removed together with the adhesive layer 19, and then the secondary pattern resist 18 is removed. This completes the manufacturing of the vapor deposition mask 1. Note that the adhesive layer 19 remains on the lower side of the frame 3. If present, it will be removed when the secondary pattern resist 18 is removed.

[0075] Thus, the vapor deposition mask according to this embodiment cuts the minimum width portion of the inner frame portion 5 of the frame 3. The surface shape is designed so that the relationship between its width and thickness is appropriate, thereby maximizing the bending rigidity at the minimum width. By ensuring that the force is applied correctly, the mask body 2 is given sufficient strength against the force applied from that side. The frame 3, which is wider and stronger than the minimum width of the mask, is combined with the other parts of the frame 3 as a whole. The displacement of each part of the body from its original position is suppressed, and the mask and the substrate to be vapor-deposited in the vapor deposition process are controlled. This ensures proper alignment with the plate and allows for accurate deposition at the appropriate location on the substrate to be deposited. Due to the resistance to bending deformation in the narrow section, the deflection caused by the weight of the minimum width section is also suppressed, and the frame 3 changes This minimizes the impact of the shape on the mask body 2.

[0076] In the vapor deposition mask according to the above embodiment, the mask body 2 is located in each opening area of ​​the frame 3. A pattern-forming region 2a is positioned at 6 and has numerous deposition holes 8 within it. Although the configuration is formed by placing only one in the section, it is not limited to this, as shown in Figure 12. The mask body 2 may also be configured to have multiple pattern-forming regions 2a. In addition, in order to reliably prevent misalignment of the mask body 2, the width of each part of the frame surrounding the mask body is set as follows: It is desirable to form the minimum width larger than the allowable width dimension to ensure sufficient rigidity. In addition, the configuration can be changed to one mask body 2 located in each opening area 6 of the frame 3. Alternatively, a configuration may be adopted in which multiple mask bodies 2 are arranged side by side in a single opening area 6. In this case, the outer edge of the mask body 2 is adjacent to the frame body 3 and to the parts adjacent to each other. Although it is divided into two parts, in the parts where the mask bodies are adjacent to each other, the mask body 2 and the frame body 3 are Similar to those joined as a single unit, the mask bodies are joined together by a metal layer formed by plating. They will be joined together.

[0077] Furthermore, in the deposition mask according to the above embodiment, the frame 3 is a first frame member 3a of the same shape. The structure is formed by joining and integrating the second frame member 3b, but it is not limited to this. Instead, the shapes of the first frame member 3a and the second frame member 3b are made different, for example, as shown in Figure 13. The opening of the second frame member 3b on the side closer to the mask body 2, and the opening on the side further away from the mask body 2 The opening of the first frame member 3a is made larger, and the width of each part of the second frame member 3b The first frame member 3a is formed to be larger than the second frame member 3b, and the first frame member 3a and the second frame member 3b are joined together. It is also possible to configure it to form a frame 3 by integrating the parts. In this case, the opening area 6 of the frame 3 is The part furthest from the main body 2 expands, and the peripheral portion surrounding the opening area 6 recedes. As a result, during the vapor deposition process, the vapor is deposited through the opening region 6 of the frame 3 and the vapor deposition holes 8 of the mask body 2. The peripheral portion around the opening region 6 of the frame 3 is deposited onto the substrate to be deposited. It is less likely to become an obstacle that hinders the material's progress, and the influence of the frame 3 on each deposition through-hole 8 is eliminated, thus protecting the deposition material. This allows the material to proceed without problems, enabling more appropriate deposition.

[0078] Furthermore, in the manufacturing of the deposition mask according to the above embodiment, the primary electrodeposition layer 15 and the frame 3 A metal layer 7 is formed so as to be in contact with the frame 3, and the metal layer 7 is used to integrate the primary electrodeposited layer 15 and the frame 3. Although this is the case, it is not limited to this, but if the frame 3 is subjected to the lower primary electrodeposition layer 15, the uncured fill The primary electrodeposition layer 15 and the frame 3 are bonded together by placing them with an adhesive stronger than the resist in between. It can also be configured to integrate the primary electrodeposition layer, i.e., the mask body 2 and the frame 3. This simplifies the integration process and improves the efficiency of mask manufacturing. In this case, furthermore, the mask By forming a metal layer so as to cover the surface of the main body 2 and the surface of the frame 3, the mask body 2 and frame The bonding state of 3 can be made more favorable. In particular, the surface (side) of the adhesive can be covered with a metal layer. This effectively prevents deterioration of the adhesive caused by washing or heating, and the mask body The connection between part 2 and frame 3 can be maintained over a long period of time.

[0079] Furthermore, in the manufacturing of the vapor deposition mask according to the above embodiment, the frame 3 is placed on the master mold 10. Afterward, a metal layer 7 is formed on the surface of the frame 3, but this is not limited to this method; metal plating is also used. Before forming layer 7, a resist is placed on part or all of the upper surface of the frame, and the metal layer 7 is placed on the frame. Instead of forming it across the entire surface, the metal layer 7 is provided only on a portion of the upper surface of the frame, or omitted in areas where it is not needed. It is also possible to create a configuration in which a stress-relieving section is provided on the surface of the frame 3.

[0080] In this case, the metal layer 7 on the upper surface of the frame 3 is not uniformly continuous but becomes partial and fragmented. As a result, even if internal stress occurs in the metal layer, it will act only partially and fragmentarily on the frame 3, rather than on the entire frame 3. This design makes the frame 3 less susceptible to adverse effects such as deformation, and ensures a flat shape.

[0081] Furthermore, in the manufacturing of the deposition mask according to the above embodiment, the primary electrodeposition layer 15 is formed. Furthermore, the primary electrodeposited layer is formed without any special surface treatment, and the metal layer 7 is formed on it. However, this is not limited to this, but the stage after the primary electrodeposition layer 15 is formed and before the metal layer 7 is formed, Acid immersion or electrolytic treatment, etc., are applied to a predetermined area in the electrodeposited layer 15 where the metal layers are to be layered. It is also possible to perform an activation treatment on it.

[0082] In this case, compared to the untreated case, the activated portion of the primary electrodeposited layer 15 and the metal layer above it are different. This will significantly improve the bonding strength between 7 and 7. Also, instead of activation treatment, A thin layer of strike nickel, matte nickel, or the like is formed over a predetermined area of ​​the secondary electrodeposited layer 15. This may also be done. This also ensures contact between the thin layer forming portion of the primary electrodeposited layer 15 and the metal layer 7 above it. This can improve the overall strength.

[0083] Furthermore, in the manufacturing of the vapor deposition mask according to the above embodiment, the primary electrodeposition layer 15 and the frame 3 and gold The area where the subordinate layer 7 overlaps is simply configured to be in contact with the planes, but in addition, the primary power Over the entire circumference of the outer edge 2b of the pattern formation region 2a in the deposition layer 15 (mask body 2) Numerous through holes or recesses are provided to form the metal layer 7 on the outer peripheral edge 2b of the primary electrodeposited layer 15. Therefore, the through-hole or recess is filled, and the metal layer 7 is formed to partially penetrate the outer edge 2b. It is also possible to configure it in this way.

[0084] In this case, the metal layer 7 is relative to the primary electrodeposited layer 15, and the outer edge 2b of the pattern formation region 2a In addition to the upper surface, it is present in each through hole or recess of the outer peripheral edge 2b, and the outer peripheral edge 2 of the primary electrodeposited layer 15 The bonding strength with b is increased. This allows the bond to the mask body 2 through the metal layer 7. This allows the frame 3 and the mask body 2 to be more firmly connected and integrated, and the relationship between the frame 3 and the mask body 2 is improved. This reliably suppresses easy detachment and misalignment, further improving the deposition accuracy and the reproducibility of the deposited product. Improvement is possible.

[0085] Furthermore, in the manufacturing of the vapor deposition mask according to the above embodiment, the primary pattern resistivity of the master mold 10 The structure of the primary electrodeposited layer 15, which forms the mask body 2, is formed on the surface not covered by 14. Although not described in detail, this primary electrodeposition layer 15 is formed on the matrix 10 side, resulting in a matte finish. The structure consists of two layers: a nickel layer and a bright nickel layer formed on top of this matte nickel layer. It is also possible. Specifically, on the surface of the matrix 10 that is not covered with the primary pattern resist 14. After forming an electrodeposited layer made of matte nickel by electroforming, a bright nickel layer is placed on top of it. An electrodeposited layer is formed by electroforming to become the primary electrodeposited layer 15. The relationship between the thickness of the glossy nickel layer and the matte nickel layer is that if the matte nickel layer is made too thick, the finished mask will be affected. The tension generated in the main body 2 may become excessively large, potentially causing deformation of the frame 3. The ratio of the thickness of the glossy nickel layer to the thickness of the matte nickel layer should be approximately 5 / 7. preferable.

[0086] The formation order of the matte nickel layer and the glossy nickel layer is reversed, and the matte layer is applied to the glossy nickel layer. It is also possible to have a two-layer structure with a nickel layer formed thereon. However, this latter bright nickel layer In the case of a two-layer structure with a matte nickel layer on top, the probability of delamination is lower than that of the former two-layer structure. Since it is thought that the former will be higher than the former, a matte nickel layer on a bright nickel layer It is preferable to adopt a two-layer structure with layers.

[0087] Thus, a two-layer structure is formed in which a glossy nickel layer is placed on top of a matte nickel layer. Furthermore, by making the matte nickel layer moderately thicker than the glossy nickel layer, the finished mask body In step 2, the tension (tensile stress) that causes inward contraction can be increased, and heat A heat-resistant vapor deposition mask 1 that does not deform even when affected by the expansion of various parts. You can obtain this.

[0088] Furthermore, if the primary electrodeposition layer is formed using only matte nickel, the following will occur in the completed mask body 2. In addition to the risk of excessive tension becoming too large and causing deformation of frame 3, this primary power Because the surface of the matte nickel layer forming the deposition layer is rough, the bonding force to the surface, such as plating, is As the size increases, problems arise such as the inability to separate the primary electrodeposited layer 15a and the metal layer 7 during the mask manufacturing process. This is likely to occur. Primary electrodeposition of a two-layer structure in which a glossy nickel layer is formed on the matte nickel layer described above. The layer can also avoid these problems. A glossy nickel layer is formed on top of this matte nickel layer. In a two-layer structure, the bonding strength in the bright nickel layer of the primary electrodeposited layer is greater than that in the matte nickel layer. As the size decreases, the primary electrodeposited layer 15 and the metal layer 7 become easier to separate, but the primary electrodeposited layer Formation of through-pores, activation treatment, or formation of thin layers of strike nickel or matte nickel, etc. This ensures sufficient bonding strength with the metal layer. [Explanation of Symbols]

[0089] 1. Evaporation mask 2. Mask body 2a Pattern formation region 2b Outer edge 3 Frame 3a First frame member 3b Second frame member 3c adhesive layer 4. Outer frame 5. Inner frame section 6 Opening area 7 metal layer 8 Vapor deposition hole 9 Evaporation Patterns 10 Maternal blood type 11 Resist layer 12 Mask film 12a Transparent hole 14 Primary Pattern Resist 15, 15a Primary electrodeposition layer 16 Resist Layers 16a, 16b resist layer 17 Mask film 17a Transparent hole 18 Secondary pattern resist 19 Adhesive layer

Claims

1. A vapor deposition mask comprising a mask body having a vapor deposition pattern consisting of numerous independent vapor deposition holes, and a frame used to reinforce the mask body, The mask body has a multilayer structure of two or more layers, consisting of a glossy nickel layer and a matte nickel layer. The frame is formed such that the cross-sectional shape of the minimum width portion is such that the ratio of the thickness dimension to the width dimension is 0.8 / 4 or more and 2 / 4 or less. A distinctive vapor deposition mask.

2. The mask body has a two-layer structure in which the glossy nickel layer is formed on the matte nickel layer. The vapor deposition mask described in claim 1, characterized by its features.

3. The matte nickel layer is thicker than the bright nickel layer. A vapor deposition mask as described in claim 1 or 2.

4. The ratio of the thickness of the bright nickel layer to the matte nickel layer is 5 / 7. A vapor deposition mask as described in any one of claims 1 to 3.

5. The frame is formed of a material having a coefficient of thermal expansion equivalent to or lower than that of the substrate to be deposited. A vapor deposition mask as described in any one of claims 1 to 4.

6. The frame has a rectangular outer frame portion located on the outermost periphery and an inner frame portion that divides the inside of the outer frame portion into a plurality of opening regions. A vapor deposition mask as described in any one of claims 1 to 5.

7. The cross-sectional shape of the narrowest part of the inner frame in the thickness direction of the frame body is such that, within the range of a thickness of 0.8 mm to 2 mm and a width of 4 mm to 90 mm, the ratio of the thickness dimension to the width dimension is 0.8 / 4 to 2 / 4. The vapor deposition mask described in claim 6, characterized by its features.

8. In the thickness direction of the frame, the cross-sectional shape of the outer frame portion and the inner frame portion, excluding the narrowest portion, has a ratio of thickness dimension to width dimension of 0.8 / 90 or more. A vapor deposition mask as described in claim 6 or 7.

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