In-cell touch display panel

Abstract

The present disclosure relates to an in-cell touch display panel.SOLUTION: According to an aspect of the present disclosure, there is provided an in-cell touch display panel including a first common electrode connected to N * M first pixels disposed in a display area, a second common electrode connected to N * M second pixels disposed in the display area, and a first pixel driver disposed in the display area to write pixel data to the first pixels and the second pixels and supply voltages to the first common electrode and the second common electrode, where N and M are each a positive integer of 2 or more.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] This application claims priority and benefits of Korean Patent Application No. 10-2024-0099484, filed on 26 July 2024, the entirety of which is incorporated into this invention.

[0002] The present invention relates to, but is not limited to, display panels, particularly in-cell touch display panels. [Background technology]

[0003] Display devices are applied to a variety of electronic devices such as televisions, mobile phones, video phones, smartwatches, watch phones, wearable devices, foldable devices, portable multimedia players (PMPs), personal digital assistants (PDAs), laptops, and tablets.

[0004] Display devices include organic light-emitting displays (OLEDs) that emit light themselves, as well as liquid crystal displays (LCDs), plasma display panels (PDPs), electroluminescent displays, electro-humidifying displays, electrophoretic displays (EPDs), stretchable displays, and flexible displays, which require a separate light source.

[0005] Recently, display devices containing inorganic light-emitting diodes (LEDs) have been attracting attention as next-generation display devices. Because inorganic light-emitting diodes are made of inorganic materials rather than organic materials, they have a faster illumination speed and superior luminous efficiency compared to liquid crystal displays and organic light-emitting displays, and can display high-brightness images. [Overview of the project] [Problems that the invention aims to solve]

[0006] The problem to be solved by the embodiments of the present invention is to provide an in-cell touch display panel in which the thickness of the display panel has been reduced.

[0007] The problem to be solved by the embodiments of the present invention is to provide an in-cell touch display panel in which the accuracy of touch sensing is increased and the time required for touch sensing is reduced.

[0008] The problems to be solved by the embodiments of the present invention are not limited to those mentioned above, and further problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0009] An in-cell touch display panel according to an embodiment of the present invention may include a first common electrode connected to N*M (where N and M are positive integers of 2 or more) first pixels arranged within a display area, a second common electrode connected to N*M second pixels arranged within the display area, and a first pixel driver arranged within the display area that writes pixel data to the first and second pixels and supplies voltage to the first and second common electrodes.

[0010] An in-cell touch display device according to an embodiment of the present invention includes a plurality of touch units, each including a plurality of pixels and a plurality of touch groups, and a pixel driver, arranged within a display area for displaying an image. The plurality of touch groups include a first touch group, each including a first common electrode connected to a first pixel of the touch unit among the plurality of pixels, and a second touch group, each including a second common electrode connected to a second pixel of the touch unit but not to the first pixel of the touch unit. The pixel driver outputs a touch drive signal to the first common electrode located in the first touch group of each of the plurality of touch units during the first touch period, and also outputs a common voltage to the second common electrode of the second touch group located in each of the plurality of touch units during the first touch period, so that the second pixel of each of the plurality of touch units displays an image during the first touch period.

[0011] Specific details of various examples of the present invention other than the means of solving the problems mentioned above are included in the following description and drawings.

[0012] According to the present invention, by using a common electrode as the touch electrode necessary for touch sensing in an in-cell touch display panel, the thickness of the panel can be reduced.

[0013] According to the present invention, in touch sensing of an in-cell touch display panel, the accuracy of sensing can be increased and the time required for sensing can be shortened by subdividing the touch group and sensing period.

[0014] The effects of the present invention are not limited to those mentioned above, and any further effects not mentioned will be clearly understood by a person with ordinary skill in the art to which the technical concept of the present invention pertains, based on the following description. [Brief explanation of the drawing]

[0015] The above objects, other objects, features, and advantages of the present invention will become more apparent to those skilled in the art by describing exemplary embodiments of the present invention in detail with reference to the accompanying drawings: [Figure 1] It is an exploded perspective view of a display device according to an embodiment of the present invention. [Figure 2] It is a plan view showing a display device according to an embodiment of the present invention. [Figure 3] It is an enlarged view showing a display device according to an embodiment of the present invention. [Figure 4] It is a diagram showing a circuit structure according to an embodiment of the present invention. [Figure 5] It is a diagram showing a plurality of touch blocks arranged in an in-cell touch display panel according to an embodiment of the present invention. [Figure 6] It is a diagram showing a driving method of an in-cell touch display panel according to an embodiment of the present invention. [Figure 7a] It is a diagram showing a driving method of an in-cell touch display panel according to an embodiment of the present invention. [Figure 7b] It is a diagram showing a driving method of an in-cell touch display panel according to an embodiment of the present invention. [Figure 7c] It is a diagram showing a driving method of an in-cell touch display panel according to an embodiment of the present invention. [Figure 7d] It is a diagram showing a driving method of an in-cell touch display panel according to an embodiment of the present invention. [Figure 7e] It is a diagram showing a driving method of an in-cell touch display panel according to an embodiment of the present invention. [Figure 8] It is an enlarged view of a touch group according to an embodiment of the present invention. [Figure 9] It is an enlarged view of a pixel arranged in a touch group according to an embodiment of the present invention. [Figure 10] It is an enlarged view of a touch group according to another embodiment of the present invention. [Figure 11] It is a cross-sectional view taken along the line I-I' of FIG. 3. [Figure 12] It is a cross-sectional view showing a sub-pixel including a light-emitting element arranged in a display area according to an embodiment of the present invention. [Figure 13] This figure shows an apparatus to which a display device according to an embodiment of the present invention is applied. [Figure 14] This figure shows an apparatus to which a display device according to an embodiment of the present invention is applied. [Figure 15] This figure shows an apparatus to which a display device according to an embodiment of the present invention is applied. [Figure 16] This figure shows an apparatus to which a display device according to an embodiment of the present invention is applied. [Modes for carrying out the invention]

[0016] The advantages and features of the present invention, as well as methods for achieving them, will become clearer with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and can be embodied in a variety of different forms, and these embodiments are provided merely to complete the disclosure of the present invention and to fully inform those who are ordinary skill in the art to which the invention pertains.

[0017] The shapes, sizes, proportions, angles, numbers, etc., disclosed in the drawings illustrating embodiments of the present invention are illustrative, and the present invention is not limited to what is shown in the drawings. Throughout the specification, the same reference numerals refer to the same components. Furthermore, in describing the present invention, if a specific description of related prior art is deemed to unnecessarily obscure the gist of the invention, such detailed description is omitted. Where words such as "includes," "has," or "consists of" are used in this specification, other parts may be added unless "only" or "only" is used. When a component is expressed singly, it may include multiple components unless otherwise explicitly stated.

[0018] When interpreting the components, even if there is no separate explicit mention of the margin of error, it shall be interpreted as including the margin of error.

[0019] When describing a spatial relationship, for example, using phrases like "on top of," "above," "below," "next to," or "adjacent," unless words like "immediately," "directly," or "near" are used, it is possible for one or more other parts to be located between the two parts.

[0020] When describing temporal relationships, if a temporal sequence is described using words like "after," "following," "next," or "before," then, as long as "immediately" or "directly" are not used, it can also include cases that are not continuous.

[0021] While terms such as "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are simply used to distinguish one component from others. Therefore, the first component mentioned below may also be the second component within the technical concept of the present invention.

[0022] In describing the components of the present invention, terms such as First, Second, A, B, (a), or (b) may be used. Such terms are used solely to distinguish a component from other components, and do not limit the nature, order, sequence, or number of the component.

[0023] When it is stated that one component is “connected,” “joined,” “attached,” or “attached,” or “mounted,” it should be understood that while that component can be directly connected, joined, attached, or mounted to that other component, other components can also be interposed between components that can be indirectly connected, joined, attached, or mounted, unless otherwise explicitly stated.

[0024] When it is stated that a component or layer "contacts" or "overlaps" with another component or layer, it should be understood that while the component or layer may directly contact or overlap with other components or layers, other components may also be interposed between each component that can indirectly contact or overlap, unless otherwise explicitly stated.

[0025] "At least one" should be understood to include all combinations of one or more of the relevant components. For example, "at least one of the first, second, and third components" can be interpreted as including not only the first, second, or third component alone, but also all combinations of two or more of the first, second, and third components.

[0026] The terms "first direction," "second direction," "third direction," "X-axis direction," "Y-axis direction," and "Z-axis direction" should not be interpreted solely as geometric relationships where the relationships between them are perpendicular, but rather can mean that there are broader directions within the range in which the configuration of the present invention can function.

[0027] The features of each of the various embodiments of the present invention can be partially or entirely combined or combined with one another, enabling various technically interconnected and driven configurations, and each embodiment can be implemented independently of the others or together in a related manner.

[0028] Various embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0029] Figure 1 is an exploded perspective view of a display device according to an embodiment of the present invention. Figure 2 is a plan view showing a display device according to an embodiment of the present invention. Figure 3 is an enlarged view showing a display device according to an embodiment of the present invention.

[0030] Referring to Figures 1 to 3, the display device 1000 according to an embodiment of the present invention may include, but is not limited to, a display panel 100, a polarizing layer 293, an adhesive layer 295, a cover member 120, a support substrate 110, a flexible circuit board CB, and a printed circuit board 160. For example, one or more of the components or layers described above may be omitted or integrated, or each may include one or more subordinate components or layers. Alternatively, the display device 1000 may include more or fewer components or layers than those described.

[0031] For example, the display device 1000 may include a substrate 110. The substrate 110 may be a member that supports other components of the display device 1000. The substrate 110 may be made of an insulating material. For example, the substrate 110 may be made of glass or resin. The substrate 110 may also be made of a flexible material. For example, the substrate 110 may be made of a flexible plastic material such as polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES), cyclic olefin copolymer (COC), triacetylcellulose (TAC) film, polyvinyl alcohol (PVA), or polystyrene (PS). However, the embodiments of the present invention are not limited thereto.

[0032] The display panel 100 can embody information, images, and / or visuals provided to the user. For example, the display panel 100 may include a display area AA and a non-display area NA. For example, the substrate 110 may include a display area AA and a non-display area NA. The display area AA and non-display area NA are not limited to the substrate 110, but may be described in relation to the display device 1000 in general.

[0033] The display area AA may be the area where the image is displayed. The non-display area NA may be outside the display area AA (for example, the area around the display area AA, or the area that completely or partially surrounds the display area AA), and may also be referred to as the edge area or bezel area. The non-display area NA may include multiple adjacent or separate non-display areas. The display area AA may include multiple pixels PX. Each of the multiple pixels PX may consist of multiple subpixels (for example, two, three, or more). Each of the multiple subpixels may have multiple light-emitting elements. The multiple light-emitting elements may be configured differently depending on the type of display device 1000. For example, if the display device 1000 is an inorganic light-emitting display device, the inorganic light-emitting elements may be LEDs (Light-emitting Diodes), Micro LEDs (Micro Light-emitting Diodes), or Mini LEDs (Mini Light-emitting Diodes), but embodiments of the present invention are not limited thereto.

[0034] The non-display area NA may be an area where no information, image, or video is displayed. Various wiring and circuits for driving multiple pixels PX of the display area AA may be arranged in the non-display area NA. For example, various wiring and drive circuits may be mounted in the non-display area NA, and a pad portion PAD to which integrated circuits and printed circuits are connected may be arranged, but the embodiments of the present invention are not limited thereto.

[0035] For example, the drive circuit may be a data drive circuit and / or a gate drive circuit and / or a touch-sensing drive circuit, but embodiments of the present invention are not limited thereto. Wiring that supplies control signals for controlling the drive circuit may be arranged on the display panel 100. For example, the control signals may include various timing signals, including a clock signal, an input data enable signal and a synchronization signal such as a horizontal synchronization signal or a vertical synchronization signal, but embodiments of the present invention are not limited thereto. The control signals may be received through a pad section PAD and / or wiring and / or layers. For example, link wiring LL for transmitting signals may be arranged in a non-display area NA. For example, drive components such as a flexible circuit board CB and a printed circuit board 160 may be connected to the pad section PAD.

[0036] According to the present invention, the non-display area NA may include a first non-display area NA1, a bending area BA, and a second non-display area NA2. For example, the first non-display area NA1 may be an area surrounding at least a portion of the display area AA. The bending area BA is an area extending from at least one of the multiple sides of the first non-display area NA1 and may be a bendable area. The second non-display area NA2 is an area extending from the bending area BA in the opposite direction to the first non-display area NA1, and a pad portion PAD may be placed thereon. For example, the bending area BA may be in a bent state, and the remaining area of ​​the substrate 110 excluding the bending area BA may be in a flat state. In this case, by bending the bending area BA, the second non-display area NA2 can be positioned on the back surface of the display area AA. However, embodiments of the present invention are not limited thereto.

[0037] The display area AA of the substrate 110 or the display device 1000 can be configured in various shapes depending on the design of the display device 1000. For example, the display area AA may be configured in a rectangular shape with rounded corners, but embodiments of the present invention are not limited to this. To give other examples, the display area AA may be configured in a rectangular shape with right angles at its corners, or in a circular shape, elliptic shape, ellipsoidal shape, polygonal shape (e.g., hexagon), but embodiments of the present invention are not limited to these.

[0038] According to the present invention, the width of the second non-display area NA2, where multiple pad electrodes PE are arranged, may be wider than the width of the bending area BA, where only multiple link wirings LL are arranged. Similarly, the width of the display area AA, where multiple subpixels are arranged, may be wider than the width of the bending area BA, where only multiple link wirings LL are arranged. In the drawings, the width of the bending area BA is shown as being narrower than the width of other areas of the substrate 110, but the shape of the substrate 110 including the bending area BA is illustrative, and embodiments of the present invention are not limited thereto.

[0039] Referring to Figure 3, multiple pixel driver circuits PD can be arranged in display area AA. These multiple pixel driver circuits PD may be circuits for driving multiple sub-pixel light-emitting elements. Each pixel driver circuit PD can drive at least one sub-pixel light-emitting element. Each of the multiple pixel driver circuits PD includes multiple transistors, including a drive transistor, and a storage capacitor, and can supply control signals, power (e.g., high potential voltage, low potential voltage), and drive current to the multiple sub-pixel light-emitting elements to control the light-emitting operation of the multiple light-emitting elements. For example, a pixel driver circuit PD may include power supply wiring and signal wiring for controlling the on / off and / or light-emitting time of the light-emitting elements. For example, multiple pixel driver PDs may be drive drivers manufactured on a semiconductor substrate using the manufacturing process of MOSFETs (Metal-oxide-silicon field effect transistors). In the embodiments of the present invention, the case where the pixel driver circuit PD is a pixel driver PD has been described as an example, but the embodiments of the present invention are not limited thereto. A drive driver includes multiple pixel driver circuits PDs and can drive multiple sub-pixels.

[0040] Referring together with Figure 1, a flexible circuit board CB and a printed circuit board 160 may be arranged at the bottom of the display panel 100. The flexible circuit board CB and the printed circuit board 160 may be arranged at least on one side edge of the display panel 100, but embodiments of the present invention are not limited thereto. One side of the flexible circuit board CB may be attached to the display panel 100 and the other side to the printed circuit board 160, but embodiments of the present invention are not limited thereto. The flexible circuit board CB may be a flexible film, but embodiments of the present invention are not limited thereto. For example, the flexible circuit board CB may be a flexible flat cable (FFC) or a flexible printed circuit board (FPC).

[0041] A pad section PAD containing multiple pad electrodes PE may be arranged in the second non-display area NA2. One or more flexible circuit boards (or flexible films) CB and / or drive components including a printed circuit board 160 may be attached to or bonded to the pad section PAD. The multiple pad electrodes PE of the pad section PAD are electrically connected to one or more flexible circuit boards (or flexible films) CB, and various signals (or power, or voltage, or current) from the printed circuit board 160 and the flexible circuit boards (or flexible films) CB can be transmitted to multiple pixel drivers PD in the display area AA.

[0042] A flexible circuit board (or flexible film) CB may be a film in which various components are arranged on a flexible base film. For example, a flexible circuit board (or flexible film) CB may have drive ICs such as a gate driver IC, a data driver IC, or a touch-sensing driver IC, but embodiments of the present invention are not limited to these. The drive IC may be a component that processes data and drive signals for displaying an image. Depending on the mounting method, the drive IC may be arranged in a chip-on-glass (COG), chip-on-film (COF), chip-on-plastic (COP), chip-on-plate (COP), or tape carrier package (TCP), but embodiments of the present invention are not limited to these. The flexible circuit board (or flexible film) CB may be attached to or bonded onto a plurality of pad electrodes PE through a conductive adhesive layer, but embodiments of the present invention are not limited to these.

[0043] The printed circuit board 160 may be a component that is electrically connected to one or more flexible circuit boards (or flexible films) CB and supplies signals to a drive IC. The printed circuit board 160 may be arranged on one side of the flexible circuit board (or flexible film) CB and electrically connected to the flexible circuit board (or flexible film) CB. Various components for supplying various signals (or power, voltage, current) to the drive IC may be arranged on the printed circuit board 160. For example, various components such as a timing controller, power supply unit, memory, or processor may be arranged on the printed circuit board 160. For example, the printed circuit board 160 may include a power management integrated circuit (PMIC), but the embodiments of the present invention are not limited thereto.

[0044] The printed circuit board 160 may include at least one hole 180, but embodiments of the present invention are not limited thereto. Internal components that sense ambient light, temperature, or humidity, which can be supplied to multiple sensors, may be arranged in the area corresponding to at least one hole 180. The sensors may be superimposed on or placed in the hole 180. For example, the internal components may include an ambient light sensor (ALS), a temperature sensor, or a humidity sensor, but embodiments of the present invention are not limited thereto. For example, the hole 180 may be a transparent hole, but embodiments of the present invention are not limited thereto.

[0045] Referring to Figure 1, the polarizing layer 293 can be placed on the display panel 100. The polarizing layer 293 can prevent or reduce light generated from an external light source from entering the interior of the display panel 100 and affecting the light-emitting elements, etc.

[0046] The cover member 120 may be placed on the polarizing layer 293. The cover member 120 may be a member for protecting the display panel 100. An adhesive layer 295 may be placed between the polarizing layer 293 and the cover member 120. The cover member 120 can be attached to the display panel 100 by the adhesive layer 295. The adhesive layer 295 may include optically clear adhesive (OCA), optically clear resin (OCR), or pressure sensitive adhesive (PSA), silicone resin, epoxy resin, UV curing resin, polyimide resin, acrylate resin, polyurethane resin, and polydimethylsiloxane (PDMS), but the embodiments of the present invention are not limited thereto.

[0047] A support substrate 110 may be placed between the display panel 100 and the printed circuit board 160. The support substrate 110 can reinforce the rigidity of the display panel 100. The support substrate 110 may be a backplate, but embodiments of the present invention are not limited thereto.

[0048] Multiple link wirings LL may be arranged in the non-display area NA. These multiple link wirings LL may be wiring that transmits various signals (or power, voltage, current) from one or more flexible circuit boards (or flexible films) CB and / or printed circuit boards 160 to the display area AA. The multiple link wirings LL may extend from multiple pad electrodes PE in the second non-display area NA2 toward the bending area BA and the first non-display area NA1 and be electrically connected to multiple drive wirings VL in the display area AA. Multiple pixel drivers PD may be driven by signals (or power, voltage, current) supplied from one or more flexible circuit boards (or flexible films) CB and / or printed circuit boards 160 through the drive wirings VL in the display area AA and the link wirings LL in the non-display area NA.

[0049] For example, multiple drive wirings VL, along with multiple link wirings LL, may be wiring for transmitting signals output from a flexible circuit board (or flexible film) CB and / or printed circuit board 160 to multiple pixel driver PDs. Multiple drive wirings VL may be arranged in the display area AA and electrically connected to each of the multiple pixel driver PDs. Multiple drive wirings VL may extend from the display area AA toward the non-display area NA and be electrically connected to multiple link wirings LL. Thus, signals (or power, voltage, current) output from the flexible circuit board (or flexible film) CB and / or printed circuit board 160 can be transmitted to each of the multiple pixel driver PDs through the multiple link wirings LL and multiple drive wirings VL.

[0050] When the bending region BA is bent, a portion of the multiple link wirings LL may also be bent. Stress may concentrate on the bent portion of the link wirings LL, which may cause cracks to form in the link wirings LL. Therefore, multiple link wirings LL may be made of a highly flexible conductive material to reduce cracking during bending of the bending region BA. For example, multiple link wirings LL may be made of a highly flexible conductive material such as gold (Au), silver (Ag), copper (Cu), or aluminum (Al), but the embodiments of the present invention are not limited to these. Furthermore, multiple link wirings LL may also be made of one of the various conductive materials used in the display region AA. For example, multiple link wirings LL may be made of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), gold (Au), aluminum (Al), neodymium (Nd), copper (Cu), and an alloy of silver (Ag) and magnesium (Mg), or alloys thereof, but the embodiments of the present invention are not limited to these. Multiple link wirings LL can be composed of a multilayer structure containing various conductive materials. For example, multiple link wirings LL can be composed of a triple-layer structure such as titanium (Ti) / aluminum (Al) / titanium (Ti) or aluminum (Al) / molybdenum titanium (MoTi) / aluminum (Al), but the embodiments of the present invention are not limited thereto.

[0051] Multiple link wirings LL can be configured in various shapes to reduce stress. At least a portion of the multiple link wirings LL arranged on the bending region BA can extend in the same direction as the extension direction of the bending region BA, or in a different direction from the extension direction of the bending region BA to reduce stress. For example, if the bending region BA extends in one direction from the first non-display region NA1 to the second non-display region NA2, at least a portion of the link wirings LL arranged on the bending region BA can extend in a direction inclined from that direction. To give another example, at least a portion of the multiple link wirings LL can be configured in various shapes. For example, at least a portion of the multiple link wirings LL arranged on the bending region BA may be a shape in which conductive patterns having at least one shape from diamond, rhombus, trapezoidal wave, stripe shape, zigzag shape, triangular wave, sawtooth wave, sinusoidal wave, circular shape, and omega (Ω) shape are repeatedly arranged, but embodiments of the present invention are not limited to these. Therefore, in order to minimize or reduce the stress concentrated in the multiple link wirings LL and the resulting cracks, the shapes of the multiple link wirings LL can be various shapes, including the shapes described above, but the embodiments of the present invention are not limited thereto.

[0052] Figure 4 shows a circuit structure according to an embodiment of the present invention.

[0053] Referring to Figure 4, an example is shown where one light-emitting element (ED) is connected to a microdriver (μDriver), but this is not the only example. For example, eight light-emitting elements (EDs) may be connected to one microdriver (μDriver). In other examples, sixteen light-emitting elements (EDs) may be connected to one microdriver (μDriver), or 32 or 64 light-emitting elements (EDs) may be connected to one microdriver (μDriver) simultaneously. The light-emitting elements (EDs) may be micro-light-emitting elements (μLEDs).

[0054] One microdriver μDriver drives the T transistor DR and light-emitting transistor TEM may be included, but the embodiments of the present invention are not limited thereto.

[0055] For example, for the driving transistor T DR a high-potential power supply voltage VDD is applied to the first electrode, the first electrode of the light-emitting transistor T EM is connected, and a scan signal SC may be applied to the gate electrode. The scan signal SC applied to the gate electrode of the driving transistor T DR is a direct current (DC) power supply, and a fixed reference voltage Vref may be applied every frame or every sub-frame, but the embodiments of the present invention are not limited thereto. Alternatively, depending on the type of the driving transistor, a low-potential power supply may be applied to the first electrode of the driving transistor.

[0056] The light-emitting transistor T EM has the second electrode of the driving transistor T DR connected to its first electrode, a light-emitting element ED is connected to the second electrode, and a light-emitting signal EM may be applied to the gate electrode. The light-emitting signal EM applied to the gate electrode of the light-emitting transistor T EM may be a pulse width modulation (PWM) signal that varies every frame, but the embodiments of the present invention are not limited thereto. Alternatively, the light-emitting signal EM applied to the gate electrode of the light-emitting transistor T EM may also be a pulse width modulation signal that changes every sub-frame, and the embodiments of the present invention are not limited thereto.

[0057] The first electrode of the light-emitting element ED is connected to the second electrode of the light-emitting transistor T EM and the second electrode of the light-emitting element ED may be connected to the ground. For example, the first electrode of the light-emitting element ED may be an anode electrode, and the second electrode of the light-emitting element ED may be a cathode electrode, but the embodiments of the present invention are not limited thereto. Alternatively, the first electrode CE1 may be a negative electrode, and the second electrode CE2 may be a positive electrode.

[0058] The driving transistor T DR and the light-emitting transistor T EMThese can be either n-type transistors or p-type transistors, respectively.

[0059] The microdriver μDriver is driven by the scan signal SC applied from the timing controller T-CON, which drives the transistor T DR When the light-emitting transistor T is turned on, the light-emitting signal EM is activated. EM This can turn on the drive transistor T. DR The high-potential power supply voltage VDD applied to the first electrode drives the drive transistor T DR and light-emitting transistor T EM By applying the light-emitting element ED via this, the light-emitting element ED can emit light.

[0060] Figure 5 shows a plurality of touch blocks arranged in an in-cell touch display panel according to an embodiment of the present invention.

[0061] Referring to Figure 5, an in-cell touch display panel according to an embodiment of the present invention may include a plurality of touch units. Each touch unit may include k touch groups TG1, TG2, ..., TG(n+3) (where n is a positive integer greater than or equal to 2, for example, n may be 13, but is not limited thereto) arranged within the display area AA of the display device 1000. Here, k is an integer greater than or equal to 2, for example, k may be 4, but is not limited thereto. Each touch group TG1, TG2, ..., TG(n+3) may include n*m ​​(where m is a positive integer greater than or equal to 2, for example, n is 2 and m may be 2, but is not limited thereto) pixels PX.

[0062] A touch group TG may include a first touch group TG1, a second touch group TG2 adjacent to the first touch group TG1 in the row direction (e.g., the first direction), a third touch group TG3 adjacent to the first touch group TG1 in the column direction (e.g., the second direction), and a fourth touch group TG4 adjacent to the second touch group TG2 in the column direction. Furthermore, a touch group of a touch unit may include the nth touch group TG(n), the (n+1)th touch group TG(n+1) adjacent to the nth touch group TG(n) in the row direction, the (n+2)th touch group TG(n+2) adjacent to the nth touch group TG(n) in the column direction, and the (n+3)th touch group TG(n+3) adjacent to the (n+1)th touch group TG(n+1) in the column direction. Embodiments of the present invention are not limited thereto.

[0063] Figure 6 shows a method for driving an in-cell touch display panel according to an embodiment of the present invention. Figures 7a to 7e show a method for driving an in-cell touch display panel according to an embodiment of the present invention.

[0064] Referring to Figures 6 and 7a to 7e, an in-cell touch display panel according to an embodiment of the present invention may be arranged in an in-cell touch manner, with some of the pixel electrodes for the display and touch electrodes for touch sensing integrated together. Therefore, a touch group can, but is not limited to, driving the display for image output and the touch sensing for a time-divided period of one frame (e.g., 16.67 ms) per touch group. Depending on the number of touch groups included in the touch unit, one frame may be divided into more or fewer display periods and touch sensing periods.

[0065] The in-cell touch display panel can be driven by dividing it into display periods D1, D2, D3, and D4 and touch sensing periods T1, T2, T3, and T4 within a single frame period.

[0066] To divide the display periods D1, D2, D3, D4 from the touch sensing periods T1, T2, T3, T4, touch sensing can be arranged so that it occurs during the period excluding the period in which the display drive signal is supplied to multiple touch groups TG1, TG2, ..., TG(n+3). For example, the first touch sensing period T1 may be arranged after the first display period D1, and the second display period D2 may be arranged after the first touch sensing period T1. Embodiments of the present invention are not limited thereto.

[0067] During the first to fourth display periods D1, D2, D3, and D4, as shown in Figure 7a, the entirety of the multiple touch groups TG1, TG2, ..., TG(n+3) outputs images in response to the display drive signal and does not proceed with touch sensing.

[0068] During the first touch sensing period T1, as shown in Figure 7b, touch sensing can be driven for the first touch group TG1, the fifth touch group TG5, ..., and the nth touch group TG(n) among the multiple touch groups TG1, TG2, ..., TG(n+3). Each touch group driven during the first touch sensing period T1 is located at the same position within each touch unit. For example, during the first touch sensing period, the first touch group TG1, the fifth touch group TG5, ..., and the nth touch group TG(n) are all located at the upper left end of the quarter-plane of the touch unit. The first touch group TG1, the fifth touch group TG5, ..., and the nth touch group TG(n) can all be considered as the "first touch group" of the touch unit. During the first touch sensing period, the other touch groups, excluding the first touch group TG1, the fifth touch group TG5, ..., and the nth touch group TG(n), can have display drive signals applied and output images, similar to the display periods D1, D2, D3, and D4, but they do not sense touches. For example, during the first touch sensing period, the common electrode of the touch group displaying an image can receive a common voltage. On the other hand, the common electrode of the first touch group TG1, the fifth touch group TG5, ..., and the nth touch group TG(n) can receive touch drive signals and sense touches during the first touch sensing period.

[0069] During the second touch sensing period T2, as shown in Figure 7c, touch sensing can be performed on the second touch group TG2, the sixth touch group TG6, ..., and the (n+1)th touch group TG(n+1) among the multiple touch groups TG1, TG2, ..., TG(n+3). For example, during the second touch sensing period, the second touch group TG2, the sixth touch group TG6, ..., and the (n+1)th touch group TG(n+1) are all located at the upper right end of the quarter plane of the touch unit. The second touch group TG2, the sixth touch group TG6, ..., and the (n+1)th touch group TG(n+1) can all be considered as the "second touch group" of the touch unit. During the second touch sensing period, the other touch groups, excluding the second touch group TG2, the sixth touch group TG6, ..., and the (n+1)th touch group TG(n+1), can have a display drive signal applied and output an image, similar to the display periods D1, D2, D3, and D4, but they do not sense touch. For example, during the second touch sensing period, the common electrode of the touch group displaying an image can receive a common voltage. On the other hand, the common electrode of the second touch group TG2, the sixth touch group TG6, ..., and the (n+1)th touch group TG(n+1) can receive a touch drive signal and sense touch during the second touch sensing period.

[0070] During the third touch sensing period T3, as shown in Figure 7d, touch sensing can be performed on the third touch group TG3, the seventh touch group TG7, ..., and the (n+2)th touch group TG(n+2) among the multiple touch groups TG1, TG2, ..., TG(n+3). For example, during the third touch sensing period, the third touch group TG3, the seventh touch group TG7, ..., and the (n+2)th touch group TG(n+2) are all located at the lower left end of the quarter-plane of the touch unit. The third touch group TG3, the seventh touch group TG7, ..., and the (n+2)th touch group TG(n+2) can all be considered as the "third touch group" of the touch unit. During the third touch sensing period, the other touch groups, excluding the third touch group TG3, the seventh touch group TG7, ..., and the (n+2)th touch group TG(n+2), can have a display drive signal applied and output an image, similar to the display periods D1, D2, D3, and D4, but they do not sense touch. For example, during the third touch sensing period, the common electrode of the touch group displaying an image can receive a common voltage. On the other hand, the common electrode of the third touch group TG3, the seventh touch group TG7, ..., and the (n+2)th touch group TG(n+2) can receive a touch drive signal and sense touch during the third touch sensing period.

[0071] During the fourth touch sensing period T4, as shown in Figure 7e, touch sensing can be performed on the fourth touch group TG4, the eighth touch group TG8, ..., and the (n+3) touch group TG(n+3) among the multiple touch groups TG1, TG2, ..., TG(n+3). For example, during the fourth touch sensing period, the fourth touch group TG4, the eighth touch group TG8, ..., and the (n+3) touch group TG(n+3) are all located at the lower right end of the quarter plane of the touch unit. The fourth touch group TG4, the eighth touch group TG8, ..., and the (n+3) touch group TG(n+3) can all be considered as the "fourth touch group" of the touch unit. During the fourth touch sensing period, the touch groups other than the fourth touch group TG4, the eighth touch group TG8, ..., and the (n+3)th touch group TG(n+3) can have a display drive signal applied and output an image, similar to the display periods D1, D2, D3, and D4, but they do not sense touch. For example, during the fourth touch sensing period, the common electrode of the touch group displaying an image can receive a common voltage. On the other hand, the common electrode of the fourth touch group TG4, the eighth touch group TG8, ..., and the (n+3)th touch group TG(n+3) can receive a touch drive signal and sense touch during the fourth touch sensing period.

[0072] The above description illustrates an example in which each touch group of a touch unit is driven sequentially clockwise, starting from the upper left quarter of the touch unit, using a touch-sensitive drive device. However, embodiments of the present invention are not limited thereto. Alternatively, each touch group of a touch unit may be driven sequentially clockwise, starting from another quarter of the touch unit, using a touch-sensitive drive device. Alternatively, the touch groups of a touch unit may be driven non-sequentially or randomly, in any order, starting from any touch group on any quarter of the touch unit, until all touch groups are driven by the touch-sensitive drive device.

[0073] By dividing the touch sensing period and area within a single frame, the accuracy of touch sensing is increased, and other touch groups that are not undergoing touch sensing during the same period can display images continuously, thereby improving display quality.

[0074] Figure 8 is a magnified view of a touch group according to an embodiment of the present invention. Figure 9 is a magnified view of pixels arranged in a touch group according to an embodiment of the present invention. Figure 10 is a magnified view of a touch group according to an embodiment of the present invention.

[0075] Figures 8 and 9 show only multiple signal lines TL, multiple communication lines NL, multiple first electrodes CE1, multiple banks BNK, and multiple light-emitting elements ED, but the embodiments of the present invention are not limited thereto. Figure 10 is an enlarged plan view of Figure 8 in which multiple second electrodes CE2 are additionally arranged.

[0076] Referring to Figures 8 and 9, a first touch group TG1 located in display area AA may contain multiple pixels PX, each composed of multiple subpixels (e.g., three) (e.g., four). Each of the multiple subpixels in the first touch group TG1 includes a light-emitting element ED and can independently emit light. The multiple subpixels may be arranged in an n*m matrix in multiple rows and multiple columns, but the embodiments of the present invention are not limited thereto. Alternatively, the subpixels may be arranged in a pentile, diamond, or diamond-like configuration.

[0077] The multiple subpixels may include a first subpixel SP1, a second subpixel SP2, and a third subpixel SP3. For example, one of the first subpixel SP1, second subpixel SP2, and third subpixel SP3 may be a red subpixel, another a green subpixel, and the remaining one a blue subpixel. The types of multiple subpixels are illustrative, and the embodiments of the present invention are not limited thereto. For example, the multiple subpixels may include a different number of subpixels that emit light of different colors from different color systems, such as CMYK.

[0078] Each of the multiple pixels PX may include one or more first subpixels SP1, one or more second subpixels SP2, and one or more third subpixels SP3. For example, one pixel PX may include a pair of first subpixels SP1, a pair of second subpixels SP2, and a pair of third subpixels SP3. A pair of first subpixels SP1 may consist of a 1-1 subpixel SP1a and a 1-2 subpixel SP1b. A pair of second subpixels SP2 may consist of a 2-1 subpixel SP2a and a 2-2 subpixel SP2b. A pair of third subpixels SP3 may consist of a 3-1 subpixel SP3a and a 3-2 subpixel SP3b. For example, a single pixel PX may include the first-first subpixel SP1a and the first-second subpixel SP1b, the second-first subpixel SP2a and the second-second subpixel SP2b, and the third-first subpixel SP3a and the third-second subpixel SP3b, but the embodiments of the present invention are not limited thereto.

[0079] Multiple subpixels constituting a single pixel PX can be arranged in various ways. For example, in a single pixel PX, a pair of first subpixels SP1 may be arranged in the same column, a pair of second subpixels SP2 in the same column, and a pair of third subpixels SP3 in the same column. The first subpixels SP1, second subpixels SP2, and third subpixels SP3 may be arranged in the same row. The number and arrangement of multiple subpixels constituting a single pixel PX are exemplary, and embodiments of the present invention are not limited thereto. Alternatively, in a single pixel PX, a pair of first subpixels SP1 may be arranged in the same row, a pair of second subpixels SP2 in the same row, and a pair of third subpixels SP3 in the same row. The first subpixels SP1, second subpixels SP2, and third subpixels SP3 may be arranged in the same column.

[0080] Multiple signal lines TL may be arranged in the region between multiple subpixels. Multiple signal lines TL may extend in the column direction between multiple subpixels. Multiple signal lines TL may be lines that transmit the anode voltage from the pixel driver PD to the multiple subpixels. For example, multiple signal lines TL may be electrically connected to multiple pixel driver PDs and multiple first electrodes CE1 of multiple subpixels. The anode voltage output from the pixel driver PD can be transmitted to the multiple first electrodes CE1 of the multiple subpixels through the multiple signal lines TL. For example, the first electrode CE1 may be an electrode electrically connected to the anode electrode 134 of the light-emitting element ED (see Figure 12). Therefore, the anode voltage from the signal lines TL can be transmitted to the anode electrode 134 of the light-emitting element ED through the first electrode CE1.

[0081] Therefore, instead of forming multiple transistors and storage capacitors for each of the multiple subpixels, the structure of the display device 1000 can be simplified by using a pixel driver PD that integrates multiple pixel circuits. Furthermore, by integrating the circuits that are placed in each of the multiple subpixels into a single pixel driver PD, highly efficient, low-power driving becomes possible. Integrating the circuits that are placed in each of the multiple subpixels SP into a single pixel driver PD means that multiple pixel circuits capable of driving multiple light-emitting elements ED are included in the pixel driver PD. Multiple light-emitting elements ED can be driven by a single pixel driver PD that integrates multiple pixel circuits. For example, the first-first light-emitting element 130a, the second-first light-emitting element 140a, and the third-first light-emitting element 150a can be driven by a single pixel driver circuit PD that integrates multiple pixel circuits. For example, the first-second light-emitting element 130b, the second-second light-emitting element 140b, and the third-second light-emitting element 150b can be driven by a single pixel driver circuit PD that integrates multiple pixel circuits.

[0082] Multiple signal lines TL may include a first signal line TL1, a second signal line TL2, a third signal line TL3, a fourth signal line TL4, a fifth signal line TL5, and a sixth signal line TL6. Each of the first signal line TL1 and the second signal line TL2 may be electrically connected to each of a pair of first subpixels SP1. Each of the third signal line TL3 and the fourth signal line TL4 may be electrically connected to each of a pair of second subpixels SP2. Each of the fifth signal line TL5 and the sixth signal line TL6 may be electrically connected to each of a pair of third subpixels SP3.

[0083] A first signal wiring TL1 may be located on one side (e.g., the first side) of a pair of first subpixels SP1, and a second signal wiring TL2 may be located on the other side (e.g., the second side) of a pair of second subpixels SP2. The first signal wiring TL1 may be electrically connected to the first electrode CE1 of one of the pair of first subpixels SP1, for example, the 1-1 subpixel SP1a. The second signal wiring TL2 may be electrically connected to the first electrode CE1 of the remaining first subpixel SP1 of the pair, for example, the 1-2 subpixel SP1b.

[0084] A third signal line TL3 may be located on one side (e.g., the first side) of a pair of second subpixels SP2, and a fourth signal line TL4 may be located on the other side (e.g., the second side) of the pair of second subpixels SP2. For example, the third signal line TL3 may be located adjacent to the second signal line TL2. The third signal line TL3 may be electrically connected to the first electrode CE1 of one of the second subpixels SP2 of the pair, for example, the 2-1 subpixel SP2a. The fourth signal line TL4 may be electrically connected to the first electrode CE1 of the remaining second subpixel SP2 of the pair, for example, the 2-2 subpixel SP2b.

[0085] A fifth signal trace TL5 may be located on one side (e.g., the first side) of a pair of third subpixels SP3, and a sixth signal trace TL6 may be located on the other side (e.g., the second side) of the pair of third subpixels SP3. For example, the fifth signal trace TL5 may be located adjacent to the fourth signal trace TL4. The sixth signal trace TL6 may be located adjacent to the first signal trace TL1 connected to an adjacent pixel PX. The fifth signal trace TL5 may be electrically connected to the first electrode CE1 of one of the pair of third subpixels SP3, for example, the 3-1 subpixel SP3a. The sixth signal trace TL6 may be electrically connected to the first electrode CE1 of the remaining third subpixel SP3 of the pair, for example, the 3-2 subpixel SP3b.

[0086] Multiple signal lines TL can consist of conductive materials. For example, multiple signal lines TL can consist of conductive materials such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), and indium gallium oxide (IGO), but the embodiments of the present invention are not limited to these. To give another example, multiple signal lines TL can consist of a multilayer structure of conductive materials. For example, multiple signal lines TL may have multilayer structures such as titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO), indium tin oxide (ITO) / aluminum (Al) / indium tin oxide (ITO), or ITO / APC / ITO, but the embodiments of the present invention are not limited to these.

[0087] Multiple communication wirings NL may be arranged in the region between multiple touch groups TG. Multiple communication wirings NL may extend in the row direction from the region between the multiple touch groups TG. Multiple communication wirings NL may be arranged in the region between multiple second electrodes CE2 and may not overlap the multiple second electrodes CE2. For example, multiple communication wirings NL may be wiring used for short-range communication such as NFC (Near Field Communication) or Bluetooth®. Multiple communication wirings NL may function as antennas. For example, multiple communication wirings NL may be multiple linkage wirings, but embodiments of the present invention are not limited thereto.

[0088] According to the present invention, a bank BNK may be arranged in each of a plurality of subpixels. The plurality of bank BNKs may be structures on which a plurality of light-emitting elements EDs are attached. The plurality of bank BNKs can guide the positions of the plurality of light-emitting elements EDs in the transfer process of transferring the plurality of light-emitting elements EDs to the display device 1000. In the transfer process of the plurality of light-emitting elements EDs, the plurality of light-emitting elements EDs can be transferred onto the plurality of bank BNKs. The plurality of bank BNKs may be a bank pattern or a structure, but the embodiments of the present invention are not limited thereto.

[0089] The bank BNK of the first subpixel SP1, the bank BNK of the second subpixel SP2, and the bank BNK of the third subpixel SP3 can be arranged spaced apart from each other. The bank BNK of the first subpixel SP1, the bank BNK of the second subpixel SP2, and the bank BNK of the third subpixel SP3 can be configured to be separated. Therefore, the bank BNKs of the first subpixel SP1, the second subpixel SP2, and the third subpixel SP3, to which different types of light-emitting elements ED are transferred, can be easily identified.

[0090] The bank BNK of the 1-1 subpixel SP1a and the bank BNK of the 1-2 subpixel SP1b can be linked together, or they can be separated or formed independently. For example, considering the design, such as the requirements of the transfer process, the bank BNK of the 1-1 subpixel SP1a and the bank BNK of the 1-2 subpixel SP1b, where the same type of light-emitting element ED is arranged, can be linked together, or they can be separated or formed independently. Similarly, the bank BNK of the 2-1 subpixel SP2a and the bank BNK of the 2-2 subpixel SP2b can be linked together, or they can be separated or formed independently. The bank BNK of the 3-1 subpixel SP3a and the bank BNK of the 3-2 subpixel SP3b can be linked together, or they can be separated or formed independently. Therefore, the bank BNK of a pair of first subpixels SP1, the bank BNK of a pair of second subpixels SP2, and the bank BNK of a pair of third subpixels SP3 can be formed in a variety of ways, and the embodiments of the present invention are not limited thereto.

[0091] For example, multiple bank BNKs may consist of organic insulating materials. Multiple bank BNKs may consist of a single layer or multiple layers of organic insulating materials. For example, multiple bank BNKs may consist of benzocyclobutene resin, photosensitive polymer, photoresist, polyimide (PI), or acrylic-based materials, but the embodiments of the present invention are not limited to these.

[0092] A first electrode CE1 may be placed on each of multiple subpixels. The first electrode CE1 may be placed on a bank BNK. The first electrode CE1 may be electrically connected to one of multiple signal lines TL. At least a portion of the first electrode CE1 may extend outside the bank BNK and be electrically connected to the signal line TL closest to the first electrode CE1. For example, a portion of the first electrode CE1 of the 1-1 subpixel SP1a may extend to one side of the 1-1 subpixel SP1a and be electrically connected to the first signal line TL1, and a portion of the first electrode CE1 of the 1-2 subpixel SP1b may extend to the other side of the 1-2 subpixel SP1b and be electrically connected to the second signal line TL2. A portion of the first electrode CE1 of the second-first subpixel SP2a may extend to one side region of the second-first subpixel SP2a and be electrically connected to the third signal line TL3, and a portion of the first electrode CE1 of the second-second subpixel SP2b may extend to the other side region of the second-second subpixel SP2b and be electrically connected to the fourth signal line TL4. A portion of the first electrode CE1 of the third-first subpixel SP3a may extend to one side region of the third-first subpixel SP3a and be electrically connected to the fifth signal line TL5, and a portion of the first electrode CE1 of the third-second subpixel SP3b may extend to the other side region of the third-second subpixel SP3b and be electrically connected to the sixth signal line TL6.

[0093] The first electrode CE1 is electrically connected to the anode electrode 134 of the light-emitting element ED, and can transmit the anode voltage from the pixel driver PD to the light-emitting element ED via the signal wiring TL. Different voltages may be applied to the first electrode CE1 of each of the multiple subpixels, depending on the displayed image. For example, different voltages may be applied to the first electrode CE1 of each of the multiple subpixels. Therefore, the first electrode CE1 can be a pixel electrode, and the embodiments of the present invention are not limited thereto. Alternatively, the first electrode CE1 can be a common electrode, and the second electrode CE2 can be a pixel electrode.

[0094] The first electrode CE1 may be composed of a conductive material. For example, the first electrode CE1 may be integrated with a plurality of signal lines TL. For example, the first electrode CE1 may be composed of the same or substantially the same conductive material as the plurality of signal lines TL, or of different conductive materials, but the embodiments of the present invention are not limited thereto. For example, the first electrode CE1 may be composed of conductive materials such as titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), chromium (Cr), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), indium gallium zinc oxide (IGZO), but the embodiments of the present invention are not limited thereto. To give another example, the first electrode CE1 may be composed of a multilayer structure of conductive materials. For example, multiple first electrodes CE1 may have multilayer structures such as titanium (Ti) / aluminum (Al) / titanium (Ti) / indium tin oxide (ITO), indium tin oxide (ITO) / aluminum (Al) / indium tin oxide (ITO), or ITO / APC / ITO, but the embodiments of the present invention are not limited thereto.

[0095] A light-emitting element (ED) may be placed in each of several subpixels. The multiple light-emitting elements (EDs) may be one of LEDs (Light-emitting Diodes), mini-LEDs, or micro-LEDs (Micro Light-emitting Diodes), but the embodiments of the present invention are not limited thereto. The multiple light-emitting elements (EDs) may be placed on a bank BNK and a first electrode CE1. The multiple light-emitting elements (EDs) may be placed on the first electrode CE1 and electrically coupled to the first electrode CE1. Thus, the light-emitting elements (EDs) can emit light when an anode voltage from a pixel driver PD is applied through the signal wiring TL and the first electrode CE1.

[0096] The multiple light-emitting elements ED may include a first light-emitting element 130, a second light-emitting element 140, and a third light-emitting element 150. The first light-emitting element 130 may be located in a first subpixel SP1. The second light-emitting element 140 may be located in a second subpixel SP2. The third light-emitting element 150 may be located in a third subpixel SP3. For example, one of the first light-emitting elements 130, the second light-emitting element 140, and the third light-emitting element 150 may be a red light-emitting element, another may be a green light-emitting element, and the rest may be blue light-emitting elements, but the embodiments of the present invention are not limited thereto. Therefore, by combining the red, green, and blue light emitted from the multiple light-emitting elements ED, various colors of light, including white, can be realized. The number and types of the multiple light-emitting elements ED are illustrative, and the embodiments of the present invention are not limited thereto. For example, the multiple subpixels may include a different number of subpixels that emit light of different colors from different color systems, such as CMYK.

[0097] The first light-emitting element 130 may include a first-first light-emitting element 130a located in the first-first subpixel SP1a and a first-second light-emitting element 130b located in the first-second subpixel SP1b. The second light-emitting element 140 may include a second-first light-emitting element 140a located in the second-first subpixel SP2a and a second-second light-emitting element 140b located in the second-second subpixel SP2b. The third light-emitting element 150 may include a third-first light-emitting element 150a located in the third-first subpixel SP3a and a third-second light-emitting element 150b located in the third-second subpixel SP3b.

[0098] Referring to Figure 10, a second electrode CE2 may be placed on each of the multiple subpixels. The second electrode CE2 may be placed on the light-emitting element ED. The second electrode CE2 may be electrically connected to the pixel driver PD through multiple contact electrodes CCE.

[0099] For example, the second electrode CE2 is electrically connected to the cathode electrode 135 of the light-emitting element ED (see Figure 12), allowing the cathode voltage from the pixel driver PD to be transmitted to the light-emitting element ED. The same cathode voltage can be applied to the second electrode CE2 of each of multiple subpixels. For example, the same voltage can be applied to the second electrode CE2 of each of multiple subpixels and the cathode electrode 135 of the light-emitting element ED. Therefore, the second electrode CE2 can be a common electrode. Alternatively, the first electrode CE1 can be a common electrode, and the second electrode CE2 can be a pixel electrode.

[0100] At least some of multiple subpixels can share the second electrode CE2. At least some of the second electrodes CE2 of each of the multiple subpixels can be electrically connected to one another. By applying the same voltage to the second electrode CE2, at least some of the second electrodes CE2 of subpixels can be shared and used. For example, at least some of the second electrodes CE2 of multiple pixels PX arranged in the same row can be connected to one another. For example, one second electrode CE2 can be placed on multiple pixels PX. One second electrode CE2 can be placed for every n subpixels, where n is an integer greater than 1.

[0101] For example, some of the second electrodes CE2 of each of the multiple subpixels may be arranged separately from each other. For example, the second electrodes CE2 connected to n*m pixels PX in the first touch group TG1 and the second electrodes CE2 connected to n*m pixels PX in other touch groups TG2 and TG3 adjacent to each other may be arranged separately. For example, the second electrodes CE2 arranged in the first touch group TG1 may be arranged separately from the second electrodes CE2 arranged in the third touch group TG3, separated by a plurality of communication lines NL extending in the row direction. Therefore, the number of multiple subpixels may be greater than the number of multiple second electrodes CE2. The embodiments of the present invention are not limited thereto.

[0102] Referring to Figure 10, multiple communication lines NL can be arranged in the region between multiple second electrodes CE2 and can not overlap the multiple second electrodes CE2. This allows the second electrodes CE2 used as touch electrodes for the first touch group TG1 and the second electrodes CE2 used as touch electrodes for the third touch group TG3 to be spaced apart from each other. The pixel driver PD can be electrically connected to the second electrodes CE2 of the first touch group TG1 and the second electrodes CE2 of the third touch group TG3 through multiple contact electrodes CCE. Here, the second electrodes CE2 of the first touch group TG1 may be the first common electrode. The second electrodes CE2 of the third touch group TG3 may be the second common electrode, but are not necessarily limited to this. For example, the second common electrode may be the second electrode CE2 of the second touch group TG2. If the second electrode CE2 of the second touch group TG2 is the second common electrode, then the second electrode CE2 of the third touch group TG3 may be the third common electrode, and the second electrode CE2 of the fourth touch group TG4 may be the fourth common electrode, but are not necessarily limited to these. The pixel connected to the second electrode CE2 of the first touch group TG1 may be the first pixel. The pixel connected to the second electrode CE2 of the third touch group TG3 may be the second pixel, but are not necessarily limited to these. For example, the aforementioned second pixel may be the pixel connected to the second electrode CE2 of the second touch group TG2. If the pixel connected to the second electrode CE2 of the second touch group TG2 is the second pixel, then the pixel connected to the second electrode CE2 of the third touch group TG3 may be the third pixel, and the pixel connected to the second electrode CE2 of the fourth touch group TG4 may be the fourth pixel, but are not necessarily limited to these. Therefore, the pixel driver PD can supply voltage to the first common electrode and the second common electrode. The pixel driver PD can supply a common voltage to the first and second common electrodes to display an image, or supply a touch drive signal to the first and second common electrodes to sense a touch.

[0103] Furthermore, the second electrode CE2 can function as an electrode used for touch sensing. When the second electrode CE2 functions as a touch electrode during touch sensing periods T1, T2, T3, and T4, the pixel driver PD, which is electrically connected through multiple contact electrodes CCE, can calculate the sensed touch information.

[0104] Multiple second electrodes CE2 may be composed of a transparent conductive material, but the embodiments of the present invention are not limited thereto. Multiple second electrodes CE2 are made of a transparent conductive material, and light emitted from the light-emitting element ED can be directed toward the top of the second electrodes CE2. For example, the second electrodes CE2 may be composed of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), or indium gallium oxide (IGO), but the embodiments of the present invention are not limited thereto.

[0105] Multiple contact electrodes CCE can be arranged on the substrate 110. For example, multiple contact electrodes CCE can be arranged at a distance from multiple banks BNK and multiple signal lines TL. Each of the multiple second electrodes CE2 can be superimposed on at least one contact electrode CCE. For example, one second electrode CE2 can be superimposed on multiple contact electrodes CCE.

[0106] For example, multiple contact electrodes CCE can be electrically connected to multiple second electrodes CE2. The multiple contact electrodes CCE can be positioned between the substrate 110 and the multiple second electrodes CE2 to transmit the cathode voltage from the pixel driver PD to the second electrodes CE2. When the second electrodes CE2 function as touch electrodes, sensed touch information can be transmitted to the pixel driver PD through the multiple contact electrodes CCE.

[0107] For example, a single pixel driver PD may be electrically connected to a second electrode CE2 located in adjacent touch groups TG1 and TG3 within the same touch unit, via a plurality of contact electrodes CCE. A pixel driver PD may be positioned superimposed at the bottom between two adjacent touch groups in the column direction within the same touch unit. For example, a pixel driver PD may be positioned superimposed between the first touch group TG1 and the third touch group TG3 within the same touch unit, but embodiments of the present invention are not limited thereto. For example, another adjacent pixel driver PD may be positioned superimposed between the second touch group TG2 and the fourth touch group TG4 within the touch unit.

[0108] For example, when using micro-LEDs as light-emitting elements (EDs), multiple micro-LEDs can be formed on a wafer, and the micro-LEDs can be transferred to the substrate 110 of the display device 1000 to manufacture the display device 1000. Various defects can occur during the process of transferring multiple light-emitting elements (EDs) of a fine size from the wafer to the substrate 110. For example, in some subpixels, defects may occur where the light-emitting elements (EDs) are not transferred, and in other subpixels, defects may occur where the light-emitting elements (EDs) are transferred outside their designated positions due to alignment errors. Also, even if the transfer process proceeds normally, the transferred light-emitting elements (EDs) themselves may be defective. Therefore, considering defects during the transfer process of multiple light-emitting elements (EDs), multiple identical light-emitting elements (EDs) can be transferred to a single subpixel. The lighting inspection of the multiple light-emitting elements (EDs) can then be performed, and only the single light-emitting element (ED) that is ultimately judged to be normal can be used.

[0109] For example, both the first-1 light-emitting element 130a and the first-2 light-emitting element 130b can be transferred to a single pixel PX, and their defects can be checked. If both the first-1 light-emitting element 130a and the first-2 light-emitting element 130b are determined to be normal, only the first-1 light-emitting element 130a can be used, and the first-2 light-emitting element 130b can be left unused. To give another example, if only the first-2 light-emitting element 130b is determined to be normal, the first-1 light-emitting element 130a can be left unused, and only the first-2 light-emitting element 130b can be used. Therefore, even if multiple identical light-emitting elements ED are transferred to a single pixel PX, ultimately only one light-emitting element ED can be used.

[0110] Therefore, one of a pair of light-emitting elements (EDs) may be the main (or primary) light-emitting element (ED), and the other may be the redundant light-emitting element (ED). The redundant light-emitting element (ED) may be an extra light-emitting element (ED) that is transferred in case of failure of the main light-emitting element (ED). When the main light-emitting element (ED) fails, the redundant light-emitting element (ED) can be used as a replacement. Thus, by transferring both the main light-emitting element (ED) and the redundant light-emitting element (ED) to a single pixel (PX), the degradation of display quality due to failure of the main light-emitting element (ED) and the redundant light-emitting element (ED) can be minimized or reduced.

[0111] For example, the first-first light-emitting element 130a, the second-first light-emitting element 140a, and the third-first light-emitting element 150a transferred to a single pixel PX can be used as the main light-emitting element ED, while the first-second light-emitting element 130b, the second-second light-emitting element 140b, and the third-second light-emitting element 150b can be used as the redundancy light-emitting element ED.

[0112] Figure 11 is a cross-sectional view taken along the line I-I' in Figure 3. Figure 12 is a cross-sectional view showing subpixels including light-emitting elements arranged in the display area.

[0113] Referring to Figure 11, the first buffer layer 111a and the second buffer layer 111b can be arranged in the remaining area of ​​the substrate 110, excluding the bending region BA.

[0114] The first buffer layer 111a and the second buffer layer 111b may be arranged in the display area AA, the first non-display area NA1, and the second non-display area NA2. The first buffer layer 111a and the second buffer layer 111b can reduce the penetration of moisture, oxygen, hydrogen, or impurities through the substrate 110. The first buffer layer 111a and the second buffer layer 111b may consist of an inorganic insulating material. For example, the first buffer layer 111a and the second buffer layer 111b may consist of a single layer or multiple layers of silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiOxNy), but the embodiments of the present invention are not limited thereto.

[0115] For example, portions of the first buffer layer 111a and the second buffer layer 111b located on the bending region BA are removable. The upper surface of the substrate 110 located in the bending region BA may be exposed from the first buffer layer 111a and the second buffer layer 111b. By removing the first buffer layer 111a and the second buffer layer 111b, which are made of inorganic insulating material, from the bending region BA, cracks in the first buffer layer 111a and the second buffer layer 111b that may occur during bending can be minimized or reduced.

[0116] Multiple alignment keys MK may be placed between the first buffer layer 111a and the second buffer layer 111b. These alignment keys MK may be configured to identify the position of the pixel driver PD during the manufacturing process of the display device 1000. For example, they may be configured to align the position of the pixel driver PD transferred onto the adhesive layer 112. Alternatively, the alignment keys MK may be omitted.

[0117] An adhesive layer 112 may be placed on the second buffer layer 111b. The adhesive layer 112 may be placed in the display area AA, the first non-display area NA1, the bending area BA, and the second non-display area NA2. In other examples, at least a portion of the adhesive layer 112 may be removed in the non-display area NA, which includes the bending area BA. For example, the adhesive layer 112 may consist of any one of the following: optically transparent adhesive (OCA), optically transparent resin (OCR), vacuum adhesive (PSA), silicone resin, adhesive polymer, epoxy resin, UV-curable resin, polyimide series, acrylate series, urethane series, and polydimethylsiloxane (PDMS), but the embodiments of the present invention are not limited thereto.

[0118] In the display area AA, a pixel driver PD may be placed on the adhesive layer 112. The pixel driver PD may be mounted on the adhesive layer 112 by a transfer process, but the embodiments of the present invention are not limited thereto.

[0119] A first protective layer 113a and a second protective layer 113b may be arranged on the adhesive layer 112 and the pixel driver PD. The first protective layer 113a and the second protective layer 113b may be arranged to surround the sides of the pixel driver PD, but embodiments of the present invention are not limited thereto. For example, the second protective layer 113b may be arranged to cover at least a portion of the upper surface of the pixel driver PD. For example, at least one of the first protective layer 113a and the second protective layer 113b arranged on the bending region BA can be omitted. For example, the first protective layer 113a may be arranged entirely over the display region AA and the non-display region NA, and the second protective layer 113b may be arranged partially over the display region AA, the first non-display region NA1, and the second non-display region NA2. For example, a portion of the second protective layer 113b in the bending region BA can be removed. However, embodiments of the present invention are not limited thereto.

[0120] The first protective layer 113a and the second protective layer 113b may be composed of an organic insulating material, but the embodiments of the present invention are not limited thereto. For example, the first protective layer 113a and the second protective layer 113b may be composed of an acrylic resin, a phenolic resin, an unsaturated polyester resin, a polyamide resin, a benzocyclobutene, a polyphenylene resin, a polyphenylene sulfide resin, a photoresist, a polyimide (PI), or a photoacryl-based material, but the embodiments of the present invention are not limited thereto. For example, the first protective layer 113a and the second protective layer 113b may be an overcoating layer or an insulating layer, but the embodiments of the present invention are not limited thereto. The first protective layer 113a and the second protective layer 113b can be made of the same or different materials.

[0121] According to the present invention, in the display area AA, a plurality of first connecting wires 121 may be arranged on the second protective layer 113b. The plurality of first connecting wires 121 may be wires for electrically connecting the pixel driver PD to other components. For example, the pixel driver PD may be electrically connected to a plurality of signal wires TL and a plurality of contact electrodes CCE, etc., through the plurality of first connecting wires 121. For example, the plurality of first connecting wires 121 may include a 1-1 connecting wire 121a, a 1-2 connecting wire 121b, a 1-3 connecting wire 121c, and a 1-4 connecting wire 121d, but embodiments of the present invention are not limited thereto.

[0122] For example, multiple first-to-first connecting wires 121a may be arranged on the second protective layer 113b. Multiple first-to-first connecting wires 121a may be electrically connected to the pixel driver PD. Multiple first-to-first connecting wires 121a can transmit the voltage output from the pixel driver PD to the first electrode CE1 or the second electrode CE2.

[0123] For example, a third protective layer 114 may be placed on the second protective layer 113b. The third protective layer 114 may be placed entirely over the display area AA and the non-display area NA. In the bending area BA, the third protective layer 114 may cover or overlap the sides of the second protective layer 113b and the top surface of the first protective layer 113a. The third protective layer 114 may be composed of an organic insulating material. For example, the third protective layer 114 may be composed of acrylic resin, phenolic resin, unsaturated polyester resin, polyamide resin, benzocyclobutene, polyphenylene resin, polyphenylene sulfide resin, photoresist, polyimide (PI), or photoacryl-based material, but the embodiments of the present invention are not limited thereto. For example, the first protective layer 113a, the second protective layer 113b, and the third protective layer 114 may be composed of the same material, but the embodiments of the present invention are not limited thereto. Alternatively, the third protective layer 114 can be made from a different material than the first protective layer 113a and the second protective layer 113b.

[0124] Multiple first- and second-order wirings 121b may be arranged on the third protective layer 114. These multiple first- and second-order wirings 121b may be indirectly or directly connected to the pixel driver PD. For example, some of the first- and second-order wirings 121b may be directly connected to the pixel driver PD through contact holes in the third protective layer 114. Alternatively, some of the first- and second-order wirings 121b may be connected to the pixel driver PD through contact holes in the third protective layer 114 and the first-to-first-order wiring 121a. Other portions of the first- and second-order wirings 121b may be electrically connected to the first-to-first-order wiring 121a through contact holes in the third protective layer 114. However, embodiments of the present invention are not limited thereto. Voltages and / or signals output from the pixel driver PD may be transmitted to the first electrode CE1 or the second electrode CE2 through multiple first- and second-order wirings 121b and other different wirings.

[0125] A first insulating layer 115a may be arranged on a plurality of first-to-second connecting wirings 121b. The first insulating layer 115a may be arranged entirely in the display area AA and the non-display area NA, but the embodiments of the present invention are not limited thereto. Alternatively, the first insulating layer 115a may be arranged partially in the display area AA, the first non-display area NA1, and the second non-display area NA2. For example, a portion of the first insulating layer 115a in the bending area BA may be removed. The first insulating layer 115a may be composed of an organic insulating material, but the embodiments of the present invention are not limited thereto. For example, the first insulating layer 115a may be composed of an acrylic resin, a phenolic resin, an unsaturated polyester resin, a polyamide resin, a benzocyclobutene, a polyphenylene resin, a polyphenylene sulfide resin, a photoresist, a polyimide (PI), or a photoacryl-based material, but the embodiments of the present invention are not limited thereto.

[0126] Multiple first- to third connecting wires 121c may be arranged on the first insulating layer 115a. Multiple first- to third connecting wires 121c may be electrically connected to multiple first- to second connecting wires 121b. For example, the first- to third connecting wires 121c may be electrically connected to the first- to second connecting wires 121b through contact holes in the first insulating layer 115a. For example, the first- to third connecting wires 121c may be electrically connected to the first- to second connecting wires 121b through contact holes in the first insulating layer 115a, and may be electrically connected to the first- to first connecting wires 121a through contact holes in the third protective layer 114.

[0127] A second insulating layer 115b may be arranged on a plurality of first to third connecting wirings 121c. The second insulating layer 115b may be arranged in the remaining area excluding the bending region BA, but the embodiments of the present invention are not limited thereto. The second insulating layer 115b may be arranged in the display region AA, the first non-display region NA1, and the second non-display region NA2, but the embodiments of the present invention are not limited thereto. For example, a portion of the second insulating layer 115b arranged in the bending region BA is removable. The second insulating layer 115b may be composed of an organic insulating material, but the embodiments of the present invention are not limited thereto. For example, the second insulating layer 115b may be composed of an acrylic resin, a phenolic resin, an unsaturated polyester resin, a polyamide resin, a benzocyclobutene, a polyphenylene resin, a polyphenylene sulfide resin, a photoresist, a polyimide (PI), or a photoacryl-based material, but the embodiments of the present invention are not limited thereto.

[0128] Multiple first- to fourth connecting wires 121d may be arranged on the second insulating layer 115b. Multiple first- to fourth connecting wires 121d may be electrically connected to multiple first- to third connecting wires 121c. For example, the first- to fourth connecting wires 121d may be electrically connected to the first- to third connecting wires 121c through contact holes in the second insulating layer 115b, to the first- to second connecting wires 121b through contact holes in the first insulating layer 115a, and to the first- to first connecting wires 121a through contact holes in the third protective layer 114.

[0129] According to the present invention, in the non-display area NA, a plurality of second connecting wires 122 can be arranged on the second protective layer 113b. The plurality of second connecting wires 122 may be wires for transmitting signals transmitted from the flexible circuit board (or flexible film) CB and / or printed circuit board 160 (see Figure 1) to the pad portion PAD to the pixel driver PD of the display area AA. For example, the plurality of second connecting wires 122 can be electrically connected to a plurality of pad electrodes PE so that signals from the flexible circuit board (or flexible film) CB and / or printed circuit board can be applied.

[0130] For example, multiple second linkage wires 122 can extend from the pad section PAD toward the display area AA and transmit signals to the wiring of the display area AA. In this case, multiple second linkage wires 122 can function as linkage wires LL. Multiple second linkage wires 122 may include a second-first linkage wire 122a, a second-second linkage wire 122b, a second-third linkage wire 122c, and a second-fourth linkage wire 122d. The second-first linkage wire 122a of the first non-display area NA1 can be electrically connected or coupled with the first-first linkage wire 121a of the display area AA.

[0131] Multiple second-first connecting wirings 122a may be arranged on the second protective layer 113b. Multiple second-first connecting wirings 122a may extend from the second non-display area NA2 to the bending area BA and the first non-display area NA1.

[0132] Multiple second-first connecting wires 122a can be electrically connected to multiple first-second connecting wires 121b in the display area AA. Multiple second-first connecting wires 122a can transmit signals transmitted from the flexible circuit board (or flexible film) CB and / or printed circuit board to the pad portion PAD to the pixel driver PD in the display area AA.

[0133] Multiple second-second connecting wires 122b may be arranged on the third protective layer 114. Multiple second-second connecting wires 122b may be arranged in the second non-display area NA2. The second-second connecting wires 122b may be electrically connected to the second-first connecting wires 122a through contact holes in the third protective layer 114. Thus, signals from the flexible circuit board (or flexible film) CB and / or printed circuit board can be transmitted to the second-first connecting wires 122a through the second-second connecting wires 122b.

[0134] Second and third connecting wires 122c may be placed on the first insulating layer 115a. The second and third connecting wires 122c may be placed in the second non-display area NA2. The second and third connecting wires 122c may be electrically connected to the second-second connecting wire 122b through contact holes in the first insulating layer 115a, and may be electrically connected to the second-first connecting wire 122a through contact holes in the third protective layer 114. Thus, signals from the flexible circuit board (or flexible film) CB and / or printed circuit board may be transmitted to the second-first connecting wire 122a through the second and third connecting wires 122c and the second-second connecting wire 122b.

[0135] Second-to-fourth connecting wires 122d may be placed on the second insulating layer 115b. The second-to-fourth connecting wires 122d may be placed in the second non-display area NA2. The second-to-fourth connecting wires 122d may be electrically connected to the second-to-third connecting wires 122c through the contact holes of the second organic insulating layer 115b, and may be electrically connected to the second-to-third connecting wires 122c through the contact holes of the second insulating layer 115b, and may be electrically connected to the second-to-second connecting wires 122b through the contact holes of the first insulating layer 115a, and may be electrically connected to the second-to-first connecting wires 122a through the contact holes of the third protective layer 114. Therefore, signals from the flexible film FF and / or printed circuit board can be transmitted to the second-first connecting wiring 122a through the second-fourth connecting wiring 122d, the second-third connecting wiring 122c, and the second-second connecting wiring 122b.

[0136] The multiple first connecting wires 121 and the multiple second connecting wires 122 may be formed from a highly flexible conductive material or from a variety of conductive materials used in the display area AA. For example, the second connecting wires 122, which are partially located in the bending area BA, may be composed of a highly flexible conductive material such as gold (Au), silver (Ag), copper (Cu), or aluminum (Al), but the embodiments of the present invention are not limited thereto. To give another example, the multiple first connecting wires 121 and the multiple second connecting wires 122 may be composed of molybdenum (Mo), chromium (Cr), titanium (Ti), gold (Au), aluminum (Al), nickel (Ni), neodymium (Nd), copper (Cu), and alloys of silver (Ag) and magnesium (Mg), or alloys thereof, but the embodiments of the present invention are not limited thereto. The multiple first connecting wires 121 and the multiple second connecting wires 122 may be formed from the same material or from different materials.

[0137] A third insulating layer 115c may be arranged on a plurality of first connecting wires 121 and a plurality of second connecting wires 122. The third insulating layer 115c may be arranged in the remaining area excluding the bending region BA, but the embodiments of the present invention are not limited thereto. The third insulating layer 115c may be arranged in the display region AA, the first non-display region NA1, and the second non-display region NA2. A portion of the third insulating layer 115c in the bending region BA is removable. The third insulating layer 115c may be composed of an organic insulating material, but the embodiments of the present invention are not limited thereto. For example, the third insulating layer 115c may be composed of an acrylic resin, a phenolic resin, an unsaturated polyester resin, a polyamide resin, a benzocyclobutene, a polyphenylene resin, a polyphenylene sulfide resin, a photoresist, a polyimide (PI), or a photoacryl-based material, but the embodiments of the present invention are not limited thereto.

[0138] In the display area AA, multiple banks BNK may be arranged on the third insulating layer 115c. Multiple banks BNK may be arranged so as to superimpose on each of multiple subpixels. One or more light-emitting elements ED of the same or different types may be arranged on top of each of the multiple banks BNK.

[0139] In display area AA, multiple signal lines TL may be arranged on the third insulating layer 115c. Multiple signal lines TL may be arranged in areas between multiple banks BNK. For example, multiple signal lines TL may be arranged adjacent to any one of the multiple banks BNK.

[0140] In the display area AA, multiple contact electrodes CCE can be arranged on the third insulating layer 115c. The multiple contact electrodes CCE can supply the cathode voltage from the pixel driver PD to the second electrode CE2.

[0141] A first electrode CE1 may be positioned on bank BNK. For example, the first electrode CE1 may extend from an adjacent signal trace TL toward the top of bank BNK. The first electrode CE1 may be positioned on the top surface and the side surface of bank BNK. For example, the first electrode CE1 may extend from a signal trace TL on the top surface of the third insulating layer 115c toward the side surface and the top surface of bank BNK.

[0142] Referring to Figure 12, the first electrode CE1 may be composed of multiple conductive layers. For example, the first electrode CE1 may include a first conductive layer CE1a, a second conductive layer CE1b, a third conductive layer CE1c, and a fourth conductive layer CE1d, but the embodiments of the present invention are not limited thereto.

[0143] The first conductive layer CE1a may be placed on bank BNK. The second conductive layer CE1b may be placed on the first conductive layer CE1a. The third conductive layer CE1c may be placed on the second conductive layer CE1b. The fourth conductive layer CE1d may be placed on the third conductive layer CE1c. For example, each of the first conductive layer CE1a, the second conductive layer CE1b, the third conductive layer CE1c, and the fourth conductive layer CE1d may be composed of titanium (Ti), molybdenum (Mo), aluminum (Al), or a titanium (Ti) alloy, and indium tin oxide (ITO) or alloys thereof, but the embodiments of the present invention are not limited thereto.

[0144] According to the present invention, among the plurality of conductive layers constituting the first electrode CE1, some conductive layers with good reflection efficiency can be composed of alignment keys and / or reflectors for aligning the light-emitting element ED. For example, among the plurality of conductive layers of the first electrode CE1, the second conductive layer CE1b can contain a reflective material. For example, the second conductive layer CE1b may contain aluminum (Al), silver (Ag), gold (Au), or magnesium (Mg), but the embodiments of the present invention are not limited thereto. Therefore, the second conductive layer CE1b can be composed of a reflector. Furthermore, the high reflection efficiency of the second conductive layer CE1b facilitates identification in the manufacturing process, and therefore, the position or transfer position of the light-emitting element ED can be aligned with respect to the second conductive layer CE1b.

[0145] For example, to construct the second conductive layer CE1b as a reflector, the third conductive layer CE1c and the fourth conductive layer CE1d covering the second conductive layer CE1b can be partially removed or etched. For example, a portion of the third conductive layer CE1c and the fourth conductive layer CE1d placed on the bank BNK can be removed or etched to expose the upper surface of the second conductive layer CE1b. For example, of the third conductive layer CE1c and the fourth conductive layer CE1d, the central portion and edge portion (or margin) where the solder pattern SDP is placed can be left intact, and the remaining portion can be removed. For example, the edges (or margins) of the third conductive layer CE1c made of titanium (Ti) and the fourth conductive layer CE1d made of indium tin oxide (ITO) can be left unetched. Therefore, corrosion of other conductive layers of the first electrode CE1 by the TMAH (Tetra Methyl Ammonium Hydroxide) solution used in the masking process of the first electrode CE1 can be prevented or reduced.

[0146] According to the present invention, the first conductive layer CE1a and the third conductive layer CE1c may contain titanium (Ti) or molybdenum (Mo). The second conductive layer CE1b may contain aluminum (Al), silver (Ag), gold (Au), magnesium (Mg), etc. The fourth conductive layer CE1d may contain a transparent conductive oxide layer such as indium tin oxide (ITO), indium gallium oxide (IGO), indium gallium zinc oxide (IGZO), or indium zinc oxide (IZO), which has good adhesion to the solder pattern SDP and is corrosion-resistant and acid-resistant. However, the embodiments of the present invention are not limited thereto.

[0147] The first conductive layer CE1a, the second conductive layer CE1b, the third conductive layer CE1c, and the fourth conductive layer CE1d can be sequentially deposited and then patterned by photolithography and etching processes, but the embodiments of the present invention are not limited thereto.

[0148] According to the present invention, the signal wiring TL, contact electrode CCE, and pad electrode PE, which are arranged in the same layer as the first electrode CE1, may be composed of multiple layers of conductive material, but the embodiments of the present invention are not limited thereto. For example, the signal wiring TL, contact electrode CCE, and pad electrode PE may be made of multiple layers of indium tin oxide (ITO) / titanium (Ti) / aluminum (Al) / titanium (Ti), indium tin oxide (ITO) / aluminum (Al) / indium tin oxide (ITO), but the embodiments of the present invention are not limited thereto.

[0149] According to the present invention, in each of a plurality of subpixels, a solder pattern SDP may be placed on a first electrode CE1, and the solder pattern SDP is located between the first electrode CE1 and the first semiconductor layer 131. The solder pattern SDP can bond a light-emitting element ED to the first electrode CE1. The first electrode CE1 and the light-emitting element ED can be electrically connected through eutectic bonding using the solder pattern SDP, but embodiments of the present invention are not limited thereto. For example, if the solder pattern SDP is made of indium (In) and the anode electrode 134 of the light-emitting element ED is made of gold (Au), the solder pattern SDP and the anode electrode 134 can be bonded by applying heat and pressure during the transfer process of the light-emitting element ED. The light-emitting element ED can be bonded to the solder pattern SDP and the first electrode CE1 through eutectic bonding without the need for another adhesive. For example, the solder pattern SDP may be made of indium (In), tin (Sn), or alloys thereof, but embodiments of the present invention are not limited thereto. For example, the solder pattern SDP may be a bonding pad or a bonding pad, but the embodiments of the present invention are not limited thereto.

[0150] According to the present invention, the passivation layer 116 can be arranged on a plurality of signal wirings TL, a plurality of first electrodes CE1, a plurality of contact electrodes CCE, and a third insulating layer 115c. For example, the passivation layer 116 can be arranged in a display area AA, a first non-display area NA1, and a second non-display area NA2. A portion of the passivation layer 116 arranged in the bending area BA is removable. In the second non-display area NA2, a portion of the passivation layer 116 covering a plurality of pad electrodes PE is removable. Since the passivation layer 116 is arranged to cover the remaining area excluding the bending area BA, the plurality of pad electrodes PE, and the area where the solder pattern SDP is arranged, the penetration of moisture or impurities into the light-emitting element ED can be reduced. For example, the passivation layer 116 can be composed of a single layer or multiple layers of silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy), etc., but the embodiments of the present invention are not limited thereto. For example, the passivation layer 116 may be a protective layer or an insulating layer, but embodiments of the present invention are not limited thereto. For example, the passivation layer 116 may include an opening 116h that exposes the solder pattern SDP.

[0151] In each of the multiple subpixels, a light-emitting element ED may be placed on the solder pattern SDP. A first light-emitting element 130 may be placed in the first subpixel SP1. A second light-emitting element 140 may be placed in the second subpixel SP2. A third light-emitting element 150 may be placed in the third subpixel SP3.

[0152] Light-emitting diodes (EDs) can be formed on a silicon wafer by methods such as metal-organic chemical vapor deposition (MOCVD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), molecular beam epitaxy (MBE), hydride vapor phase epitaxy (HVPE), or sputtering, but the embodiments of the present invention are not limited to these.

[0153] The first light-emitting element 130 may include an anode electrode 134, a first semiconductor layer 131, an active layer 132, a second semiconductor layer 133, a cathode electrode 135, and a sealing film 136, but the embodiments of the present invention are not limited thereto. For example, the first light-emitting element 130 may not include the sealing film 136.

[0154] A first semiconductor layer 131 may be placed on the solder pattern SDP. A second semiconductor layer 133 may be placed on the first semiconductor layer 131.

[0155] For example, one of the first semiconductor layer 131 and the second semiconductor layer 133 may be embodied in a compound semiconductor such as a III-V or II-VI semiconductor, and may be doped with impurities (or dopants). For example, one of the first semiconductor layer 131 and the second semiconductor layer 133 may be a semiconductor layer doped with an n-type impurity, and the other may be a semiconductor layer doped with a p-type impurity, but the embodiments of the present invention are not limited thereto. For example, one or more of the first semiconductor layer 131 and the second semiconductor layer 133 may be layers doped with n-type or p-type impurities in a substance such as gallium nitride (GaN), gallium phosphide (GaP), gallium arsenide (GaAsP), aluminum gallium indium phosphide (AlGaInP), indium aluminum phosphide (InAlP), aluminum gallium nitride (AlGaN), aluminum indium nitride (AlInN), aluminum indium gallium nitride (AlInGaN), aluminum gallium arsenide (AlGaAs), or gallium arsenide (GaAs), but the embodiments of the present invention are not limited thereto. For example, the n-type impurities may be silicon (Si), germanium (Ge), selenium (Se), carbon (C), tellurium (Te), or tin (Sn), but the embodiments of the present invention are not limited thereto. For example, p-type impurities may include magnesium (Mg), zinc (Zn), calcium (Ca), strontium (Sr), barium (Ba), or beryllium (Be), but the embodiments of the present invention are not limited to these.

[0156] For example, the first semiconductor layer 131 and the second semiconductor layer 133 may be a nitride semiconductor containing n-type impurities and a nitride semiconductor containing p-type impurities, respectively, but the embodiments of the present invention are not limited thereto. For example, the first semiconductor layer 131 may be a nitride semiconductor containing p-type impurities, and the second semiconductor layer 133 may be a nitride semiconductor containing n-type impurities, but the embodiments of the present invention are not limited thereto.

[0157] The active layer 132 may be disposed between the first semiconductor layer 131 and the second semiconductor layer 133. The active layer 132 can emit light by receiving holes and electrons from the first semiconductor layer 131 and the second semiconductor layer 133. For example, the active layer 132 may be composed of one of a single-well structure, a multi-well structure, a single quantum well structure, a multi-quantum well (MQW) structure, a quantum dot structure, and a quantum beam structure, but the embodiments of the present invention are not limited thereto. For example, the active layer 132 may be composed of indium phosphide (InP), gallium arsenide (GaAs), aluminum gallium arsenide (AlGaAs), indium gallium nitride (InGaN), or gallium nitride (GaN), but the embodiments of the present invention are not limited thereto.

[0158] For example, the active layer 132 may include a multi-quantum well (MQW) structure having a well layer and a barrier layer with a higher band gap than the well layer. For instance, the active layer 132 may be composed of InGaN as the well layer and an AlGaN layer as the barrier layer, but the embodiments of the present invention are not limited thereto.

[0159] The anode electrode 134 may be positioned between the first semiconductor layer 131 and the solder pattern SDP. For example, the anode electrode 134 can electrically connect the first semiconductor layer 131 and the first electrode CE1. The anode voltage output from the pixel driver PD can be applied to the first semiconductor layer 131 through the signal wiring TL, the first electrode CE1, and the anode electrode 134. For example, the anode electrode 134 may be composed of a conductive material that can be eutectic bonded to the solder pattern SDP, but embodiments of the present invention are not limited thereto. For example, the anode electrode 134 may be composed of gold (Au), tin (Sn), tungsten (W), silicon (Si), silver (Ag), titanium (Ti), iridium (Ir), chromium (Cr), indium (In), zinc (Zn), lead (Pb), nickel (Ni), platinum (Pt), and copper (Cu), or alloys thereof, but embodiments of the present invention are not limited thereto.

[0160] The cathode electrode 135 may be placed on the second semiconductor layer 133. For example, the cathode electrode 135 can electrically connect the second semiconductor layer 133 and the second electrode CE2. The cathode voltage output from the pixel driver PD can be applied to the second semiconductor layer 133 through the contact electrode CCE, the second electrode CE2, and the cathode electrode 135. The cathode electrode 135 may be made of a transparent conductive material so that the light emitted from the light-emitting element ED is directed towards the top of the light-emitting element ED, but the embodiments of the present invention are not limited thereto. For example, the cathode electrode 135 may be made of a material such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium gallium zinc oxide (IGZO), but the embodiments of the present invention are not limited thereto.

[0161] The encapsulation film 136 may be placed on at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135. For example, the encapsulation film 136 may surround at least a portion of the first semiconductor layer 131, the active layer 132, the second semiconductor layer 133, the anode electrode 134, and the cathode electrode 135.

[0162] For example, the encapsulation film 136 can protect the first semiconductor layer 131, the active layer 132, and the second semiconductor layer 133. For example, the encapsulation film 136 may be placed on the side surfaces of the first semiconductor layer 131, the active layer 132, and the second semiconductor layer 133.

[0163] For example, the sealing film 136 may be placed on at least a portion of the anode electrode 134 and the cathode electrode 135, for example, on the edge portion (or margin or one side) of the anode electrode 134 and the edge portion (or margin or one side) of the cathode electrode 135. At least a portion of the anode electrode 134 may be exposed from the sealing film 136 to connect the anode electrode 134 to the solder pattern SDP. For example, at least a portion of the cathode electrode 135 may be exposed from the sealing film 136 to connect the cathode electrode 135 to the second electrode CE2. For example, the sealing film 136 may be made of an insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx), but the embodiments of the present invention are not limited thereto.

[0164] For example, the encapsulation film 136 may have a structure in which a reflective material is dispersed in a resin layer, but the embodiments of the present invention are not limited thereto. For example, the encapsulation film 136 can be made of reflectors of various structures, but the embodiments of the present invention are not limited thereto. Light emitted from the active layer 132 can be reflected upward by the encapsulation film 136, thereby improving the light extraction efficiency. For example, the encapsulation film 136 may be a reflective layer, but the embodiments of the present invention are not limited thereto.

[0165] Although the present invention has described the light-emitting element ED as having a vertical structure, the embodiments of the present invention are not limited thereto. For example, the light-emitting element ED may have a lateral structure or a flip-chip structure.

[0166] Referring to Figure 12, the first light-emitting element 130 has been described, but the second light-emitting element 140 and the third light-emitting element 150 can have substantially the same structure as the first light-emitting element 130. For example, the second light-emitting element 140 and the third light-emitting element 150 may be substantially identical to the first semiconductor layer 131, active layer 132, second semiconductor layer 133, anode electrode 134, cathode electrode 135, and sealing film 136 of the first light-emitting element 130.

[0167] In the display area AA, a first optical layer 117a surrounding a plurality of light-emitting elements ED may be arranged. For example, the first optical layer 117a may be arranged to cover a plurality of light-emitting elements ED and a bank BNK in the region of a plurality of subpixels. For example, the first optical layer 117a can cover the bank BNK, a part of the passivation layer 116, and the space between the plurality of light-emitting elements ED. The first optical layer 117a can be arranged or cover the space between a plurality of light-emitting elements ED contained in a single pixel PX and the space between a plurality of bank BNKs. For example, the first optical layer 117a may extend in a first direction (X) and be spaced apart in a second direction (Y). For example, the first optical layer 117a may be arranged between the passivation layer 116 and the second electrode CE2, surrounding the sides of the light-emitting elements ED and the bank BNK, but embodiments of the present invention are not limited thereto. For example, the first optical layer 117a may be a diffusion layer or a sidewall diffusion layer, but embodiments of the present invention are not limited thereto.

[0168] The first optical layer 117a may contain an organic insulating material in which fine particles are dispersed, but the embodiments of the present invention are not limited thereto. For example, the first optical layer 117a may consist of a siloxane in which fine metal particles such as titanium dioxide (TiO2) particles are dispersed, but the embodiments of the present invention are not limited thereto. Light from multiple light-emitting elements ED can be scattered by the fine particles dispersed in the first optical layer 117a and emitted to the outside of the display device 1000. Therefore, the first optical layer 117a can improve the efficiency of extracting light emitted from multiple light-emitting elements ED.

[0169] For example, the first optical layer 117a may be located in each of a plurality of pixels PX, or it may be located together in some of the pixels PX located in the same row, but the embodiments of the present invention are not limited thereto. For example, the first optical layer 117a may be located in each of a plurality of pixels PX, or a plurality of pixels PX may share one first optical layer 117a. To give another example, each of a plurality of subpixels may separately include the first optical layer 117a, but the embodiments of the present invention are not limited thereto.

[0170] According to the present invention, a third optical layer 117c may be arranged on the passivation layer 116 in the display area AA. For example, the third optical layer 117c may be arranged to surround the first optical layer 117a. For example, the third optical layer 117c may be in contact with the side surface of the first optical layer 117a. For example, the third optical layer 117c may be arranged in the region between a plurality of pixels PX. However, embodiments of the present invention are not limited thereto; for example, the third optical layer 117c may be a diffusion layer, a diffusion layer window, or a window diffusion layer, but embodiments of the present invention are not limited thereto.

[0171] The third optical layer 117c may be composed of an organic insulating material, but the embodiments of the present invention are not limited thereto. The third optical layer 117c may be composed of the same material as the first optical layer 117a, but the embodiments of the present invention are not limited thereto. For example, the first optical layer 117a may contain fine particles, while the third optical layer 117c may not contain fine particles. For example, the third optical layer 117c may be made of siloxane, but the embodiments of the present invention are not limited thereto.

[0172] For example, the thickness of the first optical layer 117a may be less than the thickness of the third optical layer 117c, but embodiments of the present invention are not limited thereto. As a result, when viewed from above, the region where the first optical layer 117a is located may include a recess that is recessed inward from the upper surface of the third optical layer 117c.

[0173] According to the present invention, a second electrode CE2 can be arranged on the first optical layer 117a and the third optical layer 117c. For example, the second electrode CE2 can be electrically connected to a plurality of contact electrodes CCE through a contact hole in the third optical layer 117c. For example, the second electrode CE2 can be arranged on a plurality of light-emitting elements ED. For example, the second electrode CE2 may include a transparent conductive oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO), but the embodiments of the present invention are not limited thereto. For example, the second electrode CE2 can be arranged to be in contact with the cathode electrode 135. For example, the second electrode CE2 can also be superimposed on the first optical layer 117a. For example, it can cover the outer plane of the first optical layer 117a.

[0174] The second electrode CE2 can be continuously extended in the first direction (X) of the substrate 110. This allows it to be commonly connected to multiple pixels PX arranged in the first direction (X) of the substrate 110. For example, the second electrode CE2 can be commonly connected to multiple pixels PX.

[0175] According to the present invention, the second electrode CE2 can be continuously extended over the first optical layer 117a, the third optical layer 117c, and the light-emitting element ED. The region on which the first optical layer 117a is located may include a recess that is recessed inward from the upper surface of the third optical layer 117c. As a result, the first portion of the second electrode CE2 located on the first optical layer 117a is positioned along the recess and may be located lower than the second portion of the second electrode CE2 located on the third optical layer 117c.

[0176] A second optical layer 117b may be placed on the second electrode CE2. The second optical layer 117b may be placed so as to overlap the plurality of light-emitting elements ED and the first optical layer 117a. Since the second optical layer 117b is placed on top of the second electrode CE2 and the plurality of light-emitting elements ED, it can improve unevenness that may occur in some of the plurality of light-emitting elements ED. For example, when transferring a plurality of light-emitting elements ED onto the substrate 110 of the display device 1000, areas where the spacing between the plurality of light-emitting elements ED is not uniform may occur due to process variations, etc. When the spacing between the plurality of light-emitting elements ED is uneven, the light-emitting areas of each of the plurality of light-emitting elements ED may be unevenly distributed, and therefore, unevenness may be visible to the user. Therefore, by configuring a second optical layer 117b that is configured to uniformly diffuse light on top of the plurality of light-emitting elements ED, it is possible to reduce the visibility of light emitted from some of the light-emitting elements ED as unevenness. Therefore, the light emitted from the multiple light-emitting elements ED is uniformly diffused by the second optical layer 117b and taken out to the outside of the display device 1000, thereby improving the brightness uniformity of the display device 1000.

[0177] The second optical layer 117b may be composed of an organic insulating material in which fine particles are dispersed, but the embodiments of the present invention are not limited thereto. For example, the second optical layer 117b may be composed of a siloxane in which fine metal particles such as titanium dioxide (TiO2) particles are dispersed, but the embodiments of the present invention are not limited thereto. For example, the second optical layer 117b may be composed of the same material as the first optical layer 117a, but the embodiments of the present invention are not limited thereto. For example, the second optical layer 117b may be a diffusion layer or a top diffusion layer, but the embodiments of the present invention are not limited thereto.

[0178] According to the present invention, light from multiple light-emitting elements ED can be scattered by fine particles dispersed in the second optical layer 117b and emitted to the outside of the display device 1000. The second optical layer 117b can uniformly mix the light emitted from the multiple light-emitting elements ED to further improve the brightness uniformity of the display device 1000. Furthermore, the light extraction efficiency of the display device 1000 can be improved by the light scattered by the multiple fine particles, and therefore the display device 1000 can be driven with low power.

[0179] In the display area AA, a black matrix BM can be placed on the second electrode CE2, the first optical layer 117a, the third optical layer 117c, and the second optical layer 117b. For example, the black matrix BM can fill the contact hole of the third optical layer 117c. Since the black matrix BM is configured to cover the display area AA, it can reduce the mixing of light from multiple subpixels and external light reflection. For example, since the black matrix BM is also placed in the contact hole where the second electrode CE2 and the contact electrode CCE are connected, it can prevent light leakage between multiple adjacent subpixels.

[0180] For example, the black matrix BM may be composed of an opaque material, but the embodiments of the present invention are not limited thereto. For example, the black matrix BM may be an organic insulating material to which a black pigment or black dye has been added, but the embodiments of the present invention are not limited thereto.

[0181] In the display area AA, a cover layer 118 may be placed on the black matrix BM. The cover layer 118 can protect the structure beneath it. For example, the cover layer 118 may be composed of an organic insulating material, but the embodiments of the present invention are not limited thereto. For example, the cover layer 118 may be composed of an acrylic resin, a phenolic resin, an unsaturated polyester resin, a polyamide resin, a benzocyclobutene, a polyphenylene resin, a polyphenylene sulfide resin, a photoresist, a polyimide (PI), or a photoacryl-based material, but the embodiments of the present invention are not limited thereto. For example, the cover layer 118 may be an overcoating layer or an insulating layer, but the embodiments of the present invention are not limited thereto.

[0182] A polarizing layer 293 may be placed on the cover layer 118 via a first adhesive layer 291. A cover member 120 may be placed on the polarizing layer 293 via a second adhesive layer 295. For example, the first adhesive layer 291 and the second adhesive layer 295 may include optically clear adhesive (OCA), optically clear resin (OCR), or pressure sensitive adhesive (PSA), but the embodiments of the present invention are not limited thereto.

[0183] According to the present invention, in the second non-display region NA2, a plurality of pad electrodes PE can be arranged on the third insulating layer 115c. For example, at least a portion of the plurality of pad electrodes PE can be exposed from the passivation layer 116. For example, the plurality of pad electrodes PE can be electrically connected to the second to fourth connecting wirings 122d through contact holes in the third insulating layer 115c, further electrically connected to the second to third connecting wirings 122c through contact holes in the second insulating layer 115b, further electrically connected to the second to second connecting wirings 122b through contact holes in the first insulating layer 115a, and further electrically connected to the second to first connecting wirings 122a through contact holes in the third protective layer 114.

[0184] An adhesive layer ACF can be placed on multiple pad electrodes PE. The adhesive layer ACF may be an adhesive layer in which conductive balls are dispersed in an insulating material, but the embodiments of the present invention are not limited thereto. When heat or pressure is applied to the adhesive layer ACF, the conductive balls can be electrically connected in the heated or pressured portion, thereby possessing conductive properties. The adhesive layer ACF can be placed between multiple pad electrodes PE and a flexible circuit board (or flexible film) CB to bond or attach the flexible circuit board (or flexible film) CB to the multiple pad electrodes PE. For example, the adhesive layer ACF may be an anisotropic conductive film (ACF), but the embodiments of the present invention are not limited thereto.

[0185] A flexible circuit board (or flexible film) CB may be placed on the adhesive layer ACF. The flexible circuit board (or flexible film) CB may be electrically connected to a plurality of pad electrodes PE through the adhesive layer ACF. Therefore, signals output from the flexible circuit board (or flexible film) CB and the printed circuit board may be transmitted to the pixel driver PD of the display area AA through the plurality of pad electrodes PE, the second to fourth connecting wires 122d, the second to third connecting wires 122c, the second to second connecting wires 122b, and the second to first connecting wires 122a.

[0186] Figures 13 to 16 show a device to which a display device according to an embodiment of the present invention is applied.

[0187] Referring to Figures 13 to 16, the display device 1000 according to an embodiment of the present invention can be incorporated into various devices or electronic devices. For example, referring to Figures 13 to 16, various electronic devices may include a wearable device 1100, a mobile device 1200, a notebook computer 1300, and a monitor or television 1400, but embodiments of the present invention are not limited thereto.

[0188] Each of the wearable device 1100, mobile device 1200, notebook computer 1300, and monitor or television 1400 may include housings 1005, 1010, 1015, 1020 and the display panel 100 and display device 1000 according to the embodiments of the present invention described above.

[0189] For example, the display device according to the embodiment of the present invention is applicable to mobile devices, video phones, smartwatches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, curved devices, sliding devices, variable devices, electronic organizers, e-books, PMPs (portable multimedia players), PDAs (personal digital assistants), MP3 players, mobile medical devices, desktop PCs, laptop PCs, netbook computers, workstations, navigation systems, in-vehicle display devices, theater display devices, televisions, wallpaper devices, signage devices, game consoles, notebook computers, monitors, cameras, camcorders, and home appliances, etc.

[0190] An in-cell touch display panel according to one or more embodiments of the present invention can be described as follows.

[0191] An in-cell touch display panel according to one or more embodiments of the present invention may include a first common electrode connected to N*M (where N and M are positive integers of 2 or more) first pixels arranged within a display area, a second common electrode connected to N*M second pixels arranged within the display area, and a first pixel driver arranged within the display area that writes pixel data to the first and second pixels and supplies voltage to the first and second common electrodes.

[0192] In an in-cell touch display panel according to one or more embodiments of the present invention, the first pixel driver may be electrically connected to the first pixel and the second pixel, respectively, through a plurality of connecting wires, and may also be electrically connected to the first common electrode and the second common electrode, respectively, through a plurality of connecting wires.

[0193] In an in-cell touch display panel according to one or more embodiments of the present invention, the connecting wiring is arranged at different heights in the Z-axis direction of the height of the display panel between a plurality of insulating layers, and each of the connecting wirings can be electrically connected to one another through contact holes arranged in the insulating layer.

[0194] In one or more embodiments of the present invention, an in-cell touch display panel may be arranged superimposed between a first common electrode and a second common electrode.

[0195] In one or more embodiments of the present invention, an in-cell touch display panel may be arranged superimposed on a portion of the first and second pixels.

[0196] In one or more embodiments of the present invention, in an in-cell touch display panel, the connecting wiring and the first common electrode and the second common electrode can each be electrically connected through a contact electrode.

[0197] In one or more embodiments of the present invention, an in-cell touch display panel may include a first common electrode and a second common electrode, respectively, a first touch block and a second touch block.

[0198] An in-cell touch display panel according to one or more embodiments of the present invention further includes a third common electrode connected to N*M third pixels arranged within a display area, a fourth common electrode connected to N*M fourth pixels arranged within a display area, and a second pixel driver that writes pixel data to the third and fourth pixels and supplies voltage to the third and fourth common electrodes, the second pixel driver may be arranged adjacent to the first pixel driver.

[0199] In an in-cell touch display panel according to one or more embodiments of the present invention, a pixel includes a plurality of subpixels, and the subpixels may include a first light-emitting element that emits light in a first wavelength band, a second light-emitting element that emits light in a second wavelength band, and a third light-emitting element that emits light in a third wavelength band.

[0200] In an in-cell touch display panel according to one or more embodiments of the present invention, the first light-emitting element may include an anode electrode, a first semiconductor layer disposed on the anode electrode, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, and a cathode electrode disposed on the second semiconductor layer.

[0201] In one or more embodiments of the present invention, an in-cell touch display panel may have a vertical light-emitting element.

[0202] An in-cell touch display panel according to one or more embodiments of the present invention further includes a solder pattern disposed between a first electrode and an anode electrode, wherein the first electrode and the anode electrode can be electrically connected by eutectic bonding via the solder pattern.

[0203] In one or more embodiments of the present invention, an in-cell touch display panel, the first light-emitting element may be a microlight-emitting diode.

[0204] In one or more embodiments of the present invention, in an in-cell touch display panel, the first light-emitting element, the second light-emitting element, and the third light-emitting element may be arranged in substantially the same structure.

[0205] In one or more embodiments of the present invention, an in-cell touch display panel may include a first light-emitting element, a second light-emitting element, and a third light-emitting element, each comprising a single pixel, a main light-emitting element and a redundant light-emitting element that emits light of the same wavelength as the main light-emitting element.

[0206] In an in-cell touch display panel according to one or more embodiments of the present invention, the main light-emitting element and the redundancy light-emitting element may be arranged on the same bank.

[0207] In an in-cell touch display panel according to one or more embodiments of the present invention, the pixel driver may include a microdriver.

[0208] An in-cell touch display panel according to one or more embodiments of the present invention may include a driving method for the in-cell touch display panel that senses touch input based on a voltage received from the common electrode.

[0209] While embodiments of the present invention have been described in more detail above with reference to the attached drawings, the present invention is not necessarily limited to these embodiments and can be implemented in various ways without departing from the technical concept of the present invention.

[0210] Therefore, the embodiments disclosed in this invention are intended to illustrate, not to limit, the technical concept of the invention, and the scope of the technical concept of the invention is not limited by such embodiments.

[0211] Therefore, the examples described above should be understood in all respects as illustrative and not limiting.

[0212] The scope of protection of this invention shall be interpreted as per the claims, and any technical ideas within an equivalent scope shall be interpreted as being included within the scope of the rights of this invention. [Explanation of Symbols]

[0213] 100: Display Panel 1005, 1010, 1015, 1020: Enclosure 110: Circuit board 112: Adhesive layer 114:Third protective layer 116: Passivation layer 118: Cover layer 120: Cover component 121: Multiple first connection wirings 122: Multiple second-connection wiring 130: First light-emitting element 130, 140, 150: Light-emitting elements 131: First semiconductor layer 132:Active layer 133: Second semiconductor layer 134: Anode electrode 135: Cathode electrode 136: Encapsulation film 140: Second light-emitting element 150: Third light-emitting element 160: Printed circuit board 180: Hall 291: 1st adhesive layer 293: Polarizing layer 295: Adhesive layer AA:Display area ACF:adhesive layer Ag:Silver Al: Aluminum Au: Gold BA: Bending area BM: Black Matrix BNK: Bank Ba: Barium Be: Beryllium CB: Flexible circuit board CCE: Contact Electrode CE1: 1st electrode CE2: 2nd electrode Ca: Calcium Cr: Chromium Cu: Copper D1, D2, D3, D4: Display period ED: Light-emitting element EM: Light Signal PD: Pixel Driver SDP: Solder Pattern SP: Multiple subpixels SP1: First subpixel SP2: Second subpixel SP3: Third subpixel T1, T2, T3, T4: Touch sensing period TDR: Drive Transistor TEM: Light-emitting transistor TG: Touch Group TL: Signal wiring TL1: First signal wiring TL2: 2nd signal wiring TL3: 3rd signal wiring TL4: Fourth signal wiring TL5: Fifth signal wiring TL6: 6th signal wiring Te:Teruru Ti: Titanium VDD: High potential power supply voltage VL: Drive Wiring W: Tungsten X: 1st direction Y: Second direction Zn: Zinc

Claims

1. A first common electrode connected to a first pixel located within the display area, A second common electrode connected to a second pixel located within the aforementioned display area, A first pixel driver, positioned within the display area, writes pixel data to the first and second pixels, and supplies voltage or signals to the first and second common electrodes, and A display panel including a plurality of connecting wires that electrically connect the first pixel driver to the first pixel and the second pixel, and to the first common electrode and the second common electrode.

2. The aforementioned multiple connecting wires are located at different heights from each other between the multiple insulating layers. The display panel according to claim 1, wherein the plurality of connecting wires are electrically connected to one another through a plurality of contact holes arranged in the plurality of insulating layers.

3. A first common electrode connected to a first pixel arranged within the display area, A second common electrode is connected to a second pixel located within the aforementioned display area, and The first pixel driver is positioned within the display area and writes pixel data to the first and second pixels, and supplies voltage or signals to the first and second common electrodes, The first pixel driver is superimposed on the first common electrode and the second common electrode in a display panel.

4. A first common electrode connected to a first pixel arranged within the display area, A second common electrode is connected to a second pixel located within the aforementioned display area, and The first pixel driver is positioned within the display area and writes pixel data to the first and second pixels, and supplies voltage or signals to the first and second common electrodes, The first pixel driver is superimposed on a portion of the first pixels and a portion of the second pixels in a display panel.

5. The display panel according to claim 1, further comprising a plurality of contact electrodes that electrically connect each of the first common electrode and the second common electrode to the plurality of connecting wires.

6. The display panel according to claim 1, wherein the first common electrode includes a first touch block for sensing a touch, and the second common electrode includes a second touch block for sensing a touch.

7. A first common electrode connected to a first pixel arranged within the display area, A second common electrode connected to a second pixel located within the aforementioned display area, A first pixel driver, which is positioned within the display area, writes pixel data to the first and second pixels, and supplies voltage or signals to the first common electrode and the second common electrode. A third common electrode connected to a third pixel located within the display area, A fourth common electrode is connected to the fourth pixel located within the display area, and The system includes a second pixel driver that writes pixel data to the third and fourth pixels and supplies voltage or signals to the third and fourth common electrodes, The second pixel driver is a display panel located adjacent to the first pixel driver within the display area.

8. A display panel, A first common electrode connected to a first pixel located within the display area, A second common electrode is connected to a second pixel located within the aforementioned display area, and The first pixel driver is positioned within the display area and writes pixel data to the first and second pixels, and supplies voltage or signals to the first and second common electrodes, Each of the first and second pixels includes a plurality of subpixels, The aforementioned subpixel is, A first light-emitting element that emits light in the first wavelength band, A second light-emitting element that emits light in the second wavelength band, and Includes a third light-emitting element that emits light in the third wavelength band, Each of the first, second, and third light-emitting elements includes a main light-emitting element and a redundant light-emitting element that emits light of the same wavelength as the main light-emitting element. The aforementioned display panel further includes multiple banks, The main light-emitting element and the redundant light-emitting element of the first light-emitting element, the second light-emitting element, and the third light-emitting element, respectively, are arranged on the bank, forming a display panel.

9. The first light-emitting element is Anode electrode, A first semiconductor layer disposed on the anode electrode, The active layer disposed on the first semiconductor layer, A second semiconductor layer disposed on the active layer, and The display panel according to claim 8, comprising a cathode electrode disposed on the second semiconductor layer.

10. The display panel according to claim 9, wherein the first light-emitting element has a vertical structure.

11. The first light-emitting element is The solder pattern further includes a solder pattern placed beneath the anode electrode, The display panel according to claim 9, wherein the anode electrode located between the solder pattern and the first semiconductor layer is electrically connected to the solder pattern.

12. The display panel according to claim 9, wherein the first light-emitting element is a microlight-emitting diode.

13. The display panel according to claim 9, wherein the first light-emitting element, the second light-emitting element, and the third light-emitting element have the same structure.

14. A first common electrode connected to a first pixel arranged within the display area, A second common electrode is connected to a second pixel located within the aforementioned display area, and The first pixel driver is positioned within the display area and writes pixel data to the first and second pixels, and supplies voltage or signals to the first and second common electrodes, The first pixel driver includes a microdriver in the display panel.

15. A first common electrode connected to a first pixel arranged within the display area, A second common electrode connected to a second pixel located within the aforementioned display area, A first pixel driver, which is positioned within the display area, writes pixel data to the first and second pixels, and supplies voltage or signals to the first common electrode and the second common electrode. A first contact electrode connected to the first common electrode, A second contact electrode connected to the second common electrode, and A display panel including communication wiring disposed between the first contact electrode and the second contact electrode.

16. A passivation layer disposed on the anode electrode, and The anode electrode further includes a conductive layer disposed on the anode electrode, The display panel according to claim 9, wherein the conductive layer includes a surface that is in contact with the passivation layer.

17. Multiple pixels arranged within the display area for displaying an image, Multiple touch units, each containing multiple touch groups, and Includes pixel driver, Each touch unit includes a first touch group which includes a first common electrode connected to a first pixel of the touch unit among the plurality of pixels, and a second touch group which includes a second common electrode connected to a second pixel of the touch unit among the plurality of pixels, but not connected to the first pixel of the touch unit. The pixel driver outputs a touch drive signal to a first common electrode located in the first touch group of each of the plurality of touch units during the first touch period, and outputs a common voltage to a second common electrode located in the second touch group of each of the plurality of touch units during the first touch period, so that the second pixel of each of the plurality of touch units displays an image during the first touch period.

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