Substrate processing equipment

Abstract

In a substrate processing apparatus that levitates a substrate and transports it in a predetermined transport direction while supplying a processing liquid such as a resist solution to the upper surface of the substrate, the apparatus can respond to changes in the substrate size in the transport direction quickly and at low cost. [Solution] In this invention, the upstream levitation stage has a first levitation plate group and a second levitation plate group arranged in the transport direction. Of these, the second levitation plate group is detachably attached to the first levitation plate group. For example, when the second levitation plate group is provided adjacent to the first levitation plate group, relatively long substrates can be processed in the transport direction. On the other hand, when the second levitation plate group is removed from the first levitation plate group, relatively short substrates can be processed in the transport direction.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus that floats and conveys a substrate while supplying a processing liquid such as a resist liquid to the upper surface of the substrate. Substrates include, for example, glass substrates for liquid crystal display devices, substrates for organic EL, semiconductor package substrates such as substrates for FOWLP (fan out wafer level package), semiconductor substrates, glass substrates for photomasks, substrates for color filters, substrates for recording disks, substrates for solar cells, substrates for electronic papers, and other substrates for precision electronic devices, rectangular glass substrates, flexible substrates for film liquid crystals.

Background Art

[0002] In the manufacturing process of liquid crystal display devices and the like, a coating apparatus that supplies a processing liquid such as a resist liquid to the surface of a substrate and applies the processing liquid to the substrate is used. For example, Patent Document 1 discloses a substrate processing apparatus that conveys a substrate in a floating state while supplying a processing liquid such as a resist liquid from a slit nozzle in a band shape to uniformly apply the processing liquid to the upper surface of the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the substrate processing apparatus described in Patent Document 1, the levitation stage for levitating and transporting the substrate is divided into three stages. More specifically, the levitation stage includes a coating stage located opposite the slit nozzle, an upstream levitation stage positioned upstream of the coating stage in the substrate transport direction, and a downstream levitation stage positioned downstream of the coating stage in the transport direction. Of these stages, the upstream levitation stage in particular was designed for each substrate size in the transport direction. This specialized design resulted in increased design effort and higher manufacturing costs.

[0005] This invention has been made in view of the above problems, and aims to provide a substrate processing apparatus that levitates a substrate and transports the substrate in a predetermined transport direction while supplying a processing liquid such as a resist solution to the upper surface of the substrate, in order to respond to changes in the substrate size in the transport direction at low cost and quickly. [Means for solving the problem]

[0006] This invention relates to a substrate processing apparatus that supplies a processing liquid from a nozzle to the upper surface of a substrate while transporting the substrate, which is floating on a floating stage, in a predetermined transport direction. The floating stage comprises a coating stage located opposite the nozzle, an upstream floating stage located upstream of the coating stage in the transport direction, and a downstream floating stage located downstream of the coating stage in the transport direction. The upstream floating stage comprises a group of first floating plates, each having at least one first floating plate arranged in the transport direction for floating the substrate, and located adjacent to the upstream side of the coating stage in the transport direction, and a group of second floating plates, each having at least one second floating plate arranged in the transport direction for floating the substrate, and located adjacent to the upstream side of the group of first floating plates in the transport direction, and detachably provided. Furthermore, depending on the size of the substrate in the transport direction, it is possible to switch between a first substrate transport mode, in which the second group of levitation plates is removed from the upstream levitation stage and the substrate is transported to the coating stage using only the first group of levitation plates, and a second substrate transport mode, in which the second group of levitation plates is placed adjacent to the first group of levitation plates and the substrate is transported to the coating stage using both the second and first groups of levitation plates. It is characterized by the following.

[0007] In this configuration, the upstream levitation stage has a first levitation plate group and a second levitation plate group arranged in the transport direction. Of these, the second levitation plate group is detachable from the first levitation plate group. For example, when the second levitation plate group is provided adjacent to the first levitation plate group, relatively long substrates can be processed in the transport direction. On the other hand, when the second levitation plate group is removed from the first levitation plate group, relatively short substrates can be processed in the transport direction. [Effects of the Invention]

[0008] As described above, according to the present invention, in a substrate processing apparatus that levitates a substrate and transports the substrate in a predetermined transport direction while supplying a processing liquid such as a resist solution to the upper surface of the substrate, it is possible to respond to changes in the substrate size in the transport direction at low cost and quickly. [Brief explanation of the drawing]

[0009] [Figure 1] This figure schematically shows the overall configuration of one embodiment of the substrate processing apparatus according to the present invention. [Figure 2] This diagram shows a levitation stage section suitable for large-sized substrates. [Figure 3] This figure shows a levitation stage section suitable for small-sized substrates. [Figure 4] This is a side view showing a floating stage suitable for a full-size substrate in a second embodiment of the substrate processing apparatus according to the present invention. [Figure 5] This is a side view showing a floating stage suitable for a half-size substrate in a second embodiment of the substrate processing apparatus according to the present invention. [Figure 6] This is a schematic plan view showing the configuration of the first floating plate group and the second floating plate group for each substrate size in a third embodiment of the substrate processing apparatus according to the present invention. [Figure 7] This is a side view showing a floating stage suitable for a full-size substrate in a fourth embodiment of the substrate processing apparatus according to the present invention. [Modes for carrying out the invention]

[0010] Figure 1 is a schematic diagram showing the overall configuration of one embodiment of the substrate processing apparatus according to the present invention. This substrate processing apparatus 1 is a slit coater that applies a processing liquid to the upper surface of a substrate S that is transported in a horizontal position from the left side to the right side in Figure 1. In the following figures, in order to clarify the arrangement of the parts of the apparatus, the transport direction of the substrate S will be referred to as the "X direction", the horizontal direction from the left side to the right side in Figure 1 will be referred to as the "+X direction", and the opposite direction will be referred to as the "-X direction". Furthermore, of the horizontal direction Y perpendicular to the X direction, the front side of the apparatus will be referred to as the "-Y direction", and the back side of the apparatus will be referred to as the "+Y direction". In addition, the upward and downward directions in the vertical direction Z will be referred to as the "+Z direction" and the "-Z direction", respectively.

[0011] First, the configuration and operation of the substrate processing apparatus 1 will be explained using Figure 1. The basic configuration and operating principle of the substrate processing apparatus 1 are the same as those described in Patent Document 1. Therefore, in this specification, detailed explanations of the components of the substrate processing apparatus 1 that are applicable to the same configuration as described in the aforementioned prior art, or whose structure can be easily understood from that description, may be omitted.

[0012] In the substrate processing apparatus 1, the input conveyor 100, input transfer unit 2, levitation stage unit 3, output transfer unit 4, and output conveyor 110 are arranged in close proximity in this order along the transport direction Dt (+X direction) of the substrate S, and as will be described in detail below, these form a transport path for the substrate S that extends in a substantially horizontal direction. In the following description, when indicating the positional relationship in relation to the transport direction Dt of the substrate S, the "upstream side in the transport direction Dt of the substrate S" may be simply abbreviated as "upstream side," and the "downstream side in the transport direction Dt of the substrate S" may be simply abbreviated as "downstream side." In this example, relative to a certain reference position, the (-X) side corresponds to the "upstream side," and the (+X) side corresponds to the "downstream side."

[0013] The substrate S to be processed is brought into the input conveyor 100 from the left side in Figure 1. The input conveyor 100 is equipped with a roller conveyor 101 and a rotational drive mechanism 102 that rotates it. The rotation of the roller conveyor 101 transports the substrate S in a horizontal position downstream, i.e., in the (+X) direction. The input transfer unit 2 is equipped with a roller conveyor 21 and a rotation / lifting drive mechanism 22 that has the function of rotating and lifting the roller conveyor. As the roller conveyor 21 rotates, the substrate S is transported further in the (+X) direction. Also, as the roller conveyor 21 is raised and lowered, the vertical position of the substrate S is changed. With the input transfer unit 2 configured in this way, the substrate S is transferred from the input conveyor 100 to the floating stage unit 3.

[0014] The levitation stage section 3 comprises a flat plate-shaped stage divided into three sections along the substrate transport direction Dt. Specifically, the levitation stage section 3 includes an upstream levitation stage 31, a coating stage 32, and a downstream levitation stage 33, and the upper surfaces of these stages form part of the same plane. The upper surfaces of the upstream levitation stage 31 and the downstream levitation stage 33 are provided with numerous injection holes arranged in a matrix for ejecting compressed air supplied from the levitation control mechanism 35, and the substrate S is pushed up by the ejected airflow and levitates. In this way, the lower surface of the substrate S is supported in a horizontal position with a gap between it and the upper surface of the stage. The distance between the lower surface of the substrate S and the upper surface of the stage, i.e., the amount of levitation, can be, for example, 10 micrometers to 500 micrometers.

[0015] On one hand, on the upper surface of the coating stage 32, ejection holes for ejecting compressed air and suction holes for sucking air between the lower surface of the substrate S and the upper surface of the stage are alternately arranged. By the floating control mechanism 35 controlling the ejection amount of the compressed air from the ejection holes and the suction amount from the suction holes, the distance between the lower surface of the substrate S and the upper surface of the coating stage 32 is precisely controlled. Thereby, the vertical position of the upper surface of the substrate S passing above the coating stage 32 is controlled to a specified value. As a specific configuration of the floating stage portion 3, for example, the one described in Japanese Patent No. 5346643 can be applied. However, in the present embodiment, in order to accommodate substrates S of different sizes in the conveyance direction Dt, the upstream floating stage 31 has a configuration different from that of Patent Document 1. This point will be described in detail later.

[0016] Note that lift pins (not shown in the figure) are provided on the upstream floating stage 31, and a lift pin drive mechanism 34 for raising and lowering these lift pins is provided in the floating stage portion 3.

[0017] The substrate S carried into the floating stage portion 3 via the input transfer portion 2 is given a propelling force in the (+X) direction by the rotation of the roller conveyor 21 and is conveyed onto the upstream floating stage 31. The upstream floating stage 31, the coating stage 32, and the downstream floating stage 33 support the substrate S in a floating state but do not have the function of moving the substrate S in the horizontal direction. The conveyance of the substrate S in the floating stage portion 3 is performed by a substrate conveyance portion 5 disposed below the upstream floating stage 31, the coating stage 32, and the downstream floating stage 33.

[0018] The substrate transfer unit 5 includes a chuck mechanism 51 that supports the substrate S from below by partially contacting the peripheral portion of the lower surface of the substrate S, and a suction / drive control mechanism 52 that applies negative pressure to a suction pad (not shown) provided on the holding member 513 of the chuck mechanism 51 to adsorb and hold the substrate S and has a function of reciprocating the chuck mechanism 51 in the X direction. In a state where the chuck mechanism 51 holds the substrate S, the lower surface of the substrate S is positioned higher than the upper surfaces of the respective stages of the floating stage unit 3. Therefore, the substrate S maintains a horizontal posture as a whole by the buoyancy applied from the floating stage unit 3 while the peripheral portion is adsorbed and held by the chuck mechanism 51.

[0019] The chuck mechanism 51 holds the substrate S carried into the floating stage unit 3 from the input transfer unit 2, and in this state, the chuck mechanism 51 moves in the (+X) direction. As a result, the substrate S is conveyed from above the upstream floating stage 31, via above the coating stage 32, to above the downstream floating stage 33. The conveyed substrate S is delivered to the output transfer unit 4 disposed on the (+X) side of the downstream floating stage 33. That is, the substrate S conveyed from above the upstream floating stage 31 to above the coating stage 32 corresponds to an example of an unprocessed substrate, and the substrate S conveyed from above the coating stage 32 to above the downstream floating stage 33 corresponds to an example of a processed substrate.

[0020] Among the respective stages of the floating stage unit 3, the downstream floating stage 33 is capable of ascending and descending between a lower position where the upper surface position is lower than the upper surface position of the chuck mechanism 51 and an upper position where the upper surface position is higher than the upper surface position of the chuck mechanism 51. For this purpose, the downstream floating stage 33 is supported by an elevating drive mechanism 36. The elevating drive mechanism 36 raises and lowers the downstream floating stage 33 in accordance with a control command from the control unit 9 and positions it at a predetermined height according to the progress of the process.

[0021] The output transfer unit 4 includes a roller conveyor 41 and a rotation / lifting drive mechanism 42 that has the function of rotating and raising / lowering the roller conveyor 41. As the roller conveyor 41 rotates, a thrust force in the (+X) direction is applied to the substrate S, and the substrate S is further transported along the transport direction Dt. In addition, as the roller conveyor 41 is raised and lowered, the vertical position of the substrate S is changed. The output transfer unit 4 transfers the substrate S from above the downstream levitation stage 33 to the output conveyor 110.

[0022] The output conveyor 110 comprises a roller conveyor 111 and a rotational drive mechanism 112 that rotates it. The rotation of the roller conveyor 111 further transports the substrate S in the (+X) direction, and it is finally discharged outside the substrate processing apparatus 1. The input conveyor 100 and the output conveyor 110 may be provided as part of the configuration of the substrate processing apparatus 1, but they may also be separate from the substrate processing apparatus 1. For example, a substrate dispensing mechanism of a separate unit provided upstream of the substrate processing apparatus 1 may be used as the input conveyor 100. Also, a substrate receiving mechanism of a separate unit provided downstream of the substrate processing apparatus 1 may be used as the output conveyor 110.

[0023] A coating unit 7 for applying a processing liquid to the upper surface of the substrate S is positioned on the transport path of the substrate S being transported in this manner. The coating unit 7 has a nozzle 71 which is a slit nozzle. Processing liquid is supplied to the nozzle 71 from a processing liquid supply unit (not shown), and the processing liquid is discharged from a discharge port that opens downward at the bottom of the nozzle.

[0024] The nozzle 71 is movable and positionable in the X and Z directions by the positioning mechanism 79 of the coating unit 7. The positioning mechanism 79 positions the nozzle 71 at the coating position above the coating stage 32 (the position shown by the dotted line). The processing liquid is discharged from the nozzle 71 positioned at the coating position and applied to the substrate S as it is transported between the nozzle and the coating stage 32. In this way, the processing liquid is applied to the substrate S.

[0025] A maintenance unit 8 for performing maintenance on the nozzle 71 is provided above the transport path of the substrate S. The maintenance unit 8 comprises a cleaning fluid storage tank 82, a nozzle cleaner 81, and a maintenance control mechanism 89 that controls the operation of the cleaning fluid storage tank 82 and the nozzle cleaner 81, all located within a bat 80.

[0026] When the nozzle 71 is in the position above the nozzle cleaner 81 (cleaning position), indicated by the solid line, the nozzle cleaner 81 removes the processing liquid adhering to the area around the nozzle 71's discharge port. By performing this cleaning process on the nozzle 71 before moving it to the application position, the discharge of the processing liquid at the application position can be stabilized from the initial stage.

[0027] Furthermore, the positioning mechanism 79 can position the nozzle 71 to a position (standby position) where the lower end of the nozzle is in contact with the cleaning fluid stored in the cleaning fluid storage tank 82. When the coating process using the nozzle 71 is not performed, the nozzle 71 is positioned in this standby position. Alternatively, the cleaning fluid may be treated with ultrasonic waves to clean the lower end of the nozzle.

[0028] In addition, the substrate processing apparatus 1 is equipped with a control unit 9 for controlling the operation of each part of the apparatus. The control unit 9 includes storage means for storing predetermined control programs and various data, calculation means such as a CPU that executes the control program to cause each part of the apparatus to perform predetermined operations, and interface means for exchanging information with the user and external devices.

[0029] Next, the configuration of the levitation stage section 3 will be explained with reference to Figures 2 and 3. Figure 2 is a diagram showing a levitation stage section suitable for large-sized substrates. Figure 3 is a diagram showing a levitation stage section suitable for small-sized substrates. Here, "small-sized substrate" means a substrate having a first length Lh in the transport direction Dt, and "large-sized substrate" means a substrate having the same width W as the small-sized substrate, but having a second length Lf that is longer than the first length Lh in the transport direction Dt. The upper part of Figures 2 and 3 shows a plan view of the levitation stage section 3 as seen from above, and the lower part shows a side view of the levitation stage section 3. As is clear from these drawings, in this embodiment, in the transport direction Dt, the substrate Sh is half the size of the substrate Sf. Therefore, in order to distinguish between large-sized substrates and small-sized substrates, they are sometimes referred to as "full-size substrate Sf" and "half-size substrate Sh," respectively. On the other hand, when there is no distinction between the two, they are referred to as "substrate S."

[0030] In this embodiment, the upstream floating stage 31 has a different configuration from the upstream floating stage described in Patent Document 1 in order to accommodate both full-size substrates Sf and half-size substrates Sh. More specifically, as shown in Figures 2 and 3, the upstream floating stage 31 has a first floating plate group 311 arranged adjacent to the upstream side of the coating stage 32 in the transport direction Dt, and a second floating plate group 312 that is detachably provided adjacent to the upstream side of the first floating plate group 311 in the transport direction Dt. The first floating plate group 311 is provided in a state of substantially gapless contact with the coating stage 32 (in Figures 2 and 3, a small gap is provided for the convenience of illustrating the distinction between the two). The step difference between the upper surface of the first floating plate group 311 and the upper surface of the coating stage 32 is several tens of micrometers or less. Furthermore, as shown in Figure 2, when the second floating plate group 312 is placed adjacent to the first floating plate group 311, the two are arranged in a state of substantially gapless contact (in Figure 2, a small gap is provided for the sake of illustration to distinguish between the two). As a result, the coating of the processing liquid at the coating stage 32 is performed with high precision, and the untreated substrate S before the processing liquid is applied is smoothly transported from the upstream floating stage 31 to the coating stage 32.

[0031] Similarly, the coating stage 32 and the downstream floating stage 33 are provided in a state of virtually gapless contact, and the difference in height between them is less than a few tens of micrometers. As a result, the coating of the processing liquid at the coating stage 32 is performed with high precision, and the substrate to which the processing liquid has been applied (corresponding to the "processed substrate" of the present invention) is smoothly transported from the coating stage 32 to the downstream floating stage 33.

[0032] In this embodiment, the first levitation plate group 311 consists of one first levitation plate 313, and the second levitation plate group 312 consists of one second levitation plate 314. Both the first levitation plate 313 and the second levitation plate 314 have a planar size suitable for levitating a half-size substrate Sh, i.e., (first length Lh × width W). When coating a full-size substrate Sf, the upstream levitation stage 31, as shown in Figure 2, arranges the first levitation plate 313 and the second levitation plate 314 in the transport direction Dt to levitate the full-size substrate Sf. On the other hand, when coating a half-size substrate Sh, as shown in Figure 3, the second levitation plate 314 is removed, and the upstream levitation stage 31 levitates the half-size substrate Sh using only the first levitation plate 313.

[0033] Furthermore, the levitation stage section 3 has the following configuration in order to position the upstream levitation stage 31, the coating stage 32, and the downstream levitation stage 33 with the accuracy described above. When coating is performed on a full-size substrate Sf, three support bases 371 to 373 are used in the levitation stage section 3, as shown in Figure 2. On the other hand, when coating is performed on a half-size substrate Sh, support base 371 is removed along with the second levitation plate 314 and the frame section 381, as shown in Figure 3, and only support bases 372 to 373 are used. In this embodiment, the total length in the transport direction of all levitation plates constituting the upstream levitation stage 31 matches that of a full-size substrate Sf or a half-size substrate Sh, but this may not match in relation to the adjacent roller conveyor 21. For example, the total length in the transport direction of the combined downstream roller of the roller conveyor 21 and all levitation plates constituting the upstream levitation stage 31 may be configured to match that of a full-size substrate Sf or a half-size substrate Sh. The same applies to the embodiments described later.

[0034] A frame section 381 is provided on the upper surface of the support base 371. Multiple adjustment bolts 39 are erected on the upper surface of this frame section 381, and their tops support the second floating plate 314 (second floating plate group 312) from below. By turning the threaded portion of each adjustment bolt 39, the height and horizontality of the second floating plate 314 in the vertical direction Z can be adjusted. This type of adjustment using adjustment bolts 39 is also applied to the frame section, which will be described later.

[0035] The support base 372 supports the first floating plate 313 (first floating plate group 311) via the frame portion 382, ​​supports the coating stage 32 via the precision stone 383, and supports a portion of the downstream floating stage 33 via the frame portion 384.

[0036] More specifically, as shown in Figures 2 and 3, a precision stone 383 is provided on the coating support area RC on the upper surface of the support base 372, and a coating stage 32 is attached to the upper surface of the precision stone 383. The precision stone 15 is a precisely processed rectangular parallelepiped stone material. The precision stone 15 is formed from, for example, granite. When a glass substrate of, for example, 2160 mm × 2460 mm (G8) is used as the full-size substrate Sf, the size of the precision stone 15 is 2000 mm in width (length in the Y direction), 500 mm in length (length in the X direction), and 300 mm in height (length in the Z direction). The width of the precision stone 15 can be set to an appropriate value according to the size of the substrate S to be processed. Each face of the rectangular parallelepiped of the precision stone 15 is finished by high-precision surface finishing. In particular, the flatness of the upper surface of the precision stone 15 is set to 3 μm or more and 10 μm or less (5 μm in this embodiment).

[0037] A frame section 382 is provided on the upper surface of the support base 372 in the upstream support area RU, which is upstream of the coating support area RC. The first floating plate 313 is supported by a plurality of adjustment bolts 39 erected from the upper surface of the frame section 382. In addition, a frame section 384 is provided on the upper surface of the support base 372 in the downstream support area RD, which is downstream of the coating support area RC. The upstream end of the downstream floating stage 33 is supported by a plurality of adjustment bolts 39 erected from the upper surface of the frame section 384.

[0038] Frame sections 385 and 386 are provided on the upper surface of the support base 373. Multiple adjustment bolts 39 are erected on the upper surface of these frame sections 384 and 385, and their tops support the central and downstream ends of the downstream floating stage 33.

[0039] The floating stage section 3 configured in this way is divided into a first block B1, which consists of a support base 371, a frame section 381, and a second floating plate 314 (second floating plate group 312), and a second block B2, which excludes the first block B1. As shown in Figure 2, by combining the first block B1 with the second block B2, the floating stage section 3 can apply the processing solution to a full-size substrate Sf. On the other hand, as shown in Figure 3, the floating stage section 3, which consists only of the second block B2, can apply the processing solution to a half-size substrate Sh. Therefore, the substrate processing apparatus 1 equipped with the floating stage section 3 has the versatility to handle both full-size substrates S and half-size substrates S. As a result, it is possible to respond to changes in substrate size in the transport direction Dt quickly and at low cost.

[0040] Furthermore, by standardizing the first levitation plate 313 and the second levitation plate 314, design man-hours can be reduced, and equipment costs can also be lowered.

[0041] Furthermore, in the above embodiment, the upstream levitation stage 31 is composed of a first levitation plate group 311 and a second levitation plate group 312, which are separated from each other in the transport direction Dt. In conventional devices, the upstream levitation stage 31 is composed of a single levitation plate. For example, in order to accommodate a glass substrate of 2160 mm × 2460 mm (G8), it is necessary to prepare a stage material with a corresponding planar size for the levitation plate, which has made it difficult to obtain the material. In contrast, in the first embodiment, since the upstream levitation stage 31 is divided into a first levitation plate group 311 and a second levitation plate group 312, the availability of stage materials can be improved. From this viewpoint, the downstream levitation stage 33 may also be divided into two, similar to the upstream levitation stage 31.

[0042] Furthermore, in the above embodiment, a frame portion 382 is provided adjacent to the coating stage 32 on a support base 372 which corresponds to an example of the "coating support base" of the present invention. As a result, the following effects can be obtained. Since the coating process is performed on the coating stage 32, as described above, it is necessary to maintain a step difference of several tens of micrometers or less between the upper surface of the first floating plate group 311 and the upper surface of the coating stage 32. To satisfy this, it is preferable that the first floating plate group 311 and the coating stage 32 are supported by the same support base 372 rather than being supported by different support bases. In this embodiment, the frame portion 382 corresponds to an example of the "first frame portion" of the present invention.

[0043] By the way, in the first embodiment described above, the first floating plate group 311 and the second floating plate group 312 are each composed of a single first floating plate 313 and a single second floating plate 314, but the number of constituent plates is not limited to "1" and can be arbitrary. For example, as shown in Figures 4 and 5, the number of constituent plates in the first floating plate group 311 may be set to "2" (second embodiment).

[0044] Figure 4 is a side view showing a levitation stage suitable for a full-size substrate in a second embodiment of the substrate processing apparatus according to the present invention. Figure 5 is a side view showing a levitation stage suitable for a half-size substrate in a second embodiment of the substrate processing apparatus according to the present invention. In the second embodiment, the first levitation plate 315 constituting the first levitation plate group 311 has a planar size suitable for levitating a quarter-size substrate Sq, and the first levitation plate group 311 is constructed by arranging two first levitation plates 315 in the transport direction Dt. Here, "quarter-size substrate Sq" means a substrate having a planar size of (length Lq × width W) in the transport direction Dt, where length Lq is half the length of a half-size substrate Sh, as shown in column (c) of Figure 6, which will be explained later. In other words, when performing a coating process on a full-size substrate Sf, the upstream levitation stage 31, as shown in Figure 4, has two first levitation plates 315 and a second levitation plate 314 arranged in the transport direction Dt to levitate the full-size substrate Sf. On the other hand, when applying a coating to a half-size substrate Sh, as shown in Figure 5, the second levitation plate 314 is removed, and the upstream levitation stage 31 levitates the half-size substrate Sh using two first levitation plates 315.

[0045] Thus, the same effects and advantages as in the first embodiment can be obtained in the second embodiment as well. Furthermore, in the second embodiment, since the first floating plate group 311 is divided into two first floating plates 315, the availability of stage material is further improved. From this viewpoint, the second floating plate group 312 and the downstream floating stage 33 may also be divided into multiple parts, similar to the first floating plate group 311.

[0046] Furthermore, in the second embodiment, by providing a frame portion 382 for each first floating plate 315, the upstream floating stage 31 can be configured in three different patterns (third embodiment).

[0047] Figure 6 is a schematic plan view showing the configuration of the first and second floating plate groups for each substrate size in the third embodiment of the substrate processing apparatus according to the present invention. The three types of patterns are as follows: • Full-size pattern shown in column (a) of Figure 6… Two first floating plates 315 + second floating plate 314, • Half-size pattern shown in column (b) of Figure 6... Two first levitation plates 315, • Quarter-size pattern shown in column (c) of Figure 6... One first levitation plate 315, A variety of options are available, allowing you to select a pattern according to the substrate size and perform the coating process.

[0048] Figure 7 is a side view showing a levitation stage suitable for a full-size substrate in a fourth embodiment of the substrate processing apparatus according to the present invention. The main difference between the fourth embodiment and the first embodiment is that the downstream levitation stage 33 is divided into two parts, similar to the upstream levitation stage 31. Since the other components are the same as in the first embodiment, the same reference numerals are used for the same components and their descriptions are omitted.

[0049] The downstream levitation stage 33 is composed of a third levitation plate group 331 and a fourth levitation plate group 332, which are separated from each other in the transport direction Dt. In conventional devices, the downstream levitation stage 33 is composed of a single levitation plate. Therefore, similar to the inlet levitation stage, obtaining materials was difficult. In contrast, in the fourth embodiment, the downstream levitation stage 33 is divided into a third levitation plate group 331 and a fourth levitation plate group 332, thus improving the availability of stage materials.

[0050] Furthermore, as shown in Figure 7, the third floating plate group 331 has a frame portion 384 provided in the downstream support area RD of the support base 372, and is supported by a plurality of adjustment bolts 39 erected from the upper surface of the frame portion 384. In other words, in the fourth embodiment, since the first floating plate group 311, the coating stage 32, and the third floating plate group 331 are all supported by the same support base 372, the step difference between the upper surface of the third floating plate group 331 and the upper surface of the coating stage 32 can be easily maintained at several tens of micrometers or less. Thus, in the fourth embodiment, the frame portion 384 corresponds to an example of the "second frame portion" of the present invention.

[0051] Furthermore, in the above embodiment, frame portions 382 and 384 are provided adjacent to the coating stage 32 on a support base 372 which corresponds to an example of the "coating support base" of the present invention. As a result, the following effects can be obtained. Since the coating process is performed on the coating stage 32, as described above, it is necessary to maintain the step difference between the upper surface of the first floating plate group 311 and the upper surface of the coating stage 32 to be several tens of micrometers or less. The same applies to the step difference between the upper surface of the coating stage 32 and the upper surface of the downstream floating stage 33. In order to satisfy these, it is preferable to provide a frame portion 382 that supports the first floating plate group 311 and a frame portion 384 that supports the downstream floating stage 33 on the upper surface of the support base 372 for supporting the coating stage 32, as in this embodiment.

[0052] It should be noted that the present invention is not limited to the embodiments described above, and various modifications can be made to those described above without departing from the spirit of the invention. In the embodiments described above, the "large-size substrate" and "small-size substrate" of the present invention are exemplified by a full-size substrate Sf and a half-size substrate Sh having a 2:1 length ratio in the transport direction Dt, but the combination of "large-size substrate" and "small-size substrate" is not limited to this, and is arbitrary as long as the width W is the same dimension.

[0053] Furthermore, although the above embodiment applies the present invention to a substrate processing apparatus that supplies a processing liquid to the upper surface of a substrate for coating, the present invention can also be applied to a substrate processing apparatus that supplies a processing liquid to the upper surface of a substrate for purposes other than coating. [Industrial applicability]

[0054] This invention can be applied to all substrate processing apparatuses that levitate and transport a substrate while supplying a processing liquid, such as a resist solution, to the upper surface of the substrate. [Explanation of Symbols]

[0055] 1…Substrate processing equipment 3…Floating Stage Section 31…Upstream surfacing stage 32…Coating stage 33… Downstream floating stage 71…Nozzle 311...First floating plate group 312...Second floating plate group 313,315…First floating plate 314...Second floating plate 331...Third floating plate group 332...Fourth floating plate group 372…Support stand 382... Frame stand (1st frame stand) 384... Frame stand (2nd frame stand) Dt... Conveying direction RC…Coating support area RD…Downstream support area RU…Upstream support area S... Circuit board Sf...Full-size circuit board Sh... Half-size circuit board Sq...Quarter-size substrate

Claims

1. In a substrate processing apparatus that supplies a processing liquid from a nozzle to the upper surface of a substrate while transporting the substrate floating on a floating stage in a predetermined transport direction, The floating stage section comprises a coating stage located opposite the nozzle, an upstream floating stage positioned upstream of the coating stage in the transport direction, and a downstream floating stage positioned downstream of the coating stage in the transport direction. The aforementioned upstream floating stage is At least one first levitation plate for levitating the substrate is arranged in the transport direction, and the first levitation plate group is arranged adjacent to the upstream side of the coating stage in the transport direction, At least one second levitation plate for levitating the substrate is arranged in the transport direction, and the second levitation plate group is detachably provided adjacent to the upstream side of the first levitation plate group in the transport direction, It has, A substrate processing apparatus that can switch between a first substrate transport, in which the second group of floating plates is removed from the upstream floating stage and the substrate is transported to the coating stage using only the first group of floating plates, and a second substrate transport, in which the second group of floating plates is placed adjacent to the first group of floating plates and the substrate is transported to the coating stage using both the second group of floating plates and the first group of floating plates, depending on the size of the substrate in the transport direction.

2. A substrate processing apparatus according to claim 1, When supplying the processing liquid, among a small-sized substrate having a first length and a large-sized substrate having a second length longer than the first length in the transport direction, the small-sized substrate is used as the substrate. The first floating plate group is configured such that its length in the transport direction is a first length. The second group of floating plates is removed from the upstream floating stage in a substrate processing apparatus.

3. A substrate processing apparatus according to claim 2, When the aforementioned large-sized substrate is used as the substrate and the processing liquid is supplied, A substrate processing apparatus comprising a second group of floating plates arranged adjacent to the first group of floating plates, configured such that the combined length of the first and second groups of floating plates in the transport direction is the second length.

4. A substrate processing apparatus according to any one of claims 1 to 3, The coating support stand is provided on its upper surface, having a coating support area for supporting the coating stage. The substrate processing apparatus comprises an upstream levitation stage provided on the upper surface of the coating support base in the upstream support region on the upstream side of the coating support region in the transport direction, and having a first frame portion on its upper surface that holds the first levitation plate group.

5. A substrate processing apparatus according to any one of claims 1 to 3, The aforementioned downstream floating stage is At least one third levitation plate for levitating a processed substrate that has received the processing liquid is arranged in the transport direction, and a group of third levitation plates is arranged adjacent to the downstream side of the coating stage in the transport direction, At least one fourth levitation plate for levitating the processed substrate is arranged in the transport direction, and the fourth levitation plate group is detachably provided adjacent to the downstream side of the third levitation plate group in the transport direction, A substrate processing apparatus having

6. A substrate processing apparatus according to claim 5, The coating support stand is provided on its upper surface, having a coating support area for supporting the coating stage. The upstream levitation stage is provided on the upper surface of the coating support base in the upstream support region on the upstream side of the coating support region in the conveying direction, and has a first frame portion on its upper surface that holds the first levitation plate group. The substrate processing apparatus comprises a downstream levitation stage provided on the upper surface of the coating support base in the downstream support area on the downstream side of the coating support area in the transport direction, and having a second frame portion on its upper surface that holds the third levitation plate group.

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