Wiring devices that supply DC power

Abstract

To provide a wiring accessory which supplies direct current power and is excellent in heat radiation performance.SOLUTION: A wiring accessory 2 for supplying direct current power which is one example of an embodiment includes: a substrate on which electronic components are mounted; a terminal 52 that is mounted on the substrate to output direct current power; a first housing 10 positioned at a power output-side end part of the terminal; and a second housing 20 provided on the opposite side of the power output-side end. A wiring device 2 includes a heat insulation member which is disposed between the first housing 10 and the second housing 20 or between one or both of the terminal 52 and the substrate and an inner wall surface of the first housing 10 and which is composed of a material having a lower thermal conductivity than that of the second housing 20.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a wiring device that supplies DC power, and particularly to a wiring device that supplies DC power and has a USB (Universal Serial Bus) terminal.

Background Art

[0002] Conventionally, a USB hub is widely known as a wiring device for supplying DC power to electronic devices such as smartphones, tablet terminals, and notebook computers. A wiring device such as a USB hub includes a substrate on which electronic components are mounted, a terminal that outputs DC power, and a housing that surrounds the substrate and the terminal. The electronic components include a power conversion component that converts AC power into DC power, and an output circuit component for outputting DC power from the terminal. These electronic components are distributed and arranged on a plurality of substrates or arranged on one substrate. Although electronic components such as power conversion components and terminals may generate heat during operation, conventionally, the influence of this heat generation has not been a major problem. However, in recent years, the output of DC power supply devices has been increasing and the devices have been miniaturized, and the heat generation density defined as the output per unit volume has been increasing significantly.

[0003] With the increase in the heat generation density of the wiring device that supplies DC power, it is strongly required to improve the heat insulation so that the heat generated from the heat generating components such as electronic components does not reach the housing portion on the power output side that can be touched by the user when installed at an installation location such as a wall. Patent Document 1 describes that a main body unit that houses a substrate on which electronic components are mounted is configured by fixing two casings on the front side and the rear side, and the front casing having a power output side end exposed from the wall is formed of resin.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

[0005] Incidentally, in order to prevent heat generated from heat-generating components from being transferred to the power output side housing portion, which can be touched by the user when a wiring device supplying DC power is installed in its location, it is conceivable to increase the thermal resistance between the heat-generating components and the power output side housing portion. Conventional technologies, including the structure disclosed in Patent Document 1, do not adequately consider increasing this thermal resistance, and there is still considerable room for improvement. In particular, wiring devices with high heat density require the application of a structure with excellent heat insulation performance by increasing the thermal resistance between the heat-generating components and the power output side housing portion. [Means for solving the problem]

[0006] A wiring device for supplying DC power, according to one aspect of the present disclosure, is characterized by comprising: a substrate on which electronic components are mounted; a terminal mounted on the substrate and outputting DC power; a first housing located at the power output end of the terminal; a second housing provided on the opposite side from the power output end; and a heat insulating member disposed between the first housing and the second housing, or between the inner wall surface of the first housing and one or both of the terminal and the substrate, the heat insulating member being made of a material with lower thermal conductivity than the second housing. [Effects of the Invention]

[0007] This disclosure provides a wiring device for supplying DC power with excellent thermal insulation performance. The wiring device for supplying DC power according to this disclosure has a thermal insulation structure that can increase the thermal resistance between the heat-generating component and the first housing, which is the housing portion on the power output side. Therefore, even when the heat generation density is high, it is possible to effectively suppress the transfer of heat generated from the heat-generating component to parts that the user can touch. [Brief explanation of the drawing]

[0008] [Figure 1] This is a perspective view of an outlet using a wiring device that supplies DC power, which is the first embodiment. [Figure 2] This is a perspective view showing the appearance of a wiring device that supplies DC power, which is the first embodiment. [Figure 3] This is an exploded perspective view of a wiring device that supplies DC power, which is the first embodiment. [Figure 4] This is a cross-sectional view in the front-to-back direction of a wiring device that supplies DC power, which is the first embodiment. [Figure 5] This is a left-right cross-sectional view illustrating the thermal insulation structure in the power output side portion of a wiring device that supplies DC power, which is the first embodiment. [Figure 6] This is a left-right cross-sectional view illustrating the engagement structure between the first housing and the heat insulating member in the first embodiment. [Figure 7] This figure corresponds to Figure 5, which shows a wiring device that supplies DC power, representing a second embodiment. [Figure 8] This is a schematic cross-sectional view in the left-right direction of a wiring device that supplies DC power, which is a third embodiment. [Figure 9] This is a schematic cross-sectional view in the left-right direction of a wiring device that supplies DC power, which is the fourth embodiment. [Figure 10] This is a schematic cross-sectional view in the left-right direction of a wiring device that supplies DC power, which is the fifth embodiment. [Figure 11] This is a schematic cross-sectional view in the left-right direction of a wiring device that supplies DC power, which is the sixth embodiment. [Modes for carrying out the invention]

[0009] Hereinafter, an example of an embodiment of a wiring device for supplying DC power according to this disclosure will be described in detail with reference to the drawings. Note that the configurations obtained by selectively combining the various embodiments and modified components described below are included within the scope of this disclosure.

[0010] [First Embodiment] Referring to Figures 1 to 6, the wiring device 2 that supplies DC power, which is the first embodiment, will be described in detail. Figure 1 is a perspective view of the outlet 1 using the wiring device 2.

[0011] As shown in Figure 1, the outlet 1 is a wiring device comprising two wiring devices 2 that supply DC power and one power outlet device 3, and is installed in the wall 100 of a building. The outlet 1 has a frame-shaped decorative plate 4 with an opening 4a formed therein, and the front surfaces 2a and 3a of the wiring devices 2 and power outlet device 3 are exposed through the opening 4a of the decorative plate 4. The decorative plate 4 is a rectangular frame-shaped plate when viewed from the front, and covers the installation holes formed in the wall 100, the mounting frames installed around the installation holes, etc., so that they are not visible. The outlet 1 includes, for example, a frame-shaped metal plate that is screwed to the mounting frame. The decorative plate 4 is fixed to the metal plate by, for example, hooking claws formed on its back surface into holes in the metal plate.

[0012] The outlet 1 is installed with the wiring device 2 and power outlet device 3 inserted into a mounting hole formed in the wall 100. On the front of the outlet 1, which is positioned along the wall surface, only the front surfaces 2a and 3a of the wiring device 2 and power outlet device 3 are exposed through the opening 4a of the decorative plate 4. As will be described in more detail later, the wiring device 2 includes electronic components such as a power conversion component that converts AC power to DC power, and terminals that output DC power, and is equipped with a heat-insulating structure to prevent heat from one or both of the electronic components and terminals from being transferred to the front surface 2a, which is the part that the user can touch. On the other hand, the wiring device 2 may also have a heat dissipation structure to effectively reduce the heat generated from the electronic components, provided on the side opposite to the power output side end where the front surface 2a is located.

[0013] In the example shown in FIG. 1, the outlet 1 is installed on the wall 100 such that two wiring devices 2 are arranged adjacent to each other, and the wiring devices 2 and the power outlet device 3 are arranged vertically. The two wiring devices 2 are arranged above the power outlet device 3, but in the outlet including the wiring devices 2, these arrangements are not particularly limited, and the number of the wiring devices 2 is not particularly limited either. Further, the outlet including the wiring devices 2 may include an optical outlet, a LAN outlet, a telephone line outlet, etc. instead of the power outlet device 3, or may include only the wiring devices 2.

[0014] In this specification, for the sake of convenience of explanation, terms indicating the front-back, up-down, and left-right directions are used for the outlet 1, the wiring device 2, and each component of the wiring device 2. The front-back direction means the direction in which the connector connected to the wiring device 2 is inserted and removed. The up-down direction is the direction along the vertical direction, and the left-right direction is the direction orthogonal to the up-down direction and the front-back direction. The left and right refer to the left and right when the wiring device 2 is viewed from the front.

[0015] An example of the wiring device 2 is a USB outlet device. The USB outlet device is a device to which a USB connector 102 can be connected, includes a power conversion component that converts AC power into DC power, and supplies DC power to an electronic device 101 such as a smartphone. In FIG. 1, the USB connector 102 of the cable 103 extending from the electronic device 101 is connected to the wiring device 2. In the present embodiment, the wiring device 2 will be described as being a USB outlet device. The power outlet device 3 is a general outlet device that outputs AC power of 100V or 200V. On the front surface of the outlet 1, the connection ports 2b of the two wiring devices 2 and the connection port 3b of the power outlet device 3 are provided side by side in the up-down direction.

[0016] As used in this specification, "USB" includes various generations (transfer speed specifications) of USB, such as USB1.0, USB1.1, USB2.0, USB3.0, USB3.1, USB3.2, USB4, etc. Also, the terminal shape of the USB is not particularly limited and may be any of the A terminal, B terminal, C terminal, mini-USB, micro-USB, etc. In the example shown in FIG. 1, the outlet 1 including the wiring device 2 is installed on the wall 100, but the wiring device 2 may be installed on furniture such as a desk, shelf, counter, bed, etc., or on vehicles such as an automobile, airplane, railway vehicle, etc.

[0017] FIG. 2 is a perspective view showing the appearance of the wiring device 2, and FIG. 3 is an exploded perspective view of the wiring device 2.

[0018] As shown in FIGS. 2 and 3, the wiring device 2 includes, as a housing forming the external shape of the device, a first housing 10 located at the power output side end of the terminal 52 that outputs DC power described later, a second housing 20 provided on the side opposite to the power output side end, and a third housing 30. The third housing 30 corresponds to a heat insulating member. The wiring device 2 has an external shape that is generally rectangular parallelepiped, with the length in the vertical direction < the length in the horizontal direction < the length in the front-rear direction. Note that the magnitude relationship of the length in the vertical direction, the length in the horizontal direction, and the length in the front-rear direction of the wiring device 2 is not limited to this. The third housing 30 is fixed to the second housing 20 by a snap fit structure 70. The first housing 10 is connected to the third housing 30 by a locking structure using locking pieces as described later. Thereby, the three housings 10, 20, 30 are integrated, and an internal space 72 (see FIG. 4 described later) for accommodating power conversion components and the like is formed. The second housing 20 is configured by connecting a first member 20a and a second member 20b that are divided in the vertical direction.

[0019] The snap-fit ​​structure 70 consists of a pair of fixing pieces 32 formed on the third housing 30, and projections 23 and 24 formed on the outer surfaces 21 and 22 of the first and second members, respectively, which fit into the openings 33 of the fixing pieces 32. The first member 20a and the second member 20b are assembled in a first assembly direction X along the vertical direction, and the third housing 30 is provided so as to sandwich the front ends of the first member 20a and the second member 20b from both the left and right sides. In addition, the ends of the first member 20a and the second member 20b opposite to the first housing 10 (rear ends) are fixed together using screws 71 (Figure 3).

[0020] The first housing 10 has a connection port 2b into which a USB connector 102 can be inserted, and the surface of the first housing 10 becomes the front surface 2a of the wiring device 2 in the outlet 1. That is, the wiring device 2 is fixed to the mounting frame of the outlet 1 such that the surface of the first housing 10, into which the connection port 2b is formed, is exposed through the opening 4a of the decorative plate 4. The second housing 20 and the third housing 30 are located inside the wall 100 and are not placed in a location that a user's hands would touch under normal use.

[0021] The wiring device 2 comprises a first circuit board 40 on which electronic components including a power conversion component that converts AC power to DC power are mounted, and a second circuit board 50 on which electronic components including an output circuit component that outputs DC power are mounted, and a terminal 52 that outputs DC power. The first circuit board 40 has an insulating circuit board 41 and electronic components including a power conversion component arranged on the insulating circuit board 41. The second circuit board 50 has an insulating circuit board 51 and electronic components including an output circuit component arranged on the insulating circuit board 51. The terminal 52 is a USB terminal and is mounted on the insulating circuit board 51 of the second circuit board 50.

[0022] The first housing 10 and the third housing 30 surround the second circuit board 50, and the first member 20a and the second member 20b of the second housing 20 surround the first circuit board 40. The first housing 10 surrounds the front end, which is the power output end of the terminal 52, and the third housing 30 surrounds the insulating substrate 51 of the second circuit board 50 and the electronic components placed on the insulating substrate 51. A portion of the first circuit board 40 may extend into the interior of the third housing 30. Conversely, a portion of the second circuit board 50, for example, only the insulating substrate 51 and the electronic components placed on the second housing 20 side of the insulating substrate 51, may extend into the interior of the second housing 20.

[0023] The third housing 30 is positioned between the first housing 10 and the second housing 20 and constitutes a part of the housing that forms the outer surface of the wiring device 2. Furthermore, the front end wall portion 34 (see Figure 5 below), which is part of the third housing 30, is positioned between the inner wall surface of the first housing 10 and the second substrate 50. In addition, the third housing 30 is made of a material with lower thermal conductivity than the second housing 20. As a result, contact thermal resistance is generated between the first housing 10 and the third housing 30, thus forming an insulating structure that can increase the thermal resistance between the heat-generating electronic component and the first housing 10, which is the housing portion on the power output side.

[0024] As the wiring device 2 becomes more powerful and smaller, the heat density of the device increases significantly. However, because the above-described heat-insulating structure is formed, the heat generated from the heat-generating components can be effectively suppressed from being transferred to the front surface 2a, which is the part that the user can touch.

[0025] Although not shown in the diagram, the wiring device 2 may also be configured to include a heat dissipation member interposed between the inner surface of at least one of the first member 20a and the second member 20b and at least one of the power conversion component and the insulating substrate 41 that constitute the first substrate 40. With this configuration, a heat dissipation path can be formed from the power conversion component, which is the heat source, to the first member 20a or the second member 20b via the heat dissipation member, and a heat dissipation structure with low contact thermal resistance and excellent heat dissipation can be formed. Furthermore, this heat dissipation structure can be formed on the rear side of the wiring device 2 opposite to the power output side.

[0026] The following will provide a detailed explanation of each component of the wiring device 2, with reference to Figures 3 to 6 as appropriate. Figure 4 is a front-to-back cross-sectional view of the wiring device 2. Figure 5 is a left-to-right cross-sectional view illustrating the thermal insulation structure on the power output side of the wiring device 2. Figure 6 is a left-to-right cross-sectional view illustrating the engagement structure between the first housing 10 and the third housing 30.

[0027] [First circuit board] As shown in Figures 3 and 4, the first substrate 40 is positioned in the internal space 72 enclosed by the first member 20a and the second member 20b such that the substrate surface is perpendicular to the second assembly direction Y in which the first member 20a and the second member 20b are assembled. In other words, the approximate normal direction of the surface of the insulating substrate 41 is the second assembly direction Y (up and down direction), and the first substrate 40 is positioned so that the surface of the insulating substrate 41 is aligned with the left-right and front-back directions. Here, the approximate normal direction means a direction that is substantially recognized as the normal direction, and for example, includes a range that is tilted by about 5° from the normal.

[0028] The first substrate 40 is a printed circuit board containing electronic components arranged on an insulating substrate 41. The first substrate 40 includes a power supply circuit for converting AC power supplied from the grid power supply into DC current and outputting it to terminal 52 of the second substrate 50. The power supply circuit is configured by electrically connecting power conversion components through wiring formed on the surface and inside the insulating substrate 41. The first substrate 40 is provided with terminals for connection to the grid power supply, and at least one of the first member 20a and the second member 20b has a hole for inserting a cable connected to the grid power supply (neither is shown).

[0029] The first substrate 40 includes semiconductor elements 42, a transformer 43, a common-mode coil 44, an electrolytic capacitor 45, etc., as power conversion components in a broad sense that constitute the power supply circuit. Examples of semiconductor elements 42 include switching elements, diodes, transistors, etc. When the power supply circuit is in operation, some of the power conversion components generate heat, and the amount of heat generated by the semiconductor elements 42 and the transformer 43 is particularly large. Therefore, the heat generated from the power conversion components such as the semiconductor elements 42 and the transformer 43 is easily transferred to the second housing 20 by radiation, convection, and heat conduction via the insulating substrate 41, etc. Therefore, it is necessary to suppress heat transfer from the second housing 20 to the first housing 10 which has a front surface 2a. In this embodiment, since the third housing 30 is placed between the first housing 10 and the second housing 20, contact thermal resistance is generated between the first housing 10 and the third housing 30. This effectively suppresses the transfer of heat generated from the first substrate 40, which is a heat-generating component, to the front surface 2a, which is a part that the user can touch.

[0030] In this embodiment, the transformer 43, common mode coil 44, and electrolytic capacitor 45 are arranged on the first surface (upper surface in Figure 4) of the insulating substrate 41, and the plurality of semiconductor elements 42 are arranged on the second surface (lower surface in Figure 4) of the insulating substrate 41, but the arrangement of each electronic component is not limited to this.

[0031] [Second circuit board] The second substrate 50 is a printed circuit board including terminals 52 arranged on an insulating substrate 51, and is located in the internal space 72 of the first housing 10. The second substrate 50 is electrically connected to the first substrate 40 and includes an output circuit for outputting DC power converted by the power supply circuit of the first substrate 40 from terminals 52. In this embodiment, the second substrate 50 is positioned perpendicular to the first substrate 40. That is, the surface of the insulating substrate 51 is aligned with the direction normal to the surface of the insulating substrate 41 of the first substrate 40. The first substrate 40 and the second substrate 50 may have, for example, protrusions and openings into which the protrusions are inserted, and may be fixed to each other.

[0032] The first substrate 40 may be fixed inside the second housing 20, and the second substrate 50 may be fixed inside the third housing 30. For example, the first substrate 40 may be fixed to the inner surface of the second housing 20 via a member not shown. For example, the first substrate 40 may be fixed to the second housing 20 with a heat dissipation member made of a highly thermally conductive material sandwiched between the electronic components arranged on both sides of the insulating substrate 41 of the first substrate 40 in the second assembly direction Y and the inner surface of the second housing 20. Also, as shown in Figure 5, the front surfaces of both the left and right ends of the insulating substrate 51 of the second substrate 50 are in contact with a stepped surface 35 facing rearward on the inner surface of the intermediate wall portion 57 of the third housing 30, which will be described later.

[0033] On the second substrate 50, electronic components such as terminals 52 and electrolytic capacitors 53 are arranged on the front surface of the insulating substrate 51, which faces in the opposite direction (forward) to the first substrate 40. In this embodiment, there is one terminal 52, but the number of terminals 52 is not particularly limited and can be two or more.

[0034] Terminal 52 is located, for example, in the center of the front surface of the insulating substrate 51. Terminal 52 is a USB terminal to which a USB connector 102 can be connected, and is formed in a flat cylindrical shape overall. The type of USB terminal is not particularly limited. Terminal 52 is positioned so that the USB connector 102 can be inserted into and removed through a connection port 2b, which is an opening formed in the first housing 10. In this embodiment, terminal 52 is provided so that the USB connector 102 can be inserted into and removed along the first assembly direction X (front-to-back direction) in which the third housing 30 is assembled to the second housing 20.

[0035] [First enclosure] The first housing 10 is a housing that surrounds the power output side end (upper end in Figure 5) of the terminal 52 and is a cover that covers the front of the third housing 30. As described above, the surface of the power output side end of the first housing 10, where the connection port 2b is formed, becomes the front surface 2a of the wiring device 2 that is exposed to the front of the outlet 1. The connection port 2b is an elongated hole extending in the left-right direction and is formed in the center in the left-right and up-down directions on the surface of the first housing 10 facing the front of the wiring device 2. The first housing 10 has a roughly rectangular shape when viewed from the front and has a front end wall portion 11 whose length in the left-right direction is longer than its length in the up-down direction, and a peripheral wall portion 12 that extends rearward from the peripheral edge of the front end wall portion 11. Note that there may be multiple connection ports, and the shape is not limited to a horizontal shape, but may also be vertical. As shown in Figure 6, locking pieces 13 protrude from a total of four positions, at both the left and right ends and both the right and left ends of the rear end surface of the peripheral wall portion 12, and a thickened portion 14 is provided at the tip of the locking piece 13, which is thicker in the left and right direction than the rest of the locking piece 13.

[0036] The first housing 10 may be made of metal, but is preferably made of resin. Since the front surface 2a of the first housing 10 is a part that the user can touch, it is preferable that the first housing 10 be made of a resin material that does not easily conduct heat from the first substrate 40 and the second substrate 50. The resin that makes up the first housing 10 is not particularly limited, but examples include urea resin, melamine resin, ABS resin, etc.

[0037] [Third cabinet] The third housing 30 is a housing that forms an internal space 72 for housing the second substrate 50 and is coupled to the first housing 10. The third housing 30 is roughly rectangular in front view, has a front end wall portion 34 at its front end, and is a stepped rectangular cylindrical shape with stepped portions formed at both the left and right ends. The front end wall portion 34 has a roughly rectangular opening 36 (Figure 5) in the center in the left and right and up and down directions, through which the middle portion of the terminal 52 can pass in the front and back directions. Furthermore, locking holes 37 (Figure 6) that pass through in the front and back directions are formed at a total of four positions, which are at both the left and right ends and both the up and down ends of the front end wall portion 34. The locking holes 37 are roughly rectangular in front view, and their width in the left and right direction is greater than the left and right thickness of the portion of the locking piece 13 provided on the first housing 10 other than the thick portion 14, but is smaller than the left and right thickness of the thick portion 14. As a result, the locking piece 13 of the first housing 10 is inserted into the locking hole 37 of the third housing 30 while elastically deforming the thickened portion 14, and the thickened portion 14 is locked to the edge of the locking hole 37, thereby connecting the first housing 10 and the third housing 30. In this state, the rear end surface of the first housing 10 is in contact with or in close proximity to the front surface of the front end wall portion 34 of the third housing 30.

[0038] Furthermore, the third housing 30 has a wider shape, with the rear cylindrical portion 55 having a roughly rectangular cross-section extending outward in the left-right direction from the central cylindrical portion 56 having a roughly rectangular cross-section and a front end wall portion 34. Intermediate wall portions 57, which form steps, are provided at the front ends of both the left-right ends of the rear cylindrical portion 55. As a result, the front surfaces of both the left-right ends of the third housing 30 are recessed to the rearward side than the front end wall portion 34 of the central portion in the left-right direction. The third housing 30 has a projection 31 formed in this recessed portion that fits into the mounting frame of the outlet 1.

[0039] The third housing 30 is made of a material with lower thermal conductivity than the second housing 20, for example, resin. The resin that makes up the third housing 30 is not particularly limited, as with the first housing 10, but examples include urea resin, melamine resin, ABS resin, etc. The third housing 30 may be made of a material with the same thermal conductivity as the first housing 10, for example, a resin material, as will be described later. On the other hand, the third housing 30 may be made of a material having lower thermal conductivity than the material that makes up the first housing 10. For example, the first housing 10 may be made of metal and the third housing 30 may be made of resin.

[0040] Furthermore, the third housing 30 has a front end wall portion 34 that extends toward the terminals from an inner wall surface facing left and right opposite the terminals 52 and is positioned between the first housing 10 and the second substrate 50. This suppresses heat transfer from the second substrate 50 to the front surface 2a of the first housing 10 due to heat convection and radiation from the second substrate 50, as will be described later.

[0041] The third housing 30 has fixing pieces 32 that constitute a snap-fit ​​structure 70. The fixing pieces 32 are plate-shaped portions that extend rearward from both the left and right ends of the third housing 30, with one piece formed at each end. The left and right fixing pieces 32 have the same shape and size as each other and are formed to clamp the first member 20a and the second member 20b of the second housing 20 from both sides. The fixing pieces 32 abut against the outer surfaces 21 and 22 of the first member 20a and the second member 20b, and press the outer surfaces 21 and 22 from the left and right using the elasticity of the material. Each fixing piece 32 has two openings 33 into which the projections 23 and 24 of the outer surfaces 21 and 22 fit, respectively.

[0042] The first assembly direction X in which the third housing 30 is assembled to the second housing 20 is approximately normal to the second assembly direction Y. For example, after the first substrate 40, to which the second substrate 50 is fixed, is housed in the internal space 72 surrounded by the first member 20a and the second member 20b of the second housing 20, the third housing 30, which has been assembled to the first housing 10 in the first assembly direction X, is then assembled to the second housing 20 in the first assembly direction X by the snap-fit ​​structure 70. Note that the order in which the first housing 10 is assembled to the third housing 30 may be after the third housing 30 has been assembled to the second housing 20.

[0043] As described above, the assembly direction of the first housing 10 and the third housing 30 is the same as the assembly direction of the third housing 30 and the second housing 20, which is the same first assembly direction X. In addition, the first housing 10 has a connection port 2b which is an opening that overlaps with the terminal 52 in the first assembly direction X.

[0044] [Second enclosure 20] The second housing 20 is a housing that accommodates the first circuit board 40 on which the power conversion components are mounted, and unlike the first housing 10, it is not exposed on the front of the outlet 1. A part of the first circuit board 40 may be placed in the internal space 72 of the first housing 10, but it is preferable that semiconductor elements 42, transformers 43, etc., which generate a lot of heat, be placed only in the internal space 72 of the second housing 20. The wiring device 2 may have a structure that makes it difficult for heat generated from the power conversion components on the first circuit board 40 to be transferred to the first housing 10, while efficiently transferring it to the second housing 20.

[0045] The second housing 20 is made of a material with a higher thermal conductivity than the third housing 30, and is preferably made of metal in order to efficiently dissipate the heat transferred from the heat source to the outside of the device. The metal constituting the second housing 20 is not particularly limited, but aluminum or an aluminum alloy is preferred from the viewpoint of thermal conductivity, lightness, and processability. The second housing 20 is formed into a bottomed rectangular tube shape by assembling the first member 20a and the second member 20b in the second assembly direction Y with the first substrate 40 sandwiched between them. As a result, the second housing 20 has a structure divided into multiple housings.

[0046] The first member 20a includes a main wall 25 positioned substantially parallel to the insulating substrate 41 of the first substrate 40, and side walls 26a, 26b, and 26c provided at the ends of the main wall 25. The main wall 25 has a rectangular shape, and the side walls 26a, 26b, and 26c are formed along three sides of the main wall 25, respectively. The side walls 26a, 26b, and 26c are smaller rectangular walls than the main wall 25, formed, for example, perpendicular to the main wall 25, and having the same height as each other. The main wall 25 and the side walls 26a, 26b, and 26c are combined with the second member 20b to form the cylindrical wall of a bottomed rectangular tube.

[0047] The second member 20b has an external shape similar to that of the first member 20a. The second member 20b includes a main wall 27 positioned substantially parallel to the insulating substrate 41 of the first substrate 40, and side walls 28a, 28b, and 28c provided at the ends of the main wall 27. The main wall 27 is substantially the same size as the main wall 25 of the first member and is positioned parallel to the main wall 25. The side walls 28a, 28b, and 28c are formed along three sides of the main wall 27, respectively. The side walls 28a, 28b, and 28c are formed, for example, perpendicular to the main wall 28 and are of the same height to one another.

[0048] The bottomed rectangular tubular body, consisting of the first member 20a and the second member 20b, is a bottomed rectangular tubular case for housing the first substrate 40, in which the main walls 25 and 27 are arranged parallel to each other and the side walls of each member are butted together. Since there are no side walls at the front ends of the main walls 25 and 27 on the first housing 10 side, an opening is formed at the front end of the case. In addition, the side walls of each housing may have a fitting structure such as a projection and groove that engages with each other.

[0049] A through-hole 29 for passing a screw 71 is formed in the side wall 26b of the first member 20a. In addition, a rib 60 extending into the interior of the first member 20a is formed on the inner surface of the side wall 28b of the second member 20b. The rib 60 has a screw hole through which the screw 71 is fastened. In this embodiment, the rear ends of the first member 20a and the second member 20b are fixed to each other using a screw 71 which is inserted into the through-hole 29 of the side wall 26b and fastened into the screw hole of the rib 60.

[0050] Protrusions 23 and 24 constituting a snap-fit ​​structure 70 are formed on the left and right side walls 26a, 26c, 28a, and 28c of the first member 20a and the second member 20b. Each protrusion 23 and 24 is, for example, a flat rectangular prism shape. The protrusions 23 and 24 only need to be able to hook onto the edge of the opening 33 of the fixing piece 32 to maintain the connected state of the housing. Also, recesses 61 and 62 are formed on the outer surfaces 21 and 22 of the side walls 26a, 26c, 28a, and 28c so as to surround the protrusions 23 and 24. The fixing piece 32 of the third housing 30 fits into the recesses 61 and 62 of the first member 20a and the second member 20b, and the protrusions 23 and 24 fit into the opening 33 of the fixing piece 32, thereby maintaining a stable connected state between the two members 20a and 20b and the third housing 30.

[0051] In this embodiment, the second housing 20 is constructed by assembling a first member 20a and a second member 20b, which are separated in the vertical direction, in a second assembly direction Y, which is the vertical direction. On the other hand, the second housing 20 is not limited to this, and may be constructed, for example, by assembling a first member and a second member, which are separated in the left-right direction, in a third direction, which is the left-right direction. Alternatively, the second housing 20 may be constructed by assembling a rectangular tubular first member and a second member that closes the rear end opening of the first member in a first assembly direction X. Alternatively, the second housing 20 may be formed from a single bottomed rectangular tubular member, and the first substrate 40 may be assembled inward from the front end opening.

[0052] [effect] In this embodiment, the third housing 30 is positioned between the first housing 10 and the second housing 20 and constitutes a part of the housing that forms the outer surface of the wiring device 2. Furthermore, the front end wall portion 34, which is part of the third housing 30, is positioned between the inner wall surface of the first housing 10 and the second substrate 50. In addition, the third housing 30 is made of a material with lower thermal conductivity than the second housing 20. As a result, as described above, contact thermal resistance is generated between the first housing 10 and the third housing 30, thus forming an insulating structure that can increase the thermal resistance between the heat-generating electronic component and the first housing 10, which is the housing portion on the power output side. Therefore, the transfer of heat generated from the heat-generating component to the front surface 2a, which is the part that the user can touch, can be effectively suppressed. Furthermore, the fact that the third housing 30 has a front end wall portion 34, and that this front end wall portion 34 is positioned between the first housing 10 and the second substrate 50, can also effectively suppress the transfer of heat generated from the heat-generating component to the front surface 2a.

[0053] For example, the following five paths are possible as the main heat absorption paths for the front surface 2a that the user can touch. (1) Heat convection from the second substrate 50 and terminal 52 (2) Heat radiation from the second substrate 50 and terminal 52 (3) Heat conduction from the second substrate 50 (4) Heat conduction from the second housing 20 (5) Heat conduction from terminal 52 In these heat receiving paths, the first substrate 40, surrounded by the second substrate 50, terminals 52, and the second housing 20, is the heat-generating component.

[0054] According to this embodiment, the thermal resistance in the heat receiving paths (1) to (4) can be increased. Specifically, regarding (1) and (2), in the configuration of this example, the third housing 30 has a front end wall portion 34 that extends toward the terminal 52 from the inner wall surface facing left and right opposite the terminal 52 and is positioned between the first housing 10 and the second substrate 50. As a result, heat convection and radiation from the rear portion of the second substrate 50 and the terminal are transmitted to the first housing 10 via the third housing 30 having the front end wall portion 34, thus increasing the thermal resistance in the heat receiving paths (1) and (2). Therefore, heat transfer from the second substrate 50 and the terminal 52 to the front surface 2a of the first housing 10 can be suppressed.

[0055] Regarding (3), since the third housing 30 is connected between the first housing 10 and the second housing 20, contact thermal resistance is generated due to the presence of a minute gap between the contact or opposing parts of the first housing 10 and the third housing 30. This increases the thermal resistance in the heat receiving path of (3). Therefore, heat conduction from the second substrate 50 to the front surface 2a of the first housing 10 can be suppressed.

[0056] Regarding (4), similar to (3), contact thermal resistance is generated due to the presence of a minute gap between the contact or opposing parts of the first housing 10 and the third housing 30. This increases the thermal resistance in the heat receiving path of (4). Therefore, heat conduction from the second housing 20 to the front surface 2a of the first housing 10 can be suppressed. Accordingly, with the configuration of this example, the thermal resistance in the heat receiving path of the front surface 2a can be increased, so that the heat generated from the heat-generating components, the first substrate 40 and the second substrate 50, can be effectively suppressed from being transferred to the front surface 2a. For example, with the configuration of this example, even when the heat generation density of the wiring device 2 is high, it is easier to suppress the temperature rise on the front surface 2a to 30 degrees or less.

[0057] Regarding (3) and (4), the effect is also present even if the thermal conductivity of the first housing 10 and the third housing 30 are the same. For this reason, the first housing 10 and the third housing 30 may be formed from the same material, for example, resin.

[0058] In the above description, the wiring device 2 is provided with two circuit boards, a first circuit board 40 and a second circuit board 50. However, it is not limited to this, and for example, the wiring device 2 may be provided with three or more circuit boards, or it may be just one circuit board located inside the second housing 20 or the third housing 30.

[0059] [Second Embodiment] Referring to Figure 7, the wiring device 2A, which is the second embodiment, will be described below. In the following, components common to the first embodiment will be referred to with the same reference numerals, and redundant explanations will be omitted or simplified. The differences from the first embodiment will be explained in detail.

[0060] Figure 7 is a diagram corresponding to Figure 5, showing a wiring device 2A, which is a second embodiment. As shown in Figure 7, the wiring device 2A differs from the wiring device 2 of the first embodiment in that the third housing 30a includes a heat shield 38 provided between the electronic components and the terminal 52 located on the second substrate 50. The heat shield 38 is a partition wall that protrudes from the inner surface of the front end wall 34 and extends rearward. The tip of the heat shield 38 extends to the vicinity of the insulating substrate 51 of the second substrate 50. The electronic component separated from the terminal 52 by the heat shield 38 is, for example, an electrolytic capacitor 53. The electrolytic capacitor 53 is a component that constitutes the output circuit and has lower heat resistance than the terminal 52. Lower heat resistance means, for example, that the upper limit of the operating temperature (performance guarantee temperature), which indicates the temperature range in which it can operate normally, is low. Also, the terminal 52 is a heat-generating component that generates heat when the USB connector 102 (Figure 1) is connected and DC power is output to an external electronic device 101 (Figure 1).

[0061] In this embodiment, the heat shield 38 is provided to suppress the effect of heat radiated from the terminal 52 on electronic components with low heat resistance, such as the electrolytic capacitor 53. The heat shield 38 is positioned to block the space between the terminal 52 and the electrolytic capacitor 53.

[0062] The heat shield 38 is preferably made of a material with low thermal conductivity. Since the heat shield 38 is integrally provided with the third housing 30a made of resin, the heat shield 38 is also made of resin. The heat shield is not limited to this, and may be a plate member independent of the third housing that shields the terminal from electronic components such as electrolytic capacitors, or a cylindrical member with a rectangular or circular cross-section that can be placed over electronic components. In this case as well, the heat shield can be made of resin. The heat shield may also contain a large number of air bubbles. The heat shield may be made of foamed material such as polystyrene foam, urethane foam, or phenolic foam, or fibrous material such as cellulose fiber.

[0063] When a first electronic component with high heat generation and a second electronic component with lower heat generation and lower heat resistance are arranged on the second substrate 50, a heat shield may be provided between the first and second electronic components. For example, the first electronic component may be a semiconductor element or a transformer, and the second electronic component may be an electrolytic capacitor. In this case, the heat shield can suppress the effect of heat radiated from the first electronic component on the second electronic component. By providing a heat shield in this way, the thermal impact on electronic components with low operating temperatures, such as the electrolytic capacitor 45, can be effectively suppressed.

[0064] [Third Embodiment] The third embodiment, wiring device 2B, will be described with reference to Figure 8. Figure 8 is a schematic cross-sectional view of wiring device 2B in the left-right direction. In the following, components common to the first embodiment will be referred to with the same reference numerals, and redundant explanations will be omitted or simplified. The differences from the first embodiment will be explained in detail.

[0065] As shown in Figure 8, the wiring device 2B has a first housing 10a that is directly connected to the second housing 20. In addition, a heat insulating member 81, which is a rigid component, is placed adjacent to the inner wall surface of the first housing 10a. Note that in Figure 8, the first circuit board 40, which is placed in the internal space 72 of the first housing 10a and the second housing 20, is not shown.

[0066] Specifically, the first housing 10a has a shape that integrates the first housing 10 of the first embodiment with the shape of the third housing 30 that lacks the front end wall portion 34. Therefore, the first housing 10a has a front end wall portion 11 at the front end and a stepped rectangular cylindrical shape with stepped portions formed at both ends in the left-right direction. More specifically, the first housing 10a has a wider shape in which the rear cylindrical portion 8282 with a roughly rectangular cross-section protrudes outward in the left-right direction from the central cylindrical portion 83 with a roughly rectangular cross-section that has the front end wall portion 11. Intermediate wall portions 84, which form stepped portions, are provided at the front ends of both ends of the rear cylindrical portion 82 in the left-right direction. As a result, the first housing 10a has a shape in which the front surfaces of both ends in the left-right direction are recessed to the rear of the front end wall portion 11 in the central part in the left-right direction. The first housing 10a has a projection (not shown) formed in this recessed portion that fits into the mounting frame of the outlet 1 (Figure 1).

[0067] The first housing 10a has fixing pieces 85 that constitute a snap-fit ​​structure at the rear ends of both the left and right ends of the cylindrical portion 82. The shape of the fixing pieces 85 is the same as that of the fixing pieces 32 provided on the third housing 30 in the first embodiment. In addition, the power output side end of the terminal 52 located on the second substrate 50 enters into the connection port 2b of the front end wall portion 11 of the first housing 10a and is surrounded by the front end wall portion 11.

[0068] On the other hand, the heat insulating member 81 is positioned between the terminal 52 and the second substrate 50 and the inner wall surface of the first housing 10a, and is positioned adjacent to the inner wall surface of the first housing 10a. The heat insulating member 81 has a shape that allows it to fit so as to be adjacent to substantially the entire inner surface of the first housing 10a. For this reason, the heat insulating member 81 has a front end wall portion 86 adjacent to the inner surface of the front end wall portion 11, a front cylindrical portion 87 and a rear cylindrical portion 88 extending rearward from the peripheral edge of the front end wall portion 86, and intermediate wall portions 89 provided at the front ends of both the left and right ends of the rear cylindrical portion 88. Each cylindrical portion 87, 88 and the intermediate wall portion 89 are adjacent to the inner wall surfaces of each cylindrical portion 82, 83 and the intermediate wall portion 84 of the first housing 10a, respectively.

[0069] Note that "adjacent" has two meanings: when in contact with the target surface, and when facing the target surface without contact, with a small gap between them. For example, each cylindrical portion 87, 88 and intermediate wall portion 89 of the heat insulating member 81 are in contact with the inner wall surfaces of each cylindrical portion 82, 83 and intermediate wall portion 84 of the first housing 10a, respectively, but the front end wall portion 86 of the heat insulating member 81 may be configured to face the inner wall surface of the front end wall portion 11 of the first housing 10a without contact, with a small gap between them.

[0070] On the other hand, unlike the first housing 10a, the heat insulating member 81 does not have a fixing piece formed thereon. The second substrate 50 fits inside the rear cylindrical portion 88 and is in contact with the inner wall surface of the intermediate wall portion 89. In addition, an opening 90 is formed in the front end wall portion 86, through which the intermediate portion of the terminal 52 can pass in the front-rear direction.

[0071] The heat insulating member 81 is made of a material with a lower thermal conductivity than the second housing 20, similar to the third housing 30 in the first embodiment, and is preferably made of the same resin as the resin that constitutes the third housing 30.

[0072] In this embodiment, heat from the rear portion of the second substrate 50 and terminal 52 due to convection and radiation is transferred to the first housing 10a via the heat insulating member 81. As a result, the thermal resistance in the heat receiving path of "(1) heat convection from the second substrate 50 and terminal 52" and "(2) heat radiation from the second substrate 50 and terminal 52" as described in the first embodiment increases. Therefore, heat transfer from the second substrate 50 and terminal 52 to the front surface 2a of the first housing 10a can be suppressed.

[0073] Furthermore, heat conducted from the second substrate 50 is transferred to the first housing 10a via the heat insulating member 81. As a result, contact thermal resistance is generated between the first housing 10a and the heat insulating member 81 in the heat conduction path between the second substrate 50 and the front surface 2a of the first housing 10a. This increases the thermal resistance in the heat reception path described in "(3) Heat conduction from the second substrate 50" in the first embodiment. Therefore, heat transfer from the second substrate 50 to the front surface 2a of the first housing 10 can be suppressed.

[0074] Regarding (3), the effect is also present even if the thermal conductivity of the first housing 10a and the heat insulating member 81 are the same. For this reason, the first housing 10a and the heat insulating member 81 may be formed from the same material, for example, resin.

[0075] The above describes the case where the heat insulating member 81 is a rigid component having rigidity. On the other hand, the heat insulating member may be made of a flexible sheet member. For example, a sheet member made of rubber sheet material may be attached to the inner surface of the first housing 10a. Furthermore, the heat insulating member may have a lower emissivity than the inner wall of the first housing 10a. This can suppress heat transfer from the second substrate 50 and terminals 52 to the front surface 2a of the first housing 10a. Moreover, the heat insulating member may be made of a material with a lower thermal conductivity than the first housing 10a.

[0076] To reduce the emissivity of the heat insulating material, for example, a metal layer can be formed on a transparent substrate. For example, the metal layer can be made to reflect near-infrared rays to enhance heat shielding and far-infrared rays to enhance heat insulating properties. The material of the metal layer should preferably have a high far-infrared reflectivity, and materials mainly composed of Ag, Au, Cu, Ni, Cr, Fe, Al, etc. can be used. As the transparent substrate, glass plates or flexible transparent resin films can be used. In addition, as a heat insulating material, a low-emissivity glass using a glass plate as the transparent substrate can be used, in which a multilayer coating of a combination of metals such as Ag and chemical substances can be applied to the glass surface.

[0077] Furthermore, the heat insulating member 81 may be fixed to either the first housing or the second housing by a locking structure such as a snap-fit, or by screws.

[0078] In addition, in the configuration shown in Figure 8, the heat insulating member 8 may be arranged adjacent to the entire inner wall surface of the first housing 10b.

[0079] [Fourth Embodiment] The fourth embodiment, wiring device 2C, will be described with reference to Figure 9. Figure 9 is a schematic cross-sectional view of wiring device 2C in the left-right direction. In the following, components common to the first or third embodiment will be referred to with the same reference numerals, and redundant explanations will be omitted or simplified. The differences from the first or third embodiment will be described primarily.

[0080] As shown in Figure 9, the wiring device 2C has a rigid component, the heat insulating member 81a, adjacent to the inner wall surface of the first housing 10b. Unlike the heat insulating member 81 of the third embodiment, the heat insulating member 81a is positioned adjacent only to the inner wall surface between the front cylindrical portion 83 and the front end wall portion 11 of the first housing 10b.

[0081] Specifically, the heat insulating member 81a is a bottomed rectangular tube having a front end wall portion 86 adjacent to the inner surface of the front end wall portion 11 and a cylindrical portion 87 extending rearward from the peripheral edge of the front end wall portion 86. The cylindrical portion 87 is adjacent to the inner wall surface of the front cylindrical portion 83 of the first housing 10b. The open end of the cylindrical portion 87 does not protrude rearward (towards the bottom in Figure 9) from the inner surface of the intermediate wall portion 84 of the first housing 10b.

[0082] The front end of the cylindrical portion 82a at the rear of the first housing 10b is thicker than that of the first housing in the third embodiment, and the insulating substrate 51 of the second substrate 50 is fitted to its inner wall surface. In addition, the front surfaces of both left and right ends of the insulating substrate 51 are in contact with the inner surface of the intermediate wall portion 84.

[0083] In the configuration of this embodiment, the second substrate is in direct contact with the first housing 10b without an insulating member in between. As a result, unlike the third embodiment, this embodiment does not achieve the effect of increasing the thermal resistance in the heat reception path of "(3) heat conduction from the second substrate 50". On the other hand, this embodiment, like the third embodiment, achieves the effect of increasing the thermal resistance in the heat reception paths of "(1) heat convection from the second substrate 50 and terminal 52" and "(2) heat radiation from the second substrate 50 and terminal 52".

[0084] In this embodiment as well, similar to the third embodiment, the heat insulating member may be made of a flexible sheet material. Furthermore, the heat insulating member may have a lower emissivity than the inner wall of the first housing 10b. Additionally, the heat insulating member may be made of a material with a lower thermal conductivity than the first housing 10b.

[0085] [Fifth Embodiment] The fifth embodiment, wiring device 2D, will be described with reference to Figure 10. Figure 10 is a schematic cross-sectional view of wiring device 2D in the left-right direction. In the following, components common to the first or fourth embodiment will be referred to with the same reference numerals, and redundant explanations will be omitted or simplified. The differences from the first or fourth embodiment will be described primarily.

[0086] As shown in Figure 10, the wiring device 2D has an insulating member 91 positioned adjacent to the inner wall surface of the cylindrical portion 83 on the front side of the first housing 10b. Unlike the insulating member 81a in the fourth embodiment, the insulating member 91 is positioned between the inner wall surface of the first housing 10b and the second substrate 50. Furthermore, the insulating member 91 is positioned in a compressed state between the inner wall surface of the first housing 10b and the terminal 52, and is in contact with the inner wall surface of the first housing 10b and the terminal 52. In addition, the insulating member 91 is laid out over almost the entire space enclosed by the first housing 10b, the insulating substrate 51 of the second substrate 50, and the terminal 52.

[0087] The thermal insulation member 91 is made of a material with a lower thermal conductivity than the second housing 20. The thermal insulation member 91 may also be made of a material with a lower thermal conductivity than the first housing 10b. The thermal insulation member 91 is made up of a large number of air bubbles. The thermal insulation member 91 may be made of a foamed material such as polystyrene foam, urethane foam, or phenolic foam.

[0088] In the configuration shown in Figure 10, the heat insulating material 91 is laid across the entire inner wall surface of the front cylindrical portion 83 and the front end wall portion 11 of the first housing 10b. However, the heat insulating material may not be in contact with the inner wall surface of the front end wall portion 11, but rather be placed opposite each other with a small gap in between.

[0089] In this embodiment, the heat insulating member 91 is laid over substantially the entire inner wall surface of the front cylindrical portion 83 and the front end wall portion 11 of the first housing 10b. As a result, no heat convection occurs from the rear portion of the second substrate 50 or terminal 52, and heat from the rear portion of the second substrate 50 or terminal 52 is transferred to the first housing 10b by heat conduction or radiation through the heat insulating member 91, which has low thermal conductivity. This provides the same effect as in the fourth embodiment, where the thermal resistance in the heat receiving path for "(1) heat convection from the second substrate 50 and terminal 52" and "(2) heat radiation from the second substrate 50 and terminal 52" is increased.

[0090] Furthermore, in this embodiment, the heat insulating member 91 is positioned in a compressed state between the inner wall surface of the first housing 10b and the terminal 52, and is in contact with the inner wall surface of the first housing 10b and the terminal 52. As a result, when assembling the heat insulating member 91 to the first housing 10b, the second circuit board 50 can be moved in such a way that the heat insulating member 91 is pushed into the first housing 10b while the heat insulating member 91 is compressed with the heat insulating member 91 fitted around the terminal 52 of the second circuit board 50, thereby improving the workability of the assembly.

[0091] The heat insulating material may be made of resin or the like, and may be configured as a rigid component that has rigidity, covering substantially the entire inner wall surface of the front cylindrical portion 83 and the inner wall surface of the front end wall portion 11 of the first housing 10b.

[0092] Furthermore, if the thermal conductivity of the first housing 10b is sufficiently low, the effects of (1) and (2) above can be obtained even if the thermal conductivity of the insulating material and the first housing 10b are the same. For this reason, the thermal conductivity of the insulating material can be made the same as that of the first housing 10b. For example, the insulating material and the first housing 10b can be made of rigid resin components with rigidity, and their thermal conductivity can be made the same.

[0093] [Sixth Embodiment] The sixth embodiment, wiring device 2E, will be described with reference to Figure 11. Figure 11 is a schematic cross-sectional view of wiring device 2E in the left-right direction. In the following, components common to the first or fifth embodiment will be referred to with the same reference numerals, and redundant explanations will be omitted or simplified. The differences from the first or fifth embodiment will be described primarily.

[0094] As shown in Figure 10, unlike in the fifth embodiment, the insulating material 92 of the wiring device 2E is laid only in the innermost part of the cylindrical portion 83 of the first housing 10b, which is part of the space surrounded by the first housing 10b, the insulating substrate 51 of the second substrate 50, and the terminal 52. Furthermore, the insulating material 92 is positioned in a compressed state between the inner wall surface of the first housing 10b and the terminal 52, and is in contact with the inner wall surface of the first housing 10b and the terminal 52.

[0095] According to the configuration of this embodiment, heat from the rear portion of the second substrate 50 or terminal 52 due to convection and radiation is transferred to the first housing 10b via the heat insulating member 92 with low thermal conductivity. As a result, similar to the fourth embodiment, the effect of increasing the thermal resistance in the heat receiving path of "(1) heat convection from the second substrate 50 and terminal 52" and "(2) heat radiation from the second substrate 50 and terminal 52" can be obtained. On the other hand, in this embodiment, convection from the rear portion of the second substrate 50 or terminal 52 occurs due to the presence of space inside the cylindrical portion 83 of the first housing 10b, so the effect of (1) is considered to be higher in the fifth embodiment.

[0096] In this embodiment, the heat insulating material may be made of resin or the like, and may be configured as a rigid component that is laid only in the innermost part of the cylindrical portion 83 on the front side of the first housing 10b.

[0097] Furthermore, in the second to sixth embodiments, although the effect of suppressing the temperature rise of parts that the user can touch is reduced, the heat insulating member can also be configured to be placed between the inner wall surface of the first housing and one of the terminals and the circuit board, specifically between the terminals and the circuit board.

[0098] Furthermore, each of the above embodiments may be modified as appropriate without impairing the purpose of this disclosure. The wiring device for supplying DC power according to this disclosure may be in a form in which the components of the multiple embodiments and modifications are selectively combined.

[0099] The structure of this disclosure as described above is as follows: (Composition 1) A circuit board on which electronic components are mounted, A terminal mounted on the aforementioned circuit board and outputting the aforementioned DC power, A first housing located at the power output end of the aforementioned terminal, A second housing is provided on the opposite side from the aforementioned power output end, A wiring device for supplying DC power, comprising: an insulating member disposed between the first housing and the second housing, or between one or both of the terminal and the substrate and the inner wall surface of the first housing, the insulating member being made of a material with lower thermal conductivity than the second housing. (Configuration 2) The heat insulating member is positioned between the first housing and the second housing and constitutes a part of the housing that forms the outer surface. A wiring device that supplies DC power as described in Configuration 1. (Composition 3) The assembly direction of the first housing and the heat insulating member, and the assembly direction of the heat insulating member and the second housing are the same first assembly direction. The first housing has an opening formed in a position that overlaps with the terminal in the first assembly direction. A wiring device that supplies DC power as described in Configuration 2. (Composition 4) The heat insulating member has a wall portion that extends from the inner wall surface facing the terminal toward the terminal and is positioned between the first housing and the substrate. A wiring device that supplies DC power as described in Configuration 2. (Composition 5) The heat insulating member is positioned between the inner wall surface of the first housing and the terminal and the substrate, and is positioned adjacent to the inner wall surface of the first housing. A wiring device that supplies DC power as described in Configuration 1. (Composition 6) The aforementioned heat insulating member is in the form of a sheet. A wiring device that supplies DC power as described in Configuration 5. (Composition 7) The heat insulating member is disposed between the inner wall surface of the first housing and the substrate, and is composed of a large number of air bubbles. A wiring device that supplies DC power as described in Configuration 1. (Composition 8) The heat insulating member is positioned in a compressed state between the inner wall surface of the first housing and the terminal, and is in contact with the inner wall surface of the first housing and the terminal. A wiring device that supplies DC power as described in Configuration 1. (Composition 9) The aforementioned heat insulating member is made of resin. A wiring device that supplies DC power as described in Configuration 1 or Configuration 2. (Composition 10) The first housing is made of resin, and the second housing is made of metal. A wiring device that supplies DC power as described in any one of configurations 1 through 9. (Composition 11) The second housing has a structure divided into multiple housings. A wiring device that supplies DC power as described in any one of configurations 1 through 10. (Composition 12) The emissivity of the thermal insulation member is lower than the emissivity of the inner wall of the first housing. A wiring device that supplies DC power as described in any one of configurations 1 through 11. (Composition 13) A heat shield is provided between the electronic component and the terminal. A wiring device that supplies DC power as described in any one of configurations 1 to 12. (Composition 14) The thermal insulation member is made of a material having a thermal conductivity lower than that of the material constituting the first housing. A wiring device that supplies DC power as described in any one of configurations 1 to 13. (Composition 15) It is a USB outlet device. A wiring device that supplies DC power as described in any one of configurations 1 through 14. [Explanation of Symbols]

[0100] 1 Outlet, 2, 2A, 2B, 2C, 2D, 2E Wiring device for supplying DC power (wiring device), 2a, 3a Front, 2b, 3b Connection port, 3 Power outlet device, 4 Decorative plate, 4a Opening, 10, 10a, 10b First housing, 11 Front end wall, 12 Peripheral wall, 13 Locking piece, 14 Thick part, 20 Second housing, 20a First member, 20b Second member, 21, 22 Outer surface, 23, 24 Protrusion, 25, 27 Main wall, 29 Through hole, 30 Third housing, 31 Protrusion, 32 Fixing piece, 33 Opening, 34 Front end wall, 35 Stepped surface, 36 Opening, 37 Locking hole, 38 Heat shield part, 40 First substrate, 41, 51 Insulating substrate, 42 Semiconductor element, 43 Transformer, 44 Common mode coil, 45, 53 Electrolytic capacitor, 50 Second circuit board, 51 Insulating circuit board, 52 Terminal, 55, 56 Cylindrical section, 57 Intermediate wall section, 60 Rib, 61, 62 Recess, 70 Snap-fit ​​structure, 71 Screw, 72 Internal space, 80 Heat shield section, 81, 81a Insulation material, 82, 83, 82a Cylindrical section, 84 Intermediate wall section, 85 Fixing piece, 86 Front wall section, 87, 88 Cylindrical section, 89 Intermediate wall section, 90 Opening, 91, 92 Insulation material, 100 Wall, 101 Electronic equipment, 102 USB connector, 103 Cable

Claims

1. A circuit board on which electronic components are mounted, A terminal mounted on the aforementioned circuit board, to which a connector provided on a cable can be connected from the outside of the wiring device, and a terminal that outputs DC power from the wiring device, A first housing located at the power output end of the aforementioned terminal, A second housing is provided on the opposite side from the aforementioned power output end, A wiring device for supplying DC power, comprising: an insulating member disposed between the first housing and the second housing, or between one or both of the terminal and the substrate and the inner wall surface of the first housing, the insulating member being made of a material with lower thermal conductivity than the second housing.

2. The heat insulating member is positioned between the first housing and the second housing and constitutes a part of the housing that forms the outer surface. A wiring device for supplying DC power according to claim 1.

3. The assembly direction of the first housing and the heat insulating member, and the assembly direction of the heat insulating member and the second housing are the same first assembly direction. The first housing has an opening formed in a position that overlaps with the terminal in the first assembly direction. A wiring device for supplying DC power according to claim 2.

4. The heat insulating member is a third housing, The first housing includes a front end wall portion provided at the front end which is the power output side end and having a connection port for connecting the connector to the terminal, and a peripheral wall portion extending from the peripheral wall portion of the front end wall portion to the rear side which is opposite to the power output side end, The third housing has a cylindrical portion and a third housing wall portion that extends toward the terminal from the inner wall surface of the cylindrical portion facing the terminal so as to face the front end wall portion, and is positioned between the first housing and the substrate. A wiring device for supplying DC power according to claim 2.

5. The heat insulating member is positioned between the inner wall surface of the first housing and the terminal and the substrate, and is positioned adjacent to the inner wall surface of the first housing. A wiring device for supplying DC power according to claim 1.

6. The aforementioned heat insulating member is in the form of a sheet. A wiring device for supplying DC power as described in claim 5.

7. The heat insulating member is disposed between the inner wall surface of the first housing and the substrate, and is composed of a large number of air bubbles. A wiring device for supplying DC power according to claim 1.

8. The heat insulating member is positioned in a compressed state between the inner wall surface of the first housing and the terminal, and is in contact with the inner wall surface of the first housing and the terminal. A wiring device for supplying DC power according to claim 1.

9. The aforementioned heat insulating member is made of resin. A wiring device for supplying DC power according to claim 1 or claim 2.

10. The first housing is made of resin, and the second housing is made of metal. A wiring device for supplying DC power according to claim 1.

11. The second housing has a structure divided into multiple housings. A wiring device for supplying DC power according to claim 1.

12. The emissivity of the thermal insulation member is lower than the emissivity of the inner wall of the first housing. A wiring device for supplying DC power according to claim 1.

13. A heat shield is provided between the electronic component and the terminal. A wiring device for supplying DC power according to claim 1.

14. The thermal insulation member is made of a material having a thermal conductivity lower than that of the material constituting the first housing. A wiring device for supplying DC power according to claim 1.

15. It is a USB outlet device. A wiring device for supplying DC power according to claim 1.

Images