Vapor deposition substrates, laminates, and packaging containers

Abstract

To provide a vapor-deposited substrate favorably usable as a substrate of a mono-material packaging container, capable of significantly improving interlayer adhesion with a vapor-deposited layer, and capable of achieving desirable gas barrier properties.SOLUTION: A vapor-deposited substrate at least includes a substrate and a vapor-deposited film. The substrate at least includes a polyethylene resin layer and a surface resin layer. The vapor-deposited film is disposed on the surface resin layer of the substrate. The surface resin layer includes a resin material with a melting point 150°C or higher. A drawing process is applied to the substrate.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a vapor-deposited substrate, a laminate, and a packaging container.

[0002] Conventionally, resin films made from polyester resins such as polyethylene terephthalate (hereinafter also referred to as polyester films) have been used in the manufacture of packaging containers because they have excellent mechanical properties, chemical stability, heat resistance, and transparency, as well as being inexpensive.

[0003] Such polyester films are used as a base material and are typically laminated with a polyethylene film, which serves as a sealant layer, to form a laminate that is then molded into a packaging container.

[0004] As described above, packaging containers obtained by molding a vapor-deposited substrate made by laminating different types of resin films, namely polyester film and polyethylene film, are difficult to separate into their respective layers. As a result, these packaging containers collected after use are not suitable for recycling and are not actively recycled.

[0005] In light of this situation, and with the aim of improving the recyclability of packaging containers, the production of packaging containers (monomaterial packaging containers) using a vapor-deposited substrate made of the same material as the base material, by applying stretched polyethylene film (stretched polyethylene film) as the base material instead of polyester film, is being considered. [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] In this instance, the inventors attempted to compensate for the reduced gas barrier properties resulting from changing from polyester film to stretched polyethylene film by forming a vapor-deposited film on the surface of the stretched polyethylene film. However, they discovered a new problem: the adhesion between the stretched polyethylene film and the vapor-deposited film was insufficient, making it impossible to obtain satisfactory gas barrier properties.

[0007] Surprisingly, the inventors have found that by providing a surface resin layer containing a resin material with a melting point of 150°C or higher on the surface of a stretched polyethylene film, the adhesion of the vapor-deposited film formed on the surface resin layer is improved, and consequently, the gas barrier properties of the substrate are significantly improved, thereby solving the above-mentioned problems.

[0008] The present invention is based on the above findings, and the problem it aims to solve is to provide a vapor-deposited substrate that can be suitably used as a base material for monomaterial packaging containers, can significantly improve interlayer adhesion with vapor-deposited films, and can achieve desirable gas barrier properties.

[0009] Furthermore, the problem that the present invention aims to solve is to provide a laminate and a packaging container equipped with the above-described vapor-deposited substrate. [Means for solving the problem]

[0010] The vapor deposition substrate of the present invention comprises at least a substrate and a vapor-deposited film. The substrate comprises at least a polyethylene resin layer and a surface resin layer, The vapor-deposited film is provided on the surface resin layer of the substrate, The aforementioned surface resin layer contains a resin material with a melting point of 150°C or higher. The aforementioned substrate is characterized by having undergone a stretching treatment.

[0011] In one embodiment, the surface resin layer includes a resin material having a melting point of 150°C or higher and 265°C or lower.

[0012] In one embodiment, the difference in melting points between the polyethylene resin and the resin material of the surface resin layer having a melting point of 150°C or higher is 20 to 80°C.

[0013] In one embodiment, the resin material of the surface resin layer is made of a polymer having polar groups.

[0014] In one embodiment, the resin material of the surface resin layer is at least one resin material selected from the group consisting of ethylene vinyl alcohol copolymer, polyvinyl alcohol, polyester, nylon 6, nylon 6,6, nylon 6-nylon 6,6 copolymer, MXD nylon, and amorphous nylon.

[0015] In one embodiment, the ratio of the thickness of the surface resin layer to the total thickness of the base material is 2% or more and 20% or less.

[0016] In one embodiment, the polyethylene resin layer of the base material has a multilayer structure.

[0017] In one embodiment, the polyethylene resin layer of the base material includes at least one layer containing a compatibilizer.

[0018] In one embodiment, the surface resin layer is provided so as to be in contact with the layer containing the compatibilizer of the polyethylene resin layer.

[0019] In one embodiment, the base material is a coextruded film.

[0020] In one embodiment, a barrier coat layer is further provided on the vapor deposition film.

[0021] In one embodiment, the vapor deposition base material of the present invention is used for a packaging container.

[0022] The laminate of the present invention includes the above-described vapor deposition base material and a sealant layer. The vapor deposition base material includes a base material and a vapor deposition film. The base material includes at least a polyethylene resin layer and a surface resin layer. The sealant layer is made of a polyethylene resin. The content of the polyethylene resin in the entire laminate is 80% by mass or more, which is a characteristic.

[0023] The packaging container of the present invention is characterized by being made of the above laminate.

[0024] In one embodiment, the packaging container is a packaging bag. [Effects of the Invention]

[0025] According to the present invention, a vapor deposition substrate can be provided that can be suitably used as a base material for monomaterial packaging containers, significantly improves interlayer adhesion with vapor-deposited films, and achieves desirable gas barrier properties. Furthermore, according to the present invention, a laminate comprising the vapor-deposited substrate can be provided. Furthermore, according to the present invention, a packaging container comprising the laminate can be provided. [Brief explanation of the drawing]

[0026] [Figure 1] This is a schematic cross-sectional view showing one embodiment of the vapor-deposited substrate of the present invention. [Figure 2] This is a schematic cross-sectional view showing one embodiment of the vapor-deposited substrate of the present invention. [Figure 3] This is a schematic cross-sectional view showing one embodiment of a vapor deposition apparatus. [Figure 4] This is a schematic cross-sectional view showing one embodiment of a vapor deposition apparatus. [Figure 5] This is a schematic cross-sectional view showing one embodiment of the laminate of the present invention. [Figure 6] This is a front view showing one embodiment of the packaging container of the present invention. [Figure 7] This is a perspective view showing one embodiment of the packaging container of the present invention. [Figure 8] This is a front view showing one embodiment of the packaging container of the present invention. [Figure 9] This is a cross-sectional view aa in Figure 8. [Modes for carrying out the invention]

[0027] (vapor deposition base material) As shown in Figure 1, the vapor-deposited substrate 10 of the present invention comprises a substrate 11 and a vapor-deposited film 12, the substrate 11 comprising a polyethylene resin layer 13 and a surface resin layer 14. A vapor-deposited substrate having such a configuration can be suitably used as a substrate for monomaterial packaging containers, and the adhesion between the layers and the vapor-deposited film is significantly improved, resulting in a vapor-deposited substrate with high gas barrier properties.

[0028] The ratio of the thickness of the surface resin layer to the total thickness of the substrate is preferably 2% to 20%, and more preferably 4% to 15%. By setting the ratio of the surface resin layer thickness to the total thickness of the substrate to 2% or more, the adhesion of the vapor-deposited film can be further improved, and the gas barrier properties of the substrate on which the vapor-deposited film is formed can be further enhanced. Furthermore, by setting the ratio of the surface resin layer thickness to the total thickness of the base material to 20% or less, the base material can be made suitable for use in the manufacture of monomaterial packaging containers. In addition, the film-forming properties and processability of the base material can be further improved.

[0029] Furthermore, in one embodiment, the base material 11 may further include an adhesive resin layer 15 between the polyethylene resin layer 13 and the surface resin layer 14, as shown in Figure 2.

[0030] Furthermore, in one embodiment, the vapor-deposited substrate 10 of the present invention comprises a barrier coat layer on the vapor-deposited film 12 (not shown).

[0031] The following describes each layer of the vapor-deposited substrate of the present invention.

[0032] (base material) In this invention, the substrate is characterized by being subjected to a stretching treatment. This improves the strength and heat resistance of the substrate. It also improves printability. The stretching process may be uniaxial stretching or biaxial stretching.

[0033] The stretching ratio of the substrate in the longitudinal direction (MD direction) and transverse direction (TD direction) is preferably 2 times or more and 15 times or less, and preferably 5 times or more and 13 times or less. By increasing the stretching ratio to 2 times or more, the strength and heat resistance of the substrate can be further improved. Furthermore, the printability of the substrate can be improved. Furthermore, from the viewpoint of the breaking limit of the substrate, it is preferable that the stretch ratio is 15 times or less.

[0034] In one embodiment, the substrate of the present invention is a co-extruded film. Furthermore, in one embodiment, the substrate of the present invention can be produced by forming a film using a T-die method or an inflation method, forming a resin film, and then stretching it.

[0035] The following describes each layer of the base material.

[0036] (Polyethylene resin layer) The polyethylene resin layer is made of polyethylene resin. As polyethylene resins, high-density polyethylene resin (HDPE), medium-density polyethylene resin (MDPE), low-density polyethylene resin (LDPE), linear low-density polyethylene resin (LLDPE), and very low-density polyethylene resin (VLDPE) can be used. Furthermore, a copolymer of ethylene and other monomers can also be used as the polyethylene resin. Furthermore, as polyethylene resin, biomass-derived polyethylene resin or mechanically or chemically recycled polyethylene resin can also be used.

[0037] Here, the high-density polyethylene resin has a density of 0.945 g / cm³. 3 The above polyethylene resins can be used, and as a medium-density polyethylene resin, the density is 0.925 g / cm³. 3 More than 0.945g / cm 3A polyethylene resin with a density of less than 0.900 g / cm³ can be used, and as a low-density polyethylene resin, a density of 0.900 g / cm³ can be used. 3 More than 0.925g / cm 3 A polyethylene resin with a density of less than 0.900 g / cm³ can be used, and as a linear low-density polyethylene resin, a density of 0.900 g / cm³ can be used. 3 More than 0.925g / cm 3 Polyethylene resins with a density of less than 0.900 g / cm³ can be used, and ultra-low density polyethylene resins have a density of 0.900 g / cm³. 3 A polyethylene resin of less than [amount missing] can be used.

[0038] The polyethylene resin content in the polyethylene resin layer is preferably 70% by mass or more, and more preferably 80% by mass or more. This allows for more suitable use in the production of monomaterial packaging containers.

[0039] In one embodiment, the polyethylene resin layer may include at least one layer containing a compatibilizer. By including a compatibilizer in the polyethylene resin layer, when a packaging container made using the vapor-deposited substrate of the present invention is heated, melted, and recycled, it is possible to effectively prevent the uniform mixing of the resin material with a melting point of 150°C or higher contained in the surface resin layer and the polyethylene resin contained in the polyethylene resin layer, thereby preventing a decrease in their physical properties. Furthermore, it is possible to effectively prevent a decrease in their transparency. Furthermore, when the polyethylene resin layer has a multilayer structure, it is preferable that the compatibilizer be included in the layer in contact with the surface resin layer of the polyethylene resin layer. By including the compatibilizer in the layer in contact with the surface resin layer of the polyethylene resin layer, the above effects can be further improved.

[0040] While conventionally known compatibilizers can be appropriately selected and used, from the viewpoint of recyclability, unsaturated carboxylic acid-modified polyolefin resins are preferred, and among them, maleic anhydride-modified polyethylene resins are more preferred.

[0041] The content of the compatibilizer in the layer containing the compatibilizer is preferably 5% by mass or more and 30% by mass or less. The above effect can be further improved by increasing the compatibilizer content in the polyethylene resin layer to 5% by mass or more. By limiting the compatibilizer content in the polyethylene resin layer to 30% by mass or less, the strength and heat resistance of the substrate can be improved.

[0042] Within the limits that do not impair the properties of the present invention, the polyethylene resin layer may contain resin materials other than polyethylene resin, such as polyolefin resins such as polypropylene resin, (meth)acrylic resins, vinyl resins, cellulose resins, polyamide resins, polyester resins, and ionomer resins. Furthermore, from the standpoint of its recyclability, it is particularly preferable that the polyethylene resin layer does not contain any resins other than polyethylene resin.

[0043] Furthermore, within the limits that do not impair the properties of the present invention, the polyethylene resin layer may contain additives, such as crosslinking agents, antioxidants, antiblocking agents, lubricants, ultraviolet absorbers, light stabilizers, fillers, reinforcing agents, antistatic agents, pigments, and modifying resins.

[0044] The polyethylene resin layer may have a single-layer structure or a multi-layer structure.

[0045] In a polyethylene resin layer having a multilayer structure, the densities of the polyethylene resins constituting each layer may differ; that is, a density gradient may be provided in the polyethylene resin layer. By creating a density gradient in the polyethylene resin layer, its strength, heat resistance, and stretchability are significantly improved.

[0046] In a polyethylene resin layer provided with a density gradient, when the density difference between the layers is large, delamination may occur at the interface. Therefore, the density difference between the layers is preferably 0.04 g / cm 3 or less, and more preferably 0.02 g / cm 3 or less.

[0047] Hereinafter, embodiments of the polyethylene resin layer provided with a density gradient will be exemplified. Note that the configuration of the polyethylene resin layer is not limited to these.

[0048] In one embodiment, the polyethylene resin layer provided with a density gradient is composed of three layers: a layer containing high-density polyethylene resin, a layer containing medium-density polyethylene resin, and a layer containing high-density polyethylene resin. By forming the polyethylene resin layer into a three-layer structure with the above-described density gradient, the strength, heat resistance, and drawability are significantly improved. Also, in the base material, it is possible to effectively prevent the occurrence of curling.

[0049] In one embodiment, the polyethylene resin layer provided with a density gradient is composed of five layers: a layer containing high-density polyethylene, a layer containing medium-density polyethylene resin, a layer containing at least one of low-density polyethylene resin and linear low-density polyethylene resin, a layer containing medium-density polyethylene resin, and a layer containing high-density polyethylene resin. By forming the polyethylene resin layer into a five-layer structure with the above-described density gradient, the strength, heat resistance, and drawability are significantly improved. Also, in the base material, it is possible to effectively prevent the occurrence of curling. The polyethylene resin layer having such a configuration can be stably produced by the following inflation method. Specifically, from the outside, high-density polyethylene resin, medium-density polyethylene resin, and at least one of low-density polyethylene resin and linear low-density polyethylene resin are co-extruded in a tubular shape, Next, layers containing at least one of low-density polyethylene resin and linear low-density polyethylene resin can be pressed together using a rubber roll or the like. By manufacturing in this manner, the number of defective products in production can be significantly reduced, ultimately improving production efficiency. Furthermore, the inflation film-forming machine can also perform stretching, which further improves production efficiency.

[0050] In one embodiment, the polyethylene resin layer with a density gradient consists of seven layers: a layer containing high-density polyethylene resin, a layer containing a blend of high-density polyethylene resin and medium-density polyethylene resin, a layer containing at least one of low-density polyethylene resin and linear low-density polyethylene resin, a layer containing a blend of high-density polyethylene resin and medium-density polyethylene resin, and a layer containing high-density polyethylene resin. By constructing the polyethylene resin layer with a five-layer structure that has the density gradient described above, the strength, heat resistance, and stretchability are significantly improved. Furthermore, curling of the substrate can be effectively prevented. In addition, delamination of the substrate can be effectively prevented. Furthermore, polyethylene resin layers with this configuration can be stably produced by the inflation method described above.

[0051] The thickness of the polyethylene resin layer is preferably 10 μm or more and 50 μm or less, and more preferably 10 μm or more and 40 μm or less. By increasing the thickness of the polyethylene resin layer to 10 μm or more, the strength and heat resistance of the base material can be further improved. Furthermore, by setting the thickness of the polyethylene resin layer to 50 μm or less, the film-forming properties and processability of the substrate can be further improved.

[0052] The polyethylene resin layer may have a printed layer on its surface, and the image formed on the printed layer is not particularly limited and may represent letters, patterns, symbols, or combinations thereof. The printing layer on the substrate can be formed using biomass-derived ink. This reduces the environmental impact. The method for forming the printed layer is not particularly limited, and examples include conventionally known printing methods such as gravure printing, offset printing, and flexographic printing.

[0053] (Surface resin layer) The base material comprises a polyethylene resin layer with a surface resin layer containing a resin material having a melting point of 150°C or higher (hereinafter referred to as a high-melting-point resin material, depending on the circumstances).

[0054] The melting point of the high-melting-point resin material is more preferably 160°C or higher. By setting the melting point of the high-melting-point resin material to 160°C or higher, the adhesion of the vapor-deposited film can be further improved, and the gas barrier properties can be further enhanced. Furthermore, when a sealant layer is laminated, the adhesion with the sealant layer can be improved, and the laminate strength of the packaging container made from a laminate containing this substrate can be further enhanced.

[0055] The melting point of the high-melting-point resin material is preferably 265°C or lower, more preferably 260°C or lower, and even more preferably 250°C or lower. By setting the melting point of the high-melting-point resin material to 265°C or lower, the film-forming properties of the substrate can be improved.

[0056] The difference between the melting point of the high-melting-point resin material contained in the surface resin layer and the melting point of the polyethylene contained in the polyethylene resin layer is preferably 20 to 80°C, and more preferably 20 to 60°C. By ensuring that the difference between the melting point of the high-melting-point resin material in the surface resin layer and the melting point of the polyethylene in the polyethylene resin layer is 20°C or more, the adhesion of the vapor-deposited film can be further improved, and the gas barrier properties of the substrate on which the vapor-deposited film is formed can be further enhanced. Furthermore, when a sealant layer is laminated, the adhesion with the sealant layer can be improved, and the laminate strength of the packaging container made from this laminate can be further enhanced. Furthermore, by ensuring that the difference between the melting point of the high-melting-point resin material contained in the surface resin layer and the melting point of the polyethylene contained in the polyethylene resin layer is 80°C or less, the film-forming properties of the substrate can be further improved.

[0057] In one embodiment, the high-melting-point resin material is composed of a polymer having polar groups. By making the high-melting-point resin material a polymer having polar groups, the adhesion to the vapor-deposited film can be further improved.

[0058] In the present invention, a polar group refers to a group containing one or more heteroatoms, and examples include ester groups, epoxy groups, hydroxyl groups, amino groups, amide groups, carboxyl groups, carbonyl groups, carboxylic acid anhydride groups, sulfone groups, thiol groups, and halogen groups. Among these, from the viewpoint of the lamination strength of the packaging container, hydroxyl groups, ester groups, amino groups, amide groups, carboxyl groups, and carbonyl groups are preferred, with hydroxyl groups being more preferred.

[0059] Examples of high-melting-point resin materials include vinyl resins, polyamide resins, polyimide resins, polyester resins, (meth)acrylic resins, cellulose resins, polyolefin resins, and ionomer resins.

[0060] In the present invention, the high-melting-point resin material is particularly preferably a resin material having a melting point of 150°C or higher and possessing polar groups. Preferred resin materials include ethylene-vinyl alcohol copolymers, polyvinyl alcohol, nylon 6, nylon 6,6, nylon 6-nylon 6,6 copolymers, MXD nylon, amorphous nylon, and other amide resins, with ethylene-vinyl alcohol copolymers and amide resins being particularly preferred. By using such high-melting-point resin materials, the adhesion of the vapor-deposited film formed on the surface resin layer can be significantly improved, and the gas barrier properties of the substrate on which the vapor-deposited film is formed can be effectively enhanced.

[0061] The content of the high-melting-point resin material in the surface resin layer is preferably 70% by mass or more, more preferably 80% by mass or more, and even more preferably 90% by mass or more. By setting the content of the high-melting-point resin material in the surface resin layer to 70% by mass or more, the adhesion of the vapor-deposited film formed on the surface resin layer can be significantly improved, and the gas barrier properties of the substrate on which the vapor-deposited film is formed can be effectively improved.

[0062] Within the limits that do not impair the properties of the present invention, the surface resin layer may contain resin materials other than high-melting-point resin materials. Furthermore, from the viewpoint of adhesion to the vapor-deposited film, it is preferable that the surface resin layer does not contain resin materials other than high-melting-point resin materials.

[0063] Furthermore, within the limits that do not impair the properties of the present invention, the surface resin layer may contain additives, such as crosslinking agents, antioxidants, antiblocking agents, lubricants, ultraviolet absorbers, light stabilizers, fillers, reinforcing agents, antistatic agents, pigments, and modifying resins.

[0064] The thickness of the surface resin layer is preferably 0.1 μm or more and 5 μm or less, and more preferably 0.1 μm or more and 4 μm or less. By making the surface resin layer thickness 0.1 μm or more, the adhesion of the vapor-deposited film can be further improved, and the gas barrier properties of the substrate on which the vapor-deposited film is formed can be further enhanced. Furthermore, when a sealant layer is laminated, the adhesion with the sealant layer can be improved, and the laminate strength of the packaging container made from this laminate can be further enhanced. Furthermore, by setting the thickness of the surface resin layer to 5 μm or less, a substrate suitable for use in the production of monomaterial packaging containers can be created. In addition, the film-forming properties and processability of the substrate can be further improved.

[0065] Furthermore, the surface resin layer of the substrate may be surface-treated. This can improve adhesion with adjacent layers. The surface treatment method is not particularly limited and includes physical treatments such as corona discharge treatment, ozone treatment, low-temperature plasma treatment using oxygen gas and / or nitrogen gas, glow discharge treatment, and chemical treatments such as oxidation treatment using chemicals.

[0066] (adhesive resin layer) In one embodiment, the substrate of the present invention may include an adhesive resin layer between the polyethylene resin layer and the surface resin layer, thereby improving the adhesion between these layers.

[0067] The adhesive resin layer can be formed by using adhesive resins such as polyether resin, polyester resin, silicone resin, epoxy resin, polyurethane resin, vinyl resin, phenolic resin, and polyolefin resin. Among the above, polyolefin resin and its acid-modified product are preferred, and polyethylene resin and its acid-modified product are particularly preferred, as the base material can be suitable for use in the production of monomaterial packaging containers. Commercially available polyethylene resins can be used; for example, the Admer series manufactured by Mitsui Chemicals, Inc. can be used.

[0068] The thickness of the adhesive resin layer is not particularly limited, but for example, it can be between 1 μm and 15 μm. By making the adhesive resin layer 1 μm or thicker, the adhesion between the polyethylene resin layer and the surface resin layer can be further improved. By making the adhesive layer 15 μm or less thick, the processability of the substrate can be improved.

[0069] (Vaporized film) The vapor-deposited substrate of the present invention comprises a vapor-deposited film on a surface resin layer. In the vapor deposition substrate of the present invention, the vapor-deposited film and the surface resin layer have high adhesion and extremely high gas barrier properties, specifically oxygen barrier properties and water vapor barrier properties. Furthermore, because the vapor-deposited substrate has a vapor-deposited film, packaging containers made using the vapor-deposited substrate can suppress the loss of mass of the contents filled inside.

[0070] The vapor-deposited film can be made of one or more inorganic substances or inorganic oxides such as silicon (Si), aluminum (Al), magnesium (Mg), calcium (Ca), potassium (K), tin (Sn), sodium (Na), boron (B), titanium (Ti), lead (Pb), zirconium (Zr), and yttrium (Y). The vapor-deposited film can consist of two or more layers, which may be made of the same material or different materials. Among the above, from the viewpoint of adhesion to the surface resin layer and gas barrier properties, the vapor-deposited film is preferably composed of aluminum, aluminum oxide (alumina), or silicon oxide (silica).

[0071] It is preferable that the surface of the deposited film is subjected to the above-mentioned surface treatment. This improves adhesion with adjacent layers.

[0072] Furthermore, the thickness of the deposited film is preferably 1 nm to 150 nm, more preferably 5 nm to 60 nm, and even more preferably 10 nm to 40 nm. By increasing the thickness of the vapor-deposited film to 1 nm or more, the oxygen barrier and water vapor barrier properties of the vapor-deposited substrate can be further improved. Furthermore, by setting the thickness of the vapor-deposited film to 150 nm or less, it is possible to create a vapor-deposited substrate that can be suitably used for the production of monomaterial packaging containers. In addition, it is possible to prevent the occurrence of cracks in the vapor-deposited film.

[0073] Conventional known methods can be used to form the deposited film, such as physical vapor deposition (PVD) methods including vacuum deposition, sputtering, and ion plating, or chemical vapor deposition (CVD) methods including plasma chemical vapor deposition, thermochemical vapor deposition, and photochemical vapor deposition. The following describes one embodiment of a method for forming a vapor-deposited film, but the method for forming a vapor-deposited film is not limited to this.

[0074] A vacuum deposition apparatus with plasma assistance can be used as the equipment for forming vapor-deposited films by the PVD method. One embodiment of a method for depositing a vapor-deposited film using a vacuum deposition apparatus with plasma assistance is described below. In one embodiment, the vacuum film deposition apparatus, as shown in Figures 3 and 4, comprises a vacuum container A, a substrate 10, an unwinding section B, a film deposition drum C, a winding section D, a transport roll E, an evaporation source F, a reaction gas supply section G, an anti-adhesion box H, a deposition material I, and a plasma gun J. Figure 3 is a schematic cross-sectional view of the vacuum deposition apparatus in the XZ plane, and Figure 4 is a schematic cross-sectional view of the vacuum deposition apparatus in the XY plane. As shown in Figure 3, the substrate 10 wound onto the film-forming drum C is positioned at the top of the vacuum vessel A with its surface resin layer facing downwards, and an electrically grounded protective box H is positioned below the film-forming drum C inside the vacuum vessel A. An evaporation source F is positioned on the bottom of the protective box H. The film-forming drum C is positioned inside the vacuum vessel A such that the surface resin layer of the substrate 10 wound onto the film-forming drum C is positioned opposite the top surface of the evaporation source F at a certain distance. Furthermore, a transport roll E is positioned between the unwinding section B and the film-forming drum C, and between the film-forming drum C and the winding section D. The vacuum vessel is connected to a vacuum pump (not shown). The evaporation source F is for holding the deposition material I and is equipped with a heating device (not shown). The reaction gas supply unit G is the part that supplies reaction gases (such as oxygen, nitrogen, helium, argon, and mixtures thereof) that react with the evaporated deposition material. The vapor-deposited material I, heated and evaporated from the evaporation source F, is irradiated onto the surface resin layer of the substrate 10. Simultaneously, plasma is also irradiated onto the surface resin layer from the plasma gun J, and a vapor-deposited film is formed. Details of this formation method are disclosed in Japanese Patent Publication No. 2011-214089.

[0075] Plasma generators used in plasma chemical vapor deposition (PVM) can include high-frequency plasma, pulsed-wave plasma, and microwave plasma generators. Alternatively, a device with two or more deposition chambers may be used. Preferably, the device is equipped with a vacuum pump and capable of maintaining a vacuum in each deposition chamber. The vacuum level in each deposition chamber is 1 × 10 to 1 × 10 -6 Pa is preferable. One embodiment of a method for depositing a vapor-deposited film using a plasma generator is described below. First, the substrate is sent to the film deposition chamber and transported onto the cooling / electrode drum at a predetermined speed via auxiliary rolls. Next, a mixed gas composition containing a monomer gas for film formation containing inorganic oxides, oxygen gas, and an inert gas is supplied from the gas supply device into the film deposition chamber. Plasma is generated on the surface resin layer by glow discharge and irradiated to form a vapor-deposited film containing inorganic oxides on the surface resin layer. Details of this formation method are disclosed in Japanese Patent Publication No. 2012-076292.

[0076] A continuous vapor deposition apparatus equipped with a plasma pretreatment chamber and a deposition chamber can be used as the apparatus for forming vapor-deposited films. One embodiment of a method for forming a vapor-deposited film using the apparatus is described below. First, in the plasma pretreatment chamber, plasma is irradiated onto the surface resin layer of the substrate from a plasma supply nozzle. Next, in the deposition chamber, a vapor-deposited film is formed on the plasma-treated surface resin layer. Details of this formation method are disclosed in the international publication WO2019 / 087960.

[0077] (Barrier coat layer) The vapor-deposited substrate of the present invention may further comprise a barrier coating layer on the vapor-deposited film. This improves the oxygen barrier and water vapor barrier properties of the vapor-deposited substrate.

[0078] In one embodiment, the barrier coat layer includes polyamide resins such as ethylene-vinyl alcohol copolymer (EVOH), polyvinyl alcohol, polyacrylonitrile, nylon 6, nylon 6,6 and polymethoxylylene adipamide (MXD6), polyester resins, polyurethane resins, and gas barrier resins such as (meth)acrylic resins.

[0079] The gas barrier resin content in the barrier coat layer is preferably 50% by mass or more and 95% by mass or less, and more preferably 75% by mass or more and 90% by mass or less. By setting the gas barrier resin content in the barrier coat layer to 50% by mass or more, the oxygen barrier properties and water vapor barrier properties can be further improved.

[0080] The thickness of the barrier coat layer is preferably 0.01 μm or more and 10 μm or less, and more preferably 0.1 μm or more and 5 μm or less. By making the barrier coat layer thickness 0.01 μm or more, the oxygen barrier and water vapor barrier properties of the vapor-deposited substrate can be further improved. By making the barrier coat layer thickness 10 μm or less, the processability of the vapor-deposited substrate can be improved. Furthermore, the recyclability of packaging containers made using a vapor-deposited substrate consisting of the substrate of the present invention and a sealant layer made of polyethylene resin can be improved.

[0081] A barrier coating layer can be formed by dissolving or dispersing the above-mentioned material in water or a suitable solvent, applying it, and drying it. Alternatively, a barrier coating layer can also be formed by applying and drying a commercially available barrier coating agent.

[0082] In another embodiment, the barrier coating layer is a gas barrier coating film containing at least one resin composition, such as a hydrolyzed metal alkoxide or a hydrolyzed condensate of a metal alkoxide, obtained by polycondensation of a mixture of a metal alkoxide and a water-soluble polymer by a sol-gel method in the presence of a sol-gel catalyst, water, and an organic solvent. By providing such a barrier coating layer on the vapor-deposited film, the occurrence of cracks in the vapor-deposited film can be effectively prevented.

[0083] In one embodiment, the metal alkoxide is represented by the following general formula. R 1 n M(OR 2 ) m (However, in the formula, R 1 , R 2 (Each represents an organic group with 1 to 8 carbon atoms, M represents a metal atom, n represents a non-negative integer, m represents a non-negative integer, and n+m represents the valence of M.)

[0084] Examples of metal atoms M that can be used include silicon, zirconium, titanium, and aluminum. Also, R 1 and R 2 Examples of organic groups represented by include alkyl groups such as methyl, ethyl, n-propyl, i-propyl, n-butyl, and i-butyl groups.

[0085] Examples of metal alkoxides that satisfy the above general formula include tetramethoxysilane (Si(OCH3)4), tetraethoxysilane (mass%) Si(OC2H5)4), tetrapropoxysilane (Si(OC3H7)4), and tetrabutoxysilane (Si(OC4H9)4).

[0086] Furthermore, it is preferable to use a silane coupling agent together with the above-mentioned metal alkoxide. As the silane coupling agent, known organoalkoxysilanes containing organic reactive groups can be used.

[0087] As water-soluble polymers, polyvinyl alcohol and ethylene-vinyl alcohol copolymers are preferred, and from the viewpoint of oxygen barrier properties, water vapor barrier properties, water resistance and weather resistance, it is preferable to use these in combination.

[0088] The thickness of the gas barrier coating film is preferably 0.01 μm or more and 10 μm or less, and more preferably 0.1 μm or more and 5 μm or less. By setting the thickness of the gas barrier coating film to 0.01 μm or more, the oxygen barrier and water vapor barrier properties of the vapor-deposited substrate can be improved. Furthermore, the occurrence of cracks in the vapor-deposited film can be prevented. By setting the thickness of the gas barrier coating film to 10 μm or less, a vapor deposition substrate suitable for use in the production of monomaterial packaging containers can be obtained.

[0089] A gas barrier coating film can be formed by applying a composition containing the above-mentioned materials using conventionally known methods such as roll coating (including gravure roll coaters), spray coating, spin coating, dipping, brushing, barcode application, or applicator application, and then polycondensing the composition by a sol-gel method. Acid or amine compounds are preferred as catalysts for the sol-gel process.

[0090] The above composition may further contain an acid. The acid is used as a catalyst for the sol-gel process, mainly as a catalyst for the hydrolysis of alkoxides and silane coupling agents. As acids, mineral acids such as sulfuric acid, hydrochloric acid, and nitric acid, as well as organic acids such as acetic acid and tartaric acid, are used.

[0091] Furthermore, the above composition may contain an organic solvent. Examples of organic solvents include methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol, and n-butanol.

[0092] The following describes one embodiment of a method for forming a gas barrier coating film. First, a composition is prepared by mixing a metal alkoxide, a water-soluble polymer, a sol-gel catalyst, water, an organic solvent, and, if necessary, a silane coupling agent. A polycondensation reaction gradually proceeds within this composition. Next, the composition is applied to the vapor-deposited film and dried using the conventionally known method described above. This drying further promotes the polycondensation reaction between the alkoxide and the water-soluble polymer (and the silane coupling agent if the composition contains one), forming a layer of composite polymer. Finally, by heating, a gas barrier coating can be formed.

[0093] (Laminated structure) As shown in Figure 5, the laminate 20 of the present invention is characterized by comprising the above-mentioned vapor-deposited substrate 10 and the sealant layer 21. The polyethylene resin layer and sealant layer of the laminate are made of the same resin, i.e., polyethylene resin, and a laminate having such a configuration can be suitably used as a vapor deposition substrate for manufacturing monomaterial packaging containers.

[0094] The polyethylene resin content relative to the total amount of solids in the laminate is preferably 80% by mass or more, and more preferably 90% by mass or more. This makes it possible to create a laminate that can be suitably used in the manufacture of monomaterial packaging containers.

[0095] The sealant layer of the laminate is described below.

[0096] (Sealant layer) In one embodiment, the sealant layer contains the same resin as the polyethylene resin layer of the substrate, i.e., polyethylene resin. A laminate having such a configuration can be suitably used as a vapor deposition substrate for producing monomaterial packaging containers. As polyethylene resins, high-density polyethylene resin (HDPE), medium-density polyethylene resin (MDPE), low-density polyethylene resin (LDPE), linear low-density polyethylene resin (LLDPE), and very low-density polyethylene resin (VLDPE) can be used. Furthermore, a copolymer of ethylene and other monomers can also be used as the polyethylene resin. Furthermore, as polyethylene resin, biomass-derived polyethylene resin or mechanically or chemically recycled polyethylene resin can also be used.

[0097] The polyethylene resin content in the sealant layer is preferably 80% by mass or more, and more preferably 90% by mass or more. This makes it possible to create a laminate that can be suitably used in the manufacture of monomaterial packaging containers.

[0098] Within the limits that do not impair the properties of the present invention, the sealant layer may contain resin materials other than polyethylene resin, such as polyolefin resins such as polypropylene resin, (meth)acrylic resins, vinyl resins, cellulose resins, polyamide resins, polyester resins, and ionomer resins. Furthermore, from the standpoint of its recyclability, it is particularly preferable that the sealant layer does not contain any resins other than polyethylene resin.

[0099] The sealant layer may contain the above-mentioned additives, to the extent that it does not impair the properties of the present invention.

[0100] The sealant layer may have a single-layer structure or a multi-layer structure.

[0101] The thickness of the sealant layer is preferably 20 μm to 100 μm, and more preferably 30 μm to 70 μm. By increasing the thickness of the sealant layer to 20 μm or more, the lamination strength of the packaging container can be further improved. Furthermore, by making the sealant layer thickness 100 μm or less, the moldability of the laminate can be improved, making it easier to manufacture packaging containers.

[0102] The sealant layer can be formed by laminating a resin film made of the above-mentioned resin material, such as polyethylene resin, with a vapor-deposited film or barrier coat layer provided on a surface vapor-deposited film, via a conventionally known adhesive or the like. Furthermore, the sealant layer can be formed by melt-extruding the resin material onto a vapor-deposited film or a barrier coat layer provided on a surface vapor-deposited film. Furthermore, when the laminate is used to manufacture laminate tubes or the like, the laminate of the present invention further comprises a sealant layer on the non-deposited surface of the substrate (not shown).

[0103] (packaging container) The packaging container of the present invention is characterized by comprising the above-mentioned vapor-deposited substrate. Examples of packaging containers include packaging bags, lids, and laminate tubes.

[0104] Examples of packaging bags include various types such as standing pouch type, side seal type, two-side seal type, three-side seal type, four-side seal type, envelope seal type, gusset seal type (pillow seal type), pleated seal type, flat bottom seal type, square bottom seal type, and gusset type.

[0105] As shown in Figure 6, the packaging container of the present invention is a packaging bag 30 made by bonding together two laminated materials (the shaded area is the heat-sealed portion).

[0106] A packaging bag in the form shown in Figure 6 can be manufactured by preparing two laminates, each comprising a base material and a vapor-deposited film and sealant layer provided on one side of the base material, overlapping these laminates so that the sealant layers face each other, and heat-sealing three sides.

[0107] In one embodiment, the packaging container of the present invention is a standing pouch type packaging bag 40 (hereinafter simply referred to as a standing pouch 40), as shown in Figure 7, and the standing pouch 40 comprises a body (side sheet) and a bottom (bottom sheet). The body (side sheet) of the standing pouch 40 consists of a laminate comprising at least a base material, and a vapor-deposited film and a sealant layer provided on one side of the base material. Furthermore, the bottom portion may also consist of a laminate comprising a base material and a vapor-deposited film and sealant layer provided on one side of the base material. By adopting such a configuration, the gas barrier properties of the standing pouch 40 can be further improved.

[0108] As shown in Figure 7, the body (side sheet) of the standing pouch 40 can be formed by manufacturing a bag such that the sealant layer of a laminate comprising a base material and a vapor-deposited film and sealant layer provided on one side of the base material becomes the innermost layer. In another embodiment, two laminates are prepared, each comprising a base material and a vapor-deposited film and sealant layer provided on one side of the base material. These are then stacked so that the sealant layers face each other. Two V-shaped folded laminates are inserted from both ends of the stacked laminates, with the sealant layers facing outwards, and heat-sealed to form the body (side sheet) of the standing pouch 40. This manufacturing method allows for the creation of a stand pouch having a body with side gussets. Furthermore, the bottom (bottom sheet) of the standing pouch 40 can be formed by inserting a laminate between the formed body (side sheets) and heat sealing it. More specifically, the laminate can be formed by folding it in a V-shape with the sealant layer facing outwards, inserting it between the formed side sheets, and heat sealing it.

[0109] Furthermore, the packaging container may be equipped with an easy-opening mechanism 51, as shown in Figure 6. Examples of the easy-opening means 51 include a notch portion 52 that serves as the starting point for tearing, as shown in Figure 6, and a half-cut line 53 formed by laser processing or a cutter, which serves as the path for tearing.

[0110] Furthermore, the packaging container may be a stand-up pouch equipped with a dispensing nozzle 61, as shown in Figure 7. Furthermore, from the viewpoint of ease of opening, the stand pouch 40 may be provided with a curved portion 62 that curves inward, as shown in Figure 7. Furthermore, it may include a cut portion 63 formed by a laser beam or the like.

[0111] (Laminated tube) The laminate tube of the present invention is characterized by comprising the above-mentioned laminate, specifically a laminate composed of a laminated film having sealant layers on both sides. The laminate tube of the present invention will be described below with reference to the drawings. Figure 8 is a simplified diagram showing the structure of the laminate tube 70, and Figure 9 is a cross-sectional view of aa in Figure 8. As shown in Figure 8, the laminate tube 70 comprises a laminate tube body 71 having a head portion 72 and a body portion 73, and the body portion 73 is characterized in that it is made of the above-mentioned laminate.

[0112] (head) The head portion 72 includes a shoulder portion 74 connected to one end of the torso portion 73 and an extraction port portion 75 connected to the shoulder portion 74. In one embodiment, the spout portion 75 is provided with threads 77 for screwing on the cap 76.

[0113] In one embodiment, the head is made of a resin composition containing polyethylene, which improves the recyclability of the tube container.

[0114] The method for manufacturing the head is not particularly limited and can be manufactured by conventionally known methods. For example, the head can be manufactured by compression molding or injection molding and then joined to the body.

[0115] (torso) In the laminate tube body 71 of the present invention, the torso portion 73 is connected to the shoulder portion 74 of the head portion 72. The body portion 73 includes a welded portion 78 formed by rolling the laminated material into a cylindrical shape, overlapping the heat-sealed layers, and heat-sealing the overlapped portion. Furthermore, the body portion 73 includes a bottom seal portion 79 formed by heat-sealing the opening of the rolled laminate.

[0116] (cap) The laminated tube 70 may be equipped with a screw-type or plug-type cap 76. The cap is detachably attached to the dispensing opening at the top of the dispenser and serves to close the dispensing opening. The cap is made of a resin composition containing a thermoplastic resin. From the standpoint of recyclability, polyethylene is particularly preferred as a thermoplastic resin. [Examples]

[0117] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the following examples.

[0118] Example 1-1 Ethylene vinyl alcohol copolymer (manufactured by Kuraray Co., Ltd., EVAL E171B, melting point: 165℃, density: 1.14 g / cm³) 3 )and, Adhesive resin (manufactured by Mitsui Chemicals, Inc., maleic anhydride-modified polyethylene, Admer NF557, density 0.920 g / cm³) 3 )and, Medium-density polyethylene (Dow Chemical, Elite 5538, density: 0.941 g / cm³) 3 (melting point: 129°C) After co-extruding the material using the inflation molding method, the substrate was prepared by stretching it five times in the longitudinal direction (MD direction) using a stretching device. In the substrate obtained in this manner, the thickness of the surface resin layer, composed of ethylene vinyl alcohol copolymer, was 2 μm, the thickness of the adhesive resin layer was 3 μm, and the thickness of the polyethylene resin layer, composed of medium-density polyethylene, was 20 μm.

[0119] On the surface of the substrate's surface resin layer, a PVD (Physical Vapor Deposition) method is applied, at a pressure of 3.0 × 10 -2 An aluminum vapor-deposited film with a thickness of 30 nm was formed under Pa conditions to obtain the vapor-deposited substrate of the present invention. The deposition conditions were as follows:

[0120] Examples 1-2 Ethylene vinyl alcohol copolymer is used with polyamide (manufactured by Ube Industries, Ltd., 5033, melting point: 196℃, density: 1.14 g / cm³). 3 The substrate was prepared in the same manner as in Example 1-1, except that it was changed to ). In the substrate obtained in this manner, the thickness of the surface resin layer made of polyamide was 2 μm, the thickness of the adhesive resin layer was 3 μm, and the thickness of the polyethylene resin layer made of medium-density polyethylene was 20 μm.

[0121] A 30 nm thick aluminum vapor-deposited film was formed on the surface of the resin layer of the substrate by PVD (Physical Vapor Deposition) to obtain the vapor-deposited substrate of the present invention.

[0122] Examples 1-3 Ethylene vinyl alcohol copolymer (manufactured by Kuraray Co., Ltd., EVAL E171B, melting point: 165℃, density: 1.14 g / cm³) 3 )and, Adhesive resin (manufactured by Mitsui Chemicals, Inc., maleic anhydride-modified polyethylene, Admer NF557, density 0.920 g / cm³) 3 )and, Medium-density polyethylene (Dow Chemical, Elite 5538, density: 0.941 g / cm³) 3 (melting point: 129°C) and compatibilizer (Dow Chemical, polyethylene maleate anhydride, Retain 3000, density: 0.87 g / cm³) 3 A blended resin containing ) in a ratio of 8:2 by mass, Medium-density polyethylene (Dow Chemical, Elite 5538, density: 0.941 g / cm³) 3 (melting point: 129°C) After co-extruding the material using the inflation molding method, the substrate was prepared by stretching it five times in the longitudinal direction (MD direction) using a stretching device. In the substrate obtained in this manner, the thickness of the surface resin layer composed of ethylene vinyl alcohol copolymer was 2 μm, the thickness of the adhesive resin layer was 3 μm, the thickness of the second polyethylene resin layer composed of blended resin was 10 μm, and the thickness of the first polyethylene resin layer composed of medium-density polyethylene was 10 μm.

[0123] On the surface of the substrate's surface resin layer, a PVD (Physical Vapor Deposition) method is applied, at a pressure of 3.0 × 10 -2An aluminum vapor-deposited film with a thickness of 30 nm was formed under Pa conditions to obtain the vapor-deposited substrate of the present invention.

[0124] Examples 1-4 Ethylene vinyl alcohol copolymer is used with polyamide (manufactured by Ube Industries, Ltd., 5033, melting point: 196℃, density: 1.14 g / cm³). 3 The substrate was prepared in the same manner as in Examples 1-3, except that it was changed to ). In the substrate obtained in this manner, the thickness of the surface resin layer made of polyamide was 2 μm, the thickness of the adhesive resin layer was 3 μm, the thickness of the second polyethylene resin layer made of blended resin was 10 μm, and the thickness of the first polyethylene resin layer made of medium-density polyethylene was 10 μm.

[0125] A 30 nm thick aluminum vapor-deposited film was formed on the surface of the resin layer of the substrate by PVD (Physical Vapor Deposition) to obtain the vapor-deposited substrate of the present invention.

[0126] Comparative Example 1-1 Medium-density polyethylene (Dow Chemical, Elite 5538, density: 0.941 g / cm³) 3 A single-layer extruded film was produced using the inflation molding method from a polyethylene film with a melting point of 129°C. This film was then stretched five times in the longitudinal direction (MD direction) using a stretching device to produce a 25 μm stretched polyethylene film.

[0127] A 30 nm thick aluminum vapor-deposited film was formed on the surface of a polyethylene film by PVD (Physical Vapor Deposition) to obtain a laminated film.

[0128] Comparative Example 1-2 A biaxially oriented polyester film with a thickness of 12 μm (manufactured by Toyobo Co., Ltd., E5100) was prepared.

[0129] A 30 nm thick aluminum vapor-deposited film was formed on the surface of a polyester film by PVD (Physical Vapor Deposition) to obtain a laminated film.

[0130] Example 2-1 The vapor-deposited substrate of the present invention was prepared in the same manner as in Example 1-1, except that the aluminum vapor-deposited film was replaced with a 20 nm thick aluminum oxide (alumina) vapor-deposited film formed by the PVD method.

[0131] Example 2-2 The vapor-deposited substrate of the present invention was prepared in the same manner as in Examples 1-2, except that the aluminum vapor-deposited film was replaced with a 20 nm thick aluminum oxide (alumina) vapor-deposited film formed by the PVD method.

[0132] Examples 2-3 The vapor-deposited substrate of the present invention was prepared in the same manner as in Examples 1-3, except that the aluminum vapor-deposited film was replaced with a 20 nm thick aluminum oxide (alumina) vapor-deposited film formed by the PVD method.

[0133] Examples 2-4 The vapor-deposited substrate of the present invention was prepared in the same manner as in Examples 1-4, except that the aluminum vapor-deposited film was replaced with a 20 nm thick aluminum oxide (alumina) vapor-deposited film formed by the PVD method.

[0134] Comparative Example 2-1 A laminated film was prepared in the same manner as in Comparative Example 1-1, except that the aluminum vapor-deposited film was replaced with a 20 nm thick aluminum oxide (alumina) vapor-deposited film formed by the PVD method.

[0135] Comparative Example 2-2 A laminated film was prepared in the same manner as in Comparative Examples 1-2, except that the aluminum vapor-deposited film was replaced with a 20 nm thick aluminum oxide (alumina) vapor-deposited film formed by the PVD method.

[0136] Example 3-1 The vapor-deposited substrate of the present invention was prepared in the same manner as in Example 1-1, except that the aluminum vapor-deposited film was replaced with a 20 nm thick silicon oxide (silica) vapor-deposited film formed by the CVD method.

[0137] Example 3-2 The vapor-deposited substrate of the present invention was prepared in the same manner as in Examples 1-2, except that the aluminum vapor-deposited film was replaced with a 20 nm thick silicon oxide (silica) vapor-deposited film formed by the CVD method.

[0138] Example 3-3 The vapor-deposited substrate of the present invention was prepared in the same manner as in Examples 1-3, except that the aluminum vapor-deposited film was replaced with a 20 nm thick silicon oxide (silica) vapor-deposited film formed by the CVD method.

[0139] Examples 3-4 The vapor-deposited substrate of the present invention was prepared in the same manner as in Examples 1-4, except that the aluminum vapor-deposited film was replaced with a 20 nm thick silicon oxide (silica) vapor-deposited film formed by the CVD method.

[0140] Comparative Example 3-1 A laminated film was prepared in the same manner as in Comparative Example 1-1, except that the aluminum vapor-deposited film was replaced with a 20 nm thick silicon oxide (silica) vapor-deposited film formed by the CVD method.

[0141] Comparative Example 3-2 A laminated film was prepared in the same manner as in Comparative Examples 1-2, except that the aluminum vapor-deposited film was replaced with a 20 nm thick silicon oxide (silica) vapor-deposited film formed by the CVD method.

[0142] <<Gas Barrier Properties Evaluation>> The oxygen permeability (cc / m³) of the vapor-deposited substrate and laminated film obtained in the examples and comparative examples is 2 (day·atm) and water vapor transmission (g / m³) 2 The following method was used to measure the (day) and the results are summarized in Table 1.

[0143] [Oxygen permeability] Using an oxygen permeability measuring device (MOCON, OX-TRAN2 / 20), the test specimen was set with the substrate side facing the oxygen supply side, and the oxygen permeability was measured in accordance with JIS K 7126 under conditions of 23°C and 90% RH relative humidity. [Water vapor transmission rate] Using a water vapor transmission rate measuring device (MOCON, PERMATRAN-w 3 / 33), the test specimen was set with the substrate side facing the water vapor supply side, and the water vapor transmission rate was measured in accordance with JIS K 7129 under conditions of 40°C and 90% RH relative humidity.

[0144] <<Laminate Strength Test>> First linear low-density polyethylene (Prime Polymer Co., Ltd., SP2520, density: 0.925 g / cm³) 3 Multilayer extrusion was performed using inflation molding to produce unstretched polyethylene films of 20 μm thickness each of the first linear low-density polyethylene (melting point: 122°C) and a second linear low-density polyethylene (SP1520, manufactured by Prime Polymer Co., Ltd., density 0.913, melting point 116°C). The first linear low-density polyethylene side of this unstretched polyethylene film was laminated onto the vapor-deposited substrate and laminated film obtained in the above examples and comparative examples via a two-component curable urethane adhesive (Rock Paint Co., Ltd., Ru-77T / H-7) to obtain a laminate. The polyethylene content in each laminate obtained in this way is summarized in Table 1.

[0145] Samples of this laminate were cut into 15 mm wide strips and measured using a tensile testing machine (Tensilon Universal Material Tester, manufactured by Orientec Co., Ltd.) in accordance with JIS K6854-2. The laminate strength (N / 15 mm) between the vapor-deposited film and the surface resin layer (Example) and between the vapor-deposited film and the polyethylene film or polyester film (Comparative Example) was measured using a 180° peel at a peeling speed of 50 mm / min. The measurement results are summarized in Table 1.

[0146] [Table 1] [Explanation of Symbols]

[0147] 10: Vapor deposition substrate, 11: Substrate, 12: Vapor deposition film, 13: Polyethylene resin layer, 14: Surface resin layer, 15: Adhesive resin layer, 20: Laminate, 21: Sealant layer, 30: Packaging bag, 40: Standing pouch, 41: Body (side sheet), 42: Bottom (bottom sheet), 51: Easy opening means, 52: Notch, 53: Half-cut line, 61: Extraction nozzle, 62: Curved part, 63: Cut-off part, 70: Laminate tube, 71: Laminate tube body, 72: Head, 73: Body, 74: Shoulder, 75: Outlet, 76: Cap, 77: Thread, 78: Welded part, 79: Bottom seal part

Claims

1. A vapor deposition substrate comprising at least a substrate and a vapor-deposited film, The substrate comprises at least a polyethylene resin layer and a surface resin layer, The aforementioned substrate is a co-extruded film, The polyethylene resin layer is provided with a density gradient. The vapor-deposited film is provided on the surface resin layer of the substrate, A barrier coating layer is further provided on the aforementioned vapor-deposited film. The aforementioned surface resin layer contains a resin material having a melting point of 150°C or higher. The aforementioned substrate is characterized by having undergone a stretching treatment, wherein the substrate is a vapor-deposited substrate.

2. The vapor deposition substrate according to claim 1, wherein the surface resin layer comprises a resin material having a melting point of 150°C or higher and 265°C or lower.

3. The vapor deposition substrate according to claim 1 or 2, wherein the difference in melting points between the polyethylene resin and the resin material of the surface resin layer having a melting point of 150°C or higher is 20 to 80°C.

4. The vapor deposition substrate according to any one of claims 1 to 3, wherein the resin material of the surface resin layer is a polymer having polar groups.

5. The vapor deposition substrate according to any one of claims 1 to 4, wherein the resin material of the surface resin layer is at least one resin material selected from the group consisting of ethylene vinyl alcohol copolymer, polyvinyl alcohol, polyester, nylon 6, nylon 6,6, nylon 6-nylon 6,6 copolymer, MXD nylon, and amorphous nylon.

6. The vapor-deposited substrate according to any one of claims 1 to 5, wherein the ratio of the thickness of the surface resin layer to the total thickness of the substrate is 2% or more and 20% or less.

7. The vapor-deposited substrate according to any one of claims 1 to 6, wherein the polyethylene resin layer of the substrate has a multilayer structure.

8. The vapor-deposited substrate according to claim 7, wherein the polyethylene resin layer of the substrate comprises at least one layer containing a compatibilizer.

9. The vapor deposition substrate according to claim 8, wherein the surface resin layer is provided so as to be in contact with the layer containing the compatibilizer for the polyethylene resin layer.

10. A vapor-deposited substrate according to any one of claims 1 to 9, used in packaging containers.

Images