Apparatus for processing wafer-shaped articles

Abstract

An apparatus for processing wafer-like articles, comprising: a support for supporting the wafer-like article; and a liquid dispenser for dispensing a processing liquid onto a surface of the wafer-like article supported on the support, the liquid dispenser comprising a nozzle assembly having an inlet portion, a dispensing nozzle, and a static throttle between the inlet portion and the dispensing nozzle, the static throttle comprising a plurality of flow paths through which the processing liquid can flow from the inlet portion to the dispensing nozzle.

Description

Technical Field

[0001] The present invention relates to an apparatus for processing wafer-shaped articles, and also to a nozzle assembly for use in such an apparatus.

Background Art

[0002] Semiconductor wafers may be subjected to various surface treatment processes such as etching, cleaning, polishing, and material deposition.

[0003] At least some of these surface treatment processes involve applying a liquid to the surface of the wafer. For example, the surface of the wafer may be etched by applying a treatment liquid such as hydrofluoric acid to selected locations on the wafer surface. Alternatively, the surface of the wafer may be cleaned by applying a cleaning or rinsing liquid such as isopropyl alcohol or deionized water to the wafer surface.

[0004] When a liquid is applied to the surface of the wafer, the wafer may be rotated, for example, using a rotating chuck that holds the wafer, to facilitate dispersion of the liquid across the wafer surface. When the liquid is a cleaning or rinsing liquid, such a process may be referred to as a spin cleaning process.

[0005] Furthermore, the surface of the wafer may then be dried by heating the wafer to cause evaporation of the liquid on the wafer surface.

[0006] An example of an apparatus that can be used for liquid processing of semiconductor wafers is described in US2017 / 0345681A1, the content of which is incorporated herein by reference.

[0007] A further example of an apparatus that can be used for liquid processing of semiconductor wafers is described in US9,799,539B2, the content of which is also incorporated herein by reference.

[0008] As described in US9,799,539B2, spilled droplets from a liquid dispenser used to dispense liquid onto a wafer surface can damage the wafer. This means the wafer will be defective and will need to be discarded. For example, if the liquid is a processing solution used to etch the wafer surface, spilled droplets will cause improper etching on the wafer.

[0009] US9,799,539B2 discloses a liquid handling apparatus for wafer-shaped articles, which aims to prevent the formation of such spillage droplets.

[0010] As shown in Figure 1 (corresponding to Figure 1 of US9,799,539B2), US9,799,539B2 discloses an apparatus comprising a spin chuck 1 for holding a wafer W. For example, the spin chuck 1 may comprise a series of gripping pins supporting the wafer W. The spin chuck 1 is located inside a chamber 2 and is typically within a processing module for wet processing of a single semiconductor wafer. A liquid dispenser assembly comprises a liquid dispenser arm 4 located above the chuck 1 and connected to a processing liquid supply source 5 via a control valve 6. The liquid dispenser arm 4 comprises a nozzle assembly 3 at its distal end. The liquid dispenser arm 4 is preferably rotatable or linearly movable to a standby position not over the wafer W in order to facilitate loading and unloading of the wafer W into and out of the spin chuck 1.

[0011] The spin chuck 1 rotates via a lower shaft which is then driven to rotate by a motor 7. The controller 8 controls the entire operation of the spin chuck 1, including coordinating the operation of the motor 7 to rotate the spin chuck 1 and the operation of the valve 6 to open and close the flow of processed liquid from the supply source 5.

[0012] As shown in Figure 2 (corresponding to Figure 2 of US9,799,539B2), the nozzle assembly 3 of US9,799,539B2 includes a check valve 9 located inside the nozzle assembly 3. The check valve 9 includes a valve body 10 biased toward the closed position relative to the valve seat 11 by a threaded spring 12.

[0013] In the use of the apparatus disclosed in US9,799,539B2, a wafer W is placed in a spin chuck 1, and a controller 8 signals a motor 7 to rotate the wafer at a selected rpm. The controller 8 then signals a control valve 6 to open a source 5 for supplying the processing liquid to a dispenser arm 4.

[0014] Since the processing fluid enters the nozzle assembly 3 from the inlet / upstream side (the top of the nozzle assembly in Figure 2), the supply pressure of the processing fluid is sufficient to move the valve body 10 downward away from the valve seat 11, and as a result, the processing fluid can continue to flow through the nozzle assembly 3 from the outlet / downstream side of the nozzle assembly 3 (the bottom of the nozzle assembly in Figure 2). The processing fluid is dispensed onto the wafer W from the outlet / downstream side of the nozzle assembly 3.

[0015] At the end of the desired processing of the wafer W with the processing liquid, the controller 8 signals the control valve 6 to close. As the pressure of the processing liquid in the nozzle assembly 3 decreases, the valve body 10 is prompted by the spring 12 to return to the closed position relative to the valve seat 11.

[0016] Therefore, the check valve of nozzle assembly 3 closes almost immediately after the desired flow stops, preventing the processing fluid from dripping after the desired flow (for example, during the operation of the dispenser arm following the desired flow). [Overview of the Initiative]

[0017] While the deployment disclosed in US9,799,539B2 has been shown to be effective in preventing unwanted dripping of the processing fluid and is suitable for many applications, the inventors have noticed that the deployment disclosed in US9,799,539B2 may have some undesirable effects depending on the circumstances.

[0018] For example, in some situations, the check valve used in US9,799,539B2 is undesirable because its moving parts may generate or trap particles. For instance, the generated particles could cause contamination of the processing solution and / or the wafer.

[0019] This invention aims to address this problem.

[0020] Most generally, the present invention relates to a liquid dispenser for a apparatus for processing wafer-shaped articles, wherein the nozzle of the liquid dispenser comprises a static throttle including a plurality of flow paths.

[0021] The inventors have found that including such a static throttle in the nozzle can help prevent dripping when the supply of the processing liquid is stopped. Furthermore, since the static nozzle does not contain any moving parts, it does not generate or capture particles, similar to the check valve in US9,799,539B2. A first aspect of the present invention provides an apparatus for processing wafer-shaped articles. The apparatus comprises a support for supporting the wafer-shaped article and a liquid dispenser for dispensing a processing liquid onto the surface of the wafer-shaped article supported by the support, the liquid dispenser comprising a nozzle assembly, the nozzle assembly comprising an inlet portion and a dispensing nozzle,

[0022] The system includes a static throttle between the inlet and the dispensing nozzle, which includes a plurality of flow paths through which the processing liquid can flow from the inlet to the dispensing nozzle.

[0023] The inventors have discovered that providing such a nozzle assembly in a liquid dispenser can help prevent dripping when the supply of the processing liquid is stopped. Furthermore, since the static nozzle does not contain any moving parts, it does not generate or capture particles, similar to the check valve in US9,799,539B2.

[0024] The device according to the first aspect of the present invention may have any one of the following optional features, or any combination thereof if combinable.

[0025] The wafer-like article may be a semiconductor wafer.

[0026] The processing of the wafer-like article may include liquid processing of its surface. For example, the processing may include etching or rinsing of the surface.

[0027] The support may be a chuck.

[0028] The support may be rotatable to rotate the wafer-like article. For example, the support may be a rotatable chuck such as a spin chuck. The device may include a motor for rotating the support.

[0029] The liquid dispenser is a mechanism, or system, or arrangement for dispensing liquid.

[0030] The device may include a processing liquid supply source for supplying the processing liquid to the liquid dispenser.

[0031] The liquid dispenser may include a dispensing arm, and the nozzle assembly may be installed at or adjacent to the distal end of the dispensing arm. The flow passage may be provided in the dispensing arm for supplying the processing liquid to the nozzle assembly.

[0032] The dispensing arm may be rotatably attached or pivoted at its proximal end so as to be movable above the surface of the wafer-like article.

[0033] More generally, the nozzle assembly may be movable above the surface of the wafer-like article to dispense the processing liquid to different parts of the wafer-like article. For example, the device may include an X-Y stage or an X-Y-Z stage for moving the nozzle assembly relative to the wafer-like article.

[0034] The term nozzle assembly may be replaced by the terms nozzle, nozzle configuration, nozzle member, nozzle element, or nozzle section.

[0035] The nozzle assembly inlet is the part or component of the nozzle assembly into which the processing fluid flows.

[0036] For example, the inlet portion of the nozzle assembly may include a flow path or chamber within the nozzle assembly that can be connected to the processing fluid flow.

[0037] A dispensing nozzle is a component or part of a nozzle assembly from which the processing fluid is dispensed (output). Therefore, in practice, a dispensing nozzle will have a nozzle tip from which the processing fluid is dispensed.

[0038] In practice, the processing solution will be dispensed directly from the dispensing nozzle onto the surface of the wafer-shaped object.

[0039] Generally, the term static throttle refers to a part, component, or element that regulates the flow of the processing fluid through a nozzle assembly and has no moving parts. Regulation of the processing fluid flow may mean reducing, counteracting, or limiting the processing fluid flow.

[0040] The static throttle is located between the inlet and the dispensing nozzle. For example, the static throttle may be directly connected to the dispensing nozzle at the inlet, and / or separated from the dispensing nozzle at the inlet.

[0041] Multiple channels are separate and / or distinct and / or separate channels for their respective inlets and outlets.

[0042] Multiple flow channels have an inlet on the side of the static throttle's inlet portion and an outlet on the side of the static throttle's dispensing nozzle.

[0043] The term "flow channel" may be replaced by the terms "flow channel," "channel," "bore," or "borehole."

[0044] Multiple flow channels may have multiple bore holes.

[0045] Multiple boreholes may be machined from a material block. Alternatively, the nozzle can be manufactured by 3D printing (additional manufacturing).

[0046] The number of flow channels may be 5 or more, or 9 or more, or 15 or more.

[0047] At least a portion of the inner surface of a dispensing nozzle may be hydrophilic. For example, at least the inner surface of a dispensing nozzle at or adjacent to the outlet of a plurality of flow channels may be hydrophilic.

[0048] The entire inner surface of the dispensing nozzle may be substantially or completely hydrophilic.

[0049] The entire inner surface of the nozzle assembly may be substantially or completely hydrophilic.

[0050] Being hydrophilic may mean including materials whose surface has a water static contact angle of 90° or less, or 80° or less, or 45° or less.

[0051] The hydrophilic surface may contain PCTFE or PFA.

[0052] The entire dispensing nozzle may be substantially or entirely formed from a hydrophilic material such as PCTFE or PFA.

[0053] The entire nozzle assembly may be substantially or entirely formed from a hydrophilic material such as PCTFE or PFA.

[0054] By providing such a hydrophilic inner surface, it helps prevent dripping when the supply of the treatment liquid is stopped.

[0055] The length of the dispensing nozzle may be at least four times the inner diameter of the dispensing nozzle, or at least five times the inner diameter of the dispensing nozzle, or at least six times the inner diameter of the dispensing nozzle, or at least seven times the inner diameter of the dispensing nozzle.

[0056] The inventors have found that a dispensing nozzle of such length has sufficient space for individual flows through multiple channels to fuse and form a well-developed, substantially uniform velocity profile, even if the individual flows through the nozzle assembly are at different flow rates.

[0057] The inner diameter or width of the inlet may be larger than the inner diameter or width of the dispensing nozzle.

[0058] More generally, the diameter or width of the fluid flow through the nozzle assembly may decrease as soon as it passes through a static throttle. Therefore, static throttles result in necking or narrowing of the fluid flow through the nozzle assembly.

[0059] For at least some of the multiple flow paths, the outlet of the flow path may be closer to the central axis of the nozzle assembly than its inlet. Therefore, the diameter or width of the fluid flow decreases as soon as it passes through the static throttle.

[0060] The inlet of the flow path on the inlet side of the static throttle may extend over a wider area than, or reach over, or extend over a wider area than the outlet of the flow path on the dispensing nozzle side of the static throttle.

[0061] In other words, the envelope surface at the entrance of the flow path on the inlet side can be larger than the envelope surface at the exit of the flow path on the dispensing nozzle side.

[0062] The flow path may be substantially or entirely linear (straight).

[0063] Some channels may be angled with respect to the central axis of the nozzle assembly such that the exit of the channel is closer to the central axis than its inlet.

[0064] At least some of the flow paths may be parallel to the central axis of the nozzle assembly. For example, one or more central flow paths may extend parallel to the central axis of the nozzle assembly, and one or more peripheral flow paths may be angled with respect to the central axis of the nozzle assembly such that their exits are closer to the central axis than their inlets.

[0065] The nozzle assembly may be machined from a single material.

[0066] At least a portion of the inner surface of the dispensing nozzle has a surface roughness Ra of 0.5 μm or less, or 0.4 μm or less, or 0.3 μm or less, or 0.2 μm or less.

[0067] The entire inner surface of the dispensing nozzle may have substantially or completely such surface roughness.

[0068] The entire inner surface of the nozzle assembly may have substantially or completely such surface roughness.

[0069] Each of the multiple channels has a diameter d in the range of 0.8 mm ≤ d ≤ 1.6 mm.

[0070] A static throttle may have a recess, cone, tapered, or funnel-shaped section on its inlet side, with the opening of this section facing the inlet. The inlet of the flow path may be located on the bottom surface of this section (the surface facing the dispensing nozzle).

[0071] The apparatus further includes a control valve for turning on and off the supply of processing liquid to a liquid dispenser, the control valve may be located upstream of the nozzle assembly. In a second aspect of the present invention, a nozzle assembly is provided for use in an apparatus for processing wafer-shaped articles, the nozzle assembly comprising an inlet portion, a dispensing nozzle, and a static throttle between the inlet portion and the dispensing nozzle, the static throttle including a plurality of channels through which the processing liquid can flow from the inlet portion to the dispensing nozzle.

[0072] A nozzle assembly according to a second aspect of the present invention may have any of the features of the nozzle assembly according to the first aspect of the present invention described above, or any combination thereof, if possible. These features are not described again herein for the sake of brevity. [Brief explanation of the drawing]

[0073] Herein, embodiments of the present invention will be described only by illustration with reference to the accompanying drawings. [Figure 1] A schematic diagram of a device according to an embodiment of the present invention. [Figure 2] Cross-sectional view of a nozzle assembly from prior art. [Figure 3] A schematic diagram of a nozzle assembly according to an embodiment of the present invention. [Figure 4] A plan view of the nozzle assembly shown in Figure 3. [Figure 5] A schematic diagram of a nozzle assembly according to another embodiment of the present invention. [Figure 6] A plan view of the nozzle assembly shown in Figure 5. [Figure 7] Figures 5 and 6 show the fluid flow calculation model for the nozzle assembly. [Modes for carrying out the invention]

[0074] A detailed description of preferred embodiments and further configurations not essential to the invention.

[0075] In embodiments of the present invention, the apparatus for liquid processing of semiconductor wafers may have the configuration shown in Figure 1 and described above. This description will not be repeated here for the sake of brevity.

[0076] Naturally, the apparatus according to the present invention may differ from the apparatus shown in Figure 1. For example, the chuck may be a non-rotatable chuck, and / or may have a different shape and / or configuration from the chuck shown in Figure 1.

[0077] The apparatus according to this embodiment differs from the apparatus disclosed in US9,799,539B2, at least in the configuration of the nozzle assembly 3.

[0078] A nozzle assembly 3 according to an embodiment of the present invention is shown in Figure 3.

[0079] As shown in Figure 3, the nozzle assembly 3 comprises an inlet portion 13 and a dispensing nozzle 15 (or outlet portion 15). The inlet portion 13 is connected directly or via one or more additional components (for example, via an intermediate liquid flow passage) to the liquid flow passage of the liquid dispenser arm 4. Thus, liquid can flow through the liquid flow passage of the liquid dispenser arm 4 and into the nozzle assembly 3 via the inlet portion 13.

[0080] Naturally, the entrance portion 13 may have a different shape and / or configuration from the entrance portion shown in Figure 3. For example, the length of the entrance portion 13 may be longer or shorter than the length shown in Figure 3, and / or the inner width and / or outer width of the entrance portion 13 may be greater or smaller than the inner width and / or outer width shown in Figure 3, and / or the internal shape and / or external shape of the entrance portion 13 may differ from the internal shape and / or external shape shown in Figure 3.

[0081] The dispensing nozzle 15 of the nozzle assembly 3 is for dispensing liquid from the nozzle assembly 3 onto the surface of the wafer W. Specifically, the liquid is dispensed directly from the tip 16 of the dispensing nozzle 15.

[0082] Naturally, the dispensing nozzle 15 may have a different shape and / or configuration from the dispensing nozzle shown in Figure 3. For example, the length of the dispensing nozzle 15 may be longer or shorter than the length shown in Figure 3, and / or the inner width and / or outer width of the dispensing nozzle 15 may be greater or smaller than the inner width and / or outer width shown in Figure 3, and / or the internal shape and / or external shape of the dispensing nozzle 15 may differ from the internal shape and / or external shape shown in Figure 3.

[0083] The diameter (or width) of the fluid passage (or fluid flow passage) in the inlet portion 13 of the nozzle assembly 3 is greater than the diameter (or width) of the fluid passage (or fluid flow passage) of the dispensing nozzle 15 of the nozzle assembly 3.

[0084] The static throttle 17 is located between the inlet portion 13 of the nozzle assembly 3 and the dispensing nozzle 15. Specifically, the static throttle 17 connects the inlet portion 13 to the dispensing nozzle 15.

[0085] The static throttle 17 restricts the flow of liquid from the inlet portion 13 to the dispensing nozzle 15.

[0086] Generally, the term static throttle refers to a part, component, or element that regulates the flow of liquid through the nozzle assembly 3 and has no moving parts.

[0087] The static throttle 17 is provided with a plurality of bore holes 19 (or channels 19, or flow passages 19) extending from the inlet portion 13 side of the static throttle 17 to the dispensing nozzle 15 side of the static throttle 17, through which liquid can flow from the inlet portion 13 to the dispensing nozzle 15.

[0088] The static throttle 17 separates the inlet portion 13 of the nozzle assembly 3 from the dispensing nozzle 15 of the nozzle assembly 3 so that the liquid can flow only from the inlet portion 13 to the dispensing nozzle 15 through a plurality of bore holes 19 formed in the static throttle 17.

[0089] Figure 4 shows a plan view of the static throttle 17. As shown in Figure 4, in this embodiment, the static throttle 17 has a pattern of nine boreholes 19. However, a specific number of boreholes 19 is not essential to the present invention, and the static throttle 17 only needs to have a plurality of boreholes 19.

[0090] For example, Figures 5 and 6 show another embodiment of the present invention in which the static throttle 17 has 15 boreholes 19 instead of 9 boreholes 19.

[0091] In Figures 3 and 5, only a few boreholes 19 are shown for clarity.

[0092] Furthermore, the bore holes 19 do not need to be arranged in a specific pattern in the static throttle 17.

[0093] The diameter or width of the fluid flow through the nozzle assembly 3 decreases as soon as it passes through the static throttle 17. Therefore, the static throttle 17 causes necking of the fluid flow through the nozzle assembly 3.

[0094] Specifically, the inlet of the borehole 19 on the inlet portion 13 side of the static throttle 17 extends over a wider area than the outlet of the borehole 19 on the dispensing nozzle 15 side of the static throttle 17.

[0095] In other words, the envelope surface at the entrance of the borehole 19 on the inlet portion 13 side is larger than the envelope surface at the exit of the borehole 19 on the dispensing nozzle 15 side of the static throttle 17.

[0096] For example, for at least some of the boreholes 19, the exit of the borehole 19 is closer to the central axis of the nozzle assembly 3 than the inlet of the borehole 19.

[0097] In the embodiments shown in Figures 3 and 5, the boreholes 19 are substantially (or completely) linear (straight) boreholes 19, and some boreholes 19 are angled with respect to the central axis of the nozzle assembly such that the exit of the borehole 19 is closer to the central axis of the nozzle assembly 3 than the inlet of the borehole 19.

[0098] For example, a substantially (or completely) linear borehole 19 is preferred for ease of processing. However, in other embodiments, the borehole 19 may instead be non-linear (e.g., curved).

[0099] At least some of the boreholes 19 may be parallel to the central axis of the nozzle assembly 3. For example, in the embodiments shown in Figures 3 and 4, the three central boreholes 19 extend parallel to the central axis of the nozzle assembly 3, and the six peripheral boreholes 19 are angled with respect to the central axis of the nozzle assembly 3 such that their exits are closer to the central axis than their inlets.

[0100] Similarly, in the embodiments shown in Figures 5 and 6, the five central boreholes 19 extend parallel to the central axis of the nozzle assembly 3, and the 10 periphery boreholes 19 are angled with respect to the central axis of the nozzle assembly 3 such that their exits are closer to the central axis than their inlets.

[0101] The static throttle 17 may have a recess, a cone, a tapered portion, or a funnel portion on the inlet portion 13 side of the static throttle 17, and the inlet of the borehole 19 may be located at the bottom surface of this portion.

[0102] The nozzle assembly 3 may be machined from a single material block.

[0103] Preferably, at least a portion of the inner surface of the dispensing nozzle 15 of the nozzle assembly 3 is hydrophilic. For example, substantially (or completely) the entire inner surface of the dispensing nozzle 15 may be hydrophilic. Hydrophilicity may mean that the surface contains a material having a water static contact angle of less than 90°. In some embodiments, the material may have a water static contact angle of less than 80° or less than 45°.

[0104] This can be achieved by forming the dispensing nozzle 15 from a hydrophilic material, or by applying a hydrophilic material as a coating to the inner surface of the dispensing nozzle 15.

[0105] The entire inner surface of nozzle assembly 3 may be substantially (or completely) hydrophilic.

[0106] The entire nozzle assembly may be fabricated from a substantially (or entirely) hydrophilic material.

[0107] In one embodiment, the hydrophilic inner surface or material may include polychlorotrifluoroethylene (PCTFE) or perfluoroalkoxyalkane (PFA). For example, the dispensing nozzle 15 of the nozzle assembly 3 or the entire nozzle assembly 3 may be formed of PCTFE or PFA. PCTFE would be preferred because it is more hydrophilic than PFA.

[0108] The nozzle assembly may be fabricated from a single block of hydrophilic material (e.g., a PCTFE block or a PFA block).

[0109] The length of the dispensing nozzle 15 is preferably at least four times the inner diameter of the dispensing nozzle 15 (the diameter of the flow passage through the dispensing nozzle 15) (for example, seven times the inner diameter of the dispensing nozzle 15). For example, in one embodiment, the inner diameter of the dispensing nozzle 15 may be 6 mm and the length of the dispensing nozzle 15 may be 42.5 mm. With this configuration, the flows entering the dispensing nozzle 15 from different boreholes 19 have enough space to fuse and form a well-developed, substantially uniform velocity profile at the tip of the dispensing nozzle.

[0110] The length of the dispensing nozzle 15 is measured from the exit of one of the boreholes 19 to the tip 16 of the dispensing nozzle 15.

[0111] Preferably, at least a portion of the inner surface of the dispensing nozzle 15 has a surface roughness Ra of 0.5 μm or less (for example, 0.4 μm or less, or 0.3 μm or less, or 0.2 μm or less). In one embodiment, the inner surface may have a surface roughness Ra of 0.2 μm. The entire inner surface of the dispensing nozzle 15 may substantially (or completely) have such a surface roughness.

[0112] The entire inner surface of the nozzle assembly 3 may have substantially (or completely) such surface roughness.

[0113] In one embodiment, the bore hole 19 of the static throttle 17 may have a diameter of 1.2 mm. Naturally, in other embodiments, the diameter of the hole may vary (for example, 0.8 mm to 1.6 mm).

[0114] In using the apparatus of the present invention, the wafer W is placed on the spin chuck 1, and the controller 8 signals the motor 7 to rotate the wafer at a selected rpm. The controller 8 then signals the control valve 6 to open the supply source 5 for the processing liquid to the dispenser arm 4.

[0115] The processing liquid flows through the flow path of the dispenser arm 4 and through the inlet portion 13 to the nozzle assembly 3. The processing liquid flows through multiple bore holes 19 and the static throttle 17 to the dispensing nozzle 15. The processing liquid then flows through the dispensing nozzle 15 to the tip 16, where it is dispensed from the dispensing nozzle 15 onto the surface of the wafer W.

[0116] Figure 7 shows a fluid flow calculation model of the liquid flow through the nozzle assembly shown in Figures 5 and 6. In Figure 7, we can see the individual flow passages 21 through each borehole 9, where the width of the fluid flow passage in the nozzle assembly 3 decreases (necking) as soon as it passes through the static throttle 17.

[0117] The results of the computational model of the flow rate distribution of the fluid flow through the nozzle assembly shown in Figures 5 and 6 showed that the reduction in the flow path area through the borehole 19 of the static throttle 17 resulted in a decrease in the fluid velocity immediately upstream of the static throttle and an increase in the fluid velocity through the borehole 19.

[0118] Furthermore, the results of the computational model showed that a dispensing nozzle 15 of a specific length means that the fluid flow velocity profile at the tip 16 of the dispensing nozzle 15 is well developed and substantially uniform.

[0119] At the end of the desired processing of the wafer W with the processing liquid, the controller 8 sends a signal to the control valve 6 to close.

[0120] The inventors have discovered that a particular configuration of the nozzle assembly of the present invention prevents dripping when the supply of the processing fluid is stopped (for example, when moving the dispensing nozzle after performing wafer processing with the processing fluid W). Furthermore, the absence of moving parts in the static throttle 17 prevents or limits the generation or capture of particles.

[0121] While not bound by any particular theory, the use of a static throttle is said to prevent the movement of the static liquid column that forms after the supply of the processing fluid is stopped. This thus avoids the possibility of the meniscus formed at the lower end of the liquid column tilting. This, in turn, prevents the stopped fluid from flowing out of the nozzle tip. However, the specific theory that a particular configuration of the nozzle assembly of the present invention prevents dripping is not an essential part of the present invention.

[0122] In another embodiment, the chuck may not rotate, but instead simply support the wafer in a stationary position.

[0123] The dispensing arm 4 may be movable to controllably position the nozzle assembly 3 above any portion of the wafer W in order to selectively dispense the processing liquid to any portion of the wafer W. The present invention can also be realized in the following embodiments, for example. Application Example 1: An apparatus for processing wafer-shaped articles, A support for supporting the wafer-shaped article, The system comprises a liquid dispenser for dispensing a processing solution onto the surface of the wafer-shaped article supported by the support, The liquid dispenser comprises a nozzle assembly, The nozzle assembly is The entrance area, Dispensing nozzle and An apparatus comprising: a static throttle between the inlet portion and the dispensing nozzle, the static throttle having a plurality of flow paths through which the processing liquid can flow from the inlet portion to the dispensing nozzle. Application example 2: The apparatus of Application Example 1, The apparatus comprises multiple flow channels with multiple bore holes. Application Example 3: Apparatus of Application Example 1 or 2, An apparatus wherein at least a portion of the inner surface of the dispensing nozzle is hydrophilic. Application Example 4: An apparatus according to any one of the application examples 1 to 3, Apparatus wherein at least a portion of the inner surface of the dispensing nozzle contains a material having a water static contact angle of 90° or less, or 80° or less, or 45° or less. Application Example 5: An apparatus according to any one of the application examples 1 to 4, An apparatus wherein at least a portion of the inner surface of the dispensing nozzle contains PCTFE or PFA. Application example 6: An apparatus according to any one of the application examples 1 to 5, The apparatus wherein the length of the dispensing nozzle is at least four times the inner diameter of the dispensing nozzle, or at least five times the inner diameter of the dispensing nozzle, or at least six times the inner diameter of the dispensing nozzle, or at least seven times the inner diameter of the dispensing nozzle. Application example 7: An apparatus according to any one of the application examples 1 to 6, The apparatus wherein the inner diameter of the inlet portion is larger than the inner diameter of the dispensing nozzle. Application Example 8: An apparatus according to any one of Application Examples 1 to 7, The diameter of the fluid flow through the nozzle assembly decreases as soon as it passes through the static throttle. Application example 9: An apparatus according to any one of the application examples 1 to 8, An apparatus wherein, for at least some of the plurality of flow paths, the outlet of the flow path is closer to the central axis of the nozzle assembly than the inlet of the flow path. Application Example 10: An apparatus according to any one of the application examples 1 to 9, The nozzle assembly is processed from a single piece of material using a device. Application Example 11: An apparatus according to any one of the application examples 1 to 10, The apparatus wherein at least a portion of the inner surface of the dispensing nozzle has a surface roughness Ra of 0.5 μm or less, or 0.4 μm or less, or 0.3 μm or less, or 0.2 μm or less. Application Example 12: An apparatus according to any one of the application examples 1 to 11, The apparatus wherein each of the plurality of flow channels has a diameter d in the range of 0.8 mm ≤ d ≤ 1.6 mm. Application Example 13: An apparatus according to any one of Application Examples 1 to 12, further, An apparatus comprising a control valve for turning on and off the supply of processing liquid to the liquid dispenser, the control valve located upstream of the nozzle assembly. Application Example 14: A nozzle assembly for use in a apparatus for processing wafer-shaped articles, The entrance area, Dispensing nozzle and A static throttle between the inlet portion and the dispensing nozzle, comprising a plurality of flow paths through which the processing liquid can flow from the inlet portion to the dispensing nozzle, A nozzle assembly comprising:

Claims

1. An apparatus for processing wafer-shaped articles, A support for supporting the wafer-shaped article, The system comprises a liquid dispenser for dispensing a processing solution onto the surface of the wafer-shaped article supported by the support, The liquid dispenser comprises a nozzle assembly, The nozzle assembly is The entrance area, Dispensing nozzle and A static throttle between the inlet portion and the dispensing nozzle, comprising a static throttle having a plurality of flow paths through which the processing liquid can flow from the inlet portion to the dispensing nozzle, The apparatus wherein the length of the dispensing nozzle is at least four times the inner diameter of the dispensing nozzle, or at least five times the inner diameter of the dispensing nozzle, or at least six times the inner diameter of the dispensing nozzle, or at least seven times the inner diameter of the dispensing nozzle.

2. The apparatus according to claim 1, The apparatus comprises multiple flow channels with multiple bore holes.

3. The apparatus according to claim 1 or 2, An apparatus wherein at least a portion of the inner surface of the dispensing nozzle is hydrophilic.

4. The apparatus according to any one of claims 1 to 3, An apparatus wherein at least a portion of the inner surface of the dispensing nozzle contains a material having a water static contact angle of 90° or less, or 80° or less, or 45° or less.

5. The apparatus according to any one of claims 1 to 4, An apparatus wherein at least a portion of the inner surface of the dispensing nozzle contains PCTFE or PFA.

6. The apparatus according to any one of claims 1 to 5, The apparatus wherein the inner diameter of the inlet portion is larger than the inner diameter of the dispensing nozzle.

7. The apparatus according to any one of claims 1 to 6, A device in which the diameter of the liquid flow passing through the nozzle assembly decreases as it passes through the static throttle.

8. The apparatus according to any one of claims 1 to 7, An apparatus wherein, for at least some of the plurality of flow paths, the outlet of the flow path is closer to the central axis of the nozzle assembly than the inlet of the flow path.

9. The apparatus according to any one of claims 1 to 8, The nozzle assembly is a device that processes from a single piece of material.

10. The apparatus according to any one of claims 1 to 9, The apparatus wherein at least a portion of the inner surface of the dispensing nozzle has a surface roughness Ra of 0.5 μm or less, or 0.4 μm or less, or 0.3 μm or less, or 0.2 μm or less.

11. The apparatus according to any one of claims 1 to 10, The apparatus wherein each of the plurality of flow channels has a diameter d in the range of 0.8 mm ≤ d ≤ 1.6 mm.

12. The apparatus according to any one of claims 1 to 11, further, An apparatus comprising a control valve for turning on and off the supply of processing liquid to the liquid dispenser, the control valve located upstream of the nozzle assembly.

13. A nozzle assembly for use in a apparatus for processing wafer-shaped articles, The entrance area, Dispensing nozzle and A static throttle between the inlet portion and the dispensing nozzle, comprising a plurality of flow paths through which the processing liquid can flow from the inlet portion to the dispensing nozzle, Equipped with, A nozzle assembly in which the length of the dispensing nozzle is at least four times the inner diameter of the dispensing nozzle, or at least five times the inner diameter of the dispensing nozzle, or at least six times the inner diameter of the dispensing nozzle, or at least seven times the inner diameter of the dispensing nozzle.

14. The apparatus according to claim 1, The static throttle further comprises a concave, conical, tapered, or funnel-shaped portion on the inlet side of the static throttle, The opening of the concave, conical, tapered, or funnel-shaped portion faces the inlet portion. The apparatus wherein the inlet of the flow path is located at the bottom surface of the concave, conical, tapered, or funnel-shaped portion.

15. A nozzle assembly according to claim 13, The static throttle further comprises a concave, conical, tapered, or funnel-shaped portion on the inlet side of the static throttle, The opening of the concave, conical, tapered, or funnel-shaped portion faces the inlet portion. A nozzle assembly in which the inlet of the flow path is located at the bottom surface of the concave, conical, tapered, or funnel-shaped portion.

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