Power converter

Abstract

To provide a power conversion device in which a Y capacitor is prevented from becoming too hot.SOLUTION: A power conversion device includes an inverter 11 that converts the power supplied from a battery 2, a smoothing capacitor 20 that smooths a current supplied from the battery, a Y capacitor 30 having Y capacitor elements 31, 32 for reducing noise, and a case 130 that houses the inverter, the smoothing capacitor, and capacitor, the case includes a frame 131 that opens in one direction TD and forms a ring, and a partition wall 136 that divides a storage space 140 surrounded by the frame into two in the one direction, and electrical components 11, 20 having the inverter and the smoothing capacitor are provided in a first storage space 141 surrounded by a part of the frame and the partition wall, and the Y capacitor is provided in a second storage space 142 surrounded by the remainder of the frame and the partition wall, and the electrical components and the Y capacitor are arranged shifted in a planar direction perpendicular to the one direction such that the electrical components and the Y capacitor do not overlap in the one direction.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The disclosure described in this specification relates to a power conversion device.

Background Art

[0002] The power conversion device described in Patent Document 1 includes a switching element, a smoothing capacitor, a Y capacitor for reducing noise generated by the switching element, and a housing for housing these components.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The switching element, the smoothing capacitor, and the Y capacitor are housed in the same space of the housing. Heat from the switching element and the smoothing capacitor is likely to be transferred to the Y capacitor, and there is a risk that the Y capacitor will become hot.

[0005] An object of the present disclosure is to provide a power conversion device in which the Y capacitor is suppressed from becoming hot.

Means for Solving the Problems

[0006] A power conversion device according to an aspect of the present disclosure includes an inverter (11) that converts power supplied from a battery (2), a smoothing capacitor (20) that smooths the current supplied from the battery, a Y capacitor (30) having Y capacitor elements (31, 32) for reducing noise, and a case (130) that houses the inverter, the smoothing capacitor, and the Y capacitor. The case comprises a frame (131) that opens in one direction (TD) to form a ring, and a partition wall (136) that divides the storage space (132) enclosed by the frame into two in one direction. An electrical component (11, 20) having an inverter and a smoothing capacitor is provided in a first storage space (141) surrounded by part of the frame and a partition wall. A Y capacitor is installed in the second storage space (142) surrounded by the remaining frame and partition wall. The electrical components and the Y-capacitor are positioned offset in a plane perpendicular to one direction, so that they do not overlap in one direction.

[0007] According to this, the transfer of heat from the electrical components (11, 20) to the Y capacitor elements (31, 32) is suppressed. This suppresses the Y capacitor elements (31, 32) from becoming overheated.

[0008] The reference numbers in parentheses above merely indicate the correspondence with the configurations described in the embodiments below, and do not in any way limit the technical scope. [Brief explanation of the drawing]

[0009] [Figure 1] This is an electrical circuit diagram of a power converter. [Figure 2] This is a plan view of the power conversion device as seen from the first storage space. [Figure 3] This is a plan view of the power converter as seen from the second storage space. [Figure 4] This is a cross-sectional view along the line IV-IV shown in Figure 3. [Figure 5] This is an exploded perspective view illustrating the placement of the Y capacitor in the second storage space. [Figure 6] This is a perspective view illustrating the placement of the Y capacitor in the second storage space. [Figure 7] This is a perspective view of a Y-capacitor. [Figure 8] This is a cross-sectional view of the Y capacitor along the line VIII-VIII shown in Figure 7. [Figure 9]Figure 7 shows a cross-sectional view of a Y capacitor along the IX-IX line. [Figure 10] This is a cross-sectional view illustrating a modified example of a Y capacitor. [Modes for carrying out the invention]

[0010] The following describes several embodiments for implementing this disclosure with reference to the drawings. In each embodiment, parts corresponding to matters described in a preceding embodiment may be denoted by the same reference numerals, and redundant explanations may be omitted. If only a part of the configuration is described in each embodiment, other embodiments described in a preceding embodiment may be applied to the remaining parts of the configuration.

[0011] Furthermore, not only are combinations of parts explicitly shown as being combinable in each embodiment possible, but it is also possible to partially combine embodiments with each other, embodiments with modified versions, and modified versions with each other, even if not explicitly shown, as long as there are no particular problems with the combination.

[0012] (First Embodiment) <In-vehicle systems> Figure 1 is an electrical circuit diagram of the power converter 10 installed in the in-vehicle system 1. The in-vehicle system 1 is equipped with a high-voltage battery 2, a low-voltage battery 3, a motor generator 4, a control device 5, and the power converter 10. The vehicle on which the in-vehicle system 1 is installed is a hybrid vehicle capable of driving by switching between and / or combining the driving force of the engine and the driving force of the motor generator 4.

[0013] The power conversion device 10 includes a high-voltage wiring 10A, 10B, an inverter 11, a control circuit board 15, a smoothing capacitor 20, a Y capacitor 30, a high-voltage connector 81, and a low-voltage connector 91. The high-voltage wiring 10A is a wiring connected to the positive electrode of the high-voltage battery 2. The high-voltage wiring 10A may be referred to as the P-side high-voltage wiring 10A. The high-voltage wiring 10B is a wiring connected to the negative electrode of the high-voltage battery 2. The high-voltage wiring 10B may be referred to as the N-side high-voltage wiring 10B. Note that the inverter 11 and the smoothing capacitor 20 may be referred to as electrical components. The electrical components include the inverter 11 and the smoothing capacitor 20.

[0014] The inverter 11 is connected to the P-side high-voltage wiring 10A and the N-side high-voltage wiring 10B. The inverter 11 has a plurality of semiconductor modules 12. Each semiconductor module 12 has two switching elements 13 and two diodes 13A. The two switching elements 13 are connected in series between the P-side high-voltage wiring 10A and the N-side high-voltage wiring 10B.

[0015] One collector electrode provided on the P-side of the two switching elements 13 is connected to a P-side input terminal 11A connected to the high-voltage battery 2. One emitter provided on the N-side of the two switching elements 13 is connected to an N-side input terminal 11B connected to the high-voltage battery 2. The anode of the diode 13A is connected to the emitter of the corresponding switching element 13. The cathode of the diode 13A is connected to the collector of the corresponding switching element 13.

[0016] A motor terminal 11C connected to the motor generator 4 is connected to the emitter of the P-side switching element 13 and the collector of the N-side switching element 13. The plurality of switching elements 13 convert the DC power supplied from the high-voltage battery 2 into AC power capable of driving the motor generator 4. The power after power conversion is supplied to the motor generator 4 via the connection bus bar 14.

[0017] The control circuit board 15 controls the on / off state of multiple switching elements 13 using operating power supplied from the low-voltage battery 3. The control circuit board 15 has a control circuit mounted on it that controls the on / off state of multiple switching elements 13. The connection terminals 11D of multiple switching elements 13 are soldered to the control circuit board 15. The connection terminals 11D of multiple switching elements 13 are electrically connected to the control circuit.

[0018] The smoothing capacitor 20 primarily smooths the DC voltage supplied from the high-voltage battery 2. The smoothing capacitor 20 is connected to the P-side high-voltage wiring 10A and the N-side high-voltage wiring 10B. The smoothing capacitor 20 is connected in parallel to the inverter 11. The high-voltage wirings 10A and 10B electrically connect the inverter 11, the smoothing capacitor 20, and the high-voltage battery 2.

[0019] The Y capacitor 30 primarily removes noise components leaking from the inverter 11. The Y capacitor 30 has two Y capacitor elements 31 and 32, two Y capacitor busbars 41 and 42, and a GND busbar 50. The two Y capacitor elements 31 and 32 are connected in series to the P-side high-voltage wiring 10A and the N-side high-voltage wiring 10B via the two Y capacitor busbars 41 and 42.

[0020] Note that one of the two Y-capacitor elements 31 and 32, the one located on the P-side high-voltage wiring 10A side, may be referred to as the P-side Y-capacitor element 31. One of the two Y-capacitor busbars 41 and 42, the one connected to the P-side Y-capacitor element 31, may be referred to as the P-side Y-capacitor busbar 41. The P-side Y-capacitor busbar 41 has a P-side first busbar terminal 41A connected to the P-side Y-capacitor element 31 and a P-side second busbar terminal 41B connected to the P-side high-voltage wiring 10A. The P-side Y-capacitor element 31 is electrically connected to the P-side high-voltage wiring 10A via the P-side Y-capacitor busbar 41.

[0021] Similarly, one of the two Y-capacitor elements 31 and 32, located on the N-side high-voltage wiring 10B, may be referred to as the N-side Y-capacitor element 32. One of the two Y-capacitor busbars 41 and 42, connected to the N-side Y-capacitor element 32, may be referred to as the N-side Y-capacitor busbar 42. The N-side Y-capacitor busbar 42 has an N-side first busbar terminal 42A connected to the N-side Y-capacitor element 32 and an N-side second busbar terminal 42B connected to the N-side high-voltage wiring 10B. The N-side Y-capacitor element 32 is electrically connected to the N-side high-voltage wiring 10B via the N-side Y-capacitor busbar 42.

[0022] The GND busbar 50 has a P-side GND terminal 51 connected to the P-side Y capacitor element 31, an N-side GND terminal 52 connected to the N-side Y capacitor element 32, and a case connection portion 54 connected to the case 130. The GND busbar 50 extends to connect the P-side GND terminal 51, the N-side GND terminal 52, and the case connection portion 54. It can also be said that the GND busbar 50 has the P-side GND terminal 51, the N-side GND terminal 52, and an extension portion 53 connecting the P-side GND terminal 51 and the N-side GND terminal 52. It can also be said that the extension portion 53 has the case connection portion 54.

[0023] The P-side Y capacitor element 31 and the N-side Y capacitor element 32 are electrically and thermally connected via a GND busbar 50. The GND busbar 50 is connected to the Y capacitor elements 31 and 32, and is also electrically and thermally connected to the housing of the power converter 10.

[0024] The GND busbar 50 is electrically connected to the body ground of the chassis, etc., via the case 130. The Y capacitor elements 31 and 32 remove noise components leaking from the inverter 11 by directing them to the body ground via the GND busbar 50. In addition, the Y capacitor elements 31 and 32 can remove not only noise components leaking from the inverter 11 but also noise components flowing through the high-voltage wiring 10A and 10B.

[0025] The high-voltage connector 81 is a power supply port from which high-voltage power is supplied from the high-voltage battery 2. High-voltage wiring 10A and 10B, and Y-capacitor busbars 41 and 42 are electrically connected to the high-voltage connector 81. High-voltage power is supplied from the high-voltage battery 2 to the inverter 11, smoothing capacitor 20, and Y-capacitor 30 via the high-voltage connector 81. In addition to the high-voltage battery 2, a signal wiring 84 that transmits an interlock signal is also connected to the high-voltage connector 81. One end of the signal wiring 84 is connected to the high-voltage connector 81, and the other end is connected to the control circuit board 15. Note that high-voltage wiring 10A and 10B may be referred to as the first wiring. Y-capacitor busbars 41 and 42 may be referred to as the second wiring.

[0026] The low-voltage connector 91 is a supply port where low-voltage power is supplied from the low-voltage battery 3. The control circuit board 15 is electrically connected to the low-voltage connector 91. Low-voltage power is supplied from the low-voltage battery 3 to the control circuit board 15 via the low-voltage connector 91. In addition to the low-voltage battery 3, the control device 5, for example, which acts as a higher-level ECU, is also electrically connected to the low-voltage connector 91. The control circuit mounted on the control circuit board 15 works in cooperation with the control device 5 to control the inverter 11 and auxiliary equipment included in the vehicle.

[0027] <Mechanical configuration of a power converter> Before describing the mechanical configuration of the power converter 10, the drawings will be explained first. Figure 2 is a plan view of the power converter 10 as seen from the first storage space 141 side. Figure 3 is a plan view of the power converter 10 as seen from the second storage space 142 side. Figure 4 is a cross-sectional view along the line IV-IV shown in Figure 3. Figure 5 is an exploded perspective view to illustrate the placement of the Y capacitor 30 in the second storage space 142. Figure 6 is a perspective view to illustrate the placement of the Y capacitor 30 in the second storage space 142. Figure 7 is a perspective view of the Y capacitor 30. Figure 8 is a cross-sectional view of the Y capacitor along the line VIII-VIII shown in Figure 7. Figure 9 is a cross-sectional view of the Y capacitor along the line IX-IX shown in Figure 7.

[0028] In this embodiment, as an example, in Figure 2, of the two high-voltage wires 10A and 10B that overlap the power module 120, one provided on the first opening 131B side is described as the P-side high-voltage wire 10A, and the other provided on the second opening 131C side is described as the N-side high-voltage wire 10B. However, the P-side high-voltage wire 10A and the N-side high-voltage wire 10B are not limited to these. Of the two high-voltage wires 10A and 10B, one provided on the first opening 131B side may be considered as the N-side high-voltage wire 10B, and the other provided on the second opening 131C side may be considered as the P-side high-voltage wire 10A. The configuration described below is merely an example of this embodiment.

[0029] Next, the mechanical configuration of the power converter 10 will be described. In addition to the components described so far, the power converter 10 includes a cooler 110 and a case 130. The power module 120 is composed of multiple semiconductor modules 12 and the cooler 110. The cooler 110 has a stacked cooling structure. The cooler 110 includes a supply pipe 111, a discharge pipe 113, and multiple intermediate pipes 112. The multiple intermediate pipes 112 are arranged in a ladder-like fashion between the supply pipe 111 and the discharge pipe 113. The supply pipe 111 and the discharge pipe 113 are connected via the intermediate pipes 112 in a manner that allows refrigerant to flow through them.

[0030] The semiconductor modules 12 are individually housed between adjacent relay tubes 112. The semiconductor modules 12 are sandwiched between adjacent relay tubes 112. The power module 120 is formed by housing the semiconductor modules 12 in the cooler 110. The heat from the semiconductor modules 12 is efficiently dissipated to the relay tubes 112. The cooler 110 is also fixed to the case 130. The temperature of the cooler 110 is low because a coolant flows inside it. The temperature of the case 130 is also low because it is fixed to the cooler 110.

[0031] <Case> Case 130 forms a container. Case 130 is made of a metal material. For example, Case 130 is made of die-cast aluminum. Case 130 comprises a frame 131 and a partition wall 136. The frame 131 extends in one direction and forms an annular enclosed shape with respect to an axis along that direction. The frame 131 has two ends that are separated in one direction. One end of the frame 131 forms a first opening 131B that opens in one direction. The other end of the frame 131 forms a second opening 131C that opens in the width direction. As an example, the first opening 131B is located lower in the direction of gravity than the second opening 131C.

[0032] The partition wall 136 is installed inside the frame 131 and divides the storage space 140 inside the frame 131 into two. The partition wall 136 has a flat shape with a thin thickness in one direction. The partition wall 136 has a surface 136A and a back surface 136B that are aligned in one direction. Surface 136A is provided on the side of the second opening 131C. Back surface 136B is provided on the side of the first opening 131B.

[0033] One direction is sometimes referred to as the thickness direction TD because it coincides with the thickness direction of the partition wall 136. The depth direction perpendicular to the thickness direction TD is sometimes referred to as the depth direction DP. The width direction perpendicular to the thickness direction TD and the depth direction DP is sometimes referred to as the width direction WD. The direction perpendicular to the thickness direction TD is sometimes referred to as the plane direction. The plane direction is the direction along the width direction WD and the depth direction DP.

[0034] The frame 131 has two walls spaced apart in the width direction WD and two walls spaced apart in the depth direction DP. Specifically, the frame 131 comprises a first wall section 132 and a third wall section 134 spaced apart in the width direction WD, and a second wall section 133 and a fourth wall section 135 spaced apart in the depth direction DP. The first to fourth wall sections 132 to 135 are arranged in a clockwise direction. The first to fourth wall sections 132 to 135 are integrally connected to form the frame 131.

[0035] A partition wall 136 is provided on the inner surface 131A of the frame 131, dividing the storage space 140 in the thickness direction TD. The partition wall 136 divides the storage space 140 into a first storage space 141 and a second storage space 142. The first storage space 141 is divided by the part of the frame 131 on the side of the first opening 131B and the back surface 136B of the partition wall 136. The second storage space 142 is divided by the part of the frame 131 on the side of the second opening 131C and the surface surface 136A of the partition wall 136.

[0036] The partition wall 136 is provided with a through hole 137 for passing the connection terminal 11D extending from the semiconductor module 12, and a wiring hole 138 for passing the signal wiring 84. In addition to passing the signal wiring 84, the wiring hole 138 also serves to pass tools for mechanically connecting the electrical components housed in the first storage space 141 and the electrical components housed in the second storage space 142.

[0037] The through-hole 137 and the wiring hole 138 are holes that penetrate the partition wall 136 in the thickness direction TD. As an example, the through-hole 137 is provided approximately in the center of the width direction WD in the partition wall 136. The wiring hole 138 is provided on the third wall portion 134 side of the through-hole 137.

[0038] A high-voltage connector 81 is also provided on the third wall portion 134. The high-voltage connector 81 has a supply section 82 and a distribution section 83. The supply section 82 is the part to which high-voltage power is supplied from the high-voltage battery 2. The distribution section 83 is the part to which power is distributed to the high-voltage wiring 10A, 10B and the Y capacitor busbars 41, 42. The part of the distribution section 83 connected to the P-side high-voltage wiring 10A and the P-side Y capacitor busbar 41 may be referred to as the P-side distribution section 83A. The part of the distribution section 83 connected to the N-side high-voltage wiring 10B and the N-side Y capacitor busbar 42 may be referred to as the N-side distribution section 83B. The P-side high-voltage wiring 10A, the P-side Y capacitor busbar 41 and the P-side distribution section 83A are electrically and mechanically fastened via the P-side fastening member 100A. The N-side high-voltage wiring 10B, the N-side Y capacitor busbar 42 and the N-side distribution section 83B are electrically and mechanically fastened via the N-side fastening member 100B.

[0039] The supply unit 82 is attached to the third wall 134. The power distribution unit 83 extends in the width direction WD away from the third wall 134 in the first storage space 141. The P-side power distribution unit 83A and the N-side power distribution unit 83B extend in the width direction WD away from the third wall 134 in the first storage space 141. The wiring hole 138 is formed in the partition wall 136 adjacent to the portion of the third wall 134 where the high-voltage connector 81 is provided. The wiring hole 138 further overlaps with the P-side fastening member 100A and the N-side fastening member 100B in the thickness direction TD.

[0040] The first storage space 141 houses high-voltage wiring 10A, 10B, a smoothing capacitor 20, and a power module 120. The connection terminal 11D of the semiconductor module 12 extends from the through-hole 137 to the second storage space 142. The second storage space 142 houses a control circuit board 15 and a Y capacitor 30. The control circuit board 15 is mounted on the partition wall 136 so that a portion of it overlaps with the through-hole 137. The first storage space 141 is sometimes referred to as the high-voltage area because it houses high-voltage components supplied with high-voltage power from the high-voltage battery 2. The second storage space 142 is sometimes referred to as the low-voltage area because it houses low-voltage components supplied with low-voltage power from the low-voltage battery 3.

[0041] The Y capacitor 30 is installed in the second storage space 142 such that the Y capacitor busbars 41 and 42 pass through the wiring hole 138. The Y capacitor 30 is mounted next to the wiring hole 138 in the partition wall 136 such that the Y capacitor busbars 41 and 42 pass through the wiring hole 138. The P-side Y capacitor element 31 and the N-side Y capacitor element 32 are housed in the second storage space 142. The Y capacitor busbars 41 and 42 extend from the second storage space 142 to the first storage space 141 through the wiring hole 138. A fastening hole 139 for fastening the GND busbar 50 is also provided near the wiring hole 138 in the partition wall 136. The Y capacitor elements 31 and 32 are electrically connected to the case 130 by fastening the GND busbar 50 to the fastening hole 139 via a fastening member 100C. The Y capacitor elements 31 and 32 are electrically connected to the body ground of the chassis or the like via the case 130.

[0042] A power module 120 is located approximately in the center of the width direction WD in the first storage space 141. The power module 120 is located on the fourth wall 135 side in the depth direction DP. A smoothing capacitor 20 is located on the first wall 132 side in the width direction WD of the power module 120. The smoothing capacitor 20 is located from the second wall 133 to the fourth wall 135 in the depth direction DP. A high-voltage connector 81 is also provided on the third wall 134. The high-voltage connector 81 is located on the second wall 133 side of the power module 120 in the depth direction DP.

[0043] As described above, a wiring hole 138 is provided adjacent to the location where the high-voltage connector 81 is provided in the third wall portion 134. The Y capacitor 30 is provided in the second storage space 142 so as to cover the wiring hole 138. Hereinafter, the Y capacitor 30 may simply be referred to as being provided in the wiring hole 138. The Y capacitor 30 is mounted next to the wiring hole 138 in the partition wall 136 so that the Y capacitor busbars 41 and 42 pass through the wiring hole 138.

[0044] With respect to the width direction WD, the wiring hole 138 and the Y capacitor 30 are located on the third wall 134 side of the smoothing capacitor 20 and the power module 120. With respect to the thickness direction TD, the Y capacitor 30 does not overlap with the smoothing capacitor 20 and the power module 120. The Y capacitor 30 is offset in the planar direction from the smoothing capacitor 20 and the power module 120.

[0045] The P-side high-voltage wiring 10A includes a P-side capacitor busbar 101A that connects the P-side input terminal 11A of the power module 120 to the smoothing capacitor 20, and a P-side connector busbar 102A that connects the power module 120 to the P-side power distribution section 83A of the high-voltage connector 81. The P-side capacitor busbar 101A extends in the width direction WD between the smoothing capacitor 20 and the power module 120. The P-side capacitor busbar 101A has a flat portion that extends in the width direction WD and connects the P-side input terminal 11A to the smoothing capacitor 20, and a projection that protrudes from the flat portion toward the second wall portion 133.

[0046] The P-side connector busbar 102A extends in the width direction WD between the portion of the P-side capacitor busbar 101A that protrudes toward the second wall portion 133 and the P-side power distribution section 83A. The P-side second busbar terminal 41B, the P-side connector busbar 102A, and the P-side power distribution section 83A are fastened together via the P-side fastening member 100A at a position that overlaps with the wiring hole 138 in the first storage space 141 in the thickness direction TD. The P-side second busbar terminal 41B, the P-side connector busbar 102A, and the P-side power distribution section 83A are electrically and mechanically connected via the P-side fastening member 100A.

[0047] The N-side high-voltage wiring 10B includes an N-side capacitor bus bar 101B that connects the N-side input terminal 11B of the power module 120 and the smoothing capacitor 20, and an N-side connector bus bar 102B that connects the power module 120 and the N-side power distribution part 83B of the high-voltage connector 81. The N-side capacitor bus bar 101B extends in the width direction WD between the smoothing capacitor 20 and the power module 120. The N-side capacitor bus bar 101B has a flat part that extends in the width direction WD and connects the N-side input terminal 11B and the smoothing capacitor 20, and a protruding part that protrudes from the flat part toward the second wall part 133.

[0048] The N-side connector bus bar 102B extends in the width direction WD between the part protruding toward the second wall part 133 in the N-side capacitor bus bar 101B and the N-side power distribution part 83B. At a position overlapping in the thickness direction TD with the wiring hole 138 in the first storage space 141, the N-side second bus bar terminal 42B, the N-side connector bus bar 102B, and the N-side power distribution part 83B are fastened via the N-side fastening member 100B. The N-side second bus bar terminal 42B, the N-side connector bus bar 102B, and the N-side power distribution part 83B are electrically and mechanically connected via the N-side fastening member 100B.

[0049] <Mechanical Structure of Y Capacitor> In addition to the components described so far, the Y capacitor 30 further includes a Y capacitor case 33 and a coating resin 36. The Y capacitor case 33 holds and houses the Y capacitor elements 31, 32, the Y capacitor bus bars 41, 42, and the GND bus bar 50. The Y capacitor case 33 includes two element storage parts 34 that individually house the Y capacitor elements 31, 32, and a connecting part 35 that holds the GND bus bar 50. The element storage part 34 has a bottomed box shape that opens at one end side in the thickness direction TD. The two element storage parts 34 are connected via the connecting part 35. The connecting part 35 has a flat shape that extends in the plane direction.

[0050] The element housing section 34 in which the P-side Y capacitor element 31 is housed is sometimes referred to as the P-type element housing section 34A. The P-type element housing section 34A is provided with the P-side Y capacitor element 31, a portion of the P-side Y capacitor busbar 41, and a portion of the GND busbar 50. The P-type element housing section 34A is filled with a covering resin 36. The P-side Y capacitor element 31, a portion of the P-side Y capacitor busbar 41, and a portion of the GND busbar 50 are covered by the covering resin 36. The P-side first busbar terminal 41A, the P-side second busbar terminal 41B, and the P-side GND terminal 51 are exposed from the exposed surface 36A of the covering resin 36.

[0051] The P-side Y capacitor busbar 41 has a main portion 41C, a P-side first busbar terminal 41A, and a P-side second busbar terminal 41B. The main portion 41C has a portion that extends in a planar direction along the bottom surface of the P-type element housing 34A and a portion that extends in the thickness direction TD. The main portion 41C has two portions that extend in the thickness direction TD. One portion that extends in the thickness direction TD is provided at each end of the width direction WD in the portion that extends in a planar direction along the bottom surface of the P-type element housing 34A.

[0052] A first P-side busbar terminal 41A is provided at one end of the portion extending in the thickness direction TD. A second P-side busbar terminal 41B is provided at the other end of the portion extending in the thickness direction TD. Both the first P-side busbar terminal 41A and the second P-side busbar terminal 41B extend along the planar direction. The P-side Y capacitor busbar 41 has a roughly U-shape when viewed from the depth direction DP. The recessed side of the U-shape is covered with a covering resin 36 and fixed to the inner surface of the P-type element housing 34A.

[0053] The covering resin 36 covers a portion of the P-type element housing 34A in a planar direction along the bottom surface, and a portion of the portion extending in two thickness directions TD. The remaining portion of the covering resin 36 extending in two thickness directions TD, as well as the P-side first busbar terminal 41A and the P-side second busbar terminal 41B, are exposed from the exposed surface 36A of the covering resin 36.

[0054] The P-side Y capacitor element 31 has a P-side first element terminal 31A connected to the P-side first busbar terminal 41A and a P-side second element terminal 31B connected to the P-side GND terminal 51. The P-side first element terminal 31A and the P-side second element terminal 31B extend in the thickness direction TD so as to move away from the P-side Y capacitor element 31. The tips of the P-side first element terminal 31A and the P-side second element terminal 31B are exposed from the exposed surface 36A.

[0055] The first P-side element terminal 31A and the first P-side busbar terminal 41A, both exposed from the exposed surface 36A, are connected via solder 102. The second P-side element terminal 31B and the P-side GND terminal 51, both exposed from the exposed surface 36A, are connected via solder 102. The P-side GND terminal 51 is located on the first open end side of the exposed surface 36A. It can also be said that the first P-side busbar terminal 41A is located on the first storage space 141 side of the exposed surface 36A. It can also be said that the P-side GND terminal 51 is located on the first storage space 141 side of the exposed surface 36A.

[0056] The P-side Y capacitor busbar 41 is soldered to the P-side first busbar terminal 41A outside the covering resin 36. The P-side Y capacitor busbar 41 is routed so that it is covered by the covering resin 36 as it extends from the connection point with the P-side first busbar terminal 41A toward the connection point with the P-side high-voltage wiring 10A.

[0057] The element housing section 34 in which the N-side Y capacitor element 32 is housed is sometimes referred to as the N-type element housing section 34B. The N-type element housing section 34B is provided with the N-side Y capacitor element 32, a portion of the N-side Y capacitor busbar 42, and a portion of the GND busbar 50. The N-type element housing section 34B is filled with a covering resin 36. The N-side Y capacitor element 32, a portion of the N-side Y capacitor busbar 42, and a portion of the GND busbar 50 are covered by the covering resin 36. The N-side first busbar terminal 42A, the N-side second busbar terminal 42B, and the N-side GND terminal 52 are exposed from the exposed surface 36A of the covering resin 36.

[0058] The N-side Y capacitor busbar 42 has a main portion 42C, an N-side first busbar terminal 42A, and an N-side second busbar terminal 42B. The main portion 42C has a portion that extends in a planar direction along the bottom surface of the N-type element housing 34B and a portion that extends in the thickness direction TD. The N-side Y capacitor busbar 42 has two portions that extend in the thickness direction TD. One portion that extends in the thickness direction TD is provided at the end in the width direction WD and one at the end in the depth direction DP of the portion that extends in a planar direction along the bottom surface of the N-type element housing 34B.

[0059] The first N-side busbar terminal 42A is provided at the tip of the portion extending from the end in the width direction WD to the thickness direction TD. The second N-side busbar terminal 42B is provided at the tip of the portion extending from the end in the depth direction DP to the thickness direction TD. Both the first N-side busbar terminal 42A and the second N-side busbar terminal 42B extend along the plane direction.

[0060] The covering resin 36 covers a portion that extends in the planar direction along the bottom surface of the N-type element housing 34B, a portion that extends from the end in the width direction WD to the thickness direction TD, and a portion of the portion that extends from the end in the depth direction DP to the thickness direction TD. The remaining portion of the covering resin 36 that extends from the end in the width direction WD to the thickness direction TD and the portion that extends from the end in the depth direction DP to the thickness direction TD, as well as the N-side first busbar terminal 42A and the N-side second busbar terminal 42B, are exposed from the exposed surface 36A of the covering resin 36.

[0061] The N-side Y capacitor element 32 has an N-side first element terminal 32A connected to the N-side first busbar terminal 42A and an N-side second element terminal 32B connected to the N-side GND terminal 52. The N-side first element terminal 32A and the N-side second element terminal 32B extend in the thickness direction TD so as to move away from the N-side Y capacitor element 32. The tips of the N-side first element terminal 32A and the N-side second element terminal 32B are exposed from the exposed surface 36A.

[0062] The N-side first element terminal 32A and the N-side first busbar terminal 42A, both exposed from the exposed surface 36A, are connected via solder 102. The N-side second element terminal 32B and the N-side GND terminal 52, both exposed from the exposed surface 36A, are connected via solder 102. The N-side GND terminal 52 is located on the first open end side of the exposed surface 36A. It can also be said that the N-side first busbar terminal 42A is located on the first storage space 141 side of the exposed surface 36A. It can also be said that the N-side GND terminal 52 is located on the first storage space 141 side of the exposed surface 36A.

[0063] The N-side Y capacitor busbar 42 is soldered to the N-side first busbar terminal 42A outside the covering resin 36. The N-side Y capacitor busbar 42 is routed so that it is covered by the covering resin 36 as it extends from the connection point with the N-side first busbar terminal 42A toward the connection point with the N-side high-voltage wiring 10B.

[0064] The Y capacitor 30 is provided above the wiring hole 138 such that its exposed surface 36A faces the first open end. The Y capacitor 30 is provided above the wiring hole 138 such that its exposed surface 36A faces the surface 136A or the first storage space 141. As described above, a portion of the P-side Y capacitor busbar 41 and a portion of the N-side Y capacitor busbar 42 are exposed from the exposed surface 36A.

[0065] The P-side Y capacitor busbar 41 and the N-side Y capacitor busbar 42, both exposed from the exposed surface 36A, extend through the wiring hole 138 from the second storage space 142 to the first storage space 141. In the first storage space 141, the P-side second busbar terminal 41B, the P-side fastening member 100A, and the P-side power distribution section 83A are fastened together via the P-side fastening member 100A. In the first storage space 141, the N-side second busbar terminal 42B, the N-side high-voltage wiring 10B, and the N-side power distribution section 83B are fastened together via the N-side fastening member 100B.

[0066] <Yコンデンサケース> The specific configuration of the Y capacitor case 33 is described below. As described above, the Y capacitor case 33 has two element housing sections 34 and a connecting section 35. The connecting section 35 is provided with a first through-hole 35A that penetrates in the thickness direction TD. The Y capacitor 30 is installed so as to cover the wiring hole 138 such that the first through-hole 35A and the fastening hole 139 overlap in the thickness direction TD.

[0067] The opening of the P-type element housing section 34A has a roughly L-shape, extending in the width direction WD and the depth direction DP when viewed from the thickness direction TD plane. One end of the L-shape is adjacent to the first through hole 35A. Part of the L-shape of the P-type element housing section 34A extends in the width direction WD, and the remaining part of the L-shape extends in the depth direction DP. The P-side Y capacitor element 31 is housed in the portion of the P-type element housing section 34A that extends in the depth direction DP.

[0068] The P-side Y capacitor element 31 is housed in a portion of the P-type element housing 34A that extends in the depth direction DP, such that the P-side first element terminal 31A and the P-side second element terminal 31B are aligned in the depth direction DP. The P-side first element terminal 31A is further away from the fastening hole 139 than the P-side second element terminal 31B. The portion of the P-side Y capacitor busbar 41 where the P-side second busbar terminal 41B is provided extends along the wall surface furthest from the P-side first element terminal 31A in the portion of the P-type element housing 34A that extends in the width direction WD.

[0069] The opening of the N-type element housing section 34B is approximately rectangular in shape, extending in the width direction WD when viewed from the thickness direction TD. One end of the rectangle in the width direction WD is adjacent to the first through hole 35A. The N-side Y capacitor element 32 is housed in the N-type element housing section 34B such that the N-side first element terminal 32A and the N-side second element terminal 32B are aligned in the width direction WD. The N-side first element terminal 32A is further away from the fastening hole 139 than the N-side second element terminal 32B. The portion of the N-side Y capacitor busbar 42 where the N-side second busbar terminal 42B is provided extends along the wall surface of the N-type element housing section 34B, which is aligned in the depth direction DP with the N-side first element terminal 32A.

[0070] A connecting portion 35 is provided to connect the wall portion located on the inside in the planar direction in the P-type element housing portion 34A and the wall portion located on the inside in the planar direction in the N-type element housing portion 34B. A first through hole 35A is provided at the corner where the two wall portions of the connecting portion 35 meet.

[0071] <GNDバスバー> As described above, the GND busbar 50 has a P-side GND terminal 51, an N-side GND terminal 52, and an extension 53 connecting the P-side GND terminal 51 and the N-side GND terminal 52. The extension 53 has an overlapping portion 55 that overlaps with the connecting portion 35, a first connecting portion 56 that connects the overlapping portion 55 and the P-side GND terminal 51, and a second connecting portion 57 that connects the overlapping portion 55 and the N-side GND terminal 52. The overlapping portion 55 has a case connection portion 54. The overlapping portion 55 extends along the connecting portion 35. The GND busbar 50 is arranged so as to be covered by the covering resin 36 while extending from the connection portion of the P-side GND terminal 51 and the N-side GND terminal 52 toward the case connection portion 54.

[0072] The overlapping portion 55 extends along the planar direction so as to connect the first connecting portion 56 and the second connecting portion 57. The cross-sectional area of ​​the overlapping portion 55 cut at a cross section perpendicular to the extension direction connecting the first connecting portion 56 and the second connecting portion 57 is larger than the cross-sectional area of ​​the P-side GND terminal 51 and the N-side GND terminal 52 cut at a cross section perpendicular to the extension direction. The extension direction of the overlapping portion 55 so as to connect the first connecting portion 56 and the second connecting portion 57 corresponds to the longitudinal direction of the overlapping portion 55. The extension direction of the P-side GND terminal 51 and the N-side GND terminal 52 corresponds to the longitudinal direction of the P-side GND terminal 51 and the N-side GND terminal 52.

[0073] The overlapping portion 55 is provided in the case 130. The overlapping portion 55 has a case connection portion 54 that is connected to the case 130. The case connection portion 54 has a second through hole 54A that penetrates in the thickness direction TD. The second through hole 54A overlaps the first through hole 35A and the fastening hole 139. A fastening member 100C is passed through the first through hole 35A, the fastening hole 139 and the second through hole 54A. The GND busbar 50 is electrically connected to the case 130 via the fastening member 100C. The P-side second element terminal 31B of the P-side Y capacitor element 31 is located closer to the case connection portion 54 than the P-side first element terminal 31A. The N-side second element terminal 32B of the N-side Y capacitor element 32 is located closer to the case connection portion 54 than the N-side first element terminal 32A.

[0074] The first connecting portion 56 has a portion that extends in a planar direction along the bottom surface of the P-type element housing 34A and a portion that extends in the thickness direction TD. The first connecting portion 56 has two portions that extend in the thickness direction TD. One portion that extends in the thickness direction TD is provided at each end of the depth direction DP of the portion that extends in a planar direction along the bottom surface of the P-type element housing 34A. A P-side GND terminal 51 is provided at one end of the portion that extends in the thickness direction TD. An overlapping portion 55 is provided at the other end of the portion that extends in the thickness direction TD.

[0075] The P-side GND terminal 51 and the overlapping portion 55 both extend along the planar direction. The first connecting portion 56 has a roughly U-shape when viewed from the width direction WD. The recessed portion of the U-shape is covered with a covering resin 36 and fixed to the inner surface of the P-type element housing portion 34A. The portion of the first connecting portion 56 covered with the covering resin 36 faces the P-side Y capacitor element 31 in the depth direction DP. Heat from the P-side Y capacitor element 31 is easily transferred to the first connecting portion 56 via the covering resin 36.

[0076] The second connecting portion 57 is the same as the first connecting portion 56. The second connecting portion 57 has a portion that extends in a planar direction along the bottom surface of the N-type element housing portion 34B and a portion that extends in the thickness direction TD. The second connecting portion 57 has two portions that extend in the thickness direction TD. One portion that extends in the thickness direction TD is provided at each end of the width direction WD of the portion that extends in a planar direction along the bottom surface of the N-type element housing portion 34B. An N-side GND terminal 52 is provided at one end of the portion that extends in the thickness direction TD. An overlapping portion 55 is provided at the other end of the portion that extends in the thickness direction TD.

[0077] The N-side GND terminal 52 and the overlapping portion 55 both extend along the planar direction. The portion of the second connecting portion 57 housed in the N-type element housing portion 34B has a roughly U-shape when viewed from the depth direction DP plane. The recessed side of the U-shape is covered with a covering resin 36 and fixed to the inner surface of the N-type element housing portion 34B. The portion of the second connecting portion 57 covered with the covering resin 36 faces the N-side Y capacitor element 32 in the depth direction DP. Heat from the N-side Y capacitor element 32 is easily transferred to the second connecting portion 57 via the covering resin 36.

[0078] <Effects and Effects> In recent years, with the increase in switching speed in inverters and the tightening of EMC standards, the FM band, which was not previously a problem, has become an issue, and noise reduction in this FM band is required. Therefore, it is necessary to install Y capacitors in power converters to remove noise in the FM band. Generally, capacitors are required to be used below their heat rating, taking into account self-heating and heat dissipation. Y capacitors are also required to be used below their heat rating. Among the components installed in power converters, Y capacitors have the lowest heat rating. For this reason, it was necessary to devise ways to arrange and install Y capacitors within the power converter.

[0079] The power converter 10 includes a power module 120, a smoothing capacitor 20, a Y capacitor 30, and a case 130 that houses them. The case 130 comprises a frame 131 and a partition wall 136. The frame 131 extends in one direction and forms an annular enclosed shape with an axis along that direction as its center. The partition wall 136 is provided inside the frame 131 and divides the storage space 140 inside the frame 131 into two. The partition wall 136 divides the storage space 140 into a first storage space 141 and a second storage space 142. The smoothing capacitor 20 and the power module 120 are housed in the first storage space 141. The Y capacitor 30 is housed in the second storage space 142. The Y capacitor 30 does not overlap with the smoothing capacitor 20 and the power module 120 with respect to the thickness direction TD. The Y capacitor 30 is positioned offset in the planar direction from the smoothing capacitor 20 and the power module 120. This arrangement makes it easier to suppress the transfer of radiant heat from the power module 120 and the smoothing capacitor 20 to the Y capacitor 30.

[0080] The power converter 10 has high-voltage wiring 10A and 10B. The high-voltage wiring 10A and 10B electrically connect the inverter 11, the smoothing capacitor 20, and the high-voltage battery 2. The Y capacitor 30 has Y capacitor elements 31 and 32, as well as Y capacitor busbars 41 and 42 that connect the Y capacitor elements 31 and 32 to the high-voltage wiring 10A and 10B. A wiring hole 138 is provided in the partition wall 136 that penetrates in the thickness direction TD. The Y capacitor 30 is installed in the second storage space 142 such that the Y capacitor busbars 41 and 42 pass through the wiring hole 138. At a position in the first storage space 141 that overlaps with the wiring hole 138 in the thickness direction TD, the high-voltage wiring 10A and 10B and the Y capacitor busbars 41 and 42 are electrically and mechanically connected via fastening members 100A and 100B.

[0081] According to this, during manufacturing, a tool can be passed through the wiring hole 138 to fasten the Y capacitor busbars 41 and 42 and the high-voltage wiring 10A and 10B via the fastening member 100A. Furthermore, by making this wiring hole 138 the same as the hole through which the Y capacitor busbar 41 passes, it becomes unnecessary to form a separate hole in the partition wall 136 for passing the Y capacitor busbar 41. This makes it easier to suppress the transfer of radiant heat from the power module 120 and the smoothing capacitor 20 to the second storage space. It also makes it easier to suppress the rise in temperature of the Y capacitor 30.

[0082] The power converter 10 has a high-voltage connector 81 that electrically connects the high-voltage battery 2, high-voltage wiring 10A, 10B, and Y capacitor busbars 41, 42. The high-voltage connector 81 has a supply unit 82 that receives high-voltage power from the high-voltage battery 2, and a distribution unit 83 that connects to the high-voltage wiring 10A, 10B and the Y capacitor busbars 41, 42. The supply unit 82 is attached to the third wall 134 of the frame 131. The wiring hole 138 is formed in the partition wall 136 so as to be adjacent to the portion of the third wall 134 where the high-voltage connector 81 is provided.

[0083] The Y capacitor 30 is provided in the second storage space 142 so as to cover the wiring hole 138. This makes it easier for noise attempting to enter the case 130 from the outside to the inside to be reduced by the Y capacitor elements 31 and 32 before it reaches the electrical components housed inside. Also, because noise generated by switching is easily reduced by the Y capacitor elements 31 and 32, it is easier to suppress noise from jumping out from the inside to the outside. This makes it easier to suppress the propagation of noise to external equipment.

[0084] The Y capacitor 30 further comprises a GND busbar 50, a Y capacitor case 33, and a covering resin 36. The GND busbar 50 electrically connects the Y capacitor elements 31 and 32 to ground. The Y capacitor case 33 has an element housing section 34 that houses the Y capacitor elements 31 and 32 and a portion of the Y capacitor busbars 41 and 42. The covering resin 36 is provided in the element housing section 34. The covering resin 36 covers the Y capacitor elements 31 and 32 and a portion of the Y capacitor busbars 41 and 42.

[0085] The Y capacitor 30 is provided in the second storage space 142 such that its exposed surface 36A faces the first storage space 141. The GND terminals 51 and 52, which are the connection points between the GND bus bar 50 and the Y capacitor elements 31 and 32, are located on the first storage space 141 side with respect to the thickness TD compared to the Y capacitor elements 31 and 32. This makes it easier for radiant heat from the power module 120 and the smoothing capacitor 20 to be transferred to the case 130 via the GND bus bar 50. It also makes it easier to suppress the transfer of radiant heat from the power module 120 and the smoothing capacitor 20 to the Y capacitor elements 31 and 32.

[0086] The Y capacitor 30 has two Y capacitor elements 31 and 32, and two Y capacitor busbars 41 and 42. The Y capacitor case 33 has two element housing sections 34. One element housing section 34A houses the Y capacitor element 31 and a portion of the Y capacitor busbar 41. The other element housing section 34B houses the Y capacitor element 32 and a portion of the Y capacitor busbar 42. In addition to the two element housing sections 34A and 34B, the Y capacitor case 33 has a connecting section 35 that connects the two element housing sections 34A and 34B. An extension section 53 extending from the GND terminals 51 and 52 of the GND busbar 50 extends along the connecting section 35. The GND busbar 50 and the case 130 are electrically and thermally connected at the extension section 53.

[0087] Because the P-side Y capacitor element 31 and the N-side Y capacitor element 32 are housed in their respective element housing sections 34, thermal interference between the P-side Y capacitor element 31 and the N-side Y capacitor element 32 is suppressed. Furthermore, because the GND busbar 50 and the case 130 are electrically and thermally connected in the extension section 53, thermal interference between the P-side Y capacitor element 31 and the N-side Y capacitor element 32 is effectively suppressed.

[0088] The P-side Y capacitor element 31 has a P-side first element terminal 31A connected to the P-side first busbar terminal 41A and a P-side second element terminal 31B connected to the P-side GND terminal 51. The N-side Y capacitor element 32 has an N-side first element terminal 32A connected to the N-side first busbar terminal 42A and an N-side second element terminal 32B connected to the N-side GND terminal 52. The P-side second element terminal 31B of the P-side Y capacitor element 31 is located closer to the case connection portion 54 than the P-side first element terminal 31A. The N-side second element terminal 32B of the N-side Y capacitor element 32 is located closer to the case connection portion 54 than the N-side first element terminal 32A. This arrangement allows heat from the P-side Y capacitor element 31 and the N-side Y capacitor element 32 to be efficiently dissipated to the GND busbar 50.

[0089] Furthermore, the cross-sectional area of ​​the overlapping portion 55 cut perpendicular to its own longitudinal direction is larger than the cross-sectional area of ​​the P-side GND terminal 51 and the N-side GND terminal 52 cut perpendicular to their own longitudinal direction. As a result, the area of ​​the case 130 that can dissipate heat in the overlapping portion 55 is increased. This improves the heat dissipation of the P-side GND terminal 51 and the N-side GND terminal 52. The temperature rise of the P-side GND terminal 51 and the N-side GND terminal 52 can be suppressed.

[0090] The P-side Y capacitor busbar 41 is soldered to the P-side first busbar terminal 41A outside the covering resin 36. The P-side Y capacitor busbar 41 is routed so that it is covered by the covering resin 36 as it extends from the connection point with the P-side first busbar terminal 41A towards the connection point with the P-side high-voltage wiring 10A. The N-side Y capacitor busbar 42 is soldered to the N-side first busbar terminal 42A outside the covering resin 36. The N-side Y capacitor busbar 42 is routed so that it is covered by the covering resin 36 as it extends from the connection point with the N-side first busbar terminal 42A towards the connection point with the N-side high-voltage wiring 10B.

[0091] The GND busbar 50 is soldered to the P-side GND terminal 51 and the N-side GND terminal 52 outside the covering resin 36. It is routed so that it is covered by the covering resin 36 while extending from the connection point of the P-side GND terminal 51 and the N-side GND terminal 52 toward the case connection part 54.

[0092] According to this, even if vibration is transmitted from the second busbar terminals 41B and 42B to the Y capacitor busbars 41 and 42, the transmission of vibration to the connection point with the Y capacitor elements 31 and 32 is suppressed because a portion of it is covered by the covering material. Stress on the solder 102 connecting the Y capacitor elements 31 and 32 to the Y capacitor busbars 41 and 42 is suppressed. Similarly, even if vibration is transmitted from the case connection part 54 to the GND busbar 50, the transmission of vibration to the connection point with the Y capacitor elements 31 and 32 is suppressed because a portion of it is covered by the covering material. Stress on the solder 102 connecting the Y capacitor elements 31 and 32 to the GND busbar 50 is suppressed.

[0093] The GND busbar 50 has a P-side GND terminal 51, an N-side GND terminal 52, and an extension 53 connecting the P-side GND terminal 51 and the N-side GND terminal 52. The extension 53 has an overlapping portion 55 that overlaps with the connecting portion 35, a first connecting portion 56 that connects the overlapping portion 55 and the P-side GND terminal 51, and a second connecting portion 57 that connects the overlapping portion 55 and the N-side GND terminal 52. The portion of the first connecting portion 56 covered with the covering resin 36 faces the P-side Y capacitor element 31 in the depth direction DP. The portion of the second connecting portion 57 covered with the covering resin 36 faces the N-side Y capacitor element 32 in the depth direction DP. This makes it easier for heat from the Y capacitor elements 31 and 32 to be transferred to the GND busbar 50.

[0094] (Second Embodiment) Figure 10 is a cross-sectional view illustrating a modified example of the Y capacitor 30. In the second embodiment, the element housings 34A and 34B are provided with walls 37 rising from the bottom. The wall 37 provided in element housing 34A is located between the portion of the P-side Y capacitor busbar 41 covered by the coating resin 36 and the P-side Y capacitor element 31. The wall 37 suppresses heat transfer between the portion of the P-side Y capacitor busbar 41 covered by the coating resin 36 and the P-side Y capacitor element 31. Although not shown in the drawing, the wall 37 provided in element housing 34B is located between the portion of the N-side Y capacitor busbar 42 covered by the coating resin 36 and the N-side Y capacitor element 32. The wall 37 suppresses heat transfer between the portion of the N-side Y capacitor busbar 42 covered by the coating resin 36 and the N-side Y capacitor element 32. Since the wall 37 is interposed between the Y capacitor busbars 41 and 42 and the capacitor elements 31 and 32, it is sometimes referred to as an intervening wall 37. The intervening wall 37 suppresses heat transfer from the Y capacitor busbar 42 to the Y capacitor elements 31 and 32.

[0095] This disclosure is described in accordance with the embodiments, but it is understood that this disclosure is not limited to such embodiments or structures. This disclosure also includes various modifications and variations within the equivalence. In addition, while various combinations and forms are shown in this disclosure, other combinations and forms that include one, more, or fewer of those elements also fall within the scope and concept of this disclosure.

[0096] (Disclosure of technical ideas) This specification discloses several technical concepts, as listed in the following paragraphs. Some paragraphs are written in a multiple dependent form, where subsequent paragraphs optionally refer to preceding paragraphs. Some paragraphs are written in a multiple dependent form, referring to other multiple dependent forms. These paragraphs written in multiple dependent forms define several technical concepts.

[0097] (Technical thought 1) An inverter (11) that converts the power supplied from the battery (2), A smoothing capacitor (20) that smooths the current supplied from the battery, A Y capacitor (30) having Y capacitor elements (31, 32) for reducing noise, The inverter, the smoothing capacitor, and the case (130) housing the Y capacitor are included. The case comprises a frame (131) that opens in one direction (TD) and forms a ring, and a partition wall (136) that divides the storage space (132) surrounded by the frame into two in the aforementioned one direction. An electrical component (11, 20) having the inverter and the smoothing capacitor is provided in a first storage space (141) surrounded by a part of the frame and the partition wall. The Y capacitor is provided in the second storage space (142) surrounded by the remainder of the frame and the partition wall. A power conversion device in which the electrical component and the Y capacitor are arranged offset in a plane direction perpendicular to the aforementioned direction, such that the electrical component and the Y capacitor do not overlap in the aforementioned one direction.

[0098] (Technical thought 2) The inverter, the smoothing capacitor, and the first wiring (10A, 10B) electrically connected to the battery are further comprising: The Y capacitor further comprises second wirings (41, 42) connected to the first wiring, A hole (138) penetrating in one direction is formed in the partition wall. The second wiring is passed through the hole. The power conversion device according to technical concept 1, wherein the connection point between the first wiring and the second wiring is provided at a position that overlaps with the hole in the first storage space.

[0099] (Technical Thought 3) The first wiring, the second wiring, and a connector (81) for electrically connecting the battery are further provided. The connector comprises a power supply unit (82) to which power is supplied from the battery, and a power distribution unit (83) that is connected to the first wiring and the second wiring on the first storage space side. The supply unit is provided in the frame, The hole is formed in the partition wall adjacent to the portion of the frame where the supply unit is provided. The power conversion device according to technical concept 2, wherein the Y capacitor is provided in the second storage space so as to cover the aforementioned hole.

[0100] (Technical Thought 4) The aforementioned Y capacitor is A GND busbar (50) connects the Y capacitor element to ground via the case, A Y capacitor case (33) having housing sections (34A, 34B) for housing the Y capacitor element and a portion of the second wiring, The storage section further comprises a covering resin (36) that covers the Y capacitor element and a portion of the second wiring, The Y capacitor is provided in the second storage space such that the exposed surface (36A) of the covering resin faces the first storage space. The power conversion device according to technical concept 2 or 3, wherein the connection terminals (51, 52) connected to the Y capacitor element in the GND busbar are located on the first storage space side with respect to the Y capacitor element in one direction.

[0101] (Technical Thought 5) The system comprises two of the aforementioned Y capacitor elements, two of the second wiring, and two of the aforementioned storage compartments. Each of the aforementioned storage compartments is provided with one Y capacitor element and one second wiring, The Y capacitor case further comprises a connecting portion (35) that connects the two storage portions, A portion of the extension (53) of the GND busbar that extends from the connection terminal extends along the connecting portion, The power conversion device according to technical concept 4, wherein the extension portion is provided with a case connection portion (54) connected to the case.

[0102] (Technical Thought 6) Each of the two Y-capacitor elements comprises a first element terminal (31A, 32A) connected to the second wiring and a second element terminal (31B, 32B) connected to the GND busbar. The power conversion device according to technical concept 5, wherein the second element terminal is provided closer to the case connection portion than the first element terminal.

[0103] (Technical Thought 7) A power conversion device according to technical idea 5 or 6, wherein the cross-sectional area of ​​the extension perpendicular to its own longitudinal direction is greater than the cross-sectional area of ​​the connection terminal perpendicular to its own longitudinal direction.

[0104] (Technical Thought 8) The second wiring is soldered to the first element terminal outside the covering resin. The GND busbar is soldered to the second element terminal outside the covering resin. The second wiring is routed inside the covering resin while extending from the connection point with the first element terminal toward the connection point with the first wiring. The power conversion device according to technical concept 6 or 7, wherein the GND busbar is routed inside the covering resin while extending from the connection portion with the second element terminal toward the case connection portion.

[0105] (Technical Thought 9) The power conversion device according to technical concept 8, wherein the portion of the GND busbar covered with the covering resin faces the Y capacitor element.

[0106] (Technical Thought 10) The power conversion device according to technical concept 9, wherein the storage section has an intervening wall (37) between the Y capacitor element and the portion of the second wiring covered with the covering resin to suppress heat transfer between them. [Explanation of Symbols]

[0107] 10A, 10B First wiring, 11 Inverter, 11 Electrical components, 130 Case, 131 Frame, 132 Storage space, 136 Partition wall, 138 Hole, 141 First storage space, 142 Second storage space, 2 Battery, 20 Smoothing capacitor, 20 Electrical components, 30 Y capacitor, 31 Y capacitor element, 31A First element terminal, 31B Second element terminal, 32 Y capacitor element, 32A First element terminal, 32B Second element terminal, 33 Y capacitor case, 34A, 34B Storage section, 35 Connecting section, 36 Covering resin, 36A Exposed surface, 37 Intervening wall, 41, 42 Second wiring, 50 GND busbar, 51, 52 Connection terminals, 53 Extension section, 54 Case connection section, 81 Connector, 82 Supply section, 83 Distribution section, TD unidirectional

Claims

1. An inverter (11) that converts the power supplied from the battery (2), A smoothing capacitor (20) that smooths the current supplied from the battery, A Y capacitor (30) having Y capacitor elements (31, 32) for reducing noise, The inverter, the smoothing capacitor, and the case (130) housing the Y capacitor are included. The case comprises a frame (131) that opens in one direction (TD) and forms a ring, and a partition wall (136) that divides the storage space (132) surrounded by the frame into two in the same direction. An electrical component (11, 20) having the inverter and the smoothing capacitor is provided in a first storage space (141) surrounded by a part of the frame and the partition wall. The Y capacitor is provided in the second storage space (142) surrounded by the remainder of the frame and the partition wall. A power conversion device in which the electrical component and the Y capacitor are arranged offset in a plane direction perpendicular to the aforementioned direction, such that the electrical component and the Y capacitor do not overlap in the aforementioned one direction.

2. The inverter, the smoothing capacitor, and the battery are further comprising first wiring (10A, 10B) electrically connected to the battery. The Y capacitor further comprises second wirings (41, 42) connected to the first wiring, A hole (138) penetrating in one direction is formed in the partition wall. The second wiring is passed through the hole. The power conversion device according to claim 1, wherein the connection point between the first wiring and the second wiring is provided at a position that overlaps with the hole in the first storage space.

3. The first wiring, the second wiring, and a connector (81) for electrically connecting the battery are further provided. The connector comprises a power supply unit (82) to which power is supplied from the battery, and a power distribution unit (83) that is connected to the first wiring and the second wiring on the first storage space side. The supply unit is provided in the frame, The hole is formed in the partition wall adjacent to the portion of the frame where the supply unit is provided. The power conversion device according to claim 2, wherein the Y capacitor is provided in the second storage space so as to cover the hole.

4. The aforementioned Y capacitor is A GND busbar (50) connects the Y capacitor element to ground via the case, A Y capacitor case (33) having storage sections (34A, 34B) for housing the Y capacitor element and a portion of the second wiring, The storage section further comprises a covering resin (36) that covers the Y capacitor element and a portion of the second wiring, The Y capacitor is provided in the second storage space such that the exposed surface (36A) of the coating resin faces the first storage space. The power conversion device according to claim 3, wherein the connection terminals (51, 52) connected to the Y capacitor element in the GND busbar are provided on the first storage space side with respect to the Y capacitor element in one direction.

5. The system comprises two of the aforementioned Y capacitor elements, two of the second wiring, and two of the aforementioned storage compartments. Each of the aforementioned storage compartments is provided with one Y capacitor element and one second wiring, The Y capacitor case further includes a connecting portion (35) that connects the two storage portions, A portion of the extension (53) of the GND busbar that extends from the connection terminal extends along the connecting portion, The power conversion device according to claim 4, wherein the extension portion is provided with a case connection portion (54) connected to the case.

6. Each of the two Y-capacitor elements comprises a first element terminal (31A, 32A) connected to the second wiring and a second element terminal (31B, 32B) connected to the GND busbar. The power conversion device according to claim 5, wherein the second element terminal is provided closer to the case connection portion than the first element terminal.

7. The power conversion device according to claim 6, wherein the cross-sectional area of ​​the extension portion perpendicular to its own longitudinal direction is greater than the cross-sectional area of ​​the connection terminal perpendicular to its own longitudinal direction.

8. The second wiring is soldered to the first element terminal on the outside of the covering resin. The GND busbar is soldered to the second element terminal outside the covering resin. The second wiring is routed inside the covering resin while extending from the connection point with the first element terminal toward the connection point with the first wiring. The power conversion device according to claim 7, wherein the GND busbar is routed inside the covering resin while extending from the connection portion with the second element terminal toward the case connection portion.

9. The power conversion device according to claim 8, wherein the portion of the GND busbar covered with the covering resin faces the Y capacitor element.

10. The power conversion device according to claim 9, wherein the storage section has an intervening wall (37) between the Y capacitor element and the portion of the second wiring covered with the covering resin, which suppresses heat transfer between the Y capacitor element and the second wiring.

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