Workpiece processing equipment

Abstract

To provide a workpiece processing device that suppresses deterioration in processing performance of a processing device caused by a peeling unit that peels a protective sheet from a workpiece.SOLUTION: A workpiece processing device 1 includes a pasting unit 2 that pastes a dicing tape DT on a workpiece W and a dicing frame DF, and a plurality of peeling units 3 that peel off a protective sheet S pre-attached to the workpiece W from the workpiece W integrated with the dicing frame DF via the dicing tape DT.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a workpiece processing apparatus.

Background Art

[0002] In the field of semiconductor manufacturing, there is a process of grinding and thinning the back surface of a semiconductor substrate such as a silicon wafer (hereinafter referred to as "workpiece"), and in this process, a protective sheet made of an adhesive film or the like is attached to the surface of the workpiece to protect the devices formed on the surface of the workpiece.

[0003] Patent Document 1 discloses a processing apparatus 60 that peels off a protective tape attached to a workpiece 11 with a tape peeling unit 74a after attaching a dicing tape 17 to the workpiece 11 and an annular frame 15. The reference numerals are those of Patent Document 1.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, in recent years, workpieces tend to become thinner, and in order to prevent a workpiece with low rigidity from cracking when peeling off the protective sheet, it is necessary to carefully peel off the protective sheet at a low speed, which may reduce the processing capacity of the entire processing apparatus. In addition, when using a peeling tape for peeling the protective sheet, switching or replacing the peeling tape after stopping the tape peeling unit may also reduce the processing capacity of the entire processing apparatus.

[0006] Therefore, a technical problem to be solved arises in order to suppress the reduction in the processing capacity of the processing apparatus caused by the peeling unit for peeling the protective sheet, and the present invention aims to solve this problem. [Means for solving the problem]

[0007] To achieve the above objective, the workpiece processing apparatus according to the present invention is a workpiece processing apparatus comprising: an attachment unit for attaching dicing tape to a workpiece and a dicing frame; and a plurality of peeling units for peeling a protective sheet that has been previously attached to the workpiece from the workpiece which is integrated with the dicing frame via the dicing tape.

[0008] With this configuration, by using multiple peeling units to remove the protective sheet attached to the workpiece, it is possible to suppress a decrease in the processing capacity of the workpiece processing equipment, even when it is necessary to peel off the protective sheet from a thin workpiece at a low speed and carefully. Furthermore, since maintenance of other peeling units and switching or replacement of peeling tapes can be performed in parallel with the peeling of the protective sheet by one of the peeling units, a decrease in the processing capacity of the workpiece processing equipment can be suppressed. [Effects of the Invention]

[0009] This invention can suppress the decrease in processing capacity of a workpiece processing device caused by the peeling unit. [Brief explanation of the drawing]

[0010] [Figure 1] A plan view showing a workpiece processing apparatus according to one embodiment of the present invention. [Figure 2] A block diagram showing a partial configuration of a workpiece processing machine. [Modes for carrying out the invention]

[0011] One embodiment of the present invention will be described with reference to the drawings. In the following, when referring to the number, numerical values, quantities, ranges, etc., of components, unless specifically indicated or clearly limited to a particular number in principle, the number is not limited to that particular number and may be greater than or less than that number.

[0012] Furthermore, when referring to the shape, positional relationship, etc. of constituent elements, unless otherwise explicitly stated or it is clearly considered not to be so in principle, this includes things that are substantially similar or alike to those shapes, etc.

[0013] Furthermore, drawings may omit some components or exaggerate characteristic parts to make features easier to understand, and the dimensional ratios of components may not be the same as in reality. Also, in cross-sectional views, hatching of some components may be omitted to make the cross-sectional structure of the components easier to understand. In this embodiment, expressions indicating directions such as up and down or left and right are not absolute, and are appropriate when each component is in the orientation depicted in the drawing, but should be changed and interpreted accordingly if the orientation changes.

[0014] Figure 1 is a plan view showing the structure of the workpiece processing apparatus 1. Figure 2 is a block diagram showing a part of the configuration of the workpiece processing apparatus 1. The workpiece processing apparatus 1 comprises an adhesive unit 2, a peeling unit 3, a BCP unit 4, and a transport unit 5.

[0015] The adhesive unit 2 comprises an adhesive table 21, a feed roller 22, and a pressing roller 23. The adhesive unit 2 adheres the dicing tape DT to the workpiece W and the dicing frame DF. The workpiece W is, for example, a semiconductor substrate such as a silicon wafer, but is not limited thereto. The dicing tape DT is an ultraviolet-curing tape or the like. Hereinafter, the workpiece W and the dicing frame DF integrated via the dicing tape DT will be referred to as the "frame unit FY".

[0016] The attachment table 21 includes an inner circumference table (not shown) that holds the workpiece W by suction, and an outer circumference table 24 provided on the outer circumference of the inner circumference table on which the dicing frame DF is placed.

[0017] On the surface of the inner peripheral table, an adsorbent made of a porous material (not shown) is provided. The adsorbent is connected to a vacuum source or a compressed air source (not shown). When the vacuum source is activated, a negative pressure is supplied between the work W placed on the adsorbent and the adsorbent, and the work W is adsorbed and held by the adsorbent. Also, when the compressed air source is activated, compressed air (release air) is supplied between the work W and the adsorbent, and the adsorption between the work W and the adsorbent is released.

[0018] The sticking table 21 is placed on the slider 25 and is configured to be slidable between a standby position which is one end in the X direction (the left - right direction of the paper surface in FIG. 1) and a delivery position which is the other end in the X direction and between them. When the sticking table 21 is at the delivery position, a conveying arm (not shown) places the work W that has gone through a previous process such as a grinding device on the inner peripheral table. Similarly, when the sticking table 21 is at the standby position, a conveying arm (not shown) takes out the dicing frame DF housed in each slot of the frame stocker 26 and places it on the outer peripheral table 24. The frame stocker 26 is housed in a frame stocker housing portion 27 that can be accessed from the outside.

[0019] The feed roller 22 supports the dicing tape DT so that it can be fed out, and in cooperation with a take - up roller, a guide roller, and a knife plate (not shown), applies tension to the dicing tape DT and regulates the trajectory of the dicing tape DT.

[0020] The pressing roller 23 is configured to be able to move up and down by an actuator 28. The pressing roller 23 presses the dicing tape DT against the work W and the dicing frame DF for sticking.

[0021] The conveying unit 5 conveys the frame unit FY between the sticking unit 2, the peeling unit 3, and the BCP unit 4. The conveying unit 5 includes a rail portion 51 and an arm portion 52 that is supported on the rail portion 51 so as to be movable in the X direction and in the Y direction (the up - down direction of the paper surface in FIG. 1) perpendicular to the X direction, respectively.

[0022] Then, in the pasting unit 2, the dicing tape DT is pasted in the following procedure. That is, when the pasting table 21 slides to the standby position, the workpiece W is placed on the inner peripheral side table and adsorbed and held, and the dicing frame DF is transferred from the frame stocker 26 to the outer peripheral side table 24.

[0023] Next, the pasting table 21 is moved toward the other end in the X direction so that the outer peripheral portion of the dicing frame DF is disposed below the pressing roller 23. Then, the actuator 28 fully extends to lower the pressing roller 23, and the pressing roller 23 presses and pastes the dicing tape DT onto the dicing frame DF.

[0024] Next, when the pasting table 21 further moves toward the other end in the X direction, the pressing roller 23 rolls on the dicing frame DF and the workpiece W, and the dicing tape DT is gradually pasted onto the dicing frame DF and the workpiece W.

[0025] When the workpiece W is integrated with the dicing frame DF via the dicing tape DT, after the actuator 28 fully contracts to retract the pressing roller 23, the pasting table 21 is moved to the delivery position.

[0026] The peeling unit 3 peels off the protective sheet S (BG tape) pasted to protect the surface of the workpiece W when performing back grinding of the workpiece W. Note that the workpiece processing apparatus 1 includes two peeling units 3 juxtaposed along the Y direction, but the number of installed peeling units 3 may be three or more. Also, the peeling tape PT used by the peeling unit 3 to peel off the protective sheet S may be of different types or the same type for each peeling unit 3.

[0027] The peeling unit 3 includes a peeling table 31, a feed roller 32, and a heat stamp 33 as an adhesive portion, respectively.

[0028] The peeling table 31 supports the frame unit FY with the surface of the workpiece W facing upwards. The surface of the peeling table 31 is provided with an adsorbent made of a porous material (not shown). The adsorbent is connected to a vacuum source or a compressed air source (not shown). When the vacuum source is activated, negative pressure is supplied between the workpiece W placed on the adsorbent and the adsorbent, causing the workpiece W to be adsorbed and held by the adsorbent. When the compressed air source is activated, compressed air (release air) is supplied between the workpiece W and the adsorbent, releasing the adsorption between the workpiece W and the adsorbent.

[0029] The peeling table 31 is mounted on a slider 34 and is configured to slide in the X direction. The movement speed of the peeling table 31 can be arbitrarily changed, and for example, it is preferable to peel off the protective sheet S at a low speed without damaging the thin workpiece W. The peeling table 31 can be heated by a table heater 35. The temperature of the peeling table 31 is set to a temperature suitable for peeling off the protective sheet S according to the thickness and material of the workpiece W.

[0030] The feed roller 32 supports the strip-shaped release tape PT so that it can be fed out, and works in cooperation with a winding roller, guide roller and knife edge (not shown) to apply tension to the release tape PT and regulate the trajectory of the release tape PT.

[0031] The heat stamp 33 is configured to be able to move up and down by an actuator 36. The heat stamp 33 can be heated up by a stamp heater 37. The stamp temperature of the heat stamp 33 is set to a temperature suitable for peeling off the protective sheet S according to the thickness and material of the workpiece W.

[0032] Then, the peeling unit 3 peels off the protective sheet S in the following procedure. Specifically, first, when the peeling table 31 is in a standby position at one end in the X direction, the arm 52 takes the frame unit FY from the adhesive table 21 located at the transfer position, inverts the frame unit FY upside down, and then places it on the peeling table 31. It is preferable that the peeling table 31 be heated to a predetermined temperature in advance by the table heater 35 before the frame unit FY is placed on it.

[0033] Next, after the frame unit FY is adsorbed onto the peeling table 31, the peeling table 31 is moved so that the outer periphery of the workpiece W is positioned below the heat stamp 33.

[0034] Next, the actuator 36 fully extends, lowering the heat stamp 33. The heat stamp 33, heated to a predetermined temperature by the stamp heater 37, then contacts the release tape PT, heating and pressing it, thereby welding the release tape PT and the protective sheet S together.

[0035] Next, the actuator 36 fully retracts to move the heat stamp 33 into a safe position, and then the peeling table 31 is moved to the standby position. As the peeling table 31 moves, the protective sheet S peels off from the workpiece W.

[0036] The two peeling units 3 can be individually controlled to start and stop, and if the type of peeling tape PT is the same for both peeling units 3, the protective sheets S of two workpieces W can be peeled off in parallel by both peeling units 3. In addition, maintenance, switching or replacement of the peeling tape PT can be performed on the other peeling unit 3 while the protective sheet S is being peeled off by one peeling unit 3.

[0037] Furthermore, if the types of release tapes PT differ between the release units 3, different types of workpieces W can be processed seamlessly. In this case, it is preferable to pre-temperature-set the release table 31 and heat stamp 33 by starting the table heater 35 or stamp heater 37 of the other release unit 3 to match the temperature of the release table 31 and heat stamp 33, which are suitable for releasing the protective sheet S according to the thickness and material of the workpiece W to be processed next, while the protective sheet S is being released by one release unit 3.

[0038] The BCP unit 4 includes a BCP table 41, a label printer 42, and an unloading unit 43.

[0039] The frame unit FY is placed on the BCP table 41 with the surface of the workpiece W facing upwards. The BCP table 41 is mounted on a slider 44 and is configured to slide between a standby position, which is one end in the X direction, and a handover position, which is the other end in the X direction, and between these two positions.

[0040] The label printer 42 attaches a label L, on which the ID of the workpiece W is printed, to the dicing tape DT or dicing frame DF of the frame unit FY. The ID of the workpiece W is printed on the workpiece W and has been read in advance by a reader (not shown) prior to the attachment of the label L.

[0041] The unloading unit 43 receives the frame unit FY with label L attached from the BCP table 41 and places the frame unit FY into a slot in the cassette table 45. The cassette table 45 is configured to be able to move up and down with the frame cassettes 46 housed in two levels, upper and lower.

[0042] Frame cassettes 46 that do not contain frame units FY are placed in the frame cassette storage section 47 and then pulled into the cassette table 45 by an arm or the like (not shown). Frame cassettes 46 that contain a predetermined number of frame units FY are discharged into the frame cassette storage section 47 by an arm or the like.

[0043] Then, the BCP unit 4 applies the label L using the following procedure. Specifically, first, when the BCP table 41 is in the standby position, the arm unit 52 takes the frame unit FY from the peeling table 31 which is in the standby position and places it on the BCP table 41.

[0044] Next, the BCP table 41 is moved so that the dicing tape DT or dicing frame DF is positioned below the label printer 42.

[0045] Next, the label printer 42 attaches the label L, which has the ID of the workpiece W printed on it, to the dicing tape DT or dicing frame DF.

[0046] After the label L is attached, the BCP table 41 moves to the handover position, and the unloading unit 43 removes the frame unit FY from the BCP table 41. The cassette table 45 also raises and lowers the frame cassette 46 so that the height of the unloading unit 43 matches the slot position of the frame cassette 46 that will house the received frame unit FY. The unloading unit 43 then stores the frame unit FY in the slot of the frame cassette 46.

[0047] The operation of the workpiece processing device 1 is controlled via a controller 6. The controller 6 controls each of the components that make up the workpiece processing device 1. The controller 6 is, for example, a computer and is composed of a CPU, memory, etc. The functions of the controller 6 may be realized by control using software or by operating using hardware.

[0048] Thus, the workpiece processing apparatus 1 according to this embodiment is configured to include an attachment unit 2 for attaching dicing tape DT to a workpiece W and a dicing frame DF, and a plurality of peeling units 3 for peeling off protective sheets S that have been previously attached to the workpiece W from the workpiece W which is integrated with the dicing frame DF via the dicing tape DT.

[0049] With this configuration, by using multiple peeling units 3 to peel off the protective sheet S attached to the workpiece W, it is possible to suppress a decrease in the processing capacity of the workpiece processing device 1, even when it is necessary to peel off the protective sheet S from a thin workpiece W at a low speed and carefully. Furthermore, since maintenance of the other peeling unit 3 and switching or replacement of the peeling tape PT can be performed in parallel with the peeling of the protective sheet S by one peeling unit 3, a decrease in the processing capacity of the workpiece processing device 1 can be suppressed.

[0050] Furthermore, the workpiece processing apparatus 1 according to this embodiment includes a peeling unit 3 comprising a heat stamp 33 for adhering a peeling tape PT to a protective sheet S, and a peeling table 31 on which a workpiece W is placed and which can move relative to the heat stamp 33. The type of peeling tape PT is configured differently for each peeling unit 3 according to the type of workpiece W.

[0051] With this configuration, by using a peeling unit 3 equipped with a suitable peeling tape PT according to the type of workpiece W to peel off the protective sheet S, different types of workpieces W can be processed seamlessly.

[0052] Furthermore, the workpiece processing apparatus 1 according to this embodiment is configured such that the peeling unit 3 can adjust the temperature of the heat stamp 33 or the peeling table 31 so that it reaches a temperature suitable for processing the next workpiece W to be processed when it is in standby mode.

[0053] With this configuration, different types of workpieces W can be processed seamlessly by pre-conditioning the temperature of the peeling table 31 and heat stamp 33 of the other peeling unit 3 to match the temperature of the peeling table 31 and heat stamp 33 which are suitable for peeling the protective sheet S of the next workpiece W to be processed, in parallel with the peeling of the protective sheet S by one peeling unit 3.

[0054] Furthermore, the workpiece processing apparatus 1 according to this embodiment includes a peeling unit 3 comprising a heat stamp 33 for adhering a peeling tape PT to a protective sheet S, and a peeling table 31 on which a workpiece W is placed and which can move relative to the heat stamp 33, and the type of peeling tape PT is the same among the peeling units 3.

[0055] With this configuration, the protective sheets S of two workpieces W can be peeled off in parallel by two peeling units 3, thereby suppressing a decrease in the processing capacity of the workpiece processing device 1.

[0056] Furthermore, the present invention can be modified in various ways other than those described above, as long as it does not deviate from the spirit of the invention, and it goes without saying that the present invention extends to such modified forms. [Explanation of Symbols]

[0057] 1: Workpiece processing equipment 2: Adhesive unit 21: Attachment Table 22: Feed roller (of the adhesive unit) 23: Pressure roller 24: Perimeter Table 25: Slider (on the outer edge table) 26: Frame Stocker 27: Frame storage compartment 28: Actuator (of a pressure roller) 3: Peeling Unit 31: Peeling Table 32: Feed roller (of the peeling unit) 33: Heat stamping (adhesive part) 34: Slider (of the peeling table) 35: Table heater 36: Actuator (for heat stamps) 37: Stamp Heater 4: BCP Unit 41: BCP Table 42: Label printer 43: Unloading Section 44: Slider (for the BCP table) 45: Cassette Table 46: Frame Cassette 47: Frame cassette storage section 5: Conveyor Unit 51: Rail section 52: Arm section 6: Controller DF: Dicing Frame DT: Dicing Tape FY: Frame Unit L: Label PT: Release Tape S: Protective sheet W: Work

Claims

[Claim 1] A workpiece processing device, An adhesive unit for attaching dicing tape to the workpiece and dicing frame, A plurality of peeling units for peeling a protective sheet pre-attached to the workpiece from the workpiece which is integrated with the dicing frame via the dicing tape, Equipped with, The peeling unit comprises an adhesive section for adhering a release tape to the protective sheet, and a peeling table on which the workpiece is placed and which can move relative to the adhesive section. Furthermore, it is configured to allow adjustment of the temperature of at least one of the adhesive section and the peeling table to a temperature suitable for processing the next workpiece during standby. The workpiece processing apparatus is characterized in that the type of release tape differs for each release unit according to the type of workpiece.

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