Electronic control unit

Abstract

The purpose of the present invention is to comprehensively perform a noise countermeasure even for electronic components mounted to any of a plurality of circuit boards provided in an electronic control device. This electronic control device 100 comprises a first circuit board 4 and a second circuit board 5 in which respective mounting surfaces 4a, 5a for electronic components 8 are disposed facing each other with a gap therebetween. Furthermore, this electronic control device 100 of a first embodiment comprises a shielding member 9 that is disposed in the gap between the first circuit board 4 and the second circuit board 5 and shields noise, and conductive members 10a, 10b that connect the first circuit board 4 and the second circuit board 5 to the shielding member 9. The shielding member 9 is a frame body that surrounds the entire circumference around the electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5 and forms a closed path that has a width corresponding to the gap.

Description

Technical Field

[0001] The present invention relates to an electronic control device.

Background Art

[0002] An electronic control device for controlling a vehicle is composed of a main electronic control device that outputs control commands, and a plurality of sub - electronic control devices that respectively perform engine control, automatic brake control, display control, etc. based on the control commands from the main electronic control device. In addition, the vehicle is equipped with many sensors for recognizing external situations (such as road conditions). The electronic control device performs vehicle control while the sub - electronic control devices connected to the main electronic control device process sensor signals.

[0003] Both the main electronic control device and the sub - electronic control devices are equipped with a mechanism that provides basic functions in each electronic control device even when some abnormality occurs and has no impact on vehicle running, ensuring the redundancy of each function. In the electronic control device, multi - functionality including redundancy is progressing, and a configuration with a plurality of circuit boards is conceivable. In addition, each circuit board of the electronic control device may use a plurality of high - operation - frequency microcontrollers and DDR memories due to multi - functionality, and the number of heat - generating electronic components is likely to increase. As a result, noise countermeasures and heat countermeasures are essential in the electronic control device.

[0004] As a prior art document in this technical field, there is Patent Document 1. Patent Document 1 describes a high - frequency communication device including a high - frequency circuit board and a shield case covering the entire surface of the high - frequency circuit board.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] The high-frequency communication device described in Patent Document 1 can provide noise countermeasures for electronic components mounted on the high-frequency circuit board because the shielding case covers the entire surface of the high-frequency circuit board. However, there is room for improvement in noise countermeasures for electronic components mounted on the control circuit board.

[0007] The present invention has been made in view of the above, and aims to comprehensively implement noise countermeasures for electronic components mounted on any of the multiple circuit boards provided in an electronic control device. [Means for solving the problem]

[0008] To solve the above problems, the electronic control device of the present invention comprises a first circuit board and a second circuit board, the mounting surfaces of which electronic components are arranged opposite each other with a gap between them; a shielding member arranged in the gap between the first circuit board and the second circuit board to shield against noise; and a conductive member connecting the first circuit board and the second circuit board to the shielding member, wherein the shielding member is a frame that surrounds the electronic components mounted on each of the first circuit board and the second circuit board over its entire circumference and forms a closed circuit having a width corresponding to the gap. [Effects of the Invention]

[0009] According to the present invention, noise countermeasures can be comprehensively implemented for electronic components mounted on any of the multiple circuit boards provided in the electronic control device. Other issues, configurations, and effects will be clarified by the following description of the embodiments. [Brief explanation of the drawing]

[0010] [Figure 1] An exploded perspective view of the electronic control device of Embodiment 1. [Figure 2] Cross-sectional view of the electronic control unit shown in Figure 1. [Figure 3] Diagram showing the configuration of the shielding member. [Figure 4] An exploded perspective view of the electronic control device of Embodiment 2. [Figure 5] Cross-sectional view of the electronic control unit shown in Figure 4. [Figure 6] Diagram showing the configuration of the shielding member, heat sink, and heat dissipation plate. [Modes for carrying out the invention]

[0011] Embodiments of the present invention will be described below with reference to the drawings. In each embodiment, components denoted by the same reference numerals have the same function in each embodiment unless otherwise specified, and their descriptions will be omitted.

[0012] [Embodiment 1] The electronic control device 100 of Embodiment 1 will be described using Figures 1 to 3. Figure 1 is an exploded perspective view of the electronic control device 100 of Embodiment 1. Figure 2 is a cross-sectional view of the electronic control device 100 shown in Figure 1. Figure 3 is a configuration diagram of the shielding member 9.

[0013] The electronic control unit 100 is an electronic control unit comprising multiple circuit boards. The electronic control unit 100 may also be an ECU (Electronic Control Unit) mounted on a vehicle and used to control the vehicle.

[0014] The electronic control unit 100 comprises housings 1 and 2, a first circuit board 4 and a second circuit board 5, electronic components 8, a shielding member 9, conductive members 10a and 10b, and a bracket 11.

[0015] The housings 1 and 2 house the first circuit board 4 and the second circuit board 5, the shielding member 9, and the conductive members 10a and 10b. The housings 1 and 2 are formed in the shape of hollow rectangular parallelepipeds. The housings 1 and 2 are made of metal or resin. The housings 1 and 2 consist of a housing base 1 which constitutes the four walls and the ceiling of the housings 1 and 2, and a housing cover 2 which constitutes the floor of the housings 1 and 2. One of the walls of the housings 1 and 2, i.e., one wall of the housing base 1, has an opening 3 which exposes an external connector 6 that is connected to an external device. The external connector 6 is mounted on the mounting surface 4a of the first circuit board 4 and is connected to an external device via a harness or cable.

[0016] The first circuit board 4 and the second circuit board 5 are arranged such that the mounting surfaces 4a and 5a of their respective electronic components 8 face each other with a gap therebetween. The first circuit board 4 and the second circuit board 5 are arranged parallel to each other. The electronic components 8 are semiconductor elements such as a microcontroller and a DDR memory. Each of the first circuit board 4 and the second circuit board 5 mounts a plurality of electronic components 8. The first circuit board 4 and the second circuit board 5 are provided with a ground circuit pattern. Each of the first circuit board 4 and the second circuit board 5 is provided with a signal ground 12 and a frame ground 13 as the ground. Alternatively, only the signal ground 12 may be provided on each of the first circuit board 4 and the second circuit board 5.

[0017] The first circuit board 4 and the second circuit board 5 are connected to each other by a board-to-board connector 7. The first circuit board 4 and the second circuit board 5 are held at a distance from each other by a spacer 14. The spacer 14 is, for example, a high-rigidity rod-shaped member having one end fastened to the first circuit board 4 by a screw or the like and the other end fastened to the second circuit board 5 by a screw or the like. The spacer 14 is fixed to the shielding member 9.

[0018] The shielding member 9 is arranged between the first circuit board 4 and the second circuit board 5 and is a member for shielding noise. The shielding member 9 is formed using a material such as aluminum, copper, carbon fiber, conductive resin, or a material obtained by coating the surface of a non-conductive material with conductive resin. The shielding member 9 is connected and fixed to the housings 1 and 2.

[0019] The shielding member 9 is a frame that surrounds the entire circumference around the electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5, and forms a closed circuit having a width corresponding to the distance between the first circuit board 4 and the second circuit board 5. The shielding member 9 surrounds the entire circumference around the electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5, and cooperates with the first circuit board 4 and the second circuit board 5 to form a closed space at the distance between the first circuit board 4 and the second circuit board 5. For example, the shielding member 9 may be constituted by a plurality of shielding plates. FIGS. 1 and 3 show an example in which the shielding member 9 is constituted by four shielding plates provided along each side of the rectangular first circuit board 4 and second circuit board 5. One shielding plate is a shielding plate that extends in a direction in which the first circuit board 4 and the second circuit board 5 are separated from or approach each other (the normal direction of the first circuit board 4 or the second circuit board 5) and in a direction along one side of the first circuit board 4 and the second circuit board 5.

[0020] The number of electronic components 8 surrounded by the shielding member 9 is not particularly limited. That is, the shielding member 9 surrounds the entire circumference around some or all of the electronic components 8 mounted on the first circuit board 4 and also surrounds the entire circumference around some or all of the electronic components 8 mounted on the second circuit board 5.

[0021] The conductive members 10a and 10b are members that connect the first circuit board 4 and the second circuit board 5 to the shielding member 9. The conductive members 10a and 10b may be integrally formed with the shielding member 9 using the same material as the shielding member 9. The conductive members 10a and 10b include a first conductive member 10a that connects the first end face 9a on the first circuit board 4 side of the shielding member 9 to the mounting surface 4a of the first circuit board 4, and a second conductive member 10b that connects the second end face 9b on the second circuit board 5 side of the shielding member 9 to the mounting surface 5a of the second circuit board 5.

[0022] The first conductive member 10a is connected to a ground provided on the first circuit board 4. The second conductive member 10b is connected to a ground provided on the second circuit board 5. Specifically, if the first circuit board 4 and the second circuit board 5 are each provided with a signal ground 12 and a frame ground 13, the first conductive member 10a and the second conductive member 10b are connected to the frame ground 13 of the first circuit board 4 and the frame ground 13 of the second circuit board 5, respectively. If the first circuit board 4 and the second circuit board 5 are each provided with only a signal ground 12, the first conductive member 10a and the second conductive member 10b are connected to the signal ground 12 of the first circuit board 4 and the signal ground 12 of the second circuit board 5, respectively.

[0023] Multiple first conductive members 10a are arranged along the first end face 9a at a distance of half the wavelength λ of the electromagnetic wave constituting the noise (λ / 2) or less, or at a distance of one-quarter the wavelength λ (λ / 4) or less. Multiple first conductive members 10a are arranged at equal distances from each other. Multiple second conductive members 10b are arranged along the second end face 9b at a distance of half the wavelength λ of the electromagnetic wave constituting the noise (λ / 2) or less, or at a distance of one-quarter the wavelength λ (λ / 4) or less. Multiple second conductive members 10b are arranged at equal distances from each other.

[0024] One type of noise composed of electromagnetic waves is noise radiated outside the electronic control device 100 that attempts to irradiate the electronic components 8 mounted on the first circuit board 4 and the second circuit board 5 (hereinafter also referred to as "irradiation noise"). Another type of noise composed of electromagnetic waves is noise radiated from the electronic components 8 mounted on the first circuit board 4 and the second circuit board 5 that attempts to move towards the outside of the electronic control device 100 (hereinafter also referred to as "radiated noise"). The wavelength λ of the electromagnetic waves that constitute the noise may be the wavelength of the electromagnetic waves that constitute the irradiation noise, or the wavelength of the electromagnetic waves that constitute the radiated noise.

[0025] CISPR25 is a well-known standard for measuring EMI (Electromagnetic Interference) in automotive equipment. The automotive electronic control unit 100 will implement noise countermeasures in accordance with CISPR25. The frequency range of radiated emissions is 0.15MHz to 2500MHz. For example, the frequency range of "GLONASS L1" in CISPR25 is 1591MHz to 1616MHz, which can be considered a high frequency. The wavelength λ can be calculated using the following formula. Wavelength λ[m]=propagation speed C0[m 2 / s] / frequency[Hz]

[0026] The wavelength λ of 1616 MHz, which is the maximum value in the frequency range of "GLONASS L1" of CISPR25, is 185.5 [mm] from the above formula. Therefore, if you want to shield the radiated noise at 1616 MHz, the electronic control unit 100 should set the distance between the multiple first conductive members 10a and the distance between the multiple second conductive members 10b to, for example, λ / 4 = 46 [mm] or less. This allows the electronic control unit 100 to reliably attenuate the radiated noise that is trying to pass between the first circuit board 4 and the shielding member 9.

[0027] Bracket 11 secures the electronic control unit 100 to the vehicle body. Bracket 11 connects the housings 1 and 2 to the vehicle body frame ground. Bracket 11 is formed from aluminum, copper, carbon fiber, conductive resin, or a material in which a conductive resin is coated on the surface of a non-conductive material. Bracket 11 is connected to housings 1 and 2. Bracket 11 is connected to shielding member 9. For example, bracket 11 may be connected to shielding member 9 by penetrating a wall portion of housing base 1 where the opening 3 is not formed.

[0028] As described above, the electronic control device 100 of Embodiment 1 comprises a first circuit board 4 and a second circuit board 5, the mounting surfaces 4a and 5a of the respective electronic components 8, which are arranged opposite each other with a gap between them; a shielding member 9 arranged in the gap between the first circuit board 4 and the second circuit board 5 to shield against noise; and conductive members 10a and 10b connecting the first circuit board 4 and the second circuit board 5 to the shielding member 9. The shielding member 9 is a frame that surrounds the electronic components 8 mounted on each of the first circuit board 4 and the second circuit board 5 around their entire circumference, forming a closed circuit with a width corresponding to the gap.

[0029] As a result, the shielding member 9 can block or attenuate irradiation noise that is radiated outside the electronic control unit 100 and attempts to irradiate the electronic components 8 mounted on the first circuit board 4 and the second circuit board 5, respectively. The shielding member 9 can block or attenuate radiated noise that is radiated by the electronic components 8 mounted on the first circuit board 4 and the second circuit board 5 and attempts to move outside the electronic control unit 100. Therefore, the electronic control unit 100 of Embodiment 1 can effectively implement EMI countermeasures and EMS countermeasures for the electronic components 8 mounted on the first circuit board 4 and the second circuit board 5, respectively. Therefore, the electronic control unit 100 of Embodiment 1 can comprehensively implement noise countermeasures for the electronic components 8 mounted on any of the multiple circuit boards 4 and 5 provided in the electronic control unit 100.

[0030] Furthermore, in the electronic control device 100 of Embodiment 1, the conductive members 10a and 10b include a first conductive member 10a that connects the first end face 9a of the shielding member 9 on the first circuit board 4 side to the mounting surface 4a of the first circuit board 4, and a second conductive member 10b that connects the second end face 9b of the shielding member 9 on the second circuit board 5 side to the mounting surface 5a of the second circuit board 5. Multiple first conductive members 10a are arranged along the first end face 9a at a distance of half the wavelength λ of the electromagnetic wave constituting the noise (λ / 2) or less, or one-quarter the wavelength λ (λ / 4) or less. Multiple second conductive members 10b are arranged along the second end face 9b at a distance of half the wavelength λ of the electromagnetic wave constituting the noise (λ / 2) or less, or one-quarter the wavelength λ (λ / 4) or less.

[0031] As a result, the electronic control device 100 of Embodiment 1 can reliably attenuate irradiation noise or radiated noise attempting to pass between the first circuit board 4 and the shielding member 9, even without completely closing the space between the first circuit board 4 and the shielding member 9. The electronic control device 100 of Embodiment 1 can reliably attenuate irradiation noise or radiated noise attempting to pass between the second circuit board 5 and the shielding member 9, even without completely closing the space between the second circuit board 5 and the shielding member 9. Therefore, the electronic control device 100 of Embodiment 1 can comprehensively and easily implement noise countermeasures for electronic components 8 mounted on any of the multiple circuit boards 4 and 5 provided in the electronic control device 100.

[0032] Furthermore, in the electronic control device 100 of Embodiment 1, the first conductive member 10a is connected to a ground provided on the first circuit board 4, and the second conductive member 10b is connected to a ground provided on the second circuit board 5.

[0033] As a result, the electronic control unit 100 of Embodiment 1 can dissipate irradiation noise to the grounds provided on the first circuit board 4 and the second circuit board 5. The electronic control unit 100 of Embodiment 1 can reliably prevent malfunctions or failures of the electronic control unit 100, such as malfunctions or failures of electronic components 8 mounted on the first circuit board 4 and the second circuit board 5, respectively. Therefore, the electronic control unit 100 of Embodiment 1 can comprehensively implement noise countermeasures for electronic components 8 mounted on any of the multiple circuit boards 4 and 5 provided in the electronic control unit 100.

[0034] Furthermore, in the electronic control device 100 of Embodiment 1, the shielding member 9 is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which a conductive resin is coated on the surface of a non-conductive material.

[0035] As a result, the electronic control device 100 of Embodiment 1 can form a shielding member 9 without using any special materials. Therefore, the electronic control device 100 of Embodiment 1 can comprehensively and easily implement noise countermeasures for electronic components 8 mounted on any of the multiple circuit boards 4 and 5 provided in the electronic control device 100.

[0036] Furthermore, the electronic control device 100 of Embodiment 1 further comprises housings 1 and 2 mounted on the vehicle and housing a first circuit board 4 and a second circuit board 5, a shielding member 9 and conductive members 10a and 10b, and a bracket 11 that connects the housings 1 and 2 to the frame ground of the vehicle body. The shielding member 9 is connected to the bracket 11.

[0037] As a result, the electronic control unit 100 of Embodiment 1 can dissipate static electricity charged on the first circuit board 4 and the second circuit board 5, as well as the housings 1 and 2, to the vehicle's frame ground via the shielding member 9 and the bracket 11. The electronic control unit 100 of Embodiment 1 can reliably prevent malfunctions or failures of the electronic control unit 100, such as malfunctions or failures of electronic components 8 mounted on the first circuit board 4 and the second circuit board 5, respectively. Therefore, the electronic control unit 100 of Embodiment 1 can implement static electricity countermeasures while comprehensively implementing noise countermeasures for electronic components 8 mounted on any of the multiple circuit boards 4 and 5 provided in the electronic control unit 100.

[0038] Furthermore, in the electronic control device 100 of Embodiment 1, the bracket 11 is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which a conductive resin is coated on the surface of a non-conductive material.

[0039] As a result, the electronic control device 100 of Embodiment 1 can form the bracket 11 without using any special materials. Therefore, the electronic control device 100 of Embodiment 1 can comprehensively and easily implement noise countermeasures for electronic components 8 mounted on any of the multiple circuit boards 4 and 5 provided in the electronic control device 100.

[0040] Furthermore, the electronic control device 100 of Embodiment 1 further includes a spacer 14 that maintains the distance between the first circuit board 4 and the second circuit board 5. The spacer 14 is fixed to the shielding member 9.

[0041] As a result, the electronic control device 100 of Embodiment 1 can prevent the first circuit board 4 and the second circuit board 5 from becoming misaligned and interfering with each other due to vibration, and prevent the inter-board connector 7 from coming loose. Therefore, the electronic control device 100 of Embodiment 1 can improve vibration resistance while comprehensively implementing noise countermeasures for electronic components 8 mounted on any of the multiple circuit boards 4 and 5 provided in the electronic control device 100.

[0042] Furthermore, the electronic control device 100 of Embodiment 1 further comprises housings 1 and 2 that house the first circuit board 4, the second circuit board 5, the shielding member 9, and the conductive members 10a and 10b. The housings 1 and 2 are made of metal or resin.

[0043] As a result, the electronic control device 100 of Embodiment 1 can have its housings 1 and 2 formed without using any special materials. Therefore, the electronic control device 100 of Embodiment 1 can comprehensively and easily implement noise countermeasures for electronic components 8 mounted on any of the multiple circuit boards 4 and 5 provided in the electronic control device 100.

[0044] [Embodiment 2] The electronic control unit 100 of Embodiment 2 will be described using Figures 4 to 6. The same configuration and operation as in Embodiment 1 will not be described in the electronic control unit 100 of Embodiment 2. Figure 4 is an exploded perspective view of the electronic control unit 100 of Embodiment 2. Figure 5 is a cross-sectional view of the electronic control unit 100 shown in Figure 4. Figure 6 is a configuration diagram of the shielding member 9, heat sink 15, and heat sink 17.

[0045] The electronic control device 100 of Embodiment 2, like the electronic control device 100 of Embodiment 1, can perform noise countermeasures for electronic components 8 mounted on multiple circuit boards 4 and 5. Furthermore, the electronic control device 100 of Embodiment 2 can perform thermal countermeasures for electronic components 8 mounted on multiple circuit boards 4 and 5.

[0046] The electronic control device 100 of Embodiment 2 includes, in addition to the components provided in the electronic control device 100 of Embodiment 1, a heat sink 15, a heat sink 17, and a heat dissipation material 18.

[0047] The housings 1 and 2 of Embodiment 2 house the first circuit board 4 and the second circuit board 5, the shielding member 9, the conductive members 10a and 10b, the heat sink 15, and the heat dissipation material 18.

[0048] The heat sink 15 is positioned inside the shielding member 9 between the electronic components 8 mounted on the first circuit board 4 and the electronic components 8 mounted on the second circuit board 5. The heat sink 15 is positioned along the first circuit board 4 and the second circuit board 5. The heat sink 15 is made of a material with high thermal conductivity, such as aluminum, copper, or carbon fiber. The heat sink 15 is connected to the heat sink 17 by penetrating or through the shielding member 9 and the housings 1 and 2. The heat sink 15 is integrally formed with the shielding member 9 and the heat sink 17.

[0049] The heat sink 15 has a first base 16a that protrudes toward the electronic component 8 mounted on the first circuit board 4, and a second base 16b that protrudes toward the electronic component 8 mounted on the second circuit board 5. The area of ​​the top surface of the first base 16a and the second base 16b may be greater than or equal to the area of ​​the top surface of the electronic component 8 corresponding to the first base 16a and the second base 16b, respectively. The first base 16a and the second base 16b may be provided for electronic components 8 that generate a large amount of heat mounted on the first circuit board 4 and the second circuit board 5, respectively, but may not be provided for electronic components 8 that generate a small amount of heat. The heat sink 15 may be formed in a concave shape such that the area on the side facing the first circuit board 4 where the first base 16a is not provided, and the area on the side facing the second circuit board 5 where the second base 16b is not provided, are separated from the first circuit board 4 and the second circuit board 5, respectively.

[0050] The heat dissipation material 18 is a component that comes into contact with the electronic component 8 and the heat sink 15. The heat dissipation material 18 is made up of, for example, thermal grease or a thermal sheet. The heat dissipation material 18 fills the gap between the electronic component 8 mounted on the first circuit board 4 and the first base 16a, and the gap between the electronic component 8 mounted on the second circuit board 5 and the second base 16b.

[0051] The heatsink 17 is provided on the outside of the housings 1 and 2. The heatsink 17 is provided so as to be in contact with the outer surface of the housings 1 and 2. The heatsink 17 is provided on the outer surface of the housings 1 and 2, away from the opening 3 of the housings 1 and 2, and close to the electronic component 8 that generates more heat than the electronic component 8 that generates less heat. The heatsink 17 has a plurality of fins 17a that extend along the direction of gravity (up and down direction) and are spaced apart from each other in the horizontal direction (front and back direction or left and right direction). The fins 17a are arranged in a plurality, extending along the direction of gravity and spaced apart from each other in the horizontal direction, regardless of the installation orientation of the housings 1 and 2. The heatsink 17 is formed using a material with high thermal conductivity such as aluminum, copper, or carbon fiber. The shielding member 9, the heat sink 15, and the heatsink 17 are formed integrally.

[0052] In Embodiment 2, the bracket 11 is connected to a heat sink 17 provided on the outer surface of the housings 1 and 2. In Embodiment 2, the bracket 11 connects the housings 1 and 2 to the vehicle frame ground via the heat sink 17. In Embodiment 2, the bracket 11 is connected to the housings 1 and 2 via the heat sink 17. In Embodiment 2, the bracket 11 is connected to the shielding member 9 via the heat sink 17 and the heat dissipation plate 15.

[0053] The shielding member 9, heat sink 15, and heat sink 17 are connected to and fixed to the housings 1 and 2 so as to withstand vibrations or impacts from drops of the electronic control unit 100. The fixing methods may be as follows: For example, the outer surface of the shielding member 9 and the inner surface of the housing base 1 may be fixed by connecting them using a screw fastening mechanism or a hook mechanism (a mechanism using claws and holes). For example, the heat sink 17 and the outer surface of the housing base 1 may be fixed by connecting them using a screw fastening mechanism or a hook mechanism. Furthermore, the housing base 1 and the housing cover 2 may also be fixed by connecting them using a screw fastening mechanism or a hook mechanism.

[0054] As described above, the electronic control device 100 of Embodiment 2 includes a heat sink 15 positioned inside the shielding member 9 between the electronic components 8 mounted on the first circuit board 4 and the electronic components 8 mounted on the second circuit board 5, a heat dissipation material 18 that contacts the electronic components 8 and the heat sink 15, housings 1 and 2 that house the first circuit board 4 and the second circuit board 5, the shielding member 9, conductive members 10a and 10b, the heat sink 15 and the heat dissipation material 18, and a heat sink 17 provided on the outside of the housings 1 and 2. The heat sink 15 is connected to the heat sink 17 by penetrating or through the shielding member 9 and the housings 1 and 2.

[0055] As a result, the electronic control device 100 of Embodiment 2 can immediately transport the heat generated by the electronic component 8 to the heat sink 15 without going through the first circuit board 4 and the second circuit board 5. The electronic control device 100 of Embodiment 2 can immediately transport the heat transported to the heat sink 15 to the heat sink 17 outside the housing 1 and 2, and dissipate the heat from the heat sink 17. Therefore, since the electronic control device 100 of Embodiment 2 can immediately dissipate the heat generated by the electronic component 8 outside the housing 1 and 2, the temperature of the electronic component 8 can be reliably reduced. Thus, the electronic control device 100 of Embodiment 2 can reliably implement thermal countermeasures for the electronic component 8 mounted on multiple circuit boards 4 and 5 while comprehensively implementing noise countermeasures for the electronic component 8 mounted on any of the multiple circuit boards 4 and 5 provided in the electronic control device 100.

[0056] Furthermore, in the electronic control device 100 of Embodiment 2, the heat sink 15 has a first base 16a that protrudes toward the electronic component 8 mounted on the first circuit board 4, and a second base 16b that protrudes toward the electronic component 8 mounted on the second circuit board 5. The heat dissipation material 18 fills the gap between the electronic component 8 mounted on the first circuit board 4 and the first base 16a, and the gap between the electronic component 8 mounted on the second circuit board 5 and the second base 16b.

[0057] As a result, the electronic control device 100 of Embodiment 2 can reduce the thermal resistance between the electronic component 8 and the heat sink 15, thereby enabling the heat generated by the electronic component 8 to be transported to the heat sink 15 more quickly. Therefore, the electronic control device 100 of Embodiment 2 can more reliably reduce the temperature of the electronic component 8. Thus, the electronic control device 100 of Embodiment 2 can comprehensively implement noise countermeasures for the electronic component 8 mounted on any of the multiple circuit boards 4 and 5 provided in the electronic control device 100, while also more reliably implementing thermal countermeasures for the electronic component 8 mounted on the multiple circuit boards 4 and 5.

[0058] Furthermore, in the electronic control device 100 of Embodiment 2, the heat sink 17 has a plurality of fins 17a that extend along the direction of gravity and are spaced apart from each other in the horizontal direction, regardless of the installation orientation of the housings 1 and 2.

[0059] As a result, the electronic control unit 100 of Embodiment 2 can dissipate heat transported to the heat sink 17 even more quickly, regardless of the installation orientation of the housings 1 and 2, thereby more reliably reducing the temperature of the electronic components 8. Therefore, the electronic control unit 100 of Embodiment 2 can comprehensively implement noise countermeasures for the electronic components 8 mounted on any of the multiple circuit boards 4 and 5 provided in the electronic control unit 100, while also more reliably implementing thermal countermeasures for the electronic components 8 mounted on the multiple circuit boards 4 and 5.

[0060] Furthermore, in the electronic control device 100 of Embodiment 2, the shielding member 9, the heat sink 15, and the heat sink 17 are each formed using aluminum, copper, or carbon fiber.

[0061] As a result, the electronic control device 100 of Embodiment 2 can form the shielding member 9, heat sink 15, and heat sink 17 without using special materials. Therefore, the electronic control device 100 of Embodiment 2 can reliably and easily implement thermal countermeasures for the electronic components 8 mounted on any of the multiple circuit boards 4 and 5 provided in the electronic control device 100, while comprehensively implementing noise countermeasures for the electronic components 8 mounted on any of the multiple circuit boards 4 and 5 provided in the electronic control device 100.

[0062] Furthermore, in the electronic control device 100 of Embodiment 2, the shielding member 9, the heat sink 15, and the heat sink 17 are integrally formed.

[0063] As a result, the electronic control device 100 of Embodiment 2 can transport heat from the first circuit board 4 and the second circuit board 5 to the heat sink 15 via the shielding member 9. Furthermore, the electronic control device 100 of Embodiment 2 can reduce the thermal resistance between the shielding member 9 and the heat sink 15, and the thermal resistance between the heat sink 15 and the heat sink 17. Therefore, the electronic control device 100 of Embodiment 2 can transport heat generated in the first circuit board 4 and the second circuit board 5 and the electronic components 8 to the heat sink 15 even more quickly, thereby further reliably reducing the temperature of the electronic components 8. Thus, the electronic control device 100 of Embodiment 2 can comprehensively implement noise countermeasures for the electronic components 8 mounted on any of the multiple circuit boards 4 and 5 provided in the electronic control device 100, while also more reliably implementing thermal countermeasures for the electronic components 8 mounted on multiple circuit boards 4 and 5.

[0064] It should be noted that the present invention is not limited to the embodiments described above, and various modifications are included. For example, the embodiments described above are described in detail to make the present invention easier to understand, and are not necessarily limited to those having all the configurations described. Furthermore, it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. In addition, it is possible to add, delete, or replace parts of the configuration of each embodiment with other configurations. [Explanation of Symbols]

[0065] 1,2…Housing, 4…First circuit board, 4a…Mounting surface, 5…Second circuit board, 5a…Mounting surface, 8…Electronic component, 9…Shielding member, 9a…First end face, 9b…Second end face, 10a,10b…Conductive member, 10a…First conductive member, 10b…Second conductive member, 11…Bracket, 14…Spacer, 15…Heat sink, 16a…First base, 16b…Second base, 17…Heat sink, 17a…Fin, 18…Heat dissipation material, 100…Electronic control unit

Claims

1. A first circuit board and a second circuit board, in which the mounting surfaces of each electronic component are arranged opposite each other with a gap between them, The first circuit board and the second circuit board are arranged at the aforementioned interval, and the frame is configured to surround the electronic components mounted on each of the first and second circuit boards around their entire circumference, forming a closed circuit with a width corresponding to the aforementioned interval, and the shielding member is configured to block noise, A conductive member connecting the first circuit board, the second circuit board, and the shielding member, A heat sink is placed inside the shielding member between the electronic component mounted on the first circuit board and the electronic component mounted on the second circuit board, A heat dissipation material that comes into contact with the aforementioned electronic component and the heat sink, A housing that houses the first circuit board and the second circuit board, the shielding member, the conductive member, the heat sink, and the heat dissipation material, The enclosure comprises a heat sink provided on the outside of the enclosure, The heat sink is connected to the heat sink by penetrating or through the shielding member and the housing. The shielding member, the heat sink, and the heat sink are integrally formed. An electronic control device characterized by the following features.

2. The conductive member comprises a first conductive member connecting the first end face of the shielding member on the first circuit board side to the mounting surface of the first circuit board, and a second conductive member connecting the second end face of the shielding member on the second circuit board side to the mounting surface of the second circuit board. Multiple first conductive members are arranged along the first end face at distances of half or less the wavelength of the electromagnetic wave constituting the noise, or one-quarter or less the wavelength. Multiple second conductive members are arranged along the second end face at distances of half the wavelength or less, or one-quarter the wavelength or less. The electronic control device according to feature 1.

3. The first conductive member is connected to a ground provided on the first circuit board. The second conductive member is connected to a ground provided on the second circuit board. The electronic control device according to claim 2.

4. The shielding member is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which a conductive resin is coated on the surface of a non-conductive material. The electronic control device according to feature 1.

5. The heat sink has a first base that protrudes toward the electronic component mounted on the first circuit board, and a second base that protrudes toward the electronic component mounted on the second circuit board. The heat dissipation material fills the gap between the electronic component mounted on the first circuit board and the first base, and the gap between the electronic component mounted on the second circuit board and the second base. The electronic control device according to feature 1.

6. The heat sink has a plurality of fins that extend along the direction of gravity and are spaced apart from each other horizontally, regardless of the installation orientation of the housing. The electronic control device according to feature 1.

7. Each of the shielding member, the heat sink, and the heat sink is formed using aluminum, copper, or carbon fiber. The electronic control device according to feature 1.

8. The aforementioned electronic control unit is mounted on the vehicle and further comprises a bracket that connects the housing to the frame ground of the vehicle body, The shielding member is connected to the bracket. The electronic control device according to feature 1.

9. The bracket is formed using aluminum, copper, carbon fiber, conductive resin, or a material in which a conductive resin is coated on the surface of a non-conductive material. The electronic control device according to claim 8.

10. The facility further includes a spacer that maintains the distance between the first circuit board and the second circuit board, The spacer is fixed to the shielding member. The electronic control device according to feature 1.

11. The housing is made of metal or resin. The electronic control device according to feature 1.

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