Cooling system

JP7863367B2Active Publication Date: 2026-05-21SHINWA CONTROLS
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2023-10-18
Publication Date
2026-05-21

AI Technical Summary

Technical Problem

Existing refrigeration systems face challenges in achieving low temperatures due to the limitations of conventional refrigerants, particularly HFO-based solvents, which have high boiling points and are unsuitable for vapor compression type refrigeration systems, and boiling cooling systems that cannot cool below atmospheric boiling points, restricting refrigeration capacity at low temperatures.

Method used

A cooling system that utilizes a sealed container with a pressure reducing device to lower the pressure inside, allowing refrigerants to cool by expanding and releasing heat under atmospheric pressure, using HFO-based solvents with a boiling point of 30°C or higher, and incorporating a refrigerant circulation device to circulate and liquefy the refrigerant.

Benefits of technology

Enables the use of HFO-based solvents as refrigerants, expanding the range of substances usable in thermal cycles, achieving low temperatures and high refrigeration capacity while ensuring low environmental impact and safety.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

A cooling system according to an embodiment of the present invention comprises: a sealed container 10 that includes a first outflow port 11 and an inflow port 13, and that stores a liquid refrigerant; a pressure reduction device 20 that is connected to the first outflow port 11 and adjusts the pressure in the sealed container 10 to be lower than the atmospheric pressure by sucking a gas from the sealed container 10 through the first outflow port 11; and a refrigerant circulation device 30 that includes a refrigerant flow channel 31 connected to the pressure reduction device 20 and the inflow port 13 and that allows the liquid refrigerant, obtained by liquefying the gas sucked from the sealed container 10 by the pressure reduction device 20, to flow through the inflow port 13 into the sealed container 10.
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Citation Information

Patent Citations

  • Liquid-coolant circulation cooling system

    JP2008027780A

  • Superconductor cooling device

    JP2016170928A

  • Refrigerant system including direct contact heat exchanger

    JP2019045077A

  • Air-conditioning systems and related methods

    US20080035312A1