Cooling system
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- SHINWA CONTROLS
- Filing Date
- 2023-10-18
- Publication Date
- 2026-05-21
AI Technical Summary
Existing refrigeration systems face challenges in achieving low temperatures due to the limitations of conventional refrigerants, particularly HFO-based solvents, which have high boiling points and are unsuitable for vapor compression type refrigeration systems, and boiling cooling systems that cannot cool below atmospheric boiling points, restricting refrigeration capacity at low temperatures.
A cooling system that utilizes a sealed container with a pressure reducing device to lower the pressure inside, allowing refrigerants to cool by expanding and releasing heat under atmospheric pressure, using HFO-based solvents with a boiling point of 30°C or higher, and incorporating a refrigerant circulation device to circulate and liquefy the refrigerant.
Enables the use of HFO-based solvents as refrigerants, expanding the range of substances usable in thermal cycles, achieving low temperatures and high refrigeration capacity while ensuring low environmental impact and safety.
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