Sample stage and charged particle beam apparatus

The integration of a displacement absorption section in the feed member addresses vertical displacement issues in the XY table, extending the lifespan of the linear guide and improving the precision and miniaturization of the sample stage in charged particle beam apparatuses.

JP7863497B2Active Publication Date: 2026-05-21JEOL LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
JEOL LTD
Filing Date
2022-12-14
Publication Date
2026-05-21

AI Technical Summary

Technical Problem

The XY table in existing charged particle beam apparatuses experiences vertical displacement of the top table slider due to manufacturing errors, leading to increased force between the slider and guide rail, which reduces the lifespan of the linear motion guide.

Method used

Incorporating a displacement absorption section in the feed member that absorbs vertical displacement of the moving body, reducing the force between the moving body and the rail, thereby extending the lifespan of the linear guide.

Benefits of technology

The displacement absorption section reduces vertical displacement-induced forces, extending the lifespan of the linear guide, allowing for miniaturization and precise positioning of the sample stage, and reducing vibrations and yawing, thus enhancing the overall performance and accuracy of the sample stage.

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Abstract

To provide a sample stage that can prolong the life of a direct-acting guide.SOLUTION: A sample stage 100 includes: a first rail 12 extending in a first direction; a first table 20 moving along the first rail 12; a first direct-acting mechanism 30 moving the first table 20 linearly in the first direction; a second rail 22 extending in a second direction orthogonal to the first direction; a second table 50 moving along the second rail 22; a third rail 72 provided to the second table 50 and extending in the first direction; a direct-acting guide 70 including a moving body 74 moving along the third rail 72; a feed member 80 fitted with the moving body 74; a second direct-acting mechanism 60 which moves the second table 50 linearly in the second direction through the feed member 80; and a third table provided to the second table 50 and having a sample arranged, wherein the feed member 80 includes a displacement absorption part which absorbs displacement of the moving body 74 in a third direction orthogonal to the first direction and second direction.SELECTED DRAWING: Figure 2
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Description

Technical Field

[0001] The present invention relates to a sample stage and a charged particle beam apparatus.

Background Art

[0002] In charged particle beam apparatuses such as electron beam lithography apparatuses and electron microscopes, a sample stage that can move a sample within an XY plane is used as the sample stage.

[0003] For example, in Patent Document 1, an X-axis table movably supported in the X-axis direction on an X-axis base, a Y-axis table supported on the X-axis base and movably in the Y-axis direction, and an X-axis table that moves in the X-axis direction following the movement of the X-axis table and is movably supported on the Y-axis table following the movement of the Y-axis table in the Y-axis direction. A top table, a top table slider provided below the top table, and a top table guide rail provided on the Y-axis table on which the top table slider can slide are disclosed. In this X-Y table, a traction guide rail extending in the Y-axis direction is provided on the X-axis table, and a traction slider engaging with the traction guide rail is provided on the top table.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the XY table disclosed in Patent Document 1, the top table slider and the top table guide rail constitute a linear motion guide. In such an XY table, the top table slider may be displaced vertically (in the Z direction) due to manufacturing errors of the components that make up the XY table. When the top table slider is displaced vertically, a force is applied between the top table slider and the top table guide rail, shortening the lifespan of the linear motion guide. [Means for solving the problem]

[0006] One embodiment of the sample stage according to the present invention is: Bass and, A first rail is provided on the base and extends in the first direction, A first table that moves along the first rail, A first linear motion mechanism that moves the first table in a linear motion in the first direction, A second rail is provided on the first table and extends in a second direction perpendicular to the first direction, A second table that moves along the second rail, A linear guide including a third rail extending in the first direction provided on the second table, and a movable body that moves along the third rail, The feed member to which the aforementioned moving body is attached, A second linear motion mechanism that moves the second table linearly in the second direction via the feed member, A third table is provided on the second table on which the sample is placed, Includes, The feed member includes a displacement absorbing section that absorbs the displacement of the moving body in a third direction perpendicular to the first and second directions.

[0007] In such a sample stage, the feed member includes a displacement absorption section that absorbs the displacement of the moving body in the third direction, thereby reducing the force generated between the moving body and the third rail due to the displacement of the moving body in the third direction. Therefore, in such a sample stage, the lifespan of the linear guide can be extended.

[0008] One aspect of the charged particle beam apparatus according to the present invention is: This includes the sample stage described above. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic perspective view showing a sample stage according to one embodiment of the present invention. [Figure 2] A schematic perspective view showing a sample stage according to one embodiment of the present invention. [Figure 3] A schematic perspective view showing the plate of the feed member. [Figure 4] A diagram illustrating the operation of the sample stage. [Figure 5] A diagram illustrating the operation of the sample stage. [Figure 6] A diagram illustrating the operation of the sample stage. [Figure 7] A diagram illustrating the operation of the sample stage. [Figure 8] A schematic perspective view showing the plate of the feed member according to the first modified example. [Figure 9] A schematic perspective view showing the plate of the feed member according to the second modified example. [Figure 10] A schematic perspective view showing the plate of the feed member according to the third modified example. [Figure 11] A schematic perspective view showing an electron beam lithography apparatus according to one embodiment of the present invention. [Modes for carrying out the invention]

[0010] Preferred embodiments of the present invention will be described in detail below with reference to the drawings. The embodiments described below are not intended to unduly limit the scope of the present invention as described in the claims. Furthermore, not all of the configurations described below are essential components of the present invention.

[0011] 1. Sample stage First, a sample stage according to an embodiment of the present invention will be described with reference to the drawings. FIGS. 1 and 2 are perspective views schematically showing a sample stage 100 according to an embodiment of the present invention. In FIGS. 1 and 2, the X-axis, Y-axis, and Z-axis are illustrated as three axes orthogonal to each other.

[0012] The sample stage 100 is a sample stage for an electron beam lithography apparatus. The electron beam lithography apparatus is an apparatus that irradiates an electron beam onto a sample to draw a pattern on the sample. The sample is, for example, a semiconductor substrate, a mask blank, or the like.

[0013] As shown in FIGS. 1 and 2, the sample stage 100 includes a base 10, an X guide rail 12 (first rail), an X table 20 (first table), a Y guide rail 22 (second rail), an X linear motion mechanism 30 (first linear motion mechanism), a connecting member 40, a Y table 50 (second table), a Y linear motion mechanism 60 (second linear motion mechanism), a linear guide 70 including an X feed guide rail 72 (third rail) and a carrier 74 (moving body), a feed member 80, and a sample table 90 (third table). In FIG. 2, the illustration of the sample table 90 is omitted.

[0014] The base 10 is a plate-like member. Three stages of tables are arranged on the base 10. The X table 20 is arranged on the upper stage of the base 10. The Y table 50 is arranged on the upper stage of the X table 20. The sample table 90 is arranged on the upper stage of the Y table 50.

[0015] The X guide rail 12 is provided on the base 10. The X guide rail 12 extends in the X direction (first direction). That is, the X guide rail 12 is provided along the X axis. The X guide rail 12 is, for example, a parallel arrangement of two bar-shaped rail members.

[0016] [[ID=一十九]] The X-table 20 moves along the X-guide rail 12. A carrier is attached to the underside of the X-table 20. The carrier is a moving body that engages with the X-guide rail 12 and slides along the X-guide rail 12. The carrier includes, for example, a plurality of metal balls and a holder that holds the plurality of metal balls, and the plurality of metal balls move along the X-guide rail 12 by circulating within the holder. The X-table 20 can move along the X-guide rail 12 as the carrier provided on the X-guide rail 12 moves along the X-guide rail 12.

[0017] The X guide rail 12 and the carrier moving along the X guide rail 12 constitute a linear guide that guides the linear motion of the X table 20 in the X direction. Commercially available linear guides such as Linear Way manufactured by Nippon Thompson Ltd. or LM Guide (registered trademark) manufactured by THK Corporation may be used as such linear guides. Alternatively, ball splines or linear bushings may be used as linear guides.

[0018] The X linear motion mechanism 30 causes the X table 20 to move linearly in the X direction. Linear motion in the X direction is linear motion along the X axis. The X linear motion mechanism 30 includes an X motor 32 and a ball screw 34.

[0019] The X motor 32 is mounted on the wall 101 that forms the sample chamber of the electron beam lithography apparatus. The X motor 32 is located outside the sample chamber. The ball screw 34 is introduced into the sample chamber through a hole in the wall 101.

[0020] The ball screw 34 includes a screw shaft 340 and a nut 342. The screw shaft 340 is fixed to the base 10. The screw shaft 340 is positioned along the X axis. The nut 342 moves along the screw shaft 340 as the screw shaft 340 rotates. In the X linear motion mechanism 30, the nut 342 moves linearly in the X direction by rotating the screw shaft 340 with the X motor 32. Note that the X linear motion mechanism 30 is not limited to a linear motion mechanism using the X motor 32 and the ball screw 34, and other known linear motion mechanisms may be used.

[0021] The connecting member 40 (joint) connects the X table 20 and the X linear motion mechanism 30. The connecting member 40 also connects the X table 20 to the nut 342. By connecting the X table 20 and the X linear motion mechanism 30 with the connecting member 40, the X linear motion mechanism 30 can move the X table 20 in a linear motion in the X direction.

[0022] The Y-guide rail 22 is provided on the X-table 20. The Y-guide rail 22 extends in the Y direction (second direction). That is, the Y-guide rail 22 is provided along the Y-axis. The Y-guide rail 22 is, for example, made up of two rod-shaped rail members arranged in parallel.

[0023] The Y-table 50 moves along the Y-guide rail 22. A carrier is attached to the underside of the Y-table 50. The carrier is a moving body that engages with the Y-guide rail 22 and slides along the Y-guide rail 22. The carrier includes, for example, a plurality of metal balls and a holder that holds the plurality of metal balls, and the plurality of metal balls move along the Y-guide rail 22 by circulating within the holder. As the carrier provided on the Y-guide rail 22 moves along the Y-guide rail 22, the Y-table 50 moves along the Y-guide rail 22. It can be moved along the path.

[0024] The Y guide rail 22 and the carrier moving along the Y guide rail 22 constitute a linear guide that guides the linear motion of the Y table 50 in the Y direction. The configuration of the linear guide that guides the linear motion of the Y table 50 is the same as, for example, the configuration of the linear guide that guides the linear motion of the X table 20.

[0025] The Y linear motion mechanism 60 moves the Y table 50 in a linear motion in the Y direction via the feed member 80. Linear motion in the Y direction is linear motion along the Y axis. The Y linear motion mechanism 60 includes a Y motor 62, a ball screw 64, a Y feed guide rail 66 (fourth rail), and a carrier 68.

[0026] The Y-motor 62 is mounted on the wall 101 that forms the sample chamber of the electron beam lithography apparatus. The Y-motor 62 is located outside the sample chamber. The ball screw 64 is introduced into the sample chamber through a hole in the wall 101.

[0027] The ball screw 64 includes a screw shaft 640 and a nut (not shown). The screw shaft 640 is mounted on the base 10. The screw shaft 640 is mounted along the Y axis. The nut moves along the screw shaft 640 as the screw shaft 640 rotates. In the Y linear motion mechanism 60, the nut moves linearly in the Y direction by rotating the screw shaft 640 with a Y motor 62.

[0028] The Y-feed guide rail 66 is provided on the base 10. The Y-feed guide rail 66 extends in the Y direction; that is, the Y-feed guide rail 66 is provided along the Y axis. The Y-feed guide rail 66 is, for example, a single rod-shaped rail member.

[0029] The carrier 68 moves along the Y-feed guide rail 66. The carrier 68 is engaged with the Y-feed guide rail 66 and slides along the Y-feed guide rail 66. The carrier 68 includes, for example, a plurality of metal balls and a cage that holds the plurality of metal balls, and the plurality of metal balls move along the Y-feed guide rail 66 by circulating within the cage.

[0030] The Y-feed guide rail 66 and the carrier 68 constitute a linear guide that guides the linear motion of the feed member 80 in the Y direction. The configuration of the linear guide that guides the linear motion of the feed member 80 is the same as the configuration of the linear guide that guides the linear motion of the X-table 20, except that the Y-feed guide rail 66 consists of a single rail member.

[0031] The Y linear motion mechanism 60 is not limited to a linear motion mechanism using a Y motor 62, a ball screw 64, a Y feed guide rail 66, and a carrier 68, but may use other known linear motion mechanisms.

[0032] The linear motion guide 70 guides the linear motion of the feed member 80 in the X direction. The linear motion guide 70 allows the feed member 80 to move in a straight line. The linear motion guide 70 includes an X-feed guide rail 72 and a carrier 74.

[0033] The X-feed guide rail 72 is provided on the Y-table 50. The X-feed guide rail 72 extends in the X direction. That is, the X-feed guide rail 72 is provided along the X-axis. The X-feed guide rail 72 is, for example, made up of two parallel rod-shaped rail members.

[0034] The carrier 74 moves along the X-feed guide rail 72. The carrier 74 moves along the X-feed guide rail 72. It is a moving body that engages with the guide rail 72 and slides along the X-feed guide rail 72. The carrier 74 includes, for example, a plurality of metal balls and a holder that holds the plurality of metal balls, and the plurality of metal balls move along the X-feed guide rail 72 by circulating within the holder.

[0035] The configuration of the linear motion guide 70 is, for example, the same as the configuration of the linear motion guide that guides the linear motion of the X table 20. However, the configuration of the linear motion guide 70 may differ from that of the linear motion guide that guides the linear motion of the X table 20. The linear motion guide 70 may be, for example, a smaller linear motion guide than the linear motion guide that guides the linear motion of the X table 20.

[0036] The feed member 80 is a member for moving the Y table 50. The Y linear motion mechanism 60 moves the Y table 50 linearly in the Y direction via the feed member 80. A carrier 74 of the linear motion guide 70 is attached to the feed member 80. The feed member 80 is connected to the Y table 50 via the linear motion guide 70. The feed member 80 includes a plate 82 and a support member 84.

[0037] One end of the plate 82 is connected to the support member 84, and the other end of the plate 82 is fitted with a carrier 74. The plate 82 is supported by the support member 84 and the carrier 74.

[0038] The support member 84 supports the plate 82. A carrier 68 is attached to the lower surface of the support member 84. Although not shown in the figures, the nuts of the support member 84 and the Y linear motion mechanism 60 are connected via a connecting member.

[0039] The linear motion of the feed member 80 in the X direction is guided by the linear guide 70. The linear motion of the feed member 80 in the Y direction is guided by a linear guide consisting of a Y feed guide rail 66 and a carrier 68. Therefore, in the sample stage 100, the Y table 50 can be moved straight in the X and Y directions, and the Y table 50, i.e., the sample table 90, can be precisely positioned.

[0040] The feed member 80 and the sample table 90 are separated. That is, the feed member 80 and the sample table 90 are not in contact. In the illustrated example, the Y table 50 is provided with two columnar sections 52 extending in the Z direction (third direction). An X-feed guide rail 72 is positioned between the two columnar sections 52. The sample table 90 is mounted on the two columnar sections 52. The plate 82 of the feed member 80 is housed in the space between the Y table 50 and the sample table 90. Therefore, the feed member 80 (plate 82) and the sample table 90 do not come into contact.

[0041] As will be described later, the feeding member 80 has a displacement absorbing part 822 that displaces in the Z direction in accordance with the Z direction displacement of the carrier 74. The sample table 90 is positioned at a height (position in the Z direction) such that the sample table 90 and the feeding member 80 do not come into contact even when the displacement absorbing part 822 is displaced in the Z direction.

[0042] The sample table 90 is provided on the Y-table 50. The sample table 90 is provided on the columnar portion 52. The sample is placed on the sample table 90. Although not shown in the figure, the sample table 90 may be provided with a chuck device for securing the sample.

[0043] Figure 3 is a schematic perspective view showing the plate 82 of the feed member 80.

[0044] As shown in Figure 3, the plate 82 comprises a base 820, a displacement absorption part 822, and a mounting part 8 Includes 24.

[0045] A support member 84 is attached to the base 820. The base 820 supports the displacement absorption section 822.

[0046] The displacement absorbing section 822 absorbs the displacement of the carrier 74 in the Z direction. The thickness T2 of the displacement absorbing section 822 is smaller than the thickness T0 of the base section 820. Therefore, the displacement absorbing section 822 can be elastically deformed in the Z direction. In other words, by reducing the thickness T2 of the displacement absorbing section 822, the displacement absorbing section 822 can be made to function as an elastic member.

[0047] The magnitude W of the displacement absorbing section 822 in the Y direction is greater than the magnitude of the displacement absorbing section 822 in the Z direction, i.e., the thickness T2. Therefore, the rigidity of the displacement absorbing section 822 in the Y direction can be increased. The magnitude W of the displacement absorbing section 822 in the Y direction is, for example, the same as the magnitude of the base section 820 in the Y direction.

[0048] A carrier 74 is attached to the mounting portion 824. The mounting portion 824 is connected to the base portion 820 via a displacement absorption portion 822. Therefore, the displacement of the carrier 74 in the Z direction can be absorbed by the displacement absorption portion 822. The thickness of the mounting portion 824 is, for example, equal to the thickness of the base portion 820.

[0049] In the example shown in FIG. 3, by changing the thickness of the plate 82, the base 820, the displacement absorbing portion 822, and the mounting portion 824 are formed. That is, the base 820, the displacement absorbing portion 822, and the mounting portion 824 are integrally configured.

[0050] 2. Operation of the sample stage FIGS. 4 to 7 are diagrams for explaining the operation of the sample stage 100. In FIGS. 4 to 7, illustration of the sample table 90 is omitted.

[0051] <Movement in the X direction> First, with the sample table 90 shown in FIG. 4 positioned at the origin (0, 0), the operation of the sample stage 100 when the X linear motion mechanism 30 is operated to move the sample table 90 in the +X direction as shown in FIG. 5 will be described.

[0052] When moving the sample table 90 in the +X direction, the X motor 32 is driven to rotate the screw shaft 340 and move the nut 342 in the +X direction. Since the nut 342 and the X table 20 are connected by the connecting member 40, the X table 20 moves in the +X direction along the X guide rail 12 due to the movement of the nut 342 in the +X direction.

[0053] As the X table 20 moves in the +X direction, the Y guide rail 22 pushes the carrier attached to the Y table 50 in the +X direction. As a result, the Y table 50 moves in the +X direction together with the X table 20. Consequently, the sample table 90 moves in the +X direction.

[0054] Here, the linear guide composed of the carrier attached to the X table 20 and the X guide rail 12 guides the linear motion of the X table 20 in the X direction. Further, the linear guide 70 composed of the carrier 74 and the X feed guide rail 72 guides the linear motion of the Y table 50 in the X direction. Therefore, the sample table 90 can be moved straight in the +X direction while maintaining the posture of the sample table 90.

[0055] From the state where the sample table 90 shown in FIG. 5 is located at (X, Y) = (Xmax, 0), As shown in FIG. 4, the operation of the sample stage 100 when moving the sample table 90 in the -X direction is the same as the operation of the sample stage 100 when moving the sample table 90 in the +X direction described above, except that the X motor 32 is rotated in the reverse direction.

[0056] <Movement in the Y direction> Next, with the sample table 90 shown in FIG. 4 located at the origin (0, 0), the operation of the sample stage 100 when operating the Y linear motion mechanism 60 to move the sample table 90 in the +Y direction as shown in FIG. 6 will be described.

[0057] When moving the sample table 90 in the +Y direction, the Y motor 62 is driven to rotate the screw shaft 640, and the nut is moved in the +Y direction. Since the nut is connected to the feed member 80, the feed member 80 moves in the +Y direction along the Y feed guide rail 66. When the feed member 80 moves in the +Y direction, the carrier 74 pushes the X feed guide rail 72 in the +Y direction. As a result, the Y table 50 moves in the +Y direction.

[0058] Here, the linear guide composed of the carrier attached to the Y table 50 and the Y guide rail 22 guides the linear motion of the Y table 50 in the Y direction. Therefore, the sample table 90 can be moved in the +Y direction while maintaining the posture of the sample table 90.

[0059] From the state where the sample table 90 shown in FIG. 6 is located at (X, Y) = (0, Ymax), as shown in FIG. 4, the operation of the sample stage 100 when moving the sample table 90 in the -Y direction is the same as the operation of the sample stage 100 when moving the sample table 90 in the +Y direction described above, except that the Y motor 62 is rotated in the reverse direction.

[0060] In the sample stage 100, the sample table 90 is moved in the X direction by the X linear motion mechanism 30, and the sample table 90 is moved in the Y direction via the feed member 80 by the Y linear motion mechanism 60, thereby allowing the sample table 90 to be precisely positioned at a desired location in the XY plane, as shown in Figures 4 to 7.

[0061] <Displacement absorption section> As described above, when the sample table 90 is moved in the Y direction, the carrier 74 pushes the X-feed guide rail 72 in the +Y direction. This allows the Y-table 50 to be moved in the Y direction. Thus, when the sample table 90 is moved in the Y direction, a force in the Y direction is applied to the X-feed guide rail 72.

[0062] Here, the carrier 74 is displaced vertically, i.e., in the Z direction, as the sample table 90 (Y table 50) moves, due to manufacturing errors of the parts that make up the sample stage 100. For example, if the X table 20 and Y table 50 are not arranged parallel to the base 10, the position of the carrier 74 in the Z direction changes according to the position of the sample table 90 in the XY plane.

[0063] If the rigidity of the plate 82 constituting the feed member 80 is high, even a displacement of the carrier 74 in the Z direction of a few micrometers will generate a force other than in the Y direction, such as a force in the Z direction, between the carrier 74 and the X feed guide rail 72.

[0064] In contrast, in the sample stage 100, since the displacement absorption section 822 of the plate 82 is an elastic member, the displacement absorption section 822 is displaced in the Z direction in accordance with the Z direction displacement of the carrier 74. Thus, in the sample stage 100, since the displacement absorption section 822 absorbs the Z direction displacement of the carrier 74, the force generated between the carrier 74 and the X-feed guide rail 72 due to the Z direction displacement of the carrier 74 can be reduced.

[0065] 3. Effects The sample stage 100 includes a base 10, an X guide rail 12 provided on the base 10 and extending in the X direction, an X table 20 that moves along the X guide rail 12, an X linear motion mechanism 30 that moves the X table 20 in a linear motion in the X direction, a Y guide rail 22 provided on the X table 20 and extending in the Y direction perpendicular to the X direction, a Y table 50 that moves along the Y guide rail 22, a linear motion guide 70 including an X feed guide rail 72 provided on the Y table 50 that extends in the X direction and a carrier 74 that moves along the X feed guide rail 72, a feed member 80 to which the carrier 74 is attached, a Y linear motion mechanism 60 that moves the Y table 50 in a linear motion in the Y direction via the feed member 80, and a sample table 90 provided on the Y table 50 on which the sample is placed. In addition, the sample stage 100 includes a displacement absorption section 822 that absorbs the Z direction displacement of the carrier 74.

[0066] Thus, since the sample stage 100 includes a displacement absorption section 822, it can absorb the displacement of the carrier 74 in the Z direction, and the force generated between the carrier 74 and the X-feed guide rail 72 due to the Z-direction displacement of the carrier 74 can be reduced. Therefore, the lifespan of the linear guide 70 can be extended.

[0067] Furthermore, in the sample stage 100, the force generated between the carrier 74 and the X-feed guide rail 72 due to the displacement of the carrier 74 in the Z-direction can be reduced, allowing the use of a small linear guide as the linear guide 70. This makes it possible to miniaturize the sample stage 100. By miniaturizing the sample stage 100, the sample chamber can be miniaturized, and the entire electron beam lithography system can be miniaturized.

[0068] Furthermore, in the sample stage 100, the force generated between the carrier 74 and the X-feed guide rail 72 due to the displacement of the carrier 74 in the Z-direction can be reduced, so a non-magnetic guide can be used as the linear guide 70. Non-magnetic guides have low strength because they are made of non-magnetic materials such as ceramics. In the sample stage 100, the force generated between the carrier 74 and the X-feed guide rail 72 due to the displacement of the carrier 74 in the Z-direction can be reduced, so even if a non-magnetic guide is used, the lifespan of the linear guide 70 can be extended.

[0069] Furthermore, in the sample stage 100, the displacement absorption unit 822 absorbs the Z-direction displacement of the carrier 74, thereby reducing vibrations of the sample table 90 and reducing vibrations of the sample placed on the sample table 90.

[0070] Furthermore, the sample stage 100 includes a Y-feed guide rail 66 extending in the Y direction, and the feed member 80 moves along the Y-feed guide rail 66. As described above, in the sample stage 100, when the Y-table 50 is moved in the Y direction by the Y-linear motion mechanism 60, forces other than those in the Y direction applied to the linear motion guide 70 can be reduced. In addition, the sample stage 100 can maintain the orientation of the sample table 90 by the X-guide rail 12 and the Y-guide rail 22. Therefore, yawing can be suppressed in the sample stage 100, and the sample can be positioned with high precision. Moreover, the feed member 80 and the Y-feed guide rail 66 do not require a mechanism to maintain the orientation of the sample table 90, allowing for a smaller device.

[0071] In the sample stage 100, the displacement absorbing section 822 is an elastic member. Therefore, the displacement absorbing section 822 can elastically deform in accordance with the displacement of the carrier 74 in the Z direction, and thus can absorb the displacement of the carrier 74 in the Z direction.

[0072] In the sample stage 100, the magnitude W of the displacement absorption section 822 in the Y direction is greater than the magnitude (thickness T2) of the displacement absorption section 822 in the Z direction. Therefore, in the displacement absorption section 822, This allows for high rigidity. Therefore, in the sample stage 100, when the Y linear motion mechanism 60 moves the Y table 50 in the Y direction via the feed member 80, the deflection of the feed member 80 can be reduced, and the positioning accuracy in the Y direction can be improved.

[0073] In the sample stage 100, the sample table 90 and the feed member 80 are separated. Therefore, in the sample stage 100, even if the carrier 74 is displaced in the Z direction and the displacement absorption section 822 deforms, the sample table 90 is not affected by the deformation of the displacement absorption section 822.

[0074] 4. Variations 4.1. First Variation Figure 8 is a schematic perspective view showing the plate 82 of the feed member 80 according to the first modified example.

[0075] In the first modified example of the feed member 80, the displacement absorbing part 822 is a leaf spring that elastically deforms in the Z direction. The leaf spring constituting the displacement absorbing part 822 is attached to the base 820. The material of the base 820 and the material of the displacement absorbing part 822 are, for example, different. An attachment part 824 to which the carrier 74 is fixed is attached to the tip of the displacement absorbing part 822. That is, the base 820 and the attachment part 824 are connected via the displacement absorbing part 822 (leaf spring).

[0076] The first modified feeding member 80, like the feeding member 80 shown in Figure 3 described above, has a displacement absorption section 822 that can absorb the displacement of the carrier 74 in the Z direction and has high rigidity in the Y direction.

[0077] 4.2. Second Variation Figure 9 is a schematic perspective view showing the plate 82 of the feed member 80 according to the second modified example.

[0078] In the second modified example of the feed member 80, the displacement absorbing section 822 includes a leaf spring 822a and a rotating member 822b.

[0079] The leaf spring 822a is attached to the base 820. A rotating member 822b is attached to the tip of the leaf spring 822a via a rotating shaft 822c. The rotating member 822b rotates around the rotating shaft 822c in accordance with the displacement of the carrier 74 in the Z direction.

[0080] Since the displacement absorbing section 822 includes a leaf spring 822a and a rotating member 822b, it can be displaced with less force in conjunction with the Z-direction displacement of the carrier 74 compared to, for example, the feed member 80 shown in Figure 3 above. Therefore, in the feed member 80 according to the second modified example, the displacement absorbing section 822 can absorb the Z-direction displacement of the carrier 74 more effectively and have higher rigidity in the Y-direction.

[0081] 4.3. Third Variation Figure 10 is a schematic perspective view showing the plate 82 of the feed member 80 according to the third modified example.

[0082] In the third modified example of the feed member 80, the displacement absorbing section 822 includes a rotating member 823d connected to the base 820 via a first rotating shaft 823a and a second rotating shaft 823c, and a holding section 823b that holds the first rotating shaft 823a and the second rotating shaft 823c.

[0083] The base 820 and the holding portion 823b are connected via a first rotation axis 823a. The rotating member 823d and the holding portion 823b are connected via a second rotation axis 823c. In this way, the rotating member 823d is displaced in accordance with the Z-direction displacement of the carrier 74 by a link including the two rotation axes.

[0084] Furthermore, the link configuration that displaces the rotating member 823d in accordance with the Z-direction displacement of the carrier 74 is not limited to the link including the two rotation axes shown in Figure 10.

[0085] The third modified feeding member 80, like the feeding member 80 shown in Figure 3 described above, has a displacement absorption section 822 that can absorb the displacement of the carrier 74 in the Z direction and has high rigidity in the Y direction.

[0086] 5. Electron beam lithography system Next, an electron beam lithography apparatus according to one embodiment of the present invention will be described with reference to the drawings. Figure 11 is a diagram showing the configuration of an electron beam lithography apparatus 1000 according to one embodiment of the present invention.

[0087] The electron beam lithography apparatus 1000 includes a sample stage 100, as shown in Figure 11. The electron beam lithography apparatus 1000 further includes an optical system 2 for irradiating a sample S held on the sample stage 100 with an electron beam.

[0088] The electron beam lithography apparatus 1000 is a device that irradiates a sample S with an electron beam to draw a pattern on the sample S. The electron beam lithography apparatus 1000 draws fine patterns, such as semiconductor integrated circuit patterns, on substrates such as semiconductor substrates or mask blanks. Here, the sample S is, for example, a substrate such as a semiconductor substrate or a mask blank.

[0089] The optical system 2 includes an electron gun 102, a blanker 104, an illumination lens 106, a first slit 108, a shaping deflector 110, a shaping lens 112, a second slit 114, a reduction lens 116, an objective lens 118, and a positioning deflector 120.

[0090] The electron gun 102 emits an electron beam. The blanker 104 deflects the electron beam emitted from the electron gun 102 to adjust the time it takes for the electron beam to pass through the first slit 108. In other words, the blanker 104 can adjust the amount of electron beam irradiated onto the sample S. The electron beam that has passed through the blanker 104 is irradiated onto the first slit 108 via the irradiation lens 106.

[0091] The first slit 108, the shaping deflector 110, the shaping lens 112, and the second slit 114 shape the electron beam. The image formed when the electron beam passes through the first slit 108 is imaged onto the second slit 114 by the shaping lens 112. At this time, the position of the image formed in the first slit 108 on the second slit 114 can be changed by deflecting the electron beam with the shaping deflector 110. This allows the electron beam to be shaped. In the shaping deflector 110, the electron beam can be shaped into any shape by controlling the deflection direction and amount of the electron beam.

[0092] The reduction lens 116 reduces the image formed by the first slit 108, the shaping deflector 110, the shaping lens 112, and the second slit 114. The objective lens 118 focuses the image reduced by the reduction lens 116 onto the sample S. The positioning deflector 120 deflects the electron beam that has passed through the objective lens 118. This allows the irradiation position of the electron beam onto the sample S to be changed. In other words, the positioning deflector 120 can determine the position of the image formed by the first slit 108, etc., on the sample S.

[0093] The sample stage 100 holds the sample S. The sample stage 100 is located in the sample chamber 4 of the electron beam lithography apparatus 1000.

[0094] In the electron beam lithography apparatus 1000, the electron beam is shaped by the first slit 108, the shaping deflector 110, the shaping lens 112, and the second slit 114, allowing control of the cross-sectional shape of the electron beam irradiated onto the sample S, i.e., the shot shape and shot size. Furthermore, the blanker 104 allows control of the time the electron beam irradiates the sample S, i.e., the shot time. In addition, the positioning deflector 120 allows control of the position of the electron beam irradiated onto the sample S, i.e., the shot position. Moreover, by synchronizing the irradiation of the electron beam with the movement of the sample stage 100, a desired pattern can be drawn on the sample S.

[0095] In addition, the above description refers to an electron beam lithography apparatus using a variable-shape beam method, which shapes the cross-sectional shape of the electron beam and irradiates the sample S with it. However, the electron beam exposure apparatus may also be a spot beam type electron beam lithography apparatus that focuses the electron beam in the optical system 2 and deflects the focused electron beam to draw a pattern on the sample S.

[0096] Furthermore, although the above describes the case in which the sample stage 100 is used in an electron beam lithography system, the sample stage 100 may also be used in charged particle beam systems other than electron beam lithography systems. For example, the sample stage 100 may be used as a sample stage for a scanning electron microscope, or as a sample stage for a semiconductor inspection system that inspects semiconductor wafers, etc., using an electron microscope. In addition, the sample stage 100 may be used as a sample stage for a charged particle beam system equipped with an optical system that irradiates a sample with a charged particle beam other than an electron beam (such as an ion beam).

[0097] The embodiments and modifications described above are merely examples and are not limiting. For example, each embodiment and each modification can be combined as appropriate.

[0098] The present invention is not limited to the embodiments described above, and various further modifications are possible. For example, the present invention includes configurations that are substantially identical to those described in the embodiments. A substantially identical configuration is, for example, a configuration that has the same function, method, and result, or a configuration that has the same purpose and effect. The present invention also includes configurations in which non-essential parts of the configuration described in the embodiments are replaced. Furthermore, the present invention includes configurations that produce the same effects or achieve the same purpose as the configuration described in the embodiments. Furthermore, the present invention includes configurations that add known technology to the configuration described in the embodiments. [Explanation of Symbols]

[0099] 2…Optical system, 4…Sample chamber, 10…Base, 12…X guide rail, 20…X table, 22…Y guide rail, 30…X linear motion mechanism, 32…X motor, 34…Ball screw, 40…Connecting member, 50…Y table, 52…Columnar part, 60…Y linear motion mechanism, 62…Y motor, 64…Ball screw, 66…Y feed guide rail, 68…Carrier, 70…Linear guide, 72…X feed guide rail, 74…Carrier, 80…Feeding member, 82…Plate, 84…Support member, 90…Sample table, 100…Sample stage, 101…Wall, 10 2…Electron gun, 104…Blanker, 106…Irradiation lens, 108…First slit, 110…Shaping deflector, 112…Shaping lens, 114…Second slit, 116…Reduction lens, 118…Objective lens, 120…Positioning deflector, 340…Screw shaft, 342…Nut, 640…Screw shaft, 820…Base, 822…Displacement absorption part, 822a…Leaf spring, 822b…Rotating member, 822c…Rotating shaft, 823a…First rotating shaft, 823b…Holding part, 823c…Second rotating shaft, 823d…Rotating member, 824…Mounting part, 1000…Electron beam lithography device

Claims

1. Bass and, A first rail is provided on the base and extends in the first direction, A first table that moves along the first rail, A first linear motion mechanism that moves the first table in a linear motion in the first direction, A second rail is provided on the first table and extends in a second direction perpendicular to the first direction, A second table that moves along the second rail, A linear guide including a third rail extending in the first direction provided on the second table, and a movable body that moves along the third rail, The feed member to which the aforementioned moving body is attached, A second linear motion mechanism that moves the second table linearly in the second direction via the feed member, A third table is provided on the second table on which the sample is placed, Includes, The feed member includes a displacement absorbing section that absorbs the displacement of the moving body in a third direction perpendicular to the first and second directions, in a sample stage.

2. In claim 1, The displacement absorbing section is a sample stage, which is an elastic member.

3. In claim 1, The displacement absorption section includes a sample stage that rotates in accordance with the displacement of the moving body in the third direction.

4. In claim 1, The displacement absorbing section is Elastic member and A rotating member that rotates in accordance with the displacement of the moving body in the third direction, A sample stage, including the sample stage.

5. In claim 1, A sample stage in which the size of the displacement absorption portion in the second direction is larger than the size of the displacement absorption portion in the third direction.

6. In claim 1, Including a fourth rail extending in the second direction, The feeding member is a sample stage that moves along the fourth rail.

7. In claim 1, The sample stage is separated from the third table and the feed member.

8. A charged particle beam apparatus comprising a sample stage according to any one of claims 1 to 7.

9. In claim 8, A charged particle beam apparatus including an optical system for irradiating a sample held on the sample stage with a charged particle beam.

10. In claim 8, A charged particle beam apparatus including an optical system for drawing a pattern on a sample held on the sample stage with an electron beam.