Electronic device including coil antenna

Abstract

An electronic device according to various embodiments of the present disclosure may include a housing, a first circuit board disposed in the housing, a flexible circuit board electrically connecting the first circuit board, a coil antenna disposed inside the housing and including a plurality of antennas each having a conductive pattern formed to generate a magnetic field, a shielding layer disposed under a first antenna of the plurality of antennas, and a metal shield disposed on a side of the coil antenna and shielding a magnetic field in a first direction by the coil antenna.

Description

Technical Field

[0001] Various embodiments of the present disclosure relate to an electronic device including a coil antenna.

Background Art

[0002] Electronic devices (e.g., mobile terminals) have been miniaturized and multifunctionalized. For this purpose, a printed circuit board (e.g., PCB (printed circuit board), PBA (printed board assembly), and / or FPCB (flexible printed circuit board)) on which various electronic components (e.g., a processor, a memory, a camera, a broadcast receiving module, and / or a communication module) are arranged can be applied to the electronic device. The printed circuit board can include circuit wirings that connect the arranged electronic components.

[0003] In order to increase the usage time of an electronic device, it is necessary to increase the capacity of the battery. When a printed circuit board is separately formed in an electronic device, it may be difficult to secure space for expanding the capacity of the battery. In order to increase the battery capacity of an electronic device, it is necessary to reduce the thickness of the printed circuit board and secure a battery expansion space.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Coil antennas such as NFC (near-field communication), WPC (wireless power consortium), and / or MST (magnetic secure transmission) may be applied to electronic devices. Since a shielding layer (e.g., a shielding sheet) is required to shield the magnetic field generated by the coil antenna, the thickness increases and the space available for placing a battery (e.g., battery space) decreases. In the electronic devices according to the embodiments of this disclosure, when an antenna coil (e.g., NFC, WPC, and / or MST) is applied, the magnetic field in the -Z axis direction can be shielded, the thickness can be reduced, and battery space can be secured. Furthermore, in the electronic devices according to the embodiments of this disclosure, the magnetic field in the -Z axis direction can be shielded while reducing the area of ​​the shielding layer, and the area of ​​the WPC can be increased to improve the recognition area and charging efficiency of wireless charging.

[0005] The technical challenges that this disclosure seeks to address are not limited to those mentioned above, and other technical challenges not mentioned can be clearly understood by a person with ordinary skill in the art to which this disclosure pertains from the following description. [Means for solving the problem]

[0006] Electronic devices according to various embodiments of the present disclosure may include a housing, a first circuit board disposed in the housing, a flexible circuit board electrically connecting the first circuit board, a coil antenna disposed inside the housing and including a plurality of antennas having conductive patterns formed to generate a magnetic field, a shielding layer disposed below the first antenna among the plurality of antennas, and a metal shield disposed on the side of the coil antenna and shielding the magnetic field in a first direction of the magnetic field caused by the coil antenna.

[0007] Electronic devices according to various embodiments of the present disclosure may include a first housing, a second housing, a hinge structure positioned between the first and second housings such that the first and second housings are folded or unfolded, a first printed circuit board positioned in the first housing, a second printed circuit board positioned in the second housing, a flexible circuit board electrically connecting the first and second printed circuit boards, a coil antenna positioned inside the second housing and including a plurality of antennas having conductive patterns formed to generate a magnetic field, a shielding layer positioned below the first antenna among the plurality of antennas, and a metal shield positioned on the side of the coil antenna to shield the magnetic field in a first direction of the magnetic field caused by the coil antenna. Various other effects may be provided, which may be directly or indirectly understood by this document. [Effects of the Invention]

[0008] The electronic device according to the embodiments of this disclosure can shield the magnetic field in the -Z axis direction generated by the antenna coil (e.g., NFC, WPC, and / or MST), reduce thickness, and secure battery space. The electronic device according to the embodiments of this disclosure can shield the magnetic field in the -Z axis direction generated by the antenna coil (e.g., NFC, WPC, and / or MST) while reducing the area of ​​the shielding layer, and can increase the area of ​​the WPC to improve the recognition area and charging efficiency of wireless charging. [Brief explanation of the drawing]

[0009] [Figure 1] This is a block diagram of electronic devices in a network environment according to various embodiments. [Figure 2A] This is a front perspective view of an electronic device according to various embodiments of the present disclosure. [Figure 2B] This is a rear perspective view of an electronic device according to various embodiments of the present disclosure. [Figure 3A] This is a diagram showing a foldable electronic device in a folded state according to one embodiment, and is a perspective view of the foldable electronic device. [Figure 3B] This figure shows a foldable electronic device in a folded state according to one embodiment, and is a front view of the foldable electronic device. [Figure 3C] This figure shows a foldable electronic device in a folded state according to one embodiment, and is a rear view of the foldable electronic device. [Figure 4A] This is a diagram showing a foldable electronic device in a 180-degree unfolded state according to one embodiment, and is a perspective view of the foldable electronic device. [Figure 4B] This figure shows a foldable electronic device in a 180-degree unfolded state according to one embodiment, and is a front view of the foldable electronic device. [Figure 4C] This figure shows a foldable electronic device in a 180-degree unfolded state according to one embodiment, and is a rear view of the foldable electronic device. [Figure 5A] This figure shows a coil antenna and a flexible circuit board arranged in the housing of an electronic device according to various embodiments of the present disclosure. [Figure 5B] This figure shows that the NFC driver circuit, WPC driver circuit, and MST driver circuit are arranged on the PCB. [Figure 6] This is a cross-sectional view taken along the line I-I' shown in Figure 5A. [Figure 7A] This figure shows a comparison of the arrangement structure of a coil antenna, a flexible circuit board, and a shielding layer according to one embodiment. [Figure 7B] This figure shows a comparison of the arrangement structure of a coil antenna, a flexible circuit board, and a shielding layer according to one embodiment. [Figure 7C] This figure shows a comparison of the arrangement structure of a coil antenna, a flexible circuit board, and a shielding layer according to one embodiment. [Figure 8] This figure shows the form of the magnetic field generated by a coil antenna due to the arrangement of a shielding layer according to one embodiment of the present disclosure. [Figure 9] This figure shows the form of the magnetic field generated by a coil antenna due to the arrangement of a shielding layer according to one embodiment of the present disclosure. [Figure 10]A diagram showing the form of the magnetic field generated by a coil antenna due to the arrangement of a shielding layer according to an embodiment of the present disclosure. [Figure 11] A diagram showing that a metal shield (e.g., front metal) according to an embodiment of the present disclosure is arranged to surround a shielding region. [Figure 12] A diagram showing an example of the distance between a metal shield (e.g., front metal) and a shielding region. [Figure 13] A diagram showing the form of the magnetic field when a metal shield (e.g., front metal) is formed of a paramagnetic material. [Figure 14] A diagram showing the form of the magnetic field when a metal shield (e.g., front metal) is formed of a diamagnetic material. [Figure 15] A diagram showing the form of the magnetic field when a metal shield (e.g., front metal) is formed of a ferromagnetic material.

Embodiments for Carrying Out the Invention

[0010] In the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0011] Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. For convenience of explanation, the components shown in the drawings may be exaggerated or reduced in size, and the present disclosure is not necessarily limited by the figures.

[0012] FIG. 1 is a block diagram of an electronic device 101 within a network environment 100 according to various embodiments.

[0013] Referring to Figure 1, in a network environment 100, electronic device 101 can communicate with electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or with electronic device 104 or server 108 through a second network 199 (e.g., a long-range wireless communication network). In one embodiment, electronic device 101 can communicate with electronic device 104 through server 108. In one embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, acoustic output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptics module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197. In one embodiment, electronic device 101 may omit at least one of these components (e.g., connection terminal 178) or may have one or more other components added. In one embodiment, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0014] The processor 120 can, for example, execute software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120, and can perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 can store instructions or data received from other components (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the instructions or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to one embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit or application processor) or an auxiliary processor 123 (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor (CP)) that can operate independently or together with it. For example, if the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be configured to specialize in a predetermined function. The auxiliary processor 123 may be implemented separately from or as part of the main processor 121.

[0015] The auxiliary processor 123 can, for example, control at least a portion of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) on behalf of the main processor 121 when the main processor 121 is inactive (e.g., sleep), or together with the main processor 121 when the main processor 121 is active (e.g., application execution). According to one embodiment, the auxiliary processor 123 (e.g., image signal processor or CP) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190).

[0016] According to one embodiment, the auxiliary processor 123 (e.g., neural processing unit) may include hardware structures specialized for processing artificial intelligence models. The artificial intelligence model can be generated by machine learning. Such learning may be performed, for example, on the electronic device 101 on which the artificial intelligence is performed, or on a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be, but is not limited to, a deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted Boltzmann machine (RBM), deep belief network (DBN), bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above. In addition to hardware structures, artificial intelligence models may also include software structures, either additionally or alternatively.

[0017] Memory 130 can store various data used by at least one component of the electronic device 101 (e.g., processor 120 or sensor module 176). The data may include, for example, software (e.g., program 140) and input or output data for associated instructions. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0018] The program 140 can be stored as software in memory 130 and may include, for example, an operating system 142, middleware 144, or an application 146.

[0019] The input module 150 can receive instructions or data used by components of the electronic device 101 (e.g., processor 120) from outside the electronic device 101 (e.g., user). The input module 150 may include, for example, a microphone, mouse, keyboard, or digital pen (e.g., stylus pen).

[0020] The acoustic output module 155 can output an acoustic signal to the outside of the electronic device 101. The acoustic output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording and playback, and the receiver can be used to receive incoming phone calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

[0021] The display module 160 can visually provide information to an external party (e.g., a user) outside of the electronic device 101. The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to sense touches or a pressure sensor configured to measure the intensity of the force generated by a touch.

[0022] The audio module 170 can convert sound into electrical signals, or conversely, convert electrical signals into sound. In one embodiment, the audio module 170 can acquire sound via the input module 150, or output sound via the sound output device 155, or via an external electronic device (e.g., electronic device 102) (e.g., speaker or headphones) directly or wirelessly connected to the electronic device 101.

[0023] The sensor module 176 can sense the operating state of the electronic device 101 (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the sensed state. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0024] Interface 177 can support at least one predetermined protocol that can be used for the electronic device 101 to connect directly or wirelessly to an external electronic device (e.g., electronic device 102). According to one embodiment, interface 177 may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, or an audio interface.

[0025] The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0026] The haptics module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that can be perceived by the user through touch or kinesthetic sense. According to one embodiment, the haptics module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0027] The camera module 180 can capture still images and videos. According to one embodiment, the camera module 180 may include at least one lens, an image sensor, an image signal processor, or a flash.

[0028] The power management module 188 can manage the power supplied to the electronic device 101. According to one embodiment, the power management module 188 can be implemented, for example, as at least part of a PMIC (power management integrated circuit).

[0029] The battery 189 can supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0030] The communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and communication over the established communication channel. The communication module 190 operates independently of the processor 120 (e.g., application processor) and may include at least one CP that supports direct (e.g., wired) or wireless communication. According to one embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module 194 (e.g., a LAN (local area network) communication module, or a power line communication module). The relevant communication module can communicate with the external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented in multiple different components (e.g., multiple chips). The wireless communication module 192 can verify or authenticate the electronic device 101 within a communication network such as the first network 198 or the second network 199 using subscriber information (e.g., International Mobile Subscriber Identification Number (IMSI)) stored in the subscriber identification module 196.

[0031] The wireless communication module 192 can support 5G networks and next-generation communication technologies beyond 4G networks, such as NR connection technology (new radio access technology). NR connection technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of a large number of terminals (mMTC (massive machine type communications)), or ultra-reliable and low-latency communications (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 can support high-frequency bands (e.g., mmWave bands) to achieve high data transmission rates. The wireless communication module 192 can support various technologies to ensure performance in high-frequency bands, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or large-scale antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, external electronic devices (e.g., electronic device 104), or network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 can support a peak data rate for eMBB implementation (e.g., 20 Gbps or more), loss coverage for mMTC implementation (e.g., 164 dB or less), or U-plane latency for URLLC implementation (e.g., downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip of 1 ms or less).

[0032] The antenna module 197 can transmit or receive signals or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module may include an antenna comprising a radiator consisting of a conductor or conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network such as a first network 198 or a second network 199 may be selected from the plurality of antennas, for example, by the communication module 190. Signals or power may be transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. According to one embodiment, other components (e.g., an RFIC (radio frequency integrated circuit)) may be additionally formed as part of the antenna module 197 in addition to the radiator.

[0033] According to various embodiments, the antenna module 197 can form a millimeter-wave (mmWave) antenna module. According to one embodiment, the millimeter-wave (mmWave) antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a predetermined high-frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top or side surface) of the printed circuit board and capable of transmitting or receiving signals in the predetermined high-frequency band.

[0034] At least some of the above components are connected to each other by a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and can exchange signals (e.g., instructions or data) with each other.

[0035] According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and an external electronic device 104 via a server 108 connected to a second network 199. Electronic devices 102 or 104 may be the same type of device as electronic device 101 or different types of devices. According to one embodiment, all or part of the operation performed by electronic device 101 may be performed by one or more external electronic devices 102, 104, or 108. For example, if electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, electronic device 101 may, instead of performing the function or service autonomously, or additionally, request one or more external electronic devices to perform at least part of that function or service. At least one or more external electronic devices that receive the request may perform at least part of the requested function or service, or additional functions or services associated with the request, and transmit the results of the execution to electronic device 101. Electronic device 101 may process the results as they are or additionally and provide them as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies may be used. The electronic device 101 can provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In other embodiments, the external electronic device 104 may include IoT (Internet of Things) devices. The server 108 may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device 104 or the server 108 may be included within the second network 199. The electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0036] Figure 2A is a front perspective view of an electronic device according to various embodiments of the present disclosure. Figure 2B is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0037] Referring to Figures 2A and 2B, an electronic device 200 according to one embodiment (e.g., electronic device 101 in Figure 1) may include a housing 210 that includes a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C that encloses the space between the first surface 210A and the second surface 210B. In other embodiments (not shown), the housing may also show a structure that forms part of the first surface 210A, the second surface 210B, and the side surface 210C.

[0038] According to one embodiment, the first surface 210A may be formed by a front plate 202 that is at least partially substantially transparent (e.g., a glass plate or polymer plate including various coating layers). The second surface 210B may be formed by a substantially opaque rear plate 211. The rear plate 211 may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 210C may be formed by a side bezel structure 218 (or “side member”) that is coupled with the front plate 202 and the rear plate 211 and includes metal and / or polymer. In one embodiment, the rear plate 211 and the side bezel structure 218 may be integrally formed and include the same material (e.g., a metallic material such as aluminum).

[0039] In the illustrated embodiment, the front plate 202 may include two first regions 210D that curve seamlessly from the first surface 210A toward the rear plate 211, at both ends of the long edge of the front plate 202. Figure 2B(See reference) The rear plate 211 may include two second regions 210E at both ends of a long edge that curve seamlessly from the second surface 210B toward the front plate 202. In some embodiments, the front plate 202 (or the rear plate 211) may include only one of the first region 210D (or the second region 210E). In some embodiments, a portion of the first region 210D or the second region 210E may not be included. In the above embodiments, when viewed from the side of the electronic device 200, the side bezel structure 218 may have a first thickness (or width) on the side that does not include the first region 210D or the second region 210E as described above, and a second thickness that is thinner than the first thickness on the side that includes the first region 210D or the second region 210E.

[0040] According to one embodiment, the electronic device 200 may include at least one of the following: a display 201 (e.g., display module 160 in Figure 1), an input device 203 (e.g., input module 150 in Figure 1), sound output devices 207, 214 (e.g., sound output module 155 in Figure 1), sensor modules 204, 219 (e.g., sensor module 176 in Figure 1), camera modules 205, 212, 213 (e.g., camera module 180 in Figure 1), a key input device 217, an indicator (not shown), and connectors 208, 209. In one embodiment, the electronic device 200 may omit at least one of its components (e.g., a key input device 217, or an indicator) or may include additional components.

[0041] The display 201 (e.g., display module 160 in Figure 1) may be visible, for example, through the upper portion of the front plate 202. In some embodiments, at least a portion of the display 201 may be visible through the front plate 202 forming the first surface 210A and the first region 210D of the side surface 210C. The display 201 may be coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the strength (pressure) of a touch, and / or a digitizer for detecting an electromagnetic stylus pen. In some embodiments, at least a portion of the sensor modules 204, 219 and / or at least a portion of the key input device 217 may be located in the first region 210D and / or the second region 210E.

[0042] In one embodiment (not shown), the back of the screen display area of ​​the display 201 may include at least one of the following: an audio module 214, a sensor module 204, a camera module 205 (e.g., an image sensor), and a fingerprint sensor. In one embodiment (not shown), the display 201 may be coupled to, or adjacent to, a touch sensing circuit, a pressure sensor capable of measuring the strength (pressure) of a touch, and / or a digitizer for detecting an electromagnetic stylus pen. In one embodiment, at least some of the sensor modules 204, 219, and / or at least some of the key input device 217 may be arranged in the first region 210D and / or the second region 210E.

[0043] The input device 203 may include a microphone. In some embodiments, the input device 203 may include multiple microphones arranged to sense the direction of sound. The acoustic output devices 207, 214 may mean speakers 207, 214. Speakers 207, 214 may include an external speaker 207 and a call receiver (e.g., audio module 214). In some embodiments, the input device 203 (e.g., microphone), speakers 207, 214 and connectors 208, 209 are located in the above space of the electronic device 200 and may be exposed to the external environment through at least one hole formed in the housing 210. In some embodiments, the hole formed in the housing 210 may be used jointly for the input device 203 (e.g., microphone) and speakers 207, 214. In some embodiments, speakers 207, 214 may include speakers (e.g., piezo speakers) that operate while the hole formed in the housing 210 remains elimination.

[0044] Sensor modules 204, 219 (e.g., sensor module 176 in Figure 1) can generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device 200 or the external environmental state. Sensor modules 204, 219 may include, for example, a first sensor module 204 (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) located on the first surface 210A of the housing 210, and / or a third sensor module 219 (e.g., HRM sensor) located on the second surface 210B of the housing 210. The fingerprint sensor may also be located on the first surface 210A (e.g., display 201) and / or the second surface 210B of the housing 210. The electronic device 200 may further include at least one of the following sensor modules (not shown): a gesture sensor, a gyroscope, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0045] The camera modules 205, 212 may include a first camera module 205 located on a first surface 210A of the electronic device 200, a second camera module 212 located on a second surface 210B, and / or a flash 213. The camera modules 205, 212 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 may include, for example, a light-emitting diode or a xenon lamp. The first camera module 205 may be located below the display panel in an under-display camera (UDC) configuration. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and an image sensor may be located on one surface of the electronic device 200. In some embodiments, multiple first camera modules 205 may be located on the first surface of the electronic device 200 (e.g., the surface on which the screen is displayed) in an under-display camera (UDC) configuration.

[0046] The key input device 217 may be located on the side 210C of the housing 210. In other embodiments, the electronic device 200 may not include some or all of the key input devices 217 mentioned above, and the not included key input devices 217 may be implemented on the display 201 in the form of soft keys or touch keys. In one embodiment, the key input device 217 may be implemented using a pressure sensor included in the display 201.

[0047] The indicator may be located, for example, on the first surface 210A of the housing 210. The indicator can provide, for example, status information of the electronic device 200 in the form of light. In other embodiments, the indicator can provide, for example, a light source that is synchronized with the operation of the camera module 205. The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0048] Connectors 208 and 209 may include a first connector opening 208 capable of accommodating a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and a second connector opening 209 (or earphone jack) capable of accommodating a connector for transmitting and receiving audio signals with an external electronic device.

[0049] Some camera modules 205, 212, some sensor modules 204, 219, or indicators may be positioned so as to be visible through the display 201. Camera modules 205 may be positioned to overlap with the display area, and the screen may also be displayed in the display area corresponding to camera modules 205. Some sensor modules 204 may be positioned to perform their functions within the internal space of the electronic device without being visually exposed through the front plate 202.

[0050] Figures 3A to 3C show a foldable electronic device in a folded state according to one embodiment, where Figure 3A is a perspective view, Figure 3B is a front view, and Figure 3C is a rear view. Figures 4A to 4C show a foldable electronic device in a 180-degree unfolded state according to one embodiment, where Figure 4A is a perspective view, Figure 4B is a front view, and Figure 4C is a rear view.

[0051] Referring to Figures 3A to 4C, an electronic device 101 according to one embodiment (e.g., the electronic device 101 in Figure 1) may include a foldable housing 310 (or “housing”) including a first housing 311 and a second housing 312, a flexible display 320, a hinge assembly 300, and a cover 330 (or “rear cover”). According to one embodiment, the cover 330 may include a first cover 301 included in the first housing 311 and a second cover 302 included in the second housing 312.

[0052] According to one embodiment, the first housing 311 and the second housing 312 can form a space in which electronic components of the electronic device 101 (e.g., printed circuit board, battery, and / or processor) can be arranged, and can form the sides of the electronic device 101. As an example, various types of components for performing various functions of the electronic device 101 can be arranged inside the first housing 311 and the second housing 312. For example, electronic components such as a front camera, receiver, and / or sensor (e.g., proximity sensor) can be arranged inside the first housing 311 and the second housing 312.

[0053] For example, the first housing 311 and the second housing 312 may be positioned side by side when the electronic device 101 is in an unfolded state. As another example, when the electronic device 101 is in a folded state, the first housing 311 may rotate (or be rotated) with respect to the second housing 312 so that one side of the first housing 311 and one side of the second housing 312 face each other.

[0054] According to one embodiment, the first housing 311 and the second housing 312 can form a recess for housing a flexible display 320, and the flexible display 320 can be mounted in the recess and supported by the first housing 311 and the second housing 312. The first housing 311 and the second housing 312 may be formed of a metallic and / or non-metallic material having a predetermined rigidity to support the flexible display 320.

[0055] According to one embodiment, the flexible display 320 is arranged on the first housing 311 and the second housing 312 and can form the front of the electronic device 101 when the electronic device 101 is deployed. That is, the flexible display 320 may be arranged extending from one area of ​​the first housing 311 across the hinge assembly 300 to at least one area of ​​the second housing 312. According to one embodiment, the flexible display 320 may be mounted in a recess formed by the first housing 311 and the second housing 312 and arranged on the first housing 311 and the second housing 312.

[0056] As an example, the flexible display 320 may include a first region 320a corresponding to at least one region of the first housing 311, a second region 320b corresponding to at least one region of the second housing 312, and a folding region 320c located between the first region 320a and the second region 320b and having flexible properties. However, the embodiment is not limited to those described above, and depending on the embodiment, the first region 320a, the second region 320b, and the folding region 320c of the flexible display 320 may all be formed to have flexible properties.

[0057] In one embodiment, the first region 320a, the folding region 320c, and the second region 320b may be arranged side by side facing the same direction when the electronic device 101 is in an unfolded state.

[0058] In contrast, when the electronic device 101 is folded, the folding region 320c may be bent so that the first region 320a and the second region 320b face each other.

[0059] According to one embodiment, at least one region of the flexible display 320 (e.g., a first region 320a, a second region 320b) can be attached to one surface of the first housing 311 and one surface of the second housing 312.

[0060] In other embodiments, the flexible display 320 may be attached to one surface of the first housing 311 and one surface of the second housing 312.

[0061] According to one embodiment, the hinge assembly 300 connects the first housing 311 and the second housing 312, and can rotate the second housing 312 within a predetermined range of rotation with respect to the first housing 311, or conversely, rotate the first housing 311 within a predetermined range of rotation with respect to the second housing 312.

[0062] As an example, a recess may be formed in the region where the first housing 311 and the second housing 312 are connected, and the hinge assembly 300 may be positioned between the first housing 311 and the second housing 312. The recess described above may be formed in the shape of a groove with a predetermined curvature, for example, but is not limited to this.

[0063] In one embodiment, a hinge housing 300c is positioned between a first housing 311 and a second housing 312, and a hinge assembly 300 can be assembled in the hinge housing 300c. In one embodiment, the hinge housing 300c may be referred to as a hinge cover.

[0064] According to one embodiment, the hinge housing 300c may be visible from the outside of the electronic device 101 or concealed by the foldable housing 310, depending on the state of the electronic device 101. For example (see Figure 4C), the hinge housing 300c may be concealed by the foldable housing 310 and not visible from the outside of the electronic device 101 when the electronic device 101 is in the unfolded state. In another example (see Figures 3C to 3C), the hinge housing 300c may be visible from the outside of the electronic device 101 when the electronic device 101 is in the folded state due to the rotation of the first housing 311 and the second housing 312.

[0065] Figure 5A shows a coil antenna and a flexible circuit board arranged in the housing of an electronic device according to various embodiments of the present disclosure. Figure 5B shows that the NFC drive circuit, WPC drive circuit and MST drive circuit are arranged on the PCB. Figure 6 is a cross-sectional view taken along the line I-I' shown in Figure 5A.

[0066] Referring to Figures 5A to 6, electronic devices 500, 600 (e.g., electronic device 101 in Figure 1) according to various embodiments of the present disclosure may include a foldable housing 310 including a first housing 311 (e.g., the first housing 311 in Figure 3A) and a second housing 312 (e.g., the second housing 312 in Figure 3A), a flexible display 320, a hinge assembly 300, and a cover (e.g., the cover 330 in Figure 4C). The hinge assembly 300 connects the first housing 311 and the second housing 312, and the hinge assembly 300 allows the first housing 311 and the second housing 312 to be folded or unfolded.

[0067] According to one embodiment, the first housing 311 and the second housing 312 can form a space in which electronic components of the electronic device 101 (e.g., printed circuit board, battery, and / or processor) can be arranged. Furthermore, the first housing 311 and the second housing 312 can form at least a portion of the side surface of the electronic device 500 (e.g., the electronic device 101 in Figure 1, the electronic device 101 in Figure 3A).

[0068] As an example, multiple electronic components of the electronic device 500 (e.g., printed circuit boards, processors, memory, cameras, broadcast receiving modules, and / or communication modules) may be arranged in spaces provided inside the first housing 311 and the second housing 312. The printed circuit board may include a PCB (printed circuit board), a PBA (printed board assembly), and / or an FPCB (flexible printed circuit board).

[0069] As an example, a flexible display (e.g., the flexible display 320 in Figure 4A) may be placed in the first housing 311 (e.g., the first housing 311 in Figure 3A) and the second housing 312 (e.g., the second housing 312 in Figure 3A). A processor, memory, camera and / or communication module may be placed in the first housing 311. As an example, a coil antenna 510, 520, 530, a PCB (printed circuit board) 540 (or PBA (printed circuit board assembly)), a plurality of flexible circuit boards 550, 560, a connector 570, and a metal shield 670 may be placed in the second housing 312.

[0070] The coil antennas 510, 520, and 530 may include a WPC (wireless power consortium) 510, an NFC (near field communication) 520, and / or an MST (magnetic secure transmission) 530. For example, only the NFC 520 may be located within the electronic device 500, or the NFC 520 may be located together with the WPC 510 or MST 530. For example, the WPC 510 and MST 530 may be located within the electronic device 500. For example, the NFC 520, WPC 510, and MST 530 may all be located within the electronic device 500.

[0071] PCB540 may include an NFC driver circuit 542 for driving the NFC520, a WPC driver circuit 544 for driving the WPC510, and an MST driver circuit 546 for driving the MST530. The NFC520, WPC510, and MST530 may be electrically connected to PCB540 via a connector 570.

[0072] For example, the first FPCB 650 among several FPCBs (flexible printed circuit boards) 650, 660 may include a C2C (connector-to-connector) FPCB for transmitting control signals between PCB 580 (or PBA) located in the first housing 311 and PCB 540 (or PBA) located in the second housing 312.

[0073] As an example, the second FPCB660 among the multiple FPCB650,660 may include an FRC (flexible radio frequency cable) FPCB for transmitting RF signals between PCB580 (or PBA) located in the first housing 311 and PCB540 (or PBA) located in the second housing 312.

[0074] As an example, the WPC510, 610 and NFC520, 620 may be arranged above the battery 189 within the second housing 312 with reference to the Z-axis direction.

[0075] As an example, within the second housing 312, WPC510 and 610 may be positioned in the center with respect to the X-axis, and NFC520 and 620 may be positioned on either side of WPC510. Within the second housing 312, MST530 may be positioned below WPC510 and 610 with respect to the Z-axis.

[0076] For example, the shielding layer (or shielding sheet) 640 may be formed of a layer or sheet made of a material that can block magnetic fields. The shielding layer 640 may be formed of a material with high magnetic permeability (e.g., ferrite or nanocrystal) in a single-layer or multi-layer structure.

[0077] As an example, the shielding layer 640 may be placed below the WPC 510, 610. The shielding layer 640 may be placed between the WPC 510, 610 and the battery 189.

[0078] As an example, the shielding layer 640 may be located in the same layer as the FPCBs 650 and 660, at least in part. For example, the shielding layer 640 may be located between the first FPCB 650 and the second FPCB 660 with respect to the X-axis direction. However, the position and thickness of the shielding layer 640 may be changed.

[0079] As an example, NFC520 and 620 may be positioned above the battery 189 with respect to the Z-axis direction within the second housing 312. Multiple FPCB650 and 660 may be positioned between the NFC520 and 620 and the battery 189.

[0080] As an example, when viewed from the Z-axis direction, the first FPCB650 among the multiple FPCBs650,660 may be positioned so as to overlap at least a portion with the NFC520,620 located on the first side of the WPC510,610. The second FPCB660 among the multiple FPCBs650,660 may be positioned so as to overlap at least a portion with the NFC520,620 located on the second side of the WPC510,610. A metal shield 670 may be positioned to surround the sides of the NFC620 and the multiple FPCBs650,660.

[0081] As an example, the metal shield 670 may be formed of a metallic material (e.g., aluminum) to shield the magnetic field in the -Z axis direction generated by the coil antennas 610, 620. The metal shield 670 may be formed of a paramagnetic, diamagnetic, and / or ferromagnetic material.

[0082] For example, the metal shield 670 may be formed from multiple metal members. For instance, the metal shield 670 may be formed from two, three, four, or five metal members. For example, each metal member may be made of a paramagnetic, diamagnetic, and / or ferromagnetic material. For example, all of the multiple metal members constituting the metal shield 670 may be made of paramagnetic, diamagnetic, or ferromagnetic materials. For example, at least one of the multiple metal members constituting the metal shield 670 may be made of a paramagnetic material, or at least one may be made of a diamagnetic material, or some of the remaining members may be made of ferromagnetic materials.

[0083] As an example, the metal shield 670 may be formed from aluminum, stainless steel, magnesium, gold, silver, copper, iron, or a combination of at least two of the above substances.

[0084] For example, the metal shield 670 may be formed integrally with the housing (e.g., the second housing 312 in Figure 5A). For instance, at least a portion of the metal shield 670 may be formed as being included in the housing (e.g., the second housing 312 in Figure 5A).

[0085] For example, to reduce the thickness of the area where the NFC620 is located, the shielding layer 640 may not be placed on the NFC620. However, if there is no shielding layer 640 under the NFC620, the magnetic field generated by the NFC620 may not be radiated in the desired direction, and interference may occur due to the radiation of an unwanted magnetic field in the -Z axis direction. The electronic devices 500, 600 of this disclosure can shield the magnetic field in the -Z axis direction by a metal shield 670 placed outside the coil antenna (e.g., NFC520, 620), so that the magnetic field generated by the coil antenna (e.g., NFC520, 620) is radiated in the desired direction (e.g., the Z axis direction).

[0086] Figure 7A is a diagram comparing the arrangement structure of a coil antenna, a flexible circuit board, and a shielding layer according to one embodiment.

[0087] Referring to Figure 7A, the electronic device 70 may include coil antennas 71, 72, a plurality of shielding layers 74, 77, a plurality of FPCBs 75, 76, and a battery 189. NFCs 72 may be placed on both sides of the WPC 71, and a first shielding layer 74 may be placed below the WPC 71 and NFCs 72. FPCBs 75, 76 may be placed on the sides of the NFCs 72 and shielding layers 74, and a second shielding layer 77 may be placed above the FPCBs 75, 76. Thus, by applying the structures of the coil antennas 71, 72, shielding layers 74, 77, and FPCBs 75, 76, the area where the WPC 71 is placed may have a first width A1 (or first distance).

[0088] The height from the lower end of the battery 189 to the upper ends of the coil antennas 71 and 72 may have a first height B1. By applying such a structure, the electronic device 70 can reduce its thickness and secure space for the battery 189. However, since the WPC 71 and NFC 72 must all be located within the shielding area of ​​the first shielding layer 74, the area of ​​the WPC 71 may be reduced.

[0089] Figure 7B is a diagram comparing the arrangement structure of a coil antenna, a flexible circuit board, and a shielding layer according to one embodiment.

[0090] Referring to Figure 7B, the electronic device 80 may include coil antennas 81, 82, multiple FPCBs 85, 86, and a battery 189. NFCs 82 may be placed above the first FPCB 85 and the second FPCB 86 so as to ensure the area of ​​the WPC 81. For magnetic field shielding of the WPC 81 and NFC 82, the WPC 81 and NFC 82 A shielding layer 84 may be placed at the bottom of the above. In this way, by applying the structure of coil antennas 81, 82, shielding layer 84, and FPCBs 85, 86, the area where the WPC 81 is placed can have a second width A2 (or second distance) that is wider than the first width A1 (or first distance), and the height from the lower end of the battery 189 to the upper ends of the coil antennas 81, 82 can have a second height B2 that is thicker than the first height B1. By applying such a structure, the electronic device 80 can increase the area of ​​the WPC 81 by placing the NFC 82 in a position that overlaps with the FPCBs 85, 86. However, the thickness B2 (or height B2) from the lower end of the battery 189 to the upper ends of the coil antennas 81, 82 may increase. If the thickness of the electronic device 80 is not increased, the thickness of the battery 189 must be reduced, so the total capacity of the battery 189 will decrease.

[0091] In this case, the electronic device 80 can remove the shielding layer 84 between the NFC 82 and the FPCBs 85 and 86 to increase the thickness of the battery 189. However, the absence of the shielding layer 84 beneath the NFC 82 may cause a magnetic field to radiate in the -Z axis direction, degrading the performance of the NFC 82 and potentially causing interference.

[0092] Figure 7C is a diagram comparing the arrangement structure of a coil antenna, a flexible circuit board, and a shielding layer according to one embodiment.

[0093] Referring to Figure 7C, a shielding layer 840 can be placed below the WPC610 of the coil antennas 610 and 620, and a shielding layer can be placed below the NFC620. 640 The WPC 610 may not be placed. The NFC 620 may be placed so as to overlap with the FPCB 650, 660, and the area in which the WPC 610 is placed may have a second width A2 (or second distance) that is wider than the first width A1 (or first distance). The height from the lower end of the battery 189 to the upper end of the coil antennas 610, 620 may have a first height B1. The metal shield 670 may be placed so as to surround the sides of the coil antennas 610, 620 and the multiple FPCB 650, 660. The metal shield 670 allows the electronic device 600 to shield the magnetic field in the -Z axis direction generated by the coil antennas 610, 620, and to allow the magnetic field generated by the coil antennas 610, 620 to be radiated in a desired direction.

[0094] Figure 8 shows the form of the magnetic field generated by a coil antenna due to the arrangement of a shielding layer according to one embodiment of the present disclosure.

[0095] Referring to Figures 6 and 8, the simulation results of the magnetic field 830 radiated from the coil antenna 810 (e.g., NFC) are shown when a shielding layer 820 is formed below the coil antenna 810 (e.g., NFC) to cover the entire coil antenna 810 (e.g., NFC) of the electronic device 800. Here, the coil antenna 810 is represented in a simplified form relative to the NFC, which can be formed in one turn or multiple turns. The distribution of the magnetic field 830 is shown when the permeability of the NFC coil is set to 150 mu for the shielding material and a current of 350 mA is applied to the NFC. When the shielding layer 820 is formed over a wider area than the outer diameter of the coil antenna 810 (e.g., NFC), it can be confirmed that the magnetic field 830 in the -Z axis direction is shielded, and the magnetic field 830 in the Z axis direction is radiated.

[0096] Figure 9 shows the form of the magnetic field generated by a coil antenna due to the arrangement of a shielding layer according to one embodiment of the present disclosure.

[0097] Referring to Figure 9, the simulation results of the magnetic field 930 radiated from the coil antenna 910 (e.g., NFC) are shown when a shielding layer 920 is formed below the coil antenna 910 (e.g., NFC) to cover a portion of the coil antenna 910 of the electronic device 900. The coil antenna 910 is represented in a simplified form relative to the NFC, which can be formed in one or more turns. The distribution of the magnetic field 930 is shown when the permeability of the NFC coil is set to 150 mu for the shielding material and a current of 350 mA is applied to the NFC. When the shielding layer 920 is formed to cover a portion of the coil antenna 910 (e.g., NFC), it can be seen that a portion of the magnetic field 930 in the -Z axis direction is shielded, and the magnetic field 930 in the Z axis direction is radiated. In the portion where the shielding layer 920 is not placed, it can be seen that a portion of the magnetic field 930 in the -Z axis direction is radiated.

[0098] Figure 10 shows the shape of the magnetic field generated by a coil antenna due to the arrangement of a shielding layer according to one embodiment of the present disclosure.

[0099] Referring to Figure 10, the simulation results of the magnetic field 1030 radiated from the coil antenna 1010 are shown when a shielding layer 1020 is formed below the coil antenna 1010 (e.g., NFC) to cover an area smaller than the coil antenna 1010 of the electronic device 1000. Here, the coil antenna 1010 is represented in a simplified manner relative to the NFC, and the NFC can be formed in one turn or multiple turns. The distribution of the magnetic field 1030 is shown when the permeability of the NFC coil is set to 150 mu for the shielding material and a current of 350 mA is applied to the NFC. It can be confirmed that when the shielding layer 1020 is formed smaller than the area of ​​the coil antenna 1010 (e.g., NFC), the magnetic field 1030 in the -Z axis direction is radiated without shielding. Shielding layer 1020 Magnetic field from the area where no magnetic field is located, along the -Z axis. 1030 The emission of these particles can degrade NFC performance and potentially cause interference due to magnetic fields.

[0100] Figure 11 shows that a metal shield (e.g., front metal) according to one embodiment of the present disclosure is arranged to surround a shielding area.

[0101] Referring to Figures 6 and 11, the electronic devices 600, 1100 (e.g., electronic device 101 in Figure 1) according to various embodiments of the present disclosure may include coil antennas NFC620, 1100, and WPC610. However, the coil antennas may also include NFC620, 1100, WPC610, and MST (e.g., MST530 in Figure 5).

[0102] NFC620, 1110 and WPC610 may be positioned at the same height with respect to the Z-axis direction. NFC620, 1110 may be positioned above FPCB650, 660. Shielding layers 640, 1120 may be positioned to cover a smaller area than NFC620, 1110. Shielding layer 1120 may be positioned below WPC610 with respect to the Z-axis direction to cover WPC610, as shown in Figure 6. Shielding layer 640 may be positioned between WPC510, 610 and battery 189.

[0103] The metal shields 670 and 1130 can be positioned to surround the sides of the NFCs 620 and 1110. For example, the metal shields 670 and 1130 can shield the magnetic field in the -Z axis direction of the magnetic field generated by the NFCs 620 and 1110. The metal shields 670 and 1130 can be made of a paramagnetic, diamagnetic, or ferromagnetic material.

[0104] The metal shields 670 and 1130 can be positioned in the X-axis direction at a distance of a first width w1 from the NFCs 620 and 1110. For example, the metal shields 670 and 1130 can be positioned at a distance of 2 mm to 100 mm from the NFCs 620 and 1110 in the X-axis direction.

[0105] The metal shields 670 and 1130 can be positioned at a distance of a second width w2 from the NFCs 620 and 1110 in the Y-axis direction. For example, the metal shields 670 and 1130 can be positioned at a distance of 0.1 mm to 5.0 m from the NFCs 620 and 1110 in the Y-axis direction.

[0106] By arranging the metal shields 670 and 1130 around the sides of the NFCs 620 and 1110 at predetermined intervals in the X and Y directions, the electronic device can shield the magnetic field in the -Z direction generated by the NFCs 620 and 1110. In this way, the electronic device can shield the magnetic field in the -Z direction with the metal shields 670 and 1130, so that the magnetic field generated by the NFCs 620 and 1110 is radiated in a desired direction (e.g., the Z direction).

[0107] Figure 12 shows an example of the spacing between a metal shield (e.g., front metal) and the shielding area.

[0108] Referring to Figures 6 and 12, an electronic device 1200 according to one embodiment of the present disclosure may include a battery 189, an NFC 1210, and a front metal 1230 for housing an FPCB 1220.

[0109] In this disclosure, the front metal 1230 is formed from a paramagnetic, diamagnetic, or ferromagnetic metal, and the front metal 1230 can replace the metal shield 670 shown in Figure 6. That is, the electronic device can implement the metal shield 670 with the front metal 1230 without forming a separate metal shield to shield the magnetic field in the -Z axis direction.

[0110] Here, the front metal 1230 (e.g., metal shield) may be positioned at a distance of a first width w1 from the NFC 1210 in the X-axis direction. For example, the front metal 1230 (e.g., metal shield) may be positioned at a distance of 2mm to 5mm from the NFC 1210 in the X-axis direction. Also, the front metal 1230 (e.g., metal shield) may be positioned at a distance of a first height h1 from the bottom end of the NFC 1210 in the Z-axis direction. For example, the front metal 1230 (e.g., metal shield) may be positioned at a distance of 0.2mm to 2.0mm from the bottom end of the NFC 1210 in the Z-axis direction.

[0111] Front metal 1230 (e.g., metal shield) is positioned on the sides of the coil antennas 610, 620 and the multiple FPCBs 650, 660, so that the electronic device can shield the magnetic field in the -Z axis direction generated by the NFC 620 with the front metal 1230 (e.g., metal shield), and allow the magnetic field generated by the coil antennas 610, 620 to be radiated in a desired direction. That is, even if the front metal 1230 (e.g., metal shield) is positioned below the NFC 1210 in the Z axis direction and is separated from the NFC 1210 by a predetermined distance, the magnetic field in the -Z axis direction of the magnetic field generated by the NFC 1210 can be shielded.

[0112] To explain in conjunction with Figure 7C, a shielding layer is located below the WPC610, one of the coil antennas 610 and 620. 640The shielding layer 840 does not need to be placed below the NFC620. The NFC620 is placed so as to overlap with the FPCB650 and 660, and the area where the WPC610 is placed may have a second width A2 (or second distance) that is wider than the first width A1 (or first distance). By widening the area where the WPC610 is placed, the WPC610 can be formed to be wider. As an example, see Figure 7A In a structure like this, the diameter of WPC610 could be formed to a maximum of 33 mm. On the other hand, Figure 7C Furthermore, with a structure like that shown in Figure 12, the diameter of the WPC610 can be formed to approximately 42 mm. This improves the recognition area and charging efficiency of wireless charging.

[0113] Figure 13 shows the configuration of the magnetic field when a metal shield (e.g., front metal) is formed using a paramagnetic material.

[0114] Referring to Figure 13, the front metal 1230 (e.g., metal shield 670) can be formed from a paramagnetic metal material. Here, the front metal 1230 (e.g., metal shield 670) can be formed from aluminum. However, it is not limited to this, and the front metal 1230 (e.g., metal shield 670) can be formed from a metal that satisfies the permeability (Mu) of a paramagnetic material. The permeability of the front metal 1230 (e.g., metal shield 670) formed from a paramagnetic material may be approximately 1 (Mu=1).

[0115] Figure 14 shows the configuration of the magnetic field when a metal shield (e.g., front metal) is formed using a diamagnetic material.

[0116] Referring to Figure 14, the front metal 1230 (e.g., metal shield 670) can be formed from a diamagnetic metal material. Here, the front metal 1230 (e.g., metal shield 670) can be formed from aluminum. However, it is not limited to this, and the front metal 1230 (e.g., metal shield 670) may be formed from a metal that satisfies the permeability (Mu) of a diamagnetic material. The permeability of the front metal 1230 (e.g., metal shield 670) formed from a diamagnetic material may be approximately 0.5 (Mu = 0.5).

[0117] Figure 15 shows the configuration of the magnetic field when a metal shield (e.g., front metal) is formed using a ferromagnetic material.

[0118] Referring to Figure 15, the front metal 1230 (e.g., metal shield 670) can be formed from a ferromagnetic metal material. Here, the front metal 1230 (e.g., metal shield 670) can be formed from aluminum. However, it is not limited to this, and the front metal 1230 (e.g., metal shield 670) may be formed from a metal that satisfies the permeability (Mu) of a ferromagnetic material. The permeability of the front metal 1230 (e.g., metal shield 670) formed from a ferromagnetic material may be approximately 150 (Mu=150).

[0119] Referring to Figures 13 to 15, the simulation was performed assuming that the front metal 1230 (e.g., metal shield 670) is positioned 100 mm away from the NFC (e.g., NFC620 in Figure 6, NFC1210 in Figure 12) in the X-axis direction and 5 mm away in the Y-axis direction, and the magnetic field distribution is shown.

[0120] It can be confirmed that when the front metal 1230 (e.g., metal shield 670) is formed from a paramagnetic, diamagnetic, or ferromagnetic material, the magnetic field in the -Z axis direction is shielded.

[0121] As an example, as shown in Figure 13(a), if a front metal 1230 (e.g., metal shield 670) is not applied to the electronic device 600, it can be confirmed that a magnetic field 1310 in the Z-axis direction, a magnetic field 1320 in the X-axis direction, and a magnetic field 1330 in the -Z-axis direction are emitted.

[0122] As an example, as shown in Figure 13(b), when a paramagnetic front metal 1230 (e.g., metal shield 670) is applied to the electronic device 600, it can be confirmed that the magnetic field 1330 in the -Z axis direction is shielded.

[0123] As an example, as shown in Figure 14(a), if a front metal 1230 (e.g., metal shield 670) is not applied to the electronic device 600, it can be confirmed that a magnetic field 1410 in the Z-axis direction, a magnetic field 1420 in the X-axis direction, and a magnetic field 1430 in the -Z-axis direction are emitted.

[0124] As an example, as shown in Figure 14(b), when a paramagnetic front metal 1230 (e.g., metal shield 670) is applied to the electronic device 600, it can be confirmed that the magnetic field 1430 in the -Z axis direction is shielded.

[0125] As an example, as shown in Figure 15(a), if a front metal 1230 (e.g., metal shield 670) is not applied to the electronic device 600, it can be confirmed that a magnetic field 1510 in the Z-axis direction, a magnetic field 1520 in the X-axis direction, and a magnetic field 1530 in the -Z-axis direction are emitted.

[0126] As an example, as shown in Figure 15(b), when a paramagnetic front metal 1230 (e.g., metal shield 670) is applied to the electronic device 600, it can be confirmed that the magnetic field 1530 in the -Z axis direction is shielded.

[0127] When the front metal 1230 (e.g., metal shield 670) is formed from a paramagnetic, diamagnetic, or ferromagnetic material, an effect of shielding the magnetic field in the -Z axis direction is obtained. Electronic devices can determine the most suitable material from among paramagnetic, diamagnetic, or ferromagnetic materials by analyzing the distribution of magnetic material.

[0128] As shown in Figure 13, when a paramagnetic front metal 1230 (e.g., metal shield 670) is applied to the electronic device 600, a distribution appears in which a magnetic field is generated on the metal surface. As shown in Figure 14, when a diamagnetic front metal 1230 (e.g., metal shield 670) is applied to the electronic device 600, a distribution appears in which the magnetic field penetrates the metal.

[0129] As shown in Figure 15, when a ferromagnetic front metal 1230 (e.g., metal shield 670) is applied to the electronic device 600, a magnetic field distribution appears that covers the surface of the metal. Paramagnetic, diamagnetic, and ferromagnetic materials all have the effect of shielding magnetic fields, but when considering the ease of application of metal materials and the degree of suppression of the magnetic field in the -Z axis direction, applying a paramagnetic front metal 1230 (e.g., metal shield 670) is effective.

[0130] As another example of this disclosure, an electronic device can achieve magnetic field shielding even without applying a front metal 1230 (e.g., metal shield 670), by placing a metal wire approximately 1 mm thick around the NFC. Here, in order to shield the magnetic field in the -Z axis direction, the metal wire must be positioned lower than the NFC in the Z axis direction. If the metal wire is positioned higher than the NFC in the Z axis direction, the magnetic field in the Z axis direction can be shielded. Here, the distance between the NFC and the metal wire does not significantly affect the magnetic field shielding performance, but by positioning the metal wire adjacent to the NFC (e.g., within 10 mm), the magnetic field in the -Z axis direction can be shielded.

[0131] The electronic device according to the embodiments of this disclosure can shield the magnetic field in the -Z axis direction generated by the antenna coil (e.g., NFC, WPC, and / or MST), reduce thickness, and secure battery space. The electronic device according to the embodiments of this disclosure can shield the magnetic field in the -Z axis direction generated by the antenna coil (e.g., NFC, WPC, and / or MST) while reducing the area of ​​the shielding layer, and can increase the area of ​​the WPC to improve the recognition area and charging efficiency of wireless charging.

[0132] An electronic device according to one embodiment may include a housing, a first circuit board disposed in the housing, a flexible circuit board electrically connecting the first circuit board, a coil antenna disposed inside the housing and including a plurality of antennas having conductive patterns formed to generate a magnetic field, a shielding layer disposed below the first antenna among the plurality of antennas, and a metal shield disposed on the side of the coil antenna and shielding the magnetic field in a first direction of the magnetic field caused by the coil antenna.

[0133] According to one embodiment, the metal shield may be positioned at a distance of a first distance in a first direction and a second distance in a second direction from the coil antenna.

[0134] According to one embodiment, the metal shield may be positioned 2 mm to 100 mm away from the coil antenna in a first direction.

[0135] According to one embodiment, the metal shield may be positioned 0.1 mm to 5.0 mm away from the coil antenna in a second direction.

[0136] According to one embodiment, the metal shield may be positioned 0.2 mm to 2.0 mm away from the lower end of the coil antenna in a third direction.

[0137] According to one embodiment, the metal shield may be positioned lower than the lower end of the coil antenna.

[0138] According to one embodiment, the metal shield can block magnetic fields in the -z axis direction.

[0139] According to one embodiment, the flexible circuit board may overlap with the second antenna among the plurality of antennas, while the shielding layer may be arranged so as not to overlap with the second antenna.

[0140] According to one embodiment, the coil antenna may include WPC (wireless power consortium), NFC (near field communication), and MST (magnetic secure transmission).

[0141] According to one embodiment, the first antenna includes the WPC, and the second antenna includes the NFC.

[0142] According to one embodiment, the metal shield may include one of a paramagnetic material, a diamagnetic material, or a ferromagnetic material.

[0143] According to one embodiment, the metal shield can be formed from the paramagnetic material having a magnetic permeability (Mu) of about 1.

[0144] According to one embodiment, the metal shield may be formed from the diamagnetic material having a magnetic permeability (Mu) of about 0.5.

[0145] According to one embodiment, the metal shield can be formed from the ferromagnetic material having a magnetic permeability (Mu) of about 150.

[0146] An electronic device according to one embodiment may include a first housing, a second housing, a hinge structure disposed between the first housing and the second housing so that the first housing and the second housing can be folded or unfolded, a first printed circuit board disposed in the first housing, a second printed circuit board disposed in the second housing, a flexible circuit board electrically connecting the first printed circuit board and the second printed circuit board, a coil antenna disposed inside the second housing and including a plurality of antennas having conductive patterns formed to generate a magnetic field, a shielding layer disposed below the first antenna among the plurality of antennas, and a metal shield disposed on the side of the coil antenna and shielding the magnetic field in a first direction of the magnetic field caused by the coil antenna.

[0147] According to one embodiment, the metal shield may be positioned 2 mm to 100 mm away from the coil antenna in a first direction, 0.1 mm to 5.0 mm away from the coil antenna in a second direction, and 0.2 mm to 2.0 mm away from the lower end of the coil antenna in a third direction.

[0148] According to one embodiment, the metal shield may be positioned lower than the lower end of the coil antenna.

[0149] According to one embodiment, the metal shield can block magnetic fields in the -z axis direction.

[0150] According to one embodiment, the metal shield comprises one of a paramagnetic material, a diamagnetic material, and a ferromagnetic material, and the metal shield may be formed from a paramagnetic material having a permeability (Mu) of about 1, a diamagnetic material having a permeability (Mu) of about 0.5, or a ferromagnetic material having a permeability (Mu) of about 150.

[0151] The electronic devices disclosed in this document may be of various forms. These electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. The electronic devices disclosed in this document are not limited to the aforementioned devices.

[0152] The various embodiments described herein and the terminology used therein should be understood not to limit the technical features described herein to any particular embodiment, but to include various modifications, equivalents, or substitutes of the applicable embodiment. In the description of the drawings, similar or related components may be referred to by similar reference numerals. The singular form of a noun corresponding to an item may include one or more of the above items unless it is clearly indicated that they are different in the relevant context. In this document, each phrase such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” may include any one of the items listed with the applicable phrase in that phrase, or any possible combination thereof. Terms such as “first,” “second,” or “first,” or “second” may be used simply to distinguish the applicable component from other components and not to limit the applicable component in any other respect (e.g., importance or order). When one component (e.g., component 1) is referred to as "coupled" or "connected" with or without the terms "functionally" or "communically," it means that the aforementioned component may be connected to the aforementioned other component directly (e.g., by wire), wirelessly, or via component 3.

[0153] As used in various embodiments of this document, the term “module” may include units implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be a component configured as a whole, or the smallest unit or part thereof of such component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an ASIC (application-specific integrated circuit).

[0154] Various embodiments of this document may be implemented as software (e.g., programs) containing one or more instructions stored in a machine (e.g., electronic device)-readable storage medium (e.g., internal or external memory). For example, a processor (e.g., a processor) of a device (e.g., an electronic device) can invoke and execute at least one of the one or more instructions stored in the storage medium. This allows the machine to be operated to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0155] According to one embodiment, the methods according to the various embodiments disclosed herein may be provided in a computer program product. The computer program product may be traded as a commodity between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or through an application store (e.g., Play Store). TM Computer programs can be delivered online (e.g., downloaded or uploaded) via a network or directly between two user devices (e.g., smartphones). In the case of online delivery, at least a portion of the computer program product may be temporarily stored or temporarily generated on a machine-readable storage medium such as the memory of the manufacturer's server, the application store's server, or an intermediary server.

[0156] In various embodiments, each of the components described above (e.g., modules or programs) may include one or more individuals, and some of the individuals may be separated and placed in other components. In various embodiments, one or more of the aforementioned components or operations may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the respective components before the integration. In various embodiments, the operations performed by modules, programs or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added. [Explanation of symbols]

[0157] 100 Network Environment 101, 102, 104 Electronic equipment 108 servers 120 processors 121 Main Processor 123 Auxiliary processors 130 memory 132 Volatile memory 134 Non-volatile memory 140 programs 142 Operating Systems 144 Middleware 146 applications 150 Input Modules 155 Audio Output Module 160 display modules 170 Audio Modules 176 Sensor Modules 177 Interfaces 178 Connection terminals 179 Haptics Module 180 Camera Module 188 Power Management Modules 189 batteries 190 Communication Module 192 Wireless Communication Module 194 Wired communication module 196 Subscriber Identification Module 197 Antenna Module 198 First Network 199 Second Network 200 Electronic equipment 202 Front Plate 201 Display 203 Input device 204, 219 Sensor Modules 205, 212, 213 Camera Modules 207, 214 Audio output devices 208, 209 connectors 210 Housing 210A 1st page 210B 2nd side 210C side 210D 1st area 210E 2nd area 211 Rear plate 217 Key Input Device 218 Side bezel structure 300 Hinge Assembly 300c Hinge Housing 310 Housing 311 Housing 1 312 Second Housing 320 Flexible Display 320a 1st area 320b 2nd area 320c Folding Area 330 Cover 500 Electronic equipment 510, 520, 530 coil antenna 540, 580 PCBs 544 WPC drive circuit 546 MST drive circuit 550, 560 Flexible Circuit Boards 570 connector 610 WPC 620 NFC 640 Shielding layer 650, 660 FPCB 670 Metal Shield 70 Electronic equipment 71, 72 Coil antenna 74, 77 Shielding layer 75, 76 FPCB 80 Electronic equipment 81, 82 Coil antenna 84 Shielding layer 85, 86 FPCB 800 Electronic equipment 810 Coil Antenna 820 Shielding layer 830 Magnetic field 840 Shielding layer 900 Electronic equipment 910 Coil Antenna 920 Shielding layer 930 Magnetic field 1000 electronic devices 1010 Coil Antenna 1020 Shielding layer 1030 Magnetic field 1100 Electronic equipment 1100 NFC 1130 Metal Shield 1210 NFC 1230 Front Metal 1330 Magnetic field 1410 Magnetic field in the Z-axis direction 1420 Magnetic field in the X-axis direction 1430 - Magnetic field in the Z-axis direction 1510 Magnetic field in the Z-axis direction 1520 Magnetic field in the X-axis direction 1530 - Magnetic field in the Z-axis direction

Claims

1. An electronic device, Housing and A first PCB (printed circuit board) is placed inside the housing, A plurality of coil antennas for forming multiple magnetic fields, wherein the plurality of coil antennas include a first antenna and a second antenna, A shielding layer is positioned so as to overlap with at least a portion of the first antenna but not with the second antenna, A first FPCB (flexible printed circuit board) is electrically connected to the first PCB and positioned to overlap at least a portion of the second antenna, A metal shield is arranged to surround the plurality of coil antennas in order to shield at least a portion of the plurality of magnetic fields, Electronic devices, including those mentioned above.

2. Including the battery, The shielding layer is placed between the first antenna and the battery. The electronic device according to claim 1, wherein the first FPCB is disposed between the second antenna and the battery.

3. Second PCB, and Further including a second FPCB, The second FPCB is positioned between the second antenna and the battery. The electronic device according to claim 2, wherein each of the first FPCB and the second FPCB is electrically connected to the first PCB and the second PCB.

4. The electronic device according to claim 3, wherein the metal shield is arranged to surround the plurality of coil antennas, the first FPCB, and the second FPCB.

5. The electronic device according to claim 3, wherein the shielding layer is disposed between the first FPCB and the second FPCB.

6. The electronic device according to claim 1, wherein the metal shield is separated from the first antenna by a specified distance.

7. The housing includes a first housing and a second housing rotatable relative to the first housing. The electronic device according to claim 1, wherein the plurality of coil antennas are arranged within the second housing.

8. The electronic device according to claim 1, wherein the metal shield is configured to shield the magnetic field in the first direction toward the shielding layer by the first antenna.

9. Including the battery, The electronic device according to claim 1, wherein the battery is surrounded by the metal shield.

10. The electronic device according to claim 1, wherein the plurality of coil antennas further include a third antenna.

11. The first antenna includes a wireless charging antenna. The second antenna includes an NFC (near-field communication) antenna. The electronic device according to claim 10, wherein the third antenna includes an MST (magnetic secure transmission) antenna.

12. The electronic device according to claim 1, wherein the metal shield includes one of a paramagnetic material, a diamagnetic material, or a ferromagnetic material.

13. The first antenna is placed on the shielding layer, The electronic device according to claim 1, wherein the second antenna is positioned above the first FPCB.

14. The electronic device according to claim 1, wherein the shielding layer is arranged on the same plane as the first FPCB.

15. Multiple circuits for driving the multiple coil antennas; and Including the connector included in the first PCB, The aforementioned plurality of circuits are arranged on the first PCB. The electronic device according to claim 1, wherein the plurality of coil antennas are electrically connected to the plurality of circuits via the connector.

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