Laser-based manufacturing using optical correction

Abstract

To provide a method of forming an object from a material.SOLUTION: The method includes directing a first beam of light toward a first target location of the material to define a first portion of the object. The method also includes, after directing the first beam of light toward the first target location, determining an optical correction to be applied by an optical system. The optical correction is based on an atmospheric change in an atmospheric distortion region proximate to the first target location due, at least in part, to interaction of the first beam of light and the material. The method further includes directing a second beam of light toward a second target location of the material to define a second portion of the object. The second beam of light is directed through at least a portion of the atmospheric distortion region while the optical correction is applied.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to laser-based manufacturing using optical correction.

Background Art

[0002] Lasers are used in many manufacturing processes. For example, in various manufacturing processes, lasers can be used to heat a substance, promote the curing of a substance, fuse or weld a substance, cut a substance, and the like. In many such uses, in order to obtain the desired effect, it is necessary to appropriately and carefully focus the beam of light emitted from the laser device onto the target location.

[0003] Heating a substance using a light beam from a laser device can cause a part of the substance to evaporate or off-gas, which can cause a difference in refractive index between the laser device and the substance. The light beam typically provides extremely local heating of the substance. Local heating can result in a significant temperature difference along the path that the light beam propagates between the laser device and the substance. Such a temperature difference (or related density difference) can vary the refractive index of the atmosphere along the path that the light beam propagates. The difference in refractive index along the path can cause distortion of the light beam, which can defocus the light beam or cause other problems such as limiting the energy of the light beam applied to the target location.

Summary of the Invention

Means for Solving the Problems

[0004] In certain embodiments, a system for forming an object from a material includes one or more laser devices configured to process the material by directing light onto it to define a portion of the object. The system also includes an optical system coupled to the one or more laser devices and configured to perform optical correction of the light. The system further includes a controller coupled to the optical system and configured to determine an optical correction to be applied by the optical system after the one or more laser devices have directed one or more first light beams towards a first target location in the material to define a first portion of the material. The optical correction is based on atmospheric changes in an atmospheric strain region near the first target location, at least in part, due to the interaction of the one or more first light beams with the material. The controller is further configured to cause the optical system to apply the optical correction to a second light beam from one or more laser devices. The second light beam is directed towards a second target region of the material, passing through at least a portion of the atmospheric strain region, to define a second portion of the object.

[0005] In other specific embodiments, a method for forming an object from a material includes directing a first light beam to a first target location in the material to define a first portion of the object. The method also includes determining an optical correction to be applied by an optical system after the first light beam has been directed to the first target location. The optical correction is based on atmospheric changes in an atmospheric strain region near the first target location, at least in part, due to the interaction between the first light beam and the material. The method further includes directing a second light beam to a second target location in the material to define a second portion of the object. The second light beam is directed through at least a portion of the atmospheric strain region while applying the optical correction.

[0006] The features, functions, and benefits of this disclosure can be achieved independently in various embodiments and can also be combined in other embodiments, and further details can be understood by referring to the following description and drawings. [Brief explanation of the drawing]

[0007] [Figure 1]This figure shows a laser-based manufacturing system for objects using optical correction according to a specific embodiment. [Figure 2] This figure shows a first example of the system for additive manufacturing systems, as shown in Figure 1. [Figure 3] This figure shows a second example of the system shown in Figure 1 for additive manufacturing systems. [Figure 4] Figures 4A, 4B, and 4C show the stages in an additive manufacturing process using the system shown in Figure 1. [Figure 5] This figure shows an example of a subtractive manufacturing system, as shown in Figure 1. [Figure 6] Figures 6A, 6B, and 6C show the stages in a subtractive manufacturing process using the system shown in Figure 1. [Figure 7] This flowchart shows examples of methods for manufacturing objects using laser-based manufacturing and optical correction. [Figure 8] This flowchart shows an example of a method for determining optical corrections for laser-based manufacturing processes. [Figure 9] This is a block diagram of a computing environment including a computing device configured to support a laser-based manufacturing method of an object using optical correction. [Modes for carrying out the invention]

[0008] Aspects of this disclosure utilize optical correction to facilitate laser-based manufacturing. Optical correction is provided by an optical system configured to pre-deform a light beam to compensate for atmospheric strain along the path between the laser device used in the manufacturing process and the target site of the material. For example, since atmospheric strain can cause changes in the shape of the phase plane of a light beam directed along the path, the optical system can pre-deform the light beam to counteract or limit the effects of changes in the shape of the phase plane. For example, the optical system applies a conjugate phase plane shape to the light beam so that, as the light beam having a conjugate phase plane shape passes through the optical strain, the changes in the phase plane shape induced by the optical strain counteract the changes in the conjugate phase plane shape, allowing a sufficiently focused and substantially flat phase plane light beam to reach the target site.

[0009] Optical corrections can be dynamically determined and applied. For example, as a light beam interacts with material at a first target site, the light beam may produce a desired process effect (e.g., fusion or removal of parts of the material) and induce optical distortion in a region near the first target site. In certain embodiments, the optical correction is determined after the first light beam has produced optical distortion and is applied to the subsequent light beam as it is directed towards a second target site. Thus, the optical correction applied to the first period in the manufacturing process of an object may differ from the optical correction applied to the second period in the manufacturing process of an object. The application of optical corrections allows the laser device to target an object or an adjacent region of the material used to form the object over a continuous period (e.g., consecutive manufacturing steps). For example, a light beam can be directed towards a first target site, resulting in the formation of an atmospheric distortion region near the first target site. In the next process step, a second light beam can be directed towards a second target site adjacent to the first target site. In this example, the second light beam passes through at least one of the atmospheric distortions caused by the first light beam, but the effect of the atmospheric distortion region is reduced by optical correction.

[0010] In contrast to using optical correction as described in this disclosure, optical distortion caused by the first light beam can also be avoided. For example, the second light beam can be directed to a target location far from the first target location so that the second light beam does not (or hardly) pass through the atmospheric distortion region caused by the first light beam. Changing the target of the laser device to face a second target location far from the first target location increases manufacturing time because such a target change involves a significant movement that alters the relative position of the material and the target location of the laser device between process steps. Another example of avoiding optical distortion caused by the first light beam is to apply the second light beam after a delay in which the atmospheric distortion region disappears. This example also increases manufacturing time due to the additional delay time between process steps.

[0011] Another approach, in contrast to using optical correction as described in this disclosure, is to overwhelm the optical distortion caused by the first light beam. For example, the output power of the laser device can be increased so that the heat applied to each target site is sufficient to produce at least the desired effect. Increasing the output power in this way is inefficient. Furthermore, as the output power of the laser device increases, the light beam emitted by the laser device may become even more optically distorted. Also, the output power of the laser device may be limited by the properties of the material used.

[0012] The optical corrections of this disclosure can be applied in place of or in addition to other steps that avoid or overcome optical distortion in laser-based manufacturing processes. When used in place of avoiding or overcoming optical distortion, the optical corrections of this disclosure enable more efficient and faster (e.g., higher throughput) manufacturing processes. When used in combination with avoiding optical distortion, the optical corrections of this disclosure reduce delays associated with target changes by allowing the second light beam to pass more through the atmospheric distortion region created by the first light beam without affecting the manufacturing results. When used in combination with overcoming optical distortion, the optical corrections of this disclosure reduce the amount of overpower used to overwhelm the atmospheric distortion region. Thus, applicable optical corrections of this disclosure can improve the spot size and phase-plane performance of the laser system while reducing or eliminating latency between process steps.

[0013] The drawings and the following description are illustrative examples. It should be understood that a variety of configurations, not explicitly described or shown in this application, that can realize the principles of this disclosure and are included within the attached claims, can be envisioned by those skilled in the art. Furthermore, all examples described herein are intended to aid in understanding the principles of this disclosure and should not be interpreted as limiting. In other words, this disclosure is limited by the claims and their equivalents, and is not limited to the specific examples described below.

[0014] Specific embodiments are described herein with reference to the drawings. In the description, features common to all drawings are referred to by a common reference number. Some drawings use multiple instances of a particular type of feature. These features are physically and / or logically distinct, but each is given the same reference number, and different instances are distinguished by adding a letter to the reference number. When features are referred to collectively or as a type in this application (for example, not referring to a specific single feature), the reference number is used without a distinguishing letter. However, when this application refers to a specific single feature from multiple features of the same type, the reference number is used with a distinguishing letter. For example, referring to Figure 1, one or more actuators 160A and one or more actuators 160B are shown. When referring to one of these actuators or a specific set, for example actuator 160A, the distinguishing letter "A" is used. However, when referring to any one of these actuators or these actuators collectively, the reference number 160 is used without a distinguishing letter.

[0015] In this application, a variety of terms are used solely for the purpose of describing specific embodiments and are not limiting. For example, singular nouns include plural nouns unless otherwise specified. Furthermore, some features of this disclosure are singular in some embodiments and plural in others. For example, Figure 1 shows a system 100 including one or more laser devices ("laser device 102" in Figure 1), but in some embodiments the system 100 includes a single laser device 102, and in other embodiments the system 100 includes multiple laser devices 102. For simplicity of reference in this application, such features are generally described as "one or more" features and are referred to in the singular noun below unless specifically describing embodiments relating to multiple features.

[0016] The term "equipped with" is interchangeable with the terms "contain" and "possess". Similarly, the term "being" is interchangeable with the term "in". In this application, "exemplary" indicates one example, one embodiment and / or one aspect, and is not to be interpreted as indicating an exclusive, preferred, or desirable embodiment. In this application, sequential terms used to modify elements (structure, component, process, etc.) (e.g., "first," "second," "third," etc.) do not themselves indicate any priority or hierarchy relative to other elements, but merely distinguish elements having the same name (using sequential terms). In this application, the term "set" refers to a group of one or more elements, and the term "plural" refers to multiple elements.

[0017] In this application, the terms “generate,” “calculate,” “use,” “select,” “access,” and “determine” are interchangeable unless otherwise specified. For example, “generate,” “calculate,” or “determine” a parameter (or signal) may refer to actively generating, calculating, or determining that parameter (or signal), or to using, selecting, or accessing a parameter (or signal) that has already been generated, for example, by another component or device. In this application, “coupled” includes “communicatively coupled,” “electrically coupled,” or “physically coupled,” and (alternatively) a combination thereof. Two devices (or components) can be coupled directly or indirectly via one or more other devices, components, wires, buses, networks (e.g., wired networks, wireless networks, combinations thereof), etc. (e.g., communicatively coupled, electrically coupled, physically coupled). Two electrically coupled devices (or components) may be the same device or separate devices and may be connected, for example, electronic equipment, one or more connectors, or via inductive coupling, in non-limiting examples. In some embodiments, two devices (or components) that are communicatively coupled (e.g., in telecommunications) can transmit and receive electrical signals (digital or analog signals) directly or indirectly via one or more wires, buses, networks, etc. In this application, "directly coupled" means that the two devices are coupled (e.g., communicatively coupled, electrically coupled, or physically coupled) without any intervening components.

[0018] Figure 1 shows a laser-based manufacturing system 100 for an object 120 using optical correction according to a particular embodiment. The system 100 includes one or more laser devices 102 (such as one or more process laser devices 104 and one or more measurement laser devices 106). In this application, a process laser device 104 refers to a laser device configured to process a material 122 by directing a light beam (e.g., beam 126 in Figure 1) toward the material 122 to define a portion of the object 120. A measurement laser device 106 refers to a laser device configured to measure or detect optical distortion characteristics within an atmospheric strain region 128 by directing a measurement light beam (e.g., beam 124 in Figure 1) toward the atmospheric strain region 128.

[0019] In the example shown in Figure 1, beams 126 and 124 are shown as being directed along substantially parallel paths. In other examples, beams 126 and 124 coincide (for example, as shown in the example in Figure 5). In yet another example, beams 126 and 124 are directed along separate, non-parallel paths (as shown in the examples in Figures 2 and 3).

[0020] Beam 124 has one or more beam characteristics that are different from beam 126. For example, beam 124 may be different from beam 126 in wavelength, intensity, focus, duty cycle, beam power, beam shape, pulse characteristics, or a combination thereof. In one example, beam 126 has a first wavelength and beam 124 has a second wavelength that is shorter than the first wavelength. For example, beam 126 from process laser device 104 may have a wavelength within the infrared spectrum, and beam 124 from measurement laser device 106 may have a shorter wavelength to provide a fine measurement of optical distortion. In other examples, beam 126 is a pulsed beam (e.g., to provide fine manufacturing control and target change between pulses), and beam 124 is a continuous beam (e.g., to provide continuous or quasi - continuous sampling of optical distortion). In yet other examples, beam 126 is pulsed at a first rate based on manufacturing criteria (e.g., regulating the formation of an object and the interaction between beam 126 and material 122), and beam 124 is pulsed at a second rate independent of the first rate. For example, the second rate may be determined based on sampling or measurement criteria (e.g., the rate at which optical distortion is sampled based on how quickly the optical distortion changes). In yet other examples, beam 124 is pulsed at the first rate and beam 126 may be pulsed at the same rate. For example, in a particular embodiment, the pulses of beam 124 may be directed into the atmospheric distortion region to sample optical distortion immediately before the pulses of beam 126 are directed at material 122. In this particular embodiment, the pulses of beam 124 are used to adjust optical system 110 to pre - distort the light of the pulses of beam 126. Thus, in this particular embodiment, optical system 110 may be adjusted for each pulse of beam 126. Alternatively, optical system 110 may be adjusted after N pulses of the beam, where N is an integer greater than 1.

[0021] The beam characteristics of beam 126 are selected to facilitate manufacturing. For example, the beam characteristics of beam 126 can be selected based on the manufacturing process used to form object 120 and substance 122. As an exemplary first example, when system 100 is used for an additive manufacturing process, the beam characteristics of beam 126 are such that beam 126 selectively cures or solidifies substance 122 and fuses, adheres, sinters, or welds adjacent particles of substance 122 to form a portion of object 120. As an exemplary second example, when system 100 is used for a subtractive manufacturing process, the beam characteristics of beam 126 are such that the beam selectively melts, sublimates, vaporizes, ablates, or otherwise removes a portion of substance 122 such that the remaining portion of substance 122 defines a portion of the object. The interaction between beam 126 and substance 122 causes an atmospheric change in the atmospheric distortion region 128 near the target location of beam 126. For example, the atmospheric change can result in local variations in the atmospheric refractive index within atmospheric distortion region 128.

[0022] The beam characteristics of beam 124 are selected to facilitate the measurement of the optical distortion in the atmospheric distortion region 128 without adversely affecting the manufacturing process. For example, the beam characteristics of beam 124 can be selected based on the performance of sensor 130 detecting beam 124 and determining sensor data 136 indicative of the optical distortion in the atmospheric distortion region 128. As another example, when beam 124 and beam 126 coincide, the wavelength of beam 124 can be different from the wavelength of beam 126 such that it is sufficient to enable accurate detection of beam 124 by sensor 130.

[0023] In addition to the laser device 102, the system 100 includes an optical system 110 coupled to the laser device 102 and configured to perform optical correction of the light output by the laser device 102. For example, the optical system 110 may include a phase plane shape adjustment system 112 configured to change the phase plane shape of the beam 126 emitted by the process laser device 104. Examples of mechanisms that can be used to adjust the phase plane shape include one or more spatial light modulators 114, one or more dynamically adjustable lenses 116, and one or more dynamically adjustable mirrors 118. In Figure 1, the phase plane shape adjustment system 112 is shown to include a spatial light modulator 114, a dynamically adjustable lens 116, and a dynamically adjustable mirror 118. In other embodiments, the phase plane shape adjustment system 112 includes only two of the spatial light modulator 114, the dynamically adjustable lens 116, and the dynamically adjustable mirror 118. In yet another embodiment, the phase plane shape adjustment system 112 includes only one of the following: a spatial light modulator 114, a dynamically adjustable lens 116, and a dynamically adjustable mirror 118.

[0024] The system 100 further includes a controller 140 coupled to the laser device 102, to the optical system 110, or to both. The controller 140 is configured to determine the optical correction 154 to be applied by the optical system 110. Furthermore, the controller 140 may be configured to control the operation of the laser device 102, the direction of the light emitted by the laser device 102, the relative position of the laser device 102 and the material 122 (for example, using one or more actuators 160), the operation of one or more sensors 130, other aspects of performing manufacturing using the system 100, or a combination thereof.

[0025] The system 100 also includes one or more sensors 130 configured to generate sensor data 136 indicating atmospheric changes in the atmospheric strain region 128, at least partially attributable to the interaction between the beam 126 and the material 122. The sensors 130 include one or more phase-plane sensors 132, one or more other sensors 134 configured to generate sensor data 136 indicating atmospheric changes in the atmospheric strain region 128, or both. The phase-plane sensors 132 are configured to measure the phase-plane shape of the beam 124 after it has passed through at least a portion of the atmospheric strain region 128, and to generate sensor data 136 based on the measured phase-plane shape. The other sensors 134 are configured to detect conditions correlated with specific atmospheric strain characteristics. For example, the other sensors 134 may be configured to detect local temperature changes in the atmospheric strain region (or surrounding region), the presence and concentration of chemical components in the atmospheric strain region (or surrounding region), etc.

[0026] Whether the sensor 130 includes a phase-plane sensor 132, other sensors 134, or a combination thereof, the sensor data 136 includes information that the controller 140 uses to determine the optical correction 154 that the optical system 110 should apply. In Figure 1, the controller 140 includes one or more processors 142 and memory 144. Memory 144 includes or corresponds to one or more non-temporary memory devices configured to store data and instructions 146. Instructions 146 are executable by the processor 142 and cause the controller 140 to perform various processes described (such as determining the optical correction 154 that the optical system should apply, controlling other processes of the system 100, etc.). In the example shown in Figure 1, instructions 146 correspond to or include the laser control instruction 148, the position control instruction 150, and the optical correction instruction 152.

[0027] The laser control command 148 is executable by the processor 142 and generates commands 172 to activate, stop, or change the operating characteristics of one or more laser devices 102. Commands 172 control the operation of the laser devices 102 by specifying the timing, beam characteristics, direction of focus, and other aspects of the light output by the laser devices 102.

[0028] Position control commands 150 are executable by the processor 142, which generates commands 170 for the actuators 160 of system 100. In Figure 1, the actuators 160 of system 100 include actuator 160A, which is involved with the laser device 102 and / or the optical system 110, and actuator 160B, which is involved with handling material and moving objects. In other embodiments, system 100 includes more or fewer actuators 160. In certain embodiments, such as the example shown in Figure 2, actuator 160A is coupled to a target-directing mirror to facilitate the directing of one or more of the beams 124 and 126. In other examples, actuator 160A reorients the laser device 102 and / or the optical system 110 to direct beams 124, 126. In some embodiments, one or more of the beams 124 and 126 are directed along a fixed path, and actuator 160B moves material 122, object 120, or both, relative to beams 124, 126. Additionally or alternatively, the actuator 160B may be configured to perform other processes, such as supplying a certain amount of material 122 into the processing area.

[0029] In a particular embodiment shown in Figure 1, an optical correction command 152 is executable by a processor 142, which causes the optical system 110 to determine an optical correction 154 to be applied to the light emitted by one or more laser devices 102. The optical correction 154 is configured to correct atmospheric distortion in an atmospheric distortion region 128 in order to improve the targeting and effectiveness of the light emitted by the process laser device 104 (e.g., beam 126).

[0030] The optical correction 154 is determined based on a phase plane shape change 156 measured, detected, or estimated in relation to the atmospheric strain region 128. The phase plane shape change 156 indicates how much the phase plane of the beam 126 is expected to change by passing through the atmospheric strain region 128. In some embodiments, the phase plane shape change 156 is determined based on how much the phase plane of the measurement light beam (e.g., beam 124) from the measurement laser device 106 is changed by passing through at least a portion of the atmospheric strain region 128. In a particular embodiment shown in Figure 1, the measurement laser device 106 and the process laser device 104 are arranged together and both pass through the optical system 110. In this embodiment, beams 124 and 126 coincide. In other embodiments, the light from the measurement laser device 106 does not pass through the optical system 110. For example, in the example shown in Figure 5, beams 124 and 126 coincide and form a combined beam 508, but beam 124 does not pass through the optical system 110. In other examples, such as the one shown in Figure 2, the process laser device 104 and the measurement laser device 106 are not positioned together, and beams 124 and 126 do not coincide. For example, beam 124 passes through the atmospheric strain region 128 in a different direction than beam 126. In such embodiments, the controller 140 includes calibration data (e.g., calibration data 942 in Figure 9) that compensates for the differences in orientation and position between the process laser device 104 and the measurement laser device 106.

[0031] During operation, the controller 140 generates commands 170 that cause the actuator 160 to control the relative position and direction of the laser device 102 and the material 122. In some embodiments, the commands 170 also prepare the material 122 for the manufacturing process, such as by positioning a portion of the material 122 at the processing location. In certain embodiments, a position control command 150 generates a command 170 that directs the laser device 102 to a first target location on the material 122. The position control command 150 may determine the command 170 based on information received from other devices or information stored in memory 144. For example, the controller 140 may receive machine language instructions (e.g., G-code or computer numerical code instructions) from a remote computing device. In this example, the machine language instructions typically describe the steps taken to form the object 120 in a layer-by-layer process. For example, a three-dimensional (3D) computer model of object 120 may be processed by a slicer application to represent the 3D computer model as a set of discrete layers, and toolpaths and other machine language instructions may be generated based on that set of discrete layers. In some embodiments, the controller 140 includes the 3D computer model and the slicer application. In other embodiments, another device includes the 3D computer model and the slicer application, and the controller 140 determines the command 170 based on machine language instructions received from the other device.

[0032] Once the laser device 102 is correctly aimed (for example, directed at the first target location of material 122), the controller 140 sends a command 172 to direct the process laser device 104 to direct the first light beam (e.g., beam 124) to the first target location in order to define the first portion of object 120. Before, during, or after the process laser device 104 emits the first light beam, the controller 140 may also send a command 172 to direct the measurement laser device 106 to direct the measurement light beam (e.g., beam 126) to a region near the first target location (for example, to the atmospheric strain region 128, or to a predicted location within the atmospheric strain region 128).

[0033] The first light beam 126 from the process laser device 104 interacts with a portion of material 122 at a first target location to define a portion of object 120. For example, if system 100 is performing a subtractive manufacturing process, the beam 126 may ablate, melt, vaporize, or otherwise remove a portion of material 122. As another example, if system 100 is performing an additive manufacturing process, the beam 126 may harden (e.g., initiate crosslinking), bond, combine, or otherwise fuse portions of material 122 together.

[0034] In addition to defining a portion of object 120, the interaction between the first light beam and material 122 can cause atmospheric changes in the atmospheric distortion region 128, which is near the first target location. These atmospheric changes result in local fluctuations in the atmospheric refractive index within the atmospheric distortion region 128. Without correction, these local fluctuations in atmospheric refractive index would distort (for example, defocus) the second light beam 126 directed through the atmospheric distortion region 128.

[0035] Sensor 130 generates sensor data 136 indicating atmospheric distortion in the atmospheric distortion region 128. For example, measuring laser device 106 emits a beam 124 in a direction that the beam 124 passes through at least a portion of the atmospheric distortion region 128. In some embodiments, sensor 130 detects the beam 124 and generates sensor data 136 as a characteristic index of the optical distortion caused by the atmospheric distortion region 128. For example, a phase plane sensor 132 may generate sensor data 136 indicating the shape of the phase plane of the beam 124 or the phase plane change that the beam 124 undergoes. In other examples, other sensors 134 may generate sensor data 136 indicating the local temperature of the atmospheric distortion region 128, the chemical composition of the atmospheric distortion region 128, the optical irregularity of the atmospheric distortion region 128, or a combination thereof.

[0036] The controller 140 determines the optical correction 154 using the sensor data 136. In the specific example shown in Figure 1, the optical correction 154 is determined by estimating or calculating the phase plane shape change 156 that is predicted to affect the subsequent light beam 126 passing through the atmospheric distortion region 128. In this example, the phase plane shape change 156 is used to calculate the conjugate phase plane shape 158. The conjugate phase plane shape 158 is used to generate a command 174 to be given to the optical system 110. The optical system 110 adjusts the phase plane shape adjustment system 112 based on the conjugate phase plane shape 158.

[0037] The process laser device 104 directs a second light beam (e.g., beam 126) to a second target site in material 122 to generate a second part of object 120. The second target site is in the vicinity of the first target site (e.g., adjacent or near), and the second light beam passes through at least a portion of the atmospheric strain region 128. For example, the portion of material 122 removed at the second target site is continuous with or directly adjacent to the portion of material removed at the first target site. In another example, in an additive process, the portion of material fused at the first target site to form the first part of object 120 fuses directly adjacent to the second portion of material 122 at the second target site.

[0038] The second light beam is directed to the optical system 110, which applies an optical correction 154 to the second light beam. As a result, the second light beam is pre-distorted to compensate for the optical distortion of the atmospheric distortion region 128. In certain examples, this process is repeated iteratively. For example, an object 120 is formed using a series of process steps, and a beam 126 from the process laser device 104 is directed to a target location on the material at each process step. Additionally, between process steps, the optical system 110 may be reconfigured to compensate for the optical distortion of the atmospheric distortion region 128 formed during one or more previous process steps. Adjusting the optical distortion of the atmospheric distortion region 128 eliminates the need for delays and / or target changes of the laser device 102 between process steps, thus enabling high-speed operation of the manufacturing system 100.

[0039] Figure 1 shows an optical correction command 152 for calculating the optical correction 154 as a conjugate phase plane shape 158, but in other embodiments, other optical correction calculations may be performed in addition to or instead of the calculation of the conjugate phase plane shape. For example, the sensor data 136 may include information on temperature and chemical composition detected by other sensors, and the sensor data 136 may be given to a machine learning model (e.g., a neural network) as input to determine the optical correction 154. In this example, the machine learning model may be trained to estimate the optical correction 154 based on the sensor data 136. In other examples, the sensor data 136 can be compared with calibration data that maps specific sensor data values ​​to the parameters of the optical correction 154.

[0040] Figure 2 shows a first example of the system 100 of Figure 1 for an additive manufacturing process. In Figure 2, system 100 is configured as a resin-based additive manufacturing system. For example, in Figure 2, material 122 contains a resin that is cured (e.g., polymer crosslinking begins) by a light beam 126 from a process laser device 104. In this example, actuator 160B is configured to adjust the depth of object 120 within a container 206 of material 122, causing the resin layer to overflow onto the top of object 120, forming an uncured resin layer on the object. The beam 126 is then directed to specific locations in the uncured resin layer, selectively curing portions of the layer to form portions of object 120. Object 120 is formed on a platform 202, which extends into the container 206 and supports object 120 as it is formed.

[0041] In the example shown in Figure 2, actuator 160A is coupled to target-directing mirror 204. Actuator 160A moves target-directing mirror 204 to direct beam 126 towards a specific target location.

[0042] In the example shown in Figure 2, the measuring laser device 106 is positioned such that the light beam 124 emitted by the measuring laser device 106 passes through the atmospheric distortion region 128 and is detected by the sensor 130. Based on sensor data 136 from the sensor 130, the controller 140 instructs the optical system 110 to modify the beam 126 from the process laser device 104 to compensate for the optical distortion in the atmospheric distortion region 128. For example, the optical system 110 may apply optical corrections 154, such as phase plane adjustment, using a spatial light modulator 114, a dynamically adjustable lens 116, and a dynamically adjustable mirror 118, as shown in Figure 1. In some embodiments, the optical system 110 is adjusted based on the optical corrections 154 after the process laser device 104 has formed the atmospheric distortion region 128 by directing the first light beam 126 towards a first target location on the material 122. In this example, the process laser device 104 directs the second light beam 126 to the second target site of the material 122, and the optical system 110 applies optical correction 154 to the second light beam 126. The optical correction 154 pre-distorts the second light beam 126 to limit the defocusing of the second light beam 126 caused by local fluctuations in the atmospheric refractive index in the atmospheric distortion region 128.

[0043] Figure 3 shows a second example of system 100 of Figure 1 for an additive manufacturing system. In Figure 3, system 100 corresponds to a metal powder bed fusion system such as a selective laser melting (SLM) system, a selective laser sintering (SLS) system, or a direct metal laser sintering (DMLS) system. In Figure 3, system 100 includes a container 308 for material 122 and a build space 310. The container 308 includes a first platform 304 coupled to one actuator 106B, and the build space 310 includes a second platform 302 coupled to another actuator 106B. The material 122 includes fine particles such as metal powder or polymer powder.

[0044] In the example shown in Figure 3, actuator 160A is coupled to a target-directing mirror 204 and configured to move the target-directing mirror 204 to direct the beam 126 to a designated target location. In some embodiments, after the process laser device 104 directs the first light beam 126 to a first target location in the material 122 to form an atmospheric distortion region 128, the controller 140 determines the optical correction 154 to be applied by the optical system 110 when the subsequent beam 126 is directed to a second target location in the material 122. The optical correction 154 pre-distorts the second beam 126 to limit the defocusing of the second beam 126 caused by local fluctuations in the atmospheric refractive index of the atmospheric distortion region 128.

[0045] In Figure 3, the measuring laser device 106 is positioned such that the light beam 124 emitted by the measuring laser device 106 passes through the atmospheric strain region 128 and is detected by the sensor 130. Based on sensor data 136 from the sensor 130, the controller 140 instructs the optical system 110 to modify the beam 126 from the process laser device 104 to compensate for the optical strain in the atmospheric strain region 128.

[0046] During the process, the first platform 304 is moved upward, and the roller 306 or scraper is moved across the container 308 and the build space 310 to form a thin, uniform layer of material 122, thereby forming a layer of material 122 within the build space 310. The beam 126 is directed towards a selected portion of the material 122 layer to fuse adjacent portions of the material 122 together and define a portion of the object 120. Once a particular layer is complete, the second platform 302 moves downward to make room for another layer of material, and the first platform 304 moves upward to allow the roller 306 or scraper to distribute the other layer of material 122.

[0047] Figures 4A, 4B, and 4C illustrate stages in an additive manufacturing process using one of the systems 100 shown in Figures 1 to 3. In Figure 4A, a first light beam 126A from a process laser device 104 is directed to a first target location 402 in material 122. The interaction between the first light beam 126A and material 122 at the first target location 402 causes the material 122 at the first target location 402 to harden, sinter, melt, or otherwise fuse to form at least a portion of object 120 (e.g., portion 404 shown in Figure 4B). Additionally, the interaction between the first beam 126A and material 122 generates atmospheric strain in an atmospheric strain region 128 near the first target location 402. For example, atmospheric strain can be caused by thermal effects, evaporation, off-gas, or other influences that cause localized variations in atmospheric refractive index.

[0048] In Figure 4B, the measuring laser device 106 directs the beam 124 so that it passes through at least a portion of the atmospheric strain region 128. In the specific example shown in Figure 4B, the beam 124 is directed towards the first target location 402. In other examples, the beam 124 passes through the atmospheric strain region 128 in different ways, as shown in Figures 2 and 3, etc.

[0049] The controller 140 in Figures 1 to 3 determines the optical correction 154 to compensate for atmospheric distortion in the atmospheric distortion region 128 based on measurement results related to the beam 124 or other sensor data 136. The controller 140 instructs the configuration of the optical system 110 to compensate for the optical distortion in the atmospheric distortion region 128.

[0050] After the optical system 110 is configured to compensate for optical distortion, the process laser device 104 generates a second light beam 126B directed towards a second target location, as shown in Figure 4C. The second target location 406 is adjacent to the first target location 402 in Figure 4A. For example, directing the second beam 126B causes the second beam 126B to pass through at least a portion of the atmospheric distortion region 128. Additionally, in some embodiments, the interaction between the second beam 126B and the material 122 at the second target location 406 causes a portion of the material 122 to fuse with a first portion 404 of object 120 created by the interaction between the first light beam 126A and the material 122.

[0051] Figure 5 shows an example of system 100 of Figure 1 for a subtractive manufacturing system. In Figure 5, system 100 corresponds to a laser cutting system or a laser engraving system. In Figure 5, material 122 is placed on a platform 502 coupled to actuator 160B. Actuator 160B is configured to move the platform 502 to align the direction of the process laser device 104 with the target location. For example, the platform 502 and actuator 160B may include, correspond to, or be contained within a positioning table, such as an XY table or an XYZ table.

[0052] In Figure 5, the material 122 is a solid (e.g., a sheet or blank), and may be a metal, polymer, bio-based material (e.g., wood), or other material. In some embodiments, as shown in Figure 5, the system 100 is configured to define the object 120 by cutting the material. For example, in Figure 5, the system 100 separates the material 122 into waste material 506 and object 120. In other embodiments, the system 100 is configured to define the object 120 by etching or engraving the material. For example, as shown in Figures 6A to 6C, the system 100 removes the waste material so that only object 120 remains (e.g., by evaporating or ablating the waste material).

[0053] Figure 5 shows an example where the beam 126 emitted by the process laser device 104 and the beam 124 emitted by the measurement laser device 106 coincide. For example, in Figure 5, beam 126 is reflected toward material 122 by the unidirectional mirror 504, and beam 124 passes through the unidirectional mirror 504 to form a composite beam 508 containing beams 124 and 126. In some embodiments, the system 100 in Figure 5 is configured such that the direction of the process laser device 104 and the measurement laser device 106 are parallel rather than coincidental. In some embodiments, the process laser device 104 and the measurement laser device 106 operate at different time points, so that only either beam 126 or beam 124 exists during the process, rather than a composite beam 508.

[0054] During the process, actuator 160B moves platform 502 to align the beam (e.g., beam 126 or composite beam 508) with the first target location in material 122. Process laser device 104 directs the first light beam 126 to the first target location in material 122 to define at least a portion of the object 120. Controller 140 determines the optical correction 154 that the optical system 110 should apply when the subsequent beam 126 is directed to the second target location in material 122. The optical correction 154 pre-distorts the second beam 126 to limit the defocusing of the second beam 126 caused by local variations in atmospheric refractive index in the atmospheric distortion region 128.

[0055] In certain embodiments, the controller 140 determines an optical correction 154 based on a phase plane change induced in the beam 124 of the measuring laser device 106 as the beam 124 passes through at least a portion of the atmospheric distortion region 128. Additionally or alternatively, the controller 140 determines an optical correction 154 based on sensor data 136 from other sensors (e.g., other sensors 134 in Figure 1). The controller 140 instructs the optical system 110 to modify the second beam 126 from the process laser device 104 to compensate for the optical distortion in the atmospheric distortion region 128. For example, the optical system 110 may apply an optical correction 154 such as phase plane adjustment using a spatial light modulator 114, a dynamically adjustable lens 116, and a dynamically adjustable mirror 118, as shown in Figure 1.

[0056] The examples shown in Figures 2, 3, and 5 are illustrative and not exclusive. In other embodiments, the actuator 160 controls the relative position of the laser device 102 and the material 122 in a different manner than shown. Furthermore, one or more embodiments of Figures 2, 3, and 5 can be combined into a single system. For example, when using system 100 in an additive manufacturing process, the laser device 102 may be configured as shown in Figure 5. Moreover, in some embodiments, system 100 can be used for additive manufacturing processes when configured for a particular scheme and material, and for subtractive manufacturing processes when configured for a different scheme and / or material.

[0057] Figures 6A, 6B, and 6C illustrate the stages in a subtractive manufacturing process using the system 100 of Figure 1 or Figure 5. In Figure 6A, a first light beam 126A from the process laser device 104 is directed at a first target location 402 in material 122. The interaction between the first beam 126A and material 122 at the first target location 402 removes (e.g., evaporates) a portion of material 122 at the first target location 402, defining at least a portion of object 120 (e.g., the edge of object 120 as shown in Figure 6B). The interaction between the first beam 126A and material 122 also generates atmospheric strain in an atmospheric strain region 128 near the first target location 402. For example, atmospheric strain can be caused by thermal effects, evaporation, off-gas, or other influences that cause localized variations in atmospheric refractive index.

[0058] In Figure 6B, the measuring laser device 106 directs the beam 124 so that it passes through at least a portion of the atmospheric strain region 128. In the specific example shown in Figure 6B, the beam 124 is directed towards the first target location 402. In other examples, the beam 124 passes through the atmospheric strain region 128 in a different manner.

[0059] The controller 140 in Figure 1 or Figure 5 determines the optical correction 154 to compensate for atmospheric distortion in the atmospheric distortion region 128 based on measurement results related to the beam 124 or other sensor data 136. The controller 140 instructs the configuration of the optical system 110 to compensate for optical distortion in the atmospheric distortion region 128.

[0060] After the optical system 110 is configured to compensate for optical distortion, the process laser device 104 generates a second light beam 126B directed towards a second target location, as shown in Figure 6C. In some embodiments, the second target location 406 is adjacent to the first target location 402 in Figure 6A. For example, directing the second beam 126B causes the second beam 126B to pass through at least a portion of the atmospheric distortion region 128. Also in some embodiments, the interaction between the second beam 126B and the material 122 at the second target location 406 removes portions of the material 122 adjacent to the edge of the object defined by the first beam 126A (for example, the first beam 126A and the second beam 126B define adjacent or continuous features of the object 120).

[0061] Figure 7 is a flowchart of an example of a method 700 for manufacturing an object using a laser-based manufacturing method and optical correction. Method 700 can be started, executed, or controlled by any of the systems shown in Figures 1-3 and Figure 5, or a part thereof (e.g., controller 140).

[0062] Method 700 includes defining a first portion of an object by directing a first light beam to a first target location on the material in block 702. In some embodiments, the first light beam defines a first portion of an object by an additive manufacturing process. For example, as shown in Figures 2, 3, and 4A-4C, the first light beam (e.g., beam 126A) defines a first portion of object 120 by fusing or bonding adjacent portions of material 122 together to define a first portion of object 120. In some embodiments, the first light beam defines a first portion of an object by a subtractive manufacturing process. For example, as shown in Figures 5 and 6A-6C, the first light beam (e.g., beam 126A) defines a first portion of object 120 by removing portions of material 122 such that the remaining portion of material 122 defines a first portion of object 120.

[0063] In certain embodiments, the interaction between the first light beam and the material also causes atmospheric changes in the atmospheric distortion region near the first target site. For example, atmospheric changes may result from thermal changes within the atmospheric distortion region, off-gassing of parts of the material, or both.

[0064] Method 700 also includes determining, in block 704, an optical correction to be applied by the optical system after the first light beam has been directed to the first target location. The optical correction is based on atmospheric changes in the atmospheric distortion region near the first target location, which are at least partially attributable to the interaction between the first light beam and the material. For example, atmospheric changes may result in local fluctuations in the atmospheric refractive index within the atmospheric distortion region, and the optical correction distorts the second light beam (e.g., pre-distorts it) to limit the defocusing of the second light beam due to local fluctuations in the atmospheric refractive index. For example, atmospheric changes may result in phase plane changes affecting the second light beam. The optical correction distorts the second light beam using the conjugate of the phase plane changes so that the phase plane changes and conjugate phase plane changes substantially cancel each other out, resulting in a substantially flat phase plane of the second beam so that the second beam strikes the second target location as it passes through the atmospheric distortion region.

[0065] Furthermore, method 700 includes, in block 706, defining a second portion of an object by directing a second light beam to a second target location of the material. The second light beam is directed to pass through at least a portion of the atmospheric strain region while applying optical corrections. Similar to the first beam, the second beam can define a portion of an object additively or subtractively. For example, in an additive manufacturing process, the second light beam may define a second portion of an object by fusing or bonding a portion of the object to a first portion of the object defined by the first beam. As another example, in a subtractive manufacturing process, the second light beam may define a second portion of an object by removing a portion of the object that is directly adjacent to a first portion of the object defined by the first beam.

[0066] Figure 8 is a flowchart of an example of method 800 for determining optical corrections for a laser-based manufacturing process. For example, method 800 may be used to perform the process in block 704 of Figure 7. Method 800 may be started, executed, or controlled by any system 100 or part thereof (e.g., controller 140) as shown in Figures 1-3 or Figure 5.

[0067] Method 800 includes directing the measurement light beam into an atmospheric strain region in block 802. For example, the atmospheric strain region may be caused by the interaction of the process light beam (e.g., beam 126) and a material (e.g., material 122) as described above. In certain embodiments, the measurement light beam has one or more beam characteristics that differ from the process light beam. For example, one or more different beam characteristics include at least one of wavelength, intensity, focus, duty cycle, beam power, beam shape, and pulse characteristics. For example, in certain embodiments, the process light beam has a first wavelength, and the measurement light beam has a second wavelength that is shorter than the first wavelength.

[0068] Furthermore, method 800 includes receiving sensor data indicating atmospheric changes in block 804. For example, the controller 140 in Figure 1 receives sensor data 136 from sensor 130.

[0069] In a particular embodiment shown in Figure 8, method 800 further includes determining the measured phase plane shape by measuring the phase plane shape of the measurement light beam in block 806. For example, the phase plane shape may be measured based on sensor data 136, or the sensor data 136 may indicate the measured phase plane shape.

[0070] Method 800 also includes determining the estimated phase plane shape change induced for the second light beam within the atmospheric distortion region in block 808. For example, the optical correction command 152 shown in Figure 1 may be executed by the processor 142 to determine the phase plane shape change 156 based on the sensor data 136.

[0071] Method 800 further includes, in block 810, calculating the conjugate phase plane shape of the second light beam for generating a plane wave at the second target location based on the estimated phase plane shape change. For example, the optical correction command 152 in Figure 1 may be executed by the processor 142 to determine the conjugate phase plane shape based on the phase plane shape change 156.

[0072] Method 800 also includes determining the configuration of the optical system that produces the conjugate phase plane shape in block 812. For example, the optical correction instruction 152 in Figure 1 may be executed by the processor 142 to determine a command 174 that configures the optical system 110 to produce the conjugate phase plane shape 158.

[0073] In some embodiments, the sensor data 136 in Figure 1 may represent other aspects of atmospheric changes in addition to, or instead of, the measurement results indicating the phase plane shape. For example, another sensor 134 may measure temperature fluctuations within the atmospheric strain region 128, and the optical correction 154 may be determined using information describing the temperature fluctuations. In such embodiments, the optical correction instruction 152 in Figure 1 may be executed by the processor 142 to determine the optical correction 154 based at least partially on the sensor data 136 from the other sensor 134. For example, the memory 144 may store a machine learning model (e.g., a neural network) or calibration data that maps the values ​​of the sensor data 136 from the other sensor 134 to the optical correction configuration of the corresponding optical system 110. In such embodiments, simpler sensors, such as temperature sensors, can be used instead of the complex phase plane sensor 132. Also, in such embodiments, the computational resources used to calculate the optical correction 154 may be less compared to the computational resources used to calculate the phase plane shape changes 156 and the conjugate phase plane shape 158. However, you could first use additional time and resources to generate calibration data or train a machine learning model.

[0074] Figure 9 is a block diagram of a computing environment 900 including a computing device 910 configured to support a laser-based manufacturing method of an object using optical correction. In the particular embodiment shown in Figure 9, the computing device 910 includes, corresponds to, or may be included in the controller 140 of Figures 1 to 3 and 5. Alternatively, the computing device 910 may support the operation of the system 100 by performing part of the calculations for determining the optical correction 154 or by providing machine language instructions to the controller 140 used to determine command 170 or 172. The computing device 910 is configured to support the computer execution methods and computer executable program instructions (or code) of the present disclosure. For example, the computing device 910 or a part thereof is configured to execute instructions 146 for starting, executing or controlling one or more processes described with reference to Figures 1 to 8.

[0075] One or more processors 920 included in the computing device 910 may include or correspond to the processor 142 in Figure 1, or may be different from the processor 142 in Figure 1. The processors 920 are configured to communicate with system memory 930, one or more storage devices 940, one or more input / output interfaces 950, one or more communication interfaces 960, or a combination thereof. The system memory 930 includes volatile memory devices (e.g., random access memory (RAM) devices), non-volatile memory devices (e.g., read-only memory (ROM) devices, programmable read-only memory, flash memory), or both. The system memory 930 stores the operating system 932 and may include a basic input / output system (BIOS) for booting the computing device 910, and a full operating system that enables the computing device 910 to communicate with users, other programs, and other devices. In the example shown in Figure 9, the system memory 930 stores program data 936 (such as calibration data 942, a machine learning model 944, or both) that can be used to determine the optical correction 154 in Figure 1.

[0076] The system memory 930 includes one or more applications 934 (e.g., instruction sets) that can be executed by the processor 920. For example, one or more applications 934 include instructions, e.g., instruction 146, that can be executed by the processor 920 to start, control or execute one or more processes as described with reference to Figures 1 to 8. Additionally or alternatively, applications 934 may include a slicer application 984.

[0077] One or more storage devices 940 include non-volatile storage devices (such as magnetic disks, optical disks, and flash memory devices). In a particular example, storage devices 940 include both removable and non-removable memory devices. Storage devices 940 are configured to store an operating system, an image of the operating system, applications (e.g., one or more applications 934), and program data (e.g., program data 936). In a particular embodiment, system memory 930, storage devices 940, or both include tangible (e.g., non-temporary) computer-readable media. In this context, tangible computer-readable media refers to physical devices and material compositions, rather than mere signals. In a particular embodiment, one or more storage devices 940 are located outside of the computing device 910.

[0078] One or more input / output interfaces 950 enable the computing device 910 to communicate with one or more input / output devices 970 to facilitate user interaction. For example, one or more input / output interfaces 950 may include a display interface, an input interface, or both. For example, an input / output interface 950 is configured to receive input from a user, receive input from other computing devices, or a combination thereof. In some embodiments, the input / output interface 950 conforms to one or more standard interface protocols (such as a serial interface), e.g., a Universal Serial Bus (USB) interface, an IEEE (Institute of Electrical and Electronics Engineers) interface standard, a parallel interface, a display adapter, an audio adapter, or a custom interface ("IEEE" is a registered trademark of the Institute of Electrical and Electronics Engineers in Piscataway, New Jersey). In some embodiments, the input / output devices 970 include one or more user interface devices and displays (e.g., buttons, a keyboard, a pointing device, a display, a speaker, a microphone, a touchscreen, or a combination of other devices). In some embodiments, the sensor 130 communicates with the computing device 910 via the input / output interface 950.

[0079] The processor 920 is configured to communicate with other devices 980 (e.g., other computing devices or controllers 140) via one or more communication interfaces 960. For example, the communication interface 960 may include a wired or wireless network interface. The other devices 980 may include, for example, a 3D modeling device 982. In some embodiments, the 3D modeling device 982 includes a slicer application 984, and the 3D modeling device 982 sends machine code instructions (e.g., G-code) to the computing device 910 via the communication interface 960. In other embodiments, the 3D modeling device 982 sends a 3D model of the object 120 in Figure 1 to the computing device 910 via the communication interface 960, and the application 934 includes the slicer application 984, and the processor 920 executes the application and determines the machine code instructions.

[0080] In the example shown in Figure 9, the computing device 910 may communicate (e.g., send commands) with the laser device 102, the optical system 110, the actuator 160, or a combination thereof via the communication interface 960. In other examples, the computing device 910 may communicate (e.g., send commands) with the laser device 102, the optical system 110, the actuator 160, or a combination thereof via the input / output interface 950.

[0081] In some embodiments, a non-temporary computer-readable medium stores instructions that, when executed by one or more processors, cause one or more processors to start, execute, or control a process that performs some or all of the functions described above. For example, an instruction can be executed to perform one or more of the processes or methods described with reference to Figures 1 to 8. In some embodiments, one or more of the processes or methods described with reference to Figures 1 to 8 can be executed by one or more processors executing the instruction (e.g., one or more central processing units (CPUs), one or more graphics processing units (GPUs), one or more digital signal processors (DSPs)), by dedicated hardware circuits, or a combination thereof.

[0082] The illustrative examples described herein are intended to provide a general understanding of the structure of various embodiments. The examples are not intended to fully describe all elements and features of apparatus and systems using the structures and methods of the disclosure. Many other embodiments will become apparent to those skilled in the art by reference to the disclosure. Other embodiments may be available or derivable from the disclosure, and the structure and logic may be substituted and modified without departing from the scope of the disclosure. For example, the steps of the method may be performed in a different order than shown in the drawings, and one or more steps may be omitted. Accordingly, the disclosure and drawings are to be considered illustrative and not limiting.

[0083] Furthermore, this disclosure includes the following examples, but the scope of protection is given by the claims.

[0084] Example 1 A method for forming an object from a material, comprising: directing a first light beam to a first target location in the material to define a first part of the object; determining an optical correction to be applied by an optical system after directing the first light beam to the first target location (the optical correction is based on atmospheric changes in an atmospheric distortion region near the first target location, at least partially attributable to the interaction between the first light beam and the material); and directing a second light beam to a second target location in the material to define a second part of the object, wherein the second light beam is directed to pass through at least a portion of the atmospheric distortion region while applying the optical correction.

[0085] Example 2 The method according to Example 1, wherein a first light beam defines a first portion of an object by fusing or bonding adjacent portions of the material together so as to define a first portion of the object.

[0086] Example 3 The method according to Example 1 or 2, wherein a first light beam defines a first portion of an object by removing a portion of the material so that the remaining portion of the material defines the first portion of the object.

[0087] Example 4 The method according to any one of Examples 1 to 3, wherein the first light beam has a laser pulse.

[0088] Example 5 The method according to any one of Examples 1 to 4, wherein a first light beam defines a first part of an object by an additive manufacturing process.

[0089] Example 6 The method according to any one of Examples 1 to 5, wherein a first light beam defines a first part of an object by a subtractive manufacturing process.

[0090] Example 7 The method according to any one of Examples 1 to 6, wherein atmospheric changes result in local variations in atmospheric refractive index within an atmospheric distortion region, and optical correction distorts the second light beam to limit the defocusing of the second light beam caused by the local variations in atmospheric refractive index.

[0091] Example 8 The method according to any one of Examples 1 to 7, further comprising receiving sensor data indicating atmospheric changes, wherein optical correction is determined based on the sensor data.

[0092] Example 9 The method according to any one of Examples 1 to 8, wherein the interaction between the first light beam and matter causes atmospheric changes due to temperature changes within the atmospheric strain region, off-gassing of a portion of the matter, or both.

[0093] Example 10 The method according to any one of Examples 1 to 9, comprising determining an optical correction, determining an estimated phase plane shape change induced for the second light beam in the atmospheric distortion region, calculating the conjugate phase plane shape of the second light beam for generating a plane wave at the second target location based on the estimated phase plane shape change, and determining the configuration of an optical system for generating the conjugate phase plane shape.

[0094] Example 11 The method according to Example 10, further comprising directing a measurement light beam into an atmospheric strain region and determining the measurement phase plane shape by measuring the phase plane shape of the measurement light beam, wherein the change in the phase plane shape of the second light beam is estimated based on the measurement phase plane shape of the measurement light beam.

[0095] Example 12 The method according to Example 11, wherein the measurement light beam has one or more beam characteristics different from the first light beam and the second light beam, and one or more beam characteristics include at least one of wavelength, intensity, focus, duty cycle, beam power, beam shape, and pulse characteristics.

[0096] Example 13 The method according to Example 11 or 12, wherein the measurement light beam is directed to coincide with the first light beam.

[0097] Example 14 The method according to any one of Examples 11 to 13, wherein the first light beam has a first wavelength and the measurement light beam has a second wavelength, the second wavelength being shorter than the first wavelength.

[0098] Example 15 A system for forming an object from a material, comprising: one or more laser devices configured to direct light onto the material to process the material and define a first part of the object; an optical system coupled to one or more laser devices and configured to perform optical correction of the light; and a controller coupled to the optical system, wherein the controller is configured to determine, after one or more laser devices direct one or more first light beams onto a first target location of the material to define a first part of the object, an optical correction to be applied by the optical system (the optical correction is based on atmospheric changes in an atmospheric distortion region near the first target location, at least partially attributable to the interaction between one or more first light beams and the material), and to cause the optical system to apply the optical correction to a second light beam from one or more laser devices, so that the second light beam is directed through at least a portion of the atmospheric distortion region to a second target location of the material to define a second part of the object.

[0099] Example 16 The system according to Example 15 further comprises one or more sensors coupled to a controller and configured to generate sensor data indicating atmospheric changes in an atmospheric strain region.

[0100] Example 17 The system according to Example 15 or 16, further comprising: one or more measuring laser devices configured to direct one or more measuring light beams into an atmospheric strain region; and one or more phase-plane sensors configured to generate data indicating phase-plane shape changes induced in one or more measuring light beams due to interaction with the atmospheric strain region, wherein a controller determines optical corrections based on the phase-plane shape changes.

[0101] Example 18 The system according to Example 17, wherein a first laser device among one or more laser devices is configured to generate a pulsed beam, and a specific measuring laser among one or more measuring laser devices is configured to generate a continuous beam.

[0102] Example 19 The system according to Example 17 or 18, wherein the optical system includes a phase plane shape adjustment system that modifies the phase plane shape of one or more light beams emitted by one or more laser devices.

[0103] Example 20 The system according to Example 19, wherein the phase plane shape adjustment system includes one or more spatial light modulators, a plurality of dynamically adjustable lenses, a plurality of dynamically adjustable mirrors, or a combination thereof.

[0104] Furthermore, while specific examples are illustrated and described herein, it should be understood that later configurations designed to obtain the same or similar results are substitutable for the specific embodiments of this disclosure. This disclosure covers all possible later changes and modifications of a wide range of embodiments. By referring to this disclosure, combinations of the above embodiments with other embodiments not specifically described herein will become apparent to those skilled in the art.

[0105] The abstract is submitted with the understanding that it is not intended to interpret or limit the claims or their meaning. Furthermore, in the detailed description above, various features may be grouped together or described in a single embodiment in order to simplify the disclosure. The examples above are illustrative and not limiting of the disclosure. It should also be understood that various modifications and changes are possible in accordance with the principles of the disclosure. As reflected in the attached claims, the subject matter of the claims may cover fewer features than all of the features in any of the examples of the disclosure. Therefore, the scope of the disclosure is defined by the attached claims and their equivalents. [Explanation of symbols]

[0106] 100 Systems 102 Laser Devices 104 Process Laser Devices 106 Measuring Laser Devices 110 Optical Systems 120 Object 122 Substance 124 Measurement light beam 126 Process (Processing) Light Beam 130 sensors 140 controllers

Claims

1. A method (700) for forming an object (120) from a substance (122), The first light beam (126A) is directed at the first target location (402) of the material to define the first part (404) of the object (404), After directing the first light beam towards the first target location, To determine the estimated phase surface shape change induced for the second light beam within the atmospheric distortion region near the first target location, Based on atmospheric changes in the atmospheric distortion region (128) at least partially caused by the interaction between the first light beam and the material, the optical system (110) determines (704) an optical correction (154) to be applied, wherein the optical correction is determined based on the estimated phase plane shape change. The method comprises directing the second light beam (126B) to a second target location (406) of the material to define the second portion of the object, and directing the second light beam to pass through at least a portion of the atmospheric distortion region while applying the optical correction. A method wherein the first light beam is used to define a first portion of the object by an additive manufacturing process.

2. The method according to claim 1, wherein the first light beam has a laser pulse.

3. The method according to claim 1, wherein the atmospheric change causes local fluctuations in the atmospheric refractive index within the atmospheric distortion region, and the optical correction distorts the second light beam to limit the defocusing of the second light beam caused by the local fluctuations in the atmospheric refractive index.

4. The method according to claim 1, further comprising receiving (804) sensor data (136) indicating atmospheric changes, wherein the optical correction is determined based on the sensor data.

5. The method according to claim 1, wherein the interaction between the first light beam and the material causes the atmospheric change to occur due to a thermal change in the atmospheric distortion region, off-gas release of a portion of the material, or both.

6. Determining the optical correction is Determining the estimated phase plane shape change (156) induced by the second light beam within the atmospheric distortion region (808), Based on the estimated phase plane shape change, the conjugate phase plane shape (158) of the second light beam for generating a plane wave at the second target location is calculated (810), The method according to claim 1, comprising (812) determining the configuration of the optical system for generating the conjugate phase plane shape.

7. Directing the measurement light beam (124) to the aforementioned atmospheric distortion region, The method according to claim 6, further comprising (806) determining the measured phase plane shape by measuring the phase plane shape of the measurement light beam, wherein the change in the phase plane shape of the second light beam is estimated based on the measured phase plane shape of the measurement light beam.

8. The measurement light beam has one or more beam characteristics different from the first light beam and the second light beam, and the one or more beam characteristics include one or more of the following: wavelength, intensity, focal point, duty cycle, beam power, beam shape, and pulse characteristics, and / or The method according to claim 7, characterized in that the measurement light beam is directed to coincide with the first light beam.

9. The method according to claim 7, wherein the first light beam has a first wavelength, and the measurement light beam has a second wavelength, the second wavelength being shorter than the first wavelength.

10. A system (100) for forming an object (120) from a substance (122), One or more laser devices (102) configured to direct light towards a material to process the material and define a portion of the object, An optical system (110) coupled to one or more laser devices and configured to perform optical correction of the light, The optical system comprises a controller (140) coupled to the optical system, The controller, after the one or more laser devices have directed one or more first light beams (126A) at a first target location (402) of the material and defined a first portion (404) of the object, To determine the estimated phase surface shape change induced for the second light beam within the atmospheric distortion region near the first target location, The optical system determines an optical correction (154) to be applied based on atmospheric changes in the atmospheric distortion region (128) at least partially caused by the interaction of one or more first light beams with the material, wherein the optical correction is determined based on the estimated phase plane shape change. The optical system is configured to apply the optical correction to the second light beam (126B) from one or more laser devices, such that the second light beam is directed through at least a portion of the atmospheric distortion region to a second target location (406) of the material to define a second portion of the object. The system wherein the first light beam defines a first part of the object by an additive manufacturing process.

11. The system according to claim 10, further comprising one or more sensors (130) coupled to the controller and configured to generate sensor data (136) indicating atmospheric changes in the atmospheric strain region.

12. One or more measurement laser devices (106) configured to direct one or more measurement light beams (124) into the atmospheric strain region, The system according to claim 10, further comprising: one or more phase-plane sensors (132) configured to generate data (136) indicating a phase-plane shape change (156) induced in one or more measurement light beams due to interaction with the atmospheric distortion region, wherein the controller determines the optical correction based on the phase-plane shape change.

13. The system according to claim 12, wherein one or more laser devices are configured to generate a pulsed beam, and one or more measuring laser devices are configured to generate a continuous beam.

14. The system according to claim 12 or 13, wherein the optical system includes a phase plane shape adjustment system (112) that changes the phase plane shape of one or more light beams emitted by the one or more laser devices.

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