electronic machinery

Abstract

An electronic device according to the present disclosure has a communication function, and comprises: a communication module that has a first module surface and a second module surface which faces the first module surface; a first heat-dissipating material that is disposed on the first module surface; an input interface that is operated by a user; and a housing that accommodates the communication module and that has a first surface which faces the first module surface and a second surface which faces the first surface and to which the input interface is provided. The first surface of the housing has a first depressed part that is depressed toward the second surface, and the first depressed part has a first wall part that contacts the first heat-dissipating material.

Description

Technical Field

[0001] The present disclosure relates to an electronic device.

Background Art

[0002] Patent Document 1 discloses a communication module including a heating element mounted on a circuit board and a heat dissipation member held between the housing and the heating element.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

[0004] The electronic device equipped with the communication module described in Patent Document 1 still has room for improvement in terms of improving the heat dissipation function.

[0005] The present disclosure provides an electronic device with an improved heat dissipation function.

[0006] An electronic device according to an aspect of the present disclosure includes a communication module having a communication function and a first module surface and a second module surface facing the first module surface, a first heat dissipation material disposed on the first module surface, an input interface operated by a user, and a housing that houses the communication module and has a first surface facing the first module surface and a second surface provided with the input interface and facing the first surface. The first surface of the housing has a first recess recessed toward the second surface, and the first recess has a first wall portion that contacts the first heat dissipation material.

[0007] According to the present disclosure, an electronic device with an improved heat dissipation function can be provided.

Brief Description of the Drawings

[0008] [Figure 1] Perspective view showing an example of an electronic device according to Embodiment 1 [Figure 2] Figure 1 shows the second side of the second housing of the electronic device. [Figure 3] Figure 1 shows the first side of the second housing of the electronic device. [Figure 4] Figure 2: Exploded perspective view [Figure 5] Diagram showing the arrangement of communication modules [Figure 6A] Perspective view of the communication module [Figure 6B] Perspective view of the communication module [Figure 7A] Perspective cross-sectional view of electronic equipment along line AA shown in Figure 4. [Figure 7B] Perspective cross-sectional view of electronic equipment along line BB shown in Figure 4. [Figure 8A] Enlarged view of Figure 3 [Figure 8B] Cross-sectional view of the first recess along the CC line shown in Figure 8A. [Modes for carrying out the invention]

[0009] (Background leading to this disclosure) In recent years, electronic devices have been equipped with communication modules that offer faster communication capabilities. However, these communication modules generate more heat than conventional communication modules. When communication modules generate a large amount of heat, heat accumulates around them, which can degrade the speed and quality of communication. Therefore, improved heat dissipation is required in electronic devices.

[0010] Therefore, in order to solve the above problems, the present inventors have found a configuration in which a recess is provided on the side of the electronic device housing opposite to the side on which the input interface is located, and heat is dissipated through the recess, leading to this disclosure.

[0011] The electronic device according to the first aspect of the present disclosure includes a communication module having a communication function and having a first module surface and a second module surface facing the first module surface, a first heat dissipation material disposed on the first module surface, an input interface operated by a user, a housing that houses the communication module and has a first surface facing the first module surface and a second surface provided with the input interface and facing the first surface. A first concave portion recessed toward the second surface is formed on the first surface of the housing, and the first concave portion is formed by a first wall portion that contacts the first heat dissipation material.

[0012] With such a configuration, an electronic device with an improved heat dissipation function can be provided.

[0013] In the electronic device according to the second aspect of the present disclosure, one or more fins rising in the thickness direction from the second surface toward the first surface are provided in the first concave portion.

[0014] With such a configuration, by providing fins, an electronic device with a further improved heat dissipation function can be provided.

[0015] In the electronic device according to the third aspect of the present disclosure, the first wall portion has a bottom portion orthogonal to the thickness direction, the bottom portion contacts the first heat dissipation material, and one or more fins rise from the bottom portion in the thickness direction.

[0016] With such a configuration, by bringing the first heat dissipation material and the fins closer to each other, an electronic device with a further improved heat dissipation function can be provided.

[0017] In the electronic device according to the fourth aspect of the present disclosure, when viewed in the thickness direction, the first concave portion forms a rectangular shape, the first wall portion has two side walls extending along the thickness direction and facing each other, and a plurality of fins are provided in the first concave portion between the two side walls and extending parallel to each other.

[0018] With such a configuration, by increasing the surface area of the fins, an electronic device with a further improved heat dissipation function can be provided.

[0019] In the electronic device according to the fifth aspect of the present disclosure, the plurality of fins are provided at equal intervals.

[0020] With such a configuration, air easily enters around the fins, so that heat exchange between the fins and the air is promoted, and an electronic device with further improved heat dissipation function can be provided.

[0021] The electronic device according to the sixth aspect of the present disclosure further includes a second heat dissipation material disposed on the second module surface, and a second concave portion recessed toward the first surface is formed on the second surface of the housing, and the second concave portion is formed by a second wall portion that contacts the second heat dissipation material.

[0022] With such a configuration, by forming concave portions on both surfaces of the housing, an electronic device with further improved heat dissipation function can be provided.

[0023] In the electronic device according to the seventh aspect of the present disclosure, the second concave portion, the communication module, and the first concave portion are arranged side by side in the thickness direction from the second surface to the first surface.

[0024] With such a configuration, by forming concave portions on both sides of the communication module, an electronic device with further improved heat dissipation function can be provided.

[0025] In the electronic device according to the eighth aspect of the present disclosure, the communication module has a control unit, and the second concave portion, the control unit, and the first concave portion are arranged side by side in the thickness direction.

[0026] With such a configuration, by forming concave portions on both sides of the heat-generating control unit, an electronic device with further improved heat dissipation function can be provided.

[0027] In the electronic device according to the ninth aspect of the present disclosure, the second concave portion is covered by an input interface.

[0028] This configuration, through the placement of the input interface, prevents heat dissipated from the communication module through the second recess from being directly transmitted to the user of the electronic device.

[0029] An electronic device according to a tenth aspect of this disclosure further comprises a cover that covers the second recess.

[0030] This configuration prevents water or other liquids that enter between the housing and the input interface from flowing into the interior of the second recess.

[0031] The embodiments of this disclosure will be described below with reference to the attached drawings. In addition, each element in each drawing is exaggerated for the sake of clarity.

[0032] In this specification, terms such as “First,” “Second,” etc., are used for illustrative purposes only and should not be understood as expressing or implying relative importance or ranking of technical features. Features designated as “First” or “Second” express or imply that they include one or more such features.

[0033] (Embodiment 1) [Regarding the overall configuration of electronic equipment] Figure 1 is a schematic perspective view of an example of an electronic device 1 according to Embodiment 1 of this disclosure. The X, Y, and Z directions in the figure represent the width, depth, and thickness of the electronic device 1, respectively.

[0034] As shown in Figure 1, the electronic device 1 is a notebook-type personal computer (laptop PC). The electronic device 1 comprises a first enclosure 2 and a second enclosure 3. The first enclosure 2 and the second enclosure 3 have a thin, box-shaped outer shell and are rectangular in shape.

[0035] The first housing 2 houses the display unit 4. The display unit 4 is, for example, a liquid crystal display. The display surface of the display unit 4 is exposed from the first housing 2. The first housing 2 also houses an array microphone, an imaging unit, an antenna, and the like.

[0036] The second enclosure 3 houses the input interface. The input interface is, for example, a keyboard 5 and a touchpad 6. The input interface is exposed from the second enclosure 3. In this specification, the keyboard 5 and touchpad 6 may be referred to as input interfaces 5 and 6. Inside the second enclosure 3 are circuits such as the CPU and memory, and a battery.

[0037] The first housing 2 and the second housing 3 are connected via a hinge portion 7. The hinge portion 7 rotatably connects the first housing 2 and the second housing 3. The hinge portion 7 allows the first housing 2 and / or the second housing 3 to rotate, enabling the electronic device 1 to be in an open state and a closed state. The "open state" means that the first housing 2 and the second housing 3 are separated, and the display unit 4 and input interfaces 5,6 are exposed. The "closed state" means that the first housing 2 and the second housing 3 are positioned facing each other, with the display unit 4 and input interfaces 5,6 facing each other, and the display unit 4 and input interfaces 5,6 are not exposed.

[0038] The first housing 2 and the second housing 3 are made of a metal material. For example, the first housing 2 and the second housing 3 are made of a magnesium alloy. The thickness of the magnesium alloy forming the first housing 2 and the second housing 3 is, for example, 1.2 mm or more and 1.5 mm or less.

[0039] [Cabinet] Here, the second housing 3 will be described in more detail with reference to Figures 2 to 4. Figure 2 is a view of the second surface of the second housing 3 of the electronic device 1. Figure 3 is a view of the first surface of the second housing 3 of the electronic device 1. Figure 4 is an exploded perspective view of Figure 2.

[0040] As shown in Figures 2 and 3, the second housing 3 has a first surface 32 and a second surface 31. In this embodiment, the first surface 32 corresponds to the bottom surface, and the second surface 31 corresponds to the top surface. The first surface 32 and the second surface 31 face each other and are aligned in the thickness direction Z. As shown in Figure 2, the second surface 31 is the surface on which the keyboard 5 is placed. As shown in Figure 3, the first surface 32 is the surface opposite to the first surface 32, and may be a surface that the user of the electronic device 1 does not often touch when using the electronic device 1. The first surface 32 is, for example, the surface that is placed on a table, counter or workbench when the electronic device 1 is in use.

[0041] The first surface 32 and the second surface 31 are exposed to the outside air. The first surface 32 may be exposed to the outside air so as to be in direct contact with the outside air. For example, the first surface 32 is exposed to the outside air over its entire surface. The second surface 31 may form a gap between itself and the keyboard 5 through which outside air can flow in.

[0042] As shown in Figure 3, a first recess 34 is formed in the first surface 32, recessed toward the second surface 31. The first recess 34 is formed by a first wall portion 36 that is recessed from the first surface 32 toward the second surface 31. The first recess 34 has a plurality of fins 38 that rise in the thickness direction Z. The fins 38 are thin, plate-like members. The fins 38 are made of metal. For example, the fins 38 are made of a magnesium alloy.

[0043] As shown in Figure 4, a second recess 33 is formed in the second surface 31 on which the keyboard 5 is placed, recessing toward the first surface 32. The second recess 33 is formed by a second wall portion 35 that is recessed from the second surface 31 toward the first surface 32. The second recess 33 is covered by a lid 37. The second recess 33 may be sealed by the lid 37. As shown in Figure 4, the lid 37 is covered by the keyboard 5.

[0044] When viewed from the thickness direction Z, the first recess 34 and the second recess 33 may have a polygonal shape. The first recess 34 may, for example, be rectangular. The second recess 33 may, for example, be trapezoidal.

[0045] The detailed structures of the first recess 34 and the second recess 33 will be described later.

[0046] [Communication module] Figure 5 shows the arrangement of the communication module 8 with a portion of the second surface 31 of the second housing 3 omitted. Figures 6A and 6B are perspective views of the communication module 8.

[0047] As shown in Figure 5, a communication module 8 is housed inside the second enclosure 3. The communication module 8 is a circuit equipped with communication functions. More specifically, the communication module 8 is an integrated circuit that enables communication with external devices via a network, and communicates in accordance with standards such as Wi-Fi, IEEE 802.2, IEEE 802.3, third-generation mobile communication system (3G), fourth-generation mobile communication system (4G), fifth-generation mobile communication system (5G), and Long-Term Evolution (LTE). The network is a wide-area network (WAN), local area network (LAN), etc. For example, the communication module 8 communicates via a wireless WAN in accordance with the 5G standard using a frequency of 28 GHz or higher.

[0048] The communication module 8 has a first module surface 82 facing the first surface 32 and a second module surface 81 facing the second surface 31 (Figures 6A and 6B). The communication module 8 is positioned beneath the keyboard 5 (Figure 4). Viewed from the thickness direction Z, the communication module 8 may be covered by the keyboard 5. The communication module 8 may also be positioned away from the outer periphery of the second housing 3. For example, the communication module 8 may be positioned beneath the keyboard 5 near its center.

[0049] The communication module 8 is electrically connected to the electronic circuit board 18. The electronic circuit board 18 is equipped with a processor that controls the electronic device 1. The communication module 8 is electrically connected at one end to a connector 18A on the electronic circuit board 18, and fixed to the electronic circuit board 18 at the other end. The other end of the communication module 8 is fixed, for example, by a screw 19.

[0050] As shown in Figures 6A and 6B, in this embodiment, the communication module 8 includes a communication module board 83A, a control unit 84 mounted on the communication module board 83A (Figures 7A and 7B), and a case 83B covering the control unit 84. The communication module board 83A forms a second module surface 81, and the case 83B forms a first module surface 82. The control unit 84 includes a processor that performs communication functions. The control unit 84 may include a plurality of electronic components. When the communication module 8 is in operation, the control unit 84 generates heat. The case 83B may be made of metal, allowing the heat generated from the control unit 84 to be diffused throughout the case 83B.

[0051] [Heat dissipation material] As shown in Figure 6A, the second heat dissipation material 9 is placed on the second module surface 81. As shown in Figure 6B, the first heat dissipation material 10 is placed on the first module surface 82.

[0052] The heat dissipation materials 9 and 10 are sheet-shaped heat dissipation rubber with heat dissipation capabilities. The heat dissipation materials 9 and 10 are in physical contact with the first module surface 82 and the second module surface 81, respectively. The heat dissipation materials 9 and 10 may be arranged on a part of the second module surface 81 and the first module surface 82, or on the entire surface. The heat dissipation materials 9 and 10 are arranged, for example, to sandwich the control unit 84.

[0053] The heat dissipation materials 9 and 10 may contain silicone rubber. For example, the heat dissipation materials 9 and 10 are a mixture of silicone polymer and ceramics. The heat dissipation materials 9 and 10 may be formed from the same material and may have the same thickness and size.

[0054] In addition to their heat dissipation function, the heat dissipation materials 9 and 10 also have the function of mitigating the impact when the electronic device 1 is dropped.

[0055] Here, with reference to Figures 7A and 7B, the positional relationship between the first recess 34, the second recess 33, and the communication module 8 will be explained.

[0056] Figure 7A is a perspective cross-sectional view of the electronic device 1 along line AA shown in Figure 4. Figure 7B is a perspective cross-sectional view of the electronic device 1 along line BB shown in Figure 4.

[0057] As shown in Figures 7A and 7B, the second recess 33, the communication module 8, and the first recess 34 are arranged side by side in the thickness direction Z. The arrangement of the second recess 33, the communication module 8, and the first recess 34 side by side in the thickness direction Z means that, when viewed from the thickness direction Z, each structure partially overlaps. For example, the second recess 33 may be offset from the first recess 34, or the first recess 34 and the second recess 33 may be arranged to overlap completely.

[0058] More specifically, the second recess 33, the control unit 84 of the communication module 8, and the first recess 34 are arranged side by side in the thickness direction Z. Viewed from the thickness direction Z, the control unit 84 may be located inside the first wall portion 36 that defines the first recess 34.

[0059] Furthermore, the second wall portion 35 in the second recess 33 has a bottom portion 39 perpendicular to the thickness direction Z and a side wall 41 extending in the thickness direction Z from the outer circumference of the bottom portion 39. The first wall portion 36 in the first recess 34 has a bottom portion 40 perpendicular to the thickness direction Z and a side wall 42 extending in the thickness direction Z from the outer circumference of the bottom portion 40. As shown in Figures 7A and 7B, the bottom portion 40 extends in directions perpendicular to the thickness direction Z (X direction and Y direction).

[0060] The second wall portion 35 is in physical contact with the second heat dissipation material 9, and the first wall portion 36 is in physical contact with the first heat dissipation material 10. More specifically, the surface of the bottom portion 39 on the first surface 32 side is in physical contact with the second heat dissipation material 9, and the surface of the bottom portion 40 on the second surface 31 side is in physical contact with the first heat dissipation material 10. Therefore, the bottom portions 39 and 40 are in contact with the communication module 8 via the heat dissipation materials 9 and 10. In addition, the other surface of the bottom portion 39 and the other surface of the bottom portion 40 are in contact with the outside air.

[0061] Viewed from the thickness direction Z, the bottom portion 39 may have a smaller area than the second heat dissipation material 9 and may be positioned inside the outer circumference of the second heat dissipation material 9. Viewed from the thickness direction Z, the bottom portion 40 may have an area approximately equal to that of the first heat dissipation material 10. Also, the area of ​​the bottom portion 40 in contact with the first heat dissipation material 10 may be larger than the area of ​​the bottom portion 39 in contact with the second heat dissipation material 9. With such a structure, heat dissipation via the first surface 32 can be preferentially carried out. Therefore, the heat of the electronic device 1 can be released away from the user.

[0062] The bottom portion 39, the second heat dissipation material 9, the communication module 8, the first heat dissipation material 10, and the bottom portion 40 are arranged in line with the thickness direction Z. In other words, the communication module 8 is positioned between the bottom portion 39 and the second heat dissipation material 9, and the bottom portion 40 and the first heat dissipation material 10.

[0063] Furthermore, as shown in Figure 7A, the depth D1 of the second recess 33 from the opening to the bottom 39 along the thickness direction Z is greater than the depth D2 of the first recess 34 from the opening to the bottom 40. This configuration allows for easy removal of the communication module 8 by accessing it from the first surface 32 side of the second housing 3, even when replacing or repairing it. In addition, even if the communication module 8 is located close to the first surface 32, the heat dissipation function can be improved by the second heat dissipation material 9 and the second recess 33.

[0064] The opening area of ​​the second recess 33 decreases from the second surface 31 towards the first surface 32. The opening area refers to the area of ​​the opening in a cross-section along the XY plane. With this structure, the second recess 33 can be easily formed using a mold.

[0065] Figure 8A is an enlarged view of region R in Figure 3. Figure 8B is a cross-sectional view of the first recess 34 along the CC line shown in Figure 8A. As shown in Figures 8A and 8B, the first recess 34 has four side walls 42A to 42D. Side walls 42A and 42B face each other in the X direction. Side walls 42C and 42D face each other in the Y direction. Also, side wall 42 is a collective term for side walls 42A to 42D. The multiple fins 38 provided in the first recess 34 extend from the bottom 40 in the thickness direction Z, and the surface extending in the thickness direction Z is in contact with the outside air. The fins 38 may be arranged parallel to each other. Specifically, the fins 38 extend from side wall 42C toward side wall 42D between side wall 42A and side wall 42B. Therefore, the fins 38 divide the first recess 34 into multiple recesses.

[0066] As shown in Figure 8B, the thickness T1 of the fin 38 is between 0.5 mm and 2.0 mm. For example, the thickness T1 of the fin 38 is 1.0 mm. The spacing W1 between adjacent fins 38 is between 3.0 mm and 8.00 mm. For example, the spacing W1 between fins 38 is 5.0 mm. This structure prevents foreign matter from getting stuck between adjacent fins 38. The thickness and spacing of the fins 38 may be constant or tapered. When the thickness of the fins 38 increases toward the second surface 31, the first recess 34 can be easily formed using a mold. When the thickness and spacing of the fins 38 change, the thickness T1 and spacing W1 are the minimum values ​​of the thickness and spacing of the fins 38, respectively.

[0067] The fin 38 may be formed integrally with the first wall portion 36. For example, the fin 38 may be formed integrally with the first surface 32 of the second housing 3.

[0068] [Operation] In the structure described above, when the communication module 8 generates heat, a temperature gradient is formed between the communication module 8 and the bottom parts 39 and 40. The heat generated in the communication module 8 is conducted along the temperature gradient through the heat dissipation materials 9 and 10 to the bottom parts 39 and 40 and dissipated. More specifically, the heat generated in the communication module 8 is diffused into the outside air through heat exchange between the bottom parts 39 and 40 and the outside air. In addition, the fins 38 provided on the bottom part 40 allow more outside air to come into contact with the fins 38, improving the efficiency of heat exchange between the fins 38 and the outside air. As a result, more heat can be dissipated from the bottom part 40.

[0069] As a comparative example of the first recess 34, a first recess without fins 38 was examined. Thermal analysis performed under conditions in which the communication module 8 was operating showed that the maximum temperature in the first recess 34 was lower than the maximum temperature in the first recess. Therefore, it is shown that the heat dissipation function of the electronic device 1 can be improved by providing fins 38 in the first recess 34.

[0070] [effect] The electronic device 1 of Embodiment 1 can achieve the following effects.

[0071] The electronic device 1 of Embodiment 1 comprises a communication module 8, a first heat dissipation material 10, a keyboard 5, and a second housing 3. The communication module 8 has a communication function and has a first module surface 82 and a second module surface 81 facing the first module surface 82. The first heat dissipation material 10 is placed on the first module surface 82. The keyboard 5 is operated by the user. The second housing 3 houses the communication module 8 and has a first surface 32 facing the first module surface 82, and a second surface 31 on which the keyboard 5 is provided and facing the first surface 32. A first recess 34 is formed on the first surface 32 of the second housing 3, recessed toward the second surface 31, and the first recess 34 is formed by a first wall portion 36 that contacts the first heat dissipation material 10.

[0072] This configuration improves the heat dissipation function of the communication module 8 through heat exchange between the second housing 3 and the first heat dissipation material 10. Furthermore, the formation of the first recess 34 allows the first heat dissipation material 10 to be kept thin. This further improves the heat dissipation function of the communication module 8.

[0073] In the electronic device 1 of Embodiment 1, the first recess 34 is provided with a plurality of fins 38 that rise in the thickness direction Z from the second surface 31 toward the first surface 32.

[0074] This configuration allows for an increase in the surface area that can exchange heat with the outside air by providing the fins 38. This further improves the heat dissipation function of the communication module 8.

[0075] In the electronic device 1 of Embodiment 1, the first wall portion 36 has a bottom portion 40 perpendicular to the thickness direction Z. The bottom portion 40 is in contact with the first heat dissipation material 10. Multiple fins 38 rise from the bottom portion 40 in the thickness direction Z.

[0076] With this configuration, by bringing the bottom portion 40 into contact with the first heat dissipation material 10, the temperature of the bottom portion 40 approaches that of the communication module 8, and the temperature difference with the fins 38 can be increased. Therefore, the heat dissipation function of the communication module 8 is further improved.

[0077] In the electronic device 1 of Embodiment 1, the first recess 34 forms a rectangular shape when viewed from the thickness direction Z. The first wall portion 36 has two side walls 42 that extend along the thickness direction Z and face each other. The plurality of fins 38 are provided in the first recess 34, extending parallel to each other between the two side walls 42.

[0078] This configuration further improves the heat dissipation function of the communication module 8 by increasing the surface area of ​​the fins 38 compared to the case where a single fin 38 is provided. In addition, by arranging multiple fins 38 around each other, more fins 38 can be placed in the first recess 34.

[0079] In the electronic device 1 of Embodiment 1, the multiple fins 38 are provided at equal intervals.

[0080] This configuration allows air to easily enter around the fins 38, promoting heat exchange between the fins 38 and the air, and further improving the heat dissipation function of the communication module 8.

[0081] The electronic device 1 of Embodiment 1 further includes a second heat dissipation material 9 arranged on the second module surface 81. The second surface 31 of the second housing 3 has a second recess 33 formed inward toward the first surface 32, and the second recess 33 teeth It is formed by a second wall portion 35 that is in contact with the second heat dissipation material 9.

[0082] This configuration further improves the heat dissipation function of the communication module 8 by forming the second recess 33 and the first recess 34 on both sides of the second housing 3. Furthermore, by forming the second recess 33 and the first recess 34, the thickness of the second housing 3 on the first surface 32 and the second surface 31 can be kept approximately constant while the bottom portions 39 and 40 can be brought into contact with the heat dissipation materials 9 and 10. This makes it easier to manufacture the second housing 3.

[0083] In the electronic device 1 of Embodiment 1, the second recess 33, the communication module 8, and the first recess 34 are arranged side by side in the thickness direction Z from the second surface 31 to the first surface 32.

[0084] This configuration further improves the heat dissipation function of the communication module 8 by sandwiching both sides of the communication module 8 between the second recess 33 and the first recess 34.

[0085] In the electronic device 1 of Embodiment 1, the communication module 8 has a control unit 84. The second recess 33, the control unit 84, and the first recess 34 are arranged side by side in the thickness direction Z.

[0086] This configuration allows more heat to be dissipated from the control unit 84, which is a heat-generating element, by sandwiching both sides of the control unit 84 between the second recess 33 and the first recess 34, thereby further improving the heat dissipation function of the communication module 8.

[0087] In the electronic device 1 of Embodiment 1, the second recess 33 is covered by the keyboard 5.

[0088] With this configuration, the placement of the keyboard 5 prevents heat dissipated from the communication module 8 through the second recess 33 from being directly transmitted to the user of the electronic device 1. Furthermore, because the second recess 33 is located below the keyboard 5, it is possible to suppress the temperature rise of the parts of the electronic device 1 that the user directly touches.

[0089] The electronic device 1 of Embodiment 1 further includes a cover 37 that covers the second recess 33.

[0090] This configuration prevents foreign matter, water, etc. that enter the gap between the second housing 3 and the keyboard 5 from entering the interior of the second recess 33.

[0091] In this embodiment, an example was described in which the electronic device 1 is a laptop PC, but it is not limited to this. For example, the electronic device 1 may be a tablet PC, a smartphone, or other information processing device.

[0092] Although an example with multiple fins 38 has been described, the invention is not limited to this. The first recess 34 does not necessarily have to have a fin 38, or it may have only one fin 38.

[0093] Although an example has been described in which fins 38 are arranged parallel to each other, the system is not limited to this. The fins 38 may be arranged in a grid pattern, for example.

[0094] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various variations and modifications will be obvious to those skilled in the art. Such variations and modifications should be understood to be included within the scope of this disclosure as defined by the attached claims. [Industrial applicability]

[0095] This disclosure can improve the heat dissipation function of electronic devices and is therefore applicable to electronic devices (e.g., laptop PCs, tablet PCs, etc.). [Explanation of symbols]

[0096] 1 Electronic equipment 2. First cabinet 3. Second cabinet 4 Display section 5 Keyboards 6 Touchpads 7. Hinge section 8. Communication Module 9 Second heat dissipation material 10 1st heat dissipation material 31 Side 2 32 Page 1 33 Second recess 34. First recess 35 Second wall section 36 1st wall section 37 Lid 38 fins 39 Bottom 40 bottom 41 Side wall 42 Side wall 84 Control Unit

Claims

1. A communication module having a communication function and having a first module surface and a second module surface facing the first module surface, The first heat dissipation material is arranged on the first module surface, The user-operated input interface, A housing for housing the communication module, having a first surface facing the first module surface and a second surface facing the first surface on which the input interface is provided, Equipped with, The first surface of the housing has a first recess that is recessed toward the second surface, The first recess has a first wall portion that contacts the first heat dissipation material, The second module surface further comprises a second heat dissipation material, The second surface of the housing has a second recess that is recessed toward the first surface, The second recess has a second wall portion that contacts the second heat dissipation material. electronic equipment.

2. The first recess has one or more fins that rise in the thickness direction from the second surface toward the first surface. The electronic device according to claim 1.

3. The first wall portion has a bottom portion that extends in a direction perpendicular to the thickness direction, The bottom portion is in contact with the first heat dissipation material, The one or more fins rise from the bottom in the thickness direction, The electronic device according to claim 2.

4. When viewed from the thickness direction, the first recess forms a rectangular shape. The first wall portion has two side walls that extend along the thickness direction and face each other, The plurality of fins are provided in the first recess, extending parallel to each other between the two side walls. The electronic device according to claim 2.

5. The aforementioned multiple fins are arranged at equal intervals. The electronic device according to claim 4.

6. The second recess, the communication module, and the first recess are aligned in the thickness direction from the second surface to the first surface. The electronic device according to claim 1.

7. The communication module has a control unit, The second recess, the control unit, and the first recess are aligned in the thickness direction. The electronic device according to claim 6.

8. The second recess is covered by the input interface, The electronic device according to claim 1.

9. The system further comprises a cover that covers the second recess, The electronic device according to claim 1.

10. The cover is covered by the input interface, The electronic device according to claim 9.

11. The depth of the second recess is greater than the depth of the first recess. The electronic device according to claim 1.

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