Substrate processing apparatus and substrate transport method

Abstract

To provide substrate processing equipment comprising a transportation mechanism having a plurality of hands supporting substrates, and a substrate transportation method using the transportation mechanism having the plurality of hands.SOLUTION: Substrate processing equipment 100 comprises: a substrate mounting portion 29 which includes a first support unit group having ten first support units, each supporting a single substrate W, and on which a plurality of substrates are mounted; a plurality of processing units 21 which process the substrates; a first transportation mechanism 7 which has five first hands 9 each for supporting a wafer and transports the substrate from a carrier C which houses a plurality of substrates to the substrate mounting portion; and a second transportation mechanism 23 which has two second hands 25 each supporting the substrate and transports substrates from the substrate mounting portion to the plurality of processing units.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a substrate transfer method.

Background Art

[0002] The substrate processing system described in Patent Document 1 includes a first processing unit, a second processing unit, a main transfer device, a first transfer device, and a second transfer device.

[0003] The main transfer device includes a plurality (five) of wafer holding parts for holding wafers. The main transfer device can move in the horizontal and vertical directions and can turn around a vertical axis, and can simultaneously transfer a plurality of wafers between a cassette and a transfer block using the wafer holding parts.

[0004] The first transfer device includes one wafer holding part. Then, the first transfer device performs a process of taking out a wafer from a transfer block and transferring it to the first processing unit using the wafer holding part, and a process of taking out the wafer processed by the first processing unit from the first processing unit and transferring it to the transfer block. Therefore, the wafer holding part is shared by the wafer before processing and the wafer after processing.

[0005] The second transfer device includes one wafer holding part. Then, the second transfer device performs a process of taking out a wafer from a transfer block and transferring it to the second processing unit using the wafer holding part, and a process of taking out the wafer processed by the second processing unit from the second processing unit and transferring it to the transfer block. Therefore, the wafer holding part is shared by the wafer before processing and the wafer after processing.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

[0007] One embodiment of the present invention provides a substrate processing apparatus equipped with a transport mechanism having a plurality of hands for supporting a substrate, and a substrate transport method using a transport mechanism having a plurality of hands. [Means for solving the problem]

[0008] One embodiment of this invention comprises a first support group having 10 first support parts, each supporting a single substrate, a first substrate mounting section on which multiple substrates are placed, and 10 first support parts, each supporting a single substrate 3 The part having a support 3 The present invention provides a substrate processing apparatus comprising: a support group, a second substrate mounting section positioned above the first substrate mounting section and on which multiple substrates are mounted; a plurality of processing units for processing substrates; a first transport mechanism having five first hands, each supporting a single substrate, for transporting substrates from a carrier accommodating multiple substrates to the first substrate mounting section or the second substrate mounting section; and a lower transport mechanism having two lower hands, each supporting a single substrate, for transporting substrates from the first substrate mounting section to the plurality of processing units. The lower transport mechanism may be located in a lower transport chamber having an internal space. The substrate processing apparatus may further include an upper transport mechanism having two upper hands, each supporting a single substrate, for transporting substrates from the second substrate mounting section to the plurality of processing units. The upper transport mechanism may be located in an upper transport chamber having an internal space and positioned above the lower transport chamber. The center of the vertical height of the first substrate mounting section may be located above the center of the vertical height of the lower transport chamber. The center of the vertical height of the second substrate mounting section may be located below the center of the vertical height of the upper transport chamber.

[0009] In one embodiment, the first transport mechanism is a carrier capable of accommodating 25 substrates. ra base The plate The first substrate mounting section or the second Transport to the substrate mounting section.

[0010] In one embodiment, the first transport mechanism uses five of the first hands 1 From the substrate mounting section to the carrier Based on Further transport of the boards. Lower transport mechanism The processing unit 1 Substrate mounting section Based on Further transport of the boards.

[0011] In one embodiment, Lower transport mechanism The two aforementioned Lower hand A total of four of the above Lower hand It has the above. Lower transport mechanism The four aforementioned Lower hand Using two of the above 1 From the substrate mounting section to the processing unit Based on The board is transported, and the four aforementioned Lower hand Of these, the remaining two are used to process the data from the processing unit. 1 Substrate mounting section Based on Transport the boards.

[0012] In one embodiment, the first substrate mounting section has 10 components that each support a single substrate. 2 The part having a support 2 The first transport mechanism further comprises a group of support parts. The first transport mechanism transports the substrate from the carrier to the first group of support parts with five first hands, and the five first hands 2 The substrate is transported from the support group to the carrier. The lower transport mechanism uses two of the four lower hands to transport the substrate from the first support group to the processing unit, and uses the remaining two of the four lower hands to transport the substrate from the processing unit. 2 The substrate is transported to the support group.

[0013] In one embodiment, in the first substrate mounting section, the first support group is arranged in the lower section, 2 The support structure is positioned in the upper section.

[0014] In one embodiment, 1st unit From the plate mounting section to the processing unit Based onThe two that convey the board Lower hand are continuous in the vertical direction, and from the processing unit to the 1 substrate placement unit Based on The two that convey the board Lower hand are continuous in the vertical direction, and four The aforementioned lower hand are arranged with a gap in the vertical direction.

[0015] In one embodiment, of the four lower hands, the two lower hands that are continuous in the vertical direction in the lower stage convey the substrate from the first substrate placement unit to the processing unit, and the two lower hands that are continuous in the vertical direction in the upper stage convey the substrate from the processing unit to the first substrate placement unit. The upper transfer mechanism may further transfer the substrate from the processing unit to the second substrate placement unit. The upper transfer mechanism may have a total of four upper hands including the two upper hands. The upper transfer mechanism may transfer the substrate from the first substrate placement unit to the processing unit using two of the four upper hands, and transfer the substrate from the processing unit to the second substrate placement unit using the remaining two of the four upper hands. The second substrate placement unit may further include a fourth support part group having ten fourth support parts that respectively support one substrate. The first transfer mechanism may transfer the substrate from the carrier to the 3 support part group using five of the first hands, and transfer the substrate from the fourth support part group to the carrier using five of the first hands. The upper transfer mechanism may transfer the substrate from the 3 support part group to the processing unit using two of the four upper hands, and transfer the substrate from the processing unit to the fourth support part group using the remaining two of the four upper hands. The first substrate placement unit has ten 2 support parts that respectively support one substrate. 2The second substrate mounting section may further comprise a fourth support group having 10 fourth support sections, each supporting a single substrate. The first transport mechanism transports the substrate from the carrier to the first support group using five first hands, and the five first hands 2 The substrate may be transported from the support group to the carrier. The lower transport mechanism transports the substrate from the first support group to the processing unit, and from the processing unit 2 The substrate may be transported to the support group. The first transport mechanism uses five first hands to transport the substrate from the carrier. 3 The substrate may be transported to the support group, and the substrate may be transported from the fourth support group to the carrier by the five first hands. The upper transport mechanism is the 3 The substrate may be transported from the support group to the processing unit, and the substrate may be transported from the processing unit to the fourth support group. The first support group and the 2 The support group may be positioned above the center of the vertical height of the lower transport chamber. 3 The support group and the fourth support group may be positioned below the center of the vertical height of the upper transport chamber. The aforementioned plurality of processing units may include 12 pre-processing units arranged on the lower level and 12 upper-processing units arranged on the upper level. The aforementioned plurality of processing units may be 24 processing units that perform the same processing on the substrate. The lower transport mechanism may transport substrates from the first substrate mounting section to the 12 pre-processing units. The lower transport mechanism may transport substrates from the 12 pre-processing units to the first substrate mounting section. The upper transport mechanism may transport substrates from the second substrate mounting section to the 12 upper processing units. The upper transport mechanism may transport substrates from the 12 upper processing units to the second substrate mounting section.

[0016] One embodiment of this invention comprises a first support group having 10 first support parts each supporting a single substrate, a first substrate mounting section on which multiple substrates are placed, and 10 first support parts each supporting a single substrate 3 The part having a support 3The present invention provides a substrate transport method for transporting substrates between a second substrate mounting section, which is equipped with a group of support sections and is positioned above the first substrate mounting section and on which multiple substrates are mounted; a carrier that accommodates multiple substrates; and multiple processing units that process the substrates. The method includes a first step of transporting substrates from the carrier to the substrate mounting section by a first transport mechanism having five first hands, each supporting one substrate; and a second step of transporting substrates from the substrate mounting section to the processing units in a lower transport chamber having an internal space by a lower transport mechanism having two lower hands, each supporting one substrate. The method may further include a third step of transporting a substrate from the carrier to the second substrate mounting section by the first transport mechanism, and a fourth step of transporting a substrate from the second substrate mounting section to the processing unit by an upper transport mechanism having an internal space and an upper transport chamber located above the lower transport chamber, and having two upper hands each supporting a single substrate. The center of the vertical height of the first substrate mounting section may be located above the center of the vertical height of the lower transport chamber. The center of the vertical height of the second substrate mounting section may be located below the center of the vertical height of the upper transport chamber.

[0017] In one embodiment, Lower transport mechanism The two aforementioned Lower hand A total of four of the above Lower hand This includes the second step, Lower transport mechanism The four aforementioned Lower hand Using two of these, the substrate mounting section is connected to the processing unit Based on The plate is transported. The method is the four Lower hand Of these, the remaining two are used as described above. Lower transport mechanism Therefore, the processing unit is moved to the substrate mounting section. Based on The transport of the board 5 The process involves transferring the substrate from the substrate mounting section to the carrier using the first transport mechanism with five of the first hands. Based on The transport of the board 6 The process, and further,

[0018] In one embodiment, the substrate mounting section has 10 components that each support a single substrate. 2 The part having a support 2 The system further comprises a group of support units. In the first step, the first transport mechanism transports the substrate from the carrier to the first group of support units using five first hands. In the second step, the lower transport mechanism transports the substrate from the first group of support units to the processing unit using two of the four lower hands. In the fifth step, the lower transport mechanism transports the substrate from the processing unit using the remaining two of the four lower hands. 3 The substrate is transported to the support group. In the sixth step, the first transport mechanism uses five of the first hands 3 The substrate is transported from the support group to the carrier. The upper transport mechanism may include a total of four upper hands, including the two upper hands. In the fourth step, the upper transport mechanism may transport the substrate from the second substrate mounting section to the processing unit using two of the four upper hands. The method may further include a seventh step of transporting a substrate from the processing unit to the second substrate mounting section using the upper transport mechanism with the remaining two of the four upper hands, and an eighth step of transporting a substrate from the second substrate mounting section to the carrier using the first transport mechanism with the five first hands. The method may further include: a fifth step of transporting a substrate from the processing unit to the first substrate mounting section using the lower transport mechanism; a sixth step of transporting a substrate from the first substrate mounting section to the carrier using the first transport mechanism with five first hands; a seventh step of transporting a substrate from the processing unit to the second substrate mounting section using the upper transport mechanism; and an eighth step of transporting a substrate from the second substrate mounting section to the carrier using the first transport mechanism with five first hands. The first substrate mounting section has 10 parts that each support a single substrate. 2 The part having a support 2The second substrate mounting section may further comprise a fourth support group having 10 fourth support parts, each supporting a single substrate. In the first step, the first transport mechanism may transport the substrate from the carrier to the first support group using five first hands. In the second step, the lower transport mechanism may transport the substrate from the first support group to the processing unit. In the third step, the first transport mechanism may transport the substrate from the carrier to the processing unit using five first hands. 3 The substrate may be transported to the support group. In the fourth step, the lower transport mechanism is 3 The substrate may be transported from the support group to the processing unit. In the fifth step, the lower transport mechanism transports the substrate from the processing unit to the processing unit. 2 The substrate may be transported to the support group. In the sixth step, the first transport mechanism uses the five first hands 2 The substrate may be transported from the support group to the carrier. In the seventh step, the lower transport mechanism may transport the substrate from the processing unit to the fourth support group. In the eighth step, the first transport mechanism may transport the substrate from the fourth support group to the carrier using five first hands. The first support group and the 2 The support group may be positioned above the center of the vertical height of the lower transport chamber. 3 The support group and the fourth support group may be positioned below the center of the vertical height of the upper transport chamber. The aforementioned plurality of processing units may include 12 pre-processing units arranged on the lower level and 12 upper-processing units arranged on the upper level. The aforementioned plurality of processing units may be 24 processing units that perform the same processing on the substrate.The lower transport mechanism may transport the substrate from the first substrate mounting section to the 12 pre-processing units in the second step. The lower transport mechanism may transport the substrate from the 12 pre-processing units to the first substrate mounting section in the fourth step. The upper transport mechanism may transport the substrate from the second substrate mounting section to the 12 upper processing units in the fifth step. The upper transport mechanism may transport the substrate from the 12 upper processing units to the second substrate mounting section in the seventh step.

[0019] This specification also discloses a substrate processing apparatus having the following features:

[0020] In one example, the substrate processing apparatus comprises a substrate mounting section, a plurality of processing units, and a transport mechanism. A plurality of substrates are placed on the substrate mounting section. Each of the plurality of processing units processes the substrates. The transport mechanism transports the substrates between the substrate mounting section and the processing units. In one transport cycle, the transport mechanism receives N (N is an integer of 2 or more) of the substrates from the substrate mounting section before processing by the processing units, transports the N substrates into N processing units of the plurality of processing units, and transports the N substrates after processing by the N processing units from the N processing units, and returns the N substrates to the substrate mounting section. The transport mechanism comprises a plurality of hands. Each of the plurality of hands supports the substrates. The plurality of hands include a first non-shared hand, a second non-shared hand, and M (M is an integer of 1 or more) shared hands positioned between the first non-shared hand and the second non-shared hand. The first non-shared hand, the M shared hands, and the second non-shared hand are arranged continuously along the vertical direction from the first non-shared hand to the second non-shared hand. In one transport cycle, the M shared hands support the substrate before processing by the processing unit and the substrate after processing at different timings. In one transport cycle, the first non-shared hand supports only the substrate before processing by the processing unit. In one transport cycle, the second non-shared hand supports only the substrate after processing by the processing unit. When the transport mechanism has received the N substrates from the substrate mounting section, the second non-shared hand does not support the substrates, while the M shared hands and the first non-shared hand support the substrates.

[0021] In one example, in a substrate processing apparatus, it is preferable that in one transport cycle, the M shared hands and the first non-shared hand receive the substrate from the substrate placement section. In one transport cycle, it is preferable that the second non-shared hand unloads the processed substrate from the processing unit. In one transport cycle, it is preferable that one of the M shared hands adjacent to the second non-shared hand loads the unprocessed substrate into the processing unit from which the substrate was unloaded by the second non-shared hand. In one transport cycle, it is preferable that the shared hand adjacent to the second non-shared hand unloads the processed substrate from a processing unit different from the processing unit into which the unprocessed substrate was loaded by the shared hand.

[0022] In one example, in a substrate processing apparatus, the total number of M shared hands, the first non-shared hand, and the second non-shared hand is preferably N+1. It is preferable that M = N-1.

[0023] In one example, in a substrate processing apparatus, the total number of the multiple hands is preferably 2N.

[0024] In one example, in a substrate processing apparatus, it is preferable that N=2.

[0025] In one example, it is preferable that the substrate processing apparatus further includes a control unit for controlling the transport mechanism. The transport mechanism is preferably controlled by the control unit and operates in either a first substrate transport mode or a second substrate transport mode. The first substrate transport mode is preferably a mode in which N+1 of the 2N hands are used as the M shared hands, the first non-shared hand, and the second non-shared hand. The second substrate transport mode is preferably a mode in which, of the 2N hands, N hands are used to support only the substrate before processing by the processing unit, and the other N hands are used to support only the substrate after processing by the processing unit.

[0026] In one example, in a substrate processing apparatus, the total number of the multiple hands is preferably N+1.

[0027] This specification also discloses a substrate transport method having the following characteristics:

[0028] In one example, the substrate transport method is performed by a transport mechanism that transports the substrates between a substrate mounting section on which multiple substrates are placed and a plurality of processing units that process the substrates. In one transport cycle, the substrate transport method includes the steps of receiving N (N is an integer of 2 or more) of the substrates from the substrate mounting section before processing by the processing units, transporting the N substrates into N processing units among the plurality of processing units, and transporting the N substrates after processing by the N processing units from the N processing units, and then returning the N substrates to the substrate mounting section. The transport mechanism comprises a plurality of hands, each of which supports the substrates. The plurality of hands include a first non-shared hand, a second non-shared hand, and M (M is an integer of 1 or more) shared hands positioned between the first non-shared hand and the second non-shared hand. The first non-shared hand, the M shared hands, and the second non-shared hand are arranged continuously along the vertical direction from the first non-shared hand to the second non-shared hand. In the step of transferring the N substrates to the substrate mounting section, in one transport cycle, the M shared hands support the substrates before and after processing by the processing unit at different timings, the first non-shared hand supports only the substrates before processing by the processing unit, the second non-shared hand supports only the substrates after processing by the processing unit, and when the transport mechanism receives the N substrates from the substrate mounting section, the second non-shared hand does not support the substrates, while the M shared hands and the first non-shared hand support the substrates.

[0029] In one example, in a substrate transport method, in the step of transporting the N substrates to the substrate placement section, in one transport cycle, the M shared hands and the first non-shared hand receive the substrates from the substrate placement section; in one transport cycle, the second non-shared hand unloads the processed substrates from the processing unit; in one transport cycle, the shared hand adjacent to the second non-shared hand among the M shared hands loads the unprocessed substrates into the processing unit from which the substrates were unloaded by the second non-shared hand; and in one transport cycle, the shared hand adjacent to the second non-shared hand unloads the processed substrates from a processing unit different from the processing unit into which the unprocessed substrates were loaded by the shared hand.

[0030] In one example, in the substrate transport method, the total number of M shared hands, the first non-shared hand, and the second non-shared hand is preferably N+1. It is preferable that M = N-1.

[0031] In one example, in the substrate transport method, the total number of the multiple hands is preferably 2N.

[0032] In one example, in the substrate transport method, it is preferable that N=2.

[0033] In one example, in a substrate transport method, the transport mechanism preferably operates in either a first substrate transport mode or a second substrate transport mode. The first substrate transport mode is preferably a mode in which N+1 of the 2N hands are used as the M shared hands, the first non-shared hand, and the second non-shared hand. The second substrate transport mode is preferably a mode in which, of the 2N hands, N hands are used to support only the substrate before processing by the processing unit, and the other N hands are used to support only the substrate after processing by the processing unit.

[0034] In one example, in the substrate transport method, it is preferable that the total number of the multiple hands is N+1. [Brief explanation of the drawing]

[0035] [Figure 1] This is a plan view showing the inside of a substrate processing apparatus according to an embodiment of the present invention. [Figure 2] This is a cross-sectional view along line II-II in Figure 1. [Figure 3] This is a cross-sectional view along line III-III in Figure 1. [Figure 4] This is a side view showing a substrate processing apparatus according to this embodiment. [Figure 5] This is a side view showing the inside of the processing unit according to this embodiment. [Figure 6] This is a side view showing the first transport mechanism, the substrate placement section, and the second transport mechanism of the substrate processing apparatus according to this embodiment. [Figure 7] This figure shows an example of the overall flow of the first substrate transport method performed by the substrate processing apparatus according to this embodiment. [Figure 8] This flowchart shows the preceding steps of the first substrate transport method executed by the substrate processing apparatus according to this embodiment. [Figure 9] This flowchart shows the subsequent steps of the first substrate transport method executed by the substrate processing apparatus according to this embodiment. [Figure 10] This figure shows an example of the overall flow of the second substrate transport method performed by the substrate processing apparatus according to this embodiment. [Figure 11] This is a flowchart showing the preceding steps of the second substrate transport method executed by the substrate processing apparatus according to this embodiment. [Figure 12] This flowchart shows the subsequent steps of the second substrate transport method executed by the substrate processing apparatus according to this embodiment. [Figure 13] This figure provides a general explanation of the first substrate transport method performed by the substrate processing apparatus according to this embodiment. [Figure 14]This figure shows the relationship between the total number of second hands, the number of second hands used in the first substrate transport method, and the number of second hands used in the second substrate transport method, when the second transport mechanism according to this embodiment is equipped with 2N second hands. [Figure 15] This figure shows the relationship between the total number of second hands, the number of second hands used in the first substrate transport method, and the number of second hands used in the second substrate transport method, when the second transport mechanism according to this embodiment has N+1 second hands and N is an odd number. [Figure 16] This figure shows the relationship between the total number of second hands, the number of second hands used in the first substrate transport method, and the number of second hands used in the second substrate transport method, when the second transport mechanism according to this embodiment has N+1 second hands and N is an even number. [Modes for carrying out the invention]

[0036] Embodiments of the present invention will be described below with reference to the drawings. In the drawings, the same or corresponding parts will be denoted by the same reference numerals and will not be repeated in the description. Also, for the sake of explanation, a three-dimensional Cartesian coordinate system (X, Y, Z) is shown in the drawings as appropriate. In the drawings, the X and Y axes are parallel to the horizontal direction, and the Z axis is parallel to the vertical direction. In the description of the embodiments, the first direction DX, the second direction DY, and the third direction DZ will be used as appropriate. The first direction DX, the second direction DY, and the third direction DZ are orthogonal to each other. As an example, the first direction DX and the second direction DY are approximately parallel to the horizontal direction, and the third direction DZ is approximately parallel to the vertical direction. For the sake of explanation, the third direction DZ may be referred to as the "up and down direction DZ".

[0037] First, the substrate processing apparatus 100 according to this embodiment will be described with reference to Figure 1. Figure 1 is a plan view showing the interior of the substrate processing apparatus 100 according to this embodiment. In this embodiment, the intake system and exhaust system are omitted in order to simplify the drawings and explanation.

[0038] The substrate processing apparatus 100 shown in Figure 1 processes the substrate W. The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disc, a substrate for a magnetic disc, a substrate for a magneto-optical disc, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell.

[0039] The substrate processing apparatus 100 comprises an indexer unit 1 and a processing unit 20. The processing unit 20 is arranged adjacent to the indexer unit 1. The indexer unit 1 supplies the substrate W to the processing unit 20. The processing unit 20 processes the substrate W. The indexer unit 1 recovers the substrate W from the processing unit 20.

[0040] The indexer unit 1 comprises a plurality of carrier mounting units 3 (for example, four carrier mounting units 3). The plurality of carrier mounting units 3 are arranged along a first direction DX. A plurality of carriers C are mounted on each of the plurality of carrier mounting units 3. Each of the plurality of carriers C accommodates a plurality of substrates W. In this embodiment, as an example, each of the plurality of carriers C accommodates 25 substrates W. A carrier C is, for example, a FOUP (front opening unified pod).

[0041] The indexer unit 1 includes a first transport chamber 5. The first transport chamber 5 is located between a plurality of carrier mounting units 3 and a processing unit 20.

[0042] The indexer unit 1 includes at least one first transport mechanism 7. In this embodiment, as an example, the indexer unit 1 includes one first transport mechanism 7. The first transport mechanism 7 is located in the first transport chamber 5. The first transport mechanism 7 transports the substrate W. Specifically, the first transport mechanism 7 transports the substrate W between each carrier C and the processing unit 20.

[0043] The first transport mechanism 7 comprises a plurality of first hands 9 and a first hand drive unit 11. Note that only one first hand 9 is shown in Figure 1, and the other first hands 9 are omitted for simplicity. Each first hand 9 supports one substrate W. In this embodiment, each first hand 9 supports one substrate W in a horizontal position. The first hand drive unit 11 is connected to each first hand 9. The first hand drive unit 11 moves each first hand 9. The first hand drive unit 11 is equipped with a plurality of electric motors.

[0044] Next, the first hand 9 and the first hand drive unit 11 will be described with reference to Figures 1 and 2. Figure 2 is a cross-sectional view along line II-II in Figure 1.

[0045] As shown in Figure 2, the multiple first hands 9 are arranged along the vertical direction DZ. In this embodiment, as an example, the first transport mechanism 7 includes five first hands 9. In practice, as will be described later, the multiple first hands 9 are arranged with intervals in the vertical direction DZ. The first hand drive unit 11 moves the multiple first hands 9 while maintaining the intervals between them in the vertical direction DZ. Each first hand 9 receives an unprocessed substrate W from the carrier C and transports the unprocessed substrate W to the processing unit 20 (first step). , 3rd process ). In addition, each first hand 9 receives the processed substrate W processed by the processing unit 20 from the processing unit 20 and transports it to the carrier C ( 6 process , 8th process ).

[0046] As shown in Figures 1 and 2, the first hand drive unit 11 includes a rail 11a, a horizontal movement unit 11b, a vertical movement unit 11c, a swivel unit 11d, a swivel axis 11e, and a forward / backward movement unit 11f.

[0047] Rail 11a is positioned at the bottom of the first transport chamber 5. Rail 11a extends along the first direction DX. The horizontal moving section 11b is supported by rail 11a. The horizontal moving section 11b moves along rail 11a in the first direction DX. The vertical moving section 11c is supported by the horizontal moving section 11b. The vertical moving section 11c moves in the vertical direction DZ relative to the horizontal moving section 11b.

[0048] The swivel section 11d is supported by the vertical movement section 11c. The swivel section 11d rotates relative to the vertical movement section 11c. The swivel section 11d rotates around the swivel axis A1 when the swivel shaft 11e is driven. The swivel axis A1 is a virtual line extending along the vertical direction DZ.

[0049] The forward / backward section 11f moves back and forth in one horizontal direction determined by the orientation of the pivot section 11d. The forward / backward section 11f is connected to each first hand 9. The forward / backward section 11f then moves each first hand 9 individually back and forth in one horizontal direction determined by the orientation of the pivot section 11d. The forward / backward section 11f is connected to each first hand 9.

[0050] As described above with reference to Figures 1 and 2, the first transport mechanism 7 includes a first hand drive unit 11. Therefore, each first hand 9 is capable of parallel movement along the vertical direction DZ. In this case, the first hand drive unit 11 moves the entire group of first hands 9 along the vertical direction DZ. In addition, each first hand 9 is capable of rotation around the pivot axis A1. In this case, the first hand drive unit 11 rotates the entire group of first hands 9, for example. Furthermore, each first hand 9 is capable of parallel movement in any horizontal direction.

[0051] Next, the processing unit 20 will be described with reference to Figures 1 to 4. Figure 3 is a cross-sectional view along line III-III in Figure 1. Figure 4 is a side view showing the substrate processing device 100.

[0052] As shown in Figures 1, 3, and 4, the processing unit 20 comprises a plurality of processing units 21. Each of the plurality of processing units 21 processes one substrate W at a time. For example, each processing unit 21 processes the substrate W with a processing solution (e.g., a chemical solution). In this embodiment, as an example, the processing unit 20 comprises 24 processing units 21.

[0053] Specifically, the processing unit 20 has multiple processing towers TW. As an example, each processing tower TW is composed of K processing units 21 arranged along the vertical direction DZ. In this embodiment, K is an integer of 2 or more. In each processing tower TW, there are K / 2 processing units 21. (Pre-processing unit) It is located in the lower LW section and consists of K / 2 processing units 21 (Upper processing unit) It is placed in the upper row (UP).

[0054] In this embodiment, as an example, K=6, and one processing tower TW is composed of six processing units 21. The processing unit 20 has four processing towers TW. The four processing towers TW may be referred to as processing towers TW1, TW2, TW3, and TW4, respectively.

[0055] Processing towers TW1 and TW2 are arranged along the second direction DY. Processing towers TW3 and TW4 are also arranged along the second direction DY. Processing towers TW1 and TW2 and processing towers TW3 and TW4 face each other in the first direction DX, with the second transport chamber 31 in between.

[0056] Furthermore, as shown in Figures 1 and 2, the processing unit 20 further comprises a plurality of substrate mounting sections 29. In this embodiment, as an example, the processing unit 20 comprises two substrate mounting sections 29. Multiple substrates W can be placed on each substrate mounting section 29. In this embodiment, as an example, 20 substrates W can be placed on each substrate mounting section 29. Each substrate mounting section 29 is adjacent to the first transport chamber 5.

[0057] Below, of the two substrate mounting sections 29, the substrate mounting section 29 located in the lower section LW. (First substrate mounting section) This is described as "substrate mounting section 29L", and the substrate mounting section 29 located in the upper row UP (Second substrate mounting section) This may sometimes be referred to as "substrate mounting section 29U".

[0058] The substrate mounting section 29L is located in the second transport chamber 31 of the lower stage LW. (Lower transport room) It is positioned in the upper second transport chamber 31. (Upper transport room)The substrate mounting section 29L and the substrate mounting section 29U are arranged in a straight line along the vertical direction DZ.

[0059] Furthermore, as shown in Figure 2, the processing unit 20 further comprises a plurality of second transport mechanisms 23 and a plurality of second transport chambers 31. In this embodiment, as an example, the processing unit 20 comprises two second transport mechanisms 23 and two second transport chambers 31. The second transport mechanism 23 corresponds to an example of a "transport mechanism".

[0060] The two second transport chambers 31 are arranged along the vertical direction DZ. Each second transport chamber 31 extends along the second direction DY. Each second transport chamber 31 is connected to the first transport chamber 5.

[0061] Each second transport mechanism 23 transports the substrate W. Specifically, the second transport mechanism 23 transports the substrate W between the substrate mounting section 29 and the processing unit 21. Below, of the two second transport mechanisms 23, the second transport mechanism 23 located in the lower LW... (Lower transport mechanism) This is described as "Second conveying mechanism 23L," and the second conveying mechanism 23 located on the upper level UP (Upper transport mechanism) This may sometimes be referred to as "second transport mechanism 23U".

[0062] The second transport mechanism 23L is located in the second transport chamber 31 of the lower level LW. The second transport mechanism 23U is located in the second transport chamber 31 of the upper level UP.

[0063] As shown in Figures 1 to 3, each second transport mechanism 23 comprises a plurality of second hands 25 and a second hand drive unit 17. In this embodiment, as an example, each second transport mechanism 23 comprises four second hands 25. The second hand 25 corresponds to an example of a "hand".

[0064] Each second hand 25 supports a single substrate W. In this embodiment, each second hand 25 supports a single substrate W in a horizontal position. The second hand drive unit 17 is connected to each second hand 25. The second hand drive unit 17 moves each second hand 25. The second hand drive unit 17 is equipped with multiple electric motors.

[0065] Specifically, in each second transport mechanism 23, multiple second hands 25 are arranged along the vertical direction DZ. In practice, as will be described later, in each second transport mechanism 23, multiple second hands 25 are arranged with intervals in the vertical direction DZ. The second hand drive unit 17 moves the multiple second hands 25 while maintaining the intervals between them in the vertical direction DZ. For example, the second hand 25 receives an unprocessed substrate W from the substrate mounting unit 29 and transports the unprocessed substrate W to the processing unit 21. For example, the second hand 25 receives a processed substrate W from the processing unit 21 and passes it to the substrate mounting unit 29.

[0066] The second hand drive unit 17 comprises two support columns 27a, a vertical movement unit 27b, a horizontal movement unit 27c, a swivel unit 27d, a swivel axis 27e, and an advance / return unit 27f.

[0067] Two support columns 27a are positioned in the second transport chamber 31. Specifically, the two support columns 27a are positioned on the inner surface of the second transport chamber 31. The two support columns 27a are spaced apart in the second direction DY. Each support column 27a extends along the vertical direction DZ. The vertical moving section 27b is supported by the two support columns 27a. The vertical moving section 27b extends along the second direction DY across the two support columns 27a. The vertical moving section 27b moves along the two support columns 27a in the vertical direction DZ. The horizontal moving section 27c is supported by the vertical moving section 27b. The horizontal moving section 27c moves along the vertical moving section 27b between the two support columns 27a in the second direction DY.

[0068] The swivel section 27d is supported by the horizontal movement section 27c. The swivel section 27d swivels relative to the horizontal movement section 27c. The swivel section 27d swivels about the swivel axis A2 when the swivel shaft 27e is driven. The swivel axis A2 is a virtual line extending along the vertical direction DZ.

[0069] The forward / backward section 27f moves relative to the pivot section 27d. The forward / backward section 27f reciprocates in one horizontal direction determined by the orientation of the pivot section 27d. The forward / backward section 27f is connected to each second hand 25.

[0070] As described above with reference to Figures 1 to 3, each second transport mechanism 23 is equipped with a second hand drive unit 17. Therefore, each second hand 25 is capable of parallel movement along the vertical direction DZ. In this case, the second hand drive unit 17 moves the entirety of the multiple second hands 25 along the vertical direction DZ. Furthermore, each second hand 25 is capable of pivoting around the pivot axis A2. In this case, the second hand drive unit 17 pivots the entirety of the multiple second hands 25, for example. And each second hand 25 is capable of parallel movement in any horizontal direction.

[0071] Here, as shown in Figure 1, the substrate processing apparatus 100 further comprises a control unit 200. The control unit 200 controls each component of the substrate processing apparatus 100. Specifically, the control unit 200 controls the first transport mechanism 7, the second transport mechanism 23, and the processing unit 21.

[0072] The control unit 200 is, for example, a computer. Specifically, the control unit 200 comprises a processor and a storage device. The processor includes, for example, a CPU (Central Processing Unit). The storage device stores data and computer programs. The storage device includes, for example, a main storage device such as semiconductor memory and an auxiliary storage device such as semiconductor memory, a solid-state drive, and / or a hard disk drive. The storage device may also include removable media. The storage device corresponds to an example of a non-temporary computer-readable storage medium.

[0073] Specifically, the processor of the control unit 200 controls the first transport mechanism 7, the second transport mechanism 23, and the processing unit 21 by executing a computer program stored in the memory device.

[0074] Referring to Figures 1 and 2, the overall flow of the transport mechanism 7 and the second transport mechanism 23 transporting the substrate W will be explained.

[0075] The first hand 9 of the first transport mechanism 7 receives multiple unprocessed substrates W from the carrier C and passes the multiple unprocessed substrates W to the substrate mounting section 29L or the substrate mounting section 29U. (1st process, 3rd process) As a result, multiple untreated substrates W are placed on the substrate mounting section 29L or the substrate mounting section 29U. In this embodiment, "untreated substrates" refers to substrates W that have not been processed by the processing unit 21, that is, substrates W that have not been processed by the processing unit 21.

[0076] Second hand 25 of the second transport mechanism 23L (Lower hand) The unit receives multiple unprocessed substrates W from the substrate mounting section 29L and loads each unprocessed substrate W one by one into the processing units 21 of the lower stage LW. (2nd process) Then, each processing unit 21 in the lower LW processes the unprocessed substrate W.

[0077] Furthermore, the second hand 25 of the second transport mechanism 23L unloads the processed substrates W from each processing unit 21 of the lower stage LW and passes the multiple processed substrates W to the substrate mounting section 29L. (5th step) As a result, multiple processed substrates W are placed on the substrate mounting section 29L.

[0078] Meanwhile, the second hand 25 of the second transport mechanism 23U (Upper hand) The unit receives multiple unprocessed circuit boards W from the circuit board mounting section 29U and loads each unprocessed circuit board W one by one into the processing units 21 of the upper stage UP. (4th step) Then, each processing unit 21 in the upper section UP processes the unprocessed substrate W.

[0079] Furthermore, the second hand 25 of the second transport mechanism 23U unloads the processed substrates W from each processing unit 21 in the upper stage UP and passes the multiple processed substrates W to the substrate mounting section 29U. (7th step) As a result, the processed substrates W are placed on the substrate mounting section 29U.

[0080] The first hand 9 of the first transport mechanism 7 receives the processed multiple substrates W from the substrate mounting section 29L or substrate mounting section 29U and passes the processed multiple substrates W to the carrier C. (6th process, 8th process) As a result, the carrier C accommodates multiple processed substrates W.

[0081] Next, the processing unit 21 will be described with reference to Figure 5. Figure 5 is a side view showing the interior of the processing unit 21. As shown in Figure 5, the processing unit 21 comprises a processing housing 41, a substrate holding unit 43, a rotary drive unit 45, a first nozzle 47, a first nozzle moving unit 47a, a second nozzle 49, a second nozzle moving unit 49a, a third nozzle 51, a third nozzle moving unit 51a, a fourth nozzle 53, a fourth nozzle moving unit 53a, and a cup 55. The substrate processing apparatus 100 further comprises a first processing liquid supply pipe 473, a second processing liquid supply pipe 493, a third processing liquid supply pipe 513, and a rinse liquid supply pipe 533.

[0082] The processing enclosure 41 has a box shape. The processing enclosure 41 houses the substrate holder 43, the rotary drive unit 45, the first nozzle 47, the first nozzle moving unit 47a, the second nozzle 49, the second nozzle moving unit 49a, the third nozzle 51, the third nozzle moving unit 51a, the fourth nozzle 53, the fourth nozzle moving unit 53a, and the cup 55. The processing enclosure 41 also houses a portion of the first processing liquid supply piping 473, a portion of the second processing liquid supply piping 493, a portion of the third processing liquid supply piping 513, and a portion of the rinse liquid supply piping 533. The substrate W, which has been transported to the processing unit 21 by the second transport mechanism 23, is housed inside the processing enclosure 41.

[0083] The substrate holder 43 holds the substrate W horizontally. The substrate holder 43 is, for example, a vacuum-type spin chuck. However, the method by which the substrate holder 43 holds the substrate W is not limited to the vacuum type. The method by which the substrate holder 43 holds the substrate W may be, for example, a clamping type or a Bernoulli type.

[0084] The rotary drive unit 45 rotates the substrate holder 43 around the rotation axis A3. As a result, the substrate W and the substrate holder 43 rotate together around the rotation axis A3. The rotation axis A3 is a virtual line extending along the vertical direction DZ. The rotary drive unit 45 includes, for example, an electric motor.

[0085] The first nozzle 47 supplies the first processing liquid to the substrate W from above. Specifically, the first nozzle 47 discharges the first processing liquid toward the rotating substrate W. The first nozzle moving unit 47a moves the first nozzle 47 between the processing position and the retracted position. When the first nozzle 47 moves to the processing position, it faces the substrate W in a plan view. When the first nozzle 47 moves to the retracted position, it does not face the substrate W in a plan view. Specifically, when the first nozzle 47 moves to the retracted position, it retracts to the periphery of the substrate W in a plan view.

[0086] Specifically, the first nozzle moving unit 47a includes a first nozzle arm 471 and a first nozzle drive unit 472. The first nozzle arm 471 extends substantially horizontally. The first nozzle 47 is positioned at the tip of the first nozzle arm 471. The first nozzle drive unit 472 rotates the first nozzle arm 471 along a substantially horizontal plane about a rotation axis extending along the vertical direction DZ. As a result, the first nozzle 47 moves circumferentially along the circumferential direction centered on the rotation axis extending in the vertical direction DZ. The first nozzle drive unit 472 includes an electric motor capable of forward and reverse rotation.

[0087] The first treatment liquid supply pipe 473 supplies the first treatment liquid to the first nozzle 47. The first treatment liquid supply pipe 473 is a tubular member through which the first treatment liquid flows. In this embodiment, the first treatment liquid is an acidic liquid. For example, the first treatment liquid is hydrofluoric acid, a mixture of sulfuric acid and hydrogen peroxide (SPM), sulfuric acid, sulfuric acid-hydrogen peroxide solution, hydrofluoric acid-nitric acid (a mixture of hydrofluoric acid and nitric acid), or hydrochloric acid.

[0088] The second nozzle 49 supplies the second processing liquid to the substrate W from above. More specifically, the second nozzle 49 discharges the second processing liquid toward the rotating substrate W. The second nozzle moving unit 49a moves the second nozzle 49 between the processing position and the retracted position in the same manner as the first nozzle moving unit 47a. Specifically, the second nozzle moving unit 49a has a second nozzle arm 491 and a second nozzle drive unit 492, similar to the first nozzle moving unit 47a. The configuration of the second nozzle arm 491 and the second nozzle drive unit 492 is the same as that of the first nozzle arm 471 and the first nozzle drive unit 472, so a description is omitted.

[0089] The second treatment liquid supply pipe 493 supplies the second treatment liquid to the second nozzle 49. The second treatment liquid supply pipe 493 is a tubular member through which the second treatment liquid flows. In this embodiment, the second treatment liquid is an alkaline solution. For example, the second treatment liquid is ammonia hydrogen peroxide solution (SC1), ammonia water, ammonium fluoride solution, or tetramethylammonium hydroxide (TMAH).

[0090] The third nozzle 51 supplies the third processing liquid to the substrate W from above. More specifically, the third nozzle 51 discharges the third processing liquid toward the rotating substrate W. The third nozzle moving unit 51a moves the third nozzle 51 between the processing position and the retracted position in the same manner as the first nozzle moving unit 47a. Specifically, the third nozzle moving unit 51a has a third nozzle arm 511 and a third nozzle drive unit 512, similar to the first nozzle moving unit 47a. The configuration of the third nozzle arm 511 and the third nozzle drive unit 512 is the same as that of the first nozzle arm 471 and the first nozzle drive unit 472, so a description is omitted.

[0091] The third treatment liquid supply pipe 513 supplies the third treatment liquid to the third nozzle 51. The third treatment liquid supply pipe 513 is a tubular member through which the third treatment liquid flows. In this embodiment, the third treatment liquid is an organic solvent. For example, the third treatment liquid is isopropyl alcohol (IPA), methanol, ethanol, hydrofluoroether (HFE), or acetone.

[0092] The fourth nozzle 53 supplies rinsing liquid to the substrate W from above. More specifically, the fourth nozzle 53 discharges rinsing liquid toward the rotating substrate W. The fourth nozzle moving unit 53a moves the fourth nozzle 53 between the processing position and the retracted position in the same manner as the first nozzle moving unit 47a. Specifically, the fourth nozzle moving unit 53a has a fourth nozzle arm 531 and a fourth nozzle drive unit 532, similar to the first nozzle moving unit 47a. The configuration of the fourth nozzle arm 531 and the fourth nozzle drive unit 532 is the same as that of the first nozzle arm 471 and the first nozzle drive unit 472, so a description is omitted.

[0093] The rinse liquid supply pipe 533 supplies rinse liquid to the fourth nozzle 53. The rinse liquid supply pipe 533 is a tubular member through which the rinse liquid flows. For example, the rinse liquid may be pure water, carbonated water, electrolyzed ionized water, hydrogen water, ozonated water, or diluted hydrochloric acid water.

[0094] The cup 55 is positioned around the substrate holder 43. The cup 55 surrounds the sides of the substrate W held by the substrate holder 43. The cup 55 catches the first to third processing liquids and rinse liquid that are scattered from the rotating substrate W.

[0095] Next, with reference to Figure 6, the first transport mechanism 7, the second transport mechanisms 23L and 23U, and the substrate mounting sections 29L and 29U will be described.

[0096] Figure 6 is a side view showing the first transport mechanism 7, the second transport mechanisms 23L and 23U, and the substrate mounting sections 29L and 29U.

[0097] As shown in Figure 6, the first transport mechanism 7 comprises P first hands 9. In this specification, unless otherwise specified, P is an integer of 2 or more and represents the total number of first hands 9. In a preferred example, the P first hands 9 are arranged at equal intervals d along the vertical direction DZ.

[0098] Each first hand 9 supports either the substrate W before processing or the substrate W after processing. Each first hand 9 supports one substrate W at a time.

[0099] In this embodiment, as an example, P=5, and the first transport mechanism 7 is equipped with five first hands 9.

[0100] Each of the second transport mechanisms 23L and 23U comprises Q second hands 25. In this specification, unless otherwise specified, Q is an integer of 3 or more and represents the total number of second hands 25 in each of the second transport mechanisms 23L and 23U. As a preferred example, the Q second hands 25 are arranged at equal intervals d along the vertical direction DZ. That is, the distance in the vertical direction DZ between two adjacent second hands 25 is the interval d. Each second hand 25 supports one substrate W at a time.

[0101] For example, some of the Q second hands 25 may be used to support the substrate W before processing, or to support the substrate W after processing.

[0102] For example, among the Q second hands 25, some second hands 25 may support only the substrate W before processing, while other second hands 25 may support only the substrate W after processing.

[0103] In this embodiment, as an example, Q=4, and each of the second transport mechanism 23L and the second transport mechanism 23U is equipped with four second hands 25.

[0104] Hereinafter, in the second transport mechanism 23L and the second transport mechanism 23U, the four second hands 25 will be referred to as second hand HA, second hand HB, second hand HC, and second hand HD, respectively, in order from bottom to top.

[0105] Each of the substrate mounting section 29L and the substrate mounting section 29U comprises R support sections 291. In this specification, unless otherwise specified, R is an integer of 2 or more and represents the total number of support sections 291 in each of the substrate mounting section 29L and the substrate mounting section 29U. R is, for example, an even number of 2 or more. The R support sections 291 are spaced apart along the vertical direction DZ. As a preferred example, the R support sections 291 are spaced equally apart d along the vertical direction DZ. That is, the distance between two adjacent support sections 291 in the vertical direction DZ is the distance d. Each support section 291 supports one substrate W. Specifically, each support section 291 supports one substrate W in a horizontal position.

[0106] As a preferred example, the spacing d of the support parts 291, the spacing d of the first hand 9, and the spacing d of the second hand 25 are approximately equal.

[0107] In this embodiment, as an example, in each of the substrate mounting section 29L and substrate mounting section 29U, the R / 2 support sections 291 of the lower section 291A support the substrate W before processing, and the R / 2 support sections 291 of the upper section 291B support the substrate W after processing.

[0108] Furthermore, in this embodiment, as an example, R=20, and each of the substrate mounting section 29L and the substrate mounting section 29U is provided with 20 support sections 291. Therefore, R / 2 support sections 291 in the lower section 291A correspond to 10 first support sections, and these constitute a first support section group. Also, R / 2 support sections 291 in the lower section 291A of the substrate mounting section 29U correspond to 10 first... 3 These correspond to the support parts, and these are the 3 It constitutes a group of support parts. In addition, the R / 2 support parts 291 of the upper stage 291B of the substrate mounting section 29L are 10 2 These correspond to the support parts, and these are the 2 These constitute a group of support parts. In addition, the R / 2 support parts 291 of the upper stage 291B of the substrate mounting section 29U correspond to 10 fourth support parts, and these constitute a fourth support part group.

[0109] Furthermore, the spacing of the first hands 9 is not particularly limited; for example, they do not have to be equally spaced, or some of them may be equally spaced. Similarly, the spacing of the second hands 25 is not particularly limited; for example, they do not have to be equally spaced, or some of them may be equally spaced. Moreover, the spacing of the support parts 291 is not particularly limited; for example, they do not have to be equally spaced, or some of them may be equally spaced. Furthermore, the spacing of adjacent support parts 291, the spacing of adjacent first hands 9, and the spacing of adjacent second hands 25 do not have to be equal.

[0110] Next, an example of the first substrate transport method according to this embodiment will be described with reference to Figure 7. In the description of Figure 7, if it is not necessary to refer to a specific substrate W, it will simply be referred to as "substrate".

[0111] The first substrate transport method is performed by a second transport mechanism 23 that transports substrates between the substrate mounting section 29 and the processing unit 21. In the first substrate transport method, multiple substrates are transported by sharing M second hands 25 for substrates before processing and substrates after processing. In this specification, unless otherwise specified, M is an integer of 1 or more. The first substrate transport method corresponds to an example of a "substrate transport method".

[0112] Figure 7 shows an example of the overall flow of the first substrate transport method. In Figure 7, for the sake of simplicity of explanation, we will focus on the substrate placement section 29L located in the lower section LW, the second transport mechanism 23L located in the lower section LW, and processing units 21A and 21B among the multiple processing units 21 located in the lower section LW. Processing units 21A and 21B are located in different positions. Furthermore, the substrate before processing is placed on the lower section 291A of the substrate placement section 29L, and the substrate after processing is placed on the upper section 291B of the substrate placement section 29L.

[0113] Furthermore, in the description of the first substrate transport method, the second hand HA may be referred to as "first non-shared hand HA," the second hand HB as "shared hand HB," and the second hand HC as "second non-shared hand HC." In the exemplary first substrate transport method shown in Figure 7, the second hand HD is not used.

[0114] Furthermore, in the following description, the transport cycle CY refers to the operation from when the second transport mechanism 23 receives an unprocessed substrate from the substrate mounting section 29, when the second transport mechanism 23 transports the unprocessed substrate into the processing unit 21, when the second transport mechanism 23 transports the processed substrate out of the processing unit 21, and when the second transport mechanism 23 places the processed substrate onto the substrate mounting section 29.

[0115] As shown in Figure 7, as an example, at a certain point in time, ten unprocessed substrates W1 to W10 are placed on the lower section 291A of the substrate mounting section 29L along the vertical direction DZ, and no substrates are placed on the upper section 291B of the substrate mounting section 29L.

[0116] In the first substrate transport method, in one transport cycle CY, the second transport mechanism 23L loads two unprocessed substrates W1 and W2 into two processing units 21A and 21B, and loads two processed substrates WX1 and WX2 from the two processing units 21A and 21B. The transport cycle CY is executed repeatedly.

[0117] Specifically, in the first substrate transport method, in one transport cycle CY, the second transport mechanism 23L receives two substrates W1 and W2 from the substrate mounting section 29L before processing by processing units 21A and 21B, and loads the two substrates W1 and W2 into two of the multiple processing units 21, 21A and 21B. At the same time, it unloads the two substrates WX1 and WX2 after processing by the two processing units 21A and 21B, and passes the two substrates WX1 and WX2 to the substrate mounting section 29L.

[0118] More specifically, the four second hands HA~HD include a first non-shared hand HA, a shared hand HB, and a second non-shared hand HC. The shared hand HB is positioned between the first non-shared hand HA and the second non-shared hand HC. The shared hand HB is adjacent to the second non-shared hand HC in a first specific direction SD1. The first non-shared hand HA is adjacent to the shared hand HB in a first specific direction SD1.

[0119] The first specific direction SD1 indicates the direction from the second non-shared hand HC to the first non-shared hand HA. On the other hand, the second specific direction SD2 is the opposite direction to the first specific direction SD1 and indicates the direction from the first non-shared hand HA to the second non-shared hand HC. The first specific direction SD1 and the second specific direction SD2 are approximately parallel to the vertical direction DZ. For example, the first specific direction SD1 indicates the downward direction, and the second specific direction SD2 indicates the upward direction.

[0120] The first non-shared hand HA, the shared hand HB, and the second non-shared hand HC are arranged continuously along the vertical direction DZ from the first non-shared hand HA to the second non-shared hand HC.

[0121] In one transport cycle CY, the first non-shared hand HA supports only the substrate W1 before processing by the processing unit 21B. Also in one transport cycle CY, the shared hand HB supports the substrate W2 before processing by the processing unit 21A and the substrate WX1 after processing by the processing unit 21B at different timings. Furthermore, in one transport cycle CY, the second non-shared hand HC supports only the substrate WX2 after processing by the processing unit 21A.

[0122] Referring to Figure 7, the states ST1 to ST4 of the second transport mechanism 23L in one transport cycle CY will be explained.

[0123] In state ST1, where the second transport mechanism 23L has received two substrates W1 and W2 from the substrate mounting section 29L, the second non-shared hand HC does not support the substrates W, while the shared hand HB and the first non-shared hand HA support the substrates W1 and W2. In the first substrate transport method, the second hand HD is not used.

[0124] The next state after state ST1, ST2, indicates the state of the second transport mechanism 23L when the processed substrate WX2 is unloaded from the processing unit 21A by the second non-shared hand HC, which does not support the substrate, and the unprocessed substrate W2 is loaded into the same processing unit 21A by the shared hand HB.

[0125] The next state after state ST2, ST3, indicates the state of the second transport mechanism 23L when the processed substrate WX1 is unloaded from the processing unit 21B by the shared hand HB, which is not supporting the substrate in state ST2, and the unprocessed substrate W1 is loaded into the same processing unit 21B by the first non-shared hand HA.

[0126] The next state after state ST3, ST4, indicates the state of the second transport mechanism 23L when the processed substrate WX1 is supported by the shared hand HB, the processed substrate WX2 is supported by the second non-shared hand HC, and the substrate is not supported by the first non-shared hand HA.

[0127] As described above with reference to Figure 7, according to this embodiment, the second transport mechanism 23L of the substrate processing apparatus 100 includes a first non-shared hand HA, a shared hand HB, and a second non-shared hand HC, which are arranged continuously in the vertical direction DZ. Therefore, when loading and unloading substrates W1, W2, WX1, and WX2 to processing units 21A and 21B, the travel distance in the vertical direction DZ of the first non-shared hand HA to the second non-shared hand HC (specifically, the second hand HA to HD) can be shortened compared to when the hands are not shared between substrates before and after processing. As a result, the throughput of the transport operation of substrates W1, W2, WX1, and WX2 by the second transport mechanism 23L can be improved. Details of this point will be explained with specific examples with reference to Figures 8, 9, 11, and 12.

[0128] Next, an example of the first substrate transport method will be described in detail with reference to Figures 8 and 9. In the following description, when referring to the entire system of the first non-shared hand HA, shared hand HB, second non-shared hand HC, and second hand HD, it may be written as second hand HA~HD to avoid redundancy. Also, when it is not necessary to refer to a specific substrate W, it will simply be written as "substrate".

[0129] Figures 8 and 9 are flowcharts illustrating an example of a first substrate transport method. As shown in Figures 8 and 9, the first substrate transport method includes steps S1 to S12 in one transport cycle CY. The second hand HD is not used in the first substrate transport method. In steps S1 to S12, the second hands HA to HD are moved by the second hand drive unit 17, which is controlled by the control unit 200.

[0130] As shown in Figure 8, in step S1, the first non-shared hand HA supports the substrate W1 before processing, and the shared hand HB supports the substrate W2 before processing. On the other hand, the second non-shared hand HC does not support a substrate. The second non-shared hand HC faces the transport opening 41a of the processing unit 21A. The second non-shared hand HC then begins to move towards the processed substrate WX2 located inside the processing unit 21A.

[0131] Note that the state of the second hand HA~HD in process S1 is the state in which the second hand HA~HD in state ST1 shown in Figure 7 has moved to the position of the processing unit 21A. Also, during the processing of the substrate WX2, the transport opening 41a is closed by a shielding member (not shown).

[0132] Next, in step S2, the second non-shared hand HC unloads the processed substrate WX2 from the processing unit 21A through the transport port 41a.

[0133] Next, in step S3, the second non-shared hand HC returns to its position before movement. Then, the second hands HA~HD begin to move in the second specific direction SD2.

[0134] Next, in step S4, the second hands HA~HD move a distance d in the second specific direction SD2 and stop. The distance d is approximately equal to the vertical distance DZ between the second non-shared hand HC and the shared hand HB (Figure 6). As a result, the shared hand HB faces the transport opening 41a of the processing unit 21A. Then, the shared hand HB begins to move towards the interior of the processing unit 21A.

[0135] Next, in step S5, the shared hand HB transports the unprocessed substrate W2 to the processing unit 21A through the transport port 41a.

[0136] Next, in step S6, the shared hand HB returns to its position before movement. Then, the second hands HA~HD begin moving toward the next processing unit 21B (Figure 9).

[0137] Next, as shown in Figure 9, in step S7, the first non-shared hand HA supports the substrate W1 before processing, and the second non-shared hand HC supports the substrate WX2 after processing. On the other hand, the shared hand HB does not support the substrate. The shared hand HB faces the transport opening 41a of the processing unit 21B. The shared hand HB then begins to move towards the processed substrate WX1 located inside the processing unit 21B.

[0138] Note that the state of the second hand HA~HD in step S7 represents the state in step S6 shown in Figure 8, where the second hand HA~HD has moved to the position of the processing unit 21B. Also, during the processing of the substrate WX1, the transport opening 41a is closed by a shielding member (not shown).

[0139] Next, in step S8, the shared hand HB unloads the processed substrate WX1 from the processing unit 21B through the transport port 41a.

[0140] Next, in step S9, the shared hand HB returns to its position before movement. Then, the second hands HA~HD begin to move in the second specific direction SD2.

[0141] Next, in step S10, the second hand HA~HD moves a distance d in the second specific direction SD2 and stops. The distance d is approximately equal to the vertical distance DZ between the shared hand HB and the first non-shared hand HA (Figure 6). As a result, the first non-shared hand HA faces the transport opening 41a of the processing unit 21B. Then, the first non-shared hand HA begins to move towards the interior of the processing unit 21B.

[0142] Next, in step S11, the first non-shared hand HA transports the substrate W1 before processing to the processing unit 21B through the transport port 41a.

[0143] Next, in step S12, the first non-shared hand HA returns to its position before movement. Then, the second hands HA~HD begin moving toward the substrate mounting section 29L (Figure 7). The shared hand HB and the second non-shared hand HC then pass substrates WX1 and WX2 to the substrate mounting section 29L, respectively.

[0144] As shown in Figures 8 and 9 above, processes S1 to S12 are executed in one transport cycle CY. As a result, in one transport cycle CY, two unprocessed substrates W1 and W2 can be loaded into two processing units 21A and 21B, and two processed substrates WX1 and WX2 can be unloaded from the two processing units 21A and 21B.

[0145] In particular, in this embodiment, the shared hand HB is used for both loading the substrate W2 into the processing unit 21A before processing and unloading the processed substrate WX1 from the processing unit 21B. Therefore, sequentially, in the direction of the first specific direction SD1, the second non-shared hand HC to the first non-shared hand HA can be used for unloading substrates WX2 and WX1 and loading substrates W1 and W2.

[0146] As a result, in order to load the unprocessed substrate W2 into the same processing unit 21A after the processed substrate WX2 has been loaded from the processing unit 21A, the shared hand HB only needs to move a distance d (the distance d between the second non-shared hand HC and the shared hand HB) in the second specific direction SD2. Similarly, in order to load the unprocessed substrate W1 into the same processing unit 21B after the processed substrate WX1 has been loaded from the processing unit 21B, the first non-shared hand HA only needs to move a distance d (the distance d between the shared hand HB and the first non-shared hand HA) in the second specific direction SD2. Therefore, compared to the case where the hands are not shared between the unprocessed and processed substrates, the throughput of the transport operation of substrates W1, W2, WX1, and WX2 by the second transport mechanism 23L can be improved. Details of this point will be described later in comparison with the second substrate transport method shown in Figures 11 and 12.

[0147] Furthermore, in this embodiment, the first substrate transport method is performed repeatedly while changing the processing unit 21 during the transport cycle CY (process S1 to process S12).

[0148] The second transport mechanism 23U (Figure 6) performs the first substrate transport method in the same manner as the second transport mechanism 23L.

[0149] Next, an example of the second substrate transport method according to this embodiment will be described with reference to Figure 10. The second substrate transport method is performed by a second transport mechanism 23 that transports substrates W between the substrate mounting section 29 and the processing unit 21. In the second substrate transport method, of the Q second hands 25, some second hands 25 that are continuous in the vertical direction DZ support only the substrates W before processing, and other second hands 25 that are continuous in the vertical direction DZ support only the substrates W after processing, thereby transporting multiple substrates W. Therefore, in the second substrate transport method, the second hands 25 are not shared between the substrates W after processing and the substrates W before processing.

[0150] Figure 10 shows an example of the overall flow of the second substrate transport method. In Figure 10, as in Figure 7, we focus on the substrate placement section 29L, the second transport mechanism 23L, and the processing units 21A and 21B. The substrate before processing is placed on the lower section 291A of the substrate placement section 29L, and the substrate after processing is placed on the upper section 291B of the substrate placement section 29L. Furthermore, the definition of the transport cycle CY in the second substrate transport method is the same as the definition of the transport cycle CY in the first substrate transport method.

[0151] As shown in Figure 10, as an example, at a certain point in time, ten unprocessed substrates W1 to W10 are placed on the lower section 291A of the substrate mounting section 29L along the vertical direction DZ, and no substrates are placed on the upper section 291B of the substrate mounting section 29L.

[0152] In the second substrate transport cycle, similar to the first substrate transport method, in one transport cycle CY, the second transport mechanism 23L receives two substrates W1 and W2 from the substrate mounting section 29L before processing by processing units 21A and 21B, and loads the two substrates W1 and W2 into two of the multiple processing units 21, 21A and 21B (second step). After processing by the two processing units 21A and 21B, the two substrates WX1 and WX2 are unloaded from the two processing units 21A and 21B, and the two substrates WX1 and WX2 are passed to the substrate mounting section 29L (second step). 5 The process). The transport cycle CY is executed repeatedly.

[0153] Specifically, in the second substrate transport method, during one transport cycle CY, of the four second hands HA to HD, the second hands HA and HB, which are continuous in the vertical direction DZ on the lower level, support only the unprocessed substrates W1 and W2. In addition, the second hands HC and HD, which are continuous in the vertical direction DZ on the upper level, support only the processed substrates WX1 and WX2.

[0154] Referring to Figure 10, the states ST11 to ST14 of the second transport mechanism 23L in one transport cycle CY will be explained.

[0155] In state ST11, where the second transport mechanism 23L has received two substrates W1 and W2 from the substrate mounting section 29L, the second hands HA and HB support substrates W1 and W2 respectively, while the second hands HC and HD do not support any substrates.

[0156] The next state after state ST11, ST12, indicates the state of the second transport mechanism 23L when the processed substrate WX2 is unloaded from the processing unit 21A by the second hand HD, and the unprocessed substrate W2 is loaded into the same processing unit 21A by the second hand HB.

[0157] The next state after state ST12, ST13, shows the state of the second transport mechanism 23L when the processed substrate WX1 is unloaded from the processing unit 21B by the second hand HC, and the unprocessed substrate W1 is loaded into the same processing unit 21B by the second hand HA.

[0158] The next state after state ST13, ST14, indicates the state of the second transport mechanism 23L when the processed substrates WX1 and WX2 are supported by the second hands HC and HD, and the substrates are not supported by the second hands HA and HB.

[0159] As described above with reference to Figure 10, according to this embodiment, the second transport mechanism 23L of the substrate processing apparatus 100 includes dedicated second hands HA and HB for supporting substrates W1 and W2 before processing, and dedicated second hands HC and HD for supporting substrates WX1 and WX2 after processing. Therefore, it is possible to suppress the adhesion of the processing liquid from the processing unit 21 to the second hands HA and HB via the processed substrates WX1 and WX2. Consequently, it is possible to suppress the adhesion of the processing liquid to the substrates before processing that are newly supported by the second hands HA and HB.

[0160] Next, an example of the second substrate transport method will be described in detail with reference to Figures 11 and 12. In the following description, when it is not necessary to refer to a specific substrate W, it will simply be referred to as "substrate".

[0161] Figures 11 and 12 are flowcharts illustrating an example of a second substrate transport method. As shown in Figures 11 and 12, the second substrate transport method includes steps S21 to S32 in one transport cycle CY. In steps S21 to S32, the second hands HA to HD are moved by a second hand drive unit 17 controlled by a control unit 200.

[0162] As shown in Figure 11, in process S21, the second hands HA and HB support the substrates W1 and W2 before processing, respectively. On the other hand, the second hands HC and HD do not support the substrates. The second hand HD faces the transport opening 41a of the processing unit 21A. The second hand HD then begins to move towards the processed substrate WX2 located inside the processing unit 21A.

[0163] Note that the state of the second hand HA~HD in process S21 is the state in which the second hand HA~HD in state ST11 shown in Figure 10 has moved to the position of processing unit 21A.

[0164] Next, in step S22, the second hand HD unloads the processed substrate WX2 from the processing unit 21A through the transport port 41a.

[0165] Next, in step S23, the second hand HD returns to its position before movement. Then, the second hand HA~HD begins to move in the second specific direction SD2.

[0166] Next, in step S24, the second hands HA~HD move a distance of 2d (=2×d) in the second specific direction SD2 and stop. The distance 2d is approximately equal to the vertical distance DZ between the second hand HD and the second hand HB (Figure 6). As a result, the second hand HB faces the transport opening 41a of the processing unit 21A. Then, the second hand HB begins to move towards the inside of the processing unit 21A.

[0167] Next, in step S25, the second hand HB transports the substrate W2 before processing to the processing unit 21A through the transport port 41a.

[0168] Next, in step S26, the second hand HB returns to its position before movement. Then, the second hands HA~HD begin moving toward the next processing unit 21B (Figure 12).

[0169] Next, as shown in Figure 12, in step S27, the second hand HA supports the substrate W1 before processing, while the second hand HB does not support the substrate. On the other hand, the second hand HC does not support the substrate, while the second hand HD supports the substrate WX2 after processing. The second hand HC faces the transport opening 41a of the processing unit 21B. Then, the second hand HC begins to move towards the processed substrate WX1 located inside the processing unit 21B.

[0170] Note that the state of the second hand HA~HD in step S27 represents the state in which the second hand HA~HD, as shown in Figure 11 for step S26, has moved to the position of the processing unit 21B.

[0171] Next, in step S28, the second hand HC unloads the processed substrate WX1 from the processing unit 21B through the transport port 41a.

[0172] Next, in step S29, the second hand HC returns to its position before movement. Then, the second hands HA~HD begin to move in the second specific direction SD2.

[0173] Next, in step S30, the second hand HA~HD moves a distance of 2d (=2×d) in the second specific direction SD2 and stops. The distance 2d is approximately equal to the vertical distance d between the second hand HC and the second hand HA in the vertical direction DZ (Figure 6). As a result, the second hand HA faces the transport opening 41a of the processing unit 21B. Then, the second hand HA begins to move towards the inside of the processing unit 21B.

[0174] Next, in step S31, the second hand HA transports the substrate W1 before processing to the processing unit 21B through the transport port 41a.

[0175] Next, in step S32, the second hand HA returns to its position before movement. Then, the second hands HA~HD begin to move toward the substrate mounting section 29L (Figure 10). Then, the second hands HC and HD each transfer substrates WX1 and WX2 to the substrate mounting section 29L.

[0176] As shown in Figures 11 and 12, processes S21 to S32 are executed in one transport cycle CY. As a result, in one transport cycle CY, two unprocessed substrates W1 and W2 are loaded into two processing units 21A and 21B by the second hands HA and HB, and two processed substrates WX1 and WX2 are unloaded from the two processing units 21A and 21B by the second hands HC and HD.

[0177] Furthermore, in this embodiment, the second substrate transport method is performed repeatedly while changing the processing unit 21 during the transport cycle CY (process S21 to process S32).

[0178] The second transport mechanism 23U (Figure 6) performs the second substrate transport method in the same manner as the second transport mechanism 23L.

[0179] Here, we compare the first substrate transport method and the second substrate transport method with reference to Figures 8 and 11. As shown in steps S3 and S4 of Figure 8, the travel distance of the shared hand HB in the vertical direction DZ is "d". On the other hand, as shown in steps S23 and S24 of Figure 11, the travel distance of the second hand HB is "2d". Therefore, the travel distance d of the shared hand HB in the first substrate transport method is smaller than the travel distance 2d of the second hand HB in the second substrate transport method. Similarly, as shown in steps S9 and S10 of Figure 9 and steps S29 and S30 of Figure 12, the travel distance d of the first non-shared hand HA in the first substrate transport method is smaller than the travel distance 2d of the second hand HA in the second substrate transport method.

[0180] As a result, the first substrate transport method can improve the throughput of the transport operation of substrates W1, W2, WX1, and WX2 by the second transport mechanism 23 compared to the second substrate transport method. In other words, the first substrate transport method can improve the throughput of the transport operation of substrates W1, W2, WX1, and WX2 by the second transport mechanism 23 compared to the case where the handle is not shared between the substrate before processing and the substrate after processing.

[0181] For example, in the first substrate transport method, the vertical travel distance DZ of the second hand HA~HD to one processing unit 21 is "d" shorter compared to the second substrate transport method. And since the transport cycle CY is executed repeatedly, the reduction in travel distance to one processing unit 21 by "d" is effective in improving the throughput of the substrate transport operation by the second transport mechanism 23.

[0182] The first substrate transport method and the second substrate transport method have been described above with reference to Figures 7 to 12. For example, the substrate processing apparatus 100 is delivered from the manufacturer to the user with the second transport mechanism 23 configured to perform either the first or second substrate transport method. In other words, one of the first or second substrate transport method is implemented in the substrate processing apparatus 100.

[0183] However, the substrate processing apparatus 100 may be equipped with both a first substrate transport method and a second substrate transport method, and the user may select and execute either the first or second substrate transport method. In this case, the user can select the desired substrate transport method according to the situation. As a result, user convenience can be improved.

[0184] In the first substrate transport method described above with reference to Figures 7 to 9, three second hands 25 were used. However, the first substrate transport method is not limited to the use of three second hands 25 and can be generalized as shown in Figure 13. In the following description, the number of processing units 21 in which substrates W are loaded and unloaded in one transport cycle CY is denoted as "N". In this specification, unless otherwise specified, N is an integer of 2 or more. We will focus on N processing units 21. Also, for ease of understanding, we will focus on N+1 second hands 25 used in the first substrate transport method out of multiple (Q) second hands 25.

[0185] Figure 13 is a diagram illustrating the first substrate transport method in a generalized manner. In Figure 13, one of the multiple second transport mechanisms 23 is shown. As shown in Figure 13, in the first substrate transport method, in one transport cycle CY, the second transport mechanism 23 receives N substrates W from the substrate placement section 29 before processing by the processing unit 21, transports the N substrates W into N processing units 21_1 to 21_N among the multiple processing units 21, and then transports the N substrates W after processing by the N processing units 21_1 to 21_N from the N processing units 21_1 to 21_N, and passes the N processed substrates W to the substrate placement section 29.

[0186] Note that the N processing units 21_1 to 21_N may be some of the processing units 21 provided by the substrate processing device 100 (total number of processing units 21 > N), or they may be all of the processing units 21 (total number of processing units 21 = N).

[0187] Multiple second hands 25 include a first non-shared hand H_F, M shared hands H_1 to H_M, and a second non-shared hand H_S. M is an integer greater than or equal to 1. The M shared hands H_1 to H_M are placed between the first non-shared hand H_F and the second non-shared hand H_S.

[0188] The total number of the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S is N+1. Also, M = N-1. In other words, the second transport mechanism 23 is equipped with N-1 shared hands H_1 to H_M.

[0189] Note that the N+1 second hands 25 (first non-shared hand H_F, shared hands H_1 to H_M, and second non-shared hand H_S) may be some of the multiple (Q) second hands 25 provided by the second transport mechanism 23, or they may be all of the second hands 25.

[0190] The first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S are arranged consecutively along the vertical direction DZ from the first non-shared hand H_F to the second non-shared hand H_S.

[0191] Then, when the second transport mechanism 23 receives N substrates W from the substrate mounting section 29 before processing, the second non-shared hand H_S does not support the substrates W, while the M shared hands H_1 to H_M and the first non-shared hand H_F support the substrates W. In other words, the M shared hands H_1 to H_M and the first non-shared hand H_F support the N substrates W.

[0192] In one transport cycle CY, M shared hands H_1 to H_M support the substrate W before processing and the substrate W after processing by the processing unit 21 at different timings.

[0193] In one transport cycle CY, the first non-shared hand H_F supports only the substrate W before processing by the processing unit 21.

[0194] In one transport cycle CY, the second non-shared hand H_S supports only the substrate W after processing by the processing unit 21.

[0195] Referring to Figure 13, the operation of the second transport mechanism 23 in the first substrate transport method will be explained in detail.

[0196] In one transport cycle CY, each of the M shared hands H_1 to H_M and the first non-shared hand H_F receives the substrate W before processing from the substrate placement unit 29.

[0197] In one transport cycle CY, the second non-shared hand H_S moves to a position facing the transport opening 41a of the processing unit 21_1 and unloads the processed substrate W from the processing unit 21_1.

[0198] In one transport cycle CY, N+1 second hands 25 move a distance d in the second specific direction SD2, so that the shared hand H_M, one of the M shared hands H_1 to H_M, adjacent to the second non-shared hand H_S, moves to a position facing the transport opening 41a of the processing unit 21_1. The distance d represents the interval between adjacent second hands 25 in the vertical direction DZ. The shared hand H_M then transports the unprocessed substrate W into the processing unit 21_1 from which the substrate W was unloaded by the second non-shared hand H_S. The processing unit 21_1 processes the substrate W.

[0199] In one transport cycle CY, as N+1 second hands 25 move, the shared hand H_M adjacent to the second non-shared hand H_S moves to a position facing the transport port 41a of a processing unit 21_2 that is different from the processing unit 21_1 into which the substrate W before processing was transported by the shared hand H_M. Then, the shared hand H_M transports the processed substrate W out of the processing unit 21_2.

[0200] In one transport cycle CY, as N+1 second hands 25 move a distance d in the second specific direction SD2, one of the M shared hands H_1 to H_M, shared hand H_M-1 adjacent to shared hand H_M, moves to a position facing the transport opening 41a of the processing unit 21_2. Shared hand H_M-1 is adjacent to shared hand H_M in the first specific direction SD1. Then, shared hand H_M-1 transports the unprocessed substrate W into the processing unit 21_2 from which the substrate W was unloaded by shared hand H_M. The processing unit 21_2 processes the substrate W.

[0201] In one transport cycle CY, as N+1 second hands 25 move, shared hand H_M-1, adjacent to shared hand H_M, moves to a position facing the transport opening 41a of a processing unit 21_3 that is different from the processing unit 21_2 into which the substrate W before processing was transported by shared hand H_M-1. Then, shared hand H_M-1 transports the processed substrate W from processing unit 21_3.

[0202] In one transport cycle CY, as N+1 second hands 25 move a distance d in the second specific direction SD2, shared hand H_M-2, which is adjacent to shared hand H_M-1, moves to a position facing the transport opening 41a of the processing unit 21_3. Shared hand H_M-2 is adjacent to shared hand H_M-1 in the first specific direction SD1. Then, shared hand H_M-2 transports the unprocessed substrate W into the processing unit 21_3 from which the substrate W was unloaded by shared hand H_M-1. The processing unit 21_3 processes the substrate W.

[0203] In one transport cycle CY, as N+1 second hands 25 move, shared hand H_M-2, which is adjacent to shared hand H_M-1, moves to a position facing the transport port 41a of a processing unit 21_4 that is different from the processing unit 21_3 into which the substrate W before processing was transported by shared hand H_M-2. Then, shared hand H_M-2 transports the processed substrate W from processing unit 21_4.

[0204] Subsequently, in the same manner, during one transport cycle CY, the shared hands H_M-3 to H_2 load and unload the substrate W to processing units 21_4 to 21_N-1. Processing units 21_4 to 21_N-1 process the substrate W.

[0205] Then, in one transport cycle CY, as the N+1 second hands 25 move, the shared hand H_1 adjacent to the shared hand H_2, that is, the shared hand H_1 adjacent to the first non-shared hand H_F, moves to a position facing the transport port 41a of a processing unit 21_N different from the processing unit 21_N-1 from which the substrate W was unloaded by the shared hand H_2. The shared hand H_1 is adjacent to the shared hand H_2 in the first specific direction SD1. Then, the shared hand H_1 unloads the processed substrate W from the processing unit 21_N.

[0206] In other words, in one transport cycle CY, the shared hand H_1 unloads the processed substrate W from the Nth processing unit 21_N.

[0207] Then, in one transport cycle CY, as the N+1 second hands 25 move a distance d in the second specific direction SD2, the first non-shared hand H_F moves to a position facing the transport opening 41a of the processing unit 21_N. The first non-shared hand H_F then transports the unprocessed substrate W into the processing unit 21_N, from which the substrate W was unloaded by the adjacent shared hand H_1. The processing unit 21_N processes the substrate W.

[0208] In other words, in one transport cycle CY, the first non-shared hand H_F carries the unprocessed substrate W to the Nth processing unit 21_N.

[0209] Then, the M shared hands H_1 to H_M and the second non-shared hand H_S pass the N processed substrates W to the substrate mounting unit 29.

[0210] As explained above with reference to Figure 13, in this embodiment, the shared hands H_1 to H_M are used for loading the substrate W before processing into processing units 21_1 to 21_N-1, and for unloading the processed substrate W from processing units 21_2 to 21_N. Therefore, the second non-shared hand H_S to the first non-shared hand H_F can be used sequentially toward the first specific direction SD1 for unloading and loading the substrate W.

[0211] As a result, in order to load the unprocessed substrate W into the same processing unit 21 after the processed substrate W has been loaded from the processing unit 21, the shared hands H_1 to H_M and the first non-shared hand H_F only need to move a distance d (the distance d between the second hands 25) in the second specific direction SD2. Therefore, compared to a case where the hands are not shared between the unprocessed substrate W and the processed substrate W (for example, the second substrate transport method), the throughput of the substrate W transport operation by the second transport mechanism 23L can be improved.

[0212] Next, when the first substrate transport method is generalized, the relationship between the total number Q of second hands 25, the number of second hands 25 used in the first substrate transport method, and the number of second hands 25 used in the second substrate transport method will be explained with reference to Figures 14 to 16. Figures 14 to 16 show one of the multiple second transport mechanisms 23. Also, the number of processing units 21 in which substrates W are loaded and unloaded in one transport cycle CY is denoted as "N".

[0213] Figure 14 shows the relationship between the total number of second hands 25 Q, the number of second hands 25 used in the first substrate transport method, and the number of second hands 25 used in the second substrate transport method, when the second transport mechanism 23 is equipped with 2N second hands 25.

[0214] As shown in Figure 14, Q = 2 × N = 2N. Therefore, the total number Q of the multiple second hands 25 provided by the second transport mechanism 23 is 2N. In other words, the second transport mechanism 23 is equipped with 2N second hands 25. In this example, N is an integer greater than or equal to 2.

[0215] Furthermore, when the first substrate transport method is implemented in the substrate processing device 100, the 2N second hands 25 include the first non-shared hand H_F, M shared hands H_1 to H_M, and the second non-shared hand H_S. M is an integer greater than or equal to 1.

[0216] The total number of hands, including the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S, is N+1. Also, M = N-1. In other words, the second transport mechanism 23 is equipped with N-1 shared hands H_1 to H_M. Note that in the first substrate transport method, of the Q (=2N) second hands 25, N-1 second hands 25 are not used.

[0217] On the other hand, if the second substrate transport method is implemented in the substrate processing apparatus 100, for example, of the 2N second hands 25, N second hands 25 that are continuous in the vertical direction DZ (for example, the lower second hands 25) support the substrate W before processing, and the other N second hands 25 that are continuous in the vertical direction DZ (for example, the upper second hands 25) support the substrate W after processing.

[0218] As explained above with reference to Figure 14, according to this embodiment, by setting the total number Q of second hands 25 to 2N, all second hands 25 can be used when implementing the second substrate transport method in the substrate processing apparatus 100. As a result, the throughput when transporting substrates W in the second substrate transport method can be improved. Furthermore, since the second transport mechanism 23 is equipped with 2N second hands 25 in advance, when implementing the first substrate transport method in the substrate processing apparatus 100, the existing N+1 second hands 25 can be used without adding any new second hands 25.

[0219] For example, if N=2, the first substrate transport method can be performed with the first non-shared hand H_F, one shared hand H_1, and the second non-shared hand H_S. In other words, the first substrate transport method can be performed with the minimum configuration of the second hand 25. Therefore, the cost of the second transport mechanism 23 can be reduced.

[0220] Here, for example, one of the first substrate transport method and the second substrate transport method described with reference to Figure 14 is implemented in the substrate processing apparatus 100.

[0221] However, both the first substrate transport method and the second substrate transport method may be implemented in the substrate processing apparatus 100.

[0222] Specifically, the second transport mechanism 23 may operate in either the first substrate transport mode MD1 or the second substrate transport mode MD2 under the control of the control unit 200.

[0223] The first substrate transport mode MD1 is a mode in which the second transport mechanism 23 executes the first substrate transport method. Specifically, in the first substrate transport mode MD1, N+1 of the 2N second hands 25 are used as the first non-shared hand H_F, M shared hands H_1 to H_M, and the second non-shared hand H_S.

[0224] The second substrate transport mode MD2 is a mode in which the second transport mechanism 23 executes the second substrate transport method. Specifically, in the second substrate transport mode MD2, of the 2N second hands 25, N second hands 25 are used to support only the substrate W before processing by the processing unit 21, and the other N second hands 25 are used to support only the substrate W after processing by the processing unit 21.

[0225] The user can operate the control unit 200 to operate the second transport mechanism 23 in either the first substrate transport mode MD1 or the second substrate transport mode MD2. This improves user convenience. Furthermore, the manufacturer of the substrate processing device 100 can operate the control unit 200 to set the device to either the first substrate transport mode MD1 or the second substrate transport mode MD2 before shipping. This improves convenience for the manufacturer.

[0226] Figure 15 shows the relationship between the total number of second hands 25 Q, the number of second hands 25 used in the first substrate transport method, and the number of second hands 25 used in the second substrate transport method, when the second transport mechanism 23 is equipped with N+1 second hands 25 and N is an odd number.

[0227] As shown in Figure 15, Q = N+1. Therefore, in the second transport mechanism 23, the total number Q of the multiple second hands 25 is N+1. In other words, the second transport mechanism 23 has N+1 second hands 25. In this example, N is an odd number greater than or equal to 3.

[0228] Furthermore, when the first substrate transport method is implemented in the substrate processing device 100, the N+1 second hands 25 include the first non-shared hand H_F, M shared hands H_1 to H_M, and the second non-shared hand H_S. M is an integer greater than or equal to 1.

[0229] The total number of hands, including the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S, is N+1. Also, M = N-1. In other words, the second transport mechanism 23 is equipped with N-1 shared hands H_1 to H_M. In particular, in the first substrate transport method, all of the Q (=N+1) second hands 25 are used. That is, according to this embodiment, the number of second hands 25 used when executing the first substrate transport method is optimized, and there are no extra second hands 25. Therefore, the cost of the second transport mechanism 23 can be reduced.

[0230] On the other hand, if the second substrate transport method is implemented in the substrate processing apparatus 100, for example, of the N+1 second hands 25, (N+1) / 2 second hands 25 that are continuous along the vertical direction DZ (for example, the lower second hands 25) support the substrate W before processing, and the other (N+1) / 2 second hands 25 that are continuous along the vertical direction DZ (for example, the upper second hands 25) support the substrate W after processing.

[0231] Here, for example, one of the first substrate transport method and the second substrate transport method described with reference to Figure 15 is implemented in the substrate processing apparatus 100.

[0232] However, as explained in Figure 14, the second transport mechanism 23 may operate in either the first substrate transport mode MD10 or the second substrate transport mode MD20 under the control of the control unit 200.

[0233] The first board transport mode MD10 is a mode in which the second transport mechanism 23 executes the first board transport method. Specifically, in the first board transport mode MD10, all Q (=N+1) second hands 25 are used as the first non-shared hand H_F, M shared hands H_1 to H_M, and the second non-shared hand H_S.

[0234] The second substrate transport mode MD20 is a mode in which the second transport mechanism 23 executes the second substrate transport method. Specifically, in the second substrate transport mode MD20, of the Q (=N+1) second hands 25, (N+1) / 2 second hands 25 that are continuous in the vertical direction DZ are used to support only the substrate W before processing by the processing unit 21, and the other (N+1) / 2 second hands 25 that are continuous in the vertical direction DZ are used to support only the substrate W after processing by the processing unit 21.

[0235] When both the first board transport mode MD10 and the second board transport mode MD20 are implemented, the convenience for users and manufacturers can be improved, similar to when both the first board transport mode MD1 and the second board transport mode MD2 are implemented.

[0236] Figure 16 shows the relationship between the total number of second hands 25 Q, the number of second hands 25 used in the first substrate transport method, and the number of second hands 25 used in the second substrate transport method, when the second transport mechanism 23 is equipped with N+1 second hands 25 and N is an even number.

[0237] As shown in Figure 16, Q = N+1. Therefore, in the second transport mechanism 23, the total number Q of the multiple second hands 25 is N+1. In other words, the second transport mechanism 23 has N+1 second hands 25. In this example, N is an even number greater than or equal to 2.

[0238] Furthermore, when the first substrate transport method is implemented in the substrate processing device 100, the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S when N is even are the same as the first non-shared hand H_F, the M shared hands H_1 to H_M, and the second non-shared hand H_S when N is odd, as explained with reference to Figure 15.

[0239] On the other hand, when the second substrate transport method is implemented in the substrate processing apparatus 100, for example, of the N+1 second hands 25, N / 2 second hands 25 that are continuous in the vertical direction DZ (for example, the lower second hands 25) support the substrate W before processing, and the other N / 2 second hands 25 that are continuous in the vertical direction DZ support the substrate W after processing. The uppermost or lowermost second hand 25 is not used.

[0240] Here, for example, one of the first substrate transport method and the second substrate transport method described with reference to Figure 16 is implemented in the substrate processing apparatus 100.

[0241] However, as explained in Figure 14, the second transport mechanism 23 may operate in either the first substrate transport mode MD100 or the second substrate transport mode MD200 under the control of the control unit 200.

[0242] The first substrate transport mode MD100 is the same as the first substrate transport mode MD10 described with reference to Figure 15.

[0243] The second substrate transport mode MD200 is a mode in which, of the Q (=N+1) second hands 25, N / 2 second hands 25 that are continuous in the vertical direction DZ are used to support only the substrate W before processing by the processing unit 21, and the other N / 2 second hands 25 that are continuous in the vertical direction DZ are used to support only the substrate W after processing by the processing unit 21.

[0244] When both the first substrate transfer mode MD100 and the second substrate transfer mode MD200 are implemented, the convenience for users and manufacturers can be improved, similar to the case when both the first substrate transfer mode MD1 and the second substrate transfer mode MD2 are implemented.

[0245] The embodiments of the present invention have been described above with reference to the drawings (FIGS. 1 to 16). However, the present invention is not limited to the above embodiments, and can be implemented in various aspects without departing from the gist thereof (for example, the following (1) to (4)). Also, the plurality of components disclosed in the above embodiments can be appropriately modified. For example, a certain component among all the components shown in one embodiment may be added to the components of another embodiment, or some of the components among all the components shown in one embodiment may be deleted from the embodiment.

[0246] The drawings schematically show each component for ease of understanding of the invention, and the thickness, length, number, interval, etc. of each illustrated component may be different from the actual ones for convenience of drawing creation. Also, the configuration of each component shown in the above embodiments is an example and is not particularly limited, and it is needless to say that various changes can be made without substantially departing from the effects of the present invention.

[0247] (1) In the first substrate transfer method described with reference to FIG. 13, the second transfer mechanism 23 may include one or more second hands 25 continuous in the first specific direction SD1 with respect to the first non - shared hand H_F, or may include one or more second hands 25 continuous in the second specific direction SD2 with respect to the second non - shared hand H_S. This also applies to the second transfer mechanism 23 described with reference to FIGS. 7 to 9.

[0248] (2) In FIG. 13, in the first substrate transfer method, among the N + 1 second hands 25, the lowermost second hand 25 is set as the first non - shared hand H_F, and the uppermost second hand 25 is set as the second non - shared hand H_S (the first aspect). However, among the N + 1 second hands 25, the lowermost second hand 25 may be set as the second non - shared hand H_S, and the uppermost second hand 25 may be set as the first non - shared hand H_F (the second aspect).

[0249] In this case, the first specific direction SD1 and the second specific direction SD2 are opposite to those in the case of FIG. 13. That is, the first specific direction SD1 indicates the upward direction, and the second specific direction SD2 indicates the downward direction. Also, in this case, in FIG. 13, the reference numerals of the shared hands 25 are, in order from the top, "H_1~H_M", and the reference numerals of the processing units 21 are, in order from the bottom, "21_1~21_N".

[0250] Also, when repeatedly executing the transfer cycle CY, the first substrate transfer method may be executed by mixing the first aspect and the second aspect.

[0251] Regarding the second transfer mechanism 23 described with reference to FIGS. 7 to 9, the second aspect may also be adopted in the first substrate transfer method. For example, the second hand HC may be set as the first non - shared hand, and the second hand HA may be set as the second non - shared hand. Also, in the second transfer mechanism 23 described with reference to FIGS. 7 to 9, the first substrate transfer method may be executed using the second hands HB to HC without using the second hand HA.

[0252] (3) The control unit 200 shown in FIG. 1 may determine the processing unit 21 that performs the unloading and loading of the substrate W in one transfer cycle CY according to a predetermined schedule, or may determine it by an event - driven method. The event - driven method is a method of determining the optimal processing unit 21 from among a plurality of processing units 21 at the time of determining the processing unit 21 that performs the unloading and loading of the substrate W.

[0253] (4) The configuration of the first hand drive unit 11 shown in Figures 1 to 3 is not particularly limited as long as it can drive the first hand 9. For example, all five first hand 9s may have the same pivot axis. For example, as long as their pivot axes coincide, four of the five first hand 9s that are continuous in the vertical direction DZ may have the same pivot axis, while the pivot axis of the other first hand 9 may be different. Similarly, the configuration of the second hand drive unit 17 is not particularly limited as long as it can drive the second hand 25. [Industrial applicability]

[0254] The present invention relates to a substrate processing apparatus and a substrate transport method, and has industrial applicability. [Explanation of symbols]

[0255] 7…First conveying mechanism 9…First hand 21, 21A, 21B, 21_1~21_N… Processing Units 23, 23L, 23U... Second conveying mechanism (conveying mechanism) 25, HA~HD, H_F, H_S, H_1~HM ...Second hand (Hand, First non-shared hand, Second non-shared hand, Shared hand) 29, 29L, 29U... Circuit board mounting section 100... Circuit board processing equipment 200... Control Unit

Claims

1. A first substrate mounting section on which multiple substrates are placed comprises a first support group having 10 first support parts each supporting one substrate, and a second support group having 10 second support parts each supporting one substrate, A third support group having 10 third support parts each supporting one substrate, and a fourth support group having 10 fourth support parts each supporting one substrate, a second substrate mounting section positioned above the first substrate mounting section and on which multiple substrates are mounted, A plurality of processing units, including 12 pre-processing units arranged in the lower section and 12 upper-processing units arranged in the upper section, comprising 24 processing units that perform the same processing on the substrate, A first transport mechanism having five first hands, each supporting a single substrate, transports substrates from a carrier that accommodates multiple substrates to the first substrate mounting section or the second substrate mounting section, A lower transport mechanism is provided, which is located in a lower transport chamber having an internal space and has four lower hands, each supporting a single substrate, and transports substrates from the first substrate mounting section to the plurality of processing units. The system includes an upper transport mechanism that has an internal space, is located in an upper transport chamber positioned above the lower transport chamber, has four upper hands each supporting a single substrate, and transports substrates from the second substrate mounting section to the plurality of processing units, The center of the vertical height of the first substrate mounting section is positioned above the center of the vertical height of the lower transport chamber. A substrate processing apparatus wherein the center of the vertical height of the second substrate mounting section is located below the center of the vertical height of the upper transport chamber.

2. The substrate processing apparatus according to claim 1, wherein the first transport mechanism transports substrates from the carrier, which can accommodate 25 substrates, to a first substrate mounting section or a second substrate mounting section.

3. The first transport mechanism further transports the substrate from the first substrate mounting section to the carrier using five first hands. The substrate processing apparatus according to claim 1 or 2, wherein the lower transport mechanism further transports the substrate from the processing unit to the first substrate mounting section.

4. The substrate processing apparatus according to claim 3, wherein the lower transport mechanism transports a substrate from the first substrate mounting section to the processing unit using two of the four lower hands, and transports a substrate from the processing unit to the first substrate mounting section using the remaining two of the four lower hands.

5. The first transport mechanism transports a substrate from the carrier to the first support group with five first hands, and transports a substrate from the second support group to the carrier with five first hands. The substrate processing apparatus according to claim 4, wherein the lower transport mechanism transports a substrate from the first support group to the processing unit using two of the four lower hands, and transports a substrate from the processing unit to the second support group using the remaining two of the four lower hands.

6. The substrate processing apparatus according to claim 5, wherein in the first substrate mounting section, the first support group is arranged in the lower section and the second support group is arranged in the upper section.

7. A substrate processing apparatus according to any one of claims 4 to 6, wherein two of the lower hands for transporting a substrate from the first substrate mounting section to the processing unit are continuous in the vertical direction, and four of the lower hands are arranged with vertical spacing between them so that two of the lower hands for transporting a substrate from the processing unit to the first substrate mounting section are continuous in the vertical direction.

8. The substrate processing apparatus according to claim 7, wherein, of the four lower hands, two lower hands that are vertically continuous in the lower section transport a substrate from the first substrate mounting section to the processing unit, and two lower hands that are vertically continuous in the upper section transport a substrate from the processing unit to the first substrate mounting section.

9. The upper transport mechanism further transports the substrate from the processing unit to the second substrate mounting section. The substrate processing apparatus according to any one of claims 5 to 8, wherein the upper transport mechanism transports a substrate from the second substrate mounting section to the processing unit using two of the four upper hands, and transports the substrate from the processing unit to the second substrate mounting section using the remaining two of the four upper hands.

10. The first transport mechanism transports a substrate from the carrier to the third support group with five first hands, and transports a substrate from the fourth support group to the carrier with five first hands, The substrate processing apparatus according to claim 9, wherein the upper transport mechanism transports a substrate from the third support group to the processing unit using two of the four upper hands, and transports a substrate from the processing unit to the fourth support group using the remaining two of the four upper hands.

11. The first transport mechanism transports a substrate from the carrier to the first support group with five first hands, and transports a substrate from the second support group to the carrier with five first hands. The lower transport mechanism transports the substrate from the first support group to the processing unit, and transports the substrate from the processing unit to the second support group. The first transport mechanism transports a substrate from the carrier to the third support group using five first hands, and transports a substrate from the fourth support group to the carrier using five first hands. The upper transport mechanism transports the substrate from the third support group to the processing unit, and transports the substrate from the processing unit to the fourth support group. The first support group and the second support group are positioned above the center of the vertical height of the lower transport chamber. The substrate processing apparatus according to claim 10, wherein the third support group and the fourth support group are arranged below the center of the vertical height of the upper transport chamber.

12. The lower transport mechanism transports the substrate from the first substrate mounting section to the 12 pre-processing units, The lower transport mechanism transports the substrate from the 12 pre-processing units to the first substrate mounting section. The upper transport mechanism transports the substrate from the second substrate mounting section to the twelve upper processing units. The substrate processing apparatus according to any one of claims 3 to 11, wherein the upper transport mechanism transports a substrate from the 12 upper processing units to the second substrate mounting section.

13. A substrate transport method comprising: a first substrate mounting section on which multiple substrates are placed, comprising a first support section group having 10 first support sections each supporting one substrate, and a second support section group having 10 second support sections each supporting one substrate, and on which multiple substrates are placed; a second substrate mounting section positioned above the first substrate mounting section and on which multiple substrates are placed, comprising a carrier for accommodating multiple substrates; and a plurality of processing units including 12 pre-processing units positioned on the lower stage and 12 upper-processing units positioned on the upper stage, wherein substrates are transported between 24 processing units that perform the same processing on the substrates. A first step involves transporting a substrate from the carrier to the first substrate mounting section using a first transport mechanism having five first hands, each supporting a single substrate; A second step involves transporting substrates from the first substrate placement section to the plurality of processing units by a lower transport mechanism having four lower hands, each supporting a single substrate, in a lower transport chamber having an internal space. The third step involves transporting the substrate from the carrier to the second substrate mounting section using the first transport mechanism, The fourth step includes transporting substrates from the second substrate placement section to the plurality of processing units by an upper transport mechanism having four upper hands, each supporting a single substrate, in an upper transport chamber having an internal space and positioned above the lower transport chamber, The center of the vertical height of the first substrate mounting section is positioned above the center of the vertical height of the lower transport chamber. A substrate transport method wherein the center of the vertical height of the second substrate mounting section is positioned below the center of the vertical height of the upper transport chamber.

14. In the second step, the lower transport mechanism transports the substrate from the first substrate mounting section to the processing unit using two of the four lower hands, A fifth step is to use the remaining two of the four lower hands to transport the substrate from the processing unit to the first substrate mounting section using the lower transport mechanism, The substrate transport method according to claim 13, further comprising a sixth step of transporting a substrate from the first substrate mounting section to the carrier using the first transport mechanism with five of the first hands.

15. In the first step, the first transport mechanism transports the substrate from the carrier to the first support group with five first hands, In the second step, the lower transport mechanism uses two of the four lower hands to transport the substrate from the first support group to the processing unit. In the fifth step, the lower transport mechanism uses the remaining two of the four lower hands to transport the substrate from the processing unit to the second support group. The substrate transport method according to claim 14, wherein in the sixth step, the first transport mechanism transports the substrate from the second support group to the carrier with five first hands.

16. In the fourth step, the upper transport mechanism transports the substrate from the second substrate mounting section to the processing unit using two of the four upper hands, A seventh step involves using the remaining two of the four upper hands to transport the substrate from the processing unit to the second substrate mounting section using the upper transport mechanism, The substrate transport method according to claim 15, further comprising an eighth step of transporting a substrate from the second substrate mounting section to the carrier using the first transport mechanism with five of the first hands.

17. In the third step, the first transport mechanism transports the substrate from the carrier to the third support group with five first hands, In the fourth step, the lower transport mechanism uses two of the four lower hands to transport the substrate from the third support group to the processing unit. In the seventh step, the lower transport mechanism uses the remaining two of the four lower hands to transport the substrate from the processing unit to the fourth support group. The substrate transport method according to claim 16, wherein in the eighth step, the first transport mechanism transports the substrate from the fourth support group to the carrier with five first hands.

18. The fifth step involves transporting the substrate from the processing unit to the first substrate mounting section using the lower transport mechanism, A sixth step involves using five of the first hands to transport the substrate from the first substrate mounting section to the carrier using the first transport mechanism, The seventh step involves transporting the substrate from the processing unit to the second substrate mounting section using the upper transport mechanism, The process further includes an eighth step of transporting a substrate from the second substrate mounting section to the carrier using the first transport mechanism with five of the first hands, In the first step, the first transport mechanism transports the substrate from the carrier to the first support group using five first hands. In the second step, the lower transport mechanism transports the substrate from the first support group to the processing unit. In the third step, the first transport mechanism transports the substrate from the carrier to the third support group using five first hands. In the fourth step, the lower transport mechanism transports the substrate from the third support group to the processing unit. In the fifth step, the lower transport mechanism transports the substrate from the processing unit to the second support group. In the sixth step, the first transport mechanism transports the substrate from the second support group to the carrier using five first hands. In the seventh step, the lower transport mechanism transports the substrate from the processing unit to the fourth support group, In the eighth step, the first transport mechanism transports the substrate from the fourth support group to the carrier using five first hands. The first support group and the second support group are positioned above the center of the vertical height of the lower transport chamber. The substrate transport method according to claim 13, wherein the third support group and the fourth support group are arranged below the center of the vertical height of the upper transport chamber.

19. The lower transport mechanism transports the substrate from the first substrate mounting section to the 12 pre-processing units in the second step, In the fourth step, the lower transport mechanism transports the substrate from the 12 pre-processing units to the first substrate mounting section. In the fifth step, the upper transport mechanism transports the substrate from the second substrate placement section to the twelve upper processing units. The substrate transport method according to any one of claims 16 to 18, wherein the upper transport mechanism transports a substrate from the 12 upper processing units to the second substrate mounting section in the seventh step.

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