Film wrapping machine

Abstract

To provide a film lap processing device which enables improvement of surface roughness of a processing surface located at the back side of a workpiece.SOLUTION: A film lap processing device 100 polishes a processing surface 104 with a tape-like polishing film 106. The processing surface is an outer peripheral surface of a center shaft 108 whose periphery is enclosed by a flange 110. The film lap processing device includes: a back up shoe 118 which presses the polishing film to the processing surface; and a film guide 120 which guides the polishing film. The film guide has a pair of inclined parts 140, 142 which are disposed at both sides of the back up shoe and incline in a direction such that the inclined parts come close to each other in a direction toward at a tip of the film guide. The film guide bends the polishing film sent from the rear of the film guide toward the back up shoe with the inclined part 140 and bends the polishing film that has passed through the back up shoe backward with the other inclined part 142.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a film wrapping processing apparatus for polishing a processing surface with a tape-shaped polishing film.

Background Art

[0002] As a method for polishing a workpiece of a metal part, film wrapping processing is known. Film wrapping processing is a polishing method performed using a polishing film having abrasive grains applied to its surface. In this polishing method, the polishing film is pressed against the processing surface of a predetermined workpiece, and the workpiece is rotated to polish the processing surface.

[0003] For example, Patent Document 1 discloses a polishing apparatus having a processing surface that is a small peripheral portion of a disk-shaped member. This polishing apparatus includes a bypass guide member that guides a polishing tape in a bypass manner. The bypass guide member has left and right guide grooves extending in the longitudinal direction, a forward guide surface, and a return guide surface. The forward guide surface and the return guide surface are formed on the outer inner surfaces of the respective guide grooves, enabling the polishing tape to be guided forward and backward.

[0004] Further, a bypass pressure receiving surface is formed at the tip of the bypass guide member. The bypass pressure receiving surface enables the folded-back portion of the polishing tape guided forward and backward to be bypass-guided to the side on the processing side. The bypass pressure receiving surface has two folded-back surfaces and a pressure receiving surface. The two folded-back surfaces are formed by being cut at 45 degrees so as to fold back the forward portion of the forward and return portions of the polishing tape from the forward guide surface to the side and fold back the return portion from the side to the return guide surface. The pressure receiving surface is the outer peripheral surface of a roll-shaped pressure receiving pad, which guides the polishing tape folded back to the side by the two folded-back surfaces and receives the polishing pressure against the disk-shaped member.

[0005] In Patent Document 1, it is stated that by guiding the polishing tape in a bypass manner by the above-described bypass guide member, the processing surface, which is a small peripheral portion of the disk-shaped member, can be polished well without being obstructed by surrounding members.

Prior Art Documents

[0006] [Patent Document 1] Japanese Patent Publication No. 2002-126981 [Overview of the project] [Problems that the invention aims to solve]

[0007] However, depending on the shape of the workpiece, the machined surface may be located in a recessed area, making it difficult to polish. For example, if the machined surface is the outer surface of a central axis surrounded by a flange, the polishing apparatus described in Patent Document 1 will result in insufficient polishing of the machined surface. Therefore, there is a demand for improving surface roughness even when polishing machined surfaces located in recessed areas of a workpiece.

[0008] In view of these problems, the present invention aims to provide a film wrapping apparatus that can improve the surface roughness of a processed surface located deep within a workpiece. [Means for solving the problem]

[0009] To solve the above problems, a typical configuration of the film wrapping apparatus according to the present invention is a film wrapping apparatus that polishes a processing surface with a tape-shaped polishing film, wherein the processing surface is the outer circumferential surface of a central axis surrounded by a flange, and comprises a backup shoe that presses the polishing film onto the processing surface and a film guide that guides the polishing film, wherein the film guide has a pair of inclined portions arranged on both sides of the backup shoe and inclined in a direction that moves closer to each other as it approaches the tip of the film guide, and the polishing film fed from behind the film guide is bent toward the backup shoe at one of the pair of inclined portions, and the polishing film that has passed through the backup shoe is bent backward at the other inclined portion.

[0010] In the above configuration, the pair of inclined sections are tapered, for example, at an angle of 45 degrees, so that they move closer to each other as they approach the tip of the film guide, i.e., the processing surface. The polishing film, fed from the rear of the film guide, is bent twice by the pair of inclined sections and returned to the rear of the film guide. The processing surface is the outer circumferential surface of the central axis, surrounded by a flange, and is located in a recessed position within the workpiece.

[0011] This allows the polishing portion (polishing film and backup shoe) to protrude from the processing device, even when using a long, tape-like polishing film. Therefore, the polishing portion can be inserted into and processed on the recessed surface of the workpiece. Consequently, the surface roughness of the recessed surface of the workpiece can be improved with this configuration.

[0012] The pressing surface of the backup shoe described above should be a concave surface that follows the outer circumference of the machined surface. This allows the concave pressing surface and the machined surface to come into surface contact via the abrasive film when the backup shoe presses the abrasive film against the machined surface, thereby improving the roundness of the machined surface.

[0013] The pair of inclined sections described above have a semicircular shape with a convex shape toward the tip of the film guide, and are preferably coated with a coating that provides wear resistance and high slipperiness. This makes it possible to obtain wear resistance and slipperiness for the pair of inclined sections even when the film guide is small and rollers cannot be attached to the inclined sections.

[0014] It is preferable to attach rollers to the pair of inclined sections described above. This allows the rollers to smoothly feed the abrasive film through the pair of inclined sections. [Effects of the Invention]

[0015] According to the present invention, it is possible to provide a film wrapping apparatus that can improve the surface roughness of a processed surface located in a recessed area of ​​a workpiece. [Brief explanation of the drawing]

[0016] [Figure 1] This is a view showing the film wrapping processing apparatus in an embodiment of the present invention together with a workpiece. [Figure 2] This is a view showing the workpiece of FIG. 1. [Figure 3] This is an enlarged view of the film guide of the film wrapping processing apparatus of FIG. 1. [Figure 4] This is an enlarged view of the main part of the film wrapping processing apparatus of FIG. 1 as seen from various directions. [Figure 5] This is a view showing a state where the part to be polished of the film wrapping processing apparatus of FIG. 1 is approaching the processing surface of the workpiece. [Figure 6] This is a view showing a state where the processing surface of the workpiece is being polished by the film wrapping processing apparatus of FIG. 1. [Figure 7] This is a view showing a modified example of the film guide of FIG. 3.

Embodiments for Carrying Out the Invention

[0017] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Dimensions, materials, and other specific numerical values shown in such embodiments are merely examples for facilitating understanding of the invention, and do not limit the present invention unless otherwise specified. In the present specification and drawings, elements having substantially the same functions and configurations are denoted by the same reference numerals to omit redundant explanations, and elements not directly related to the present invention are not shown in the drawings.

[0018] FIG. 1 is a view showing a film wrapping processing apparatus (hereinafter, processing apparatus 100) in an embodiment of the present invention together with a workpiece 102. FIG. 2 is a view showing the workpiece 102 of FIG. 1. FIG. 2(a) is an enlarged view showing the workpiece 102 of FIG. 1. FIG. 2(b) is a view showing the processing surface 104 of the workpiece 102 of FIG. 2(a).

[0019] The processing device 100 is a machine tool that polishes the processing surface 104 (see FIG. 2(b)) of the workpiece 102, which is the object to be processed, using a long tape-shaped polishing film 106. In the processing device 100, the polishing film 106 is pressed against the processing surface 104 of the workpiece 102, and the workpiece 102 is rotated as shown by the arrow A in FIG. 1 to polish the processing surface 104.

[0020] As shown in FIG. 2(a), the workpiece 102 has a central axis 108 and a flange 110 that projects radially from the central axis 108. The processing surface 104 shown in FIG. 2(b) is the outer peripheral surface of the central axis 108 surrounded by the flange 110 at its periphery and is located deep inside the workpiece 102. Therefore, the processing surface 104 of the workpiece 102 may be difficult to polish and may suffer from insufficient polishing.

[0021] Therefore, the processing device 100 adopts a configuration that can improve the surface roughness of the processing surface 104 located deep inside the workpiece 102.

[0022] The processing device 100 includes a base 112, a cylinder 114, a support base 116, a backup shoe 118, and a film guide 120. A rail 122 extending in the vertical direction is attached to the base 112. The cylinder 114 is fixed to an upper plate 124 attached to the upper part of the base 112. Note that, for example, a hydraulic cylinder can be used as the cylinder 114.

[0023] The support base 116 is installed so as to be able to travel on the rail 122 attached to the base 112 and is further connected to the rod 126 of the cylinder 114. Therefore, the support base 116 can travel on the rail 122 in accordance with the movement of the rod 126 of the cylinder 114 and can move in the vertical direction.

[0024] Furthermore, a backup shoe 118 is fixed to the support base 116 by means of a screw or the like. The film guide 120 is a single plate member attached to the lower part of the base 112 (see FIG. 3) and guides the polishing film 106.

[0025] As the support base 116 moves along the rail 122 and descends in response to the movement of the rod 126 of the cylinder 114, the backup shoe 118 presses the abrasive film 106 against the machined surface 104 of the workpiece 102.

[0026] The polishing film 106 is fed from the supply reel 128 through the film guide roller 130 and film guide 120 to pass through the backup shoe 118. Furthermore, the polishing film 106 is not fed out during polishing, and when it is worn down by polishing, it is wound onto the take-up reel 134 through the film guide 120 and film guide roller 132 (see Figure 4(a)). In the processing apparatus 100, by appropriately moving the worn-down polishing film 106, it becomes possible to efficiently polish the processed surface 104 of the workpiece 102.

[0027] Figure 3 is an enlarged view of the film guide 120 of the processing apparatus 100 shown in Figure 1. Figure 4 is an enlarged view of the main part of the processing apparatus 100 shown in Figure 1, viewed from various directions. As shown in Figure 3, the film guide 120 is a single split plate member having a pair of guide surfaces 136, 138 and a pair of inclined portions 140, 142.

[0028] The pair of inclined sections 140 and 142 are formed on the tip side of the pair of guide surfaces 136 and 138, that is, on the machining surface 104 side of the workpiece 102. The pair of inclined sections 140 and 142 are positioned on both sides of the backup shoe 118 (see Figure 4(b)) and are tapered, inclined at an angle of, for example, 45 degrees, so that they move closer to each other as they approach the tip of the film guide 120.

[0029] As shown in Figure 4(a), the guide surface 136 guides the polishing film 106, which has been fed from the rear via the film guide roller 130, to one of the inclined sections 140 located at the front end. A side plate 144 is also attached to the guide surface 136 to prevent the polishing film 106 from shifting position.

[0030] The inclined portion 140 bends the polishing film 106, which has been fed from behind the film guide 120 by the guide surface 136, toward the backup shoe 118 as shown in Figures 4(b) and 4(c). As a result, the polishing film 106 faces the pressing surface 146 shown in Figure 4(b) relative to the processing surface 104 of the backup shoe 118.

[0031] The other inclined section 142 bends the polishing film 106, which has been worn down by polishing and passed through the backup shoe 118, towards the rear of the film guide 120, as shown in Figure 4(b). The polishing film 106, which has been bent backward by the inclined section 142, is guided backward by the guide surface 138 shown in Figure 4(a) and returned to the rear via the film guide roller 132. A side plate 148 (see Figure 4(b)) is attached to the guide surface 138 to prevent the polishing film 106 from shifting position.

[0032] In this way, the film guide 120 bends the polishing film 106, which has been fed from the rear of the film guide 120, twice by the pair of inclined sections 140 and 142, and returns it to the rear of the film guide 120. Furthermore, as shown in Figure 3, the pair of inclined sections 140 and 142 have a semicircular shape with a convex shape toward the tip side of the film guide 120, and are coated with a coating that provides wear resistance and high slipperiness. For example, a TiN coating can be used for such a coating. As a result, even if the film guide 120 in this embodiment is small and rollers cannot be attached to the pair of inclined sections 140 and 142, wear resistance and slipperiness can be obtained for the pair of inclined sections 140 and 142.

[0033] Figure 5 shows the polishing portion of the processing device 100 in Figure 1 being brought close to the machined surface 104 of the workpiece 102. Figure 6 shows the state of polishing the machined surface 104 of the workpiece 102 with the processing device 100 in Figure 1.

[0034] In the processing apparatus 100, as described above, the pair of inclined portions 140 and 142 of the film guide 120 are positioned on both sides of the backup shoe 118, and are further inclined and tapered towards each other as they approach the processing surface 104 of the workpiece 102. Therefore, even though the processing apparatus 100 uses a long, tape-shaped polishing film 106, as shown in Figure 5, the polishing portion, i.e., the polishing film 106 and the backup shoe 118, can be made to protrude from the processing apparatus 100 by a dimension La toward the processing surface 104 of the workpiece 102. Furthermore, this dimension La is larger than the dimension Lb shown in Figure 5, i.e., the depth of the flange 110 surrounding the processing surface 104 of the workpiece 102.

[0035] Therefore, in the processing device 100, the polishing film 106 and backup shoe 118 can be brought close to the processing surface 104 and the flange 110 as shown by arrow B in Figure 5, and further, as shown in Figure 6, the polishing film 106 and backup shoe 118 can be inserted into the processing surface 104 which is located in a recessed position on the workpiece 102.

[0036] In the processing device 100, the backup shoe 118 descends together with the support base 116, pressing the polishing film 106 against the processing surface 104, thereby enabling processing of the processing surface 104 located in a recessed position on the workpiece 102, and improving the surface roughness of the processing surface 104.

[0037] Furthermore, as shown in Figure 6, the pressing surface 146 is a concave surface that follows the outer circumference of the machined surface 104 of the workpiece 102. Therefore, when the abrasive film 106 is pressed against the machined surface 104 by the backup shoe 118, the concave pressing surface 146 and the machined surface 104 come into surface contact via the abrasive film 106. As a result, the roundness of the machined surface 104 can be improved by the machining apparatus 100.

[0038] Figure 7 shows a modified version of the film guide 120 in Figure 3. The modified film guide 120A has a pair of inclined portions 140A and 142A formed on the leading edge sides of a pair of guide surfaces 136 and 138. Rollers 150 and 152 are attached to this pair of inclined portions 140A and 142A.

[0039] Therefore, the pair of inclined sections 140A and 142A of the film guide 120A allow the polishing film 106 to be smoothly fed by the rollers 150 and 152.

[0040] Preferred embodiments of the present invention have been described above with reference to the attached drawings, but it goes without saying that the present invention is not limited to these examples. It will be obvious to those skilled in the art that various modifications or alterations can be conceived within the scope of the claims, and these will naturally also fall within the technical scope of the present invention. [Industrial applicability]

[0041] The present invention can be used as a film wrapping apparatus that polishes a processed surface using a tape-shaped abrasive film. [Explanation of Symbols]

[0042] 100…Film wrapping device, 102…Workpiece, 104…Processing surface, 106…Abrasive film, 108…Workpiece central axis, 110…Workpiece flange, 112…Base, 114…Cylinder, 116…Support base, 118…Backup shoe, 120…Film guide, 122…Rail, 124…Top plate, 126…Cylinder rod, 128…Supply reel, 130, 132…Film guide roller, 134…Take-up reel, 136, 138…Guide surface, 140, 142…Inclined section, 144, 148…Side plate, 146…Pressing surface of backup shoe, 150, 152…Roller

Claims

1. A film lapping apparatus that polishes the processed surface of a workpiece while rotating it with a tape-shaped polishing film, The workpiece has a central axis and a flange that extends radially from the central axis. The machined surface is the outer circumferential surface of the central axis surrounded by the flange, A backup shoe for pressing the abrasive film against the processed surface, A film guide for guiding the polishing film, A supply reel located behind the film guide, which supplies the polishing film, A take-up reel for winding the polishing film so that the polishing film is supplied from the supply reel and passes through the film guide and back to the backup shoe, A cylinder that presses the polishing film onto the processing surface via the film guide, Equipped with, The thickness of the film guide is smaller than the gap between the processed surface and the flange. The aforementioned film guide is It protrudes forward toward the machined surface of the workpiece, The backup shoe has a pair of inclined portions positioned on either side of the aforementioned backup shoe, which are inclined in a direction that brings them closer to each other as they approach the protruding tip, A film wrapping apparatus characterized in that, with the film guide and the backup shoe inserted between the flange and the processing surface, the take-up reel winds up the polishing film, causing the polishing film fed from behind the film guide to bend toward the backup shoe at one of the pair of inclined sections, bringing the polishing film facing the pressing surface of the backup shoe toward the processing surface, the cylinder presses the polishing film toward the processing surface to polish the processing surface, and the polishing film that has passed through the backup shoe is bent backward at the other inclined section.

2. The film wrapping apparatus according to claim 1, characterized in that the pressing surface of the backup shoe is a concave surface along the outer circumference of the processing surface.

3. The film wrapping apparatus according to claim 1 or 2, characterized in that the pair of inclined portions have a semicircular shape with a convex shape toward the tip side of the film guide and are coated with a coating that has wear resistance and high slipperiness.

4. The film wrapping apparatus according to claim 1 or 2, characterized in that rollers are attached to the pair of inclined sections.

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