Substrate processing equipment

Abstract

To provide a substrate processing apparatus capable of achieving high throughput.SOLUTION: A substrate processing apparatus 1 is structured so that an attitude conversion region R3 is provided between a transfer block 5 and a batch processing region R1, a sheet substrate transfer region R4 adjoins to the transfer block 5 and the posture conversion region R3, and a sheet processing region R5 adjoins to the sheet substrate transfer region R4. A center robot CR of the sheet substrate transfer region R4 transfers a second posture conversion mechanism 35 of the posture conversion region R3, sheet processing chambers SW1, SW2 of the sheet processing region R5 and a buffer section 27. The center robot CR are constituted of a hand 37A of capable of horizontal displacement retaining a substrate in a horizontal posture and a ramp 41 lifting the hand 37A and includes the ramp 41 with a fixed position in a horizontal direction XY.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus for processing a substrate. The substrate may be, for example, a semiconductor substrate, a substrate for a FPD (Flat Panel Display), a glass substrate for a photomask, a substrate for an optical disk, a substrate for a magnetic disk, a ceramic substrate, a substrate for a solar cell, and the like. Examples of the FPD include a liquid crystal display device, an organic EL (electroluminescence) display device, and the like.

Background Art

[0002] As a conventional substrate processing apparatus, there is a hybrid type substrate processing apparatus including a batch type processing module (batch processing unit) for processing a plurality of substrates collectively and a single wafer type processing module (single wafer processing unit) for processing the substrates processed by the batch type processing module one by one (see, for example, Patent Documents 1 and 2).

[0003] The substrate processing apparatus of Patent Document 1 includes a load port used for receiving a cassette, a first robot, two rotation mechanisms for rotating a wafer between a vertical posture and a horizontal posture, two tanks arranged in a row between the two rotation mechanisms, a second robot capable of transporting the wafer in the vertical posture between the two rotation mechanisms and the two tanks, a plurality of single wafer type cleaning modules for performing cleaning and drying, and a third robot.

[0004] The plurality of single wafer type cleaning modules are arranged in a row. The first robot takes out five wafers at a time from the cassette and transports the five wafers to the first rotation mechanism. The third robot takes out the wafer from the second rotation mechanism and transports the wafer to the single wafer type cleaning module. The first robot takes out one wafer from one of the plurality of single wafer type cleaning modules and returns the wafer to the cassette.

[0005] The substrate processing apparatus described in Patent Document 2 comprises an loading / unloading section having a cassette mounting table, a single-wafer processing section (area), an interface section, and a batch processing section (area). The substrate processing apparatus described in Patent Document 3 includes a posture change mechanism. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] Special Publication No. 2016-502275 [Patent Document 2] Japanese Patent Publication No. 2021-064652 [Patent Document 3] Japanese Patent Publication No. 2018-056341 [Overview of the project] [Problems that the invention aims to solve]

[0007] Conventional substrate processing devices have the following problems. For example, in the substrate processing device described in Patent Document 1, the first robot moves along multiple single-wafer cleaning modules, picks up five wafers at a time from a cassette, and transports these five wafers to the first rotating mechanism. The first robot also moves along multiple single-wafer cleaning modules, picks up one wafer from one of the modules, and returns that wafer to the cassette. As a result, the first robot is busy, which may reduce the throughput of the substrate processing device.

[0008] Furthermore, in the substrate processing apparatus described in Patent Document 2, the loading / unloading unit, single-wafer processing unit, interface unit, and batch processing unit are arranged in this order. Substrates removed from the cassette are sent from the loading / unloading unit to the interface unit while passing through the single-wafer processing unit. At the interface unit, a lot consisting of multiple vertically oriented substrates is formed for processing in the batch processing unit. In other words, the lot is not directly transported from the loading / unloading unit to the batch processing unit. This may reduce the throughput of the substrate processing apparatus.

[0009] This invention has been made in view of these circumstances, and aims to provide a substrate processing apparatus that can improve throughput. [Means for solving the problem]

[0010] To achieve this objective, the present invention has the following configuration.In other words, the substrate processing apparatus according to the present invention is a substrate processing apparatus that continuously performs batch processing for processing multiple substrates at once and single-wafer processing for processing substrates one by one, and comprises a carrier mounting shelf on which a carrier for storing multiple substrates in a horizontal position with predetermined intervals between them in the vertical direction is mounted, a transfer block adjacent to the carrier mounting shelf, a processing block adjacent to the transfer block, and a substrate mounting section on which substrates are mounted, wherein the transfer block includes a first posture conversion mechanism for converting the multiple substrates removed from the carrier from a horizontal position to a vertical position, and the The processing block comprises a carrier mounted on a carrier rack, a first attitude changing mechanism, and a substrate handling mechanism for transporting multiple substrates in a horizontal position simultaneously between the carrier, the first attitude changing mechanism, and the substrate mounting section, wherein the processing block includes a batch processing area extending away from the transfer block, a batch substrate transport area provided along the batch processing area with one end extending to the transfer block and the other end extending away from the transfer block, an attitude changing area provided between the transfer block and the batch processing area, and adjacent to the transfer block and the attitude changing area. The batch processing area comprises a single-wafer substrate transport area and a single-wafer processing area adjacent to the single-wafer substrate transport area, wherein the batch processing area has a plurality of batch processing tanks arranged in the direction extending from the batch processing area for processing a plurality of vertically oriented substrates at once, and the orientation conversion area is provided with a second orientation conversion mechanism for converting the batched plurality of substrates from a vertical orientation to a horizontal orientation, and the batch substrate transport area has a substrate transfer position determined within the transfer block, the plurality of batch processing tanks and the second orientation conversion mechanism for processing a plurality of vertically oriented substrates at once A batch substrate transport mechanism is provided for transporting substrates in a horizontal position, and the single-wafer processing area is provided with a plurality of single-wafer processing chambers for processing horizontal substrates one by one, and the single-wafer substrate transport area is provided with a horizontal substrate transport mechanism that can transport horizontal substrates one by one between the second position changing mechanism, the plurality of single-wafer processing chambers and the substrate mounting section, and the horizontal substrate transport mechanism is characterized by comprising a horizontally movable hand for holding horizontal substrates and a lifting platform for raising and lowering the hand, the lifting platform having a fixed horizontal position.

[0011] According to the substrate processing apparatus of the present invention, the attitude change area (including the second attitude change mechanism) is provided between the transfer block and the batch processing area. The single-wafer substrate transport area is adjacent to the transfer block and the attitude change area. Furthermore, the single-wafer processing area (including multiple single-wafer processing chambers) is adjacent to the single-wafer substrate transport area. In addition, the horizontal position of the lifting platform of the horizontal substrate transport mechanism provided in the single-wafer substrate transport area is fixed. Therefore, the transfer block, the second attitude change mechanism, and multiple single-wafer processing chambers can be arranged around the horizontal substrate transport mechanism. This allows for a shorter transport distance for the substrate by the horizontal substrate transport mechanism, for example, enabling efficient substrate transport. Furthermore, the batch substrate transport mechanism can transport multiple substrates simultaneously between the substrate transfer position in the transfer block, multiple batch processing chambers, and the second attitude change mechanism. As a result, throughput can be improved.

[0012] Furthermore, in the substrate processing apparatus described above, the second attitude conversion mechanism comprises a substrate waiting area and an attitude conversion execution area arranged along the direction in which the batch processing area extends, the substrate waiting area is provided with a substrate holding section for holding the plurality of substrates transported by the batch substrate transport mechanism in a vertical position, the attitude conversion execution area is provided with an attitude conversion section comprising two chucks for holding the plurality of substrates, a vertical rotation section for rotating the two chucks around a horizontal axis, and a horizontal movement section for moving the two chucks and the vertical rotation section between above the substrate holding section and a preset position in the attitude conversion execution area, and it is preferable that the attitude conversion section receives the plurality of substrates from the substrate holding section using the two chucks in the substrate waiting area and converts the orientation of the plurality of substrates from vertical to horizontal using the vertical rotation section in the attitude conversion execution area.

[0013] In the width direction perpendicular to the direction in which the batch processing area extends, the width of the attitude change area where the second attitude change mechanism is located becomes smaller. Therefore, the width of the substrate processing device can be kept small.

[0014] Furthermore, in the substrate processing apparatus described above, it is preferable that the horizontal substrate transport mechanism is suspended above the single-wafer substrate transport area. This prevents contamination of the horizontal substrate transport mechanism by droplets falling from a wet substrate. For example, it prevents the horizontal substrate transport mechanism from malfunctioning due to contamination.

[0015] Furthermore, in the substrate processing apparatus described above, it is preferable that the single-wafer processing area is provided on the opposite side of the transfer block via the single-wafer substrate transport area and adjacent to the attitude conversion area. In the width direction perpendicular to the direction in which the batch processing area extends, the width of the transfer block is relatively large. Since the single-wafer substrate transport area is arranged opposite to the transfer block, the width of the substrate processing apparatus can be kept small.

[0016] Furthermore, in the substrate processing apparatus described above, it is preferable that the processing block further comprises a second single-wafer processing area provided on the opposite side of the attitude conversion area via the single-wafer substrate transport area. Since the single-wafer processing area is larger, many single-wafer processing chambers can be arranged. Therefore, the throughput of single-wafer processing can be improved.

[0017] Furthermore, the substrate processing apparatus according to the present invention is a substrate processing apparatus that continuously performs batch processing for processing multiple substrates at once and single-wafer processing for processing substrates one by one, and comprises a carrier mounting shelf on which a carrier for storing multiple substrates in a horizontal position with predetermined intervals between them in the vertical direction is mounted, a transfer block adjacent to the carrier mounting shelf, and a processing block adjacent to the transfer block, wherein the transfer block includes a first posture conversion mechanism for converting the multiple substrates removed from the carrier from a horizontal position to a vertical position, and horizontal The processing block comprises a horizontal substrate transport mechanism for transporting substrates in a specific orientation, and the processing block comprises a batch processing area extending away from the transfer block, a batch substrate transport area provided along the batch processing area, with one end extending to the transfer block and the other end extending away from the transfer block, an orientation conversion area provided between the transfer block and the batch processing area, a single-wafer substrate transport area adjacent to the transfer block and the orientation conversion area, and a single-wafer processing area adjacent to the single-wafer substrate transport area. The batch processing area is provided with a plurality of batch processing tanks arranged in the direction in which the batch processing area extends, for processing the plurality of substrates in a vertical orientation all at once; the orientation conversion area is provided with a second orientation conversion mechanism for converting the batched plurality of substrates from a vertical orientation to a horizontal orientation; the batch substrate transport area is provided with a batch substrate transport mechanism for transporting the plurality of substrates in a vertical orientation all at once between a substrate transfer position determined within the transfer block, the plurality of batch processing tanks and the second orientation conversion mechanism; the single-wafer processing area is provided with a plurality of single-wafer processing chambers for processing horizontal substrates one at a time; the horizontal substrate transport mechanism is capable of transporting horizontal substrates between the carrier placed on the carrier rack, the first orientation conversion mechanism, the second orientation conversion mechanism and the plurality of single-wafer processing chambers; and the horizontal substrate transport mechanism is characterized by comprising a horizontally movable hand for holding horizontal substrates and a lifting platform for raising and lowering the hand, the lifting platform having a fixed horizontal position.

[0018] According to the substrate processing apparatus of the present invention, the posture conversion area (including the second posture conversion mechanism) is provided between the transfer block and the batch processing area. Further, the single substrate transfer area is adjacent to the transfer block and the posture conversion area. Furthermore, the single substrate processing area (including a plurality of single substrate processing chambers) is adjacent to the single substrate transfer area. Also, the horizontal position of the lift of the horizontal substrate transfer mechanism provided in the transfer block is fixed. Therefore, it is possible to arrange carriers placed on the carrier placement shelf, the first posture conversion mechanism, the second posture conversion mechanism, and a plurality of single substrate processing chambers around the horizontal substrate transfer mechanism. As a result, for example, the transfer distance of the substrate by the horizontal substrate transfer mechanism can be shortened, so that the substrate can be efficiently transferred. Also, the batch substrate transfer mechanism can transfer a plurality of substrates in a batch between the substrate delivery position in the transfer block, a plurality of batch processing tanks, and the second posture conversion mechanism. In particular, the substrate taken out from the single substrate processing chamber can be directly transferred to the carrier on the carrier placement shelf. As a result, the throughput can be improved.

Effect of the Invention

[0019] According to the substrate processing apparatus of the present invention, the throughput can be improved.

Brief Description of the Drawings

[0020] [Figure 1] It is a plan view showing a schematic configuration of a substrate processing apparatus according to Example 1. [Figure 2] It is a side view showing a substrate handling mechanism. [Figure 3] (a) to (f) are side views for explaining the first posture conversion mechanism (posture changing part and pusher mechanism) of the transfer block. [Figure 4] (a) is a plan view showing the second posture conversion mechanism, and (b) is a front view showing the second posture conversion mechanism. [Figure 5] It is a front view for explaining two chucks (horizontal holding part and vertical holding part) of the posture changing part. [Figure 6]It is a flowchart for explaining the operation of the substrate processing apparatus. [Figure 7] It is a flowchart for explaining the operation of the second posture conversion mechanism. [Figure 8] (a) to (c) are front views for explaining the first half operation of the second posture conversion mechanism. [Figure 9] (a) to (c) are plan views for explaining the first half operation of the second posture conversion mechanism. [Figure 10] (a) to (c) are front views for explaining the second half operation of the second posture conversion mechanism. [Figure 11] (a) to (c) are plan views for explaining the second half operation of the second posture conversion mechanism. [Figure 12] (a) is a plan view showing the second posture conversion mechanism according to Example 2, and (b) is a front view showing the second posture conversion mechanism according to Example 2. [Figure 13] It is a plan view showing the schematic configuration of the substrate processing apparatus according to Example 3. [Figure 14] It is a plan view showing the schematic configuration of the substrate processing apparatus according to the modification example. [Figure 15] It is a plan view showing the schematic configuration of the substrate processing apparatus according to the modification example. [Figure 16] It is a side view showing the center robot according to the modification example.

Example 1

[0021] Hereinafter, Example 1 of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the schematic configuration of the substrate processing apparatus 1 according to Example 1. FIG. 2 is a side view showing the substrate handling mechanism HTR.

[0022] <1. Overall configuration> Referring to FIG. 1. The substrate processing apparatus 1 includes a stocker block 3, a transfer block 5, and a processing block 7. The stocker block 3, the transfer block 5, and the processing block 7 are arranged in a row in the horizontal direction in this order.

[0023] The substrate processing apparatus 1 performs treatments on the substrate W, such as chemical treatment, cleaning, and drying. The substrate processing apparatus 1 performs batch processing and single-wafer processing on the substrate W in succession. That is, the substrate processing apparatus 1 performs batch processing and then single-wafer processing on the substrate W. Batch processing is a processing method in which multiple substrates W are processed at once. Single-wafer processing is a processing method in which substrates W are processed one by one.

[0024] In this specification, for convenience, the direction in which the stocker block 3, transfer block 5, and processing block 7 are aligned is called the "front-to-back direction X". The front-to-back direction X is horizontal. Of the front-to-back direction X, the direction from the transfer block 5 toward the stocker block 3 is called "forward". The direction opposite to forward is called "rear". The horizontal direction perpendicular to the front-to-back direction X is called the "width direction Y". One direction in the width direction Y is appropriately called "right". The direction opposite to right is called "left". The direction perpendicular to the horizontal is called the "vertical direction Z". For example, in Figure 1, front, rear, right, left, up, and down are shown as appropriate for reference.

[0025] <2. Storage Block> The stocker block 3 accommodates at least one carrier C. The stocker block 3 is provided with one or more (e.g., two) load ports 9. The stocker block 3 includes a carrier transport mechanism (robot) 11 and shelves 13.

[0026] The carrier transport mechanism 11 transports the carrier C between the load port 9 and the shelf 13. The carrier transport mechanism 11 is equipped with a gripping part that grips the projection on the upper surface of the carrier C, or a hand that supports the carrier C while in contact with the bottom surface of the carrier C. The shelf 13 is divided into shelf 13A for taking out and storing substrates W, and shelf 13B for storage.

[0027] The shelf 13A is positioned adjacent to the transfer block 5. The shelf 13A may be provided with a mechanism for attaching and detaching the lid of the carrier C. At least one shelf 13A is provided. The carrier C is placed on the shelf 13A. The carrier C stores multiple substrates W (e.g., 25) in a horizontal position with predetermined intervals (e.g., 10 mm intervals) between them in the vertical direction Z. The substrates W are aligned in the thickness direction of the substrates W. For example, a FOUP (Front Opening Unify Pod) can be used as the carrier C. A FOUP is a sealed container. The carrier C may be an open container, and is of any type. The shelf 13A corresponds to the carrier mounting shelf of the present invention.

[0028] <3. Transfer Block> The transfer block 5 is positioned adjacent to the rear X of the stocker block 3. The transfer block 5 includes a substrate handling mechanism (robot) HTR and a first attitude change mechanism 15. The substrate handling mechanism HTR corresponds to the substrate handling mechanism of the present invention.

[0029] The substrate handling mechanism HTR is located on the right Y side within the transfer block 5. The substrate handling mechanism HTR can transport multiple substrates (for example, 25) W in a horizontal orientation simultaneously between the carrier C placed on the shelf 13A, the first orientation changing mechanism 15, and the buffer section 27 (described later).

[0030] Refer to Figure 2. The substrate handling mechanism HTR comprises multiple (e.g., 25) hands 17. In Figure 2, for illustrative purposes, the substrate handling mechanism HTR is shown to have three hands 17. Each hand 17 holds one substrate W.

[0031] The circuit board handling mechanism HTR also includes a hand support section 19, a forward / backward section 20, and a lifting / rotating section 21. The hand support section 19 supports multiple hands 17, allowing the multiple hands 17 to move as a single unit. The forward / backward section 20 moves the multiple hands 17 forward and backward via the hand support section 19. The lifting / rotating section 21 rotates the forward / backward section 20 around the vertical axis AX1, thereby rotating the multiple hands 17 around the vertical axis AX1. The lifting / rotating section 21 also raises and lowers the multiple hands 17 by raising and lowering the forward / backward section 20. The lifting / rotating section 21 is fixed to the floor surface; that is, the lifting / rotating section 21 does not move horizontally. The forward / backward section 20 and the lifting / rotating section 21 are each equipped with electric motors. In addition, the substrate handling mechanism HTR may include a separate hand (not shown) for transporting a single substrate W, in addition to the hand 17 and the hand support 19.

[0032] Refer to Figure 1. The first attitude change mechanism 15 changes the orientation of multiple substrates W removed from the carrier C from a horizontal orientation to a vertical orientation. The first attitude change mechanism 15 comprises an attitude change unit 23 and a pusher mechanism 25. In Figure 1, the substrate handling mechanism HTR, the attitude change unit 23, and the pusher mechanism 25 are arranged in this order to the left Y. Figures 3(a) to 3(f) are side views illustrating the first attitude change mechanism 15 (attitude change unit 23 and pusher mechanism 25) of the transfer block 5.

[0033] As shown in Figures 1 and 3(a), the attitude change unit 23 comprises a support base 23A, a pair of horizontal holding units 23B, a pair of vertical holding units 23C, and a rotation drive unit 23D. The pair of horizontal holding units 23B and the pair of vertical holding units 23C are provided on the support base 23A. The horizontal holding units 23B and the vertical holding units 23C receive multiple substrates W transported by the substrate handling mechanism HTR. When the substrates W are in a horizontal position, the pair of horizontal holding units 23B support the substrates W from below while contacting the lower surface of each substrate W. When the substrates W are in a vertical position, the pair of vertical holding units 23C hold the substrates W.

[0034] The rotary drive unit 23D rotatably supports the support base 23A around the horizontal axis AX2. The rotary drive unit 23D also rotates the support base 23A around the horizontal axis AX2, thereby changing the orientation of the multiple substrates W held by the holding units 23B and 23C from horizontal to vertical.

[0035] As shown in Figures 1 and 3(f), the pusher mechanism 25 comprises a pusher 25A, a lifting and rotating section 25B, a horizontal moving section 25C, and a rail 25D. The pusher 25A supports the lower part of each of the multiple (e.g., 50) substrates W in a vertical position. For illustrative purposes, in Figures 3(a) to 3(f), the pusher 25A is configured to support six substrates W.

[0036] The lifting and rotating section 25B is connected to the underside of the pusher 25A. The lifting and rotating section 25B moves the pusher 25A up and down by extending and retracting. The lifting and rotating section 25B also rotates the pusher 25A around the vertical axis AX3. The horizontal movement section 25C supports the lifting and rotating section 25B. The horizontal movement section 25C moves the pusher 25A and the lifting and rotating section 25B horizontally along the rail 25D. The rail 25D is formed to extend in the width direction Y. The rotation drive section 23D, the lifting and rotating section 25B, and the horizontal movement section 25C are each equipped with electric motors.

[0037] The operation of the first attitude changing mechanism 15 will now be explained. The batch processing tanks BT1 to BT6 of the processing block 7, described later, process, for example, 50 substrates W from two carriers C at once. The first attitude changing mechanism 15 changes the attitude of the 50 substrates W in batches of 25. The first attitude changing mechanism 15 also arranges multiple substrates W in a face-to-face manner at predetermined intervals (half-pitch). The half-pitch is, for example, 5 mm. The pusher mechanism 25 transports these 50 substrates W to the transport mechanism WTR.

[0038] The 25 substrates W within the first carrier C will be described as substrates W1 of the first substrate group. The 25 substrates W in the second carrier C will be described as substrates W2 of the second substrate group. Furthermore, in Figures 3(a) to 3(f), for illustrative purposes, it will be explained that there are 3 substrates W1 in the first substrate group and 3 substrates W2 in the second substrate group. Also, when substrates W1 and W2 are not specifically distinguished, they will be referred to as "substrate W".

[0039] Refer to Figure 3(a). The attitude change unit 23 receives the 25 substrates W1 of the first substrate group, which have been transported by the substrate handling mechanism HTR, with the holding units 23B and 23C. At this time, the 25 substrates W1 are in a horizontal orientation, with the device surface facing upward. The 25 substrates W1 are arranged at predetermined intervals (full pitch). The full pitch is, for example, 10 mm intervals. The full pitch is also called the normal pitch.

[0040] Half-pitch refers to a spacing that is half the distance of full-pitch. The device side of substrate W (W1, W2) is the side on which electronic circuits are formed and is called the "front surface." The back surface of substrate W is the side on which electronic circuits are not formed. The back surface is the side opposite the device side.

[0041] Refer to Figure 3(b). The attitude conversion unit 23 rotates the holding units 23B and 23C by 90 degrees around the horizontal axis AX2, converting the orientation of the 25 substrates W1 from horizontal to vertical. Refer to Figure 3(c). The pusher mechanism 25 raises the pusher 25A to a position higher than the holding units 23B and 23C of the attitude conversion unit 23. As a result, the pusher 25A receives the 25 substrates W from the holding units 23B and 23C. The 25 substrates W1 held by the pusher 25A face left Y. In Figures 3(a) to 3(f), the arrow AR attached to the substrate W indicates the orientation of the device surface of the substrate W.

[0042] Refer to Figure 3(d). The pusher mechanism 25 rotates the 25 vertically oriented substrates W 180 degrees around the vertical axis AX3. As a result, the 25 substrates W1 are inverted and facing to the right Y. Furthermore, the inverted 25 substrates W1 move half a pitch (e.g., 5 mm) to the left Y from their positions before rotation. The holding parts 23B and 23C of the attitude conversion unit 23 are also rotated -90 degrees around the horizontal axis AX2 to prepare for receiving the next substrate W2. Subsequently, the attitude conversion unit 23 receives the 25 substrates W2 of the second group of substrates transported by the substrate handling mechanism HTR with the holding parts 23B and 23C. At this time, the 25 substrates W2 are in a horizontal position with the device surface facing upward. The attitude conversion unit 23 and the pusher mechanism 25 are operated in such a way that they do not interfere with each other.

[0043] Refer to Figure 3(e). The pusher mechanism 25 lowers the pusher 25A, which holds the 25 substrates W1 of the first substrate group, to the retracted position. Then, the attitude change unit 23 changes the attitude of the 25 substrates W2 from horizontal to vertical. After the attitude change, the 25 substrates W2 are facing left Y. Refer to Figure 3(f). Then, the pusher mechanism 25 raises the pusher 25A, which holds the 25 substrates W2 of the second substrate group. As a result, the pusher mechanism 25 receives another 25 substrates W2 from the attitude change unit 23.

[0044] As a result, the pusher 25A holds 50 substrates W (W1, W2) from the first substrate group and the second substrate group. The 50 substrates W are arranged alternately in groups of 25 W1 and 25 W2. The 50 substrates W are arranged at half-pitch intervals (e.g., 5 mm apart). Furthermore, the 25 W1 substrates face in the opposite direction to the 25 W2 substrates. Therefore, the 50 substrates W are arranged in a face-to-face manner. That is, two adjacent substrates W1 and W2 have their two device faces (or two back faces) facing each other.

[0045] Subsequently, the pusher mechanism 25 moves the pusher 25A, which holds the 50 substrates W, along the rail 25D to the substrate transfer position PP below the pair of chucks 29, 30 of the transport mechanism WTR.

[0046] <4. Processing Block 7> The processing block 7 is adjacent to the transfer block 5. The processing block 7 is located behind X of the transfer block 5. The processing block 7 comprises a batch processing area R1, a batch substrate transport area R2, a posture change area R3, a single-wafer substrate transport area R4, and a single-wafer processing area R5. The substrate processing apparatus 1 also includes a buffer section 27 on which the substrate W is placed. The buffer section 27 corresponds to the substrate placement section of the present invention.

[0047] <4-1. Batch processing area R1> The batch processing area R1 is adjacent to the batch substrate transport area R2, the attitude change area R3, and the single-wafer processing area R5. Furthermore, the batch processing area R1 extends in the direction away from the transfer block 5 (rear X).

[0048] The batch processing area R1 is provided with, for example, six batch processing tanks BT1 to BT6. The six batch processing tanks BT1 to BT6 are arranged in a single line in the front-to-back direction X along which the batch processing area R1 extends. Note that the number of batch processing tanks is not limited to six; any number is acceptable.

[0049] Each of the six batch processing tanks BT1 to BT6 immerses multiple substrates W in a vertical position all at once. For example, the six batch processing tanks BT1 to BT6 consist of four chemical treatment tanks BT1 to BT4 and two water rinsing tanks BT5 and BT6. Specifically, two chemical treatment tanks BT1 and BT2 and water rinsing tank BT5 form one set. Another set consists of two chemical treatment tanks BT3 and BT4 and water rinsing tank BT6.

[0050] Each of the four chemical treatment tanks BT1 to BT4 performs etching treatment using a chemical solution. For example, phosphoric acid is used as the chemical solution. Chemical treatment tank BT1 stores the chemical solution supplied from a chemical solution discharge pipe (not shown). The chemical solution discharge pipe is provided on the inner wall of chemical treatment tank BT1. The three chemical treatment tanks BT2 to BT4 are each configured similarly to chemical treatment tank BT1.

[0051] The two rinsing tanks BT5 and BT6 each perform a pure water cleaning process to wash away the chemical solution adhering to multiple substrates W with pure water. Deionized water (DIW) is used as the pure water. The two rinsing tanks BT5 and BT6 each store the pure water supplied from a cleaning solution discharge pipe (not shown). The cleaning solution discharge pipe is provided on the inner wall of each rinsing tank BT5 and BT6.

[0052] Each of the six batch processing tanks BT1 to BT6 is equipped with six lifters LF1 to LF6. For example, lifter LF1 holds multiple substrates W in a vertical position, arranged at predetermined intervals (half-pitch). Lifter LF1 also raises and lowers the multiple substrates W between the processing position inside batch processing tank (chemical processing tank) BT1 and the transfer position above batch processing tank BT1. The other five lifters LF2 to LF6 are configured similarly to lifter LF1.

[0053] <4-2. Batch substrate transport area R2> The batch substrate transport area R2 is adjacent to the transfer block 5, the batch processing area R1, and the attitude change area R3. The batch substrate transport area R2 is provided along the batch processing area R1. One end of the batch substrate transport area R2 extends to the transfer block 5, and the other end extends away from the transfer block 5 (rear X). The batch substrate transport area R2 extends parallel to the batch processing area R1.

[0054] The batch substrate transport area R2 has a transport mechanism (robot) WTR. That is, the batch substrate transport area R2 is provided with a transport mechanism WTR. The transport mechanism WTR transports multiple substrates (e.g., 50) in a vertical orientation at once between the substrate transfer position PP defined in the transfer block 5, for example, six batch processing tanks BT1 to BT6, and the second orientation change mechanism 35 (lifter LF9). When the transport mechanism WTR passes the second orientation change mechanism 35, the transport mechanism WTR moves above the horizontal movement section 95 of the orientation change section 63, which will be described later.

[0055] The transport mechanism WTR comprises a pair of chucks 29, 30 and a guide rail 33. Each of the chucks 29, 30 has 50 holding grooves to hold, for example, 50 substrates W. The two chucks 29, 30 each extend parallel to the Y direction (Figure 1) in a plan view. The transport mechanism WTR opens and closes the two chucks 29, 30. The transport mechanism WTR moves the pair of chucks 29, 30 along the guide rail 33. The transport mechanism WTR is driven by an electric motor.

[0056] <4-3. Posture Change Region R3> The attitude change area R3 is located between the transfer block 5 and the batch processing area R1. Furthermore, the attitude change area R3 is positioned between the batch substrate transport area R2, the single-wafer substrate transport area R4, and the single-wafer processing area R5. Therefore, the attitude change area R3 is adjacent to the transfer block 5, the batch processing area R1, the batch substrate transport area R2, the single-wafer substrate transport area R4, and the single-wafer processing area R5.

[0057] A second attitude conversion mechanism 35 is provided in the attitude conversion region R3. The second attitude conversion mechanism 35 converts multiple batch-processed substrates W from a vertical orientation to a horizontal orientation. Details of the second attitude conversion mechanism 35 will be described later.

[0058] <4-4. Single-wafer substrate transport area R4> The single-wafer substrate transport area R4 is adjacent to the transfer block 5, the attitude change area R3, and the single-wafer processing area R5. Furthermore, the single-wafer substrate transport area R4 is located on the opposite side of the batch substrate transport area R2, via the attitude change area R3.

[0059] A center robot CR is provided in the single-wafer substrate transport area R4. The center robot CR can transport horizontally positioned substrates W one at a time between the second posture change mechanism 35, the single-wafer processing chambers SW1 and SW2 (described later), and the buffer section 27. In addition, a transfer block 5, the second posture change mechanism 35, and the single-wafer processing chambers SW1 and SW2 can be arranged around the center robot CR. This shortens the transport distance of the substrates W by the center robot CR, allowing for efficient transport of the substrates W.

[0060] The central robot CR comprises two hands 37A and 37B, two articulated arms 39A and 39B, and a lifting platform 41. Each of the two hands 37A and 37B holds a single substrate W in a horizontal position. Each of the two hands 37A and 37B is capable of horizontal movement. Each of the two articulated arms 39A and 39B is configured, for example, as a SCARA type. The tip of the articulated arm 39A supports hand 37A, and the tip of the articulated arm 39B supports hand 37B. Articulated arm 39A moves hand 37A horizontally (in the front-to-back direction X and width direction Y), and articulated arm 39B moves hand 37B horizontally.

[0061] The lifting platform 41 supports the base ends of the two articulated arms 39A and 39B. The lifting platform 41 is configured to extend and retract in the vertical direction. Therefore, the lifting platform 41 raises and lowers the two hands 37A and 37B and the two articulated arms 39A and 39B. The horizontal position of the lifting platform 41 is fixed and does not move. This makes it possible to shorten the transport distance of the substrate W by eliminating the need for the lifting platform 41 to move horizontally. It also eliminates the need to move the lifting platform 41.

[0062] The buffer unit 27 is positioned across the transfer block 5 and the single-wafer substrate transport area R4. That is, it is provided at the boundary between the transfer block 5 and the single-wafer substrate transport area R4. Alternatively, the buffer unit 27 may be provided only in the transfer block 5 or only in the single-wafer substrate transport area R4. Therefore, the buffer unit 27 only needs to be fixedly provided at the boundary between the transfer block 5 and the single-wafer substrate transport area R4, on the transfer block 5, or on the single-wafer substrate transport area R4. The center robot CR was equipped with two sets of hands 37A, 37B and articulated arms 39A, 39B, but the center robot CR may be equipped with one or more sets of hands and articulated arms.

[0063] The buffer unit 27 is equipped with multiple mounting shelves. Each of the multiple mounting shelves is in a horizontal position. Each of the multiple mounting shelves can hold one substrate W. The buffer unit 27 places the multiple substrates W in a horizontal position at predetermined intervals (full pitch) in the vertical direction Z. That is, the multiple mounting shelves are arranged at predetermined intervals (full pitch) and in the vertical direction Z. The buffer unit 27 is configured to hold at least 25 substrates W that can be transported by the substrate handling mechanism HTR. The buffer unit 27 is configured to hold, for example, 50 substrates W. If necessary, the number of mounting shelves in the buffer unit 27 may be between 2 and 24.

[0064] <4-5. Single-wafer processing area R5> The single-wafer processing area R5 is adjacent to the batch processing area R1, the attitude change area R3, and the single-wafer substrate transport area R4. The single-wafer processing area R5 is located on the opposite side of the transfer block 5 via the single-wafer substrate transport area R4.

[0065] Multiple (e.g., two) single-wafer processing chambers SW1 and SW2 are provided in the single-wafer processing area R5. The two single-wafer processing chambers SW1 and SW2 are arranged along the width direction Y, which is perpendicular to the front-to-back direction X in which the batch processing area R1 extends. Each single-wafer processing chamber SW1 and SW2 processes one horizontal substrate W at a time. The first single-wafer processing chamber SW1 is located to the right X of the orientation change area R3. The second single-wafer processing chamber SW2 is located to the right X of the first single-wafer processing chamber SW1.

[0066] Furthermore, the single-wafer processing chambers SW1 and SW2 may be configured in multiple stages. For example, six single-wafer processing chambers SW1 and SW2 may be arranged in a configuration of two in the width direction Y (horizontal direction) and three in the vertical direction Z. Note that the number of single-wafer processing chambers is not limited to two or six.

[0067] For example, the first single-wafer processing chamber SW1 includes a rotation processing unit 45 and a nozzle 47. The rotation processing unit 45 includes a spin chuck that holds a single substrate W in a horizontal position and an electric motor that rotates the spin chuck around a vertical axis passing through the center of the substrate W. The spin chuck may hold the bottom surface of the substrate W by vacuum suction. The spin chuck may also have three or more chuck pins that grip the outer edge of the substrate W.

[0068] The nozzle 47 supplies processing liquid to the substrate W held by the rotating processing unit 45. The nozzle 47 moves between a standby position away from the rotating processing unit 45 and a supply position above the rotating processing unit 45. For example, pure water (DIW) and IPA (isopropyl alcohol) are used as processing liquids. The single-wafer processing chamber SW1 may, for example, wash the substrate W with pure water and then form a liquid film of IPA on the upper surface of the substrate W.

[0069] The single-wafer processing chamber SW2 performs drying treatment using a supercritical fluid, for example, carbon dioxide is used as the fluid. The single-wafer processing chamber SW2 comprises a chamber body (container) 48, a support tray, and a lid. The chamber body 48 has a processing space provided inside, an opening for placing the substrate W into this processing space, a supply port, and an exhaust port. The substrate W is housed in the processing space while being supported by the support tray. The lid closes the opening of the chamber body 48. For example, in each single-wafer processing chamber SW2, the fluid is made supercritical and supplied to the processing space inside the chamber body 48 from the supply port. At this time, the processing space inside the chamber body 48 is exhausted from the exhaust port. The substrate W is dried by the supercritical fluid supplied to the processing space.

[0070] A supercritical state is achieved by bringing a fluid to its specific critical temperature and pressure. Specifically, when the fluid is carbon dioxide, the critical temperature is 31°C and the critical pressure is 7.38 MPa. By drying the substrate W with a supercritical fluid, it is possible to suppress the collapse of the pattern formed on the substrate W.

[0071] <5. Control Unit> The substrate processing apparatus 1 comprises a control unit 59 and a storage unit (not shown). The control unit 59 controls each component of the substrate processing apparatus 1. The control unit 59 comprises one or more processors, such as a central processing unit (CPU). The storage unit comprises at least one of ROM (Read-Only Memory), RAM (Random-Access Memory), and a hard disk. The storage unit stores the computer programs necessary to control each component of the substrate processing apparatus 1.

[0072] <6. Second attitude change mechanism> Figure 4(a) is a plan view of the second attitude changing mechanism 35. Figure 4(b) is a front view of the second attitude changing mechanism 35. Figure 5 is a front view illustrating the two chucks (horizontal holding part and vertical holding part) of the attitude changing section.

[0073] The second attitude change mechanism 35 includes a substrate standby area R31 and an attitude change execution area R32. The substrate standby area R31 and the attitude change execution area R32 are arranged along the front-rear direction X to which the batch processing area R1 or the six batch processing tanks BT1 to BT6 extend.

[0074] The second attitude changing mechanism 35 comprises a lifter LF9 and an attitude changing unit 63. The lifter LF9 is provided in the substrate standby area R31. In contrast, the attitude changing execution area R32 is provided in the attitude changing unit 63. Next, the details of the lifter LF9 and the attitude changing unit 63 will be described.

[0075] <6-1. Lifter LF9> The lifter LF9 holds multiple substrates (for example, 50) W transported by the transport mechanism WTR in a vertical position. The lifter LF9 comprises a substrate holding section 65 and a lifting section 67 that raises and lowers the substrate holding section 65 in the vertical direction Z. The substrate holding section 65 corresponds to the substrate holding section of the present invention.

[0076] The substrate holding section 65 holds, for example, 50 substrates W arranged at predetermined intervals (e.g., half-pitch) from below. The substrate holding section 65 comprises, for example, three holding members 68, each extending in the Y direction. Each of the three holding members 68 has the same number of holding grooves 68A as the number of substrates W (50 grooves) to hold the 50 substrates W. The back of each holding groove 68A is formed in a V shape. The lifting section 67 raises and lowers the substrate holding section 65. The lifting section 67 comprises, for example, an electric motor or an air cylinder.

[0077] The lifter LF9 (substrate holding section 65) and the six batch processing tanks BT1 to BT6 are arranged linearly in the front-to-back direction X so that the transport mechanism WTR can transport 50 substrates W in a straight line.

[0078] <6-2. Posture Change Section> The attitude changing unit 63 receives multiple substrates W from the substrate holding unit 65 and changes the orientation of the multiple substrates W from vertical to horizontal. The attitude changing unit 63 includes two chucks 71, 72, two arms 75, 76, and an arm support unit 78.

[0079] The attitude change unit 63 receives multiple (for example, 25) substrates W from the substrate holding unit 65 using two chucks 71 and 72 in the substrate waiting area R31, and changes the orientation of the multiple substrates W from vertical to horizontal using the vertical rotation unit 94 in the attitude change execution area R32. This will be explained in detail.

[0080] The two chucks 71 and 72 hold multiple substrates W (for example, 25). The first chuck 71 includes a first horizontal holding section 79 and a first vertical holding section 80. The second chuck 72 includes a second horizontal holding section 81 and a second vertical holding section 82. The two horizontal holding sections 79 and 81 and the two vertical holding sections 80 and 82 are each formed to extend in the direction in which the multiple substrates W are aligned.

[0081] The two horizontal holding sections 79 and 81 accommodate two radially opposing sides of each substrate W included in a plurality of substrates W. The two horizontal holding sections 79 and 81 support the plurality of substrates W at predetermined intervals (e.g., half-pitch) when the plurality of substrates W are in a horizontal position. The two vertical holding sections 80 and 82 accommodate two sides of each substrate W included in a plurality of substrates W. The two vertical holding sections 80 and 82 are provided below the horizontal holding sections when the plurality of substrates W are in a vertical position. The two vertical holding sections 80 and 82 also support the plurality of substrates W in a vertical position when the plurality of substrates W are in a vertical position. When the plurality of substrates W held by the two vertical holding sections 80 and 82 are in a vertical position, the two horizontal holding sections 79 and 81 are positioned horizontally in the XY direction, sandwiching the plurality of substrates W. Similarly, when the substrate W is in a vertical position, the two vertical holding parts 80 and 82 are positioned in the horizontal XY direction, sandwiching multiple substrates W.

[0082] Refer to Figure 5. The two horizontal holding sections 79 and 81 are equipped with multiple pairs (e.g., 50 pairs) of horizontal guide grooves 85 and 86. The 50 first horizontal guide grooves 85 are provided on the horizontal holding section 79. The 50 second horizontal guide grooves 86 are provided on the horizontal holding section 81. For example, two sets of horizontal guide grooves 85A and 86A are arranged opposite each other. When multiple substrates W are in a vertical position, each of the multiple pairs of horizontal guide grooves 85 and 86 has the same function as the through grooves 91 and 92 described later.

[0083] Furthermore, the two horizontal holding sections 79, 81 may be equipped with, for example, 25 pairs of horizontal guide grooves 85, 86. The number of pairs of horizontal guide grooves 85, 86 is not limited to 50 pairs or 25 pairs. The number of pairs of holding grooves 89, 90 and through grooves 91, 92, which will be described later, is also not limited to 25 pairs.

[0084] The two vertical holding sections 80 and 82 are each equipped with multiple pairs (e.g., 25 pairs) of holding grooves 89 and 90 and multiple pairs (25 pairs) of through grooves 91 and 92. Each pair of holding grooves 89 and 90 holds one substrate W. Each pair of through grooves 91 and 92 allows one substrate W to pass through. The multiple pairs of holding grooves 89 and 90 and the multiple pairs of through grooves 91 and 92 are arranged alternately in pairs. Note that the two holding grooves 89A and 90A are arranged opposite each other.

[0085] 25 retaining grooves 89 and 25 through grooves 91 are provided in the first vertical holding section 80. The 25 retaining grooves 89 and 25 through grooves 91 are arranged alternately, one at a time. 25 retaining grooves 90 and 25 through grooves 92 are provided in the second vertical holding section 82. The 25 retaining grooves 90 and 25 through grooves 92 are arranged alternately, one at a time. The back of each retaining groove 89, 90 is formed in a V-shape in cross-section. Therefore, each retaining groove 89, 90 can hold one substrate W in a vertical position. As a result, it will not tip over onto an adjacent substrate W.

[0086] As shown in Figure 4(b), the first arm 75 supports the first horizontal support section 79 and the first vertical support section 80. The second arm 76 supports the second horizontal support section 81 and the second vertical support section 82. The arm support section 78 supports the upper end (base end) of each of the two arms 75 and 76. The arm support section 78 and the two arms 75 and 76 are formed in a C-shape or a U-shape.

[0087] The arm support section 78 is positioned on the opposite side of the two vertical support sections 80 and 82 via two horizontal support sections 79 and 81. Therefore, the arm support section 78 and the like support the two horizontal support sections 79 and 81 and the two vertical support sections 80 and 82 from the opposite side of the two vertical support sections 80 and 82 via the two horizontal support sections 79 and 81.

[0088] Furthermore, as shown by the solid and dashed lines in Figure 5, the two horizontal holding parts 79 and 81 are configured to open and close horizontally. That is, the attitude changing unit 63 includes an opening / closing unit 87 (see Figure 4). The opening / closing unit 87 includes, for example, an electric motor or an air cylinder. The opening / closing unit 87 linearly moves the two vertical holding parts 80 and 82 between a holding position PP2 in which the distance between the two vertical holding parts 80 and 82 is narrowed in order to hold the substrate W with the two vertical holding parts 80 and 82, and a passing position PP3 in which the distance between the two vertical holding parts 80 and 82 is widened in order to allow each substrate W to pass between the two vertical holding parts 80 and 82.

[0089] When the two vertical holding sections 80 and 82 are in the holding position PP2, they are in a closed state. For example, when multiple substrates W are in a vertical position, the distance between the two vertical holding sections 80 and 82 is narrowed. The two vertical holding sections 80 and 82 are moved to the holding position PP2 by the opening / closing section 87, thereby holding the multiple vertical substrates W held by the substrate holding section 65, while the two horizontal holding sections 79 and 81 accommodate the multiple substrates W held by the two vertical holding sections 80 and 82. Also, when the two vertical holding sections 80 and 82 are in the passing position PP3, they are in an open state. For example, when the vertical rotation section 94 (described later) rotates the substrate W from a vertical to a horizontal position, the opening / closing section 87 moves the two vertical holding sections 80 and 82 to the passing position PP3. That is, when multiple substrates W are in a horizontal position, the distance between the two vertical holding sections 80 and 82 is widened.

[0090] The attitude changing unit 63 also includes a lateral rotation unit 93, a vertical rotation unit 94, a horizontal movement unit 95, a rotating shaft 97, and a vertical arm 98. The lateral rotation unit 93 rotatably supports the arm support unit 78. When the two vertical holding units 80 and 82 hold the substrate W in a vertical position, the lateral rotation unit 93 rotates the two chucks 71 and 72 and the arm support unit 78, etc., around a rotation axis (vertical axis) AX4 that is perpendicular to the direction in which the substrate W is aligned. The lateral rotation unit 93 and the vertical rotation unit 94 are each equipped with, for example, an electric motor.

[0091] The tip of the rotating shaft 97 is connected to the horizontal rotating section 93. The base end of the rotating shaft 97 is rotatably connected to the vertical rotating section 94. The rotating shaft 97 extends horizontally (in the front-rear direction X). Therefore, the central axis of the rotating shaft 97 is the horizontal axis AX5. The horizontal axis (central axis) AX5 is positioned higher than the vertically oriented substrate W held by the two vertical holding sections 80 and 82. The vertical rotating section 94 rotates the two chucks 71 and 72 and the arm support section 78, etc., around the horizontal axis AX5 in order to rotate the orientation of the substrate W from vertical to horizontal. The vertical rotating section 94 is supported at the lower end of the vertical arm 98.

[0092] The horizontal movement unit 95 moves the two chucks 71 and 72, the arm support unit 78, the opening / closing unit 87, the horizontal rotation unit 93, and the vertical rotation unit 94 in the horizontal direction. The horizontal movement unit 95 also moves the arm support unit 78 and the vertical rotation unit 94 in the horizontal direction across the substrate standby area R31 where the substrate holding unit 65 is located, and the attitude conversion execution area R32 for converting multiple substrates W from a vertical to a horizontal position.

[0093] The horizontal moving section 95 is positioned higher than each vertical substrate W held by the two vertical holding sections 80 and 82. This suspends the two chucks 71 and 72. This prevents droplets adhering to the substrate W from falling and contaminating the moving and rotating sections. This prevents the moving and rotating sections from malfunctioning due to droplet contamination.

[0094] The horizontal movement section 95 comprises an X-direction movement section 101 and a Y-direction movement section 102. The X-direction movement section 101 moves the two chucks 71, 72 and the arm support section 78, etc., along the front-rear direction X. The Y-direction movement section 102 moves the two chucks 71, 72 and the arm support section 78, etc., along the width direction Y. Each of the two movement sections 101 and 102 is equipped with a linear actuator having an electric motor. In Figure 4(a), the upper end of the vertical arm 98 is movably connected to the Y-direction movement section 102. The Y-direction movement section 102 moves the vertical arm 98 along the width direction Y.

[0095] <6. Operation Description> Next, the operation of the substrate processing apparatus 1 will be explained with reference to the flowcharts in Figures 6 and 7. Refer to Figure 1. An external transport robot (not shown) transports the two carriers C to the load port 9 in sequence.

[0096] [Step S01] Transfer of substrate from carrier The carrier transport mechanism 11 of the stocker block 3 transports the first carrier C from the load port 9 to the shelf 13A. The substrate handling mechanism HTR of the transfer block 5 takes out 25 horizontally oriented substrates W1 from the first carrier C placed on shelf 13A and transports them to the orientation change unit 23. After that, the carrier transport mechanism 11 transports the empty first carrier C to shelf 13B. After that, the carrier transport mechanism 11 transports the second carrier C from the load port 9 to shelf 13A. The substrate handling mechanism HTR takes out 25 horizontally oriented substrates W2 from the second carrier C placed on shelf 13A and transports them to the orientation change unit 23.

[0097] [Step S02] Change of posture to a vertical position The attitude conversion unit 23 receives 50 substrates W (W1, W2) on two carriers C. As shown in Figures 3(a) to 3(f), the attitude conversion unit 23 and the pusher mechanism 25 align the 50 substrates W in a face-to-face manner and at half-pitch (5 mm), and also convert the orientation of the 50 substrates W from horizontal to vertical. The pusher mechanism 25 transports the 50 vertically oriented substrates W to the substrate transfer position PP determined within the transfer block 5.

[0098] [Step S03] Chemical treatment (batch processing) The transport mechanism WTR receives 50 vertically oriented substrates W from the pusher mechanism 25 at the substrate transfer position PP and transports the 50 substrates W to one of the four lifters LF1 to LF4 of the four chemical treatment tanks BT1 to BT4. When the transport mechanism WTR passes through the attitude change region R3, it passes above the second attitude change mechanism 35, for example, to avoid interference with the second attitude change mechanism 35.

[0099] For example, the transport mechanism WTR transports 50 substrates W to the lifter LF1 of the chemical treatment tank BT1. The lifter LF1 receives the 50 substrates W at a position above the chemical treatment tank BT1. The lifter LF1 immerses the 50 substrates W in the phosphoric acid used as the treatment solution in the chemical treatment tank BT1. This performs an etching process on the 50 substrates W. After the etching process, the lifter LF1 lifts the 50 substrates W out of the phosphoric acid in the chemical treatment tank BT1. The same process as in the chemical treatment tank BT1 is performed when the 50 substrates W are transported to the lifters LF2 to LF4 of the other chemical treatment tanks BT2 to BT4.

[0100] [Step S04] Pure water washing treatment (batch treatment) The transport mechanism WTR receives 50 substrates W in a vertical position from, for example, lifter LF1 (or lifter LF2), and transports the 50 substrates W to lifter LF5 in the water washing tank BT5. Lifter LF5 receives the 50 substrates W at a position above the water washing tank BT5. Lifter LF5 immerses the 50 substrates W in the pure water in the water washing tank BT5. In this way, the 50 substrates W undergo a washing process.

[0101] When the transport mechanism WTR receives 50 substrates W in a vertical position from either lifter LF3 or LF4, the transport mechanism WTR transports the 50 substrates W to lifter LF6 in the water washing tank BT6. Lifter LF6 receives the 50 substrates W at a position above the water washing tank BT6. Lifter LF6 immerses the 50 substrates W in the pure water in the water washing tank BT6.

[0102] [Step S05] Change of posture to horizontal position The second orientation changing mechanism 35 changes the orientation of the substrate W that has undergone cleaning from vertical to horizontal. However, the following problem arises: If the orientation of 50 substrates W arranged at half-pitch intervals (5 mm spacing) is changed all at once, the hands 37A and 37B of the center robot CR may not be able to properly enter the gap between two adjacent substrates W among the 50 substrates W.

[0103] Furthermore, when substrates W are aligned using a face-to-face method, some substrates W, after being converted to a horizontal orientation, may have their device surfaces facing upwards, while others may have their device surfaces facing downwards. For example, it is undesirable for the hands 37A and 37B of the center robot CR to come into contact with the device surfaces of the substrates W. It is also undesirable for substrates W with different device surface orientations to be transported to the respective single-wafer processing chambers SW1 and SW2.

[0104] Therefore, in this embodiment, the distance between two adjacent substrates W is increased, and the orientation of the device surfaces of the 50 substrates W is aligned with each other. This will be explained in detail with reference to the flowchart in Figure 7, Figure 1, and Figures 8(a) to 11(c).

[0105] Figures 8(a) to 8(c) and 10(a) to 10(c) are front views of the second attitude changing mechanism 35. Figures 9(a) to 9(c) and 11(a) to 11(c) are top views of the second attitude changing mechanism 35. For example, Figure 9(a) corresponds to Figure 8(a), and Figure 11(b) corresponds to Figure 10(b).

[0106] [Step S11] Transfer of the substrate to the lifter LF9 Refer to Figure 1. The transport mechanism WTR transports 50 substrates W from one of the lifters LF5 or LF6 to the substrate holding section 65 of the lifter LF9 of the second attitude changing mechanism 35. The substrate holding section 65 of the lifter LF9 holds the 50 substrates W in a vertical orientation, arranged in a half-pitch and face-to-face manner. The 50 substrates W are also aligned along the width direction Y.

[0107] [Step S12] Movement of the attitude conversion unit to the substrate standby area Refer to Figures 8(a) and 9(a). When 50 substrates W in a vertical position are held by the substrate holding section 65, the horizontal movement section 95 (mainly the X-direction movement section 101) of the attitude change section 63 moves the two chucks 71, 72 and the arm support section 78, etc., from the attitude change execution area R32 to above the substrate holding section 65 in the substrate standby area R31. The Y-direction movement section 102 of the horizontal movement section 95 moves the two chucks 71, 72 and the arm support section 78, etc., to the first substrate holding position. The first substrate holding position is the position where the 25 pairs of holding grooves 89, 90 can hold the 25 substrates W1 of the first substrate group.

[0108] Furthermore, the opening / closing section 87 of the attitude changing section 63 opens by horizontally moving the two vertical holding sections 80 and 82 away from each other (see passing position PP3 in Figure 5).

[0109] [Step S13] Receiving of the first substrate group by the attitude change unit The two vertical holding sections 80 and 82 are moved to the holding position PP2 by the opening / closing section 87, thereby holding the first divided substrate group (25 substrates W1) which is aligned alternately from the 50 vertically oriented substrates W held by the substrate holding section 65, in 25 pairs of holding grooves 89 and 90. The two horizontal holding sections 79 and 81 accommodate the first divided substrate group (25 substrates W1). This will be explained in detail.

[0110] The substrate holder 65 holds 50 substrates W (W1, W2) in a vertical position. The lifting mechanism 67 of the lifter LF9 raises the substrate holder 65 to an upper position where the substrates W can be passed. At this time, the 50 substrates W pass between the two vertical holders 80, 82 and are placed in the 50 pairs of horizontal guide grooves 85, 86 of the two horizontal holders 79, 81.

[0111] Subsequently, the opening / closing section 87 moves horizontally in a direction that brings the two vertical holding sections 80 and 82 closer together, closing the section (see holding position PP2 in Figure 5). As a result, the 50 substrates W held vertically by the substrate holding section 65 are accommodated by 25 pairs of holding grooves 89 and 90 and 25 pairs of through grooves 91 and 92, which are arranged alternately in pairs, as shown in the two lower frames of Figure 5.

[0112] Subsequently, the lifting section 67 of the lifter LF9 lowers the substrate holding section 65 to the lower standby position. As a result, the 25 substrates W1 of the first substrate group are handed over to the attitude changing section 63, while the 25 substrates W2 of the second substrate group remain in the substrate holding section 65. That is, the attitude changing section 63 removes the 25 substrates W1 of the first substrate group, which are aligned alternately from the 50 substrates W, by holding them in 25 pairs of holding grooves 89, 90. The multiple substrates W1 of the first substrate group are called the first divided substrate group. The multiple substrates W2 of the second substrate group are called the second divided substrate group.

[0113] The 25 circuit boards W1, which were removed one at a time, are aligned at full pitch. The 25 circuit boards W2 remaining in the circuit board holder 65 are also arranged at full pitch. The 25 circuit boards W2 remaining in the circuit board holder 65 are then placed in a standby state.

[0114] [Step S14] Move to the posture change execution area Refer to Figures 8(b) and 9(b). The horizontal movement unit 95 (X-direction movement unit 101 and Y-direction movement unit 102) moves two chucks 71, 72 and an arm support unit 78, etc., from above the substrate holding unit 65 in the substrate waiting area R31 to a predetermined position in the attitude change execution area R32, while the 25 substrates W1 are held by two vertical holding units 80, 82. In other words, the attitude change unit 63 transports the 25 substrates W1 of the first substrate group in a vertical orientation to the attitude change execution area R32.

[0115] [Step S15] Horizontal attitude change of the first substrate group by the attitude change unit Refer to Figures 8(c) and 9(c). Subsequently, in the attitude change execution area R32, the attitude change unit 63 changes the attitude of the 25 extracted substrates W1 to a horizontal attitude. Specifically, the vertical rotation unit 94 of the attitude change unit 63 rotates the substrates W1, the two chucks 71 and 72, and the arm support unit 78 by 90 degrees around the horizontal axis AX5 so that the two vertical holding units 80 and 82 face the center robot CR (see Figure 1).

[0116] In this state, the center robot CR cannot remove the substrate W1 from the attitude change unit 63. Therefore, the opening / closing unit 87 of the attitude change unit 63 opens by horizontally moving the two vertical holding units 80 and 82 away from each other. That is, when the 25 substrates W, which have been converted to a horizontal position, are placed on the two horizontal holding units 79 and 81, the opening / closing unit 87 moves the two vertical holding units 80 and 82 to the passing position PP3. This allows the substrate W1 to pass between the two vertical holding units 80 and 82. The 25 substrates W1 are then placed on the 25 horizontal placement guide grooves 85 and 86. Since the 25 substrates W1 are aligned at full pitch, the center robot CR can easily remove the substrates W.

[0117] Subsequently, the central robot CR uses two hands 37A and 37B to pick up one substrate W1 at a time from the 25 horizontally positioned substrates W1, passing them between two vertical holding units 80 and 82 that have been moved to the passing position PP3, and then transports the picked-up substrates W1 to the single-wafer processing chamber SW1.

[0118] [Step S16] Movement of the attitude conversion unit to the substrate standby area Refer to Figures 10(a) and 11(a). After transporting all 25 substrates W1 from the attitude change unit 63, the horizontal movement unit 95 (mainly the X-direction movement unit 101) moves the two chucks 71, 72 and the arm support unit 78, etc., from the attitude change execution area R32 to above the substrate holding unit 65 in the substrate waiting area R31. The Y-direction movement unit 102 of the horizontal movement unit 95 moves the two chucks 71, 72 and the arm support unit 78, etc., to the second substrate holding position. The second substrate holding position is the position where the 25 pairs of holding grooves 89, 90 can hold the 25 substrates W2 of the second substrate group.

[0119] Furthermore, the opening / closing section 87 of the attitude changing section 63 opens by horizontally moving the two vertical holding sections 80 and 82 away from each other (see passing position PP3 in Figure 5).

[0120] [Step S17] Receiving of the second group of substrates by the attitude change unit The substrate holder 65 holds the 25 substrates W2 of the second substrate group in a vertical position. The lifting section 67 of the lifter LF9 raises the substrate holder 65 to an upper position where the substrates W2 can be passed. At this time, the 25 substrates W2 pass between the two vertical holders 80 and 82 and are placed in 25 pairs of horizontal guide grooves 85 and 86 out of 50 pairs of horizontal guide grooves 85 and 86.

[0121] Subsequently, the opening / closing section 87 moves horizontally in a direction that brings the two vertical holding sections 80 and 82 closer together, closing the section (see holding position PP2 in Figure 5). As a result, the 25 substrates W2 held vertically by the substrate holding section 65 are accommodated by 25 pairs of holding grooves 89 and 90.

[0122] Subsequently, the lifting section 67 of the lifter LF9 lowers the substrate holding section 65 to the lower standby position. As a result, the 25 substrates W2 of the second substrate group are handed over to the attitude changing section 63. That is, the attitude changing section 63 receives the 25 substrates W2 of the second substrate group from the substrate holding section 65 and holds them in 25 pairs of holding grooves 89, 90.

[0123] [Step S18] Move to the posture change execution area Refer to Figures 10(b) and 11(b). The horizontal movement unit 95 (X-direction movement unit 101 and Y-direction movement unit 102) moves two chucks 71, 72 and an arm support unit 78, etc., from above the substrate holding unit 65 in the substrate waiting area R31 to a predetermined position in the attitude change execution area R32, while holding 25 substrates W2 with two vertical holding units 80, 82. In other words, the attitude change unit 63 transports 25 substrates W2 in a vertical orientation to the attitude change execution area R32.

[0124] [Step S19] Rotation of the second substrate group by 180 degrees by the lateral rotation unit. Furthermore, in the attitude change execution region R32, the lateral rotation section 93 of the attitude change section 63 rotates the vertically oriented substrate W2 and arm support section 78, etc., 180 degrees around the rotation axis AX4. As a result, the orientation of the device surface indicated by arrow AR is rotated 180 degrees from left Y to right Y. Therefore, when the horizontal attitude is changed, the orientation of the device surface of each substrate W2 can be made to face upward.

[0125] [Step S20] Horizontal attitude change of the second substrate group by the attitude change unit. Refer to Figures 10(c) and 11(c). Subsequently, the attitude change unit 63 changes the orientation of the 25 substrates W2 to be held to a horizontal orientation. Specifically, the vertical rotation unit 94 of the attitude change unit 63 rotates the substrates W2, the two chucks 71 and 72, and the arm support unit 78 by 90 degrees around the horizontal axis AX5 so that the two vertical holding units 80 and 82 face the center robot CR (see Figure 1).

[0126] Subsequently, the opening / closing section 87 of the attitude changing section 63 moves horizontally so that the two vertical holding sections 80 and 82 are separated from each other, opening them up (see passing position PP3 in Figure 5). This allows the substrate W2 to pass between the two vertical holding sections 80 and 82. The 25 substrates W2 are then placed in the 25 horizontal guide grooves 85 and 86.

[0127] Subsequently, the central robot CR uses two hands 37A and 37B to move the substrates W2 through two vertical holding units 80 and 82 that have been moved to the passing position PP3, picking up one substrate W2 at a time from the 25 substrates W2 in a horizontal position, and then transporting the picked-up substrates W2 to the single-wafer processing chamber SW1.

[0128] [Step S06] First sheet-fed processing Let's return to the explanation of the flowchart in Figure 6. For example, the center robot CR transports substrates W (W1, W2) one by one from the attitude change unit 63 to the first single-wafer processing chamber SW1. The first single-wafer processing chamber SW1 rotates the substrate W with the device surface facing upward using, for example, the rotation processing unit 45, while supplying pure water to the device surface from the nozzle 47. Subsequently, the first single-wafer processing chamber SW1 supplies IPA to the device surface (upper surface) of the substrate W from the nozzle 47 to replace the pure water in the substrate W with IPA.

[0129] [Step S07] Second sheet-fed processing (drying process) Subsequently, the central robot CR removes the substrate W, which is wet with IPA, from the first single-wafer processing chamber SW1 and transports it to the second single-wafer processing chamber SW2. The second single-wafer processing chamber SW2 dries the substrate W using supercritical carbon dioxide (supercritical fluid). This drying process using supercritical fluid suppresses the collapse of the pattern on the pattern side (device side) of the substrate W.

[0130] [Step S08] Transfer of substrate from buffer unit to carrier The central robot CR transports the dried substrates W from the second single-wafer processing chamber SW2 to one of the shelves in the buffer section 27. When one lot (25 substrates) of substrates W1 are transported to the buffer section 27, the substrate handling mechanism HTR transports all 25 substrates W1 at once from the buffer section 27 into the empty first carrier C placed on shelf 13A. Subsequently, the carrier transport mechanism 11 in the stocker block 3 transports the first carrier C to the load port 9.

[0131] Furthermore, once a batch of substrates W2 is placed in the buffer unit 27, the substrate handling mechanism HTR transports all 25 substrates W2 at once from the buffer unit 27 into the empty second carrier C placed on the shelf 13A. Subsequently, the carrier transport mechanism 11 in the stocker block 3 transports the second carrier C to the load port 9. An external transport robot (not shown) transports the two carriers C sequentially to their next destinations.

[0132] In this embodiment, the attitude change region R3 (including the second attitude change mechanism 35) is provided between the transfer block 5 and the batch processing region R1. The single-wafer substrate transport region R4 is adjacent to the transfer block 5 and the attitude change region R3. Furthermore, the single-wafer processing region R5 (including multiple single-wafer processing chambers SW1, SW2) is adjacent to the single-wafer substrate transport region R4. In addition, the horizontal XY position of the lifting platform 41 of the center robot CR, which is provided in the single-wafer substrate transport region R4, is fixed. Therefore, the transfer block 5, the second attitude change mechanism 35, and the multiple single-wafer processing chambers SW1, SW2 can be arranged around the center robot CR. This allows for a shorter transport distance of the substrate W by the center robot CR, for example, enabling efficient transport of the substrate W. Furthermore, the transport mechanism WTR can transport multiple substrates W simultaneously between the substrate transfer position PP in the transfer block 5, the six batch processing tanks BT1 to BT6, and the second attitude change mechanism 35. As a result, throughput can be improved.

[0133] Furthermore, the second attitude change mechanism 35 includes a substrate waiting area R31 and an attitude change execution area R32, which are arranged along the front-rear direction X in which the batch processing area R1 extends. The substrate waiting area R31 is provided with a substrate holding section 65 that holds multiple substrates W transported by the transport mechanism WTR in a vertical position. The attitude change execution area R32 is provided with an attitude change section 63. The attitude change section 63 includes two chucks 71 and 72 that hold multiple substrates W, a vertical rotation section 94 that rotates the two chucks 71 and 72 around a horizontal axis AX5, and a horizontal movement section 95 that moves the two chucks 71 and 72 and the vertical rotation section 94 between above the substrate holding section 65 and a preset position in the attitude change execution area R32.

[0134] The attitude change unit 63 receives multiple substrates W from the substrate holding unit 65 using two chucks 71 and 72 in the substrate standby area R31, and changes the orientation of the multiple substrates W from vertical to horizontal using the vertical rotation unit 94 in the attitude change execution area R32.

[0135] As a result, the width of the attitude change region R3 where the second attitude change mechanism 35 is located is reduced in the width direction Y, which is orthogonal to the front-to-back direction X in which the batch processing region R1 extends. Therefore, the width of the substrate processing device 1 can be kept small.

[0136] Furthermore, the single-wafer processing area R5 is located on the opposite side of the transfer block 5 via the single-wafer substrate transport area R4. In the width direction Y, which is perpendicular to the front-to-back direction X in which the batch processing area R1 extends, the width of the transfer block 5 is relatively large. Since the single-wafer processing area R5 is positioned opposite the transfer block 5, the width of the substrate processing apparatus 1 can be kept small. [Example 2]

[0137] Next, Embodiment 2 of the present invention will be described with reference to the drawings. Descriptions that overlap with those of Embodiment 1 will be omitted. Figure 12(a) is a plan view showing the second attitude changing mechanism 35 according to Embodiment 2. Figure 12(b) is a front view of Figure 12(a).

[0138] In Embodiment 1, the second attitude changing mechanism 35 comprised a lifter LF9 and an attitude changing unit 63 having a lateral rotating part 93. In contrast, the second attitude changing mechanism 35 of Embodiment 2 comprises a pusher mechanism 105 and an attitude changing unit 63 that does not have a lateral rotating part 93.

[0139] The pusher mechanism 105 holds multiple substrates (for example, 50) W transported by the transport mechanism WTR in a vertical position. The pusher mechanism 105 comprises a pusher 107 and a lifting and rotating section 109. The pusher 107 corresponds to the substrate holding section of the present invention.

[0140] The pusher 107 holds, for example, 50 substrates W arranged at predetermined intervals (e.g., half-pitch) from below. The pusher 107 has the same number of holding grooves (50) as the number of substrates W to hold the 50 substrates W. The back of each holding groove of the pusher 107 is formed in a V shape. The lifting and rotating unit 109 raises and lowers the pusher 107 and also rotates the pusher 107 around the vertical axis AX6. The lifting and rotating unit 109 is equipped with, for example, one or more electric motors.

[0141] Furthermore, as shown in Figure 12(b), the attitude changing unit 63 of Embodiment 2 does not include the lateral rotation unit 93 shown in Figure 4(b). Therefore, the tip of the rotating shaft 97 is fixed to the arm support unit 78.

[0142] Next, the operation of the second attitude changing mechanism 35 of Embodiment 2 will be described with reference to the flowchart in Figure 7. The operation of the second attitude changing mechanism 35 is basically as shown in the flowchart in Figure 7. However, since the second attitude changing mechanism 35 of Embodiment 2 does not have a lateral rotation section 93, step S19 shown in Figure 7 is not performed. Instead, the pusher mechanism 105 rotates the 25 substrates W2 of the second substrate group around the vertical axis AX6.

[0143] In step S13 of Figure 7, the attitude change unit 63 removes 25 substrates W1, which are aligned alternately from the 50 substrates W, from the substrate holding unit 65, by holding them with two vertical holding units 80, 82 (25 pairs of holding grooves 89, 90).

[0144] Subsequently, the lifting and rotating section 109 of the pusher mechanism 105 rotates the 25 substrates W2 held by the pusher 107 by 180 degrees around the vertical axis AX6. This allows the device surface to face upward when the orientation of the substrates W2 of the second substrate group is changed, similar to the substrates W1 of the first substrate group. The vertical axis AX6 is set in the center of the 50 substrates W held by the pusher 107 in a plan view. Therefore, the 180-degree rotation causes the position of the substrates W2 to shift by half a pitch in the alignment direction of the substrates W. As a result, the two vertical holding sections 80 and 82 can hold the substrates W1 of the second substrate group at the same position as the first substrate holding position where the substrates W1 of the first substrate group can be held by the 25 pairs of holding grooves 89 and 90. The horizontal moving section 95 may move the two vertical holding sections 80 and 82 to the first substrate holding position and the second substrate holding position, respectively.

[0145] Subsequently, in step S17 of Figure 7, the attitude changing unit 63 holds and transports the 25 substrates W2 that have been rotated 180 degrees. Note that in Embodiment 2, step S19 of Figure 7 is not performed.

[0146] In this embodiment, the lifting and rotating section 109 of the pusher mechanism 105 rotates the pusher 107 around the vertical axis AX6. Therefore, the attitude changing section 63 does not need to have the lateral rotating section 93 of Embodiment 1, and the orientation of the substrate W can be changed on the pusher 107 side, thus simplifying the configuration of the attitude changing section 63. [Example 3]

[0147] Next, Embodiment 3 of the present invention will be described with reference to the drawings. Note that explanations that overlap with Embodiments 1 and 2 will be omitted. Figure 13 is a plan view showing the schematic configuration of the substrate processing apparatus 1 according to Embodiment 3.

[0148] In Embodiment 1, the substrate processing apparatus 1 includes a substrate handling mechanism HTR, a center robot CR, and a buffer unit 27 (see Figure 1). In contrast, in Embodiment 3, the substrate processing apparatus 1 does not include the substrate handling mechanism HTR or the buffer unit 27. That is, the center robot CR2 further performs the role of the substrate handling mechanism HTR.

[0149] Refer to Figure 13. Transfer block 5 is equipped with a center robot CR2. Single-wafer substrate transport area R4 is not equipped with a transport robot, including the center robot CR2. The center robot CR2 of transfer block 5 is configured in substantially the same way as the center robot CR of Embodiment 1. The center robot CR2 transports the substrate W between the carrier C placed on shelf 13A, the first attitude changing mechanism 15, the second attitude changing mechanism 35 (attitude changing section 63), and a plurality of single-wafer processing chambers SW1, SW2.

[0150] For example, the center robot CR2 uses its hands 37A and 37B to pick up one substrate W from the carrier C placed on the shelf 13A and transports that single substrate W to the first posture changing mechanism 15. The center robot CR2 also uses its hands 37A and 37B to pick up one substrate W from the second posture changing mechanism 35 and transports that single substrate W to the first single-sheet processing chamber SW1.

[0151] Furthermore, the center robot CR2 takes one substrate W from the first single-wafer processing chamber SW1 and transports that substrate W to the second single-wafer processing chamber SW2. Then, the center robot CR2 takes one substrate W from the second single-wafer processing chamber SW2 and returns that substrate W to the carrier C placed on shelf 13A.

[0152] In this embodiment, the attitude change region R3 (including the second attitude change mechanism 35) is provided between the transfer block 5 and the batch processing region R1. The single-wafer substrate transport region R4 is adjacent to the transfer block 5 and the attitude change region R3. Furthermore, the single-wafer processing region R5 (including multiple single-wafer processing chambers SW1, SW2) is adjacent to the single-wafer substrate transport region R4. In addition, the horizontal XY position of the lifting platform 41 of the center robot CR2 provided on the transfer block 5 is fixed. Therefore, the carrier C placed on the mounting shelf 13A, the first attitude change mechanism 15, the second attitude change mechanism 35, and the multiple single-wafer processing chambers SW1, SW2 can be arranged around the center robot CR2. This allows, for example, the transport distance of the substrate W by the center robot CR2 to be shortened, thereby enabling efficient transport of the substrate W. Furthermore, the transport mechanism WTR can transport multiple substrates W simultaneously between substrate transfer positions PP within the transfer block 5, for example, between the six batch processing tanks BT1 to BT6 and the second posture changing mechanism 35. In particular, substrates W removed from the single-wafer processing chamber SW2 can be directly transported to the carrier C on the mounting shelf 13A. As a result, throughput can be improved.

[0153] The present invention is not limited to the embodiments described above, and can be modified and implemented as follows.

[0154] (1) In each of the embodiments described above, for example in Figure 1, the substrate standby area R31 of the second attitude change mechanism 35 is adjacent to the batch processing area R1, and the attitude change execution area R32 is adjacent to the transfer block 5. That is, the substrate standby area R31 and the attitude change execution area R32 of the second attitude change mechanism 35 are arranged in the front-rear direction X. In this respect, as shown in Figure 14, the substrate standby area R31 and the attitude change execution area R32 may be arranged in the width direction Y.

[0155] In this case, the attitude change execution area R32 is located to the left of the single-wafer substrate transport area R4 in the Y direction. The substrate waiting area R31 is located to the left of the attitude change execution area R32 in the Y direction.

[0156] (2) In each of the embodiments and modification (1) described above, the single-wafer processing area R5 (single-wafer processing chambers SW1, SW2) is located on the opposite side of the transfer block 5 via the single-wafer substrate transport area R4 and is adjacent to the attitude change area R3. In this regard, as shown in Figure 15, the processing block 7 may further include a second single-wafer processing area R6 located on the opposite side of the attitude change area R3 via the single-wafer substrate transport area R4. The second single-wafer processing area R6 is provided with a third single-wafer processing chamber SW3 configured in the same way as one of the single-wafer processing chambers SW1, SW2. The second single-wafer processing area R6 may include a plurality of third single-wafer processing chambers SW3 arranged in the vertical direction Z.

[0157] This increases the single-wafer processing area, allowing for the placement of more single-wafer processing chambers. Specifically, in Figure 15, since the single-wafer processing chamber SW3 is provided, the number of single-wafer processing chambers can be increased. Therefore, the throughput of single-wafer processing can be improved.

[0158] (3) In each of the embodiments and modifications described above, the lifting platform 41 of the center robot CR is provided on the floor surface of the single-wafer substrate transport area R4. Alternatively, the center robot CR, i.e., the lifting platform 41, may be suspended at a position above the single-wafer substrate transport area R4. At this upper position, the horizontal XY position of the lifting platform 41 is fixed. As shown in Figure 16, the upper end (base end) of the lifting platform 41 is fixed to the ceiling support frame 120 above the single-wafer substrate transport area R4 without moving in the horizontal XY direction. The base ends of the articulated arms 39A and 39B are provided at the bottom of the lifting platform 41. Two hands 37A and 37B are provided at the tips of the articulated arms 39A and 39B, respectively.

[0159] According to this modification, it is possible to prevent contamination of the center robot CR(CR2) by droplets falling from a wet substrate. For example, it is possible to prevent the center robot CR(CR2) from malfunctioning due to contamination.

[0160] (4) In each of the embodiments and modifications described above, each batch processing tank BT1 to BT6 processed 50 substrates W arranged in a half-pitch and face-to-face manner. In this regard, each batch processing tank BT1 to BT6 may process substrates W arranged in a face-to-back manner, where the device faces of all substrates W face the same direction. Each batch processing tank BT1 to BT6 may process 25 substrates W in one carrier C arranged in a full-pitch manner. When 50 substrates W are arranged in a face-to-back manner in the substrate holding section 65, the Y-direction moving section 102 moves the two chucks 71 and 72 in the front-to-back direction X where the substrates W are aligned. That is, the Y-direction moving section 102 moves the two chucks 71 and 72 between the first substrate holding position and the second substrate holding position. As a result, the attitude changing section 63 can extract 25 substrates W1 or 25 substrates W2.

[0161] (5) In each of the embodiments and modifications described above, the single-wafer processing chamber SW2 used a supercritical fluid to dry the substrate W. In this regard, the single-wafer processing chamber SW2 may also be equipped with a rotary processing unit 45 and a nozzle 47, similar to the single-wafer processing chamber SW1. In this case, the single-wafer processing chambers SW1, SW2 (or single-wafer processing chambers SW1 to SW3) each supplied, for example, pure water and IPA to the substrate W in that order, and then performed a drying process (spin drying) of the substrate W.

[0162] (6) In each of the embodiments and modifications described above, for example, in step S13, when the attitude changing unit 63 receives the substrate W from the substrate holding unit 65, the lifting unit 67, which acts as a relative lifting unit, raises and lowers the substrate holding unit 65. In this regard, the attitude changing unit 63 may also be equipped with a lifting unit and receive the substrate W from the substrate holding unit 65 by raising and lowering the two chucks 71, 72 and the arm support unit 78, etc. Furthermore, when the attitude changing unit 63 receives the substrate W from the substrate holding unit 65, the lifting unit of the attitude changing unit 63 and the lifting unit 67 may be raised and lowered together. [Explanation of Symbols]

[0163] 1 ... Substrate processing equipment 3… Storage block 5… Transfer Block 7 ... Processing block 13A ... Shelf HTR… Circuit board handling mechanism 15 ... First attitude change mechanism PP… Circuit board handover location R1 ... Batch processing area R2… Batch substrate transport area R3… Attitude change region R4 ... Single-wafer substrate transport area R5 ... Single-wafer processing area 27 … Buffer section BT1~BT6 ... Batch processing tanks WTR… Conveyor mechanism 35… Second attitude change mechanism CR, CR2… Center Robot 41… Lifting platform 59 ... Control Unit R31 … Board standby area R32 ... Attitude change execution area LF9… Lifter 63 ... Posture change unit 65 … Board holding part 71, 72… Chuck 94… Vertical rotation section 95…Horizontal moving part AX5…Horizontal axis

Claims

1. A substrate processing apparatus that continuously performs batch processing, which processes multiple substrates at once, and single-wafer processing, which processes substrates one by one, A carrier mounting shelf on which a carrier is placed for storing multiple circuit boards in a horizontal position with predetermined spacing between them in a vertical direction, A transfer block adjacent to the carrier mounting shelf, A processing block adjacent to the aforementioned transfer block, A substrate mounting section on which the substrate is placed, Equipped with, The aforementioned transfer block is, A first attitude conversion mechanism that converts the multiple substrates removed from the carrier from a horizontal orientation to a vertical orientation, The system includes a substrate handling mechanism that transports multiple substrates in a horizontal position simultaneously between the carrier placed on the carrier mounting shelf, the first attitude changing mechanism, and the substrate mounting section, The aforementioned processing block is, A batch processing area extending away from the transfer block, A batch substrate transport area is provided along the batch processing area, with one end extending to the transfer block and the other end extending away from the transfer block, A posture change region is provided between the transfer block and the batch processing region, The transfer block and the single-wafer substrate transport area adjacent to the attitude change area, The system includes a single-wafer processing area adjacent to the single-wafer substrate transport area, In the batch processing area, a plurality of batch processing tanks for processing the plurality of substrates in a vertical orientation all at once are arranged in the direction in which the batch processing area extends. The attitude conversion region is provided with a second attitude conversion mechanism that converts the batch-processed plurality of substrates from a vertical orientation to a horizontal orientation. The batch substrate transport area is provided with a batch substrate transport mechanism that transports multiple substrates in a vertical orientation simultaneously between the substrate transfer position determined within the transfer block, the multiple batch processing tanks, and the second orientation conversion mechanism. The aforementioned single-wafer processing area is provided with multiple single-wafer processing chambers for processing horizontal substrates one at a time. The single-wafer substrate transport area is provided with a horizontal substrate transport mechanism that can transport substrates one by one in a horizontal position between the second attitude changing mechanism, the plurality of single-wafer processing chambers, and the substrate mounting section. The horizontal substrate transport mechanism is characterized by comprising a horizontally movable hand for holding a substrate in a horizontal position, and a lifting platform for raising and lowering the hand, wherein the lifting platform has a fixed horizontal position.

2. In the substrate processing apparatus according to claim 1, The second attitude change mechanism comprises a substrate standby area and an attitude change execution area, which are arranged along the direction in which the batch processing area extends. The substrate waiting area is provided with a substrate holding section that holds the plurality of substrates transported by the batch substrate transport mechanism in a vertical position. The attitude change execution area is provided with an attitude change unit comprising two chucks for holding the plurality of substrates, a vertical rotation unit for rotating the two chucks around a horizontal axis, and a horizontal movement unit for moving the two chucks and the vertical rotation unit between above the substrate holding unit and a preset position in the attitude change execution area. The substrate processing apparatus is characterized in that the attitude changing unit receives the plurality of substrates from the substrate holding unit using the two chucks in the substrate waiting area, and changes the attitude of the plurality of substrates from vertical to horizontal using the vertical rotation unit within the attitude changing execution area.

3. In the substrate processing apparatus according to claim 1 or 2, The substrate processing apparatus is characterized in that the horizontal substrate transport mechanism is suspended above the single-wafer substrate transport area.

4. In the substrate processing apparatus according to claim 1 or 2, The substrate processing apparatus is characterized in that the single-wafer processing area is provided on the opposite side of the transfer block via the single-wafer substrate transport area and is provided adjacent to the attitude conversion area.

5. In the substrate processing apparatus according to claim 4, The substrate processing apparatus is characterized in that the processing block further comprises a second sheet processing area provided on the opposite side of the attitude conversion area via the sheet substrate transport area.

6. A substrate processing apparatus that continuously performs batch processing, which processes multiple substrates at once, and single-wafer processing, which processes substrates one by one, A carrier mounting shelf on which a carrier is placed for storing multiple circuit boards in a horizontal position with predetermined spacing between them in a vertical direction, A transfer block adjacent to the carrier mounting shelf, A processing block adjacent to the aforementioned transfer block, Equipped with, The aforementioned transfer block is, A first attitude conversion mechanism that converts the multiple substrates removed from the carrier from a horizontal orientation to a vertical orientation, It includes a horizontal substrate transport mechanism for transporting substrates in a horizontal position, The aforementioned processing block is, A batch processing area extending away from the transfer block, A batch substrate transport area is provided along the batch processing area, with one end extending to the transfer block and the other end extending away from the transfer block, A posture change region is provided between the transfer block and the batch processing region, The transfer block and the single-wafer substrate transport area adjacent to the attitude change area, The system includes a single-wafer processing area adjacent to the single-wafer substrate transport area, In the batch processing area, a plurality of batch processing tanks for processing the plurality of substrates in a vertical orientation all at once are arranged in the direction in which the batch processing area extends. The attitude conversion region is provided with a second attitude conversion mechanism that converts the batch-processed plurality of substrates from a vertical orientation to a horizontal orientation. The batch substrate transport area is provided with a batch substrate transport mechanism that transports multiple substrates in a vertical orientation simultaneously between the substrate transfer position determined within the transfer block, the multiple batch processing tanks, and the second orientation conversion mechanism. The aforementioned single-wafer processing area is provided with multiple single-wafer processing chambers for processing horizontal substrates one at a time. The horizontal substrate transport mechanism can transport substrates in a horizontal position between the carrier placed on the carrier shelf, the first posture changing mechanism, the second posture changing mechanism, and the plurality of single-wafer processing chambers. The horizontal substrate transport mechanism is characterized by comprising a horizontally movable hand for holding a substrate in a horizontal position, and a lifting platform for raising and lowering the hand, wherein the lifting platform has a fixed horizontal position.

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