Sensors, sensor systems, and electronic devices

Abstract

To provide a sensor, a sensor system, and an electronic apparatus that can improve accuracy.SOLUTION: According to an embodiment, a sensor includes a first member, a first substrate, and a sensor unit. A direction from the first member to the first substrate extends along a first direction. A first member thickness of the first member along the first direction is larger than a first substrate thickness of the first substrate along the first direction. The sensor unit is provided between the first member and the first substrate. The sensor unit is fixed to the first member. The first substrate is fixed to the sensor unit. The sensor unit includes a housing, and a sensor element provided in the housing. The sensor element includes a sensor base body, a fixation part fixed to the sensor base body, and a movable part supported on the fixation part. A direction from the fixation part to the sensor base body extends along the first direction. A first gap is provided between the sensor base body and the movable part.SELECTED DRAWING: Figure 1

Description

【Technical Field】 【0001】 Embodiments of the present invention relate to sensors, sensor systems, and electronic devices. 【Background Art】 【0002】 For example, there is a sensor with a MEMS (Micro Electro Mechanical Systems) structure. In some cases, an electronic device or the like is controlled based on what is obtained by the sensor. In the sensor, improvement in accuracy is desired. information 【Prior Art Documents】 【Patent Documents】 【0003】 【Patent Document 1】 Japanese Patent No. 6533518 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0004】 Embodiments of the present invention provide a sensor, a sensor system, and an electronic device capable of improving accuracy. 【Means for Solving the Problems】 【0005】 According to an embodiment, the sensor includes a first member, a first substrate, and a sensor unit. The direction from the first member to the first substrate is along a first direction. A first member thickness of the first member along the first direction is thicker than a first substrate thickness of the first substrate along the first direction. The sensor unit is provided between the first member and the first substrate. The sensor unit is fixed to the first member. The first substrate is fixed to the sensor unit. The sensor unit includes a housing and a sensor element provided in the housing. The sensor element includes a sensor base, a fixing portion fixed to the sensor base, and a movable portion supported by the fixing portion. The direction from the fixing portion to the sensor base is along the first direction. A first gap is provided between the sensor base and the movable portion. [Brief explanation of the drawing] 【0006】 [Figure 1] Figure 1 is a schematic cross-sectional view illustrating a sensor according to the first embodiment. [Figure 2] Figure 2 is a schematic plan view illustrating a sensor according to the first embodiment. [Figure 3] Figure 3 is a graph illustrating the characteristics of the sensor. [Figure 4] Figure 4 is a graph illustrating the characteristics of the sensor. [Figure 5] Figure 5 is a schematic cross-sectional view illustrating a sensor according to the first embodiment. [Figure 6] Figure 6 is a schematic cross-sectional view illustrating a sensor according to the first embodiment. [Figure 7] Figure 7 is a schematic diagram illustrating an electronic device according to the third embodiment. [Figure 8] Figures 8(a) to 8(h) are schematic diagrams illustrating applications of the electronic device according to the embodiment. [Figure 9] Figures 9(a) and 9(b) are schematic diagrams illustrating applications of the sensor according to the embodiment. [Modes for carrying out the invention] 【0007】 (First Embodiment) Figure 1 is a schematic cross-sectional view illustrating a sensor according to the first embodiment. Figure 2 is a schematic plan view illustrating a sensor according to the first embodiment. Figure 1 is a cross-sectional view taken along the line A1-A2 in Figure 2. As shown in Figure 1, the sensor 110 according to this embodiment includes a first member 41, a first substrate 51, and a sensor unit 10. 【0008】 The direction from the first member 41 to the first substrate 51 is along the first direction D1. The first direction D1 is defined as the Z-axis direction. One direction perpendicular to the Z-axis direction is defined as the X-axis direction. The direction perpendicular to both the Z-axis direction and the X-axis direction is defined as the Y-axis direction. 【0009】 The sensor unit 10 is provided between the first member 41 and the first substrate 51. The sensor unit 10 is fixed to the first member 41. The first substrate 51 is fixed to the sensor unit 10. In this example, the sensor 110 further includes a first fixing member 51F. For example, the first fixing member 51F is provided between the sensor unit 10 and the first substrate 51. The first fixing member 51F fixes the sensor unit 10 to the first substrate 51. The first fixing member 51F may also fix the side of the sensor unit 10 to the first substrate 51. Multiple first fixing members 51F may be provided. The first fixing member 51F may include, for example, metal. The first fixing member 51F may include, for example, solder. A stable and firm fixation can be obtained. 【0010】 The sensor unit 10 includes a housing 18 and a sensor element 10E provided inside the housing 18. The pressure inside the housing 18 is lower than 1 atmosphere. By keeping the inside of the housing 18 under reduced pressure, the effects of, for example, temperature changes outside the housing 18 are suppressed. 【0011】 The sensor element 10E includes a sensor base 10B, a fixed part 10F, and a movable part 10M. The sensor base 10B may be, for example, a silicon substrate. 【0012】 The fixed part 10F is fixed to the sensor base 10B. The movable part 10M is supported by the fixed part 10F. The direction from the fixed part 10F to the sensor base 10B is along the first direction D1. A first gap 10G is provided between the sensor base 10B and the movable part 10M. 【0013】 In this example, the sensor element 10E further includes a connecting member 10C. A portion 10Cp of the connecting member 10C (see Figure 2) is supported by a fixed portion 10F. The other portion 10Cq of the connecting member 10C (see Figure 2) supports the movable portion 10M. The connecting member 10C has, for example, a meander structure (or spring structure). The provision of a spring-structured connecting member 10C makes the movable portion 10M easier to move. The fixed portion 10F is, for example, an anchor. 【0014】 The movable part 10M is displaceable, for example, within the X-Y plane. As shown in FIGS. 1 and 2, the sensor element 10E , electric may further include a pole 15 . electric An AC voltage is applied between the pole 15 and the movable part 10M, so that the movable part 10M can vibrate. For example, when an external force (such as an angular velocity) is applied to the vibrating movable part 10M, the vibration state of the movable part 10M changes. By detecting the change in the vibration state of the movable part 10M, the external force can be detected. The change in the vibration state due to the external force is, for example, the effect of the Coriolis force. 【0015】 The housing 18 provided with the sensor element 10E is fixed to the first substrate 51. As shown in FIG. 1, the first substrate 51 includes a first surface 51a and a second surface 51b. The second surface 51b is between the sensor unit 10 and the first surface 51a in the first direction D1. The second surface 51b faces the sensor unit 10. The first surface 51a faces the detection member 81 to which the first substrate 51 is fixed. The detection member 81 is an inspection target by the sensor 110. 【0016】 As shown in FIG. 1, the sensor 110 may include a control unit 70. The control unit 70 is, for example, an electric circuit. The control unit 70 is provided on the first substrate 51. The control unit 70 is provided, for example, on the second surface 51b. The movable part 10M vibrates by a control signal from the control unit 70. The vibration state of the movable part 10M is detected by the control unit 70. 【0017】 When the sensor unit 10 is fixed to the first substrate 51, in a system including the movable part 10M, the fixed part 10F, the sensor base 10B, the first fixing member 51F, and the first substrate 51, etc., energy dissipation due to the anchor part occurs. For example, the Q value may fluctuate. In such a configuration, for example, elastic waves may propagate asymmetrically. Due to these, differences may occur in the excitation intensity of the movable part 10M in the X-Y plane in the sensor 110, and the detection stability may deteriorate. 【0018】 In this embodiment, the first member 41 is fixed to the sensor unit 10. The first member 41 functions, for example, as a weight. By providing a weight, energy dissipation can be suppressed. For example, the difference in excitation intensity in the XY plane can be reduced. For example, the effects of asymmetric propagation of elastic waves can be suppressed. According to this embodiment, a sensor with improved stability can be provided. 【0019】 As shown in Figure 1, the thickness of the first member 41 along the first direction D1 is defined as the first member thickness t41. The thickness of the first substrate 51 along the first direction D1 is defined as the first substrate thickness t51. In this embodiment, the first member thickness t41 is greater than the first substrate thickness t51. This makes it easier for the first member 41 to function as a weight. Stable vibration of the movable part 10M can be maintained. 【0020】 For example, the density of the first member 41 is higher than the density of the first substrate 51. For example, the mass of the first member 41 is greater than the mass of the first substrate 51. The mass of the first member 41 is greater than the mass of the movable part 10M. The sufficiently heavy first member 41 helps maintain stable vibration of the movable part 10M. 【0021】 For example, the first member 41 may contain a metal. For example, the first member 41 may contain at least one selected from the group consisting of aluminum, iron, and copper. Due to its high density, the first member 41 is likely to function as a weight. 【0022】 As shown in Figure 2, the first member 41 has a first member length L41 in a second direction D2 perpendicular to the first direction D1. The second direction D2 is, for example, the X-axis direction. The housing 18 has a housing length L18 in the second direction D2. The first member length L41 is preferably 0.9 times or more and 5 times or less the housing length L18. If the first member length L41 is excessively short, the function of the first member 41 as a weight will be reduced. If the first member length L41 is excessively long, deflection of the first member 41 will occur more easily, and the influence of other vibration components will increase. It may also be 1 time or more and 50 times or less the housing length L18. 【0023】 The movable part 10M is capable of resonating at a first frequency f1 (unit: Hz). The first sound velocity v1 (unit: m / s) of the transverse wave in the first member 41 is the product of the first frequency f1 and the first wavelength λ1 (unit: m) of the transverse wave in the first member 41. In this embodiment, the thickness t41 of the first member is preferably 1 / 4 times or more of the first wavelength λ1. This effectively suppresses the energy loss of the transverse wave. 【0024】 As already explained, the first member 41 has a first member length L41 (in m) in the second direction D2 perpendicular to the first direction D1 (see Figure 2). The second sound velocity v2 (in m / s) of the longitudinal wave in the first member 41 is the product of the first resonance frequency f1 of the movable part 10M and the second wavelength λ2 (m) of the longitudinal wave in the first member 41. In this embodiment, it is preferable that the first member length L41 is 1 / 4 times or more the second wavelength λ2. This effectively suppresses the loss of longitudinal wave energy. 【0025】 The following describes examples of the characteristics of sensor 110. Figure 3 is a graph illustrating the characteristics of the sensor. Figure 3 illustrates the characteristics when the ratio of the first member thickness t41 to the first wavelength λ1 is changed. The horizontal axis in Figure 3 represents the first parameter P1. The first parameter P1 is the ratio of the first member thickness t41 to the first wavelength λ1 (t41 / λ1). The vertical axis in Figure 3 represents, for example, the Q value Q1 of the movable part 10M. 【0026】 In the sensor unit 10, the movable part 10M is excited in an arbitrary direction. The excitation includes excitation along the X-axis direction and excitation along the Y-axis direction. Figure 3 illustrates the Q value Q1x for excitation along the X-axis direction and the Q value Q1y for excitation along the Y-axis direction. The difference between the Q value Q1x and the Q value Q1y is caused, for example, by the influence of asymmetric propagation of elastic waves. As shown in Figure 3, when the first parameter P1 is 0.25 or greater, the difference between the Q value Q1x and the Q value Q1y becomes smaller. In the embodiment, the first parameter P1 may be 1 or greater. The difference in Q values ​​with respect to the excitation direction becomes smaller, and symmetric vibration in the XY plane becomes easier to obtain. In the embodiment, the first member thickness t41 is preferably 1 or more times the first wavelength λ1. In the embodiment, for example, the first member thickness t41 is preferably 5 or less times the first wavelength λ1. If the thickness t41 of the first member is excessively thick, strain is more likely to occur in at least one of the sensor part 10 and the first fixing member 51F, for example. 【0027】 Figure 4 is a graph illustrating the characteristics of the sensor. Figure 4 illustrates the characteristics when the ratio of the first member length L41 to the second wavelength λ2 is changed. The horizontal axis in Figure 4 represents the second parameter P2. The second parameter P2 is the ratio of the first member length L41 to the second wavelength λ2 (L41 / λ2). The vertical axis in Figure 4 represents, for example, the Q value Q1 of the movable part 10M. 【0028】 Figure 4 illustrates the Q value Q1x for excitation along the X-axis and the Q value Q1y for excitation along the Y-axis. As shown in Figure 4, the difference between the Q value Q1x and the Q value Q1y becomes smaller when the second parameter P2 is 0.25 or greater. In the embodiment, the second parameter P2 may be 1 or greater. The difference in Q values ​​with respect to the excitation direction becomes smaller, making it easier to obtain symmetrical vibrations in the XY plane. In the embodiment, the length of the first member L41 is preferably 1 or more times the second wavelength λ2. In the embodiment, for example, the length of the first member L41 is preferably 5 or less times the second wavelength λ2. If the length of the first member L41 is excessively thick, strain is more likely to occur in at least one of the sensor part 10 and the first fixing member 51F, for example. 【0029】 Figure 5 is a schematic cross-sectional view illustrating a sensor according to the first embodiment. As shown in Figure 5, in the sensor 111 according to this embodiment, the first member 41 has a laminated structure. The configuration of the sensor 111, excluding this, may be the same as that of the sensor 110. 【0030】 In the sensor 111, the first member 41 includes a first partial region 41a and a second partial region 41b. The second partial region 41b is provided between the first partial region 41a and the housing 18. The second material of the second partial region 41b is different from the first material of the first partial region 41a. The first partial region 41a includes a metal. For example, the second partial region 41b may include a metal different from the metal of the first partial region 41a. 【0031】 For example, the first subregion 41a may include at least one selected from the group consisting of aluminum, iron, and copper. For example, the second subregion 41b may include solder, for example. For example, the melting point of the second material is lower than the melting point of the first material. The second subregion 41b may also be, for example, an adhesive region. 【0032】 The first component 41 includes multiple sub-regions made of different materials, which facilitates its design and manufacture. 【0033】 In one example, the thickness of the first subregion 41a along the first direction D1 may be greater than the thickness of the second subregion 41b along the first direction D1. 【0034】 Figure 6 is a schematic cross-sectional view illustrating a sensor according to the first embodiment. As shown in Figure 6, in the sensor 112 according to this embodiment, the first member 41 also includes a first partial region 41a and a second partial region 41b. In sensor 112, the configuration of the second partial region 41b is different from the configuration of the second partial region 41b in sensor 111. The configuration of sensor 112 other than this can be the same as that of sensor 111. 【0035】 As shown in Figure 6, in the sensor 112, the second partial region 41b is provided between a part of the first partial region 41a and the housing 18. For example, the second partial region 41b may be provided in the region that overlaps with the housing 18 and the first direction D1. 【0036】 (Second Embodiment) The second embodiment relates to a sensor system. As shown in Figure 1, the sensor system 210 according to the second embodiment includes a sensor 110 and a detection member 81. As shown in Figure 5, the sensor system 211 according to the second embodiment includes a sensor 111 and a detection member 81. As shown in Figure 6, the sensor system 212 according to the second embodiment includes a sensor 112 and a detection member 81. In the second embodiment, highly accurate detection results can be obtained. 【0037】 (Third embodiment) The third embodiment relates to an electronic device. Figure 7 is a schematic diagram illustrating an electronic device according to the third embodiment. As shown in Figure 7, the electronic device 310 according to the embodiment includes a sensor according to the first embodiment and a circuit control unit 170. In the example in Figure 7, a sensor 110 is depicted as the sensor. The circuit control unit 170 can control a circuit 180 based on a signal S1 obtained from the sensor. The circuit 180 is, for example, a control circuit for a drive device 185. According to the embodiment, for example, a circuit 180 for controlling a drive device 185 can be controlled with high precision. 【0038】 Figures 8(a) to 8(h) are schematic diagrams illustrating applications of the electronic device according to the embodiment. As shown in Figure 8(a), the electronic device 310 may be at least part of a robot. As shown in Figure 8(b), the electronic device 310 may be at least part of a machine robot installed in a manufacturing plant or the like. As shown in Figure 8(c), the electronic device 310 may be at least part of an automated guided vehicle in a factory or the like. As shown in Figure 8(d), the electronic device 310 may be at least part of a drone (unmanned aerial vehicle). As shown in Figure 8(e), the electronic device 310 may be at least part of an airplane. As shown in Figure 8(f), the electronic device 310 may be at least part of a ship. As shown in Figure 8(g), the electronic device 310 may be at least part of a submarine. As shown in Figure 8(h), the electronic device 310 may be at least part of an automobile. The electronic device 310 may include, for example, at least one of a robot and a mobile body. 【0039】 Figures 9(a) and 9(b) are schematic diagrams illustrating applications of the sensor according to the embodiment. As shown in Figure 9(a), the sensor 430 according to the embodiment includes the sensor according to the first embodiment and a transmitting / receiving unit 420. In the example in Figure 9(a), the sensor 110 is depicted as the sensor. The transmitting / receiving unit 420 can transmit the signal obtained from the sensor 110 by, for example, at least one of wireless and wired methods. The sensor 430 is installed, for example, on a slope surface 410 such as a road 400. The sensor 430 can monitor the state of, for example, a facility (e.g., infrastructure). The sensor 430 may be, for example, a state monitoring device. 【0040】 For example, the sensor 430 detects changes in the condition of the slope surface 410 of the road 400 with high accuracy. Changes in the condition of the slope surface 410 include, for example, changes in the inclination angle and changes in the vibration state. The signal (inspection result) obtained from the sensor 110 is transmitted by the transmitting / receiving unit 420. The condition of the facility (e.g., infrastructure) can be monitored, for example, continuously. 【0041】 As shown in Figure 9(b), the sensor 430 is installed, for example, on a part of a bridge 460. The bridge 460 is built over a river 470. For example, the bridge 460 includes at least one of a main girder 450 and a pier 440. The sensor 430 is installed on at least one of the main girder 450 and the pier 440. For example, the angle of at least one of the main girder 450 and the pier 440 may change due to deterioration or other reasons. For example, the vibration state may change in at least one of the main girder 450 and the pier 440. The sensor 430 can detect these changes with high accuracy. The detection results can be transmitted to any location by the transmitting / receiving unit 420. Anomalies can be effectively detected. 【0042】 The embodiments may include the following technical proposals. (Technical proposal 1) First member and A first substrate, wherein the direction from the first member to the first substrate is along a first direction, and the thickness of the first member along the first direction is greater than the thickness of the first substrate along the first direction, A sensor portion provided between the first member and the first substrate, wherein the sensor portion is fixed to the first member, and the first substrate is fixed to the sensor portion, and the sensor portion includes a housing and a sensor element provided inside the housing, and the sensor element includes a sensor base, a fixed portion fixed to the sensor base, and a movable portion supported by the fixed portion, and the direction from the fixed portion to the sensor base is along the first direction, and a first gap is provided between the sensor base and the movable portion, A sensor equipped with this feature. 【0043】 (Technical proposal 2) The first substrate includes a first surface and a second surface, The second surface is located between the sensing portion and the first surface in the first direction. The second surface faces the sensor portion, The first surface is opposite to the detection member to which the first substrate is fixed, as described in Technical Proposal 1. 【0044】 (Technical proposal 3) The sensor according to Technical Proposal 1 or 2, wherein the density of the first component is higher than the density of the first substrate. 【0045】 (Technical proposal 4) The sensor according to any one of Technical Proposals 1 to 3, wherein the mass of the first member is greater than the mass of the movable part. 【0046】 (Technical proposal 5) The sensor element further includes a connecting member, A portion of the connecting member is supported by the fixing portion, The other part of the connecting member is a sensor according to any one of Technical Proposals 1 to 4, which supports the movable part. 【0047】 (Technical proposal 6) The pressure inside the aforementioned housing is lower than 1 atmosphere, as described in any one of Technical Proposals 1 to 5. 【0048】 (Technical proposal 7) Further comprising a first fixing member, The first fixing member is provided between the sensor portion and the first substrate, The first fixing member is a sensor according to any one of Technical Proposals 1 to 6, wherein the sensor portion is fixed to the first substrate. 【0049】 (Technical proposal 8) The first fixing member is the sensor according to Technical Proposal 7, which includes metal. 【0050】 (Technical proposal 9) The aforementioned movable part is capable of resonating at a first frequency (unit: Hz), The first sound velocity (in m / s) of the transverse wave in the first member is the product of the first frequency and the first wavelength (in m) of the transverse wave in the first member. The sensor according to any one of Technical Proposals 1 to 8, wherein the thickness of the first member is 1 / 4 or more of the first wavelength. 【0051】 (Technical proposal 10) The sensor according to Technical Proposal 9, wherein the thickness of the first member is 1 or more times the first wavelength. 【0052】 (Technical proposal 11) The sensor according to Technical Proposal 9 or 10, wherein the thickness of the first member is 5 times or less the first wavelength. 【0053】 (Technical proposal 12) The first member has a first member length in a second direction perpendicular to the first direction, The housing has a housing length in the second direction, The sensor according to any one of Technical Proposals 1 to 9, wherein the length of the first member is 0.9 times or more and 5 times or less the length of the housing. 【0054】 (Technical proposal 13) The aforementioned movable part is capable of resonating at a first frequency (unit: Hz), The first member has a first member length (in m) in a second direction perpendicular to the first direction, The second sound velocity (in m / s) of the longitudinal wave in the first member is the product of the first frequency and the second wavelength (m) of the longitudinal wave in the first member. The sensor according to any one of Technical Proposals 1 to 8, wherein the length of the first member is 1 / 4 or more of the second wavelength. 【0055】 (Technical proposal 14) The sensor according to technical proposal 13, wherein the length of the first member is one time or more than the length of the second wavelength. 【0056】 (Technical proposal 15) The sensor according to technical proposal 13 or 14, wherein the length of the first member is 5 times or less the length of the second wavelength. 【0057】 (Technical proposal 16) The first component is a sensor according to any one of Technical Proposals 1 to 15, which includes a metal. 【0058】 (Technical proposal 17) The first member includes a first partial region and a second partial region, The second partial region is provided between the first partial region and the housing, The sensor according to any one of Technical Proposals 1 to 15, wherein the second material of the second subregion is different from the first material of the first subregion. 【0059】 (Technical proposal 18) The sensor according to Technical Proposal 17, wherein the thickness of the first partial region along the first direction of the first partial region is greater than the thickness of the second partial region along the first direction of the second partial region. 【0060】 (Technical proposal 19) The sensor described in Technical Proposal 2, The detection member and, A sensor system equipped with [unspecified features]. 【0061】 (Technical proposal 20) A sensor described in any one of Technical Proposals 1 to 18, A circuit control unit capable of controlling the circuit based on the signal obtained from the sensor, An electronic device equipped with [the necessary components]. 【0062】 According to the embodiment, sensors, sensor systems, and electronic devices capable of improving accuracy can be provided. 【0063】 In this specification, "perpendicular" and "parallel" do not mean strictly perpendicular and strictly parallel, but also include variations in the manufacturing process, for example, and it is sufficient if they are substantially perpendicular and substantially parallel. 【0064】 The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. For example, the specific configuration of each element included in the sensor, such as the components, substrate, sensor part, housing, sensor element, base body, fixed part, movable part, and control unit, is included within the scope of the present invention as long as those skilled in the art can appropriately select from the known range to implement the present invention in the same way and obtain the same effects. 【0065】 Furthermore, combinations of two or more elements from any of the specific examples, to the extent technically feasible, are also included within the scope of the present invention, insofar as they encompass the gist of the invention. 【0066】 Furthermore, all sensors, sensor systems, and electronic devices that a person skilled in the art can design and implement based on the above-described embodiments of the present invention, insofar as they encompass the gist of the present invention, also fall within the scope of the present invention. 【0067】 Furthermore, within the scope of the concept of the present invention, a person skilled in the art could conceive of various modifications and alterations, and it is understood that such modifications and alterations also fall within the scope of the present invention. 【0068】 While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of symbols] 【0069】 10: Sensor part, 10B: Sensor base, 10C: Connecting member, 10Cp: Part, 10Cq: Other part, 10E: Sensor element, 10F: Fixed part, 10G: First gap, 10M: Movable part, 15 :ElectronicPole, 18: Housing, 41: First member, 41a, 41b: First and second partial regions, 51: First substrate, 51F: First fixing member, 51a, 51b: First and second surfaces, 70: Control unit, 81: Detection member, 110-112: Sensor, 170: Circuit control unit, 180: Circuit, 185: Drive unit, 210-212: Sensor system, 310: Electronic device, 400: Road, 410: Slope surface, 420: Transceiver unit, 430: Sensor, 440: Pier, 450: Main girder, 460: Bridge, 470: River, D1, D2: First and second directions, L18: Housing length, L41: First member length, P1, P2: First and second parameters, S1: Signal, t41: Thickness of the first component, t51: Thickness of the first substrate

Claims

[Claim 1] First member and A first substrate, wherein the direction from the first member to the first substrate is along a first direction, and the thickness of the first member along the first direction is greater than the thickness of the first substrate along the first direction, A sensor portion provided between the first member and the first substrate, wherein the sensor portion is fixed to the first member, and the first substrate is fixed to the sensor portion, and the sensor portion includes a housing and a sensor element provided inside the housing, and the sensor element includes a sensor base, a fixed portion fixed to the sensor base, and a movable portion supported by the fixed portion, and the direction from the fixed portion to the sensor base is along the first direction, and a first gap is provided between the sensor base and the movable portion, Equipped with, The vibration state of the movable part is detected. Sensor. [Claim 2] The first substrate includes a first surface and a second surface, The second surface is located between the sensing portion and the first surface in the first direction. The second surface faces the sensor portion, The sensor according to claim 1, wherein the first surface faces the detection member to which the first substrate is fixed. [Claim 3] The sensor according to claim 1 or 2, wherein the density of the first member is higher than the density of the first substrate. [Claim 4] The sensor according to claim 1 or 2, wherein the mass of the first member is greater than the mass of the movable part. [Claim 5] The movable part is capable of resonating at a first frequency (unit: Hz), The first sound velocity (in m / s) of the transverse wave in the first member is the product of the first frequency and the first wavelength (in m) of the transverse wave in the first member. The sensor according to claim 1 or 2, wherein the thickness of the first member is 1 / 4 or more of the first wavelength. [Claim 6] The first member has a first member length in a second direction perpendicular to the first direction, The housing has a housing length in the second direction, The sensor according to claim 1 or 2, wherein the length of the first member is 0.9 times or more and 5 times or less the length of the housing. [Claim 7] The movable part is capable of resonating at a first frequency (unit: Hz), The first member has a first member length (in m) in a second direction perpendicular to the first direction, The second sound velocity (in m / s) of the longitudinal wave in the first member is the product of the first frequency and the second wavelength (m) of the longitudinal wave in the first member. The sensor according to claim 1 or 2, wherein the length of the first member is 1 / 4 or more of the second wavelength. [Claim 8] The first member includes a first partial region and a second partial region, The second partial region is provided between the first partial region and the housing, The sensor according to claim 1 or 2, wherein the second material of the second partial region is different from the first material of the first partial region. [Claim 9] The sensor according to claim 2, The detection member and, A sensor system equipped with [unspecified features]. [Claim 10] A sensor according to claim 1 or 2, A circuit control unit capable of controlling the circuit based on the signal obtained from the sensor, An electronic device equipped with [the necessary components].

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