Polishing method using a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy.

The polishing method using piezoelectric vibration energy addresses the challenge of uniform and efficient processing on complex curved surfaces by adjusting abrasive grain impact and vibration parameters, achieving consistent results on artificial joints and similar complex shapes.

JP7873021B2Active Publication Date: 2026-06-11ZHEJIANG UNIV CITY COLLEGE

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
ZHEJIANG UNIV CITY COLLEGE
Filing Date
2025-01-14
Publication Date
2026-06-11

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Abstract

To provide a uniform and efficient curved surface abrasive flow polishing method based on piezoelectric oscillation energy.SOLUTION: A uniform and efficient curved surface abrasive flow polishing method based on piezoelectric oscillation energy comprises steps of: manufacturing a casing and a case assembly; assembling a polishing device, placing a workpiece in the casing, and forming polishing flow channels with the consistent distance between the lower surface of a flexible flow channel wall and a to-be-machined curved surface of the workpiece; starting the polishing device, making the polishing liquid enter the polishing flow channel for polishing, applying alternating voltage to the piezoelectric ceramic through an alternating voltage source, making the piezoelectric ceramic drive the corresponding part of the wall of the flexible flow channel to vibrate, accordingly, making the abrasive particles at the corresponding positions in the polishing flow channel obtain vibration energy, and increasing the impact force of the abrasive particles on the curved surface of the workpiece; closing the polishing device and taking out the workpiece after polishing is completed. The rotating speed of the abrasive particles and the impact force on the workpiece are improved through the vibration energy of the piezoelectric ceramics, and then the overall grinding efficiency of the surface of the artificial knee joint is improved.SELECTED DRAWING: Figure 1
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Description

Technical Field

[0001] The present invention relates to the field of ultra-precision machining, and specifically, it is a polishing method based on the flow of abrasive grains on a curved surface that is uniform and efficient using piezoelectric vibration energy.

Background Art

[0002] Printing a titanium alloy artificial joint that meets individual needs as required by 3D printing technology and obtaining surface characteristics that meet the requirements of the human body through plasma oxidation not only further meets the needs of individualized treatment but can also provide excellent mechanical properties and biological properties.

[0003] In order to ensure that the surface of the 3D printed artificial joint is smooth, a polishing process is essential, which contributes to reducing friction and wear after implantation and improving the success rate of artificial joint replacement surgery and the quality of life of patients. Currently, the methods for polishing artificial knee joints mainly include two types: manual polishing and mechanical automatic polishing. The manual polishing method is time-consuming and labor-intensive and not efficient. Compared with it, mechanical automatic polishing performs surface ultra-precision machining on the artificial knee joint with a soft medium, and examples of such a soft medium include non-Newtonian fluid or a soft polishing disk, etc. Such a method significantly improves the processing efficiency, but there are still problems, that is, the processing uniformity is poor, especially the part with a large curvature of the artificial knee joint is more difficult to be processed well.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The object of the present invention is to solve the problems presented in the above background art by providing a polishing method based on the flow of abrasive grains on a curved surface that is uniform and efficient using piezoelectric vibration energy.

Means for Solving the Problems

[0005] To achieve the above object, the present invention provides the following technical solutions.

[0006] A polishing method using a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy, Step 1 involves manufacturing a casing and case assembly, wherein the casing has a flexible channel wall on its upper side, and the shape of the lower surface of the flexible channel wall matches the curved surface of the workpiece to be machined. Step 2 involves assembling the polishing apparatus, placing the workpiece into the casing, and forming polishing channels of equal spacing between the lower surface of the flexible channel wall and the curved surface of the workpiece to be processed. Step 3 involves activating the polishing device, allowing the polishing fluid to enter the polishing channel and perform polishing, and applying an AC voltage to the piezoelectric ceramic using an AC voltage source so that the piezoelectric ceramic drives the corresponding portion of the flexible channel wall to vibrate, thereby causing the abrasive grains at corresponding positions in the polishing channel to acquire vibrational energy and increasing the impact force of the abrasive grains on the curved surface of the workpiece. Step 4 includes closing the polishing device and removing the workpiece once polishing is complete.

[0007] Furthermore, in step 3, the voltage amplifier is adjusted based on the convex and concave curvatures of the workpiece, and the amplitude and frequency of the AC voltage applied to the piezoelectric ceramic are further adjusted.

[0008] Furthermore, in step 3, the AC voltage amplitude and change frequency for the piezoelectric ceramic at locations with large curvature on the curved surface of the workpiece are increased.

[0009] Furthermore, the polishing apparatus comprises a casing, a case assembly, several piezoelectric ceramics, and a polishing fluid supply mechanism. The casing houses a workpiece and has a flexible channel wall on its upper side, the flexible channel wall being located at the upper end of the workpiece, the shape of its lower surface matching the curved surface of the workpiece being machined, and polishing channels of equal spacing being formed between its lower surface and the curved surface of the workpiece being machined. The case assembly provides support to the casing and includes a restricting upper cover, the restricting upper cover covering the casing, the piezoelectric ceramics are electrically connected to an AC voltage source and a voltage amplifier, respectively, several of the piezoelectric ceramics are arranged in an array along the polishing channels between the upper inner wall of the restricting upper cover and the upper surface of the flexible channel wall, and the spacing between corresponding positions in the polishing channels is changed by changing the length after energization, and the polishing fluid supply mechanism supplies polishing fluid to the polishing channels.

[0010] Furthermore, the casing has a sleeve-like structure and an internal cavity for housing the workpiece, and the flexible flow channel wall is the upper shell wall of the casing.

[0011] Furthermore, a liquid supply passage and a liquid drainage passage are provided at both ends of the casing, and these passages are connected to both ends of the polishing channel.

[0012] Furthermore, the flexible channel wall has a constant thickness, the shape of its upper surface matches the shape of its lower surface, and the shape of the upper inner wall of the restricting upper cover matches the curved surface of the workpiece to be machined and the shape of the upper surface of the flexible channel wall.

[0013] Furthermore, the case assembly further includes a base, the restricting upper cover is mounted on the base, both forming an internal cavity for housing the casing, the casing is supported by the base, and the restricting upper cover and the base sandwich the casing, piezoelectric ceramic and workpiece between them.

[0014] Furthermore, the polishing fluid supply mechanism includes a polishing fluid pool, a liquid pump, and a liquid supply pipe, and the liquid pump pressurizes the polishing fluid in the polishing fluid pool and sends it to the polishing channel via the liquid supply pipe.

[0015] Furthermore, the polishing liquid supply mechanism further includes a drain pipe, and the drain pipe sends the polishing liquid flowing out from the outlet of the polishing channel to the polishing liquid pool.

Advantages of the Invention

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows.

[0017] First), the present invention utilizes the vibration energy of the piezoelectric ceramic to increase the rotational speed of the abrasive grains and the impact force on the workpiece, and further improves the grinding efficiency of the entire surface of the artificial knee joint. Second), based on the convex curvature and concave curvature of the artificial knee joint, the present invention adaptively adjusts the vibration amplitude and frequency of each piezoelectric ceramic, and further increases the grinding amount in the concave area to realize that the grinding amounts in each area of the surface of the artificial knee joint are the same, and completes the uniform polishing of the surface of the artificial knee joint. Third), the present invention utilizes a voltage amplifier to adjust the driving voltage of the piezoelectric ceramic, corresponding to having a relatively large voltage adjustment range, realizes a relatively wide vibration amplitude and frequency adjustment range, and further realizes a relatively wide grinding amount adjustment range. Fourth), the present invention can realize a large amount of automatic processing, improving the grinding and polishing efficiency. Fifth), the processing object to which the present invention is applied is not limited to the artificial knee joint, and any complex curved surface processing member can realize a uniform polishing effect on the whole surface by using the polishing method of the present invention.

Brief Description of the Drawings

[0018] [Figure 1] Figure 1 is a flowchart of the present invention. [Figure 2] Figure 2 is a schematic structural diagram of the polishing device according to the present invention. [Figure 3] Figure 3 is a schematic longitudinal sectional structural diagram of the polishing device according to the present invention. [Figure 4] Figure 4 is an enlarged view of part A in Figure 3. [Figure 5] Figure 5 is a first schematic diagram of the polishing principle of the present invention. [Figure 6] Figure 6 is a second schematic diagram of the polishing principle of the present invention. [Figure 7] Figure 7 is a schematic structural diagram of the casing according to the present invention. [Figure 8] Figure 8 is a schematic longitudinal sectional structure diagram of the casing according to the present invention. [Figure 9] Figure 9 is a diagram showing the circuit relationship of the polishing apparatus according to the present invention. [Figure 10] Figure 10 is a schematic structural diagram of the workpiece according to the present invention. [Figure 11] Figure 11 is a schematic diagram showing a partial cross-sectional structure of another embodiment of the polishing apparatus according to the present invention.

Mode for Carrying Out the Invention

[0019] Hereinafter, while referring to the drawings of the embodiments of the present invention, the technical solutions of the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, any other embodiments obtained by those skilled in the art without inventive labor all belong to the protection scope of the present invention.

[0020] Referring to FIG. 1, a polishing method by a uniform and efficient flow of abrasive grains on a curved surface based on piezoelectric vibration energy is realized using a polishing apparatus and includes the following steps 1 to 4.

[0021] Step 1: Fabricate the casing 12 and the case assembly, which has the flexible flow path wall 2 on the upper side of the casing 12, and the shape of the lower surface of the flexible flow path wall 2 matches the processed curved surface of the workpiece 8.

[0022] The casing 12 is made of a rubber material and is three-dimensionally modeled and then 3D printed according to the shape and size of the workpiece 8 . The restraint holding cover 7 in the case assembly is similarly three-dimensionally modeled and then 3D printed. The casing 12 and the restraint holding cover 7 may be manufactured using a mold in addition to 3D printing.

[0023] Step 2 Assemble the polishing apparatus and place the workpiece 8 into the casing 12 to form polishing channels 13 with equal spacing between the lower surface of the flexible channel wall 2 and the curved surface of the workpiece 8 to be processed.

[0024] Step 3 The polishing device is activated so that the polishing fluid 6 enters the polishing channel 13 and polishes, and an AC voltage is applied to the piezoelectric ceramic 1 by the AC voltage source 15 so that the piezoelectric ceramic 1 drives the corresponding portion of the flexible channel wall 2 to vibrate, thereby causing the abrasive grains 3 at the corresponding positions in the polishing channel 13 to acquire vibrational energy and increase the impact force of the abrasive grains 2 on the curved surface of the workpiece.

[0025] Furthermore, during the polishing process, the voltage amplifier is adjusted based on the convex and concave curvatures of the workpiece 8, and the amplitude and frequency of the AC voltage applied to the piezoelectric ceramic 1 are also adjusted.

[0026] Furthermore, for locations with a large curvature on the curved surface of the workpiece 8, the AC voltage amplitude and change frequency for the piezoelectric ceramic 1 at those locations are increased.

[0027] Step 4: Once polishing is complete, close the polishing device and remove the workpiece.

[0028] The polishing principle of the above method is that the rubber channel wall 2 is subjected to the vibration action of the piezoelectric ceramic 1, causing the wall surface to vibrate in response, and the vibration amplitude A' and frequency f' also change accordingly. The abrasive grains 3 acquire vibrational energy in the vibrating region of the rubber channel wall 2, increasing the rotational speed ω and the impact force F of the abrasive grains 3 on the workpiece surface. As the rotational speed and impact force of the abrasive grains 3 increase, the grinding efficiency of the abrasive grains 3 in this region improves. As the amount of abrasive material removed from the artificial knee joint 8 in this region increases, the polishing quality improves.

[0029] Referring to Figures 2 to 11, the polishing apparatus comprises a casing 12, a case assembly, several piezoelectric ceramics 1, and a polishing fluid supply mechanism. The casing 12 houses the workpiece 8 and has a flexible channel wall 2 on its upper side. The flexible channel wall 2 is located at the upper end of the workpiece 8, and the shape of its lower surface matches the curved surface of the workpiece 8 to be processed. Polishing channels 13 are formed at the same interval between the lower surface, the inner walls on both the left and right sides of the casing 12, and the curved surface of the workpiece 8 to be processed. The case assembly provides support to the casing and includes a restricting upper cover 7, which has a rigid structure and is located at the upper end of the flexible channel wall 2. Several piezoelectric ceramics 1 are arranged in an array along the polishing channel 13 between the restricting upper cover 7 and the flexible channel wall 2, where the array also includes an independent row. The piezoelectric ceramics 1 change in length after being energized, that is, the length of the piezoelectric ceramics 1 in the direction normal to the upper surface of the flexible channel wall 2 changes. Although the flexible channel wall 2 is a flexible material, the restricting upper cover 7 has a rigid structure. Therefore, the change in the length of the piezoelectric ceramics 1 deforms the flexible channel wall 2, thereby changing the spacing of the corresponding positions in the polishing channel 13. The polishing fluid supply mechanism supplies polishing fluid to the polishing channel 13.

[0030] In the polishing apparatus according to the present invention, the workpiece 8 is specifically an artificial knee joint, and its shape is shown in Figure 10 As shown, the upper surface is the curved surface to be processed.

[0031] Referring to Figures 7 and 8, the casing 12 has a sleeve-like structure and an internal cavity for housing the workpiece 8, with an opening at the bottom, the opening being slightly smaller than the workpiece 8, and deformation allowing the workpiece 8 to be inserted into the internal cavity of the casing 12 through the opening. The flexible channel wall 2 is the upper shell wall of the casing, and a liquid supply passage 1200 and a liquid drain passage 1201 are installed at both ends of the casing 12, the liquid supply passage 1200 is connected to the inlet of the polishing channel 13, and the liquid drain passage 1201 is connected to the outlet of the polishing channel 13.

[0032] Referring to Figure 4, the flexible channel wall 2 has a constant thickness, the shape of its upper surface matches the shape of its lower surface, and the shape of the upper inner wall of the restricting upper cover 7 matches the curved surface of the workpiece 8 to be machined and the shape of the upper surface of the flexible channel wall 2. The restricting upper cover 7 can similarly be manufactured by 3D printing or mold.

[0033] Referring further to Figures 2 to 4, the case assembly further includes a base 4, on which a restricting upper cover 7 is mounted, both connected by fasteners, forming an internal cavity between them for housing the casing 12, the casing 12 is supported by the base 4, and the restricting upper cover 7 and the base 4 provide support pressure between the piezoelectric ceramic 1, the casing 12 and the workpiece 8.

[0034] Referring to Figure 3, the polishing fluid supply mechanism includes a polishing fluid pool 5, a liquid pump 10, a supply pipe 11, and a drain pipe 9. Polishing fluid 6 is stored in the polishing fluid pool 5, and the polishing fluid 6 contains abrasive particles 3. One end of the supply pipe 11 is connected to the supply passage 1200, and the other end is connected to the liquid pump 10. One end of the drain pipe 9 is connected to the drain passage 1201, and the other end extends into the polishing fluid pool 5. The liquid pump 10 pumps the polishing fluid in the polishing fluid pool 5 into the polishing channel 13 via the supply pipe 11. The polishing fluid in the polishing channel 13 is returned to the polishing fluid pool 5 through the drain pipe 9 by the action of its power and the thrust of the subsequent polishing fluid. The liquid pump 10 also gives the polishing fluid an initial velocity and power to polish the workpiece 8.

[0035] Referring to Figure 9, each piezoelectric ceramic 1 is electrically connected to an AC voltage source 15 and a voltage amplifier 14, the AC voltage source 15 is electrically connected to the voltage amplifier 14, the AC voltage source 15 supplies power to the piezoelectric ceramics 1, a single neuron pid is integrated into the voltage amplifier 14, the voltage amplifier 14 can change the amplitude, frequency and on / off state of the AC voltage of each piezoelectric ceramic 1, and can control each piezoelectric ceramic 1 independently.

[0036] As shown in Figure 11, in another embodiment of the polishing apparatus according to the present invention, several insertion grooves 70 for inserting and engaging the piezoelectric ceramic 1 are provided on the upper inner wall of the restricting upper cover 7.0 These are installed at intervals, and the insertion groove 70 of the piezoelectric ceramic 1 0 The end facing away from the other end is fixed to the flexible channel wall 2 by adhesion.

[0037] The piezoelectric ceramic 1 is driven by the voltage of the AC voltage source 15 and vibrates periodically with a constant vibration amplitude A and frequency f, transmitting vibration energy to the flexible channel wall 2. There are multiple piezoelectric ceramics 1, and each piezoelectric ceramic 1 has a vibration amplitude A n and frequency f n These can be adjusted independently. The shape of the flexible channel wall 2 is customized according to the surface irregularities distribution of the workpiece 8.

[0038] The vibrational energy of the piezoelectric ceramic 1 is transmitted to the flexible channel wall 2, causing the flexible channel wall 2 to vibrate with the corresponding amplitude A' and frequency f'. This vibrational energy is further transmitted to the polishing fluid 6 in the polishing channel 13, causing a turbulent effect in the polishing fluid 6. The turbulent kinetic energy of the polishing fluid 6 is transmitted to the abrasive grains 3 in the polishing fluid 6, further increasing the rotational angular velocity ω of the abrasive grains 3 in the polishing fluid 6, and increasing the impact force F of the abrasive grains 3 on the workpiece 8. Ultimately, the grinding efficiency p of the abrasive grains 3 on the artificial knee joint 8 per unit time is improved. As can be seen from the formula grinding amount δ = kpv, the grinding amount of the workpiece 8 in this region also increases accordingly, where k is the grinding amount constant, taking a value between 0 and 1, and v is the flow velocity of the abrasive grains 3.

[0039] Furthermore, the present invention relates to the convex curvature ρ of the workpiece 8. 凸 and concave curvature ρ 凹 Based on this, the voltage amplifier 14 controls the vibration amplitude A of each piezoelectric ceramic 1. n and frequency f n By adjusting the vibration amplitude A' and frequency f' of the flexible channel wall 2 in the corresponding region, and further adjusting the amount of grinding and polishing of the workpiece 8 in the corresponding region, it is possible to obtain a similar amount of grinding even in regions with a low material removal rate, thereby achieving a uniform polishing effect on the workpiece 8.

[0040] Although embodiments of the present invention have been shown and described, as will be understood by those skilled in the art, various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is limited by the appended claims and equivalents.

[0041] (Note) (Note 1) A polishing method using a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy, Step 1 involves manufacturing a casing and case assembly, wherein the casing has a flexible channel wall on its upper side, and the shape of the lower surface of the flexible channel wall matches the curved surface of the workpiece to be machined. Step 2 involves assembling the polishing apparatus, placing the workpiece into the casing, and forming polishing channels of equal spacing between the lower surface of the flexible channel wall and the curved surface of the workpiece to be processed. Step 3 involves activating the polishing device, allowing the polishing fluid to enter the polishing channel and perform polishing, and applying an AC voltage to the piezoelectric ceramic using an AC voltage source so that the piezoelectric ceramic drives the corresponding portion of the flexible channel wall to vibrate, thereby causing the abrasive grains at corresponding positions in the polishing channel to acquire vibrational energy and increasing the impact force of the abrasive grains on the curved surface of the workpiece. A polishing method using a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy, characterized by comprising step 4, which involves closing the polishing device and removing the workpiece once polishing is complete.

[0042] (Note 2) The polishing method described in Appendix 1, characterized in that, in step 3, the voltage amplifier is adjusted based on the convex and concave curvatures of the workpiece, and the amplitude and frequency of the AC voltage applied to the piezoelectric ceramic are further adjusted.

[0043] (Note 3) In step 3, the polishing method using a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy as described in Appendix 2, characterized in that the AC voltage amplitude and change frequency for the piezoelectric ceramic at locations with large curvature on the curved surface of the workpiece are increased.

[0044] (Note 4) The polishing apparatus comprises a casing, a case assembly, several piezoelectric ceramics, and a polishing fluid supply mechanism, wherein the casing houses a workpiece and has a flexible channel wall on its upper side, the flexible channel wall is located at the upper end of the workpiece, the shape of its lower surface matches the curved surface of the workpiece to be processed, and polishing channels of equal spacing are formed between its lower surface and the curved surface of the workpiece to be processed, the case assembly provides support to the casing and includes a restricting upper cover, the restricting upper cover covers the casing, the piezoelectric ceramics are electrically connected to an AC voltage source and a voltage amplifier, respectively, several of the piezoelectric ceramics are arranged in an array along the polishing channels between the upper inner wall of the restricting upper cover and the upper surface of the flexible channel wall, the spacing of corresponding positions in the polishing channels is changed by changing the length after energization, and the polishing fluid supply mechanism supplies polishing fluid to the polishing channels, characterized in that a polishing method using a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy as described in any of Appendices 1 to 3.

[0045] (Note 5) The polishing method described in Appendix 4, characterized in that the casing has a sleeve-like structure and an internal cavity for housing a workpiece, and the flexible flow channel wall is the upper shell wall of the casing, by uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy.

[0046] (Note 6) The polishing method using a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy as described in Appendix 5, characterized in that a liquid supply passage and a liquid drainage passage are provided at both ends of the casing, and the liquid supply passage and the liquid drainage passage are connected to both ends of the polishing flow path, respectively.

[0047] (Note 7) The polishing method using a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy, as described in Appendix 4, characterized in that the flexible channel wall has a constant thickness, the shape of its upper surface matches the shape of its lower surface, and the shape of the upper inner wall of the restricting upper cover matches the curved surface of the workpiece to be processed and the shape of the upper surface of the flexible channel wall.

[0048] (Note 8) The polishing method by uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy, as described in Appendix 4, characterized in that the case assembly further includes a base, the restricting upper cover is mounted on the base, both form an internal cavity for housing the casing, the casing is supported by the base, and the restricting upper cover and the base sandwich the casing, piezoelectric ceramic and workpiece between them.

[0049] (Note 9) The polishing method described in Appendix 4, characterized in that the polishing fluid supply mechanism includes a polishing fluid pool, a liquid pump, and a liquid supply pipe, and the liquid pump pressurizes the polishing fluid in the polishing fluid pool to the polishing channel via the liquid supply pipe, thereby providing a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy.

[0050] (Note 10) The polishing method described in Appendix 9, characterized in that the polishing fluid supply mechanism further includes a drain pipe, and the drain pipe sends the polishing fluid that has flowed out from the outlet of the polishing channel to a polishing fluid pool, resulting in a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy. [Explanation of symbols]

[0051] 1. Piezoelectric ceramics 2 Flexible channel wall 3 abrasive grains 4 bases 5. Polishing solution pool 6 Polishing liquid 7. Upper cover for constraints 70 0 Insertion groove 8 Work 9 Drainage pipe 10 liquid pumps 11 Liquid supply pipe 12 Casing 1200 Liquid supply passage 1201 Drainage passage 13 Polishing channel 14 Voltage Amplifier 15 AC voltage source

Claims

1. A polishing method using a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy, Step 1 involves manufacturing a casing and case assembly, wherein the casing has a flexible channel wall on its upper side, and the shape of the lower surface of the flexible channel wall matches the curved surface of the workpiece to be machined. Step 2 involves assembling the polishing apparatus, placing the workpiece into the casing, and forming polishing channels of equal spacing between the lower surface of the flexible channel wall and the curved surface of the workpiece to be processed. Step 3 involves activating the polishing device, allowing the polishing fluid to enter the polishing channel and perform polishing, and applying an AC voltage to the piezoelectric ceramic using an AC voltage source so that the piezoelectric ceramic drives the corresponding portion of the flexible channel wall to vibrate, thereby causing the abrasive grains at corresponding positions in the polishing channel to acquire vibrational energy and increase the impact force of the abrasive grains on the curved surface of the workpiece. Step 4 includes closing the polishing device and removing the workpiece once polishing is complete. In step 3, the method for polishing by a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy is characterized by adjusting the voltage amplifier based on the convex and concave curvature of the workpiece, and further adjusting the amplitude and change frequency of the AC voltage applied to the piezoelectric ceramic.

2. The polishing method according to claim 1, characterized in that, in step 3, the AC voltage amplitude and change frequency for the piezoelectric ceramic at locations with a large curvature on the curved surface of the workpiece are increased.

3. The polishing apparatus comprises a casing, a case assembly, several piezoelectric ceramics, and a polishing fluid supply mechanism, wherein the casing houses a workpiece and has a flexible channel wall on its upper side, the flexible channel wall is located at the upper end of the workpiece, the shape of its lower surface matches the curved surface of the workpiece to be processed, and polishing channels of equal spacing are formed between its lower surface and the curved surface of the workpiece to be processed, the case assembly provides support to the casing and includes a restricting upper cover, the restricting upper cover covers the casing, the piezoelectric ceramics are electrically connected to an AC voltage source and a voltage amplifier, respectively, several of the piezoelectric ceramics are arranged in an array along the polishing channels between the upper inner wall of the restricting upper cover and the upper surface of the flexible channel wall, the spacing of corresponding positions in the polishing channels is changed by changing the length after energization, and the polishing fluid supply mechanism supplies polishing fluid to the polishing channels, characterized in that a polishing method by uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy according to claim 1 or 2.

4. The polishing method according to claim 3, characterized in that the casing has a sleeve-like structure and an internal cavity for housing a workpiece, and the flexible flow channel wall is the upper shell wall of the casing, resulting in a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy.

5. The polishing method according to claim 4, characterized in that a liquid supply passage and a liquid drainage passage are provided at both ends of the casing, and the liquid supply passage and the liquid drainage passage are connected to both ends of the polishing flow path, respectively, for uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy.

6. The polishing method according to claim 3, characterized in that the flexible channel wall has a constant thickness, the shape of its upper surface matches the shape of its lower surface, and the shape of the upper inner wall of the restricting upper cover matches the curved surface of the workpiece to be processed and the shape of the upper surface of the flexible channel wall, resulting in a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy.

7. The polishing method by uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy, as described in claim 3, characterized in that the case assembly further includes a base, the restricting upper cover is mounted on the base, both form an internal cavity for housing the casing, the casing is supported on the base, and the restricting upper cover and the base sandwich the casing, piezoelectric ceramic and workpiece between them.

8. The polishing method according to claim 3, characterized in that the polishing fluid supply mechanism includes a polishing fluid pool, a liquid pump, and a liquid supply pipe, and the liquid pump pressurizes the polishing fluid in the polishing fluid pool to the polishing channel via the liquid supply pipe, resulting in a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy.

9. The polishing method according to claim 8, characterized in that the polishing fluid supply mechanism further includes a drain pipe, the drain pipe sending the polishing fluid that has flowed out from the outlet of the polishing channel to a polishing fluid pool, resulting in a uniform and efficient flow of abrasive particles on a curved surface based on piezoelectric vibration energy.