Retaining system for holding a substrate during machining of the substrate surface

The holding system addresses the challenges of handling and transport in machining by enabling secure and easy rotation of substrates, reducing handling effort and damage risk.

JP7874057B2Active Publication Date: 2026-06-15OERLIKON SURFACE SOLUTIONS AG PFAFFIKON

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
OERLIKON SURFACE SOLUTIONS AG PFAFFIKON
Filing Date
2020-12-16
Publication Date
2026-06-15

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Patent Text Reader

Abstract

The present invention relates to a holding system (1) for holding substrates (12) for use in a surface treatment system having a coating area (20), the holding system including a plurality of fixing elements (2), a body (24) disposed in the coating area (20) to receive the fixing elements (2), and a positioning element (26) for adjusting the coating area and the machining area (20, 22), so that a plurality of substrates (12) can be fixed by the fixing elements (2) and processed in the machining area (22).
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Description

【Technical Field】 【0001】 The present invention relates to a holding system for holding a substrate (e.g., a workpiece or a tool) for processing the surface of the substrate, particularly in a surface treatment system, and a method of using this holding system. 【Background Art】 【0002】 Particularly when machining an elongated substrate (e.g., a shank tool-type tool or a workpiece similar in shape to a shank tool), the transport and holding process occupies a significant portion of the overall effort of the machining process. In such a machining process, the substrate to be machined is generally transported by a specially designed / constructed transport system and sent to a holding system before machining. Before surface treatment, the substrate to be treated is typically first re-batched manually and then individually placed in a carrier within the surface treatment system. For example, in a certain process, it is necessary to hold individual substrates upside down or horizontally. After treatment, the substrate is usually re-batched manually again and then shipped. This entire process chain not only means high handling costs but also risks damaging the substrate during processing, which in turn leads to an increase in manufacturing costs. The handling effort and the associated risk of damage are particularly high when processing delicate substrates. 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0003】 Therefore, an object of the present invention is to at least partially remove the above-mentioned drawbacks of known devices and systems for fixing and holding substrates, particularly workpieces and / or tools of elongated shape. In particular, an object of the present invention is to provide an apparatus and a system for holding a substrate that can minimize the handling effort in the overall machining process chain by enabling stable fixation and safe and easy transport of the substrate before, during, and after machining operations in a simple and inexpensive manner. [Means for solving the problem] 【0004】 The above objectives are achieved by a holding system having the features of the independent claim for the system and a method having the features of the independent claim for the method. Further features and details of the present invention are derived from the respective dependent claims, specification and drawings. Features and details described in relation to the holding system according to the present invention are, in all cases, also applicable in relation to the method according to the present invention, and vice versa, and therefore disclosures relating to individual aspects of the present invention are, or may be, always made by mutual reference. 【0005】 The present invention provides a holding system for holding substrates used in a surface treatment system. In this case, the holding system has a covering area and further includes a plurality of fixing elements, a body positioned within the covering area to receive the fixing elements, and positioning elements for defining the covering area and the machining area, wherein a plurality of substrates can be fixed by the fixing elements and processed within the machining area. 【0006】 Therefore, the holding system according to the present invention is designed / configured to fix the substrate to be processed during processing, and to shield a portion of the substrate so that a portion of the substrate is inaccessible for processing and the rest of the substrate is free for processing. According to the present invention, the positioning element preferably acts to set or release the machining area. In particular, the positioning element may be rotatably mounted within the holding system and may, in addition to changing the positioning in the longitudinal extent of the holding system, preferably also to change the lateral positioning with respect to the longitudinal extent of the holding system. 【0007】 The substrate processing is performed in a machining area that does not protrude into the coating area. The body of the retaining system according to the present invention preferably has a plurality of recesses arranged adjacent to each other to realize fixing elements, these recesses may be advantageously formed in the form of bores or the like and may be arranged in a circular manner within the body. By pressure-fitting fixing via the fixing elements, the retaining system is hereby preferably designed so that the substrate is rotatable at least 90°, and especially at least 180°, during processing. It is understood that the substrate may also be rotatable at angles smaller than 90° or larger than 180°. It is also understood that the substrate may preferably be rotatable around two or more axes, especially three axes x, y, and z, during processing. 【0008】 To secure the substrate to be processed, the fixing element may preferably have a fixing region. This fixing region allows the substrate to be advantageously pressure-fitted during processing. The fixing region may be locally limited to the entire surface or the entire volume of the fixing element. Advantageously, the fixing region may be located between a first recess for penetrating the substrate and a second recess for penetrating the substrate. Advantageously, in this case, the fixing element may be formed to have a diameter that varies in its longitudinal spread. Along the longitudinal spread of the fixing element, the diameter may, for example, decrease from the outside towards the center in any case, and it is preferable that the diameter in the fixing region is minimized. To ensure maximum flexibility with respect to the diameter of the substrate to be accommodated and fixed, the fixing element may, more advantageously, have a partially circular cross-section, at least in cross-section. 【0009】 Within the scope of the present invention, it is possible to fix substrates, particularly workpieces, in a simple manner using fixing elements designed / configured according to the present invention, and this fixing enables particularly simple transport, especially simple handling, of the substrates before, during, and after processing, and allows the substrates to be handled during processing, for example, by rotating or turning them upside down. 【0010】 With regard to securely fixing a substrate, particularly a tool to be machined such as a shank tool, and simultaneously machining it as accurately as possible, it may be advantageous for the covering area to have a greater longitudinal extension than the machining area, preferably at least twice as much, and particularly at least three times as much. 【0011】 For the most compact design / configuration possible, and at the same time, for a holding force that can be defined as precisely as possible, the body is cylindrical, and the height of the cylinder may preferably be at least the same length as the fixing element placed inside the body. This allows the fixing element to be completely contained within the body. 【0012】 Within the structurally simple possibilities of ensuring an adjustable machining area, the present invention advantageously allows the positioning element to have a disc-shaped first portion for separating the covering area from the machining area and a second bolt-shaped portion for positioning the first portion. In this case, the second portion is preferably fastened to the main body and may have a spherical design / configuration, for example, so that the positioning of the first portion can be performed in a simple manner, for example, via a threaded rod. Within the framework of a stable and robust design / configuration of this holding system, the positioning element may further have an integrated design / configuration, and the first and second portions may be integrally formed from materially homogeneous parts. 【0013】 Regarding the structurally simple possibility of separating the machining area from the coating area and simultaneously ensuring access of the substrate to the machining area, the positioning element may further have a plurality of recesses, each for penetrating one substrate, and the recesses may preferably be arranged in a first portion. In this case, the recesses may preferably be in the form of holes and, advantageously, may be arranged in a circular pattern within the first portion of the positioning element, particularly in correspondence with the arrangement of recesses within the body. 【0014】 In order to prevent the positioning of the machining area from changing during substrate processing, it is particularly conceivable that a rotation prevention element be provided to prevent unintended rotation around the rotation axis, and that the rotation prevention element may be firmly connected to the main body and the positioning element to prevent unintended rotation of the positioning element. 【0015】 In a structurally simple design / configuration, the anti-rotation element may be formed in the form of a locking pin, which may be fixed at its first end by a locking element within the main body to prevent unintended rotation of the positioning element, and may be firmly fixed to the positioning element, particularly to the first portion of the positioning element, via its other end. The connection between the locking pin and the first portion of the positioning element may also be formed in a pressure fit manner, preferably via a plug-in connection, a latch connection, or a screw connection. 【0016】 In the context of safely and stably guiding the substrate during processing, it is further conceivable that at least one guide element for guiding the substrate is provided, and the guide element is preferably positioned between the main body and the first portion of the positioning element. 【0017】 Within the range of a structurally simple design / configuration that safely and stably guides the substrate during processing, according to the present invention, each guide element may have a plurality of recesses for penetrating one substrate, and the recesses may preferably be arranged in correspondence with the arrangement of recesses within the main body and / or the arrangement of recesses within the first part of the positioning element. In this case, the guide element may be designed / configured in forms such as disc-shaped or cylindrical in particular. 【0018】 In the context of easily transporting or positioning substrates during processing, it is even more advantageous that at least one connecting element may be provided for connecting the holding system to a moving unit, the connecting element may preferably be cylindrical and in particular may be directly positioned on the body. In this case, the connecting element may preferably be designed / configured in the form of a flange, which is connected to the body of the holding system in the manner of material joining, pressure fitting, or shape fitting. The connecting element may thus advantageously be positioned in a gripping area that can produce translational and rotational motion by gripping the holding system with the moving unit. To ensure easy connection to the moving unit, it is even more advantageous that the connecting element may include connecting means / elements such as a sleeve, hook, thread, or holding magnet that connect to the moving unit. In addition to the first connecting element, further connecting elements, preferably flange-like designs / configurations, may be provided to be positioned in the gripping area. 【0019】 To enable non-destructive, contamination-free transport of the substrate to be processed, it may be even more advantageous to provide at least one covering means / element for covering the machining area, and this covering means / element preferably in the form of a cover cap or the like. 【0020】 To the extent that the holding system allows for a structurally simple design / configuration of the substrate while securely fixing it, the fixing elements arranged within the holding system may, advantageously, have an upper circular portion for penetrating the substrate, and / or a lower circular portion located opposite the upper portion for penetrating the substrate, and / or a fixing region located between the upper and lower portions for pressure-fitting the substrate, wherein the fixing region is preferably formed in a waist shape, and in particular has a waist portion located between the upper and lower portions, so that the diameter of the fixing region decreases from the upper portion towards the waist, and the diameter of the fixing region decreases from the lower portion towards the waist. The fixing elements may preferably be provided for fixing substrates to be machined, particularly elongated substrates, such as sophisticated tools to be machined, such as shank tools or milling tools, drill heads, and especially preferably for pressure-fitting. The term "partially circular" is intended to be understood more broadly, particularly in the context of the present invention, and is therefore understood to include not only a portion of an ideal circle, but also a non-ideal circle, such as a compressed or stretched circle. In the context of the present invention, the term pressure-fit fastening is more preferably understood to mean clamping. The term pressure-fit fastening may be understood more broadly in the context of the present invention, and therefore may be understood to include at least partially shape-fit type connections. Such embodiments of the fastening elements according to the present invention allow for greater flexibility, particularly with respect to the diameter of the substrate to be accommodated. In this regard, the fastening elements may also be designed to be particularly interchangeable and thus adaptable in a targeted manner with respect to the diameter or shape of the substrate to be processed. 【0021】 Within the limits of the most compact design / configuration possible and the maximum utilization of fixing force, the waist of the fixing element can, advantageously, be positioned centrally between the upper and lower portions. In the context of the present invention, central positioning is understood to mean, in particular, that the waist is at the same distance from the upper and lower portions. The waist, or constricted portion, in this case preferably has the same diameter along its longitudinal spread. Here, the waist, or constricted region, may preferably represent the center of the fixing area for fixing the substrate. The constricted region may cover a smaller or narrower portion of the fixing element, or a larger portion as well. 【0022】 To enable flexible pressure-fitting and fixing of substrates of different diameters, according to the present invention, in particular, recesses may be provided that are arranged longitudinally along the fixing element, and the recesses may be able to completely separate the fixing element along its longitudinal spread, thereby completely separating both the upper and lower portions as well as the fixing area, in particular, the width of the recess may be minimal along the waist and increase in the direction of the upper and lower portions. Preferably, the recess is very large in this case so that the two ends separated by the recess will inevitably exert force on the fixing element when they come into contact with each other. It is also conceivable that the recess cuts only a portion of the fixing element along its longitudinal spread. 【0023】 With respect to precisely adjustable and adaptable forces for pressure-fitting and securing the substrate, the fixing area of ​​the fixing element may further have multiple fins, and an inner recess may preferably be located between two fins in any case. The length and width of the fins may preferably be formed in a manner equivalent to the length and width of the recess located between the two fins. Advantageously, the width of the fins can be made slightly larger than the width of the recess, and in particular, at least 15% larger than the width of the recess. 【0024】 Here, the number of thin plates correlates with the diameter along the waist, and it is conceivable that at least two thin plates, and more preferably at least three thin plates, are provided per millimeter of the diameter along the waist. 【0025】 In the context of arranging the substrate compactly and at the same time effectively fixing it by press fitting, furthermore, the diameter along the waist portion can be less than at least 80% of the diameter along the upper portion and / or the lower portion, preferably less than at least 75% of the diameter along the upper portion and / or the lower portion, and particularly can be less than at least 70% of the diameter along the upper portion and / or the lower portion. 【0026】 Here, the diameter along the waist portion can be from 2 cm to 0.2 mm, preferably from 1 cm to 0.5 mm, and particularly can be from 0.5 cm to 1 mm. In the context of accurately conforming to a specific substrate, the diameter along the waist portion can also be, for example, 2.34 mm, 2.5 mm, 3 mm, 4 mm, 5 mm or 6 mm. 【0027】 Regarding ensuring consistent fixing characteristics even under different machining conditions, advantageously, the fixing element can be formed at least partially of a heat-resistant and corrosion-resistant material, preferably at least partially of a nickel-chromium alloy, such as Nimonic® (e.g., Nimonic 90®) or Inconel® (e.g., Inconel X750®). In the context of the present invention, the heat-resistant material is understood to particularly mean a material having a melting point exceeding 1200 °C. Furthermore, this material is preferably 10 -6It can be stabilized up to at least 650 °C at a pressure below bar, preferably it can be used even at extremely low pressures and the temperature is stable. A corrosion-resistant material particularly means a material with a corrosion rate of less than 0.001 mm / year under standard conditions. Particularly with respect to materials resistant to temperature and corrosion, in addition to nickel and chromium, the material may preferably further contain, as trace components, aluminum and / or titanium and / or iron and / or molybdenum and / or niobium and / or cobalt and / or manganese and / or copper and / or aluminum and / or silicon and / or carbon and / or sulfur and / or phosphorus and / or boron. Here, the fixing element may be entirely made of a heat-resistant and corrosion-resistant material or may only be provided with a heat-resistant and corrosion-resistant coating. 【0028】 Regarding safe, stable but at the same time non-destructive press-fit fixing, according to the present invention, particularly, the fixing element can be designed / configured such that the substrate can be fixed with a peeling force of 2 to 6.1 N, preferably with a peeling force of 2.5 to 3.5 N. 【0029】 Regarding structurally simply and surface-friendly fixing of the substrate, according to the present invention, further, the fixing element can be formed in the form of a spring element. In the context of the present invention, a spring element is understood to particularly mean an element having at least partially an elastic effect. The elastic effect can preferably be exerted in the waist region. 【0030】 A further object of the present invention is to provide a method for processing a substrate, preferably using the holding system described above. Here, the method according to the present invention includes the steps of inserting a plurality of substrates into the holding system and positioning the substrates within the covering region and the machining region of the holding system by positioning elements. Therefore, the method according to the present invention has the same advantages as already described in detail with respect to the holding system according to the present invention. The processing of the target substrate can preferably take the form of a surface treatment, such as coating or the like. < Regarding effective processing, in particular, the substrate is rotatable at least 90°, preferably at least 180°, during processing. By ensuring fixation via fixing elements, this enables, for example, "overhead storage" of the substrate during processing. 【0032】 Further advantages, features, and details of the present invention will become apparent from the following description, which details embodiments of the invention with reference to the drawings. In this regard, each of the features mentioned in the claims and description may be essential to the invention individually or in any combination. [Brief explanation of the drawing] 【0033】 [Figure 1(a)] This is a schematic front view showing a fixing element according to the present invention for fixing a substrate, used in a holding system for a surface treatment system. [Figure 1(b)] This is a schematic rear view showing a fixing element according to the present invention for fixing a substrate, used in a holding system for a surface treatment system. [Figure 2] This is a schematic plan view showing a fixing element according to the present invention for fixing a substrate, used in a holding system used in a surface treatment system. [Figure 3] This is a schematic cross-sectional view showing the holding system according to the present invention for holding a substrate. [Figure 4] This is a schematic spatial representation of the holding system according to the present invention for holding a substrate. [Figure 5] This is a schematic diagram of the individual steps of the method for processing a substrate according to the present invention. [Modes for carrying out the invention] 【0034】 Figures 1a and 1b are schematic front view (a) and rear view (b) of the fixing element 2 according to the present invention, used in the holding system 1 to fix the substrate 12. 【0035】 The fixing element 2 includes an upper semicircular portion 4 for penetrating the substrate 12, a lower partially circular portion 6 located on the opposite side of the upper semicircular portion 4 for penetrating the substrate 12, and a fixing region 8 located between the upper portion 4 and the lower portion 6 for pressure-fitting and fixing the substrate 12. In this case, the fixing region 8 is formed in the shape of a waist and has a waist portion 10 located between the upper portion 4 and the lower portion 6, so that the diameter D of the fixing region 8 decreases from the upper portion 4 toward the waist portion 10, and the lower diameter D of the fixing region 8 decreases from the lower portion 6 toward the waist portion 10. 【0036】 As seen in this case, the waist portion 10 of the fixed element 2 is positioned in the center between the upper portion 4 and the lower portion 6. 【0037】 Furthermore, the fixing element 2 has a recess 14 positioned on its longitudinal side, and the recess 14 completely cuts through the fixing element 2 along its longitudinal extension L, so that the recess 14 completely cuts through both the upper portion 4 and the lower portion 6 as well as the fixing area 8. Here, the width of the recess 14 is minimum along the waist portion 10 and increases towards the upper portion 4 and the lower portion 6. 【0038】 Furthermore, it can be seen that the fixing region 8 has multiple thin plates 16, with inner recesses 18 positioned between every two thin plates 16. This structure acts, in particular, to provide precisely adjustable and adaptable forces for pressure-fitting and fixing the substrate 12. The number of thin plates 16 may, in particular, correlate with the diameter D along the waist 10. 【0039】 Figure 2 is a schematic plan view showing the fixing element 2 according to the present invention, which is used in the holding system 1 to fix the substrate 12. 【0040】 This top view of the upper circular portion 4 for penetrating the substrate 12 clearly shows the recess 14 and the individual thin plates 16 having an inner recess 18 positioned between them. Furthermore, it can be seen that the inner diameter D along the waist portion 10 is considerably smaller than the diameter D along the opening of the upper semicircular portion 4. 【0041】 Figure 3 is a schematic cross-sectional view showing the holding system 1 according to the present invention for holding the substrate 12. 【0042】 Here, the holding system 1 according to the present invention has a covering area 20 and includes a plurality of fixing elements 2 as described above, a main body 24 positioned within the covering area 20 to receive the fixing elements 2, and a positioning element 26 for adjusting the covering area 20 and the machining area 22. Here, a plurality of substrates 12 can be fixed by the fixing elements 2 and processed within the machining area 22. 【0043】 As seen in this case, the covering area 20 has a greater longitudinal extension than the machining area 22. It is understood that the covering area 20 may also have a smaller longitudinal extension than the machining area 22. Furthermore, the main body 24 has a cylindrical shape, and in this case, this cylindrical shape has approximately the same length as the fixed element 2 located inside the main body 24. 【0044】 The positioning element 26 further includes a disc-shaped first portion 26a for separating the covering area 20 from the machining area 22, and a bolt-shaped second portion 26b for positioning the disc-shaped first portion 26a. Furthermore, the positioning element 26 includes a plurality of recesses 28 for penetrating each substrate 12, the recesses 28 being located in this case in the disc-shaped first portion 26a. 【0045】 Furthermore, as seen in this case, the holding system 1 is located on the rotation axis D X It includes an anti-rotation element 30 to prevent unintended rotation around the substrate 12, the anti-rotation element 30 being fixedly connected to the main body 24 and the positioning element 26 to prevent unintended rotation of the positioning element 26 during processing of the substrate 12. 【0046】 Furthermore, the holding system 1 includes a guide element 32 for guiding the substrate 12, which in this case is positioned between the main body 24 and the disc-shaped first portion 26a of the positioning element 26, and in both cases has a plurality of recesses 28 for penetrating the substrate 12. Here, the recesses 28 are positioned in correspondence with the arrangement of recesses 28 within the main body 24 and the arrangement of recesses 28 within the disc-shaped first portion 26a of the positioning element 26. 【0047】 Figure 4 is a schematic spatial representation of the holding system 1 according to the present invention for holding a substrate 12. In this spatial representation, the arrangement of the connecting element 34 for connecting the holding system 1 to the moving unit 36 ​​can also be seen. In this case, the connecting element 34 is also cylindrical in shape and is positioned directly on the body 24 of the holding system 1. The holding system 1 can be advantageously gripped by the moving unit 36 ​​via the connecting element 34, generating translational and rotational motion to enable easy transport or processing of the substrate 12 placed inside the holding system 1. 【0048】 Figure 5 shows a schematic diagram of the individual steps / stages of the method for processing the substrate 12 according to the present invention. 【0049】 Here, the method for processing the substrate 12 includes, in addition to the steps of inserting a plurality of substrates 12 into the holding system 1 (step 40) and positioning the substrates within the covering area 20 and machining area 22 of the holding system 1 using positioning elements (step 42), an additional optional step / stage 44 for processing the substrate 12 within the machining area 22 and a step / stage 46 for post-processing the substrate 12. Possible processing methods may preferably include surface treatment methods such as polishing, chemical, thermal, electrolytic, or similar surface treatment methods. 【0050】 In particular, according to the method of the present invention, the substrate 12 is rotatable by at least 90°, preferably at least 180°, during processing. 【0051】 The holding system 1 according to the present invention and the method of using the holding system 1 according to the present invention make it possible to fix a substrate 12, in particular a workpiece such as a tool to be machined, in a simple manner. This fixing allows for particularly simple transport, and especially simple handling, of the substrate 12 before, during, and after machining operations. This fixing also allows the substrate 12 to be handled during machining operations, for example, by rotating or turning it upside down. [Explanation of symbols] 【0052】 List of reference symbols 1. Holding system 2 Fixed elements 4. Upper semicircular section 6. Lower semicircular section 8 Fixed area 10 Lower back 12 circuit boards 14 recess 16 thin plate 18 Inner recess 20 Covered area 22 Machining area 24 Main unit 26 Positioning elements 26a Disc-shaped first part 26b Bolt-shaped second part 28 Recess for penetrating the substrate 30 Anti-rotation element 32 Guidance Elements 34 connection elements 36 Mobile Units 40 Insert multiple circuit boards 42 Position the substrate 44 Processing the substrate 46. ​​Post-processing the circuit board. D diameter L: Longitudinal spread H Height D x Rotation axis

Claims

[Claim 1] A holding system (1) for holding the substrate (12), which is used in a surface treatment system for machining a substrate (12) having an elongated shape extending in the longitudinal direction, The holding system (1) includes a covering area (20) and a machining area (22), The covering region (20) is configured to shield a portion of the substrate (12) so that the portion of the substrate (12) is not exposed to the machining process. With the remaining portion of the substrate (12) protruding into the machining area (22), the machining process is performed on the remaining portion of the substrate (12). The holding system (1) is - Multiple fixed elements (2), - A body (24) having a plurality of bores arranged adjacent to each other to receive a plurality of the aforementioned fixing elements (2), and positioned within the covering region (20), - A positioning element (26) having a disc-shaped first portion (26a), the disc-shaped first portion (26a) adjusting the covering area (20) and the machining area (22) by relative movement of the disc-shaped first portion (26a) with respect to the main body (24), wherein the fixing element (2) has a fixing area (8), the fixing area (8) has a diameter (D) that changes with respect to the longitudinal spread of the fixing element (2), the changing diameter (D) in all cases decreasing along the longitudinal spread (L) of the fixing element (2) from the outside toward the center of the fixing element (2), and the diameter (D) is smallest at the center of the fixing area (8), - A holding system in which multiple substrates (12) are fixed by the fixing element (2) and can be processed within the machining area (22). [Claim 2] The holding system (1) according to claim 1, characterized in that the covering area (20) has a greater longitudinal extension than the machining area (22). [Claim 3] The holding system (1) according to claim 1 or 2, characterized in that the main body (24) is cylindrical, and the height (H) of the cylinder is at least the same length as the fixing element (2) disposed within the main body (24). [Claim 4] The holding system (1) according to any one of claims 1 to 3, characterized in that the positioning element (26) includes a disc-shaped first portion (26a) for separating the covering area (20) from the machining area (22) and a bolt-shaped second portion (26b) for positioning the disc-shaped first portion (26a). [Claim 5] The holding system (1) according to any one of claims 1 to 4, characterized in that the first portion (26a) and the second portion (26b) of the positioning element (26) are of an integrated design. [Claim 6] The holding system (1) according to any one of claims 1 to 5, characterized in that the positioning element (26) has a plurality of recesses (28) for penetrating each substrate (12), and the recesses (28) are arranged in the disc-shaped first portion (26a). [Claim 7] Rotation axis (D x A holding system (1) according to any one of claims 1 to 6, characterized in that a rotation prevention element (30) is provided to prevent unintended rotation around the positioning element (26), and the rotation prevention element (30) can be fixedly connected to the main body (24) and the positioning element (26) to prevent unintended rotation of the positioning element (26). [Claim 8] The holding system (1) according to claim 7, characterized in that the anti-rotation element (30) is formed in the form of a fixing pin, the fixing pin is fixed at its first end by the fixing element (2) in the main body (24) to prevent unintended rotation of the positioning element (26), and is connected to the first portion (26a) of the positioning element (26) via its other end. [Claim 9] The holding system (1) according to any one of claims 1 to 8, characterized in that at least one guide element (32) for guiding the substrate (12) is provided, and the guide element (32) is positioned between the main body (24) and the disc-shaped first portion (26a) of the positioning element (26). [Claim 10] The holding system (1) according to claim 9, wherein the guide element (32) has a plurality of through holes (28) for penetrating each of the substrates (12), and the through holes (28) are arranged in correspondence with the arrangement of the bores in the main body (24) and / or the arrangement of the recesses (28) in the disc-shaped first portion (26a) of the positioning element (26). [Claim 11] The holding system (1) according to any one of claims 1 to 10, wherein at least one connecting element (34) is provided, which is connected to a moving unit (36) for moving the substrate (12) by generating translational and rotational motion of the holding system (1), the connecting element (34) has a cylindrical configuration, and the connecting element (34) is directly positioned on the main body (24). [Claim 12] The holding system (1) according to any one of claims 1 to 11, characterized in that at least one covering element is provided for covering the machining area (22), and the covering element is in the form of a cover cap. [Claim 13] The holding system (1) according to any one of claims 1 to 12, characterized in that the fixing element (2) has a fixing region (8) for pressure-fitting and fixing the substrate (12), and the fixing region (8) is configured in the form of a locally limited sub-region. [Claim 14] The holding system (1) according to any one of claims 1 to 13, characterized in that, when the axis extending along the longitudinal direction of the elongated substrate (12) is defined inside the fixing element (2), the fixing element (2) is configured such that the substrate (12) can rotate at least 90° around the axis by pressure-fitting and fixing by the fixing element (2) during processing. [Claim 15] The aforementioned fixed element (2) is The upper portion (4) has a partially circular shape for penetrating the substrate (12), A lower portion (6) having a partially circular shape is positioned on the opposite side of the upper portion (4) for penetrating the substrate (12), The substrate (12) has a fixing region (8) positioned between the upper portion and the lower portion (4, 6) for pressure-fitting and fixing, The holding system (1) according to claim 13, characterized in that the fixing region (8) is formed in the shape of a waist and has a waist portion (10) positioned between the upper portion and the lower portions (4, 6), so that the diameter (D) of the fixing region (8) decreases from the upper portion (4) toward the waist portion (10), and the diameter (D) of the fixing region (8) decreases from the lower portion (6) toward the waist portion (10). [Claim 16] The holding system (1) according to claim 15, characterized in that the waist portion (10) of the fixing element is positioned in the center between the upper portion and the lower portions (4, 6). [Claim 17] The retaining system (1) according to claim 15 or 16, characterized in that a cutting portion (14) is provided along the fixed element (2) and is arranged in the longitudinal direction, and the cutting portion (14) completely cuts the fixed element (2) along the longitudinal spread (L), so that the cutting portion (14) completely cuts both the upper portion and the lower portion (4, 6) and the fixed area (8), and the width of the cutting portion (14) is minimum along the waist portion (10) and increases in the direction of the upper portion and the lower portion (4, 6). [Claim 18] The holding system (1) according to any one of claims 15 to 17, characterized in that the fixing region (8) of the fixing element (2) has a plurality of thin plates (16), and the inner recess (18) is in any case positioned between two thin plates (16). [Claim 19] The holding system (1) according to claim 18, characterized in that the number of the plurality of thin plates (16) correlates with the diameter (D) along the waist portion (10), and at least two thin plates (16) are provided for every 1 mm of the diameter (D) along the waist portion (10). [Claim 20] The holding system (1) according to any one of claims 15 to 19, characterized in that the diameter (D) along the waist portion (10) is less than 80% of the diameter (D) along the upper portion and / or the lower portion (4, 6). [Claim 21] The holding system (1) according to any one of claims 15 to 20, characterized in that the diameter (D) along the waist portion (10) is 2 cm to 0.2 mm. [Claim 22] The holding system (1) according to any one of claims 15 to 21, characterized in that the fixing element (2) is formed at least partially of a heat-resistant and corrosion-resistant material. [Claim 23] The holding system (1) according to any one of claims 15 to 22, characterized in that the fixing element (2) is designed so that the substrate (12) can be fixed with a peeling force of 2 to 6.1 N. [Claim 24] The holding system (1) according to any one of claims 15 to 23, characterized in that the fixing element (2) is formed in the form of a spring element. [Claim 25] A method for processing a substrate (12) using a holding system (1) according to any one of claims 1 to 24, - Step (40) of inserting multiple substrates (12) into the holding system (1), A method comprising the step (42) of positioning the substrate (12) within the covering area and machining area (20, 22) of the holding system (1) using a positioning element (26). [Claim 26] The method according to claim 25, characterized in that the substrate (12) is rotated by at least 90° during processing.