Imaging device
The imaging device addresses dew condensation by heating and airflow management, ensuring clear images across varying temperatures and humidities through a heater and fan system, while cooling sensitive components.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- 株式会社KDW
- Filing Date
- 2022-03-24
- Publication Date
- 2026-06-17
AI Technical Summary
In-vehicle monitoring cameras face dew condensation issues on the protective glass due to temperature differences, leading to unclear captured images in high-temperature environments.
An imaging device with a heater to maintain the protective substrate at a high temperature, combined with a fan to circulate air and a light-shielding member to block external light, ensuring consistent airflow and preventing condensation, while cooling the imaging unit and light-emitting module.
The device maintains a clear image capture by suppressing condensation and cooling the imaging components, allowing operation across wide temperature and humidity ranges without malfunction.
Smart Images
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Abstract
Description
Technical Field
[0001] The present invention relates to an imaging device.
Background Art
[0002] An in-vehicle monitoring camera including a camera, a housing that houses the camera, and a protective glass provided on the front surface of the housing has been proposed (see, for example, Patent Document 1). This in-vehicle monitoring camera is used while being attached to the outside of the vehicle body.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] By the way, this type of monitoring camera may be used in an environment where the temperature is relatively high. In this case, if the temperature on the front surface side of the protective glass becomes lower than the temperature on the back surface side, dew condensation may occur on the back surface side, and there is a risk that a clear captured image of the subject cannot be obtained.
[0005] The present invention has been made in view of the above circumstances, and an object thereof is to provide an imaging device that can obtain a clear captured image of a subject regardless of the temperature environment in which it is used.
Means for Solving the Problems
[0006] To achieve the above object, an imaging device according to the present invention includes an imaging unit, a housing that is cylindrical and in which the imaging unit is disposed inside, a protective substrate that has translucency and is disposed so as to close one end side in the cylinder axis direction of the housing and protects the imaging unit, a heater that heats the protective substrate, A cylindrical member is provided, which is cylindrical and positioned on the other end of the housing in the cylindrical axis direction of the housing, with its cylindrical axis direction aligned with the cylindrical axis direction of the housing, and the imaging portion is located inside the housing. A fan is positioned on the opposite side of the cylindrical member from the imaging unit side, and generates an airflow that flows from the other end of the housing in the cylindrical axis direction toward the inside of the cylindrical member. It is cylindrical and is positioned to cover the side of the imaging unit on the side of the protective substrate, and on the side of the imaging unit A light-shielding member that blocks light incident on the imaging unit from the side, It is annular in shape and surrounds the outside of the light-shielding member on the inside of the end portion on one side of the housing. A circuit board arranged in such a manner, and the protective board mounted on the protective board side of the circuit board A light-emitting module having at least one light-emitting part that emits light toward the substrate side, Equipped with, When viewed from the direction of the cylindrical member in the direction of the cylindrical axis, only a portion of the opening on the imaging part side of the cylindrical member overlaps with the imaging part, and a gap is formed between the side wall of the housing and the side wall of the cylindrical member. , At least one notch is provided around the periphery of the circuit board. . [Effects of the Invention]
[0007] According to the present invention, a heater is provided to heat the protective substrate, and when viewed from the direction of the cylindrical axis of the cylindrical member, only a portion of the opening on the imaging unit side of the cylindrical member overlaps with the imaging unit, and a gap is formed between the side wall of the housing and the side wall of the cylindrical member. As a result, while the protective substrate is heated by the heater, the gas sent from the fan passes through the inside of the cylindrical member, through the portion of the protective substrate that is not covered by the imaging unit at the opening on the imaging unit side of the cylindrical member, and strikes the portion of the protective substrate that is exposed to the inside of the housing. The gas that hits the protective substrate and is heated by the protective substrate does not stagnate inside the housing but flows to the other end of the housing through the gap formed between the side wall of the housing and the side wall of the cylindrical member. As a result, the protective substrate is maintained at a relatively high temperature, and fresh gas sent from the fan is constantly supplied to the portion of the protective substrate that is exposed to the inside of the housing, so that condensation on the portion of the protective substrate that is exposed to the inside of the housing can be suppressed. Therefore, a clear image of the subject can be obtained regardless of the environment in which it is used. Furthermore, since the imaging unit is cooled by the gas that passes from the fan through the inside of the cylindrical member and hits the imaging unit, it is possible to suppress malfunctions of the imaging unit due to an increase in its temperature. [Brief explanation of the drawing]
[0008] [Figure 1] This is an exploded perspective view of the imaging device according to the embodiment. [Figure 2] This is a cross-sectional view of an imaging device according to an embodiment. [Figure 3] (A) is a plan view of the protective substrate, resin layer, and cover member according to the embodiment, and (B) is a cross-sectional view of (A) along line AA. [Figure 4] (A) is a plan view showing a part of the imaging device according to the embodiment, and (B) is a plan view showing a part of the imaging device according to the embodiment. [Figure 5] This is a diagram illustrating the temperature measurement position in the imaging device according to the embodiment. [Modes for carrying out the invention]
[0009] The imaging device according to an embodiment of the present invention will now be described with reference to the drawings. The imaging device according to this embodiment can be used in an environment in which only the temperature outside the housing changes over a wide temperature range or a wide humidity range, and the temperature inside the housing is at room temperature (5°C to 30°C). The environment outside the housing is, for example, an environment in which the temperature is within a temperature range from below freezing to a relatively high temperature (-40°C to 150°C), or an environment in which the temperature is within a temperature range of 0°C to less than 100°C and the humidity is within a humidity range of 0% to 98%.
[0010] As shown in Figures 1 and 2, the imaging device 1 according to this embodiment comprises an imaging unit 20, a housing 11, a protective substrate 31, a cylindrical member 12, and a fan 60. In Figures 1 and 2, the imaging direction of the imaging unit 20 is set to the +Y direction. In the following description, the imaging direction of the imaging unit 20 will be appropriately set to the +Y direction. The imaging device 1 also comprises a light-shielding member 131, a support member 132, a frame 14, a packing 16, and a light-emitting module 40. The housing 11 is a long cylindrical shape with the imaging unit 20 positioned inside.
[0011] The imaging unit 20 includes a lens group (not shown), a lens barrel 26 that holds the lens group, and a control unit 21. The control unit 21 includes an image sensor (not shown) on which image light transmitted through the lens group is formed, and a control board (not shown) that controls the operation of the image sensor. The image sensor is, for example, a CMOS image sensor or a CCD image sensor. The control unit 21 also includes an interface 23 for receiving control signals from the outside and transmitting the image signal obtained by imaging with the image sensor to the outside, and a screw 25 and a long cylindrical spacer 24 for fixing the control unit 21 to the support member 132. The control unit 21 also includes a drive circuit (not shown) for driving the light-emitting module 40 to light up, and a lighting control module (not shown) for controlling the drive circuit. The drive circuit is connected to the light-emitting module 40 via conductive wires (not shown).
[0012] The light-shielding member 131 is cylindrical and positioned inside the housing 11 so as to cover the side of the imaging unit 20 on the side facing the protective substrate 31, thereby blocking light incident on the imaging unit 20 from the side. A groove 131a is formed around the entire circumference of the +Y direction end of the light-shielding member 131. The packing 16 is annular and is positioned around the entire circumference of the +Y direction end of the light-shielding member 131, in contact with the protective substrate 31. The packing 16 is made of elastomer, rubber, or the like and is fitted inside the groove 131a of the light-shielding member 131.
[0013] The support member 132 is formed continuously and integrally with a light-shielding member 131 arranged inside, the outer diameter of which is shorter than the inner diameter of the support member 132. Together with the light-shielding member 131, they constitute one support unit 13, and support the frame body 14 and the imaging unit 20 arranged inside the light-shielding member 131. The support member 132 has a cylindrical support member main body 1321 and an outer flange portion 1322 protruding outward from the end portion on the +Y direction side of the support member main body 1321. Further, on the support member main body 1321, a rib 1323 is provided with a screw hole (not shown) through which the tip of the screw 25 of the imaging unit 20 is screwed into the end face on the -Y direction side protruding inside the support member main body 1321. This support member 132 is fixed to the housing 11 with the end face on the -Y direction side of the outer flange portion 1322 abutting against the end face on the +Y direction side of the housing 11.
[0014] The frame body 14 has a frame body main body 141 and tongue pieces 142 protruding outward from two locations sandwiching the center of the frame body main body 141 and having through holes 142a formed in the central portion. This frame body 14 is arranged in a state of abutting against the peripheral portion of the protection substrate 31 from the +Y direction side of the protection substrate 31, and is fixed to the support member 132 by screws 15 inserted through the through holes 142a formed in the tongue pieces 142. Thereby, the frame body 14 is fixed to the support member 132 while holding the peripheral portion of the protection substrate 31.
[0015] The protective substrate 31 has translucency and is disposed to block one end side in the cylinder axis direction of the housing 11, that is, the +Y direction side, to protect the imaging unit 20. The protective substrate 31 is formed in a plate shape from an insulator material having electrical insulation and translucency. As the insulator material, for example, transparent glass can be adopted. Further, as the transparent glass, for example, TEMPAX-Float (registered trademark) glass can be adopted. The thickness of the protective substrate 31 is set to about 3 mm, for example. The distance between the protective substrate 31 and the imaging unit 20 is set to 3 mm or more. Also, as shown in FIG. 3(A), electrode lands (not shown) for soldering conductive wires (not shown) for supplying power to the heater 32 are disposed at two locations on the peripheral portion of the protective substrate 31. Further, two pins 36 that are elongated and extend to the -Y direction side are protruding at two locations on the peripheral portion of the protective substrate 31.
[0016] The heater 32 is long and has a plurality of conductive patterns 321 disposed to extend along the X-axis direction on the -Y direction side of the protective substrate 31, and two electrodes 322 connected to both ends of each of the plurality of conductive patterns 321. Each of the conductive patterns 321 is a transparent conductive film formed from, for example, ITO (Indium Tin Oxide). The electrodes 322 are formed from a metal that can conduct electricity to the conductive pattern 321 such as Ag, for example, and a part thereof is continuous with the aforementioned electrode land. The thickness of the conductive pattern 321 is set to about 60 nm, for example. Also, the electrodes 322 are electrically connected to a heater power source (not shown) via a conductive wire (not shown). Then, when current is supplied from the heater power source to the conductive pattern 321 via the electrodes 322, the conductive pattern 321 generates heat. Here, the heater 32 is set to heat until the temperature rise value with respect to the ambient temperature of the protective substrate 31 reaches +40°C to +50°C. Note that an insulating member (not shown) made of a material having electrical insulation may be provided outside the portion of the protective substrate 31 where the electrodes 322 are formed.
[0017] The resin layer 34 is formed from transparent silicone resin and, as shown in Figure 3(B), is provided on the -Y direction side of the protective substrate 31 so as to cover the conductive pattern 321. The thickness of the resin layer 34 is not particularly limited as long as it is thick enough to ensure waterproofing, and can be set to a thickness of 0.5 mm or more, for example. The cover member 35 is formed from transparent glass in a disc shape and is provided so as to cover the -Y direction side of the resin layer 34. The outer diameter of the cover member 35 is set to be shorter than the outer diameter of the end of the light-shielding member 131 on the +Y direction side, so that the periphery of the cover member 35 is contained inside the light-shielding member 131 when viewed from the Y-axis direction. The thickness of the cover member 35 is set to be between 0.3 mm and 0.7 mm. If the thickness of the cover member 35 is greater than 0.7 mm, the heat from the heater 32 may not be sufficiently transmitted to the vicinity of the -Y direction side surface of the cover member 35, and condensation may occur on the -Y direction side surface of the cover member 35. Therefore, it is preferable to set the thickness of the cover member 35 to at least 0.7 mm or less.
[0018] As shown in Figure 4(A), the light-emitting module 40 has an annular circuit board 41 and a plurality of (eight in Figure 4(A)) light-emitting parts 42 mounted on the circuit board 41 side of the protective substrate 31, i.e., the +Y direction side, which emit light toward the protective substrate 31. The circuit board 41 is an insulating substrate such as an epoxy substrate or a phenolic substrate, and has conductive patterns (not shown) formed on it for supplying power to each of the plurality of light-emitting parts 42. The circuit board 41 is arranged inside the +Y direction end of the housing 11 so as to surround the outside of the light-shielding member 131. The circuit board 41 is also provided with four notches 41a. The plurality of light-emitting parts 42 have, for example, LED elements that emit blue-violet light and wavelength conversion members that convert the blue-violet light into light of a different wavelength, and emit white light, and are mounted on the circuit board 41 along the circumferential direction of the circuit board 41. Each of the multiple light-emitting units 42 is a chip LED (Light Emitting Diode) with a relatively high heat resistance temperature, and emits light in the imaging direction of the imaging unit 20, i.e., in the +Y direction.
[0019] As shown in Figures 1 and 2, the cylindrical member 12 is rectangular in shape and is positioned on the other end of the housing 11 in the cylindrical axis direction, i.e., on the -Y direction side, relative to the imaging unit 20 inside the housing 11, with its cylindrical axis direction aligned with the cylindrical axis direction of the housing 11. When viewed from the Y-axis direction, only a portion of the opening 12a on the +Y direction side of the cylindrical member 12 overlaps with the imaging unit 20. Furthermore, a gap S1 is formed between the side wall of the housing 11 and the side wall of the cylindrical member 12.
[0020] The fan 60 is positioned on the side of the cylindrical member 12 opposite to the imaging unit 20, i.e., on the -Y direction side, and generates an airflow that flows from the -Y direction side into the inside of the cylindrical member 12. The fan 60 is, for example, a DC fan driven by a DC motor.
[0021] In the imaging device 1 according to this embodiment, the fan 60 generates an airflow that flows inside the cylindrical member 12 in the +Y direction, as shown by arrow AR1 in Figure 5. A portion of the air that flows out from the +Y end of the cylindrical member 12 then flows around the side of the imaging unit 20 and into the light-shielding member 131, as shown by arrow AR2, and hits the inside of the light-shielding member 131 on the -Y side of the protective substrate 31. At this time, a portion of the air that flows out from the +Y end of the cylindrical member 12 flows into the inside of the light-shielding member 131 through the gap S2 between the imaging unit 20 and the inside of the light-shielding member 131 when viewed from the Y-axis direction as shown in Figure 4(B). Furthermore, as shown in Figure 5, some of the air flowing out from the +Y direction end of the cylindrical member 12 flows through the four notches 41a provided in the circuit board 41 of the light-emitting module 40, as indicated by arrow AR3, into the area between the housing 11 and the light-shielding member 131, and strikes the outside of the light-shielding member 131 on the -Y direction side of the protective substrate 31. The air that strikes the -Y direction side of the protective substrate 31 then recirculates again through the gap S2 between the inside of the light-shielding member 131 and the imaging unit 20, or through the notches 41a of the circuit board 41, to the +Y direction side of the cylindrical member 12. The air that has recirculated to the +Y direction side of the cylindrical member 12 then flows to the -Y direction side of the housing 11 through the air gap S1 formed between the housing 11 and the cylindrical member 12, as indicated by arrow AR4 in Figure 5.
[0022] Next, we will describe the results of measuring the temperature inside the constant temperature chamber of the imaging device 1 according to this embodiment, when the protective substrate 31 is mounted in the constant temperature chamber with its +Y direction side exposed to the chamber, and the temperature inside the chamber of the protective substrate 31 is changed, as well as the temperature inside and outside the light-shielding member 131 on the housing 11 side of the protective substrate 31. Here, the distance between the protective substrate 31 and the imaging unit 20 was set to 3 mm. The results when the set temperature inside the constant temperature chamber was -40°C are shown in Table 1 below.
[0023] [Table 1]
[0024] From the results in Table 1, it was found that even when the set temperature inside the constant temperature chamber was -40°C, the inside of the light-shielding member 131 on the housing 11 side of the protective substrate 31 was maintained at a higher temperature than the temperature outside the constant temperature chamber, and condensation in this area could be suppressed. From this, it can be seen that condensation on the protective substrate 31 can be suppressed in at least the area that falls within the field of view of the imaging unit 30. Next, the results when the set temperature inside the constant temperature chamber was 85°C, 100°C, and 150°C are shown in Tables 2, 3, and 4 below, respectively.
[0025] [Table 2]
[0026] [Table 3]
[0027] [Table 4]
[0028] The results in Tables 2 to 4 show that when the set temperature inside the constant temperature chamber is 85°C or higher, not only the inside of the light-shielding member 131 on the housing 11 side of the protective substrate 31 but also the outside of the light-shielding member 131 is maintained at a higher temperature than the temperature outside the constant temperature chamber, and condensation can be suppressed throughout the housing 11 side of the protective substrate 31.
[0029] Furthermore, when the noise levels generated by the three types of fans 60 with different maximum static pressures were checked at a distance of 1 m from the imaging device 1, no extremely high levels were observed in any of them. In other words, if the maximum static pressure of the fan 60 is between 40 Pa and 66 Pa, it is possible to suppress condensation in the area inside the light-shielding member 131 on the housing 11 side of the protective substrate 31, even if the temperature outside the protective substrate 31 changes within a temperature range of -40°C to 150°C, and to suppress the noise level around the imaging device 1 to some extent.
[0030] As described above, the imaging device 1 according to this embodiment is equipped with a heater 32 for heating the protective substrate 31, and when viewed from the Y-axis direction, only a portion of the opening on the +Y direction side of the cylindrical member 12 overlaps with the imaging unit 20, and a gap S1 is formed between the side wall of the housing 11 and the side wall of the cylindrical member 12. In addition, the distance between the imaging unit 20 and the protective substrate 31 is set to 3 mm or more. As a result, while the protective substrate 31 is heated by the heater 32, the air sent from the fan 60 passes inside the cylindrical member 12, through the portion of the opening 12a on the +Y direction side of the cylindrical member 12 that is not covered by the imaging unit 20, and hits the -Y direction side of the protective substrate 31. The air that hits the protective substrate 31 and is heated by the protective substrate 31 does not stagnate inside the housing 11 but flows through the gap S1 formed between the side wall of the housing 11 and the side wall of the cylindrical member 12 to the -Y direction side of the housing 11. As a result, the protective substrate 31 is maintained at a relatively high temperature, and fresh air from the fan 60 is constantly supplied to the -Y direction side of the protective substrate 31, thereby suppressing condensation on the -Y direction side of the protective substrate 31. Therefore, clear images of the subject can be obtained regardless of the environment in which it is used.
[0031] Incidentally, the lens group held in the lens barrel 26 of the imaging unit 20, the electronic components such as the image sensor of the control unit 21 of the imaging unit 20, and the light-emitting unit 42 consisting of LEDs of the light-emitting module 40 are relatively sensitive to heat, so it is required to lower their temperatures. In response to this, in the imaging device 1 according to this embodiment, the imaging unit 20 and the light-emitting module 40 are cooled by gas that passes from the fan 60 through the inside of the cylindrical member 12 and hits the imaging unit 20 and the light-emitting module 40, so it is possible to suppress failure of the imaging unit 20 and the light-emitting module 40 due to the temperature of the imaging unit 20 and the light-emitting module 40 rising.
[0032] Furthermore, the circuit board 41 of the light-emitting module 40 according to this embodiment is provided with four notches 41a. As a result, air flowing out from the +Y direction end of the cylindrical member 12 passes through the notches 41a provided in the circuit board 41 and hits the outer portion of the light-shielding member 131 on the -Y direction side of the protective substrate 31. This suppresses condensation on the outer portion of the light-shielding member 131 on the -Y direction side of the protective substrate 31, and allows light emitted from the light-emitting unit 42 to be efficiently transmitted to the +Y direction side of the protective substrate 31.
[0033] Furthermore, the maximum static pressure of the fan 60 according to this embodiment is 40 Pa or more and 66 Pa or less. This makes it possible to reduce the noise level around the imaging device 1 while suppressing condensation on the protective substrate 31.
[0034] Although embodiments of the present invention have been described above, the present invention is not limited to the configuration of the embodiments described above. For example, the cylindrical member 12 may have a cylindrical or other cylindrical shape. Also, the housing 11 may have a rectangular tubular or other cylindrical shape.
[0035] In the embodiment, an example was described in which the protective substrate 31 is formed from transparent glass, but the embodiment is not limited to this, and the protective substrate 31 may be formed from other insulating materials such as a resin or ceramic crystal material that has electrical insulating properties and light transmittance. Also, in the embodiment, an example was described in which the resin layer 34 is formed from silicone resin, but the embodiment is not limited to this, and any other resin that has electrical insulating properties, heat resistance, and light transmittance may be used. For example, the resin layer 34 may be formed from a transparent urethane resin, epoxy resin, fluororesin, etc. Furthermore, in the embodiment, an example was described in which the cover member 35 is formed from transparent glass, but the embodiment is not limited to this, and the cover member 35 may be formed from other insulating materials such as a resin or ceramic crystal material that has electrical insulating properties and light transmittance.
[0036] In the embodiment described, an example was given in which the protective substrate 31, resin layer 34, and cover member 35 are formed from transparent materials, but the embodiment is not limited to this, and they may be formed from light-transmitting materials. For example, depending on the application of the imaging device 1, they may be formed from a material that transmits only light in the infrared wavelength range.
[0037] In the embodiment described, an example was given in which the light-emitting unit 42 is a chip LED, but the invention is not limited to this, and for example, the light-emitting unit 42 may utilize other types of light-emitting elements such as organic EL (Electro-Luminescence) elements.
[0038] Although embodiments and variations of the present invention have been described above, the present invention is not limited thereto. The present invention includes embodiments and variations that are appropriately combined, and those that are appropriately modified thereto. [Industrial applicability]
[0039] The present invention is suitable as a surveillance camera used in an environment where only the temperature outside the protective substrate changes over a wide temperature range or a wide humidity range, and the temperature inside the protective substrate is at room temperature (5°C to 30°C). Here, the environment outside the protective substrate is, for example, an environment where the temperature is within a temperature range from below freezing to a relatively high temperature (-40°C to 150°C), or an environment where the temperature is within a temperature range of 0°C to less than 100°C and the humidity is within a humidity range of 0% to 98%. [Explanation of Symbols]
[0040] 1: Imaging device, 11: Housing, 12: Cylindrical member, 12a: Opening, 13: Support unit, 14: Frame, 15, 25: Screw, 16: Packing, 20: Imaging unit, 21: Control unit, 23: Interface, 24: Spacer, 26: Lens barrel, 31: Protective substrate, 32: Heater, 34: Resin layer, 35: Cover member, 36: Pin, 40: Light-emitting module, 41: Circuit board, 41a: Notch, 142a: Through hole, 42: Light-emitting unit, 60: Fan, 131: Light-shielding member, 131a: Groove, 132: Support member, 141: Frame body, 142: Tongue, 321: Conductive pattern, 322: Electrode, 1321: Support member body, 1322: Outer flange, 1323: Rib, S1: Gap, S2: Crevice
Claims
1. Imaging unit, A cylindrical housing with the imaging unit positioned inside, A protective substrate having light-transmitting properties and positioned to close one end of the housing in the cylindrical axis direction, protecting the imaging unit, A heater for heating the protective substrate, A cylindrical member is provided, which is cylindrical and positioned on the other end of the housing in the cylindrical axis direction of the housing, with its cylindrical axis direction aligned with the cylindrical axis direction of the housing, and the imaging portion is located inside the housing. A fan is positioned on the opposite side of the cylindrical member from the imaging unit side, and generates an airflow that flows from the other end of the housing in the cylindrical axis direction toward the inside of the cylindrical member. A light-shielding member is cylindrical and positioned to cover the side of the imaging unit on the side of the protective substrate, blocking light that enters the imaging unit from the side, The light-emitting module comprises a circuit board which is annular in shape and arranged to surround the outside of the light-shielding member inside the end of one end of the housing, and at least one light-emitting part which is mounted on the protective substrate side of the circuit board and emits light toward the protective substrate side, When viewed from the direction of the cylindrical axis of the cylindrical member, only a portion of the opening on the imaging portion side of the cylindrical member overlaps with the imaging portion, and a gap is formed between the side wall of the housing and the side wall of the cylindrical member. At least one notch is provided in the peripheral portion of the circuit board. Imaging device.
2. An imaging unit, A cylindrical housing with the imaging unit positioned inside, A protective substrate having light-transmitting properties and positioned to close one end of the housing in the cylindrical axis direction, protecting the imaging unit, A heater for heating the protective substrate, A cylindrical member is provided, which is cylindrical and positioned on the other end of the housing in the cylindrical axis direction of the housing, with its cylindrical axis direction aligned with the cylindrical axis direction of the housing, and the imaging portion is located inside the housing. The device comprises a fan positioned on the opposite side of the cylindrical member from the imaging unit side, which generates an airflow that flows from the other end of the housing in the cylindrical axis direction toward the inside of the cylindrical member, When viewed from the direction of the cylindrical axis of the cylindrical member, only a portion of the opening on the imaging portion side of the cylindrical member overlaps with the imaging portion, and a gap is formed between the side wall of the housing and the side wall of the cylindrical member. The distance between the imaging unit and the protective substrate is 3 mm or more. Imaging device.
3. The maximum static pressure of the aforementioned fan is between 40 Pa and 66 Pa. The imaging apparatus according to claim 1 or 2.