Method for manufacturing a radiation detector, radiation detector, radiation imaging device, and radiation imaging system

Abstract

To provide a technique advantageous for improving the quality of a radiation detector.SOLUTION: A method for manufacturing a radiation detector includes: a step of preparing a structure including a support base, a flexible base material arranged on the support base and having a principal surface including a pixel area where a plurality of pixels are arranged, a scintillator arranged to cover the pixel area, and a protective layer arranged to cover the scintillator; and a peeling step of peeling the support base from the flexible base material. The principal surface includes a peripheral area not covered by the protective layer. The method further includes, before the peeling step, a step of arranging a reinforcement member in contact with the peripheral area at a position overlapping the peripheral area and not overlapping the scintillator in orthogonal projection to the principal surface.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a radiation detector, a radiation detector, a radiation imaging device, and a radiation imaging system.

Background Art

[0002] In medical image diagnosis and non-destructive inspection, a radiation imaging device using a radiation detector including a scintillator and a plurality of pixels for detecting light converted from radiation by the scintillator is widely used. Patent Document 1 shows that a flexible base material is used for a substrate in order to reduce the weight of the radiation detector. When manufacturing a radiation detector, a flexible base material is formed on a support such as a glass substrate, and pixels, a scintillator, etc. are formed on the base material. After forming pixels, a scintillator, etc., a lightweight radiation detector can be obtained by peeling off the support.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When peeling the support from the base material, the peripheral region of the base material that is not covered by a scintillator or the like is easily bent, which may cause a decrease in yield, such as cracks in the wiring pattern arranged in the peripheral region.

[0005] The object of the present invention is to provide a technology advantageous for improving the quality of a radiation detector.

Means for Solving the Problems

[0006] In view of the above problems, a method for manufacturing a radiation detector according to an embodiment of the present invention is a method for manufacturing a radiation detector comprising: a step of preparing a structure including a support base; a flexible substrate disposed on the support base and having a main surface with a pixel region on which a plurality of pixels are disposed; a scintillator disposed to cover the pixel region; and a protective layer disposed to cover the scintillator; and a peeling step of peeling the support base from the flexible substrate, wherein the main surface includes a peripheral region not covered by the protective layer, and before the peeling step, a reinforcing member is placed in contact with the peripheral region at a position that overlaps with the peripheral region and does not overlap with the scintillator in an orthogonal projection onto the main surface. Furthermore, in the orthogonal projection onto the main surface, the reinforcing member overlaps the protective layer, and the reinforcing member is in contact with the protective layer. It is characterized by the following: [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a technology that is advantageous for improving the quality of radiation detectors. [Brief explanation of the drawing]

[0008] [Figure 1] A diagram showing an example configuration of a radiation imaging system using a radiation detector according to the present invention. [Figure 2] Figure 1 shows an example of the configuration of a radiation detector. [Figure 3] A plan view showing an example of the pixel region configuration of a radiation detector in Figure 1. [Figure 4] A flowchart showing the manufacturing method of the radiation detector in Figure 1. [Figure 5] A cross-sectional view showing the manufacturing method of the radiation detector in Figure 1. [Figure 6] A cross-sectional view showing the manufacturing method of the radiation detector in Figure 1. [Figure 7] Figure 1 shows a modified example of the reinforcing member for the radiation detector. [Figure 8] A flowchart showing the manufacturing method of the radiation detector in Figure 1. [Figure 9] A cross-sectional view showing the manufacturing method of the radiation detector in Figure 1. [Figure 10] Cross-sectional view of the radiation detector in Figure 1. [Figure 11] Flow chart showing a method for manufacturing the radiation detector of FIG. 1. [Figure 12] Cross-sectional view showing a method for manufacturing the radiation detector of FIG. 1. [Figure 13] Diagram showing a modified example of the reinforcing member of the radiation detector of FIG. 1. [Figure 14] Flow chart showing a method for manufacturing the radiation detector of FIG. 1. [Figure 15] Cross-sectional view showing a method for manufacturing the radiation detector of FIG. 1. [Figure 16] Flow chart showing a method for manufacturing the radiation detector of FIG. 1. [Figure 17] Cross-sectional view showing a method for manufacturing the radiation detector of FIG. 1. [Figure 18] Diagram showing a modified example of the reinforcing member of the radiation detector of FIG. 1.

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.

[0010] In addition, the radiation in the present invention includes, in addition to α-rays, β-rays, γ-rays, etc., which are beams formed by particles (including photons) emitted by radioactive decay, beams having energy of the same level or higher, for example, X-rays, particle beams, cosmic rays, etc.

[0011] Referring to FIGS. 1 to 18(a) and 18(b), a method for manufacturing a radiation detector according to the present embodiment will be described. Further, a radiation detector manufactured by the manufacturing method of the present embodiment, a radiation imaging apparatus using this radiation detector, and a radiation imaging system will also be described. FIG. 1 is a diagram showing a configuration example of a radiation imaging system SYS using a radiation imaging apparatus 120 including a radiation detector 100 (shown in FIGS. 2 and later) according to the present embodiment.

[0012] The radiation imaging system SYS includes a radiation imaging apparatus 120, a radiation source 130 that irradiates the radiation imaging apparatus 120 with radiation, and a system control unit 140. The radiation imaging apparatus 120 detects radiation irradiated from the radiation source 130 through a subject 110. The radiation imaging apparatus 120 includes a radiation detector 100 for detecting radiation, and may further include a signal processing unit that processes a signal output from the radiation detector 100. The signal processing unit outputs the signal detected by the radiation detector 100 to the system control unit 140, and the system control unit 140 can generate radiation image data by performing desired arithmetic processing. The radiation image data can be transmitted to, for example, a display device 141 and displayed as a radiation image. Further, the system control unit 140 controls the entire radiation imaging system SYS, such as the radiation imaging apparatus 120 and the radiation source 130. With these configurations, for example, a diagnosis of the subject 110 can be performed.

[0013] Figure 2 shows an example of the configuration of a radiation detector 100 provided in a radiation imaging device 120. The radiation detector 100 includes a flexible substrate 150 having a main surface 151 (shown in Figures 6 and later) with a pixel region 160 (shown in Figures 3 and later) on which a plurality of pixels 200 (shown in Figure 3) are arranged, a scintillator 230 (shown in Figures 6 and later) arranged to cover the pixel region 160, and a protective layer 250 arranged to cover the scintillator 230. The radiation detector 100 may also include wiring boards 170 and 180 connected to the outer edge of the flexible substrate 150 for operating the plurality of pixels arranged in the pixel region 160. For example, the wiring board 170 transfers signals output from the pixel region 160 to the signal processing unit described above. Also, for example, the wiring board 180 transfers control signals from the system control unit 140 described above to the pixels arranged in the pixel region 160.

[0014] Figure 3 is a plan view showing an example configuration of a pixel region 160. Multiple pixels 200 are arranged in an array within the pixel region 160. Each pixel 200 is equipped with a photoelectric conversion element that is sensitive to light converted from radiation by a scintillator 230. Each pixel 200 is connected to a signal readout line 210 for outputting signals from the pixel 200, and the signal readout line 210 is connected to a wiring board 170. Additionally, each pixel 200 is connected to a control line 220 for controlling the operation of the pixel 200, and the control line 220 is connected to a wiring board 180.

[0015] Next, the manufacturing method of the radiation detector 100 will be described using Figures 4 to 7. Figure 4 is a flowchart showing the manufacturing method of the radiation detector 100. Figures 5(a) to 5(e) and 6 are cross-sectional views of the manufacturing process of the radiation detector 100. In the cross-sectional views shown in each figure, including Figures 5(a) to 5(e) and 6, a control line 220 is shown on the left side, but the control line 220 may not be provided and the main surface 151 of the flexible substrate 150 may be exposed, or a signal readout line 210 may be provided on the main surface 151 of the flexible substrate 150.

[0016] First, in S400, a step is taken to prepare the structure 101 shown in Figure 5(c). The structure 101 includes a support base 190, a flexible substrate 150 disposed on the support base 190 and having a main surface 151 with a pixel region 160 on which a plurality of pixels 200 are arranged, a scintillator 230 disposed to cover the pixel region 160, and a protective layer 250 disposed to cover the scintillator 230.

[0017] The structure 101 can be prepared, for example, by the process described below. First, a flexible substrate 150 and a support base 190 for supporting the flexible substrate 150 are prepared. The support base 190 is made of a material that has high rigidity and can withstand the formation temperature of photoelectric conversion elements and switching elements such as thin-film transistors (TFTs) included in the pixels 200 arranged in the pixel region 160. For example, a transparent insulating substrate such as glass or ceramics may be used as the support base 190. The flexible substrate 150 is placed on this support base 190. The flexible substrate 150 is made of a material that can withstand the formation temperature of photoelectric conversion elements and switching elements included in the pixels 200. Furthermore, a material is selected for the flexible substrate 150 that provides impact resistance during the manufacture and use of the radiation detector 100, as well as flatness for manufacturing the radiation detector 100. For example, an organic insulating resin such as polyimide may be used as the flexible substrate 150. The support base 190 and the flexible substrate 150 may be bonded together. Alternatively, the flexible substrate 150 may be formed by, for example, applying a resin material that will become the flexible substrate 150 onto the support base 190. Next, a pixel region 160 is formed on the main surface 151 of the flexible substrate 150. Signal readout lines 210 and control lines 220 are also formed on the main surface 151 of the flexible substrate 150. A cross-section of the main surface 151 of the flexible substrate 150, where the pixel region 160, signal readout lines 210, and control lines 220 are formed, is shown in Figure 5(a).

[0018] Next, as shown in Figure 5(b), a scintillator 230 is formed to cover the pixel region 160. The scintillator 230 may be formed over a wider area than the pixel region 160, as shown in Figure 5(b). The scintillator 230 converts incident radiation into light to which a photoelectric conversion element arranged in the pixel 200 is sensitive. The scintillator 230 may, for example, convert radiation into visible light. As the scintillator 230, a mixture of phosphor particles such as gadolinium oxysulfide (GOS) and a binder, or cesium iodide (CsI) activated with thallium (Tl) can be used. When a mixture containing GOS is used as the scintillator 230, the scintillator 230 is formed by coating the mixture onto the pixel region 160 or by laminating sheets of the mixture. Furthermore, when CsI is used as the scintillator 230, the scintillator 230 may be formed by growing multiple columnar CsI crystals with a diameter of 1 to several tens of microns on the pixel region 160 to a desired thickness using a vacuum deposition method. A characteristic of CsI is that voids exist between the columnar crystals, and the sharpness is improved as light converted from radiation passes through the crystals while being reflected. When CsI is used as the scintillator 230, as described above, it is not limited to growing CsI directly on the flexible substrate 150, but CsI formed on another substrate may be bonded to the flexible substrate 150. In the configuration shown in Figure 5(b), the scintillator 230 made of CsI is formed directly on the pixel region 160.

[0019] After the formation of the scintillator 230, a protective layer 250 is formed to cover the scintillator 230, as shown in Figure 5(c). The protective layer 250 covers the scintillator 230 via an adhesive layer 240. The protective layer 250 and the adhesive layer 240 are also positioned outside the outer edge of the scintillator 230, covering a portion of the main surface 151 of the flexible substrate 150. In this embodiment, the CsI used in the scintillator 230 is liquefiable due to moisture, and liquefaction can lead to a decrease in sharpness, which is an important performance characteristic of the radiation detector 100. Specifically, when columnar crystals of CsI liquefy due to moisture, adjacent crystals come into contact with each other, and light converted from radiation in one columnar crystal is transmitted and scattered to other columnar crystals. To prevent deliquescence of the scintillator 230, a moisture-resistant protective layer 250 is formed not only on the surface of the scintillator 230 but also in an area extending beyond the outer edge of the scintillator 230 to the main surface 151 of the flexible substrate 150.

[0020] Furthermore, the protective layer 250 has a requirement for its own rigidity. Rigidity varies depending on the material, thickness, and shape. In this embodiment, since the protective layer 250 is formed to a thickness that is almost the same as the shape of the covering, the shape requirement is excluded, and the rigidity of the protective layer 250 depends on the material and thickness. In a later step, the flexible substrate 150 is peeled off from the support base 190, so the rigidity of the protective layer 250 may be less than the combined rigidity of the flexible substrate 150 and the scintillator 230. For example, as the protective layer 250, metal materials such as Al, Au, Ag, Cr, Pt, Ti, Mg, Ce, Na, Si, Ca, or their oxide compounds may be used with a thickness on the order of microns. Alternatively, for example, an organic material such as a paraxylylene polymer may be used as the protective layer 250.

[0021] Using the above steps, the structure 101 shown in Figure 5(c) is prepared. At this time, as shown in Figure 5(c), the area of ​​the main surface 151 of the flexible substrate 150 that is not covered by the protective layer 250 is called the peripheral region 155. In the peripheral region 155, the main surface 151 and the aforementioned signal readout lines 210 and control lines 220 may be exposed.

[0022] In S400, once the structure 101 is prepared, the process moves to S410, where the reinforcing member 260 is installed. The reinforcing member 260 is positioned so as to overlap the peripheral region 155 and not overlap the scintillator 230 in the orthogonal projection onto the main surface 151 of the flexible substrate 150. During the peeling process to separate the support base 190 from the flexible substrate 150, the peripheral region 155, where the scintillator 230 and protective layer 250 are not mounted, is the most susceptible to deformation. If the flexible substrate 150 deforms, cracks may occur in the wiring patterns of signal readout lines 210 and control lines 220 located in the peripheral region 155, potentially leading to disconnections and reducing the yield in the manufacturing process of the radiation detector 100. Therefore, the reinforcing member 260 is placed in the peripheral region 155. As shown in Figure 5(d), the reinforcing member 260 is in contact with the peripheral region 155. Here, "the reinforcing member 260 is in contact with the surrounding region 155" may include "the reinforcing member 260 is fixed to the surrounding region 155, such as by being bonded or joined to the surrounding region 155." The same applies when it is expressed that the reinforcing member 260 is in contact with other components.

[0023] The material of the reinforcing member 260 is selected such that the bending and deformation of the flexible base material 150 is reduced in the area where the reinforcing member 260 is placed. For example, a material with higher rigidity than the flexible base material 150 may be used for the reinforcing member 260. As the reinforcing member 260, for example, a resin plate may be bonded to the main surface 151 of the flexible base material 150. Alternatively, for example, the reinforcing member 260 may be formed by coating the main surface of the flexible base material 150 with resin and curing it. As an example, the epoxy resin EP001K manufactured by Cemedyne has a tensile shear strength of 6.13 MPa and a coefficient of linear expansion of 1.53 × 10⁻⁶. -4 As a result, there was little bending or deformation in the coated area, and good results were obtained for the reinforcing member 260.

[0024] After the reinforcing member 260 is placed, the process moves to S420, in which a peeling process is performed to separate the support base 190 from the flexible substrate 150. The peeling process may be performed using laser irradiation, as shown in Figure 6. As shown in Figure 7, the laser is irradiated from the main surface 191 of the support base 190, opposite to the main surface on which the flexible substrate 150 is placed. The laser is focused to increase its energy, and laser irradiation for peeling the support base 190 can be performed by two-dimensional scanning of the entire surface of the support base 190.

[0025] Furthermore, the peeling process is performed by placing the structure 101, which has the reinforcing member 260, on the stage 270, as shown in Figure 6, so that the laser is irradiated from the side of the main surface 191 of the support base 190. At this time, the structure 101 is placed so that the main surface 151 of the flexible substrate 150 faces the mounting surface 271 of the stage 270 on which the structure 101 is placed. For this reason, if the reinforcing member 260 is taller than the laminated structure of the scintillator 230, adhesive layer 240, and protective layer 250, for example, the central part of the scintillator 230 may deform during the peeling process, and the columnar crystal may be damaged. Therefore, the protective layer 250 has an upper surface 251 at the position furthest from the main surface 151 of the flexible substrate 150, and the reinforcing member 260 may be positioned closer to the main surface 151 of the flexible substrate 150 than the virtual surface 252 (shown in Figure 5(e)) along the main surface 151 of the flexible substrate 150, including the upper surface 251. The virtual surface 252 may be in the same position as the mounting surface 271 of the stage 270 in the state shown in Figure 6.

[0026] Figure 5(e) shows a cross-section of the radiation detector 100 after the support base 190 has been removed. When the support base 190 is removed, the reinforcing member 260 is placed to suppress deformation of the flexible substrate 150. As a result, bending of the peripheral region 155 of the flexible substrate 150 is suppressed during the removal process, making it less likely for wiring patterns such as the signal readout line 210 and control line 220 to break. In other words, the yield in the manufacturing process of the radiation detector 100 is improved, and as a result, the quality of the radiation detector 100 can be improved.

[0027] Figure 7 shows a modified example of the radiation detector 100 shown in Figure 5(e). The radiation detector 100 shown in Figure 7 differs from the radiation detector 100 shown in Figure 5(e) in the shape of the reinforcing member 260. The other components may be the same as those of the radiation detector 100 described above, so the explanation of the components other than the reinforcing member 260 is omitted here.

[0028] In the radiation detector 100 shown in Figure 7, the reinforcing member 260 overlaps the protective layer 250 in the orthogonal projection onto the main surface 151 of the flexible substrate 150. Furthermore, the reinforcing member 260 is in contact with the protective layer 250. In the configuration shown in Figure 7, the reinforcing member 260 is positioned to connect the protective layer 250 and the peripheral region 155 of the flexible substrate 150. Therefore, bending and deformation near the outer edge of the protective layer 250 can be suppressed. Even in this case, the reinforcing member 260 may be positioned on the side of the main surface 151 of the flexible substrate 150 that is closer to the main surface 151 of the flexible substrate 150 than the virtual surface 252 along the main surface 151 of the flexible substrate 150, including the upper surface 251 of the protective layer 250.

[0029] Next, using Figures 8 to 10, an alternative manufacturing method that suppresses deformation of the flexible substrate 150 in the peeling step of separating the support base 190 from the flexible substrate 150 will be described. Figure 8 is a flowchart showing the manufacturing method of the radiation detector 100. Compared with the flowchart shown in Figure 4, the step of installing the reinforcing member 260 in S410 has been changed to the step of placing the structure 101 in S800 on the stage 290 (shown in Figure 9). Other components and steps, such as the structure 101, may be the same as those in the manufacturing method described above using Figures 4 to 7, so the differences will be explained in detail.

[0030] Prior to the peeling process (S420) in S800, the mounting process for placing the structure 101 on the stage 290 will be explained using Figure 9. Figure 9 is a diagram illustrating the mounting and peeling processes when manufacturing the radiation detector 100. In the mounting process, the structure 101 is positioned such that the main surface 151 of the flexible substrate 150 faces the mounting surface 291 on the stage 290 on which the structure 101 is placed. At this time, the mounting surface 291 of the stage 290 has a protrusion 300 positioned so as to extend from the mounting surface 291 toward the peripheral region 155, in an orthogonal projection onto the main surface 151 of the flexible substrate 150, overlapping with the peripheral region 155 and not overlapping with the scintillator 230. The protrusion 300 of the stage 290 may be in contact with the peripheral region 155 of the flexible substrate 150, as shown in Figure 9. Furthermore, the peripheral region 155 of the flexible base material 150 may be fixed to the protrusion 300 of the stage 290.

[0031] Once the structure 101 is placed on the stage 290, the process transitions to S420, in which a peeling process is performed to separate the support base 190 from the flexible substrate 150 while the structure 101 is placed on the stage 290. Laser irradiation may be used for the peeling process, as shown in Figure 9. Figure 10 shows a cross-section of the radiation detector 100 after the peeling process.

[0032] In this embodiment as well, the protrusions 300 can suppress deformation of the flexible substrate 150 when peeling off the support base 190. As a result, bending of the peripheral region 155 of the flexible substrate 150 is suppressed during the peeling process, making it less likely for wiring patterns such as the signal readout line 210 and control line 220 to break. In other words, the yield in the manufacturing process of the radiation detector 100 is improved, and as a result, the quality of the radiation detector 100 can be improved.

[0033] Furthermore, by using the manufacturing method shown in Figures 8 and 9, the process of forming the reinforcing member 260 described above can be eliminated in the manufacturing process of the radiation detector 100. In other words, not only is the bending and deformation of the flexible substrate 150 during the peeling process suppressed, but the need for the reinforcing member 260 is eliminated, thus reducing manufacturing costs.

[0034] Next, the radiation detector 100 and the method for manufacturing the radiation detector 100 will be described using Figures 11 to 13(a) and 13(b). Figure 11 is a flowchart showing the method for manufacturing the radiation detector 100. Figures 12(a) to 12(c) are cross-sectional views of the manufacturing process of the radiation detector 100. In this embodiment, in the step of preparing the structure of S401, a structure 102 different from the structure 101 described above is prepared.

[0035] Structure 102 is shown in Figure 12(a). Compared to structure 101 shown in Figure 5(c), structure 102 further includes a wiring board 180 connected to the outer edge of the main surface 151 of the flexible substrate 150. The wiring board 180 is electrically connected to the signal readout lines 210 and control lines 220 via bumps 181 and the like. Signals output from the pixels 200 and signals for controlling the pixels 200 are transmitted via the wiring board 180.

[0036] After the structure 102 is prepared, in S410, the reinforcing member 260 is placed in the peripheral region 155 of the flexible base material 150. As shown in Figure 12(b), the reinforcing member 260 is placed in the area of ​​the peripheral region 155 of the flexible base material 150 that is not covered by the wiring board. This is because the reinforcing member 260 is placed after the structure 102 has been prepared, in which the wiring board 180 is already connected to the flexible base material 150 via bumps 181, etc. As shown in Figure 12(b), the reinforcing member 260 is in contact with the peripheral region 155 of the flexible base material 150.

[0037] In this embodiment, unlike the manufacturing process described above, the wiring board 180 can be connected to the flexible substrate 150 while the rigid support base 190 is located beneath the flexible substrate 150. Therefore, when connecting the wiring board 180 to the signal readout lines 210 and control lines 220 arranged on the flexible substrate 150, deformation of the flexible substrate 150 is suppressed, and the wiring board 180 can be connected to the signal readout lines 210 and control lines 220 with high precision. In this embodiment as well, the reinforcing member 260 is placed in the peripheral region 155 of the flexible substrate 150. As a result, similar to the manufacturing process described above, bending and deformation of the flexible substrate 150 can be suppressed in the peeling process in which the support base 190 is peeled off from the flexible substrate 150. In other words, the yield in the manufacturing process of the radiation detector 100 is improved, and as a result, the quality of the radiation detector 100 can be improved.

[0038] In this embodiment as well, as shown in Figure 7, the reinforcing member 260 may have a portion that overlaps with the protective layer 250 in an orthographic projection onto the main surface 151 of the flexible substrate 150, and may be in contact with the protective layer 250. Alternatively, the reinforcing member 260 may not be in contact with the protective layer 250, but may have a portion that overlaps with the wiring board 180 in an orthographic projection onto the main surface 151 of the flexible substrate 150, and may be in contact with the wiring board 180. Furthermore, as shown in Figure 13(a), the reinforcing member 260 may have portions that overlap with the protective layer 250 and the wiring board 180, respectively, in an orthographic projection onto the main surface 151 of the flexible substrate 150, and may be in contact with the protective layer 250 and the wiring board 180. By having the reinforcing member 260 in contact with the wiring board 180 and the protective layer 250, it becomes possible to further suppress the bending and deformation of the flexible substrate 150 during the peeling process.

[0039] After the reinforcing member is placed on the structure 102, a peeling process is performed in S420 to form a radiation detector 100 as shown in Figures 12(c) and 13(a). Even in this case, the reinforcing member 260 may be placed on the side of the main surface 151 of the flexible substrate 150 rather than the virtual surface 252 along the main surface 151 of the flexible substrate 150, which includes the upper surface 251 of the protective layer 250.

[0040] Furthermore, the reinforcing member 260 does not necessarily need to be in contact with the peripheral region 155 of the structure 102. For example, similar to the configuration shown in Figure 13(a), the reinforcing member 260 is positioned so as to overlap the peripheral region 155, the protective layer 250, and the wiring board 180, but not the scintillator 230, in the orthogonal projection onto the main surface 151 of the flexible substrate 150. In this case, as shown in Figure 13(b), the reinforcing member 260 may be in contact with the protective layer 250 and the wiring board 180, but not with the peripheral region 155. In this case, a material with higher rigidity can be used for the reinforcing member 260 compared to the case shown in Figure 13(a). The reinforcing member 260 shown in Figure 13(b) can also suppress bending and deformation of the flexible substrate 150 during the peeling process. Furthermore, even in this case, the reinforcing member 260 may be positioned on the side of the main surface 151 of the flexible substrate 150 that is closer to the main surface 151 of the flexible substrate 150 than the virtual surface 252 that is along the main surface 151 of the flexible substrate 150, including the upper surface 251 of the protective layer 250.

[0041] Next, using Figures 14, 15(a), and 15(b), we will describe the radiation detector 100 and a different manufacturing method for the radiation detector 100 than those described above. Figure 14 is a flowchart showing the manufacturing method of the radiation detector 100. Figures 15(a) and 15(b) are cross-sectional views of the manufacturing process of the radiation detector 100.

[0042] In this embodiment, the above-described structure 102 is prepared in S401. Next, in S411, the reinforcing member 430 is placed, and further, in S412, the structure 102 is placed on the housing 420. In S411, for example, the reinforcing member 430 may be placed on the mounting surface 421 of the housing 420 on which the structure 102 will be placed, and then the structure 102 may be placed on the mounting surface 421 of the housing 420. Alternatively, for example, the reinforcing member 430 may be placed on the structure 102, and then the structure 102 may be placed on the mounting surface 421 of the housing 420.

[0043] Figure 15(a) shows a cross-sectional view of the structure 102 when it is placed on the housing 420 in S412. The main surface 151 of the flexible base material 150 is positioned to face the mounting surface 421. The reinforcing member 430 is positioned between the peripheral region 155 and the mounting surface 421.

[0044] Figure 15(b) shows the radiation detector 100 after the peeling process in which the support base 190 is peeled off from the flexible substrate 150 shown in S420. In this embodiment as well, the arrangement of the reinforcing member 430 makes it possible to suppress bending and deformation of the flexible substrate 150 during the peeling process, similar to the embodiments described above. In this embodiment, the reinforcing member 430 may be in contact with the mounting surface 421. In other words, the reinforcing member 430 may be fixed to the mounting surface 421. This allows the structure 102 (radiation detector 100) to be placed in the highly rigid housing 420 before subsequent processes can be carried out, significantly improving the handling of the radiation detector 100 during manufacturing and preventing damage during the manufacturing process. As a result, the quality of the radiation detector 100 can also be improved.

[0045] Thus, by mounting the structure 102 on the housing 420 via the reinforcing member 430, defects in the manufactured radiation detector 100 are suppressed. Therefore, the step of arranging the reinforcing member 430 can be said to include the step of mounting the structure 102 on the housing 420. Furthermore, the housing 420 on which the structure 102 is mounted may be used, for example, as the exterior of a radiation imaging device 120. In addition, although the resin material described above is used as the reinforcing member 430, the reinforcing member 430 may be formed using the same material as the material used for the housing 420.

[0046] Furthermore, while Figures 15(a) and 15(b) show a structure equivalent to that in Figures 12(b) and 12(c) for the structure 102 side of the reinforcing member 430, it is not limited to this. As described above, the reinforcing member 430 may be in contact with the protective layer 250, or in contact with the wiring board 180, or in contact with both the protective layer 250 and the wiring board 180. Also, as shown in Figure 13(b), the reinforcing member 430 may be in contact with the protective layer 250 and the wiring board 180, but not in contact with the peripheral region 155.

[0047] Using Figures 16 to 18(a) and 18(b), we will explain modified examples of the radiation detector 100 and the method of manufacturing the radiation detector 100 described using Figures 14, 15(a), and 15(b). Figure 16 is a flowchart showing the method of manufacturing the radiation detector 100. Figures 17(a), 17(b), 18(a), and 18(b) are cross-sectional views of the manufacturing process of the radiation detector 100.

[0048] In this embodiment, the reinforcing member 450 protrudes from the mounting surface 441 of the housing 440, and is similar to the convex portion 300 of the stage 290 described above, which is different from the housing 420 described using Figures 15(a) and 15(b). Other configurations may be the same as those shown in Figures 14, 15(a), and 15(b), so their description is omitted here.

[0049] As shown in Figures 17(a) and 17(b), a reinforcing member 450 is positioned on the mounting surface 441 of the housing 440 so as to extend from the mounting surface 421 toward the peripheral region, in an orthogonal projection onto the main surface 151 of the flexible substrate 150, at a position that overlaps with the peripheral region 155 and does not overlap with the scintillator 230. For example, the reinforcing member 450 may be integrally molded with the housing 440. In S413, prior to the peeling process in S420, the structure 102 is placed on the housing 440 on which the reinforcing member 450 is formed.

[0050] In this embodiment as well, the placement of the reinforcing member 430 makes it possible to suppress bending and deformation of the flexible substrate 150 during the peeling process, similar to the embodiments described above. Furthermore, since the structure 102 (radiation detector 100) can be placed in the highly rigid housing 420 before subsequent processes can be carried out, the handling of the radiation detector 100 during manufacturing is greatly improved, and damage during the manufacturing process can be prevented. As a result, the quality of the radiation detector 100 can also be improved. In addition, compared to the flow chart in Figure 14, the process of placing the reinforcing member 430 in S411 is reduced, making it possible to simplify the process and reduce costs. Furthermore, since the reinforcing member 450 and the housing 440 are designed and molded as a single unit, it becomes possible to place the reinforcing member 450 with high precision.

[0051] Furthermore, as described above, the reinforcing member 450 may be in contact with the protective layer 250, or in contact with the wiring board 180, or, as shown in Figure 18(a), in contact with both the protective layer 250 and the wiring board 180. Also, as shown in Figure 18(b), the reinforcing member 450 may be in contact with the protective layer 250 and the wiring board 180, but not with the peripheral region 155.

[0052] The disclosures herein include the following methods for manufacturing radiation detectors, radiation detectors, radiation imaging devices, and radiation imaging systems.

[0053] (Item 1) A step of preparing a structure comprising: a support base; a flexible substrate disposed on the support base and having a main surface with a pixel region in which a plurality of pixels are arranged; a scintillator disposed to cover the pixel region; and a protective layer disposed to cover the scintillator. A method for manufacturing a radiation detector, comprising a peeling step of peeling the support base from the flexible substrate, The main surface includes a peripheral area not covered by the protective layer. A manufacturing method characterized by further including, before the peeling step, a step of arranging a reinforcing member in contact with the peripheral region at a position that overlaps with the peripheral region and does not overlap with the scintillator in an orthogonal projection onto the main surface.

[0054] (Item 2) In the orthogonal projection onto the main surface, the reinforcing member overlaps the protective layer. The manufacturing method according to item 1, characterized in that the reinforcing member is further in contact with the protective layer.

[0055] (Item 3) The structure further includes a wiring board connected to the outer edge of the main surface, The manufacturing method according to item 1 or 2, characterized in that the reinforcing member is disposed in a region of the peripheral area that is not covered by the wiring board.

[0056] (Item 4) In the orthogonal projection onto the main surface, the reinforcing member overlaps the wiring board. The manufacturing method according to item 3, characterized in that the reinforcing member is further in contact with the wiring board.

[0057] (Item 5) In the orthogonal projection onto the main surface, the reinforcing member overlaps the protective layer and the wiring board, respectively. The manufacturing method according to item 3, characterized in that the reinforcing member is further in contact with the protective layer and the wiring board.

[0058] (Item 6) A step of preparing a structure comprising: a support base; a flexible substrate disposed on the support base and having a main surface with a pixel region on which a plurality of pixels are arranged; a scintillator disposed to cover the pixel region; a protective layer disposed to cover the scintillator; and a wiring board connected to the outer edge of the main surface; A method for manufacturing a radiation detector, comprising a peeling step of peeling the support base from the flexible substrate, The main surface includes a peripheral area not covered by the protective layer. Prior to the peeling step, the process further includes placing a reinforcing member at a position that overlaps with the peripheral region, the protective layer, and the wiring substrate in the orthogonal projection onto the main surface, but does not overlap with the scintillator. A manufacturing method characterized in that the reinforcing member is in contact with the protective layer and the wiring board, but not in contact with the peripheral region.

[0059] (Item 7) The protective layer has an upper surface at the position furthest from the main surface, The manufacturing method according to any one of claims 1 to 6, characterized in that the reinforcing member is positioned on the side of the main surface rather than a virtual plane along the main surface including the upper surface.

[0060] (Item 8) The step of arranging the reinforcing member includes the step of placing the structure on the housing, The main surface is positioned to face the mounting surface of the housing on which the structure is placed. The manufacturing method according to any one of items 1 to 7, characterized in that the reinforcing member is disposed between the peripheral region and the mounting surface described above.

[0061] (Item 9) The manufacturing method according to item 8, characterized in that the reinforcing member is in contact with the mounting surface described above.

[0062] (Item 10) The manufacturing method according to item 8, characterized in that the reinforcing member is integrally molded with the housing.

[0063] (Item 11) The manufacturing method according to any one of items 8 to 10, characterized in that the reinforcing member is formed of the same material as the housing.

[0064] (Item 12) The manufacturing method according to any one of items 1 to 11, characterized in that the reinforcing member includes at least one of epoxy resin and acrylic resin.

[0065] (Item 13) A step of preparing a structure comprising: a support base; a flexible substrate placed on the support base; a scintillator placed to cover a pixel region of the flexible substrate having multiple pixels; and a protective layer placed to cover the scintillator. A method for manufacturing a radiation detector, comprising a peeling step of peeling the support base from the flexible substrate, The main surface of the flexible substrate that includes the pixel region includes a peripheral region that is not covered by the protective layer. Prior to the peeling step, the process further includes a placement step of placing the structure on a stage, In the aforementioned placement process, the main surface is positioned to face the placement surface of the stage on which the structure is placed. On the mounting surface, a convex portion is arranged so as to extend from the mounting surface toward the peripheral region in an orthogonal projection onto the main surface, at a position that overlaps with the peripheral region but does not overlap with the scintillator. A manufacturing method characterized in that the peeling step is performed with the structure placed on the stage.

[0066] (Item 14) The manufacturing method according to item 13, characterized in that the convex portion is in contact with the surrounding region.

[0067] (Item 15) The manufacturing method according to any one of items 1 to 14, characterized in that, in the peeling step, the support base is peeled off from the flexible substrate using laser irradiation.

[0068] (Item 16) A radiation detector comprising a flexible substrate having a main surface with a pixel region in which a plurality of pixels are arranged, a scintillator disposed to cover the pixel region, and a protective layer disposed to cover the scintillator, The main surface includes a peripheral area not covered by the protective layer. In the orthogonal projection onto the main surface, a reinforcing member is further positioned in contact with the peripheral region at a location that overlaps with the peripheral region but does not overlap with the scintillator. The protective layer has an upper surface at the position furthest from the main surface, A radiation detector characterized in that the reinforcing member is positioned on the side of the main surface that is closer to the main surface than a virtual plane that is parallel to the main surface including the upper surface.

[0069] (Item 17) A radiation detector comprising: a flexible substrate having a main surface with a pixel region in which a plurality of pixels are arranged; a scintillator disposed to cover the pixel region; a protective layer disposed to cover the scintillator; and a wiring substrate connected to the outer edge of the main surface, The main surface includes a peripheral area not covered by the protective layer. In the orthogonal projection onto the main surface, a reinforcing member is further positioned in contact with the peripheral region at a location that overlaps with the peripheral region, the protective layer, and the wiring substrate, but does not overlap with the scintillator. The reinforcing member is in contact with the protective layer and the wiring board, but is not in contact with the peripheral region. The protective layer has an upper surface at the position furthest from the main surface, A radiation detector characterized in that the reinforcing member is positioned on the side of the main surface that is closer to the main surface than a virtual plane that is parallel to the main surface including the upper surface.

[0070] (Item 18) Radiation detectors as described in item 16 or 17, A signal processing unit that processes the signal output from the radiation detector, A radiation imaging device characterized by comprising the following features.

[0071] (Item 19) The radiation imaging device described in item 18, A radiation source that irradiates the aforementioned radiation imaging device with radiation, A radiation imaging system characterized by having the following features.

[0072] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of symbols]

[0073] 100: Radiation detector, 101, 102: Structure, 150: Flexible substrate, 151: Main surface, 155: Peripheral area, 160: Pixel area, 190: Support base, 200: Pixel, 230: Scintillator, 250: Protective layer, 260, 430, 450: Reinforcement members

Claims

1. A step of preparing a structure comprising: a support base; a flexible substrate disposed on the support base and having a main surface with a pixel region on which a plurality of pixels are arranged; a scintillator disposed to cover the pixel region; and a protective layer disposed to cover the scintillator. A method for manufacturing a radiation detector, comprising a peeling step of peeling the support base from the flexible substrate, The main surface includes a peripheral area not covered by the protective layer. Prior to the peeling step, the process further includes arranging a reinforcing member in contact with the peripheral region at a position that overlaps with the peripheral region and does not overlap with the scintillator in the orthogonal projection onto the main surface, In the orthogonal projection onto the main surface, the reinforcing member overlaps the protective layer. A manufacturing method characterized in that the reinforcing member is further in contact with the protective layer.

2. The structure further includes a wiring board connected to the outer edge of the main surface, The manufacturing method according to claim 1, characterized in that the reinforcing member is disposed in a region of the peripheral area that is not covered by the wiring board.

3. In the orthogonal projection onto the main surface, the reinforcing member overlaps the wiring board. The manufacturing method according to claim 2, characterized in that the reinforcing member is further in contact with the wiring board.

4. In the orthogonal projection onto the main surface, the reinforcing member overlaps the protective layer and the wiring board, respectively. The manufacturing method according to claim 2, characterized in that the reinforcing member is further in contact with the wiring board.

5. A step of preparing a structure comprising: a support base; a flexible substrate disposed on the support base and having a main surface with a pixel region on which a plurality of pixels are arranged; a scintillator disposed to cover the pixel region; a protective layer disposed to cover the scintillator; and a wiring board connected to the outer edge of the main surface; A method for manufacturing a radiation detector, comprising a peeling step of peeling the support base from the flexible substrate, The main surface includes a peripheral area not covered by the protective layer. Prior to the peeling step, the process further includes placing a reinforcing member at a position that overlaps with the peripheral region, the protective layer, and the wiring substrate in the orthogonal projection onto the main surface, but does not overlap with the scintillator. A manufacturing method characterized in that the reinforcing member is in contact with the protective layer and the wiring board, but not in contact with the peripheral region.

6. The protective layer has an upper surface at the position furthest from the main surface, The manufacturing method according to any one of claims 1 to 5, characterized in that the reinforcing member is positioned on the side of the main surface rather than a virtual surface along the main surface including the upper surface.

7. The step of arranging the reinforcing member includes the step of placing the structure on the housing, The main surface is positioned to face the mounting surface of the housing on which the structure is placed. The manufacturing method according to any one of claims 1 to 5, characterized in that the reinforcing member is disposed between the peripheral region and the mounting surface described above.

8. The manufacturing method according to claim 7, characterized in that the reinforcing member is in contact with the mounting surface described above.

9. The manufacturing method according to claim 7, characterized in that the reinforcing member is integrally molded with the housing.

10. The manufacturing method according to claim 7, characterized in that the reinforcing member is formed of the same material as the housing.

11. The manufacturing method according to any one of claims 1 to 5, characterized in that the reinforcing member includes at least one of epoxy resin and acrylic resin.

12. A step of preparing a structure comprising: a support base; a flexible substrate placed on the support base; a scintillator placed to cover a pixel region of the flexible substrate having multiple pixels; and a protective layer placed to cover the scintillator. A method for manufacturing a radiation detector, comprising a peeling step of peeling the support base from the flexible substrate, The main surface of the flexible substrate that includes the pixel region includes a peripheral region that is not covered by the protective layer. Prior to the peeling step, the process further includes a placement step of placing the structure on a stage, In the aforementioned placement process, the main surface is positioned to face the placement surface of the stage on which the structure is placed. On the mounting surface, a convex portion is arranged so as to extend from the mounting surface toward the peripheral region in an orthogonal projection onto the main surface, at a position that overlaps with the peripheral region but does not overlap with the scintillator. A manufacturing method characterized in that the peeling step is performed with the structure placed on the stage.

13. The manufacturing method according to claim 12, characterized in that the convex portion is in contact with the surrounding region.

14. The manufacturing method according to any one of claims 1 to 5, 12, and 13, characterized in that, in the peeling step, the support base is peeled off from the flexible substrate using laser irradiation.

15. A radiation detector comprising: a flexible substrate having a main surface with a pixel region in which a plurality of pixels are arranged; a scintillator disposed to cover the pixel region; a protective layer disposed to cover the scintillator; and a wiring substrate connected to the outer edge of the main surface, The main surface includes a peripheral area not covered by the protective layer. In the orthogonal projection onto the main surface, a reinforcing member is further positioned in contact with the peripheral region at a location that overlaps with the peripheral region, the protective layer, and the wiring board, but does not overlap with the scintillator. The reinforcing member is in contact with the protective layer and the wiring board, but is not in contact with the peripheral region. The protective layer has an upper surface at the position furthest from the main surface, A radiation detector characterized in that the reinforcing member is positioned on the side of the main surface that is greater than a virtual plane along the main surface including the upper surface.

16. A radiation detector according to claim 15, A signal processing unit that processes the signal output from the radiation detector, A radiation imaging device characterized by comprising the following features.

17. A radiation imaging apparatus according to claim 16, A radiation source that irradiates the aforementioned radiation imaging device with radiation, A radiation imaging system characterized by having the following features.

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