Electrical connection device

Abstract

To adjust the degree of flatness of a substrate on which a plurality of probes are mounted to improve the electric contact of the probes with an electrode terminal of an inspection target body.SOLUTION: An electric connection device of the present invention includes: a wire substrate electrically connected to an inspection device side; a probe substrate provided on a lower surface side of the wire substrate, and having one or more probe attachment units on which a plurality of probes to be in electric contact with a corresponding electrode terminal are mounted, for each electrode terminal of an inspection target body with one or more electrode terminals; and a cover member for adjusting the degree of flatness of the probe substrate, and having one or more flatness degree adjusting mechanisms provided to correspond to each probe attachment unit of the probe substrate.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an electrical connection device, and can be applied to, for example, an electrical connection device used for an energization test of a semiconductor integrated circuit or the like.

Background Art

[0002] In the electrical inspection of a semiconductor integrated circuit (test object) on a semiconductor wafer, an inspection device (tester) having a probe card with a plurality of probes (electrical contacts) attached to a test head is used. Then, the electrode terminals of the semiconductor integrated circuit and the probes are brought into electrical contact, and the tester supplies an electrical signal to the semiconductor integrated circuit via the probes, or the semiconductor integrated circuit outputs to the tester side via the probes, thereby performing an electrical inspection of the semiconductor integrated circuit.

[0003] There are various types of probe cards. As one type, there are those described in Patent Document 1 and probe cards such as those illustrated in FIG. 9. Here, for convenience of explanation, the structure of a conventional probe card 100 will be described using FIG. 9.

[0004] The probe card 100 in FIG. 9 includes a wiring board 11 and a multilayer wiring board 12 having a plurality of probes on the lower side of the wiring board 11, and the wiring board 11 and the multilayer wiring board 12 are joined by a number of joining members (solder balls) 31. Further, a reinforcing member 13 and a cover member 94 are provided on the upper surface of the wiring board 11 of the probe card 100, and a block member 95 is provided at a position corresponding to the probe pad area 121 of the multilayer wiring board 12 in order to support the load of the probes.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

[0006] However, when joining the multilayer wiring board 12 and the wiring board 11 with the joining member 31, applying heat can cause the multilayer wiring board 12 to warp. Also, the multilayer wiring board 12 may be joined to the wiring board 11 in a tilted state. In such cases, variations in the height of the probes mounted on the probe pad area of ​​the multilayer wiring board 12 may occur, potentially preventing the probes from making proper contact with the electrode terminals.

[0007] Therefore, in order to improve the electrical contact of the probe with the electrode terminals of the object under test, there is a need for an electrical connection device that can adjust the flatness of a substrate (for example, a multilayer wiring board) on which multiple probes are mounted. [Means for solving the problem]

[0008] To solve these problems, the electrical connection device of the present invention includes (1) a wiring board that is electrically connected to the inspection device side, (2) a probe board provided on the lower surface side of the wiring board and having one or more probe mounting portions on which a plurality of probes are mounted to electrically contact the corresponding electrode terminal for each electrode terminal of an object to be inspected which has one or more electrode terminals, and (3) a member for adjusting the flatness of the probe board, which has at least one or more flatness adjustment mechanisms provided corresponding to each probe mounting portion of the probe board. (4) Reinforcement member on the upper side of the wiring board Equipped with The reinforcing member on the wiring board has a space in the center, and the cover member having one or more flatness adjustment mechanisms is provided in the center of the reinforcing member. It is characterized by the following: [Effects of the Invention]

[0009] According to the present invention, the flatness of the substrate on which multiple probes are mounted can be adjusted in order to improve the electrical contact of the probes with the electrode terminals of the object under inspection. [Brief explanation of the drawing]

[0010] [Figure 1]This figure shows a schematic diagram of the main components of the electrical connection device according to the embodiment. [Figure 2] This is a plan view of an electrical connection device according to an embodiment. [Figure 3] This is a bottom view of an electrical connection device according to an embodiment. [Figure 4] This is a configuration diagram showing the configuration of a multilayer wiring board provided on the lower surface of a wiring board according to the embodiment. [Figure 5] This figure shows the arrangement of the indenter 22 on the wiring board according to the embodiment. [Figure 6] This is a diagram showing the upper surface of the cover member according to the embodiment. [Figure 7] This is a perspective view of the indenter according to the embodiment, as seen from below. [Figure 8] This figure visualizes the flatness measurement results of a multilayer wiring board in one embodiment. [Figure 9] This diagram shows a schematic configuration of a conventional electrical connection device. [Figure 10] This is a diagram (part 1) showing the configuration of an indenter according to a modified embodiment. [Figure 11] This is a diagram (part 2) showing the configuration of the indenter according to a modified embodiment. [Modes for carrying out the invention]

[0011] (A) Embodiment Hereinafter, embodiments of the electrical connection device according to the present invention will be described in detail with reference to the drawings.

[0012] In this embodiment, each of the multiple semiconductor integrated circuits formed on a semiconductor wafer is used as the object under test. Furthermore, an example is provided in which the electrical connection device of the present invention is applied to a probe card used in an inspection device for testing the electrical characteristics of such objects under test.

[0013] "Flatness" generally refers to the magnitude of deviation from the geometrically correct plane of a planar object. That is, flatness is a numerical value indicating the smoothness (uniformity) of a plane, and it is a value indicating how precisely the surface should be flat. For example, the flatness can be the value of the vertical distance between the plane including the most protruding part of a planar object and the plane including the most sunken part. For example, in this disclosure, "flatness" is intended to include not only the overall flatness of the probe substrate but also the flatness of a partial region (e.g., the probe region) of the probe substrate where a plurality of probes are arranged.

[0014] (A-1) Configuration of the Embodiment FIG. 1 is a diagram showing an outline of the main configuration of an electrical connection device according to an embodiment. FIG. 2 is a plan view of the electrical connection device, and FIG. 3 is a bottom view of the electrical connection device.

[0015] In FIGS. 1 to 3, the electrical connection device 10 according to the embodiment includes a wiring substrate 11, a multilayer wiring substrate 12, a reinforcing member 13, and a cover member 14 having a flatness adjustment mechanism 20.

[0016] The electrical connection device 10 is provided in a test head of an inspection device when performing an electrical inspection of a plurality of test objects 43 formed on a semiconductor wafer. The multilayer wiring substrate 12 of the electrical connection device 10 has a plurality of electrical contacts (probes). And when performing an electrical inspection, each probe of the electrical connection device 10 is brought into electrical contact with a corresponding electrode terminal of the test object 43, and the inspection device performs an electrical inspection of the test object 43.

[0017] The test object 43 is placed on the upper surface of a chuck 42 that holds the wafer and is held by the chuck 42. The chuck 42 is connected to, for example, an inspection stage 41 of a multi-axis stage, and the position of the test object 43 held by the chuck 42 can be adjusted by driving the inspection stage 41.

[0018] [Multilayer Wiring Substrate 12] The multilayer wiring substrate 12 is a probe substrate on which a plurality of electrical contacts (probes) are mounted.

[0019] The multilayer wiring board 12 is joined to the center of the lower surface of the wiring board 11 by a number of bonding members 31 such as solder balls. The multilayer wiring board 12 is a substantially square substrate formed of an electrically insulating material such as polyimide resin. To enable fine wiring, the multilayer wiring board 12 can use a substrate made of resin, for example, as an MLO (Multi-Layer Organic) substrate.

[0020] A probe pad area 121 capable of attaching multiple probes is formed on the lower surface of the multilayer wiring board 12, and multiple wiring paths are formed inside the multilayer wiring board 12. Each wiring path of the multilayer wiring board 12 connects each probe in the probe pad area 121 to a connection terminal provided on the multilayer wiring board 12 that connects to the wiring board 11.

[0021] The probe pad area 121 allows for the attachment of multiple probes to each device under test (DUT: Device Under Test) as the object under test 43. For example, Figure 3 illustrates a case where six probe pad areas 121 are formed on the multilayer wiring board 12. In this case, there are six DUTs as the objects under test 43, and each probe pad area 121 is positioned at the location of the corresponding DUT in order to electrically contact multiple probes with each DUT. Thus, the probe pad area 121 is positioned at the location of the corresponding DUT, and the multiple probes in each probe pad area 121 are positioned to electrically contact the corresponding DUT. The probe pad area 121 is also called a probe head.

[0022] In Figure 3, an example is shown where the multilayer wiring board 12 has six probe pad areas 121, but the number of probe pad areas 121 is not limited to this. Since a probe pad area 121 is provided for each DUT, there will be as many probe pad areas 121 as there are DUTs.

[0023] [Wiring board 11] The wiring board 11 is a circuit board that connects to the test head of a tester to send and receive electrical signals. The upper surface of the wiring board 11 has numerous electrodes, which connect to the test head. The lower surface of the wiring board 11 has a wiring pattern, which connects to the multilayer wiring board 12. Furthermore, wiring paths are formed inside the wiring board 11, connecting each terminal on the upper surface of the wiring board 11 to each terminal on the lower surface of the wiring board 11. Therefore, the wiring board 11 has a structure that allows each terminal on the upper surface to be electrically connected to each terminal on the lower surface via the internal wiring paths.

[0024] On the upper surface of the wiring board 11, a reinforcing member 13 and a cover member 14 having a flatness adjustment mechanism 20 are arranged to suppress deformation of the wiring board 11.

[0025] To assemble the reinforcing member 13 to the wiring board 11, both the wiring board 11 and the reinforcing member 13 have through holes 531 and 532, such as screw holes, for connecting with the fixing member 53. When assembling, the through holes 531 of the wiring board 11 and 532 of the reinforcing member 13 are aligned, and the fixing member 53, such as a screw, is inserted into the through holes 531 and 532 to secure them.

[0026] [Reinforcement member 13] The reinforcing member 13 is a member attached to the upper surface of the wiring board 11 in order to suppress deformation such as bending of the wiring board 11. The reinforcing member 13 is also called a stiffener.

[0027] The reinforcing member 13 is a member having thickness in the Z direction. The reinforcing member 13 can take various shapes, but in this embodiment, for example, as shown in Figure 3, it has one annular portion and a plurality of radial portions extending radially from the center of the annular portion toward the annular portion. Furthermore, the plurality of radial portions have four inner radial portions extending radially from the center of the annular portion toward the annular portion and eight outer radial portions extending radially outward from the annular portion.

[0028] Furthermore, a square frame is provided in the central part of the reinforcing member 13 to connect with the square cover member 14, which will be described later. Also, the shape of the reinforcing member 13 is not limited to the shape shown in Figure 3.

[0029] [Cover member 14] The cover member 14 is a member that is attached to the upper side of the reinforcing member 13. The cover member 14 is a member that is removable from the reinforcing member 13.

[0030] Furthermore, the cover member 14 has a flatness adjustment mechanism 20 that adjusts the flatness of the multilayer wiring board 12 located on the underside of the wiring board 11. The cover member 14 also has the function of supporting the load when the probe provided on the multilayer wiring board 12 makes contact (when the probe makes contact with the electrode terminals of the object under test 43).

[0031] As illustrated in Figure 2, the cover member 14 is a square-shaped plate-like member positioned in the center of the wiring board 11. The size of the square cover member 14 is slightly larger than the size of the multilayer wiring board 12 on the underside of the wiring board 11. Note that the shape of the cover member 14 is not limited to a square.

[0032] To assemble the cover member 14 onto the reinforcing member 13, the reinforcing member 13 and the cover member 14 each have through holes 511 and 512, such as screw holes. When assembling, the through holes 511 of the reinforcing member 13 and the through holes 512 of the cover member 14 are aligned, and the fastening members 51, such as screws, are inserted into the through holes 511 and 512 to secure them.

[0033] [Flatness adjustment mechanism 20] The flatness adjustment mechanism 20 of the cover member 14 adjusts the flatness of the multilayer wiring board 12 on the lower surface of the wiring board 11.

[0034] Conventionally, when attaching a multilayer wiring board 12 to the underside of a wiring board 11, a number of bonding members 31, such as solder balls, are placed in the center of the underside of the wiring board 11, and the multilayer wiring board 12 is placed on top of these bonding members 31 and bonded. When bonding the multilayer wiring board 12 with bonding members 31 such as solder balls, heat is applied, which can cause the multilayer wiring board 12 to warp. In addition, some multilayer wiring boards 12 may be warped even before bonding.

[0035] If a multilayer wiring board 12 that is warped and does not have good flatness after bonding to the wiring board 11 is used for inspection, the tip positions of multiple electrical contacts (probes) will vary (i.e., the height of the probes will vary), which may result in poor contact between the probes and the electrode terminals of the object under inspection 43. This will affect the accuracy of the electrical inspection of the object under inspection 43.

[0036] Therefore, in this embodiment, the cover member 14 is equipped with a flatness adjustment mechanism 20 for adjusting the flatness of the multilayer wiring board 12.

[0037] The flatness adjustment mechanism 20 corrects warping by applying a concentrated load to the multilayer wiring board 12 via the wiring board 11 after bonding the multilayer wiring board 12 to the lower surface of the wiring board 11. This suppresses warping of the wiring board 11 and the multilayer wiring board 12, and reduces variations in the tip positions of multiple probes. As a result, the contact of the probes with the electrode terminals of the object under inspection 43 is improved, and the electrical inspection of the object under inspection 43 becomes highly accurate.

[0038] The flatness adjustment mechanism 20 of the cover member 14 includes one or more indenters 22 that apply a load to the multilayer wiring board 12 via the wiring board 11, and an adjustment member 21 that adjusts the load of each of the one or more indenters 22.

[0039] The indenter 22 is a contact member placed on the upper surface of the wiring board 11. The indenter 22 is a member that applies a load to the wiring board 11 and the multilayer wiring board 12 after receiving load adjustment from the adjustment member 21. In other words, the adjustment member 21 adjusts the amount of indentation of the indenter 22 according to the degree of warping of the wiring board 11 and the multilayer wiring board 12, and the indenter 22 applies a load to the wiring board 11 and the multilayer wiring board 12 according to the amount of indentation adjusted by the adjustment member 21. As the magnitude of the load changes, the substrates of the wiring board 11 and the multilayer wiring board 12 deform, and the warping is corrected.

[0040] The position in which the indenter 22 is installed is preferably a position that ensures good flatness of the wiring board 11 and the multilayer wiring board 12, and / or a position that ensures good contact between the probe and the DUT.

[0041] For example, the indenter 22 is positioned at a location corresponding to the center of the multilayer wiring board 12 (e.g., the center of gravity) and at a location corresponding to the center of each probe pad area 121. By positioning the indenter 22 at a location corresponding to the center of the multilayer wiring board 12, as in the former case, the multilayer wiring board 12, which needs to be balanced, can be supported at its center. Alternatively, by positioning the indenter 22 at a location corresponding to the probe pad area 121 (in other words, providing an indenter 22 for each DUT of the object under inspection 43), as in the latter case, the indenter 22 can apply a load to the corresponding probe pad area 121, thereby stabilizing the control of flatness and improving the probe's contact with the DUT.

[0042] For example, as shown in Figures 2 and 3, if the object under inspection 43 has 6 DUTs and the multilayer wiring board 12 has 6 probe pad areas 121, then a total of 7 indenters 22 are provided: 1 indenter 22 placed in the center of the multilayer wiring board 12 and 6 indenters 22 placed at each of the 6 probe pad areas 121.

[0043] The indenter 22 can have various shapes (types), such as a flat cylindrical indenter, a flat rectangular prism indenter, a spherical indenter, or a conical indenter. However, any type of indenter can be used as long as it can apply a load to the multilayer wiring board 12 via the wiring board 11. In this embodiment, the indenter 22 is provided to apply a substantially uniform load to the surface of the probe pad area 121. The material of the indenter 22 is not particularly limited.

[0044] The adjustment member 21 adjusts the amount of indentation of the corresponding indenter 22. An adjustment member 21 is provided for each indenter 22. The adjustment member 21 fixes the upper part of the indenter 22 and adjusts the amount of indentation of the indenter 22 in the vertical direction, and can use, for example, a clamping screw or a screw. For example, when a clamping screw or a screw is used as the adjustment member 21, it becomes possible to adjust how much rotation is required to apply a certain amount of indentation load to the indenter 22.

[0045] [Alignment of the indenter 22 in the flatness adjustment mechanism 20] Next, we will explain the alignment of the indenter 22, which is part of the flatness adjustment mechanism 20 of the cover member 14.

[0046] Figure 4 is a configuration diagram showing the structure of the multilayer wiring board 12 on the lower surface of the wiring board 11. Figure 5 is a diagram showing the arrangement of the indenters 22 on the wiring board 11. Figure 6 is a configuration diagram showing the upper surface of the cover member 14 according to the embodiment.

[0047] Here, the object under test 43 is assumed to have six DUTs. Therefore, as shown in Figure 4, the multilayer wiring board 12 is used that has six probe pad areas 121 (121a to 121f). When referring to a specific probe pad area 121, it will be denoted as probe pad area 121a, etc.

[0048] The indenter 22 shall be a flat rectangular prism indenter as shown in Figure 7. Figure 7 is a perspective view of the indenter 22 as seen from below. When referring to a specific indenter 22, it shall be denoted as indenter 22a, etc.

[0049] In Figure 7, the indenter 22 (22a to 22g) has a pressure receiving portion 222 that receives indentation pressure from the adjustment member 21, and a flat rectangular prism-shaped contact portion 221 that applies load to the wiring board 11 and the multilayer wiring board 12.

[0050] The shape of the contact portion 221 that contacts the wiring board 11 is the same as the shape of the probe pad area 121, and the size of the contact portion 221 is also the same as the size of the probe pad area 121. This ensures that a load is reliably applied to the probe pad area 121, and as a result, the contact performance of the probe with the electrode terminals of the object under test 43 can be improved.

[0051] Furthermore, when the indenter 22 applies a load to the wiring board 11 and the multilayer wiring board 12, the tip of the contact portion 221 of the indenter 22 is flattened to distribute the load and avoid damage to the wiring board 11 and the multilayer wiring board 12.

[0052] An example of the placement of the indenters 22 will be explained. In this example, as shown in Figure 5, one of the seven indenters 22, indenter 22g, is placed at a position corresponding to the center of the multilayer wiring board 12 (i.e., the center of gravity) in order to balance it. The remaining six indenters 22a to 22f are each placed at a position corresponding to the center of the six probe pad areas 121a to 121f of the multilayer wiring board 12.

[0053] As shown in Figure 6, the cover member 14 has, for each indenter 22 (22a to 22g), an adjustment hole 211 such as a screw hole for receiving the adjustment member 21, and two positioning holes 23.

[0054] To align each indenter 22, the positioning holes 23 of the cover member 14 are aligned with the corresponding positioning holes 24 of the indenter 22, and a fixing member such as a screw is inserted through the positioning holes 23 of the cover member 14 and the positioning holes 23 of the indenter 22. In this way, each indenter 22 is aligned. Note that the number of positioning holes 24 and positioning holes 23 is not limited to two, but may be one or three or more, as long as the indenter 22 can be positioned.

[0055] When adjusting the magnitude of the load applied by the indenter 22, the adjustment member 21 is inserted into the adjustment hole 211 of the cover member 14.

[0056] Here, regarding the alignment of the indenter 22, in order to ensure that the contact portion 221 of the indenter 22 can apply the target load to the wiring board 11 and the multilayer wiring board 12, the tip (lower end) of the adjustment member 21 is positioned to contact the center of the pressure receiving portion 222 of the indenter 22 (i.e., the position corresponding to the center of the contact portion 221).

[0057] [Flatness adjustment method using flatness adjustment mechanism 20] Next, a method for adjusting the flatness of the cover member 14 using the flatness adjustment mechanism 20 will be explained.

[0058] Here, it is assumed that a multilayer wiring board 12 is bonded to the underside of a wiring board 11 using numerous bonding members 31 such as solder balls. Multiple probes are attached to each probe pad area 121 of the multilayer wiring board 12, and the necessary electronic components are set on the wiring board 11. A reinforcing member 13 is then attached to the upper side of the wiring board 11. Finally, the flatness adjustment mechanism 20 is aligned, and a cover member 14 is attached to the reinforcing member 13.

[0059] In this state, the flatness of the multilayer wiring board 12 bonded to the wiring board 11 is measured, and while determining whether the measured flatness value is below the target value, the flatness adjustment mechanism 20 is used to adjust the flatness. The flatness is measured using an existing flatness measuring machine to measure the flatness of the multilayer wiring board 12.

[0060] More specifically, for example, in a multilayer wiring board 12, the flatness values ​​of multiple arbitrary points in a certain probe pad area 121 are measured, and the pad average value of the flatness values ​​is calculated. Furthermore, the flatness is measured across the entire surface of the multilayer wiring board 12, and the value with the largest deviation is taken as the maximum value. Then, adjustments are made so that the difference between the maximum value and the area average value is less than or equal to the target value.

[0061] Figure 8 visualizes the flatness measurement results of the multilayer wiring board 12. Figure 8A shows the flatness of the multilayer wiring board 12 before adjustment by the flatness adjustment mechanism 20, and Figure 8B shows the flatness of the multilayer wiring board 12 after adjustment.

[0062] In Figure 8A, observing the overall flatness of the multilayer wiring board 12 before adjustment, it can be seen that the difference value near the right edge (the difference between the maximum value and the area average value mentioned above) is larger than the difference value from the center to the left.

[0063] Therefore, in order to correct the warping of the entire multilayer wiring board 12, a flatness adjustment mechanism 20 is used, for example, provided for the probe pad areas 121c and 121f located on the left side of the multilayer wiring board 12, as shown in Figure 8B. In other words, in order to increase the load on the indenters 22c and 22f on the probe pad areas 121c and 121f, the amount of indentation of the respective adjustment members 21 of the indenters 22c and 22f is increased.

[0064] As a result, the indenters 22c and 22f apply a large load to the left side of the multilayer wiring board 12, causing the multilayer wiring board 12 to deform, suppressing the warping of the entire board, and reducing the overall flatness value of the board (see Figure 8B).

[0065] Furthermore, the difference in probe height (probe height variation) on the multilayer wiring board 12 before adjustment in Figure 8A was compared with the difference in probe height on the multilayer wiring board 12 after adjustment in Figure 8B. As a result, it was confirmed that the difference in probe height after adjustment in Figure 8B was no smaller than the difference in probe height before adjustment in Figure 8A.

[0066] (A-2) Effects of the embodiment As described above, according to this embodiment, the cover member 14 is equipped with a flatness adjustment mechanism 20 that can apply multiple concentrated loads to the multilayer wiring board 12, thereby allowing the flatness value of the multilayer wiring board 12 to be adjusted.

[0067] As a result, the tip positions of the multiple probes provided on the multilayer wiring board 12 can be aligned, thereby improving contact with the terminals (DUT) of the object under inspection 43 and increasing inspection accuracy.

[0068] According to this embodiment, since the cover member 14 is removable from the reinforcing member 13, it can be provided on reinforcing members 13 of various shapes, as long as the cover member 14 equipped with the flatness adjustment mechanism 20 can be placed on it.

[0069] (B) Other embodiments Although various modifications of this disclosure were mentioned in the first embodiment described above, this disclosure can also be applied to the following modified embodiments.

[0070] (B-1) In the first embodiment described above, an example was given in which the shape of the contact portion 221 of the indenter 22 corresponds to the shape of the corresponding probe pad area 121. However, the shape of the contact portion 221 of the indenter 22 is not limited to this.

[0071] For example, it is common for many electronic components 6, such as capacitors, to be provided on the upper surface of the wiring board 11. Therefore, electronic components 6 may be located on the upper surface of the wiring board 11 where the indenter 22 is positioned, in a location corresponding to the probe pad area 121. In this case, the indenter 22 and the electronic components 6 may come into contact. Therefore, it may be possible to avoid contact with the electronic components 6 on the wiring board 11 and to allow the indenter 22 to apply a load to the probe pad area 121 of the wiring board 11 and the multilayer wiring board 12.

[0072] For example, as illustrated in Figure 10(B), a recess (contact avoidance portion) 2211 may be provided in the center of the contact portion 221 of the indenter 22 to avoid contact with the electronic component 6. This allows a load to be applied to the wiring board 11 and the multilayer wiring board 12 while avoiding contact between the contact portion 221 of the indenter 22 and the electronic component 6, as shown in Figure 10(A). Even in this case, the flatness of the wiring board 11 (the probe pad area where multiple probes are arranged) can be adjusted.

[0073] As another variation, as illustrated in Figure 11(B), a recess (contact avoidance portion) 2212 may be provided in a portion of the contact surface of the contact portion 221 of the indenter 22 (in this example, the region including the edges of the square contact surface of the contact portion 221). The same effect can be obtained in this case as well.

[0074] Note that while Figures 10(B) and 11(B) illustrate the case where the recesses (contact avoidance parts) 2211 and 2212 are recesses of a rectangular prism, the shape is not limited as long as contact with the electronic component 6 can be avoided, and for example, a cylindrical shape, a polygonal prism, etc., are also acceptable.

[0075] Furthermore, while the examples in Figures 10(B) and 11(B) illustrate the case where one recess 2211 and 2212 are provided on the contact portion 221 of the indenter 22, two or more recesses may be provided. Moreover, it is not necessary to provide recesses 2211 and 2212 on all indenters 22; a configuration in which recesses 2211 and 2212 are provided only on some of the indenters 22 that come into contact with the electronic component 6 may be applied.

[0076] (B-2) In the first embodiment described above, the case in which the cover member 14 is provided on the reinforcing member 13 was illustrated. However, the arrangement of the cover member 14 is not limited to this. For example, the cover member 14 may be placed on the upper surface of the multilayer wiring board 12 if it is possible to adjust the flatness of the multilayer wiring board 12 as a probe substrate (or the flatness of each probe pad area 121 of the multilayer wiring board 12). [Explanation of symbols]

[0077] 10...Electrical connection device, 11...Wiring board, 12...Multilayer wiring board, 13...Reinforcement member, 14...Cover member, 20...Flatness adjustment mechanism, 21...Adjustment member, 22 (22a~22g)...Indenter, 211...Adjustment hole, 221...Contact part, 2211 and 2212...Recess (contact avoidance part), 222...Pressure receiving part, 23...Positioning hole, 24...Positioning hole, 31...Joining member, 41...Inspection stage, 42...Chuck, 43...Object to be inspected, 51...Fixing member, 53...Fixing member, 100...Probe card, 121 (121a~121f)...Probe pad area, 511...Through hole, 512...Through hole, 531...Through hole, 532...Through hole.

Claims

1. A wiring board that is electrically connected to the inspection device, A probe board provided on the lower side of the wiring board, having one or more probe mounting portions for mounting a plurality of probes that electrically contact the corresponding electrode terminal of an object to be inspected, each of which has one or more electrode terminals, A member for adjusting the flatness of the probe substrate, comprising a cover member having at least one or more flatness adjustment mechanisms provided corresponding to each of the probe mounting portions of the probe substrate, A reinforcing member is provided on the upper surface of the aforementioned wiring board. Equipped with, There is a space in the center of the reinforcing member on the wiring board, and the cover member having one or more flatness adjustment mechanisms is provided in the center of the reinforcing member. An electrical connection device characterized by the following features.

2. Each of the aforementioned flatness adjustment mechanisms, A contact member placed on the upper surface of the wiring board and applying a load to the probe board via the wiring board, The contact member adjusts the load applied to the probe substrate. The electrical connection device according to claim 1, characterized by having the following features.

3. The electrical connection device according to claim 2, characterized in that the adjusting member adjusts the load on the contact member by adjusting the pressure on the contact member on the wiring board.

4. The contact member has a contact portion that contacts the wiring board and a pressure receiving portion that transmits pressure from the adjustment member to the contact portion. The shape of the contact portion corresponds to the shape of the probe mounting portion. The electrical connection device according to feature 2.

5. The contact member has a contact portion that contacts the wiring board and a pressure receiving portion that transmits pressure from the adjustment member to the contact portion. The contact portion has a contact avoidance portion that avoids contact with electronic components on the wiring board. The electrical connection device according to feature 2.

6. The electrical connection device according to claim 1, characterized in that the cover member having the flatness adjustment mechanism is removable from the reinforcing member.

7. The electrical connection device according to claim 1, characterized in that the cover member is provided with the flatness adjustment mechanism for each probe mounting portion at a corresponding position of each probe mounting portion, and also at a position corresponding to the center of gravity of the probe substrate.

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