A substrate scanning device equipped with a pendulum and a rotatable substrate holder.

Abstract

A method of scanning a substrate includes clamping the substrate to a substrate holder in a processing chamber and synchronously driving a first rotation drive and a second rotation drive to perform parallel raster pattern passes by moving the substrate relative to a processing device focused on a localized spot on the substrate, the first rotation drive being coupled to a proximal end of a pendulum arm and the second rotation drive being mounted to a distal end of the pendulum arm and the substrate holder. Driving the first rotation drive during a pass includes moving the pendulum arm through a first arc motion over a first portion of the pass while the localized spot is over the substrate, and then moving the pendulum arm through an opposite second arc motion over a second portion of the pass while the localized spot is over the substrate.

Description

Technical Field

[0001] Cross - reference to Related Applications This application claims priority to U.S. Non - Provisional Patent Application No. 17 / 381,743, filed on July 21, 2021, the entire content of which is incorporated herein by reference.

[0002] The present invention generally relates to substrate scanning, and in certain embodiments, to an apparatus, system, and method for scanning a substrate including a rotatable substrate holder attached to the distal end of a pendulum arm.

Background Art

[0003] Element formation within a microelectronics workpiece generally requires a series of manufacturing techniques including the formation, patterning, and removal of multiple material layers on a substrate. Many substrate processing techniques are performed on selected portions of the substrate rather than on the entire substrate simultaneously. For example, the surface of a substrate can be exposed to a focused beam localized to a spot much smaller than the substrate surface. A substrate scanning apparatus moves the substrate or a processing device in a raster pattern (i.e., a scanning pattern) over a portion or the entire substrate to perform processing specialized to the position of the substrate.

Summary of the Invention

Problems to be Solved by the Invention

[0004] As feature sizes decrease and feature densities increase, substrate scanning apparatuses must have increasingly high accuracy and flexibility in aligning the substrate being processed. Various two - dimensional scanning mechanisms are possible. However, conventional mechanisms are bulky and have a footprint much larger than the substrate size. Since these mechanisms are often placed in the same vacuum environment as the substrate during processing, they require larger and more expensive vacuum chambers. Smaller conventional mechanisms cannot achieve the accuracy required for delicate additive or subtractive position - specific processing.

Means for Solving the Problems

[0005] According to one embodiment of the present invention, a method for scanning a substrate includes the steps of fixing the substrate to a substrate holder in a processing chamber and executing a first pass of a parallel raster pattern by synchronously driving a first rotary drive and a second rotary drive to move the substrate relative to a processing device focused on a localized spot on the substrate, wherein the first rotary drive is coupled to the proximal end of a pendulum arm and the second rotary drive is mounted on the distal end of the pendulum arm and the substrate holder. During the first pass, the step of driving the first rotary drive includes moving the pendulum arm across a first portion of the first pass by first arc motion while the localized spot is on the substrate, and then moving the pendulum arm across a second portion of the first pass by second arc motion in the opposite direction while the localized spot is on the substrate.

[0006] According to another embodiment of the present invention, the system includes a vacuum chamber, a first rotational drive coupled to the proximal end of a pendulum arm located within the vacuum chamber, a second rotational drive mounted on the distal end of the pendulum arm and moving together with the distal end, a substrate holder located within the vacuum chamber and coupled to the second rotational drive at a pivot point, and a controller coupled to the first and second rotational drives. The controller is configured to synchronously drive the first and second rotational drives to cause a stationary position-specific processing device to trace a parallel raster pattern on the substrate holder.

[0007] According to yet another embodiment of the present invention, the apparatus includes a processing chamber, a pendulum arm disposed within the processing chamber, and a substrate holder. The pendulum arm includes a proximal end and a distal end. The proximal end is coupled to a first rotary drive. The first rotary drive is configured to move the pendulum arm by arc motion around the proximal end. The substrate holder is disposed within the processing chamber and is coupled to a second rotary drive at a pivot point offset in the first direction by an offset distance smaller than the outer radius of the substrate holder from the center of the substrate holder. The second rotary drive is mounted on the distal end of the pendulum arm and is configured to rotate the substrate holder around the pivot point synchronously with the arc motion of the pendulum arm, thereby moving the substrate holder laterally relative to the position-specific processing device.

[0008] Please refer to the following description in conjunction with the attached drawings for a more complete understanding of the present invention and its advantages. [Brief explanation of the drawing]

[0009] [Figure 1] Three schematic diagrams, viewed from above, show a substrate scanning device, including a rotary drive attached to the distal end of a pendulum arm, according to one embodiment of the present invention. [Figure 2] Three further schematic diagrams, viewed from above, show a substrate scanning device, including a rotary drive attached to the distal end of a pendulum arm, according to one embodiment of the present invention. [Figure 3] This shows a top view of parallel raster patterns superimposed on a substrate according to one embodiment of the present invention. [Figure 4] A schematic diagram of the movement of the pendulum arm and substrate in one embodiment of the present invention is shown. [Figure 5] A geometric diagram of the movement of a substrate relative to a stationary position-specific processing device according to one embodiment of the present invention is shown. [Figure 6] A schematic diagram of a substrate scanning apparatus including two or more static processing nozzles, according to one embodiment of the present invention, is shown as viewed from above. [Figure 7]A schematic diagram of a substrate scanning apparatus including a translational processing nozzle, according to one embodiment of the present invention, is shown as viewed from above. [Figure 8] Three schematic diagrams, viewed from above, show a substrate scanning device according to one embodiment of the present invention, which includes a rotary drive attached to the distal end of a pendulum arm and a substrate attached to the rotary drive at a pivot point offset from the center of the substrate. [Figure 9] Three more schematic diagrams, viewed from above, show a substrate scanning device according to one embodiment of the present invention, which includes a rotary drive attached to the distal end of a pendulum arm and a substrate attached to the rotary drive at a pivot point offset from the center of the substrate. [Figure 10] This document illustrates a substrate scanning process according to one embodiment of the present invention, in which a substrate is lifted from a substrate holding unit and rotated 180°. [Figure 11A] This invention illustrates a substrate scanning process that shifts the pivot point of a rotatable substrate by linearly translating the substrate relative to its pivot point. [Figure 11B] This invention illustrates a substrate scanning process that shifts the pivot point of a rotatable substrate by rotating and translating the substrate relative to its pivot point. [Figure 12] A schematic diagram of a substrate scanning device according to one embodiment of the present invention, viewed from the side, is shown. [Figure 13] A schematic diagram of a substrate scanning system according to one embodiment of the present invention is shown, viewed from the side. [Figure 14] A method for scanning a substrate according to one embodiment of the present invention is shown. [Modes for carrying out the invention]

[0010] Corresponding numbers and symbols in different drawings generally refer to corresponding parts unless otherwise indicated. Each drawing is drawn to clearly illustrate relevant aspects of multiple embodiments and is not necessarily drawn to a fixed scale. The edges of features depicted in each drawing plane do not necessarily indicate the end of the extent of that feature.

[0011] The creation and use of various embodiments are described in detail below. However, it should be understood that the various embodiments described herein are applicable to a wide range of specific situations. The specific embodiments described are merely illustrative of specific ways of creating and using the various embodiments and should not be interpreted as limiting.

[0012] While substrate scanning processes that scan only in one dimension are also possible, the following description relates in particular to substrate processing techniques that scan in at least two dimensions. For example, the processing apparatus may be configured to affect only a selected portion (e.g., a small region) of the substrate at a predetermined time (e.g., using a focused beam). The substrate may be moved (i.e., scanned) laterally relative to the processing apparatus (e.g., in a plane perpendicular to the beam generated by the nozzle). In this way, position-specific processing of the substrate is realized.

[0013] A substrate scanning device can be used to perform position-specific processing on the substrate. The substrate scanning device may also be used for imaging (e.g., scanning electron microscope (SEM) and atomic force microscope (AFM), etc.), as well as for other applications such as integrated photonics and microelectromechanical systems (MEMS).

[0014] Position-targeted processing can be applied to various substrate processing techniques such as etching, stripping, cleaning, particle removal, deposition, and ion implantation. For example, position-targeted processing is advantageously applicable to gas cluster ion beam (GCIB) processing. Another application where position-targeted processing is advantageous is plasma etching, which is configured to etch only a portion of the substrate. Other applications of position-targeted processing include cleaning processes that utilize fluid or gas flow. Position-targeted processing allows for highly precise and advantageous adjustment of the amount added to or removed from a selected area of ​​the substrate.

[0015] Position specialization processing may be used for GCIB processing. For example, during the GCIB processing step, the substrate (e.g., wafer) can be scanned through with a particle beam to uniformly expose the substrate surface to the particle beam. The particle beam contains a wide distribution of clusters of thousands to a few atoms / molecules (including monomers). The cross-section of the particle beam is usually small compared to the area of the substrate surface. Therefore, during the GCIB processing, a substrate scanning device can be used to expose a part of the substrate surface or the entire substrate surface to the particle beam. Instead of moving the GCIB source (e.g., nozzle), moving the substrate through a mechanically stationary beam can avoid problems in controlling the spot size and shape during the electrostatic scanning of a high-current ion beam.

[0016] Conventional substrate scanning devices such as those used for GCIB processing have large mechanisms that may be located on the substrate side. For example, the substrate may be held at one end and extend relatively far from the rotating axis that drives the movement of the substrate. These large mechanisms are often placed inside a large vacuum chamber containing the substrate. Such large chambers have several disadvantages compared to small chambers. Large chambers are inherently more costly to manufacture. They require larger and more expensive pumps. The larger the chamber size, the larger the installation area of the tool and the heavier the tool becomes. These require more complex automation schemes for transporting wafers within a multi-chamber cluster tool. The larger the chamber size, the more difficult it is to integrate with other processing technologies that utilize smaller vacuum chambers within the same cluster tool.

[0017] The raster pattern can also vary between different scanning mechanisms. Some raster patterns, such as a spiral raster pattern, can reduce the chamber size by reducing the size of the scanning mechanism. For example, in contrast to moving the substrate along a linear path, in the design of some substrate scanning devices, an arc motion can be used to move the substrate along an arc. By combining the arc motion with the rotation of the substrate, while moving from one end of the substrate to the center and, if necessary, reversing the direction of the arc motion to return to the same side of the substrate or pass through the center of the rotating substrate and proceed to the opposite side, a spiral raster pattern can be effectively formed on the processed area.

[0018] Due to the spiral raster pattern, the lateral speed controlled by the angular velocity of the arc motion is increased as it approaches the centered processing area of the substrate (e.g., the spot on the substrate surface generated by the nozzle) to equalize the residence time across the entire substrate. However, to achieve a completely uniform residence time, the angular velocity when passing through the center would need to be infinite. Therefore, to effectively control, a realistic upper limit of the angular velocity must be set for the spiral raster pattern. As a result, the residence time at the center and in the vicinity of the substrate becomes longer compared to other areas of the substrate, leading to unwanted overprocessing at the center and malfunctioning of any process that requires high precision for addition or subtraction processing.

[0019] The following embodiments advantageously achieve an improvement in processing accuracy due to the enlargement of the scanning mechanism in combination with the reduction of the chamber size enabled by the arc motion of the substrate.

[0020] The following multiple embodiments describe various systems, apparatuses, and methods for performing substrate scanning, particularly those including a rotatable substrate holder attached to the distal end of a pendulum arm. These multiple embodiments are described in the following description. A substrate scanning apparatus of one embodiment is illustrated with Figures 1 and 2. A parallel raster pattern of one embodiment is illustrated with Figure 3. An example of the movement of the pendulum arm of a substrate scanning apparatus of one embodiment is illustrated with Figure 4. A geometric diagram of a substrate scanning apparatus of one embodiment is illustrated with Figure 5. Two embodiments of substrate scanning apparatuses with different nozzle configurations are illustrated with Figures 6 and 7. Another embodiment of a substrate scanning apparatus is illustrated with Figures 8 and 9. Three embodiments of substrate scanning processes that scan the entire substrate in two separate steps are illustrated with Figures 10, 11A, and 11B. A side view of a substrate scanning apparatus of one embodiment is shown and illustrated with Figure 12. A substrate scanning system of one embodiment is illustrated with Figure 13. A substrate scanning method of one embodiment is illustrated with Figure 14.

[0021] Figure 1 shows three schematic diagrams of a substrate scanning device, according to one embodiment of the present invention, which includes a rotary drive attached to the distal end of a pendulum arm, as viewed from above.

[0022] Referring to Figure 1, the substrate scanning device 100 includes a substrate 101 placed in a processing chamber 110. A pendulum arm 125 is also at least partially placed in the processing chamber 110. The pendulum arm 125 includes a proximal end 123 and a distal end 124. The proximal end 123 is coupled to a first rotational drive 121. The first rotational drive is configured to move the pendulum arm 125 in an arc motion 150 about the proximal end 123 of the pendulum arm 125.

[0023] The substrate 101 is coupled to a second rotational drive 122 at a pivot point 127. In some embodiments, the pivot point 127 is at the center 105 of the substrate 101 (as shown in the figure). In other embodiments, the pivot point 127 is offset from the center 105 of the substrate 101. The second rotational drive 122 is mounted on the distal end 124 of the pendulum arm 125 and is configured to rotate the substrate 101 around the pivot point 127 (e.g., via a substrate holder) in synchronous motion 150 of the pendulum arm 125, thereby moving the substrate 101 laterally relative to the position-specializing device.

[0024] A position-specific device (such as a position-specific processing device or a raster imaging device) is focused on a localized spot 109 on the substrate 101. Scanning the substrate 101 enables the step of performing position-specific processing on the substrate 101 using the localized spot 109. However, scanning the substrate may also be used for various other techniques, such as imaging techniques. In applications such as imaging, the processing chamber 110 is sometimes simply called a scanning chamber, but it should be noted that for explanatory purposes, the processing chamber may be considered a scanning chamber if a scanning mechanism is included in the processing chamber.

[0025] The combination of the arc motion 150 of the pendulum arm 125 and the rotation 155 of the substrate 101 at the distal end 124 is advantageous in that it allows for high-precision control of localized spots 109 on the substrate 101 and complete access to the entire surface of the substrate 101. For example, the embodiments described herein have the advantage of allowing for precise scanning of the substrate (i.e., scanning along parallel paths such as a straight line 135). While any pattern is possible, linear scanning including parallel or substantially straight lines may be desirable for several reasons, including improved consistency in both dwell time and the size and shape of the exposed area, as well as more precise fine control over position. The three schematic diagrams shown in Figure 1 illustrate the ability of the substrate scanning device 100 to reach the entire area of ​​a straight line 135 passing through the center 105 of the substrate 101.

[0026] As shown in the figure, the localized spot 109 may, but is not required, pass directly over the center 105 of the substrate 101. For example, by shifting the localized spot 109 by half the spot size, the center 105 can be uniformly exposed even without passing directly over it. Such a configuration is shown, for example, in Figure 3. The localized spot 109 may also be moved away from or closer to the proximal end 123 of the pendulum arm 125, depending on the specific content of the given application. The position of the localized spot 109 relative to the first rotation drive 121 and the second rotation drive 122 may affect the range of motion required of the scanning mechanism and its ability to scan the entire substrate.

[0027] As described above, the substrate 101 may be fixed to a substrate holder (not shown in the specific figure for simplicity). The substrate holder may be of any suitable size, but unless otherwise specified, it may be assumed to be substantially the same length as the substrate 101. Furthermore, unless otherwise specified, the center 105 of the substrate 101 is the center of the substrate holder.

[0028] The substrate 101 may be any suitable substrate (or an empty substrate holder) whose exposed surface scanning is desired. In various embodiments, the substrate 101 is a wafer, and in one embodiment, a silicon wafer. More possible substrates include flat panel displays, photolithography masks, etc. While many substrates are circular, it is not essential that the substrate 101 is circular, or even nearly circular. For example, the substrate 101 may be circular, square, rectangular, or any other desired shape, including irregular shapes.

[0029] In various embodiments, the processing chamber 110 is a vacuum chamber capable of maintaining a pressure lower than ambient atmospheric pressure. In some embodiments, the processing chamber 110 is configured to maintain a high vacuum environment, and in one embodiment, it is configured to maintain an ultra-high vacuum. While maintaining a vacuum is often advantageous in many applications, there are no limitations on the processing chamber 110's ability to maintain a certain level of vacuum. However, several embodiments described herein are advantageous in that, due to the compactness and internal configuration of the scanning mechanism, the airtightness of the processing chamber in these embodiments is improved, as is the cleanliness of the substrate scanning apparatus during operation.

[0030] In one embodiment, the entire pendulum arm 125 is located within the processing chamber 110. In several other embodiments, a portion of the pendulum arm 125 may pass through a feedthrough to the processing chamber 110. The pendulum arm 125 is longer than the radius of the substrate 101 (or half the maximum dimension of the non-circular substrate). As shown in the figure, the small size of the pendulum arm 125 allows for a favorable reduction in the area required by the processing chamber 110 compared to conventional bulky scanning mechanisms. In some applications, the length of the pendulum arm 125 may be increased (for example, to improve controllability or reduce the angular velocity at the substrate). However, the combination of the arc motion 150 of the pendulum arm 125 and the rotation 155 of the substrate 101 allows for a relatively small area to be occupied.

[0031] Figure 2 shows three more schematic diagrams of a substrate scanning device, according to one embodiment of the present invention, including a rotary drive mounted on the distal end of a pendulum arm, viewed from above. The schematic diagrams in Figure 2 show different views of the same configuration as described above using Figure 1. These different views further demonstrate the ability of the configuration to reach all areas of the substrate. The elements labeled similarly are as described above.

[0032] Referring to Figure 2, the substrate scanning device 200 includes the substrate 101, along with guide lines 236 indicating the orientation of the substrate 101. Note that, in order to keep the following explanation concise and clear, the notation used is such that elements associated with pattern [x00] may be related implementation examples of the substrate scanning device in various embodiments. For example, the substrate scanning device 200 may be the same as the substrate scanning device 100 unless otherwise stated. Also, in conjunction with the numbering system described above, similar terminology is used for other elements for clarity.

[0033] Guide lines 236 help visualize the mapping of the arc motion and rotation system onto the entire surface of the substrate 101. For example, the substrate 101 has a step in which it swings by the arc motion 150 until the localized spot 109 is at or off the edge of the substrate 101. As the substrate 101 traverses the arc, the localized spot 109 continuously exposes the substrate 101 from the center 105 to the edge. The arc motion 150 can be stopped at any point along the path, and the substrate 101 can be rotated 155 to reach any point on the substrate 101.

[0034] Figure 3 shows a top view of parallel raster patterns superimposed on a substrate according to one embodiment of the present invention. The substrate in Figure 3 may be, for example, the substrate 101 in Figure 1, or other specific mounting examples of substrates described herein.

[0035] Referring to Figure 3, a parallel raster pattern 330 is shown superimposed on a substrate 300, illustrating how the pattern covers the entire substrate 300. The parallel raster pattern 330, as a whole, consists of a series of parallel passes that cover the entire area of ​​the substrate 300 being scanned. While there are no restrictions on the specific pattern that can be used, in some embodiments, the parallel raster pattern is a linear raster pattern consisting of a series of parallel straight lines (or nearly straight lines) extending from one side of the substrate 300 to the other, as shown. Each section of the parallel raster pattern 330 extending from one side of the substrate 300 to the other may be referred to as a pass 333. The parallel raster pattern 330 does not need to change direction while covering the substrate 300 (as shown). While not a strict requirement, this may have the advantage of ensuring extremely consistent exposure of the substrate 300 during scanning.

[0036] In this particular implementation of parallel raster patterns, each consecutive pass of the parallel raster pattern 330 moves in the opposite direction to the preceding pass. For example, the first pass 331 may be scanned from left to right, as shown in the figure, the second pass 332 may be scanned from right to left, and so on. The parallel raster pattern 330 may start from the endpoint of the path, or it may start from any point along the way (for example, when scanning half of the substrate at once, as described later). Also note that because the spot size of the parallel raster pattern 330 is finite (often Gaussian), it may or may not directly pass through the center 305 of the substrate 300.

[0037] Although the parallel raster pattern 330 is illustrated and described as covering the entire substrate 300, partial processing is also possible, not just partial coverage. For example, the processing unit may be stopped at several points in the pattern to process only specific areas of the substrate 300. Similarly, the parameters of the substrate processing (e.g., intensity, duration, etc.) may be changed in real time during scanning to vary the processing of different parts of the substrate compared to other parts of the substrate. In some cases (for example, when multiple locations on the substrate to be processed are grouped together, or when representing a relatively small portion of the total area of ​​the substrate), a partial raster pattern may be used.

[0038] The ability described above to dynamically change processing parameters while the combined scanning scans only a portion of the substrate is advantageous in that it can enable targeted processing of specific areas of the substrate (for example, areas where correctable defects have been identified or where processing needs to be done without damaging other parts of the substrate).

[0039] Figure 4 shows a schematic diagram of the movement of the pendulum arm and substrate according to one embodiment of the present invention. The schematic diagram of the substrate in Figure 4 may represent a specific configuration of other substrates described herein, such as substrate 101 in Figure 1. Similarly, the labeled elements may be as described above.

[0040] Referring to Figure 4, schematic diagram 400 shows the substrate 101 in various positions during circular motion and rotation. Schematic diagram 400 shows how the substrate 101 and the pendulum arm 125 move when a straight line 437, which is off-center and does not pass through the center 405 of the substrate 101, is followed. As before, the substrate 101 is connected to the distal end of the pendulum arm 125. The straight line 435 passing through the center 405 is drawn along with a thicker straight line 437 and a thick arrow that are off-center, indicating the direction in which the substrate 101 rotates.

[0041] At the lowest position shown in the diagram, the localization spot 109 is located on the edge of the substrate 101 on a line 437 offset from the center. The position of the pendulum arm 125 causes a first rotation 456 of 22.2° counterclockwise, moving the end of the off-center line 437 to the localization spot 109. As the substrate 101 on the pendulum arm 125 moves toward the localization spot 109 by the first circular motion 451, the substrate 101 continues to rotate counterclockwise, increasing its angular velocity. For example, between the two upper positions, the substrate 101 only undergoes a small (almost) linear motion 434, but the second rotation 457 is caused by a larger angular motion 438.

[0042] At the upper position, the localized spot 109 is located at the midpoint 439 of a straight line 437 off-center. At this point, either the arc motion or the rotation of the substrate can continue in the same direction, while the other can also continue in the same direction. If the arc motion continues past this point, the rotation must stop instantaneously and rotate in the opposite direction. This may be far less practical than alternatives because the arc motion naturally slows down as it approaches the midpoint 409, while the rotational motion compensates for the decrease in arc motion to maintain a constant scanning speed.

[0043] Consequently, it may be advantageous to take a step that changes the direction of the arc motion during each pass of a parallel raster pattern that does not pass through the center. By scanning directly through the center, both the arc motion and rotation can maintain their respective directions. Therefore, the pendulum arm 125 may change direction at the midpoint 439 to follow the second arc motion 452 in order to complete a linear path along a line off-center. For the sake of clarity, the substrate 101 is not shown moving in the latter half of the path. Since the line off-center 437 is very close to the center 405, the return motion of the substrate 101 is fairly symmetrical. The second arc motion 452 is shown as symmetrical, but note that this is only an approximation as it is asymmetrical. In fact, the further the path is from the center 405, the less symmetry there is in the return movement.

[0044] Furthermore, changing the direction of the arc motion may have the additional advantage of reducing the area required in the processing chamber when only half of the substrate 101 needs to be processed. As will be explained with reference to Figures 10, 11A, and 11B, there are also configurations that allow scanning of the entire substrate with a limited area.

[0045] The substrate diameter of 407 affects the range of arc motion required to move away from the origin. For example, the proportional relationship shown is for a substrate radius of 150 mm (substrate diameter of 407 with a substrate radius of 300 mm) and a pendulum arm of 125 mm with a length of 250 mm. The specific ratio for a given application may depend on various factors, such as acceleration and velocity limitations, the desired or required area of ​​the processing chamber, and the range of the substrate to be processed. Generally, the longer the pendulum arm, the smaller the angular range required for arc motion and the smaller the area occupied in one dimension, but the area occupied in other dimensions increases due to the extension of the pendulum arm.

[0046] While this specification focuses on the ability of the scanning mechanism to reach any part of the substrate and trace out a raster pattern consisting of straight lines, it should be noted that any raster pattern is possible using the various substrate scanning embodiments described herein. For example, the substrate scanning methods, apparatus, and systems described herein are equally capable of generating raster patterns that include curves or trace out any pattern as desired for a given application. That is, the advantages obtained by combining a pendulum arm with a rotatable substrate, such as reduced tool footprint and improved accuracy, are equally applicable to other raster patterns.

[0047] Figure 5 shows a geometric diagram of the movement of a substrate relative to a stationary position-specific processing device according to one embodiment of the present invention. The geometric diagram of the substrate in Figure 5 can represent a specific configuration of other substrates described herein, such as the substrate 101 in Figure 1. Similarly, the labeled elements may be as described above.

[0048] Referring to Figure 5, geometric figure 500 shows the substrate 101 centered at a position on the edge of a great circle with radius R1. Radius R1 is the length of the pendulum arm. Similarly, radius R2 is the radius of the base plate. The figure shows the arc motion φ and rotation θ angles required to move point (r,α) to the localized spot 109 at (0,0).

[0049] Since φ is the vertex angle of an isosceles triangle, θ-α=φ / 2. Assuming that the coordinates (r,α) of the point to be scanned are known, the rotation φ can be determined from φ=2arcsin(r / R1 / 2), and then the circular motion θ can be solved using the above equation. For example, at the lowest position in Figure 4, (r,α)=(150mm,4.8°) and R1=250mm, so φ=34.9° (and θ=22.2°).

[0050] As described with reference to Figure 4, the angular acceleration and velocity of the substrate increase dramatically near the midpoint of multiple lines, although they do not pass through the center of the pivot point. In many applications, this is not a problem. However, in some applications, especially with small spot sizes, managing such high angular acceleration and velocity can be difficult. Figures 6-10, 11A, and 11B illustrate various embodiments that address this potential problem.

[0051] Figure 6 shows a schematic top view of a substrate scanning device including two or more static processing nozzles according to one embodiment of the present invention. The substrate scanning device in Figure 6 may be a specific implementation example of other substrate scanning devices described herein, such as the substrate scanning device in Figure 1. Similarly labeled elements are as described above.

[0052] Referring to Figure 6, the substrate scanning device 600 includes a substrate 101 placed in a processing chamber 610, similar to the substrate scanning device 100 in Figure 1. However, in contrast to Figure 1, the substrate scanning device 600 includes two or more static processing nozzles, including a first static processing nozzle 661 and a second static processing nozzle 662, which are positioned at different distances 667 from a first rotary drive 121. The multiple static processing nozzles may be used to scan multiple different parts of the substrate, advantageously avoiding scanning too close to the center of the substrate.

[0053] Figure 7 shows a schematic top view of a substrate scanning device including a translational processing nozzle according to one embodiment of the present invention. The substrate scanning device in Figure 7 may be a specific implementation example of other substrate scanning devices described herein, such as the substrate scanning device in Figure 1. Similarly labeled elements are as described above.

[0054] Referring to Figure 7, the substrate scanning device 700 includes a substrate 101 placed in a processing chamber 710, similar to the substrate scanning device 100 in Figure 1. However, in contrast to Figure 1, the substrate scanning device 700 includes a single translatable processing nozzle 763 that can move between a first rotary drive 121 and a different distance 667. Multiple processing nozzles may be used to scan different parts of the substrate, advantageously avoiding scanning too close to the center of the substrate.

[0055] It should be noted that a static processing nozzle is different from a nozzle that remains stationary over a portion of the processing area. For the purposes of this disclosure, a stationary nozzle does not move relative to the substrate scanning device itself (except potentially for calibration and maintenance reasons), whereas a stationary nozzle may be either a stationary nozzle or a translational (i.e., movable) nozzle.

[0056] Figure 8 shows three schematic diagrams of a substrate scanning device, viewed from above, according to one embodiment of the present invention, which includes a rotary drive attached to the distal end of a pendulum arm and a substrate attached to the rotary drive at a pivot point offset from the center of the substrate. The substrate scanning device in Figure 8 may be a general implementation example of other substrate scanning devices described herein, such as the substrate scanning device in Figure 1. Similarly labeled elements are as described above.

[0057] Referring to Figure 8, the substrate scanning device 800 is similar to the substrate scanning device 100 in Figure 1, except that the pivot point 827 of the second rotary drive 822 is offset from the center of the substrate 101 by an offset distance d smaller than the outer radius of the substrate (and substrate holder). As shown in the three schematic diagrams, the longer reach of the rotation 855 results in a slight increase in the occupied area of ​​the processing chamber 810. However, as with the on-axis embodiment described earlier, the off-axis configuration still has the advantage of reaching all parts of the substrate 101 within a small occupied area.

[0058] The offset distance d may be appropriately selected to balance the advantage of a small processing chamber footprint with the angular acceleration and velocity requirements of a given process. A smaller offset distance d may be advantageous because the angular velocity and acceleration of the line decrease rapidly as it moves away from the center.

[0059] Figure 9 shows three more schematic diagrams, viewed from above, of a substrate scanning device according to one embodiment of the present invention, which includes a rotary drive attached to the distal end of a pendulum arm and a substrate attached to the rotary drive at a pivot point offset from the center of the substrate. The schematic diagrams in Figure 9 show different views of a configuration similar to that described above using Figure 8. These different views further demonstrate the ability of the configuration to reach all areas of the substrate. The similarly labeled elements are as described above.

[0060] Referring to Figure 9, the substrate scanning device 900 includes a substrate 101 drawn with guide lines 936 to indicate the orientation of the substrate 101. Similar to guide lines 236, guide lines 936 help visualize the mapping of the arc motion and rotation system onto the entire surface of the substrate 101.

[0061] Figure 10 shows a substrate scanning process according to one embodiment of the present invention, in which the substrate is lifted from the substrate holder and rotated 180°. The substrate scanning process in Figure 10 can be performed using, for example, the substrate scanning device in Figure 8, or other substrate scanning devices described herein. Similarly labeled elements are as described above.

[0062] Referring to Figure 10, the substrate scanning process 1000 includes five steps labeled (a), (b), (c1), (d), and (e). Step (a) shows a processing chamber 1010 which includes a substrate 101 offset from the second rotary drive 822 and includes guide lines 1036 indicating rotation in subsequent steps.

[0063] In step (b), the first processing area 1011 is scanned. The first processing area 1011 includes at least half of the surface of the substrate 101. In step (c1), the substrate 101 is lifted from the substrate holder (for example, using a lift pin 1041 or other physically protruding support, clamp, arm, or other lifting mechanism). The substrate 101 is then rotated 1042 by 180°. Then, in step (d), the entire surface of the substrate is scanned as shown in step (e) by scanning the remaining portion of the substrate 101, without the pendulum arm 125 crossing the midpoint. Thus, an advantage is that the entire surface of the substrate 101 is scanned without increasing the footprint of the processing chamber.

[0064] Figure 11A shows a substrate scanning process according to one embodiment of the present invention, which shifts the pivot point of a rotatable substrate by linearly translating the substrate relative to its pivot point. The substrate scanning process in Figure 11A can be performed using a substrate scanning device as described herein, such as the substrate scanning device in Figure 8. Similarly labeled elements are as described above.

[0065] Referring to Figure 11A, the substrate scanning process 1100 includes five steps labeled (a), (b), (c2), (d), and (e). All steps except (c2) are as previously described. In step (c2), instead of lifting and rotating the substrate 101 from the substrate holder, the substrate is linearly translated (e.g., slid) relative to the pivot point to achieve the same effect. This translation can be achieved using an actuator such as a linear actuator included in the pendulum arm 125. By not lifting the substrate to change its position, complexity can be advantageously reduced and alignment can be improved.

[0066] Figure 11B shows a substrate scanning process according to one embodiment of the present invention, in which the pivot point of a rotatable substrate is shifted by rotating and translating the substrate relative to the pivot point.

[0067] Referring to Figure 11B, the substrate scanning process 1105 includes six steps labeled (a), (b), (c3), (c4), (d), and (e). All steps except (c3) and (c4) are as previously described. In steps (c3) and (c4), instead of lifting the substrate 101 from the substrate holder or physically translating the substrate 101 linearly, the substrate 101 is rotated 1147 around a pivot point using a rotation mechanism 1145 (for example, a belt may be used) to achieve the same effect. Similar to linear translation, not lifting the substrate to change its position can be advantageously simplified, reducing complexity and improving alignment.

[0068] Figure 12 shows a schematic side view of a substrate scanning device according to one embodiment of the present invention. The substrate scanning device in Figure 12 may be a specific implementation example of other substrate scanning devices described herein, such as the substrate scanning device in Figure 1 or 8. Similarly labeled elements are as described above.

[0069] Referring to Figure 12, the substrate scanning device 1200 includes a processing chamber 1210 which includes a processing nozzle 1265 and an exhaust port 1273. The processing nozzle 1265 is configured to focus a localized spot on a substrate 101 fixed by a substrate holder 1203. Although the processing nozzle 1265 is shown as single and static, it may be replaced by one of the alternative nozzles shown in Figures 6 and 7, and each nozzle is typically stationary while actually processing the substrate.

[0070] The exhaust port 1273 is configured to create a vacuum environment for scanning and processing the substrate. As shown in the figure, the pivot point 827 is located in a typical position offset from the center of the substrate holder 1203 and the substrate 101, but the pivot point 827 may be aligned with the center. The pivot point axis 1228 is coupled to the second rotary drive 122 and the substrate holder at the distal end 124 of the pendulum arm 125. The pivot point axis 1228 can couple the rotational motion of the second rotary drive 122 to the substrate holder 1203 to facilitate the rotation 855 of the substrate 101.

[0071] Similarly, a rotary feedthrough shaft 1229 is attached to the proximal end 123 of the pendulum arm 125, coupling the rotational motion of the first rotary drive 121 to the pendulum arm 125, enabling the arc motion 150. In one embodiment, the rotary feedthrough shaft 1229 passes through the processing chamber 1210 at a vacuum feedthrough port 1271, thereby further reducing the footprint of the processing chamber 1210 and improving the cleanliness of the scanning mechanism.

[0072] Figure 13 shows a schematic side view of a substrate scanning system according to one embodiment of the present invention. The substrate scanning system in Figure 13 may include, for example, the substrate scanning apparatus in Figures 1, 8, or 12, or other substrate scanning apparatuses described herein. Similarly labeled elements are as described above.

[0073] Referring to Figure 13, the substrate scanning system 1300 includes a processing unit 1360 coupled to a processing chamber 1310. The processing chamber 1310 houses a pendulum arm 125, a substrate holder 1203, and a substrate 101. A vacuum pump 1375 is coupled to the processing chamber 1310. A controller 1370 is operably coupled to a pivot point access 1378 and an arc axis 1379 and is configured to control the simultaneous movement of the first and second rotary drives.

[0074] Figure 14 shows a method for scanning a substrate according to one embodiment of the present invention. The method in Figure 14 may be combined with other methods and performed using the systems and apparatus described herein. For example, the method in Figure 14 may be combined with any of the embodiments in Figures 1 to 13.

[0075] Referring to Figure 14, Method 1400 includes a first step 1401 of securing the substrate to a substrate holder in a processing chamber. In step 1402, a first pass of a parallel raster pattern is executed by synchronously driving a first and second rotary drive to move the substrate relative to a processing device focused on localized spots on the substrate. The first rotary drive is coupled to the proximal end of a pendulum arm, and the second rotary drive is mounted on the distal end of the pendulum arm and the substrate holder. For example, the first pass may start at a first position off the substrate, move onto the substrate, and end at a second position off the substrate. However, starting and ending at positions off the substrate are not required in either case.

[0076] Step 1402 includes steps 1403 and 1404. Steps 1403 and 1404 are performed sequentially. In step 1403, the pendulum arm moves over a first portion of the first pass during the first pass by a first arc motion while the localization spot is on the substrate. In step 1404, the pendulum arm also moves over a second portion of the first pass during the first pass, but in a second arc motion in the opposite direction, while the localization spot is on the substrate. During steps 1403 and 1404, the substrate holder may be rotated in one direction around a pivot point at the distal end of the pendulum arm.

[0077] Exemplary embodiments of the present invention are summarized below. Other embodiments can be understood from the entire text of this specification and the appended claims.

[0078] Example 1. A method for scanning a substrate, the method comprising the steps of fixing the substrate to a substrate holder in a processing chamber, and executing a first pass of a parallel raster pattern by synchronously driving a first rotary drive coupled to the proximal end of a pendulum arm and a second rotary drive mounted on the distal end of the pendulum arm and the substrate holder to move the substrate relative to a processing device focused on a localized spot on the substrate, wherein during the first pass, the step of driving the first rotary drive includes moving the pendulum arm in a first arc motion over a first portion of the first pass while the localized spot is on the substrate, and then moving the pendulum arm in a second arc motion in the opposite direction over a second portion of the first pass while the localized spot is on the substrate.

[0079] Example 2. In the method of Example 1, the pivot point is at the center of the substrate.

[0080] Example 3. The method of Example 2, further comprising the step of driving a first rotation drive and a second rotation drive synchronously to execute a second pass of a parallel raster pattern, which is parallel to the first pass and a plurality of passes passing through the center of the substrate, wherein the step of driving the first rotation drive during the second pass includes the step of moving the pendulum arm through a single continuous arc motion during the second pass.

[0081] Example 4. In the method of Example 1, the pivot point is offset in the first direction by an offset distance of less than half the maximum dimension of the substrate from the center of the substrate.

[0082] Example 5. The method of Example 4 further includes the steps of: executing a subsequent second pass of the parallel raster pattern by synchronously driving a first rotation drive and a second rotation drive so that the localized spots pass through at least half of the substrate; shifting the pivot point so that it is offset from the center of the substrate by an offset distance in the second direction opposite to the first direction; and executing a subsequent third pass of the parallel raster pattern by synchronously driving a first rotation drive and a second rotation drive so that the localized spots pass through the entire substrate region.

[0083] Example 6. In the method of Example 5, the step of shifting the pivot point includes the steps of lifting the substrate from the substrate holder, rotating the substrate 180 degrees relative to the substrate holder to a new position, and fixing the substrate in the new position on the substrate holder.

[0084] Example 7. In the method of Example 5, the step of shifting the pivot point includes the step of translating the substrate relative to the pivot point.

[0085] Example 8. A step of executing a second pass of a parallel raster pattern by synchronously driving a first rotary drive and a second rotary drive in any one of the methods of Examples 1 to 7, further comprising the step of a position-specific processing device including a first static processing nozzle and a second static processing nozzle positioned at different distances from the proximal end of a pendulum arm, wherein the second pass is parallel to the first pass, and the substrate is processed using the first processing nozzle during the first pass and processed using the second nozzle during the second pass.

[0086] Example 9. A step of performing a second pass of a parallel raster pattern by synchronously driving a first rotary drive and a second rotary drive in any one of the methods of Examples 1 to 7, wherein the position-specific processing device includes a single processing nozzle capable of translating between two or more different distances from the proximal end of a pendulum arm, and the second pass is parallel to the first pass, processing the substrate with a single processing nozzle in a first position relative to the proximal end during the first pass, and processing the substrate with a single processing nozzle in a second position relative to the proximal end during the second pass.

[0087] Example 10. The system includes a vacuum chamber, a first rotational drive coupled to the proximal end of a pendulum arm located within the vacuum chamber, a second rotational drive mounted on the distal end of the pendulum arm so as to move together with the distal end, a substrate holder located within the vacuum chamber and coupled to the second rotational drive at a pivot point, and a controller coupled to the first and second rotational drives, the controller configured to synchronously drive the first and second rotational drives so that a stationary position specialized processing device traces a raster pattern parallel to the substrate holder.

[0088] Example 11. In the system of Example 10, the first rotary drive is located outside the vacuum chamber and is coupled to the proximal end of the pendulum arm via a rotary feedthrough shaft.

[0089] Example 12. In either system from Example 10 or 11, the pivot point is at the center of the substrate.

[0090] Example 13. In the system of Example 12, the position-specific processing unit includes two or more static processing nozzles positioned at different distances from the proximal end of the pendulum arm.

[0091] Example 14. In either system of Example 12 or 13, the position-specific processing device includes a single processing nozzle capable of translating between two or more different distances from the proximal end of the pendulum arm.

[0092] Example 15. Any one of the systems in Examples 10 to 14 further includes a lift mechanism, which is located in the substrate holder and configured to lift the substrate from the substrate holder and rotate the substrate 180 degrees relative to the substrate holder to a new position.

[0093] Example 16. The system further includes an actuator coupled to a pivot point in any one of the systems in Examples 10 to 14, which is configured to shift the pivot point by translating a substrate relative to the pivot point.

[0094] Example 17. The apparatus includes a processing chamber, a pendulum arm disposed within the processing chamber and having a proximal end and a distal end, the proximal end of which is coupled to a first rotary drive configured to move the pendulum arm by arc motion around the proximal end, and a substrate holder disposed within the processing chamber and coupled to a second rotary drive at a pivot point shifted in the first direction by an offset distance smaller than the outer radius of the substrate holder from the center of the substrate holder, the second rotary drive being mounted on the distal end of the pendulum arm and configured to rotate the substrate holder around the pivot point synchronously with the arc motion of the pendulum arm, thereby moving the substrate holder laterally relative to the position-specific processing device.

[0095] Example 18. In the apparatus of Example 17, the main dimensions of the processing chamber, measured in the plane of the substrate holder, are substantially equal to the sum of the length of the pendulum arm, the offset distance, and the outer radius of the substrate holder.

[0096] Example 19. The apparatus in either Example 17 or 18 further includes a lift mechanism, which is located in the substrate holder and configured to lift the substrate from the substrate holder and rotate the substrate 180 degrees relative to the substrate holder to a new position.

[0097] Example 20. The apparatus in either Example 17 or 18 further includes an actuator coupled to a pivot point, which is configured to shift the pivot point by translating a substrate relative to the pivot point.

[0098] While the present invention has been described with reference to several exemplary embodiments, it is not intended to be constrained. Various modifications and combinations of the exemplary embodiments, as well as other embodiments of the present invention, will become apparent to those skilled in the art by referring to the above description. Accordingly, the appended claims are intended to encompass such modifications or embodiments.

Claims

1. A method for scanning a substrate, The steps include fixing the substrate to the substrate holder in the processing chamber, The step involves executing a first pass of a parallel raster pattern by synchronously driving a first rotary drive and a second rotary drive so as to move the substrate relative to a processing device that is focused on a localized spot on the substrate. The first rotary drive is coupled to the proximal end of the pendulum arm, and the second rotary drive is mounted on the substrate holder at the distal end of the pendulum arm. Steps, including, During the first pass, driving the first rotary drive is While the localized spot is on the substrate, the pendulum arm is moved by a first arc motion across the first portion of the first pass, and Next, while the localized spot is on the substrate, the pendulum arm is moved by a second arc motion in the opposite direction across a second portion of the first pass, method.

2. The substrate holder is coupled to the second rotary drive at a pivot point, and the pivot point is at the center of the substrate. The method according to claim 1.

3. The above method further, The step is to execute a second pass of the parallel raster pattern by synchronously driving the first rotation drive and the second rotation drive, The second path is parallel to the first path and passes through the center of the substrate. Steps include, During the second pass, driving the first rotary drive is During the second pass, the pendulum arm is moved by a single continuous arc motion, The method according to claim 2.

4. The substrate holder is coupled to the second rotary drive at a pivot point, and the pivot point is offset in the first direction by an offset distance of less than half the maximum dimension of the substrate from the center of the substrate. The method according to claim 1.

5. The above method further, The steps include: executing a subsequent second pass of the parallel raster pattern by synchronously driving the first rotary drive and the second rotary drive so that the localized spots pass through at least half of the substrate; A step of shifting the pivot point such that it is offset by the offset distance from the center of the substrate in a second direction opposite to the first direction, The steps include: executing a third subsequent pass of the parallel raster pattern by synchronously driving the first rotary drive and the second rotary drive so that the localized spots pass through the entire area of ​​the substrate; The method according to claim 4, comprising:

6. The step of shifting the pivot point is Lifting the substrate from the substrate holding portion, The substrate is rotated 180 degrees relative to the substrate holding portion to a new position, and To fix the substrate at the new position of the substrate holding portion, The method according to claim 5, including the method described in claim 5.

7. The step of shifting the pivot point is To translate the substrate relative to the pivot point, The method according to claim 5, including the method described in claim 5.

8. The above method further, The process includes the step of performing a second pass of the parallel raster pattern by synchronously driving the first rotary drive and the second rotary drive, The position-specific processing device includes a first static processing nozzle and a second static processing nozzle, which are positioned at different distances from the proximal end of the pendulum arm. The second path is parallel to the first path, The substrate is processed using the first static processing nozzle during the first pass, and The substrate is processed using the second static processing nozzle during the second pass. The method according to claim 1.

9. The above method further, The process includes the step of performing a second pass of the parallel raster pattern by synchronously driving the first rotary drive and the second rotary drive, The position-specific processing device includes a single processing nozzle capable of translating between two or more different distances from the proximal end of the pendulum arm, The second path is parallel to the first path. The substrate is processed during the first pass using the single processing nozzle located at a first position relative to the proximal end, The substrate is processed during the second pass using the single processing nozzle located at a second position relative to the proximal end. The method according to claim 1.

10. Vacuum chamber and A first rotational drive is coupled to the proximal end of a pendulum arm positioned within the vacuum chamber, Since it is mounted on the distal end of the pendulum arm, the second rotation drive moves together with the distal end, A substrate holder configured to support a substrate, located within the vacuum chamber, and coupled to the second rotary drive at a pivot point offset from the center of the substrate by an offset distance smaller than the outer radius of the substrate. The second rotary drive is configured to rotate the substrate holder alternately around the pivot point in a clockwise and counterclockwise direction, in synchronization with the arc motion of the pendulum arm, and the substrate holder is configured to rotate the substrate holder alternately in a clockwise and counterclockwise direction. A controller coupled to the first rotary drive and the second rotary drive, A controller is configured to synchronously drive the first rotary drive and the second rotary drive, causing a position-specific processing device to trace a parallel raster pattern on the substrate. A system that includes this.

11. The first rotary drive is located outside the vacuum chamber and is coupled to the proximal end of the pendulum arm via a rotary feedthrough shaft. The system according to claim 10.

12. The pivot point is located at the center of the substrate. The system according to claim 10.

13. The position-specific processing device includes two or more static processing nozzles positioned at different distances from the proximal end of the pendulum arm. The system according to claim 12.

14. The position-specific processing device includes a single processing nozzle capable of translating between two or more different distances from the proximal end of the pendulum arm. The system according to claim 12.

15. The aforementioned system further, The lift mechanism, which is positioned in the substrate holding portion and configured to lift the substrate from the substrate holding portion and rotate the substrate 180 degrees relative to the substrate holding portion to a new position, The system according to claim 10.

16. The aforementioned system further, Includes an actuator coupled to the pivot point, The actuator is configured to shift the pivot point by translating the substrate relative to the pivot point. The system according to claim 10.

17. Processing chamber and It is a pendulum arm located within the processing chamber, and includes a proximal end and a distal end. The pendulum arm is configured such that its proximal end is coupled to a first rotational drive configured to move the pendulum arm by an arc motion centered on the proximal end, The processing chamber includes a substrate holder, which is arranged within the processing chamber and coupled to a second rotary drive at a pivot point shifted in the first direction by an offset distance smaller than the outer radius of the substrate holder from the center of the substrate holder, The second rotary drive is mounted on the distal end of the pendulum arm and is configured to rotate the substrate holder around the pivot point in synchronous motion with the arc motion of the pendulum arm, thereby moving the substrate holder laterally relative to the position-specific processing device. Device.

18. The main dimensions of the processing chamber, measured within the plane of the substrate holding portion, are substantially equal to the sum of the length of the pendulum arm, the offset distance, and the outer radius of the substrate holding portion. The apparatus according to claim 17.

19. The aforementioned device further, The lift mechanism, which is positioned in the substrate holding portion and configured to lift the substrate from the substrate holding portion and rotate the substrate 180 degrees relative to the substrate holding portion to a new position, The apparatus according to claim 17.

20. The aforementioned device further, Includes an actuator coupled to the pivot point, The actuator is configured to shift the pivot point by translating the substrate relative to the pivot point. The apparatus according to claim 17.

Images