Biochip and method for manufacturing the same

Abstract

A biochip and manufacturing method that can contain a solution without overflow and simultaneously detect multiple biomaterials without interference. [Solution] A semiconductor layer is placed on a substrate and has a reaction region, an insulating layer is placed on the semiconductor layer and has a first opening that exposes the reaction region, a metal layer is placed on the insulating layer and includes source and drain electrodes and an enclosure wall structure, the source and drain electrodes are electrically connected to the semiconductor layer, the enclosure wall structure surrounds the first opening, the source and drain electrodes, a first protective layer is placed on the metal layer and has a second opening, a second protective layer is placed on the first protective layer and has a third opening and a fourth opening, the second protective layer includes a first protrusion, a second protrusion and a third protrusion, the first protrusion is placed corresponding to the source electrode, the second protrusion is placed corresponding to the drain electrode, the third protrusion is placed corresponding to the enclosure wall structure and surrounds and defines the fourth opening, the third opening overlaps the second and first openings in the direction normal to the substrate, and the fourth opening exposes the first protective layer.

Description

Technical Field

[0001] The present invention relates to a semiconductor chip and a method for manufacturing the same, and particularly to a biochip and a method for manufacturing the same.

Background Art

[0002] In a general biochip, the space capable of accommodating a normal solution (for example, a polymer spotting solution or a sample solution) is limited by the size of the reaction region. Therefore, when the amount of the solution is large or there is an error in solution addition, the problem of solution overflow is likely to occur.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The present invention provides a biochip and a method for manufacturing the same, which can prevent the problem of overflow of a solution (for example, a polymer spotting solution or a sample solution), can accommodate a larger volume of the solution, and can simultaneously detect a plurality of types of biological materials without interfering with each other.

Means for Solving the Problems

[0004] The biochip of the present invention is used to detect biomaterials and includes a substrate, a semiconductor layer, an insulating layer, a metal layer, a first protective layer, and a second protective layer. The semiconductor layer is placed on the substrate and has a reaction region. The insulating layer is placed on the semiconductor layer and has a first opening that exposes the reaction region. The metal layer is placed on the insulating layer and includes a source electrode, a drain electrode, and an enclosure wall structure. The source electrode and drain electrode are electrically connected to the semiconductor layer, respectively. The enclosure wall structure surrounds the first opening, the source electrode, and the drain electrode. The first protective layer is placed on the metal layer and has a second opening. The second protective layer is placed on the first protective layer and has a third opening and a fourth opening. The second protective layer includes a first protrusion, a second protrusion, and a third protrusion. The first protrusion is placed corresponding to the source electrode. The second protrusion is placed corresponding to the drain electrode. The third protrusion is placed corresponding to the enclosure wall structure and surrounds and defines the fourth opening. In the direction normal to the substrate, the third opening overlaps the second and first openings. The fourth opening exposes the first protective layer.

[0005] In one embodiment of the present invention, the source electrode, drain electrode, and enclosure wall structure are on the same layer and separated from each other, and the source electrode and drain electrode are electrically insulated from the enclosure wall structure.

[0006] In one embodiment of the present invention, the first protective layer is a hydrophobic material.

[0007] In one embodiment of the present invention, the second protective layer is a hydrophilic material.

[0008] In one embodiment of the present invention, the first protrusion, the second protrusion, and the third protrusion are separated from each other.

[0009] In one embodiment of the present invention, the third projection completely encloses the fourth opening.

[0010] In one embodiment of the present invention, the third opening is located between the first protrusion and the second protrusion, and the fourth opening is located between the second protrusion and the third protrusion.

[0011] In one embodiment of the present invention, the dimensions of the fourth opening are greater than the dimensions of the third opening.

[0012] In one embodiment of the present invention, the biochip further comprises a solution, the solution in contact with the upper surface of the first protective layer exposed through a fourth opening, and the solution comprises a biological probe.

[0013] The method for manufacturing the biochip of the present invention comprises the following steps: A substrate is provided. A semiconductor layer is formed on the substrate, the semiconductor layer having a reaction region. An insulating layer is formed on the semiconductor layer, the insulating layer having a first opening that exposes the reaction region. A metal layer is formed on the insulating layer, the metal layer including a source electrode, a drain electrode and an enclosure wall structure, the source electrode and drain electrode being electrically connected to the semiconductor layer, and the enclosure wall structure surrounding the first opening, the source electrode and the drain electrode. A first protective layer is formed on the metal layer, the first protective layer having a second opening. A second protective layer is formed on the first protective layer, the second protective layer having a third opening and a fourth opening, and including a first protrusion, a second protrusion and a third protrusion. The first protrusion is positioned corresponding to the source electrode. The second protrusion is positioned corresponding to the drain electrode. The third protrusion is positioned corresponding to the enclosure wall structure and defines the fourth opening. In the direction normal to the substrate, the third opening overlaps the second opening and the first opening. The fourth opening exposes the first protective layer. [Effects of the Invention]

[0014] Based on the above, in one embodiment of the present invention, the biochip and its manufacturing method, the third protrusion installed above the enclosure wall structure is a figure that completely encloses the fourth opening, so that the solution (e.g., polymer spotting solution or sample solution) can not overflow outside the fourth opening, a larger volume of solution can be accommodated, and multiple types of biomaterials can be detected simultaneously without interfering with each other.

[0015] To make the above-mentioned features and advantages of the present invention easier to understand, examples will be given below and described in detail together with the accompanying drawings. [Brief explanation of the drawing]

[0016] [Figure 1] This is a schematic plan view of a biochip according to one embodiment of the present invention. [Figure 2] Figure 1 is a three-dimensional schematic diagram of the biochip manufacturing method. [Figure 3] Figure 1 is a three-dimensional schematic diagram of the biochip manufacturing method. [Figure 4] Figure 1 is a three-dimensional schematic diagram of the biochip manufacturing method. [Figure 5] Figure 1 is a three-dimensional schematic diagram of the biochip manufacturing method. [Figure 6] Figure 1 is a three-dimensional schematic diagram of the biochip manufacturing method. [Figure 7] Figure 6 is a schematic cross-sectional view of the biochip along the cross-sectional line I-I'. [Figure 8] Figure 6 is a schematic cross-sectional view of the biochip along the cross-sectional line II-II'. [Modes for carrying out the invention]

[0017] Figure 1 is a schematic plan view of a biochip according to one embodiment of the present invention. Figures 2 to 6 are schematic three-dimensional views of the manufacturing method of the biochip of Figure 1. Figure 7 is a schematic cross-sectional view of the biochip of Figure 6 along the cross-sectional line I-I'. Figure 8 is a schematic cross-sectional view of the biochip of Figure 6 along the cross-sectional line II-II'. For clarity and ease of explanation, the semiconductor layer 120, metal layer 140, and solution 200 in the biochip 10 are omitted from Figures 5 and 6.

[0018] Referring to FIGS. 1, 6, 7 and 8 simultaneously, the biochip 10 of this embodiment can include at least one detection unit 100 (in FIG. 1, three detection units 100 are illustratively shown, but it is not limited thereto). The detection unit 100 includes a substrate 110, an insulating layer IL1, an insulating layer IL2, a semiconductor layer 120, an insulating layer 130, a metal layer 140, a first protective layer 150 and a second protective layer 160. The semiconductor layer 120 is installed on the substrate 110 and has a reaction region 121. The insulating layer 130 is installed on the semiconductor layer 120 and has a first opening O1 that exposes the reaction region 121. The metal layer 140 is installed on the insulating layer 130, and the metal layer 140 includes a source electrode 141, a drain electrode 142 and a surrounding wall structure 143. The source electrode 141 and the drain electrode 142 are electrically connected to the semiconductor layer 120 respectively. The surrounding wall structure 143 can surround the first opening O1, the source electrode 141 and the drain electrode 142. The first protective layer 150 is installed on the metal layer 140 and has a second opening O2. The second protective layer 160 is installed on the first protective layer 150, and the second protective layer 160 has a third opening O3 and a fourth opening O4. The second protective layer 160 includes a first protrusion 161, a second protrusion 162 and a third protrusion 163. The first protrusion 161 is installed corresponding to the source electrode 141. The second protrusion 162 is installed corresponding to the drain electrode 142. The third protrusion 163 is installed corresponding to the surrounding wall structure 143, and the third protrusion 163 can surround and define the fourth opening O4. In the normal direction Z of the substrate 110, the third opening O3 can overlap with the second opening O2 and the first opening O1. The fourth opening O4 can expose a part of the first protective layer 150.

[0019] The biochip 10 of this embodiment can be used for detecting biological materials. The biological materials are, for example, microorganisms or biomolecules in a sample solution, but are not limited thereto. The microorganisms can include, for example, bacteria, viruses or combinations thereof, and the biomolecules can include, for example, nucleic acids (including deoxyribonucleic acid, ribonucleic acid or combinations thereof), nucleotides, proteins, carbohydrates, lipids or combinations thereof, but are not limited thereto.

[0020] Hereinafter, a method for manufacturing the biochip 10 of the present embodiment will be described. The manufacturing method of the biochip 10 of the present embodiment can include the following steps.

[0021] First, referring to FIGS. 2, 7, and 8, a substrate 110 is provided, an insulating layer IL1 is formed on the substrate 110, an insulating layer IL2 is formed on the insulating layer IL1, and a semiconductor layer 120 is formed on the substrate 110 and the insulating layer IL2. In the present embodiment, the substrate 110 can be a silicon substrate or a silicon wafer. For example, the substrate 110 can be, for example, a P-type silicon substrate, but is not limited thereto.

[0022] In the present embodiment, the semiconductor layer 120 has a reaction region 121, a source region 122, and a drain region 123. The reaction region 121 is located between the source region 122 and the drain region 123, and the reaction region 121 can connect the source region 122 and the drain region 123. In the present embodiment, the material of the semiconductor layer 120 can include polycrystalline silicon (polysilicon) or other suitable semiconductor materials, but is not limited thereto. In some embodiments, the reaction region 121 can be regarded as a channel in a transistor structure. Therefore, when the threshold voltage of the reaction region 121 (channel) is exceeded, the reaction region 121 (channel) can be turned on, and the current from the drain electrode 142 can be transmitted through the reaction region 121 (channel) to the source electrode 141.

[0023] Next, referring to FIGS. 3, 7, and 8, an insulating layer 130 is formed on the semiconductor layer 120. Specifically, the insulating layer 130 has a first opening O1, an opening 131, and an opening 132. Here, the first opening O1 can expose a part of the reaction region 121 and a part of the insulating layer 130, the opening 131 can expose a part of the source region 122, and the opening 132 can expose a part of the drain region 123.

[0024] Next, referring to Figures 4, 7, and 8, a metal layer 140 is formed on the insulating layer 130. Specifically, the metal layer 140 can expose a portion of the insulating layer 130. The metal layer 140 includes a source electrode 141, a drain electrode 142, and an enclosure wall structure 143. The source electrode 141 is installed on the insulating layer 130 and within the opening 131, and the drain electrode 142 is installed on the insulating layer 130 and within the opening 132. In the direction Z normal to the substrate 110, the source electrode 141 can be installed overlapping the source region 122, and the drain electrode 142 can be installed overlapping the drain region 123. The enclosure wall structure 143 is installed on the insulating layer 130, and the enclosure wall structure 143 can surround the source electrode 141 and the drain electrode 142. In this embodiment, the source electrode 141, the drain electrode 142, and the enclosure wall structure 143 can be on the same layer, the source electrode 141, the drain electrode 142, and the enclosure wall structure 143 can be physically separated from each other, and the source electrode 141 and the drain electrode 142 can be electrically insulated from the enclosure wall structure 143.

[0025] Next, referring to Figures 5, 7, and 8, a first protective layer 150 is formed on the metal layer 140. Specifically, the first protective layer 150 has a second opening O2 and an opening 151, and includes a flat portion 152 and a protruding portion 153. The flat portion 152 can cover the insulating layer 130 exposed by the metal layer 140, and the flat portion 152 can surround and define the second opening O2. The protruding portion 153 can cover the metal layer 140, and the protruding portion 153 can completely surround and define the opening 151. In the direction Z normal to the substrate 110, the protruding portion 153 can be installed in conjunction with the source electrode 141, the drain electrode 142, and the enclosure wall structure 143, and the second opening O2 can be installed in conjunction with the first opening O1 to expose a part of the reaction region 121.

[0026] In the three-dimensional view of the biochip 10 shown in Figure 5, the protruding portion 153 can be closed and the figure can be made without any missing parts, the opening 151 can be connected to the second opening O2, and the dimensions of the opening 151 can be made larger than the dimensions of the second opening O2.

[0027] In this embodiment, the material of the first protective layer 150 can be a hydrophobic material, not a hydrophilic material. For example, the material of the first protective layer 150 may include, but is not limited to, silicon nitride (SiN), plasma-enhanced silicon nitride (PESIN), oxynitrides (SION), other suitable hydrophobic materials, or a combination of the above.

[0028] Next, referring to Figures 6, 7, and 8, a second protective layer 160 is formed on the first protective layer 150, and a solution 200 containing the bioprobe 210 is added. Specifically, the second protective layer 160 has a third opening O3 and a fourth opening O4, and includes a first protrusion 161, a second protrusion 162, and a third protrusion 163. In the direction Z normal to the substrate 110, the first protrusion 161 can be installed in conjunction with the source electrode 141, the second protrusion 162 can be installed in conjunction with the drain electrode 142, and the third protrusion 163 can be installed in conjunction with the enclosure wall structure 143. The first protrusion 161, the second protrusion 162, and the third protrusion 163 can be separated from each other. The third protrusion 163 can completely enclose and define the fourth opening O4.

[0029] In this embodiment, the third opening O3 is located between the first protrusion 161 and the second protrusion 162, and the fourth opening O4 is located between the second protrusion 162 and the third protrusion 163. In the direction Z normal to the substrate 110, the third opening O3 is positioned to overlap and correspond to the second opening O2 and the first opening O1, allowing a portion of the reaction region 121 to be exposed. The fourth opening O4 can expose a portion of the first protective layer 150, for example, a portion of the upper surface S1 of the flat portion 152. Here, the upper surface S1 faces away from the substrate 110.

[0030] In the three-dimensional view of the biochip 10 shown in Figure 6, the third protrusion 163 can be closed and form a complete figure, the fourth opening O4 can be connected to the third opening O3, and the dimensions of the fourth opening O4 can be larger than the dimensions of the third opening O3, the second opening O2, and the first opening O1.

[0031] In this embodiment, the second protective layer 160 can be a hydrophilic material, not a hydrophobic material. For example, the material of the second protective layer 160 may include, but is not limited to, oxides, silicon oxide (SiO2), plasma-enhanced silicon oxide (PEOX), low-pressure tetraethoxysilane (LPTEOS), plasma-enhanced tetraethoxysilane (PETEOS), phosphate silicon glass (PSG), boron-phosphate silicon glass (BPSG), spin-on glass (SOG), other suitable hydrophilic materials, or combinations thereof.

[0032] Next, referring to Figures 7 and 8, the solution 200 can be placed in the first opening O1, the second opening O2, the third opening O3, opening 151, and the fourth opening O4. A portion of the solution 200 can come into contact with the reaction region 121 of the semiconductor layer 120, and another portion of the solution 200 can come into contact with a portion of the upper surface S1 of the first protective layer 150 exposed by the fourth opening O4.

[0033] In this embodiment, the solution 200 may contain a bioprobe 210 and a liquid 220. The bioprobe 210 can be bound to a reaction region 121 of the semiconductor layer 120 and is used to specifically identify and bind to biomaterials in the sample solution. Specifically, after adding the solution 200 containing the bioprobe 210, one end of the bioprobe 210 can be connected to and fixed to the reaction region 121, and the other end of the bioprobe 210 can be used to identify and bind to biomaterials. The bioprobe 210 can be a chemical molecule or a biomolecule; for example, the bioprobe 210 can be an antibody, antigen, nucleic acid, carbohydrate, or a combination thereof, but is not limited thereto, as long as the bioprobe 210 can specifically identify and bind to biomaterials. In this embodiment, the solution 200 containing the bioprobe 210 may be a polymer spotting solution, but is not limited thereto.

[0034] In this embodiment, the protrusions 153 and 3rd protrusion 163, installed above the enclosure wall structure 143, are shapes that completely enclose the opening 151 and 4th opening O4, respectively. As shown in Figures 7 and 8, the solution 200 can be confined to the opening 151 or 4th opening O4, preventing the solution 200 from overflowing outside the 4th opening O4. For example, if the solution 200 added to the 1st opening O1 or 2nd opening O2 of one of the detection units 100 in the biochip 10 overflows from the 2nd opening O2, the installation of the protrusions 153 and 3rd protrusion 163 allows the solution 200 to be confined to the opening 151 and 4th opening O4, respectively, thereby preventing the solution from overflowing and interfering with the detection results of other adjacent detection units 100. Therefore, compared to a typical biochip, the biochip 10 of this embodiment can increase the volume of solution 200 that it can contain by installing the opening 151 and the fourth opening O4, and can also improve the operability and convenience of the biochip 10. In this way, the biochip 10 of this embodiment can simultaneously detect different biomaterials in different detection units 100, and there is no need to worry about the risk of solution overflow and cross-contamination between adjacent detection units, and it can also achieve the effect of simultaneously detecting multiple types of biomaterials.

[0035] In this embodiment, the third protrusion 163 of the second protective layer 160 installed above the enclosure wall structure 143 is made of a hydrophilic material and not a hydrophobic material. Therefore, the fluidity of the solution 200 that comes into contact with the third protrusion 163 can be reduced, and the probability of the solution 200 overflowing the third protrusion 163 can be further reduced, thereby further reducing the probability of solution overflow.

[0036] In this embodiment, the fourth opening O4 can expose a portion of the first protective layer 150, and since the first protective layer 150 is a hydrophobic material and not a hydrophilic material, the fluidity of the solution 200 in contact with the first protective layer 150 can be increased, and furthermore, the solution 200 can be rapidly introduced into the third opening O3 to perform detection in the reaction region 121.

[0037] As described above, in the biochip and method for manufacturing the same according to one embodiment of the present invention, the third protrusion installed above the enclosure wall structure is a figure that completely encloses the fourth opening, thus preventing the solution from overflowing outside the fourth opening, allowing for the storage of a larger volume of solution, and preventing interference with each other even when multiple types of biomaterials are detected simultaneously. Since the third protrusion is made of a hydrophilic material and not a hydrophobic material, the fluidity of the solution in contact with the third protrusion can be reduced, further reducing the probability of the solution overflowing the third protrusion and further reducing the probability of solution overflow. Since the first protective layer exposed by the fourth opening is made of a hydrophobic material and not a hydrophilic material, the fluidity of the solution in contact with the first protective layer can be increased, further allowing the solution to flow rapidly into the third opening for detection.

[0038] Although the present invention has been disclosed by the embodiments described above, this does not limit the invention, and any person with ordinary skill in the art may make some modifications and alterations without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention shall be defined by the claims described below. [Industrial applicability]

[0039] The biochip and method for producing the same of the present invention can be used to prevent overflow of a solution (e.g., a polymer spotting solution or a sample solution), to accommodate a larger volume of solution, and to detect multiple types of biomaterials simultaneously without interference from each other. [Explanation of symbols]

[0040] 10: Biochips 100: Detection Unit 110: Circuit board 120: Semiconductor layer 121: Reaction area 122: Source area 123: Drain area 130, IL1, IL2: Insulating layer 131, 132, 151: Opening 140: Metal layer 141: Source electrode 142: Drain electrode 143: Enclosure wall structure 150: 1st protective layer 152: Flat part 153:Protrusion 160:Second protective layer 161:First protrusion 162:Second protrusion 163: Third protrusion 200: Solution 210: Bioprobe 220:Liquid O1: First opening O2: 2nd opening O3: Third opening O4: Fourth opening S1:Top surface Z: Normal direction

Claims

1. A biochip used to detect biological materials, circuit board and A semiconductor layer having a reaction region is placed on the substrate, An insulating layer is provided on the semiconductor layer and has a first opening that exposes the reaction region, A metal layer comprising a source electrode and a drain electrode, which are placed on the insulating layer and electrically connected to the semiconductor layer, respectively, and a surrounding wall structure that encloses the first opening, the source electrode, and the drain electrode, A first protective layer is installed on the metal layer and has a second opening, The second protective layer is installed on the first protective layer and includes a first projection that is installed corresponding to the source electrode and has a third opening and a fourth opening, a second projection that is installed corresponding to the drain electrode, and a third projection that is installed corresponding to the enclosure wall structure and surrounds and defines the fourth opening. A biochip in which, in the direction normal to the substrate, the third opening overlaps the second opening and the first opening, and the fourth opening exposes the first protective layer.

2. The biochip according to claim 1, wherein the source electrode, the drain electrode, and the enclosure wall structure are in the same layer and separated from each other, and the source electrode and the drain electrode are electrically insulated from the enclosure wall structure.

3. The biochip according to claim 1, wherein the first protective layer is a hydrophobic material.

4. The biochip according to claim 1, wherein the second protective layer is a hydrophilic material.

5. The biochip according to claim 1, wherein the first protrusion, the second protrusion, and the third protrusion are separated from each other.

6. The biochip according to claim 1, wherein the third protrusion completely surrounds the fourth opening.

7. The biochip according to claim 1, wherein the third opening is located between the first protrusion and the second protrusion, and the fourth opening is located between the second protrusion and the third protrusion.

8. The biochip according to claim 1, wherein the dimensions of the fourth opening are greater than the dimensions of the third opening.

9. The biochip according to claim 1, further comprising a solution containing a bioprobe that is in contact with the upper surface of the first protective layer exposed from the fourth opening.

10. To provide a substrate, A semiconductor layer is formed on the aforementioned substrate, and the semiconductor layer has a reaction region. An insulating layer is formed on the semiconductor layer, and the insulating layer has a first opening that exposes the reaction region. A metal layer is formed on the insulating layer, and the metal layer includes a source electrode and a drain electrode that are electrically connected to the semiconductor layer, and an enclosure wall structure that surrounds the first opening, the source electrode and the drain electrode. A first protective layer is formed on the metal layer, and the first protective layer has a second opening. A second protective layer is formed on the first protective layer, the second protective layer having a third opening and a fourth opening, and including a first projection installed corresponding to the source electrode, a second projection installed corresponding to the drain electrode, and a third projection installed corresponding to the enclosure wall structure and enclosing and defining the fourth opening, A method for manufacturing a biochip, wherein, in the direction normal to the substrate, the first opening overlaps the second and third openings, and the fourth opening exposes the first protective layer.

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