Sensor device and method for manufacturing a sensor device

Abstract

A sensor device and a method for manufacturing the sensor device are provided. A sensor apparatus (1) for measuring temperature is described, the sensor apparatus (1) comprising: at least one double-sided printed circuit board (2), the circuit board (2) having an upper surface (2a) and a lower surface (2b), with at least one first solder pad (3) and at least one second solder pad (4) disposed on the upper surface (2a) and the lower surface (2b), respectively; at least one sensor device (6) directly connected mechanically and electrically to the upper surface (2a) of the circuit board (2); and an insulator (5) completely enclosing at least the sensor device (6) on the upper surface (2a) of the circuit board (2). A method for manufacturing the sensor apparatus (1) is also described.

Description

Technical Field

[0007]

[0001] The present invention relates to a sensor arrangement, preferably a temperature sensor arrangement. The present invention further relates to a method for manufacturing a sensor arrangement, preferably a plurality of sensor arrangements.

Summary of the Invention

[0002] The object of the present invention is to describe a sensor arrangement with improved characteristics.

[0003] This object is solved by a sensor arrangement according to the independent claims and a method for manufacturing a plurality of sensor arrangements.

[0004] According to one aspect, a sensor arrangement is described. The sensor arrangement is configured and arranged to measure temperature. The sensor arrangement is a temperature sensor arrangement. In particular, the sensor arrangement is configured to measure the temperature of a surface.

[0005] The sensor arrangement includes at least one double-sided printed circuit board. The circuit board can have one layer or a plurality of layers connected to each other. Thus, the circuit board has a varying thickness.

[0006] The circuit board can have a plurality of shapes, for example, rectangular, square or block-shaped. The shape of the circuit board, and thus the shape of the entire sensor arrangement, can be adapted to the requirements of a specific customer. The same applies to the thickness of the circuit board. Thus, a very user-friendly sensor arrangement that is flexible in use is provided.

[0007] The circuit board has a top side and a bottom side. The bottom side is the side (side) of the circuit board that will be electrically connected to the user application. At least one first solder pad and at least one second solder pad are located on the bottom side. In addition, at least one first solder pad and at least one second solder pad are located on the top side. The solder pads on the top side are electrically connected to the solder pads on the bottom side by vias.

[0008] The sensor device further includes at least one sensor device. The sensor device has a temperature-dependent electrical resistance. The sensor device may include an SMD (surface mount device) NTC (negative temperature coefficient) or chip NTC component.

[0009] The sensor device has a first external electrode and a second external electrode, which are configured and arranged to be directly electrically and mechanically connected to the first and second solder pads on the upper surface of the circuit board. The first and second external electrodes are located on the outer surface of the sensor device, for example, on the lower surface and / or sides of the sensor device.

[0010] The sensor device is directly connected mechanically and electrically to the top surface of the circuit board. In particular, the sensor device / external electrodes of the sensor device are directly connected to the first and second solder pads on the top surface of the circuit board. The sensor device may be soldered, press-fitted, or wire-bonded to the top surface of the circuit board.

[0011] The term "directly connected" means that there are no further components / intermediate components, such as metal pins / additional metal pads / terminals, between the sensor device (especially its external electrodes) and the circuit board (especially its solder pads) to establish the connection. Therefore, depending on the specific structure of the sensor device, at least one connection (e.g., the connection between the sensor device and an intermediate component and / or the connection between the intermediate component and the circuit board) can be reduced compared to the prior art. Thus, a cost-effective and compact sensor device is provided.

[0012] The sensor device further includes an insulator. The insulator is positioned on the upper surface of the sensor device. The sensor device is configured to measure the temperature of a surface that is in (direct) contact with the insulator.

[0013] The insulating material may include thermoplastic or epoxy or plastic materials such as insulating adhesives. The insulator protects the sensor device, in particular, from external influences.

[0014] The insulator completely covers at least the sensor device on the top surface of the circuit board. The sensor device is overmolded by the insulator. The bottom surface of the sensor device is free of insulating material. By encapsulating the soldered sensor device with insulating material, the solder joints are not exposed to the environment.

[0015] By using double-sided printed circuit boards on which SMD NTCs or chip NTCs are mounted and protected with epoxy or plastic materials as insulators, an optimized cost solution is provided, along with the same features and functionality as current designs using the latest technology.

[0016] According to one embodiment, the insulator completely covers the top surface of the circuit board. In other words, not only the sensor device, but the entire top surface including the sensor device is covered by the insulator. This method provides better protection of the top surface of the sensor device from external influences. Furthermore, the contact area of ​​the surface where the temperature will be measured is larger than that of an insulator covering only the sensor device. This can also help to improve the accuracy of the sensor device.

[0017] In a further embodiment, a method for manufacturing multiple sensor devices is described. Sensor devices manufactured by this method may correspond to the sensor devices described above. All features described in relation to sensor devices also apply to this method, and vice versa.

[0018] This method includes the following steps:

[0019] A) Provides a substrate for obtaining multiple double-sided printed circuit boards. Each circuit board has a top surface and a bottom surface, and at least one first solder pad and at least one second solder pad are located on the top surface and bottom surface, respectively. The connection from the top solder pad to the bottom solder pad is a through-via. The substrate has a thickness / height that can be adapted to specific customer requirements.

[0020] B) Multiple sensor devices are electrically and mechanically connected to the top surface. Each sensor device is soldered, press-fitted, or wire-bonded to the first and second solder pads on the top surface of the respective circuit board.

[0021] Each sensor device may include an SMD NTC or chip NTC component. Each sensor device includes a top surface and a bottom surface, and a first external electrode and a second external electrode are located on the bottom surface of each sensor device.

[0022] C) Provide an insulating material to form an insulator. The insulating material includes epoxies or plastics such as thermoplastics or insulating adhesives. The choice of material depends on temperature and thermal property requirements. The insulator completely encloses at least each sensor device. In particular, each sensor device is overmolded with an insulating material. Alternatively, the entire upper surface of the final (i.e., singulated) circuit board can be completely overmolded with an insulating material.

[0023] D) Divide the substrate into single components to obtain a plurality of final sensor devices. In particular, the formed circuit board is diced / scored at breaking points to break it into single components. The shape of the final sensor device / circuit board can be adapted to customer requirements. Thus, for example, a rectangular, square or block-shaped circuit board can be singulated in this step.

[0024] For example, a double-sided printed circuit board used instead of a state-of-the-art connector block is a cost-effective solution and can be manufactured directly on one large sheet. In this way, processing is simplified. Thus, a very effective and cost-efficient method is provided.

[0025] By adapting the shape and thickness of the circuit board and thus the shape and thickness of the final sensor device, a very user-friendly and flexibly usable sensor device can be provided.

Brief Description of the Drawings

[0026] The drawings described below are not intended to be to scale. Rather, individual dimensions may be enlarged, reduced, or distorted for better representation.

[0027] Elements performing similar or the same functions are denoted by the same reference numerals.

[0028] [Figure 1a]Perspective bottom view of the sensor device.

[0029] [Figure 1b] Perspective top view of the sensor device.

[0030] [Figure 2a] Perspective view of the sensor device according to the second embodiment during assembly.

[0031] [Figure 2b] Perspective view of the sensor device according to FIG. 2a during assembly.

[0032] [Figure 2c] Perspective view of the completed sensor device according to FIGS. 2a and 2b.

[0033] [Figure 3] Perspective view of an exemplary sensor device.

Mode for Carrying Out the Invention

[0034] FIGS. 1a and 1b show a sensor device 1. The sensor device 1 is configured to measure temperature, for example, the temperature of a surface. The sensor device 1 is a temperature sensor device.

[0035] The sensor device 1 has an upper surface 1a and a lower surface 1b. The lower surface 1b is the surface (side) of the sensor device 1 that is electrically connected to an external application when the sensor device 1 is finally installed.

[0036] The upper surface 1a is the surface (side) that directly contacts the surface where the temperature will be measured when the sensor device 1 is finally installed.

[0037] The sensor device 1 has a circuit board 2. The circuit board 2 is a double-sided printed circuit board 2. The circuit board 2 has an upper surface 2a and a lower surface 2b. The lower surface 2b of the circuit board 2 is also the lower surface 1b of the sensor device 1. The upper surface 2a of the circuit board 2 is configured and positioned to be directly mechanically and electrically connected to the sensor device 6, in particular the temperature sensor device 6 (see Figures 1b and 3).

[0038] The shape of the circuit board 2 can be changed according to the customer's mounting requirements. In this embodiment, the circuit board 2 has a rectangular shape, but of course, various shapes such as square, circular, or block shapes are possible. The circuit board 2 may have a single layer or multiple layers connected to each other. Therefore, not only the shape of the circuit board 2, but also the overall thickness of the sensor device 1 can be adapted according to the customer's requirements.

[0039] The circuit board 2 has first and second solder pads 3 and 4. The first solder pad 3 and the second solder pad 4 are located on the upper surface 2a for direct electrical and mechanical connection with the sensor device 6. Furthermore, the first solder pad 3 and the second solder pad 4 are located on the lower surfaces 1b and 2b for electrical connection between the sensor device 1 and an external application.

[0040] Connection to external applications is made via solder pads 3 and 4 by soldering, wire bonding, or pin connections. Electrical connections between solder pads 3 and 4 on the upper surface 1a and solder pads 3 and 4 on the lower surfaces 1b and 2b are established by vias (not explicitly shown in the figure).

[0041] The sensor device 6 (see the exemplary sensor device 6 in Figures 1b and 3) includes an SMD NTC sensor or a chip NTC sensor device. The use of the SMD NTC sensor device 6 or the chip NTC sensor device 6 depends on the RT curve requirements. The NTC chip sensor device 6 requires additional connection means, such as wire bonding or pin connection, to connect one pole to the other.

[0042] The sensor device 6 has an upper surface 6a and a lower surface 6b, as well as opposing side surfaces 6c. Connecting elements, in particular external electrodes (first external electrode 7 and second external electrode 8), are located on the lower surface 6b. In alternative embodiments (not explicitly shown), the external electrodes 7 and 8 may be located, for example, on the opposing side surfaces 6c or on the upper surface 6a.

[0043] The first external electrode 7 is directly connected to the first solder pad 3 on the upper surface 2a of the circuit board 2, for example, by soldering, press-fitting, or wire bonding. The second external electrode 8 is directly connected to the second solder pad 4 on the upper surface 2a of the circuit board 2, for example, by soldering, press-fitting, or wire bonding.

[0044] No intermediate components, such as pins / terminals / metal layers, are placed between the external electrodes 7 and 8 of the sensor device 6 and the solder pads 3 and 4 of the circuit board 2.

[0045] The sensor device 6 shown in Figures 1b and 6 is merely an exemplary embodiment of a sensor device 6 connected to the circuit board 2. Of course, all kinds of SMD NTC or chip NTC sensor devices are possible.

[0046] As can be seen from Figures 1a and 1b, the sensor device 6 is completely enclosed by the insulator 5. The sensor device 6 is overmolded by the material of the insulator 5. The insulator contains plastic material or epoxy.

[0047] In the embodiments shown in Figures 1a and 1b, the insulator 5 also completely covers the top surface 1a of the sensor device 1. In particular, the entire top surface 1a of the sensor device 1, including the sensor device 6, is overmolded by the insulator 5. This means that the sensor device 6 is located inside the sensor device 1. In other words, the sensor device 6 is fully integrated into the sensor device 1.

[0048] The sensor device 6 measures the temperature of the surface in contact with the insulator 5.

[0049] Figures 2a to 2c show the sensor device 1 according to the second embodiment or an intermediate state thereof.

[0050] The sensor device 1 has a double-sided printed circuit board 2. In this embodiment, the circuit board 2 has a block shape. In particular, it has a greater thickness than the circuit board 2 shown in Figures 1a and 1b. The thickness of the circuit board 2 can be adapted to specific mounting conditions by providing multiple layers on the circuit board 2, and these layers are connected to each other.

[0051] Here too, the circuit board 2 has a first solder pad 3 and a second solder pad 4 on its upper surface 2a (Figure 2a). The sensor device 6, described in relation to Figures 1a, 1b, and 3, is directly connected to the first solder pad 3 and the second solder pad 4, for example, by soldering, press-fitting, or wire bonding (Figure 2b). No intermediate components such as metal pins are placed between the sensor device 6 and the circuit board 2.

[0052] The sensor device 1 may include an SMD NTC component or a chip NTC component. Furthermore, the sensor device 6 is completely embedded / overmolded by the insulator 5 (Figure 2c). By sealing the soldered sensor device 6, the solder joints are not exposed to the environment.

[0053] In this embodiment, the insulator 5 covers only a portion of the upper surface 2a of the circuit board 2, as can be seen in Figure 2c. In other words, the upper surface 2a of the circuit board 2 is left without insulating material except for the area on which the sensor device 6 is placed.

[0054] The following describes a method for manufacturing a sensor device 1, and more particularly, a plurality of sensor devices 1. Preferably, the sensor device 1 described above is manufactured by this method. Therefore, all features described in relation to the sensor device 1 also apply to this method, and vice versa.

[0055] This method includes the following steps:

[0056] In the first step A), a substrate is provided. The substrate constitutes the base material for a plurality of double-sided printed circuit boards 2 having an upper surface 2a and a lower surface 2b. Each circuit board 2 has a first solder pad 3 and a second solder pad 4 disposed on the upper surface 2a and the lower surface 2b, respectively.

[0057] In the next step B), multiple sensor devices 6 are directly connected electrically and mechanically to the top surface 2a, particularly to the first and second solder pads 3 and 4 on the top surface 2a of the substrate. The sensor devices 6 are soldered, press-fitted, or wire-bonded to the solder pads 3 and 4 (see Figure 2a).

[0058] In the next step C), an insulating material, such as plastic or epoxy, is provided to form an insulator 5. The insulator 5 completely encloses at least each sensor device 6 (Figure 2c). In an alternative embodiment, the insulator 5 encloses the entire top surface 1a of the final (i.e., separated) sensor device 1 (Figures 1a, 1b).

[0059] In the final step D), the substrate is separated into single components to obtain multiple final sensor devices 1.

[0060] The description of the subject matter disclosed herein is not limited to individual specific embodiments. Rather, the features of individual embodiments can be combined with each other in any way that is technically meaningful. [Explanation of symbols]

[0061] 1. Sensor device 1a Top surface 1b Bottom side 2. Double-sided printed circuit board 2a Top surface of the substrate 2b Bottom surface of the circuit board 3. First solder pad 4. Second solder pad 5. Insulator 6 Sensor Devices 6a Top view of the sensor device 6b Bottom surface of the sensor device Side view of a 6c sensor device 7. First external electrode 8. Second external electrode

Claims

1. A sensor device for measuring temperature: At least one double-sided printed circuit board, wherein the circuit board has an upper surface and a lower surface, and at least one first solder pad and at least one second solder pad are disposed on the upper surface and the lower surface, respectively. At least one sensor device is mechanically and electrically directly connected to the upper surface of the circuit board, An insulator that completely encloses at least the sensor device on the upper surface of the circuit board, It has, The sensor device has an upper surface and a lower surface, the lower surface of the sensor device being the surface of the sensor device that will be electrically connected to an external application when the sensor device is finally installed, and the upper surface of the sensor device being the surface that will be in direct contact with the surface on which the temperature will be measured when the sensor device is finally installed. The lower surface of the circuit board is also the lower surface of the sensor device. The upper surface of the sensor device does not have metal contacts. Sensor device.

2. The insulator completely covers the upper surface of the circuit board. The sensor device according to claim 1.

3. The sensor device has a temperature-dependent electrical resistance. The sensor device according to claim 1.

4. The sensor device has a first external electrode and a second external electrode that make direct electrical and mechanical contact with the first and second solder pads on the upper surface of the circuit board. The sensor device according to claim 1.

5. The first external electrode and the second external electrode are arranged on the lower surface and / or the opposing side surface of the sensor device, and the lower surface of the sensor device is free of the insulating material. The sensor device according to claim 4.

6. The first and second solder pads, located on the lower surface of the circuit board, are configured and positioned to electrically connect the sensor device to an external application. The first and second solder pads, which are located on the upper surface of the circuit board, are configured and positioned to electrically connect the circuit board to the sensor device. The sensor device according to claim 1.

7. The sensor device is directly soldered, press-fitted, or wire-bonded to the upper surface of the circuit board. The sensor device according to claim 1.

8. The first and second solder pads located on the upper surface of the circuit board are electrically connected to the first and second solder pads on the lower surface by vias. The sensor device according to claim 1.

9. The sensor device includes an SMD NTC or a chip NTC. The sensor device according to claim 1.

10. The material of the insulator includes epoxy or plastic. The sensor device according to claim 1.

11. The external form of the sensor device can be adapted to the requirements of a specific customer. The sensor device according to claim 1.

12. A method for manufacturing multiple sensor devices, comprising the following steps: A) A step of providing a substrate for a plurality of double-sided printed circuit boards, wherein each of the circuit boards has an upper surface and a lower surface, and at least one first solder pad and at least one second solder pad are disposed on the upper surface and the lower surface, respectively; B) The step of electrically and mechanically connecting a plurality of sensor devices to the upper surface; C) A step of providing an insulating material to form an insulator, wherein the insulator completely encloses at least each of the sensor devices; D) The step of separating the substrate into a single component in order to obtain multiple final sensor devices; Includes, The sensor device has an upper surface and a lower surface, the lower surface of the sensor device being the surface of the sensor device that will be electrically connected to an external application when the sensor device is finally installed, and the upper surface of the sensor device being the surface that will be in direct contact with the surface on which the temperature will be measured when the sensor device is finally installed. The lower surface of the circuit board is also the lower surface of the sensor device. The upper surface of the sensor device does not have metal contacts. method.

13. In step C), at least each of the sensor devices is overmolded with the insulating material. The method according to claim 12.

14. In step C), the upper surface of the circuit board is completely overmolded with the insulating material. The method according to claim 12.

15. The insulating material includes epoxy or plastic. The method according to claim 12.

16. The sensor device is soldered, press-fitted, or wire-bonded to the first and second solder pads on the upper surface. The method according to any one of claims 12 to 15.

17. The sensor device is overmolded with the insulator. The sensor device according to claim 1.

18. The material of the insulator includes thermoplastic or insulating adhesive. The sensor device according to claim 1.

19. No intermediate component is placed between the sensor device and the circuit board to establish a connection. The sensor device according to claim 1.

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