Control device, inspection method, and circuit board work machine

Abstract

To properly perform inspection work on a component holder.SOLUTION: A control device includes a determination unit that determines whether to perform an inspection work on a component holder that holds a component, on the basis of whether the component scheduled to be held, which is the component scheduled to be held by the component holder, is a specific component, and an output unit that outputs a command to perform inspection work on the component holder when the determination unit determines that the inspection work on the component holder is to be performed.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a control device and the like for performing an inspection operation of a component holder.

Background Art

[0002] The following patent documents describe technologies related to inspection operations of component holders.

[0003]

Patent Document 1

Disclosure of the Invention

Problems to be Solved by the Invention

[0004] An object is to appropriately perform an inspection operation of a component holder.

Means for Solving the Problems

[0005] In order to solve the above problems, this specification discloses a control device including a determination unit that determines whether to perform an inspection operation of a component holder based on whether a component to be held, which is a component scheduled to be held by the component holder, is a specific component, and an output unit that outputs an execution command for the inspection operation of the component holder when it is determined by the determination unit that the inspection operation of the component holder is to be performed.

[0006] Also, this specification discloses an inspection method for a component holder that includes a determination step of determining whether to perform an inspection operation of a component holder based on whether a component to be held, which is a component scheduled to be held by the component holder, is a specific component, and when it is determined in the determination step that the inspection operation of the component holder is to be performed, executes the inspection operation of the component holder.

[0007] Furthermore, this specification discloses a substrate mounting machine comprising: a mounting head having a component holder for holding a component; an inspection device for inspecting the component holder; and a control device for controlling the operation of the mounting head and the inspection device, wherein the control device determines whether or not to perform an inspection of the component holder based on whether or not the component to be held, which is a component to be held by the component holder, is a specific component, and if it determines that an inspection of the component holder should be performed, the inspection of the component holder is performed by the inspection device, and if it determines that an inspection of the component holder should not be performed, the mounting head performs a component mounting operation. [Effects of the Invention]

[0008] In this disclosure, the decision of whether or not to perform inspection work on a component holder is made based on whether or not the component to be held by the component holder is a specific component. This makes it possible to perform inspection work on the component holder before the specific component is held by the component holder, thereby enabling the inspection work on the component holder to be performed appropriately. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view showing an electronic component mounting device. [Figure 2] This is a perspective view showing a tape feeder. [Figure 3] Control device branch. [Best Mode for Carrying Out the Invention]

[0010] Hereinafter, embodiments of the present invention will be described in detail with reference to the figures, as embodiments for carrying out the present invention.

[0011] Figure 1 shows an electronic component mounting device 10. The electronic component mounting device 10 comprises a mounting machine body 20, a transport device 22, a mounting head moving device (hereinafter abbreviated as "moving device") 24, a mounting head 26, a mark camera 27, a parts camera 28, a supply device 29, and a control device (see Figure 3) 30. The mounting machine body 20 is composed of a frame 32 and a beam 34 mounted on the frame 32.

[0012] The conveying device 22 is equipped with two conveyor devices 40 and 42. These two conveyor devices 40 and 42 are arranged on the frame 32 so as to be parallel to each other and extending in a predetermined direction. The direction in which the conveyor devices 40 and 42 extend is referred to as the X-axis direction, and the horizontal direction perpendicular to that direction is referred to as the Y-axis direction. Each of the two conveyor devices 40 and 42 conveys the circuit boards supported by each conveyor device 40 and 42 in the X-axis direction by an electromagnetic motor (see Figure 3) 46. The circuit boards are also held in a predetermined position by a board holding device (see Figure 3) 48.

[0013] The mobile device 24 is an XY robot type mobile device. The mobile device 24 is equipped with an electromagnetic motor (see Figure 3) 52 that slides the slider 50 in the X-axis direction and an electromagnetic motor (see Figure 3) 54 that slides it in the Y-axis direction. A mounting head 26 is attached to the slider 50, and the mounting head 26 moves to any position on the frame 32 by the operation of the two electromagnetic motors 52 and 54.

[0014] The mounting head 26 is used to mount electronic components onto a circuit board. The mounting head 26 has a suction nozzle 60 provided on its lower end surface. The suction nozzle 60 is connected to a positive / negative pressure supply device (see Figure 3) 62 via negative pressure air and positive pressure air passages. The suction nozzle 60 attracts and holds electronic components using negative pressure and releases the held electronic components using positive pressure. The mounting head 26 also has a nozzle lifting device (see Figure 3) 64 that raises and lowers the suction nozzle 60. The nozzle lifting device 64 allows the mounting head 26 to change the vertical position of the held electronic component.

[0015] The mark camera 27 is mounted on the slider 50 facing downwards and moves in the X-axis and Y-axis directions together with the mounting head 26. This allows the mark camera 27 to image any position on the frame 32. The part camera 28 is positioned on the frame 32 between the transport device 22 and the supply device 29, facing upwards. This allows the part camera 28 to image the part held by the suction nozzle 60 of the mounting head 26.

[0016] The supply device 29 is located at the front end of the frame 32 and has a plurality of tape feeders 70. As shown in Figure 2, each tape feeder 70 has a reel 72, a feeder 74, and a peeling device 76, and supplies electronic components at the upper end. Specifically, tape components 78 are wound around the reel 72, and the reel 72 with the tape components 78 wound around it is housed in the reel storage section 79. The tape components 78 are then pulled out from the reel 72 housed in the reel storage section 79 onto the tape guide 80. The tape components 78 are electronic components taped together, and feed holes (not shown) are formed at a predetermined pitch. The sprocket 82 of the feeder 74 engages with these feed holes. The sprocket 82 is rotated by an electromagnetic motor 84. With this structure, the tape components 78 are fed towards the supply position.

[0017] Furthermore, the peeling device 76 has a film peeling mechanism 86 and a gear mechanism 88. The film peeling mechanism 86 is a mechanism for peeling the top film 90 from the tape component 78 and is positioned in front of the opening 92 formed at the upper end of the tape feeder 70. The gear mechanism 88 is a mechanism for pulling the top film 90 peeled from the tape component 78 into the film recovery section 94. With this structure, the top film 90 is peeled from the tape component 78. When the film 90 is peeled off, the electronic components housed in the tape component 78 are exposed at the opening 92, and these exposed electronic components are held in place by the suction nozzle 60 of the mounting head 26. In other words, the opening 92 is the electronic component supply position of the tape feeder 70. Furthermore, a tape guide passage 96 is formed on the side of the opening 92 in the direction of feeding the tape component 78, extending downwards. The discarded tape 98, from which the electronic components have been removed from the tape component 78, is discharged through this tape guide passage 96. The reel 72 has a barcode 100 attached to it that indicates the component ID of the electronic components in the tape component 78 wound around the reel 72, and the tape feeder 70 has a barcode 102 attached to it that indicates the feeder ID of the tape feeder 70. The tape feeder 70 also has a memory 104 in which the feeder ID is stored.

[0018] Furthermore, a connector 106 is provided on the side of the tape feeder 70 in the direction of feeding the tape component 78. On the other hand, as shown in Figure 1, a tape feeder mounting base 110 is provided at the front end of the frame 32. The tape feeder mounting base 110 consists of a vertical surface 112 erected perpendicular to the frame 32 and a protruding surface 114 protruding from the lower end of the vertical surface 112. Multiple slide grooves 116 are formed on the protruding surface 114 so as to extend in the Y direction, and connector connection parts 118 are provided on the vertical surface 112 corresponding to each of the multiple slide grooves 116. The lower end of the tape feeder 70 is then fitted into the slide groove 116, and the connector 106 of the tape feeder 70 is connected to the connector connection part 118. As a result, the tape feeder 70 is mounted on the tape feeder mounting base 110 in a positioned state and electrically connected.

[0019] Furthermore, as shown in Figure 3, the control device 30 includes a controller 130, a plurality of drive circuits 131, an image processing device 132, a control circuit 133, and a memory 134. The plurality of drive circuits 131 are connected to electromagnetic motors 46, 52, 54, 84, a substrate holding device 48, and a positive / negative pressure supply device 62. The controller 130 is a computer-based system equipped with a CPU, ROM, RAM, etc., and is connected to the plurality of drive circuits 131. As a result, the operation of the transport device 22, the moving device 24, etc., is controlled by the controller 130. The controller 130 is also connected to the image processing device 132. The image processing device 132 processes image data obtained by the mark camera 27 and the parts camera 28, and the controller 130 acquires various information from this image data. The controller 130 is also connected to the display device 136 via the control circuit 133. As a result, the controller 130 displays any image on the display device 136. Furthermore, the controller 130 is also connected to the memory 134. As a result, the controller 130 stores various information in the memory 134 and retrieves various information from the memory 134. The memory 134 is also connected to the information management device 150. The information management device 150 manages the information necessary when the mounting work is performed by the electronic component mounting device 10, and this information is output from the information management device 150 to the memory 134 of the control device 30, so that the information necessary for the mounting work is stored in the memory 134.

[0020] In the electronic component mounting device 10, the mounting operation is performed by the mounting head 26 on the circuit board held by the transport device 22, according to the configuration described above. Specifically, the circuit board is transported to the work position by command from the controller 130, and at that position, the circuit board is fixedly held by the board holding device 48. Next, the mark camera 27 moves above the circuit board by command from the controller 130 and takes an image of the circuit board. At this time, information regarding the holding position of the circuit board is calculated based on the image data. Also, the tape feeder 70 feeds out tape-formed components by command from the controller 130 and supplies electronic components at the supply position. Then, the mounting head 26 moves above the supply position of the electronic components by command from the controller 130 and picks up and holds the electronic components with the suction nozzle 60. Next, the mounting head 26 moves above the parts camera 28 by command from the controller 130 The device moves to the suction nozzle 60 and images the electronic component held by the nozzle. At this time, information regarding the holding position of the electronic component is calculated based on the image data. Then, the mounting head 26 moves above the circuit board according to a command from the controller 130 and mounts the electronic component onto the circuit board. At this time, the orientation and position of the electronic component held by the suction nozzle 60 are corrected based on the holding position of the circuit board and the holding position of the electronic component, and the electronic component is mounted onto the circuit board.

[0021] Thus, in the electronic component mounting apparatus 10, the electronic components supplied from the tape feeder 70 are held by the suction nozzles 60 and mounted on the circuit board. Therefore, if foreign matter, solder, etc. adhere to the suction nozzles 60, or if the suction nozzles 60 are damaged such as chipped, the holding of the electronic components by the suction nozzles 60 may become unstable. In such a case, holding errors of the electronic components by the suction nozzles 60, posture deviations of the electronic components after image processing, etc. may occur, leading to wasteful component disposal, production of defective substrates, etc., and the productivity may decrease. For this reason, the inspection operation of the suction nozzles 60 by the parts camera 28 is performed. Specifically, before the electronic components are held by the suction nozzles 60, the mounting head 26 moves above the parts camera 28, and the suction nozzles 60 in the state of not holding the electronic components are imaged by the parts camera 28. At this time, the tip of the nozzle of the suction nozzles 60 that holds the electronic components is imaged by the parts camera 28 from a viewpoint below. Therefore, through image processing, the presence or absence of adhesion of foreign matter, etc. to the nozzle tip of the suction nozzles 60, the presence or absence of damage to the nozzle tip, etc. are inspected based on the imaging data. And when there is no adhesion of foreign matter, etc. to the nozzle tip of the suction nozzles 60 and there is no damage to the nozzle tip, the suction nozzles 60 are determined to be normal. On the other hand, when foreign matter, etc. adhere to the nozzle tip of the suction nozzles 60 or there is damage to the nozzle tip, the suction nozzles 60 are determined to be abnormal. And when the suction nozzles 60 are determined to be normal, the operation of holding the electronic components by the suction nozzles 60 is performed. On the other hand, when the suction nozzles 60 are determined to be abnormal, an error screen is displayed on the display device 136. Thereby, it is possible to prevent a decrease in productivity caused by holding errors of the electronic components by the suction nozzles 60, etc.

[0022] However, it is ideal that the inspection operation of the suction nozzle 60 is performed every time before the suction nozzle 60 holds the electronic component. However, since imaging by the parts camera 28 and image processing require a predetermined time, if the inspection frequency is too high, the throughput will decrease. In view of such a situation, it is determined whether or not to perform the inspection operation of the suction nozzle 60 based on the price of the component (hereinafter referred to as "component to be held") to be held by the suction nozzle 60. At this time, it is determined whether or not to perform the inspection operation of the suction nozzle 60 by using the information used in the mounting operation of the electronic component mounting apparatus 10.

[0023] Specifically, before the mounting operation is performed by the electronic component mounting apparatus 10, the operator sets the component to be mounted on the circuit board in the mounting operation to the tape feeder 70. That is, the operator sets the reel 72 around which the taped component 78 of the component to be mounted is wound in the reel storage section 79 of the tape feeder 70. At this time, the operator reads the barcode 100 attached to the reel 72 and the barcode 102 attached to the tape feeder 70 with a barcode reader. The barcode reader is connected to the information management device 150, and the component ID indicated by the barcode 100 and the feeder ID indicated by the barcode 102 are input to the information management device 150. The information management device 150 stores in advance component information of electronic components and feeder information of tape feeders. The component information includes the component ID, component name, number of components, vendor, and price of the electronic component. On the other hand, the feeder information includes the feeder ID of the tape feeder. Therefore, when the component ID indicated by the barcode 100 and the feeder ID indicated by the barcode 102 are input, the information management device 150 associates and stores the component information including the input component ID and the feeder information including the input feeder ID as related information. Further, the information management device 150 transmits the related information to the memory 134 of the control device 30 to send.

[0024] Furthermore, when the worker sets the reel 72 on which the tape component 78 of the component to be installed is wound into the reel storage section 79 of the tape feeder 70, the worker installs the tape feeder 70 onto the tape feeder mounting stand 110 of the electronic component mounting device 10. At this time, the connector 106 of the tape feeder 70 is connected to the connector connection section 118 of the tape feeder mounting stand 110, and the tape feeder 70 transmits the feeder ID stored in the memory 104 to the control device 30 of the electronic component mounting device 10. As a result, the control device 30 recognizes the installation position of the tape feeder 70 on the tape feeder mounting stand 110. The control device 30 also refers to the relevant information stored in the memory 134 to identify the types of electronic components that can be supplied from the tape feeder 70 installed on the tape feeder mounting stand 110. In other words, it identifies component information associated with feeder information that includes a feeder ID that matches the feeder ID of the tape feeder 70 installed on the tape feeder mounting stand 110, based on the relevant information. Then, the type of component is identified based on the component ID included in the identified component information. This allows the control device 30 to recognize the types of electronic components that can be supplied from the tape feeder 70 mounted on the tape feeder mounting base 110. In this way, the control device 30 recognizes the types of electronic components that can be supplied from each tape feeder mounted on the tape feeder mounting base 110, and then performs the mounting work on the electronic component mounting device 10.

[0025] Furthermore, the control device 30 uses the relevant information stored in the memory 134 to determine whether or not to perform an inspection of the suction nozzle 60. Specifically, when the control device 30 performs the installation of a component to be installed, it outputs a holding command for the component to be installed to the installation head 26. Before outputting this holding command, it identifies the price of the component to be installed from the component information of the component to be installed. In other words, the control device 30 identifies component information containing the same component ID as the component to be installed from the relevant information stored in the memory 134. Then, the control device 30 identifies the price of the component included in the identified component information. Next, the control device 30 determines whether the price of the identified component, that is, the price of the component to be installed, is above a threshold. A predetermined value is registered in the memory 134 as the threshold.

[0026] The control device 30 then determines that it will perform an inspection of the suction nozzle 60 if the price of the part to be mounted is above a threshold. In other words, the control device 30 determines that the part to be mounted is a specific high-priced part if the price of the part to be mounted is above a threshold, and therefore determines that it will perform an inspection of the suction nozzle 60. When the control device 30 determines that it will perform an inspection of the suction nozzle 60, it outputs a command to the electronic component mounting device 10 to execute the inspection of the suction nozzle 60. In other words, the control device 30 outputs a command to the moving device 24 to move the mounting head 26 above the parts camera 28, and also outputs a command to the parts camera 28 to image the suction nozzle 60 after the mounting head 26 has moved above the parts camera 28. The control device 30 then performs image processing based on the image data to inspect the suction nozzle 60 for any foreign matter adhering to the nozzle tip, any damage to the nozzle tip, etc.

[0027] On the other hand, the control device 30 decides not to perform the inspection of the suction nozzle 60 if the price of the component to be mounted is below a threshold. In other words, the control device 30 decides not to perform the inspection of the suction nozzle 60 if the price of the component to be mounted is below a threshold, as it determines that the component to be mounted is not a specific high-priced component. Once the control device 30 decides not to perform the inspection of the suction nozzle 60, it outputs a command to the electronic component mounting device 10 to perform the component holding operation. In other words, the control device 30 outputs a command to the moving device 24 to move the mounting head 26 above the supply position of the tape feeder 70, and then outputs a command to the mounting head 26 to hold the electronic component with the suction nozzle 60 after the mounting head 26 has moved above the supply position of the tape feeder 70.

[0028] Thus, in the electronic component mounting device 10, if the component to be mounted is a high-priced specific component, the inspection of the suction nozzle 60 is performed. If the component to be mounted is not a high-priced specific component, the inspection of the suction nozzle 60 is not performed, and the component to be mounted is held by the suction nozzle 60. This reduces the frequency of the inspection of the suction nozzle 60, thereby preventing a decrease in throughput. Furthermore, by performing the inspection of the suction nozzle 60 before the holding of high-priced components, it is possible to prevent the disposal of expensive components.

[0029] The controller 130 of the control device 30 has a determination unit 160 and an output unit 162, as shown in Figure 3. The determination unit 160 is a functional unit that determines whether or not to perform inspection work on the suction nozzle 60 based on whether or not the part to be installed is a specific part with a high price. The output unit 162 is a functional unit that outputs an execution command for the inspection work when it is determined that the inspection work on the suction nozzle 60 should be performed.

[0030] Furthermore, in the above embodiment, the price of the part included in the part information is used to determine whether the price of the part to be installed is above a threshold, and if so, the system determines that the part to be installed is a high-priced specific part and decides to perform the inspection of the suction nozzle 60. On the other hand, in the second embodiment, the part information includes information indicating a specific part, and the system may use this information to determine whether or not to perform the inspection of the suction nozzle 60 based on whether or not the part to be installed is a high-priced specific part. Specifically, the part ID of a high-priced part is registered as specific part information. For example, part IDs aaa and bbb are registered as specific part information. Then, it is determined whether or not the part ID of the part to be installed matches the specific part information. That is, for example, if the part ID of the part to be installed is aac, it is determined that the part ID of the part to be installed does not match the specific part information. And if the part ID of the part to be installed does not match the specific part information, it is determined that the inspection of the suction nozzle 60 is not performed. On the other hand, for example, if the part ID of the part to be installed is aaa, it is determined that the part ID of the part to be installed matches the specific part information. Then, if the part ID of the part to be installed matches the specific part information, it is decided to perform the inspection of the suction nozzle 60. In this way, it may be determined whether the part to be installed is a specific part based on the specific part information, and then a decision may be made whether or not to perform the inspection of the suction nozzle 60 based on that determination.

[0031] Furthermore, in the second embodiment, the part ID of a high-priced part is registered as specific part information, but in the third embodiment, the part ID of a part with a small number of spare parts may be registered. For example, part IDs ccc and ddd, which have a small number of spare parts, may be registered as specific part information. Then, for example, if the part ID of the part to be installed is ccb, ​​it is determined that the part ID of the part to be installed does not match the specific part information. Then, if the part ID of the part to be installed does not match the specific part information, it is determined that the inspection work of the suction nozzle 60 will not be performed. On the other hand, for example, if the part ID of the part to be installed is ccc, it is determined that the part ID of the part to be installed matches the specific part information. Then, if the part ID of the part to be installed matches the specific part information, it is determined that the inspection work of the suction nozzle 60 will be performed. In this way, the part ID of a part with a small number of spare parts may be registered as specific part information, and it may be determined whether the part to be installed is a specific part based on that specific part information, and based on that determination result, it may be determined whether or not to perform the inspection work of the suction nozzle 60.

[0032] Furthermore, in the third embodiment, the part ID of a part with a small number of spare parts is registered in the part information, but in the fourth embodiment, the number of spare parts may be registered. In such cases, it is determined whether or not the number of spare parts of the part to be installed is below a threshold. If the number of spare parts of the part to be installed is below the threshold, it is determined that the part to be installed is a specific part with a small number of spare parts, and the inspection work of the suction nozzle 60 is performed. On the other hand, if the number of spare parts of the part to be installed exceeds the threshold, it is determined that the part to be installed is not a specific part with a small number of spare parts, and the inspection work of the suction nozzle 60 is not performed. Based on the number of spare parts, it may be determined whether the part to be installed is a specific part, and based on that determination, it may be decided whether or not to perform the inspection work on the suction nozzle 60.

[0033] In the embodiment described above, the following effects are achieved.

[0034] A determination is made based on whether the part to be installed is a specific part, and if the part to be installed is a specific part, a command to perform an inspection of the suction nozzle 60 is issued. This reduces the frequency of the inspection of the suction nozzle 60, thereby preventing a decrease in throughput, and by performing the inspection of the suction nozzle 60 before the holding operation of the specific part, it becomes possible to prevent the disposal of that specific part.

[0035] The inspection of the suction nozzle 60 is performed based on imaging data of the suction nozzle 60. This makes it possible to determine whether or not foreign matter is attached to the suction nozzle 60, and whether or not the suction nozzle 60 is damaged.

[0036] If the price of the part to be installed exceeds a threshold, it is determined that the part to be installed is a specific part, and the inspection of the suction nozzle 60 is performed. This makes it possible to appropriately determine whether or not the part to be installed is an expensive specific part.

[0037] The memory 134 stores component information, including information indicating whether the component to be installed is a specific component and the component ID of the component to be installed, and feeder information, including the feeder ID of the tape feeder 70 that supplies the component to be installed, in association with each other. The control device 30 then retrieves the information indicating whether the component to be installed is a specific component from the memory 134 and determines whether or not to perform the inspection of the suction nozzle 60 based on the retrieved information. The component information and feeder information are used in the component installation work, and by using the information used in the installation work to determine whether or not to perform the inspection of the suction nozzle 60, it becomes possible to effectively utilize the information used in the installation work. In the above embodiment, the information indicating whether or not the component to be installed is a specific component is the price of the component, the number of spare parts, and specific component information, but it is possible to use various types of information, such as information indicating a component with high rarity value, information indicating a component that is easily damaged, or information indicating a component with a shape that is difficult to hold.

[0038] In the above embodiment, the electronic component mounting device 10 is an example of a substrate work machine. The mounting head 26 is an example of a mounting head. The parts camera 28 is an example of an inspection device. The control device 30 is an example of a control device. The suction nozzle 60 is an example of a component holder. The tape feeder 70 is an example of a supply device. The memory 134 is an example of a storage device. The judgment unit 160 is an example of a judgment unit. The output unit 162 is an example of an output unit. The component to be mounted is an example of a component to be held. Also, the process executed by the judgment unit 160 is an example of a judgment process.

[0039] Furthermore, the present invention is not limited to the above embodiments, and can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiments, it is determined that the inspection of the suction nozzle 60 is performed when the part to be attached is a specific part, but it may also be determined that the inspection of the suction nozzle 60 is performed when the part to be attached is a specific part and predetermined conditions are met. Various conditions can be adopted as predetermined conditions. Specifically, for example, the number of times the suction nozzle 60 performs suction, the number of times suction errors occur by the suction nozzle 60, the number of times image processing errors occur based on imaging data, etc., can be adopted as predetermined conditions.

[0040] Furthermore, although a suction nozzle 60 is used as the component holder in the above embodiment, various component holders such as chucks can be used as long as they are capable of holding components.

[0041] Furthermore, although a tape feeder 70 is used as the supply device for supplying parts in the above embodiment, various types of feeders such as bulk feeders and stick feeders can be used. Moreover, the device is not limited to feeders, and tray-type parts supply devices, loose parts supply devices, etc., can also be used.

[0042] Furthermore, in the above embodiment, an inspection operation based on imaging data is employed as the inspection operation for the suction nozzle 60, but various inspection operations can be employed. Specifically, for example, operations such as checking the expandability of the nozzle of the suction nozzle 60 and operations to check the negative pressure when the suction nozzle 60 suctions and holds the parts can be employed.

[0043] Furthermore, in the above embodiment, the component information stored in the memory 134 is output from the information management device 150, but the component information may also be output from a component ordering system or the like.

[0044] Furthermore, in the above embodiment, the control device 30 of the electronic component mounting device 10 determines whether or not to perform inspection work on the suction nozzle 60. However, an information processing device located outside the electronic component mounting device 10 may also determine whether or not to perform inspection work on the suction nozzle 60. In this case, if the information processing device makes the determination, it transmits a command corresponding to the determination result to the electronic component mounting device 10.

[0045] Furthermore, in the above embodiment, the memory 134 for storing component information is provided in the control device 30, but it may also be provided in a cloud, a higher-level management device that manages the electronic component mounting device 10, etc. [Explanation of symbols]

[0046] 10: Electronic component mounting device (board mounting machine) 26: Mounting head 28: Parts camera (inspection device) 30: Control device 60: Suction nozzle (parts holder) 70: Tape feeder (supply device) 134: Memory (storage device) 160: Judgment unit (judgment process) 162: Output unit

Claims

1. A determination unit that determines whether or not to perform inspection work on a component holder that holds a component, based on whether or not the component to be held by the component holder is a specific component, When the determination unit determines that the inspection work of the component holder should be performed, the output unit outputs an execution command for the inspection work of the component holder. A control device equipped with the following features.

2. The control device according to claim 1, wherein the inspection of the component holder is an inspection of the component holder based on imaging data of the component holder.

3. The unit that makes the determination said, The control device according to claim 1, which determines that the component to be held is a specific component and performs inspection work on the component holder when the price of the component to be held is above a threshold.

4. The unit that makes the determination said, A control device according to any one of claims 1 to 3, which acquires information indicating whether the part to be held is a specific part from a storage device that stores part information including information indicating whether the part to be held is a specific part and identification information of the part to be held, and supply device information including identification information of a supply device that supplies the part to be held, in association with the information, and determines whether or not to perform inspection work on the part holder based on the acquired information.

5. The process includes a determination step of whether or not to perform an inspection of a component holder that holds a component, based on whether or not the component to be held by the component holder is a specific component. A method for inspecting a component holder, wherein, in the judgment step, it is determined that an inspection of the component holder should be performed, the inspection of the component holder is performed.

6. A mounting head having a component holder for holding the component, An inspection device for inspecting the aforementioned component holder, A control device that controls the operation of the mounting head and the inspection device. Equipped with, The control device, A circuit board work machine that determines whether or not to perform an inspection of the component holder based on whether or not the component to be held by the component holder is a specific component, and if it is determined that an inspection of the component holder should be performed, the inspection of the component holder is performed by the inspection device, and if it is determined that an inspection of the component holder should not be performed, the mounting of the component is performed by the mounting head.

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