Component mounting apparatus and component mounting method

Abstract

To provide a component mounting device and a component mounting method, capable of mounting a component to a substrate with high accuracy.SOLUTION: A component mounting device (1) comprises: a mounting head (17) mounting a component (3) to a substrate (2); a head movement device (14) that moves the mounting head (17); and a control device (C1) that controls a driving of the head movement device (14). The component (3) contains a first component (3A) that includes a flat surface part (50), and a projection part (56) that projects in a lower direction at a position different from the flat surface part (50). The mounting head (17) includes: a holding part (71) that holds the flat surface part (50) of the first component (3A); and a pressing part (72) that presses the projection part (56) of the first component (3A) downward to be inserted into an insertion hole (2B) of the substrate (2).SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a component mounting device and a component mounting method.

Background Art

[0002] Conventionally, a component mounting device that holds electronic components such as radial components and axial components with a mounting head and mounts them on a substrate is known (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, not only radial components and axial components but also other components with special shapes may be the mounting targets, and it is required to be able to mount such components on the substrate with high accuracy.

[0005] Therefore, an object of the present disclosure is to solve the above conventional problems and provide a component mounting device and a component mounting method capable of mounting components on a substrate with high accuracy.

Means for Solving the Problems

[0006] To achieve the above object, the component mounting device of the present disclosure includes a mounting head that mounts components on a substrate, a head moving device that moves the mounting head, and a control device that controls the driving of the head moving device. The component includes a first component having a flat surface portion and a protruding portion that protrudes downward at a position different from the flat surface portion. The mounting head has a holding portion that holds the flat surface portion of the first component and a pushing portion that pushes the protruding portion of the first component downward and inserts it into an insertion hole of the substrate.

[0007] Furthermore, the component mounting method of this disclosure includes the steps of: holding the flat portion of the first component with the holding portion of the mounting head; and using the pushing portion of the mounting head to push downward a protruding portion of the first component that protrudes downward at a position different from the flat portion, thereby inserting it into the insertion hole of the substrate. [Effects of the Invention]

[0008] According to this disclosure, components can be mounted on a substrate with high precision. [Brief explanation of the drawing]

[0009] [Figure 1] Schematic plan view of a component mounting device according to an embodiment. [Figure 2] Schematic front view of a component mounting device according to an embodiment. [Figure 3] Perspective view of the first part according to the embodiment [Figure 4A] Schematic side view of the first component according to the embodiment (before contact) [Figure 4B] Schematic side view of the first component according to the embodiment (state after contact) [Figure 5] Perspective view of the mounting head according to the embodiment [Figure 6] Perspective view of the mounting head according to the embodiment [Figure 7] Perspective view of the mounting head according to the embodiment [Figure 8] A perspective view showing a magnified portion of the mounting head according to the embodiment. [Figure 9A] Perspective view showing a longitudinal section of the mounting head according to the embodiment. [Figure 9B] Perspective view showing a longitudinal section of the mounting head according to the embodiment. [Figure 10] A flowchart illustrating an example of a method for mounting a first component onto a circuit board using the component mounting apparatus according to the embodiment. [Figure 11A] Schematic front view illustrating the operation of the flowchart shown in Figure 10. [Figure 11B]Schematic front view for explaining the operation of the flowchart shown in FIG. 10 [Figure 11C] Schematic front view for explaining the operation of the flowchart shown in FIG. 10 [Figure 11D] Schematic front view for explaining the operation of the flowchart shown in FIG. 10 [Figure 11E] Schematic front view for explaining the operation of the flowchart shown in FIG. 10 [Figure 11F] Schematic front view for explaining the operation of the flowchart shown in FIG. 10 [Figure 11G] Schematic front view for explaining the operation of the flowchart shown in FIG. 10 [Figure 11H] Schematic front view for explaining the operation of the flowchart shown in FIG. 10 [Figure 12A] Perspective view (state before contact) for explaining the operation when the pushing portion according to the embodiment contacts the first component [Figure 12B] Perspective view (state after contact) for explaining the operation when the pushing portion according to the embodiment contacts the first component [Figure 13A] Schematic front view (state before contact) for explaining the operation of mounting the second component on the substrate using the component mounting apparatus according to the embodiment [Figure 13B] Schematic front view (state after contact) for explaining the operation of mounting the second component on the substrate using the component mounting apparatus according to the embodiment

MODE FOR CARRYING OUT THE INVENTION

[0010] According to the first aspect of the present disclosure, there is provided a component mounting apparatus including a mounting head for mounting a component on a substrate, a head moving device for moving the mounting head, and a control device for controlling the driving of the head moving device, wherein the component includes a first component having a flat portion and a protruding portion protruding downward at a position different from the flat portion, and the mounting head has a holding portion for holding the flat portion of the first component and a pushing portion for pushing the protruding portion of the first component downward and inserting it into an insertion hole of the substrate.[[ID=!]] [[ID=!]]

[0011] [[ID=!]] According to a second aspect of this disclosure, the control device provides a component mounting apparatus according to the first aspect, which performs a first operation of moving the mounting head toward a mounting position while the first component is held by the holding portion of the mounting head, and a second operation after the first operation of pressing the first component held by the holding portion against the substrate and pushing the protruding portion of the first component downward with the pushing portion to insert it into the insertion hole of the substrate.

[0012] According to a third aspect of this disclosure, the component mounting apparatus described in the first or second aspect is provided, wherein the holding portion is vertically movable relative to the pressing portion.

[0013] According to a fourth aspect of the present disclosure, the mounting head is movable between a first height position in which the holding portion holds the first component and the pressing portion is spaced apart from the first component, and a second height position lower than the first height position, wherein at the second height position, the holding portion rises relative to the pressing portion, and the pressing portion comes into contact with the first component, as described in the third aspect.

[0014] According to a fifth aspect of this disclosure, the control device provides a component mounting apparatus according to the fourth aspect, which performs a third operation of lowering the mounting head toward the first component positioned at a predetermined location so that the holding portion of the mounting head comes into contact with the first component, and a fourth operation of further lowering the mounting head so that the holding portion rises relative to the pressing portion so that the pressing portion comes into contact with the first component.

[0015] According to a sixth aspect of the present disclosure, the first component further has a convex portion that protrudes upward on the back side of the protruding portion, and the lower end of the push-in portion is provided with a guide groove for guiding the convex portion inward, providing a component mounting device according to any one of the first to fifth aspects.

[0016] According to a seventh aspect of this disclosure, the component mounting apparatus according to the second aspect is provided, further comprising a head body portion to which the holding portion is mounted so as to be vertically movable.

[0017] According to an eighth aspect of this disclosure, the component mounting apparatus described in the seventh aspect is provided, wherein the pressing portion is integrally configured with the head body portion.

[0018] According to a ninth aspect of this disclosure, the component mounting apparatus described in the seventh aspect is provided, wherein the pressing portion is detachable from the head body.

[0019] According to a tenth aspect of this disclosure, the component mounting apparatus according to the second aspect is provided, further comprising a biasing member that biases the holding portion downward.

[0020] According to an eleventh aspect of this disclosure, the lower end of the holding portion is provided with a suction hole for adsorbing the flat portion of the first component, the mounting head incorporates a negative pressure channel communicating with the suction hole, and the biasing member is provided in the negative pressure channel, providing a component mounting apparatus according to the tenth aspect.

[0021] According to a twelfth aspect of this disclosure, the component includes a second component different from the first component, and the control device enables the pressing operation of the pressing portion when the first component is mounted and disables the pressing operation of the pressing portion when the second component is mounted, providing a component mounting apparatus according to any one of the first to eleventh aspects.

[0022] According to a thirteenth aspect of this disclosure, the component mounting apparatus according to the twelfth aspect is provided, wherein the second component is a radial component.

[0023] According to a fourteenth aspect of this disclosure, the component mounting apparatus described in any one of the first to thirteenth aspects is provided, wherein the holding portion is provided at a position offset in a first direction with respect to the central axis extending in the vertical direction of the mounting head, and the pressing portion is provided at a position offset in a second direction opposite to the first direction with respect to the central axis.

[0024] According to a 15th aspect of this disclosure, the first component is a thermal fuse that melts in response to a rise in temperature, and has a melting portion between the flat portion and the protruding portion, and the component mounting apparatus is provided according to any one of the 1st to 14th aspects.

[0025] A sixteenth aspect of this disclosure provides a component mounting method that includes the steps of: holding a flat portion of a first component with a holding portion of a mounting head; and using a pushing portion of the mounting head to push downward a protruding portion of the first component that protrudes downward at a position different from the flat portion, thereby inserting it into an insertion hole of a substrate.

[0026] Hereinafter, exemplary embodiments of the component mounting apparatus and component mounting method relating to this disclosure will be described with reference to the attached drawings. This disclosure is not limited to the specific configurations of the embodiments described below, and configurations based on similar technical ideas are included in the present invention.

[0027] (Embodiment) First, the overall configuration of the component mounting apparatus 1 in the embodiment will be described with reference to Figures 1 and 2. The component mounting apparatus 1 has the function of mounting components 3 onto a substrate 2. Figure 1 is a plan view of the component mounting apparatus 1, and Figure 2 is a front view of the component mounting apparatus 1. Hereinafter, the horizontal transport direction of the substrate 2 will be defined as the X direction, the direction perpendicular to the X direction in the horizontal plane will be defined as the Y direction, and the direction perpendicular to the XY plane will be defined as the Z direction.

[0028] As shown in Figures 1 and 2, the component mounting apparatus 1 comprises a substrate transport mechanism 5, a component supply unit 6, a mounting head 17, a clinch unit 20, and a control device C1.

[0029] The substrate transport mechanism 5 is a mechanism that transports the substrate 2 and positions it at a predetermined working position. The substrate transport mechanism 5 is, for example, a pair of transport conveyors extending in the X direction. The substrate transport mechanism 5 is provided on the upper surface of the base 4.

[0030] The component supply unit 6 is a unit that supplies components 3 to be mounted on the substrate 2. The component supply unit 6 is provided, for example, at positions on both sides in the Y direction of the substrate transport mechanism 5.

[0031] In the component supply section 6 on the front side (bottom of the paper), for example, multiple tape feeders 7 are arranged in parallel in the X direction. In Figure 2, the tape feeders 7 are set above the trolley 8. The tape feeders 7 supply components 3 to predetermined component supply positions by intermittently feeding a carrier tape 9 that holds multiple components 3. Examples of components 3 supplied by the tape feeders 7 include radial components and chip components.

[0032] In Figure 1, the component supply unit 6 on the rear side (upper side of the paper) has multiple tape feeders 7 and tray feeders 10 arranged in parallel in the X direction. In Figure 2, the tray feeder 10 includes a tray storage unit 12 and a tray holding unit 13. The tray storage unit 12 stores multiple trays 11 held on a pallet (not shown). The tray holding unit 13 holds the trays 11 and is provided to be movable in the horizontal and vertical directions.

[0033] Multiple components 3 are stored in tray 11. The tray feeder 10 has the function of pulling out tray 11 from tray storage section 12 by tray holding section 13 and supplying it to the position where components 3 are picked up by mounting head 17, which will be described later. An example of a component 3 supplied by tray feeder 10 is the first component 3A (Figures 3, 4A, and 4B), which is a thermal fuse, as will be described later.

[0034] The mounting head 17 is a head that takes components 3 supplied from the component supply unit 6 and mounts them onto the substrate 2. The mounting head 17 is configured to move horizontally above the substrate 2 by the drive of a head moving device 14 by the control device C1. For example, when mounting components 3 that have leads, such as radial components, the mounting head 17 inserts the leads into insertion holes formed in the substrate 2.

[0035] The head moving device 14 has a Y-axis beam 14a and an X-axis beam 14b. As shown in Figure 1, the Y-axis beam 14a is provided at the end of the base 4 in the X direction. Multiple X-axis beams 14b are provided on the Y-axis beam 14a so as to be movable in the Y direction. A plate-shaped plate member 16 is mounted on each X-axis beam 14b so as to be slidable in the X direction. A mounting head 17 is attached to the plate member 16. By driving the Y-axis beam 14a and the X-axis beam 14b, the mounting head 17 can move in the XY direction. The mounting head 17 is further configured to be vertically movable relative to the plate member 16, and can move vertically by driving a head vertical movement device (not shown) by the control device C1.

[0036] The plate member 16 is provided with a first recognition camera 18 whose imaging field of view is directed downward. The first recognition camera 18 images the substrate mark (not shown) and the like formed on the substrate 2 positioned at the work position. On the base 4, a second recognition camera 19 with its imaging field of view directed upward is provided between the substrate transport mechanism 5 and the component supply unit 6. The second recognition camera 19 images the component 3 held by the mounting head 17 moving above it from below.

[0037] The clinch unit 20 is a unit that, when mounting a component 3 having leads, clinches the leads that are inserted into the insertion holes by the mounting head 17 and protrude downwards from the substrate 2. The component mounting apparatus 1 may not have the clinch unit 20.

[0038] Next, the configuration of the first component 3A supplied by the tray feeder 10 will be described with reference to Figures 3, 4A, and 4B. Figure 3 is a perspective view of the first component 3A, and Figures 4A and 4B are schematic side views of the first component 3A, respectively. Both Figures 4A and 4B show the state in which the nozzle 70 of the mounting head 17 holds the first component 3A. Figure 4A shows the state before the first component 3A contacts the substrate 2, and Figure 4B shows the state after contact.

[0039] The first component 3A shown in Figure 3 is a thermal fuse that functions to melt when it reaches a predetermined temperature or higher. The first component 3A is made of a conductive material (e.g., metal) and is used by being mounted on the substrate 2.

[0040] The first part 3A is created, for example, by bending and punching a single sheet of metal. The first part 3A comprises a flat portion 50, a cut portion 52, a convex portion 54, a protruding portion 56, and a support portion 58.

[0041] The flat portion 50 is a part having a flat shape. The flat portion 50 is held by the nozzle 70 of the mounting head 17 and mounted on the mounting surface 2A of the substrate 2 shown in Figures 4A and 4B. The flat portion 50 has an upper surface 50A and a lower surface 50B (Figures 4A and 4B). The upper surface 50A is the surface to be held by suction from the nozzle 70 of the mounting head 17 (see arrow A1 in Figure 3). The lower surface 50B is the surface to be mounted to the mounting surface 2A of the substrate 2 by soldering or the like (see arrow A2 in Figure 4A).

[0042] The cutting section 52 is the part that cuts in response to the temperature rise of the first component 3A. The cutting section 52 has an arc-shaped curve from the end of the flat section 50. As shown in Figure 3, a through hole 60 is formed from the middle of the cutting section 52, and the through hole 60 continues to the support section 58. A projection 56 extending downward from the convex section 54 is housed in the through hole 60.

[0043] The protrusion 54 is a convex portion formed at the point where it extends upward from the support portion 58 and then folds back downward. A projection 56 is connected to the tip of the protrusion 54. The projection 56 is a portion that protrudes downward from the protrusion 54. As shown in Figure 4A, the projection 56 extends below the lower surface 50B of the flat portion 50 (see dotted line A3 in Figure 4A) and terminates there, and is inserted into the insertion hole 2B of the substrate 2 (see arrow A4). As shown in Figure 4B, the projection 56 is mounted to the substrate 2 by soldering or the like while inserted into the insertion hole 2B of the substrate 2.

[0044] The support portion 58 is the part that supports the convex portion 54 and the protruding portion 56. The support portion 58 is located opposite the flat portion 50, and the flat portion 50 and the support portion 58 are spaced apart horizontally (see arrow A5 in Figure 3). The cutting portion 52 is positioned between the flat portion 50 and the support portion 58.

[0045] In the contact state shown in Figure 4B, both the flat portion 50 and the protruding portion 56 are mounted on the substrate 2, and electricity flows to the first component 3A. When electricity flows to the first component 3A, the temperature of the first component 3A rises, and when the temperature of the first component 3A reaches a predetermined temperature or higher, the melting portion 52 melts and the current is interrupted.

[0046] Here, in order to accurately mount the first component 3A onto the substrate 2, it is necessary to accurately insert the protruding portion 56 of the first component 3A into the insertion hole 2B of the substrate 2. However, the protruding portion 56 is located laterally (horizontally) away from the flat portion 50 held by the nozzle 70 of the mounting head 17, and the nozzle 70 cannot strongly push the protruding portion 56 downwards simply by pressing the flat portion 50 against the substrate 2. As a result, the protruding portion 56 may not be properly inserted into the insertion hole 2B of the substrate 2, and the mounting of the first component 3A may fail.

[0047] Therefore, as shown in Figures 4A and 4B, the mounting head 17 of this embodiment is provided with a push-in portion 72 for pushing the protruding portion 56 of the first component 3A downward, in addition to the holding portion 71 for holding the flat portion 50 of the first component 3A. By using the push-in portion 72 to firmly push the protruding portion 56 downward (see arrow A6 in Figure 4B), the protruding portion 56 can be accurately inserted into the insertion hole 2B of the substrate 2, thereby improving the accuracy of component mounting.

[0048] Next, the detailed configuration of the mounting head 17 of this embodiment will be described with reference to Figures 5 to 8. Figures 5 to 7 are perspective views of the mounting head 17 from different angles, and Figure 8 is a perspective view showing an enlarged portion of the mounting head 17. Figures 5 and 6 show the mounting head 17 holding the first component 3A, while Figures 7 and 8 show the mounting head 17 not holding the first component 3A.

[0049] As shown in Figures 5 to 8, the mounting head 17 comprises a nozzle 70 having a holding portion 71, a head body portion 74 having a pressing portion 72, a nozzle holding plate 76, and a head mounting portion 78.

[0050] The holding portion 71 is a part that has the function of holding the first component 3A and is provided at the lower end of the nozzle 70. As shown in Figures 7 and 8, the holding portion 71 has an adsorption hole 73 at its lower end and holds the first component 3A by adsorption through the negative pressure supplied to the adsorption hole 73.

[0051] The push-in portion 72 is a part that has the function of pushing the protruding portion 56 of the first part 3A downward, and has a shape that protrudes downward, similar to the nozzle 70. The holding portion 71 and the push-in portion 72 are located at horizontally separated positions and engage independently with different parts of the first part 3A.

[0052] As shown in Figures 7 and 8, the push-in portion 72 of this embodiment has a pair of claw portions 75 that protrude downward. The pair of claw portions 75 are spaced apart from each other, and between the claw portions 75 there is a guide groove 77 that is recessed upward and a pressing surface 79 (Figure 8).

[0053] The guide groove 77 is a groove (recess) for guiding the protrusion 54 of the first part 3A inward. By guiding the protrusion 54 of the first part 3A inward, the guide groove 77 can bring the relative rotational position of the mounting head 17 having the pressing portion 72 and the first part 3A having the protrusion 54 closer to a constant value. To improve the guiding function of the guide groove 77, the inner side walls of the pair of claw portions 75 have a tapered shape that slopes inward upward. The protrusion 54 housed in the guide groove 77 contacts the pressing surface 79.

[0054] The pressing surface 79 is a surface that contacts the convex portion 54 of the first part 3A from above and is capable of pressing the convex portion 54 and the protruding portion 56 downward. The pressing surface 79 constitutes the guide groove 77 and is provided in a position recessed above the lower end of the claw portion 75.

[0055] The head body portion 74 is a block-shaped member that supports the nozzle 70 and the push-in portion 72. In this embodiment, the head body portion 74 holds the nozzle 70 in a state where it can move up and down. Figures 5 to 8 show the state in which the nozzle 70 protrudes downward (default state). In this embodiment, the head body portion 74 and the push-in portion 72 are integrally configured, and the push-in portion 72 does not have the function of moving relative to the head body portion 74.

[0056] The nozzle holding plate 76 is a plate-shaped member for attaching and holding the nozzle 70 to the head body 74 in a state where it can move up and down. The nozzle 70 is inserted through the center of the nozzle holding plate 76 in a state where it can move up and down. As shown in Figures 6 and 7, two screws 80 are inserted through the nozzle holding plate 76, and the nozzle holding plate 76 is fixed to the head body 74 by screwing the screws 80 into the head body 74.

[0057] The head mounting section 78 is a part for attaching the mounting head 17 to another block (not shown). The other block is attached to the plate member 16 shown in Figures 1 and 2, and functions as an integrated mounting head together with the mounting head 17.

[0058] The head mounting portion 78 has a flange portion 82, an upward projection portion 84, and a negative pressure connecting member 86.

[0059] The flange portion 82 is a part that protrudes horizontally. The flange portion 82 functions as a background when recognizing parts using the second recognition camera 19 shown in Figure 1.

[0060] The upward projection 84 is a roughly cylindrical portion that protrudes upward from the central position of the flange portion 82 and is attached to the aforementioned other block. As shown in Figures 5 and 6, a negative pressure connecting member 86 is inserted from above into the upward projection 84. The negative pressure connecting member 86 is a connecting member for supplying negative pressure to the suction hole 73 of the nozzle 70, and a connecting opening 88 is provided at the upper end of the negative pressure connecting member 86. When the head mounting portion 78 is attached to the other block, the connecting opening 88 is connected to a suction source (not shown), and negative pressure can be supplied to the suction hole 73 of the holding portion 71. The control device C1 switches between supplying / stopping negative pressure to the suction hole 73 by controlling the opening and closing of a valve (not shown).

[0061] Figures 9A and 9B are perspective views showing a vertical cross-section of the mounting head 17. Figure 9A shows the nozzle 70 in a protruding state (default state) where it is protruding downwards, and Figure 9B shows the nozzle 70 in a retracted state (operating state) where it is retracted upwards.

[0062] As shown in Figures 9A and 9B, a negative pressure channel 90 is provided inside the mounting head 17 to supply negative pressure to the suction hole 73. The negative pressure channel 90 is a channel that extends continuously from the connection opening 88 to the suction hole 73, and extends from the upstream side through the negative pressure connecting member 86, the head body 74, and the nozzle 70 in that order. In Figure 9A, the direction of the negative pressure acting on the negative pressure channel 90 is indicated by an arrow.

[0063] The nozzle 70 has a retaining portion 71 at its lower end, as well as an enlarged diameter portion 92 at its upper end. The enlarged diameter portion 92, like the retaining portion 71, is a portion of the nozzle 70 that protrudes horizontally relative to the nozzle, and is positioned inside the head body portion 74 in a manner that prevents it from falling out. The enlarged diameter portion 92 is positioned in a space 94 that constitutes part of the negative pressure passage 90.

[0064] A biasing member 96 is further positioned in the arrangement space 94. The biasing member 96 is a member that contacts the enlarged diameter portion 92 of the nozzle 70 from above and biases the nozzle 70 downward. In this embodiment, the biasing member 96 is a spring. The biasing member 96 applies a downward biasing force F1 to the nozzle 70. When the biasing force F1 acts on the nozzle 70, the nozzle 70 defaults to a protruding position (see Figure 9A) that protrudes downward relative to the head body portion 74.

[0065] As shown in Figure 9B, when an upward pressing force F2 acting on the nozzle 70 is contrary to the biasing force F1, the biasing member 96 contracts and the nozzle 70 becomes able to move to a retracted position in the upward position.

[0066] As shown in the configurations in Figures 9A and 9B, the nozzle 70 is able to move up and down relative to the head body 74, allowing various operations to be performed by moving the mounting head 17 up and down as a whole. Specifically, by lowering the mounting head 17, the following operations can be performed: the holding portion 71 contacts the first component 3A to hold the first component 3A; the holding portion 71 presses the first component 3A held by the holding portion 71 against the substrate 2; and the pushing portion 72 contacts the protruding portion 56 of the first component 3A to push it downwards.

[0067] As shown in Figure 9B, the nozzle 70 and the pressing portion 72 are positioned symmetrically with respect to the central axis Ax extending vertically from the mounting head 17. Specifically, the nozzle 70 is positioned offset in a first direction D1 along the horizontal direction with respect to the central axis Ax, while the pressing portion 72 is positioned offset in a second direction D2 opposite to the first direction D1 along the horizontal direction with respect to the central axis Ax. This allows the nozzle 70 and the pressing portion 72 to be positioned in different locations while maintaining a balanced arrangement so that the horizontal dimensions of the mounting head 17 do not become biased in one direction around the central axis Ax, thereby contributing to the miniaturization of the mounting head 17.

[0068] An example of the operation of mounting the first component 3A onto the substrate 2 using the mounting head 17 having the above-described configuration will be explained with reference to Figures 10, 11A to 11H, and 12A and 12B. Figure 10 is a flowchart of an example of the operation of the mounting head 17, and Figures 11A to 11H are schematic front views illustrating the operation of the flowchart shown in Figure 10. Figures 12A and 12B are perspective views illustrating the operation when the pressing portion 72 of the mounting head 17 contacts the first component 3A.

[0069] Each process in the flowchart shown in Figure 10 is executed, for example, by the control device C1.

[0070] First, the control device C1 moves the mounting head 17 above the tray 11 (S1). Specifically, as shown in Figure 11A, the mounting head 17 is moved horizontally (see arrow B1) and positioned above the tray 11. Multiple first components 3A are placed on the tray 11, and Figures 11A to 11H illustrate one first component 3A to be mounted. The tray 11 is shown schematically, and the multiple first components 3A are arranged in slots etc. not shown, and their position and orientation are controlled to some extent.

[0071] The memory unit of the component mounting device 1 stores the position information of each of the multiple first components 3A placed on the tray 11. Based on the position information stored in the memory unit, the control device C1 moves the mounting head 17 horizontally to a position where the first component 3A to be mounted can be held by suction.

[0072] As shown in Figure 11A, the mounting head 17 is moved horizontally so that the holding portion 71 of the mounting head 17 is positioned directly above the flat portion 50 of the first component 3A, and the pressing portion 72 of the mounting head 17 is positioned directly above the convex portion 54 and the protruding portion 56 of the first component 3A.

[0073] The control device C1 lowers the mounting head 17 to bring the holding portion 71 into contact with the first component 3A (S2). Specifically, as shown in Figure 11B, the mounting head 17 is lowered integrally (arrow B2) to bring the lower end of the holding portion 71 of the mounting head 17 into contact with the flat portion 50 of the first component 3A. At this point, no negative pressure is supplied to the suction hole 73 of the holding portion 71, and the holding portion 71 does not suction and hold the first component 3A.

[0074] As shown in Figure 11B, when the retaining portion 71 begins to contact the flat portion 50, the pushing portion 72 is positioned above the protrusion 54 and does not yet engage with the first part 3A. Thus, the lower end positions of the retaining portion 71 and the pushing portion 72 in the default position are preset so that the retaining portion 71 contacts the first part 3A before the pushing portion 72.

[0075] The control device C1 further lowers the mounting head 17, bringing the pressing portion 72 into contact with the first component 3A (S3). Specifically, the mounting head 17 is lowered integrally from the state shown in Figure 11B, so that the pressing portion 72 of the mounting head 17 comes into contact with the protrusion 54 of the first component 3A, as shown in Figure 11C (see arrow B3). Since the first component 3A is pressed against the tray 11, when the mounting head 17 is lowered integrally, the holding portion 71 that contacts the first component 3A rises relative to the pressing portion 72 and the head body portion 74 (see arrow C1). In this way, the pressing portion 72 can be brought into contact with the first component 3A while maintaining the state in which the first component 3A is pressed downward.

[0076] The operation of the push-in portion 72 when it comes into contact with the first part 3A will be explained using Figures 12A and 12B. Figure 12A shows the state before the push-in portion 72 comes into contact with the first part 3A, and Figure 12B shows the state after contact.

[0077] As shown in Figure 12A, the horizontal position of the mounting head 17 is set so that the guide groove 77 is located directly above the protrusion 54 of the first part 3A. When the mounting head 17 is lowered as a whole from the state shown in Figure 12A, as shown in Figure 12B, the push-in part 72 provided on the mounting head 17 lowers together with the mounting head 17 and comes into contact with the protrusion 54 of the part 3 (see arrow D). At this time, the protrusion 54 is guided inside the guide groove 77, which adjusts the relative rotational position of the mounting head 17 and the first part 3A. Even if there is a relative misalignment between the mounting head 17 and the first part 3A, alignment can be performed to eliminate the misalignment, and then the push-in part 72 can accurately press the protrusion 56 downwards.

[0078] The control device C1 turns ON the suction by the holding unit 71 (S4). Specifically, by supplying negative pressure to the suction hole 73 of the holding unit 71, the holding unit 71 suctions and holds the flat portion 50 of the first component 3A. Because the relative orientation of the mounting head 17 and the first component 3A is corrected in step S3, the first component 3A can be held in the desired orientation in step S4.

[0079] The control device C1 raises the mounting head 17 (S5). Specifically, as shown in Figure 11D, the mounting head 17 is raised integrally with the holding part 71 while it is still holding the first part 3A by suction (arrow B4). As a result, the first part 3A is carried out of the tray 11. Due to the biasing force F1 of the biasing member 96 (see Figures 9A and 9B), the nozzle 70 returns to a protruding position that is projecting downward relative to the head body 74 (arrow C2).

[0080] As the first component 3A held by the nozzle 70 also moves downward relatively, the protrusion 54 of the first component 3A separates from the pressing portion 72 of the mounting head 17 and contact is released. Since the holding portion 71 holds the first component 3A by suction, the relative positional relationship between the mounting head 17 and the first component 3A when viewed from above does not change.

[0081] The control device C1 moves the mounting head 17 above the substrate 2 (S6). Specifically, as shown in Figure 11E, the mounting head 17 is moved horizontally (see arrow B5) to be positioned above the substrate 2 (mounting position). The mounting head 17 is moved horizontally so that the protruding portion 56 of the first component 3A and the pressing portion 72 of the mounting head 17 are positioned directly above the insertion hole 2B of the substrate 2.

[0082] The control device C1 lowers the mounting head 17 to bring the first component 3A into contact with the substrate 2 (S7). Specifically, as shown in Figure 11F, the mounting head 17 is lowered integrally (arrow B6) to bring the flat portion 50 of the first component 3A, held by the holding portion 71 of the mounting head 17, into contact with the mounting surface 2A of the substrate 2. At this time, the protruding portion 56 of the first component 3A begins to be inserted into the insertion hole 2B of the substrate 2.

[0083] The control device C1 further lowers the mounting head 17 and presses the first component 3A with the pressing portion 72 (S8). Specifically, from the state shown in Figure 11F, the mounting head 17 is further lowered integrally so that the pressing portion 72 of the mounting head 17 contacts the protrusion 54 of the first component 3A, as shown in Figure 11G (arrow B7). The specific operation is the same as that shown in Figures 12A and 12B, and as shown in Figure 12B, by bringing the pressing surface 79 of the pressing portion 72 into contact with the upper end of the protrusion 54, the protrusion 54 and the projection 56 can be pressed downward integrally. Also, if the pair of claw portions 75 contact the support portion 58, the support portion 58 that supports the protrusion 54 and projection 56 can also be pressed downward. As a result, as shown in Figure 11G, the pressing portion 72 presses the projection 56 downward (see arrow B8), allowing it to be accurately inserted into the insertion hole 2B of the substrate 2. This makes it easier to maintain the position in which the protruding portion 56 is inserted into the insertion hole 2B, thereby reducing mounting errors.

[0084] The control device C1 turns OFF the suction by the holding unit 71 (S9). Specifically, it stops supplying negative pressure to the suction hole 73 of the holding unit 71, thereby releasing the suction holding of the first component 3A by the holding unit 71.

[0085] The control device C1 raises the mounting head 17 (S10). Specifically, as shown in Figure 11H, the mounting head 17, which has released the suction holding of the first component 3A, is raised integrally (arrow B9). The mounting head 17 moves away from the first component 3A and the substrate 2, and can move on to picking up and mounting the next component to be mounted, the first component 3A. The nozzle 70 returns to its protruding position, which is projecting downward relative to the head body 74 (arrow C4).

[0086] According to the above operation, the protruding portion 56 of the first component 3A can be accurately inserted into the insertion hole 2B of the substrate 2 by using the push-in portion 72, which is located at a different position from the holding portion 71 of the nozzle 70, to push it downward. As a result, even if the first component 3A has a special shape in which the flat portion 50 and the protruding portion 56 are located far apart, it can be accurately mounted on the substrate 2, thereby improving the accuracy of component mounting.

[0087] Furthermore, by attaching the nozzle 70 having the holding portion 71 to the head body portion 74 in a state that allows it to move up and down, when the mounting head 17 is lowered, it becomes possible to continuously perform the operation of bringing the first component 3A held by the holding portion 71 into contact with the mounting surface 2A of the substrate 2, and the operation of pressing the first component 3A against the substrate 2 and bringing the pressing portion 72 into contact with the first component 3A to press it in.

[0088] Furthermore, the push-in portion 72 not only has the function of pushing in the first component 3A, but also has the function of guiding the protrusion 54 of the first component 3A inward by providing a guide groove 77 between the pair of claw portions 75. This allows the mounting head 17 to adjust the relative rotational position of the mounting head 17 and the first component 3A when the mounting head 17 holds the first component 3A, and then stabilizes the position in which the push-in portion 72 contacts the first component 3A when pushing it in, thereby stabilizing the pushing operation.

[0089] The mounting head 17 having the above configuration can be used not only for mounting the first component 3A having a flat portion 50 and a protruding portion 56, but also for mounting different types of components 3. A specific example will be explained using Figures 13A and 13B.

[0090] Figures 13A and 13B are schematic front views illustrating the operation of mounting the second component 3B, which is a radial component supplied by the tape feeder 7 shown in Figure 1 as a type of component 3, onto the substrate 2. Both Figures 13A and 13B show the state in which the holding part 71 of the mounting head 17 holds the second component 3B. Figure 13A shows the state before the second component 3B contacts the substrate 2, and Figure 13B shows the state after contact.

[0091] As shown in Figure 13A, the second component 3B, as a radial component, has a component body 100 and two leads 102, and the upper surface of the component body 100 is held by the holding portion 71 of the mounting head 17.

[0092] When the mounting head 17 is lowered integrally from the state shown in Figure 13A, the lead 102 of the second component 3B is inserted into the insertion hole 2C of the substrate 2, as shown in Figure 13B (see arrow E1). When the mounting head 17 is pushed further, the component body 100 of the second component 3B is pressed against the mounting surface 2A of the substrate 2, and the nozzle 70 rises relatively (arrow F1). The biasing member 96 shown in Figures 9A and 9B contracts, absorbing the impact when the component body 100 of the second component 3B is pressed against the substrate 2.

[0093] Subsequently, the suction holding by the holding unit 71 is released, and the mounting head 17 is raised and retracted, thereby completing the mounting and installation of the second component 3B.

[0094] When the mounting head 17 holds the second component 3B, the component body 100 to be held and the lead 102 to be inserted are in a position that overlaps in a plan view (the X and Y coordinates are the same). Therefore, by simply lowering the mounting head 17 and the nozzle 70, the lead 102 of the second component 3B can be pushed into the insertion hole 2C of the substrate 2 without using the pushing action of the pushing part 72.

[0095] According to the mounting operation shown in Figures 13A and 13B, a different type of second component 3B (e.g., a radial component) can be mounted on the substrate 2 using a mounting head 17 capable of mounting the first component 3A. The push-in portion 72 of the mounting head 17 does not engage with the second component 3B, and the push-in and alignment functions of the second component 3B are not performed. In other words, the function of the push-in portion 72 is disabled. Even when there are multiple types of components 3 supplied to the component mounting device 1, one type of mounting head 17 can handle them.

[0096] As described above, the component mounting apparatus 1 of this embodiment includes a mounting head 17 for mounting components 3 onto a substrate 2, a head moving device 14 for moving the mounting head 17, and a control device C1 for controlling the drive of the head moving device 14. The component 3 includes a first component 3A having a flat portion 50 and a protruding portion 56 that protrudes downward at a position different from the flat portion 50. The mounting head 17 has a holding portion 71 for holding the flat portion 50 of the first component 3A and a pushing portion 72 for pushing the protruding portion 56 of the first component 3A downward and inserting it into the insertion hole 2B of the substrate 2.

[0097] With this configuration, even if the component to be mounted has a special shape (component 3), it can be accurately inserted and mounted onto the substrate (board 2) by using the mounting head 17, which combines a holding portion 71 and a pressing portion 72.

[0098] Furthermore, in the component mounting apparatus 1 of this embodiment, the control device C1 performs a first operation (S6) in which the mounting head 17 is moved toward the mounting position while the first component 3A is held by the holding portion 71 of the mounting head 17, and a second operation (S8) in which, after the first operation, the holding portion 71 presses the first component 3A held by the holding portion 71 against the substrate 2, and the pushing portion 72 pushes the protruding portion 56 of the first component 3A downward to insert it into the insertion hole 2B of the substrate 2. With this configuration, the operation of inserting the protruding portion 56 of the first component 3A into the insertion hole 2B of the substrate 2 can be performed quickly and easily.

[0099] Furthermore, in the component mounting apparatus 1 of this embodiment, the holding portion 71 is vertically movable relative to the pressing portion 72. With this configuration, the relative position of the pressing portion 72 with respect to the first component 3A can be changed by moving the mounting head 17 up and down while the first component 3A held by the holding portion 71 is pressed against the substrate 2.

[0100] Furthermore, in the component mounting apparatus 1 of this embodiment, the mounting head 17 is movable between a first height position (Figures 11D, 11E, etc.) where the holding portion 71 holds the first component 3A and the pressing portion 72 is spaced apart from the first component 3A, and a second height position (Figure 11G, etc.) which is lower than the first height position. At the second height position, with the first component 3A held by the holding portion 71 in contact with the substrate 2, the holding portion 71 rises relative to the pressing portion 72, causing the pressing portion 72 to contact the first component 3A. With this configuration, simply by lowering the mounting head 17, the operation of pressing the first component 3A against the substrate 2 and inserting the protruding portion 56 of the first component 3A into the insertion hole 2B of the substrate 2 can be performed.

[0101] Furthermore, in the component mounting apparatus 1 of this embodiment, the control device C1 performs a third operation (S2) in which the mounting head 17 is lowered toward the first component 3A placed on the tray 11 (a predetermined position) and the holding portion 71 of the mounting head 17 is brought into contact with the first component 3A, and a fourth operation (S3) in which the mounting head 17 is lowered further so that the holding portion 71 rises relative to the pressing portion 72 and the pressing portion 72 is brought into contact with the first component 3A. With this configuration, by bringing the pressing portion 72 into contact with the first component 3A when holding the first component 3A, it becomes possible to align the relative position of the mounting head 17 and the first component 3A.

[0102] Furthermore, in the component mounting apparatus 1 of this embodiment, the first component 3A has a protrusion 54 that protrudes upward on the back side of the protruding portion 56, and a guide groove 77 is provided at the lower end of the push-in portion 72 to guide the protrusion 54 inward. With this configuration, when the push-in portion 72 contacts the protrusion 54 of the first component 3A, the protrusion 54 can be guided inward into the guide groove 77, and the relative position of the mounting head 17 and the first component 3A can be aligned with high precision.

[0103] Furthermore, in the component mounting apparatus 1 of this embodiment, the mounting head 17 further includes a head body portion 74 to which the holding portion 71 is mounted so as to be vertically movable. With this configuration, the holding portion 71 can be held stably.

[0104] Furthermore, in the component mounting apparatus 1 of this embodiment, the pressing portion 72 is integrally formed with the head body portion 74. With this configuration, the structure of the mounting head 17 can be simplified.

[0105] Furthermore, in the component mounting apparatus 1 of this embodiment, the mounting head 17 further includes a biasing member 96 that biases the holding portion 71 downward. With this configuration, the impact when the holding portion 71 is brought into contact with the first component 3A or when the first component 3A is brought into contact with the substrate 2 for mounting can be mitigated.

[0106] Furthermore, in the component mounting apparatus 1 of this embodiment, a suction hole 73 for adsorbing the flat portion 50 of the first component 3A is provided at the lower end of the holding portion 71, the mounting head 17 incorporates a negative pressure channel 90 that communicates with the suction hole 73, and the biasing member 96 is provided in the negative pressure channel 90. With this configuration, the biasing member 96 can be arranged by effectively utilizing the internal space of the mounting head 17, which contributes to miniaturization of the mounting head 17.

[0107] Furthermore, in the component mounting apparatus 1 of this embodiment, component 3 includes a second component 3B that is different from the first component 3A, and the control device C1 enables the pressing operation of the pressing unit 72 when mounting the first component 3A, and disables the pressing operation of the pressing unit 72 when mounting the second component 3B. With this configuration, the mounting head 17 capable of mounting the first component 3A can also be used for mounting the second component 3B, which does not require the pressing operation of the pressing unit 72.

[0108] Furthermore, in the component mounting apparatus 1 of this embodiment, the second component 3B includes a radial component. With this configuration, the mounting head 17 can also be used for mounting radial components.

[0109] Furthermore, in the component mounting apparatus 1 of this embodiment, the holding portion 71 is positioned at a location offset in a first direction D1 with respect to the central axis Ax extending in the vertical direction of the mounting head 17, and the pressing portion 72 is positioned at a location offset in a second direction D2, which is opposite to the first direction D1 with respect to the central axis Ax. With this configuration, the holding portion 71 and the pressing portion 72 can be arranged in a balanced manner, thereby reducing the bias in the horizontal dimensions of the mounting head 17.

[0110] Furthermore, in the component mounting apparatus 1 of this embodiment, the first component 3A is a thermal fuse that melts in response to rising temperatures, and has a melting portion 52 between a flat portion 50 and a protruding portion 56. With this configuration, it can also be applied to mounting special components 3 such as thermal fuses.

[0111] Furthermore, the component mounting method of this embodiment includes the steps of holding the flat portion 50 of the first component 3A with the holding portion 71 of the mounting head 17 (S2 to S4), and pressing down on the protruding portion 56 that protrudes downward at a position different from the flat portion 50 of the first component 3A with the pushing portion 72 of the mounting head 17, and inserting it into the insertion hole 2B of the substrate 2 (S7, S8).

[0112] With this method, even if the component to be mounted has a special shape (component 3), it can be accurately inserted and mounted onto the substrate (substrate 2) by using the mounting head 17, which combines a holding portion 71 and a pressing portion 72.

[0113] Although the present invention has been described above with reference to the embodiments described, the present invention is not limited to the embodiments described above. For example, in the embodiments, the case in which the first component 3A to be mounted by the mounting head 17 is a thermal fuse was described, but the present invention is not limited to this case. The first component may be any type of component as long as it has a "flat portion" that is held by the nozzle 70 of the mounting head 17 and a "protruding portion" that is pushed downward by the push portion 72 of the mounting head 17. Furthermore, the "flat portion" does not need to be flat as a whole, but it is sufficient that it has a flat surface that can be held by the holding portion 71.

[0114] Furthermore, although the embodiment described a case in which the push-in portion 72 is integrally configured with the head body portion 74, it is not limited to this case. For example, the push-in portion may be detachably attached to the head body portion 74, or the push-in portion itself may be operable. With such a configuration, even if the first component 3A is changed to a component with different specifications or shape, the same mounting head 17 can be used.

[0115] Although the present invention has been fully described in relation to preferred embodiments with reference to the accompanying drawings, various modifications and alterations will be obvious to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the invention as defined in the appended claims. Furthermore, changes in the combination and order of elements in the embodiments can be realized without departing from the scope and spirit of the invention. [Industrial applicability]

[0116] The component mounting apparatus and component mounting method of this disclosure are applicable to any device that mounts components onto a circuit board. [Explanation of Symbols]

[0117] 1. Component mounting equipment 2 circuit boards 2B Insertion hole 3 parts 3A 1st part 3B 2nd part 14. Head movement device 17 Mounting Head 50 Plane section 56 Protrusion 71 Holding part 72 Push-in section C1 Control Unit

Claims

1. A mounting head for mounting components onto a circuit board, A head moving device for moving the aforementioned mounting head, The system includes a control device for controlling the drive of the head moving device, The aforementioned part includes a first part having a flat portion and a protruding portion that protrudes downward at a position different from the flat portion. The mounting head has a holding portion that holds the flat portion of the first component and a pushing portion that pushes the protruding portion of the first component downward and inserts it into the insertion hole of the substrate. The holding portion is capable of moving up and down relative to the pressing portion. The mounting head is movable between a first height position in which the holding portion holds the first component and the pressing portion is spaced apart from the first component, and a second height position lower than the first height position, and at the second height position, with the first component held by the holding portion in contact with the substrate, the holding portion rises relative to the pressing portion, and the pressing portion comes into contact with the first component. The control device is A third operation involves lowering the mounting head toward the first component positioned in a predetermined location, thereby bringing the holding portion of the mounting head into contact with the first component, A component mounting apparatus that performs a fourth operation by further lowering the mounting head so that the holding portion rises relative to the pressing portion and the pressing portion comes into contact with the first component.

2. A mounting head for mounting components onto a circuit board, A head moving device for moving the aforementioned mounting head, The system includes a control device for controlling the drive of the head moving device, The aforementioned part includes a first part having a flat portion and a protruding portion that protrudes downward at a position different from the flat portion. The mounting head has a holding portion that holds the flat portion of the first component and a pushing portion that pushes the protruding portion of the first component downward and inserts it into the insertion hole of the substrate. The first component further has a convex portion that protrudes upward on the back side of the protruding portion, A component mounting device is provided with a guide groove at the lower end of the pressing portion for guiding the protrusion inward.

3. A mounting head for mounting components onto a circuit board, A head moving device for moving the aforementioned mounting head, The system includes a control device for controlling the drive of the head moving device, The aforementioned part includes a first part having a flat portion and a protruding portion that protrudes downward at a position different from the flat portion. The mounting head has a holding portion that holds the flat portion of the first component and a pushing portion that pushes the protruding portion of the first component downward and inserts it into the insertion hole of the substrate. The control device is A first operation involves moving the mounting head toward the mounting position while the first component is being held by the holding portion of the mounting head, After the first operation, with the first component held by the holding part pressed against the substrate, the pushing part pushes the protruding part of the first component downward and inserts it into the insertion hole of the substrate, and the second operation is performed. The mounting head further includes a head body portion to which the holding portion is mounted so as to be movable up and down, The aforementioned pressing portion is integrally formed with the head body portion, in a component mounting device.

4. A mounting head for mounting components onto a circuit board, A head moving device for moving the aforementioned mounting head, The system includes a control device for controlling the drive of the head moving device, The aforementioned part includes a first part having a flat portion and a protruding portion that protrudes downward at a position different from the flat portion. The mounting head has a holding portion that holds the flat portion of the first component and a pushing portion that pushes the protruding portion of the first component downward and inserts it into the insertion hole of the substrate. The control device is A first operation involves moving the mounting head toward the mounting position while the first component is being held by the holding portion of the mounting head, After the first operation, with the first component held by the holding part pressed against the substrate, the pushing part pushes the protruding part of the first component downward and inserts it into the insertion hole of the substrate, and the second operation is performed. The mounting head further includes a head body portion to which the holding portion is mounted so as to be movable up and down, The aforementioned pressing portion is detachable from the head body portion, in a component mounting device.

5. A mounting head for mounting components onto a circuit board, A head moving device for moving the aforementioned mounting head, The system includes a control device for controlling the drive of the head moving device, The aforementioned part includes a first part having a flat portion and a protruding portion that protrudes downward at a position different from the flat portion. The mounting head has a holding portion that holds the flat portion of the first component and a pushing portion that pushes the protruding portion of the first component downward and inserts it into the insertion hole of the substrate. The control device is A first operation involves moving the mounting head toward the mounting position while the first component is being held by the holding portion of the mounting head, After the first operation, with the first component held by the holding part pressed against the substrate, the pushing part pushes the protruding part of the first component downward and inserts it into the insertion hole of the substrate, and the second operation is performed. The component mounting apparatus further comprises a biasing member that biases the holding portion downward, wherein the mounting head is a component mounting device.

6. The lower end of the holding portion is provided with an adsorption hole for adsorbing the flat portion of the first component. The component mounting apparatus according to claim 5, wherein the mounting head incorporates a negative pressure channel communicating with the suction hole, and the biasing member is provided in the negative pressure channel.

7. A mounting head for mounting components onto a circuit board, A head moving device for moving the aforementioned mounting head, The system includes a control device for controlling the drive of the head moving device, The aforementioned part includes a first part having a flat portion and a protruding portion that protrudes downward at a position different from the flat portion. The mounting head has a holding portion that holds the flat portion of the first component and a pushing portion that pushes the protruding portion of the first component downward and inserts it into the insertion hole of the substrate. The aforementioned component includes a second component that is different from the first component. The control device enables the pressing action of the pressing part when mounting the first component, and disables the pressing action of the pressing part when mounting the second component.

8. The component mounting apparatus according to claim 7, wherein the second component is a radial component.

9. The holding portion is provided at a position offset in a first direction with respect to the central axis extending vertically of the mounting head, The component mounting apparatus according to any one of claims 1 to 5, 7, wherein the pressing portion is provided at a position offset in a second direction opposite to the first direction with respect to the central axis.

10. The component mounting apparatus according to any one of claims 1 to 5, 7, wherein the first component is a thermal fuse that melts in response to a rise in temperature, and has a melting portion between the flat portion and the protruding portion.

11. The control device is A first operation involves moving the mounting head toward the mounting position while the first component is being held by the holding portion of the mounting head, A component mounting apparatus according to any one of claims 1 to 5, 7, wherein, after the first operation, the holding part presses the first component held by the holding part against the substrate, and the pushing part pushes the protruding part of the first component downward to insert it into the insertion hole of the substrate, the component mounting apparatus according to any one of claims 1 to 5, 7.

12. The component mounting apparatus according to any one of claims 2 to 5, 7, wherein the holding portion is movable up and down relative to the pressing portion.

13. The component mounting apparatus according to claim 12, wherein the mounting head is movable between a first height position in which the holding portion holds the first component and the pressing portion is spaced apart from the first component, and a second height position lower than the first height position, and at the second height position, with the first component held by the holding portion in contact with the substrate, the holding portion rises relative to the pressing portion so that the pressing portion comes into contact with the first component.

14. The control device is A third operation involves lowering the mounting head toward the first component positioned in a predetermined location, thereby bringing the holding portion of the mounting head into contact with the first component, The component mounting apparatus according to claim 13, further lowering the mounting head to perform a fourth operation in which the holding portion rises relative to the pressing portion and the pressing portion comes into contact with the first component.

15. The mounting head holds the flat portion of the first component, and The step of using the pressing portion of the mounting head to push downward the protruding portion of the first component that protrudes downward at a position different from the flat portion of the first component, and inserting it into the insertion hole of the substrate, Includes, The holding portion is capable of moving up and down relative to the pressing portion. The mounting head is movable between a first height position in which the holding portion holds the first component and the pressing portion is spaced apart from the first component, and a second height position lower than the first height position, and at the second height position, with the first component held by the holding portion in contact with the substrate, the holding portion rises relative to the pressing portion, and the pressing portion comes into contact with the first component. A third operation involves lowering the mounting head toward the first component positioned in a predetermined location, thereby bringing the holding portion of the mounting head into contact with the first component, A component mounting method comprising: further lowering the mounting head, causing the holding portion to rise relative to the pressing portion, and performing a fourth operation to bring the pressing portion into contact with the first component.

16. A step of holding the flat portion of the first component with the holding portion of the mounting head, The step includes using the pressing portion of the mounting head to press downward a protruding portion of the first component that protrudes downward at a position different from the flat portion of the first component, and inserting it into the insertion hole of the substrate, The first component further has a convex portion that protrudes upward on the back side of the protruding portion, A component mounting method wherein a guide groove is provided at the lower end of the push-in portion to guide the protrusion inward.

17. A step of holding the flat portion of the first component with the holding portion of the mounting head, With the first component held in the holding portion of the mounting head, the mounting head is moved toward the mounting position. The step of pressing the first component held by the holding portion against the substrate, and using the pressing portion of the mounting head, pressing downward a protruding portion that protrudes downward at a position different from the flat portion of the first component, thereby inserting it into the insertion hole of the substrate, is included. The mounting head further includes a head body portion to which the holding portion is mounted so as to be movable up and down, The aforementioned pressing portion is integrally formed with the head body portion in a component mounting method.

18. A step of holding the flat portion of the first component with the holding portion of the mounting head, With the first component held in the holding portion of the mounting head, the mounting head is moved toward the mounting position. The step of pressing the first component held by the holding portion against the substrate, and using the pressing portion of the mounting head, pressing downward a protruding portion that protrudes downward at a position different from the flat portion of the first component, thereby inserting it into the insertion hole of the substrate, is included. The mounting head further includes a head body portion to which the holding portion is mounted so as to be movable up and down, A component mounting method wherein the pressing portion is detachable from the head body.

19. A step of holding the flat portion of the first component with the holding portion of the mounting head, With the first component held in the holding portion of the mounting head, the mounting head is moved toward the mounting position. The step of pressing the first component held by the holding portion against the substrate, and using the pressing portion of the mounting head, pressing downward a protruding portion that protrudes downward at a position different from the flat portion of the first component, thereby inserting it into the insertion hole of the substrate, is included. A component mounting method wherein the mounting head further comprises a biasing member that biases the holding portion downward.

20. A step of holding the flat portion of the first component with the holding portion of the mounting head, The step includes using the pressing portion of the mounting head to press downward a protruding portion of the first component that protrudes downward at a position different from the flat portion of the first component, and inserting it into the insertion hole of the substrate, A component mounting method comprising enabling the pressing action of the pressing part when mounting the first component, and disabling the pressing action of the pressing part when mounting a second component different from the first component.

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