Quality control support methods, quality control support systems, and work systems

Abstract

To provide a quality control supporting method, a quality control supporting system, and a work system that facilitate effective utilization of inspection data from an inspection machine which inspects a substrate assembly based on its electrical characteristics.SOLUTION: A quality control supporting method for supporting quality control for a component mounting system 20, has first acquisition processing, second acquisition processing, and detection processing. The component mounting system 20 comprises a first inspection machine 101 and a second inspection machine 102. In the first acquisition processing, inspection data obtained by inspecting electrical characteristics of a substrate assembly is acquired by the first inspection machine 101, as first data. In the second acquisition processing, second data obtained by inspecting a state of a joint member printed on a substrate is acquired by the second inspection machine 102. In the detection processing, a sign of an abnormality is detected based on the first data and the second data.SELECTED DRAWING: Figure 1

Description

Technical Field

[0006] ,

[0001] The present disclosure generally relates to a quality management support method, a quality management support system, and a work system. More specifically, it relates to a quality management support method, a quality management support system, and a work system for supporting quality management related to a component mounting system.

Background Art

[0002] Patent Document 1 describes an inspection machine that inspects a substrate (printed circuit board) in a state where components (electronic components) are mounted, that is, a board assembly, by in-circuit test (ICT) and functional test (FT). This inspection machine measures electrical characteristics such as the resistance, voltage drop, or polarity of individual components and compares them with predicted values of those components to inspect the board assembly including the state of component mounting on the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The inspection machine described in Patent Document 1 inspects a board assembly, that is, a substrate in a state where components are mounted, so the inspection data is only used for evaluating the board assembly.

[0005] In view of the above reasons, the present disclosure is made, and an object thereof is to provide a quality management support method, a quality management support system, and a work system that facilitate effective utilization of inspection data of an inspection machine that inspects a board assembly based on electrical characteristics. <000002​​​​​A quality control support method according to one aspect of the present disclosure is a method for supporting quality control of a component mounting system that produces a substrate assembly by mounting components on a substrate using bonding members, and comprises a first acquisition process, a second acquisition process, and a detection process. The component mounting system includes a first inspection machine and a second inspection machine. In the first acquisition process, the first inspection machine inspects the electrical characteristics of the substrate assembly and acquires inspection data obtained as first data. In the second acquisition process, the second inspection machine inspects the state of the bonding members printed on the substrate and acquires second data. In the detection process, an indication of an abnormality is detected based on the first data and the second data. In the detection process, the resistance value indicated by the first data is within an acceptable range, and the amount of the bonding member indicated by the second data is within an acceptable range but has decreased, which is detected as a precursor. The component mounting system further comprises a third inspection machine. The quality control support method further includes a third acquisition process to acquire third data obtained by inspecting at least one of the state of the component and the state of the bonding member after the component has been mounted on the substrate using the third inspection machine. If the inspection result of the third inspection machine is abnormal and the inspection results of the first and second inspection machines are normal, the quality control support method sets a threshold for the second data. In the detection process, the precursor is detected based on the second data.

[0007] A quality control support system according to one aspect of the present disclosure is a quality control support system that supports quality control for a component mounting system that produces a substrate assembly by mounting components on a substrate using bonding members, and comprises a first acquisition unit, a second acquisition unit, and a detection unit. The first acquisition unit acquires inspection data obtained by inspecting the electrical characteristics of the substrate assembly using a first inspection machine provided in the component mounting system as first data. The second acquisition unit acquires second data obtained by inspecting the state of the bonding members printed on the substrate using a second inspection machine provided in the component mounting system. The detection unit detects signs of abnormality based on the first data and the second data. The detection unit detects as a precursor that the resistance value indicated by the first data is within an acceptable range, and the amount of the bonding member indicated by the second data is within an acceptable range but has decreased. The quality control support system further includes a third acquisition unit that acquires third data obtained by inspecting at least one of the state of the component and the state of the bonding member after the component has been mounted on the substrate by a third inspection machine provided in the component mounting system. The quality control support system sets a threshold for the second data if the inspection result of the third inspection machine is abnormal and the inspection results of the first and second inspection machines are normal. The detection unit detects the precursor based on the second data.

[0008] A work system according to one aspect of the present disclosure comprises the quality control support system and the component mounting system for mounting the components onto the substrate to produce the substrate assembly. [Effects of the Invention]

[0009] According to this disclosure, there is an advantage in that it is possible to provide a quality control support method, a quality control support system, and a work system that facilitate the effective utilization of inspection data from inspection machines that inspect substrate assemblies based on their electrical characteristics. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a schematic diagram showing an overview of a work system including a quality control support system according to Embodiment 1. [Figure 2] Figure 2 is a conceptual diagram showing the production process of circuit board assembly using the component mounting system of the same work system. [Figure 3] Figure 3 is a conceptual diagram showing the quality control process for a component mounting system using the quality control support method according to Embodiment 1. [Figure 4] Figure 4 is a conceptual diagram showing the inspection of a substrate assembly using a first inspection machine consisting of an in-circuit tester, relating to Embodiment 1. [Figure 5] Figure 5 is a flowchart showing an example of the quality control support method described above. [Figure 6] Figure 6 is a schematic diagram showing an overview of the work system, including the quality control support system according to Embodiment 2. [Figure 7] Figure 7 is a conceptual diagram showing the quality control process for a component mounting system using the quality control support method according to Embodiment 2. [Figure 8] Figure 8 is a flowchart showing an example of the quality control support method described above. [Modes for carrying out the invention]

[0011] (Embodiment 1) The quality control support method, data set generation method, program, quality control support system 10 (see Figure 1), and work system 100 (see Figure 1) according to this embodiment will be described below with reference to Figures 1 to 5.

[0012] (1) Overview The quality control support method according to this embodiment is a quality control support method that supports quality control related to a component mounting system 20. As shown in Figures 1 and 2, the component mounting system 20 produces a substrate assembly P10 by mounting components P2 on a substrate P1 using a bonding member P3.

[0013] In this embodiment, the component mounting system 20 includes one or more solder forming machines 1, one or more mounting machines 2, and one or more reflow ovens 3. These solder forming machines 1, mounting machines 2, and reflow ovens 3 are connected to each other and, together with inspection machines (first inspection machine 101 and second inspection machines 102, 103, 104) described later, constitute a single mounting line. In other words, the component mounting system 20 according to this embodiment is a mounting line configured by connecting multiple devices, including mounting machines 2, to each other. In such a component mounting system 20 (mounting line), as the substrate P1 passes through the solder forming machine 1, mounting machine 2, and reflow oven 3 in that order, components P2 are mounted on the substrate P1 to produce a substrate assembly P10.

[0014] The component mounting system 20 is used, for example, in facilities such as factories, research laboratories, offices, and educational institutions for the manufacturing of various products such as electronic equipment, automobiles, clothing, food products, pharmaceuticals, and handicrafts.

[0015] The substrate assemblies P10 produced by such a component mounting system 20 are inspected by a first inspection machine 101 located at the end of the component mounting system 20, as shown in Figure 1. The first inspection machine 101 is an inspection machine (inspection device) that performs inspection of the substrate assemblies P10 based at least on electrical characteristics and determines whether the conductivity state of the substrate assemblies P10 is normal or abnormal. If the first inspection machine 101 determines that the substrate assemblies P10 are normal (no abnormalities), it is confirmed that the substrate assemblies P10 produced by the component mounting system 20 (mounting line), including the soldering machine 1, mounting machine 2, and reflow oven 3, have been produced normally.

[0016] However, since the first inspection machine 101 that performs inspections based on such electrical characteristics inspects the substrate assembly P10, that is, the substrate P1 in a state where the component P2 is mounted, the inspection data is basically used for the evaluation of the substrate assembly P10. That is, the inspection data of the first inspection machine 101 is usually only used for determining normal / abnormal conditions such as conduction states in the substrate assembly P10, and it is difficult to say that the inspection data of the first inspection machine 101 is being fully and effectively utilized in this way.

[0017] Therefore, the quality management support method according to the present embodiment supports quality management for the component mounting system 20 by effectively utilizing the inspection data of the first inspection machine 101 through the functions shown below.

[0018] That is, the quality management support method according to the present embodiment is a method for supporting quality management for the component mounting system 20, and includes a first acquisition process, a second acquisition process, and an association process. The component mounting system 20 generates a substrate assembly P10 by mounting a component P2 on a substrate P1 with a joining member P3. In the first acquisition process, inspection data obtained from the first inspection machine 101 that inspects the substrate assembly P10 based at least on electrical characteristics is acquired as first data D1 (see FIG. 3). In the second acquisition process, second data D2, D3, D4 (see FIG. 3) is acquired. The second data D2, D3, D4 are data related to the substrate P1 and are different from the first data D1. In the association process, the first data D1 is associated with the second data D2, D3, D4.

[0019] According to the above embodiment, inspection data (first data D1) obtained from a first inspection machine 101 that inspects a substrate assembly P10 based at least on its electrical characteristics is associated with data other than the first data D1 (second data D2, D3, D4) relating to the substrate P1. Since the substrate assembly P10 is generated by mounting components P2 to the substrate P1 using a bonding member P3, the first data D1 and the second data D2, D3, D4 are associated, for example, with each substrate P1. As a result, when components P2 are mounted to a certain substrate P1, the first data D1, which is the inspection data obtained from the first inspection machine 101, can be associated with the second data D2, D3, D4, which are different from the first data D1 for this substrate P1, and handled accordingly. Consequently, for example, the first data D1, which is the inspection data of the first inspection machine 101, can be fed back to the component mounting system 20 and used to update various conditions or parameters, thereby making effective use of the inspection data of the first inspection machine 101. Therefore, there is an advantage in that it is easier to effectively utilize the inspection data from the inspection machine (first inspection machine 101) that inspects the substrate assembly P10 based on its electrical characteristics.

[0020] Furthermore, by utilizing the quality control support method according to this embodiment, a method for generating a dataset including the first data D1 and the second data D2, D3, and D4 can also be realized. In other words, in the quality control support method, the association process establishes a relationship between the first data D1 and the second data D2, D3, and D4, and this can be used to generate a dataset including the first data D1 and the second data D2, D3, and D4.

[0021] In short, the dataset generation method according to this embodiment is a dataset generation method used for managing a component mounting system 20, and comprises a first acquisition process, a second acquisition process, and a generation process. As described above, the component mounting system 20 generates a substrate assembly P10 by mounting components P2 on a substrate P1 using a bonding member P3. In the first acquisition process, inspection data obtained from a first inspection machine 101 that inspects the substrate assembly P10 based on at least its electrical characteristics is acquired as first data D1. In the second acquisition process, second data D2, D3, and D4 are acquired. The second data D2, D3, and D4 are data relating to the substrate P1 and are different from the first data D1. In the generation process, a dataset including the first data D1 and the second data D2, D3, and D4 is generated by associating the first data D1 with the second data D2, D3, and D4.

[0022] Thus, by using this dataset generation method, instead of the association process of the quality control support method, a generation process can be adopted to obtain a dataset containing the first data D1 and the second data D2, D3, and D4 as the output.

[0023] Furthermore, the quality control support method according to this embodiment is executed, for example, in a quality control support system 10. In other words, the quality control support system 10 is one embodiment for realizing the quality control support method described above. That is, the quality control support system 10 is a system that supports quality control related to the component mounting system 20, and as shown in Figure 1, comprises a first acquisition unit 11, a second acquisition unit 12, and an association unit 13. As described above, the component mounting system 20 produces a substrate assembly P10 by mounting components P2 on a substrate P1 using a bonding member P3. The first acquisition unit 11 acquires inspection data obtained from a first inspection machine 101 that inspects the substrate assembly P10 based at least on its electrical characteristics as first data D1. The second acquisition unit 12 acquires second data D2, D3, and D4. The second data D2, D3, and D4 are data related to the substrate P1 and are different from the first data D1. The association unit 13 associates the first data D1 with the second data D2, D3, and D4.

[0024] Here, the quality control support system 10 primarily consists of a computer system having one or more processors and one or more memories. In other words, the quality control support method according to this embodiment is used on a computer system (quality control support system 10). That is, the quality control support method can also be implemented as a program. Similarly, the data set generation method can also be implemented as a program. Therefore, the program according to this embodiment is a program that causes one or more processors to execute the quality control support method or the data set generation method according to this embodiment.

[0025] Furthermore, the work system 100 according to this embodiment includes a quality control support system 10 and a component mounting system 20. The component mounting system 20 mounts components P2 onto a substrate P1 to produce a substrate assembly P10.

[0026] (2) Details The following describes the details of the quality control support method, the data set generation method, the program, the quality control support system 10, and the work system 100 according to this embodiment.

[0027] (2.1) Premise In this embodiment, we will describe a case in which the component mounting system 20 is used in the manufacture of electronic equipment in a factory. Typical electronic equipment has various circuit blocks, such as power supply circuits and control circuits. In the manufacture of these circuit blocks, as an example, the following steps are performed in this order: solder application, mounting, and soldering. In the solder application step, paste-type solder is applied (or printed) onto the substrate P1 (including a printed wiring board). In the mounting step, components P2 (including electronic components) are mounted (placed) on the substrate P1. In the soldering step, for example, the substrate P1 with the mounted components P2 is heated in a reflow oven 3 to melt the paste-type solder and perform soldering.

[0028] The component mounting system 20 performs the task of mounting multiple components P2 onto the substrate P1 during the mounting process. As a result, the component mounting system 20 generates a substrate assembly P10 consisting of the substrate P1 on which the multiple components P2 are mounted. In other words, the substrate assembly P10 includes the substrate P1 and the multiple components P2 mounted on the substrate P1.

[0029] In this disclosure, a “substrate assembly” is produced by mounting components P2 onto a substrate P1, and more specifically, is an intermediate product (semi-finished product) or final product in which components P2 are mounted onto the substrate P1 by a bonding member P3. In other words, a substrate assembly P10 produced by a component mounting system 20 is a substrate P1 with components P2 mounted by a bonding member P3, or in other words, an intermediate product or final product including a substrate P1, components P2, and a bonding member P3.

[0030] In this disclosure, "substrate" refers to a component on which component P2 is mounted, and is a printed circuit board having an electrically insulating substrate body and conductive wiring formed on or inside the substrate body. Substrate P1 includes not only printed circuit boards formed in the shape of a plate, but also substrates that are molded in a three-dimensional shape, such as a three-dimensional molded substrate. In this embodiment, as an example, substrate P1 is a printed circuit board that is plate-shaped and has wiring formed on its surface.

[0031] In this disclosure, "components" refers to members that are mounted on a substrate P1, and includes electronic components, etc. In this embodiment, as an example, a case in which the component mounting system 20 is used to mount a component P2 using surface mount technology (SMT) will be described. That is, component P2 is a surface mount device (SMD) and is mounted by being placed on the surface (mounting surface) of the substrate P1. However, the component mounting system 20 may also be used to mount component P2 using insertion mount technology (IMT), not limited to this example. In this case, component P2 is an insertion mount component having lead terminals and is mounted on the surface (mounting surface) of the substrate P1 by inserting the lead terminals into holes in the substrate P1.

[0032] In this disclosure, "joining member" refers to a member for mounting a component P2 to a substrate P1, and includes, for example, solder and conductive paste such as silver paste. Here, "mounting" means mechanical and electrical connection to the substrate P1. More specifically, the joining member P3 mechanically and electrically connects the terminals of the component P2 to the wiring formed on the substrate P1. In this embodiment, as an example, the joining member P3 is a paste-type solder, and soldering is performed by heating it in a reflow oven 3.

[0033] In this disclosure, "association" means creating a connection (association) between multiple things, and includes linking multiple data to each other, that is, matching them. In other words, by associating first data D1 with second data D2, D3, D4 in the association process, first data D1 and second data D2, D3, D4 are linked to each other, and a connection is created between first data D1 and second data D2, D3, D4. As a result, for example, it becomes possible to identify second data D2, D3, D4 that are associated with first data D1 based on first data D1. Conversely, it also becomes possible to identify first data D1 that are associated with second data D2, D3, D4 based on second data D2, D3, D4.

[0034] Various methods can be employed to establish a relationship between the first data D1 and the second data D2, D3, and D4. Specifically, the following are some examples of methods for establishing a relationship between two entities: The first method directly links the two entities by defining a linked relationship between the two entities with a common key, using a part of the two entities' data as a key. The second method links the two entities by placing them in the same group. The third method indirectly links the two entities by using a third entity's data, separate from the two entities' data, as a key, and linking the two entities to that key. The fourth method directly links the two entities by linking them together. In this embodiment, as an example, the first method is used to indirectly link the first data D1 and the second data D2, D3, and D4.

[0035] (2.2) Configuration of the component mounting system Next, the configuration of the component mounting system 20 in which the quality control support method according to this embodiment is used will be described with reference to Figures 1 and 2.

[0036] As described above, the component mounting system 20 according to this embodiment includes a plurality of devices that constitute a mounting line. Here, the component mounting system 20 includes one or more (one in the example of Figure 1) solder forming machines 1, one or more (three in the example of Figure 1) mounting machines 2, and one or more (one in the example of Figure 1) reflow ovens 3. These solder forming machines 1, three mounting machines 2, and reflow ovens 3 are connected to each other and, together with inspection machines (first inspection machine 101 and second inspection machines 102, 103, 104), constitute a single mounting line. That is, in this embodiment, as an example, the component mounting system 20 includes a first inspection machine 101 and three second inspection machines 102, 103, 104 in addition to the solder forming machine 1, three mounting machines 2, and reflow oven 3.

[0037] The multiple devices included in the component mounting system 20 (solder forming machine 1, three mounting machines 2, reflow oven 3, first inspection machine 101, and three second inspection machines 102, 103, and 104) are arranged in a line and connected to form a mounting line. Specifically, the solder forming machine 1, second inspection machine 102, three mounting machines 2, second inspection machine 103, reflow oven 3, second inspection machine 104, and first inspection machine 101 are arranged in this order from the upstream side of the mounting line. In other words, in the mounting line, the left end of Figure 1 (solder forming machine 1) is upstream, and the right end of Figure 1 (first inspection machine 101) is downstream.

[0038] Therefore, in the component mounting system 20 according to this embodiment, the solder forming machine 1 is at the front, followed by the second inspection machine 102, three mounting machines 2, the second inspection machine 103, the reflow oven 3, the second inspection machine 104, and finally the first inspection machine 101, as the substrate P1 moves between multiple devices in that order. In other words, the substrate P1 moves from the left end to the right end of Figure 1, passing through the multiple devices in sequence. While the substrate P1 passes through the multiple devices, the component mounting system 20 mounts one or more (multiple in this embodiment) components P2 onto the substrate P1. Thus, the component mounting system 20 introduces the substrate P1 from the solder forming machine 1 side, mounts multiple components P2 (electronic components) onto the substrate P1, and then discharges the substrate assembly P10 from the first inspection machine 101 side.

[0039] The solder forming machine 1 is a device that places (forms) a bonding member P3 on the surface of a substrate P1. In this embodiment, as an example, since the bonding member P3 is a paste-type solder, the solder forming machine 1 is a solder printing machine (paste solder printing machine) such as a screen printing machine. For this reason, in drawings such as Figure 1, the solder forming machine 1 is labeled "Printer". In the solder application process, the solder forming machine 1 places the bonding member P3 on the substrate P1 by printing (applying) the bonding member P3 of the desired shape (pattern) onto the surface of the substrate P1 using a mask such as a metal mask. The mask has holes formed in it according to the positions of the pads formed on the surface of the substrate P1, and the bonding member P3 is attached to the surface of the substrate P1 by a squeegee through these holes.

[0040] As shown in Figure 2, a substrate P1 in its raw state is introduced into the solder forming machine 1. In other words, a substrate P1 without components P2 and bonding members P3 is introduced into the solder forming machine 1, and a substrate P1 with the bonding members P3 arranged (formed) is discharged from the solder forming machine 1.

[0041] The mounting machine 2 is a device that mounts components P2 onto a substrate P1 during the mounting process. The component mounting system 20 includes multiple mounting machines 2 (three in this embodiment). These multiple mounting machines 2 have a common configuration with respect to each other in this embodiment.

[0042] The component mounting system 20 may mount multiple identical or different components P2 onto a substrate P1 using a single mounting machine 2, or it may mount multiple identical or different components P2 onto a substrate P1 using multiple mounting machines 2 (three in this embodiment). For example, multiple mounting machines 2 sequentially mount components P2 onto a single substrate P1, ultimately producing a substrate assembly P10 with multiple components P2 mounted on it. In this embodiment, as an example, to accommodate the mounting of components P2 using surface mount technology (SMT), the mounting machine 2 consists of a chip mounter (surface mount machine) that mounts components P2, which are electronic components, onto the surface of a substrate P1 with a bonding member P3 formed on it. Therefore, in drawings such as Figure 1, the mounting machine 2 is labeled "Mounter".

[0043] As shown in Figure 2, the mounting machine 2 receives the substrate P1 in which the bonding member P3 has been formed by the soldering machine 1. In other words, the mounting machine 2 receives the substrate P1 with the bonding member P3 attached, and the mounting machine 2 discharges the substrate P1 with the components P2 placed (mounted). In the substrate P1 discharged from the mounting machine 2, the bonding of components P2 by the bonding member P3 is not yet complete.

[0044] More specifically, the mounting machine 2 has a capture unit for capturing component P2. The capture unit consists of, for example, a suction nozzle and captures (holds) the component in a state where it can be released (i.e., released). The mounting machine 2 captures the component P2 supplied to the supply unit with the capture unit, moves the capture unit with the component P2 captured, and releases the component P2 on the substrate P1, thereby mounting the component P2 on the mounting surface of the substrate P1. The "supply unit" here refers to the part (location) of the component mounting system 20 that supplies the component P2 used in the component mounting system 20. The component mounting system 20 has multiple supply units, and the mounting work is performed using the component P2 supplied to each supply unit. For example, the supply unit is configured to be able to be fitted with a tape feeder for supplying component P2. The tape feeder is fitted with a reel of carrier tape containing multiple components P2, thereby enabling the supply of these multiple components P2 from the supply unit to the component mounting system 20.

[0045] The reflow oven 3 is a device that joins components P2 to a substrate P1 using a bonding member P3. In this embodiment, for example, the bonding member P3 is a paste-type solder, so in the soldering process, the reflow oven 3 heats the substrate P1 with the components P2 mounted on it, melting the bonding member P3 and performing soldering. In other words, the reflow oven 3 is a device that joins components P2 to the substrate P1 using the bonding member P3 by heating and melting the bonding member P3 placed on the surface of the substrate P1, and for example, it is a far-infrared air reflow oven. For this reason, in drawings such as Figure 1, the reflow oven 3 is labeled "Reflow".

[0046] As shown in Figure 2, a substrate P1 is introduced into the reflow oven 3 in which a bonding member P3 has been formed by the soldering machine 1 and components P2 have been placed (mounted) by the mounting machine 2. In other words, a substrate P1 with components P2 and bonding member P3 attached is introduced into the reflow oven 3, and a substrate P1 with components P2 bonded by the bonding member P3, i.e., a substrate assembly P10, is discharged from the reflow oven 3.

[0047] The first inspection machine 101 is an inspection machine that performs inspections of the substrate assembly P10 based on at least its electrical characteristics, and is, for example, an in-circuit tester (ICT) or a function tester (FCT). An in-circuit tester is an inspection machine that tests the electrical characteristics of each part of the substrate assembly P10 (substrate P1, component P2, or bonding member P3) while a small current that does not cause the substrate assembly P10 to operate as intended is passed through the substrate assembly P10. A function tester is an inspection machine that tests the electrical characteristics of each part of the substrate assembly P10 (substrate P1, component P2, or bonding member P3) while an operating current that causes the substrate assembly P10 to operate is passed through the substrate assembly P10.

[0048] In other words, unlike optical visual inspection devices that inspect the substrate assembly P10 from images captured by a camera or the like, the first inspection machine 101 is a device that inspects the substrate assembly P10 by measuring its electrical characteristics. This type of first inspection machine 101 inspects items such as the state of each of the substrate P1, component P2 and bonding member P3 (including conductivity status, etc.), the mounting state of component P2, or the conductivity status of at least a part of the substrate assembly P10. In other words, the first inspection machine 101 can detect abnormalities such as a short circuit where adjacent pins of component P2 are short-circuited via the bonding member P3, or an open circuit where the pins of component P2 and the substrate P1 (pads) are not conductive. This type of first inspection machine 101 makes it easier to detect defects that are difficult to find with visual inspection devices or visual inspection.

[0049] In this embodiment, as an example, the first inspection device 101 is an in-circuit tester (ICT). Therefore, in drawings such as Figure 1, the first inspection device 101 is labeled "ICT". In the case of the first inspection device 101 consisting of an in-circuit tester, for example, even if there is a short-circuit mode abnormality, the inspection current is minute, which has the advantage that the component P2 included in the circuit board assembly P10 is less likely to be damaged.

[0050] The second inspection machine 102 is positioned between the solder forming machine 1 and the mounting machine 2, that is, downstream of the solder forming machine 1 and upstream of the mounting machine 2. Therefore, the substrate P1 discharged from the solder forming machine 1 is sent to the mounting machine 2 via the second inspection machine 102. The second inspection machine 102 is an inspection machine that inspects the state of the bonding member P3 placed on the substrate P1 before the components P2 are mounted on the substrate P1. In other words, the second inspection machine 102 inspects the substrate P1 after the bonding member P3 has been formed and before the components P2 have been mounted, and inspects, for example, the amount of bonding member P3 attached (amount of solder), or whether the bonding member P3 is properly attached. In this embodiment, as an example, the second inspection machine 102 is a solder paste inspection device (SPI) that inspects the state of the bonding member P3 formed on the substrate P1 using two-dimensional or three-dimensional images. Therefore, in drawings such as Figure 1, the second inspection machine 102 is labeled "SPI".

[0051] The second inspection machine 103 is positioned between the mounting machine 2 and the reflow oven 3, that is, downstream of the mounting machine 2 and upstream of the reflow oven 3. Therefore, the substrate P1 discharged from the mounting machine 2 is sent to the reflow oven 3 via the second inspection machine 103. The second inspection machine 103 is an inspection machine that inspects the state of at least one of the bonding member P3 and the component P2 that are placed on the substrate P1 after the component P2 has been mounted on the substrate P1. In other words, the second inspection machine 103 inspects the substrate P1 after the component P2 has been mounted and the bonding of the component P2 by the bonding member P3 is incomplete, for example, to check whether the position of the component P2 on the substrate P1 is correct (whether the deviation is within an acceptable range). In this embodiment, as an example, the second inspection machine 103 is a substrate inspection device that inspects the substrate P1 (including the bonding member P3) in a state where the component P2 has been mounted and the bonding of the component P2 by the bonding member P3 is incomplete, using two-dimensional or three-dimensional images. The term "substrate inspection equipment" as used herein includes automated optical inspection equipment (AOI), also known as substrate visual inspection equipment, and automated X-ray inspection equipment (AXI), etc. In this embodiment, as an example, the second inspection machine 103 is an automated optical inspection equipment (AOI). Therefore, in drawings such as Figure 1, the second inspection machine 103 is labeled "AOI".

[0052] The second inspection machine 104 is positioned between the reflow oven 3 and the first inspection machine 101, that is, downstream of the reflow oven 3 and upstream of the first inspection machine 101. Therefore, the substrate P1 discharged from the reflow oven 3 is sent to the first inspection machine 101 via the second inspection machine 104. The second inspection machine 104 is an inspection machine that checks the state of at least one of the bonding member P3 and the component P2 that are placed on the substrate P1 after the component P2 has been mounted on the substrate P1. In other words, the second inspection machine 104 checks the substrate P1 after the component P2 has been mounted and the bonding of the component P2 by the bonding member P3 has been completed, for example, whether the position of the component P2 on the substrate P1 is correct or whether the bonding member P3 is properly attached. In this embodiment, as an example, the second inspection machine 104 is a substrate inspection device that inspects the state of a substrate P1 (including the bonding member P3) in which a component P2 is mounted and the bonding of the component P2 by the bonding member P3 is completed, using two-dimensional or three-dimensional images. In this embodiment, as an example, the second inspection machine 104 is an automated optical inspection device (AOI). Therefore, in drawings such as Figure 1, the second inspection machine 104 is labeled "AOI".

[0053] In this embodiment, the three second inspection machines 102, 103, and 104 are all separate inspection machines from the first inspection machine 101 included in the component mounting system 20. In particular, in this embodiment, the three second inspection machines 102, 103, and 104 are all located upstream of the first inspection machine 101 on the mounting line. In other words, the substrate P1 that has been inspected by the three second inspection machines 102, 103, and 104 is sent to the first inspection machine 101. Furthermore, unlike the first inspection machine 101, which performs inspection based on electrical characteristics, the three second inspection machines 102, 103, and 104 are all optical inspection machines that inspect the substrate P1 (including components P2 and bonding members P3) from images captured by a camera or the like. In other words, the component mounting system 20, which includes the first inspection machine 101 and the (three) second inspection machines 102, 103, and 104, can perform both electrical characteristic-based inspection and optical inspection on the substrate assembly P10.

[0054] In this embodiment, the first inspection machine 101 and the (three) second inspection machines 102, 103, and 104, together with the soldering machine 1, the mounting machine 2, and the reflow oven 3, constitute a mounting line. In other words, the first inspection machine 101 and the (three) second inspection machines 102, 103, and 104 are included as components of the component mounting system 20. In particular, since the first inspection machine 101, which consists of an in-circuit tester, is located at the end of the mounting line, the substrate assembly P10 that is ultimately discharged from the mounting line is a substrate assembly P10 that has undergone inspection by the first inspection machine 101. In other words, in the mounting line constructed by the component mounting system 20 in this embodiment, in addition to the production of substrate assemblies P10, inspection based on the electrical characteristics of the produced substrate assemblies P10 is carried out consistently.

[0055] Therefore, the component mounting system 20 can ultimately produce a circuit board assembly P10 with multiple components P2 mounted by mounting multiple components P2 with multiple devices sharing the work. Moreover, since the circuit board P1 (or the circuit board assembly P10 including the circuit board P1) is inspected by the first inspection machine 101 and multiple (in this case, three) second inspection machines 102, 103, and 104, the component mounting system 20 can achieve the production of the circuit board assembly P10 including inspection.

[0056] Furthermore, each of the components included in the component mounting system 20—the solder forming machine 1, the mounting machine 2, the reflow oven 3, the first inspection machine 101, and the second inspection machines 102, 103, and 104—has a user interface, a transport device, a control device, and a communication device, etc.

[0057] The user interface includes, for example, a touch panel display, and accepts user input and presents (displays, etc.) information to the user. The user interface is not limited to a touch panel display; it may also have input devices such as a keyboard, pointing device, mechanical switch, or gesture sensor. The user interface may also have an audio input / output unit instead of, or together with, the touch panel display. The transport device is a device for transporting the substrate P1 and is implemented by a belt conveyor or the like.

[0058] A control device is a device that controls the operation of each part. A control device primarily consists of a microcontroller having one or more processors and one or more memories. That is, the functions of the control device are realized when the microcontroller's processor executes a program stored in the microcontroller's memory. The program may be pre-stored in memory, provided via telecommunication lines such as the internet, or provided on a non-temporary recording medium such as a memory card.

[0059] The communication device is configured to communicate with a higher-level system (including the quality control support system 10) directly or indirectly via a network or relay. This allows each of the soldering machine 1, mounting machine 2, reflow oven 3, first inspection machine 101, and second inspection machines 102, 103, and 104 to exchange data with the quality control support system 10.

[0060] (2.3) Configuration of the Quality Control Support System Next, the configuration of the quality control support system 10 according to this embodiment will be described with reference to Figure 1.

[0061] As described above, the quality control support system 10 is a system that supports quality control related to the component mounting system 20. In this embodiment, as described above, the solder forming machine 1, three mounting machines 2, reflow oven 3, first inspection machine 101, and three second inspection machines 102, 103, and 104 included in the component mounting system 20 are arranged in a line and connected to each other to form a mounting line. Therefore, the quality control support system 10 is connected to the solder forming machine 1, three mounting machines 2, reflow oven 3, first inspection machine 101, and three second inspection machines 102, 103, and 104 in a communication manner to support quality control of these devices.

[0062] As shown in Figure 1, the quality control support system 10 includes a first acquisition unit 11, a second acquisition unit 12, an association unit 13, an output unit 14, a notification unit 15, an additional acquisition unit 16, an estimation unit 17, a communication unit 18, and a data storage unit 19. In this embodiment, the quality control support system 10 mainly consists of a computer system having one or more processors and one or more memories, as described above. Of the quality control support system 10, at least the functions of the first acquisition unit 11, the second acquisition unit 12, the association unit 13, the output unit 14, the notification unit 15, the additional acquisition unit 16, and the estimation unit 17 are realized by one or more processors executing programs.

[0063] As described above, the first acquisition unit 11 executes a first acquisition process to acquire the first data D1. The first data D1 is inspection data obtained from the first inspection machine 101. The first inspection machine 101 is an inspection machine that inspects the substrate assembly P10 based at least on its electrical characteristics, and in this embodiment, as an example, is an in-circuit tester (ICT).

[0064] The second acquisition unit 12 executes a second acquisition process to acquire second data D2, D3, and D4. The second data D2, D3, and D4 are data relating to the substrate P1 and are different from the first data D1. In this embodiment, as an example, the second data D2, D3, and D4 are inspection data acquired from each of the three second inspection machines 102, 103, and 104 (see Figure 3). In other words, the second acquisition process acquires second data D2, D3, and D4, which include inspection data obtained by the second inspection machines 102, 103, and 104, which are different from the first inspection machine 101 included in the component mounting system 20.

[0065] In other words, in this embodiment, the second acquisition unit 12 is configured to acquire three types of second data D2, D3, and D4. Second data D2 is inspection data from the second inspection machine 102, which consists of a solder printing inspection device (SPI), and is acquired from the second inspection machine 102. Second data D3 is inspection data from the second inspection machine 103, which consists of an automatic optical inspection device (AOI) located upstream of the reflow oven 3, and is acquired from the second inspection machine 103. Second data D4 is inspection data from the second inspection machine 104, which consists of an automatic optical inspection device (AOI) located downstream of the reflow oven 3, and is acquired from the second inspection machine 104.

[0066] The association unit 13 performs an association process to associate the first data D1 with the second data D2, D3, and D4. In this embodiment, as an example, the association unit 13 directly associates the two targets (first data D1 and second data D2, D3, and D4) by defining a linked relationship between the two targets that share a common key, using some of the data of the two targets as a key. Here, the key data is, as an example, the unique identification information (hereinafter referred to as "board ID") attached to each individual substrate P1.

[0067] The output unit 14 performs output processing to output the result of the association processing. In other words, the quality control support method according to this embodiment has output processing to output the result of the association processing. The "result of the association processing" referred to here is the result of the association between the first data D1 and the second data D2, D3, D4 performed by the association unit 13, or in other words, a dataset containing the first data D1 and the second data D2, D3, D4 in an associated state. The forms of output from the output unit 14 include, for example, output to the notification unit 15, transmission to the component mounting system 20 or other systems, display, audio output, recording (writing) to a non-temporary recording medium (including the data storage unit 19), and printing (printout).

[0068] In this embodiment, as an example, the output unit 14 directly or indirectly outputs the result of the association processing to the notification unit 15 and the data storage unit 19. Furthermore, in this embodiment, as an example, the output unit 14 directly or indirectly transmits the result of the association processing to the component mounting system 20. Since each device included in the component mounting system 20 has a user interface as described above, the result of the association processing transmitted from the output unit 14 can be presented to a person such as a worker through the user interface of the component mounting system 20. In addition, for example, the output unit 14 can output the result of the association processing to a person such as a worker through display or audio output.

[0069] The notification unit 15 executes a notification process. The notification process is performed when the inspection result of the first inspection machine 101 is abnormal and the inspection results of the second inspection machines 102, 103, and 104 are normal. In other words, the quality control support method according to this embodiment has a notification process that performs a notification when the inspection result of the first inspection machine 101 is abnormal and the inspection results of the second inspection machines 102, 103, and 104 are normal. In this embodiment, as an example, the condition for the notification unit 15 to give a notification is that the inspection results of all of the multiple (3) second inspection machines 102, 103, and 104 are normal. The determination of whether or not the condition for giving a notification is met is performed, as an example, by the output unit 14 or the notification unit 15. The forms of notification by the notification unit 15 include, for example, direct notifications such as display, audio output, and printing (printout), as well as indirect notifications by transmission to the component mounting system 20 or other systems (including mobile terminals, etc.).

[0070] Furthermore, in this embodiment, when the notification unit 15 issues a notification, it notifies at least recommended information. The recommended information is information regarding changes to the inspection conditions in the second inspection machines 102, 103, and 104. In other words, the notification process notifies recommended information regarding changes to the inspection conditions in the second inspection machines 102, 103, and 104.

[0071] The additional information acquisition unit 16 executes an additional information acquisition process. The additional information acquisition process is a process for acquiring additional information when the inspection result of the first inspection machine 101 is abnormal and the inspection results of the second inspection machines 102, 103, and 104 are also abnormal. The additional information is information related to the user's judgment regarding the inspection results of the second inspection machines 102, 103, and 104. In other words, the quality control support method has an additional information acquisition process that acquires additional information related to the user's judgment regarding the inspection results of the second inspection machines 102, 103, and 104 when the inspection result of the first inspection machine 101 is abnormal and the inspection results of the second inspection machines 102, 103, and 104 are also abnormal. In this embodiment, as an example, the condition for the additional information acquisition unit 16 to acquire additional information is that the inspection result of at least one of the multiple (3) second inspection machines 102, 103, and 104 is abnormal.

[0072] The estimation unit 17 performs an estimation process to estimate the cause of an abnormality when the inspection result of the first inspection machine 101 is abnormal. The cause of the abnormality here includes location information relating to a specific location on the substrate assembly P10. In other words, if there is an abnormality in a component P2 or a bonding member P3 at a specific location on the substrate assembly P10, these components P2 or bonding members P3 can be identified by the location information. In this embodiment, the estimation unit 17 estimates the cause of the abnormality (including location information) from the inspection data of the first inspection machine 101 using a node list based on the arrangement of components P2 on the substrate assembly P10. The "node list" here is a list of components P2 included between two test nodes used for inspection by the first inspection machine 101, which consists of an in-circuit tester (ICT), etc. As an example, the estimation unit 17 estimates the cause of the abnormality using a trained model generated by machine learning.

[0073] The communication unit 18 is configured to communicate directly or indirectly via a network or relay, etc., with the component mounting system 20 and / or the higher-level system. This allows the quality control support system 10 to exchange data with the component mounting system 20 and / or the higher-level system. More precisely, the communication unit 18 communicates with each of the devices included in the component mounting system 20 (soldering machine 1, three mounting machines 2, reflow oven 3, first inspection machine 101, and three second inspection machines 102, 103, 104).

[0074] The data storage unit 19 stores various data, including the results of association processing and data collected from individual devices included in the component mounting system 20 (first data D1 and second data D2, D3, D4, etc.). The data storage unit 19 also stores information necessary for calculations in the first acquisition unit 11, second acquisition unit 12, association unit 13, output unit 14, notification unit 15, additional acquisition unit 16, and estimation unit 17, etc. The data storage unit 19 includes a rewritable non-volatile memory such as EEPROM (Electrically Erasable Programmable Read-Only Memory).

[0075] The operation of each part of the quality control support system 10 will be explained in detail in the section "(3) Quality control support method".

[0076] Furthermore, the quality control support system 10 may also include a processing unit and a user interface in addition to the above configuration. However, the processing unit and user interface are not essential components of the quality control support system 10. In Figure 1, the configuration of the quality control support system 10 is shown with the exception of the first acquisition unit 11, second acquisition unit 12, association unit 13, output unit 14, notification unit 15, additional acquisition unit 16, estimation unit 17, communication unit 18, and data storage unit 19, with the other components omitted as appropriate.

[0077] The processing unit controls the equipment included in the component mounting system 20, thereby comprehensively managing the mounting line (component mounting system 20). In other words, the quality control support system 10 also functions as an integrated management system for the mounting line.

[0078] The user interface includes, for example, a touch panel display, and accepts user input and presents (displays, etc.) information to the user. The user interface is not limited to a touch panel display; it may also have input devices such as a keyboard, pointing device, mechanical switch, or gesture sensor. Furthermore, the user interface may have an audio input / output unit instead of, or in conjunction with, a touch panel display.

[0079] Incidentally, as described above, the quality control support system 10 according to this embodiment constitutes the work system 100 together with the component mounting system 20. That is, as shown in Figure 1, the work system 100 according to this embodiment includes the quality control support system 10 and the component mounting system 20. The component mounting system 20 is a system that mounts components P2 onto a substrate P1 to produce a substrate assembly P10.

[0080] (3) Quality control support method The quality control support method according to this embodiment will be described in more detail below. In this embodiment, the quality control support method is executed by the quality control support system 10, as described above. Therefore, the quality control support method according to this embodiment will be described below as an operation of the quality control support system 10.

[0081] (3.1) Basic form First, the basic aspects of the quality control support method according to this embodiment will be described with reference to Figure 3. Figure 3 is a conceptual diagram showing the quality control of the component mounting system 20 using the quality control support method.

[0082] As in this embodiment, with a component mounting system 20 including a first inspection machine 101 and a plurality of (in this case, three) second inspection machines 102, 103, and 104, inspection data will be obtained from each inspection machine as illustrated in Figure 3.

[0083] In other words, the first inspection machine 101, which consists of an in-circuit tester (ICT), outputs the results of the inspection of the substrate assembly P10 as inspection data by measuring the electrical characteristics of the substrate assembly P10 discharged from the reflow oven 3, as shown in Figure 3. Therefore, the first data D1, which is the inspection data of the first inspection machine 101, includes data representing, for example, a short-circuit mode abnormality in which adjacent pins of component P2 are short-circuited via the bonding member P3, and an open-circuit mode abnormality in which the pins of component P2 and the substrate P1 are not conductive. In the example in Figure 3, the first data D1 includes two files D11 and D12. File D11 is data representing an open-circuit mode abnormality of pin 7 or pin 8 of component P2, named "IC-2", and file D12 is data representing a short-circuit mode abnormality between pins 5 and 6 of component P2, named "IC-1".

[0084] Thus, in the first acquisition process of the quality control support method according to this embodiment, inspection data from the first inspection machine 101 is acquired as first data D1, which includes not only whether or not there is an abnormality, but also, if there is an abnormality, information regarding the location (specific location) of the abnormality in the substrate assembly P10. In other words, the first acquisition process acquires first data D1 which includes location information regarding a specific location in the substrate assembly P10. To put it another way, first data D1 includes location information regarding a specific location in the substrate assembly P10.

[0085] However, the first inspection machine 101, which performs inspections based on the electrical characteristics of the substrate assembly P10, does not output inspection data in a manner that would allow for the identification of the cause of the abnormality, such as location information regarding the location of the abnormality, if the inspection results of the first inspection machine 101 are abnormal. The quality control support method according to this embodiment has an estimation process that estimates the cause (location information) of the abnormality in the inspection results of the first inspection machine 101, which is precisely why it is possible to identify the cause of such abnormalities. In other words, as illustrated in Figure 3, files D11 and D12, which represent a manner in which the cause of the abnormality can be identified, do not actually directly represent the inspection data from the first inspection machine 101, but rather represent results that are identified (estimated) through the estimation process.

[0086] In short, in the first acquisition process of the quality control support method according to this embodiment, the inspection data output from the first inspection machine 101 is not directly acquired, but rather the inspection data is acquired as first data D1 via an estimation process. This makes it possible to acquire first data D1, which includes position information for specific locations on the substrate assembly P10, as described above. In the estimation process, as described above, the position information is estimated using a node list based on the arrangement of components P2 on the substrate assembly P10. In other words, in the first acquisition process, position information is acquired using a node list based on the arrangement of components P2 on the substrate assembly P10. The estimation process will be explained in detail in the section "(3.2) Estimation Process".

[0087] The second inspection machine 102, which consists of a solder printing inspection device (SPI), captures an image of the substrate P1 discharged from the solder forming machine 1, as shown in Figure 3, and outputs the results of the inspection of the state of the bonding members P3 placed on the substrate P1 as inspection data. Therefore, the second data D2, which is the inspection data of the second inspection machine 102, includes data that represents, for example, the amount of bonding members P3 attached (amount of solder), or whether the bonding members P3 are properly attached. In the example in Figure 3, the second data D2 includes image data D21 to D28 obtained by capturing images with a camera for each of the multiple (eight in this case) inspection areas set on the substrate P1. Image data D21 to D28 are image data that include bonding members P3 placed (formed) at multiple locations on the substrate P1.

[0088] As shown in Figure 3, the second inspection machine 103, which consists of an automated optical inspection (AOI) system, captures an image of the substrate P1 discharged from the mounting machine 2 and outputs the results of the inspection of the state of at least one of the bonding member P3 and component P2 placed on the substrate P1 as inspection data. Therefore, the second data D3, which is the inspection data of the second inspection machine 103, includes data that indicates, for example, whether the position of component P2 on the substrate P1 is correct or not (whether the deviation is within an acceptable range or not). In the example in Figure 3, the second data D3 includes image data D31 to D38 obtained by capturing images with a camera for each of the multiple (in this case, eight) inspection areas set on the substrate P1. Image data D31 to D38 are image data that include parts of component P2 and bonding member P3 placed (formed) at multiple locations on the substrate P1, respectively.

[0089] As shown in Figure 3, the second inspection machine 104, which consists of an automated optical inspection (AOI) system, captures an image of the substrate P1 discharged from the reflow oven 3 and outputs the results of the inspection of the state of at least one of the bonding member P3 and component P2 placed on the substrate P1 as inspection data. Therefore, the second data D4, which is the inspection data of the second inspection machine 104, includes data indicating, for example, whether the position of component P2 on the substrate P1 is correct or not, or whether the bonding member P3 is properly attached. In the example in Figure 3, the second data D4 includes image data D41 to D48 obtained by capturing images with a camera for each of the multiple (in this case, eight) inspection areas set on the substrate P1. Image data D41 to D48 are image data that include parts of component P2 and bonding member P3 placed (formed) at multiple locations on the substrate P1, respectively.

[0090] In the quality control support method according to this embodiment, the first acquisition process acquires inspection data obtained from the first inspection machine 101 as first data D1, and the second acquisition process acquires inspection data obtained from the second inspection machines 102, 103, and 104 as second data D2, D3, and D4. The quality control support method then associates these first data D1 with the second data D2, D3, and D4 through an association process.

[0091] In this embodiment, as an example, in the association process, a part of the information (data) of two targets (first data D1 and second data D2, D3, D4) is used as a key, and the two targets that share a common key are defined as linked, thereby directly associating the two targets. The key data is the unique identification information (board ID) assigned to each board P1. In short, both the first data D1 and the second data D2, D3, D4 contain the key board ID. Since the board ID is unique identification information for board P1, the same board ID is used for the same board P1 in both the first inspection machine 101 and the three second inspection machines 102, 103, and 104. Therefore, the first data D1 and the second data D2, D3, D4 obtained for the same board P1 in both the first inspection machine 101 and the three second inspection machines 102, 103, and 104 will all contain the same board ID.

[0092] Therefore, in the association process, the board ID is used as the key to associate the first data D1 with the second data D2, D3, and D4 that contain the same board ID. As a result, the first data D1 and the second data D2, D3, and D4 related to the same board P1 are associated. In other words, the first data D1 and the second data D2, D3, and D4 are associated for each board P1 (for each board ID). Then, the dataset containing the first data D1 and the second data D2, D3, and D4 in their associated state, as a result of the association process, is stored in the data storage unit 19 during the output process.

[0093] Furthermore, in this embodiment, as described above, the second data D2, D3, and D4 include image data. In the association process, the position information in the first data D1 is associated with the image data corresponding to a specific location in the image data of the second data D2, D3, and D4. That is, if the first data D1 and the second data D2, D3, and D4 are subdivided into multiple data, these subdivided data are associated with each other, i.e., the position information in the first data D1 and the image data of the second data D2, D3, and D4. For example, the file D11 of the first data D1 is associated with the image data D27, D37, and D47 of the inspection area corresponding to pin 7 or pin 8 of component P2 called "IC-2" in the second data D2, D3, and D4. On the other hand, the file D12 of the first data D1 is associated with the image data D22, D32, and D42 of the inspection area corresponding to pin 5 or pin 6 of component P2, named "IC-1," among the second data D2, D3, and D4. Therefore, in the association process, the first data D1 and the second data D2, D3, and D4 are associated not only on a board P1 basis, but also on a "position" basis within the board P1.

[0094] By the way, in the example in Figure 3, the inspection result of the first inspection machine 101 is abnormal (Failed), while the inspection results of the three second inspection machines 102, 103, and 104 are all normal, i.e., Passed. In other words, in this case, even though no abnormalities were found in any of the three second inspection machines 102, 103, and 104 located upstream from the first inspection machine 101, the first inspection machine 101 ultimately determined that there was an abnormality. In such cases, the associated first data D1 and second data D2, D3, and D4 can provide a trigger to review, for example, the inspection results or inspection conditions of any of the three second inspection machines 102, 103, and 104.

[0095] In other words, in the quality control support method according to this embodiment, if the inspection result of the first inspection machine 101 is abnormal and the inspection results of the second inspection machines 102, 103, and 104 are normal, a notification is issued by the notification process. Therefore, in a case like the one shown in Figure 3, the notification issued by the notification process can, for example, give the user (worker) of the component mounting system 20 an opportunity to review the inspection result or inspection conditions of any of the three second inspection machines 102, 103, and 104.

[0096] Furthermore, in this embodiment, as described above, the first data D1 and the second data D2, D3, D4 are associated not only on a board P1 basis, but also on a "position" basis within the board P1. For example, file D11, which represents an abnormality in the open circuit mode of pin 7 or pin 8 of component P2 named "IC-2", can provide an opportunity to review the inspection results or inspection conditions related to the associated image data D27, D37, D47. Similarly, file D12, which represents an abnormality in the short circuit mode between pins 5 and 6 of component P2 named "IC-1", can provide an opportunity to review the inspection results or inspection conditions related to the associated image data D22, D32, D42.

[0097] Furthermore, in the quality control support method according to this embodiment, the notification process provides recommended information regarding changes to the inspection conditions in the second inspection machines 102, 103, and 104. In other words, it is possible that the inspection conditions in the second inspection machines 102, 103, and 104 are too lenient, and therefore, even though no abnormalities were detected in the second inspection machines 102, 103, and 104, the first inspection machine 101 may have determined that there is an abnormality. Therefore, the recommended information provided encourages changes to the inspection conditions, such as tightening the inspection conditions for at least one of the second inspection machines 102, 103, and 104. For example, regarding the inspection conditions of the second inspection machine 102, the recommended information may include information recommending that the threshold used to determine whether the amount of solder is insufficient by comparing it with the amount of solder is increased. Similarly, regarding the inspection conditions of the second inspection machine 103, the recommended information may include information recommending that the threshold used to determine whether the misalignment of part P2 is within an acceptable range by comparing it with the amount of misalignment of part P2 is decreased.

[0098] Furthermore, in the quality control support method according to this embodiment, if the inspection result of the first inspection machine 101 is abnormal, and the inspection results of the second inspection machines 102, 103, and 104 are also abnormal, additional information is acquired through an additional acquisition process. That is, in the case of Figure 3, although all three second inspection machines 102, 103, and 104 are normal, if the inspection result of at least one of the three second inspection machines 102, 103, and 104 is abnormal, the additional acquisition process is executed. For example, if the inspection result of the second inspection machine 104 for a certain substrate P1 is abnormal, the substrate P1 would normally be removed from the assembly line at that point. However, depending on the operation, the substrate P1 may be returned to the assembly line based on the user's judgment (visual inspection). In such a case, since the inspection result of the first inspection machine 101 is abnormal, and the inspection results of the second inspection machines 102, 103, and 104 are also abnormal, additional information is acquired through the additional acquisition process.

[0099] Here, the additional information is information related to the user's judgment regarding the inspection results of the second inspection machines 102, 103, and 104. For example, the additional information may include information that, although the inspection result of the second inspection machine 104 was abnormal, the user intervened and determined that the substrate P1 was normal. Furthermore, the additional information may include information that identifies the intervening user, i.e., the user who determined that the substrate P1 was normal. By acquiring such additional information, the quality control support system 10 can utilize the first data D1 for user education or user identification.

[0100] Incidentally, in the second acquisition process, second data may be acquired that includes at least one of the following: information about the joining member P3, information about the component P2, and information about the inspection conditions in any of the inspection machines, including the first inspection machine 101 included in the component mounting system 20. In other words, the second data is not limited to the inspection data of the second inspection machines 102, 103, and 104, but may include at least one of the following: information about the joining member P3, information about the component P2, and information about the inspection conditions in any of the inspection machines. Here, the information about the joining member P3 includes information that identifies the part number, lot number, or manufacturer of the joining member P3. The information about the component P2 includes information that identifies the part number, lot number, or manufacturer of the component P2. The information about the inspection conditions in any of the inspection machines (first inspection machine 101 and second inspection machines 102, 103, and 104) includes information that identifies the current inspection conditions of the inspection machine (such as thresholds for judgment) or the history of changes to the inspection conditions. Furthermore, the history of changes to the inspection conditions includes the fact that the inspection conditions were changed, the date and time of the change, and the person who made the change (such as the user name).

[0101] Thus, when the second data includes information other than the inspection data from the second inspection machines 102, 103, and 104, the first data D1 and the second data are linked, enabling further utilization of the first data D1. For example, it becomes possible to analyze and manage the characteristics or quality of the substrate assembly P10 for each part number, lot number, or manufacturer of the bonding member P3 or component P2. Specifically, for a substrate P1 using a bonding member P3 of a certain part number, if the first data D1, which is the inspection data from the first inspection machine 101, is unsatisfactory, it can provide an opportunity to review the part number of the bonding member P3. Therefore, it becomes possible to improve the mounting quality, including the selection of bonding member P3 or component P2.

[0102] Furthermore, if the second data includes a history of changes to the inspection conditions, it can be used to verify whether the recommended information was appropriate, for example, when the inspection conditions have been changed in accordance with the recommended information. Specifically, if the first data D1, which is the inspection data of the first inspection machine 101, is unsatisfactory after the inspection conditions of a certain inspection machine have been changed in accordance with the recommended information, it is possible to realize that the recommended information was not appropriate.

[0103] (3.2) Estimation process Next, the estimation process in the quality control support method according to this embodiment will be explained in detail with reference to Figure 4. Figure 4 is a conceptual diagram showing the inspection of a substrate assembly P10 by a first inspection machine 101 consisting of an in-circuit tester (ICT).

[0104] The first inspection machine 101, which performs inspections based on the electrical characteristics of a circuit board assembly P10, performs inspections for multiple test cases for a single circuit board assembly P10 and outputs inspection data for each test case. Each of the multiple test cases measures the resistance value between two test nodes and checks the continuity state. Since multiple such test cases are set for a single circuit board assembly P10, multiple combinations of two test nodes are set for a single circuit board assembly P10. Multiple components P2 may be included between the two test nodes. Therefore, in addition to the inspection data for each test case, this type of first inspection machine 101 outputs a node list for each test case, which lists the components P2 included between the two test nodes.

[0105] On the other hand, various data related to the production process of the PCB assembly P10 on the mounting line (component mounting system 20) (including trace data and inspection data, etc.) are basically managed on a mounting point basis. Here, "mounting point" refers to each of the components P2 or the terminals (including pins and leads) of component P2, meaning that various data related to the production process are managed on a component P2 or component P2 terminal basis. Therefore, the smallest unit of data differs between the inspection data output by the first inspection machine 101 for each test case that may include multiple components P2, and the various data related to the production process for each component P2 or component P2 terminal, making it unsuitable for managing them in association with each other.

[0106] In the quality control support method according to this embodiment, the estimation process performed by the estimation unit 17 facilitates the association between the inspection data (first data D1) from the first inspection machine 101 and various data related to the production process for each part P2 or each terminal of part P2.

[0107] In other words, as an example, when the first inspection machine 101 inspects a circuit board assembly P10 with the circuit configuration shown in Figure 4, the inspection is performed using two of the four test nodes: "NodeA", "NodeB", "NodeC", and "NodeD".

[0108] For example, in a test case using two test nodes, "NodeA" and "NodeB," a list of components P2 contained between these two test nodes exists as a node list. Specifically, in the example in Figure 4, the node list associates the component numbers and pin numbers "R23.2," "R22.1," "C90.1," "IC2.3," and "IC1.9" with "NodeA," and the component numbers and pin numbers "IC2.4," "C91.2," and "IC1.8" with "NodeB." Here, the string before the "." represents the component number that identifies component P2, and the string after the "." represents the pin number (shown in Figure 4). In such a case, if a short-circuit anomaly occurs in a test case using two test nodes, "NodeA" and "NodeB," it can be inferred that one of the current paths I1 or I2 shown in Figure 4 occurred.

[0109] Therefore, in this case, the estimation process uses the node list to estimate from the inspection data that a short circuit between "IC1.8" and "IC1.9", or a short circuit between "IC2.3" and "IC2.4", is the cause of the abnormality. In other words, it is estimated that the abnormality is caused by a short circuit between pins 8 and 9 of component P2 called "IC1", or a short circuit between pins 3 and 4 of component P2 called "IC2". In this way, the estimation process uses the node list to estimate positional information for specific locations on the circuit board assembly P10.

[0110] (3.3) Flowchart Next, the overall picture of the quality control support method according to this embodiment, that is, the operation of the quality control support system 10, will be explained with reference to the flowchart shown in Figure 5. Figure 5 shows a series of steps in the quality control support method for one substrate P1.

[0111] The quality control support system 10 first executes a first acquisition process to acquire the first data D1 using the first acquisition unit 11 (S1), and then executes a second acquisition process to acquire the second data D2, D3, and D4 using the second acquisition unit 12 (S2).

[0112] Next, the quality control support system 10 performs an association process in the association unit 13 to associate the first data D1 with the second data D2, D3, and D4 (S3). In this association process, the substrate ID included in the first data D1 and the second data D2, D3, and D4 is used as a key to associate the first data D1 with the second data D2, D3, and D4 for each substrate ID. As a result, the first data D1 and the second data D2, D3, and D4 obtained from the first inspection machine 101 and the three second inspection machines 102, 103, and 104 for the same substrate P1 are associated with each other. The association process generates a dataset containing the first data D1 and the second data D2, D3, and D4 in an associated state (S4).

[0113] Next, the quality control support system 10 performs output processing in the output unit 14 to output the dataset (S5), and further determines whether the inspection result from the first inspection machine 101 is "abnormal" or not (S6). In process S6, the inspection result from the first inspection machine 101 is determined for substrate P1, whose substrate ID is included in the first data D1 and second data D2, D3, D4 that constitute the dataset. If the inspection result from the first inspection machine 101 is not "abnormal" (S6: No), the quality control support system 10 terminates the series of processes for this substrate P1.

[0114] On the other hand, if the inspection result of the first inspection machine 101 is "abnormal" (S6:Yes), the quality control support system 10 performs an estimation process in the estimation unit 17 to identify (estimate) the cause of the abnormality, that is, the location of the abnormality (S7). Then, the quality control support system 10 determines whether the inspection results of the second inspection machines 102, 103, and 104 are "normal" or not (S8). If the inspection results of all three second inspection machines 102, 103, and 104 are "normal" (S8:Yes), the quality control support system 10 performs a notification process in the notification unit 15 to notify the system of recommended information (S9).

[0115] On the other hand, if the inspection result of at least one of the three second inspection machines 102, 103, and 104 is not "normal" (S8: No), the quality control support system 10 determines whether or not the user intervened in the inspection results of the second inspection machines 102, 103, and 104 (S10). If the inspection results of the second inspection machines 102, 103, and 104 were not "normal" but the user intervened and determined them to be normal (S10: Yes), the quality control support system 10 executes an additional information acquisition process in the additional information acquisition unit 16 to acquire additional information (S11).

[0116] The quality control support system 10 provides feedback (S12) when it has completed notification processing (S9) or additional processing (S11), or when there is no user intervention (S10: No). Here, "feedback" means providing an opportunity to review the inspection results or inspection conditions of any of the second inspection machines 102, 103, or 104 based on the associated first data D1 and second data D2, D3, D4. Therefore, the entity that ultimately reviews the inspection results or inspection conditions may be the user or the quality control support system 10.

[0117] Furthermore, the flowchart shown in Figure 5 is merely an example, and the order of processing may be changed as appropriate, or processes may be added or deleted as appropriate.

[0118] (4) Variations Embodiment 1 is merely one of many embodiments of the present disclosure. Embodiment 1 can be modified in various ways depending on the design, etc., as long as the objectives of the present disclosure are achieved. Furthermore, the drawings referenced in the present disclosure are all schematic diagrams, and the ratios of the size and thickness of each component in the drawings do not necessarily reflect the actual dimensional ratios. In addition, functions similar to the quality control support method according to Embodiment 1 may be embodied in a quality control support system 10, a (computer) program, or a non-temporary recording medium on which the program is recorded. A program according to one embodiment is a program for causing one or more processors to execute the quality control support method according to Embodiment 1.

[0119] The following lists some modifications of Embodiment 1. The modifications described below can be combined and applied as appropriate.

[0120] The quality control support system 10 in this disclosure includes a computer system. The computer system mainly consists of a processor and memory as hardware. The functionality of the quality control support system 10 in this disclosure is realized by the processor executing a program recorded in the memory of the computer system. The program may be pre-recorded in the memory of the computer system, provided via a telecommunications line, or provided on a non-temporary recording medium such as a memory card, optical disk, or hard disk drive that can be read by the computer system. The processor of the computer system consists of one or more electronic circuits including semiconductor integrated circuits (ICs) or large-scale integrated circuits (LSIs). The integrated circuits such as ICs or LSIs referred to here are named differently depending on the degree of integration, and include integrated circuits called system LSIs, VLSIs (Very Large Scale Integration), or ULSIs (Ultra Large Scale Integration). Furthermore, FPGAs (Field-Programmable Gate Arrays) that are programmed after the manufacture of LSIs, or logic devices that allow for the reconfiguration of junction relationships or circuit compartments within LSIs, can also be used as processors. Multiple electronic circuits may be integrated onto a single chip or distributed across multiple chips. Multiple chips may be integrated onto a single device or distributed across multiple devices. The computer system referred to here includes a microcontroller having one or more processors and one or more memories. Therefore, the microcontroller also consists of one or more electronic circuits, including semiconductor integrated circuits or large-scale integrated circuits.

[0121] Furthermore, it is not essential for the quality control support system 10 to have multiple functions integrated into a single enclosure. The components of the quality control support system 10 may be distributed across multiple enclosures. Moreover, at least some of the functions of the quality control support system 10 may be implemented using the cloud (cloud computing), etc.

[0122] Functions that can be implemented by distributing them across two or more systems, such as the cloud (or server) and edge devices, include, for example, the following: The acquisition and association of the first data D1 and the second data D2, D3, D4 are performed at the edge, while the utilization of the generated dataset is performed in the cloud. In this case, by analyzing the dataset (the associated first data D1 and second data D2, D3, D4) in the cloud, it becomes possible to provide a basis for reviewing, for example, the inspection results or inspection conditions of any of the three second inspection machines 102, 103, and 104.

[0123] Conversely, in Embodiment 1, at least some of the functions of the quality control support system 10 or the work system 100, which are distributed across multiple devices, may be consolidated into a single housing. For example, some of the functions that are distributed between the component mounting system 20 and the quality control support system 10 may be consolidated into the component mounting system 20.

[0124] Specifically, the function of the estimation unit 17 may be provided in the first inspection machine 101. In this case, the first inspection machine 101 can perform estimation processing to estimate the cause of an abnormality when the inspection result of the first inspection machine 101 is abnormal. In other words, the first inspection machine 101 can estimate the cause of the abnormality (including position information) from the inspection data of the first inspection machine 101 using a node list based on the arrangement of component P2 in the substrate assembly P10. As a result, the first inspection machine 101 can output inspection data for component P2 or each terminal of component P2. Consequently, the smallest unit of data becomes the same for the inspection data of the first inspection machine 101 and the various data for each component P2 or each terminal of component P2 related to the production process, making it easier to manage them in association with each other.

[0125] Furthermore, in the association process, the data used as the key to associate the first data D1 and the second data D2, D3, D4 is not limited to the unique identification information (board ID) attached to each individual board P1. For example, the first data D1 and the second data D2, D3, D4 may be associated using the number of boards P1 inspected by each of the first inspection machine 101 and the three second inspection machines 102, 103, and 104 (hereinafter referred to as "number of boards") as the key. However, in this case, for example, if a board P1 is determined to be abnormal by any of the three second inspection machines 102, 103, or 104 and is excluded, a discrepancy in the number of boards will occur between that inspection machine (first inspection machine 101) and the downstream inspection machine. In other words, even for the same board P1, the number of boards may differ between the first inspection machine 101 and the second inspection machines 102, 103, and 104.

[0126] Furthermore, in the association process, if the unique identification information (board ID) assigned to each board P1 is used as the key to associate the first data D1 and the second data D2, D3, and D4, it becomes easier to identify missing board P1s on the assembly line based on the board ID. In other words, if the inspection machine or quality control support system 10 knows the order of board IDs flowing through the assembly line in advance, it can determine that a board P1 is missing if it is not inspected by any of the inspection machines using the board IDs in that order. For example, if the first inspection machine 101 knows the order of board IDs flowing through the assembly line, and it does not inspect board P1 using the board IDs in that order, the first inspection machine 101 can determine that a missing board has occurred.

[0127] Furthermore, the applications of the component mounting system 20 are not limited to the manufacturing of electronic devices in factories. For example, when the component mounting system 20 is used to mount mechanical components onto a glass plate, the component mounting system 20 performs the task of mounting the mechanical components, which are components P2, onto the glass plate, which is the substrate P1.

[0128] Furthermore, the component mounting system 20 only needs to include one or more solder forming machines 1, one or more mounting machines 2, and one or more reflow ovens 3. For example, the mounting machines 2 may consist of only one or two, or four or more. Similarly, multiple solder forming machines 1 or reflow ovens 3 may be provided. Moreover, it is not essential for the component mounting system 20 to arrange the multiple devices included in the component mounting system 20 in a line and connect them to form a mounting line.

[0129] Furthermore, the multiple mounting machines 2 (three in Embodiment 1) included in the component mounting system 20 are not limited to having a common configuration, and may have some different characteristics. That is, since there are many types, performance levels, characteristics, or specifications of mounting machines 2, the multiple mounting machines 2 included in the component mounting system 20 may also have different characteristics from each other. Specifically, the mounting machines 2 may differ in, for example, speed (maximum mounting speed), number of capture units (number of nozzles), number of supply units, type of capture unit, number of slots, number of mounting heads, and model.

[0130] Furthermore, the solder forming machine 1 can be any device that places (forms) a bonding member P3 on the surface of the substrate P1, and is not limited to a solder printing machine; for example, it could be a dispenser or the like.

[0131] Furthermore, the inspection machines (first inspection machine 101 and second inspection machines 102, 103, 104) are not essential components of the component mounting system 20. Therefore, for example, at least one of the first inspection machine 101 and the second inspection machines 102, 103, 104 may not be included in the component mounting system 20. For example, the first inspection machine 101 may not be included in the mounting line constructed by the component mounting system 20 and may be installed in a separate location from the mounting line. In this case, the circuit board assembly P10 produced by the component mounting system 20 will be transported to the first inspection machine 101 for inspection.

[0132] Furthermore, the first inspection machine 101 can be any inspection machine that performs at least electrical characteristic-based inspections of the substrate assembly P10, and is not limited to an in-circuit tester (ICT). For example, the first inspection machine 101 may be a function tester (FCT), or a combination of an in-circuit tester and a function tester.

[0133] Furthermore, the means of realizing the association between the first data D1 and the second data D2, D3, D4 are not limited to means of directly linking the two subjects by defining a linked relationship between the two subjects with a common key, using some of the items (data) of the two subjects as a key. For example, the association between the first data D1 and the second data D2, D3, D4 may be realized by linking the two subjects by having them belong to the same group. In addition, means of indirectly linking the two subjects by using a third item (data) different from the two subjects as a key and linking the two subjects to that key, or means of directly linking the two subjects by linking them together, may also be employed.

[0134] Furthermore, the conditions for the notification unit 15 to issue a notification are not limited to all inspection results of the multiple (3) second inspection machines 102, 103, and 104 being normal, but may also be limited to some of the inspection results of the multiple (3) second inspection machines 102, 103, and 104 being normal. In this case, the notification process issues a notification if the inspection result of the first inspection machine 101 is abnormal and some of the inspection results of the multiple second inspection machines 102, 103, and 104 are normal.

[0135] Furthermore, the quality control support method according to Embodiment 1 is not limited to a configuration in which one or more processors execute all of its processes; at least some of the processes may involve human intervention. For example, notification processing may be performed by a human using a user interface or the like.

[0136] (Embodiment 2) The quality control support method according to this embodiment differs from the quality control support method according to Embodiment 1 in that it has a function to detect signs of abnormalities. Hereinafter, components similar to those in Embodiment 1 will be denoted by common reference numerals and their descriptions will be omitted as appropriate.

[0137] In this embodiment, the definition of "second inspection machine" differs from that of Embodiment 1, where "second inspection machines 103, 14" in Embodiment 1 are referred to as "third inspection machines" in this embodiment. That is, as shown in Figure 6, in this embodiment, the third inspection machine 103 is an automated optical inspection device (AOI) located between the mounting machine 2 and the reflow oven 3, and the third inspection machine 104 is an automated optical inspection device (AOI) located between the reflow oven 3 and the first inspection machine 101. The solder printing inspection device (SPI) located between the solder forming machine 1 and the mounting machine 2 is the second inspection machine 102 in this embodiment as well, as in Embodiment 1. Thus, in the work system 100A according to this embodiment, the component mounting system 20 includes a solder forming machine 1, three mounting machines 2 and a reflow oven 3, in addition to the first inspection machine 101, the second inspection machine 102, and two third inspection machines 103, 104.

[0138] The inspection data from the third inspection machines 103 and 104 is used as third data D3 (see Figure 7). In other words, second data D2 (see Figure 7) is the inspection data from the second inspection machine 102, which consists of a solder printing inspection device (SPI), and is acquired from the second inspection machine 102. Third data D3 is the inspection data from the third inspection machine 103, which consists of an automatic optical inspection device (AOI) located in front of the reflow oven 3, and is acquired from the third inspection machine 103. In addition, third data separate from third data D3 is the inspection data from the third inspection machine 104, which consists of an automatic optical inspection device (AOI) located behind the reflow oven 3, and is acquired from the third inspection machine 104.

[0139] As shown in Figure 6, the quality control support system 10A according to this embodiment includes a third acquisition unit 21, a detection unit 22, and a notification unit 23 in addition to the configuration described in Embodiment 1. These third acquisition unit 21, detection unit 22, and notification unit 23 are realized by one or more processors executing a program, similar to the first acquisition unit 11, second acquisition unit 12, and association unit 13, etc.

[0140] The third acquisition unit 21 executes a third acquisition process to acquire the third data D3. The third data D3 is data relating to the substrate P1 and is different from the first data D1. In this embodiment, as an example, the third data D3 includes inspection data obtained by third inspection machines 103 and 104, which are different from the first inspection machine 101 and the second inspection machine 102. The third data D3 acquired in the third acquisition process is associated with the second data D2 in the association process.

[0141] In other words, the quality control support method according to this embodiment includes a third acquisition process for acquiring third data D3, which includes inspection data obtained by third inspection machines 103 and 104, which are separate from the first inspection machine 101 and second inspection machine 102 included in the component mounting system 20. The third inspection machines 103 and 104 are inspection machines that inspect the state of at least one of the bonding member P3 and the component P2, which are placed on the substrate P1 after the component P2 has been mounted on the substrate P1. In the association process, the second data D2 and the third data D3 are further associated.

[0142] The detection unit 22 performs a detection process to detect signs of anomalies when the inspection results of the second inspection machine 102 are normal. In the detection process, signs of anomalies when the inspection results of the second inspection machine 102 are normal are detected based on the first data D1 and the second data D2 associated with the first data D1. As an example, the detection unit 22 uses a trained model generated by machine learning to detect signs of anomalies.

[0143] The notification unit 23 executes a notification process to notify the system of an anomaly when an anomaly is detected by the detection process. In other words, the quality control support method according to this embodiment has a notification process that notifies the system of an anomaly when an anomaly is detected by the detection process. The "notification of an anomaly" referred to here includes notifying the system that there is an anomaly and the cause (details) of the anomaly in which the anomaly was detected. The forms of notification by the notification unit 23 include direct notification such as display, audio output and printing (printout), as well as indirect notification by transmission to the component mounting system 20 or other systems (including mobile terminals, etc.).

[0144] In the quality control support method according to this embodiment, it is possible to detect signs of abnormality while the inspection results of the inspection machines (first inspection machine 101, second inspection machine 102, and third inspection machines 103, 104) are within the "normal" range, that is, before the inspection results become "abnormal". The dataset generated by the association process (associated first data D1 and second data D2) can be used to detect signs of abnormality. For example, by focusing on the correlation between the first data D1, which is the inspection data of the first inspection machine 101, and the inspection data of the second inspection machine 102, which performs inspection before the component P2 is mounted on the substrate P1, it is possible to detect signs of abnormality using the inspection data of the second inspection machine 102 (second data D2). If signs of abnormality are detected, before it leads to an abnormality, i.e., a defect in the substrate assembly P10, measures such as checking the printing conditions or temperature profile of the solder forming machine 1, maintenance of the solder forming machine 1, stirring of the solder paste, or temperature adjustment can be taken.

[0145] In other words, the quality control support method according to this embodiment includes a detection process. Here, the second inspection machine 102 is an inspection machine that inspects the state of the bonding member P3 placed on the substrate P1 before the component P2 is mounted on the substrate P1. In the detection process, based on the first data D1 and the second data D2 associated with the first data D1, an indication of an abnormality is detected when the inspection result of the second inspection machine 102 is normal. If an indication of an abnormality is detected, the indication is notified by a notification process.

[0146] Figure 7 is a conceptual diagram showing the quality control process for the component mounting system 20 using the quality control support method according to this embodiment.

[0147] As in this embodiment, with a component mounting system 20 including a first inspection machine 101, a second inspection machine 102, and a third inspection machine 103, inspection data will be obtained from each inspection machine as illustrated in Figure 7.

[0148] In other words, the first inspection machine 101, which consists of an in-circuit tester (ICT), outputs the results of the inspection of the substrate assembly P10 as inspection data by measuring the electrical characteristics of the substrate assembly P10 discharged from the reflow oven 3, as shown in Figure 7. Therefore, the first data D1, which is the inspection data of the first inspection machine 101, includes data representing electrical characteristics, such as the resistance value between two test nodes in a certain test case. In the example in Figure 7, the first data D1 is data representing the resistance value (maximum value, minimum value, and nominal value) between two test nodes for the number of substrates (number of substrates P1 inspected).

[0149] The first inspection machine 101, consisting of an in-circuit tester (ICT), outputs inspection data as the result of inspecting the substrate assembly P10 by measuring the electrical characteristics of the substrate assembly P10 discharged from the reflow oven 3, as shown in Figure 7. Therefore, the first data D1, which is the inspection data of the first inspection machine 101, includes data representing electrical characteristics, such as the resistance value between two test nodes in a certain test case. In the example in Figure 7, the first data D1 is data representing the resistance value (maximum value, minimum value, and nominal value) between two test nodes for the number of substrates (number of substrates P1 inspected).

[0150] The second inspection machine 102, which consists of a solder printing inspection device (SPI), captures an image of the substrate P1 discharged from the solder forming machine 1, as shown in Figure 7, and outputs the results of the inspection of the state of the bonding member P3 placed on the substrate P1 as inspection data. Therefore, the second data D2, which is the inspection data of the second inspection machine 102, includes data representing, for example, the amount of bonding member P3 attached (amount of solder). In the example in Figure 7, the second data D2 is data representing the amount of solder (maximum value, minimum value, and nominal value) relative to the number of substrates (number of substrates P1 inspected).

[0151] As shown in Figure 7, the third inspection machine 103, which consists of an automated optical inspection (AOI) system, captures an image of the substrate P1 discharged from the mounting machine 2 and outputs the results of the inspection of the state of at least one of the bonding member P3 and component P2 placed on the substrate P1 as inspection data. Therefore, the third data D3, which is the inspection data of the third inspection machine 103, includes data indicating, for example, whether the position of component P2 on the substrate P1 is correct or not (whether the deviation is within an acceptable range or not). In the example in Figure 7, the third data D3 includes image data D31 to D38 obtained by capturing each of the multiple (in this case, eight) inspection areas set on the substrate P1 with a camera.

[0152] Here, there is a correlation between the resistance value in the first data D1 and the amount of solder included in the second data D2. In other words, as the amount of solder, which is the amount of bonding material P3, decreases, the resistance value tends to increase accordingly. Furthermore, as is clear from Figure 7, the amount of solder tends to gradually decrease as the number of inspections increases. This is because, for example, the amount of bonding material P3 (amount of solder) placed on the substrate P1 by the solder forming machine 1 gradually decreases due to factors such as clogging of the mask of the solder forming machine 1 or an increase in the viscosity of the bonding material P3 over time.

[0153] By the way, in the example in Figure 7, the inspection result of the third inspection machine 103 is abnormal (Failed). In such cases, the associated first data D1 and second data D2 can be used to detect signs of an abnormality. Furthermore, the third data D3 associated with the first data D1 and second data D2 will provide an opportunity to review the judgment criteria for detecting signs of an abnormality.

[0154] In other words, in the quality control support method according to this embodiment, it is possible to detect signs of abnormality from the first data D1, which is the inspection data of the first inspection machine 101 and the second data D2, which is the inspection data of the second inspection machine 102, which are linked to each other. For example, in Figure 7, if we focus on the data for board number V1, we can see from the first data D1 that the resistance value has decreased, although it is within the acceptable range (judged as normal). At this time (board number V1), the amount of solder in the second data D2 is set as the threshold for detecting signs of abnormality. That is, if the amount of solder in the second data D2, which is the inspection data of the second inspection machine 102, falls below the threshold for the signs of abnormality, even though it is within the acceptable range (judged as normal), the quality control support system 10A detects signs of abnormality in the detection unit 22 and notifies in the notification unit 23.

[0155] When an indication of an abnormality is reported, the component mounting system 20 may take measures such as stopping the transport of the substrate P1, performing maintenance on the solder forming machine 1, or stirring or adjusting the temperature of the solder paste. The entity that takes these measures may be the user or the component mounting system 20.

[0156] Furthermore, as shown in the example in Figure 7, if the inspection result of the third inspection machine 103 is abnormal, the number of boards for predictive detection is changed from "V1" to "V2" (ST1) so that the number of boards V2 in the first data D1 at that time becomes the number of boards for predictive detection. Furthermore, in the second data D2 associated with the first data D1, the number of boards for predictive detection is also changed from "V1" to "V2" (ST2). As a result, the amount of solder in the second data D2 at this time (number of boards V2) becomes the threshold for predictive detection.

[0157] Figure 8 is a flowchart showing a characteristic example of the operation of the quality control support method according to this embodiment. The overall processing flow of the quality control support method according to this embodiment is the same as that of Embodiment 1, and processes S21 to S25 shown in Figure 8 are inserted between processes S5 and S6 in the flowchart of Figure 5.

[0158] First, the quality control support system 10A performs a detection process in the detection unit 22 to detect signs of an anomaly from the first data D1 and the second data D2 (S21), and determines whether or not there are signs of an anomaly (S22). If there are signs of an anomaly (S22: Yes), the quality control support system 10A performs a notification process in the notification unit 23 to notify the system of the anomaly (S23), and performs a third acquisition process in the third acquisition unit 21 to acquire the third data (S24).

[0159] On the other hand, if there are no signs of abnormality (S22: No), the quality control support system 10A skips the notification process and executes a third acquisition process in the third acquisition unit 21 to acquire the third data (S24). Then, the quality control support system 10A executes an association process in the association unit 13 to associate the second data D2 with the third data D3 (S25). At this time, the association process associates the second data D2 with the third data D3 for each board ID, using the board ID included in the second data D2 and the third data D3 as the key. Therefore, the second data D2 and the third data D3 obtained by the second inspection machine 102 and the two third inspection machines 103 and 104 for the same board P1 are associated with each other.

[0160] Furthermore, the flowchart shown in Figure 8 is merely an example, and the order of processing may be changed as appropriate, or processes may be added or deleted as appropriate.

[0161] Incidentally, as a modification of Embodiment 2, signs of abnormality may be detected based on the correlation between the second data D2 and the third data D3. That is, by focusing on the correlation between the second data D2, which is the inspection data of the second inspection machine 102, and the third data D3, which is the inspection data of the third inspection machines 103 and 104, it becomes possible to detect signs of abnormality using the inspection data of the second inspection machine 102 (second data D2). In this case, it is not essential to detect signs of abnormality based on the correlation between the first data D1 and the second data D2.

[0162] The configuration described in Embodiment 2 (including modified examples) can be applied in appropriate combination with the configuration described in Embodiment 1 (including modified examples).

[0163] (summary) As described above, the quality control support method according to the first embodiment is a method for supporting quality control of a component mounting system (20), and comprises a first acquisition process, a second acquisition process, and an association process. The component mounting system (20) produces a substrate assembly (P10) by mounting components (P2) to a substrate (P1) using a bonding member (P3). In the first acquisition process, inspection data obtained from a first inspection machine (101) that inspects the substrate assembly (P10) based at least on its electrical characteristics is acquired as first data (D1). In the second acquisition process, second data (D2, D3, D4) is acquired, which is data relating to the substrate (P1) and is different from the first data (D1). In the association process, the first data (D1) and the second data (D2, D3, D4) are associated.

[0164] In this embodiment, inspection data (first data (D1)) obtained from a first inspection machine (101) that inspects a substrate assembly (P10) based on its electrical characteristics is associated with data other than the first data (D1) related to the substrate (P1) (second data (D2, D3, D4)). Since the substrate assembly (P10) is generated by mounting components (P2) to the substrate (P1) using a bonding member (P3), the first data (D1) and the second data (D2, D3, D4) are associated, for example, with each substrate (P1). As a result, when components (P2) are mounted to the substrate (P1), the first data (D1), which is the inspection data obtained from the first inspection machine (101), can be associated with and handled in relation to second data (D2, D3, D4) that is different from the first data (D1) of this substrate (P1). As a result, for example, the inspection data (D1) from the first inspection machine (101) can be fed back to the component mounting system (20) and used to update various conditions or parameters, thereby making effective use of the inspection data from the first inspection machine (101). Therefore, there is an advantage in that it is easier to make effective use of the inspection data from the inspection machine (first inspection machine (101)) that inspects the board assembly (P10) based on its electrical characteristics.

[0165] The quality control support method according to the second embodiment further includes an output process that outputs the result of the association process in the first embodiment.

[0166] According to this embodiment, it becomes easier to make effective use of the inspection data from the inspection machine (first inspection machine (101)) that inspects the substrate assembly (P10) based on its electrical characteristics.

[0167] The quality control support method according to the third embodiment, in the first or second embodiment, acquires second data (D2, D3, D4) in the second acquisition process, which includes inspection data obtained by the second inspection machine (102, 103, 104). The second inspection machine (102, 103, 104) is a different inspection machine from the first inspection machine (101) included in the component mounting system (20).

[0168] According to this embodiment, inspection data from a first inspection machine (101) that inspects a substrate assembly (P10) based on its electrical characteristics can be fed back to second inspection machines (102, 103, 104).

[0169] The quality control support method according to the fourth embodiment further includes a notification process that, in the third embodiment, provides notification when the inspection result of the first inspection machine (101) is abnormal and the inspection results of the second inspection machines (102, 103, 104) are normal.

[0170] According to this embodiment, if the inspection conditions of the second inspection machine (102, 103, 104) are too lenient, a notification can be issued, providing an opportunity to review the inspection results and inspection conditions of the second inspection machine (102, 103, 104).

[0171] The quality control support method according to the fifth aspect, in the fourth aspect, provides notification of recommended information regarding changes to inspection conditions in the second inspection machine (102, 103, 104) during the notification process.

[0172] According to this embodiment, it is possible to suggest a change in the inspection conditions of the second inspection machine (102, 103, 104).

[0173] The quality control support method according to the sixth embodiment further includes an additional acquisition process for acquiring additional information when the inspection result of the first inspection machine (101) is abnormal and the inspection result of the second inspection machines (102, 103, 104) is also abnormal, in any of the third to fifth embodiments. The additional information is information related to the user's judgment regarding the inspection result of the second inspection machines (102, 103, 104).

[0174] According to this embodiment, if user judgment is involved in the inspection results of the second inspection machine (102, 103, 104), it becomes possible to identify this fact, which can provide an opportunity for the user to review their operations.

[0175] The seventh aspect of the quality control support method further comprises a detection process in any of the third to sixth aspects. The second inspection machine (102) is an inspection machine that inspects the state of bonding members (P3) placed on a substrate (P1) before components (P2) are mounted on the substrate (P1). In the detection process, based on first data (D1) and second data (D2) associated with the first data (D1), an indication of an abnormality is detected when the inspection result of the second inspection machine (102) is normal.

[0176] According to this embodiment, by detecting signs of abnormality before the inspection results of the second inspection machine (102) deviate from the normal range, it is possible to provide an opportunity to review the mounting process early.

[0177] The quality control support method according to the eighth aspect further includes a third acquisition process for acquiring third data (D3) which includes inspection data obtained by a third inspection machine (103, 104) according to the seventh aspect. The third inspection machine (103, 104) is an inspection machine separate from the first inspection machine (101) and the second inspection machine (102) included in the component mounting system (20). The third inspection machine (103, 104) is an inspection machine that inspects the state of at least one of the bonding member (P3) and the component (P2) placed on the substrate (P1) after the component (P2) has been mounted on the substrate (P1). In the association process, the association between the second data (D2) and the third data (D3) is further performed.

[0178] According to this embodiment, even if inspection data from the first inspection machine (101) cannot be obtained, the results of the association between the inspection data from the second inspection machine (102) and the inspection data from the third inspection machines (103, 104) can be effectively utilized.

[0179] The quality control support method according to the ninth embodiment further includes a notification process that notifies of an early sign if an early sign is detected by the detection process, in the seventh or eighth embodiment.

[0180] According to this embodiment, by detecting signs of abnormality before the inspection results of the second inspection machine (102) deviate from the normal range, it is possible to provide an opportunity to review the mounting process early.

[0181] The quality control support method according to the tenth embodiment, in any of the first to ninth embodiments, acquires second data (D2, D3, D4) in the second acquisition process, which includes at least one of the following three pieces of information: the three pieces of information are information about the joining member (P3), information about the component (P2), and information about the inspection conditions in any inspection machine, including the first inspection machine (101) included in the component mounting system (20).

[0182] According to this embodiment, the inspection data from the first inspection machine (101) can provide an opportunity to review at least one of the following: the joining member (P3), the component (P2), and the inspection conditions in either inspection machine.

[0183] The quality control support method according to the 11th embodiment is as follows: In any of the 1st to 10 embodiments, the first acquisition process acquires first data (D1) which includes positional information relating to a specific part of the substrate assembly (P10).

[0184] According to this embodiment, inspection data from the first inspection machine (101) can be acquired in a state that allows for identification of specific locations on the substrate assembly (P10).

[0185] The quality control support method according to the 12th embodiment, in the 11th embodiment, acquires position information using a node list based on the arrangement of components (P2) in the substrate assembly (P10) in the first acquisition process.

[0186] According to this embodiment, inspection data from the first inspection machine (101) can be acquired in a state that allows for identification of specific locations on the substrate assembly (P10).

[0187] The quality control support method according to the 13th embodiment is such that, in the 11th or 12th embodiment, the second data (D2, D3, D4) includes image data. In the association process, the position information in the first data (D1) is associated with the image data corresponding to a specific location in the image data of the second data (D2, D3, D4).

[0188] According to this embodiment, it becomes easier to effectively utilize the inspection data from the first inspection machine (101) for each specific location of the substrate assembly (P10).

[0189] A method for generating a dataset according to the 14th embodiment is a method for generating a dataset used for managing a component mounting system (20), and comprises a first acquisition process, a second acquisition process, and a generation process. The component mounting system (20) produces a substrate assembly (P10) by mounting components (P2) to a substrate (P1) using a bonding member (P3). In the first acquisition process, inspection data obtained from a first inspection machine (101) that inspects the substrate assembly (P10) based on at least its electrical characteristics is acquired as first data (D1). In the second acquisition process, second data (D2, D3, D4) is acquired, which is data relating to the substrate (P1) and is different from the first data (D1). In the generation process, a dataset including the first data (D1) and the second data (D2, D3, D4) is generated by associating the first data (D1) and the second data (D2, D3, D4).

[0190] This embodiment has the advantage of making effective use of inspection data from an inspection machine (first inspection machine (101)) that inspects a substrate assembly (P10) based on its electrical characteristics.

[0191] The program relating to the 15th aspect is a program that causes one or more processors to execute a quality control support method relating to any of the 1st to 13th aspects, or a data set generation method relating to the 14th aspect.

[0192] This embodiment has the advantage of making effective use of inspection data from an inspection machine (first inspection machine (101)) that inspects a substrate assembly (P10) based on its electrical characteristics.

[0193] The quality control support system (10,10A) according to the 16th embodiment is a quality control support system (10,10A) that supports quality control of a component mounting system (20), and comprises a first acquisition unit, a second acquisition unit, and an association unit. The component mounting system (20) produces a substrate assembly (P10) by mounting components (P2) to a substrate (P1) using a bonding member (P3). The first acquisition unit acquires inspection data obtained from a first inspection machine (101) that inspects the substrate assembly (P10) based at least on electrical characteristics as first data (D1). The second acquisition unit acquires second data (D2, D3, D4) which is data relating to the substrate (P1) and is different from the first data (D1). The association unit associates the first data (D1) with the second data (D2, D3, D4).

[0194] This embodiment has the advantage of making effective use of inspection data from an inspection machine (first inspection machine (101)) that inspects a substrate assembly (P10) based on its electrical characteristics.

[0195] The work system (100, 100A) according to the 17th embodiment comprises a quality control support system (10, 10A) according to the 16th embodiment and a component mounting system (20) for mounting components (P2) onto a substrate (P1) to produce a substrate assembly (P10).

[0196] This embodiment has the advantage of making effective use of inspection data from an inspection machine (first inspection machine (101)) that inspects a substrate assembly (P10) based on its electrical characteristics.

[0197] Not limited to the embodiments described above, various embodiments (including modifications) of the quality control support method according to Embodiment 1 and Embodiment 2 can be realized using a quality control support system (10, 10A), a work system (100, 100A), a program, and a non-temporary recording medium on which the program is recorded.

[0198] The configurations relating to aspects 2 through 13 are not essential to the quality control support method and can be omitted as appropriate. [Explanation of Symbols]

[0199] 10,10A Quality Control Support System 20 Component Mounting System 100, 100A work system 101 First Inspection Machine 102 Second Inspection Machine 103, 104 Second inspection machine (third inspection machine) D1 First Data D2 Second Data D3 Second Data (Third Data) P1 circuit board P2 parts P3 Joining Member P10 PCB Assembly

Claims

1. A quality control support method for a component mounting system that produces circuit board assemblies by mounting components onto a circuit board using bonding members, The component mounting system comprises a first inspection machine and a second inspection machine. A first acquisition process is performed to acquire inspection data obtained by inspecting the electrical characteristics of the substrate assembly using the first inspection machine as first data, A second acquisition process is performed to acquire second data obtained by inspecting the state of the bonding member printed on the substrate using the second inspection machine, The system includes a detection process that detects signs of an anomaly based on the first data and the second data, In the detection process described above, the resistance value indicated by the first data is within the acceptable range, and the amount of the joining member indicated by the second data is within the acceptable range but decreasing, which is detected as a precursor. The aforementioned component mounting system further comprises a third inspection machine, The third inspection machine further includes a third acquisition process for acquiring third data obtained by inspecting at least one of the state of the components and the state of the bonding members after the components have been mounted on the substrate, If the inspection result of the third inspection machine is abnormal, and the inspection results of the first and second inspection machines are normal, set the threshold for the second data. In the detection process described above, the precursor is detected based on the second data. Quality control support method.

2. The invention further comprises a notification process that notifies the presence of the presence of the presence if the presence is detected by the detection process, The quality control support method according to claim 1.

3. The component mounting system further comprises a soldering machine for arranging the bonding member on the substrate, The notification process enables one of the following: maintenance of the solder forming machine, stirring of the joining member, or temperature adjustment of the joining member. The quality control support method according to claim 2.

4. The first data includes positional information of a specific part of the substrate assembly, The second data includes image data, The second inspection machine further includes a linking process that associates the image data of the region corresponding to the specific location among the image data obtained by the second inspection machine with the first data. A method for supporting quality control according to any one of claims 1 to 3.

5. The system further includes a notification process that, if the inspection result of the first inspection machine on the specific location is abnormal and the inspection result of the second inspection machine on the specific location is normal, notifies the system of recommendation information recommending that the inspection conditions related to the second data associated with the first data be changed. The quality control support method according to claim 4.

6. A quality control support system for a component mounting system that produces a circuit board assembly by mounting components to a circuit board using a bonding member, the system being used to support quality control of a component mounting system, The component mounting system includes a first inspection machine which inspects the electrical characteristics of the substrate assembly and acquires the inspection data obtained as first data, and The component mounting system includes a second inspection machine which acquires second data obtained by inspecting the state of the bonding member printed on the substrate, and The system includes a detection unit that detects signs of an anomaly based on the first data and the second data, The detection unit detects as a precursor that the resistance value indicated by the first data is within the acceptable range, and the amount of the joining member indicated by the second data is within the acceptable range but is decreasing. The component mounting system further includes a third acquisition unit that acquires third data obtained by inspecting at least one of the state of the component and the state of the bonding member after the component has been mounted on the substrate using a third inspection machine, If the inspection result of the third inspection machine is abnormal, and the inspection results of the first and second inspection machines are normal, set the threshold for the second data. The detection unit detects the precursor based on the second data. Quality control support system.

7. The quality control support system according to Claim 6, The system comprises a component mounting system for mounting the aforementioned components onto the substrate to produce the substrate assembly. Work system.

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