A method for manufacturing a vacuum processing apparatus and a vacuum-treated substrate.

Abstract

The substrates supported in the substrate holders are supported on the holder carrier (5) such that their extension faces are exposed to the ambient atmosphere along the extension face of the holder carrier (5). The holder carrier (5) is oriented along an axis (A11 TR , A11 LL ). The substrates on the holder carrier (5) are vacuum processed in a vacuum processing chamber (15). This chamber (15) communicates with a transfer vacuum chamber (23) via a gate valve (21). The holder carrier (5) with the substrate in the vacuum processing chamber (15) is exchanged with a holder carrier (5) carrying an unprocessed substrate from the transfer vacuum chamber 23 by an exchange robot (33). During processing in the vacuum processing chamber (15), the holder carrier (5) with the processed substrate and the holder carrier (5) with the unprocessed substrate are exchanged in the transfer vacuum chamber (23) via a gate valve (25). The transfer vacuum chamber (23) functions as a load lock.

Description

[Technical Field]

[0001] This invention deviates from the need to improve the throughput of processed substrates when processing a batch of substrates by evaporation under vacuum. Nevertheless, the inventive solution discovered by the inventors can generally be applied to vacuum processing techniques that satisfy all of the following definitions, which will be illustrated with reference to Figures 1 to 6. [Background technology]

[0002] Definition: i) The substrate holder SH is a device or part of a device on which the substrate is held on the holder carrier HC. Thereafter, one extended surface of the substrate held within the SH is freely exposed to the ambient atmosphere, except for any members that overlap the aforementioned free-exposed surface for holding the substrate. Figure 1 schematically shows an example of an SH1 that holds a substrate 3 on the HC5. The SH may be an integral part of the HC5 or a separate part held within the HC, as shown by the dashed line. In this example, both extended surfaces 7 of the substrate 3 are freely exposed to the ambient atmosphere.

[0003] In a cross-sectional view, the substrate 3 may have an extended surface 7 that is bent in a planar, concave, or convex shape, or a combination thereof. In a top view, the substrate 3 may have any desired shape, such as a circle, ellipse, rectangle, or square, and may be, for example, a wafer, optical glass, or lens.

[0004] ii) The holder carrier HC5 is therefore a device that holds at least one SH1 or has at least one SH1 integrated into it. In particular, if the substrate to be processed is large, only one or two SH1s are on the HC5. Otherwise, a number of SH1s are provided along the extent of the HC5. Figure 2 schematically shows an example of an HC5. Thereafter, in a cross-sectional view, the HC5 may have an extending surface 9, along which the extending surface 7 of the substrate 3 is freely exposed around the periphery, which is planar, convex, or concave. In the example shown in Figure 3, which shows a rimless cap-shaped HC5, the aforementioned surface 9 is concave. In a top view, the HC5 may be circular as shown in Figure 4a, or square or rectangular as shown in Figure 4b.

[0005] iii) HC5 is the central axis A that crosses the extending surface 9. HC It has a central axis A HC The extended surface 7 of the substrate is freely exposed to the surroundings along this line.

[0006] iv) The holder carrier (HC) support (HCS11) is a device that holds the HC5 in a predetermined position, and in some embodiments, the HC5 is driven by a drive unit 13, shown by a dashed line in Figure 5, along the central axis A HC Rotate it around it.

[0007] Figures 5 and 6 schematically show the circular plate shape of HC5. SH1 is not shown in Figures 3 through 6. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] International Publication No. 2019 / 219371 [Overview of the Initiative] [Means for solving the problem]

[0009] At least one, two, or more substrates, i.e., one batch, are handled within a vacuum processing apparatus that satisfies the aforementioned definition.

[0010] To address the need to improve the substrate throughput of a vacuum processing apparatus or a method for manufacturing a vacuum-processed substrate, a vacuum processing apparatus is proposed that satisfies the above definitions i) to iv), and the vacuum processing apparatus is: -At least one substrate holder positioned along the extending surface of at least one holder carrier, the substrate holder is configured to hold the extending surface of a substrate placed in the substrate holder so as to be freely exposed to the periphery along the extending surface of the holder carrier, the extending surface of the holder carrier extends around the central axis of the holder carrier which is oriented laterally with respect to the extending surface of the holder carrier (5), - At least one vacuum processing chamber communicating with a transfer vacuum chamber via one first gate valve, Equipped with, - The vacuum processing chamber comprises a first holder carrier support configured to support one holder carrier, - The transfer vacuum chamber is, • Pumping port, • A second holder carrier support configured to support one holder carrier, A replacement conveyor between a first gate valve and a second holder carrier support, configured to grip and release a holder carrier from and on the first holder carrier support, respectively, through the first gate valve, and to grip and release a holder carrier from and on the second holder carrier support, respectively. • At least one second gate valve communicating with the ambient atmosphere, • Second holder carrier support (11 LL ) and / or second holder carrier support (11 LL) and further conveyors configured to transport the holder carrier through at least one second gate valve, It is equipped with.

[0011] The transfer vacuum chamber communicates with the vacuum processing chamber by a first gate valve and has a pumping port and at least one second gate valve, thus having a load-lock chamber structure. This allows the holder carrier to be removed through at least one second gate valve and loaded through at least one second gate valve while the first gate valve is closed, and therefore during the processing operation of the vacuum processing chamber on the substrates on the holder carrier in the processing chamber. Furthermore, the processing atmosphere in the processing chamber is not interrupted when the holder carrier with unprocessed substrates in the transfer vacuum chamber is replaced with the holder carrier with processed substrates in the vacuum processing chamber, and is therefore maintained continuously. This significantly contributes to the high throughput of processed substrates.

[0012] In one embodiment of the apparatus according to the present invention, a separate holder carrier comprises at least two separate segments. The exchange conveyor grasps and releases one of the separate segments on the first holder carrier support at once from the first holder carrier support and on the second holder carrier support (11 LL ) and the second holder carrier support (11 LL ) is configured to grasp and release one of the separate segments on each side.

[0013] Therefore, the exchange conveyor handles one segment after the other segments to complete the handling of each complete, separate holder carrier. This significantly reduces the range of the first gate valve compared to the range for exchanging and handling a complete holder carrier at once, and significantly reduces the weight of the parts handled simultaneously by the exchange conveyor, while still allowing large holder carriers to be processed within the vacuum processing chamber.

[0014] According to one embodiment of the apparatus according to the present invention, the first holder carrier support comprises a frame support structure for separate segments.

[0015] Therefore, the aforementioned segments of the holder carrier are placed one by one within the first holder carrier support and each is removed from the first holder carrier support, and the first holder carrier support, by its frame structure, does not prevent the free exposure of the substrates on the substrate holder to the vacuum processing in the vacuum chamber. Clearly, the second holder carrier support may also have a frame support structure for separate segments, even if it has the same structure as the first holder carrier support, in order to simplify the handling of the segments of the exchange conveyor.

[0016] In one embodiment of the apparatus according to the present invention, the extending surface of the holder carrier is one of a flat, convex, or concave surface.

[0017] In one embodiment of the apparatus according to the present invention, the extending surface of the holder carrier is concave and has a rimless cap shape.

[0018] In one embodiment of the apparatus according to the present invention, the extending surface of the holder carrier is concave or convex and is formed by planar sectors of a planar surface.

[0019] In one embodiment of the apparatus according to the present invention, the first holder carrier support is controllably rotatable around the central axis of the support.

[0020] The rotation of the first holder carrier support as described above is performed to equalize the processing effect on all substrates on the holder carrier applied to the first holder carrier support.

[0021] In one embodiment of the device according to the invention, a separate holder carrier comprises at least two separate segments, and the exchange conveyor is configured to grip and release, one by one and on the first holder carrier support, one of the separate segments respectively, and to grip and release, one by one and on the second holder carrier support, one of the separate segments respectively. The first holder carrier support and the second holder carrier support are rotatable about their respective holder central axes in angular steps by means of at least one step drive.

[0022] In one embodiment of the device according to the invention, each of the first holder carrier support and the second holder carrier support has a holder central axis (A11 TR , A11 LL ), and these holder central axes are parallel to each other.

[0023] In one embodiment of the device according to the invention, which is just the foregoing embodiment, the central axis of one of the holder carriers on the first holder carrier support and the central axis of one of the holder carriers on the second holder carrier support each coincide with the support central axis.

[0024] In one embodiment of the device according to the invention, the central axis of one of the holder carriers on the first holder carrier support and the central axis (A HC ) of one of the holder carriers (5) on the second holder carrier support are parallel to each other.

[0025] In one embodiment of the device according to the invention, which is the foregoing embodiment, the central axis is vertical.

[0026] In one embodiment of the device according to the invention, the exchange conveyor is configured to convey the holder carriers perpendicular to the central axes of the holder carriers on the first holder carrier support and the second holder carrier support.

[0027] In one embodiment of the apparatus according to the present invention, the exchange conveyor comprises at least two extendable and retractable gripping arms (33a, 33b) that are extendable and retractable with respect to the rotation axis of the exchange conveyor and are rotatably controlled in common around the rotation axis by a rotary drive unit, each of which comprises a gripping unit configured to controllably grip and release a holder carrier either as a single component or, if the holder carrier is composed of separate segments, by gripping and releasing each holder carrier segment.

[0028] In one embodiment of the aforementioned embodiment of the apparatus according to the present invention, the central axis of one of the holder carriers on the first holder carrier support, the central axis of one of the holder carriers on the second holder carrier support, and the rotation axis are parallel to each other.

[0029] In one embodiment of the apparatus according to the present invention, the gripping arms are extendable and retractable in a manner that can be controlled independently of each other.

[0030] In one embodiment of the apparatus according to the present invention, each gripping arm is retractable and extendable only when the other gripping arm is retracted.

[0031] In one embodiment of the aforementioned embodiment of the apparatus according to the present invention, the gripping unit grips and releases a holder carrier or a segment of a holder carrier by pin (51v, 51b) and bore (53v, 53b) links.

[0032] In one embodiment of the aforementioned embodiments, the pin link and bore link are established and released by the radial relative motion of the pin (51v, 51b) and bore (53v, 53b) with respect to the axis of rotation. Below the "bore," the guide is also understood, for example, as a rail that is open on one side.

[0033] In one embodiment of the apparatus according to the present invention, a second gate valve is located at the bottom wall of a transfer vacuum chamber, and a further conveyor comprises a controllably driven elevator that is movable toward and from the bottom wall and carries a valve plate oriented parallel to the bottom wall, the valve plate sealing the transfer vacuum chamber when the elevator is closest to the bottom wall.

[0034] One embodiment of the apparatus according to the present invention comprises at least two second gate valves, and the further conveyor is configured to transport a holder carrier from a second holder carrier support through one of the at least two second gate valves and to transport the holder carrier onto the second holder carrier support through another of the at least two second gate valves.

[0035] In one embodiment of the apparatus according to the present invention, a further conveyor is configured to transport the holder carrier in a bidirectional reciprocating manner from and onto the second holder carrier support through one of the at least one second gate valves.

[0036] In one embodiment of the apparatus according to the present invention, the holder carrier comprises at least two substrate holders or a number of substrate holders.

[0037] In one embodiment of the apparatus according to the present invention, at least one substrate holder is either inseparable from the holder carrier or is a separate component that can be separated from the holder carrier.

[0038] In one embodiment of the apparatus according to the present invention, the exchange conveyor comprises at least two extendable and retractable gripping arms that are extendable and retractable with respect to the rotation axis of the exchange conveyor and are rotatable in a commonly controllable manner around the rotation axis by a rotary drive unit. The gripping arms have a stroke for gripping and releasing holder carriers from and on a first holder carrier support through a first gate valve, and for gripping and releasing holder carriers from and on a second holder carrier support.

[0039] In one embodiment of the aforementioned embodiment of the apparatus according to the present invention, the gripping arm is a frog-leg shaped arm.

[0040] In one embodiment of the aforementioned design, both gripping arms consist of the same frog-shaped legs.

[0041] In the aforementioned embodiment, only one of the gripping arms can be extended at a time.

[0042] One embodiment of the apparatus according to the present invention includes an ambient atmosphere loading / unloading conveyor (63) configured to load at least one substrate into a substrate holder and unload it from the substrate holder in an ambient atmosphere.

[0043] One embodiment of the apparatus according to the present invention includes a timing unit configured to control the operation of at least a further conveyor and a second gate valve, and to control the operation of the further conveyor to replace a holder carrier on a second holder carrier support during the processing operation of the vacuum processing chamber.

[0044] The further conveyor is controlled to replace a holder carrier having at least one processed substrate on a second holder carrier support with a holder carrier having at least one unprocessed substrate. Therefore, due to the load lock configuration of the transfer vacuum chamber, the processing atmosphere in the vacuum processing chamber does not need to be changed, and the processing process is only interrupted for the operation of the replacement conveyor.

[0045] In one embodiment of the apparatus according to the present invention, a) The vacuum processing chamber is a deposition coating chamber and is equipped with at least one evaporator source, b) The holder carrier comprises at least two distinct segments and has a brimless cap shape, c) The first holder carrier support and the second holder carrier support are rimless cap-shaped frames and are controllably rotatable around their respective central axes.

[0046] The embodiments described above may be implemented in any combination, as long as they are not condensable.

[0047] The present invention further relates to a holder carrier adapted for use in an apparatus according to the present invention, wherein the holder carrier is configured to hold extending surfaces of at least two substrates applied so as to be freely exposed circumferentially along the extending surface of the holder carrier, the extending surface of the holder carrier extends about a central axis oriented laterally with respect to the extending surface of the holder carrier, and the holder carrier comprises at least two separate segments, each having at least one substrate holder, the segments being assembled and disassembled to give rise to the holder carrier.

[0048] In one embodiment of the holder carrier according to the present invention, the holder carrier has a brimless cap shape.

[0049] The present invention further relates to a method for manufacturing a vacuum-treated substrate, thereby achieving the aforementioned objective, namely, improving the throughput of the substrate. The step of providing two or more holder carriers, each of which comprises an extending surface and at least one substrate holder distributed along the extending surface, wherein the at least one substrate holder is constructed to hold the extending surface of a substrate placed in the substrate holder so as to be freely exposed to the periphery along the extending surface of the holder carrier, and the extending surface of each holder carrier extends around a central axis of the holder carrier oriented laterally with respect to the extending surface of the holder carrier. The steps include providing at least one vacuum processing chamber constructed to process at least one substrate on one of the holder carriers, The steps include providing a transfer vacuum chamber connected to at least one vacuum processing chamber via a gate valve, a) A step of processing a substrate on one of the holder carriers at once in a vacuum processing chamber, bringing the processed substrate onto one of the holder carriers, thereby carrying out the processing at the process pressure in the vacuum processing chamber, the processing continuing for the duration of the processing period, b) During the processing period, b1) A step of transporting one of the holder carriers having a previously processed substrate out of the transfer vacuum chamber toward the surroundings, thereby ventilating the transfer vacuum chamber, b2) A step of transporting one of the holder carriers having an unprocessed substrate from the surroundings into a transfer vacuum chamber and establishing a process pressure within the transfer vacuum chamber. c) After processing, in the vacuum processing chamber, one holder carrier having processed substrates is replaced with one holder carrier having unprocessed substrates from the transfer vacuum chamber through a gate valve, and in the transfer vacuum chamber, one holder carrier having unprocessed substrates is replaced with one holder carrier having processed substrates from the transfer vacuum chamber through a gate valve, and d) A step that repeats steps a) to c), The steps to implement, Includes.

[0050] One variation of the method according to the present invention includes the steps of removing at least one processed substrate from one holder carrier and loading at least one unprocessed substrate onto one of the holder carriers, performed in an ambient atmosphere.

[0051] One of the aforementioned variations of the method according to the present invention includes the steps of removing at least one processed substrate from one holder carrier and loading at least one unprocessed substrate into the same holder carrier.

[0052] One variation of the method according to the present invention includes the steps of constructing each holder carrier by at least two distinct segments, wherein at least one of the segments comprises at least one substrate holder, and performing step c) by replacing the segments.

[0053] Therefore, a further variation of the above-mentioned modified form includes the step of performing the exchange by repeatedly exchanging segments one by one from the transfer vacuum chamber within the vacuum processing chamber, and by repeatedly exchanging segments one by one from the vacuum processing chamber within the transfer vacuum chamber.

[0054] In one modified form of the method according to the present invention, the aforementioned treatment is a vapor deposition coating, and the holder carrier is selected as a rimless cap shape.

[0055] In one variation of the method according to the present invention, the method is carried out using the apparatus according to the present invention or one or more embodiments of the apparatus.

[0056] Modified forms of the method according to the present invention can be implemented in any combination, unless they are limited.

[0057] Next, the apparatus and method according to the present invention will be further illustrated with reference to the drawings. [Brief explanation of the drawing]

[0058] [Figure 1] This is a schematic cross-sectional view showing a portion of a holder carrier having a substrate holder. [Figure 2] This figure, similar to Figure 1, shows a portion of the holder carrier. [Figure 3] This is a schematic cross-sectional view showing one embodiment of a holder carrier. [Figure 4(a)] This is a schematic top view of one embodiment of a holder carrier. [Figure 4(b)] This is a schematic top view of one embodiment of a holder carrier. [Figure 5] This is a schematic and simplified side view of one embodiment of a holder carrier support. [Figure 6] This is a schematic and simplified top view of one embodiment of a holder carrier support. [Figure 7] This is a schematic and simplified top view of one embodiment of the apparatus according to the present invention, which is suitable for carrying out a modified form of the method according to the present invention. [Figure 8] This is a side view of the embodiment shown in Figure 7. [Figure 9] This is a schematic and simplified diagram of one embodiment of a replacement conveyor that can be applied to the apparatus according to the present invention. [Figure 10] This is a schematic and simplified diagram of one embodiment of a replacement conveyor that can be applied to the apparatus according to the present invention. [Figure 10a] This figure shows both gripping arms in the retracted position. [Figure 10b] This diagram shows one of the gripping arms in the extended position. [Figure 10c] This is the other gripping arm in the extended position. [Figure 11] Figures 10a to 10c show the most schematic representation of the mechanical block operation of the components of the exchange conveyor. [Figure 12] This is a schematic cross-sectional view of one embodiment of a gripping unit applicable to the apparatus according to the present invention. [Figure 13] Figure 12 is a plan view of the gripping unit. [Figure 14] This is a schematic and simplified cross-sectional view of a rimless cap-shaped holder carrier equipped with gripping unit components similar to those shown in Figures 12 and 13. [Figure 15] Figures 12 to 14 show a schematic diagram illustrating the shape of one embodiment of a gripping bore that cooperates with the gripping pin. [Figure 16] This is a schematic and simplified diagram of one embodiment of an apparatus according to the present invention that carries out the method according to the present invention. [Figure 17] This figure shows a schematic and simplified representation of a further embodiment of the apparatus according to the present invention, which carries out the method according to the present invention. [Figure 18] This figure shows a schematic and simplified representation of a further embodiment of the apparatus according to the present invention, which carries out the method according to the present invention. [Figure 19] This is a simplified schematic perspective view of an embodiment of the apparatus according to the present invention, which includes a holder carrier segment and each holder carrier having a frame shape for supporting the holder carrier composed of such segments. [Figure 20] A simplified schematic perspective view of each holder carrier, including a further embodiment of the holder carrier segment, such as one embodiment of the apparatus according to the present invention, and a frame shape for supporting the holder carrier composed of such segments. [Figure 21(a)] This is a schematic side view of one embodiment of a gripping unit applicable to a segment of a rimless cap-shaped holder carrier in one embodiment of the apparatus according to the present invention. [Figure 21(b)] Figure 21(a) is a top view of the gripping unit. [Figure 22] A schematic representation of an apparatus and method for carrying out the present invention, as currently in use, is shown below. [Figure 23]This is a schematic and simplified diagram showing the timing of subsequent handling of the holder carrier in one embodiment of the apparatus according to the present invention and a modified form of the method according to the present invention. [Figure 24] This is a schematic and simplified diagram of one embodiment of an apparatus according to the present invention, which implements a modified form of the method according to the present invention, wherein the holder carrier is composed of separate segments. [Modes for carrying out the invention]

[0059] Figures 7 and 8 show a simplified schematic representation of one embodiment of the apparatus and method according to the present invention, in a side view and a top view, respectively.

[0060] Inside the vacuum processing chamber 15 is the holder carrier support HCS11 TR However, it remains stationary, or a dashed line and arrow W11 TR As shown, the drive unit 13 drives the vertical axis A11 TR It is rotatably mounted around it. Generally, the processing chamber 15 may be a chamber capable of performing any type of vacuum processing on the surface of the substrate 3. Thus, the vacuum processing chamber 15 may be equipped with the respective equipment (not shown) for performing the desired vacuum process.

[0061] The vacuum processing chamber 15 is equipped with a pumping port 17 for applying a pump 19.

[0062] The vacuum processing chamber 15 communicates with the transfer vacuum chamber 23 via a gate valve 21, and the transfer vacuum chamber 23 communicates directly with the ambient atmosphere AM via a further gate valve 25, or with the ambient atmosphere AM via one or more further vacuum chambers (not shown). The transfer vacuum chamber 23 is equipped with a pumping port 27 for applying a pump 29.

[0063] Therefore, the vacuum transfer chamber 23 actually functions as a load lock chamber with respect to pressure handling.

[0064] Inside the transfer vacuum chamber 23, HCS11 LL A is provided, and in the embodiments shown in Figures 7 and 8, HCS11 LL It remains stationary, as schematically indicated by the 31 “stationary” symbols used throughout the figure.

[0065] HCS11 TR and 11 LL In this embodiment, each of the parallel planes PL TR and PL LL The holder carrier HC5 is adapted to be positioned along the planar PL. If HC5 has a planar extending surface 9 in which the extending surface 7 of the substrate or the extending surface 7 of two or more substrates 3 are freely exposed, TR and PL LL This coincides with the extending surface 9. If HC5 is a rimless cap shape, then the aforementioned planar PL TR and PL LL As shown in Figure 3, the central axis A of the holder carrier 5 HC It is perpendicular to it.

[0066] HCS11 LL A transfer vacuum chamber 23 between the gate valve 21 and the holder carrier HC5 is provided with, for example, a replacement robot, a replacement conveyor 33. The replacement conveyor 33 has a pair of extendable and retractable gripping arms 33a, 33b, each of which is provided with terminal gripping units 35a, 35b, as schematically shown. Each gripping unit 35a, 35b grips the holder carrier HC5, each of which grips the holder carrier support HCS11 when the respective gripping arm is extended. TR and 11 LLThey can be gripped from or released from one of them. As schematically shown, each of the gripping arms 33a, 33b is extendable and retractable in a controllable manner by extension drive units 37a, 37b. The gripping arms 33a, 33b are on the rotation axis A of the exchange conveyor 33. 33 (W3) Perpendicular extension plane PL 33 It is operated to extend and retract along the axis A, as indicated by the double arrow W2. Thus, the gripping arm rotates along axis A. 33 It can be rotated in a controllable and drivable manner around the positioning plane PL TR and P LL A plane PL parallel to it 33 It can be extended and retracted along the plane PL. In particular, the plane PL LL and PL TR If they are not identical, the replacement robot 33 can raise and lower the gripping arms 33a and 33b as schematically shown by arrow W4. Axis A11 TR A11 LL , and A33 may be parallel, and thereby may be oriented vertically. Holder carrier support 11 TR , 11 LL When applied to one of the two, the central axis A of the HC5 to which it is applied HC Each axis A11 TR A11 LL It can be matched with this.

[0067] During operation, the exchange conveyor 33 is moved by one of the gripping arms 33a or 33b to the HCS11 TR The holding carrier HC5 on which one or more substrates 3 processed in the vacuum processing chamber 15 are placed is grasped by the other gripping arm 33b or 33a, and the HCS11 LL The gripping arms 33a and 33b grasp the HC5 on which one or more substrates 3 that have not been processed in the vacuum processing chamber 15 are placed. After being retracted, the gripping arms 33a and 33b rotate along axis A 33 The gripping arm 33a, which is rotated in common around a central point and then extended, and which carries an HC5 having at least one processed substrate 3, moves the HC5 to the HCS11LL The other gripping arm 33b, which is placed on top and holds the HC5 which still has an unprocessed substrate 3, moves the HC5 to the HCS11 TR Place on top. This exchange is performed with the gate valve 21 open, the gate valve 25 closed, and the pressure in the transfer vacuum chamber 23, which acts as a load lock, equal to the processing pressure in the vacuum processing chamber 15. Thus, the vacuum processing chamber 15 is neither vented nor pumped for the subsequent series of HC5 to be processed. This significantly improves the throughput of HC5 with processed substrates. While processing HC5 with substrates 3 in the vacuum processing chamber 15, the pressure in the transfer vacuum chamber 23 is adjusted to the pressure outside the gate valve 25, on the one hand by venting to the ambient atmosphere, for example, and on the other hand to the processing pressure in the vacuum processing chamber 15. Thus, the volume of the transfer vacuum chamber 23 can often be selected to be significantly smaller than the volume of the vacuum processing chamber 15, because processing equipment, such as evaporation sources and sputtering sources, is installed in the vacuum processing chamber 15 for their respective processes. The ventilation and repressurization of the transfer vacuum chamber are performed in a period significantly shorter than the processing period of the holder carrier 5 in the vacuum processing chamber 15, and in a period significantly shorter than the period required for ventilation and repressurization of the vacuum processing chamber 15.

[0068] The handling steps of HC5, and therefore variations of the method according to the present invention, will be explained using the timing diagram in Figure 23.

[0069] To initiate the process, the first HC1 present in the ambient atmosphere AM is transported into the transfer vacuum chamber 23, which functions as a load lock chamber. As indicated by the double arrow p, the pressure in the transfer vacuum chamber 23 is initially increased to a higher pressure, thus reaching the processing pressure p required to process the substrate 3 in the vacuum processing chamber 15. TR It can be lowered to that level.

[0070] Subsequently, HC1 under process pressure p TRThe HC1, having at least one substrate 3, is transferred into the vacuum processing chamber 15 after being pumped down to a certain temperature.

[0071] HC1 processing period T TR During this time, HC2 is transported from the surrounding AM to the transfer vacuum chamber 23. To do this, the transfer vacuum chamber 23 is ventilated, and once the HC2 enters, the processing pressure p TR It is pumped down to that point.

[0072] The processing of HC1 is complete, and the transfer vacuum chamber 23 and the HC2 inside the transfer vacuum chamber 23 reach process pressure p TR At this point, HC1 and HC2 are exchanged by the exchange conveyor 33. This means that HC1, which has the processed substrate 3 in the vacuum processing chamber 15, is replaced by HC2, which has the unprocessed substrate from the transfer vacuum chamber 23, and conversely, HC2, which has the unprocessed substrate in the transfer vacuum chamber 23, is replaced by HC1, which has the processed substrate from the vacuum processing chamber 15.

[0073] The transfer vacuum chamber 23 where HC1 currently exists is under process pressure p TR Air is vented from the vacuum chamber 15, and HC1 is processed during the period T in which HC2 is processed. TR During this time, it is transported towards the surrounding AM.

[0074] The time sequence sustained by the third HC3 will be apparent here to those skilled in the art.

[0075] Therefore, it becomes clear that two or more holder carriers 5, HC1 to HC3 are provided. One is processed in the vacuum processing chamber 15, and the processing period T TRDuring this process, one holder carrier 5 is transported into the transfer vacuum chamber 23 from the periphery toward the transfer vacuum chamber 23, and another holder carrier 5 is transported out of the transfer vacuum chamber 23 toward the periphery. Each holder carrier 5 comprises, as described above, an extending surface 9 and at least one substrate holder 1 along the extending surface 9. Each substrate holder 1 is constructed to hold the extending surface 7 of the substrate 3 to be processed, which is placed within the substrate holder, so that it is freely exposed to the periphery along the extending surface 9 of the holder carrier 5. The extending surface 9 of each holder carrier 5 is aligned with the central axis A of the holder carrier 5. HC It extends around the 5, and this axis is oriented laterally with respect to the extending surface 9 of the holder carrier 5.

[0076] The vacuum processing chamber 15 is constructed to process at least one substrate 3 on one of the holder carriers 5. Therefore, the holder carriers 5 may be introduced into the vacuum processing chamber 15, processed within the vacuum processing chamber 15, and removed from the vacuum processing chamber 15 only one at a time in succession.

[0077] At a time, at least one substrate 3 on one of the holder carriers 5 is processed in the vacuum processing chamber 15. This step is shown in Figure 23(a). This brings the processed substrate 3 onto one of the holder carriers 5 in the vacuum processing chamber 15. The processing in the vacuum processing chamber 15 is performed under a process pressure p selected according to the desired processing process of the substrate in the vacuum processing chamber 15. TR The process is carried out over a processing period of T. TR It will continue for a certain period of time.

[0078] Processing period T TR Inside, one of the holder carriers 5, each having at least one processed substrate 3, is transported by a conveyor 26 through a gate valve 25, according to embodiments of Figures 7 and 8, from the transfer vacuum chamber 23 toward the surroundings AM. This allows the processing vacuum chamber 23 to be vented toward a higher pressure. This step is shown in (b1) in Figure 23.

[0079] According to the embodiments of Figures 7 and 8, the period T is still TR Inside, a holder carrier 5 containing at least one unprocessed substrate 3 is transported into the transfer vacuum chamber 23 by a conveyor 26 through a gate valve 25. When the gate valve 25 is closed, the transfer vacuum chamber 23 is subjected to a processing pressure p TR The system is pumped down to this point. This step is shown in Figure 23(b2).

[0080] After processing at least one substrate on one holder carrier 5 within the vacuum processing chamber 15, this holder carrier 5 with the processed substrate 3 is replaced via a gate valve 21 with a holder carrier 5 with an unprocessed substrate 3 from the transfer vacuum chamber 23. Conversely, within the transfer vacuum chamber 23, one holder carrier 5 with an unprocessed substrate 3 is replaced via a gate valve 21 with a holder carrier 5 with a processed substrate 3 from the vacuum processing chamber 15. This step is carried out by an exchange conveyor 33, as shown in Figure 23(c).

[0081] These steps are repeated, namely, one holder carrier is processed, during the processing time the processed holder carrier is replaced with an unprocessed holder carrier in the transfer vacuum chamber 23, and after processing the processed holder carrier in the vacuum processing chamber 15 is replaced with an unprocessed holder carrier from the transfer vacuum chamber 23, and vice versa.

[0082] In the apparatus and method according to the present invention, it becomes clear that the processing process in the vacuum processing chamber 15 is interrupted only for the replacement of HC5 in step (c). The available period T for processing the substrate in the vacuum processing chamber 15 TR Therefore, the process pressure is maintained within the vacuum processing chamber 15 even during the HC5 exchange in step c) and is not reduced by any pumping or aeration period.

[0083] This significantly improves the throughput of processed substrates.

[0084] As can be seen in Figure 23, when the time intervals for steps (b1) and (b2) are appropriately adjusted, for example, by shortening the time intervals for handling HC1 and HC3, a processed substrate on one HC can be exchanged for an unprocessed substrate on the same HC in the ambient atmosphere AM. For example, since HC1 reaches the ambient atmosphere AM with the processed substrate before HC3 leaves the ambient atmosphere AM with the unprocessed substrate, HC1 can be used as HC3 after the processed substrate has been exchanged for the unprocessed substrate.

[0085] Therefore, as is currently implemented, removing a processed substrate from one of the holder carriers 5 and loading an unprocessed substrate into one of the holder carriers 5 may be performed in an ambient atmosphere, and / or removing a processed substrate from one holder carrier and loading an unprocessed substrate may be performed in the same holder carrier 5. Loading and removing substrates 3 in an ambient atmosphere AM may be performed manually in some cases, but may also be performed by a robot as shown in 63 of Figure 16, as is currently implemented.

[0086] Regarding the implementation of the exchange conveyor 33, the following considerations take priority. - The swivel radius R (see Figure 7) of the outermost parts of both HC5s that have passed through the gate valve 21 should be as small as possible to minimize the range of the gate valve 21. Therefore, the two gripping arms 33a and 33b are retractable after gripping the HC5s, respectively, by extension drive units 37a and 37b, and each HC5 is moved to the respective HCS11 TR , 11 LL It is expandable for placement on top. In addition, in order to minimize the range of the gate valve 21, the larger of the two minimum strokes (retracted position) of the two gripping arms 33a and 33b should be as small as possible. -The gripping stroke of the two gripping arms 33a and 33b is within the HCS11 in the transfer vacuum chamber 23. LL To grasp / place HC5 from / on top of and HCS11 in vacuum processing chamber 15 TR It may be equal to gripping / placing HC5 from / to. This is HCS11 LL and HCS11 TR Rotation axis A of the replacement conveyor 33 33 It is necessary to position it with high precision at an equidistant distance from the object. HCS11 LL HCS11 TR Rotation axis A 33 The former is to minimize the volume of the vacuum transfer chamber 23, and the latter is often determined by the type of process carried out in the vacuum processing chamber 15, which can be difficult to achieve due to structural tolerances and is therefore undesirable in practice. Accordingly, in one embodiment of the present invention, the extension / retraction of the gripping arms 33a and 33b are controlled independently of each other by extension drive units 37a and 37b.

[0087] The most suitable replacement conveyor to meet the requirements of the replacement conveyor 33 is one having frog-leg type gripping arms 33a and 33b.

[0088] An example is schematically shown in Figure 9. The exchange conveyor 33 comprises two opposing gripping arms 33a and 33b, realized as frog-leg type arms with controlled electric motors 41 for controlling the relative angles of the frog legs 39. The strokes of the gripping arms 33a and 33b may be individually controlled by appropriate control of the electric motors 41. In Figure 9, the typical position of gripping arm 33a is the retracted position shown by the solid line. The gripping arm 33a carries the HC5 by the graphically shown gripping unit 35a. The gripping arm 33a is shown in the extended position by the dashed line. To show the independence of stroke control in the two gripping arms 35a and 35b, these frog legs 39 of gripping arm 35b are shown by solid lines in the typical position, i.e., the extended position, while the position of these legs 39 in the retracted minimum stroke position is shown by the dashed line.

[0089] A second example currently used in carrying out the present invention is shown in Figures 10a) to 10c). Here again, despite the fact that the same frog legs 39 are used to realize one of the gripping arms, then two gripping arms, it can be said that the exchange conveyor 33 comprises two gripping arms 35a and 35b. This is evident from Figure 10.

[0090] In Figure 10a), it can be said that both gripping arms 33a, 33b (see also Figure 10b) are in the minimum stroke position. The two pairs of frog legs 39 are coupled via their respective electric motors 41 to reference blocks 43a and 43b, which can alternately block in a stationary position relative to the rotating part of the exchange conveyor 33. This is most schematically shown in Figure 11 by mechanically connecting one or the other of the reference blocks 43 to the rotating part 45 of the exchange conveyor 33. The mechanical links are illustrated by switch symbols 47.

[0091] Returning to Figure 10, in order to extend the gripping arm 35a as shown in Figure 10b, the reference block 43a is blocked against the rotating part 45 of the exchange conveyor 33. According to the schematic diagram in Figure 11, the mechanical connection switch 47 is in the right position. The gripping arm 33b is in the retracted position. Conversely, in order to extend the gripping arm 33b, the reference block 47b is mechanically blocked against the rotating part 45 of the exchange conveyor 33.

[0092] In this type of interchangeable conveyor, which is best suited to realizing the present invention, one of the gripping arms 33a, 33b can only be extended when the other gripping arm 33b or 33a is fully retracted. Such a conveyor, adapted to the specific needs of the present invention, is known as "bisymmetric" and is commercially available from Brooks Vacuum Robots.

[0093] Figures 12 to 14 show one embodiment of the gripping units 35a and 35b currently in use. As will be entirely obvious to those skilled in the art, other realizations of the gripping units 35a and 35b are possible, for example, by magnetically gripping and releasing the holder carrier HC5, or by other types of mechanical gripping and releasing.

[0094] Figures 12 and 13 show schematic and simplified gripping units 35a and 35b for HC5, respectively, where HC5 is rectangular in the top view (Figure 13) and flat in the cross-sectional view (Figure 12).

[0095] Projection 49 v and 49 b It is attached to or integrated with HC5, and is located on the extended plane PL of the gripping arms 33a, 33b of the exchange conveyor 33. 33 They extend parallel to each other. The gripping units 35a and 35b are realized by protruding gripping pins 51v and 51b that are aligned with bores 53v and 53b within their respective protrusions 49v and 49b.

[0096] By extending and retracting the gripping arms 33a and 33b, respectively, the gripping pins 51v and 51b are simultaneously introduced into or withdrawn from the bores 53v and 53b. As shown in the figure, three projections 49v and 49b are provided distributed along the periphery of the HC5, for example, one projection 49v is at the far end of the HC5 when viewed in the direction of extension of the gripping arm 33a or 33b, and the two projections are at the near end of the HC5 when viewed in the aforementioned direction. By providing a three-point grip of the HC5a in particular as shown in Figure 13, stable and clear positioning of the HC5 is achieved once it is gripped. The HC5 is then placed in HCS11 TR Or HCS11 LL Each lifts up from the respective holding carrier support HCS11. TR Or HCS11 LLTo place it on top, the exchange conveyor 33 rotates on axis A as indicated by arrow W4 in Figure 12, with gripping arms 33a and 33b. 33 The gripping pins 51v, 51b may be controllably raised and lowered in the direction of the gripping arms 33a, 33b, or the arrangement of all gripping pins 51v, 51b may be controllably raised and lowered relative to the gripping arms 33a, 33b (not shown). This is because the commercially available conveyor itself has the gripping arms 33a, 33b on the rotation axis A of the conveyor 33. 33 This is particularly suitable when it does not provide the ability to raise or lower in that direction.

[0097] Figure 14 shows a rimless cap-shaped HC5 adjusted to be gripped in exactly the same way as the rectangular HC5 shown in Figures 12 and 13. The bores 53v and 53b may be provided directly on the HC5.

[0098] Contrary to the representations in Figures 12 to 14, it is clear that gripping pins 51v, 51b or parts thereof may be attached to HC5, and bores 53v, 53b or parts thereof may be attached to gripping units 35a, 35b.

[0099] To ensure proper centering of the HS5 relative to the gripping pin, bores 53v and 53b may be tapered as shown in Figure 15.

[0100] As schematically shown in Figure 16, the transfer vacuum chamber 23 communicates with a series of one or more further vacuum chambers 55, the vacuum chambers 55 of which contain at least HCS11 LL The system may also include a holder carrier support 57 and a replacement conveyor 59, respectively, constructed similarly to the replacement conveyor 33, for handling the HS5. For example, processing time T in the vacuum processing chamber 15 TR If the time T is too short, TRTo vent and pump the transfer vacuum chamber 23 and replace the HC5 through the gate valve 25, two or more transfer vacuum chambers 23 can be installed in series, each acting as a load lock, as described in Patent Document 1 of the same applicant as this application. Additional vacuum chambers 55 may further be pre-treatment chambers for the HC5, such as a heating chamber, etching chamber, or layer deposition chamber. Note that this allows for some pre-treatment of the HC5, such as preheating with a heating lamp (not shown), even within the transfer vacuum chamber 23. In embodiments such as that shown in Figure 16, the pre-treatment chambers 55 are typically deactivated when the HC5 is returned to the ambient atmosphere through these chambers along with the processed substrate.

[0101] Therefore, the input of HC5 to the entire apparatus and the output of HC5 from the entire apparatus are either directly from the ambient atmosphere AM through gate valve 25, which acts as an input / output gate valve, or through a downstream gate valve as shown by reference numeral 61 in Figure 16.

[0102] Unprocessed substrates 3 are loaded into HC5 and each SH1 above it, and processed substrates 3 are removed by hand or by a loading / removal robot 63 in ambient atmosphere AM, as schematically shown in Figure 16.

[0103] Since the loading / unloading robot 63 operates in the ambient atmosphere, it can be adjusted to accommodate the highly complex three-dimensional gripping and placement operations of the substrate 3 relative to the HC5.

[0104] Figure 17 shows further possible structures of the apparatus according to the present invention. Since pre-treatment before processing in the vacuum processing chamber 15 may differ from post-treatment after processing in the vacuum processing chamber 15, HC5 that still has an untreated substrate in the vacuum processing chamber 15 may be moved to one or more pre-treatment chambers 55 from the surrounding area. IN One gate valve 25 of the transfer vacuum chamber 23 INThe HC5 that is conveyed to and processed in the vacuum processing chamber 15 is passed through the gate valve 25 OUT and one or more post-processing chambers 55 OUT and conveyed to the ambient atmosphere AM.

[0105] A further overall structure of the device according to the invention, which can be combined with one of the structures described in connection with FIG. 16 or FIG. 17, is schematically shown in FIG. 18. Here, one transfer vacuum chamber 23 exchanges HC5 with two or more vacuum processing chambers 15, and in FIG. 18, two such chambers 15A and 15B are shown. This enables the HC5 input through the gate valve 25 to be distributed to one vacuum processing chamber, for example 15A, and then another HC5 to be distributed to another vacuum processing chamber, for example 15B, or one of the HC5s to be delivered first to one vacuum processing chamber, for example 15A, and then to another vacuum processing chamber, for example 15B, looped through the transfer vacuum chamber 23, and delivered before such HC5 leaves the transfer vacuum chamber 23 through the gate valve 25.

[0106] So far, the device and method according to the invention have been described, where a complete holder carrier HC5 is handled as one part. Such HC5 can be very large and heavy, for example, an edge-less cap-shaped HC5 for a vacuum processing chamber 15 that performs vapor deposition coating of a substrate on the edge-less cap-shaped HC5.

[0107] Therefore, in one embodiment of the device and method according to the currently implemented invention, the holder carrier HC5 is subdivided into a plurality of holder carrier segments HC Se The HC5 having the carrier segment HC Se is handled in the same way as the HC5 described so far. The above-described exchange step c) is performed for each segment. The segment can carry one, two, or a number of substrate holders SH1, and the segment can also be a dummy segment without SH1.

[0108] Holder carrier support 11 LL and 11 TR is realized as a frame structure, on which HC Se can be placed, from which, as described for handling a complete single part HC5, they can be taken out by the exchange conveyor 33 having gripping arms 33a, 33b, gripping units 35a, 35b.

[0109] Handling of a single part HC5 and HC Se The only general difference between the handling of HC5 composed of and the handling of HC LL and 11 TR is that in each of the transfer vacuum chamber 23 and the vacuum treatment chamber 15, both holder carrier supports HCS11 TR and 11 LL must be rotatable in a step - controllable manner around their respective axes A,

[0110] FIG. 19 schematically shows in perspective view a holder carrier sector HC Se 65 of a rectangular HC5 having a number of substrates 3. Features already described in connection with FIGS. 1 - 18 are treated with the same reference numerals and are additionally described only when differences have to be pointed out.

[0111] Holder carrier support HCS11 LL and 11 TR is realized by a two - dimensional frame structure 67, on which a triangular plane HC Se 65 is placed and removed therefrom. Note that even if the aforementioned HC Se 65 of the rectangular HC5 are not equal, the geometric arrangements for different HC Se 65 may be equal in order to grip and release the respective unequal HC Se 65 by the gripping pins 51v, 51b and bores 53v, 53b as described above. Both HCS11 LL and 11 TR are both, around their respective axes A11 TR 、A11LL It can be rotated in steps in a controllable manner around the center. HCS11 LL Please note the rotating support step drive unit 69, which is shown as a dashed line in Figure 8.

[0112] Figure 24 schematically shows one embodiment of the apparatus according to the present invention, which operates with segmented HC5.

[0113] In this case as well, we will not mention the parts that have already been described, and they will have the same reference numerals as in the figures described so far. The HCS 11 supports segments 65 of each HC5 in order to exchange the untreated substrate for the treated substrate through the open gate valve 21. TR and 11 LL The segments 65 of the HC5 above are replaced segment by segment by the replacement conveyor 33.

[0114] To do so, HCS11 TR and 11 LL Axis A HC Only the angle β that matches the angle range β of segment 65 for each axis A11 LL and A11 TR It is rotated in steps around it. HCS11 by angle β TR and 11 LL The stepwise rotation is driven by one or two rotary drive units 69.

[0115] The opening and closing of gate valves 21 and 25, the operation of pump 29 to the transfer vacuum chamber 23, and the operation of exchange conveyor 33 and conveyor 26 are controlled by timing unit 85 to operate in common, as described above, for example in relation to Figure 23, in addition to other operations of the entire apparatus according to the present invention.

[0116] Furthermore, if HC5 is a single component as described above, note that the timing unit 85 controls the aforementioned common operation.

[0117] Therefore, HCS11 TR Axis A11TR The HC5 may rotate in different ways, that is, on the one hand, continuously to carry out a processing process, and on the other hand, it may rotate in steps if the HC5 is constructed by segment 65. HCS11 LL In reality, HC5 is constructed by segment 65 and, if otherwise stationary, is simply rotated in angular steps.

[0118] Figure 20 shows the HC5 for the brimless hat shape. Se 65 and HCS11 LL and 11 TR Each of the frame structures 73 is shown in a schematic perspective view. In this case as well, the same reference numerals are used for features already described, and additional explanations are given only when it is necessary to point out differences.

[0119] Figures 21a) and 21b) show, respectively, the edgeless cap-shaped segment HC. Se A schematic and simplified side view (Figure 21a) and top view (Figure 21b) show one embodiment of the gripping units 35a and 35b for 65, which are functionally similar to the gripping units 35a and 35b shown in Figures 12 and 13 for integrated HC5 handling. The central arm 52, also shown in Figures 12 and 13, is used in this embodiment for HC Se It is bent according to the outer shape of 65 and carries the gripping pin 51v. The lateral arm 54 is similarly HC Se They are shaped according to the external shape of 65 and each carries a gripping pin 51b.

[0120] Figure 22 schematically shows one embodiment of an apparatus according to the present invention that implements the method according to the present invention as currently being carried out.

[0121] According to Figure 22, the vacuum processing chamber 15 is a vapor deposition coating chamber. Holder carrier support HCS11 TR This is realized as a frame structure 73 as schematically shown in Figure 20, and on top of that, as also shown in Figure 20, HC Se65 may be applied and removed. HCS11 of rimless cap-shaped frame structure TR The rotation axis A11 is oriented vertically. TR The central axis A coincides with this. HC Controllable rotation around (W11 TR ) The evaporation source 75, for example, an electron beam evaporation source or a thermal evaporation source, is HCS11 TR It is positioned at the bottom and center in the vertical direction. Therefore, the extending surface 7 of the substrate (not shown) is located on a separate HC as shown in Figure 20. Se The holder carrier HC5, which is realized by or composed of 65, is freely exposed to the evaporation source 75 along its lower extending surface. The vacuum processing chamber 15, in which case the evaporation chamber is in communication with the transfer vacuum chamber 23 via a gate valve 21.

[0122] The holder carrier 5, consisting of separate rimless cap-shaped segments 65, is transported to the transfer vacuum chamber 23 via the gate valve 25 and removed from the transfer vacuum chamber 23. HCS11 LL The rotating axis is A11 LL The vertical central axis A coincides with this. HC Controllable and rotatable in steps around the axis (W11 LL The processed substrates 3 are removed from the holder carrier 5, which is output via the gate valve 25, and are replaced by unprocessed substrates 3 in the ambient atmosphere AM. This is done by a loading / unloading robot 63 that handles the substrates between a set of cassettes 77 and HC5.

[0123] As shown by the dashed line in Figure 22, HC Se The loading and unloading of 65, and therefore HC5, is carried out under the transfer vacuum chamber 23. HCS11 with HC5 LL Therefore, the HC having an untreated substrate 3 Se 65 is lowered out of the transfer vacuum chamber 23 via the gate valve 25 (W79), and HC5 with the replaced unprocessed substrate 3 is lifted into the transfer vacuum chamber 23 by a vertical movement drive unit 79 having a rod 83.

[0124] The gate valve 25 is realized by a valve plate 81 mounted horizontally to the rod 83, that is, parallel to the outer surface of the bottom wall of the transfer vacuum chamber 23.

[0125] In its uppermost position, the valve plate 81 seals the transfer vacuum chamber as schematically shown by the seal 84.

[0126] The exchange conveyor 33 is HCS11, as shown by the solid line. TR and HCS located above LL Between HC Se 65 is replaced. The replacement conveyor 33 is implemented by the conveyor type as shown with reference to Figures 10 and 11, and the gripping unit is implemented as schematically shown and described with reference to Figure 21.

[0127] The operation of the device follows the sequence shown in Figure 23 and described in relation to Figure 23. The exchange step (c) shown in Figure 23 is performed as follows: a) Both axes A11 LL and A11 TR The retracted gripping arms 33a and 33b, which are aligned and in the retracted position as shown in Figure 10a, are rotated. b) For example, by extending the gripping arm 33a (see Figure 10b) and using the gripping unit 35a realized as shown in Figure 21, the HCS11 has a substrate 3 that is realized and processed, i.e., vapor-deposited coated, as shown in Figure 20. TR From one HC Se Grasp 65. Gripping unit 35a to shaft A11 TR Slightly lift it in that direction and retract the gripping arm 33a (Figure 10a). The gripping arm 33b (Figure 10c) is extended and the gripping unit 35b, which is realized as shown in Figure 21, is realized as shown in Figure 20, and the HCS11 has an unprocessed substrate 3. LL From one HC Se65 is grasped. The gripping unit 35b is placed on axis A11 LL Slightly lift it in that direction and retract the gripping arm 33b (Figure 10a). c) Gripping arms 33a and 33b on both axes A11 LL and A11 TR Conversely, at the aligned position, rotation axis A 33 Rotate 180° around the center. d) Extend one of the gripping arms, for example 33a, and position the gripping arm on axis A 33 By slightly lowering them in that direction, the gripping pins 51v and 51b are released from the bores 53v and 53b, thereby allowing the EC having the processed substrate 3 to be opened. Se 65 to HCS11 LL Place it on top. Retract the now-empty gripping arm 33a. e) Extend the gripping arm 33b and position the gripping arm on axis A 33 By slightly lowering them in that direction, the gripping pins 51v and 51b are released from the bores 53v and 53b, thereby EC having the unprocessed substrate 3 Se 65 to HCS11 TR Place it on top. Retract the now-empty gripping arm 33b. f) HCS11 TR and HCS11 LL Rotate it by an angular step of angle β, g) HCS11 inside the vacuum processing chamber 15 TR All HCs supporting the processed substrate 3 above Se 65 is the HC that supports the unprocessed substrate 3 from the transfer vacuum chamber 23. Se Replace 65 with HCS11 LL Repeat steps a) to f) until the part is replaced.

[0128] moreover: During the evaporation process in the vacuum processing chamber 15, the HC5 containing the processed substrate is transported from the transfer vacuum chamber 23 to the ambient atmosphere, removed, and then an unprocessed substrate is reloaded and transported back into the transfer vacuum chamber 23, ready for exchange with the HC5 containing the processed substrate from the vacuum processing chamber 15.

[0129] The vacuum processing chamber 15 is not vented until all substrates have been processed, if necessary.

[0130] HC Se 65 does not need to carry the same number of SH1s. For example, for a small batch of substrates, dummy HC Se Introducing 71, that is, not using SH1, or one HC in part of each HCS Se It has only 65, and the other parts have HC Se To provide an HC5 that does not have 65, or, for example, two HCs each supporting one large substrate Se It is possible to offer only 65, for example. [Explanation of Symbols]

[0131] 1 substrate holder, 3 substrate, 5 holder carrier, 7 extended surface, 9 extended surface, 11 holder carrier support, 11 LL Second holder carrier support, 11 TR First holder carrier support, 15 Vacuum processing chamber, 17 Pumping port, 19 Pump, 21 First gate valve, 23 Transfer vacuum chamber, 25 Second gate valve, 26 Further conveyor, 27 Pumping port, 29 Pump, 33 Replacement conveyor, 33a Gripping arm, 33b Gripping arm, 35a Gripping unit, 35b Gripping unit, 37a Extension drive unit, 37b Extension drive unit, 39 Frog leg, 41 Electric motor, 43 Reference block, 43a Reference block, 43b Reference block, 45 Rotating part, 47 Mechanical connection switch, 49 b protrusion, 49 v Protruding part, 51b Gripping pin, 51v Gripping pin, 52 Central arm, 53b Bore, 53v Bore, 54 Side arm, 55 IN Pre-processing chamber, 55 OUT Post-processing chamber, 57 holder carrier support, 59 exchange conveyor, 63 loading / unloading conveyor, 65 separate segment, 67 frame structure, 69 rotary support step drive unit, 71 dummy HC Se73 Frame structure, 75 Evaporation source, 77 Cassette, 79 Vertical movement drive unit, 81 Valve plate, 83 Rod, 84 Seal, 85 Timing unit

Claims

1. - At least one substrate holder (1) positioned along the extending surface (9) of at least one holder carrier (5), wherein the substrate holder (1) is configured to hold the extending surface (7) of a substrate (3) placed in the substrate holder (1) so as to be freely exposed to the surroundings along the extending surface (9) of the holder carrier (5), and the extending surface (9) of the holder carrier (5) is oriented laterally to the central axis (A) of the holder carrier (5) ＨＣ ) extending around, at least one substrate holder (1), - At least one vacuum processing chamber (15) communicating with a transfer vacuum chamber (23) via a first gate valve (21), Equipped with, - The vacuum processing chamber (15) is configured to support a first holder carrier support (11) ＴＲ ) equipped, - The transfer vacuum chamber (23) is, - Pumping port (27), - A second holder carrier support (11) configured to support one holder carrier (5) ＬＬ )and, - The first gate valve (21) and the second holder carrier support (11 ＬＬ A replacement conveyor (33) between the first gate valve (21) and the first holder carrier support (11 ＴＲ ) and the first holder carrier support (11 ＴＲ The holder carrier (5) is grasped and released on the second holder carrier support (11 ＬＬ ) and the second holder carrier support (11 ＬＬ A replacement conveyor (33) is configured to grip and release the holder carrier (5) on each of the following surfaces, - At least one second gate valve (25) communicating with the ambient atmosphere (AM), ・ the second holder carrier support (11 ＬＬ ) and / or from the second holder carrier support (11 ＬＬ ) onto the holder carrier (5) through the at least one second gate valve (25), further comprising a conveyor (26) configured to convey the holder carrier (5), a vacuum processing apparatus.

2. The separate holder carrier (5) comprises at least two separate segments (65), and the exchange conveyor (33) comprises the first holder carrier support (11 ＴＲ ) and the first holder carrier support (11 ＴＲ ) on which one of the separate segments (65) is grasped and released, and the second holder carrier support (11 ＬＬ ) and the second holder carrier support (11 ＬＬ The vacuum apparatus according to claim 1, configured to grip and release one of the separate segments (65) on each of the above.

3. The first holder carrier support (11 ＴＲ The vacuum apparatus according to claim 2, further comprising a frame support structure for the separate segment (65).

4. The vacuum apparatus according to any one of claims 1 to 3, wherein the extending surface (9) of the holder carrier (5) is one of a flat surface, a convex surface, or a concave surface.

5. The vacuum apparatus according to any one of claims 1 to 4, wherein the extending surface (9) of the holder carrier (5) is concave and has a rimless cap shape.

6. The vacuum apparatus according to any one of claims 1 to 5, wherein the extending surface (9) of the holder carrier (5) is concave or convex and is formed by planar sectors.

7. The first holder carrier support (11 ＴＲ ) is the central axis (A11) of the first holder carrier support (11 TR). ＴＲ The vacuum apparatus according to any one of claims 1 to 6, which is controllably rotatable around ).

8. The separate holder carrier (5) comprises at least two separate segments (65), and the exchange conveyor (33) comprises the first holder carrier support (11 ＴＲ ) and the first holder carrier support (11 ＴＲ ) on which one of the separate segments (65) is grasped and released, and the second holder carrier support (11 ＬＬ ) and the second holder carrier support (11 ＬＬ Each of the separate segments (65) is configured to grip and release on the first holder carrier support (11 ＴＲ ) and the second holder carrier support (11 ＬＬ ) is driven by at least one step drive unit in angular steps by each holder central axis (A11 ＴＲ A11 ＬＬ The vacuum apparatus according to any one of claims 1 to 7, which is rotatable around ).

9. The first holder carrier support (11 ＴＲ ) and the second holder carrier support (11 ＬＬ Each of the ) is the holder central axis (A11 ＴＲ A11 ＬＬ ) has the holder central axis (A11 ＴＲ A11 ＬＬ The vacuum apparatus according to any one of claims 1 to 8, wherein the elements are parallel to each other.

10. The first holder carrier support (11 ＴＲ ) one of the holder carriers (5) on the central axis (A ＨＣ ) and the second holder carrier support (11 ＬＬ ) one of the holder carriers (5) on the central axis (A ＨＣ ) are, respectively, the holder central axis (A11 ＴＲ A11 ＬＬ A vacuum apparatus according to claim 9, which matches the one described above.

11. The first holder carrier support (11 ＴＲ ) one of the holder carriers (5) on the central axis (A ＨＣ ) and the second holder carrier support (11 ＬＬ ) one of the holder carriers (5) on the central axis (A ＨＣ The vacuum apparatus according to any one of claims 1 to 10, wherein the elements are parallel to each other.

12. The vacuum apparatus according to claim 11, wherein the central axis is vertical.

13. The exchange conveyor (33) is the first holder carrier support (11 ＴＲ ) and the second holder carrier support (11 ＬＬ ) the central axis (A ＨＣ The vacuum apparatus according to claim 11 or 12, configured to transport the holder carrier (5) perpendicular to the ).

14. The vacuum apparatus according to any one of claims 1 to 13, wherein the exchange conveyor (33) is extendable and retractable with respect to the rotation axis (A33) of the exchange conveyor (33) and comprises at least two gripping arms (33a, 33b) which are rotatably controlled in common around the rotation axis (A33) by a rotation drive unit, and each of the gripping arms (33a, 33b) comprises a gripping unit (35a, 35b) configured to controllably grip and release a holder carrier.

15. The first holder carrier support (11 ＴＲ ) one of the holder carriers (5) on the central axis (A ＨＣ ) and the second holder carrier support (11 ＬＬ ) one of the holder carriers (5) on the central axis (A ＨＣ The vacuum apparatus according to claim 14, wherein the and the rotation axis are parallel to each other.

16. The vacuum apparatus according to claim 14 or 15, wherein the gripping arms (33a, 33b) are extendable and retractable in a manner that can be controlled independently of each other.

17. The vacuum apparatus according to any one of claims 14 to 16, wherein each of the gripping arms (33a, 33b) is retractable and extendable only when the other gripping arm is retracted.

18. The vacuum apparatus according to any one of claims 14 to 17, wherein the gripping units (35a, 35b) grip and release the holder carrier (5), or the separate holder carrier comprises at least two separate segments (65), and the gripping units grip and release the segments (65) of the holder carrier (5) by pin (51v, 51b) and bore or slot (53v, 53b) links.

19. The vacuum apparatus according to claim 18, wherein the pin and bore link are established and released by the relative motion of the radial pin (51v, 51b) and bore (53v, 53b) with respect to the axis of rotation.

20. The vacuum apparatus according to any one of claims 1 to 19, wherein the second gate valve (25) is located in the bottom wall of the transfer vacuum chamber (23), and the further conveyor (26) is driven to and from the bottom wall and comprises a controllably driven elevator carrying a valve plate (81) oriented parallel to the bottom wall, the valve plate (81) sealing the transfer vacuum chamber when the elevator is in the position closest to the bottom wall.

21. The vacuum apparatus comprises at least two of the second gate valves (25), and the further conveyor (26) comprises the second holder carrier support (11 ＬＬ ) transports the holder carrier (5) through one of the at least two second gate valves (25) and the second holder carrier support (11) through the other of the at least two second gate valves. ＬＬ The vacuum apparatus according to any one of claims 1 to 20, configured to transport a holder carrier (5) on a )

22. The further conveyor (26) carries the holder carrier (5) through one of the at least one second gate valve (25) to the second holder carrier support (11 ＬＬ ) and the second holder carrier support (11 ＬＬ The vacuum apparatus according to any one of claims 1 to 21, configured to transport by reciprocating to ).

23. The vacuum apparatus according to any one of claims 1 to 22, wherein the holder carrier (5) comprises at least two of the substrate holders (1) or a plurality of the substrate holders (1).

24. The vacuum apparatus according to any one of claims 1 to 23, wherein the at least one substrate holder is either inseparable from the holder carrier (5) or is a separate component that can be separated from the holder carrier (5).

25. The exchange conveyor (33) comprises at least two expandable and retractable gripping arms (33a, 33b) that are expandable and retractable with respect to the rotation axis (A33) of the exchange conveyor (33) and are rotatable in a commonly controllable manner around the rotation axis (A33) by a rotation drive unit, wherein the gripping arms (33a, 33b) are connected to the first holder carrier support (11) through the first gate valve (21). ＴＲ ) and the first holder carrier support (11 ＴＲ On the second holder carrier support (11 ＬＬ ) and the second holder carrier support (11 ＬＬ The vacuum apparatus according to any one of claims 1 to 24, wherein the holder carrier (5) is gripped on the surface and has a stroke for releasing each of them.

26. The vacuum processing apparatus according to claim 25, wherein the gripping arms (33a, 33b) are frog-leg shaped arms.

27. The vacuum apparatus according to claim 26, wherein both gripping arms consist of the same frog legs (39).

28. The vacuum apparatus according to any one of claims 25 to 27, wherein only one of the gripping arms (33a, 33b) can be extended at a time.

29. The vacuum apparatus according to any one of claims 1 to 28, comprising a loading / unloading conveyor (63) in an ambient atmosphere, configured to load a substrate (3) into the at least one substrate holder (1) and to unload the substrate (3) from the at least one substrate holder (1).

30. Controlling at least the operation of the further conveyor (26) and the second gate valve (25), and the second holder carrier support (11) during the processing operation of the vacuum processing chamber (15). ＬＬ The vacuum apparatus according to any one of claims 1 to 29, further comprising a timing unit (85) configured to control the operation of the further conveyor (26) in order to replace the holder carrier (5) on the above.

31. a) The vacuum processing chamber (15) is a deposition coating chamber and is equipped with at least one evaporator source (75), b) The holder carrier (5) comprises at least two separate segments (65) and has a brimless cap shape, c) The first holder carrier support (11 ＴＲ ) and the second holder carrier support (11 ＬＬ ) has a rimless cap-shaped frame, and each axis (A11 ＴＲ A11 ＬＬ The vacuum apparatus according to any one of claims 1 to 30, which is controllably rotatable around ).

32. A holder carrier (5) adapted for use in an apparatus according to any one of claims 1 to 31, wherein the holder carrier (5) is constructed to hold the extending surfaces (7) of at least two substrates (3) applied to the holder carrier (5) so as to be freely exposed to the periphery along the extending surface (9) of the holder carrier (5), the extending surface (9) of the holder carrier (5) has a central axis (A) oriented laterally with respect to the extending surface (9) of the holder carrier (5) ＨＣ The holder carrier (5) extends around the holder carrier (5), and comprises at least two separate segments (65) which can be assembled and disassembled to give rise to the holder carrier (5).

33. The holder carrier according to claim 32, having a brimless cap shape.

34. A method for manufacturing a vacuum-treated substrate, - A step of providing two or more holder carriers (5), each of the holder carriers (5) comprising an extending surface (9) and at least one substrate holder (1) along the extending surface (9), wherein the at least one substrate holder (1) is constructed to hold the extending surface (7) of a substrate (3) placed in the substrate holder (1) so as to be freely exposed to the periphery along the extending surface (9) of the holder carrier (5), and the extending surface (9) of the holder carrier (5) is oriented laterally to the central axis (A) of the holder carrier (5) ＨＣ Steps extending around ) - Providing at least one vacuum processing chamber (15) constructed to process the at least one substrate (3) on one of the holder carriers (5), - A step of providing a transfer vacuum chamber (23) connected to the at least one vacuum processing chamber (15) via a gate valve (21), a) A step of processing the substrate (3) on one of the holder carriers (5) at once in the vacuum processing chamber (15) to bring the processed substrate (3) onto the one holder carrier (5), thereby performing the processing at the process pressure in the vacuum processing chamber (15), wherein the processing is performed for a processing period (T ＴＲ ) continues for the duration of the step, b) The processing period (T ＴＲ ) inside, b1) A step of transporting one of the holder carriers (5) having a previously processed substrate out of the transfer vacuum chamber (23) toward the surroundings, thereby ventilating the transfer vacuum chamber, b2) One of the holder carriers (5) having an unprocessed substrate (3) is transported from the surroundings into the transfer vacuum chamber (23), and process pressure (p ＴＲ ) Steps to establish c) After the above processing, in the vacuum processing chamber (15), the holder carrier (5) having the processed substrate (3) is replaced by the holder carrier (5) having the processed substrate (3) from the transfer vacuum chamber (23) through the gate valve (21), and in the transfer vacuum chamber (23), the holder carrier (5) having the processed substrate (3) is replaced by the holder carrier (5) having the processed substrate (3) from the vacuum processing chamber (15) through the gate valve (21), and d) A step that repeats steps a) to c), The steps to implement, Methods that include...

35. The method according to claim 34, comprising the steps of removing at least one processed substrate from one of the holder carriers (5) and loading at least one unprocessed substrate into one of the holder carriers (5), performed in an ambient atmosphere.

36. The method according to claim 34 or 35, wherein at least one processed substrate is removed from one holder carrier (5), and at least one unprocessed substrate is loaded into the same holder carrier (5).

37. The method according to any one of claims 34 to 36, wherein each of the holder carriers (5) is constructed by at least two separate segments (65), and at least one of the segments comprises at least one substrate holder (1), and step c) is carried out by replacing the segments (65).

38. The method according to claim 37, wherein the exchange is performed by repeatedly exchanging one segment (65) at a time from the transfer vacuum chamber (23) within the vacuum processing chamber (15), and by repeatedly exchanging one segment at a time from the vacuum processing chamber (15) within the transfer vacuum chamber (23).

39. The method according to any one of claims 34 to 38, wherein the process is a vapor deposition coating, and the holder carrier (5) is a rimless cap shape.

40. The method according to any one of claims 34 to 39, carried out using the vacuum apparatus according to any one of claims 1 to 31.

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