Storage device and method for processing storage device

Abstract

This enables the destruction of non-volatile memory without requiring a separate component to destroy it. [Solution] A storage device comprising a non-volatile memory and a housing case for housing the non-volatile memory, wherein the housing case is provided with a recess that is recessed from the outer wall surface toward the inside of the housing space for the non-volatile memory, and the non-volatile memory is positioned so that it is folded together with the housing case when the housing case is folded with the recess as the center.

Description

Technical Field

[0001] The present disclosure relates to a memory device and a method for processing a memory device.

Background Art

[0002] For example, Patent Document 1 discloses a recording device unit including a nonvolatile memory. The recording device unit disclosed in Patent Document 1 includes a destructible component for the nonvolatile memory. Further, when removing the recording device unit from the housing, the recording device unit disclosed in Patent Document 1 destroys the nonvolatile memory by forming holes or cutting the nonvolatile memory in conjunction with the movement of the recording device unit.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, when providing a destructible component for destroying a nonvolatile memory as in the recording device unit disclosed in Patent Document 1, the destructible component is provided inside the case. Therefore, the device becomes complicated and large-sized.

[0005] The present disclosure has been made in view of the above problems, and an object thereof is to enable destruction of a nonvolatile memory without separately providing a component for destroying the nonvolatile memory.

Means for Solving the Problems

[0006] A storage device according to one aspect of the present disclosure comprises a non-volatile memory and a housing case for housing the non-volatile memory, wherein the housing case is provided with a recess that extends inward from the outer wall surface toward the housing space of the non-volatile memory, and the non-volatile memory is positioned so as to be bent together with the housing case when the housing case is bent around the recess.

[0007] A method for processing a storage device according to one aspect of the present disclosure involves bending a storage case, which is provided with a recess that extends from the outer wall surface toward the inner storage space, around the recess, thereby bending and destroying the non-volatile memory housed in the storage case together with the storage case. [Effects of the Invention]

[0008] According to this disclosure, it is possible to destroy non-volatile memory without providing a separate component for destroying the non-volatile memory. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic perspective view of a USB memory device, which is one embodiment of the present disclosure. [Figure 2] This is a schematic perspective view of a USB memory device, which is one embodiment of the present disclosure. [Figure 3] This is a schematic cross-sectional view of a USB memory device, which is one embodiment of the present disclosure. [Figure 4] This is a schematic cross-sectional view of a USB memory device, which is one embodiment of the present disclosure. [Figure 5] This is a schematic perspective view including the flash memory of a USB memory device, which is one embodiment of the present disclosure. [Figure 6] This is a schematic perspective view including a circuit board of a USB memory device, which is one embodiment of the present disclosure. [Figure 7] This is a schematic cross-sectional view showing an operation for processing a USB memory stick, which is one embodiment of the present disclosure. [Figure 8] This is a schematic perspective view of a solid-state drive, which is one embodiment of the present disclosure. [Figure 9] A schematic perspective view of a solid state drive according to an embodiment of the present disclosure. [Figure 10] A schematic cross-sectional view of a solid state drive according to an embodiment of the present disclosure. [Figure 11] A schematic cross-sectional view of a solid state drive according to an embodiment of the present disclosure. [Figure 12] A schematic perspective view including a flash memory included in a solid state drive according to an embodiment of the present disclosure. [Figure 13] A schematic perspective view including a substrate included in a solid state drive according to an embodiment of the present disclosure. [Figure 14] A schematic cross-sectional view showing an operation of processing a solid state drive according to an embodiment of the present disclosure. [Figure 15] A schematic cross-sectional view showing an operation of processing a solid state drive according to an embodiment of the present disclosure. [Figure 16] A schematic cross-sectional view of a storage device according to an embodiment of the present disclosure.

Embodiments for Carrying Out the Invention

[0010] Hereinafter, an embodiment of a storage device and a method for processing the storage device according to the present disclosure will be described with reference to the drawings.

[0011] (First Embodiment) The storage device of the present disclosure is not particularly limited as long as it includes a non-volatile memory, and for example, it can be used as a USB (Universal Serial Bus) memory or an external SSD (Solid State Drive). In this embodiment, an example in which the storage device of the present disclosure is applied to a USB memory 1 will be described.

[0012] As shown in FIGS. 1 to 4, the USB memory 1 of the present embodiment includes an external case 2 and a housing case 3. Further, as shown in FIG. 3 for example, the USB memory 1 of the present embodiment includes a substrate 4, a flash memory 5 (non-volatile memory), and a plug 6.

[0013] The external case 2 is a case member capable of housing the housing case 3 therein, and is formed of, for example, resin. The external case 2 is formed hollow, and one end is an open end 2a. The outer shape of the external case 2 is not particularly limited, but in the present embodiment, it is a rectangular parallelepiped shape that is long in one direction. Further, in the present embodiment, one end in the long axis direction of the external case 2 is the above-mentioned open end 2a.

[0014] The housing case 3 is housed inside the external case 2 and can be taken in and out of the external case 2 through the open end 2a of the external case 2. The housing case 3 can be partially pulled out from the external case 2 or pushed back into the external case 2 from the pulled-out state by sliding it with respect to the external case 2.

[0015] The housing case 3 houses the substrate 4 and the flash memory 5. As shown in FIGS. 3 and 4 for example, the housing case 3 has a first wall portion 3a disposed opposite to the flash memory 5 and a second wall portion 3b disposed opposite to the flash memory 5 from the side opposite to the first wall portion 3a. The second wall portion 3b is disposed opposite to the flash memory 5 with the substrate 4 interposed therebetween. That is, the substrate 4 is located between the second wall portion 3b and the flash memory 5.

[0016] The housing case 3 is provided with a plurality of outer wall surfaces 3c connected to each other. The surface of the first wall portion 3a facing away from the flash memory 5 forms one of the plurality of outer wall surfaces 3c of the housing case 3. Also, the surface of the second wall portion 3b facing away from the flash memory 5 forms one of the plurality of outer wall surfaces 3c of the housing case 3.

[0017] Such a housing case 3 is provided with a recess 10. The recess 10 is formed to be recessed from the outer wall surface 3c of the housing case 3 toward the internal housing space 3d. The housing space 3d is the space in which the flash memory 5 is housed. In other words, the housing case 3 is provided with a recess 10 that is recessed from the outer wall surface 3c toward the inside of the housing space 3d of the flash memory 5.

[0018] The recesses 10 are provided in the first wall portion 3a and the second wall portion 3b, respectively. In other words, in this embodiment, two recesses 10 are provided in the storage case 3. The recess 10 provided in the first wall portion 3a is provided in a linear direction perpendicular to the sliding direction of the storage case 3 and along the outer wall surface 3c formed by the first wall portion 3a. The recess 10 provided in the second wall portion 3b is provided in a linear direction perpendicular to the sliding direction of the storage case 3 and along the outer wall surface 3c formed by the second wall portion 3b.

[0019] Both ends of the recess 10 provided in the first wall portion 3a are connected to the edges 3c1 of the outer wall surface 3c formed by the first wall portion 3a. Similarly, both ends of the recess 10 provided in the second wall portion 3b are connected to the edges 3c1 of the outer wall surface 3c formed by the second wall portion 3b. These recesses 10 provided in the first wall portion 3a and the recesses 10 provided in the second wall portion 3b are positioned at the same location in the sliding direction of the storage case 3.

[0020] In other words, the recesses 10 provided in the first wall portion 3a and the recesses 10 provided in the second wall portion 3b are arranged to overlap when viewed from a direction along the perpendicular line between the outer wall surface 3c formed by the first wall portion 3a and the outer wall surface 3c formed by the second wall portion 3b (the stacking direction between the substrate 4 and the flash memory 5).

[0021] In this type of storage case 3, the thickness of the part where the recess 10 is provided is thinner compared to other parts of the storage case 3. Therefore, the part of the storage case 3 where the recess 10 is provided becomes a weaker part (hereinafter referred to as the storage case weak part 20) than other parts.

[0022] Furthermore, as shown in Figure 2, for example, the housing case 3 is formed such that the first part 30 and the second part 31 are connected via a sealing portion 32 (flexible member). The first part 30 is the part of the housing case 3 on the plug 6 side. The second part 31 is the part of the housing case 3 on the opposite side of the plug 6.

[0023] The first part 30 includes the portion of the first wall 3a on the plug 6 side and the portion of the second wall 3b on the plug 6 side. The second part 31 includes the portion of the first wall 3a on the opposite side of the plug 6 and the portion of the second wall 3b on the opposite side of the plug 6.

[0024] The sealing portion 32 is formed from a material that is more flexible than the first part 30 and the second part 31. For example, the sealing portion 32 is formed from silicone resin. The sealing portion 32 is located inside the recess 10 and is connected to the first part 30 and the second part 31.

[0025] In this embodiment, the first part 30 and the second part 31 are not directly connected, but are connected to each other via the sealing portion 32. However, some or all of the first part 30 and the second part 31 may be directly connected.

[0026] The sealing portion 32 is deformable. For example, the sealing portion 32 is deformed when the storage case 3 is folded around the recess 10. The deformation of the sealing portion 32 may be elastic or plastic.

[0027] Such a sealing portion 32 prevents a gap from forming at the boundary between the first part 30 and the second part 31 that connects the outside and the storage space 3d, including when the storage case 3 is folded around the recess 10.

[0028] Such a storage case 3 can be easily bent around the recess 10 (weak part of the storage case 20) by applying an external force to bring both ends in the sliding direction closer together, with the recess 10 as the center, compared to a case where the recess 10 (weak part of the storage case 20) is not provided.

[0029] The housing case 3 is slidable relative to the outer case 2 between a position where the recess 10 shown in Figure 3 is covered by the outer case 2 (hereinafter referred to as the housing position) and a position where the recess 10 is exposed from the outer case 2 (hereinafter referred to as the exposed position), as shown in Figure 4.

[0030] The circuit board 4 and flash memory 5 are housed inside the housing case 3. As shown in Figure 5, the circuit board 4 is a printed circuit board on which the flash memory 5 is mounted, and is positioned so that the mounting surface of the flash memory 5 faces the first wall portion 3a. In addition, a plug 6 is fixed to the end of the circuit board 4, which protrudes to the outside from the end of the housing case 3.

[0031] As shown in Figures 3 and 4, multiple support columns 7 are provided in the storage space 3d of the storage case 3. The substrate 4 is fixed in place by being supported by the support columns 7. It is not necessary for all of the support columns 7 to support the substrate 4. Supporting the substrate 4 with such support columns 7 can suppress warping of the substrate 4.

[0032] As shown in Figure 6, the substrate 4 is provided with a plurality of through holes 4a. These through holes 4a are arranged in a straight line so as to overlap with the recess 10 of the housing case 3 when viewed from the stacking direction of the substrate 4 and the flash memory 5.

[0033] As a result of the formation of these multiple through-holes 4a, the strength of the areas of the substrate 4 where the through-holes 4a are formed is reduced compared to other areas of the substrate 4. Therefore, the areas of the substrate 4 where the through-holes 4a are provided become weaker areas (hereinafter referred to as substrate weak areas 4b) than other areas.

[0034] The substrate weak point 4b is positioned so as to overlap with the housing case weak point 20 when viewed from the stacking direction of the substrate 4 and the flash memory 5. Such a substrate 4 can be broken at the substrate weak point 4b when the housing case 3 is bent.

[0035] The flash memory 5 is mounted on the substrate 4. The flash memory 5 is positioned so as to overlap with the recess 10 of the housing case 3 when viewed from the stacking direction of the substrate 4 and the flash memory 5, and is positioned so as to straddle the substrate weak portion 4b of the substrate 4. The flash memory 5 is positioned so as to be bent together with the housing case 3 when the housing case 3 is bent around the recess 10.

[0036] Next, we will explain the procedure for disposing of USB memory stick 1 (how the storage device is handled).

[0037] First, pull out the housing case 3 from the housing position shown in Figure 3 to the exposed position shown in Figure 4. Here, for example, the housing case 3 is pulled out from the outer case 2 by holding down the outer case 2 and pulling the plug 6 protruding from the housing case 3.

[0038] Next, as shown in Figure 7, the storage case 3 is folded around the recess 10. Note that in Figure 7, the storage case 3 is folded around the recess 10 provided in the first wall 3a. However, the storage case 3 may also be folded around the recess 10 provided in the second wall 3b.

[0039] When the housing case 3 is bent, the flash memory 5 is bent together with the housing case 3, as shown in Figure 7, and the flash memory 5 is destroyed. Furthermore, because the substrate 4 has a substrate weak point 4b, the force required to bend the flash memory 5 is less than in the case where the substrate weak point 4b is not provided.

[0040] Furthermore, when the storage case 3 is folded, the sealing portion 32 deforms according to the folding angle of the storage case 3. This prevents a gap from forming between the first part 30 and the second part 31.

[0041] The USB memory 1 of this embodiment, as described above, comprises a flash memory 5 and a housing case 3. The housing case 3 houses the flash memory 5. The housing case 3 is also provided with a recess 10 that extends inward from the outer wall surface 3c towards the housing space 3d of the flash memory 5. The flash memory 5 is positioned so that it can be folded together with the housing case 3 by folding the housing case 3 around the recess 10.

[0042] In this embodiment of the USB memory 1, since the housing case 3 is provided with a recess 10, the housing case 3 can be easily bent around the recess 10 compared to a case where the housing case 3 is not provided with a recess 10.

[0043] Furthermore, in the USB memory 1 of this embodiment, the flash memory 5 can also be bent by bending the housing case 3. Therefore, the USB memory 1 of this embodiment can destroy the flash memory 5 without providing a separate component for destroying the flash memory 5.

[0044] Furthermore, in the USB memory 1 of this embodiment, the housing case 3 has a recess 10 that extends in a straight line. In this USB memory 1 of this embodiment, the straight recess 10 serves as the axis when the housing case 3 is folded. Therefore, the housing case 3 of the USB memory 1 of this embodiment can be folded more easily compared to, for example, a case where the recess 10 is a circular recess.

[0045] Furthermore, in the USB memory 1 of this embodiment, both ends of the recess 10 in the extending direction are connected to the edge 3c1 of the outer wall surface 3c. Compared to the case where the ends of the recess 10 in the extending direction do not reach the edge 3c1 of the outer wall surface 3c, the connection of both ends of the recess 10 in the extending direction to the edge 3c1 of the outer wall surface 3c reduces the strength of the weak part 20 of the housing case 3.

[0046] Therefore, the USB memory 1 of this embodiment can be easily folded in its housing case 3. Note that one of the two ends of the recess 10 in the extending direction may be connected to the edge 3c1 of the outer wall surface 3c.

[0047] Furthermore, in the USB memory 1 of this embodiment, the housing case 3 has a first wall portion 3a facing the flash memory 5 from one side, and a second wall portion 3b facing the flash memory 5 from the opposite side of the first wall portion 3a. The recess 10 is provided in both the first wall portion 3a and the second wall portion 3b.

[0048] In this embodiment of the USB memory 1, the strength of the weak part 20 of the housing case can be further reduced compared to the case where the recess 10 is provided in either the first wall portion 3a or the second wall portion 3b. Therefore, the housing case 3 of the USB memory 1 of this embodiment can be bent more easily. In addition, the first part 30 can be tilted relative to the second part 31 with respect to either the stacking direction of the substrate 4 and the flash memory 5.

[0049] Furthermore, in the USB memory 1 of this embodiment, the housing case 3 comprises a first part 30, a second part 31 different from the first part 30, and a sealing portion 32. The sealing portion 32 is located inside the recess 10 and is deformable. The first part 30 and the second part 31 are connected to each other via the sealing portion 32.

[0050] In this embodiment of the USB memory 1, even when the storage case 3 is bent, the seal portion 32 deforms, preventing a gap from forming between the first part 30 and the second part 31.

[0051] Furthermore, the USB memory 1 of this embodiment includes an outer case 2 that covers the housing case 3 from the outside. In this USB memory 1 of this embodiment, the housing case 3 cannot bend while housed in the outer case 2. Therefore, the USB memory 1 of this embodiment can prevent the housing case 3 from bending due to unintended external forces acting on it.

[0052] Furthermore, in the USB memory 1 of this embodiment, the external case 2 slidably houses the storage case 3. The storage case 3 is also slidable relative to the external case 2 between a position where the recess 10 is covered by the external case 2 and a position where the recess 10 is exposed from the external case 2.

[0053] In this embodiment of the USB memory 1, the housing case 3 can be easily moved to an exposed position without the use of tools by sliding the housing case 3 relative to the outer case 2.

[0054] Furthermore, the USB memory 1 of this embodiment includes a circuit board 4 on which a flash memory 5 is mounted and which is located inside the housing case 3. In addition, the circuit board 4 has a weak portion 4b that is more fragile than other parts of the circuit board 4, at a position that overlaps with the recess 10 when viewed from the direction in which the circuit board 4 and the flash memory 5 are stacked.

[0055] In this embodiment of the USB memory 1, the substrate 4 is suppressed from acting as resistance when the housing case 3 is bent, and the housing case 3 can be bent more easily compared to a case where the substrate weak point 4b is not provided.

[0056] Furthermore, the method for disposing of the USB memory 1 in this embodiment (method for processing the storage device) involves bending the storage case 3, which has a recess 10 that extends from the outer wall surface 3c toward the inner storage space 3d, around the recess 10, thereby bending and destroying the flash memory 5 housed in the storage case 3 together with the storage case 3.

[0057] This method of disposing of the USB memory 1 in this embodiment allows for the destruction of the flash memory 5 without requiring a separate component to destroy the flash memory 5.

[0058] (Second Embodiment) Next, a second embodiment of the present disclosure will be described. In this description, parts that are the same as those of the first embodiment will be omitted or simplified.

[0059] In this embodiment, an example of applying the storage device of this disclosure to an SSD (Solid State Drive 1A) will be described. As shown in Figures 8 to 11, the Solid State Drive 1A of this embodiment comprises an external case 2A and a housing case 3A. Also, as shown in Figure 3, for example, the Solid State Drive 1A of this embodiment comprises a circuit board 4A, flash memory 5A (non-volatile memory), and a plug 6A.

[0060] The outer case 2A is a case member capable of housing the inner case 3A inside, and is formed of, for example, resin. The outer case 2A is hollow and has an open end 2Aa at one end. The external shape of the outer case 2 is not particularly limited, but in this embodiment it is square. However, the external shape of the outer case 2A may be a rectangular parallelepiped that is elongated in one direction.

[0061] The storage case 3A is housed inside the outer case 2A and can be inserted into and removed from the outer case 2A through the open end 2Aa of the outer case 2A. The storage case 3A can be partially pulled out from the outer case 2A by sliding it against the outer case 2A, or pushed back into the outer case 2A from a pulled-out position.

[0062] The housing case 3A houses the substrate 4A and the flash memory 5A. For example, as shown in Figures 10 and 11, the housing case 3A has a first wall portion 3Aa positioned opposite the flash memory 5A, and a second wall portion 3Ab positioned opposite the flash memory 5A from the opposite side of the first wall portion 3Aa. The second wall portion 3Ab is positioned opposite the flash memory 5A with the substrate 4A in between. In other words, the substrate 4A is located between the second wall portion 3Ab and the flash memory 5A.

[0063] The housing case 3A is provided with multiple external wall surfaces 3Ac that are connected to each other. The surface of the first wall portion 3Aa facing away from the flash memory 5A forms one of the multiple external wall surfaces 3Ac of the housing case 3A. Similarly, the surface of the second wall portion 3Ab facing away from the flash memory 5A also forms one of the multiple external wall surfaces 3Ac of the housing case 3A.

[0064] Such a housing case 3 is provided with multiple recesses 10A. The recesses 10A are formed to be recessed from the outer wall surface 3Ac of the housing case 3A toward the internal housing space 3Ad. The housing space 3Ad is a space in which multiple flash memories 5A are housed. In other words, the housing case 3A is provided with recesses 10A that are recessed from the outer wall surface 3Ac toward the inside of the flash memory housing space 3Ad.

[0065] The recesses 10A are provided in the first wall portion 3Aa and the second wall portion 3Ab, respectively. In this embodiment, three recesses 10A are provided in the first wall portion 3Aa. Also, in this embodiment, three recesses 10A are provided in the second wall portion 3Ab. In other words, in this embodiment, six recesses 10A are provided in the housing case 3A.

[0066] Each recess 10A provided in the first wall portion 3Aa is provided in a direction perpendicular to the sliding direction of the housing case 3A and extends linearly along the outer wall surface 3Ac formed by the first wall portion 3Aa. These three recesses 10A provided in the first wall portion 3Aa are parallel to each other and arranged in the sliding direction of the housing case 3A.

[0067] Furthermore, each recess 10A provided in the second wall portion 3Ab is provided in a direction perpendicular to the sliding direction of the housing case 3A and extends linearly along the outer wall surface 3Ac formed by the second wall portion 3Ab. These three recesses 10A provided in the second wall portion 3Ab are parallel to each other and arranged in the sliding direction of the housing case 3A.

[0068] Both ends of the recess 10A provided in the first wall portion 3Aa are connected to the edge 3Ac1 of the outer wall surface 3Ac formed by the first wall portion 3Aa. Similarly, both ends of the recess 10A provided in the second wall portion 3Ab are connected to the edge 3Ac1 of the outer wall surface 3Ac formed by the second wall portion 3Ab. These recesses 10A provided in the first wall portion 3Aa and the recesses 10A provided in the second wall portion 3Ab are positioned at the same location in the sliding direction of the housing case 3A.

[0069] In other words, the recesses 10 provided in the first wall portion 3Aa and the recess 10A provided in the second wall portion 3Ab are arranged to overlap when viewed from a direction along the perpendicular line between the outer wall surface 3Ac formed by the first wall portion 3Aa and the outer wall surface 3Ac formed by the second wall portion 3Ab (the stacking direction between the substrate 4A and the flash memory 5A).

[0070] In this type of storage case 3A, the thickness of the portion where the recess 10A is provided is thinner compared to other parts of the storage case 3A. Therefore, the portion of the storage case 3A where the recess 10A is provided becomes a weaker, more vulnerable part (hereinafter referred to as the storage case weak part 20A) than other parts.

[0071] Furthermore, the storage case 3A is provided with a sealing portion 32A (flexible member) at the bottom of each recess 10A. The sealing portion 32A is formed using a material that is more flexible than other parts of the storage case 3A. For example, the sealing portion 32A is formed using silicone resin.

[0072] The sealing portion 32A is deformable. For example, the sealing portion 32A is deformed when the housing case 3A is bent around the recess 10A. The deformation of the sealing portion 32A may be elastic or plastic.

[0073] Such a sealing portion 32A prevents a gap from forming in the recess 10A that connects the outside and the storage space 3d, including when the storage case 3A is bent around the recess 10A.

[0074] Such a storage case 3A can be easily bent around the recess 10A (the weak point of the storage case 20A) by applying an external force to bring both ends in the sliding direction closer together, with the recess 10A as the center, compared to a case where the recess 10A (weak point of the storage case 20A) is not provided.

[0075] The housing case 3A is slidable relative to the outer case 2A between a position where the recess 10A shown in Figure 10 is covered by the outer case 2A (hereinafter referred to as the housing position) and a position where the recess 10A is exposed from the outer case 2A (hereinafter referred to as the exposed position) as shown in Figure 11. Note that Figures 9 and 11 show the state where all recesses 10A are exposed. However, any position in which any of the recesses 10A are exposed is considered the exposed position.

[0076] The circuit board 4A and the flash memory 5A are housed inside the housing case 3A. As shown in Figure 12, the circuit board 4A is a printed circuit board on which the flash memory 5A is mounted, and is positioned so that the mounting surface of the flash memory 5A faces the first wall portion 3Aa. A plug 6A is fixed to the end of the circuit board 4A, protruding from the end of the housing case 3A to the outside.

[0077] As shown in Figures 10 and 11, multiple support columns 7A are provided in the housing space 3Ad of the housing case 3A. The substrate 4A is fixed by being supported by the support columns 7A. Note that it is not necessary for all of the support columns 7A to support the substrate 4A. By supporting the substrate 4A with such support columns 7A, warping of the substrate 4A can be suppressed.

[0078] As shown in Figure 13, the substrate 4A is provided with a plurality of through holes 4Aa. These through holes 4Aa are arranged in a straight line so as to overlap with the recesses 10A of the housing case 3A when viewed from the stacking direction of the substrate 4A and the flash memory 5A.

[0079] The formation of these multiple through-holes 4Aa results in a decrease in strength in the areas of the substrate 4A where the through-holes 4Aa are formed, compared to other areas of the substrate 4A. Therefore, the areas of the substrate 4A where the through-holes 4Aa are provided become weaker areas (hereinafter referred to as substrate weak areas 4Ab) than other areas.

[0080] The substrate weak point 4Ab is located such that it overlaps with the housing case weak point 20A when viewed from the stacking direction of the substrate 4A and the flash memory 5A. Such a substrate 4A can be broken at the substrate weak point 4Ab when the housing case 3A is bent.

[0081] Each flash memory 5A is mounted on a substrate 4A. When viewed from the stacking direction of the substrate 4A and the flash memory 5A, the flash memory 5A is positioned to overlap with the recess 10A of the housing case 3A, and is positioned to straddle the substrate weak portion 4Ab of the substrate 4A. Such flash memory 5A is positioned so that it can be folded together with the housing case 3A when the housing case 3A is folded around the recess 10A.

[0082] Next, we will explain the procedure for disposing of Solid State Drive 1A (how the storage device is processed).

[0083] First, pull out the housing case 3A from the housing position shown in Figure 10 to the exposed position. Here, for example, by holding down the outer case 2A and pulling the plug 6A protruding from the housing case 3A, the housing case 3A is pulled out from the outer case 2A.

[0084] Next, as shown in Figure 14, the housing case 3A is folded around the recess 10A. In Figure 14, the housing case 3A is folded around the recess 10A closest to the plug 6A among the three recesses 10A provided in the first wall 3Aa. However, the housing case 3A may also be folded around the recess 10A closest to the plug 6A among the three recesses 10A provided in the second wall 3Ab.

[0085] When the housing case 3A is bent, the flash memory 5A is bent together with the housing case 3A, as shown in Figure 14, and the flash memory 5A is destroyed. However, since the substrate 4A has a substrate weak point 4Ab, the force required to bend the flash memory 5A is less than in the case where the substrate weak point 4Ab is not provided.

[0086] For example, as shown in Figure 15, the storage case 3A may be folded around the recess 10A located in the center of the sliding direction among the three recesses 10A provided in the first wall portion 3Aa. Alternatively, the storage case 3A may be folded around the recess 10A located in the center of the sliding direction among the three recesses 10A provided in the second wall portion 3Ab.

[0087] Alternatively, the housing case 3A may be bent around the recess 10A located furthest from the plug 6A among the three recesses 10A provided in the first wall portion 3Aa. Alternatively, the housing case 3A may be bent around the recess 10A located furthest from the plug 6A among the three recesses 10A provided in the second wall portion 3Ab.

[0088] Furthermore, it is preferable to slide the housing case 3A so that the recesses 10A aligned in the sliding direction are sequentially exposed, and to bend the housing case 3A each time a new recess 10A is exposed, thereby destroying all of the flash memory 5A.

[0089] The solid-state drive 1A of this embodiment, as described above, comprises a flash memory 5A and a housing case 3A. The housing case 3A houses the flash memory 5A. The housing case 3A is also provided with a recess 10A that extends inward from the outer wall surface 3Ac towards the housing space 3Ad of the flash memory 5A. The flash memory 5A is positioned so that it can be folded together with the housing case 3A by folding the housing case 3A around the recess 10A.

[0090] In this embodiment, since the housing case 3A of the solid-state drive 1A is provided with a recess 10A, the housing case 3A can be easily bent around the recess 10A, compared to a case where the housing case 3A is not provided with a recess 10A.

[0091] Furthermore, in the solid-state drive 1A of this embodiment, the flash memory 5A can also be bent by bending the housing case 3A. Therefore, the solid-state drive 1A of this embodiment can destroy the flash memory 5A without providing a separate component for destroying the flash memory 5A.

[0092] Furthermore, in the solid-state drive 1A of this embodiment, the housing case 3A has a recess 10A that extends in a straight line. In this solid-state drive 1A of this embodiment, the straight recess 10A serves as the axis when the housing case 3A is folded. Therefore, the solid-state drive 1A of this embodiment allows the housing case 3A to be folded more easily compared to, for example, a case where the recess 10A is a circular recess.

[0093] Furthermore, in the solid-state drive 1A of this embodiment, both ends of the recess 10A in the extension direction are connected to the edge 3Ac1 of the outer wall surface 3Ac. Compared to the case where the ends of the recess 10A in the extension direction do not reach the edge 3Ac1 of the outer wall surface 3Ac, the connection of both ends of the recess 10A in the extension direction to the edge 3Ac1 of the outer wall surface 3Ac reduces the strength of the weak portion 20A of the housing case 3A.

[0094] Therefore, the solid-state drive 1A of this embodiment allows the housing case 3A to be easily bent. Note that one of the two ends of the recess 10A in the extension direction may be connected to the edge 3Ac1 of the outer wall surface 3Ac.

[0095] Furthermore, in the solid-state drive 1A of this embodiment, the housing case 3A has a first wall portion 3Aa facing the flash memory 5A from one side, and a second wall portion 3Ab facing the flash memory 5A from the opposite side of the first wall portion 3Aa. The recess 10A is provided in both the first wall portion 3Aa and the second wall portion 3Ab.

[0096] In this embodiment of the solid-state drive 1A, the strength of the housing case's weak point 20A can be further reduced compared to the case where the recess 10A is provided in either the first wall portion 3Aa or the second wall portion 3Ab. Therefore, the housing case 3A can be bent more easily in this embodiment of the solid-state drive 1A.

[0097] Furthermore, in the solid-state drive 1A of this embodiment, the housing case 3A includes a sealing portion 32A. The sealing portion 32A is located inside the recess 10A and is deformable.

[0098] In this embodiment, even when the housing case 3A is bent, the solid-state drive 1A can prevent a gap from forming in the recess 10A by deforming the seal portion 32.

[0099] Furthermore, the solid-state drive 1A of this embodiment includes an outer case 2A that covers the housing case 3A from the outside. In this solid-state drive 1A of this embodiment, the housing case 3A cannot bend while housed in the outer case 2A. Therefore, the solid-state drive 1A of this embodiment can prevent the housing case 3A from bending due to unintended external forces acting on it.

[0100] Furthermore, in the solid-state drive 1A of this embodiment, the external case 2A slidably houses the housing case 3A. The housing case 3A is slidable relative to the external case 2A between a position where the recess 10A is covered by the external case 2A and a position where the recess 10A is exposed from the external case 2A.

[0101] In this embodiment of the solid-state drive 1A, the housing case 3A can be easily moved to an exposed position without the use of tools by sliding the housing case 3A relative to the external case 2A.

[0102] Furthermore, the solid-state drive 1A of this embodiment includes a substrate 4A on which a flash memory 5A is mounted and which is located inside the housing case 3A. In addition, the substrate 4A has a substrate weak portion 4Ab that is weaker than other parts of the substrate 4A, at a position that overlaps with the recess 10A when viewed from the direction in which the substrate 4A and the flash memory 5A are stacked.

[0103] In this embodiment, the solid-state drive 1A suppresses the resistance of the substrate 4A when the housing case 3A is bent, and the housing case 3A can be bent more easily compared to the case where the substrate weak portion 4Ab is not provided.

[0104] Furthermore, the solid-state drive 1A of this embodiment includes a plurality of flash memories 5A and a housing case 3A that houses the plurality of flash memories 5A. The housing case 3A is also provided with a plurality of recesses 10A.

[0105] In this embodiment, the solid-state drive 1A can destroy multiple flash memories 5A without providing a separate component for destroying the flash memories 5A.

[0106] Furthermore, the disposal method (processing method for the storage device) for the solid-state drive 1A in this embodiment involves bending the housing case 3A, which is provided with a recess 10A that extends from the outer wall surface 3Ac toward the inner housing space 3Ad, around the recess 10A, thereby bending and destroying the flash memory 5A housed in the housing case 3A together with the housing case 3.

[0107] This method for disposing of the solid-state drive 1A in this embodiment allows for the destruction of the flash memory 5A without requiring a separate component to destroy the flash memory 5A.

[0108] (Third embodiment) Next, a third embodiment of this disclosure will be described.

[0109] As shown in Figure 16, the storage device 100 of this embodiment comprises a non-volatile memory 101 and a housing case 102. The housing case 102 houses the non-volatile memory 101. The housing case 102 is also provided with a recess 103.

[0110] The recess 103 is recessed from the outer wall surface of the housing case 102 toward the inside of the housing space for the non-volatile memory. The non-volatile memory 101 is positioned so that it can be folded together with the housing case 102 by folding the housing case 102 around the recess 103.

[0111] In this embodiment of the storage device 100, since the storage case 102 is provided with a recess 103, the storage case 102 can be easily folded around the recess 103, compared to a case where the storage case 102 is not provided with a recess 103.

[0112] Furthermore, in the storage device 100 of this embodiment, the non-volatile memory 101 can also be bent by bending the housing case 102. Therefore, in the storage device 100 of this embodiment, the non-volatile memory 101 can be destroyed without providing a separate component for destroying the non-volatile memory 101.

[0113] Although the present disclosure has been described above with reference to embodiments, the present disclosure is not limited to the embodiments described above. Various modifications to the structure and details of the present disclosure are possible, as can be understood by those skilled in the art within the scope of the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate.

[0114] Some or all of the above embodiments may also be described as follows, but are not limited to the following:

[0115] (Note 1) Non-volatile memory and A housing case for housing the aforementioned non-volatile memory, Equipped with, The housing case is provided with a recess that extends inward from the outer wall surface toward the interior of the housing space for the non-volatile memory. The non-volatile memory is positioned so that it can be folded together with the housing case by folding the housing case around the recess. storage device.

[0116] (Note 2) The aforementioned storage case is provided with the recess extending in a straight line. The storage device described in Appendix 1.

[0117] (Note 3) At least one end of the recess in the extending direction is connected to the edge of the outer wall surface. The storage device described in Appendix 2.

[0118] (Note 4) The aforementioned storage case is The first wall portion facing the non-volatile memory from one side, A second wall portion facing the non-volatile memory from the opposite side of the first wall portion, It has, The recess is provided in the first wall portion and the second wall portion, A storage device as described in any one of the appendices 1 to 3.

[0119] (Note 5) The aforementioned storage case is Part 1 and, The second part is different from the first part mentioned above, A flexible member located inside the recess and capable of deformation, It has, The first part and the second part are connected to each other via the flexible member. A storage device as described in any one of the appendices 1 to 4.

[0120] (Note 6) The aforementioned storage case is further provided with an external case that covers it from the outside. A storage device as described in any one of the appendices 1 to 5.

[0121] (Note 7) The aforementioned external case slidably houses the aforementioned storage case, The housing case is slidable relative to the outer case between a position where the recess is covered by the outer case and a position where the recess is exposed from the outer case. The storage device described in Appendix 6.

[0122] (Note 8) The circuit board on which the non-volatile memory is mounted and located inside the housing case is provided, The substrate has a weak portion that is more fragile than other parts of the substrate, at a position that overlaps with the recess when viewed from the direction in which the substrate and the non-volatile memory are stacked. A storage device as described in any one of the appendices 1 to 7.

[0123] (Note 9) Multiple non-volatile memories, The housing case for housing multiple non-volatile memories, Equipped with, The aforementioned storage case is provided with a plurality of recesses. A storage device as described in any one of the appendices 1 to 8.

[0124] (Note 10) A storage case, which has a recess that curves inward from the outer wall surface towards the inner storage space, can be bent around the recess. The non-volatile memory housed in the aforementioned housing case is destroyed by bending it together with the housing case. A method for processing data in a storage device.

[0125] (Note 11) The aforementioned storage case is provided with the recess extending in a straight line. The processing method for the storage device described in Appendix 10.

[0126] (Note 12) At least one end of the recess in the extending direction is connected to the edge of the outer wall surface. The processing method for the storage device described in Appendix 11.

[0127] (Note 13) The aforementioned storage case is The first wall portion facing the non-volatile memory from one side, A second wall portion facing the non-volatile memory from the opposite side of the first wall portion, It has, The recess is provided in the first wall portion and the second wall portion, The processing method for the storage device described in any one of the appendices 10 to 12.

[0128] (Note 14) The aforementioned storage case is Part 1 and, The second part is different from the first part mentioned above, A flexible member located inside the recess and capable of deformation, It has, The first part and the second part are connected to each other via the flexible member. The processing method for the storage device described in any one of the appendices 10 to 13.

[0129] (Note 15) The aforementioned storage case is further provided with an external case that covers it from the outside. The processing method for the storage device described in any one of the appendices 10 to 14.

[0130] (Note 16) The aforementioned external case slidably houses the aforementioned storage case, The housing case is slidable relative to the outer case between a position where the recess is covered by the outer case and a position where the recess is exposed from the outer case. The processing method for the storage device described in Appendix 15.

[0131] (Note 17) The circuit board on which the non-volatile memory is mounted and located inside the housing case is provided, The substrate has a weak portion that is more fragile than other parts of the substrate, at a position that overlaps with the recess when viewed from the direction in which the substrate and the non-volatile memory are stacked. The processing method for the storage device described in any one of the appendices 10 to 16.

[0132] (Note 18) Multiple non-volatile memories, The housing case for housing multiple non-volatile memories, Equipped with, The aforementioned storage case is provided with a plurality of recesses. The processing method for the storage device described in any one of the appendices 10 to 17. [Explanation of Symbols]

[0133] 1 USB flash drive (storage device) 2. External case 2a Open end 3 Storage Cases 3a 1st wall 3b 2nd wall part 3c External wall surface 3c1 edge 3D storage space 4 circuit boards 4a through hole 4b Substrate weak areas 5. Flash memory (non-volatile memory) 10 recesses 20 Vulnerable parts of the containment case 30 Part 1 31 Part 2 32 Seal part 1A Solid State Drive (Storage Device) 2A External Case 2Aa Open end 3A Storage Case 3Aa 1st wall part 3Ab 2nd wall part 3Ac External wall surface 3Ac1 edge 3Ad Containment Space 4A circuit board 4Aa through hole 4Ab Weak part of board 5A Flash Memory (Non-Volatile Memory) 10A recess 20A Vulnerable part of the housing case 32A Seal section 100 storage device 101 Non-volatile memory 102 storage cases 103 Recess

Claims

1. Non-volatile memory and A housing case for housing the aforementioned non-volatile memory, Equipped with, The housing case is provided with a recess that extends inward from the outer wall surface toward the interior of the housing space for the non-volatile memory. The aforementioned recess serves as the pivot point when the storage case is folded. The non-volatile memory is positioned so that it can be folded together with the housing case by folding the housing case around the recess. storage device.

2. The aforementioned storage case is provided with the recess extending in a straight line. The storage device according to claim 1.

3. At least one end of the recess in the extending direction is connected to the edge of the outer wall surface. The storage device according to claim 2.

4. The aforementioned storage case is The first wall portion facing the non-volatile memory from one side, A second wall portion facing the non-volatile memory from the opposite side of the first wall portion, It has, The recess is provided in the first wall portion and the second wall portion, The storage device according to any one of claims 1 to 3.

5. The aforementioned storage case is Part 1 and, A second part that is different from the first part mentioned above, A flexible member located inside the recess and capable of deformation, It has, The storage device according to any one of claims 1 to 3, wherein the first part and the second part are connected to each other via the flexible member.

6. The aforementioned storage case is further provided with an external case that covers it from the outside. The storage device according to any one of claims 1 to 3.

7. The aforementioned external case slidably houses the aforementioned storage case, The housing case is slidable relative to the outer case between a position where the recess is covered by the outer case and a position where the recess is exposed from the outer case. The storage device according to claim 6.

8. The non-volatile memory is mounted on a substrate located inside the housing case, and the substrate has a weak portion that is more fragile than other parts of the substrate, at a position that overlaps with the recess when viewed from the direction in which the substrate and the non-volatile memory are stacked. The storage device according to any one of claims 1 to 3.

9. Multiple non-volatile memories, The housing case for housing multiple non-volatile memories, Equipped with, The aforementioned storage case is provided with a plurality of recesses. The storage device according to any one of claims 1 to 3.

10. Non-volatile memory and A housing case for housing the aforementioned non-volatile memory, Equipped with, The housing case is provided with a recess that extends inward from the outer wall surface toward the interior of the housing space for the non-volatile memory. The non-volatile memory is positioned so that it can be folded together with the housing case by folding the housing case around the recess, The aforementioned storage case is Part 1 and, A second part that is different from the first part mentioned above, A flexible member located inside the recess and capable of deformation, It has, The first part and the second part are connected to each other via the flexible member. storage device.

11. Non-volatile memory and A housing case for housing the aforementioned non-volatile memory, Equipped with, The housing case is provided with a recess that extends inward from the outer wall surface toward the interior of the housing space for the non-volatile memory. The non-volatile memory is positioned so that it can be folded together with the housing case by folding the housing case around the recess, The aforementioned storage case is equipped with an external case that covers it from the outside, The aforementioned external case slidably houses the aforementioned storage case, The housing case is slidable relative to the outer case between a position where the recess is covered by the outer case and a position where the recess is exposed from the outer case. storage device.

12. Non-volatile memory and A housing case for housing the aforementioned non-volatile memory, Equipped with, The housing case is provided with a recess that extends inward from the outer wall surface toward the interior of the housing space for the non-volatile memory. The non-volatile memory is positioned so that it can be folded together with the housing case by folding the housing case around the recess, The non-volatile memory is mounted on a substrate located inside the housing case, and the substrate has a weak portion that is more fragile than other parts of the substrate, at a position that overlaps with the recess when viewed from the direction in which the substrate and the non-volatile memory are stacked. storage device.

13. A storage case, which has a recess that curves inward from the outer wall surface towards the inner storage space, can be bent around the recess. The non-volatile memory housed in the aforementioned housing case is destroyed by bending it together with the housing case. A method for processing data in a storage device.

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