Condensation-curable composition containing a siloxane-imide polymer

Abstract

Presented and described herein is a condensation curable silicone adhesive composition comprising a siloxane-imide based polymer, a condensation curable organopolysiloxane crosslinker, a condensation catalyst, and additives, which is relatively room temperature curable and exhibits good thermal stability.

Description

[Technical Field]

[0001] The present invention relates to condensation-curable compositions. More particularly, the present invention relates to curable compositions comprising a siloxane-imide polymer, a crosslinking agent, a catalyst, and optionally other additives. The composition may be curable in less than 24 hours at room temperature, and the cured material may exhibit stability to harsh temperature conditions (e.g., 350°C or higher) for use in various applications. [Background technology]

[0002] High-temperature stable materials, such as those stable at approximately 350°C or higher, are desirable for a wide range of applications. In addition, many applications require not only high-temperature stability, but also that the material maintain, or substantially maintains, its mechanical properties and flexibility over a wide temperature range, from extremely low temperatures (e.g., below 0°C to -100°C) to high temperatures (e.g., approximately 350°C or higher). Many current curable silicone-based materials are generally only stable up to 275°C.

[0003] Current curable silicone-based materials used in the aerospace industry maintain their elastic properties continuously from -115°C (-175°F) to 260°C (500°F), and may even maintain them for short periods up to 316°C (600°F). Organic polymers such as polyimides and polybenzimidazoles can be stable above 400°C, however, these materials have their own challenges in processability and flexibility, making their use difficult for some applications. Considering their individual characteristic constraints (thermal stability and flexibility), pure silicones or pure organic polymers such as polyimides cannot be used alone for such a wide temperature range.

[0004] Siloxane-modified polyimide materials are known in the art. These materials are flexible, self-supporting film-type materials with high thermal stability and high thermal conductivity. However, these materials have several processability challenges, which limits their applicability in large-scale applications.

[0005] Recent attempts to improve thermal stability include the use of mold-making compositions containing siloxane-modified polyimide copolymers or siloxane-polyetherimide block copolymers (see, for example, U.S. Patent No. 8,071,693, U.S. Patent Publication 2003 / 0004268, and U.S. Patent No. 6,451,381). Other attempts are described, for example, in Japanese Patent Nos. 3279635 and 4803371 relating to non-curable siloxaneimide copolymers, and in Korean Patent Publication 10-2014-007363 relating to composite sheets containing siloxaneimide copolymers with reinforcing materials. However, the solutions proposed in these do not target materials with high thermal stability above 350°C. [Overview of the Initiative]

[0006] The following is an overview of the disclosure to provide a basic understanding of several embodiments. This overview is not intended to identify essential or important elements or to impose any limitations on the embodiments or claims. Furthermore, this overview may provide a simplified outline of several embodiments that may be described in more detail in other parts of the disclosure.

[0007] Provided are a condensation-curable silicone-imide composition that has been found to cure at room temperature within 24 hours without the presence of any solvent, and a curing material comprising this composition that exhibits superior thermal stability compared to pure silicone.

[0008] Provided in one embodiment is a condensation-curable composition comprising: (a) a silicone-imide based polymer; (b) a crosslinking agent; (c) a condensation curing catalyst; and (d) optionally an additive.

[0009] In one embodiment, the silicone-imide based polymer (a) is selected from compounds of formula (I):

Chemical formula

[0010] In one embodiment, R 1 [[ID=四十二]]is selected from benzene, naphthalene, benzophenone, biphenyl, biphenylalkane, biphenylether, isopropylidenediphenylphenoxy, biphenylsulfone, biphenylsulfide, norbornyl, and hexafluoromethylbiphenyl. In one embodiment, R 1 is benzene.

[0011] In one embodiment of one of the curable silicone compositions of any of the above-described embodiments, the silicone-imide-based polymer (a) is present in an amount of about 2 parts by weight to about 100 parts by weight, about 40% to about 95% by weight, or about 50% to about 91% by weight based on the total parts by weight of the curable silicone composition.

[0012] In one embodiment, the crosslinking agent (b) is selected from alkoxysilanes, alkoxysilicates, alkoxysiloxanes, oximosilanes, oximosiloxanes, enoxysilanes, enoxysiloxanes, aminosilanes, carboxysilanes, carboxysiloxanes, alkylamidosilanes, alkylamidosiloxanes, arylamidosilanes, arylamidosiloxanes, alkoxyaminosilanes, alkarylaminosiloxanes, alkoxycarbamatosilanes, alkoxycarbamatosiloxanes, and combinations of two or more thereof.

[0013] In one embodiment of one of the curable silicone compositions of any of the above-described embodiments, the crosslinking agent (b) is selected from tetraethyl orthosilicate (TEOS), methyltrimethoxysilane (MTMS), or combinations thereof.

[0014] In one embodiment of one of the curable silicone compositions of any of the above-described embodiments, the crosslinking agent (b) is present in an amount of about 0.5 parts by weight to about 50 parts by weight, about 1 part by weight to about 30 parts by weight, or about 5 parts by weight to about 10 parts by weight based on the total parts by weight of the curable silicone composition.

[0015] In one embodiment of the curable silicone composition of any of the embodiments described above, catalyst (c) is selected from tin-based catalysts such as dibutyltin dilaurate (dBTDL) or dioctyltin compounds, metal catalysts or organometallic catalysts containing metals such as Ca, Ce, Bi, Fe, Mo, Mn, Pb, Ti, V, Zn, and Y, and non-tin catalysts containing a combination of carboxylic acid components, amino-containing silanes or mixtures of amino-containing silanes, and optionally amino-containing siloxane components.

[0016] In one embodiment of the curable silicone composition of any of the embodiments described above, the organometallic catalyst is dibutyltin dilaurate.

[0017] In one embodiment of the curable silicone composition of any of the embodiments described above, catalyst (c) is present in an amount of about 0.01 to about 5 parts by weight, about 0.2 to about 1 part by weight, or about 0.01 to about 0.03 parts by weight, based on the total parts by weight of the curable silicone composition.

[0018] In one embodiment of the curable silicone composition of any of the embodiments described above, additive (d) is selected from fillers, pigments, lubricants, viscosity modifiers, antioxidants, light stabilizers, heat stabilizers, flame retardants, inhibitors, adhesion promoters, or two or more combinations thereof.

[0019] In one embodiment of the curable silicone composition of any of the embodiments described above, the additive is a filler.

[0020] In one embodiment of the curable silicone composition of any of the embodiments described above, the filler is selected from SiO2, TiO2, MgO, ZnO, CaCO3, CeO2, Fe2O3, SiC, clay material, graphene oxide, boron oxide, boron nitride, carbon nanotubes, zirconium oxide, fly ash, Zr(OEt)4, Ti(OEt)4, any polyimide in powder form, polybenzimidazole, polyamideimide, polybisphenol A sulfone, siloxane-polyimide, siloxane-benzimidazole, siloxane-polysulfone, or any other heat-stable filler.

[0021] In one embodiment of the curable silicone composition of any of the embodiments described above, the filler is present in an amount of about 0 to about 50 parts by weight, about 15 to about 40 parts by weight, or about 25 to about 30 parts by weight, based on the total weight of the curable silicone composition.

[0022] In one embodiment of the curable silicone composition of any of the embodiments described above, the filler is Fe2O3.

[0023] In one embodiment, a silicone-imide composition according to any of the embodiments described above is coated or bonded onto a substrate.

[0024] In one embodiment, the substrate is selected from plastic materials, ceramics, glass, rubber materials, filled metals, metal alloys, metallized plastics, and / or coated or painted metals.

[0025] In one embodiment, a cured silicone-imide material is formed from the composition.

[0026] In one embodiment, a silicone-imide material is provided which is formed from this composition and has a thermal degradation of 400°C to 600°C as measured by thermogravimetric analysis.

[0027] In another embodiment, the cured silicone-imide material formed from the composition is used in aerospace, electronics, automotive, thermal insulation, coatings, and solvent-resistant film applications.

[0028] The following description and drawings disclose various exemplary embodiments. Some improvements and novel embodiments may be explicitly identified, while others may be apparent from the description and drawings. [Modes for carrying out the invention]

[0029] The following descriptions refer to exemplary embodiments, examples of which are shown in the accompanying drawings. As will be understood, other embodiments may be used, and structural and functional modifications may be made. Furthermore, features of various embodiments may be combined or modified. Therefore, the following description is presented only as an example and does not limit in any way to the various changes and modifications that may be made to the embodiments described. Many specific details in this disclosure will lead to a full understanding of the subject matter of this disclosure. It should be understood that embodiments of this disclosure may be implemented in other embodiments without necessarily including all embodiments described herein.

[0030] As used in this application, the terms “example” or “exemplary” mean a case or example. The terms “example” or “exemplary” do not indicate that they are important or preferred embodiments or forms. The term “or” is intended to be inclusive, not exclusive, unless the context specifically suggests otherwise. For example, the phrase “A uses B or C” includes all inclusive substitutions (e.g., A uses B; A uses C; or A uses both B and C). Separately, the articles “a” and “one” are generally intended to mean “one or more” unless the context specifically suggests otherwise.

[0031] This disclosure may specify several different ranges for one or more components in a composition. As can be understood, it is possible to combine the numerical values ​​of each range to form new, unspecified ranges.

[0032] The term "alkyl" includes linear, branched, and cyclic monovalent hydrocarbon groups, which may be substituted with heteroatoms or heteroatom-containing groups. In embodiments, the term alkyl may include C1-C30 alkyl groups. Suitable alkyl groups include, but are not limited to, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, and others.

[0033] The term "alkylene" includes linear, branched, and cyclic divalent hydrocarbon groups, which may be substituted with heteroatoms or heteroatom-containing groups. In embodiments, the term alkylene may include C1-C30 alkylene groups. Examples of alkylene groups, but are not limited to, include methylene, ethylene, propylene, isopropylene, butylene, isobutylene, tert-butylene, pentylene, hexylene, heptylene, octylene, nonylene, desilene, and others.

[0034] The term "aryl" includes any monovalent aromatic hydrocarbon group, which may be substituted with a heteroatom or a heteroatom-containing group. The term also includes fusion systems containing aromatic groups and groups comprising multiple aryl groups linked by bonding or linking groups. In embodiments, the term aryl includes C5-C20 aryl groups, fusion aryl groups containing two or more C5-C20 aryl groups, and multiple aryl group structures containing two or more C5-C20 aryl groups linked by linking groups.

[0035] The term "arylene" includes any divalent aromatic hydrocarbon group, which may be substituted with a heteroatom or a heteroatom-containing group. The term also includes fusion systems containing aromatic groups. In embodiments, the term arylene includes C5-C20 arylene groups, fusion arylene groups containing two or more C5-C20 aryl groups, and multiple arylene group structures containing two or more C5-C20 aryl groups linked by linking groups.

[0036] The term "aralkyl" includes linear, branched, and cyclic monovalent hydrocarbon groups substituted with aryl substituents.

[0037] The term “cyclic” or “cyclic” alkyl includes monovalent cyclic hydrocarbons, including single cyclic groups, dicyclic groups, tricyclic groups, and higher-order cyclic structures, as well as crosslinked cyclic groups, fusion cyclic groups, and fusion cyclic groups containing at least one crosslinked cyclic group. In embodiments, cyclic alkyl groups include C3-C20 cyclic alkyl groups. Suitable examples of cyclic groups include, but are not limited to, cyclopropyl, cyclopentyl, cyclohexyl, norbornyl, bicyclo[2.2.2]nonane, adamantyl, or tetrahydronaphthyl (tetraline).

[0038] The term "cyclic" or "cyclic" alkylene includes divalent cyclic hydrocarbons, including single cyclic groups, dicyclic groups, tricyclic groups, and higher-order cyclic structures, as well as bridged cyclic groups, fusion cyclic groups, and fusion cyclic groups containing at least one bridged cyclic group. In embodiments, cyclic alkylene groups include C3-C20 cyclic alkylene groups.

[0039] The term "alkynyl" is defined as a C2-C10 branched or straight unsaturated aliphatic hydrocarbon group having one or more triple bonds between two or more carbon atoms. Examples of alkynes include ethynyl, propynyl, butynyl, pentynyl, hexynyl, heptynyl, octinyl, and noninyl.

[0040] The term "substitution" means that one or more hydrogens on a molecule, on a part of a molecule, or on an atom are replaced by a substituent, provided that the valency does not exceed the normal valency. Substituents can be heteroatoms. The term "hetero" is used here to refer to atoms such as oxygen, nitrogen, sulfur, silicon, phosphorus, and boron, or in relation to another group that contains such atoms or atoms. Suitable examples of substituents include, but are not limited to, -OR, -NR'R, -C(O)R, -SR, -halogens, -CN, -NO2, -SO2, phosphoryl, imino, thioester, carbocyclic groups, aryl, heteroaryl, alkyl, alkenyl, bicyclic, and tricyclic groups. When a substituent is a keto group (i.e., =O), two hydrogens on the atom are replaced. Keto substituents are not present in aromatic moieties. The terms R and R' refer to alkyl groups, which may be the same or different.

[0041] Provided is a condensation-curable silicone-imide composition found to cure at room temperature without the presence of any solvent. This condensation-curable composition contains a siloxane-imide polymer. Also provided is a cured material containing this curable composition or formed from this curable composition. This cured material has a thermal decomposition peak (T) that can be evaluated, for example, by thermogravimetric analysis. d It exhibits excellent thermal stability, as demonstrated by [the following]. The thermal stability of the cured material formed from the composition is superior to that of pure siloxane.

[0042] One embodiment provides a condensation-curable composition comprising: (a) a silicone-imide-based polymer; (b) a crosslinking agent; (c) a condensation-curing catalyst; and (d) optionally an additive.

[0043] In one embodiment, the silicone-imide-based polymer is selected from the compounds of formula (I): [ka] R in the formula 1R is selected from C5-C20 aryl groups, polycyclic aryl groups containing two or more C5-C20 aryl groups, where R 1 It may be unsubstituted or substituted with C1-C6 alkyl groups, halogen groups, haloalkyl groups, hydroxyl groups, and / or C1-C5 alkoxy groups; C 1 The group can be selected from C1-C5 alkyl groups, C5-C20 aryl groups, C7-C16 arylalkyl groups, or C7-C16 alkylaryl groups; R 2 , R 3 , and R 4 These may be the same or different and can be selected from C1-C3 alkyl groups or phenyl groups; R 5 These may be the same or different and can be selected from C1-C30 alkyl groups, C1-C30 alkoxy groups, C1-C30 acetoxy groups, or C1-C30 ketoxime groups; m is an integer between 1 and 30; and n is an integer between 1 and 200.

[0044] R 1 R is independently selected from C5-C20 aryl groups, polycyclic aryl groups containing two or more C5-C20 aryl groups. The polycyclic aryl group can be a fused ring or an unfused system linked by a linking group. 1 Suitable examples of aryl and / or polycyclic aryl groups include, but are not limited to, benzene, naphthalene, benzophenone, biphenyl, biphenylalkane (e.g., biphenylmethane, biphenylethane, biphenylpropane, biphenylisopropane, biphenylbutane, biphenylisobutene, biphenylter-butane, biphenylhexane, biphenyloctane, etc., biphenyl groups having alkyl linking groups selected from C1-C20 alkyls), biphenyl ethers, isopropylidene diphenylphenoxy, biphenyl sulfone, biphenyl sulfide, norbornyl, and hexafluoromethylbiphenyl, among others. In one embodiment, R1 It is benzene.

[0045] R 2 , R 3 , and R 4 These may be the same or different, and can be selected from C1-C3 alkyl groups or phenyl groups. In one embodiment, R 2 , R 3 , and R 4 Each of these is a methyl group. In one embodiment, R 2 and R 4 Each of these is a C1-C3 alkyl group, and R 3 It is a phenyl group.

[0046] R 5 These may be the same or different, and can be selected from C1-C30 alkyl groups, C1-C30 alkoxy groups, C1-C30 acetoxy groups, or C1-C30 ketoxime groups. In embodiments, R 5 Each of these is independently selected from C1-C10 alkyl groups, C2-C8 alkyl groups, or C4-C6 alkyl groups. In one embodiment, R 5 These are each methyl groups.

[0047] The variable m can be 1 to 30, 2 to 25, 5 to 20, 6 to 15, or 8 to 10. In one embodiment, m is 1.

[0048] The variable n is between 1 and 200, 5 and 150, 10 and 125, 25 and 100, or 50 and 75.

[0049] The crosslinking agent (b) may be selected as desired depending on the specific purpose or intended use. The crosslinking agent (b) is generally selected from silicone-based materials. Examples of suitable materials as crosslinking agent (b) include, but are not limited to, alkoxysilanes, alkoxysilicates, alkoxysiloxanes, oxymosilanes, oxymosiloxanes, enoxysilanes, enoxysiloxanes, aminosilanes, carboxysilanes, carboxysiloxanes, alkylamidosilanes, alkylamidosiloxanes, arylamidosilanes, arylamidosiloxanes, alkoxyaminosilanes, alkalylaminosiloxanes, alkoxycarbamatesilanes, alkoxycarbamatesiloxanes, and combinations of two or more of these.

[0050] Examples of suitable crosslinking agents include, but are not limited to, tetraethyl orthosilicate (TEOS); tiltrimethoxysilane (MTMS); methyltriethoxysilane; vinyltrimethoxysilane; vinyltriethoxysilane; methylphenyldimethoxysilane; 3,3,3-trifluoropropyltrimethoxysilane; methyltriacetoxysilane; vinyltriacetoxysilane; ethyltriacetoxysilane; dibutoxydiacetoxysilane; phenyltripropionoxysilane; methyltris(methylethylketoxyme)silane; vinyltris(methyl Ethyl ketoxime) silane; 3,3,3-trifluoropropyl tris(methyl ethyl ketoxime) silane; methyl tris(isopropenoxy) silane; vinyl tris(isopropenoxy) silane; ethyl polysilicate; dimethyltetraacetoxydisiloxane; tetra-n-propyl orthosilicate; methyl dimethoxy(ethyl methyl ketoximo) silane; methyl methoxybis-(ethyl methyl ketoximo) silane; methyl dimethoxy(acetaldehyde) silane; methyl dimethoxy(N-methyl carbamate) silane; ethyl dimethoxy(N-methyl (Cylcarbamate)silane; methyldimethoxyisopropenoxysilane; trimethoxyisopropenoxysilane; methyltriisopropenoxysilane; methyldimethoxy(buto-2-ene-2-oxy)silane; methyldimethoxy(1-phenylethenoxy)silane; methyldimethoxy-2(1-carboethoxypropenoxy)silane; methylmethoxydi-N-methylaminosilane; vinyldimethoxymethylaminosilane; tetra-N,N-diethylaminosilane; methyldimethoxymethylaminosilane; methyltricyclohexylaminosilane; methyl Didimethoxyethylaminosilane; Dimethyldi-N,N-dimethylaminosilane; Methyldimethoxyisopropylaminosilane; Dimethyldi-N,N-diethylaminosilane; Ethyldimethoxy(N-ethylpropionamide)silane; Methyldimethoxy(N-methylacetamide)silane; Methyltris(N-methylacetamide)silane; Ethyldimethoxy(N-methylacetamide)silane; Methyltris(N-methylbenzamide)silane; Methylmethoxybis(N-methylacetamide)silane; Methyldimethoxy(caprolactamo)silane;This includes trimethoxy(N-methylacetamide)silane; methyldimethoxyethylacetoimidatosilane; methyldimethoxypropylacetoimidatosilane; methyldimethoxy(N,N',N'-trimethylureido)silane; methyldimethoxy(N-allyl-N',N'-dimethylureido)silane; methyldimethoxy(N-phenyl-N',N'-dimethylureido)silane; methyldimethoxyisocyanatosilane; dimethoxydiisocyanatosilane; methyldimethoxythioisocyanatosilane; methylmethoxydithioisocyanatosilane; or two or more combinations of these.

[0051] A condensation curing catalyst (c) may be used to facilitate the reaction between the condensation curing organopolysiloxane and the siloxane-imide crosslinking agent. The condensation curing catalyst is not particularly limited and can be selected from any suitable catalytic material for facilitating the condensation curing reaction. Examples of suitable metal catalysts or organometallic catalysts include, but are not limited to, those using metals such as tin, titanium, zinc, and calcium, and complexes of these metals. Examples of suitable condensation catalysts for use in the present invention include, but are not limited to, tin-based catalysts such as dibutyltin dilaurate (dBTDL) or dioctyltin compounds, metal catalysts or organometallic catalysts containing metals such as Ca, Ce, Bi, Fe, Mo, Mn, Pb, Ti, V, Zn, and Y, and non-tin catalysts containing carboxylic acid components, amino-containing silanes or mixtures of amino-containing silanes, and optionally combinations of amino-containing siloxane components.

[0052] The carboxylic acid component of the catalyst may be selected from any suitable carboxylic acid component. In one embodiment, the carboxylic acid component may be selected from aliphatic carboxylic acids. Suitable carboxylic acids for the carboxylic acid component include, but are not limited to, branched alkyl C4-C30 alkylcarboxylic acids, which include C5-C30, and even C5-C19 acids with an alpha-tertiary carbon, or two or more combinations thereof. Some useful carboxylic acids that can be used in this application include, but are not limited to, propanoic acid, 2-methylpropanoic acid, butanoic acid, pentanoic acid (valeric acid), hexanoic acid (caproic acid), 2-ethylhexanoic acid, heptanoic acid (enanthic acid), hexanoic acid, octanoic acid (caprylic acid), oleic acid, linoleic acid, linolenic acid, cyclohexanecarboxylic acid, cyclohexylacetic acid, cyclohexenecarboxylic acid, benzoic acid, benzeneacetic acid, propanediic acid (malonic acid), butanediic acid (succinic acid), hexanediic acid (adipic acid), 2-butenioic acid (maleic acid), lauric acid, stearic acid, myristic acid, palmitic acid, isoanoic acid, and versatility. TM This includes acids (available from Momentive), other substances, or a combination of two or more of these.

[0053] In one embodiment, the organometallic catalyst is dibutyltin dilaurate.

[0054] Additive (d) can be selected from a number of additives and may be selected as desired for a specific purpose or intended use. Additives may be selected to impart predetermined properties to the cured material formed from the composition, to assist in the processing of the composition, and for other purposes. In one embodiment, additive (d) is selected from pigments, lubricants, viscosity modifiers, heat stabilizers, light stabilizers, flame retardants, inhibitors, adhesion promoters, or two or more combinations thereof.

[0055] In one embodiment, additive (d) is present in an amount of about 0.05 parts by mass to about 3000 parts by mass, about 0.5 parts by mass to about 1000 parts by mass, or about 0.05 parts by mass to about 1 part by mass, based on the total weight of the curable silicone composition. In one embodiment, the additive is present in an amount of about 0 parts by weight to about 50 parts by weight, more preferably about 10 parts by weight to about 40 parts by weight, and most preferably about 25 parts by weight to about 30 parts by weight, based on the total weight of the curable silicone composition.

[0056] In one embodiment, the additive is selected from inhibitors. In one embodiment, the inhibitor is selected from ethylenically unsaturated amides, aromatic unsaturated amides, acetylene compounds, ethylenically unsaturated isocyanates, olefinic siloxanes, unsaturated hydrocarbon diesters, unsaturated hydrocarbon monoesters of unsaturated acids, conjugated or unconjugated enynes, hydroperoxides, ketones, sulfoxides, amines, phosphines, phosphates, nitrites, diaziridines, and others. Inhibitors particularly suitable for the composition are alkynyl alcohols and maleates. Examples of suitable polymerization inhibitors include, but are not limited to, diallyl maleate, hydroquinone, p-methoxyphenol, t-butylcatechol, and phenothiazine.

[0057] In one embodiment, the inhibitor is present in an amount of about 1 to about 10 parts by mass, more preferably about 0.1 to about 2 parts by mass, and most preferably about 0.05 to about 1 part by mass, based on the total weight of the curable silicone-imide composition.

[0058] In one embodiment, additive (d) is selected from polymerization inhibitors. Polymerization inhibitors are not particularly limited and may be selected as desired for a particular purpose or intended use. Examples of suitable inhibitors include, but are not limited to, ethylenically unsaturated amides, aromatic unsaturated amides, acetylene compounds, ethylenically unsaturated isocyanates, olefinic siloxanes, unsaturated hydrocarbon diesters, unsaturated hydrocarbon monoesters of unsaturated acids, conjugated or unconjugated enynes, hydroperoxides, ketones, sulfoxides, amines, phosphines, phosphates, nitrites, diaziridines, and others. Inhibitors particularly suitable for this composition are alkynyl alcohols and maleates. Examples of suitable polymerization inhibitors include, but are not limited to, diallyl maleate, hydroquinone, p-methoxyphenol, t-butylcatechol, phenothiazine, and others.

[0059] The amount of inhibitor used in this composition can be any amount that delays the above reaction at room temperature without hindering the reaction at appropriately raised temperatures. In embodiments, the polymerization inhibitor may be present in an amount of about 0.05 parts by mass to about 10 parts by mass, about 0.1 parts by mass to about 5 parts by mass, or about 1 part by mass to about 2 parts by mass.

[0060] The curable composition may also contain antioxidant compounds. Suitable examples of antioxidant compounds include, but are not limited to, hindered amine compounds and / or hindered phenol compounds.

[0061] Examples of hindered amine antioxidant compounds include, but are not limited to, hindered amine antioxidants such as (N,N',N'',N'''-tetrakis-(4,6-bis(butyl-(N-methyl)-2,2,6,6-tetramethylpiperidine-4-yl)amino)-triazine-2-yl)-4,7-diazadecane-1,10-diamine, dibutylamine-1,3,5-triazine-N,N'-bis-(2,2,6,6-tetramethyl-4-piperidyl)-1,6-hexamethylenediamine-N-(2,2 Polycondensation product of ,6,6-tetramethyl-4-piperidyl)butylamine, poly[{6-(1,1,3,3-tetramethylbutyl)amino-1,3,5-triazine-2,4-diyl}{(2,2,6,6-tetramethyl-4-piperidyl)imino}hexamethylene{(2,2,6,6-tetramethyl-4-piperidyl)imino}], polymer of dimethyl succinate and 4-hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol, [bis(2,2,6,6-tetramethyl-1(octyl)decandioate] [Oxy)-4-piperidyl) ester, reaction product of 1,1-dimethylethyl hydroperoxide and octane] (70%) - polypropylene (30%), bis(1,2,2,6,6-pentamethyl-4-piperidyl)[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate, methyl 1,2,2,6,6-pentamethyl-4-piperidyl sebacate, bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis(1,2,2,6,6-pentamethyl- This includes 4-piperidyl)sebacate, 1-[2-[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyloxy]ethyl]-4-[3-([3,5-di-tert-butyl-4-hydroxyphenyl)propionyloxy]-2,2,6,6-tetramethylpiperidine, 4-benzoyloxy-2,2,6,6-tetramethylpiperidine, 8-acetyl-3-dodecyl-7,7,9,9-tetramethyl-1,3,8-triazaspiro[4.5]decane-2,4-dione, and others.

[0062] In one embodiment, the antioxidant compound is a hindered phenol compound. The hindered phenol may be selected as desired for a particular purpose or intended use. Suitable examples of hindered phenols include, but are not limited to, monophenols such as 2,6-di-t-butyl-p-cresol, 2-t-butyl-4-methoxyphenol, 3-t-butyl-4-methoxyphenol, and 2,6-t-butyl-4-ethylphenol; bisphenols such as 2,2'-methylene-bis(4-methyl-6-t-butylphenol), 4,4'-thiobis(3-methyl-6-t-butylphenol), and 4,4'-butylidene-bis(3-methyl-6-t-butylphenol);Furthermore, polycyclic phenols such as 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane, 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, tetrakis[methylene-3-(3',5'-di-t-butyl-4'-hydroxyphenyl)propionate]methane, bis[3,3'-bis(4'-hydroxy-3)-t-butylphenyl) glycol butyrate, and tocopherol (vitamin E), pentaerythritol-tetrakis[3-(3,5-di-t [3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], thiodiethylene-bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate), N,N'-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenylpropioamide)], 3,5-bis(1,1-dimethylethyl)-4-hydroxyC7-C9 side-chain alkyl ester of benzenepropanoate, 2,4-dimethyl-6-(1- Methylpentadecyl)phenol, diethyl[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]phosphonate, 3,3',3'',5,5',5''-hexa-tert-butyl-a,a',a''-(mesitylene-2,4,6-triyl)tri-p-cresol, calcium diethylbis[[[3,5-bis-(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]phosphonate], 4,6-bis(octylthiomethyl)-o-cresol, ethylenebis(oxyethylene)bis[3-(5-tert-butyl] This includes [4-hydroxy-m-tolyl)propionate], hexamethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione, reaction products of N-phenylbenzeneamine and 2,4,4-trimethylpentene, 2,6-di-tert-butyl-4-(4,6-bis(octylthio)-1,3,5-triazine-2-ylamino)phenol, and others.

[0063] IRGANOX1330 is a sterically hindrance phenol antioxidant commercially available from BASF ("3,3',3',5,5',5'-hexa-tert-butyl-a,a',a''-(mesitylene-2,4,6-triyl)tri-p-cresol"). Irganox1010 is a sterically hindrance phenol antioxidant commercially available from BASF ("pentaerythritol-tetrakis(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate)" or 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene is ETHANOX TM It is commercially available as 330 (Albemarle), pentaerythritol-tetrakis(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate) (Irganox 1010), tris(3,5-di-tert-butyl-4-hydroxybenzyl) isocyanurate (Irganox 3114), and tris(3,5-di-tert-butyl-4-hydroxybenzyl) isocyanurate is commercially available as Irganox 3114.

[0064] The antioxidant may be included in the composition in an amount of about 0 to about 10 parts by mass, about 0 to about 5 parts by mass, or about 0 to about 3 parts by mass.

[0065] The curable composition may optionally contain a light stabilizer. The light stabilizer is not particularly limited and may be selected as desired for a specific purpose or intended use. Examples of suitable materials for the light stabilizer include, but are not limited to, 2,4-di-tert-butyl-6-(5-chlorobenzotriazole-2-yl)phenol, 2-(2H-benzotriazole-2-yl)-4,6-di-tert-pentylphenol, 2-(2H-benzotriazole-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, and methyl 3-(3-(21-1-benzotriazole-2-yl)-5-tert-butyl-4-hydroxyphenyl)propionene. This includes reaction products of 300 / polyethylene glycol, 2-(2H-benzotriazol-2-yl)-6-(linear and branched dodecyl)-4-methylphenol, 2-(4,6-diphenyl-1,3,5-triazine-2-yl)-5-[(hexyl)oxy]phenol, octabenzone, 2,4-di-tert-butylphenyl-3,5-di-tert-butyl-4-hydroxybenzoate, Tinuvin 622LD, Tinuvin 144, CHIMASSORB119FL, MARK LA-57, LA-62, LA-67, LA-63, SANDOL LS-765, LS-292, LS-2626, LS-1114, LS-744, and others.

[0066] The light stabilizer may be included in the composition in an amount of about 0 to about 10 parts by mass, about 0 to about 5 parts by mass, or about 0 to about 3 parts by mass.

[0067] The composition optionally contains a filler (F). In one embodiment, additive (F) is selected from the fillers. Suitable filler examples include, but are not limited to, silica, fumed silica, SiO2, TiO2, MgO, ZnO, CaCO3, CeO2, Fe2O3, SiC, clay materials, graphene oxide, boron oxide, boron nitride, carbon nanotubes, zirconium oxide, fly ash, Zr(OEt)4, Ti(OEt)4, any polyimide in powder form, polybenzimidazole, polyamideimide, polyBPA sulfone, siloxane-polyimide, siloxane-benzimidazole, siloxane-polysulfone, or any other thermally stable filler.

[0068] In one embodiment, the filler is present in an amount of about 0 to about 3000 parts by mass, more preferably about 15 to about 2000 parts by mass, and most preferably about 25 to about 30 parts by mass, based on the total weight of the curable silicone composition. In one embodiment, the filler may be present in an amount of about 0 to about 50 parts by weight, more preferably about 10 to about 40 parts by weight, and most preferably about 25 to about 30 parts by weight, based on the total weight of the curable silicone composition.

[0069] In one embodiment, the filler is present in an amount of about 20 to about 30 parts by mass based on the total weight of the curable silicone composition.

[0070] In one embodiment, the curable composition does not contain any adhesion promoter. In another embodiment, the curable composition contains an adhesion promoter.

[0071] According to one embodiment, the adhesion promoter is selected from alkoxysilanes such as aminoalkylalkoxysilanes and epoxyalkylalkoxysilanes, e.g., 3-glycidoxypropyltrimethoxysilane, mercaptoalkylalkoxysilane, and γ-aminopropyltriethoxysilane, reaction products of ethylenediamine and silyl acrylate. Furthermore, isocyanurates containing silicon groups, such as 1,3,5-tris(trialkoxysilylalkyl)isocyanurate, may be used. Further suitable adhesion promoters are reaction products of epoxyalkylalkoxysilanes, e.g., reaction products of aminosubstituted alkoxysilanes such as 3-glycidoxypropyltrimethoxysilane and 3-aminopropyltrimethoxysilane, optionally further reaction products with alkylalkoxysilanes such as methyltrimethoxysilane, epoxyalkylalkoxysilane, and mercaptoalkylalkoxysilane, derivatives thereof, or combinations of two or more of these.

[0072] The silicone-imide-based polymer (a) is present in an amount of about 20 to about 100 parts by weight, more preferably about 40% to about 95% by weight, and most preferably about 50% to about 91% by weight, based on the total parts by weight of the curable silicone composition.

[0073] The crosslinking agent (b) is present in an amount of about 0.5 to about 50 parts by weight, more preferably about 1 to about 30 parts by weight, and most preferably about 5 to about 10 parts by weight, based on the total parts by weight of the curable silicone composition.

[0074] Catalyst (c) may be present in an amount of about 0.01 to about 5 parts by weight, more preferably about 0.2 to about 1 part by weight, and most preferably about 0.01 to about 0.03 parts by weight, based on the total parts by weight of the curable silicone composition.

[0075] The filler may be present in an amount of about 0 to about 50 parts by weight, more preferably about 10 to about 40 parts by weight, and most preferably about 25 to about 30 parts by weight, based on the total weight of the curable silicone composition.

[0076] Condensation-curable formulations cure in the presence of water, for example, in the form of moisture in the atmosphere. When cured with water, the hydrolysis and condensation reactions described above occur between the organopolysiloxane and the crosslinking agent, optionally assisted by a catalyst, and siloxane bonds are formed by crosslinking. This curing is therefore also called networking. The condensation-curable formulations of this application can be cured by applying the composition to a target substrate (as a one-component composition or by mixing the components of a two-component composition) and exposing the composition to sufficient moisture to promote curing. Curing can be achieved at room temperature (e.g., a temperature of about 20°C to about 25°C) or by raising the temperature (e.g., about 25°C).

[0077] In one embodiment, the silicone-imide composition can be coated or adhered to a substrate. The composition can be applied in any suitable manner, including, but not limited to, brush application, spraying, curtain coating, dipping, spin coating, and others.

[0078] The substrate can be selected from plastic materials, ceramics, glass, rubber materials, filled metals, metal alloys, metallized plastics, and / or coated or painted metals. Suitable plastics include, but are not limited to, synthetic organic polymer materials, such as poly(methyl methacrylate) and other acrylic polymers; polyesters such as poly(ethylene terephthalate), poly(butylene terephthalate), and other polyesters; polyamides, polyimides, acrylonitrile-styrene copolymers, styrene-acrylonitrile-butadiene copolymers, polyvinyl chloride, polyethylene, and others; polycarbonates; and copolycarbonates such as EXL and high-heat polycarbonates. In one embodiment, the substrate is formed from polycarbonate or acrylic resin. Polycarbonate is a particularly suitable material for transparent substrates due to its excellent physical, mechanical, and chemical properties. Generally, the choice of substrate is ultimately determined by the end application being considered.

[0079] This composition may be used for a variety of applications. In embodiments, the composition is cured and used for properties such as excellent thermal stability, thermal conductivity, dimensional stability, adhesion, mechanical properties, electrical properties, low-temperature flexibility, low dielectric constant, thermal oxidation stability, hydrophobicity, chemical resistance, biocompatibility, flame retardancy, and gas permeability, and is mainly used in applications such as aerospace, electronics, automotive, insulation, coatings, and solvent-resistant films.

[0080] Silicone-imide materials formed from this composition may exhibit thermal degradation from 300°C to 600°C, from approximately 350°C to approximately 550°C, or from approximately 400°C to approximately 500°C. Thermal degradation may also be referred to as pyrolysis and can be measured by thermogravimetric analysis (TGA). In one embodiment, thermal degradation can be measured using a TGA Q5000 from TA Instruments. Thermal degradation can be evaluated at a heating rate of 10°C / min up to 1000°C in a nitrogen or air atmosphere. The curable composition may be used in a variety of applications. In embodiments, the curable composition is cured and used for properties such as excellent thermal stability, thermal conductivity, dimensional stability, adhesion, mechanical properties, electrical properties, low-temperature flexibility, low dielectric constant, thermal oxidation stability, hydrophobicity, chemical resistance, biocompatibility, flame retardancy, and gas permeability, and is used primarily in applications such as aerospace, electronics, automotive, insulation, coatings, solvent-resistant films, and others.

[0081] The silicone formulation contains at least one hydroxy-terminated or alkoxy-terminated organopolysiloxane. These hydroxy-terminated or alkoxy-terminated organopolysiloxanes are condensation-crosslinkable. In addition, the hydroxy-terminated or alkoxy-terminated organopolysiloxanes may contain one or more branches. However, linear hydroxy-terminated or alkoxy-terminated organopolysiloxanes are preferred. These organopolysiloxanes are well known to those skilled in the art.

[0082] The silicone formulation may be a one-component or two-component formulation, as in the conventional method. In particular, the silicone formulation according to the present invention is a water-curable silicone formulation.

[0083] The following examples are intended to illustrate embodiments and representations of the present technology. Unless otherwise specified, all parts and percentages are by weight, and all temperatures are in Celsius. All patents, other documents, and U.S. patent applications referenced herein are incorporated in their entirety by reference.

[0084] Examples

[0085] The compositions were prepared according to the examples listed in Tables 1 and 2. These compositions were prepared by mixing the base polymer with the crosslinking agent and condensation catalyst in a container. The mixtures were thoroughly mixed by hand and using a speed mixer.

[0086] The siloxane-imide polymer is a Si-alkoxy-terminated ABn siloxane-polyimide material of formula (I), synthesized from pyromellitic anhydride and allylamine, followed by the introduction of the Si-H moiety and reaction with vinyltrimethoxysilane. [ka]

[0087] Synthesis of N-allylamide of pyromellitic dianhydride: Pyromellitic dianhydride (50 g, 0.2292 mol) and acetic acid (250 ml) were placed in a three-necked round-bottom flask (condenser / overhead stirrer / dropping funnel), and then allyl amide was synthesized under ice-cold conditions. Amine (28g, 0.504 mol) was added dropwise. Once the addition was complete, heating was started from 40°C until the reaction mixture reached 130°C, at which point it became a clear solution. A color change occurred over time. Once the solution was clear, it was heated at 130°C for 4 hours to form a ring. 250 ml of water was placed in another round-bottom flask and heated to approximately 100°C. The reaction mixture was then slowly poured into this water, and a solid substance was formed. This solid substance was filtered off using filter paper and a funnel. The solid substance was washed with water and methanol and dried using a high-vacuum pump. The yield was 65 g (95%). 1 The analysis was performed using 1H-NMR.

[0088] General procedure for the synthesis of Si-alkoxy-terminated ABn siloxane-imide polymers: N-allyl-terminated pyromellitic diimide and toluene (three times the volume of the total reactants) were placed in a three-necked round-bottom flask (condenser / thermometer / dropping funnel) under an inert atmosphere and heated to 75°C until the mixture became a clear solution. Platinum catalyst (15 ppm) was added, followed by M H D n M H The compound (calculated in ABn based on the target n) was added dropwise. The reaction was monitored by 1H-NMR, and after the reaction was complete (disappearance of the allyl group peak), vinyltrimethoxysilane (0.02 equivalents) was added dropwise from a dropping funnel. Once the reaction was complete (disappearance of the hydride peak in 1H-NMR), the reaction was quenched over activated carbon. The product was obtained by removing toluene from the filtrate using a rotary evaporator. The product was obtained as a liquid, with a yield of approximately >80%. This substance was analyzed by 1H-NMR.

[0089] The crosslinking agent is selected from alkoxysilicates or alkoxysilanes.

[0090] The condensation-curable silicone-imide-based polymers used in the examples may differ in the concentration of low-molecular-weight volatile substances or low-molecular-weight cyclic substances.

[0091] Tatami mats are 145mm thick. 2 The material was poured into a Teflon mold measuring 0.15 mm in size and allowed to cure completely at room temperature for 24 hours.

[0092] Thermal stability: Thermal degradation was evaluated using TA Instruments' TGA Q5000 at a heating rate of 10°C / min up to 1000°C in a nitrogen or air atmosphere. [Table 1] [Table 2]

[0093] As illustrated in Tables 1 and 2, the condensation-curable adhesive compositions of the present invention, which include siloxane-imide as a base polymer, provide better thermal stability compared to those using known base polymers.

[0094] The above descriptions include examples provided herein. Naturally, it is impossible to describe all recognizable combinations of components or methods for the purposes of this specification, but those skilled in the art will recognize that many other combinations and substitutions are possible herein. Thus, this specification is intended to encompass all changes, modifications, and variations that fall within the idea and scope of the claims. Furthermore, where the term “includes” is used in the detailed description of the invention or in the claims, the term is intended to be inclusive in a similar manner to how the term “includes” is interpreted when it is used as a substitute in the claims.

[0095] The above description identifies various, non-limiting embodiments of aromatic-containing silicone compositions and curable compositions containing such compositions. Modifications may be recalled by those skilled in the art and those who can create and use the present invention. The disclosed embodiments are for illustrative purposes only and are not intended to limit the scope of the invention or the subject matter described in the claims.

Claims

1. (a) Silicone-imide-based polymer selected from compounds of formula (I) 【Chemistry 4】 In the formula, R1 is selected from C5-C20 aryl groups, polycyclic aryl groups containing two or more C5-C20 aryl groups, where R1 is unsubstituted or can be substituted with C1-C6 alkyl groups, halogen groups, haloalkyl groups, hydroxyl groups, and / or C1-C5 alkoxy groups; C1 can be selected from C1-C5 alkyl groups, C5-C20 aryl groups, C7-C16 arylalkyl groups, or C7-C16 alkylaryl groups; R2, R3, and R4 may be the same or different and can be selected from C1-C3 alkyl groups or phenyl groups; R5 may be the same or different and can be selected from C1-C30 alkyl groups, C1-C30 alkoxy groups, C1-C30 acetoxy groups, or C1-C30 ketoxime groups; m is an integer between 1 and 30; and n is an integer between 1 and 200; (b) A crosslinking agent comprising at least two groups reactive with condensing groups in a silicone-imide polymer; (c) A condensation curing catalyst; and (d) A condensation curable composition comprising optionally an additive.

2. R １ The condensation-curable composition of claim 1, wherein is selected from benzene, naphthalene, benzophenone, biphenyl, biphenylalkane, biphenyl ether, isopropylidene diphenylphenoxy, biphenyl sulfone, biphenyl sulfide, norbornyl, and hexafluoromethylbiphenyl.

3. R １ The condensation-curable composition according to claim 1, wherein is benzene.

4. A condensation-curable composition according to any one of claims 1 to 3, comprising a silicone-imide-based polymer (a) in an amount of 40% to 95% by weight based on the total weight of the condensation-curable composition.

5. The condensation-curable composition according to any one of claims 1 to 4, wherein a silicone-imide-based polymer (a) is present in an amount of 50% to 91% by weight based on the total weight of the condensation-curable composition.

6. The condensation-curable composition according to any one of claims 1 to 5, wherein the crosslinking agent (b) is selected from alkoxysilane, alkoxysilicate, alkoxysiloxane, oxymosilane, oxymosiloxane, enoxysilane, enoxysiloxane, aminosilane, carboxysilane, carboxysiloxane, alkylamidosilane, alkylamidosiloxane, arylamidosilane, arylamidosiloxane, alkoxyaminosilane, alkalylaminosiloxane, alkoxycarbamatesilane, alkoxycarbamatesiloxane, or a combination of two or more of these.

7. The condensation-curable composition of claim 6, wherein the crosslinking agent (b) is selected from tetraethyl orthosilicate (TEOS), methyltrimethoxysilane (MTMS), or a combination thereof.

8. The condensation-curable composition according to any one of claims 1 to 7, wherein the crosslinking agent (b) is contained in an amount of 0.5 to 50 parts by weight based on 100 parts by weight of the total condensation-curable composition.

9. The condensation-curable composition according to any one of claims 1 to 8, wherein the crosslinking agent (b) is contained in an amount of 5 to 10 parts by weight based on 100 parts by weight of the total condensation-curable composition.

10. The condensation-curable composition according to any one of claims 1 to 9, wherein catalyst (c) is selected from (i) a metal catalyst or organometallic catalyst comprising a metal selected from Ca, Ce, Bi, Fe, Mo, Mn, Pb, Ti, V, Zn, Sn, and Y, or (ii) a non-tin catalyst comprising a combination of a carboxylic acid component, an amino-containing silane or a mixture of amino-containing silanes, and optionally an amino-containing siloxane component.

11. The condensation-curable composition according to claim 10, wherein the organometallic catalyst is dibutyltin dilaurate.

12. The condensation-curable composition according to any one of claims 1 to 11, comprising catalyst (c) in an amount from 0.01 parts by weight to 5 parts by weight based on 100 parts by weight of the total condensation-curable composition.

13. The condensation-curable composition according to any one of claims 1 to 12, wherein additive (d) is selected from fillers, pigments, lubricants, viscosity modifiers, antioxidants, light stabilizers, heat stabilizers, flame retardants, inhibitors, adhesion promoters, or combinations of two or more thereof.

14. The additive (d) is SiO ２ , TiO ２ , MgO, ZnO, CaCO ３ , CeO ２ , Fe ２ O ３ , SiC, clay material, graphene oxide, boron oxide, boron nitride, carbon nanotube, zirconium oxide, fly ash, Zr(OEt) ４ , Ti(OEt) ４ , any polyimide, polybenzimidazole, polyamideimide, polybis-phenol A sulfone, siloxane-polyimide, siloxane-benzimidazole, siloxane-polysulfone in powder form, a filler selected from two or more combinations thereof, the condensation curable composition of claim 13

15. Filler is Fe ２ O ３ The condensation-curable composition according to claim 14.

16. The condensation-curable composition according to claim 14 or 15, comprising a filler in an amount from 0 to 50 parts by weight based on 100 parts by weight of the total condensation-curable composition.

17. The condensation-curable composition according to claim 14 or 15, comprising a filler in an amount from 10 to 40 parts by weight based on a total of 100 parts by weight of the condensation-curable composition.

18. A cured silicone-imide material formed from any condensation-curable composition according to claim 1 to 17.

19. A cured silicone-imide material according to claim 18, which has thermal degradation from 400°C to 600°C as measured by thermogravimetric analysis.

20. The cured silicone-imide material according to claim 18 or 19, which is used in aerospace devices, electronic devices, electronic components, automobiles, thermal insulation materials, coatings, or solvent-resistant films, or as part of an article.

21. An article comprising a substrate, wherein a condensation-curable composition according to any one of claims 1 to 17 is coated or adhered to the surface of the substrate.

22. The article of claim 21, wherein the base material comprises a material selected from plastic materials, ceramics, glass, rubber materials, filled metals, metal alloys, metallized plastics, coated or painted metals, or two or more combinations thereof.

23. The article of claim 21, wherein the base material is selected from acrylic polymer, polyester, polyamide, polyimide, acrylonitrile-styrene copolymer, styrene-acrylonitrile-butadiene polymer, polyvinyl chloride, polyethylene, polycarbonate, copolycarbonate, or two or more combinations thereof.

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