Solid-state battery module

Abstract

Provided is a solid-state battery module capable of efficiently performing wireless power transmission and the like.　A solid-state battery module (1000) comprises: a first substrate (200A) with wiring (210); a solid-state battery (100) provided on the first substrate (200A); and a second substrate (200B) that is provided above the solid-state battery (100) and that includes therein a coil unit (300) which can be electrically connected to the first substrate (200A).　The top surface of the second substrate (200B) is positioned along the module top surface (1100), or inside of the module top surface (1100).

Description

Solid-state battery module

[0001] The present invention relates to a solid-state battery module, and more particularly to a solid-state battery that is modularized so as to be mountable on a substrate.

[0002] Secondary batteries, which can be repeatedly charged and discharged, have been used for various applications. For example, secondary batteries are used as power sources for electronic devices such as smartphones and laptops. In secondary batteries, a liquid electrolyte is generally used as a medium for ion migration, which contributes to charging and discharging. In other words, so-called electrolytic solution is used in secondary batteries. However, such secondary batteries generally require safety in terms of preventing leakage of the electrolytic solution. In addition, organic solvents and the like used in the electrolytic solution are flammable, so safety is also required in this respect.

[0003] Therefore, research is being conducted on solid-state batteries that use a solid electrolyte instead of a liquid electrolyte. A solid-state battery has battery elements including a positive electrode layer, a negative electrode layer, and a solid electrolyte interposed between the positive electrode layer and the negative electrode layer.

[0004] JP 2018-160968 A

[0005] The solid-state battery may be used, for example, as a control circuit for the solid-state battery, a sensor, an antenna, a wireless power supply circuit, or a solid-state battery module that combines and integrates these.

[0006] A solid-state battery module having a wireless power supply mechanism or a wireless communication mechanism requires a coil unit for transmitting and receiving electromagnetic waves. The coil unit may be arranged separately from the solid-state battery module. For example, the coil unit may be externally attached to the solid-state battery module. In such an arrangement, if the coil unit is arranged separately from the solid-state battery module, the total size of the solid-state battery module and the coil unit may become large. Furthermore, depending on the position of the separately arranged coil unit relative to the location of the solid-state battery module, the inductance value of the coil unit may differ, and matching must be performed for each solid-state battery module. For these reasons, it is difficult to say that an arrangement in which the coil unit is arranged separately from the solid-state battery module efficiently implements wireless power supply, etc.

[0007] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a solid-state battery module that can efficiently perform wireless power supply and the like.

[0008] The present invention provides a solid-state battery module comprising: a first substrate having wiring; a solid-state battery arranged on the first substrate; and a second substrate arranged on top of the solid-state battery and having a coil portion therein that can be electrically connected to the first substrate, wherein the top surface of the second substrate is positioned along or inside the module top surface.

[0009] The solid-state battery module according to the present invention makes it possible to efficiently perform wireless power supply and the like.

[0010] FIG. 1 is a cross-sectional view schematically showing the configuration of a solid-state battery module according to an embodiment. FIG. 2 is a cross-sectional view schematically showing the solid-state battery module of FIG. 1 cut along a side surface 1300. FIG. 3 is a cross-sectional view schematically showing the configuration of a solid-state battery module according to an embodiment. FIG. 4 is a cross-sectional view schematically showing the solid-state battery module of FIG. 3 cut along a side surface 1300. FIG. 5 is a plan view schematically showing a coil unit provided in a solid-state battery module according to an embodiment. FIG. 6 is a plan view schematically showing a coil unit provided in a solid-state battery module according to an embodiment. FIG. 7 is a plan view schematically showing a coil unit provided in a solid-state battery module according to an embodiment. FIG. 8 is a cross-sectional view schematically showing the configuration of a solid-state battery module according to an embodiment. FIG. 9 is a cross-sectional view schematically showing the solid-state battery module of FIG. 8 cut along a side surface 1300. FIG. 10 is a plan view schematically showing the bottom surface of a solid-state battery module according to an embodiment. FIG. 11A is a cross-sectional view schematically showing a step in a method for manufacturing a solid-state battery module according to an embodiment. Fig. 11B is a process cross-sectional view schematically showing a step in a method for manufacturing a solid battery module according to one embodiment of the present invention. Fig. 11C is a process cross-sectional view schematically showing a step in a method for manufacturing a solid battery module according to one embodiment of the present invention. Fig. 11D is a process cross-sectional view schematically showing a step in a method for manufacturing a solid battery module according to one embodiment of the present invention. Fig. 11E is a process cross-sectional view schematically showing a step in a method for manufacturing a solid battery module according to one embodiment of the present invention. Fig. 11F is a process cross-sectional view schematically showing a step in a method for manufacturing a solid battery module according to one embodiment of the present invention.

[0011] Hereinafter, a solid-state battery module according to an embodiment of the present invention will be described in detail. Although the description will be made with reference to the drawings as necessary, the contents shown in the drawings are merely schematic and illustrative for understanding the present invention, and the appearance and dimensional ratios may differ from the actual product.

[0012] In this specification, the term "solid-state battery module" refers, in a broad sense, to a composite device composed of multiple components including a solid-state battery, and, in a narrow sense, to a composite device composed of a solid-state battery, circuit elements, a circuit connecting them, and a substrate.

[0013] The term "cross-sectional view" as used herein refers to a view taken from a direction substantially perpendicular to the stacking direction in the stacked structure of a solid-state battery (in other words, a view taken along a plane parallel to the thickness direction of the layers). The term "plan view" as used herein refers to a sketch of an object viewed from above or below along the thickness direction of the layers (i.e., the stacking direction).

[0014] The terms "upper and lower directions" and "left and right directions" used directly or indirectly in this specification correspond to the upper and lower directions and left and right directions in the drawings, respectively. Unless otherwise specified, the same symbols or signs indicate the same components or parts or the same meanings. In a preferred embodiment, the vertical downward direction (i.e., the direction in which gravity acts) can be considered to correspond to the "lower direction" / "bottom side," and the opposite direction can be considered to correspond to the "upper direction" / "top side."

[0015] In the present invention, the term "solid-state battery" broadly refers to a battery whose components are made of solids, and in the narrow sense refers to an all-solid-state battery whose components are all made of solids. In a preferred embodiment, the solid-state battery of the present invention is a stacked solid-state battery in which each layer constituting a battery unit is stacked on top of each other, and preferably each such layer is made of a sintered body. The term "solid-state battery" encompasses not only so-called "secondary batteries" that can be repeatedly charged and discharged, but also "primary batteries" that can only discharge. According to a preferred embodiment of the present invention, the "solid-state battery" is a secondary battery. The term "secondary battery" should not be overly limited to its name, and can also include, for example, an electricity storage device. In the present invention, the solid-state battery included in the module can also be referred to as a "solid-state battery element."

[0016] Fig. 1 is a cross-sectional view schematically showing the configuration of a modularized solid-state battery according to one embodiment of the present invention. Fig. 2 is a cross-sectional view schematically showing the solid-state battery module of Fig. 1 cut along a side surface 1300.

[0017] [Basic Structure of Solid-State Battery] First, the basic structure of the solid-state battery 100 will be described below. The structure of the solid-state battery described here is merely an example for understanding the invention and is not intended to limit the invention. The solid-state battery 100 has at least positive and negative electrode layers and a solid electrolyte. Specifically, the solid-state battery 100 has battery elements including battery structural units each consisting of a positive electrode layer 110, a negative electrode layer 120, and at least a solid electrolyte 130 interposed therebetween.

[0018] The layers of the solid-state battery 100 may be formed by firing, and the positive electrode layer, the negative electrode layer, the solid electrolyte, etc. may form fired layers. Preferably, the positive electrode layer, the negative electrode layer, and the solid electrolyte are fired together, and therefore the battery elements form a fired body.

[0019] The positive electrode layer is an electrode layer containing at least a positive electrode active material. The positive electrode layer may further contain a solid electrolyte. In a preferred embodiment, the positive electrode layer may be composed of a sintered body containing at least positive electrode active material particles and a solid electrolyte. On the other hand, the negative electrode layer is an electrode layer containing at least a negative electrode active material. The negative electrode layer may further contain a solid electrolyte. In a preferred embodiment, the negative electrode layer may be composed of a sintered body containing at least negative electrode active material particles and a solid electrolyte.

[0020] The positive electrode active material and the negative electrode active material are materials involved in the transfer of electrons in a solid-state battery. Charge and discharge are performed by transferring (conducting) ions between the positive electrode layer and the negative electrode layer via the solid electrolyte, transferring electrons. It is preferable that each electrode layer, the positive electrode layer and the negative electrode layer, is a layer capable of absorbing and releasing lithium ions or sodium ions in particular. In other words, the solid-state battery is preferably an all-solid-state secondary battery in which lithium ions or sodium ions transfer between the positive electrode layer and the negative electrode layer via the solid electrolyte to charge and discharge the battery.

[0021] (Positive electrode active material) The positive electrode active material contained in the positive electrode layer can be selected from the group consisting of, for example, lithium-containing phosphate compound with Nasicon structure, lithium-containing phosphate compound with olivine structure, lithium-containing layered oxide, and lithium-containing oxide with spinel structure.An example of the lithium-containing phosphate compound with Nasicon structure is Li ３ V ２ (P.O. ４ ) ３ Examples of lithium-containing phosphate compounds having an olivine structure include Li ３ Fe ２ (P.O. ４ ) ３ , LiFePO ４ , and / or LiMnPO ４ An example of a lithium-containing layered oxide is LiCoO ２ , and / or LiCo １／３ Ni １／３ Mn １／３ O ２ An example of a lithium-containing oxide having a spinel structure is LiMn ２ O ４ , and / or LiNi ０．５ Mn １．５ O ４ The lithium compound may be, for example, a lithium transition metal composite oxide or a lithium transition metal phosphate compound. The lithium transition metal composite oxide is a general term for oxides containing lithium and one or more transition metal elements as constituent elements, and the lithium transition metal phosphate compound is a general term for phosphate compounds containing lithium and one or more transition metal elements as constituent elements. The transition metal element may be, for example, cobalt (Co), nickel (Ni), manganese (Mn), or iron (Fe), for example.

[0022] In addition, the positive electrode active material capable of absorbing and releasing sodium ions may be at least one selected from the group consisting of sodium-containing phosphate compounds having a Nasicon structure, sodium-containing phosphate compounds having an olivine structure, sodium-containing layered oxides, and sodium-containing oxides having a spinel structure. For example, in the case of sodium-containing phosphate compounds, Na ３ V ２ (P.O. ４ ) ３ , NaCoFe ２ (P.O. ４ ) ３ , Na ２ Ni ２ Fe(PO ４ ) ３ , Na ３ Fe ２ (P.O. ４ ) ３ , Na ２ FeP ２ O ７ , Na ４ Fe ３ (P.O. ４ ) ２ (P ２ O ７ ), and NaFeO as a sodium-containing layered oxide ２ At least one selected from the group consisting of:

[0023] Alternatively, the positive electrode active material may be, for example, an oxide, a disulfide, a chalcogenide, or a conductive polymer. The oxide may be, for example, titanium oxide, vanadium oxide, or manganese dioxide. The disulfide may be, for example, titanium disulfide or molybdenum sulfide. The chalcogenide may be, for example, niobium selenide. The conductive polymer may be, for example, a disulfide, polypyrrole, polyaniline, polythiophene, polyparastyrene, polyacetylene, or polyacene.

[0024] (Negative Electrode Active Material) Examples of the negative electrode active material contained in the negative electrode layer include at least one selected from the group consisting of oxides containing at least one element selected from the group consisting of titanium (Ti), silicon (Si), tin (Sn), chromium (Cr), iron (Fe), niobium (Nb), and molybdenum (Mo), carbon materials such as graphite, graphite-lithium compounds, lithium alloys, lithium-containing phosphate compounds having a Nasicon structure, lithium-containing phosphate compounds having an olivine structure, and lithium-containing oxides having a spinel structure. An example of a lithium alloy is Li-Al. An example of a lithium-containing phosphate compound having a Nasicon structure is Li3V2(PO4)3 and / or LiTi2(PO4)3. An example of a lithium-containing phosphate compound having an olivine structure is Li3Fe2(PO4)3 and / or LiCuPO4. An example of a lithium-containing oxide having a spinel structure is Li4Ti5O. 12 etc.

[0025] In addition, examples of negative electrode active materials capable of absorbing and releasing sodium ions include at least one selected from the group consisting of sodium-containing phosphate compounds having a Nasicon structure, sodium-containing phosphate compounds having an olivine structure, and sodium-containing oxides having a spinel structure.

[0026] In the solid-state battery, the positive electrode layer and the negative electrode layer may be made of the same material.

[0027] The positive electrode layer and / or the negative electrode layer may contain a conductive material, which may include at least one of metal materials such as silver, palladium, gold, platinum, aluminum, copper, and nickel, and carbon.

[0028] Furthermore, the positive electrode layer and / or the negative electrode layer may contain a sintering aid, such as at least one selected from the group consisting of lithium oxide, sodium oxide, potassium oxide, boron oxide, silicon oxide, bismuth oxide, and phosphorus oxide.

[0029] The thickness of the positive electrode layer and the negative electrode layer is not particularly limited, but may be, for example, independently 2 μm or more and 50 μm or less, particularly 5 μm or more and 30 μm or less.

[0030] (Positive Electrode Current Collector Layer / Negative Electrode Current Collector Layer) Although not essential elements of the electrode layer, the positive electrode layer and the negative electrode layer may each comprise a positive electrode current collector layer and a negative electrode current collector layer. The positive electrode current collector layer and the negative electrode current collector layer may each have the form of a foil. However, if greater emphasis is placed on improving electronic conductivity through co-firing, reducing the manufacturing cost of the solid-state battery, and / or reducing the internal resistance of the solid-state battery, the positive electrode current collector layer and the negative electrode current collector layer may each have the form of a sintered body. The positive electrode current collector constituting the positive electrode current collector and the negative electrode current collector constituting the negative electrode current collector are preferably made of a material with high conductivity, such as silver, palladium, gold, platinum, aluminum, copper, and / or nickel. The positive electrode current collector and the negative electrode current collector may each have an electrical connection portion for electrical connection to the outside and may be configured to be electrically connectable to an end electrode. Note that when the positive electrode current collector and the negative electrode current collector have the form of a sintered body, they may be composed of a sintered body containing a conductive material and a sintering aid. The conductive materials contained in the positive electrode current collecting layer and the negative electrode current collecting layer may be selected from, for example, the same materials as the conductive materials that may be contained in the positive electrode layer and the negative electrode layer. The sintering aids contained in the positive electrode current collecting layer and the negative electrode current collecting layer may be selected from, for example, the same materials as the sintering aids that may be contained in the positive electrode layer and the negative electrode layer. As described above, the positive electrode current collecting layer and the negative electrode current collecting layer are not essential for a solid-state battery, and a solid-state battery that does not include such a positive electrode current collecting layer and a negative electrode current collecting layer is also conceivable. In other words, the solid-state battery included in the package of the present invention may be a solid-state battery without a current collecting layer.

[0031] (Solid Electrolyte) The solid electrolyte is a material capable of conducting lithium ions or sodium ions. In particular, the solid electrolyte layer constituting a battery unit in a solid-state battery may be a layer capable of conducting lithium ions between the positive electrode layer and the negative electrode layer. The solid electrolyte layer may be provided at least between the positive electrode layer and the negative electrode layer. In other words, the solid electrolyte layer may be present around the positive electrode layer and / or the negative electrode layer so as to extend from between the positive electrode layer and the negative electrode layer. The solid electrolyte contained in the solid electrolyte layer may include, for example, one or more of a crystalline solid electrolyte, a glass-based solid electrolyte, a glass-ceramic-based solid electrolyte, and the like.

[0032] The crystalline solid electrolyte is, for example, an oxide-based crystalline material and a sulfide-based crystalline material. The oxide-based crystalline material includes, for example, a lithium-containing phosphate compound having a Nasicon structure, an oxide having a perovskite structure, an oxide having a garnet structure or a garnet-like structure, an oxide glass ceramic-based lithium ion conductor, etc. The lithium-containing phosphate compound having a Nasicon structure includes Li ｘ M ｙ (P.O. ４ ) ３ (1≦x≦2, 1≦y≦2, M is at least one selected from the group consisting of titanium (Ti), germanium (Ge), aluminum (Al), gallium (Ga) and zirconium (Zr). An example of a lithium-containing phosphate compound having a Nasicon structure is, for example, Li １．２ Al ０．２ Ti １．８ (P.O. ４ ) ３ Examples of oxides having a perovskite structure include La ０．５５ Li ０．３５ TiO ３ Examples of oxides having a garnet-type or garnet-like structure include Li ７ La ３ Zr ２ O １２ Examples of sulfide-based crystal materials include thio-LISICON, for example, Li ３．２５ Ge０．２５ P ０．７５ S4 and Li １０ GeP ２ S １２ The crystalline solid electrolyte may include a polymer material (for example, polyethylene oxide (PEO)).

[0033] Examples of glass-based solid electrolytes include oxide-based glass materials and sulfide-based glass materials. Examples of oxide-based glass materials include 50Li ４ SiO ４ ・50Li ３ BO ３ The sulfide glass material is, for example, 30Li ２ S・26B ２ S ３ ・44LiI, 63Li ２ S・36SiS ２ ・1Li ３ P.O. ４ , 57Li ２ S・38SiS ２ ・5Li ４ SiO ４ , 70Li ２ S・30P ２ S ５ and 50Li ２ S・50GeS ２ etc.

[0034] The glass ceramic solid electrolyte may be, for example, an oxide-based glass ceramic material or a sulfide-based glass ceramic material. As the oxide-based glass ceramic material, for example, a phosphate compound containing lithium, aluminum, and titanium as constituent elements (LATP) or a phosphate compound containing lithium, aluminum, and germanium as constituent elements (LAGP) may be used. LATP may be, for example, Li １．０７ Al ０．６９ Ti １．４６ (P.O. ４ ) ３ LAGP is, for example, Li １．５ Al ０．５ Ge １．５ (P.O. ４ ) and the like. Examples of sulfide-based glass ceramic materials include Li ７ P３ S １１ and Li ３．２５ P ０．９５ S ４ etc.

[0035] In addition, examples of solid electrolytes capable of conducting sodium ions include sodium-containing phosphate compounds having a Nasicon structure, oxides having a perovskite structure, and oxides having a garnet or garnet-like structure. Examples of sodium-containing phosphate compounds having a Nasicon structure include Na x M y (PO4)3 (1≦x≦2, 1≦y≦2, M is at least one selected from the group consisting of Ti, Ge, Al, Ga and Zr).

[0036] The solid electrolyte layer may contain a sintering aid. The sintering aid contained in the solid electrolyte layer may be selected from the same materials as the sintering aids that may be contained in the positive electrode layer and the negative electrode layer, for example.

[0037] The thickness of the solid electrolyte layer is not particularly limited. The thickness of the solid electrolyte layer located between the positive electrode layer and the negative electrode layer may be, for example, 1 μm to 15 μm, particularly 1 μm to 5 μm.

[0038] (End Electrodes) Solid-state batteries are generally provided with end electrodes 140. In particular, end electrodes 140 are provided on the side surfaces of the solid-state battery. More specifically, an end electrode on the positive electrode side connected to the positive electrode layer and an end electrode on the negative electrode side connected to the negative electrode layer are provided (see FIG. 1). Such end electrodes preferably contain a material with high conductivity. Specific materials for the end electrodes are not particularly limited, but may include at least one selected from the group consisting of silver, gold, platinum, aluminum, copper, tin, and nickel.

[0039] (Covering portion) The solid-state battery module may include a covering portion that covers the solid-state battery. The covering portion is a layer that covers at least the periphery of the solid-state battery. As shown in FIGS. 1 and 2 , the solid-state battery 100 may be entirely enveloped by the covering portion 500. In other words, the solid-state battery 100 may be entirely surrounded by the covering portion 500.

[0040] The covering portion covers the solid-state battery, thereby shielding it from the external environment. This can further suppress deterioration of battery characteristics due to water vapor (more specifically, deterioration of the solid-state battery characteristics due to water vapor from the external environment). Note that "water vapor" as used herein is not limited to gaseous water, but also includes liquid water. In other words, the term "water vapor" is used to broadly encompass anything related to water, regardless of its physical state. Therefore, "water vapor" can also be referred to as moisture, and liquid water can include condensed water formed by condensation of gaseous water.

[0041] The covering portion may include a covering insulating layer and a covering inorganic layer located outside the covering insulating layer. For example, as shown in FIGS. 1 and 2 , the covering insulating layer 510 may be provided so as to cover the solid-state battery 100 and the electronic component 600 on the first substrate. In other words, the solid-state battery 100 and the electronic component 600 may be largely enclosed as a whole by the covering insulating layer 510. The covering inorganic layer 520 may be positioned relatively farther from the solid-state battery 100 than the covering insulating layer 510. In other words, the covering inorganic layer 520 may be provided so as to cover the covering insulating layer 510. Since the covering inorganic layer 520 is positioned outside the covering insulating layer 510, it has a form that, together with the covering insulating layer 510, covers the periphery of the solid-state battery 100.

[0042] (Coating Insulation Layer) The coating insulation layer may be of any type as long as it exhibits insulating properties. For example, the coating insulation layer preferably corresponds to a resin layer. That is, the coating insulation layer preferably contains a resin, which forms the base material of the layer.

[0043] The material of the covering insulating layer may be any type as long as it exhibits insulating properties. For example, the covering insulating layer may contain a resin, and the resin may be either a thermosetting resin or a thermoplastic resin. The covering insulating layer may contain an inorganic filler. As just one example, the covering insulating layer may be made of SiC, SiO ２The insulating coating layer may be made of an epoxy resin containing an inorganic filler such as SiN. ６ It is sufficient if it is Ω·cm or more.

[0044] (Coating Inorganic Layer) The coating inorganic layer may have, for example, a film form. Furthermore, the coating inorganic layer may also cover the side surfaces of the substrate. The coating insulating layer cooperates with the coating inorganic layer to form a suitable water vapor barrier, and the coating inorganic layer cooperates with the coating insulating layer to form a suitable water vapor barrier.

[0045] The term "barrier" as used herein means that the substrate has a water vapor permeability preventing property to such an extent that water vapor from the external environment does not pass through the substrate and cause undesirable deterioration of the characteristics of the solid-state battery. In a narrow sense, the term "barrier" means a property that prevents water vapor permeation to such an extent that the water vapor permeability is 5×10 －３ g / (m ２ In short, the water vapor barrier layer preferably has a thermal conductivity of 0 to 5×10 －３ g / (m ２ - It has a water vapor transmission rate of less than 1000 sq. m / s (Day).

[0046] The material of the coating inorganic layer is not particularly limited and may be metal, glass, oxide ceramic, or a mixture thereof. In a preferred embodiment, the coating inorganic layer contains a metal component. The thickness of the coating inorganic layer may be 0.1 μm or more and 100 μm or less, for example, 1 μm or more and 50 μm or less.

[0047] (Metal Pads) To further strengthen the bond between the coated inorganic layer and the substrate, metal pads may be interposed between the coated portion and the substrate. For example, as shown in FIG. 1, metal pads 523 may be provided on the first substrate 200A and the second substrate 200B, and the coated inorganic layer 520 may be provided so as to extend over the metal pads 523. As shown in FIG. 1, such metal pads 523 may be provided, for example, on the periphery of the bottom surface of the first substrate 200A and the top surface of the second substrate 200B. In particular, when the substrate is made of ceramic or the like, it is preferable to provide metal pads.

[0048] [Characteristic Features of the Present Invention] The following describes the characteristic features of the present invention. The description will be made with reference to the drawings. The contents shown in the drawings are merely shown schematically and exemplarily to facilitate understanding of the present invention, and the appearance and dimensional ratios may differ from the actual product. In each drawing, components having the same function may be assigned the same reference numerals. In the embodiments described below, descriptions of matters common to the above may be omitted, and only differences may be described. Furthermore, the various embodiments described below may be implemented in any combination, and are not limited to the embodiments described in this application.

[0049] 1 and 2 , a solid-state battery module 1000 according to one embodiment includes a first substrate 200A having wiring, a solid-state battery 100 disposed on the first substrate 200A, and a second substrate 200B disposed above the solid-state battery 100 and including therein a coil unit 300 electrically connectable to the first substrate 200A, with the top surface of the second substrate 200B positioned along or inside the module top surface. The second substrate 200B including therein the coil unit 300 electrically connectable to the first substrate is positioned on the opposite side of the first substrate 200A with the solid-state battery 100 sandwiched therebetween.

[0050] In the solid-state battery module 1000 shown in FIGS. 1 and 2 , a first substrate 200A, a solid-state battery 100, and a second substrate 200B are arranged in this order. The coil unit 300 is provided inside the second substrate 200B. When the coil unit 300 is subjected to a magnetic field, an induced current is generated in the coil unit 300. The induced current flows to the solid-state battery 100 via the first substrate 200A, which has wiring electrically connected to the coil unit 300, and the solid-state battery 100 is charged. The solid-state battery module 1000 can be mounted on a mounting substrate via the first substrate 200A. Note that in this specification, an alternating magnetic field generated by an alternating current may be simply referred to as a "magnetic field."

[0051] The module top surface refers to the module outer surface on the top side of the solid-state battery module among the module outer surfaces that form the outer contour of the solid-state battery module. As shown in FIGS. 1 and 2 , the main surface of the solid-state battery module 1000 that is relatively closer to the second substrate 200B is the top surface 1100 of the solid-state battery module. In this specification, the top surface 1100 of the solid-state battery module is also simply referred to as the module top surface 1100. Meanwhile, the main surface of the solid-state battery module 1000 that is relatively closer to the first substrate 200A is the bottom surface 1200 of the solid-state battery module. The surface connecting the top surface 1100 of the solid-state battery module and the bottom surface 1200 of the solid-state battery module is the side surface 1300 of the solid-state battery module. In this specification, the side surface 1300 of the solid-state battery module is also simply referred to as the module side surface 1300. Since the solid-state battery module 1000 can be mounted on a mounting substrate via the first substrate 200A, the bottom surface 1200 of the solid-state battery module can also be considered a mounting surface.

[0052] "The top surface of the second substrate 200B is aligned with the module top surface" means that the top surface of the second substrate 200B and the module top surface are located on the same plane. Specifically, this means that, of the main surfaces of the second substrate, the main surface that is relatively distal from the solid-state battery and the module top surface are located on the same plane. Note that the top surface of the second substrate 200B refers to the main surface of the second substrate that is proximal to the module top surface.

[0053] 1 and 2, the top surface of the second substrate 200B having the coil portion 300 therein is disposed inside the module top surface 1100. "Inside the module top surface" means the direction from the module top surface 1100 toward the inside of the solid-state battery module 1000 (e.g., the solid-state batteries 100).

[0054] According to the above-described aspect, the solid-state battery module of the present disclosure can achieve the following effects.

[0055] A solid-state battery module having a wireless power supply mechanism or a wireless communication mechanism requires a coil unit for transmitting and receiving electromagnetic waves. The coil unit may be disposed separately from the solid-state battery module. For example, the coil unit may be disposed externally on the solid-state battery module. When the coil unit is disposed separately from the solid-state battery module, the total size of the solid-state battery module and the coil unit may become large.

[0056] In the solid-state battery module of the present disclosure, the coil unit is positioned inside the second substrate. The top surface of the second substrate having the coil unit therein is positioned along the module top surface or more inward than the module top surface. The module top surface is the outer surface of the solid-state battery module that forms the outer contour of the solid-state battery module. Therefore, the top surface of the second substrate including the coil unit is positioned flush with the outer surface of the solid-state battery module or more inward than the outer surface of the solid-state battery module. In other words, the coil unit is disposed inside the solid-state battery module. Such a coil unit arrangement does not require a separate location for arranging the coil unit separately from the solid-state battery module, and therefore the total size of the solid-state battery module and the coil unit can be reduced.

[0057] The coil unit has an inherent inductance value, and the inductance value of the coil unit can be affected by other components included in the solid-state battery module. For example, wiring included in the solid-state battery module can have its own inherent inductance value. The inductance value of the coil unit connected to the wiring can be a combined inductance value with the inherent inductance value of the wiring, and therefore can vary from the inherent inductance value of the coil unit. Furthermore, if the positional relationship between the coil unit and other components included in the solid-state battery module changes, the length between the coil unit and other components that can be connected to the coil unit changes, and the inductance value of the coil unit can also change.

[0058] In conventional solid-state battery modules, the coil unit may be disposed separately from the solid-state battery module, and the location of the coil unit may vary for each solid-state battery module. For example, in conventional solid-state battery modules, the coil unit may be disposed relatively closer or farther from the solid-state battery module. For this reason, in conventional solid-state battery modules, it is difficult to stabilize the coil inductance value for each solid-state battery module. Therefore, when wirelessly powering solid-state battery modules, matching must be performed for each solid-state battery module.

[0059] Since the solid-state battery module of the present disclosure has a coil unit therein, the location of the coil unit can be fixed. Because the location of the coil unit can be fixed, it becomes easier to maintain a predetermined distance between the coil unit and other components provided in the solid-state battery module. In other words, the inductance value of the coil unit for each solid-state battery module becomes more stable. When the inductance value becomes more stable, it becomes easier to match the LC frequency using the coil unit and a capacitor in wireless power transfer, making it easier to efficiently charge the solid-state battery module.

[0060] The solid-state battery module of the present disclosure may further take the following forms.

[0061] (Magnetic Layer) When a solid-state battery module is placed in an alternating magnetic field environment, an induced current may be generated in the coil section provided in the solid-state battery module. The alternating magnetic field may also be absorbed by components other than the coil section constituting the solid-state battery module. For example, the solid-state battery module of the present disclosure includes a covering section that covers the solid-state battery. Since the covering section is the outermost exterior of the solid-state battery module, it may be able to absorb the external alternating magnetic field more than other components. In particular, if the covering section contains a metal component, the external alternating magnetic field is more easily absorbed by the covering section than by the coil section. Therefore, the alternating magnetic field may be difficult to transmit to the coil section.

[0062] In one embodiment, a magnetic layer may be provided between the solid-state battery and the second substrate to facilitate transmission of a magnetic field to the coil section. In other words, a magnetic layer may be provided between the solid-state battery and the coil section. In the embodiment shown in FIGS. 3 and 4 , the magnetic layer 700 is provided below the second substrate 200B. The magnetic layer 700 has a higher magnetic permeability than the other components constituting the solid-state battery module, and therefore can act as a magnetic path for magnetic flux passing through the coil section 300. By providing the magnetic layer 700 below the second substrate 200B, an external magnetic field is more likely to be attracted to the coil section built into the second substrate 200B above the magnetic layer 700. In other words, the external magnetic field can be more efficiently converted into an induced current, improving the charging efficiency of the solid-state battery.

[0063] From the viewpoint of attracting the magnetic field to the coil portion more effectively, the thickness of the magnetic layer may be 50 μm or more, preferably 75 μm or more, more preferably 100 μm or more, and even more preferably 150 μm or more. From the viewpoint of reducing the thickness of the solid-state battery module, the thickness of the magnetic layer may be 500 μm or less, preferably 400 μm or less, more preferably 300 μm or less, and even more preferably 250 μm or less.

[0064] The thickness of the magnetic layer may be thicker than the thickness of the electrode layer of the solid-state battery. Specifically, the thickness of the magnetic layer may be thicker than the positive electrode layer or the negative electrode layer of the solid-state battery. From the viewpoint of more attracting the magnetic field to the coil portion, the thickness of the magnetic layer may be at least two times, preferably at least three times, more preferably at least five times, and even more preferably at least eight times, the thickness of the positive electrode layer or the negative electrode layer. From the viewpoint of reducing the thickness of the solid-state battery module, the thickness of the magnetic layer may be 25 times or less, preferably at most 20 times, more preferably at most 15 times, and even more preferably at most 13 times.

[0065] The magnetic layer may be, for example, a layer containing a magnetic material and a resin. The magnetic material may be contained in the magnetic layer in the form of particles. The resin may be a thermoplastic resin or a thermosetting resin.

[0066] The magnetic material contained in the magnetic layer may be a soft magnetic material. For example, the soft magnetic material may be iron, silicon steel, permalloy, sendust alloy, permendur, ferrite, amorphous magnetic alloy, magnetic stainless steel, etc. The ferrite may be Ni-Zn-Cu ferrite, Mn-Zn ferrite, etc.

[0067] The thermoplastic resin contained in the magnetic layer may be at least one selected from the group consisting of polyamide resin, polycarbonate resin, polyphenylene sulfide resin, aromatic polyether ketone resin, and thermoplastic polyimide resin.

[0068] The thermosetting resin contained in the magnetic layer may be one or more selected from the group consisting of epoxy resin, phenol resin, melamine resin, unsaturated polyester resin, silicone resin, and thermosetting polyimide resin.

[0069] The magnetic layer may be, for example, a mixture of the magnetic material and the resin rolled to a desired thickness and formed into a plate shape, or a commercially available magnetic layer containing the magnetic material and the resin may be used.

[0070] In one embodiment, a magnetic layer is provided between the solid-state battery and the coil unit, and the magnetic layer may be disposed adjacent to the second substrate side of the solid-state battery. Preferably, the magnetic layer may be in contact with the second substrate side. By adopting such an arrangement of the magnetic layer, the distance between the magnetic layer and the coil unit built into the second substrate is shortened, making it easier for an external magnetic field to be attracted to the coil unit. In other words, it becomes easier to efficiently convert an external magnetic field into an induced current, and the solid-state battery can be charged more efficiently. In the solid-state battery module, as described above, the magnetic layer attracts the external magnetic field to the coil unit, so the magnetic layer can be said to be a magnetic field attracting layer for the coil unit.

[0071] The magnetic layer can have a relatively higher magnetic permeability than the components constituting the solid-state battery module. Therefore, the magnetic layer can absorb more of the external magnetic field than the components constituting the solid-state battery module. In other words, the magnetic layer can suppress the external magnetic field from being absorbed by the components constituting the solid-state battery module. In particular, the magnetic layer can suppress the external magnetic field from being absorbed by the components containing metal components. From this perspective, the magnetic layer can be said to be a magnetic field absorption suppression layer for the metal side.

[0072] In one embodiment, the coil portion may be positioned inside the planar contour of the magnetic layer. Specifically, the coil portion may be positioned inside the region formed by the peripheral edge of the magnetic layer. In the embodiment shown in FIG. 5 , the planar contour of the magnetic layer 700 is rectangular, and the coil portion 300 is positioned inside the rectangular planar contour formed by the magnetic layer 700. By adopting such a positional relationship between the magnetic layer 700 and the coil portion 300, the external magnetic field induced by the magnetic layer 700 can easily pass through the entire coil portion. In other words, the external magnetic field can be easily converted into an induced current efficiently, and the solid-state battery can be charged more efficiently.

[0073] The first substrate and the second substrate included in the solid state battery module of the present disclosure will be described below.

[0074] (First substrate and second substrate) As shown in FIG. 1, a solid-state battery module 1000 according to one embodiment includes a first substrate 200A with wiring, a solid-state battery 100 disposed on the first substrate 200A, and a second substrate 200B disposed on the solid-state battery 100 and including a coil section 300 therein that can be electrically connected to the first substrate 200A.

[0075] The first substrate includes wiring and electronic components. Specifically, a plurality of electronic components are mounted on the first substrate, and each of the plurality of electronic components is electrically connected to each other by wiring provided on the first substrate. Each of the plurality of electronic components and the wiring provided on the first substrate are fixed by solder or the like. The first substrate may include a control circuit for controlling the solid-state battery module, which is configured by the wiring and the plurality of electronic components.

[0076] The first substrate may be provided with a battery terminal connection pin for electrically connecting the first substrate and the solid-state battery. As shown in FIG. 1 , one end of the battery terminal connection pin 142 is connected to the first substrate 200A, and the other end of the battery terminal connection pin 142 is connected to a connection electrode 141. The connection electrode 141 is connected to the end electrode 140. The battery terminal connection pin 142 enables the transfer of electricity between the first substrate 200A and the solid-state battery 100.

[0077] A resist layer may be disposed on the first substrate. As shown in FIGS. 1 and 2, the resist layer 220 may be provided, in particular, on the main surface of the first substrate 200A. The resist layer 220 is a layer that at least partially covers the substrate surface to prevent physical processing or chemical reaction. In the embodiment shown in FIG. 1, the resist layer 220 is provided on the first substrate 200A, and a plurality of electronic components 600 are provided on the resist layer 220. Wiring 210 is provided on the resist layer 220. The wiring 210 in the resist layer 220 and the electronic components 600 are connected by solder 215 or the like. The plurality of electronic components 600 and the wiring 210 in the first substrate 200A are electrically connected via the wiring 210 in the resist layer 220.

[0078] The second substrate includes a coil portion. The coil portion is provided on the second substrate, and may have a portion provided inside the second substrate and a portion exposed on the second substrate. Specifically, the coil portion is mainly disposed inside the second substrate, with a portion of the coil portion located on the upper surface of the second substrate. In other words, the portion of the coil portion buried inside the second substrate is relatively larger than the portion exposed on the upper surface of the second substrate. Furthermore, a portion of the coil portion does not necessarily have to be located on the upper surface of the second substrate; the entire coil portion may be located inside the second substrate. As shown in FIGS. 1 and 2 , the coil portion 300 is connected to wiring 210 provided on the second substrate 200B. The wiring 210 provided on the second substrate 200B is electrically connected to the first substrate 200A.

[0079] The coil section provided on the second substrate may be provided parallel to the second substrate. For example, the coil section may be provided by being stacked on the second substrate. For example, as shown in FIG. 5 , the coil section 300 may be configured to describe a spiral in a direction substantially parallel to the module top surface 1100. The coil section 300 is covered with a resist layer 220 (described later) and is therefore located inside the module top surface 1100.

[0080] A resist layer may be disposed on the second substrate. As shown in FIGS. 1 and 2 , the resist layer 220 may be provided, in particular, on the main surface of the second substrate 200B. The resist layer 220 is a layer that at least partially covers the substrate surface to prevent physical processing or chemical reaction. In the embodiment shown in FIG. 1 , the resist layer 220 is provided on the second substrate 200B. The resist layer 220 provided on the second substrate 200B is the outermost layer of the solid-state battery module 1000 and can at least constitute the module top surface 1100.

[0081] The first and second substrates can be printed circuit boards. The type of substrate is not particularly limited, and they may be resin or ceramic. They may also be rigid or flexible. Examples of ceramic substrates include alumina substrates, LTCC substrates, and HTCC substrates. Resin substrates may be made of a material in which a substrate is impregnated with resin. Examples of substrates include paper, glass fiber cloth, and resin films. The resin may be a thermoplastic resin and / or a thermosetting resin. Examples include a paper-phenolic substrate in which a paper substrate is impregnated with phenolic resin, a paper-epoxy substrate in which a paper substrate is impregnated with epoxy resin, a glass-epoxy substrate in which a glass fiber cloth is impregnated with epoxy resin, and a flexible substrate made of polyimide or PET (polyethylene terephthalate) resin. The wiring on the substrate may be made of at least one metal selected from the group consisting of Cu, Ni, Ag, Au, and Pt.

[0082] The first substrate preferably serves as a component for electrically connecting the modularized solid-state battery to the outside. In other words, the substrate can be considered a terminal substrate for the external terminals of the solid-state battery. FIG. 10 shows the bottom surface 1200 of the solid-state battery module. This bottom surface 1200 is the main surface of the first substrate. As shown in FIG. 10, the first substrate is provided with a backside pad (specifically, a metal foil) 211 that can function as an external terminal. A solid-state battery module including such a substrate can mount the solid-state battery on another secondary substrate, such as a printed wiring board, with the substrate interposed. For example, surface mounting can be achieved using solder or conductive paste. For this reason, the solid-state battery module of the present invention is preferably an SMD (Surface Mount Device) type battery module.

[0083] Possible embodiments of the covering portion provided in the solid-state battery module of the present disclosure will be described below.

[0084] In one embodiment, the coated inorganic layer is provided on the solid-state battery module, and the coated inorganic layer may be provided along the side surface of the solid-state battery module. In other words, the coated inorganic layer may constitute at least the side surface portion of the module. In the embodiment shown in FIGS. 1 and 2 , the coated inorganic layer 520 is provided to cover each side surface 1300 of the solid-state battery module 1000. Specifically, the coated inorganic layer 520 covers the coated insulating layer 510 surrounding the solid-state battery 100, the side surface of the first substrate, and the side surface of the second substrate. By providing the coated inorganic layer 520 along the side surface of the solid-state battery module, water penetration into the solid-state battery module can be further suppressed. To optimally function as a water vapor barrier, the coated inorganic layer 520 may cover the entire side surface 1300 of the solid-state battery module 1000.

[0085] In one embodiment, the coated inorganic layer may be provided along the top surface of the solid-state battery module. Specifically, the coated inorganic layer may be provided so as to cover a portion of the top surface of the solid-state battery module. In the embodiment shown in FIGS. 1 and 2 , the coated inorganic layer 520 is provided so as to cover the periphery (or peripheral portion) of the module top surface 1100. The contour shape of the coated inorganic layer 520 covering the module top surface 1100 corresponds to the contour of the module top surface 1100. In the embodiment shown in FIG. 5 , the contour shape of the coated inorganic layer 520 covering the module top surface 1100 is a rectangular and annular contour. Since the contour shape of the coated inorganic layer 520 covering the module top surface 1100 is rectangular and annular, it has an outer contour that forms the outer contour of the "ring" and an inner contour that forms the inner contour of the "ring." By providing the coated inorganic layer so as to cover a portion of the top surface of the solid-state battery module, the coil portion provided inside the second substrate is less likely to be covered by the coated inorganic layer. Therefore, the coil portion can be more easily subjected to an external magnetic field, and the charging efficiency of the solid-state battery can be further improved.

[0086] 1, 2, and 5 from another perspective, the coated inorganic layer 520 can be said to include a discontinuous region of the coated inorganic layer 520 on the module top surface 1100 side. The "discontinuous region" refers to a region including both a portion covered by the coated inorganic layer 520 and a portion not covered by the coated inorganic layer 520. For example, on the module side surface 1300 side in FIGS. 1, 2, and 5, the coated inorganic layer 520 covers the entire module side surface 1300, forming a continuous region of the coated inorganic layer 520. On the other hand, on the module top surface 1100 side, the coated inorganic layer 520 covers only a portion of the top surface, rather than the entire module top surface 1100, forming a discontinuous region of the coated inorganic layer. In other words, a portion of the second substrate 200B can be said to be exposed on the module top surface 1100 side. By including a discontinuous region of the coated inorganic layer on the module top surface side, the coil portion provided inside the second substrate is less likely to be covered by the coated inorganic layer. Therefore, the coil portion can be more easily subjected to an external magnetic field, and the charging efficiency of the solid-state battery can be further improved.

[0087] In one embodiment, the coated inorganic layer may be provided along the bottom surface of the solid-state battery module. The coated inorganic layer provided on the bottom surface of the module may have the same form as the coated inorganic layer provided on the top surface of the module.

[0088] In one embodiment, the coated inorganic layer may cover the module side surface and / or form a portion of at least one of the module top surface and module bottom surface that are continuous with the module side surface. In the embodiment shown in FIG. 1 , the coated inorganic layer 520 covering the periphery of the module top surface 1100 is continuous with the coated inorganic layer 520 covering the module side surface 1300. From another perspective, the coated inorganic layer 520 can be said to cover the side surface of the second substrate 200B and further cover a portion of the upper main surface of the second substrate 200B that is continuous with the side surface of the second substrate 200B. Similarly, the coated inorganic layer 520 can be said to cover the side surface of the first substrate 200A and further cover a portion of the upper main surface of the first substrate 200A that is continuous with the side surface of the first substrate 200A. This configuration makes it easier for the coil unit 300 to receive an external magnetic field, thereby improving the charging efficiency of the solid-state battery 100. It also makes it easier to prevent water from entering the solid-state battery module.

[0089] In one embodiment, in a cross-sectional view, the outer contour of the magnetic layer may be on or inside the inner contour of the coated inorganic layer. In other words, the outer contour of the magnetic layer may overlap the inner contour of the coated inorganic layer or may be located within the area defined by the inner contour of the coated inorganic layer. Specifically, in the embodiment shown in FIG. 5 , the outer contour of the magnetic layer 700 is surrounded by the inner contour of the coated inorganic layer 520. In the embodiment shown in FIG. 3 , the portion corresponding to the outer contour of the magnetic layer 700 in FIG. 5 is located inside the portion corresponding to the inner contour of the coated inorganic layer 520 in FIG. 5 . In other words, in the stacking direction of the solid-state battery, the portion corresponding to the outer contour of the magnetic layer 700 and the portion corresponding to the inner contour of the coated inorganic layer 520 do not overlap each other. By adopting such an embodiment, the coated inorganic layer is not positioned above the magnetic layer 700, making it difficult for the magnetic field attracted to the magnetic layer 700 and the magnetic field emanating from the magnetic layer 700 to be absorbed by the coated inorganic layer. Therefore, it becomes easier to efficiently convert the magnetic field into an induced current, and the charging efficiency of the solid-state battery can be improved.

[0090] In one embodiment, the planar outline of the magnetic layer may be surrounded by the coated inorganic layer. Specifically, the coated inorganic layer may be positioned outside the area formed by the peripheral edge of the magnetic layer. The planar outline of the magnetic layer refers to the outline shape of the magnetic layer when viewed in a plan view. In the embodiment shown in FIG. 5 , the planar outline of the magnetic layer 700 is rectangular, and the coated inorganic layer 520 is positioned outside the planar outline of the magnetic layer 700. By adopting such a positional relationship between the magnetic layer 700 and the coated inorganic layer 520, an external magnetic field is more easily attracted to the coil portion 300. In other words, the external magnetic field can be more efficiently converted into an induced current, allowing the solid-state battery to be charged more efficiently.

[0091] In one embodiment, the covering insulating layer may include a solid-state battery sealing layer that covers the periphery of the solid-state battery and an electronic component sealing layer that covers the periphery of the electronic component provided on the substrate. In the embodiment shown in Figures 1 and 2, the solid-state battery 100 is covered by a solid-state battery sealing layer 511. The electronic component 600 on the first substrate 200A is covered by an electronic component sealing layer 512. The materials of the solid-state battery sealing layer 511 and the electronic component sealing layer 512 may be the materials of the covering insulating layer exemplified above.

[0092] In one embodiment, the coating inorganic layer may include a metal thin film and a metal plating layer. For example, as shown in Figures 1 and 2, the metal thin film 521 may be provided so as to be in contact with the coating insulating layer 510. The metal plating layer 522 may be provided on the outer side of the metal thin film 521, in other words, may be positioned relatively farther from the solid-state battery 100 than the metal thin film 521.

[0093] The metal thin film may be a dry-plated layer, specifically a sputtered film. That is, the solid-state battery module of the present invention may be provided with a sputtered film as the metal thin film. A sputtered film is a thin film obtained by sputtering. That is, a film formed by sputtering ions onto a target and expelling and depositing the atoms can be used as the dry-plated layer.

[0094] The sputtered film has a very thin morphology on the nano- or micro-order, yet is a relatively dense and / or uniform layer, which can contribute to preventing water vapor permeation in solid-state batteries. Furthermore, because the sputtered film is formed by atomic deposition, it can adhere more favorably to the target. Therefore, the sputtered film can be more effectively used as a barrier to prevent water vapor from the external environment from penetrating into solid-state batteries. Therefore, by further including a sputtered film as a dry-plated layer in the coated inorganic layer, it is possible to further improve the water vapor permeation prevention properties of the solid-state battery. The dry-plated layer may also be formed by other dry plating methods, such as vacuum deposition or ion plating. In a preferred embodiment, the dry-plated layer may include at least one selected from the group consisting of Al (aluminum), Cu (copper), Ti (titanium), and stainless steel (SUS).

[0095] The thickness of the metal thin film is preferably 1 μm to 10 μm, more preferably 2 μm to 8 μm, and even more preferably 3 μm to 6 μm. By setting the thickness of the metal thin film within the above range, the metal thin film can more effectively contribute to preventing water vapor from entering the solid-state battery.

[0096] The metal plating layer may be a wet-plated layer. As shown in FIG. 1 , the metal plating layer 522 forms the outermost layer of the coating inorganic layer 520. The metal plating layer 522 may be resistant to deterioration because it may be exposed to the external environment. The metal plating layer 522 preferably contains at least one metal selected from the group consisting of Ni (nickel), Cr (chromium), Pd (palladium), Pt (platinum), and Zn.

[0097] The thickness of the metal plating layer is preferably 1 μm or more and 20 μm or less, more preferably 2 μm or more and 15 μm or less, and particularly preferably 2 μm or more and 10 μm or less. By keeping the thickness of the metal plating layer within the above range, deterioration of the plating layer can be suitably reduced.

[0098] Possible embodiments of wiring provided in the solid-state battery module of the present disclosure will be described below.

[0099] (Wiring) In one embodiment of the solid-state battery module, the first substrate and the coil section are electrically connected to each other. In the embodiment shown in FIGS. 1 and 2 , the solid-state battery module 1000 further includes connection wiring 400 connecting the first substrate 200A and the coil section 300, thereby electrically connecting the first substrate 200A and the coil section 300. The connection wiring 400 is arranged so as to run along the wall surface of the solid-state battery 100. In the cross-sectional view embodiment shown in FIG. 1 , the connection wiring 400 is provided so as to traverse the solid-state battery 100, and the connection wiring 400 is connected to the first substrate 200A via the antenna circuit connection pin 450. Therefore, the coil section and the solid-state battery are electrically connected via the connection wiring.

[0100] The arrangement of the connection wiring 400 allows the induced current generated in the coil unit 300 to be sent to the first substrate 200A. Furthermore, as shown in Fig. 1, since an electronic component 600 is mounted on the main surface of the first substrate 200A, the induced current generated in the coil unit 300 is supplied to the electronic component. In this respect, it can be said that the coil unit 300 and the electronic component 600 are electrically connected via the connection wiring 400.

[0101] 6 shows the positional relationship between the coil portion 300 and the connection wiring 400 in FIGS. 1 and 2. As described above, the connection wiring 400 connects the first substrate 200A and the coil portion 300, and the connection wiring 400 and the coil portion 300 are connected via connection pins 350. As shown in FIG. 6, the connection pins 350 are provided on the coil portion. The connection wiring 400 is connected to the connection pins 350 (not shown). In the embodiment shown in FIG. 6, four connection pins 350 are provided on the coil portion 300, and therefore four connection wirings are provided on the coil portion 300 via the connection pins.

[0102] Note that the locations of the connection wirings 400 provided in the solid-state battery module 1000 can be changed by changing the locations of the connection pins 350 provided in the coil section 300. Similarly, the number of connection pins 350 provided in the coil section 300 can be changed by changing the number of connection wirings 400 provided in the solid-state battery module 1000. For example, as shown in Fig. 8, by providing two connection pins in the coil section 300, the number of connection wirings can be reduced to two.

[0103] In one embodiment, the coil portion and the metal wiring may be connected by a connecting pin, and the position where the connecting wiring is provided may be adjusted. In the embodiment shown in Figures 6 and 7, metal wiring 370 is provided at the tip of coil portion 300. Specifically, coil portion 300 and metal wiring 370 are fixed by connecting pin 360. In this embodiment, it can be said that coil portion 300 is extended by metal wiring 370. As shown in Figure 6, another metal wiring 375 may be provided in addition to metal wiring 370. By connecting the coil portion and metal wiring, the degree of freedom in the location where the connecting wiring is provided can be further improved.

[0104] In one embodiment, two or more connecting wires may be provided in the solid-state battery module. For example, the connecting wires may be provided along only one side surface of the solid-state battery module, or along two or more side surfaces. For example, one or more connecting wires may be provided along one side surface.

[0105] FIG. 1 shows a cross-sectional view cut along the side surface of a solid-state battery module 1000. In the embodiment shown in FIG. 1, two connection wires 400 are arranged on the side surface of the solid-state battery 100. FIG. 2 shows a cross-sectional view cut along the module side surface 1300 shown in FIG. 1. In the embodiment shown in FIG. 2, two connection wires 400 are arranged on the side surface of the solid-state battery 100. In other words, the solid-state battery module 1000 shown in the embodiments of FIGS. 1 and 2 is provided with a total of four connection wires 400.

[0106] In one embodiment, the solid-state battery module may be provided with a U-shaped connection wiring. In other words, the solid-state battery module may be provided with a connection wiring having multiple bent portions. FIG. 8 is a cross-sectional view schematically illustrating the configuration of a solid-state battery module according to one embodiment. FIG. 9 is a cross-sectional view schematically illustrating the solid-state battery module of FIG. 8 cut along a side surface 1300. In the embodiment illustrated in FIG. 9, two or more connection wirings are arranged in the solid-state battery module 1000. Specifically, a first connection wiring 410 and a second connection wiring 420 extend in a first direction from the first substrate 200A toward the coil portion 300. Furthermore, a third connection wiring 430 is arranged to connect the first connection wiring 410 and the second connection wiring 420. The third connection wiring 430 extends in a second direction intersecting the first direction.

[0107] 9 , a connection wiring having a U-shaped appearance is formed by the first connection wiring 410, the second connection wiring 420, and the third connection wiring 430. In other words, a connection wiring having two bent portions is formed. The connection wiring having such a shape is provided so as to straddle the solid-state battery.

[0108] When the connection wiring composed of the first, second, and third connection wirings is provided on the first substrate, the first connection wiring and the second connection wiring can be positioned simultaneously on the first substrate. In other words, instead of providing the first connection wiring and the second connection wiring separately on the first substrate, the first connection wiring and the second connection wiring can be easily provided simultaneously on the first substrate, which makes it easier to manufacture the solid-state battery module and improves manufacturing efficiency.

[0109] (Water-Resistant Barrier Film) In one embodiment, a water-resistant barrier film may be provided between the substrate and the solid-state battery. As shown in FIG. 1 , a water-resistant barrier film 800 may be provided between the first substrate 200A and the solid-state battery 100, and / or a water-resistant barrier film 800 may be provided between the second substrate 200B and the solid-state battery 100. By providing the water-resistant barrier film 800, undesirable permeation of water vapor from the external environment through the substrate to the solid-state battery is reduced, and therefore, deterioration of the solid-state battery characteristics can be reduced in the long term.

[0110] In the embodiment shown in FIG. 1 , the water-resistant barrier film 800 is provided on one of the main surfaces of the first substrate 200A that is closer to the solid-state battery 100. Similarly, the water-resistant barrier film 800 is provided on one of the main surfaces of the second substrate that is closer to the solid-state battery. The water-resistant barrier films 800 provided on the first substrate 200A and the second substrate 200B are provided along the main surfaces of the respective substrates. The peripheral edge of the water-resistant barrier film 800 may be in contact with the coating inorganic layer 520. Furthermore, the main surface of the water-resistant barrier film 800 is provided so as to be in contact with the coating insulating layer 510. In the embodiment having the magnetic layer 700 shown in FIGS. 3 and 4 , the water-resistant barrier film 800 may be provided between the magnetic layer 700 and the second substrate 200B.

[0111] The water-resistant barrier film is not particularly limited as long as it is made of a material that exhibits insulating properties. Specific examples of such materials include inorganic insulators such as glass and alumina, and organic insulators such as resin. These may be used alone or in combination of two or more.

[0112] Wireless power supply to the solid-state battery module of the present disclosure will be described below.

[0113] The first substrate may include a wireless power supply circuit. The wireless power supply circuit may include wiring, a plurality of electronic components, and a coil portion provided inside the second substrate. Specifically, the wireless power supply circuit may be composed of a plurality of circuits. For example, the wireless power supply circuit may include a power receiving circuit, a step-up / step-down circuit, and a battery charging circuit.

[0114] The power receiving circuit can receive power wirelessly from an external device (e.g., a power transmitting unit). The power receiving circuit can include a coil unit, a capacitor, a resistor, and a rectifier circuit provided on the second substrate. The coil unit provided on the second substrate generates an induced current when receiving electromagnetic waves from the external device.

[0115] The rectifier circuit rectifies the induced current generated in the coil and converts AC to DC. The rectifier circuit may be a diode bridge circuit. A smoothing capacitor may be connected to the output of the rectifier circuit, thereby smoothing the output voltage output from the rectifier circuit.

[0116] The step-up / step-down circuit converts the input voltage. A voltage that has been rectified and smoothed may be input to the step-up / step-down circuit. For example, a DC-DC converter or an LDO (Low Dropout Regulator) may be used as the step-up / step-down circuit. A smoothing capacitor may be connected to the output of the step-up / step-down circuit, and the output voltage output from the step-up / step-down circuit may be smoothed. The smoothed output voltage of the step-up / step-down circuit is input to a battery charging circuit that controls charging of the solid-state battery. The output voltage from the battery charging circuit may be smoothed by a smoothing capacitor, and may be input to the solid-state battery to charge it.

[0117] The wireless power supply circuit may further include other circuits, such as a wireless communication circuit (Wi-Fi, Bluetooth, NFC, RF-ID, Zig-Bee, and / or specific low-power radio, etc.), a protection circuit, a current path circuit, and / or a sensor circuit.

[0118] In one embodiment, the solid-state battery module may include a resonant circuit. In other words, the coil unit may resonate with a capacitor provided on the first substrate. Specifically, it is preferable that the capacitor and the coil unit resonate (i.e., match) at a predetermined frequency. The coil unit and the capacitor may be connected in parallel. Resonance between the capacitor and the coil may increase the received current, allowing the external magnetic field to be converted into an induced current more efficiently, thereby improving the charging efficiency of the solid-state battery.

[0119] [Method for Manufacturing a Solid-State Battery Module] The solid-state battery module of the present disclosure can be obtained by preparing a solid-state battery including a battery constituent unit having a positive electrode layer, a negative electrode layer, and a solid electrolyte between the electrodes, and then modularizing the solid-state battery.

[0120] The production of the solid state battery of the present invention can be broadly divided into the production of the solid state battery itself (hereinafter also referred to as a "pre-module battery"), which corresponds to a pre-modularization stage, the preparation of the substrate, and modularization.

[0121] <<Method for Manufacturing Pre-Module Battery>> The pre-module battery can be manufactured by a printing method such as screen printing, a green sheet method using a green sheet, or a combination of these. That is, the pre-module battery itself may be manufactured in accordance with a conventional method for manufacturing solid-state batteries (therefore, raw materials such as the solid electrolyte, organic binder, solvent, optional additives, positive electrode active material, and negative electrode active material described below may be those used in the manufacture of known solid-state batteries).

[0122] In the following, one production method will be described as an example for better understanding of the present invention, but the present invention is not limited to this method. Furthermore, the chronological order of the following description is merely for the convenience of explanation and is not necessarily binding.

[0123] (Laminate Block Formation) A solid electrolyte, an organic binder, a solvent, and optional additives are mixed to prepare a slurry. The prepared slurry is then fired to form a sheet containing the solid electrolyte. A positive electrode paste is prepared by mixing a positive electrode active material, a solid electrolyte, a conductive material, an organic binder, a solvent, and optional additives. Similarly, a negative electrode paste is prepared by mixing a negative electrode active material, a solid electrolyte, a conductive material, an organic binder, a solvent, and optional additives. The positive electrode paste is printed on a sheet, and a current collecting layer and / or a negative layer are printed as needed. Similarly, the negative electrode paste is printed on a sheet, and a current collecting layer and / or a negative layer are printed as needed. Sheets printed with the positive electrode paste and sheets printed with the negative electrode paste are alternately stacked to obtain a laminate. The outermost layer (top layer and / or bottom layer) of the laminate may be an electrolyte layer, an insulating layer, or an electrode layer.

[0124] (Formation of fired battery body) After the laminate is pressure-bonded and integrated, it is cut to a predetermined size. The obtained cut laminate is subjected to degreasing and firing. In this way, a fired laminate is obtained. Note that the laminate may be degreased and fired before cutting, and then cut.

[0125] (Formation of End Electrodes) The end electrode on the positive electrode side can be formed by applying a conductive paste to the exposed side of the positive electrode in the fired laminate. Similarly, the end electrode on the negative electrode side can be formed by applying a conductive paste to the exposed side of the negative electrode in the fired laminate. The end electrodes on the positive and negative electrodes may be provided so as to extend to the main surfaces of the fired laminate. The components of the end electrodes may be at least one selected from silver, gold, platinum, aluminum, copper, tin, and nickel. Antimony, bismuth, indium, zinc, aluminum, etc., which form alloys with tin, may also be included.

[0126] The end electrodes on the positive and negative electrodes do not necessarily have to be formed after firing of the laminate, but may be formed before firing and then subjected to simultaneous firing.

[0127] By going through the above steps, a desired pre-module battery (corresponding to the solid-state battery 100) can finally be obtained.

[0128] <Preparation of Substrate> In this step, a substrate is prepared.

[0129] (Preparation of First Substrate) While not particularly limited, when a resin substrate is used as the substrate, its preparation may be carried out by stacking multiple layers and subjecting them to heat and pressure treatment. For example, a substrate precursor is formed using a resin sheet composed of a base fiber cloth impregnated with a resin material. After the substrate precursor is formed, this substrate precursor is subjected to heat and pressure treatment in a press. On the other hand, when a ceramic substrate is used as the substrate, its preparation may be carried out, for example, by thermocompression bonding multiple green sheets to form a green sheet laminate and then firing the green sheet laminate to obtain a ceramic substrate. The ceramic substrate may be prepared, for example, in a manner similar to the preparation of an LTCC substrate. The semi-lacquer substrate may have vias and / or lands. In such cases, for example, holes may be formed in the green sheets using a punch press or a carbon dioxide laser, and the holes may be filled with a conductive paste material. Alternatively, precursors of conductive portions such as vias and lands may be formed by a printing method using a conductive paste material or solder. Note that lands may also be formed after firing the green sheet laminate.

[0130] Thereafter, a plurality of wirings are formed at predetermined intervals on the main surface of the substrate for electrical connection. In this way, the desired substrate can be obtained.

[0131] (Preparation of Second Substrate) The method for preparing the second substrate is not particularly limited, and for example, the second substrate may be prepared by the same method as the method for preparing the first substrate. The coil inside the second substrate may be provided inside the second substrate by arranging a conductive material such as wiring in a spiral or helical shape. Specifically, the second substrate including a coil portion therein may be prepared by forming a spiral or spiral pattern of a conductive paste material on a substrate by a printing method or the like. The second substrate including a coil portion therein may be a single product or a stack of substrates on which a spiral or spiral pattern of a conductive paste material has been formed.

[0132] Next, at least an electronic component 600 such as a capacitor and a battery terminal connection pin 142 are placed on the wiring 210 located at a predetermined position on the first substrate 200A (see FIG. 11A ). The wiring 210 located at a predetermined position on the first substrate 200A and the electronic component 600 may be fixed with solder 215 or the like.

[0133] <<Modularization>> First, a covering portion (e.g., electronic component sealing layer 512) is formed on the first substrate 200A on which the electronic components 600, battery terminal connection pins 142, etc. are mounted. Specifically, raw material for the covering insulating layer is provided so as to completely cover the electronic components, etc. If the covering insulating layer is made of a resin material, the electronic component sealing layer may be formed by applying a resin precursor to the substrate and curing it. When forming the electronic component sealing layer, at least a portion of the battery terminal connection pins 142 is exposed and not covered by the electronic component sealing layer. A conductive connection electrode 141 is printed on the exposed battery terminal connection pins 142 (see FIG. 11B ). Next, a solid-state battery 100 (specifically, a “non-modularized solid-state battery”) coated with an end electrode 140 is mounted on the first substrate 200A so that the end electrode 140 and the connection electrode 141 are connected (see FIG. 11C ).

[0134] After mounting the solid-state battery 100 on the first substrate 200A, the connection wiring 400 is connected to the connection electrodes 141 so as to straddle the solid-state battery 100 (see FIG. 11D). After connecting the connection wiring 400, the second substrate 200B is placed above the solid-state battery (see FIG. 11E). Specifically, the second substrate 200B is positioned above the solid-state battery, and the second substrate 200B and the connection wiring 400 are connected. More specifically, the second substrate 200B is positioned above the solid-state battery so that the wiring 210 provided on the second substrate 200B and the connection wiring 400 are connected.

[0135] After connecting the wiring 210 and the connection wiring 400 on the second substrate, a covering insulating layer (e.g., a solid battery sealing layer 511) is formed (see FIG. 11F ). Specifically, a raw material for the covering insulating layer is provided so as to completely cover the solid battery 100 on the first substrate 200A. When the covering insulating layer is made of a resin material, a resin precursor is applied to the substrate and cured to form the covering insulating layer (e.g., the solid battery sealing layer 511). In a preferred embodiment, the solid battery sealing layer may be molded by applying pressure with a mold. By way of example only, the solid battery sealing layer that seals the solid battery on the substrate may be molded using a compression mold. If the resin material is a resin commonly used in molding, the raw material for the solid battery sealing layer may be in the form of granules or may be thermoplastic. This molding is not limited to mold molding, and may also be performed through polishing, laser processing, and / or chemical treatment. As a result, the solid battery is positioned between the first substrate and the second substrate.

[0136] After forming the coating insulating layer (e.g., a solid-state battery sealing layer), a coating inorganic layer 520 is formed (see FIG. 11F ). Specifically, the coating inorganic layer 520 (e.g., a metal thin film 521) is formed on the "coating precursor in which a solid-state battery is coated with a solid-state battery sealing layer on a first substrate." The metal thin film 521 may be formed, for example, by dry plating to form a dry-plated film as the metal thin film. More specifically, dry plating is performed to form a metal thin film on the coating precursor and the exposed surfaces of the side surfaces of the first substrate and the second substrate (i.e., other than the bottom surface of the first substrate and the top surface of the second substrate). After forming the metal thin film, a metal plating layer 522 is formed outside the metal thin film 521 (see FIG. 11F ). Specifically, the metal plating layer 522 is formed so as to cover the metal thin film 521. The metal plating layer 522 may also be formed by wet plating. More specifically, wet plating is performed to form a metal plating layer covering the coating precursor and the metal thin films covering the side surfaces of the first substrate and the second substrate. Furthermore, the metal plating layer may be formed to cover a portion of the bottom surface of the first substrate and / or the top surface of the second substrate. Specifically, the metal plating layer may be formed to cover the peripheral edge of the bottom surface of the first substrate and / or the peripheral edge of the top surface of the second substrate.

[0137] A magnetic layer may be provided to make the coil provided inside the second substrate more susceptible to external magnetic fields. The magnetic layer can be obtained, for example, by rolling a mixture of magnetic powder and resin to a desired thickness and forming it into a plate. The magnetic layer can also be cut to a desired size.

[0138] The magnetic layer obtained by the above method can be provided, for example, during the step of placing a second substrate on top of the solid-state battery. Specifically, a magnetic layer cut to an arbitrary size may be placed on the second substrate, and the second substrate on which the magnetic layer is placed may be placed on top of the solid-state battery. For example, the second substrate on which the magnetic layer is placed may be placed on top of the solid-state battery so that the magnetic layer and the solid-state battery placed on the second substrate face each other. As a method of placing the magnetic layer on the second substrate, the magnetic layer may be attached to the second substrate using an adhesive or the like.

[0139] By going through the above steps, a module product can be obtained in which the solid-state battery on the substrate is covered with a coating portion. In other words, a "solid-state battery module" according to the present invention can be finally obtained. In the solid-state battery module obtained through these steps, the coil portion is provided inside the second substrate, so the total size of the solid-state battery module and the coil portion is likely to be relatively small. Furthermore, since the position of the coil portion is easily fixed, the inductance value of the coil portion is easily stabilized, and the need for matching for each solid-state battery module can be reduced. Therefore, wireless power supply, etc. can be performed efficiently.

[0140] Although the embodiments of the present invention have been described above, they are merely typical examples. Therefore, it will be readily understood by those skilled in the art that the present invention is not limited to these and that various other embodiments are possible.

[0141] Aspects of the solid-state battery module of the present disclosure are as follows. <1> A solid-state battery module including a first substrate having wiring, a solid-state battery disposed on the first substrate, and a second substrate disposed above the solid-state battery and including a coil portion therein that can be electrically connected to the first substrate, wherein the top surface of the second substrate is positioned along a module top surface or inside the module top surface. <2> The solid-state battery module according to <1>, in which a magnetic layer is provided between the solid-state battery and the second substrate. <3> The solid-state battery module according to <2>, in which the magnetic layer is disposed adjacent to the second substrate side of the solid-state battery. <4> The solid-state battery module according to <2> or <3>, in which the magnetic layer is in contact with the second substrate side. <5> The solid-state battery module according to any one of <2> to <4>, in which the coil portion is positioned inside the planar contour of the magnetic layer. <6> The solid-state battery module according to any one of <2> to <5>, further comprising a covering section covering the solid-state battery, the covering section including a covering insulating layer and a covering inorganic layer located outside the covering insulating layer, and the planar outline of the magnetic layer being surrounded by the covering inorganic layer. <7> The solid-state battery module according to <6>, wherein, in a cross-sectional view, the outer outline of the magnetic layer is on or inside the inner outline of the covering inorganic layer. <8> The solid-state battery module according to any one of <2> to <7>, wherein the solid-state battery includes an electrode layer, and the thickness of the magnetic layer is greater than the thickness of the electrode layer of the solid-state battery. <9> The solid-state battery module according to any one of <2> to <8>, wherein the magnetic layer is a magnetic field attraction layer for the coil section. <10> The solid-state battery module according to any one of <2> to <9>, wherein the magnetic layer is a metal absorption suppression layer. <11> The solid-state battery module according to any one of <1> to <5>, further comprising a covering portion covering the solid-state battery, the covering portion including a covering insulating layer and a covering inorganic layer located outside the covering insulating layer, and including a discontinuous region of the covering inorganic layer on the top surface side of the module. <12> The solid-state battery module according to <11>, wherein the covering inorganic layer constitutes at least a side surface portion of the module.<13> The solid-state battery module according to <11> or <12>, wherein the coated inorganic layer further constitutes a part of at least one of a module top surface and a module bottom surface that are continuous with the module side surface portion. <14> The solid-state battery module according to any one of <11> to <13>, wherein the coated inorganic layer covers at least the side surface of the second substrate. <15> The solid-state battery module according to any one of <11> to <14>, wherein the coated inorganic layer further covers a part of the upper main surface of the second substrate that is continuous with the side surface of the second substrate. <16> The solid-state battery module according to any one of <1> to <115>, further comprising a connection wiring that connects the first substrate and the coil portion. <17> The solid-state battery module according to <16>, wherein two or more connecting wires are arranged, the first and second connecting wires extending in a first direction from the first substrate to the coil portion, and a third connecting wire connecting the first and second connecting wires is arranged and extends in a second direction intersecting the first direction. <18> The solid-state battery module according to <16> or <17>, wherein an electronic component is mounted on an upper main surface of the first substrate, and the coil portion and the electronic component are electrically connected via the connecting wires. <19> The solid-state battery module according to any one of <16> to <18>, wherein the coil portion and the solid-state battery are electrically connected via the connecting wires.

[0142] The solid-state battery module of the present invention can be used in various fields where battery use or power storage is expected. For example, the solid-state battery module of the present invention can be used in the electrical, information, and communications fields where mobile devices are used (e.g., electrical and electronic devices or mobile devices including mobile phones, smartphones, laptops, digital cameras, activity monitors, arm computers, electronic paper, RFID tags, card-type electronic money, smart watches, and other small electronic devices), household and small industrial applications (e.g., power tools, golf carts, and household, nursing care, and industrial robots), large industrial applications (e.g., forklifts, elevators, and harbor cranes), transportation systems (e.g., hybrid cars, electric cars, buses, trains, electrically assisted bicycles, and electric motorcycles), power system applications (e.g., various power generation systems, road conditioners, smart grids, and general-purpose household power storage systems), medical applications (e.g., medical devices such as earphone hearing aids), pharmaceutical applications (e.g., medication management systems), IoT, and space and deep-sea applications (e.g., space probes and submersible research vessels).

[0143] REFERENCE SIGNS LIST 100 Solid-state battery 110 Positive electrode layer 120 Negative electrode layer 130 Solid electrolyte 140 End electrode 141 Connection electrode 142 Battery terminal connection pin 200A First substrate 200B Second substrate 210 Wiring 211 Back surface pad 215 Solder 220 Resist layer 300 Coil portion 350 Connection pin 400 Connection wiring 410 First connection wiring 420 Second connection wiring 430 Third connection wiring 450 Antenna circuit connection pin 500 Covering portion 510 Covering insulating layer 511 Solid-state battery sealing layer 512 Electronic component sealing layer 520 Covering inorganic layer 521 Metal thin film 522 Metal plating layer 523 Metal pad 600 Electronic component 700 Magnetic layer 800 Water-resistant barrier film 1000 Solid-state battery module 1100 Top surface of solid-state battery module 1200 Bottom surface of solid-state battery module 1300 Side surface of solid-state battery module

Claims

1. A solid-state battery module comprising: a first substrate having wiring; a solid-state battery disposed on the first substrate; and a second substrate disposed above the solid-state battery and including a coil portion therein and electrically connectable to the first substrate, wherein a top surface of the second substrate is positioned along a module top surface or on the inside of the module top surface.

2. The solid-state battery module according to claim 1 , wherein a magnetic layer is provided between the solid-state batteries and the second substrate.

3. The solid-state battery module according to claim 2 , wherein the magnetic layer is disposed adjacent to the second substrate on a side closer to the solid-state battery than the solid-state battery.

4. The solid-state battery module according to claim 2 , wherein the magnetic layer is in contact with the second substrate side.

5. The solid-state battery module according to claim 2 , wherein the coil portion is positioned inside a planar contour of the magnetic layer.

6. 4. The solid-state battery module according to claim 2, further comprising a covering portion covering the solid-state battery, the covering portion including a covering insulating layer and a covering inorganic layer located outside the covering insulating layer, and a planar outline of the magnetic layer is surrounded by the covering inorganic layer.

7. The solid-state battery module according to claim 6 , wherein, in a cross-sectional view, an outer contour of the magnetic layer is on the inner contour of the coating inorganic layer or is located inside the inner contour of the coating inorganic layer.

8. The solid-state battery module according to claim 2 , wherein the solid-state battery includes an electrode layer, and a thickness of the magnetic layer is greater than a thickness of the electrode layer of the solid-state battery.

9. The solid-state battery module according to claim 2 , wherein the magnetic layer is a layer that attracts a magnetic field to the coil portion.

10. The solid-state battery module according to claim 2 , wherein the magnetic layer is a layer for suppressing magnetic field absorption toward a metal side.

11. 3. The solid-state battery module according to claim 1, further comprising a covering portion covering the solid-state battery, the covering portion including a covering insulating layer and a covering inorganic layer located outside the covering insulating layer, and including a discontinuous region of the covering inorganic layer on a top surface side of the module.

12. The solid-state battery module according to claim 11 , wherein the coating inorganic layer constitutes at least a side surface portion of the module.

13. The solid-state battery module according to claim 12 , wherein the coating inorganic layer further constitutes a part of at least one of a module top surface and a module bottom surface that are continuous with the module side surface portion.

14. The solid-state battery module according to claim 11 , wherein the coating inorganic layer covers at least a side surface of the second substrate.

15. The solid-state battery module according to claim 11 , wherein the coating inorganic layer further covers a portion of an upper main surface of the second substrate that is continuous with a side surface of the second substrate.

16. The solid-state battery module according to claim 1 , further comprising a connection wiring that connects the first substrate and the coil portion.

17. 17. The solid-state battery module according to claim 16, wherein two or more of the connection wirings are arranged, a first and a second of the connection wirings extend in a first direction from the first substrate toward the coil portion, and a third connection wiring that connects the first and second connection wirings is arranged, and the third connection wiring extends in a second direction intersecting the first direction.

18. The solid-state battery module according to claim 16 , wherein an electronic component is placed on an upper main surface of the first substrate, and the coil portion and the electronic component are electrically connected to each other via the connecting wiring.

19. The solid-state battery module according to claim 16 , wherein the coil portion and the solid-state battery are electrically connected via the connection wiring.