Heat-dissipating structure

Abstract

Provided is a heat-dissipating structure having a reduced dimension in the thickness direction and yet capable of reliably dissipating heat generated by a heat source member.　The heat-dissipating structure comprises: an imaging element (23); a stack (41) disposed in a Z1-direction opposite an imaging surface (23A) with respect to the imaging element (23); a sheet metal member (25) having a through-hole (25A); a rear case (28) disposed on the Z1-direction side with respect to the sheet metal member (25); and a first heat conduction member (26) which is in contact with the stack (41) and is in contact with the rear case (28) through the through-hole (25A). The stack (41) is a heat source member.

Description

Heat dissipation structure

[0001] The present invention relates to a heat dissipation structure.

[0002] The imaging device described in Patent Document 1 includes a photoelectric conversion element module unit, an imaging lens barrel unit, a heat dissipation member, and a heat conduction member. The photoelectric conversion element module unit is attached to the imaging lens barrel unit. The heat conduction member is disposed between the center of the back surface of the photoelectric conversion element package and the heat dissipation member disposed opposite it. This forms a heat conduction path that dissipates heat generated by the photoelectric conversion element package to the heat dissipation member via the heat conduction member.

[0003] The optical unit described in Patent Document 2 includes an optical element, an imaging element, a movable body, and a fixed body. The movable body supports the optical element and the imaging element. A thermally conductive member having elasticity or viscoelasticity is provided between the movable body and the fixed body to connect them. The thermally conductive member transfers heat generated by the imaging element to the fixed body.

[0004] Japanese Patent No. 5225171 Japanese Patent Application Laid-Open No. 2020-30393

[0005] One embodiment of the technique of the present disclosure provides a heat dissipation structure that can reduce the dimension in the thickness direction and reliably dissipate heat generated in a heat source member.

[0006] In order to achieve the above object, the heat dissipation structure of the present invention includes an imaging element, a heat source member, a first metal member, a second metal member, and a first heat conduction member. The heat source member is arranged in a first direction of the imaging element. The first metal member has a through hole. The second metal member is arranged on the first direction side relative to the first metal member. The first heat conduction member contacts the heat source member and also contacts the second metal member through the through hole.

[0007] The first direction is preferably a direction opposite to the imaging surface of the imaging element. The first thermal conductive member preferably changes shape to come into contact with the first metal member. The change in shape is preferably elastic.

[0008] Preferably, at least a part of the contact surface of the first metal member that comes into contact with the first heat conduction member by elastic deformation is made of metal, and at least a part of the surface of the first metal member that faces the second metal member is made of metal.

[0009] The first thermal conductivity, which is the thermal conductivity of the first metal member, is preferably greater than the second thermal conductivity, which is the thermal conductivity of the second metal member. The first thermal conductivity and the second thermal conductivity are preferably the thermal conductivities of metals. The first thermal conductivity and the second thermal conductivity are preferably the thermal conductivities of the surfaces of the first metal member and the second metal member that face each other.

[0010] Preferably, the first metal member is made of a material containing aluminum, and the second metal member is made of a material containing magnesium. Preferably, at least a portion of the surface of the first metal member facing the second metal member is made of a material containing aluminum, and at least a portion of the surface of the second metal member facing the first metal member is made of a material containing magnesium.

[0011] The electronic device preferably further includes a first electronic component to which heat from the heat source component is transferred and a second heat conducting component disposed in contact with the first electronic component, the second heat conducting component being disposed around the through-hole and in contact with the first metal component. At least a portion of the contact surface of the first metal component that contacts the second heat conducting component is preferably made of metal. Preferably, a plurality of second heat conducting components are disposed.

[0012] The heat source member preferably includes at least a large-scale integrated circuit. The heat source member preferably includes a large-scale integrated circuit, an intermediate substrate, and a semiconductor memory, with the large-scale integrated circuit stacked on one side of the intermediate substrate and the semiconductor memory stacked on the other side.

[0013] Preferably, the thickness of the second metal member at a portion in contact with the first heat conducting member is greater than the thickness of a portion not in contact with the first heat conducting member. Preferably, the first heat conducting member and the second heat conducting member are gel-like members.

[0014] The display may further be disposed on the first direction side of the second metal member, and the first heat conducting member may be disposed within the display. At least a portion of the through-hole may be disposed within the display. The range may be within the range when the display is viewed through in the first direction.

[0015] 1 is a front perspective view of an imaging device; 2 is a rear perspective view of an imaging device; 3 is a plan view of an imaging device; 4 is a cross-sectional view of a main part of an imaging device; 5 is an exploded perspective view of the periphery of a heat dissipation structure; 6 is an explanatory view illustrating a state of a first thermal conduction member sandwiched between a heat source member and a second metal member before deformation (A) and after deformation (B); 7 is a perspective view showing the positional relationship between the first thermal conduction member, the first metal member, and the second metal member;

[0016] As shown in Fig. 1, a digital camera 10 includes a camera body 11 and an interchangeable lens barrel 12. A lens mount 13 and a release switch 14 are provided on the front of the camera body 11. The lens mount 13 has a circular imaging opening 13A. The lens barrel 12 is removably attached to the lens mount 13. The digital camera 10 is an example of an imaging device having a heat dissipation structure according to the present invention.

[0017] As shown in Fig. 2, the camera body 11 is provided with a display 15, operation buttons 16, and the like on the rear surface. The display 15 is an LCD (Liquid Crystal Display) or an OELD (Organic Electroluminescent Display), etc. The display 15 is used to display live view images, captured images, setting menus, and the like. The camera body 11 also has a grip portion 11A.

[0018] As shown in FIG. 3 , the camera body 11 incorporates an image sensor unit 21 and a main board 22. The main board 22 corresponds to the first electronic component in the claims. The image sensor unit 21 includes an image sensor 23 and an image sensor board 24. The image sensor 23 is mounted on the image sensor board 24. The image sensor unit 21 also includes an anti-vibration device for correcting blurring of subject light due to vibrations of the camera body 11, and a flexible printed circuit board used for connection to the main board 22, but these are not shown. The image sensor unit 21 is attached to the front case 29 by fastening with, for example, screws (not shown).

[0019] The imaging element 23 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor, a CCD (Charge Coupled Device) image sensor, or an organic thin-film imaging element. The imaging element 23 has a rectangular imaging surface 23A that captures an image of a subject. The imaging surface 23A receives subject light that represents the subject. As is well known, the imaging surface 23A has a two-dimensional array of pixels that photoelectrically convert the received subject light and output electrical signals. The entire imaging surface 23A is exposed to the outside through the imaging opening 13A.

[0020] The image sensor unit 21 and the main board 22 are connected using a flexible printed circuit board (not shown). The lens barrel 12 includes a lens barrel main body 31 and an image sensor 32 (see FIG. 1). The lens barrel main body 31 is cylindrical and holds the image sensor 32 therein, with a lens mount (not shown) provided at the rear end. When the lens barrel 12 is attached to the camera body 11, the image sensor 23 receives light from a subject and forms an image on the image sensor 23.

[0021] 4, the camera body 11 includes, in addition to the image sensor unit 21, the main board 22, and the display 15, a sheet metal member 25, a first heat conduction member 26, a second heat conduction member 27, a rear case 28, and a front case 29. The sheet metal member 25 is a first metal member in the claims, and the rear case 28 is a second metal member in the claims.

[0022] The rear case 28 and the front case 29 are combined with a top (top) case, a bottom (bottom) case, and a cover member (not shown), etc. to form the exterior case of the camera body 11. The rear case 28 and the front case 29 house the image sensor unit 21, the main board 22, the sheet metal member 25, the first heat conductive member 26, and the second heat conductive member 27 inside.

[0023] The main board 22 is provided with a laminate 41 as a heat source member. This allows heat from the laminate 41 to be transferred to the main board 22. The laminate 41 includes an LSI (Large Scale Integration) 42. Specifically, the laminate 41 includes the LSI 42, an intermediate board 43, and a semiconductor memory 44, with the LSI 42 stacked on one side of the intermediate board 43 and the semiconductor memory 44 stacked on the other side.

[0024] The LSI 42 functions as a CPU (Central Processing Unit) that executes software (programs) and performs various processes, and controls the operation of each part of the digital camera 10, including the image sensor 23.

[0025] For example, a dynamic random access memory (DRAM) is used as the semiconductor memory 44. The semiconductor memory 44 is electrically connected to the LSI 42 and is used, for example, as a main storage device in which programs are stored when the LSI 42 is operating.

[0026] The stacked body 41 is disposed in the Z1 direction (first direction) relative to the imaging element 23. The side of the stacked body 41 where the LSI 42 is located is fixed to the main board 22, and the side where the semiconductor memory 44 is located is located on the Z1 direction side relative to the LSI 42.

[0027] The Z2 direction is the direction toward the imaging surface 23A of the imaging element 23, and the Z1 direction is the direction opposite the Z2 direction with respect to the imaging element 23. The main board 22 is disposed on the Z1 direction side of the imaging element unit 21 including the imaging element 23, and the laminated body 41 is further provided on the Z1 direction side of the main board 22. The Y1-Y2 direction (see FIG. 5 ) is a direction perpendicular to the Z1-Z2 direction and is parallel to the top-bottom direction (up-down direction) of the digital camera 10 in this embodiment. The X1-X2 direction is a direction perpendicular to the Z1-Z2 direction and the Y1-Y2 direction and is the left-right direction of the digital camera 10 in this embodiment. In this specification, the term "orthogonal" not only means completely orthogonal, but also includes the meaning of approximately orthogonal, which includes tolerances allowable in design and manufacturing. The term "parallel" not only means completely parallel, but also includes the meaning of approximately parallel, which includes tolerances allowable in design and manufacturing.

[0028] The sheet metal member 25 is located on the Z1 direction side with respect to the main board 22. At least a portion of the sheet metal member 25 is made of metal, and the entire member may be made of metal. In this embodiment, the entire sheet metal member 25 is made of metal and is formed in a plate shape. Examples of metals that can be used to form the sheet metal member 25 include aluminum. Note that a material with high thermal conductivity is preferred for the sheet metal member 25, and materials other than aluminum that contain copper may be used as long as a high specific gravity is acceptable. A rectangular through hole 25A is formed in the sheet metal member 25. The through hole 25A is formed at a position that matches the stack 41.

[0029] The rear case 28 is located on the Z1 direction side of the sheet metal member 25. At least a portion of the rear case 28 is made of metal, and the entire rear case 28 may be made of metal. In this embodiment, the entire rear case 28 is made of metal, and has a larger area and volume when viewed in a direction parallel to the Z1 direction than the sheet metal member 25. Examples of metals that are used to make the rear case 28 include magnesium. The area ratio of the sheet metal member 25 to the rear case 28 when viewed in a direction parallel to the Z1 direction is, for example, 20%.

[0030] The first thermal conductivity, which is the thermal conductivity of the sheet metal member 25, is greater than the second thermal conductivity, which is the thermal conductivity of the rear case 28. An example of such a relationship in thermal conductivity is when the metal material for the sheet metal member 25 contains aluminum and the metal material for the rear case 28 contains magnesium, as described above. Note that the first thermal conductivity and the second thermal conductivity referred to here refer to the thermal conductivities of the metal materials for the sheet metal member 25 and the rear case 28.

[0031] 5 , the first thermally conductive member 26 is disposed at a position where it contacts the laminate 41. The first thermally conductive member 26 contacts the rear case 28 through the through-hole 25A. Furthermore, the first thermally conductive member 26 contacts the sheet metal member 25 by changing its shape. Specifically, as described below, the first thermally conductive member 26 contacts the sheet metal member 25 by elastically deforming as a change in shape. The first thermally conductive member 26 and the second thermally conductive member 27 are gel-like members that conduct heat generated in a heat source member (a member that generates heat, such as the laminate 41) to a heat dissipation member (a member with a large volume, such as the rear case 28 and the sheet metal member 25), and may be made of, for example, a thermal interface material (TIM).

[0032] The second thermal conductive members 27 are arranged in contact with the main board 22. In this embodiment, two second thermal conductive members 27 are provided. However, this is not limited to this, and the number of second thermal conductive members 27 may be one, or three or more. The two second thermal conductive members 27 are arranged around the through hole 25A and in contact with the sheet metal member 25. Specifically, the two second thermal conductive members 27 are arranged at different positions in the X1 and X2 directions, with the through hole 25A sandwiched between them. In the digital camera 10, there is ample space in the X1 and X2 directions due to the component layout, so it is easy to arrange the second thermal conductive members 27 at different positions in the X1 and X2 directions.

[0033] 6A , before first heat conduction member 26 changes shape, i.e., before elastic deformation, the dimensions of first heat conduction member 26 in the X1-X2 direction and / or Y1-Y2 direction are smaller than the dimensions of through hole 25A in the X1-X2 direction and / or Y1-Y2 direction, so first heat conduction member 26 does not contact sheet metal member 25. Note that dimension L11 is the dimension of first heat conduction member 26 in the X1-X2 direction, and dimension L12 is the dimension of through hole 25A in the X1-X2 direction. In the state shown in FIG. 6A , dimension L11 of first heat conduction member 26 is smaller than dimension L12 of through hole 25A.

[0034] When assembling the camera body 11, for example, the sheet metal member 25 is fixed to the rear case 28 by fitting or fastening, and the main board 22 is further attached to the rear case 28 by fastening. When these components are joined, the first heat conduction member 26 is sandwiched between the laminate 41 and the rear case 28 through the through-hole 25A.

[0035] 6B , first thermal conduction member 26 passes through through hole 25A and is sandwiched between stack 41 and rear case 28, undergoing elastic deformation. Specifically, first thermal conduction member 26 is compressed in the Z1 and Z2 directions. When first thermal conduction member 26 is compressed in the Z1 and Z2 directions, it is simultaneously expanded in the X1, X2 and / or Y1 and Y2 directions. Therefore, when first thermal conduction member 26 is in a deformed state, i.e., in an elastically deformed state, the dimensions of first thermal conduction member 26 in the X1, X2 and / or Y1 and Y2 directions become equal to or greater than the dimensions of through hole 25A in the X1, X2 and / or Y1 and Y2 directions, and first thermal conduction member 26 comes into contact with sheet metal member 25. In the state shown in FIG. 6B, dimension L11 of first heat conducting member 26 is equal to dimension L12 of through hole 25A, and both side ends of first heat conducting member 26 are in contact with through hole 25A.

[0036] The display 15 is also attached to the rear case 28. The display 15 is rotatably connected to the rear case 28 via a rotation shaft 15A. The display 15 is disposed on the Z1 side of the rear case 28. The first heat conduction member 26 is disposed within the range of the display 15. The range of the display 15 refers to the range when the display 15 is viewed in the Z1 direction. At least a portion of the through-hole 25A is disposed within the range of the display 15. In this embodiment, the entire through-hole 25A is disposed within the range of the display 15.

[0037] As shown in FIG. 7 , the thickness of the rear case 28 at a portion 28A (see FIG. 6A ) that contacts the first thermal conductive member 26 is greater than the thickness of a portion 28B (see FIG. 6A ) that does not contact the first thermal conductive member 26. Note that the thickness here refers to the dimensions of the rear case 28 in the Z1 and Z2 directions. The metal that constitutes the rear case 28 has a higher thermal conductivity than the first thermal conductive member 26. The thickness of the portion 28A that contacts the first thermal conductive member 26 is, for example, 1.2 mm, and the thickness of the portion 28B that does not contact the first thermal conductive member 26 is, for example, 0.8 mm.

[0038] Next, the operation of the digital camera 10 of this embodiment will be described. When the digital camera 10 is used, that is, when various operations such as photographing and recording are performed, heat is generated in the laminate 41, which includes the LSI 42 functioning as a CPU, the semiconductor memory 44 functioning as a main storage device, and the intermediate substrate 43 on which these are stacked. In this embodiment, as described above, the first thermal conductive member 26 is disposed in a position where it contacts the laminate 41, and contacts the rear case 28 through the through hole 25A of the sheet metal member 25. This allows the digital camera 10 to have a small thickness and to reliably dissipate heat generated in the laminate 41.

[0039] If, as in conventional imaging devices, the thermally conductive member were to come into surface-to-surface contact with the sheet metal member without passing through a through-hole, the thickness of the imaging device would increase by the thickness of the sheet metal member and the thickness of the thermally conductive member. In contrast, in this embodiment, the first thermally conductive member 26 passes through the through-hole 25A, thereby reducing the thickness and enabling a more compact device. Furthermore, heat generated in the laminate 41 can be reliably conducted to the rear case 28. In this way, by conducting heat from the laminate 41 to the rear case 28, which has a large surface area and volume, heat spots (areas where the temperature becomes high in only one place) are less likely to occur, and heat generated in the laminate 41 can be reliably dissipated.

[0040] Furthermore, in the digital camera 10, the second thermally conductive member 27 is in contact with the main board 22, is disposed around the through-hole 25A, and is in contact with the sheet metal member 25. This allows the second thermally conductive member 27 to transfer heat from the stack 41 from the main board 22 and conduct it to the sheet metal member 25. In this way, the heat from the stack 41 is thermally conducted by the sheet metal member 25, so that heat generated in the stack 41 can be more reliably dissipated. Furthermore, because the sheet metal member 25 and the rear case 28 contain metal, heat is also transferred from the sheet metal member 25 to the rear case 28.

[0041] Furthermore, the thickness of portion 28A of rear case 28 that contacts first thermal conductive member 26 is greater than the thickness of portion 28B that does not contact first thermal conductive member 26, and the metal that constitutes rear case 28 has a higher thermal conductivity than first thermal conductive member 26. As a result, contact between thick portion 28A of rear case 28 and first thermal conductive member 26 facilitates heat conduction. Therefore, heat generated in stack 41 can be dissipated more reliably.

[0042] Furthermore, the display 15 is disposed on the Z1 direction side of the rear case 28, and the first heat conductive member 26 is disposed within the range of the display 15. This allows heat generated in the stack 41 to be conducted to the first heat conductive member 26, the rear case 28, and the display 15, thereby enabling the heat generated in the stack 41 to be dissipated more reliably.

[0043] In the above embodiment, the entire sheet metal member 25 is made of metal. However, it is preferable that the contact surface of the sheet metal member 25 that comes into contact with the first thermal conductive member 26 due to compression, i.e., at least a portion of the inner surface of the through hole 25A, is made of metal. This achieves the same effect as the above embodiment, i.e., ensures heat dissipation in the stack 41. It is also preferable that at least a portion of the contact surface of the sheet metal member 25 that comes into contact with the second thermal conductive member 27 is made of metal. However, this is not limited to this. It is preferable that at least a portion of the surface of the sheet metal member 25 that faces the rear case 28 is made of metal, and it is also preferable that at least a portion of the surface of the rear case 28 that faces the sheet metal member 25 is made of metal. Furthermore, when the sheet metal member 25 and the rear case 28 are partially made of metal, the first thermal conductivity and the second thermal conductivity described above refer to the respective thermal conductivities of the surfaces of the sheet metal member 25 and the rear case 28 that face each other. Furthermore, when the sheet metal member 25 and the rear case 28 are partially made of metal, the non-metal portions may be, for example, components containing a resin material.

[0044] Furthermore, when a portion of the sheet metal member 25 is made of a material containing aluminum, it is preferable that at least a portion of the surface of the sheet metal member 25 that faces the rear case 28 is made of a material containing aluminum. Furthermore, when a portion of the rear case 28 is made of a material containing magnesium, it is preferable that at least a portion of the surface of the rear case 28 that faces the sheet metal member 25 is made of a material containing magnesium.

[0045] In addition, in the above embodiment, the multiple second heat conduction members 27 are arranged at different positions from each other in the X1 and X2 directions (left and right directions), but this is not limited to this, and they may also be arranged at different positions from each other in the Y1 and Y2 directions (top and bottom directions).

[0046] In the above embodiments, the LSI 42 has been exemplified as a processor that controls the operation of the camera body, but the processor as a hardware structure of a processing unit that executes various processes, such as the LSI 42, is not limited to this. Various processors include, instead of or in addition to a CPU, programmable logic devices (PLDs) that are processors whose circuit configuration can be changed after manufacture, such as a GPU (Graphical Processing Unit) or an FPGA (Field Programmable Gate Array), and dedicated electrical circuits that are processors with circuit configurations designed specifically for executing various processes.

[0047] A single processing unit may be configured with one of these various processors, or may be configured with a combination of two or more processors of the same or different types (e.g., multiple FPGAs, a combination of a CPU and an FPGA, or a combination of a CPU and a GPU). Multiple processing units may also be configured with a single processor. Examples of multiple processing units configured with a single processor include: a first configuration, as typified by client or server computers, in which a single processor is configured with a combination of one or more CPUs and software, and this processor functions as multiple processing units; and a second configuration, as typified by system-on-chip (SoC), in which a processor is used to realize the functions of an entire system including multiple processing units on a single IC (Integrated Circuit) chip. In this way, the various processing units are configured with one or more of the above-mentioned various processors as a hardware structure.

[0048] The heat source member is not limited to the stack 41 exemplified in the above embodiment, but may be a single LSI without a semiconductor memory or intermediate substrate, or may be any of the above-mentioned various processors.

[0049] Furthermore, the hardware structure of these various processors is, more specifically, an electric circuit in the form of a combination of circuit elements such as semiconductor elements.

[0050] The present invention can be applied to imaging devices other than digital cameras, such as smartphones and video cameras.

[0051] 10 Digital camera 11 Camera body 11A Grip portion 12 Lens barrel 13 Lens mount 13A Imaging aperture 14 Release switch 15 Display 15A Rotating shaft 16 Operation button 21 Imaging element unit 22 Main board 23 Imaging element 23A Imaging surface 24 Imaging element board 25 Sheet metal member 25A Through hole 26 First heat conducting member 27 Second heat conducting member 28 Rear cover 28A Part 28B Part 29 Front cover 31 Lens barrel body 32 Imaging optical system 41 Laminated body 42 LSI (Large Scale Integration) 43 Intermediate board 44 Semiconductor memory L11 Dimension L12 Dimension

Claims

1. An imaging element; A heat source member disposed in a first direction of the imaging element; A first metal member having a through hole; A second metal member disposed on the first direction side with respect to the first metal member; a first heat conducting member in contact with the heat source member and in contact with the second metal member through the through hole; Equipped with the first metal member comes into contact with the first thermally conductive member due to a change in shape of the first thermally conductive member; the second metal member has a larger area and a larger volume when viewed in a direction parallel to the first direction than the first metal member; A first thermal conductivity that is a thermal conductivity of the first metal member is greater than a second thermal conductivity that is a thermal conductivity of the second metal member. Heat dissipation structure.

2. The heat dissipation structure according to claim 1 , wherein the first direction is a direction opposite to an imaging surface of the imaging element.

3. The heat dissipation structure according to claim 1 , wherein the first thermally conductive member comes into contact with the first metal member by changing its shape.

4. The heat dissipation structure according to claim 3 , wherein the change in shape is an elastic deformation.

5. The heat dissipation structure according to claim 4 , wherein at least a part of a contact surface of the first metal member that comes into contact with the first thermal conductive member due to the elastic deformation is made of metal.

6. A heat dissipation structure as described in claim 5, wherein at least a portion of the surface of the first metal member facing the second metal member is metal.

7. The heat dissipation structure according to claim 1 , wherein the first thermal conductivity and the second thermal conductivity are the thermal conductivity of a metal.

8. The heat dissipation structure according to claim 1 , wherein the first thermal conductivity and the second thermal conductivity are the respective thermal conductivities of the first metal member and the second metal member at opposing surfaces thereof.

9. the first metal member is a material including aluminum, 2. The heat dissipation structure according to claim 1, wherein the second metal member is made of a material containing magnesium.

10. the first metal member has a surface facing the second metal member, and at least a portion of the surface is made of a material containing aluminum; The heat dissipation structure according to claim 1 , wherein at least a portion of the surface of the second metal member facing the first metal member is made of a material containing magnesium.

11. a first electronic component to which heat from the heat source component is transferred; a second thermal conductive member disposed in contact with the first electronic component, The heat dissipation structure according to claim 1 , wherein the second thermal conductive member is disposed around the through hole and in contact with the first metal member.

12. The heat dissipation structure according to claim 11 , wherein at least a part of a contact surface of the first metal member that contacts the second thermal conductive member is made of metal.

13. The heat dissipation structure according to claim 11 , wherein a plurality of the second thermal conductive members are arranged.

14. The heat dissipation structure according to claim 11 , wherein the heat source member includes at least a large scale integrated circuit.

15. the heat source member includes the large scale integrated circuit, an intermediate substrate, and a semiconductor memory; 15. The heat dissipation structure according to claim 14, wherein the large scale integrated circuit is stacked on one surface of the intermediate substrate, and the semiconductor memory is stacked on the other surface of the intermediate substrate.

16. 16. The heat dissipation structure according to claim 15, wherein the second metal member has a thickness at a portion in contact with the first thermal conductive member that is greater than a thickness at a portion not in contact with the first thermal conductive member.

17. The heat dissipation structure according to claim 16 , wherein the first heat conducting member and the second heat conducting member are gel-like members.

18. The display is disposed on the first direction side of the second metal member. The first thermal conductive member is disposed within the display. The heat dissipation structure according to claim 1.

19. The heat dissipation structure according to claim 18 , wherein at least a portion of the through hole is disposed within a range of the display.

20. The heat dissipation structure according to claim 18 , wherein the range is a range when the display is seen through in the first direction.